LED sheet, plant and animal cultivation system, and method for manufacturing the plant and animal cultivation system.

Abstract

This disclosure provides an LED sheet, a plant and animal cultivation system, and a method for manufacturing the plant and animal cultivation system, which are capable of improving the yield of the plants and animals being cultivated. [Solution] The LED sheet 20 comprises a substrate 31 having a surface 31a and a back surface 31b located opposite the surface 31a, and a plurality of LED chips 21 arranged two-dimensionally and discretely on the surface 31a of the substrate 31. The LED chips 21 have a peak in relative brightness in the range of radiation angle from 10° to 80°.

Description

[Technical Field]

[0001] This disclosure relates to an LED sheet, a plant and animal cultivation system, and a method for manufacturing the plant and animal cultivation system. [Background technology]

[0002] In recent years, there has been a growing demand for lighting equipment using LEDs as a light source, which consume less power, as an alternative to conventional fluorescent lamps and high-pressure sodium lamps used in plant and animal breeding factories.

[0003] As an example of a plant and animal cultivation factory using LED lighting devices, a plant cultivation system is known in which multiple straight-tube plant growth lights with LEDs as the light source are arranged on the shelves of a plant cultivation rack (see, for example, Patent Document 1).

[0004] In recent years, algal biofuels have attracted attention as a renewable energy resource. There are two main methods for cultivating algae: the so-called open pond system and the so-called closed photobioreactor system. Of these, the closed photobioreactor system can suppress contamination of the culture medium compared to the open pond system. Furthermore, because the closed photobioreactor system can be used indoors year-round, it offers superior algal productivity. As a technology for cultivating algae using such a photobioreactor, for example, a technology has been disclosed in which light from a light-emitting diode is guided into the culture tank through an optical waveguide (see, for example, Patent Document 2). [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2008-118957 [Patent Document 2] Japanese Patent Publication No. 2012-183002 [Overview of the project] [Problems that the invention aims to solve]

[0006] This disclosure aims to provide an LED sheet, a plant and animal cultivation system, and a method for manufacturing the plant and animal cultivation system that can improve the yield of the plants and animals being cultivated. [Means for solving the problem]

[0007] Embodiments of this disclosure relate to the following [1] to

[11] .

[0008] [1] It is an LED sheet, A substrate having a first surface and a second surface located opposite to the first surface, The substrate comprises a plurality of LED chips arranged two-dimensionally and discretely on the first surface thereof, The LED chip is an LED sheet having a peak in relative light intensity in the range of radiation angle from 10° to 80°.

[0009] [2] The LED sheet according to [1], wherein the uniformity is 0.5 or greater in a region where the distance from the LED chip along the normal direction of the first surface is 10 mm or more and 40 mm or less.

[0010] [3] The shortest distance between the LED chips is D min When the value is [mm], in the region where the distance along the normal direction of the first surface is 10 mm or more and 40 mm or less, the uniformity is 0.5 × 40 / D min The LED sheet described above is as described in [1] or [2].

[0011] [4] A container for raising plants and animals, A plant and animal cultivation system comprising an LED sheet according to any one of [1] to [3] for irradiating the cultivation container with light.

[0012] [5] The plant and animal cultivation system according to [4], wherein the LED sheet covers the cultivation container in a curved state.

[0013] [6] The end of the LED sheet is bent toward the growth container side, the plant and animal growth system according to [4] or [5].

[0014] [7] The distance between the LED sheet and the growth container is 7 mm or more and 15 mm or less, the plant and animal growth system according to any one of [4] to [6].

[0015] [8] A step of preparing a cylindrical growth container, A step of preparing a first LED sheet rolled into a cylinder and a second LED sheet rolled into a cylinder, A step of covering the growth container with the first LED sheet from the upper end of the growth container so that the first LED sheet covers the outer surface of the growth container, [[ID=二十三]]A step of covering the growth container with the second LED sheet from the upper end of the growth container covered with the first LED sheet so that the second LED sheet covers the outer surface of the growth container, comprising: The first LED sheet and the second LED sheet cover different regions of the outer surface of the growth container, [[ID=二十七]]The first LED sheet and the second LED sheet each A substrate having a first surface and a second surface located on the opposite side of the first surface, A plurality of LED chips two-dimensionally and discretely arranged on the first surface of the substrate, The LED chip has a peak of relative illuminance in a range where the radiation angle is 10° or more and less than 80°, a method for manufacturing a plant and animal growth system.

[0016] [9] The first LED sheet and the second LED sheet each cover the outer surfaces of a plurality of the growth containers, the method for manufacturing a plant and animal growth system according to [8].

[0017]

[10] The process of preparing a cylindrical growing container, The process involves preparing the first LED sheet and the second LED sheet. A step of wrapping the first LED sheet around the growing container such that the first LED sheet covers the outer surface of the growing container, The process includes the step of wrapping the second LED sheet around the growing container such that the second LED sheet covers the outer surface of the growing container, The first LED sheet and the second LED sheet cover different areas of the outer surface of the growing container. The first LED sheet and the second LED sheet are, respectively, A substrate having a first surface and a second surface located opposite to the first surface, The substrate comprises a plurality of LED chips arranged two-dimensionally and discretely on the first surface thereof, The LED chip has a peak in relative light intensity in the range of radiation angle from 10° to 80°, a method for manufacturing a plant and animal cultivation system.

[0018]

[11] The method for manufacturing an animal and plant cultivation system according to

[10] , wherein the first LED sheet and the second LED sheet each cover the outer surfaces of a plurality of cultivation containers. [Effects of the Invention]

[0019] According to this embodiment, it is possible to improve the yield of the plants and animals being cultivated. [Brief explanation of the drawing]

[0020] [Figure 1] Figure 1 is a perspective view showing a culture system according to one embodiment. [Figure 2] Figure 2 is a vertical cross-sectional view showing a culture system according to one embodiment. [Figure 3] Figure 3 is a schematic diagram showing an LED sheet in a culture system according to one embodiment. [Figure 4]Figure 4 is a plan view showing the LED sheet of a culture system according to one embodiment. [Figure 5] Figures 5(a)-(b) are plan views showing modified examples of the LED sheet in the culture system. [Figure 6] Figure 6 is a cross-sectional view (cross-sectional view along line VI-VI in Figure 4) showing the LED sheet of a culture system according to one embodiment. [Figure 7] Figure 7 is a graph showing the relationship between relative light intensity and radiation angle of an LED chip according to one embodiment. [Figure 8] Figure 8 is a schematic diagram showing the light intensity distribution of an LED sheet according to one embodiment. [Figure 9] Figure 9 is a graph showing the relationship between relative light intensity and radiation angle for an LED chip used as a comparative example. [Figure 10] Figure 10 is a schematic diagram showing the light intensity distribution of an LED sheet as a comparative example. [Figure 11] Figure 11 shows the simulation results of the light intensity distribution. [Figure 12] Figure 12 shows the simulation results of the light intensity distribution. [Figure 13] Figure 13 shows the simulation results of the light intensity distribution. [Figure 14] Figure 14 shows the simulation results of the light intensity distribution. [Figure 15] Figure 15 shows the simulation results of the light intensity distribution. [Figure 16] Figure 16 shows the simulation results of the light intensity distribution. [Figure 17] Figures 17(a)-(h) are cross-sectional views showing a method for manufacturing an LED sheet in a culture system according to one embodiment. [Figure 18] Figure 18 is a schematic perspective view showing an example of the use of a culture system according to one embodiment. [Figure 19] Figure 19 is a schematic perspective view showing an example of the use of a culture system according to one embodiment. [Figure 20]Figure 20 is a plan view showing a modified example of an LED sheet according to one embodiment. [Figure 21] Figure 21 is a plan view showing a modified example of an LED sheet according to one embodiment. [Figure 22] Figure 22 is a plan view showing a modified example of an LED sheet according to one embodiment. [Figure 23] Figure 23 is a vertical cross-sectional view showing a modified example of a culture system according to one embodiment. [Figure 24] Figure 24 is a vertical cross-sectional view showing a modified example of a culture system according to one embodiment. [Figure 25] Figure 25 is a perspective view showing a modified example of a culture system according to one embodiment. [Figure 26] Figure 26 is a vertical cross-sectional view showing a modified example of a culture system according to one embodiment. [Figure 27] Figure 27 is a plan view showing a modified example of an LED sheet according to one embodiment. [Figure 28] Figure 28 is a vertical cross-sectional view showing a modified example of a culture system according to one embodiment. [Figure 29] Figure 29 is a plan view showing a modified example of an LED sheet according to one embodiment. [Figure 30] Figure 30 is a plan view showing a modified example of an LED sheet according to one embodiment. [Figure 31] Figure 31 is a plan view showing a modified example of an LED sheet according to one embodiment. [Figure 32] Figure 32 is a vertical cross-sectional view showing a modified example of a culture system according to one embodiment. [Figure 33] Figure 33 is a perspective view showing a modified example of a culture system according to one embodiment. [Figure 34] Figures 34(a)-(c) are perspective views showing a modified method for producing a culture system according to one embodiment. [Figure 35] Figures 35(a)-(d) are perspective views showing other examples of methods for manufacturing a modified culture system according to one embodiment. [Figure 36]Figure 36 is a perspective view showing a modified example of a culture system according to one embodiment. [Figure 37] Figures 37(a)-(b) are perspective views showing a modified method for producing a culture system according to one embodiment. [Figure 38] Figures 38(a)-(b) are perspective views showing other examples of methods for manufacturing a modified culture system according to one embodiment. [Figure 39] Figure 39 is a perspective view showing a modified example of a culture system according to one embodiment. [Figure 40] Figure 40 is a perspective view showing a modified example of a culture system according to one embodiment. [Figure 41] Figure 41 is a perspective view showing a modified example of a culture system according to one embodiment. [Modes for carrying out the invention]

