3D mounting device and 3D mounting method

Abstract

To suppress misalignment of parts. [Solution] The 3D mounting apparatus comprises a stage that supports a three-dimensional substrate having a surface on which mounting areas coated with solder paste are set, a mounting head for mounting components to the mounting areas, a heater head for heating the solder paste, and a controller. The controller includes a mounting order determination unit that determines the mounting order of components to a plurality of mounting areas, a stage control unit that controls the stage so that the plurality of mounting areas become horizontal sequentially according to the mounting order, a head control unit that controls the mounting head so that components are sequentially mounted to the horizontal mounting areas according to the mounting order, and a heater control unit that controls the heater head so that the solder paste of the first mounting area is heated during the mounting of the first component when it is not possible to mount the first component to the first mounting area after the first component has been mounted to the first mounting area and when it is time to mount the second component.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a three-dimensional mounting device and a three-dimensional mounting method.

Background Art

[0002] In the technical field related to three-dimensional mounting devices, a three-dimensional mounting device for mounting components on a three-dimensional substrate, as disclosed in Patent Document 1, is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When mounting a component on a mounting area set on the surface of a three-dimensional substrate, the tilt angle of the three-dimensional substrate is adjusted so that the mounting area is in a horizontal state. When mounting a second component on a second mounting area after mounting a first component on a first mounting area, the first mounting area may be tilted with respect to the horizontal plane. If the first mounting area is tilted with respect to the horizontal plane, the first component may be displaced due to the action of gravity.

[0005] The technology disclosed in this specification aims to suppress displacement of components.

Means for Solving the Problems

[0006] This specification discloses a three-dimensional mounting apparatus comprising: a stage for supporting a three-dimensional substrate having a surface on which mounting areas coated with solder paste are set; a mounting head for mounting components to the mounting areas; a heater head for heating the solder paste; and a controller. The controller includes: an allowable angle acquisition unit for acquiring an allowable angle indicating the maximum tilt angle of a component that suppresses the amount of misalignment after mounting to a specified amount or less; a mounting order determination unit for determining the mounting order of components to a plurality of mounting areas so that the mounted components are at or below the allowable angle; a stage control unit for controlling the stage so that the plurality of mounting areas sequentially become horizontal according to the mounting order; a head control unit for controlling the mounting head so that components are sequentially mounted to the horizontal mounting areas according to the mounting order; and a heater control unit for controlling the heater head so that the solder paste of the first mounting area is heated during the mounting of the first component if, after the mounting of the first component to the first mounting area, it is not possible to mount the first component at or below the allowable angle when mounting the second component. [Effects of the Invention]

[0007] According to the technology disclosed herein, misalignment of parts is suppressed. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view showing a substrate and components according to an embodiment. [Figure 2] Figure 2 is a perspective view showing a pallet for holding a substrate according to the embodiment. [Figure 3] Figure 3 is an exploded perspective view showing a substrate and pallet according to an embodiment. [Figure 4] Figure 4 is a schematic side view showing a three-dimensional mounting device according to an embodiment. [Figure 5] Figure 5 is a schematic plan view showing a three-dimensional mounting device according to an embodiment. [Figure 6] Figure 6 is a perspective view showing a pallet and stage according to an embodiment. [Figure 7]Figure 7 is an exploded perspective view showing the pallet and stage according to the embodiment. [Figure 8] Figure 8 is a schematic diagram showing the mounting head according to the embodiment. [Figure 9] Figure 9 is a hardware configuration diagram of the controller according to the embodiment. [Figure 10] Figure 10 is a functional block diagram showing a three-dimensional mounting device according to an embodiment. [Figure 11] Figure 11 is a schematic plan view showing a substrate according to the embodiment. [Figure 12] Figure 12 is a diagram illustrating the operation of the stage and mounting head according to the embodiment. [Figure 13] Figure 13 is a diagram illustrating the operation of the stage and mounting head according to the embodiment. [Figure 14] Figure 14 is a diagram illustrating the operation of the laser head according to the embodiment. [Figure 15] Figure 15 is a diagram illustrating the operation of the heater head according to the embodiment. [Figure 16] Figure 16 illustrates the misalignment of parts according to the embodiment. [Figure 17] Figure 17 is a diagram illustrating the mounting order of the components according to the embodiment. [Figure 18] Figure 18 is a diagram illustrating the mounting order of the components according to the embodiment. [Figure 19] Figure 19 illustrates a component in which the misalignment according to the embodiment is not resolved. [Figure 20] Figure 20 illustrates a component in which the misalignment according to the embodiment is not resolved. [Figure 21] Figure 21 illustrates the operation of the 3D mounting apparatus when there are components whose misalignment according to the embodiment cannot be resolved. [Figure 22] Figure 22 illustrates the operation of the 3D mounting apparatus when there are parts whose misalignment according to the embodiment cannot be resolved. [Figure 23]FIG. 23 is a flowchart showing a method for determining the mounting order of components according to an embodiment. [Figure 24] FIG. 24 is a flowchart showing a method for mounting components according to an embodiment. [Figure 25] FIG. 25 is a diagram schematically showing an allowable angle storage unit according to an embodiment. [Figure 26] FIG. 26 is a diagram schematically showing a controller according to an embodiment. [Figure 27] FIG. 27 is a diagram for explaining the relationship between cream solder and a heater head according to an embodiment.

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis of the predetermined plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The rotational direction or tilting direction centered on the X-axis direction is defined as the θX direction. The rotational direction or tilting direction centered on the Y-axis direction is defined as the θY direction. The rotational direction or tilting direction centered on the Z-axis direction is defined as the θZ direction. In the embodiments, the predetermined plane and the horizontal plane are parallel. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Also, in the embodiments, the predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0010] [Substrate] FIG. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a part of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. Protrusions may be provided on the surface of the substrate 1.

[0011] An electrical circuit is provided on the surface of the substrate 1. In this embodiment, the substrate 1 is formed by in-mold molding technology. The substrate 1 includes a base material 1A having a curved surface and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electrical circuit. The surface of the substrate 1 includes the surface of the film 1B.

[0012] Component 2 includes an electronic component. Component 2 may be a leaded electronic component with leads protruding from its body. Component 2 may also be a chip-type electronic component without leads. An electronic device is manufactured by mounting component 2 on the surface of substrate 1.

[0013] [palette] Figure 2 is a perspective view showing a pallet 3 that holds a substrate 1 according to the embodiment. Figure 3 is an exploded perspective view showing the substrate 1 and pallet 3 according to the embodiment. The pallet 3 holds the substrate 1. In this embodiment, the substrate 1 is handled while being held in the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1 and a clamping mechanism 5 that fixes the substrate 1.

[0014] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from the +Y side and -Y side, respectively.

[0015] The base portion 4A is plate-shaped with multiple openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

[0016] The guard portion 4B is elongated in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are separated from each other in the Y-axis direction. One guard portion 4B protrudes from the +Y side end of the upper surface of the base portion 4A toward the +Z side. The other guard portion 4B protrudes from the -Y side end of the upper surface of the base portion 4A toward the +Z side.

[0017] Each of the multiple pin portions 4C protrudes from the upper surface of the base portion 4A toward the +Z side. Some of the pin portions 4C are located toward the +Y side of the center of the base portion 4A. Some of the pin portions 4C are located toward the -Y side of the center of the base portion 4A. The multiple pin portions 4C located toward the +Y side of the center of the base portion 4A support the +Y side edge of the substrate 1. The multiple pin portions 4C located toward the -Y side of the center of the base portion 4A support the -Y side edge of the substrate 1.

