Imprint device

Abstract

The present invention provides an imprinting device that can prevent film deformation by controlling the tension of the film to a constant level. [Solution] The imprint apparatus 100 includes a transfer unit 104 positioned between a film supply unit 102 and a film recovery unit 106, and a control unit 101 that controls the driving of the transfer unit. The transfer unit includes a stage 108 on which a master mold and a substrate are placed, a pressing member 110 positioned on the stage and pressing the film onto the stage, a resin curing unit 112 positioned on the stage and curing the resin applied to the master mold and the substrate, a first roll 118 positioned on the film's movement path and moving up and down so that the film is positioned adjacent to and parallel to the upper surface of the stage, a second roll 120 that moves in the opposite direction to the first roll to control the tension of the film in response to the movement of the first roll, and a sensor 116 that measures the tension of the film.

Description

Technical Field

[0001] The present invention relates to an imprint apparatus using a film, which can control the tension of the film to be constant to prevent deformation of the film, and can perform a series of steps including a step of forming a working mold and a step of forming a pattern on a substrate in a single process.

Background Art

[0002] As methods for forming circuit patterns on semiconductors, LCDs, biochips, printed circuit boards, etc., there are photolithography, imprint methods, etc. The imprint method is a method of transferring a pattern by squeezing a mold having a concavo-convex pattern into a liquid resin or the like on a substrate, and is classified into photo imprint, thermal imprint, etc. By using the imprint method, fine patterns from nanometers (nm) to micrometers (μm) can be realized, and patterns can be formed on substrates of various sizes from 4 inches to 12 inches and various materials such as metal, silicone, sapphire, and glass.

[0003] As one method of performing the imprint method, a mold can be formed on a polymer film for continuous processes and transferred to a substrate. Such apparatuses include an imprint apparatus for forming a working mold on a film using a master mold, and an imprint apparatus for transferring a pattern to a substrate using the working mold formed on the film.

[0004] When forming a working mold on a film or transferring the working mold formed on the film to a substrate in an imprint apparatus, the working mold and the substrate must be aligned at a predetermined position and squeezed against each other. However, in the process of installing the working mold or the substrate in the transfer apparatus or moving to squeeze the working mold and the substrate, the working mold and the substrate may not be positioned at a fixed position due to various factors.

[0005] In particular, tension can be applied to the film during the imprinting process, causing it to deform. When the film deforms in this way, the position of the work mold formed on the film changes, making it difficult to align the work mold with the substrate.

[0006] Furthermore, if the imprinting device that forms a working mold on a film using a master mold and the imprinting device that transfers a pattern to a substrate using the working mold formed on the film are separate devices, it becomes difficult to align the working mold and the substrate, or the alignment stage must be performed separately in each imprinting device.

[0007] In this way, when the mold and the substrate are compressed against each other without being properly aligned, defects occur where the pattern is not transferred to the predetermined position in the resin. [Overview of the project] [Problems that the invention aims to solve]

[0008] The embodiment of the present invention aims to prevent deformation of the film by controlling the tension of the film to a constant level in an imprinting apparatus.

[0009] Furthermore, the embodiments of the present invention aim to form a working mold in a series of steps and then form a pattern on a substrate. [Means for solving the problem]

[0010] An embodiment of the present invention provides an imprint apparatus comprising: a film supply unit for supplying a film; a film recovery unit for recovering the film supplied from the film supply unit; a transfer unit disposed between the film supply unit and the film recovery unit on the film's movement path; and a control unit for controlling the drive of the transfer unit, wherein the transfer unit comprises: a stage on which a master mold and a substrate are placed; a pressing member disposed on the stage for pressing the film onto the stage; a resin curing unit disposed on the stage for curing a resin applied to the master mold and the substrate; a first roll disposed on the film's movement path and moving up and down so that the film is adjacent to and parallel to the upper surface of the stage; a second roll that moves in the opposite direction to the first roll in response to the movement of the first roll to control the tension of the film; and a sensor for measuring the tension of the film.

[0011] An embodiment of the present invention provides an imprinting apparatus in which the second roll moves such that the tension of the film is maintained at a predetermined value (T).

[0012] An embodiment of the present invention provides an imprint apparatus in which, while the first roll descends to position the film adjacent to and parallel to the upper surface of the stage, the second roll rises to control the tension of the film, and while the first roll rises to move the film a predetermined distance away from the stage, the second roll descends to control the tension of the film.

[0013] An embodiment of the present invention provides an imprint apparatus in which, when a master mold is placed on the stage, a working mold with the pattern of the master mold transferred onto it is formed and attached to the film, and when a substrate is placed on the stage, the pattern of the working mold is transferred to the resin coated on the substrate.

[0014] An embodiment of the present invention provides an imprinting apparatus in which the second roll is a dancer roll.

[0015] An embodiment of the present invention provides an imprint apparatus in which the sensor is a load cell positioned between the first roll and the second roll on the film's movement path.

[0016] An embodiment of the present invention provides an imprint apparatus further comprising a first nip roll positioned between the sensor and the second roll on the film's movement path, and a second nip roll positioned between the second roll and the film recovery unit on the film's movement path.

[0017] An embodiment of the present invention provides an imprint apparatus in which the film is placed on the stage such that it is inclined at a predetermined angle (α) with respect to the upper surface of the stage, the angle (α) decreases as the first roll descends and the predetermined position of the film descends in the direction of the stage, and the angle (α) increases as the first roll rises and the predetermined position of the film rises from the stage.

[0018] An embodiment of the present invention provides an imprinting apparatus in which the pressurizing member pressurizes the film while moving horizontally by rolling contact.

[0019] An embodiment of the present invention provides an imprint apparatus in which the transfer unit further includes a first camera positioned on one side of the stage for recognizing the position of a work mold to be attached to the film.

[0020] An embodiment of the present invention provides an imprint apparatus in which the transfer unit is located on the other side of the stage and further includes a second camera that recognizes the position of the substrate placed on the stage.

[0021] An embodiment of the present invention provides an imprint apparatus in which a second camera recognizes the position of the substrate while the first camera recognizes the position of the work mold. [Effects of the Invention]

[0022] According to an embodiment of the present invention, in an imprint apparatus, the tension of a film can be controlled to be constant to prevent deformation of the film.

[0023] Also, according to an embodiment of the present invention, by preventing deformation of the film, deformation of a working mold formed on the film can be prevented.

[0024] Also, according to an embodiment of the present invention, by preventing deformation of the film, transfer accuracy and yield can be increased, and the working time can be shortened.

[0025] Also, according to an embodiment of the present invention, by forming a working mold on a roll-to-roll film and repeatedly using it, the reuse rate of the mold can be increased.

[0026] Also, according to an embodiment of the present invention, by using a roll-to-plate process in an atmospheric state, a vacuum environment is not required, the configuration of the apparatus can be simplified, and the size of the apparatus can be reduced.

[0027] Also, according to an embodiment of the present invention, by preventing deformation of the working mold in a mold forming step and a pattern forming step, the mold forming step and the pattern forming step can be performed in a series of steps.

[0028] Also, according to an embodiment of the present invention, by implementing an integrated apparatus capable of performing a mold forming step and a pattern forming step in a series of steps, the accuracy of the transfer process can be improved.

[0029] Also, according to an embodiment of the present invention, by aligning a coating material using a camera, the process accuracy can be improved and the defect rate can be reduced.

