Setting method, control method, and information processing device

Abstract

This provides a setting method that allows for efficient setting of device parameter values. [Solution] A setting method for setting a first setting value for a parameter of a first device, comprising: an acquisition step of acquiring a second setting value for the parameter from a second device different from the first device; a first setting step of setting a reference value for the parameter based on the second setting value; and a second setting step of setting the first setting value based on the reference value when the first setting value and the reference value are different, wherein the reference value is a setting value for the parameter that is set in common in the first and second devices.

Description

Technical Field

[0001] The present invention relates to a setting method, a control method, and an information processing apparatus.

Background Art

[0002] In an apparatus for manufacturing an article such as a device (semiconductor device, magnetic storage medium, liquid crystal display element, etc.), a color filter, or a hard disk, parameters for controlling the operation of the apparatus are set. These parameters need to be set to appropriate values according to the conditions of the factory where the apparatus is installed (temperature, air pressure inside and outside the factory, floor strength of the installation location, vibration of peripheral devices, etc.), the required accuracy of the article to be manufactured, productivity, and the like. Since there are a huge number of parameters for the apparatus, it takes time to set the set values of the parameters.

[0003] In Patent Document 1, a method is disclosed in which, in order to reduce the labor and errors associated with the operation of changing the set value of a parameter, the set value at a predetermined time is stored and the comparison result with the current set value is output.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] When installing a plurality of apparatuses in a factory, the work of setting set values for each apparatus takes time. Further, when a function is added to an apparatus or a unit is changed, parameters may be newly added, and it is necessary to set the set values of the newly added parameters.

[0006] <​​​

[0007] The setting method according to the present invention is a setting method for setting a first setting value of a parameter of a first device, comprising: an acquisition step of acquiring a second setting value of the parameter from a second device different from the first device; a first setting step of setting a reference value of the parameter based on the second setting value; and a second setting step of setting the first setting value based on the reference value when the first setting value and the reference value are different, wherein the reference value is a setting value of the parameter that is set in common in the first and second devices. [Effects of the Invention]

[0008] The present invention provides a setting method that allows for efficient setting of the parameters of a device. [Brief explanation of the drawing]

[0009] [Figure 1] This is a diagram illustrating a manufacturing system for goods. [Figure 2] This figure shows an exposure apparatus as an example of a pattern forming apparatus. [Figure 3] This diagram shows the hardware configuration of an information processing device. [Figure 4] This is a flowchart showing how to set the reference value and the set value. [Figure 5] This diagram illustrates a setting method for setting values ​​based on reference values. [Figure 6] This diagram shows the setting method for establishing reference values ​​and set values. [Figure 7] This diagram illustrates how to display related data when setting reference values. [Figure 8] This is a flowchart illustrating the manufacturing process of devices using an exposure system. [Figure 9] Figure 8 shows a detailed flowchart of the wafer process in step 4 of the flowchart. [Modes for carrying out the invention]

[0010] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention to the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, the same or similar components are given the same reference numeral, and redundant descriptions are omitted. Also, in order to facilitate understanding of these embodiments, the attached drawings may be drawn to a different scale than the actual dimensions.

[0011] <First Embodiment> This embodiment describes an article manufacturing system comprising multiple devices and a management device for managing these multiple devices. Figure 1 is a diagram showing the article manufacturing system. The article manufacturing system 100 of this embodiment includes a pattern forming device 101 for forming patterns on a wafer (substrate) as a device for manufacturing articles. The article manufacturing system 100 of this embodiment also includes an inspection device 102 for performing various inspections and a management device 104 for managing these devices. The article manufacturing system 100 may also include a processing device 103 as a device for manufacturing articles. The processing device 103 may include, for example, a coating device, a developing device, an etching device, a film deposition device, etc. Furthermore, in the article manufacturing system 100, the pattern forming device 101, the inspection device 102, and the processing device 103 may each consist of one or more devices.

[0012] The pattern forming apparatus 101 may include an exposure apparatus that irradiates a reticle (mask, master plate) on which a pattern has been formed with light, and projects the pattern onto a shot area on a wafer using light from the reticle. The pattern forming apparatus 101 may also include an imprint apparatus that, for example, brings an imprint material supplied onto a wafer into contact with a mold (master plate, mold), and applies curing energy to the imprint material to form a composition on which the shape of the mold has been transferred. The pattern forming apparatus 101 may also include a drawing apparatus that performs pattern formation on a substrate by drawing on the substrate with a charged particle beam (such as an electron beam or ion beam) via a charged particle optical system. The pattern forming apparatus 101 may also include manufacturing apparatus that performs processes other than those performed by the exposure apparatus, etc., in the manufacturing of items such as devices, such as a coating apparatus that coats a photosensitive medium or the like onto the surface of a substrate, and a developing apparatus that develops a substrate on which a pattern has been transferred.