[0018] The clamping mechanism 5 is provided on the support member 4. The clamping mechanism 5 fixes the substrate 1 to the support member 4. The clamping mechanism 5 includes a pair of support parts 5A that support the -X side end of the substrate 1 and a movable part 5B that supports the +X side end of the substrate 1. The movable part 5B is movable in the X direction on the upper surface of the base part 4A. With the substrate 1 positioned between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, causing the substrate 1 to be sandwiched between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0019] [3D Packaging Device] Figure 4 is a schematic side view showing the 3D mounting apparatus 10 according to the embodiment. Figure 5 is a schematic top view showing the 3D mounting apparatus 10 according to the embodiment. The 3D mounting apparatus 10 mounts components 2 onto a substrate 1.

[0020] The 3D mounting apparatus 10 comprises a base member 18, a transport device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a camera 25, a head moving device 27, a dispenser 11, a laser head 12, a heater head 13, a nozzle stocker 14, a chamber 29, and a controller 16.

[0021] The base member 18 supports the transport device 19, the stage 20, the stage moving device 21, the parts supply device 22, the mounting head 24, the head moving device 27, the dispenser 11, the laser head 12, the heater head 13, and the nozzle stocker 14.

[0022] The transport device 19 transports the pallet 3 holding the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 to the processing position of the 3D mounting device 10. The processing position is defined by the transport path of the transport device 19.

[0023] The conveying device 19 includes a conveying belt 19A that conveys the pallet 3 in the X-axis direction and a guide member 19B that guides the pallet 3.

[0024] The guide member 19B is elongated in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are separated from each other in the Y-axis direction. One guide member 19B is positioned on the +Y side of the pallet 3. The other guide member 19B is positioned on the -Y side of the pallet 3.

[0025] The conveyor belt 19A is annular. A pair of conveyor belts 19A are provided. The conveyor belts 19A are supported by guide members 19B via a drive pulley and a driven pulley. The conveyor belts 19A are placed over the drive pulley and the driven pulley. One conveyor belt 19A is supported by one guide member 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0026] Of the pair of conveyor belts 19A, the conveyor belt 19A positioned on the +Y side supports the +Y side end of the underside of the pallet 3. The conveyor belt 19A positioned on the -Y side supports the -Y side end of the underside of the pallet 3. The pallet 3 is conveyed in the X-axis direction by the rotation of a drive pulley by a drive motor (not shown).

[0027] An actuator (not shown) allows one guide member 19B to move in the Y-axis direction relative to the other guide member 19B. When one guide member 19B and the other guide member 19B move apart in the Y-axis direction, the support of the pallet 3 by the conveyor belt 19A is released.

[0028] Figure 6 is a perspective view showing the pallet 3 and stage 20 according to the embodiment. Figure 7 is an exploded perspective view showing the pallet 3 and stage 20 according to the embodiment.

[0029] Stage 20 supports the substrate 1 via the pallet 3. Stage 20 supports the pallet 3, which has been transported to the processing position, from the -Z side. Two positioning members 20A are provided on the upper surface of Stage 20. The positioning members 20A are inserted into holes 4D in the pallet 3. By inserting the positioning members 20A into the holes 4D from the -Z side of the pallet 3, Stage 20 and the pallet 3 are positioned. Hooks are provided at the upper ends of the positioning members 20A. The hooks are attached to the pallet 3. The hooks include balls that move by air pressure. After the positioning members 20A are inserted into the holes 4D from the -Z side of the pallet 3, the balls are attached to the pallet 3, thereby fixing Stage 20 and the pallet 3 in place.

[0030] The stage moving device 21 moves the stage 20. In this embodiment, the stage moving device 21 moves the stage 20 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction, respectively. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move it in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0031] After the pallet 3 is transported to the processing position by the conveying device 19, the guide member 19B on the +Y side moves in the +Y direction so as to move away from the other guide member 19B, and the stage 20 moves in the +Z direction by the stage moving device 21. As the guide member 19B on the +Y side moves in the Y direction so as to move away from the other guide member 19B, the support of the pallet 3 by the conveying belt 19A is released. With the support of the pallet 3 by the conveying belt 19A released, and the stage 20 moves in the +Z direction, the pallet 3 is transferred from the conveying device 19 to the stage 20. With the pallet 3 supported by the stage 20, the stage moving device 21 can move the stage 20 in the Z direction, the θX direction, and the θY direction, respectively.

[0032] When transferring the pallet 3 from the stage 20 to the conveying device 19, the stage 20 moves in the -Y direction so that the -Y end of the pallet 3 is positioned above the -Y side conveying belt 19A, and the +Y side guide member 19B moves in the -Y direction so that the +Y end of the pallet 3 is positioned above the +Y side conveying belt 19A. After the hook provided on the upper end of the positioning member 20A is released, the stage 20 moves in the -Z direction by the stage moving device 21. As a result, the support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the conveying belt 19A.

[0033] The parts supply device 22 supplies parts 2. The parts supply device 22 includes a plurality of tape feeders. The tape feeders hold the plurality of parts 2. The parts supply device 22 supplies at least one of the plurality of parts 2 to the supply position. The parts supply device 22 is located on the -Y side of the transport device 19. The parts supply device 22 may also be located on both the +Y side and the -Y side of the transport device 19.

[0034] The mounting head 24 mounts components 2 onto the substrate 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them onto the substrate 1. The mounting head 24 is movable between a supply position where components 2 are supplied from the component supply device 22 and a processing position where the substrate 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts them onto the surface of the substrate 1 located at the processing position.

[0035] The head moving device 27 moves the mounting head 24. In this embodiment, the head moving device 27 moves the mounting head 24 in the X-axis direction and the Y-axis direction, respectively. The head moving device 27 includes an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. The operation of the X-axis moving device 27X causes the mounting head 24 to move in the X-axis direction. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. The operation of the Y-axis moving device 27Y causes the X-axis moving device 27X to move in the Y-axis direction, thereby causing the mounting head 24 to move in the Y-axis direction.

[0036] Figure 8 is a schematic diagram showing a mounting head 24 according to an embodiment. As shown in Figure 8, the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that hold the component 2 by suction. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. When the lower end of the nozzle 23 and the component 2 are in contact, a suction operation is performed from the opening provided at the lower end of the nozzle 23, causing the component 2 to be held by suction at the lower end of the nozzle 23. When the suction operation from the opening is released, the component 2 is released from the nozzle 23. Note that the nozzles 23 may also be gripper nozzles that hold the component 2 by gripping it.

[0037] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in the Z-axis direction and the θZ direction, respectively. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to the lower end of a shaft 23A. Multiple shafts 23A are provided. Multiple nozzles 23 are connected to each of the multiple shafts 23A. Multiple nozzle moving devices 28 are provided. Multiple nozzle moving devices 28 are connected to each of the multiple shafts 23A. The nozzle 23 is supported by the mounting head 24 via the shafts 23A and the nozzle moving devices 28. The nozzle moving device 28 moves the nozzle 23 by moving the shafts 23A in the Z-axis direction and the θZ direction.