Brief Description of the Drawings

[0030] [Figure 1] It is a diagram schematically showing an imprint apparatus according to an embodiment of the present invention. [Figure 2]This figure schematically shows the preparation state for the mold formation process of an imprint apparatus according to an embodiment of the present invention. [Figure 3] This is a magnified view of portion A in Figure 2. [Figure 4] This figure schematically shows the transfer step of the mold formation process of an imprint apparatus according to an embodiment of the present invention. [Figure 5] This is a magnified view of section B in Figure 4. [Figure 6] This figure schematically shows the demolding step of the mold formation process of an imprint apparatus according to an embodiment of the present invention. [Figure 7] This is a magnified view of section C in Figure 6. [Figure 8] This figure schematically shows the preparation state for the pattern formation process of an imprint apparatus according to an embodiment of the present invention. [Figure 9] This is a magnified view of section D in Figure 8. [Figure 10] This figure schematically shows the transfer step of the pattern formation process of an imprint apparatus according to an embodiment of the present invention. [Figure 11] This is a magnified view of section E in Figure 10. [Figure 12] This is a schematic cross-sectional view showing the stage where the lower camera is installed. [Figure 13] This figure schematically shows the demolding step of the pattern formation process of an imprint apparatus according to an embodiment of the present invention. [Figure 14] This is an enlarged view of section F in Figure 13. [Figure 15] This figure schematically shows the film recovery step of the pattern formation process of an imprint apparatus according to an embodiment of the present invention. [Figure 16] This is a flowchart of a film tension control method according to an embodiment of the present invention. [Figure 17] This is a flowchart of an imprint method for pattern formation according to an embodiment of the present invention. [Modes for carrying out the invention]

[0031] Hereinafter, embodiments disclosed herein will be described in detail with reference to the attached drawings, where identical or similar components are denoted by the same reference numerals, and redundant descriptions thereof will be omitted. In the following description of embodiments according to the present invention, when each layer (film), region, pattern, or structure is described as being formed "on" or "under" the substrate, each layer (film), region, pad, or pattern, this includes being formed "directly" on or "indirectly" on or under the substrate.

[0032] Furthermore, the reference points for the top / top, bottom / bottom, left / left side, right / right side, vertical (up and down), and horizontal (left and right) of each layer will be explained based on the drawings. In the drawings, the thickness and size of each layer are exaggerated, omitted, or shown schematically for the sake of clarity and ease of explanation. Also, the size of each component does not reflect the actual size as a whole.

[0033] In this description, expressions such as “includes,” “composes,” or “constitutes” are intended to refer to a particular characteristic, number, stage, action, element, part thereof, or combination thereof, and should not be construed to exclude the existence or possibility of one or more other characteristics, numbers, stages, actions, elements, part thereof, or combination thereof that are not described.

[0034] Furthermore, terms such as "first," "second," etc., are used to describe various components, but these terms are not used to limit the various components; rather, they are used to distinguish one component from others.

[0035] Furthermore, the term "approximately" represents the normal error range for each value that is well known to the average engineer in the field of this technology. Alternatively, the term "approximately" may represent within ±0.5% or up to 1% of the indicated value. The term "approximately" may also represent measurement error due to limitations of the measurement method.

[0036] Furthermore, when describing the embodiments disclosed herein, if it is determined that a specific description of the relevant prior art would obscure the gist of the embodiments disclosed herein, such detailed description will be omitted.

[0037] The accompanying drawings are for the sole purpose of facilitating the understanding of the embodiments disclosed herein and should not be understood to limit the technical ideas disclosed herein, but rather to include any modifications, equivalents, or substitutions that fall within the concept and scope of the present invention.

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Figure 1 is a schematic diagram showing an imprint apparatus according to an embodiment of the present invention.

[0039] Referring to Figure 1, the imprint apparatus 100 according to an embodiment of the present invention includes a control unit 101, a film supply unit 102, a transfer unit 104, and a film recovery unit 106.

[0040] The imprint process is a process of forming fine patterns ranging in size from nanometers to micrometers on the surface of a substrate using a mold. The imprint process can be performed by forming a pattern on the substrate surface using a master mold. Alternatively, a replica mold can be manufactured from the master mold, and a pattern can be formed on the substrate surface using the replica mold. Alternatively, a working mold can be manufactured from the replica mold, and a pattern can be formed on the substrate surface using the working mold. In the embodiments of this invention, the term "mold" may include master molds, replica molds, and working molds. Furthermore, master molds, replica molds, and working molds may be used interchangeably.

[0041] To perform a continuous imprinting process, the imprinting apparatus 100 according to an embodiment of the present invention may be an apparatus in which a working mold is formed on a roll-to-roll film. The roll-to-roll film is a flexible film having a predetermined width and length wound on a rotating roll, with one end of the film in the longitudinal direction wound on a rewinder and the other end of the film in the longitudinal direction wound on an unwinder. The roll-to-roll film may be a continuous film that moves from the unwinder to the rewinder.

[0042] The imprint apparatus 100 according to an embodiment of the present invention may be an imprint apparatus (mold forming apparatus) that forms a working mold on a film using a master mold (mold forming process), or an imprint apparatus (pattern forming apparatus) that transfers a pattern to a substrate using the working mold formed on the film (pattern forming process). Alternatively, it may be an imprint apparatus that implements both the mold forming process and the pattern forming process in a single apparatus. When the imprint apparatus implements both the mold forming process and the pattern forming process in a single apparatus, separate components for mold mounting and ejection are not required. Furthermore, since a robot for handling the mold is not required, automation can be performed more easily.

[0043] The film according to the embodiment of the present invention may be a polymer film such as PC (poly carbonate), PET (polyethylene terephthalate), PEN (polyethylene naphthalene), or PI (polyimide). The film may also be made of a transparent material that transmits light (e.g., visible light and / or ultraviolet light).

[0044] The control unit 101 controls the driving of each component of the imprint device 100, such as the film supply unit 102, the transfer unit 104, and the film recovery unit 106.

[0045] The film supply unit 102 is located at one end of the film and is responsible for unwinding the film. The film supply unit 102 supplies the film for the process of forming a working mold on the film (mold forming process) or the process of transferring a pattern to a substrate using the working mold formed on the film (pattern forming process). The film wound onto the film supply unit 102 is a film on which no working mold has been formed. The film supply unit 102 supplies the film toward the transfer unit 104. The film supply unit 102 may further include a protective film winding unit (not shown). The protective film winding unit removes the protective film adhering to the film and winds it (rewinds).

[0046] The film recovery unit 106 is located at the other end of the film and is responsible for winding up and recovering the film. After performing multiple pattern formation processes using the work mold, the work mold reaches its service life limit. The film wound up to the film recovery unit 106 is the film to which the work mold that has reached the end of its service life is attached. The film recovery unit 106 recovers the film from the transfer unit 104. In this embodiment of the present invention, the film is supplied in a clockwise direction (referenced to Figure 1) in the order of film supply unit 102, transfer unit 104, and film recovery unit 106, but the positions of the film supply unit 102 and the film recovery unit 106 may be reversed and the film may be supplied in a counterclockwise direction.

[0047] The transfer unit 104 consists of an apparatus table 105, a stage 108, an imprint roll 110, a resin curing unit 112, an upper camera 114, a lower camera (115 in Figure 12), a load cell 116, and a plurality of rolls 118, 119, 120, 122-1 to 122-5, 124 for driving the film.

[0048] The apparatus table 105 supports the various components that make up the transfer section 104, such as the stage 108 and the imprint roll 110, which will be described later.

[0049] A master mold (in the case of a mold forming apparatus) or a substrate (in the case of a pattern forming apparatus) is placed on the stage 108. The master mold and substrate are materials to be coated with resin. The stage 108 may be an XYθ stage or a UVW stage for aligning the position of the master mold or substrate. The XYθ stage 108 can form movement motion by a plurality of independently operating modules. That is, the stage can move in the x-axis, y-axis, and θ-axis directions by individual modules that move in the x-axis, y-axis, and θ-axis directions, respectively. The UVW stage 108 can form movement motion by a plurality of modules that operate in a manner that influences each other. That is, the stage can move in the x-axis, y-axis, and θ-axis directions by combinations of modules that move along the u-axis, v-axis, and w-axis.

[0050] The imprint roll (third roll) 110 pressurizes the film for the transfer process. The imprint roll 110 moves horizontally while pressing the film through rolling contact. The imprint roll 110 may be positioned between the resin curing section 112 and the upper camera 114.