[0021] Hereinafter, one embodiment will be described in detail with reference to the drawings. The following figures are schematic representations. Therefore, the size and shape of each part are exaggerated as appropriate to facilitate understanding. Furthermore, it is possible to modify and implement the invention as appropriate without departing from the technical concept. In the following figures, the same parts are denoted by the same reference numerals, and some detailed explanations may be omitted. In addition, the numerical values ​​such as dimensions and material names of each component described in this specification are examples of embodiments and are not limited to them; they can be selected and used as appropriate. In this specification, terms that specify shapes and geometric conditions, such as parallel, orthogonal, and perpendicular, shall be interpreted to include not only their strict meaning but also substantially the same state. In this specification, "upper" and "lower" refer to the upper and lower parts, respectively, when the culture tube is in an upright position (Figures 1 and 2).

[0022] (Culture system) As shown in Figures 1 and 2, the culture system (plant and animal cultivation system) 1 comprises a culture tube (cultivation container) 10 for cultivating algae and an LED sheet 20 for irradiating the culture tube 10 with light. The LED sheet 20 covers the outer surface 10a of the culture tube 10. A control unit 40 is electrically connected to the LED sheet 20.

[0023] The culture tube 10 comprises a hollow body portion 11, a bottom portion 12 located below the body portion 11, and a lid portion 13 located above the body portion 11. The body portion 11 has a cylindrical shape. However, the body portion 11 may also have a polygonal cylindrical shape, such as a square or octagonal shape.

[0024] The base portion 12 is circular in plan view and is connected to the lower end of the body portion 11. The base portion 12 may be molded integrally with the body portion 11, or it may be detachably attached to the body portion 11. The planar shape of the base portion 12 may be an ellipse or a polygon such as a quadrilateral.

[0025] The lid portion 13 is circular in plan view and is connected to the upper end of the body portion 11. This lid portion 13 may be detachably attached to the body portion 11. The planar shape of the lid portion 13 may be elliptical, quadrilateral, or other polygonal shape.

[0026] The culture tube 10 is filled with culture medium CS. The materials used to construct the culture tube 10 may include, for example, glass (refractive index: approximately 1.55), polycarbonate (refractive index: approximately 1.58), or resin materials such as acrylic.

[0027] The LED sheet 20 covers the culture tube 10 in a curved state. In this case, the LED sheet 20 is wrapped around the culture tube 10 so that the light-emitting surface 20a faces the culture tube 10. The LED sheet 20 covers the body 11 of the culture tube 10. Preferably, the LED sheet 20 covers the entire body 11 of the culture tube 10 in the circumferential direction. This allows light to be irradiated into the culture tube 10 from all sides of the body 11. This can increase the efficiency of algae growth. Furthermore, preferably, the LED sheet 20 covers the entire body 11 of the culture tube 10 in the longitudinal direction. This can further increase the efficiency of light utilization.

[0028] The ends 20b of the LED sheet 20 are bent towards the culture tube 10. In the illustrated example, the vertical ends 20b of the LED sheet 20 are bent towards the culture tube 10. This prevents light emitted from the LED sheet 20 from leaking out from the upper and lower ends of the LED sheet 20. Although not shown in the illustration, the circumferential ends 20b of the LED sheet 20 may also be bent towards the culture tube 10.

[0029] The LED sheet 20 may be provided with a display unit 25 that displays the ON state and the OFF state of the LED chip 21, which will be described later. This makes it easy to check the ON and OFF states of the LED chip 21 even when the LED sheet 20 is wrapped around the culture tube 10. The display unit 25 may be a through-hole that penetrates the LED sheet 20. Alternatively, the display unit 25 may be a portion of the LED sheet 20 configured to allow light to pass through the LED sheet 20 by partially cutting out the metal wiring portion 32 and the light-reflective insulating protective film 34, which will be described later. In these cases, when the LED chip 21 is lit, a small amount of light leaks from the display unit 25. On the other hand, when the LED chip 21 is not lit, no light leaks from the display unit 25. In this way, the ON and OFF states of the LED chip 21 can be easily checked.

[0030] In the illustrated example, the display unit 25 is rectangular in front view, but the size and shape of the display unit 25 are not particularly limited. Furthermore, multiple display units 25 may be formed. For example, one display unit 25 may be formed near each LED chip 21. This makes it easy to identify damaged LED chips 21.

[0031] Next, the LED sheet 20 will be described in detail. As shown in Figures 3 and 4, the LED sheet 20 is a so-called single-sided light-emitting, planar light source sheet. Multiple LED chips 21 are arranged on the light-emitting surface 20a side of this LED sheet 20. By using such a direct-lit LED sheet 20, the light emitted from the LED chips 21 passes directly through the light-emitting surface 20a. This allows for a stronger light intensity, promoting the cultivation of algae. Furthermore, since the LED sheet 20 can be made thinner overall than an LED bar light, the occurrence of shadows on the sides of the LED chips 21 can be suppressed.

[0032] The LED sheet 20 in Figure 4 comprises a flexible wiring board 30 and a plurality of LED chips 21 regularly arranged on the flexible wiring board 30. By using such a flexible wiring board 30, an LED sheet 20 with a relatively large surface area can be obtained. An LED sheet 20 with a relatively large surface area can reduce the number of LED sheets 20 used, thereby suppressing variations in light intensity that may occur when arranging multiple LED sheets 20. An LED sheet 20 with a relatively large surface area may be, for example, about 600 mm x 500 mm in size. Note that in Figure 4, the light-reflective insulating protective film 34 and the transparent protective film 35, which will be described later, are not shown.

[0033] In this case, the LED chips 21 are arranged regularly on the flexible wiring board 30. Specifically, the LED chips 21 are arranged in a grid pattern in a plan view within the flexible wiring board 30. That is, the LED chips 21 are arranged in a matrix with multiple rows and columns, and there are N columns R of M LED chips 21 connected in series.

[0034] For example, in Figure 4, 14 LED chips (M=14) are connected in series along the first arrangement direction (X direction) of the LED chips 21. Furthermore, 10 rows (N=10) of this row R, each containing 14 LED chips 21, are arranged in parallel along the second arrangement direction (Y direction) of the LED chips 21. Note that the number of LED chips 21 is not limited to these. Also, in this embodiment, the first arrangement direction (X direction) of the LED chips 21 corresponds to the circumferential direction of the culture tube 10 in the culture system 1. The second arrangement direction (Y direction) of the LED chips 21 corresponds to the vertical direction in the culture system 1.

[0035] The LED sheet 20 has multiple metal wiring sections 22, which are arranged along a first arrangement direction (X direction). Each of the multiple metal wiring sections 22 arranged along the first arrangement direction (X direction) corresponds to each row R of the LED chip 21. Each LED chip 21 is positioned so as to straddle a pair of adjacent metal wiring sections 22 in the X direction. In addition, each terminal of the LED chip 21 (not shown) is electrically connected to a pair of metal wiring sections 22. The multiple metal wiring sections 22 constitute a power supply section for the LED chip 21, and when power is supplied to the multiple metal wiring sections 22, all the LED chips 21 arranged in the row R light up. The multiple metal wiring sections 22 also constitute a part of the metal wiring section 32, which will be described later.

[0036] The spacing Px between LED chips 21 in the first arrangement direction (X direction) may be 15 mm or more, and is preferably 25 mm or more. The spacing Px between LED chips 21 may be 100 mm or less, and is preferably 60 mm or less. The spacing Py between LED chips 21 in the second arrangement direction (Y direction) may be 15 mm or more, and is preferably 25 mm or more. The spacing Py between LED chips 21 may be 100 mm or less, and is preferably 75 mm or less. By setting the spacing between LED chips 21 within the above ranges, the brightness of the LED sheet 20 can be made uniform across the surface. This suppresses variations in the light illuminating the space and reduces the power consumption of the LED sheet 20.

