Correction method, mold manufacturing method, imprint method, article manufacturing method, and information processing device.

Abstract

This technology provides advantages for the precise manufacturing of molds used in imprint technology. [Solution] A correction method for correcting the pattern design data of a mold used in an imprint process to form a pattern on an imprint material on a substrate using an information processing device includes: an acquisition step of acquiring the actual volume of a concave pattern element formed on a test mold; a determination step of determining a correction value for correcting the difference between the actual volume and the design volume of the pattern element based on the dimensions of the pattern element in a plane direction parallel to the surface of the test mold; and a correction step of correcting the design data based on the correction value.

Description

Technical Field

[0001] The present invention relates to a correction method, a mold manufacturing method, an imprint method, an article manufacturing method, and an information processing device.

Background Art

[0002] In recent years, as one of the lithography techniques for realizing the demand for miniaturization of semiconductor devices and the like, the development of imprint technology has been progressing. The imprint technology is a technique for forming a pattern on an imprint material on a substrate by curing the imprint material in a state where a mold having a concavo-convex pattern is brought into contact with the imprint material on the substrate. In the imprint technology, for example, as described in Patent Document 1, based on the design data (layout data) of the pattern of the mold, an arrangement pattern (drop pattern) of the imprint material supplied as a plurality of droplets on the substrate can be generated. By using such an imprint technology, a fine concavo-convex structure on the order of nanometers composed of a cured film of the imprint material can be formed on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Unlike a mask used in other lithography techniques (for example, an exposure apparatus), a mold used in the imprint technology is provided with a pattern in which a plurality of concave pattern elements are arranged three-dimensionally. However, the volume of each pattern element in the mold may differ from the design value (design volume) due to the manufacturing process or the like. In this case, it may be difficult to accurately form a pattern on the imprint material on the substrate using the mold.

[0005] Therefore, the present invention aims to provide a technology that is advantageous for accurately manufacturing molds used in imprint technology. [Means for solving the problem]

[0006] To achieve the above objective, a correction method as one aspect of the present invention is a correction method for correcting the pattern design data of a mold used in an imprint process for forming a pattern on an imprint material on a substrate using an information processing device, characterized in that it includes: an acquisition step of acquiring the actual volume of a concave pattern element formed on a test mold; a determination step of determining a correction value for correcting the difference between the actual volume and the design volume of the pattern element by the dimensions of the pattern element in a plane direction parallel to the surface of the test mold; and a correction step of correcting the design data based on the correction value.

[0007] Further objects or other aspects of the present invention will be revealed by preferred embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0008] According to the present invention, for example, it is possible to provide a technology that is advantageous for accurately manufacturing molds used in imprint technology. [Brief explanation of the drawing]

[0009] [Figure 1] Schematic diagram showing an example configuration of an imprint device. [Figure 2] Schematic diagram showing an example of the correction system configuration. [Figure 3] Flowchart showing the method for correcting design data in the first embodiment [Figure 4] Schematic diagram illustrating the definition of area and dimensions of pattern elements. [Figure 5] A flowchart illustrating how to determine the amount of data bias. [Figure 6]A schematic diagram illustrating the parameters used to determine the amount of data bias. [Figure 7] A diagram showing an example of correction information. [Figure 8] A schematic diagram illustrating an example of correcting the dimensions of pattern elements in mold design data in the planar direction according to the data bias amount. [Figure 9] A schematic diagram showing an example of mold design data before correction. [Figure 10] A diagram showing an example of correction information. [Figure 11] Flowchart showing the method for correcting design data in the third embodiment [Figure 12] Schematic diagram showing the configuration and arrangement of the first and second pattern elements. [Figure 13] This figure shows an example of the results after correcting the mold design data. [Figure 14] Diagrams to explain the manufacturing method of an item. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] In this specification and accompanying drawings, unless otherwise specified, directions are indicated in an XYZ coordinate system where the plane direction parallel to the surface on which the relief pattern is formed in the mold is defined as the XY direction. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are defined as the X direction, Y direction, and Z direction, respectively, and the rotations around the X, Y, and Z axes are defined as θX, θY, and θZ, respectively. Control or driving with respect to the X, Y, and Z axes means control or driving with respect to the direction parallel to the X, Y, and Z axes, respectively. Control or driving with respect to the θX, θY, and θZ axes means control or driving with respect to the rotation around the axis parallel to the X, Y, and Z axes, respectively. Position is information that can be determined based on the coordinates of the X, Y, and Z axes, and orientation is information that can be determined by the values ​​of the θX, θY, and θZ axes.

[0012] <First Embodiment> A first embodiment of the present invention will be described. The imprint apparatus is a lithography apparatus that forms a pattern on an imprint material (composition) on a substrate using a mold, and can be used in lithography processes for manufacturing semiconductor devices, magnetic storage media, and the like. The imprint apparatus brings the uncured imprint material supplied to the substrate into contact with the mold and applies curing energy to the imprint material, thereby forming a pattern on the substrate of a cured material onto which the pattern of the mold has been transferred. Such a process is called imprint processing and is performed for each of the multiple shot areas (imprint areas) on the substrate. In this embodiment, an example will be described in which a photocuring method is employed in which the imprint material on the substrate is cured by irradiating it with light (ultraviolet light).

[0013] Figure 1 is a schematic diagram showing an example configuration of the imprint apparatus 10 of this embodiment. The imprint apparatus 10 of this embodiment may include a light irradiation unit 11, a mold holding unit 12, a substrate stage 13, a supply unit 14, and a control unit 15. The control unit 15 is composed of a computer (information processing device) having, for example, a processor such as a CPU (Central Processing Unit) and a storage unit such as memory, and controls the imprint process by controlling each part of the imprint apparatus 10.