[0051] The resin curing section 112 may be configured as a light irradiation section for curing a photocurable resin. The photocurable resin may be, for example, an ultraviolet curing resin. In this case, the light irradiation section may be an ultraviolet lamp. If the film is a thermosetting resin, the resin curing section 112 may be configured as a heat generating section. In the embodiments of the present invention, the resin curing section 112 is described as a light irradiation section, but the present invention is not limited to a light irradiation section. The resin curing section 112 and the upper camera 114 may be arranged horizontally separated from each other.

[0052] The upper camera 114 and the lower camera (115 in Figure 12) recognize alignment marks and alignment keys in order to align the master mold or substrate. The upper camera 114 is located above the stage 108, and the lower camera 115 may be located inside or below the stage 108.

[0053] The load cell 116 is an electromechanical sensor used to measure force or weight. The load cell 116 can measure the tension of a film.

[0054] Rolls 118, 119, 120, 122, and 124 include a film angle adjustment roll (first roll) 118, a demold nip roll (first nip roll) 119, a dancer roll (second roll) 120, multiple guide rolls 122-1, 122-2, 122-3, 122-4, 122-5, and a film recovery nip roll (second nip roll) 124.

[0055] The film angle adjustment roll 118 adjusts the angle between the film and the top surface of the stage, keeping the film horizontal to the top surface of the stage during the transfer process. The film angle adjustment roll 118 is movable up and down.

[0056] The nip rolls 119 and 124 are devices that transport a resin film while pressing it between a pair of rolls. The demolded nip roll 119 controls the tension applied to the film by adjusting the rotation speed of the rolls. A more detailed explanation is as follows:

[0057] When the film angle adjustment roll 118 moves up and down, the demolded nip roll 119 is held in an open state (without pressurizing or fixing the film). At this time, the film between the film angle adjustment roll 118 and the dancer roll 120 is not fixed by the demolded nip roll 119, so the position of the dancer roll 120 changes in conjunction with the movement of the film angle adjustment roll 118.

[0058] To maintain the tension of the film measured by the load cell 116, the demolding nip roll 119 can be rotated to control the tension of the film. In the demolding process described later, the demolding nip roll 119 can pull the film taut so that it forms an angle α with the top surface of the stage. At this time, the drive of the demolding nip roll 119 can be controlled so that the tension measured by the load cell 116 is maintained. When the film is wound up and recovered in the film recovery unit 106, the film recovery nip roll 124 moves the film.

[0059] The dancer roll 120 is configured to apply a constant force of a constant magnitude in a constant direction by means of a spring, air pressure, or weight, so that a constant tension is applied to the film regardless of positional changes. The dancer roll 120 can absorb tension fluctuations applied to the film. The dancer roll 120 can control the tension while moving up and down. In this case, the weight of the dancer roll 120 may be the tension applied to the film.

[0060] Guide rolls 122-1, 122-2, 122-3, 122-4, and 122-5 guide or alter the path of the film. Guide rolls 122-1, 122-2, 122-3, 122-4, and 122-5 are positioned along the path through which the film is supplied and retrieved, and support the film while rotating without power at their respective positions. To guide the movement of the film, guide rolls 122-1, 122-2, 122-3, 122-4, and 122-5 may be positioned between the film supply unit 102 and the transfer unit 104, and between the transfer unit 104 and the film retrieval unit 106.

[0061] The film clamp 111 is positioned between the imprint roll 110 and the film supply unit 102 and can move up and down.

[0062] The imprint device 100 may have the following components arranged in a clockwise direction (reference to Figure 1): film supply unit 102, film clamp 111, stage 108, film angle adjustment roll 118, load cell 116, demolding nip roll 119, dancer roll 120, film recovery nip roll 124, and film recovery unit 106. Multiple guide rolls 122-1, 122-2, 122-3, 122-4, and 122-5 may be arranged between each component. That is, the stage 108, film angle adjustment roll 118, load cell 116, demolding nip roll 119, dancer roll 120, and film recovery nip roll 124 may be arranged in order along the path through which the film passes.

[0063] Therefore, the film supplied from the film supply unit 102 passes over the stage 108, under the film angle adjustment roll 118, and is positioned above the load cell 116. The film then passes between the demolding nip rolls 119 and through the first guide roll 122-1 before being wound onto the dancer roll 120. After passing through the dancer roll 120, the film passes through several guide rolls 122-2, 122-3, 122-4 and the film recovery nip roll 124 before being wound onto the film recovery unit 106.

[0064] An imprint roll 110, a resin curing unit 112, and an upper camera 114 are arranged on the stage 108. A film clamp 111 may be positioned adjacent to the stage 108 between the imprint roll 110 and the film supply unit 102. A guide roll 122-5 may be positioned between the film clamp 111 and the film supply unit 102. The film clamp 111 plays the role of fixing the film 126 so that it does not move during the mold forming process or the pattern forming process. The film clamp 111 can also be moved up and down while the film 126 is fixed, and can be adjusted together with the film angle adjustment roll 118 so that the film 126 is positioned parallel to the film 126.

[0065] The imprint apparatus 100 according to an embodiment of the present invention is a roll-to-plate type apparatus. While the conventional plate-to-plate method is used in a vacuum state, the imprint apparatus 100 according to an embodiment of the present invention may be used in an atmospheric state. In the conventional plate-to-plate method, the mold surface and the substrate surface are in contact and pressurized simultaneously. In this case, air bubbles may be generated between the mold surface and the substrate surface, so the process must be carried out in a vacuum state. However, in the roll-to-plate method according to an embodiment of the present invention, the mold attached to the film comes into contact with the substrate surface sequentially. In this case, "sequentially" may mean that the contact occurs along the path in which the imprint roll 110 moves while pressurizing the film. Therefore, the imprint apparatus 100 according to an embodiment of the present invention can prevent the generation of air bubbles between the mold surface and the substrate surface even in an atmospheric state.

[0066] The film supply unit 102, the transfer unit 104, and the film recovery unit 106 can be integrated into a single imprint device 100. Alternatively, the film supply unit 102 and the film recovery unit 106 may be configured as separate devices from the transfer unit 104, and these separate devices may be assembled with the transfer unit 104.

[0067] The imprint apparatus 100 may include a drive unit (not shown) for driving a film supply unit 102, a transfer unit 104, and a film recovery unit 106. The drive unit may be an actuator, for example, a stepper motor or a servo motor. The imprint apparatus 100 may further include a storage unit for housing a master mold or substrate, and a spin coating unit for coating the surface of the master mold or substrate with resin to a predetermined thickness.

[0068] [Mold formation process] Figure 2 is a schematic diagram showing the preparation state for the mold formation process of an imprint apparatus according to an embodiment of the present invention, and Figure 3 is an enlarged view of portion A in Figure 2.

[0069] The film 126 is supplied from the film supply unit 102 to the upper side of the stage 108. The transfer unit 104 can form a duplicate mold or a working mold W on the lower side of the film 126. This will be explained in detail next.

[0070] Referring to Figures 2 and 3, a film 126 is supplied to the imprint apparatus 100, and the process for manufacturing a work mold is prepared. First, the master mold M is loaded onto the stage 108. An embossed or intaglio pattern is formed on the upper surface of the master mold M. A resin R is applied to the pattern on the master mold M. The resin R may be applied by a spin coating method before the master mold M is loaded onto the stage 108.

[0071] Resin R may be a photocurable resin that hardens in response to ultraviolet light. For example, it may be a resin mixed with oligomers, monomers, and photopolymerization initiators. Alternatively, it may be an acrylic curing resin, or a resin containing silicone. Resin R may be a transparent material that transmits light or an opaque material that does not transmit light.

[0072] The master mold M is positioned on the upper surface 109 of the stage between the stage 108 and the film 126. The master mold M may be positioned on a tray 131 located in the center of the stage 108. The tray 131 may have a plurality of vacuum suction holes. The vacuum suction holes can be connected to a vacuum pump, and the master mold M can be vacuum-suctioned and fixed in place. Alternatively, the master mold M may be fixed by electrostatic force.

