Holding members for electronic components and electronic devices

Abstract

The present invention provides an electronic component holder and electronic device that can prevent other electronic components from failing due to electrolyte leakage from an electronic component. [Solution] In the electronic device 10, the holding member 2 for the electronic component 3 is provided with a storage section 6. The storage section is formed by a bottom surface 20 and side surfaces 21 to 24 erected on the periphery of the bottom surface so as to surround the bottom surface. The storage section houses and holds the electronic component containing the electrolyte at a position away from the side surfaces, and also stores the electrolyte leaking from the electronic component.

Description

Technical Field

[0001] The disclosed embodiments relate to a holding member for electronic components and an electronic device.

Background Art

[0002] After an electronic component filled with an electrolytic solution such as an EDLC (Electric Double Layer Capacitor) is attached to a substrate, over time, the electrolytic solution may leak or scatter due to aging deterioration or the like. The electrolytic solution that leaks or scatters from the electronic component may cause other electronic components attached to the substrate to malfunction if it adheres to the substrate.

[0003] Therefore, for example, there is a technique for suppressing the leakage of the electrolytic solution from the electronic component by covering the side and bottom of the electronic component filled with the electrolytic solution with an insulator (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the prior art, when the electrolytic solution leaks from the electronic component, the electrolytic solution may further leak to the outside through the insulator in close contact with the electronic component, and the leaked electrolytic solution may cause other electronic components to malfunction.

[0006] One aspect of the embodiment has been made in view of the above circumstances, and an object thereof is to provide a holding member for an electronic component and an electronic device that can suppress other electronic components from malfunctioning due to the leaked electrolytic solution even when the electrolytic solution leaks from the electronic component.

Means for Solving the Problems

[0007] An electronic component holder according to one embodiment includes a storage section. The storage section is formed by a bottom surface and a side surface erected on the periphery of the bottom surface so as to surround the bottom surface. The storage section houses and holds the electronic component containing the electrolyte at a position away from the side surface, and also stores the electrolyte leaking from the electronic component. [Effects of the Invention]

[0008] An electronic component holding member according to one embodiment houses and holds the electronic component at a position away from the side surface of the storage section, and includes a storage section for storing electrolyte that leaks from the electronic component. Therefore, even if electrolyte leaks from the electronic component, the leaked electrolyte is stored, thus preventing other electronic components from failing. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is an exploded perspective view of an electronic device according to an embodiment. [Figure 2] Figure 2 is a plan view of the holding member according to the embodiment. [Figure 3] Figure 3 is a perspective view of the holding member according to the embodiment. [Figure 4] Figure 4 is a side view of the holding member according to the embodiment. [Figure 5] Figure 5 is a perspective view showing an example of the arrangement of electronic components according to the embodiment. [Figure 6] Figure 6 is an explanatory diagram showing the heat insulation function of the retaining member according to the embodiment. [Figure 7] Figure 7 is an explanatory diagram showing the liquid leakage prevention function of the holding member according to the embodiment. [Figure 8] Figure 8 is an explanatory diagram showing an example of the arrangement of the heat dissipation sheet according to the embodiment. [Figure 9] Figure 9 is an explanatory diagram showing the heat dissipation function of the holding member according to the embodiment. [Figure 10] Figure 10 is an explanatory diagram showing the ventilation function of the retaining member according to the embodiment. [Modes for carrying out the invention]

[0010] The holding member of the electronic device and embodiments of the electronic device will be described in detail below with reference to the attached drawings. However, this invention is not limited to the embodiments described below. In the following, identical components shown in each drawing are denoted by the same reference numerals, and redundant explanations are omitted.

[0011] Furthermore, in order to make the explanations easier to understand, the drawings referenced below show a Cartesian coordinate system in which the X, Y, and Z axes are defined as mutually orthogonal, and the positive Z-axis direction is defined as the vertically upward direction when the electronic equipment is placed flat. In the following explanation, the XY plane will be described as the horizontal plane. Also, except for the explanation of Figure 10, for convenience, the positive Z-axis direction will be described as up and the negative Z-axis direction as down.