[0014] The light irradiation unit 11 (curing unit) cures the imprint material IM by irradiating it with light 11a (e.g., ultraviolet light) while the mold M and the imprint material IM on the substrate S (on the shot area) are in contact during the imprint process. The light irradiation unit 11 may include, for example, a light source and an optical element for adjusting the light emitted from the light source to light suitable for the imprint process.

[0015] The mold holding unit 12 is a mechanism that holds the mold M and moves the mold M in the Z direction. Specifically, the mold holding unit 12 may have a mold chuck that holds the mold M by vacuum suction or the like, and a mold driving mechanism that drives the mold M (mold chuck). The mold holding unit 12 drives the mold M in the Z direction during the process of bringing the mold M into contact with the imprint material IM on the substrate S (contact process) and the process of separating the mold M from the hardened imprint material IM on the substrate S (release process). Furthermore, the mold holding unit 12 may be configured to have a position adjustment function for adjusting the position of the mold M not only in the Z direction, but also in the X direction, Y direction, and rotational directions around each axis (θX, θY, θZ direction).

[0016] The mold M typically has a rectangular outer shape and is made of a material that can transmit light 11a (ultraviolet light), such as quartz glass. A mesa portion Ma is provided in a part of the surface of the mold M that faces the substrate S, which is configured as a mesa shape with a step of, for example, several tens of micrometers. The surface of the mesa portion Ma on the substrate S side is a contact surface that contacts the imprint material IM on the substrate S, and is configured as a pattern surface in which a three-dimensional pattern of raised and recessed patterns to be transferred to the imprint material IM on the substrate S, such as a circuit pattern, is formed. Hereinafter, the mesa portion Ma on which the raised and recessed pattern is formed may be referred to as the "pattern portion Ma".

[0017] The substrate stage 13 is a mechanism that moves the substrate S in the XY direction while holding it. Specifically, the substrate stage 13 has a substrate chuck that holds the substrate S by vacuum suction or the like, and a substrate drive mechanism that drives the substrate S (substrate chuck). The substrate stage 13 drives the substrate S in the XY direction for alignment between the mold M (pattern area Ma) and the substrate S (shot area). The substrate stage 13 may be composed of multiple drive systems, such as a coarse drive system and a fine drive system, for each of the X and Y directions. Furthermore, the substrate stage 13 may be configured to have a position adjustment function for adjusting the position of the substrate S not only in the XY direction, but also in the Z direction and rotational directions around each axis (θX, θY, θZ directions).

[0018] Here, the contact and release processes in the imprinting process may be achieved by driving the mold M in the Z direction with the mold holding unit 12, or by driving the substrate S in the Z direction with the substrate stage 13. Alternatively, the contact and release processes may be achieved by driving the mold M and the substrate S relative to each other in the Z direction with both the mold holding unit 12 and the substrate stage 13.

[0019] The substrate S can be made from materials such as glass, ceramics, metal, semiconductor, or resin. If necessary, a component made of a different material may be provided on the surface of the substrate S. The substrate S may be, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

[0020] The supply unit 14 supplies imprint material IM onto the substrate S as multiple droplets. The supply unit 14 may also be understood as a dispensing head (dispenser) that discharges the imprint material IM as multiple droplets toward the substrate S. For example, while the substrate S is moved in the XY direction by the substrate stage 13 below the supply unit 14, the supply unit 14 is discharged with the imprint material IM as multiple droplets. This allows the imprint material IM to be supplied (placed) as multiple droplets on the substrate S (shot area).

[0021] The imprint material IM supplied onto the substrate S is a curable composition (sometimes called an uncured resin) that hardens when curing energy is applied. The curable composition is a composition that hardens by irradiation with light or by heating. Of these, the photocurable composition that hardens by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as needed. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal release agents, surfactants, antioxidants, polymer components, etc. The viscosity of the viscous material (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0022] The imprint apparatus 10 configured as described above sequentially performs imprint processing on each of the multiple shot areas on the substrate S. In the imprint processing, first, the supply unit 14 supplies the imprint material IM as multiple droplets onto the substrate S (specifically, the shot areas to be imprinted) (supply step). Then, the substrate stage 13 positions the substrate S below the mold M, and the mold holding unit 12 drives the mold M in the -Z direction to bring the pattern portion Ma of the mold M into contact with the imprint material IM on the substrate S (contact step). After aligning the mold M and the substrate S, the light irradiation unit 11 irradiates the imprint material IM with light 11a to cure the imprint material IM (curing step). After the imprint material IM has cured, the mold M is separated from the imprint material IM on the substrate S (release step). This makes it possible to form an uneven pattern consisting of the cured imprint material IM on the substrate S.

[0023] Incidentally, as mentioned above, the mold M used in the imprint apparatus 10 is provided with a relief pattern consisting of multiple concave pattern elements arranged in three dimensions. The relief pattern of the mold M is created based on design data such as CAD data, but due to manufacturing processes such as development and etching, the volume of each pattern element actually formed on the mold M (hereinafter sometimes referred to as the actual volume) may differ from the design volume. In this case, it may become difficult to accurately form a pattern on the imprint material IM on the substrate S by imprint processing using the mold M. Furthermore, creating design data from the beginning to reduce the error between the actual volume and the design volume of each pattern element would take a considerable amount of time and is therefore not advisable. Therefore, in this embodiment, we propose a method for correcting the design data of the mold M pattern so as to reduce the error between the actual volume and the design volume of each pattern element.