[0073] The resin top surface 133 may be at the same height as the stage top surface 109, or the master mold M may be positioned such that the resin top surface 133 is slightly higher than the stage top surface 109 by a predetermined distance. The tray 131 may be raised and lowered by the cylinder 128 to adjust the height of the master mold M. The stage 108 may also be driven to adjust the distance between the imprint roll 110 and the master mold M. In this case, the stage 108 may be driven by a drive unit such as a servo motor or a stepper motor. The heights of the resin top surface 133 and the stage top surface 109 may be adjusted so that the imprint roll 110 can press down on the film 126 during the transfer stage and transfer the pattern of the master mold M to the resin R.

[0074] The imprint roll 110 is positioned at a preparation position (110a in Figure 5), which is one end of the stage 108 (the right side of the stage in Figures 2 and 3). The imprint roll 110 is positioned above the film 126 so that the film 126 can be pressed towards the upper surface 109 of the stage.

[0075] The load cell 116 may be positioned higher than the stage surface 109 and the imprint roll 110 (relative to the stage surface). The imprint roll 110 and the load cell 116 tilt the film 126 at a predetermined angle α relative to the stage surface 109. α may be, for example, 10° to 20°. At this time, the tension of the film 126 applies a force to the load cell 116. This allows the load cell 116 to measure the tension of the film 126. In embodiments of the present invention, the tension of the film 126 may be controlled by the dancer roll 120 to maintain a constant value T1. At this time, the tension T1 may vary within an error range known to the articulates of the people. The tension T1 of the film 126 may be set to a predetermined value in the range of 1 kgf to 10 kgf. In this configuration, load cells 116 are positioned one on each side of the film 126 in the width direction (perpendicular to the longitudinal direction of the film), allowing the tension of the film 126 to be measured.

[0076] If the tension of the film 126 is less than 1 kgf, a film sagging phenomenon may occur due to the load on the film 126. In this case, the positions of the film 126 and the material to be coated (master mold M or substrate S described later) may not be aligned, or the film and the material to be coated may gradually lose contact.

[0077] If the tension of the film 126 exceeds 10 kgf, deformation may occur in the film 126. If deformation occurs in the film 126, the positions of the film 126 and the material to be coated may not align. In addition, the pressure applied by the drive unit that pressurizes the imprint roll 110 may be weakened, resulting in poor contact between the film 126 and the material to be coated.

[0078] To withstand the tension described above and ensure transparency for photocuring, the thickness of film 126 may be between 100 μm and 500 μm.

[0079] The film angle adjustment roll 118 is positioned between the imprint roll 110 and the load cell 116. Specifically, the film angle adjustment roll 118 is positioned between the arrival position of the imprint roll (110b in Figure 5) and the load cell 116. The arrival position of the imprint roll will be described later. The film angle adjustment roll 118 may be positioned above the film 126. For example, the film angle adjustment roll 118 may be positioned above the film 126, spaced apart so as not to come into contact with the film 126.

[0080] Figure 4 is a schematic diagram showing the transfer step of the mold formation process of an imprint apparatus according to an embodiment of the present invention, and Figure 5 is an enlarged view of portion B in Figure 4.

[0081] The imprint apparatus 100 according to an embodiment of the present invention can manufacture a working mold W by pressing a master mold M and a film 126 against each other, and can attach the manufactured working mold W to the film 126.

[0082] When the master mold M is loaded onto the stage 108, the film angle adjustment roll 118 descends. As the film angle adjustment roll 118 descends and pushes the film 126 downwards, the angle α between the film 126 and the stage top surface 109 decreases. The film angle adjustment roll 118 descends until the film 126 is parallel to the stage top surface 109. At this time, the film clamp 111 can move up and down to adjust the height of one side of the film 126.

[0083] The film 126 and the stage surface 109 may be parallel and separated by a predetermined distance. For example, the film 126 and the stage surface 109 may be separated by a distance of approximately 100 μm to 500 μm. Depending on the load on the film 126 alone and the tension conditions applied to the film 126, the film 126 may sag. In this case, if the distance between the film 126 and the stage surface 109 is less than 100 μm, the film 126 may come into contact with the material to be coated with resin beforehand. Also, if the distance exceeds 500 μm, the alignment error may increase during the alignment process described later.

[0084] As the film angle adjustment roll 118 descends, the dancer roll 120 rises while maintaining a constant tension T1 in the film 126. The dancer roll 120 rises so that the tension T1 of the film 126, as measured by the load cell 116, remains constant. Because the tension T1 of the film 126 is controlled to remain constant, the film 126 does not deform when the imprint device 100 is driven.

[0085] In this embodiment of the present invention, the tension can be controlled while the film angle adjustment roll 118 and the dancer roll 120 move up and down. When the film angle adjustment roll 118 moves up and down, the position and length of the film 126 change. This causes a change in the tension applied to the film 126. At this time, the tension can be controlled using a method in which the potential energy of the dancer roll 118 increases or decreases by the amount by which the tension of the film 126 increases or decreases. This makes it possible to maintain a constant tension applied to the film 126 itself. However, the present invention is not limited to the film angle adjustment roll 118 and the dancer roll 120 moving up and down. The film angle adjustment roll 118 and the dancer roll 120 can also move in the same direction.

[0086] Once the film 126 and the stage top surface 109 are aligned parallel to each other, the master mold is positioned accordingly. The alignment of the master mold will be described later.

[0087] The imprint roll 110 moves from the preparation position 110a to the arrival position 110b (in the direction of the arrow in Figure 5) while applying pressure to the film by rolling contact. As the imprint roll 110 moves horizontally above the film 126 and applies pressure to the film 126, the resin R located below the film 126 can be pressed onto the film 126. The pattern of the master mold M is transferred to the resin R by the pressure applied by the imprint roll 110.

[0088] The pressure applied by the imprint roll 110 to the film 126 may be between 10 kgf and 200 kgf. If the pressure is less than 10 kgf, contact between the film 126 and the resin R applied to the master mold M may be insufficient. In this case, contact between the resin R and the patterned uneven areas of the master mold M, or the entire surface or a portion of the master mold M, may be poor, which may result in uneven pattern transfer. If the pressure exceeds 200 kgf, deformation of the film 126 or damage to the master mold M may occur due to the pressure.

[0089] The movement speed of the imprint roll 110 may be between 1 mm / sec and 100 mm / sec. If the movement speed is less than 1 mm / sec, the time required for the process may increase, reducing process efficiency. If the movement speed exceeds 100 mm / sec, the film 126 and the master mold M may not make sufficient contact, potentially reducing the quality of the transferred pattern. Furthermore, the high-speed movement may continuously apply mechanical and physical shocks to the transfer section 104, making it difficult to maintain stable performance of the imprint device 100.

[0090] After the imprint roll 110 moves from the preparation position 110a to the arrival position 110b, the light irradiation unit 112 irradiates the pressurized resin R with light to cure the resin R while the imprint roll 110 is moving from the preparation position 110a to the arrival position 110b or while the imprint roll 110 is returning from the arrival position 110b to the preparation position 110a. The light may be, for example, ultraviolet light.

[0091] Preferably, the light irradiation unit 112 can cure the resin R while moving together with the imprint roll 110. For example, the light irradiation unit 112 may be positioned so that ultraviolet light is directly irradiated onto the resin R as it passes under pressure by the imprint roll 110. For example, the light irradiation unit 112 may be positioned to have a certain gradient (for example, a gradient of 10° to 80°) with respect to the film 126. Alternatively, the light irradiation unit 112 may be equipped with a reflector or prism to irradiate light perpendicularly to the film 126.

[0092] Ultraviolet light emitted from the light irradiation unit 112 penetrates the film 126 and hardens the resin R. At this time, the resin R, which is pressed by the imprint roll 110 and adheres to the film 126, hardens due to the ultraviolet light. The hardened resin R adheres to the underside of the film 126. Once the hardening of the resin R is complete, the imprint roll 110 returns from the arrival position 110b to the preparation position 110a.