[0013] Furthermore, the inspection device 102 may include, for example, an overlay inspection device, a CD inspection device, a pattern inspection device, and an electrical characteristics inspection device. Here, an overlay inspection device is a device that inspects the accuracy of the misalignment between the upper layer pattern and the lower layer pattern on a substrate in which multiple layers of patterns are formed. A CD inspection device is a device that inspects the accuracy of dimensions such as line width of patterns formed on a substrate. A pattern inspection device is a device that inspects whether there are any patterns that do not meet the accuracy standards due to foreign matter adhering to the substrate on which the pattern is formed or incomplete filling of imprint material. An electrical characteristics inspection device is a device that inspects the accuracy of the electrical characteristics of semiconductor devices, etc., manufactured from a substrate on which the pattern is formed.

[0014] Next, as an example of a pattern forming apparatus 101, an exposure apparatus that exposes a wafer with light from a reticle on which a pattern has been formed will be described. Figure 2 is a diagram showing an exposure apparatus as an example of a pattern forming apparatus. The exposure apparatus 201 according to this embodiment will be described as a step-and-scan type exposure apparatus (scanner) that exposes while synchronously driving the reticle stage and the wafer stage. Furthermore, the exposure apparatus 201 is not limited to a scanner, and may also be a step-and-repeat type exposure apparatus (stepper) that exposes with the wafer stage stationary. In the example in Figure 2, the exposure apparatus 201 has a light source 7, an illumination optical system 8, a reticle stage 2, a projection optical system 3, a wafer stage 6, a wafer chuck 5, and a control unit 16. The exposure apparatus 201 also has a laser interferometer 9, a laser interferometer 10, a focus sensor 11, a wafer transport unit 12, a reticle transport unit 14, and an alignment scope 15. In Figure 2, the direction parallel to the optical axis of the projection optical system 3 is defined as the Z-axis direction, and the two mutually orthogonal directions in a plane perpendicular to the Z-axis direction are defined as the X-axis direction and the Y-axis direction.

[0015] Examples of light sources 7 include high-pressure mercury lamps, ArF excimer lasers, and KrF excimer lasers. Furthermore, the light source 7 is not necessarily located inside the exposure chamber; it may be externally mounted. Light emitted from the light source 7 illuminates the reticle 1 (master plate, mask) via the illumination optical system 8. The reticle 1 has a pattern drawn on it that will be transferred onto a wafer 4 (substrate) coated with photosensitive material, and is mounted on the reticle stage 2. The reticle stage 2 holds the reticle by adsorption via a reticle chuck (not shown) and is configured to be movable by means of, for example, a linear motor (not shown).

[0016] The projection optical system 3 projects (exposes) the image of the pattern drawn on the reticle 1 onto the wafer 4 placed on the wafer chuck 5. When projecting the pattern image onto the wafer 4, the image is inverted and reduced by a projection magnification (e.g., 1 / 4) via the projection optical system 3 and projected onto the wafer 4. If the area on which the pattern image is projected is called the shot area, then multiple shot areas are set on the wafer 4, and projection onto the shot areas is repeated sequentially.

[0017] The wafer stage 6 is movable in the X and Y directions by being driven by a linear motor (not shown). The wafer chuck 5 is mounted on the wafer stage 6 and holds the wafer 4. The wafer stage 6 positions the wafer chuck 5 in the Z direction, θ direction, ωX direction, and ωY direction. Thus, the wafer 4 held by the wafer chuck 5 moves by the driving of the wafer stage 6 and the wafer chuck 5.

[0018] The laser interferometer 9 measures the position of the reticle stage 2 in the Y direction and measures the attitude of the reticle stage 2. The laser interferometer 9 similarly includes a laser interferometer (not shown) for measuring the position of the reticle stage 2 in the X direction. Further, the laser interferometer 10 measures the position of the wafer stage 6 on which the wafer 4 is mounted in the Y direction and measures the attitude of the wafer stage 6. The laser interferometer 10 similarly includes a laser interferometer (not shown) for measuring the position of the wafer stage 6 in the X direction. The positions of the reticle stage 2 and the wafer stage 6 are controlled by a control unit 16 described later based on the positions measured by the laser interferometer 9 and the laser interferometer 10.

[0019] The focus sensor 11 includes a light projecting system 11a that projects light (a plurality of beams) onto the wafer 4, a light receiving system 11b that receives the reflected light from the wafer, and a detection unit (not shown) that detects the light from the light receiving system and outputs a detection signal to the control unit 16. The light projecting system 11a and the light receiving system 11b are installed so as to sandwich the vicinity of the emission part of the projection optical system 3. The light projecting system 11a irradiates the wafer with obliquely incident light, and the light receiving system 11b takes in the light reflected on the opposite side. From the detection signal detected by the focus sensor 11, the control unit 16 described later measures the position of the wafer 4 in the Z direction and controls the movement of the wafer 4 by the wafer stage 6.