[0024] Figure 2 shows an example configuration of a correction system 20 for correcting design data. The correction system 20 may include an information processing device 21 and a measuring device 22. Information and data are transmitted and received between the information processing device 21 and the measuring device 22 via a network 23. The correction system 20 may also be equipped with the above-mentioned imprint device 10, in which case the imprint device 10 may also be connected to the network 23.

[0025] The information processing device 21 is composed of a computer having, for example, a processor 21a such as a CPU (Central Processing Unit) and a storage unit 21b such as memory. The storage unit 21b stores a correction program for correcting design data, and the processor 21a can correct the design data by reading and executing the correction program stored in the storage unit 21b. The information processing device 21 may be composed of, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), or a general-purpose computer with a program installed, or a combination of all or part of these.

[0026] The measuring device 22 (measuring unit) measures the area and dimensions (size) of each of the multiple types of pattern elements formed on the test mold, which will be described later. Specifically, for each of the multiple types of pattern elements, the measuring device 22 measures the area and dimensions of the region opened by the pattern element on the surface of the test mold, the area and dimensions of the bottom surface of the pattern element, and the depth of the pattern element. As a result, the information processing device 21 (processor 21a) can obtain (calculate) the actual volume of each type of pattern element based on the measurement results of the measuring device 22 acquired via the network 23. Examples of measuring devices 22 include electron microscopes (Top View SEM), atomic force microscopes (AFM), and cross-sectional SEMs.

[0027] Figure 3 is a flowchart showing the method for correcting design data in this embodiment. In the flowchart of Figure 3, step S12 is performed by the measuring device 22, and steps S13 to S16 can be performed by the information processing device 21 (processor 21a).

[0028] In step S11, a test mold is prepared. The test mold is a mold used to determine conditions in order to obtain in advance process errors that may occur in the manufacturing process of the mold M used in the imprint device 10. Step S11 may include the steps of creating design data for the test mold (hereinafter sometimes referred to as test design data) and manufacturing the test mold based on the test design data.

[0029] The test mold of this embodiment includes multiple types of pattern elements that can constitute the pattern of the mold M actually used in the imprint device 10, and may further include other pattern elements. Each of the multiple types of pattern elements is formed concavely in the test mold by being carved from the surface of the test mold and has a tapered shape in the depth direction due to the manufacturing process. Each of the multiple types of pattern elements may be understood as an element that extracts (simulates) a part of the pattern of the mold M, or it may be a collection of multiple separate sub-elements (e.g., multiple geometric figures). Furthermore, the multiple types of pattern elements have different configuration conditions. The configuration conditions may include at least one of the following: dimensions, depth, perimeter (outer circumference), pitch of the multiple sub-elements, and occupancy density per unit area (density of sub-elements). Here, the test design data may be understood as layout data showing the layout of the multiple types of pattern elements in the test mold, and may be created as two-dimensional or three-dimensional data. The creation of the test design data may be performed by the information processing device 21.

[0030] In step S12, the area and dimensions of each of the multiple types of pattern elements formed on the test mold are measured using the measuring device 22. Specifically, for each of the multiple types of pattern elements, the area and dimensions of the region opened by the pattern element on the surface of the test mold, the area and dimensions of the bottom surface of the pattern element, and the depth of the pattern element are measured by the measuring device 22.

[0031] In step S13, the information processing device 21 obtains (calculates) the actual volume for each of the multiple types of pattern elements. As mentioned above, the actual volume is defined as the actual volume (capacity) of the various pattern elements formed on the test mold. The information processing device 21 can obtain the measurement results from the measuring device 22 in step S12 via the network 23 and calculate the actual volume of the various pattern elements based on those measurement results.

[0032] In step S14, the information processing device 21 determines a correction value for each of the multiple types of pattern elements to correct the difference between the actual volume and the design volume of the pattern element (hereinafter sometimes referred to as volume error). The correction value is a value used to correct the volume error by the dimensions of the pattern element in the planar direction (XY direction) parallel to the surface of the test mold. Specifically, it is a value that specifies the amount or ratio by which the dimensions of the pattern element are changed in the planar direction to reduce the volume error. The correction value may also be understood as a value that compensates for the volume error by expanding the dimensions of the pattern element overall in the planar direction by an amount or ratio, assuming that the taper angle that may occur due to the manufacturing process remains unchanged. By determining a correction value for each of the multiple types of pattern elements, correction information (e.g., a table) showing the relationship between the type of pattern element and the correction value can be created. In the following, the correction value used to correct the volume error by the dimensions of the pattern element in the planar direction may be referred to as the "data bias amount". Details on how to determine the data bias amount will be described later.

[0033] In step S15, the information processing device 21 acquires the design data for the mold M to be used in the imprint device 10. If the design data for the mold M has been created in the information processing device 21, the design data is stored in the storage unit 21b. In this case, the information processing device 21 acquires (reads) the design data from the storage unit 21b. On the other hand, if the design data for the mold M is stored in an external device (a device different from the information processing device 21) connected to the network 23, the information processing device 21 acquires the design data from the external device via the network 23.

[0034] In step S16, the information processing device 21 corrects the design data of the mold M based on the data bias amount. Specifically, for each of the multiple types of pattern elements that constitute the pattern of the mold M in the design data, the information processing device 21 obtains (selects) a data bias amount from the correction information according to the type of pattern element. Then, for each of the multiple types of pattern elements, the information processing device 21 changes the dimensions of the pattern element in the surface direction (a direction parallel to the surface of the mold M) according to the obtained data bias amount.

[0035] In this way, the design data of the mold M can be corrected. By performing imprint processing using the mold M manufactured based on the corrected design data, the dimensional controllability (e.g., film thickness controllability) of the uneven pattern of the imprint material IM formed on the substrate can be improved. That is, a pattern can be formed with high precision on the imprint material IM on the substrate S.