[0038] The nozzle 23 is movable in the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by the head moving device 27 and the nozzle moving device 28. As the nozzle 23 moves, the part 2 held by the nozzle 23 is also movable in the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0039] Camera 25 images the substrate 1. In one embodiment, camera 25 images the surface of the substrate 1 from the +Z side of the substrate 1. Camera 25 is mounted on the mounting head 24. Camera 25 moves together with the mounting head 24 in the X-axis and Y-axis directions. Camera 25 can image alignment marks provided on the surface of the substrate 1. Camera 25 can image components 2 after they have been mounted on the substrate 1.

[0040] The dispenser 11 applies solder paste to the substrate 1. The dispenser 11 moves in the X-axis, Y-axis, and Z-axis directions, respectively, on the +Z side of the transport device 19. The dispenser 11 and the mounting head 24 can move independently. After the dispenser 11 applies solder paste to the surface of the substrate 1, the mounting head 24 mounts the components 2 onto the substrate 1. The mounting head 24 mounts the components 2 onto the substrate 1 to which the solder paste has been applied.

[0041] The laser head 12 irradiates the solder paste with laser light so that it melts. The laser head 12 irradiates the solder paste with laser light after the component 2 has been mounted on the substrate 1 via the solder paste. The laser head 12 irradiates the solder paste with laser light to melt it. The laser head 12 moves in the X-axis, Y-axis, and Z-axis directions, respectively, on the +Z side of the transport device 19.

[0042] The heater head 13 heats the solder paste. The heater head 13 heats the solder paste by supplying hot air to it. The heater head 13 supplies hot air to the solder paste so that it melts. Hot air refers to heated air. The temperature of the hot air is a temperature at which the solder paste can melt. In this embodiment, the temperature of the hot air is between 100°C and 500°C. The heater head 13 blows hot air onto the solder paste when the component 2 is mounted onto the substrate 1 via the solder paste. The heater head 13 melts the solder paste by blowing hot air onto it. The heater head 13 moves in the X-axis, Y-axis, and Z-axis directions, respectively, on the +Z side of the transport device 19.

[0043] The heater head 13 includes a heating unit 13A that heats air to generate hot air, and a hot air nozzle 13B that sprays the hot air generated in the heating unit 13A. The heating unit 13A has a heating device capable of heating air, such as an electric heating element. The hot air nozzle 13B has a nozzle for spraying hot air. The nozzle is provided at the lower end of the hot air nozzle 13B. Hot air generated in the heating unit 13A is sprayed from the nozzle of the hot air nozzle 13B. The hot air sprayed from the nozzle of the hot air nozzle 13B is supplied to the solder paste. The heating unit 13A can adjust the temperature and flow rate of the hot air sprayed from the hot air nozzle 13B.

[0044] The heater head 13, laser head 12, dispenser 11, and mounting head 24 can be moved independently.

[0045] The nozzle stocker 14 houses a plurality of hot air nozzles 13B. The nozzle stocker 14 is supported by a base member 18. In this embodiment, the nozzle stocker 14 is positioned on the +Y side of the conveying device 19. The hot air nozzles 13B are detachable from the heating unit 13A. The hot air nozzles 13B are replaceable with respect to the heating unit 13A. After the heater head 13 moves above the nozzle stocker 14, the hot air nozzles 13B removed from the heating unit 13A are housed in the nozzle stocker 14. After a hot air nozzle 13B is removed from the heating unit 13A, another hot air nozzle 13B housed in the nozzle stocker 14 is attached to the heating unit 13A, thereby replacing the hot air nozzle 13B.

[0046] The nozzle stocker 14 houses a plurality of hot air nozzles 13B having different structures from one another. The nozzle stocker 14 houses a plurality of hot air nozzles 13B having at least different sizes of nozzle openings from one another. Replacing the hot air nozzles 13B involves changing the size of the nozzle openings of the hot air nozzles 13B.

[0047] The chamber 29 has an internal space that houses the base member 18, the transport device 19, the stage 20, the stage moving device 21, the parts supply device 22, the mounting head 24, the head moving device 27, the nozzle moving device 28, the dispenser 11, the laser head 12, the heater head 13, and the nozzle stocker 14.

[0048] [controller] Figure 9 is a hardware configuration diagram of a controller 16 according to an embodiment. The controller 16 includes a computer system. The controller 16 has a processor 16A such as a CPU (Central Processing Unit), a main memory 16B including non-volatile memory such as ROM (Read Only Memory) and volatile memory such as RAM (Random Access Memory), a storage 16C, and an interface 16D including input / output circuits. The functions of the controller 16 are stored in the storage 16C as a computer program. The processor 16A reads the computer program from the storage 16C, loads it into the main memory 16B, and executes predetermined processing according to the computer program. The computer program may be distributed to the controller 16 via a network.

[0049] Figure 10 is a functional block diagram showing a three-dimensional mounting apparatus 10 according to an embodiment. As shown in Figure 10, the controller 16 includes a dispenser control unit 31, a stage control unit 32, a head control unit 33, a laser control unit 34, a heater control unit 35, a positional displacement amount calculation unit 36, a tolerance angle acquisition unit 37, a mounting order determination unit 38, a tolerance angle storage unit 41, and a mounting order storage unit 42.

[0050] The dispenser control unit 31 controls the dispenser 11. The dispenser control unit 31 controls the dispenser 11 so that the solder paste 60 is applied to the surface of the substrate 1.

[0051] Figure 11 is a schematic plan view showing a substrate 1 according to an embodiment. As shown in Figure 11, a plurality of mounting areas 50 are set on the surface of the substrate 1. The mounting areas 50 are areas on which components 2 are mounted. Components 2 are mounted in each of the plurality of mounting areas 50. The dispenser control unit 31 applies solder paste 60 to each of the plurality of mounting areas 50.

[0052] The stage control unit 32 controls the stage 20. The stage 20 supports a substrate 1 having a surface on which multiple mounting areas 50 on which solder paste 60 is applied are set. The head control unit 33 controls the mounting head 24 so that components 2 are mounted on the mounting areas 50 of the substrate 1 supported by the stage 20.

[0053] Figures 12 and 13 are diagrams illustrating the operation of the stage 20 and mounting head 24 according to the embodiment. Multiple mounting areas 50 are set on the surface of the substrate 1. In the example shown in Figures 12 and 13, the mounting areas 50 set on the surface of the substrate 1 include mounting area 50A, mounting area 50B, and mounting area 50C. Solder paste 60 is applied to each of the multiple mounting areas 50. Component 2 includes component 2A mounted in mounting area 50A, component 2B mounted in mounting area 50B, and component 2C mounted in mounting area 50C.

[0054] When mounting components 2 to mounting areas 50 set on the surface of substrate 1, the tilt angle of substrate 1 is adjusted so that the mounting areas 50 become horizontal. The stage control unit 32 controls the stage 20 so that multiple mounting areas 50 become horizontal sequentially. Substrate 1 is rotated so that multiple mounting areas 50 become horizontal sequentially. The head control unit 33 controls the mounting head 24 so that components 2 are sequentially mounted to the horizontal mounting areas 50.

[0055] As shown in Figure 12, when mounting component 2A to mounting area 50A, the stage control unit 32 controls the stage 20 so that mounting area 50A is in a horizontal position. The head control unit 33 controls the mounting head 24 so that component 2A is mounted to the horizontal mounting area 50A. Component 2A is mounted to mounting area 50A via solder paste 60 applied to the mounting area 50A.