[0037] The thickness of the thickest part of the LED sheet 20 is preferably 5 mm or less. By making the LED sheet 20 thinner in this way, it is possible to suppress the bulkiness of the LED sheet 20 when it is attached to the culture tube 10. This makes it possible to easily attach the LED sheet 20 to the culture tube 10 even in a limited space.

[0038] The arrangement of the LED chips 21 is not limited to a grid pattern in plan view, but may also be arranged in a staggered pattern in plan view, as shown in Figure 5(a). Furthermore, the LED chips 21 do not need to be uniformly arranged within the plane of the LED sheet 20. For example, the density of LED chips 21 may be higher at the periphery of the LED sheet 20. Specifically, as shown in Figure 5(b), the LED chips 21 may be arranged in a grid pattern in the central part of the LED sheet 20 (lower part of Figure 5(b)) and in a staggered pattern at the periphery of the LED sheet 20 (upper part of Figure 5(b)). This suppresses the decrease in brightness of the LED sheet 20 at the periphery, makes the brightness of the LED sheet 20 uniform within the plane, and suppresses the variation in light illuminating space.

[0039] The overall shape of the LED sheet 20 is rectangular in plan view, but there are no particular limitations on the size or planar shape of the LED sheet 20. Because the LED sheet 20 offers a high degree of freedom in size and shape processing, it can flexibly respond to various needs in this regard. Furthermore, because the LED sheet 20 is flexible, it can be installed not only on flat mounting surfaces but also on mounting surfaces of various shapes.

[0040] In Figure 4, the length Lx of the LED sheet 20 in the first arrangement direction (X direction) is preferably 500 mm or more, and more preferably 550 mm or more. Furthermore, the length Lx of the LED sheet 20 in the first arrangement direction (X direction) is preferably 750 mm or less, and more preferably 650 mm or less. The length Ly of the LED sheet 20 in the second arrangement direction (Y direction) is preferably 300 mm or more, and more preferably 350 mm or more. Furthermore, the length Ly of the LED sheet 20 in the second arrangement direction (Y direction) is preferably 500 mm or less, and more preferably 450 mm or less. By ensuring that the size of each LED sheet 20 is not excessively small, the amount of light emitted from the LED sheet 20 can be increased. Also, by ensuring that the size of each LED sheet 20 is not excessively large, the impact on other LED chips 21 when a particular LED chip 21 is damaged can be minimized. Therefore, it is possible to prevent an extreme decrease in the overall illuminance of the LED sheet 20 and to limit the range in which the illuminance decreases.

[0041] Next, the control unit 40 will be described. As shown in Figure 3, the control unit 40 supplies power to the LED sheet 20 and controls the illumination of the LED sheet 20. The control unit 40 is detachably connected to the LED sheet 20 via a first connector 44A provided on the LED sheet 20. In other words, the control unit 40 is configured separately from the LED sheet 20 and is connected to the LED sheet 20 externally. To put it another way, the control unit 40 is not integrated with the LED sheet 20. This allows the control unit 40 to be separated from the LED sheet 20 and installed in any location. Therefore, the LED sheet 20 can be easily attached to the culture tube 10 even in a limited space.

[0042] The control unit 40 also includes a power input unit 41, an AC / DC converter (driver) 42, and a PWM control unit 43. The power input unit 41 is supplied with an AC voltage having any voltage, for example, between 100V and 240V. The AC / DC converter 42 converts the AC voltage of 100V to 240V into a constant voltage (for example, 44V) DC voltage. The PWM control unit 43 adjusts the brightness of the LED chips 21 of the LED sheet 20 by arbitrarily changing the pulse width of the constant voltage waveform from the AC / DC converter 42. In other words, the PWM control unit 43 also functions as a dimming control unit that controls the dimming of the LED sheet 20. The constant voltage output from the PWM control unit 43 is applied to the LED sheet 20 via the first connector 44A.

[0043] When controlling the dimming of the LED chip 21 in this way, for example, the illuminance of the LED sheet 20 may be adjusted according to the growth rate of the algae. This allows for adjustment of the growth rate of the algae. For example, in the early stages of growth when the number (concentration) of algae relative to the culture medium is small, the illuminance of the LED sheet 20 may be set low, and in the later stages of growth when the number of algae increases and the algae grow profusely in the culture tube 10, the illuminance of the LED sheet 20 may be set high. Another example of adjusting the illuminance of the LED sheet 20 is to set the illuminance high for types of algae that require high illuminance, and low for types of algae that can be grown at low illuminance. Also, the illuminance may be set high to expedite the shipping period, and low to delay the shipping period.

[0044] Referring again to Figure 3, the LED sheet 20 is equipped with regulators 45. In this case, a regulator 45 is provided for each row of LED chips 21, specifically, 10 regulators 45 are provided for each of the 10 rows of LED chips 21. These regulators 45 play the role of maintaining a constant current flowing through the multiple LED chips 21 in each row. This prevents excessive current from flowing to the LED chips 21 in other rows even if one LED chip 21 is damaged, thus preventing damage to the LED chips 21 in other rows. As a result, it is possible to prevent an extreme decrease in the overall illuminance of the LED sheet 20 and suppress variations in the light illuminating the space.

[0045] Furthermore, the LED sheet 20 is provided with a power supply line 46 branching from the first connector 44A. A second connector 44B is also provided on the LED sheet 20. The power supply line 46 is not electrically connected to the LED chips 21 of the LED sheet 20, but is electrically connected to the wiring of another LED sheet 200 having the same configuration as the LED sheet 20. That is, the power supply line 46 is detachably connected to the wiring of the LED sheet 200 via the second connector 44B and another first connector 44A provided on the other LED sheet 200. Current from the power supply line 46 is supplied to the other LED sheet 200 via the second connector 44B and the other first connector 44A. This allows two LED sheets 20, 200 to be linked and simultaneously controlled by a single control unit 40. By enabling the simultaneous control of multiple LED sheets 20, 200 by a single control unit 40, the number of control units 40 can be reduced, thus preventing the culture system 1 from becoming bulky. Therefore, the culture system 1 can be easily installed even in a limited space.

[0046] (Each component of the LED sheet) Next, the components constituting the LED sheet 20 will be described. As shown in Figure 6, the LED sheet 20 comprises a flexible wiring board 30, a plurality of LED chips 21 arranged on the flexible wiring board 30, and spacers 50 (see Figures 1 to 4) arranged on the flexible wiring board 30. The flexible wiring board 30 has a substrate 31 and a metal wiring portion 32 on the substrate 31. The metal wiring portion 32 is laminated to the substrate 31 via an adhesive layer 33. The substrate 31 has a surface (first surface) 31a, which is the surface on the light-emitting surface 20a side, and a back surface (second surface) 31b located on the opposite side of the surface 31a. The plurality of LED chips 21 are arranged two-dimensionally and discretely on the surface (first surface) 31a of the substrate 31. The spacers 50 are also arranged on the surface (first surface) 31a of the substrate 31.

[0047] Each LED chip 21 is mounted in a manner that allows it to conduct electricity to the metal wiring section 32. In this LED sheet 20, since the LED chips 21 are mounted on the flexible wiring board 30, it is possible to arrange multiple LED chips 21 at a desired high density.

[0048] The metal wiring section 32 is located on the surface 31a of the substrate 31. A light-reflective insulating protective film 34 is formed on the metal wiring section 32. This light-reflective insulating protective film 34 is not formed in the area of ​​the LED sheet 20 where the LED chip 21, regulator 45, first connector 44A, or second connector 44B are provided. Furthermore, the light-reflective insulating protective film 34 is not formed in the peripheral area of ​​the area where the LED chip 21, regulator 45, first connector 44A, or second connector 44B are provided. The light-reflective insulating protective film 34 is a layer that combines an insulating function that contributes to improving the migration resistance characteristics of the LED sheet 20 and a light-reflecting function that contributes to improving the light environment created by the LED sheet 20. This layer is formed from an insulating resin composition containing a white pigment. If the aforementioned metal wiring section 32 and the transparent protective film 35 described later provide the necessary migration resistance and light-reflecting functions, the light-reflective insulating protective film 34 does not need to be formed on the metal wiring section 32.

[0049] A transparent protective film 35 is formed to cover the light-reflective insulating protective film 34 and the LED chip 21. The transparent protective film 35 is a resinous film formed on the outermost surface (the surface closest to the light-emitting surface 20a) of the LED sheet 20, primarily to ensure the waterproofness of the LED sheet 20.

[0050] Furthermore, a solder joint 36 is provided on the metal wiring section 32. Each LED chip 21 is electrically connected to the metal wiring section 32 via the solder joint 36.

[0051] (substrate) In this embodiment, the substrate 31 is flexible. The substrate 31 can be made of a flexible resin film. In this specification, "flexible" means "having a radius of curvature when bent of at least 1 m, preferably 50 cm, more preferably 30 cm, even more preferably 10 cm, and particularly preferably 5 cm."