[0020] The wafer transport unit 12 transports the wafer 4. The wafer transport unit 12 transports the wafer 4 from a wafer storage container (not shown) or the like that which houses the wafer 4 to the wafer stage 6. The wafer transport unit 12 also transports the wafer 4 from the wafer stage 6 to the wafer storage container or the like.

[0021] The reticle transport unit 14 transports the reticle 1. The reticle transport unit 14 transports the reticle 1 from a reticle storage container (not shown) or the like that houses the reticle 1 to the reticle stage 2. The reticle transport unit 14 also transports the reticle 1 from the reticle stage 2 to the reticle storage container or the like.

[0022] The alignment scope 15 acquires a digital image signal of a mark formed on the wafer 4 in order to position (align) the wafer 4 held in the wafer chuck 5. The alignment scope 15 includes an image sensor (not shown) that outputs a grayscale image signal corresponding to the brightness, i.e., the density, of the reflected light from the wafer 4, and an A / D converter (not shown) that converts the grayscale image signal obtained from the image sensor into a digital image signal. The control unit 16, described later, uses the acquired digital image signal to detect the position of the mark formed on the wafer 4 and controls the wafer stage 6 based on the detected mark position to position the wafer 4.

[0023] The control unit 16 controls the process of exposing the wafer 4 by controlling the operation and adjustment of each part of the exposure apparatus 201. The control unit 16 is an information processing device that may be composed of, for example, an FPGA (Field Programmable Gate Array), a PLD (Programmable Logic Device), an ASIC (Application Specific Integrated Circuit), a computer with a program embedded in it, or a combination of all or part of these. The control unit 16 may also be composed of multiple information processing devices. Furthermore, the control unit 16 may be configured together with the other parts of the exposure apparatus 201 (in a common housing) or separately from the other parts of the exposure apparatus 201 (in a separate housing). The control unit 16 also controls the wafer 4 exposure process (pattern formation process) by applying processing conditions obtained from a storage device, etc., as described later.

[0024] Figure 3 shows the hardware configuration of an information processing device. Each hardware component of the information processing device functions according to a program. In the example in Figure 3, the CPU 301 is a processing device that performs calculations for control according to a program and controls each component connected to the bus 308. The ROM 302 is a memory dedicated to data reading and stores programs and data. The RAM 303 is a memory for reading and writing data and is used for storing programs and data. The RAM 303 is used for temporary storage of data such as the results of calculations performed by the CPU 301. The storage device 304 is also used for storing programs and data. The storage device 304 is also used as a temporary storage area for the operating system (OS) program and data of the information processing device. Although the data input / output of the storage device 304 is slower than that of the RAM 303, it can store large amounts of data. It is desirable that the storage device 304 be a non-volatile storage device that can store data as persistent data so that the data to be stored can be referenced over a long period of time. The storage device 304 is mainly composed of a magnetic storage device (HDD), but it may also be a device that reads and writes data by inserting external media such as CDs, DVDs, and memory cards. The input device 305 is a device for inputting characters and data into the information processing device, and includes various keyboards and mice. The display device 306 is a device for displaying information necessary for operating the information processing device and processing results on a screen (user interface), and includes CRT or LCD monitors. The communication device 307 is used when connecting to a network and performing data communication using communication protocols such as TCP / IP, and communicating with other information processing devices. In addition, the information processing device may be configured with a GPU (abbreviation for Graphics Processor Unit) (not shown) to enable high-speed arithmetic processing.

[0025] Furthermore, the management device 104 described in Figure 1 is also an information processing device, and includes, for example, the configuration shown in the example in Figure 3. The management device 104 is connected to a plurality of exposure devices 201 for data communication via a communication device 307. The management device 104 may also be provided in the exposure devices 201.

[0026] Using Figure 4, we will explain the setting method for setting the reference value (reference value) for the parameters and the parameter setting value set in the exposure apparatus 201. In the flowchart shown in Figure 4, the reference value for the exposure apparatus parameters is set in advance, and the parameter setting value is set to the reference value. Here, the flowchart shown in Figure 4 is executed by the CPU 301 of the control device 104. In the following explanation, the reference value for parameters may be simply referred to as the reference value, and the parameter setting value may be simply referred to as the setting value.

[0027] In step 401, the CPU 301 acquires one or more reference values ​​stored in the storage device 304 (first acquisition step). Here, the CPU 301 can function as an acquisition unit that acquires one or more reference values. Alternatively, the CPU 301 may acquire one or more reference values ​​input by the user from the input device 305. Each of the one or more reference values ​​may correspond to each of the one or more parameters of the exposure apparatus 201.