[0012] First, with reference to Figure 1, an overview of the configuration of the electronic device 10 according to the embodiment will be described. Figure 1 is an exploded perspective view of the electronic device 10 according to the embodiment. As shown in Figure 1, the electronic device 10 according to the embodiment includes a substrate 1, a holding member 2, electronic components 3, a heat dissipation sheet 4, and a housing 5. The housing 5 is a case that houses the entire electronic device 10, but only a part of the housing 5 is shown in Figure 1.

[0013] The substrate 1 is a circuit board on which multiple chips 11, such as a CPU (Central Processing Unit), memory, and power supply circuit, are mounted. The retaining member 2 is a box-shaped member with an open top. The retaining member 2 is attached and fixed to the substrate 1, for example, with an insulating adhesive. The specific configuration of the retaining member 2 will be described later with reference to Figures 2 to 5.

[0014] The electronic component 3 is, for example, a capacitor encapsulated with an electrolytic solution such as a cylindrical Electric Double Layer Capacitor (EDLC). Note that the electronic component 3 may be a component other than a capacitor, such as a secondary battery, as long as it is a component encapsulated with an electrolytic solution. The electronic component 3 is housed and held inside the holding member 2.

[0015] The heat dissipation sheet 4 is a sheet-like member formed of a material having heat dissipation properties, insulation properties, and flame retardancy. The heat dissipation sheet 4 is closely adhered and affixed onto the holding member 2 so as to close the upper opening of the holding member 2 that houses the electronic component 3.

[0016] The housing 5 is a metal case that houses the entire electronic device 10. Note that the housing 5 is not limited to metal and may be formed of, for example, resin. The housing 5 is preferably provided such that its inner surface is in close contact with the upper surface of the heat dissipation sheet 4.

[0017] Next, referring to FIGS. 2 to 5, the configuration of the holding member 2 according to the embodiment will be described. FIG. 2 is a plan view of the holding member 2 according to the embodiment. FIG. 3 is a perspective view of the holding member 2 according to the embodiment. FIG. 4 is a side view of the holding member 2 according to the embodiment. FIG. 5 is a perspective view showing an arrangement example of the electronic component 3 according to the embodiment.

[0018] As shown in FIGS. 2 to 4, the holding member 2 is, for example, a box-shaped member with an open top, including a bottom surface portion 20 in the shape of a rectangular plate in plan view, and side surface portions 21, 22, 23, 24 erected on the peripheral edge of the bottom surface portion 20 so as to surround the bottom surface portion 20. The holding member 2 is formed of a material having heat insulation properties and insulation properties.

[0019] The holding member 2 is formed by the bottom surface portion 20 and the side surface portions 21, 22, 23, 24, and includes a storage portion 6 that houses and holds the electronic component 3 at a position away from the side surface portions 21, 22, 23, 24 and stores the electrolytic solution leaking from the electronic component 3.

[0020] As a result, even if electrolyte leaks from the electronic component 3, the retaining member 2 can store the leaked electrolyte in the storage section 6, thus preventing the electrolyte from leaking onto the substrate 1 and coming into contact with other electronic components, such as the chip 11, which is attached to the substrate 1, and causing the chip 11 to malfunction.

[0021] Furthermore, the retaining member 2 is equipped with a rib 25. The rib 25 is provided on the bottom surface 20 so as to traverse between the opposing side surfaces 21, 22, 23, and 24. In the example shown in Figures 2 and 3, the rib 25 is provided on the bottom surface 20 so as to traverse between the side surface 21 and the side surface 23.

[0022] As a result, the holding member 2 has a storage section 6 that is divided into multiple storage areas by the ribs 25, which prevents the electrolyte leaked from the electronic component 3 from moving to an adjacent storage area, thereby preventing the electrolyte from leaking out of the holding member 2.

[0023] Furthermore, the holding member 2 includes a partition plate 25A that separates the area for housing the electronic components 3 from the side portion 22 that is not in contact with the storage portion 6. The height position of the partition plate 25A from the bottom portion 20 is equal to the height position of all side portions 21, 22, 23, and 24 from the bottom portion 20.