[0036] Next, the method for determining the data bias amount (steps S13-S14) will be explained. In determining the data bias amount, the area and dimensions of the pattern element measured by the measuring device 22 in step S12 above are defined as shown in Figure 4. Figure 4 shows a certain pattern element E T The definitions of area and dimensions are shown. In Figure 4, the solid line shows the measured values ​​obtained by the measuring device 22, and the dashed line shows the design values ​​in the test design data.

[0037] FIG. 4(a) shows a plan view of the region opened by the pattern element E on the surface of the test mold as viewed from the -Z direction. As described above, since the pattern element E is dug in from the surface of the test mold and formed in a concave shape, it is configured as an opening on the surface of the test mold. However, hereinafter, for the sake of easy explanation, this region may be referred to as the "upper surface of the pattern element E". As shown in FIG. 4(a), the upper surface of the pattern element E has a rounded shape due to the manufacturing process. Let the designed value of the width in the X direction on the upper surface of the pattern element E be 30 as X T [nm], and the designed value of the width in the Y direction be 31 as Y T [nm]. Also, let the measured value of the width in the X direction on the upper surface of the pattern element E be 32 as X T [nm], and the measured value of the width in the Y direction be 33 as Y T [nm]. Let the measured value of the area on the upper surface of the pattern element E be 34 as S T [nm D [nm] and the measured value of the width in the Y direction be 33 as Y D [nm]. Let the measured value of the area on the upper surface of the pattern element E be 34 as S T [nm], and the measured value of the width in the Y direction be 33 as Y AT [nm]. Let the measured value of the area on the upper surface of the pattern element E be 34 as S AT [nm]. Let the measured value of the area on the upper surface of the pattern element E be 34 as S T [nm AT [nm 2 .

[0038] FIG. 4(b) shows a plan view of the bottom surface of the pattern element E in the test mold as viewed from the -Z direction. As shown in FIG. 4(b), the bottom surface of the pattern element E has a rounded shape due to the manufacturing process, similar to the upper surface of the pattern element E. The designed value of the width in the X direction and the designed value of the width in the Y direction on the bottom surface of the pattern element E are the same as the designed value of the width in the X direction 30 and the designed value of the width in the Y direction 31 on the upper surface of the pattern element E, respectively. That is, the pattern element E in the example of FIG. 4 is designed to be a quadrangular prism. Also, let the measured value of the width in the X direction on the bottom surface of the pattern element E be 35 as X T [nm], and the measured value of the width in the Y direction be 36 as Y T [nm]. T ​​​​​​​​​​​​Let it be [nm]. Pattern element E T The measured area of ​​the base is 37 S AB [nm 2 ]

[0039] Figure 4(c) shows pattern element E in the test mold. T This shows the XZ cross-section. Also, Figure 4(d) shows the pattern element E in the test mold. T This shows a YZ cross-sectional view. As shown in Figures 4(c) to (d), in the test mold, pattern element E T It can be formed in a tapered shape. Pattern element E T The design value for the depth is 38 H D [nm] and pattern element E T The measured depth is 39 H A Let it be [nm].

[0040] Figure 5 is a flowchart showing the method for determining the amount of data bias. The flowchart in Figure 5 is performed by the information processing device 21 (processor 21a). Here, using Figure 4, the dimensions and area of ​​the pattern element E are defined as described above. T I will explain this using an example.

[0041] In step S21, the information processing device 21 processes the pattern element E T Dimensional correction amount P for each of the top and bottom surfaces XAT ,P YAT Calculate the dimensional correction amount P. XAT This is a correction value used to correct the dimension (width) in the X direction when volume errors are not considered. Also, the dimension correction amount P YAT This is a correction value used to correct the dimension (width) in the Y direction when volume errors are not considered. Pattern element E T In the manufacturing process, anisotropy may occur in the X and Y directions, so dimensional correction amounts may be calculated separately for the X and Y directions.

[0042] Specifically, as shown in Figure 6(a), pattern element E TRegarding the top surface, the area S when the width in the X and Y directions is increased to the design value without changing the amount of corner rounding. AT ' is calculated by equation (1). The first term of equation (1) is "X D Y D " is pattern element E T This shows the design area of ​​the top surface, and item 2 "X AT Y AT -S AT This indicates the amount of area reduction due to the rounding of the corners. JPEG2026049512000002.jpg9170

[0043] Also, as shown in Figure 6(b), pattern element E T Regarding the bottom surface, the amount of corner rounding and pattern element E T Area S when the width in the X and Y directions is increased without changing the taper angle. AB ' is calculated using equation (2). The reasoning behind equation (2) is the same as in equation (1), but the first term of equation (2) "(X D -X AT +X AB )(Y D -Y AT +Y AB )」 is pattern element E T From the design area of ​​the base, pattern element E T This shows the value after subtracting the area reduction due to the tapered shape. The second term of equation (2) "X AB Y AB -S AB This indicates the amount of area reduction due to the rounding of the corners. JPEG2026049512000003.jpg9170

[0044] This results in a dimensional correction amount P XAT ,P YAT This can be calculated using the following equations (3) to (4). JPEG2026049512000004.jpg9170JPEG2026049512000005.jpg9170

[0045] In step S22, the information processing device 21 displays pattern element E T The difference between the actual volume and the design volume (volume error V) A Calculate the volume error V. A This can be calculated using equation (5). JPEG2026049512000006.jpg13170