[0052] As the material for the substrate 31, a thermoplastic resin with high heat resistance and insulation properties may be used. As such a resin, polyimide resin (PI) or polyethylene naphthalate (PEN), which has excellent heat resistance, dimensional stability when heated, mechanical strength, and durability, can be used. Among these, polyethylene naphthalate (PEN) whose heat resistance and dimensional stability have been improved by heat resistance improvement treatment such as annealing is preferably used. Alternatively, polyethylene terephthalate (PET) whose flame retardancy has been improved by adding flame-retardant inorganic fillers may also be used.

[0053] The surface 31a of the substrate 31 faces the culture tube 10. Preferably, this surface 31a is colored white. This allows for effective reflection of light leaking out from the culture tube 10, further improving the efficiency of light utilization.

[0054] The thickness of the substrate 31 is not particularly limited. From the viewpoint of not becoming a bottleneck in the heat dissipation path, having heat resistance and insulation properties, and balancing manufacturing costs, the thickness of the substrate 31 is preferably about 10 μm or more, and more preferably about 50 μm or more. Furthermore, the thickness of the substrate 31 is preferably 500 μm or less, and more preferably 250 μm or less. Also, from the viewpoint of maintaining good productivity when manufacturing by a roll-to-roll method, it is preferable that the thickness of the substrate 31 be within the above thickness range.

[0055] (adhesive layer) The adhesive forming the adhesive layer 33 may be any known resin-based adhesive. Among these resin adhesives, urethane-based, polycarbonate-based, silicone-based, ester-based, or epoxy-based adhesives are particularly preferred.

[0056] (Metal wiring part) The metal wiring section 32 is a wiring pattern formed on the surface 31a (the surface on the light-emitting surface 20a side) of the substrate 31 using a conductive substrate such as metal foil. Preferably, this metal wiring section 32 is formed on the surface 31a of the substrate 31 by a dry lamination method via an adhesive layer 33. The metal wiring section 32 includes a plurality of metal wiring sections 22 as described above. The plurality of metal wiring sections 22 include a first metal wiring section 22A and a second metal wiring section 22B arranged spaced apart from the first metal wiring section 22A. LED chips 21 are mounted on the first metal wiring section 22A and the second metal wiring section 22B, and the LED chips 21 are electrically connected to the first metal wiring section 22A and the second metal wiring section 22B. The LED chips 21 light up when power is supplied to the first metal wiring section 22A and the second metal wiring section 22B.

[0057] The metal wiring section 32 preferably achieves a high level of both heat dissipation and electrical conductivity, and for example, copper foil can be used. In this case, heat dissipation from the LED chip 21 is stable and an increase in electrical resistance is prevented, so the variation in light emission between LED chips 21 is reduced and stable light emission is possible. The lifespan of the LED chip 21 is also extended. Furthermore, deterioration of surrounding materials such as the substrate 31 due to heat is prevented, so the product lifespan of the LED sheet 20 can also be extended. Examples of metals that can form the metal wiring section 32 include, in addition to the above-mentioned copper, aluminum, gold, silver, and other metals.

[0058] The thickness of the metal wiring section 32 can be appropriately set according to the current resistance required for the flexible wiring board 30. However, in order to suppress warping due to thermal shrinkage of the substrate 31 during soldering by reflow soldering, etc., it is preferable that the thickness of the metal wiring section 32 be 10 μm or more. On the other hand, it is preferable that the thickness of the metal wiring section 32 be 50 μm or less, which allows for sufficient flexibility of the flexible wiring board 30 and prevents a decrease in handling performance due to increased weight.

[0059] (Soldering section) The solder joint 36 connects the metal wiring section 32 to the LED chip 21. This soldering can be performed using either a reflow soldering method or a laser soldering method.

[0060] (LED chip) The LED chip 21 is a light-emitting element that utilizes light emission at the PN junction where a P-type semiconductor and an N-type semiconductor are joined. The LED chip 21 may have a structure in which a P-type electrode and an N-type electrode are provided on the upper and lower surfaces of the element, respectively, or it may have a structure in which both a P-type electrode and an N-type electrode are provided on one side of the element.

[0061] Furthermore, it is preferable to select LED chips 21 with high luminous efficiency. Specifically, it is preferable to use LED chips 21 with a luminous efficiency of 150 lm / W or more, and even more preferable to use LED chips 21 with a luminous efficiency of 180 lm / W or more. By increasing the luminous efficiency of the LED chips 21 to 150 lm / W or more, the number (density) of LED chips 21 to be mounted can be reduced, and the heat generated by Joule heating from the LED chips 21 can be reduced. This prevents the deterioration of surrounding components such as the substrate 31 due to heat from the LED chips 21.

[0062] As described above, the LED sheet 20 directly mounts the LED chips 21 onto a metal wiring section 32 that exhibits high heat dissipation. This allows the excess heat generated when the LED chips 21 are lit to be quickly dissipated through the metal wiring section 32, even when the LED chips 21 are arranged at high density. As a result, sufficient heat can be dissipated to the outside of the LED sheet 20 via the substrate 31, preventing deterioration of the substrate 31 and other surrounding components due to heat from the LED chips 21.

[0063] As shown in Figure 7, in this embodiment, the LED chip 21 has a relative intensity peak in the range of radiation angles from 10° to 80°. Thus, in this embodiment, the LED chip 21 is a highly oriented LED chip. In this case, as shown in Figure 8, the variation in the intensity of light L irradiated from the LED chip 21 within the culture tube 10 can be reduced. In contrast, as shown in Figure 9, if the LED chip has a relative intensity peak at a radiation angle of 0°, the variation in the intensity of light L irradiated from the LED chip 21 within the culture tube 10 may become large, as shown in Figure 10. Note that in Figures 8 and 10, the intensity of light L is shown as an image by a dashed line.

[0064] As shown in Figure 7, the LED chip 21 may, for example, have a peak in relative brightness at a radiation angle of 50° (-50°). The position where the LED chip 21 has a peak in relative brightness may also be at a radiation angle of 10° or more, 20° or more, 30° or more, or 40° or more. Furthermore, the position where the LED chip 21 has a peak in relative brightness may also be at a radiation angle of 80° or less, 70° or less, 60° or less, or 50° or less.

[0065] (Light-reflective insulating protective film) As shown in Figure 6, the light-reflective insulating protective film 34 is a layer formed in areas excluding the region where the LED chip 21 is provided and its surrounding areas. This light-reflective insulating protective film 34 is a so-called resist layer that improves the migration resistance characteristics of the flexible wiring substrate 30 by having sufficient insulating properties. Furthermore, the light-reflective insulating protective film 34 is a light-reflective layer that has light reflectivity that contributes to improving the luminous brightness of the light environment created by the LED sheet 20.

[0066] The light-reflective insulating protective film 34 can be formed from various resin compositions that use a urethane-based resin or the like as a base resin and further contain a white pigment made of an inorganic filler such as titanium dioxide. As the base resin of the resin composition used to form the light-reflective insulating protective film 34, in addition to urethane-based resins, acrylic polyurethane resins, polyester resins, phenolic resins, silicone resins, etc. can be used as appropriate. It is more preferable that the base resin of the resin composition for forming the light-reflective insulating protective film 34 be the same as or of the same type as the resin used for forming the transparent protective film 35. As will be described later, it is preferable to use an acrylic polyurethane resin as the main material resin for the transparent protective film 35. Therefore, when the base resin of the resin composition for forming the transparent protective film 35 is an acrylic polyurethane resin, it is more preferable that the base resin of the resin composition for forming the light-reflective insulating protective film 34 be a urethane-based resin or an acrylic polyurethane resin.

[0067] As an inorganic filler to be included as a white pigment in the resin composition that forms the light-reflective insulating protective film 34, in addition to titanium dioxide, at least one selected from alumina, barium sulfate, magnesia, aluminum nitride, boron nitride, barium titanate, kaolin, talc, calcium carbonate, zinc oxide, silica, mica powder, glass powder, nickel powder, and aluminum powder can be used.

[0068] The thickness of the light-reflective insulating protective film 34 is 5 μm or more, more preferably 7 μm or more. Furthermore, the thickness of the light-reflective insulating protective film 34 is 50 μm or less, more preferably 20 μm or less. A thickness of 5 μm or more for the light-reflective insulating protective film 34 prevents it from becoming thinner, particularly at the edges of the metal wiring portion 32. This prevents the metal wiring portion 32 from being exposed. Additionally, a thickness of 50 μm or less for the light-reflective insulating protective film 34 prevents it from peeling off, for example, from the metal wiring portion 32, even if the flexible wiring substrate 30 is bent during transport or other processes.

[0069] Furthermore, the light-reflective insulating protective film 34 preferably has a light reflectance of 65% or more, more preferably 70% or more, and even more preferably 80% or more at wavelengths of 400 nm to 780 nm. For example, by including 20 parts by mass or more of titanium dioxide per 100 parts by mass of a urethane-based or acrylic-based polyurethane base resin, it is possible to achieve a light reflectance of 75% or more in the light-reflective insulating protective film 34 when its thickness is 8 μm.