[0024] Furthermore, the partition plate 25A has a communication portion 27 at its top that connects the area sandwiched between the side portion 22 and the partition plate 25A with the area that houses the electronic components 3. The side portion 22 has an external communication portion 28 that connects the area sandwiched between the side portion 22 and the partition plate 25A with the outside of the holding member 2.

[0025] As a result, even if the internal pressure of the holding member 2 increases while the electrolyte is being stored in the storage section 6, the holding member 2 can retain the electrolyte while releasing only the air inside the holding member 2 to the outside.

[0026] Furthermore, the connecting portion 27 of the partition plate 25A is provided closer to one of the side portions 21 and 23 that are directly connected to the partition plate 25A. Also, the external connecting portions 28 of the side portions 21, 22, 23, and 24 are provided on the other side portion 23 that are directly connected to the partition plate 25A.

[0027] As a result, the retaining member 2 can change the direction of the air release path from the storage section 6 to the area sandwiched between the side section 22 and the partition plate 25A by, for example, 90 degrees, and release the air to the outside of the retaining member 2 through the external passage section 28. The ventilation function of the retaining member 2 will be explained in detail with reference to Figure 10.

[0028] Furthermore, at least the side portions 21, 22, 23, and 24 of the retaining member 2 are made of thermal insulation material. The entire retaining member 2 may also be made of thermal insulation material. This prevents the internal temperature of the retaining member 2 from rising due to external heat. The thermal insulation function of the retaining member 2 will be explained in detail with reference to Figure 6.

[0029] Furthermore, as shown in Figure 5, the cylindrical electronic component 3 is housed and held inside the holding member 2 at a position away from the side portions 21, 22, 23, and 24, with its longitudinal direction parallel to the longitudinal direction of the holding member 2. For this reason, as shown in Figure 3, the rib 25 provided on the bottom portion 20 of the holding member 2 is provided with an arc-shaped recess 29 that follows the side circumference of the electronic component 3. As a result, the holding member 2 can hold the electronic component 3 in the appropriate position without wobbling by the recess 29 of the rib 25.

[0030] Furthermore, as shown in Figures 2 and 5, the bottom portion 20 of the retaining member 2 is provided with an insertion hole 26 into which a terminal 30 extending from the electronic component 3 is inserted. The insertion hole 26 is filled with an insulating material after the terminal 30 is inserted. This prevents the electrolyte from leaking out of the insertion hole 26 to the substrate 1 side, even if the electrolyte flows into the reservoir 6 at the location where the insertion hole 26 is provided.

[0031] Furthermore, the upper opening formed by the tops of the side portions 21, 22, 23, and 24 of the holding member 2 that houses the electronic component 3 is closed by the heat dissipation sheet 4 (see Figure 1). This allows the holding member 2 to dissipate heat, for example, emitted from the electronic component 3, to the outside of the holding member 2 via the heat dissipation sheet 4. The heat dissipation function of the holding member 2 will be explained in detail with reference to Figure 9.

[0032] Next, with reference to Figure 6, the heat insulation function of the holding member 2 according to this embodiment will be described. Figure 6 is an explanatory diagram showing the heat insulation function of the holding member 2 according to this embodiment. Note that the heat dissipation sheet 4 and the housing 5 are not shown in Figure 6.

[0033] Furthermore, in Figure 6, the heat generated outside the holding member 2 is indicated by a white arrow. As shown in Figure 6, the chips 11, such as the CPU, memory, and power supply circuit, attached to the substrate 1, generate heat during operation. This heat becomes heat generated outside the holding member 2.

[0034] Therefore, at least the side portions 21, 22, 23, and 24 of the retaining member 2 are made of insulating material. As a result, the retaining member 2 can block external heat from rising through the side portions 21, 22, 23, and 24, thereby suppressing an increase in internal temperature and internal pressure.

[0035] Next, with reference to Figure 7, the liquid leakage prevention function of the holding member 2 according to the embodiment will be described. Figure 7 is an explanatory diagram showing the liquid leakage prevention function of the holding member 2 according to the embodiment. As shown in Figure 7, electrolyte 31 may leak from the end face of the electronic component 3 from the end face opposite to the end face on which the terminal 30 (see Figure 5) is provided. Note that electrolyte 31 may also leak from the end face of the electronic component 3 on which the terminal 30 (see Figure 5) is provided.