[0093] The master mold M, loaded into stage 108, has a position confirmation mark or alignment mark formed on it. The alignment mark may be formed on the upper or lower surface of the master mold M.

[0094] As the initial step of the process, after the master mold M is placed on the stage 108, the vertical or horizontal position of the upper camera (114 in Figure 1) or lower camera (115 in Figure 12) is adjusted so that its field of view points towards the position where the alignment marks are formed. In the mold forming process, the XYθ or UVW stage 108 does not move, and an imprint process is performed in which the mold pattern is transferred onto a blank film. Subsequently, in the repeated mold forming process, the position of the master mold M placed on the stage 108 may be aligned by the upper camera 114. The upper camera 114 may be configured to adjust one or more of its horizontal position, vertical position, and angle so that its field of view points towards the position where the alignment marks are formed. When the upper camera 114 recognizes the alignment marks, the XYθ stage or UVW stage 108 moves to align the master mold M to a predetermined position.

[0095] Figure 6 is a schematic diagram showing the demolding stage of the mold formation process of an imprint apparatus according to an embodiment of the present invention, and Figure 7 is an enlarged view of portion C in Figure 6.

[0096] Once the resin R has cured, it is separated (demolded) from the master mold M. The separated resin R adheres to the underside of the film 126 and is used as the working mold W. A more detailed explanation is as follows:

[0097] The film 126 is positioned between a pair of rolls that make up the demolded nip roll 119. Once the resin R has cured, the pair of rolls that make up the demolded nip roll 119 move in a direction that presses the film 126. The film 126, positioned between the demolded nip rolls 119, is fixed in place by the demolded nip rolls 119. After the film 126 is fixed in place by the demolded nip rolls 119, the imprint roll 110 can also be returned from the arrival position 110b to the preparation position 110a.

[0098] Furthermore, the film angle adjustment roll 118 rises upward and returns to its original position. When the film angle adjustment roll 118 rises upward, the tension in the film 126 generated by the rotation of the demolding nip roll 119 causes one side of the film 126 (the arrival position of the imprint roll) to rise in the direction away from the stage 108 (above the stage). As a result, the film 126 and the upper surface 109 of the stage tilt again by a predetermined angle (for example, α).

[0099] Therefore, when the film angle adjustment roll 118 returns to its original position, the tension of the film 126 separates (demolds) the working mold W from the master mold M. At this time, the demolding nip roll 119 rotates in accordance with the upward speed of the film angle adjustment roll 118. Specifically, the rotation speed of the demolding roll 119 can be changed to control the speed at which demolding occurs during the demolding process. For example, if separation of the film 126 from the master mold M is required at a high speed, the demolding nip roll 119 can be driven to rotate at a high speed. However, since the film angle adjustment roll 118 is driven precisely to adjust the angle α, it would not be desirable to drive the film angle adjustment roll 118 at a high speed for the purpose of demolding at a high speed.

[0100] The demolding nip roll 119 rotates, moving the film 126 in the direction of the dancer roll 120. At this time, the descent of the dancer roll 20 maintains a constant tension in the film 126. Therefore, since the tension in the film 126 is maintained at a constant level during the demolding stage, the film 126 does not deform. Alternatively, the demolding stage can be performed without driving the demolding nip roll 119, using only the tension control of the dancer roll 120 and the upward movement of the film angle adjustment roll 118. Alternatively, the demolding stage can be performed with the film angle adjustment roll 118 in the raised position and the imprint roll 110 returning to the preparation position 110a. In this case, demolding may be performed by the dancer roll 120 controlling the tension of the film 126. In this case, the demolding nip roll 119 can also be driven to ensure the angle between the film 126 and the stage top surface 109 for demolding. The demolding method described above can be selectively used depending on the release force between the film 126 to be demolded and the master mold M, and the required separation conditions.

[0101] As shown in Figure 7, the separated working mold W is attached to the lower surface of the film 126. In this embodiment of the present invention, since the working mold W is formed on the film 126, the working mold W can be separated more easily. The resin R may be a material that adheres well to the film 126 and separates well from the master mold M. Once the working mold W is separated from the master mold M, the demolding nip roll 119 releases the film 126 from its fixation. The master mold M is then unloaded from the stage 108. The stage 108 then returns to its original position (origin). The unloaded master mold M may be transferred to a storage section for storage.

[0102] Once the working mold W is manufactured and attached to the film 126, a pattern formation process can be carried out using the working mold W, as described below.

[0103] [Pattern formation process] Figure 8 is a schematic diagram showing the preparation state for the pattern formation process of an imprint apparatus according to an embodiment of the present invention, and Figure 9 is an enlarged view of portion D in Figure 8.

[0104] A working mold W is attached to the underside of the film 126. An embossed or intaglio pattern is formed on the underside of the working mold W. The substrate S is loaded onto the stage 108 from which the master mold M has been unloaded. A resin R' is applied to the substrate S. Before the substrate S is loaded onto the stage 108, the resin R' may be applied by a spin coating method.

[0105] Resin R' may be a photocurable resin that hardens in response to ultraviolet light. For example, it may be a resin mixed with oligomers, monomers, and photopolymerization initiators. Resin R' may be made of the same material as resin R or a different material. Resin R' may be a transparent material that transmits light or an opaque material that does not transmit light.

[0106] The substrate S is placed on the upper surface 109 of the stage between the stage 108 and the film 126. The substrate S may be placed on a tray 131 provided in the center of the stage 108. The tray 131 may have a plurality of vacuum suction holes. The vacuum suction holes can be connected to a vacuum pump, and the substrate S can be fixed by vacuum suction. Alternatively, the substrate S may be fixed by electrostatic force.

[0107] The resin top surface 133 may be at the same height as the stage top surface 109, or the substrate S may be positioned such that the resin top surface 133 is slightly higher than the stage top surface 109 by a predetermined distance. The tray 131 may be raised and lowered by the cylinder 128 to adjust the height of the substrate S. The stage 108 may also be driven to adjust the distance between the imprint roll 110 and the substrate S. In this case, the stage 108 may be driven by a drive unit such as a servo motor or a stepper motor. The heights of the resin top surface 133 and the stage top surface 109 may be adjusted so that in the transfer stage the imprint roll 110 presses the film 126 and transfers the pattern of the work mold W onto the resin R'.

[0108] The imprint roll 110 is positioned at a preparation position (110a in Figure 11), which is one end of the stage 108 (the right side of the stage in Figures 8 and 9). The imprint roll 110 is positioned above the film 126 so that the film 126 can be pressed towards the upper surface 109 of the stage.

[0109] The load cell 116 may be positioned higher (relative to the stage surface) than the stage top surface 109 and the imprint roll 110. The imprint roll 110 and the load cell 116 cause the film 126 to tilt at a predetermined angle α relative to the stage top surface 109. α may be, for example, 10° to 20°. At this time, the tension of the film 126 allows the film 126 to exert force on the load cell 116. This allows the load cell 116 to measure the tension of the film 126. In embodiments of the present invention, the tension of the film 126 may be controlled to be maintained at a constant predetermined value T2. The tension T2 of the film 126 may be the same as or substantially the same as T1. The fact that T2 and T1 are substantially the same means that even if force is applied to the film 126 during the pattern formation process, causing the film 126 to deform and the working mold W to deform, the difference between T2 and T1 is small enough that the deformation of the working mold W remains within the design error or manufacturing error range of the pattern (the pattern formed on the working mold or the pattern transferred to the resin of the substrate). In other words, the pattern transferred to the substrate S by the working mold W deformed by tension T2 is within the design error or manufacturing error range of the pattern transferred by the undeformed working mold W.

[0110] The film angle adjustment roll 118 is positioned between the imprint roll 110 and the load cell 116. Specifically, the film angle adjustment roll 118 is positioned between the arrival position of the imprint roll (110b in Figure 11) and the load cell 116. The arrival position of the imprint roll will be described later. The film angle adjustment roll 118 may be positioned above the film 126. For example, the film angle adjustment roll 118 may be positioned above the film 126, spaced apart so as not to come into contact with the film 126.