[0028] Here, the reference value is a setting value that is commonly set across multiple exposure devices. For example, the reference value is a setting value that is commonly set across multiple exposure devices installed in the same factory. Also, for example, the reference value is a setting value that is commonly set across multiple exposure devices used for the same purpose. Also, for example, the reference value is a constant value that is commonly set across multiple exposure devices used for the purpose of manufacturing the same type of goods. Also, for example, the reference value is a setting value that is commonly set across multiple exposure devices used for the purpose of performing the same process. Also, for example, the reference value is a setting value that is commonly set across multiple exposure devices used for the purpose of performing processing with the same required precision.

[0029] Furthermore, it is not necessary to set reference values ​​for parameters whose settings are changed for each of the multiple exposure devices (such as parameters to compensate for unit differences or manufacturing errors in the exposure devices). Also, the reference values ​​can be changed based on the factory where the exposure device is installed, the purpose of the exposure device, and the process and precision of the products produced by the exposure device. For example, in the case of an exposure device installed in a factory for research and development, there are few parameters that need to be changed to recommended values, so there are few parameters for which reference values ​​are set. On the other hand, in the case of a device installed in a factory that manufactures state-of-the-art semiconductor products, detailed parameter management is necessary, so there are many parameters for which reference values ​​are set.

[0030] In step 402, the CPU 301 determines whether a reference value corresponding to the parameter exists. If it is determined that no reference value corresponding to the parameter exists, the process proceeds to step 403. If it is determined that a reference value corresponding to the parameter exists, the process proceeds to step 406.

[0031] In step 403, the CPU 301 acquires a set value (second set value) from another exposure apparatus (second apparatus) via the communication device 307 (acquisition step). Here, the CPU 301 can function as a second acquisition unit that acquires a set value from another exposure apparatus. The other exposure apparatus may be one or more exposure apparatuses. The exposure apparatus from which the set value is to be acquired is selected, for example, an apparatus installed in the same factory as the exposure apparatus in question. The exposure apparatus from which the set value is to be acquired is selected, for example, an apparatus used for the same purpose. An apparatus used for the same purpose is, for example, an apparatus used for the purpose of manufacturing the same type of goods (e.g., semiconductor devices). An apparatus used for the same purpose is, for example, an apparatus used for the purpose of performing the same process. An apparatus used for the same purpose is, for example, an apparatus used for the purpose of performing the same required precision processing.

[0032] In step 404, the CPU 301 determines whether the number of setting values ​​acquired in step 403 is greater than or equal to a predetermined number. Here, the predetermined number may be stored in the storage device 304 and can be changed depending on the type of parameter. For example, if a reference value can be set without checking the parameters of multiple exposure devices, such as a parameter that sets whether or not to enable a specific function, the predetermined number is set to "1". On the other hand, the setting value of a parameter that sets the upper limit of the data being monitored to detect abnormalities in the exposure device needs to be set based on the setting values ​​of multiple exposure devices. For example, if it needs to be set based on the setting values ​​of a parameter acquired from at least three or more exposure devices, the predetermined number is set to "3". If it is determined that the number of setting values ​​is greater than or equal to a predetermined number, the process proceeds to step 405; if it is determined that the number of setting values ​​is less than or equal to a predetermined number, the process terminates.

[0033] In step 405, the CPU 301 sets a reference value based on the setting value obtained in step 403 (first setting step). Here, the CPU 301 can function as a first setting unit that sets a reference value based on the acquired setting value. The set reference value is then stored in the storage device 304. The reference value may be set based on, for example, a statistical value obtained from multiple setting values ​​(for example, at least one of the mode, maximum, minimum, mean, median, variance, and standard deviation). The CPU 301 also displays the set reference value, the setting value of the target exposure device, and the setting value of other exposure devices on the screen of the display device 306. If the user determines that it is necessary to change the reference value, the value changed by the user via the input device 305 may be set as the reference value.

[0034] In step 406, the CPU 301 compares the reference value obtained in step 401 with the setting value of the exposure apparatus 201. The CPU 301 may also display the comparison result on the screen of the display device 306.

[0035] In step 407, the CPU 301 determines from the comparison results in step 406 whether the set value and the reference value are different. If it is determined that the set value and the reference value are different, the process proceeds to step 408; if it is determined that the set value and the reference value are the same, the process terminates.

[0036] Step 408 is when the CPU 301 sets the parameter setting value (first setting value) of the target exposure apparatus (first apparatus) based on a reference value (first setting step). Here, the CPU 301 may function as a second setting unit that sets the setting value based on the reference value. The CPU 301 may also display the parameter setting value on the screen of the display device 306, and if the setting value is confirmed by the user, it may set the parameter setting value of the target exposure apparatus to the reference value. The CPU 301 then instructs the target exposure apparatus to update the parameter setting value via the communication device 307. The CPU 301 may also set the setting values ​​of other exposure apparatuses based on the reference value, not just the target exposure apparatus. In other words, if the parameters of other exposure apparatuses differ from the reference value, the CPU 301 may set the parameter setting value of other exposure apparatuses based on the reference value and instruct the other exposure apparatuses to update their parameter setting values ​​via the communication device 307.