[0036] In this case, the retaining member 2 is held by the rib 25 while being separated from the side portions 21, 22, 23, 24 and the bottom portion 20. Therefore, if the electrolyte 31 leaks from the end face opposite to the end face on which the terminal 30 (see Figure 5) is provided, for example, the retaining member 2 can store the electrolyte 31 in the storage portion 6 formed by the bottom portion 20, the side portions 21, 23, 24, and the rib 25 closest to the side portion 24.

[0037] Furthermore, even if the amount of electrolyte 31 leaking from the electronic component 3 increases, the holding member 2 can store the electrolyte 31 in the adjacent storage section 6. This prevents the electrolyte 31 from spreading over a wide area on the bottom surface 20.

[0038] Furthermore, the partition plate 25A of the retaining member 2 is higher than the height of the rib 25, and also higher than the diameter of the cylindrical electronic component 3, that is, higher than the height of the horizontally placed electronic component 3. Therefore, the retaining member 2 can prevent the leaked electrolyte 31 from exceeding the partition plate 25A and leaking to the outside of the retaining member 2.

[0039] Next, with reference to Figure 8, an example of the arrangement of the heat dissipation sheet 4 according to the embodiment will be described. Figure 8 is an explanatory diagram showing an example of the arrangement of the heat dissipation sheet 4 according to the embodiment. In Figure 8, the heat dissipation sheet 4 is shown with dashed lines (dotted lines) so that the size and arrangement of the holding member 2 and the heat dissipation sheet 4 can be seen.

[0040] As shown in Figure 8, the heat dissipation sheet 4 has a shape in plan view that is similar to the shape of the retaining member 2 in plan view, and its area in plan view is slightly larger than the area of ​​the retaining member 2 in plan view.

[0041] Therefore, when attaching the heat dissipation sheet 4 to the retaining member 2, the upper opening of the retaining member 2 can be closed by positioning and fixing the heat dissipation sheet 4 on top of the retaining member 2 so that the four corners of the retaining member 2 do not protrude from the heat dissipation sheet 4 in a plan view.

[0042] Next, with reference to Figure 9, the heat dissipation function of the holding member 2 according to this embodiment will be described. Figure 9 is an explanatory diagram showing the heat dissipation function of the holding member 2 according to this embodiment. In Figure 9, the heat emitted from the electronic component 3 is indicated by white arrows.

[0043] As shown in Figure 9, the electronic component 3 may generate heat when a voltage is applied, for example. In this case, the internal pressure of the holding member 2 increases due to the heat. The electrolyte 31 may be scattered when the internal pressure of the holding member 2 increases.

[0044] Therefore, a heat dissipation sheet 4 is provided at the upper opening of the retaining member 2. This allows the heat dissipation sheet 4 to absorb the heat generated inside the retaining member 2 and dissipate it to the outside of the retaining member 2.

[0045] Furthermore, since the heat dissipation sheet 4 has a larger surface area in plan view than the surface area of ​​the upper opening in the holding member 2 in plan view, heat can be efficiently dissipated to the outside of the holding member 2 not only from directly above the electronic component 3 but also from its surroundings.

[0046] Furthermore, the inner surface of the metal housing 5, which has a larger surface area than the surface area of ​​the heat dissipation sheet 4 in a plan view, is positioned in contact with the heat dissipation sheet 4. As a result, the heat generated inside the holding member 2 is efficiently dissipated to the outside of the holding member 2 via the heat dissipation sheet 4 and the housing 5.

[0047] In this way, even if the electronic component 3 generates heat, the holding member 2 can efficiently dissipate that heat to the outside, thereby suppressing an increase in internal pressure, and as a result, preventing the electrolyte 31 from splashing. Furthermore, even if the electrolyte 31 splashes inside the holding member 2, the upper opening is closed by the heat dissipation sheet 4, thus preventing the electrolyte 31 from splashing outside the holding member 2.

[0048] Next, with reference to Figure 10, the ventilation function of the holding member 2 according to the embodiment will be described. Figure 10 is an explanatory diagram showing the ventilation function of the holding member 2 according to the embodiment. In Figure 10, the airflow is indicated by black arrows, and the flow of the electrolyte 31 is indicated by white arrows.