[0056] As shown in Figure 13, after component 2A is mounted in mounting area 50A, component 2B is mounted in mounting area 50B. When mounting component 2B in mounting area 50B, the stage control unit 32 controls the stage 20 so that mounting area 50B is in a horizontal position. The head control unit 33 controls the mounting head 24 so that component 2B is mounted in the horizontal mounting area 50B. Component 2B is mounted in mounting area 50B via the solder paste 60 applied to mounting area 50B.

[0057] After component 2B is mounted in mounting area 50B, component 2C is mounted in mounting area 50C. When mounting component 2C in mounting area 50C, the stage control unit 32 controls the stage 20 so that mounting area 50C is in a horizontal position. The head control unit 33 controls the mounting head 24 so that component 2C is mounted in the horizontal mounting area 50C. Component 2C is mounted in mounting area 50C via the solder paste 60 applied to the mounting area 50C.

[0058] The laser control unit 34 controls the laser head 12. After the component 2 is mounted on the mounting area 50 via the solder paste 60, the laser control unit 34 controls the laser head 12 so that the solder paste 60 is irradiated with laser light. When the solder paste 60 is irradiated with laser light, the solder paste 60 melts. As the molten solder paste 60 cools, the component 2 is soldered to the substrate 1.

[0059] Figure 14 is a diagram illustrating the operation of the laser head 12 according to the embodiment. As shown in Figure 14, the laser head 12 irradiates the solder paste 60 with laser light after the component 2 has been mounted on the mounting area 50. When irradiating the solder paste 60 of the mounting area 50 on which the component 2 has been mounted with laser light, the tilt angle of the substrate 1 is adjusted so that the mounting area 50 is in a horizontal state. The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are sequentially brought into a horizontal state. The laser control unit 34 controls the laser head 12 so that the laser light is sequentially irradiated onto the solder paste 60 of the horizontal mounting areas 50.

[0060] As shown in Figure 14, when a laser beam is shone onto the solder paste 60 in the mounting area 50A on which component 2A is mounted, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal position. The laser control unit 34 controls the laser head 12 so that the laser beam is shone onto the solder paste 60 in the horizontal mounting area 50A. The solder paste 60 in the mounting area 50A melts due to the irradiation of the laser beam. As the melted solder paste 60 in the mounting area 50A cools, component 2A is soldered to the mounting area 50A.

[0061] When irradiating the solder paste 60 in the mounting area 50B on which component 2B is mounted with a laser beam, the stage control unit 32 controls the stage 20 so that the mounting area 50B is in a horizontal position. The laser control unit 34 controls the laser head 12 so that the laser beam is irradiated onto the solder paste 60 in the horizontal mounting area 50B. The solder paste 60 in the mounting area 50B melts due to the irradiation of the laser beam. As the molten solder paste 60 in the mounting area 50B cools, component 2B is soldered to the mounting area 50B.

[0062] When irradiating the solder paste 60 in the mounting area 50C on which component 2C is mounted with a laser beam, the stage control unit 32 controls the stage 20 so that the mounting area 50C is in a horizontal position. The laser control unit 34 controls the laser head 12 so that the laser beam is irradiated onto the solder paste 60 in the horizontal mounting area 50C. The solder paste 60 in the mounting area 50C melts due to the irradiation of the laser beam. As the molten solder paste 60 in the mounting area 50C cools, component 2C is soldered to the mounting area 50C.

[0063] The heater control unit 35 controls the heater head 13. The heater control unit 35 controls the heater head 13 so that hot air is supplied to the solder paste 60 when the component 2 is mounted to the mounting area 50 via the solder paste 60. The supply of hot air to the solder paste 60 causes the solder paste 60 to melt. As the molten solder paste 60 cools, the component 2 is fixed to the substrate 1.

[0064] Figure 15 is a diagram illustrating the operation of the heater head 13 according to the embodiment. As shown in Figure 15, the heater head 13 supplies hot air to the solder paste 60 when mounting the component 2 to the mounting area 50. When supplying hot air to the solder paste 60 in the mounting area 50 on which the component 2 is mounted, the tilt angle of the substrate 1 is adjusted so that the mounting area 50 is horizontal. The stage control unit 32 controls the stage 20 so that the mounting area 50 is horizontal. The heater control unit 35 controls the heater head 13 so that the solder paste 60 in the mounting area 50 is heated when mounting the component 2. As shown in Figure 15, in this embodiment, the heater control unit 35 heats the solder paste 60 in the mounting area 50 while the component 2 is pressed against the mounting area 50 (substrate 1) by the nozzle 23 of the mounting head 24. The heater control unit 35 controls the heater head 13 so that hot air is supplied to the solder paste 60 while the component 2 is pressed against the solder paste 60 in the horizontal mounting area 50 by the mounting head 24.

[0065] As shown in Figure 15, when hot air is supplied to the solder paste 60 in the mounting area 50A on which component 2A is mounted, the stage control unit 32 controls the stage 20 so that the mounting area 50A is in a horizontal position. The heater control unit 35 controls the heater head 13 so that hot air is supplied to the solder paste 60 in the horizontal mounting area 50A. The solder paste 60 in the mounting area 50A melts due to the supply of hot air. As the molten solder paste 60 in the mounting area 50A cools, component 2A is fixed to the mounting area 50A.

[0066] When mounting component 2B to mounting area 50B, the heater head 13 heats the solder paste 60 in mounting area 50B, and the substrate 1 is rotated so that mounting area 50B is horizontal. With component 2B pressed against the solder paste 60 in the horizontal mounting area 50B by the mounting head 24, the heater head 13 is controlled to supply hot air to the solder paste 60. The same procedure is followed when mounting component 2C to mounting area 50C and heating the solder paste 60 in mounting area 50C with the heater head 13.

[0067] [Allowable angle] The misalignment amount calculation unit 36 ​​calculates the misalignment amount ΔD of the mounted component 2 relative to the mounting area 50. The mounted component 2 on the substrate 1 is imaged by the camera 25. The misalignment amount calculation unit 36 ​​calculates the misalignment amount ΔD of the mounted component 2 based on the image data of the mounted component 2 captured by the camera 25.

[0068] Figure 16 illustrates the displacement of component 2 according to the embodiment. After component 2 is mounted on the mounting area 50 via solder paste 60, component 2 is not fixed to the mounting area 50 before the solder paste 60 is irradiated with laser light or hot air is supplied. Therefore, as shown in Figure 16, if the mounting area 50 is tilted with respect to the horizontal plane, component 2 may be displaced relative to the mounting area 50 due to the action of gravity.

[0069] For example, as shown in Figure 13, when component 2A is mounted in mounting area 50A and then component 2B is mounted in mounting area 50B, mounting area 50A is tilted with respect to the horizontal plane. When mounting area 50A is tilted with respect to the horizontal plane, component 2A may shift position due to the effect of gravity.

[0070] When calculating the displacement amount ΔD of component 2, after component 2 is mounted on the mounting area 50 via solder paste 60, and before the solder paste 60 is irradiated with laser light or hot air is supplied, component 2 is imaged by the camera 25. The displacement amount calculation unit 36 ​​can calculate the displacement amount ΔD of component 2 based on the image data of component 2 captured by the camera 25.

[0071] The allowable angle acquisition unit 37 acquires an allowable angle θ that indicates the maximum tilt angle of the component 2 at which the displacement amount ΔD of the component 2 after mounting is suppressed to be less than or equal to a predetermined specified amount. The tilt angle of the component 2 is equal to the tilt angle of the mounting area 50 on which the component 2 is mounted. The tilt angle of the component 2 and the tilt angle of the mounting area 50 are tilt angles with respect to the horizontal plane. The specified amount is a value close to zero. In this embodiment, the allowable angle θ is the maximum tilt angle at which the component 2 does not substantially shift position.