[0070] (Transparent protective film) The transparent protective film 35 is formed on the outermost surface of the LED sheet 20 so as to cover the LED chip 21. The transparent protective film 35 is waterproof and transparent. The waterproof nature of the transparent protective film 35 prevents water from entering the inside of the LED sheet 20. If a high-luminosity LED chip 21 is selected, for example, one with a luminous efficiency of 150 lm / W or more, the impact on the LED sheet 20 will be greater if a specific LED chip 21 is damaged. Therefore, it is important from a risk management perspective to make the LED chip 21 as undamaged as possible.

[0071] The transparent protective film 35 can be formed from various resin compositions using acrylic polyurethane resin or the like as the base resin. As the base resin for the resin composition used to form the transparent protective film 35, in addition to acrylic polyurethane resin, urethane resin, polyester resin, phenolic resin, silicone resin, etc., can be used as appropriate. It is more preferable that the base resin for the resin composition forming the transparent protective film 35 be the same as or of the same type as the resin used for the resin composition forming the light-reflective insulating protective film 34. A preferred specific combination is one in which the base resin for the resin composition forming the light-reflective insulating protective film 34 is a urethane resin, and the resin forming the transparent protective film 35 is an acrylic polyurethane resin.

[0072] The thickness of the transparent protective film 35 is preferably 10 μm or more, and more preferably 20 μm or more. Furthermore, the thickness of the transparent protective film 35 is preferably 40 μm or less, and more preferably 25 μm or less. By setting the thickness of the transparent protective film 35 within the above range, the good flexibility, thinness, lightness, and good optical properties required in emergencies of the LED sheet 20 can be maintained. Additionally, sufficient waterproofing required in emergencies can be provided to the LED sheet 20.

[0073] The water resistance of the LED sheet 20 with the transparent protective film 35 is not particularly limited, as long as it is sufficient to suppress the degradation of the LED chips 21 when water is sprayed onto the LED sheet 20. Such water resistance is preferably IPX4 or higher according to the waterproof and dustproof protection standards set by the IEC (International Electrotechnical Commission). IPX4 or higher waterproofing means that the LED chips 21 are not adversely affected by water splashes from any direction. Specifically, this means that when water is sprayed from a spray nozzle at a rate of 10 L / min over the entire range of ±180° relative to the normal direction of the LED sheet 20 for 5 minutes, the LED chips 21 are not adversely affected.

[0074] (Spacer) The spacers 50 play a role in adjusting the distance between the LED chip 21 and the culture tube 10. As shown in Figures 3 and 4, in a plan view, one spacer 50 is placed near each end of the LED sheet 20 in the width direction (both ends in the Y direction). The spacers 50 also extend along the longitudinal direction (X direction) of the LED sheet 20. In this case, as shown in Figures 1 and 2, in the culture system 1, the spacers 50 are provided near the upper and lower ends of the culture tube 10. In this embodiment, the spacers 50 are made of rod-shaped members. In the culture system 1, the spacers 50 surround the culture tube 10 by being rolled into a cylindrical shape. The number of spacers 50 is arbitrary, but it is preferable to have multiple spacers 50. In this case, there may be three or more spacers 50. For example, in addition to the ends in the width direction of the LED sheet 20, spacers 50 may also be placed in the center in the width direction, etc. Furthermore, a pre-formed ring-shaped member may be used as the spacer 50. Such a spacer 50 may be made of a resin such as acrylic, polycarbonate, or polyvinyl chloride, or it may be made of a metal such as aluminum, aluminum alloy, or stainless steel plate.

[0075] The distance D between the LED chip 21 and the culture tube 10 (see Figure 8) may be 7 mm or more, or 10 mm or more. A distance D of 7 mm or more can suppress algal growth problems caused by light irradiated into the culture tube 10. In particular, a distance D of 10 mm or more can equalize the intensity of light irradiated at the boundary between the culture tube 10 and the culture medium CS (i.e., the inner surface 10b of the culture tube 10). This can suppress damage to algae and improve algal yield. Alternatively, the distance D may be 15 mm or less, or 12 mm or less. This can increase the efficiency of light utilization and improve algal yield. For example, the distance D may be 10 mm. Note that distance D refers to the distance (radial distance) from the surface (the surface on the light-emitting side 20a) 21a of the LED chip 21 to the inner surface 10b of the culture tube 10.

[0076] In this embodiment, the uniformity may be 0.5 or greater in the region where the distance from the LED chip 21 along the normal direction N (see Figure 6) of the surface (first surface) 31a of the substrate 31 is 10 mm or more and 40 mm or less. This makes it possible to equalize the intensity of the light irradiated into the culture tube 10. Also, the shortest distance between the LED chips 21 is D min When the distance along the normal direction N of the surface 31a of the substrate 31 is 10 mm or more and 40 mm or less, the uniformity is 0.5 × 40 / D min It may be greater than or equal to this. This makes it possible to equalize the intensity of light irradiated into the culture tube 10. Note that the distance for measuring uniformity refers to the distance from the surface (the surface on the light-emitting surface 20a side) 21a of the LED chip 21. Furthermore, uniformity is the value obtained by dividing the minimum illuminance in a predetermined area by the average illuminance in that area. The maximum value of uniformity is 1. A larger uniformity value means that the uniformity of the light intensity is higher. In addition, the shortest distance D between the LED chips 21 min This is calculated as follows: First, the difference in distance in the X direction between one LED chip 21 and the other LED chip 21 closest to that LED chip 21 is D. Xand let the difference in distance in the Y direction be D Y be so. In this case, D min , D X 2 and D Y 2 are such that D min =√(D X 2 +D Y 2 ) satisfies the relationship.

[0077] Here, when there is a large variation in the intensity of the light irradiated into the culture tube 10, a hot spot of the light irradiated from the LED chip 21 can be formed inside the culture tube 10. Note that a hot spot means a location (a location where the light intensity is partially high) where a specific region becomes brighter than other regions in an area where the light should be evenly irradiated, due to the light concentrating and strongly hitting a specific location. Thus, when a hot spot is formed inside the culture tube 10, the algae may be damaged by the overly strong light. In this case, the yield of the algae may decrease. On the other hand, by simply reducing the intensity of the light from the light source, the damage to the algae can be suppressed. However, when the intensity of the light from the light source is reduced, the inside of the culture tube 10 becomes overall darker, and the yield of the algae may decrease.

[0078] In the present embodiment, the uniformity of the intensity of the light irradiated into the culture tube 10 can be achieved. Thereby, the formation of a hot spot of the light irradiated from the LED chip 21 inside the culture tube 10 can be suppressed. Thus, in the present embodiment, while maintaining the light intensity, the formation of a hot spot of the light inside the culture tube 10 can be suppressed. For this reason, the utilization efficiency of the light can be increased and the yield of the algae can be improved.

[0079] Here, the relationship between the LED sheet 20 according to this embodiment and the uniformity of light, and the relationship between the LED sheet according to the comparative example and the uniformity of light will be explained with reference to Figures 11 to 16. Figure 11 is a diagram showing the simulation results of the light intensity distribution at a distance of 10 mm along the normal direction N from the LED chip 21 in the LED sheet 20 according to this embodiment. Figure 12 is a diagram showing the simulation results of the light intensity distribution at a distance of 20 mm along the normal direction N from the LED chip 21 in the LED sheet 20 according to this embodiment. Figure 13 is a diagram showing the simulation results of the light intensity distribution at a distance of 40 mm along the normal direction N from the LED chip 21 in the LED sheet 20 according to this embodiment. Figure 14 is a diagram showing the simulation results of the light intensity distribution at a distance of 10 mm along the normal direction N from the LED chip in the LED sheet according to the comparative example. Figure 15 is a diagram showing the simulation results of the light intensity distribution at a distance of 20 mm along the normal direction N from the LED chip in the LED sheet according to the comparative example. Figure 16 shows the simulation results of the light intensity distribution at a distance of 40 mm along the normal direction N from the LED chip in the comparative example LED sheet. The LED chip 21 in the LED sheet 20 of this embodiment is the LED chip shown in Figure 7. The LED chip in the comparative example LED sheet is the LED chip shown in Figure 9.

[0080] As shown in Figures 11 to 13, in the LED sheet 20 according to this embodiment, it can be seen that no hot spots occur at the position corresponding to the LED chip 21, even at a distance of 10 mm. In contrast, as shown in Figures 14 to 16, in the LED sheet according to the comparative example, hot spots HS occur at distances of 10 mm and 20 mm. Therefore, it can be seen that in the LED sheet 20 according to this embodiment, even when the distance D between the LED chip 21 and the culture tube 10 is shortened, the formation of hot spots HS inside the culture tube 10 can be effectively suppressed.