[0037] The setting method for setting values ​​based on reference values ​​will be explained using Figure 5. Table 501 in Figure 5 shows the comparison results between the parameter setting values ​​and reference values. The "Parameter" column shows the name of the parameter. The "Setting Value" column shows the setting value of the parameter of the exposure device in question. The "Reference Value" column shows the reference value corresponding to the parameter. In the example shown in Table 502, there is a difference between the setting value and the reference value for four parameters. As shown in Table 502, the parameters of the exposure device in question can be set by changing the four setting values ​​to the reference values. In step 402, the CPU 301 may also display Table 501 as the comparison result on the screen of the display device 306. Alternatively, when an exposure device is installed in a factory, the process may be executed up to step 402 and Table 501 may be displayed on the screen of the display device 306.

[0038] In this way, by performing the setting method for setting parameter values, the settings of the exposure device can be easily configured. Furthermore, this setting method can be performed in the same way when, for example, a new function is added to the exposure device, a unit within the exposure device is changed, or a new unit is added.

[0039] The setting method for reference values ​​and set values ​​will be explained using Figure 6. Reference values ​​are set when parameters are added due to the addition of functions or unit changes to the exposure equipment. Table 601 shows the results of comparing the set values ​​and reference values ​​of the parameters. In Table 601, there is a difference between the set values ​​and reference values ​​for four parameters of the exposure equipment (Function A, AAA, Function B, BBB). Also, there is no reference value for one parameter (EEE). For the four parameters where there is a difference between the set value and the reference value, the set value is changed to the reference value as in Figure 5. At this stage, the set value of parameter EEE is not changed and remains at the original set value (1000).

[0040] For parameters EEE for which no reference value exists, the reference value is set by referring to the parameters of other exposure devices. However, depending on the parameter, it may be necessary to set the reference value by referring to the settings of a number of exposure devices greater than or equal to a predetermined threshold. In other words, the predetermined threshold indicates the lower limit of the number of exposure devices required to set the reference value. For example, if parameter EEE is a parameter that sets the range of acceptable foreign matter size in the inspection of foreign matter on a wafer, the setting value may vary depending on the size of the foreign matter detected in the inspection, so it is preferable that the predetermined threshold be at least two or more. Here, as an example, the predetermined threshold will be described as "4".

[0041] Here, we will explain an example where, in addition to the exposure apparatus (first apparatus) for which parameter settings are to be set, an exposure apparatus (second apparatus) is also installed. In Table 602, the setting value A (first setting value), the reference value, and the setting value B (second setting value) of the second apparatus are shown. Although the setting value B of the second apparatus can be referenced, the number of referenced setting values ​​is 1, and since it does not meet the predetermined threshold of 4 or more, the reference value is not set.

[0042] Next, we will explain an example where, in addition to the exposure apparatus (first apparatus) for which the parameter setting value is to be set, four exposure apparatuses (second apparatus) are installed. In Table 602, setting value A (first setting value), reference value, and setting values ​​B to E (second setting values) for the second apparatus are added. Since setting values ​​B to E can be referenced, the number of referenced setting values ​​is 4, which satisfies the predetermined threshold of 4 or more. In this case, if we define a method for setting the reference value as the mode of setting values ​​B to E, the reference value of parameter (EEE) will be set to 400 (Table 604). Here, the method for setting the reference value can be determined for each parameter. For example, the reference value of one parameter can be set based on the mode of multiple setting values, and the reference values ​​of other parameters can be set based on the average value of multiple setting values.

[0043] As shown in Table 604, after the baseline value of parameter EEE is set, the setting value of the exposure device for which the parameter setting value is to be set is set. Table 605 shows that the setting value of parameter EEE has been changed from 1000 to the baseline value of 400. Furthermore, once the baseline value is set, the settings of parameters other than those of the target exposure device may also be changed. Table 605 also shows that the setting value D has been changed from the original setting value (1000) to the baseline value (400). In addition, once the baseline value of parameter EEE is set, if a new exposure device is installed, the setting value of parameter EEE of the new exposure device can be set based on the baseline value.

[0044] Figure 7 illustrates the method for displaying relevant data when setting reference values ​​for parameters. Table 701 shows an example where a new exposure device (first device) is installed in a factory that already has three exposure devices (second device). In Table 701, there is a difference between the set value and the reference value for four of the exposure device parameters (Function A, AAA, Function B, BBB). Also, there is no reference value for one parameter (FFF). Here, as an example, we will explain using a predetermined threshold of "3". Since set values ​​B to D can be referenced, the number of referenced set values ​​is 3, satisfying the predetermined threshold of 3 or more. Furthermore, if a method is defined to set the mode of set values ​​B to D as the reference value, then set value A will be set for the four parameters (Function A, AAA, Function B, BBB) as shown in Table 702.