[0072] As shown in Figure 16, when the displacement amount calculation unit 36 ​​calculates the displacement amount ΔD, the stage control unit 32 tilts the mounting area 50 to an arbitrary tilt angle. The stage control unit 32 gradually increases the tilt angle of the mounting area 50 with respect to the horizontal plane from 0 degrees. The camera 25 images the components 2 mounted in the mounting area 50 as the tilt angle gradually increases. Based on the image data of the components 2 mounted in the mounting area 50 as the tilt angle gradually increases, the displacement amount calculation unit 36 ​​can calculate the maximum tilt angle of the components 2 at which the displacement amount ΔD is less than or equal to a specified value. In this embodiment, based on the image data of the components 2, the displacement amount calculation unit 36 ​​can calculate the maximum tilt angle of the components 2 at which the components 2 do not substantially shift position.

[0073] The allowable angle acquisition unit 37 acquires the maximum tilt angle of component 2 such that the positional displacement amount ΔD of component 2 calculated by the positional displacement amount calculation unit 36 ​​is less than or equal to a specified amount, as the allowable angle θ. The positional displacement amount calculation unit 36 ​​calculates the allowable angle θ for each of the multiple components 2 mounted on the substrate 1. The allowable angle acquisition unit 37 acquires the allowable angle θ for each of the multiple components 2 mounted on the substrate 1. The allowable angle θ acquired by the allowable angle acquisition unit 37 is stored in the allowable angle storage unit 41.

[0074] [Implementation Order] The mounting order determination unit 38 determines the mounting order of components 2 to a plurality of mounting areas 50 set on the surface of the substrate 1 so that the angle of the components 2 after mounting to the substrate 1 is less than or equal to an allowable angle θ. The stage control unit 32 controls the stage 20 so that the plurality of mounting areas 50 sequentially become horizontal according to the mounting order determined by the mounting order determination unit 38. The substrate 1 is rotated so that the plurality of mounting areas 50 sequentially become horizontal according to the mounting order. The head control unit 33 controls the mounting head 24 so that components 2 are sequentially mounted to the horizontal mounting areas 50 according to the mounting order determined by the mounting order determination unit 38. Components 2 are sequentially mounted to the horizontal mounting areas 50 according to the mounting order.

[0075] Figures 17 and 18 illustrate the mounting order of component 2 according to the embodiment. In the examples shown in Figures 17 and 18, the allowable angle θa of component 2A is smaller than the allowable angle θb of component 2B. Figure 17 shows an example where component 2A is mounted in mounting area 50A, and then component 2B is mounted in mounting area 50B. Figure 18 shows an example where component 2B is mounted in mounting area 50B, and then component 2A is mounted in mounting area 50A.

[0076] As shown in Figure 17(A), when mounting component 2A in mounting area 50A, the stage control unit 32 controls the stage 20 so that mounting area 50A is horizontal. As shown in Figure 17(B), after component 2A has been mounted in mounting area 50A, when mounting component 2B in mounting area 50B, the stage control unit 32 controls the stage 20 so that mounting area 50B is horizontal. Since the allowable angle θa of component 2A is small, if mounting area 50A is tilted relative to the horizontal plane, there is a high possibility that component 2A will shift position due to the effect of gravity.

[0077] As shown in Figure 18(A), when mounting component 2B in mounting area 50B, the stage control unit 32 controls the stage 20 so that mounting area 50B is horizontal. As shown in Figure 18(B), after component 2B has been mounted in mounting area 50B, when mounting component 2A in mounting area 50A, the stage control unit 32 controls the stage 20 so that mounting area 50A is horizontal. Since the allowable angle θb of component 2B is large, even if mounting area 50B is tilted relative to the horizontal plane, the possibility of component 2B shifting position is low.

[0078] As shown in Figure 18, by mounting component 2A, which has a small allowable angle θa, after mounting component 2B, which has a large allowable angle θb, positional misalignment of component 2A and component 2B is suppressed. The mounting order determination unit 38 determines the mounting order of component 2 for each of the multiple mounting areas 50 so that component 2 with a small allowable angle θ is mounted after component 2 with a large allowable angle θ is mounted. The mounting order determination unit 38 determines the mounting order so that the mounted component 2 does not exceed the allowable angle θ when subsequent components 2 are mounted.

[0079] The mounting order of the components 2 determined by the mounting order determination unit 38 is stored in the mounting order storage unit 42. By mounting the components 2 according to the mounting order, misalignment of the components 2 is suppressed.

[0080] [Handling of parts whose misalignment cannot be corrected] Due to factors such as the weight of component 2, the size of component 2, and the shape of circuit board 1, there may be some component 2 whose mounting angle remains below the allowable angle θ even after the mounting order has been adjusted. In other words, there may be some component 2 whose misalignment cannot be resolved even after the mounting order has been adjusted.

[0081] In the following explanation, component 2 whose misalignment is resolved by adjusting the mounting order will be referred to as an "acceptable component," and component 2 whose misalignment is not resolved even when the mounting order is adjusted will be referred to as an "unacceptable component."

[0082] Figures 19 and 20 illustrate a component 2 in which the misalignment according to the embodiment is not resolved. In the example shown in Figures 19 and 20, the mounting area 50 set on the surface of the substrate 1 includes mounting area 50D, mounting area 50E, and mounting area 50F. Solder paste 60 is applied to each of the multiple mounting areas 50. Component 2 includes component 2D mounted in mounting area 50D, component 2E mounted in mounting area 50E, and component 2F mounted in mounting area 50F. The allowable angle θf of component 2F is large. The allowable angle θd of component 2D and the allowable angle θe of component 2E are small. Component 2F is an allowable component. Component 2D and component 2E are both non-allowable components. Figure 19 shows an example in which component 2D is mounted in mounting area 50D, and then component 2E is mounted in mounting area 50E. Figure 20 shows an example where component 2E is mounted in mounting area 50E, and then component 2D is mounted in mounting area 50D. Component 2F is already mounted in mounting area 50F.

[0083] As shown in Figure 19(A), when mounting component 2D in mounting area 50D, the stage control unit 32 controls the stage 20 so that mounting area 50D is horizontal. As shown in Figure 19(B), after component 2D has been mounted in mounting area 50D, when mounting component 2E in mounting area 50E, the stage control unit 32 controls the stage 20 so that mounting area 50E is horizontal. Since the allowable angle θd of component 2D is small, if mounting area 50D is tilted relative to the horizontal plane, there is a high possibility that component 2D will shift position due to the effect of gravity.

[0084] As shown in Figure 20(A), when mounting component 2E in mounting area 50E, the stage control unit 32 controls the stage 20 so that mounting area 50E is horizontal. As shown in Figure 20(B), after component 2E has been mounted in mounting area 50E, when mounting component 2D in mounting area 50D, the stage control unit 32 controls the stage 20 so that mounting area 50D is horizontal. Since the allowable angle θe of component 2E is small, if the mounting area 50E is tilted relative to the horizontal plane, there is a high possibility that component 2E will shift position due to the effect of gravity.