[0081] Furthermore, Table 1 shows the measurement results of the degree of uniformity in the simulation described above.

[0082] [Table 1]

[0083] As shown in Table 1, the LED sheet 20 according to this embodiment shows higher uniformity than the LED sheet according to the comparative example at distances of 10 mm, 20 mm, and 40 mm. In particular, the LED sheet 20 according to this embodiment shows higher uniformity than the LED sheet according to the comparative example at distances of 10 mm and 20 mm. Therefore, it can be seen that the LED sheet 20 according to this embodiment can achieve uniformity of the light intensity irradiated into the culture tube 10 even when the distance D between the LED chip 21 and the culture tube 10 is shortened. Thus, in this embodiment, by shortening the distance D between the LED chip 21 and the culture tube 10, it is possible to suppress the formation of light hotspots in the culture tube 10 while maintaining light intensity. Therefore, it is possible to increase the efficiency of light utilization and improve the yield of algae.

[0084] (How to manufacture LED sheets) Next, the method for manufacturing the LED sheet 20 according to this embodiment will be described with reference to Figures 17(a)-(h).

[0085] First, a substrate 31 is prepared (Figure 17(a)). Next, a metal foil 32A, such as copper foil, which will be the material for the metal wiring section 32, is laminated onto the surface 31a of the substrate 31 (see Figure 6) (Figure 17(b)). The metal foil 32A is bonded to the surface 31a of the substrate 31 by an adhesive layer 33, such as a urethane-based adhesive. Alternatively, the metal foil 32A may be directly formed on the surface 31a of the substrate 31 by an electrolytic plating method or a vapor deposition method (sputtering, ion plating, electron beam deposition, vacuum deposition, chemical deposition, etc.). Alternatively, the substrate 31 may be directly welded to the metal foil 32A.

[0086] Next, an etching mask 37 patterned to the shape required for the metal wiring portion 32 is formed on the surface of the metal foil 32A (Figure 17(c)). This etching mask 37 is provided so that the portion of the metal foil 32A corresponding to the wiring pattern that will become the metal wiring portion 32 is not corroded by the etching solution. The method for forming the etching mask 37 is not particularly limited. The etching mask 37 may be formed, for example, by exposing a photoresist or dry film to light through a photomask and then developing it. Alternatively, the etching mask 37 may be formed on the surface of the metal foil 32A by printing technology such as an inkjet printer.

[0087] Next, the metal foil 32A located in areas not covered by the etching mask 37 is removed by immersion (Figure 17(d)). This removes the parts of the metal foil 32A other than those that will become the metal wiring section 32.

[0088] Subsequently, the etching mask 37 is removed using an alkaline stripping solution. This removes the etching mask 37 from the surface of the metal wiring section 32 (Figure 17(e)).

[0089] Next, a light-reflective insulating protective film 34 is laminated onto the metal wiring portion 32 (Figure 17(f)). The formation of the light-reflective insulating protective film 34 is not particularly limited as long as a coating means is possible that can uniformly coat the material resin composition constituting the light-reflective insulating protective film 34. For example, methods such as screen printing, offset printing, dip coating, and brush coating can be used. Alternatively, the light-reflective insulating protective film 34 may be formed by coating the entire surface with a photosensitive insulating protective film material, exposing only the necessary areas to light through a photomask, and then developing the material.

[0090] Next, the LED chip 21, regulator 45, and connectors 44A and 44B are mounted on the metal wiring section 32 (Figure 17(g)). Note that in Figure 17(g) and Figure 17(h), which will be described later, the regulator 45 and other components are omitted from the diagram for clarity. In this case, the LED chip 21 is joined to the metal wiring section 32 by soldering via the solder section 36. This soldering can be done by reflow soldering, laser soldering, or by bonding with conductive resin.

[0091] Next, a transparent protective film 35 is formed to cover the light-reflective insulating protective film 34, the LED chip 21, the regulator 45, and the connectors 44A and 44B (Figure 17(h)). This transparent protective film 35 is preferably formed by a method of spraying a transparent resin composition (hereinafter referred to as the "spray coating method") or by a curtain coating method. The transparent protective film 35 can be formed by the spray coating method, for example, by spraying a coating liquid for spray coating treatment containing an acrylic polyurethane resin onto a desired area on the flexible wiring board 30 using a spray coating machine to form a coating film. The transparent protective film 35 can be formed by the curtain coating method, for example, by dropping a coating liquid for curtain coating treatment containing an acrylic polyurethane resin onto a desired area on the flexible wiring board 30 using a curtain coating machine to form a coating film.

[0092] Furthermore, the LED sheet 20 according to this embodiment is not limited to the method described above, but can also be manufactured using conventionally known flexible wiring boards for LED chips, or known methods for manufacturing various LED sheets on which LED chips are mounted.

[0093] (culture factory) Figure 18 is a schematic diagram showing the configuration of a culture factory 90 using the culture system 1 according to this embodiment. The culture factory 90 comprises a building 91 and a plurality of culture shelves 80 arranged inside the building 91.

[0094] As shown in Figure 19, the culture shelf 80 has a plurality (four) of support columns 82 and a pair of substrates 81 arranged vertically at intervals along the support columns 82. A plurality of culture systems 1 are arranged between the pairs of substrates 81. In the illustrated example, the culture systems 1 are arranged so that the longitudinal direction of the culture tubes 10 is parallel to the vertical direction. Although not shown in the illustration, the culture systems 1 may also be arranged so that the longitudinal direction of the culture tubes 10 is parallel to the horizontal direction.

[0095] Here, the control unit 40 is positioned at a sufficient distance from the culture tubes 10. Therefore, there is less risk of variations in algal growth due to heat from the control unit 40 between culture tubes 10 located close to the control unit 40 and those located far away.

[0096] The LED sheet 20 according to this embodiment is thinner compared to conventional straight-tube lighting devices. This allows for a narrower spacing between culture systems 1, and increases the number of culture systems 1 placed between pairs of substrates 81. As a result, the amount of algae grown per unit area can be increased.

[0097] As described above, according to this embodiment, the LED sheet 20 comprises a substrate 31 having a surface (first surface) 31a and a back surface (second surface) 31b located opposite to the surface 31a, and a plurality of LED chips 21 arranged two-dimensionally and discretely on the surface 31a of the substrate 31. Furthermore, the LED chips 21 have a peak in relative brightness in the range of radiation angle from 10° to 80°. This reduces variations in the intensity of light L irradiated from the LED chips 21 within the culture tube 10. As a result, the intensity of light irradiated within the culture tube 10 can be made uniform. Consequently, the efficiency of light utilization can be increased, damage to algae can be suppressed, and the efficiency of algae growth can be improved. Therefore, the yield of algae can be improved.

[0098] Furthermore, according to this embodiment, the end portion 20b of the LED sheet 20 is bent toward the culture tube 10. This prevents light emitted from the LED sheet 20 from leaking out from the upper and lower ends of the LED sheet 20. As a result, the efficiency of light utilization can be increased.

[0099] In the embodiment described above, an example was given in which the LED sheet 20 is applied to a culture system 1 for cultivating algae, but the embodiment is not limited to this. For example, the LED sheet 20 may be applied to a plant and animal cultivation system that includes a cultivation container for growing plants and animals. That is, the LED sheet 20 (LED lighting device) may irradiate light onto the cultivation container for growing plants and animals. In this specification, "plants and animals" means animals and / or plants.

[0100] Furthermore, in the embodiment described above, an example was described in which the spacer 50 extends along the longitudinal direction (X direction) of the LED sheet 20 in a plan view, but the embodiment is not limited to this. For example, as shown in Figure 20, the spacer 50 may extend along the width direction (Y direction) of the LED sheet 20. In the illustrated example, three spacers 50 are arranged. In this case, it is preferable that the LED sheet 20 is configured such that the spacers 50 are arranged at approximately equal intervals in the circumferential direction when surrounding the culture tube 10. This makes it possible to keep the distance between the LED sheet 20 and the culture tube 10 approximately constant in the circumferential direction of the culture tube 10.

[0101] Furthermore, as shown in Figure 21, the spacer 50 may extend along a direction that is inclined in both the longitudinal direction (X direction) and the width direction (Y direction) of the LED sheet 20.

[0102] Furthermore, as shown in Figure 22, the spacers 50 may be arranged in a point-like manner in a plan view. In this case, the spacers 50 are arranged regularly in a plan view. In the illustrated example, the spacers 50 are arranged in a staggered pattern in a plan view. By arranging the spacers 50 regularly in a plan view in this way, the distance between the LED sheet 20 and the culture tube 10 can be kept approximately constant in the vertical and circumferential directions. Although not shown in the illustration, the spacers 50 may also be arranged irregularly.