[0049] As shown in Figure 10, even if the electronic component 3 generates heat, the retaining member 2 can release the internal air to the outside through the channels indicated by the black arrows (communication section 27 and external access section 28). This prevents the internal pressure of the retaining member 2 from rising.

[0050] On the other hand, the electrolyte 31 is blocked by the partition plate 25A. As a result, the holding member 2 can prevent the electrolyte 31 from entering the air passage from the storage section 6, thereby suppressing leakage of the electrolyte 31 to the outside.

[0051] Furthermore, the air passage connecting the inside to the outside of the holding member 2 is bent at a 90-degree angle. Therefore, even when the holding member 2 is attached to a substrate 1 that is placed vertically with its side portion 23 facing upwards, rather than lying flat, leakage of the electrolyte 31 to the outside can be suppressed.

[0052] In this case, the retaining member 2 is attached to the substrate 1 such that, for example, the plane defined by the Y-axis and Z-axis shown in Figure 10 becomes a horizontal plane, and the positive X-axis direction is vertically upward. As a result, the retaining member 2 has an external access portion 28 provided on its side portion 23 located at the top in the vertical direction, which helps to prevent the electrolyte 31 from leaking to the outside.

[0053] Furthermore, the electronic device 10 according to this embodiment includes the holding member 2 described above. Therefore, the electronic device 10 according to this embodiment can suppress the leakage of electrolyte 31 leaking from the electronic component 3 to the outside of the holding member 2.

[0054] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents. [Explanation of Symbols]

[0055] 1 circuit board 2. Retaining member 3 Electronic Components 4. Heat dissipation sheet 5 cabinets 6 Storage section 10 Electronic equipment 11 chips 20 Bottom part 21 Side part 22 Side part 23 Side part 24 Side part 25 Ribs 25A Partition Plate 26 Insertion holes 27 Communication part 28 External section 29 Recess 30 terminals 31 Electrolyte

Claims

1. It is formed by a bottom portion and side portions erected on the periphery of the bottom portion so as to surround the bottom portion, and houses and holds an electronic component containing an electrolyte at a position away from the side portions, and has a storage portion for storing the electrolyte that leaks from the electronic component. A holding member for electronic components that includes [a specific feature].

2. Ribs are provided on the bottom surface so as to traverse between the opposing side surfaces and hold the electronic components. An electronic component holding member according to claim 1, comprising:

3. A partition plate is provided to separate the area for housing the electronic components from the side portion. The partition plate has a height position from the bottom portion that is equal to the height position from the bottom portion of the side portion, and has a communication portion at its top that connects the area sandwiched between the side portion and the partition plate with the area for housing the electronic components. The side portion includes an external passage that connects the area sandwiched between the side portion and the partition plate with the outside of the retaining member. A holding member for an electronic component according to claim 1.

4. The connecting portion of the partition plate is provided closer to one of the side surfaces that are directly connected to the partition plate. The external access portion of the side portion is provided on the other side portion of the side portion that is directly connected to the partition plate. The electronic component holding member according to claim 3.

5. The aforementioned side portion is made of a heat insulating material. A holding member for an electronic component according to claim 1.

6. The bottom portion is provided with an insertion hole into which a terminal extending from the electronic component is inserted. The insertion hole is filled with insulating material after the terminal is inserted. A holding member for an electronic component according to claim 1.

7. The opening formed by the top of the aforementioned side portion is closed by the heat dissipation sheet. A holding member for an electronic component according to claim 1.

8. circuit board and A retaining member attached to the substrate, An electronic component held by the aforementioned holding member and containing an electrolyte, A heat dissipation sheet attached to the aforementioned holding member and Includes, The retaining member includes a storage section, The storage section is, It is formed by a bottom portion attached to the substrate and a side portion erected on the periphery of the bottom portion so as to surround the bottom portion, and it houses and holds the electronic components at a position away from the side portion, and stores the electrolyte that leaks from the electronic components, The aforementioned heat dissipation sheet is Closing the opening formed by the top of the side portion. electronic equipment.

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