[0085] In other words, if component 2D is mounted in mounting area 50D and then component 2E is mounted in mounting area 50E, component 2D may not be at an angle less than or equal to the allowable angle θd when component 2E is mounted, potentially causing component 2D to be misaligned. If component 2E is mounted in mounting area 50E and then component 2D is mounted in mounting area 50D, component 2E may not be at an angle less than or equal to the allowable angle θe when component 2D is mounted, potentially causing component 2E to be misaligned. In other words, there may be cases where it is impossible to mount component 2D (first component) at an angle less than or equal to the allowable angle θd when component 2E (second component) is mounted after component 2D (first component) is mounted in mounting area 50D (first mounting area). There may also be cases where it is impossible to reverse the mounting order and mount component 2E (first component) at an angle less than or equal to the allowable angle θe when component 2D (second component) is mounted after component 2E (first component) is mounted in mounting area 50E (first mounting area).

[0086] In situations like those shown in Figures 19 and 20, where component 2D is mounted on the mounting area 50D but component 2E is mounted, component 2D may not be at an allowable angle θd or less, and even if the mounting order is reversed, component 2E may not be at an allowable angle θe or less when component 2D is mounted on the mounting area 50E after component 2E has been mounted. In such cases, the heater control unit 35 controls the heater head 13 so that the solder paste 60 in the mounting area 50D is heated during the mounting of component 2D. After the solder paste 60 in the mounting area 50D is heated and then cooled, component 2D is fixed to the substrate 1 via the solder paste 60. Component 2D is fixed to the substrate 1 before the substrate 1 is tilted for the mounting of component 2E. If the mounting order is reversed, the heater control unit 35 controls the heater head 13 so that the solder paste 60 in the mounting area 50E is heated during the mounting of component 2E. After the solder paste 60 in the mounting area 50E is heated and then cooled, component 2E is fixed to the substrate 1 via the solder paste 60. Component 2E is fixed to the substrate 1 before the substrate 1 is tilted for mounting component 2D.

[0087] Figures 21 and 22, respectively, illustrate the operation of the 3D mounting apparatus 10 when there are parts 2 whose misalignment according to the embodiment cannot be resolved.

[0088] As shown in Figure 21, when mounting component 2D in the mounting area 50D, the stage control unit 32 controls the stage 20 so that the mounting area 50D is in a horizontal position. When component 2D is mounted in the mounting area 50D while the horizontal position of the mounting area 50D is maintained, hot air is supplied to the solder paste 60 in the mounting area 50D.

[0089] As shown in Figure 21(A), when mounting a component 2D to the mounting area 50D, the mounting head 24 brings the nozzle 23 holding the component 2D closer to the mounting area 50D. The mounting head 24 lowers the nozzle 23 holding the component 2D so that the component 2D approaches the mounting area 50D. In this embodiment, the heater control unit 35 moves the heater head 13 closer to the mounting area 50D in synchronization with the approach of the nozzle 23 (component 2D) to the mounting area 50D. The heater control unit 35 lowers the heater head 13 in synchronization with the lowering of the nozzle 23 holding the component 2D so that the nozzle of the hot air nozzle 13B approaches the solder paste 60 in the mounting area 50D.

[0090] As shown in Figure 21(B), with the component 2D pressed against the solder paste 60 in the mounting area 50D by the mounting head 24, hot air is supplied from the heater head 13 to the solder paste 60 in the mounting area 50D. The hot air cools the molten solder paste 60, fixing the component 2D in place in the mounting area 50D. After the component 2D is fixed in place in the mounting area 50D, the nozzle 23 of the mounting head 24 moves away from the mounting area 50D. After the component 2D is fixed in place in the mounting area 50D, the nozzle 23 of the mounting head 24 rises away from the component 2D. The heater control unit 35 moves the heater head 13 away from the mounting area 50D in synchronization with the movement of the nozzle 23 away from the mounting area 50D. The heater head 13 rises away from the substrate 1 in synchronization with the rise of the nozzle 23.

[0091] As shown in Figure 22, after component 2D is fixed to the mounting area 50D, component 2E is mounted to the mounting area 50E. When mounting component 2E to the mounting area 50E, the stage control unit 32 controls the stage 20 so that the mounting area 50E becomes horizontal. When the mounting area 50E becomes horizontal, the mounting area 50D is tilted with respect to the horizontal plane. Since component 2D is fixed to the mounting area 50D via solder paste 60, even if the tilt angle of the mounting area 50D exceeds the allowable angle θd, displacement of component 2D is suppressed. When component 2E is mounted to the mounting area 50E while the horizontal state of the mounting area 50E is maintained, hot air is supplied to the solder paste 60 in the mounting area 50E.

[0092] As shown in Figure 22(A), when mounting component 2E onto the mounting area 50E, the mounting head 24 moves the nozzle 23 holding component 2E closer to the mounting area 50E. The heater control unit 35 moves the heater head 13 closer to the mounting area 50E in synchronization with the approach of the nozzle 23 (component 2E) to the mounting area 50E. As shown in Figure 22(B), with component 2E pressed against the solder paste 60 in the mounting area 50E by the mounting head 24, hot air is supplied from the heater head 13 to the solder paste 60 in the mounting area 50E. The solder paste 60 melted by the hot air is cooled, fixing component 2E in place in the mounting area 50E. After component 2E is fixed in place in the mounting area 50E, the nozzle 23 of the mounting head 24 moves away from the mounting area 50E. The heater control unit 35 moves the heater head 13 away from the mounting area 50E in synchronization with the moving of the nozzle 23 away from the mounting area 50E.

[0093] The component 2 may be soldered to the substrate 1 or temporarily fixed by heating the solder paste 60 with the heater head 13. Temporary fixing refers to a state where the component 2 is fixed to the substrate 1 by the flux solidifying, even though the solder does not melt. When the component 2 is temporarily fixed to the substrate 1 by the hot air from the heater head 13, the laser head 12 irradiates the solder paste 60 with laser light so that the component 2 is soldered to the substrate 1. When the solder paste 60 is irradiated with laser light, the solder melts and then solidifies, soldering the component 2 to the substrate 1. In other words, when a non-permitted component is temporarily fixed to the substrate 1 via the solder paste 60 by the heater head 13, the laser control unit 34 controls the laser head 12 so that the laser light is irradiated onto the solder paste 60 heated by the heater head 13, and the non-permitted component is soldered.

[0094] [Method for determining the implementation order] Figure 23 is a flowchart showing the method for determining the mounting order of component 2 according to the embodiment. When determining the mounting order, a test board 1 and test component 2 are used.

[0095] The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are sequentially brought into a horizontal position. The dispenser control unit 31 controls the dispenser 11 so that solder paste 60 is applied to each of the multiple mounting areas 50 on the substrate 1 (step SA1).

[0096] The head control unit 33 controls the mounting head 24 so that the component 2 is mounted in the horizontal mounting area 50 (step SA2).

[0097] The positional displacement calculation unit 36 ​​causes the camera 25 to image the component 2 in the mounting area 50 (step SA3).

[0098] The positional displacement amount calculation unit 36 ​​calculates the positional displacement amount ΔD of each part 2 based on the image data of the part 2 captured in step SA3 (step SA4). It is determined whether the positional displacement amount ΔD calculated by the positional displacement amount calculation unit 36 ​​is less than or equal to a specified amount (step SA5).

[0099] In step SA5, if it is determined that the positional displacement amount ΔD is less than or equal to a specified amount (step SA5: Yes), the stage control unit 32 increases the inclination angle of the mounting area 50, and the positional displacement amount calculation unit 36 ​​repeats the imaging and calculation of the positional displacement amount ΔD (step SA6).