[0046] In step S23, the information processing device 21 displays the pattern element E in the planar direction (XY direction). T Volume error V due to dimensions A Data bias amount P to correct for this bias. V The volume error V is calculated. In this embodiment, the volume error V A The data bias amount P is assumed to be applied equally to the X and Y directions. V The following is calculated: Data bias amount P V and volume error V A The relationship can be expressed as shown in equation (6). Therefore, equation (7) is derived from equations (5) and (6), and the data bias amount P V This is calculated by equation (7). JPEG2026049512000007.jpg9170JPEG2026049512000008.jpg13170

[0047] In step S24, the information processing device 21 calculates the data bias amount P for all of the multiple types of pattern elements formed on the test mold. V Determine whether or not the data bias amount P has been calculated. V If there are pattern elements of a type for which the data bias amount P has not yet been calculated, steps S21 to S23 are performed for those pattern elements of that type. Meanwhile, the data bias amount P is calculated for all of the multiple types of pattern elements. V If the calculation is successful, the process proceeds to step S25, where the information processing device 21 creates correction information (e.g., a table) showing the relationship between the type of pattern element and the amount of data bias. Figure 7 shows an example of the correction information.

[0048] Figure 8 shows a certain pattern element E in the design data of mold M.M The dimensions of the data bias amount P V An example of correction in the planar direction according to this is shown. Figure 8(a) shows pattern element E M Regarding this, the pre-correction design shape 41 and the shape 42 actually produced from the pre-correction design shape 41 (hereinafter sometimes referred to as the pre-correction actual shape 42) are shown. Also, Figure 8(b) shows the pattern element E M Regarding the amount of data bias P, V The corrected design shape 43 and the shape 44 actually manufactured using the corrected design shape 43 (hereinafter sometimes referred to as the corrected actual shape 44) are shown.

[0049] The dimensions in the surface direction (XY direction) of the design shape 41 before correction are given by the data bias amount P. V By expanding it by only that much, the corrected design shape 43 can be obtained. This allows the pattern element E to be manufactured according to the corrected design shape 43. M Therefore, the volume of the corrected actual shape 44 can be made closer to the volume of the uncorrected design shape 41. In other words, the difference between the volume of the corrected actual shape 44 and the volume of the uncorrected design shape 41 can be reduced.

[0050] As described above, in this embodiment, a data bias amount is determined to correct the difference (volume error) between the actual volume and the design volume of the pattern elements formed in the test pattern using dimensions in the surface direction, and the design data of the mold M is corrected based on this data bias amount. This method makes it easy to correct the design data so that the volume error is reduced. Then, by performing imprint processing using the mold M manufactured based on the corrected design data, a pattern can be formed accurately on the imprint material IM on the substrate S.

[0051] <Second Embodiment> A second embodiment of the present invention will now be described. This embodiment basically follows the first embodiment, and can be described in accordance with the first embodiment except for the matters mentioned below.

[0052] The method for correcting the design data in this embodiment can be carried out according to the flowchart in Figure 3 described in the first embodiment above, but step S11 (test mold preparation step) differs from that of the first embodiment. In this embodiment, a test mold is manufactured based on the uncorrected design data created for the mold M used in the imprint device 10. The test mold of this embodiment, like the test mold of the first embodiment, may include multiple types of pattern elements that can constitute the pattern of the mold M.

[0053] Figure 9 shows an example of uncorrected design data 50 created for the pattern of mold M used in the imprint device 10. The uncorrected design data 50 may include various pattern elements such as the main pattern 51, dummy pattern 52, peripheral pattern 53, accessory pattern 54, and monitor pattern 55.

[0054] The main pattern 51 is a pattern for forming the circuit (e.g., wiring) of a semiconductor device, and may be subject to optical proximity effect correction. The dummy pattern 52 is a pattern placed around the main pattern 51 for the purpose of reducing the difference in pattern density (occupancy density) per unit area and improving the uniformity (flatness) of the film thickness of the cured film formed on the substrate by imprint processing. Since the dummy pattern 52 is not used as a circuit for a semiconductor device, the requirements regarding its dimensions and placement are less stringent than those for the main pattern 51.

[0055] The peripheral pattern 53 is a pattern for forming a control circuit for controlling the circuit of the semiconductor device formed by the main pattern 51, and may be arranged around the area where the main pattern 51 is provided. The accessory pattern 54 is a pattern that constitutes a scribe line for separating each semiconductor device formed on the substrate S as a chip, and / or a pattern that constitutes an ID code (e.g., a barcode) that can be read in the manufacturing process or by peripheral equipment. The monitor pattern 55 is a pattern for managing the quality of the semiconductor device, and may also be a pattern that constitutes an alignment mark. If optical proximity effect correction is applied to the main pattern 51, it is difficult to measure the main pattern 51, so the monitor pattern 55 may be provided. The monitor pattern 55 may be made up of the same dimensional accuracy and simple shape as the main pattern 51.

[0056] Furthermore, in this embodiment, as in the first embodiment, the data bias amount of various pattern elements is determined in steps S12 to S14, and correction information is generated. Figure 10 shows an example of the correction information. In steps S15 to S16, the design data 50 of the mold M is corrected by the data bias amount. Here, if the layer configuration of the design data 50 before correction is separated for each type of pattern element, in step S12, representative locations of the various pattern elements may be sampled, and the area and dimensions of the various pattern elements may be measured by the measuring device 22. Note that the method for determining the data bias amount in this embodiment is the same as in the first embodiment, so the explanation is omitted here.

[0057] As described above, in this embodiment, a test mold is manufactured based on the uncorrected design data created for the pattern of the mold M used in the imprint apparatus 10. In this embodiment as well, similar to the first embodiment, the design data can be easily corrected to reduce volume errors. Then, by performing the imprint process using the mold M manufactured based on the corrected design data, a pattern can be formed accurately on the imprint material IM on the substrate S.