[0045] Here, let's assume that the parameter FFF is, for example, a parameter that sets a threshold for detecting abnormalities from the measured value of the reticle magnification. In that case, the display device 306 screen displays the parameter setting value, the reference value, and a graph 703 showing the relationship between the measured value of the reticle magnification in each device. In graph 703, the vertical axis is the measured value of the reticle magnification and the horizontal axis is each device. In addition, graph 703 displays the measured value of the reticle magnification when processing a lot in each device, and also shows whether the product failed the subsequent product inspection. In Table 703, "○" indicates that the product inspection was OK, and "×" indicates that the product inspection was NG. By displaying this information and comparison results together, the user can infer the reason why the setting value D was set in other exposure devices. For example, it is presumed that the reason why the setting value D of parameter FFF is set to "12" is because there were cases where products failed the product inspection even with a measured value of "15" in the reticle magnification, so the value was changed to "12" to allow for a little margin. Based on data from other devices, a value of "12" may detect abnormalities even in lots that would otherwise pass product inspection. On the other hand, a value of "20," the most frequent value, may fail to detect abnormalities in lots that would otherwise fail product inspection. From these results, the user can determine, for example, that "13" is an appropriate reference value and set the reference value of parameter FFF to "13" via the input device 305.

[0046] Then, based on the reference value of parameter FFF, the setting value of parameter FFF for the first device is set to "13". In addition, the setting values ​​B to D of parameters FFF for the other exposure device (second device) may also be set to "13".

[0047] In the example shown in Figure 7, parameter-related information may be displayed along with the comparison results. Parameter-related information may include, for example, at least one of the following: accuracy information, unit information constituting the exposure apparatus, functional specification information, and trouble information. Accuracy information may include, for example, measured reticle magnification values ​​and product inspection results. Unit information may include, for example, the unit's model number and service life. Functional specification information may include, for example, documentation describing the specifications when additional functions were added. Trouble information may include, for example, the date and time of trouble such as an operational error or equipment shutdown, and the cause of the trouble. This allows the user to efficiently set appropriate reference values.

[0048] As described above, according to the setting method of this embodiment, the reference value of the parameter can be set in advance, and the parameter setting value can be set based on the reference value, so the parameter setting value can be set efficiently.

[0049] <Method of manufacturing articles> As examples of articles, we will describe a method for manufacturing devices (semiconductor devices, magnetic storage media, liquid crystal display elements, etc.), color filters, or hard disks. Such a manufacturing method includes a step of forming a pattern on a substrate (wafer, glass plate, film substrate, etc.) by irradiating it with light from a lithography apparatus (e.g., exposure apparatus, drawing apparatus, etc.) having a light source. Such a manufacturing method further includes a step of processing the substrate on which the pattern has been formed (processing step). This processing step may include a step of removing the residual film of the pattern. This processing step may also include a step of etching the substrate using the pattern as a mask. This processing step may also include other well-known steps such as dicing, bonding, and packaging. The method for manufacturing articles in this embodiment is advantageous compared to conventional methods in at least one of the performance, quality, productivity, and production cost of the articles.

[0050] Next, as an example of a method for manufacturing articles, an embodiment of a device manufacturing method using the exposure apparatus described above will be explained with reference to Figures 8 and 9. Figure 8 is a flowchart for explaining the manufacturing of devices (semiconductor chips such as ICs and LSIs, LCDs, CCDs, etc.). Here, the manufacturing method of a semiconductor chip will be explained as an example.

[0051] Step S1 (Circuit Design) involves designing the circuit for a semiconductor device. Step S2 (Mask Fabrication) involves fabricating a mask (master plate) based on the designed circuit pattern. Step S3 (Wafer Manufacturing) involves manufacturing a wafer (substrate) using materials such as silicon. Step S4 (Wafer Processing) is called the front-end process, where the mask and wafer are used to form the actual circuit on the wafer using lithography technology with the exposure apparatus described above. Here, the exposure apparatus illuminates the master plate on which the circuit pattern has been formed. Then, the imaging characteristics of the projection optical system are corrected using the acquired correction data, and the image of the circuit pattern on the master plate is projected onto the wafer, thereby forming the circuit pattern on the wafer. Step S5 (Assembly) is called the back-end process, and is the process of creating a semiconductor chip using the wafer produced in Step S4. It includes assembly processes such as assembly (dicing, bonding) and packaging (chip encapsulation). Step S6 (Inspection) involves performing inspections such as operational verification tests and durability tests on the semiconductor device produced in Step S5. After these processes, the semiconductor device is completed and shipped (Step S7).