[0111] The substrate S may be made of a transparent material that transmits light or an opaque material that does not transmit light. For example, the substrate may be a silicone wafer, a metal vapor-deposited wafer, etc. In addition, a resin S onto which the pattern is transferred is applied to the upper surface of the substrate S.

[0112] Figure 10 is a schematic diagram showing the transfer step of the pattern formation process of an imprint apparatus according to an embodiment of the present invention, and Figure 11 is an enlarged view of portion E in Figure 10.

[0113] The imprint apparatus 100 according to an embodiment of the present invention can transfer the pattern of the working mold W to the resin R' applied on the substrate by pressing the working mold W and the substrate S together.

[0114] When the substrate S is loaded onto the stage 108, the film angle adjustment roll 118 descends. As the film angle adjustment roll 118 descends and pushes the film 126 downwards, the angle α between the film 126 and the stage top surface 109 decreases. The film angle adjustment roll 118 descends until the film 126 is parallel to the stage top surface 109. The film 126 and the stage top surface 109 may be separated by a predetermined distance while remaining parallel. For example, the film 126 and the stage top surface 109 may be separated by a distance of approximately 100 μm to 500 μm. Depending on the load on the film 126 alone and the tension conditions applied to the film 126, the film 126 may sag. In this case, if the distance between the film 126 and the stage top surface 109 is less than 100 μm, the film 126 may come into contact with the substrate S to be coated with resin beforehand. Also, if the distance exceeds 500 μm, the alignment error may increase during the alignment process described later. At this time, the film clamp 111 can move up and down to adjust the height of one side of the film 126.

[0115] As the film angle adjustment roll 118 descends, the dancer roll 120 rises while being controlled to maintain a constant tension T2 in the film 126. The dancer roll 120 rises so that the tension T2 of the film 126, as measured by the load cell 116, remains constant. Since the tension T2 of the film 126 is maintained constant, the film 126 does not deform when the imprint device 100 is driven.

[0116] In this embodiment of the present invention, the tension can be controlled while the film angle adjustment roll 118 and the dancer roll 120 move up and down. When the film angle adjustment roll 118 moves up and down, the position and length of the film 126 change. This causes a change in the tension applied to the film 126. At this time, the tension can be controlled using a method in which the potential energy of the dancer roll 118 increases or decreases by the amount by which the tension of the film 126 increases or decreases. This makes it possible to maintain a constant tension applied to the film 126 itself. However, the present invention is not limited to the film angle adjustment roll 118 and the dancer roll 120 moving up and down. The film angle adjustment roll 118 and the dancer roll 120 can also move in the same direction.

[0117] Once the film 126 and the upper surface 109 of the stage are aligned parallel to each other, the working mold W and the substrate S are aligned. The alignment of the working mold W and the substrate S will be described later.

[0118] The imprint roll 110 moves from the preparation position 110a to the arrival position 110b (in the direction of the arrow in Figure 11) while applying pressure to the film by rolling contact. The imprint roll 110 applies pressure to the film 126 as it moves horizontally from above the film 126, thereby applying pressure to the resin R'. The pattern of the work mold W is transferred to the resin R' by the pressure applied by the imprint roll 110.

[0119] The pressure applied by the imprint roll 110 to the film 126 may be between 10 kgf and 200 kgf. If the pressure is less than 10 kgf, contact between the work mold W and the resin R' applied to the substrate S may be insufficient. In this case, contact between the resin R' and the patterned uneven areas of the work mold W, or the entire surface or a portion of the work mold W, may be poor, which may result in uneven pattern transfer. If the pressure exceeds 200 kgf, deformation of the film 126 or damage to the work mold W may occur due to the pressure.

[0120] The movement speed of the imprint roll 110 may be between 1 mm / sec and 100 mm / sec. If the movement speed is less than 1 mm / sec, the process time may increase, reducing process efficiency. If the movement speed exceeds 100 mm / sec, the working mold W and the resin R' may not be able to make sufficient contact, potentially reducing the quality of the transferred pattern. In addition, the high-speed movement may continuously apply mechanical and physical shocks to the transfer section 104, making it difficult to maintain stable performance of the imprint device 100.

[0121] After the imprint roll 110 moves from the preparation position 110a to the arrival position 110b, the light irradiation unit 112 irradiates the pressurized resin R' with light to cure it while the imprint roll 110 is moving from the preparation position 110a to the arrival position 110b or while the imprint roll 110 is returning from the arrival position 110b to the preparation position 110a. The light may be, for example, ultraviolet light.

[0122] Preferably, the light irradiation unit 112 can cure the resin R' while moving together with the imprint roll 110. For example, the light irradiation unit 112 may be positioned so that ultraviolet light is directly irradiated onto the resin R' as it passes through the imprint roll 110 under pressure. For example, the light irradiation unit 112 may be positioned to have a certain gradient (e.g., a gradient of 10° to 80°) with respect to the film 126. Alternatively, the light irradiation unit 112 may be equipped with a reflector or prism to irradiate light perpendicularly to the film 126.

[0123] Ultraviolet light emitted from the light irradiation unit 112 penetrates the film 126 and hardens the resin R'. Once the hardening of the resin R' is complete, the imprint roll 110 returns from the arrival position 110b to the preparation position 110a.

[0124] Figure 12 is a schematic cross-sectional view showing the stage on which the lower camera is installed. Before transferring the pattern of the work mold W to the resin R', the horizontal position is adjusted so that the work mold W and the substrate S are aligned to predetermined positions. In the embodiment of the present invention, the positions of the work mold W and the substrate S can be aligned using a camera.

[0125] To confirm the transfer position, position confirmation marks or alignment marks may be formed on the work mold W, and position confirmation keys or alignment keys may be formed on the substrate S. The alignment marks and alignment keys may be pattern marks in the form of raised or recessed areas, pattern marks in the form of metal or metal oxide, ink marks, or laser marks.

[0126] Alignment marks may be formed on one or more of the lower or upper surfaces of the work mold W. Alignment marks may be placed in areas on the lower or upper surfaces of the work mold W where no pattern is formed. Multiple alignment marks may be formed on the work mold W. That is, the alignment marks may include a first alignment mark and a second alignment mark. The second alignment mark may be located away from the first alignment mark.

[0127] Alignment keys are placed on the substrate S at positions corresponding to the alignment marks. The alignment keys may be formed on one or more of the upper or lower surfaces of the substrate.

[0128] Multiple alignment keys may be formed on the substrate S. That is, the alignment keys may include first alignment keys and second alignment keys. The first alignment key is positioned at a location corresponding to a first alignment mark, and the second alignment key is positioned at a location corresponding to a second alignment mark.

[0129] Alignment marks and alignment keys may be formed in corresponding shapes. For example, alignment marks may be formed in the shape of a cross. Alignment keys may be formed in the shape of four spaced-apart rectangles arranged so as to form a space where alignment marks can be located when viewed from the lower camera 115.

[0130] If the alignment mark overlaps with part of the alignment key, or if the alignment mark and alignment key do not overlap, it is determined that the work mold W and substrate S are not aligned in the correct position. If the alignment mark is located between the four squares of the alignment key, it is determined that the work mold W and substrate S are aligned in the correct position. In this case, the alignment mark and alignment key can overlap to form a square or rectangle.

[0131] In embodiments of the present invention, alignment marks and alignment keys can be recognized using the upper camera 114, or alignment marks and alignment keys can be recognized using the upper camera 114 and the lower camera 115.

[0132] The case in which the alignment marks on the work mold W and the alignment keys on the substrate S are recognized using the upper camera 114 is described as follows.