[0058] <Third Embodiment> A third embodiment of the present invention will now be described. This embodiment basically follows the first embodiment, and can be applied to the first embodiment except for matters mentioned below. Furthermore, the second embodiment may be applied in this embodiment.

[0059] In this embodiment, an example is described in which the pattern of the mold M (design data before correction) includes a first pattern element for forming an element on the substrate S and a second pattern element arranged around the first pattern element to adjust the pattern density on the mold. The first pattern element may include the main pattern 51 described in the second embodiment above, and the second pattern element may include the dummy pattern 52 described in the second embodiment above.

[0060] In the first pattern element (main pattern 51), dimensions such as line width are strictly defined, and it is conceivable that there may be cases where the dimensions of the first pattern element cannot be corrected. Therefore, in this embodiment, no dimensional correction using the data bias amount is performed on the first pattern element, and only the second pattern element is corrected using the data bias amount. Furthermore, in this embodiment, the data bias amount applied to the second pattern element can be determined not only based on the volume error of the second pattern element, but also based on the volume error of the first pattern element.

[0061] Figure 11 is a flowchart showing the method for correcting design data in this embodiment. In the flowchart of Figure 11, step S32 is performed by the measuring device 22, and steps S33 to S37 can be performed by the information processing device 21 (processor 21a).

[0062] In step S31, a test mold is prepared. The first or second embodiment may be applied to the fabrication of the test mold. Next, in step S32, the area and dimensions of each of the multiple types of pattern elements formed on the test mold are measured using the measuring device 22. Since steps S31 to S32 are the same as steps S11 to S12 in the flowchart of Figure 3, a detailed explanation is omitted here.

[0063] In step S33, the information processing device 21 selects (identifies) from among multiple types of pattern elements a type of pattern element whose dimensions in the surface direction can be corrected by the amount of data bias. In this embodiment, the second pattern element (dummy pattern 52) is selected as the type of pattern element that can be corrected, and the first pattern element (main pattern 51) is not selected. The selection of the type of pattern element that can be corrected may be made based on information indicating whether or not each type of pattern element can be corrected. This information may be defined by design data or data acquired together with the design data.

[0064] In step S34, the information processing device 21 obtains (calculates) the actual volume for each of the multiple types of pattern elements. In step S35, the information processing device 21 determines the data bias amount for the type of pattern element selected in step S33. In this embodiment, when determining the data bias amount for the type of pattern element selected in step S33, the volume errors of the type of pattern element not selected in step S33 are also taken into consideration. For example, the data bias amount applied to the second pattern element (hereinafter sometimes referred to as the data bias amount for the second pattern element) is determined based on the volume error of the first pattern element and the volume error of the second pattern element.

[0065] The information processing device 21 can determine the data bias amount of the second pattern element so as to reduce the difference between the volume density of the first pattern element and the volume density of the second pattern element (hereinafter sometimes referred to as the density difference). Volume density is defined as the density occupied by the volume of the pattern element per unit volume.

[0066] For example, as shown in Figure 12, the volume density of the second pattern element is reduced in accordance with the reduction in the volume density of the first pattern element, so as to reduce the density difference. Figure 12(a) shows the configuration and arrangement of the first pattern element (main pattern 51) and the second pattern element (dummy pattern 52) in the design data before correction. Figure 12(b) shows the configuration and arrangement of the first pattern element and the second pattern element in the design data after correction. In this case, the information processing device 21 determines the data bias amount of the second pattern element so that the volume of the second pattern element is reduced by the volume error of the first pattern element. For example, the information processing device 21 determines the data bias amount of the second pattern element so that the volume density Um of the first pattern element and the volume density Ud2 of the second pattern element are the same. By correcting the dimensions of each second pattern element in the design data with the data bias amount determined in this way, the density difference can be reduced.

[0067] Figure 13 shows an example of the results of correcting the design data of the mold M in this embodiment. Figure 13(a) shows the design shape 61 of the second pattern element (dummy pattern 52) in the design data before correction and the actual shape 62 of the second pattern element manufactured with the corrected design data. Figure 13(b) shows the actual shape 63 of the second pattern element reduced by the volume error of the first pattern element. Figure 13(c) shows the surface pattern density and volume density results for the first pattern element and the second pattern element, respectively. As shown in Figure 13(c), in the corrected design data, there is a discrepancy in the surface pattern density between the first pattern element and the second pattern element, but the difference in volume density between the first pattern element and the second pattern element is reduced.

[0068] Here, the information processing apparatus 21 may determine the data bias amount of the second pattern element based on the total value of the volume error of the first pattern element and the volume error of the second pattern element. The determination of the data bias amount of the second pattern element in this case can basically be performed according to the flowchart of FIG. 5. The information processing apparatus 21 calculates the volume error of the first pattern element and the volume error of the second pattern element by performing steps S21 to S22 for each of the first pattern element and the second pattern element. Each of the volume error of the first pattern element and the volume error of the second pattern element can be calculated using equations (1) to (5). Next, in step S23, the information processing apparatus 21 calculates the data bias amount of the second pattern element. Specifically, the total value of the volume error of the first pattern element and the volume error of the second pattern element calculated in steps S21 to S22 is substituted into the volume error V in equation (7). Thereby, the data bias amount P obtained from equation (7) can be calculated as the data bias amount P of the second pattern element. A to. V as MV can be calculated.