[0103] In this modified example, as shown in Figures 22 and 23, the shape of the spacer 50 is a frustum of a cone. Although not shown in the figures, the shape of the spacer 50 may also be a frustum of a pyramidal pyramid. In this modified example, as shown in Figure 23, the spacer 50 gradually tapers toward the culture tube 10. This reduces the area of ​​the outer surface 10a of the culture tube 10 that is covered by the spacer 50. Therefore, the efficiency of light utilization can be increased.

[0104] Furthermore, as shown in Figure 24, a non-slip surface 51 may be attached to the tip of the spacer 50. This non-slip surface 51 may be made of rubber or the like. This helps to suppress displacement of the LED sheet 20 when it is attached to the culture tube 10.

[0105] When attaching the LED sheet 20 to the culture tube 10, for example, as shown in Figure 25, the LED sheet 20 is attached to the culture tube 10 so that it covers the outer surface 10a of the culture tube 10. In this case, the rolled-up cylindrical LED sheet 20 is placed over the culture tube 10 from the upper end 10c of the culture tube 10. For this reason, for example, as shown in Figure 26, the lower surface 52 of the spacer 50 may be inclined downward as it moves radially outward. This makes it easier to attach the LED sheet 20 to the culture tube 10 and suppresses displacement of the LED sheet 20 when it is attached to the culture tube 10.

[0106] Furthermore, although the above-described embodiment describes an example in which the LED sheet 20 is equipped with a spacer 50, the embodiment is not limited to this. For example, as shown in Figure 27, the LED sheet 20 may be equipped with a magnet 55 placed on the surface 31a of the substrate 31.

[0107] The magnets 55 play a role in adjusting the distance between the LED chip 21 and the culture tube 10. As shown in Figure 27, in this modified example, in a plan view, one magnet 55 is placed at each end of the LED sheet 20 in the width direction (both ends in the Y direction). The magnets 55 also extend along the longitudinal direction (X direction) of the LED sheet 20. In this case, as shown in Figure 28, in the culture system 1, the magnets 55 are provided at the upper and lower ends of the culture tube 10. In the culture system 1, the magnets 55 surround the culture tube 10 by being rolled into a cylindrical shape. In this case, the culture tube 10 may also have magnets 15 attached for attaching the magnets 55. The number of magnets 55 is arbitrary, but it is preferable to have multiple magnets 55. In this case, there may be three or more magnets 55. For example, in addition to the ends of the LED sheet 20 in the width direction, the magnets 55 may also be placed in the center in the width direction, etc. Alternatively, a magnet that has been pre-formed into a ring shape may be used as the magnet 55.

[0108] In this modified example, the magnet 55 adjusts the distance between the LED chip 21 and the culture tube 10. Even in this case, the formation of hot spots HS of light irradiated from the LED chip 21 inside the culture tube 10 can be suppressed. This improves the efficiency of light utilization and increases the yield of algae.

[0109] As shown in Figure 29, the magnets 55 may extend along the width direction (Y direction) of the LED sheet 20. In the illustrated example, three magnets 55 are arranged. In this case, it is preferable that the LED sheet 20 is configured such that the magnets 55 are arranged at approximately equal intervals in the circumferential direction when surrounding the culture tube 10. This makes it possible to keep the distance between the LED sheet 20 and the culture tube 10 approximately constant in the circumferential direction of the culture tube 10.

[0110] Furthermore, as shown in Figure 30, the magnet 55 may extend along a direction that is inclined in both the longitudinal direction (X direction) and the width direction (Y direction) of the LED sheet 20.

[0111] Furthermore, as shown in Figure 31, the magnets 55 may be arranged as points in a plan view. In this case, the magnets 55 are arranged regularly in a plan view. Although not shown in the figure, the magnets 55 may also be arranged irregularly.

[0112] Furthermore, in the embodiment described above, an example was described in which the distance between the LED chip 21 and the culture tube 10 is adjusted by a spacer 50, but the embodiment is not limited to this. For example, as shown in Figure 32, the culture system 1 may further include a light diffusing sheet 60 positioned between the culture tube 10 and the LED sheet 20. This light diffusing sheet 60 may be, for example, a film with a high haze value. In this case, the haze value of the light diffusing sheet 60 may be 90% or more.

[0113] For measuring the haze value, a light source that mimics the spectrum of sunlight (hereinafter referred to as the D65 light source) using D65 standard light is used. Before measuring the haze value of the light diffusion sheet 60, the D65 light source is turned on for 15 minutes to stabilize its output.

[0114] The sample for measuring the haze value will be cut from a light diffusion sheet 60. The sample size will be 10cm x 10cm. Visually inspect the sample to ensure there are no abnormalities such as dust or scratches. A haze meter "HM-150" manufactured by Murakami Color Technology Laboratory will be used to measure the haze value. The angle of incidence on the sample when measuring the haze value will be 0°. The test environment for measuring the haze value will be a temperature of 23℃ ± 2℃ and a relative humidity of 50% ± 5%. The sample will be placed in the test environment for 16 hours before the start of the test. Other measurement conditions for measuring the haze value will follow JIS K7136:2000.

[0115] The haze value is the arithmetic mean of the five measurements. The five measurements are taken at five different measurement locations on the light diffusion sheet 60 being evaluated. The five measurement locations are located at least 10 mm apart from each other.

[0116] In this modified version, the culture system 1 further includes a light-diffusing sheet 60 positioned between the culture tube 10 and the LED sheet 20. This allows the light from the LED chip 21 to be diffused. As a result, the formation of light hotspots HS within the culture tube 10 can be suppressed while maintaining the light intensity. This improves the efficiency of light utilization and increases the yield of algae.

[0117] Although not shown in the diagram, the culture system 1 may also include two or more of the spacer 50, magnet 55, and light diffusing sheet 60.

[0118] Furthermore, in the embodiment described above, an example was described in which the culture system 1 comprises a culture tube 10 and an LED sheet 20 that irradiates light onto the culture tube 10. In this case, as shown in Figure 33, the culture system 1 may be equipped with multiple LED sheets 20.

[0119] In this modified example, as shown in Figure 33, the culture system 1 includes a first LED sheet 201, a second LED sheet 202, and a third LED sheet 203. In this modified example, the multiple LED sheets 20 (first LED sheet 201, second LED sheet 202, and third LED sheet 203) are arranged along the vertical direction. Furthermore, the first LED sheet 201, the second LED sheet 202, and the third LED sheet 203 cover different areas of the outer surface 10a of the culture tube 10. This allows for a larger culture system 1. In this specification, the first LED sheet 201, the second LED sheet 202, or the third LED sheet 203 are also simply referred to as LED sheets 20. The culture system 1 may also include four or more LED sheets 20.

[0120] Each LED sheet 20 may be connected to one another by a connecting member (not shown). The connecting member may be, for example, double-sided tape or Velcro tape, adhesive, or rivet. Alternatively, the connecting member may be a string-like member such as a cable tie. If the connecting member is a string-like member, for example, through holes (not shown) may be formed in the LED sheets 20 that penetrate through the LED sheets 20, and the LED sheets 20 may be connected to each other by passing the connecting member through these through holes. In this case, the area around the through holes may be protected by eyelets (not shown).

[0121] To manufacture such a culture system 1, first, prepare a cylindrical culture tube 10 as shown in Figures 34(a)-(c). Also, prepare a first LED sheet 201 rolled into a cylindrical shape, a second LED sheet 202 rolled into a cylindrical shape, and a third LED sheet 203 rolled into a cylindrical shape.

[0122] Next, as shown in Figure 34(a), the first LED sheet 201 is placed over the culture tube 10 from the upper end 10c of the culture tube 10 so that the first LED sheet 201 covers the outer surface 10a of the culture tube 10.

[0123] Next, as shown in Figure 34(b), the second LED sheet 202 is placed over the culture tube 10 from the upper end 10c of the culture tube 10, which is covered with the first LED sheet 201, so that the second LED sheet 202 covers the outer surface 10a of the culture tube 10.

[0124] Next, as shown in Figure 34(c), the third LED sheet 203 is placed over the culture tube 10 from the upper end 10c of the culture tube 10, which is covered with the second LED sheet 202, so that the third LED sheet 203 covers the outer surface 10a of the culture tube 10.

[0125] In this way, the culture system 1 shown in Figure 33 is obtained.

[0126] In this modified example, the culture system 1 is equipped with multiple LED sheets 20. Furthermore, the first LED sheet 201, the second LED sheet 202, and the third LED sheet 203 cover different areas of the outer surface 10a of the culture tube 10. This allows for a larger culture system 1, thereby improving the yield of algae. Even when the culture system 1 is equipped with multiple LED sheets 20, the culture system 1 can be easily manufactured using the method described with reference to Figure 34.

[0127] When manufacturing the culture system 1 shown in Figure 33, the LED sheet 20 may be wrapped around the culture tube 10.

[0128] In this case, first, prepare a cylindrical culture tube 10 as shown in Figures 35(a)-(d). Also, prepare a first LED sheet 201, a second LED sheet 202, and a third LED sheet 203 (not shown).