[0133] The upper camera 114 may be configured so that one or more of its horizontal position, vertical position, and angle are adjusted so that the camera's field of view is directed towards the positions where alignment marks and alignment keys are formed. The upper camera 114 may be configured so that its focal length can be changed to a first focal length or a second focal length. The first focal length can recognize alignment marks, and the second focal length can recognize alignment keys. For example, after the upper camera 114 has recognized alignment marks, it may be configured so that its focal length is changed from the first focal length to the second focal length in order to recognize alignment keys. The focal length may be the focal length perpendicular to the stage surface 109.

[0134] When the upper camera 114 recognizes the alignment marks and alignment keys, the XYθ stage or UVW stage 108 moves to align the positions of the work mold W and the substrate S. A more detailed explanation is as follows.

[0135] First, the upper camera 114 recognizes the alignment marks on the work mold W at a first focal length and obtains the coordinates of the alignment marks. Then, the upper camera 114 descends in the direction of the stage 108. The descended upper camera 114 recognizes the alignment keys on the substrate S at a second focal length and obtains the coordinates of the alignment keys.

[0136] To align the work mold W and the substrate S, the stage 108 is driven using the coordinates of the alignment marks and alignment keys. Then, the upper camera 114 rises away from the stage 108 and reconfirms the alignment mark coordinates of the work mold W at the first focal length. The upper camera 114 descends again and reconfirms the alignment key coordinates of the substrate S at the second focal length. Using the reconfirmed alignment mark and alignment key coordinates, the work mold W and the substrate S are realigned. The realignment process can be repeated until the positions of the work mold W and the substrate S are within the tolerance range.

[0137] Preferably, in the embodiment of the present invention, the position of the work mold W can be recognized using the upper camera 114 and the position of the substrate S can be recognized using the lower camera 115. When the positions of the work mold W and the substrate S are aligned using the upper camera 114 and the lower camera 115, the positions of the work mold W and the substrate S can be aligned while being controlled simultaneously. Next, this will be described in detail.

[0138] For example, if the working mold W is made of an opaque material, the upper camera 114 can recognize the alignment marks and the lower camera 115 can recognize the alignment keys. The upper camera 114 and the lower camera 115 may recognize the alignment marks and alignment keys simultaneously, or they may recognize one of the alignment marks or alignment keys first and the other later. By recognizing the relative positions of the first alignment mark and the first alignment key, and the relative positions of the second alignment mark and the second alignment key, the positional error between the working mold W and the substrate S can be confirmed.

[0139] The upper camera 114 and the lower camera 115 may be configured so that one or more of their horizontal position, vertical position, and angle are adjusted so that the camera's field of view is directed towards the position where the alignment marks and alignment keys are formed. The upper camera 114 and the lower camera 115 may be arranged one by one, or multiple by one. If there are two lower cameras 115, one lower camera 115 can recognize the first alignment key, and the other lower camera 115 can recognize the second alignment key.

[0140] The lower camera 115 may be located inside or below the stage 108. Referring to Figure 12, the lower camera 115 is located below the stage 108. During the substrate alignment process, the lower camera 115, the imaging guidance unit 132, and the reflector 134 can also recognize the alignment keys 21 on the substrate in a fixed position, regardless of the movement of the stage 108.

[0141] A shooting passage 130 is formed in the stage 108, penetrating it vertically. Therefore, the lower camera 115 can recognize the alignment key of the substrate S through the shooting passage 130. One side of the shooting guidance unit 132 communicates with the shooting passage 130, and the other side, opposite to the first side, is connected to the lower camera 115. The shooting guidance unit 132 may be formed in a direction perpendicular to the direction in which the shooting passage 130 is formed.

[0142] The lower camera 115 can photograph the lower surface of the substrate S through the shooting guidance unit 132 and the shooting passage 130. When the shooting guidance unit 132 is arranged horizontally as shown in the figure, the installation space for the lower camera 115 can be reduced. In addition, the degree of freedom in the position where the lower camera 115 is placed can be increased. A more detailed explanation is as follows.

[0143] The imaging guidance unit 132 may be equipped with a prism or a reflector 134. The reflector 134 is positioned between the imaging guidance unit 132 and the imaging passage 130, and can reflect light traveling along the imaging passage 130 so that it travels along the imaging guidance unit 132. The reflector 134 reflects the image of the alignment key and directs it into the lower camera 115, thereby enabling the lower camera 115 to recognize the alignment key.

[0144] As described above, the coordinates of the alignment marks and alignment keys are confirmed using the upper camera 114 and the lower camera 115, and the stage 108 is driven to align the positions of the work mold W and the substrate S. When the alignment marks and alignment keys are recognized by the upper camera 114 and / or the lower camera 115, the control unit 101 adjusts the horizontal position of the stage 108. For example, the XYθ stage or UVW stage 108 can be moved horizontally in the X and Y directions or rotated. By adjusting the position of the stage 108 on which the substrate S is placed, the work mold W and the substrate S can be aligned to their fixed positions. Furthermore, the alignment process can be repeated until the positions of the work mold W and the substrate S are within the tolerance range.

[0145] Figure 13 is a schematic diagram showing the demolding stage of the pattern formation process of an imprint apparatus according to an embodiment of the present invention, and Figure 14 is an enlarged view of portion F in Figure 13.

[0146] Once the resin R' has finished curing, it is separated (demolded) from the working mold W. The pattern transferred from the working mold W is then formed on the separated resin R'. This is explained in detail as follows:

[0147] The film 126 is positioned between a pair of rolls that make up the demolded nip roll 119. Once the resin R' has finished curing, the pair of rolls that make up the demolded nip roll 119 move in a direction that presses the film 126. The film 126, positioned between the demolded nip rolls 119, is fixed in place by the demolded nip rolls 119. After the film 126 is fixed in place by the demolded nip rolls 119, the imprint roll 110 can also be returned from the arrival position 110b to the preparation position 110a.

[0148] Furthermore, the film angle adjustment roll 118 rises upward and returns to its original position. When the film angle adjustment roll 118 rises upward, the tension in the film 126 generated by the rotation of the demolding nip roll 119 causes one side of the film 126 (the arrival position of the imprint roll) to rise in the direction away from the stage 108 (upwards the stage). As a result, the film 126 and the upper surface 109 of the stage tilt again by a predetermined angle (for example, α).

[0149] Therefore, when the film angle adjustment roll 118 returns to its original position, the tension of the film 126 separates (demolds) the working mold W from the resin R'. At this time, the demolding nip roll 119 rotates in accordance with the upward speed of the film angle adjustment roll 118. Specifically, the rotation speed of the demolding roll 119 can be changed to control the speed at which demolding occurs during the demolding process. For example, if separation of the working mold W and the resin R' is required at a high speed, the demolding nip roll 119 can be driven to rotate at a high speed. However, since the film angle adjustment roll 118 is driven precisely to adjust the angle α, it would not be desirable to drive the film angle adjustment roll 118 at a high speed for the purpose of demolding at a high speed.

[0150] The demolding nip roll 119 rotates, moving the film 126 in the direction of the dancer roll 120. At this time, the descent of the dancer roll 20 maintains a constant tension in the film 126. Therefore, since the tension in the film 126 is maintained at a constant level during the demolding stage, the film 126 is not deformed. Alternatively, the demolding stage can be performed without driving the demolding nip roll 119, using only the tension control of the dancer roll 120 and the upward movement of the film angle adjustment roll 118. Alternatively, the demolding stage can be performed with the film angle adjustment roll 118 in the raised position and the imprint roll 110 returning to the preparation position 110a. In this case, demolding may be performed by the dancer roll 120 controlling the tension of the film 126. In this case, the demolding nip roll 119 can also be driven to ensure the angle between the film 126 and the stage top surface 109 for demolding. The demolding method described above can be selectively used depending on the release force between the working mold W and the resin R' being demolded, and the required separation conditions.

[0151] As shown in Figure 14, a pattern is formed on the cured resin R'. In this embodiment of the present invention, a working mold W is formed on the film 126, and the cured resin R' adheres to the substrate S, making it easier to separate the working mold W. The resin R' may be made of a material that adheres well to the substrate S and separates well from the working mold W. Once the working mold W is separated from the resin R', the demolding nip roll 119 releases the film 126 from its fixation. The substrate S is then ejected from the stage 108, and the stage 108 returns to its original position (origin).