[0100] In step SA5, if it is determined that the misalignment amount ΔD exceeds a specified amount (step SA5: No), the misalignment amount calculation unit 36 ​​stores the inclination angle before the misalignment amount ΔD exceeded the specified amount as the allowable angle θ of the inclination angle of the part 2 in the allowable angle storage unit 41 (step SA7).

[0101] The process from step SA3 to step SA7 is performed for each component 2 mounted on the circuit board 1. The allowable angle θ stored in the allowable angle storage unit 41 can be applied to other circuit boards 1 if the same component 2 is used.

[0102] The mounting order determination unit 38 determines the mounting order of the components 2 to the multiple mounting areas 50 based on the allowable angle θ of each of the multiple components 2.

[0103] The mounting order determination unit 38 tentatively determines the mounting order based, for example, on the optimal mounting order for a conventional planar substrate (step SA8).

[0104] The mounting order determination unit 38 checks whether each component 2 becomes an acceptable or unacceptable component when mounted according to the mounting order (step SA9).

[0105] The mounting order determination unit 38 moves the mounting order of non-acceptable components to the end and checks whether each component 2 is an acceptable or non-acceptable component (step SA10).

[0106] The mounting order determination unit 38 repeats the rearrangement and checking of the mounting order until the identification of acceptable and unacceptable parts no longer changes (step SA11).

[0107] The mounting order determination unit 38 stores the mounting order and the identification of permissible and non-permissible components in that order in the mounting order storage unit 42 (step SA12).

[0108] By doing this, components 2 with a small allowable angle θ, i.e., components prone to misalignment, are mounted later, making them less susceptible to the tilt of the circuit board 1 during the mounting of other components 2. As a result, the number of allowable components increases and the number of non-allowable components decreases, enabling continuous mounting operation and shortening the mounting cycle time.

[0109] [Implementation Method] Figure 24 is a flowchart showing the mounting method of component 2 according to the embodiment.

[0110] The dispenser control unit 31 controls the dispenser 11 so that solder paste 60 is applied to each of the multiple mounting areas 50 on the substrate 1 (step SB1).

[0111] The stage control unit 32 controls the stage 20 so that the multiple mounting areas 50 are sequentially brought into a horizontal state according to the mounting order stored in the mounting order storage unit 42. The head control unit 33 controls the mounting head 24 so that the components 2 are sequentially mounted on the horizontal mounting areas 50 according to the mounting order stored in the mounting order storage unit 42, and mounts the permissible components (step SB2).

[0112] The head control unit 33 determines whether or not there are any non-permissible parts (step SB3).

[0113] If it is determined in step SB3 that an unacceptable component exists (step SB3: Yes), the head control unit 33 mounts the unacceptable component in the mounting area 50 (step SB4).

[0114] As described with reference to Figures 21 and 22, the heater control unit 35 controls the heater head 13 so that after the non-permitted component is mounted in the mounting area 50, hot air is supplied to the solder paste 60 of the non-permitted component while the mounting area 50 remains horizontal (step SB5).

[0115] The head control unit 33 determines whether or not the mounting of all non-permissible components has been completed (step SB6).

[0116] If it is determined in step SB6 that the mounting of the non-acceptable component has not been completed (step SB6: No), the process returns to step SB4.

[0117] In step SB6, if it is determined that the mounting of the non-acceptable components has been completed (step SB6: Yes), the laser control unit 34 controls the laser head 12 so that the laser beam is irradiated onto the solder paste 60 of both the non-acceptable and acceptable components (step SB7).

[0118] The laser control unit 34 controls the laser head 12 so that the laser beam is sequentially irradiated onto the solder paste 60 of each of the multiple components 2. Similarly, if it is determined in step SB3 that there are no non-acceptable components (step SB3: No), the laser control unit 34 controls the laser head 12 so that the laser beam is irradiated onto the solder paste 60 of each of the multiple components 2 (acceptable components) (step SB7).

[0119] The soldering sequence using the laser beam at this time is the reverse of the component mounting sequence, which prevents the allowable components before soldering from being tilted beyond the angle at which they will be mounted.

[0120] [effect] As described above, according to the embodiment, the mounting order of component 2 is determined based on the allowable angle θ of component 2. Since the mounting order of component 2 is determined so that the angle of component 2 after mounting is less than or equal to the allowable angle θ, misalignment of component 2 is suppressed.

[0121] The 3D mounting device 10 is designed to achieve an optimal cycle time and increase productivity when continuously picking up and mounting components 2. According to the present invention, by identifying permissible and non-permissible components, permissible components can be mounted by continuous picking up and mounting as in the conventional method, and the decrease in cycle time can be minimized even in 3D mounting where components are mounted while the substrate 1 is tilted.

[0122] If, after mounting the first component 2 to the first mounting area 50, it is not possible to mount the second component 2 in a way that keeps the first component 2 at an angle less than or equal to the allowable angle θ, the heater head 13 is controlled so that the solder paste 60 in the first mounting area 50 is heated during the mounting of the first component 2. Since the first component 2 is fixed to the substrate 1 via the solder paste 60 by the heater head 13, displacement of the first component 2 is suppressed even if the substrate 1 is tilted for mounting the second component 2.

[0123] With the component 2 pressed against the mounting area 50 by the mounting head 24, the solder paste 60 in the mounting area 50 is heated by the heater head 13. Because the component 2 is pressed against the mounting area 50 by the mounting head 24, the solder paste 60 is fixed in place by the heater head 13 while the displacement of the component 2 is suppressed.

[0124] [Other embodiments] Figure 25 is a schematic diagram showing the allowable angle storage unit 41 according to the embodiment. In the above embodiment, the allowable angle θ is calculated based on image data of the component 2 captured by the camera 25. The allowable angle θ of the component 2 may be measured by a measuring device other than the 3D mounting device 10. As shown in Figure 25, correlation data (allowable angle table) between the component 2 and the allowable angle θ measured by the other measuring device may be stored in the allowable angle storage unit 41. The allowable angle acquisition unit 37 can acquire the allowable angle θ of the component 2 from the allowable angle storage unit 41.

[0125] Figure 26 is a schematic diagram showing a controller 16 according to an embodiment. As shown in Figure 26, the controller 16 may have an allowable angle calculation unit 39 that calculates the allowable angle θ of the component 2 based on the weight of the component 2. The allowable angle acquisition unit 37 may acquire the allowable angle θ from the allowable angle calculation unit 39. The weight of the component 2 and the allowable angle θ are correlated. The larger the weight of the component 2, the smaller the allowable angle θ. The allowable angle calculation unit 39 may calculate the allowable angle θ considering not only the weight of the component 2, but also the volume of the component 2 and the physical properties of the solder paste 60. By considering not only the weight of the component 2, but also the volume of the component 2 and the physical properties of the solder paste 60, the accuracy of calculating the allowable angle θ is improved.

[0126] Figure 27 is a diagram illustrating the relationship between the solder paste 60 and the heater head 13 according to the embodiment. As described above, the heater head 13 has a heating unit 13A and a hot air nozzle 13B having an injection port 13C. The heater control unit 35 may change the size of the injection port 13C based on the volume of the solder paste 60. As described above, the hot air nozzle 13B attached to the heating unit 13A is replaceable. Multiple hot air nozzles 13B with mutually different sizes of injection ports 13C are housed in the nozzle stocker 14. The heater control unit 35 can change the size of the injection port 13C by replacing the hot air nozzles 13B attached to the heating unit 13A based on the volume of the solder paste 60. For example, the heater control unit 35 may increase the opening area (nozzle diameter) of the injection port 13C as the volume of a single solder paste 60 increases.