[0129] Next, as shown in Figures 35(a)-(b), the first LED sheet 201 is wrapped around the culture tube 10 so that it covers the outer surface 10a of the culture tube 10.

[0130] Next, as shown in Figures 35(c)-(d), the second LED sheet 202 is wrapped around the culture tube 10 on which the first LED sheet 201 is wrapped, so that the second LED sheet 202 covers the outer surface 10a of the culture tube 10.

[0131] Subsequently, although not shown in the diagram, the third LED sheet 203 is wrapped around the culture tube 10, which the second LED sheet 202 is wrapped around, so that the third LED sheet 203 covers the outer surface 10a of the culture tube 10.

[0132] In this way, the culture system 1 shown in Figure 33 is obtained. Even in this case, the culture system 1 can be easily manufactured.

[0133] Furthermore, in the embodiment described above, an example was described in which the culture system 1 comprises culture tubes 10 and an LED sheet 20 for irradiating light onto the culture tubes 10. In this case, as shown in Figure 36, the culture system 1 may comprise multiple culture tubes 10.

[0134] In this modified example, as shown in Figure 36, the culture system 1 is equipped with three culture tubes 10. However, the culture system 1 may also be equipped with two or four or more culture tubes 10.

[0135] In this modified example, the culture system 1 also includes a first LED sheet 201 and a second LED sheet 202. In this modified example, the multiple LED sheets 20 (first LED sheet 201 and second LED sheet 202) are arranged along the vertical direction.

[0136] In this modified example, the first LED sheet 201 and the second LED sheet 202 each cover the outer surface 10a of multiple culture tubes 10. This reduces the number of LED sheets 20 used, thereby suppressing variations in light intensity. Furthermore, the first LED sheet 201 and the second LED sheet 202 cover different areas of the outer surface 10a of the culture tubes 10. This allows for a larger culture system 1. In this specification, the first LED sheet 201 or the second LED sheet 202 will also be simply referred to as LED sheet 20. The culture system 1 may also be equipped with one or three or more LED sheets 20. Moreover, in this modified example, each LED sheet 20 may be connected to each other by connecting members (not shown).

[0137] To manufacture such a culture system 1, first, prepare several cylindrical culture tubes 10 as shown in Figures 37(a)-(b). Also, prepare a first LED sheet 201 rolled into a cylindrical shape and a second LED sheet 202 rolled into a cylindrical shape.

[0138] Next, as shown in Figure 37(a), the first LED sheet 201 is placed over the culture tubes 10 from the upper end 10c of the culture tubes 10 so that the first LED sheet 201 covers the outer surface 10a of the culture tubes 10.

[0139] Next, as shown in Figure 37(b), the second LED sheet 202 is placed over the culture tubes 10 from the upper end 10c of the culture tubes 10 covered with the first LED sheet 201, so that the second LED sheet 202 covers the outer surface 10a of the culture tubes 10.

[0140] In this way, the culture system 1 shown in Figure 36 is obtained.

[0141] In this modified example, the culture system 1 is equipped with multiple culture tubes 10. This allows for a larger culture system 1, thereby improving the yield of algae. Furthermore, even when the culture system 1 is equipped with multiple culture tubes 10, the culture system 1 can be easily manufactured using the method described with reference to Figure 37.

[0142] When manufacturing the culture system 1 shown in Figure 36, the LED sheet 20 may be wrapped around the culture tube 10.

[0143] In this case, first, prepare several cylindrical culture tubes 10 as shown in Figures 38(a)-(b). Also, prepare the first LED sheet 201 and the second LED sheet 202.

[0144] Next, as shown in Figure 38(a), the first LED sheet 201 is wrapped around the multiple culture tubes 10 so that it covers the outer surface 10a of the multiple culture tubes 10.

[0145] Next, as shown in Figure 38(b), the second LED sheet 202 is wrapped around the multiple culture tubes 10 to which the first LED sheet 201 is wrapped, so that the second LED sheet 202 covers the outer surface 10a of the multiple culture tubes 10.

[0146] In this way, the culture system 1 shown in Figure 36 is obtained. Even in this case, the culture system 1 can be easily manufactured.

[0147] Furthermore, although the embodiment described above describes an example in which the body 11 of the culture tube 10 has a cylindrical shape, it is not limited to this. For example, as shown in Figure 39, the body 11 of the culture tube 10 may have a rectangular tubular shape. In the illustrated example, the body 11 includes a pair of first side portions 11a and a pair of second side portions 11b provided between the pair of first side portions 11a. Of these, the outer surface area of ​​the first side portions 11a is larger than the outer surface area of ​​the second side portions 11b.

[0148] In this modified example, the LED sheet 20 covers only the outer surface of one of the first side portions 11a of the body portion 11. However, as shown in Figure 40, the LED sheet 20 may cover the outer surfaces of both of the first side portions 11a of the body portion 11. Furthermore, as shown in Figure 41, the LED sheet 20 may cover the outer surfaces of both of the first side portions 11a and both of the second side portions 11b of the body portion 11.

[0149] As shown in this modified example, even when the body 11 of the culture tube 10 has a rectangular cylindrical shape, damage to algae can be suppressed and the efficiency of algae growth can be improved.

[0150] The multiple components disclosed in the above embodiments and each of the variations can be combined as needed. Alternatively, some components may be removed from all the components shown in the above embodiments and each of the variations. [Explanation of symbols]

[0151] 1. Culture System 10 culture tubes 10a Exterior 10b Inner surface 10c top end 20 LED sheets 20A LED lighting device 21 LED chips 31 circuit boards 31a surface 31b back side 50 Spacer 52 Bottom side 55 Magnets 60 Light Diffusion Sheets 201 1st LED Sheet 202 Second LED Sheet

Claims

1. It is an LED sheet, A substrate having a first surface and a second surface located opposite the first surface, The substrate comprises a plurality of LED chips arranged two-dimensionally and discretely on the first surface thereof, The LED chip is an LED sheet having a peak in relative light intensity in the range of radiation angle from 10° to 80°.

2. The LED sheet according to claim 1, wherein the uniformity is 0.5 or more in a region where the distance from the LED chip along the normal direction of the first surface is 10 mm or more and 40 mm or less.

3. The shortest distance between the LED chips is D ｍｉｎ When the value is [mm], in the region where the distance along the normal direction of the first surface is 10 mm or more and 40 mm or less, the uniformity is 0.5 × 40 / D ｍｉｎ The LED sheet described in claim 1 is as described above.

4. A container for raising plants and animals, A plant and animal cultivation system comprising an LED sheet according to any one of claims 1 to 3 for irradiating the cultivation container with light.

5. The plant and animal cultivation system according to claim 4, wherein the LED sheet covers the cultivation container in a curved state.

6. The end of the LED sheet is bent toward the growing container, as described in claim 4, for the plant and animal growing system.

7. The plant and animal cultivation system according to claim 4, wherein the distance between the LED sheet and the cultivation container is 7 mm or more and 15 mm or less.

8. The process of preparing a cylindrical growing container, The process involves preparing a first LED sheet rolled into a cylindrical shape and a second LED sheet rolled into a cylindrical shape, The steps include: placing the first LED sheet over the growing container from the top of the growing container so that the first LED sheet covers the outer surface of the growing container; The process includes the step of covering the growing container with the second LED sheet from the upper end of the growing container on which the first LED sheet is placed, such that the second LED sheet covers the outer surface of the growing container, The first LED sheet and the second LED sheet cover different areas of the outer surface of the growing container. The first LED sheet and the second LED sheet are, respectively, A substrate having a first surface and a second surface located opposite the first surface, The substrate comprises a plurality of LED chips arranged two-dimensionally and discretely on the first surface thereof, The LED chip has a peak in relative light intensity in the range of radiation angle from 10° to 80°, a method for manufacturing a plant and animal cultivation system.

9. The method for manufacturing a plant and animal cultivation system according to claim 8, wherein the first LED sheet and the second LED sheet each cover the outer surfaces of a plurality of cultivation containers.

10. The process of preparing a cylindrical growing container, The process involves preparing the first LED sheet and the second LED sheet. A step of wrapping the first LED sheet around the growing container such that the first LED sheet covers the outer surface of the growing container, The process includes wrapping the second LED sheet around the growing container such that the second LED sheet covers the outer surface of the growing container, The first LED sheet and the second LED sheet cover different areas of the outer surface of the growing container. The first LED sheet and the second LED sheet are, respectively, A substrate having a first surface and a second surface located opposite the first surface, The substrate comprises a plurality of LED chips arranged two-dimensionally and discretely on the first surface thereof, The LED chip has a peak in relative light intensity in the range of radiation angle from 10° to 80°, a method for manufacturing a plant and animal cultivation system.

11. The method for manufacturing a plant and animal cultivation system according to claim 10, wherein the first LED sheet and the second LED sheet each cover the outer surfaces of a plurality of cultivation containers.

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