[0152] A new substrate S is loaded into the stage 108, which has returned to its original position. The process shown in Figures 8 to 14 above can be repeated to transfer the pattern to the new substrate S. At this time, the working mold W can be reused without being replaced.

[0153] [Mold replacement process] Figure 15 is a schematic diagram showing the film recovery step in the pattern formation process of an imprint apparatus according to an embodiment of the present invention.

[0154] When the working mold W reaches the end of its lifespan, a new working mold W is formed. To wind up the film 126 to which the expired working mold W is attached, the film retrieval unit 106 is rotationally driven under the control of the control unit 101. The film retrieval unit 106 may be rotationally driven by, for example, a servo motor. A more detailed explanation is as follows.

[0155] First, the dancer roll 120 is fixed in place so that it does not move. The dancer roll 120 may be fixed in the prepared position described above. At this time, the demold nip roll 119 may be in a state where the film 126 is released from its fixation. Also, the film angle adjustment roll 118 may be positioned above the film 126, separated from the film 126 so as not to come into contact with it.

[0156] Subsequently, the film recovery nip roll 124 is driven to move the film 126 toward the film recovery unit 106. The film recovery unit 106 is driven by a predetermined amount of rotation to wind up the film 126. At this time, the film 126 moves a predetermined distance from the film supply unit 102 toward the film recovery unit 106. The film 126 can move toward the film recovery unit 106 by the distance (1 pitch) it takes for the work mold W, which has reached the end of its lifespan, to pass through and leave the stage 108. Due to this movement of the film 126, an empty film 126, on which no work mold W is formed, is located above the stage 108.

[0157] Subsequently, the master mold M is loaded into the stage 108, and the process described in Figures 2 to 7 above is repeated to form a new working mold W on the empty film 126. Once the new working mold W is formed, the master mold M is ejected from the stage 108.

[0158] Figure 16 is a flowchart of a film tension control method according to an embodiment of the present invention. The film tension control method according to an embodiment of the present invention includes (A) a step of placing a film on which a mold can be formed on a stage (S100); (B) a step of measuring the tension T of the film (S102); (C) a step of positioning the film parallel to the upper surface of the stage (S104); and (D) a step of raising a second roll supporting the film to control the tension of the film while the film is positioned parallel to the upper surface of the stage (S106). The method may further include a step of pressing the film onto the stage to transfer a pattern to a resin applied to a material to be coated (master mold or substrate), and a step of separating the material to be coated and the film after the pattern has been transferred to the resin (S108). At this time, the tension of the film in steps S104, S106, and S108 is the same as or substantially the same as the tension T measured in step S102.

[0159] Figure 17 is a flowchart of an imprint method for pattern formation according to an embodiment of the present invention. The pattern formation step according to an embodiment of the present invention is: (A) a step of placing a film to which a first mold having a predetermined pattern is attached on the stage at a predetermined distance from the stage (S200); (B) a step of placing a first substrate coated with resin on the stage (S202); (C) a step of moving a first roll and a second roll arranged along the movement path of the film in opposite directions to position the film adjacent to and parallel to the upper surface of the stage (S204); (D) a step of pressing the film positioned parallel to the upper surface of the stage onto the resin to transfer the pattern of the first mold to the resin ( (S206); (E) a step of curing the resin on which the pattern has been transferred (S208); (F) a step of separating the first mold from the cured resin by the tension of the film, so that the first roll and the second roll move in opposite directions to each other, so that the film is separated from the stage by the tension of the film (S210); (G) a step of discharging the first substrate separated from the first mold from the stage (S212); (H) a step of placing the second substrate coated with resin on the stage from which the first substrate was discharged (S214); and (I) a step of repeating steps (C) to (F) for the second substrate (S216).

[0160] As described above, the present invention has been explained with specific details such as concrete components, and with limited embodiments and drawings. These are provided only to aid in a more general understanding of the present invention, and the present invention is not limited to the above embodiments. A person with ordinary skill in the art to which the present invention belongs can make various modifications and variations without departing from the essential characteristics of the present invention. Furthermore, the positional relationships (including up, down, left, and right) and movement directions of components such as the stage 108 and imprint roll 110 in the embodiments of the present invention can be appropriately modified within the spirit of the present invention by a person with ordinary skill in the art to which the present invention belongs. Therefore, the spirit of the present invention should not be limited to the described embodiments, and any technical ideas that are equivalent or comparable to the claims described below, as well as any variations thereof, are to be interpreted as being included within the scope of the rights of the present invention. In addition, each of the above embodiments may be used in combination with each other as necessary. [Explanation of Symbols]

[0161] 100 Imprinting Devices 102 Film supply unit 104 Transfer section 106 Film Recovery Section 108 stages 110 Imprint Rolls 111 Film Clamp 112 Resin hardening section 114 Top camera 115 Lower camera 116 load cells 118 Film Angle Adjustment Roll 119 Demolded Nip Roll 120 Dancer Roll 122-1, 122-2, 122-3, 122-4, 122-5 Guide Roll 124 Film recovery nip roll 130 Shooting passageway 131 Tray 132 Shooting guidance unit 134 Reflector

Claims

1. A film supply unit that can supply film, A film recovery unit capable of recovering the film supplied from the film supply unit, A transfer unit is positioned between the film supply unit and the film recovery unit on the film's movement path, An imprint apparatus including a control unit capable of controlling the driving of the transfer unit, The transfer section is A stage on which the master mold and circuit board can be placed, A pressing member is placed on the stage and is capable of applying pressure to the film on the stage, A resin curing unit is placed on the stage and capable of curing the resin applied to the master mold and the substrate, A first roll is positioned on the film's movement path and is capable of moving up and down so that the film is adjacent to and parallel to the upper surface of the stage. A second roll that can move in the opposite direction to the first roll to control the tension of the film in response to the movement of the first roll, An imprint apparatus including a sensor capable of measuring the tension of the aforementioned film.

2. The second roll is, The imprint apparatus according to claim 1, which can move the film so that its tension is maintained at a predetermined value (T).

3. While the first roll descends and positions the film adjacent to and parallel to the upper surface of the stage, the second roll rises to control the tension of the film. The imprint apparatus according to claim 2, wherein the second roll can lower to control the tension of the film while the first roll rises to move the film a predetermined distance away from the stage.

4. When a master mold is placed on the stage, a working mold with the pattern of the master mold transferred onto it can be formed and attached to the film. The imprint apparatus according to claim 2, wherein when a substrate is placed on the stage, the pattern of the work mold can be transferred to the resin coated on the substrate.

5. The imprint apparatus according to claim 2, wherein the second roll is a dancer roll.

6. The aforementioned sensor is The imprint apparatus according to claim 1, wherein the load cell is positioned between the first roll and the second roll on the film's movement path.

7. A first nip roll is positioned between the sensor and the second roll on the film's movement path, The imprint apparatus according to claim 1, further comprising a second nip roll positioned between the second roll and the film recovery unit on the film movement path.

8. The film can be placed on the stage so as to be inclined at a predetermined angle (α) with respect to the upper surface of the stage. As the first roll descends and the predetermined position of the film descends in the direction of the stage, the angle (α) can be reduced. The imprint apparatus according to claim 1, wherein the angle (α) can be increased by raising the first roll so that a predetermined position of the film rises from the stage.

9. The imprint apparatus according to claim 1, wherein the pressing member can pressurize the film while moving horizontally by rolling contact.

10. The transfer section is The imprint apparatus according to claim 1, further comprising a first camera positioned on one side of the stage for recognizing the position of a work mold attached to the film.

11. The transfer section is The imprint apparatus according to claim 10, further comprising a second camera positioned on the other side of the stage for recognizing the position of the substrate placed on the stage.

12. The imprint apparatus according to claim 11, wherein the second camera can recognize the position of the substrate while the first camera recognizes the position of the work mold.

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