[0127] The heater control unit 35 may change the flow rate of hot air injected from the nozzle 13C of the hot air nozzle 13B based on the volume of solder paste 60. For example, the heater control unit 35 may increase the flow rate of hot air injected from the nozzle 13C as the volume of a single solder paste 60 increases.

[0128] The heater control unit 35 may adjust the temperature of the hot air sprayed from the nozzle 13C of the hot air nozzle 13B based on the melting temperature of the solder paste 60. The heater control unit 35 may also adjust the relative position between the nozzle 13C and the solder paste 60 so that the hot air sprayed from the nozzle 13C does not directly hit the component 2 or the substrate 1.

[0129] In the above-described embodiment, the heater head 13 heats the solder paste 60 with hot air. The heater head 13 may also heat the solder paste 60 by irradiating it with, for example, halogen light or infrared light. The heater head 13 should heat the solder paste 60 without contact with it. [Explanation of Symbols]

[0130] 1...Substrate, 1A...Base material, 1B...Film, 2...Component, 2A...Component, 2B...Component, 2C...Component, 2D...Component, 2E...Component, 2F...Component, 3...Pallet, 4...Support member, 4A...Base part, 4B...Guard part, 4C...Pin part, 4D...Hole, 5...Clamping mechanism, 5A...Support part, 5B...Movable part, 10...3D mounting device, 11...Dispenser, 12...Laser head, 13...Heater head, 13A...Heating part, 13B...Hot air nozzle, 13C...Spray nozzle, 14...Nozzle stocker, 16...Controller, 16A...Processor, 16B...Main memory, 16C...Storage, 16D...Interface, 18...Base member, 19...Transport device, 19A...Transport belt, 19B...Guide member, 20...Stage, 20A...Positioning 21...Stage moving device, 22...Parts supply device, 23...Nozzle, 23A...Shaft, 24...Mounting head, 25...Camera, 27...Head moving device, 27X...X-axis moving device, 27Y...Y-axis moving device, 28...Nozzle moving device, 29...Chamber, 31...Dispenser control unit, 32...Stage control unit, 33...Head control unit, 34...Laser control unit, 35...Heater control unit, 36...Position deviation amount calculation unit, 37...Allowable angle acquisition unit, 38...Mounting order determination unit, 39...Allowable angle calculation unit, 41...Allowable angle storage unit, 42...Mounting order storage unit, 50...Mounting area, 50A...Mounting area, 50B...Mounting area, 50C...Mounting area, 50D...Mounting area, 50E...Mounting area, 50F...Mounting area, 60...Solder paste.

Claims

1. A stage that supports a three-dimensional circuit board having a surface on which a mounting area with solder paste applied is set, A mounting head for mounting components in the aforementioned mounting area, A heater head for heating the aforementioned solder paste, Equipped with a controller, The aforementioned controller, An allowable angle acquisition unit that acquires the allowable angle indicating the maximum tilt angle of a component in which the amount of positional deviation after implementation is suppressed to a specified amount or less, A mounting order determination unit that determines the mounting order of components to multiple mounting areas so that the angle of the mounted components is below the allowable angle, A stage control unit controls the stage so that the multiple mounting areas are sequentially brought into a horizontal state according to the aforementioned mounting order, A head control unit controls the mounting head so that components are sequentially mounted in the horizontal mounting area according to the aforementioned mounting order, The device includes a heater control unit that controls the heater head so that the solder paste in the first mounting area is heated when mounting the first component, after mounting the first component to the first mounting area and when mounting the second component, if it is not possible to mount the first component to an angle below the allowable angle, 3D packaging device.

2. The heater control unit heats the solder paste in the first mounting area while the first component is pressed against the first mounting area by the mounting head. The three-dimensional mounting apparatus according to claim 1.

3. The mounting head has a nozzle for holding the first component, and in mounting the first component, the nozzle holding the first component is brought close to the first mounting area. The heater control unit moves the heater head closer to the first mounting area in synchronization with the approach of the nozzle to the first mounting area. The three-dimensional mounting apparatus according to claim 1.

4. The nozzle moves away from the first mounting area after the first component has been fixed in the first mounting area. The heater control unit moves the heater head away from the first mounting area in synchronization with the separation of the nozzle from the first mounting area. The three-dimensional mounting apparatus according to claim 3.

5. The heater head supplies hot air to the solder paste to heat the solder paste. The three-dimensional mounting apparatus according to claim 1.

6. The heater control unit changes the flow rate of the hot air based on the volume of the solder paste. The three-dimensional mounting apparatus according to claim 5.

7. The heater head has a hot air nozzle having an outlet for injecting the hot air, The heater control unit changes the size of the nozzle based on the volume of the solder paste. The three-dimensional mounting apparatus according to claim 5.

8. The heater head has a heating section to which the hot air nozzle is attached and detached, and which heats the air to generate the hot air. The nozzle stocker accommodates a plurality of hot air nozzles, each having a different size for its nozzle opening. The heater control unit changes the size of the nozzle by replacing the hot air nozzle attached to the heating unit. The three-dimensional mounting apparatus according to claim 7.

9. The controller has a positional displacement calculation unit that calculates the amount of positional displacement of the mounted component based on image data of the mounted component, The allowable angle acquisition unit acquires the maximum value of the inclination angle of the part at which the positional displacement amount calculated by the positional displacement amount calculation unit is less than or equal to the specified amount as the allowable angle. The three-dimensional mounting apparatus according to claim 1.

10. The controller has a tolerance angle storage unit that stores correlation data between the component and the tolerance angle, The allowable angle acquisition unit acquires the allowable angle from the allowable angle storage unit. The three-dimensional mounting apparatus according to claim 1.

11. The controller has an allowable angle calculation unit that calculates the allowable angle based on the weight of the component, The allowable angle acquisition unit acquires the allowable angle from the allowable angle calculation unit. The three-dimensional mounting apparatus according to claim 1.

12. The mounting order determination unit determines the mounting order such that the mounted component does not exceed the allowable angle when subsequent components are mounted. The three-dimensional mounting apparatus according to claim 1.

13. The system includes a laser head that irradiates the solder paste with laser light after the components have been mounted in the aforementioned mounting area. The aforementioned controller, The system includes a laser control unit that controls the laser head so that a laser beam is irradiated onto the solder paste heated by the heater head, thereby performing soldering of the first component. The three-dimensional mounting apparatus according to claim 1.

14. To obtain the maximum allowable angle of inclination of a component that, after being mounted on a mounting area set on the surface of a three-dimensional circuit board and to which solder paste has been applied, has its positional displacement after mounting suppressed to a specified amount or less, and The mounting order of components to multiple mounting areas is determined so that the angle of the mounted components is below the allowable angle, The three-dimensional substrate is rotated so that the multiple mounting areas are sequentially brought into a horizontal position according to the aforementioned mounting order, The components are sequentially mounted in the horizontal mounting area according to the aforementioned mounting order, If, after mounting the first component to the first mounting area, it is not possible to mount the second component in a way that keeps the first component below an acceptable angle, the method includes heating the solder paste of the first mounting area during the mounting of the first component. 3D implementation method.

Images