[0052] Figure 9 is a detailed flowchart of the wafer process in step 4. In step S11 (oxidation), the surface of the wafer is oxidized. In step S12 (CVD), an insulating film is formed on the surface of the wafer. In step S13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step S14 (ion implantation), ions are implanted into the wafer. In step S15 (resist treatment), a photosensitive material is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is exposed onto the wafer using an exposure device. In step S17 (development), the exposed wafer is developed. In step S18 (etching), the parts other than the developed resist image are removed. In step S19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

[0053] Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its essence.

[0054] Furthermore, while we have described an exposure apparatus that exposes a substrate by irradiating it with light from a master plate on which a pattern has been formed, as an example of an exposure apparatus, it is not limited to this. Another example of an exposure apparatus may be a drawing apparatus that forms a pattern on a substrate by drawing on it with a charged particle beam (such as an electron beam or ion beam) via a charged particle optical system.

[0055] <Other Embodiments> The present invention can also be realized by supplying a program that implements one or more of the functions of the above-described embodiments to a system or device via a network or storage medium, and by the computer of that system or device reading and executing the program. The computer has one or more processors or circuits and may include a plurality of separate computers or a network of a plurality of separate processors or circuits for reading and executing computer executable instructions.

[0056] <Summary of Embodiments> The disclosures herein include the following setting methods, control methods, information processing devices, pattern forming devices, and methods for manufacturing articles.

[0057] (Item 1) A setting method for setting a first set value for the parameters of the first device, An acquisition step of acquiring a second setpoint of the parameter from a second device different from the first device, A first setting step of setting a reference value for the parameter based on the second setting value, The system includes a second setting step of setting the first setting value based on the reference value when the first setting value and the reference value are different, The setting method is characterized in that the reference value is a setting value of the parameter that is set in common in the first device and the second device.

[0058] (Item 2) The setting method according to item 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices installed in the same factory.

[0059] (Item 3) The setting method according to item 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices used for the same purpose.

[0060] (Item 4) The setting method according to item 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices used for the purpose of manufacturing articles of the same type.

[0061] (Item 5) The setting method according to item 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices used for the purpose of performing the same process.

[0062] (Item 6) The setting method according to item 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices used for the purpose of performing processing with the same required accuracy.

[0063] (Item 7) The setting method according to item 1, characterized in that, if the number of second setting values ​​obtained from a plurality of second devices in the acquisition step is greater than or equal to a predetermined number, the reference value is set in the first setting step based on the plurality of second setting values.

[0064] (Item 8) The setting method according to item 7, characterized in that the reference value is set based on statistical values ​​obtained from a plurality of second setting values ​​in the first setting step.

[0065] (Item 9) The setting method according to item 8, characterized in that the aforementioned statistical value is at least one of the mode, mean, median, maximum, minimum, variance, and standard deviation.

[0066] (Item 10) The setting method according to item 1, characterized in that the second setting value is acquired from a plurality of the second devices installed in the same factory during the acquisition process.

[0067] (Item 11) The setting method according to item 1, characterized in that a second setting value is obtained from a plurality of the second devices used for the same purpose in the acquisition step.

[0068] (Item 12) The setting method according to item 1, characterized in that the second setting value is obtained from a plurality of the second devices used for the purpose of manufacturing articles of the same type in the acquisition step.

[0069] (Item 13) The setting method according to item 1, characterized in that a second setting value is obtained from a plurality of second devices used for the purpose of performing the same process in the acquisition step.

[0070] (Item 14) The setting method according to item 1, characterized in that a second setting value is obtained from a plurality of second devices used for the purpose of performing the same required accuracy processing in the acquisition step.

[0071] (Item 15) An acquisition process to acquire a second parameter setting value from a second device different from the first device, A first setting step of setting a reference value for the parameter based on the second setting value, A second setting step in which, if the first setting value of the parameter of the first device differs from the reference value, the first setting value is set based on the reference value, The system includes a control step for controlling the reference value and the first set value to be displayed on the user interface, The control method is characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices.

[0072] (Item 16) The control method according to item 15, characterized in that, in the control step, information related to the parameter is displayed on the user interface along with the reference value and the first set value.

[0073] (Item 17) The control method according to item 16, characterized in that the aforementioned information includes at least one of the following: unit information, accuracy information, functional specification information, and trouble information.

[0074] (Item 18) An information processing device, An acquisition unit that acquires a second parameter setting value from a second device different from the first device, A first setting unit sets a reference value for the parameter based on the second setting value, The first device has a second setting unit that sets the first setting value based on the reference value when the first setting value of the parameter of the first device is different from the reference value, The information processing device is characterized in that the reference value is a setting value of the parameter that is set in common in the first device and the second device.