[0069] When a plurality of first pattern elements and a plurality of second pattern elements are provided, the total value of the volume error of all the plurality of first pattern elements and the volume error of all the plurality of second pattern elements may be distributed to the plurality of second pattern elements. Based on the value obtained by dividing the total value by the number of second pattern elements, the data bias amount P of each second pattern element may be calculated. MV can be calculated.

[0070] Returning to FIG. 11, in step S36, the information processing apparatus 21 acquires the design data of the mold M used in the imprint apparatus 10. Next, in step S37, the information processing apparatus 21 determines the data bias amount P for the pattern element (second pattern element) of the type selected in step S33. MVBased on this, the design data for mold M is corrected. Steps S36 to S37 are the same process as steps S15 to S16 in the flowchart of Figure 3, so a detailed explanation is omitted here.

[0071] As described above, in this embodiment, the dimensions of the second pattern element in the design data are corrected based on the volume error of the first pattern element and the volume error of the second pattern element. According to this embodiment, even if there are pattern elements of a type that cannot be corrected (first pattern elements), the volume error in the entire mold can be reduced by using pattern elements of a type that can be corrected (second pattern elements). Furthermore, according to this embodiment, the design data can be easily corrected to reduce the volume error, similar to the first and second embodiments. Then, by performing imprint processing using the mold M manufactured based on the corrected design data, a pattern can be formed accurately on the imprint material IM on the substrate S.

[0072] <Embodiment of Article Manufacturing Method> The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing articles such as microdevices, semiconductor devices, and elements having microstructures. The article manufacturing method of this embodiment includes the steps of forming a pattern on an imprint material on a substrate using the above-described imprint method (imprint apparatus), processing the substrate having the imprint material on which the pattern has been formed, and manufacturing an article from the processed substrate. Furthermore, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0073] The patterns of the cured material formed using the above-described imprint apparatus are used permanently on at least a portion of various articles, or temporarily during the manufacturing of various articles. Articles include electrical circuit elements, optical elements, MEMS, recording elements, sensors, or molds. Examples of electrical circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, as well as semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for imprinting.

[0074] The pattern of the cured material is either used as is as a component of at least some of the above-mentioned articles, or it is used temporarily as a resist mask. After etching or ion implantation is performed during the substrate processing process, the resist mask is removed.

[0075] Next, we will explain the specific method for manufacturing the product. As shown in Figure 14(a), a substrate 1z such as a silicon wafer is prepared on which a workpiece material 2z such as an insulator is formed on its surface. Subsequently, an imprint material 3z is applied to the surface of the workpiece material 2z by an inkjet method or the like. Here, we show how multiple droplet-shaped imprint material 3z are applied to the substrate.

[0076] As shown in Figure 14(b), the mold 4z for imprinting is positioned opposite the imprint material 3z on the substrate, with the side where the uneven pattern is formed facing it. As shown in Figure 14(c), the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z fills the gap between the mold 4z and the workpiece 2z. In this state, when light is shone through the mold 4z as curing energy, the imprint material 3z hardens.

[0077] As shown in Figure 14(d), after the imprint material 3z has hardened, when the mold 4z and substrate 1z are separated, a pattern of the hardened imprint material 3z is formed on the substrate 1z. In this pattern, the recesses of the mold correspond to the protrusions of the hardened material, and the protrusions of the mold correspond to the recesses of the hardened material. In other words, the uneven pattern of the mold 4z has been transferred to the imprint material 3z.

[0078] As shown in Figure 14(e), when etching is performed using the cured material pattern as an etching-resistant mask, the parts of the workpiece 2z surface that are free of or have a thin remaining cured material are removed, forming grooves 5z. As shown in Figure 14(f), when the cured material pattern is removed, an article with grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the cured material pattern was removed, but it may also be used without removal after processing, for example, as an interlayer insulating film included in semiconductor devices, i.e., as a component of the article.

[0079] <Other Embodiments> The present invention can also be realized by supplying a program that implements one or more of the functions of the above-described embodiments to a system or device via a network or storage medium, and by having one or more processors in the computer of that system or device read and execute the program. It can also be realized by a circuit (e.g., an ASIC) that implements one or more functions.