[0075] (Item 19) An information processing device, An acquisition unit that acquires a second parameter setting value from a second device different from the first device, A first setting unit sets a reference value for the parameter based on the second setting value, A second setting unit sets the first setting value based on the reference value when the first setting value of the parameter of the first device differs from the reference value, The system includes a control unit that controls the display of the reference value and the first set value on the user interface, The information processing device is characterized in that the reference value is a setting value of the parameter that is set in common in the first device and the second device.

[0076] (Item 20) A program that causes a computer to execute the configuration methods described in items 1 through 14.

[0077] (Item 21) A program that causes a computer to execute the control methods described in items 15 to 17.

[0078] (Item 22) A pattern forming apparatus for forming patterns on a substrate, A pattern forming apparatus characterized by having an information processing device as described in item 18 or 19.

[0079] (Item 23) A step of forming a pattern on a substrate using the pattern forming apparatus described in item 22, A step of processing the substrate on which the pattern is formed, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by having the following:

Claims

1. A setting method for setting a first set value for the parameters of the first device, An acquisition step of acquiring a second setpoint of the parameter from a second device different from the first device, A first setting step of setting a reference value for the parameter based on the second setting value, The process includes a second setting step of setting the first setting value based on the reference value when the first setting value and the reference value are different, The setting method is characterized in that the reference value is a setting value of the parameter that is set in common in the first device and the second device.

2. The setting method according to claim 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices installed in the same factory.

3. The setting method according to claim 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices used for the same purpose.

4. The setting method according to claim 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices used for the purpose of manufacturing articles of the same type.

5. The setting method according to claim 1, characterized in that the reference value is a parameter setting value that is set in common in the first and second devices used for the purpose of performing the same process.

6. The setting method according to claim 1, characterized in that the reference value is a setting value of the parameter that is set in common in the first and second devices used for the purpose of performing processing with the same required accuracy.

7. The setting method according to claim 1, characterized in that if the number of second setting values ​​obtained from a plurality of second devices in the acquisition step is greater than or equal to a predetermined number, the reference value is set in the first setting step based on the plurality of second setting values.

8. The setting method according to claim 7, characterized in that the reference value is set in the first setting step based on statistical values ​​obtained from a plurality of second setting values.

9. The setting method according to claim 8, characterized in that the aforementioned statistical value is at least one of the mode, mean, median, maximum, minimum, variance, and standard deviation.

10. The setting method according to claim 1, characterized in that the second setting value is acquired from a plurality of the second devices installed in the same factory during the acquisition step.

11. The setting method according to claim 1, characterized in that the second setting value is obtained from a plurality of the second devices used for the same purpose in the acquisition step.

12. The setting method according to claim 1, characterized in that the second setting value is obtained from a plurality of the second devices used for the purpose of manufacturing articles of the same type in the acquisition step.

13. The setting method according to claim 1, characterized in that a second setting value is obtained from a plurality of second devices used for the purpose of performing the same process in the acquisition step.

14. The setting method according to claim 1, characterized in that the second setting value is obtained from a plurality of second devices used for the purpose of performing the same required accuracy processing in the acquisition step.

15. An acquisition step to acquire a second parameter setting value from a second device different from the first device, A first setting step of setting a reference value for the parameter based on the second setting value, A second setting step in which, if the first setting value of the parameter of the first device differs from the reference value, the first setting value is set based on the reference value, The system includes a control step for controlling the reference value and the first set value to be displayed on the user interface, The control method is characterized in that the reference value is a setting value of the parameter that is set in common in the first device and the second device.

16. The control method according to claim 15, characterized in that, in the control step, information related to the parameter is displayed on the user interface along with the reference value and the first set value.

17. The control method according to claim 16, characterized in that the aforementioned information includes at least one of unit information, accuracy information, functional specification information, and trouble information.

18. An information processing device, An acquisition unit that acquires a second parameter setting value from a second device different from the first device, A first setting unit sets a reference value for the parameter based on the second setting value, The first device has a second setting unit which sets the first setting value based on the reference value when the first setting value of the parameter of the first device is different from the reference value, The information processing device is characterized in that the reference value is a setting value of the parameter that is set in common in the first device and the second device.

19. An information processing device, An acquisition unit that acquires a second parameter setting value from a second device different from the first device, A first setting unit sets a reference value for the parameter based on the second setting value, A second setting unit sets the first setting value based on the reference value when the first setting value of the parameter of the first device differs from the reference value, The system includes a control unit that controls the display of the reference value and the first set value on the user interface, The information processing device is characterized in that the reference value is a setting value of the parameter that is set in common in the first device and the second device.

20. A program that causes a computer to execute the setting method described in claim 1.

21. A program that causes a computer to execute the control method described in claim 15.

22. A pattern forming apparatus for forming patterns on a substrate, A pattern forming apparatus characterized by having the information processing device described in claim 18 or 19.

23. A step of forming a pattern on a substrate using the pattern forming apparatus described in claim 22, A step of processing the substrate on which the pattern is formed, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by having the following:

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