[0080] <Summary of Embodiments> The disclosures herein include at least the following correction methods, mold manufacturing methods, imprinting methods, article manufacturing methods, and information processing devices. (Item 1) A correction method for correcting the pattern design data of a mold used in an imprint process to form a pattern on an imprint material on a circuit board, using an information processing device, An acquisition process to obtain the actual volume of the concave pattern element formed in the test mold, A determination step of determining a correction value for correcting the difference between the actual volume and the design volume of the pattern element by the dimensions of the pattern element in the planar direction parallel to the surface of the test mold, A correction step of correcting the design data based on the correction value, A correction method characterized by including the following. (Item 2) The correction method according to item 1, characterized in that the correction value is a value that defines the amount or ratio by which the dimensions of the pattern element are changed in the surface direction so as to reduce the difference. (Item 3) The test mold includes a plurality of types of pattern elements that constitute the pattern of the mold, For each of the above multiple types of pattern elements, the actual volume is obtained in the acquisition step, and the correction value is determined in the determination step. The correction method according to item 1 or 2, characterized in that the correction step corrects the design data based on the correction value determined for each of the plurality of types of pattern elements. (Item 4) The correction method according to item 3, characterized in that the plurality of pattern elements differ from each other in at least one of dimensions, depth, and occupancy density per unit area. (Item 5) The correction method according to item 3 or 4, characterized in that the test mold is manufactured based on the design data before correction. (Item 6) The correction method according to any one of items 3 to 5, characterized in that the determination step involves creating information showing the relationship between the type of pattern element and the correction value. (Item 7) The correction method according to any one of items 1 to 6, characterized in that the acquisition step involves obtaining the actual volume of the pattern element based on the results of measuring the area and dimensions of the region opened by the pattern element on the surface, the area and dimensions of the bottom surface of the pattern element, and the depth of the pattern element. (Item 8) The correction method according to any one of items 1 to 7, characterized in that the pattern element has a tapered shape in the depth direction. (Item 9) The pattern of the mold includes a first pattern element for forming an element on the substrate and a second pattern element arranged around the first pattern element to adjust the pattern density on the mold. In the determination step, the correction value for the second pattern element is determined based on the difference between the actual volume and the design volume of the first pattern element, and the difference between the actual volume and the design volume of the second pattern element. The correction method according to any one of items 1 to 8, characterized in that the correction step corrects the dimensions of the second pattern element in the design data based on the correction value. (Item 10) The correction method according to item 9, characterized in that the dimensions of the first pattern element in the design data are not corrected in the correction step. (Item 11) A step of correcting the design data of the mold pattern used in the imprint process, which forms a pattern on an imprint material on a substrate, using the correction method described in any one of items 1 to 10, A step of manufacturing the mold based on the corrected design data, A mold manufacturing method characterized by including [a certain element]. (Item 12) An imprinting method for forming a pattern on an imprint material on a substrate using a mold, wherein the mold is manufactured using the mold manufacturing method described in item 11. (Item 13) A step of forming a pattern on an imprint material on a substrate using the imprint method described in item 12, A step of processing the substrate having the imprint material on which the pattern is formed, A process for manufacturing an article from the processed substrate, A method for manufacturing articles, characterized by including the following: (Item 14) An information processing device for correcting the pattern design data of a mold used in an imprint process to form a pattern on an imprint material on a substrate, The actual volume of the concave pattern element formed in the test mold is obtained. A correction value is determined to compensate for the difference between the actual volume and the design volume of the pattern element, based on the dimensions of the pattern element in the planar direction parallel to the surface of the test mold. An information processing device characterized by correcting the design data based on the correction value.

[0081] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0082] 10: Imprint device, 11: Light irradiation unit, 12: Mold holding unit, 13: Substrate stage, 14: Supply unit, 15: Control unit, M: Mold, S: Substrate, IM: Imprint material 20: Correction system, 21: Information processing device, 22: Measuring device

Claims

1. A correction method for correcting the pattern design data of a mold used in an imprint process to form a pattern on an imprint material on a circuit board, using an information processing device, An acquisition process to obtain the actual volume of the concave pattern element formed in the test mold, A determination step of determining a correction value for correcting the difference between the actual volume and the design volume of the pattern element by the dimensions of the pattern element in the planar direction parallel to the surface of the test mold, A correction step of correcting the design data based on the correction value, A correction method characterized by including the following.

2. The correction method according to claim 1, characterized in that the correction value is a value that defines the amount or ratio by which the dimensions of the pattern element are changed in the planar direction so as to reduce the difference.

3. The test mold includes a plurality of types of pattern elements that constitute the pattern of the mold, For each of the above multiple types of pattern elements, the actual volume is obtained in the acquisition step, and the correction value is determined in the determination step. The correction method according to claim 1, characterized in that the correction step corrects the design data based on the correction value determined for each of the plurality of types of pattern elements.

4. The correction method according to claim 3, characterized in that the plurality of pattern elements differ from each other in at least one of dimensions, depth, and occupancy density per unit area.

5. The correction method according to claim 3, characterized in that the test mold is manufactured based on the design data before correction.

6. The correction method according to claim 3, characterized in that the determination step involves creating information showing the relationship between the type of pattern element and the correction value.

7. The correction method according to claim 1, characterized in that the acquisition step involves obtaining the actual volume of the pattern element based on the results of measuring the area and dimensions of the region opened by the pattern element on the surface, the area and dimensions of the bottom surface of the pattern element, and the depth of the pattern element.

8. The correction method according to claim 1, characterized in that the pattern element has a tapered shape in the depth direction.

9. The pattern of the mold includes a first pattern element for forming an element on the substrate and a second pattern element arranged around the first pattern element for adjusting the pattern density on the mold. In the determination step, the correction value for the second pattern element is determined based on the difference between the actual volume and the design volume of the first pattern element, and the difference between the actual volume and the design volume of the second pattern element. The correction method according to claim 1, characterized in that the correction step corrects the dimensions of the second pattern element in the design data based on the correction value.

10. The correction method according to claim 9, characterized in that the dimensions of the first pattern element in the design data are not corrected in the correction step.

11. A step of correcting the design data of the mold pattern used in the imprint process for forming a pattern on an imprint material on a substrate using the correction method described in any one of claims 1 to 10, A step of manufacturing the mold based on the corrected design data, A mold manufacturing method characterized by including [a certain element].

12. An imprinting method for forming a pattern on an imprint material on a substrate using a mold, wherein the mold is manufactured using the mold manufacturing method described in claim 11.

13. A step of forming a pattern on an imprint material on a substrate using the imprint method described in claim 12, A step of processing the substrate having the imprint material on which the pattern is formed, A process for manufacturing an article from the processed substrate, A method for manufacturing articles, characterized by including the following:

14. An information processing device for correcting the pattern design data of a mold used in an imprint process to form a pattern on an imprint material on a substrate, The actual volume of the concave pattern element formed in the test mold is obtained. A correction value is determined to compensate for the difference between the actual volume and the design volume of the pattern element, based on the dimensions of the pattern element in the planar direction parallel to the surface of the test mold. An information processing device characterized by correcting the design data based on the correction value.

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