Heat dissipation structure

Abstract

To ensure heat dissipation in various mounting positions of the enclosure without compromising shielding or rigidity. [Solution] This heat dissipation structure is provided in an electronic device housing 10 which is composed of multiple wall sections 11 arranged in different directions, and includes multiple vents 12 arranged in the wall sections 11, and a lid 13 which is movable in a manner that opens and closes each vent 12. That is, the heat dissipation structure can open only the upper vents 12 of the vertically arranged wall sections 11, and discharge the heat rising inside the electronic device housing 10 from these vents 12. In addition, the heat dissipation structure can close the other vents 12 other than the upper vents 12 of the vertically arranged wall sections 11, and ensure the shielding and rigidity of the electronic device housing 10 in the part where the closed vents 12 are located.

Description

Technical Field

[0001] The present invention relates to a waste heat structure.

Background Art

[0002] For example, in the electronic device of Patent Document 1, the housing has an upper wall provided with a first ventilation portion and a right side wall provided with a second ventilation portion, and can be installed in both a horizontal posture with the upper wall facing upward and a vertical posture with the right side wall facing upward.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, in the housing of an electronic device, in order to perform good waste heat discharge to the outside according to various installation postures, it is conceivable to provide ventilation portions on each wall of the housing as in the above-described Patent Document 1. However, in an electronic device, if there are ventilation portions on each wall, it may not be preferable in consideration of the shielding property and rigidity of the housing.

[0005] An object of the present invention is to provide a waste heat structure that can ensure waste heat discharge performance in various installation postures of the housing without impairing the shielding property and rigidity.

Means for Solving the Problems

[0006] To achieve the above object, a waste heat structure according to an aspect of the present invention is provided in an electronic device housing surrounded by a plurality of wall portions arranged in different directions, and includes a plurality of ventilation openings arranged in the wall portions, and a lid portion provided movably in a manner of opening and closing each of the ventilation openings.

Effects of the Invention

[0007] This invention ensures heat dissipation in various mounting positions of the enclosure without compromising shielding or rigidity. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view showing the arrangement of an electronic device housing to which the heat dissipation structure according to the embodiment is applied. [Figure 2] Figure 2 is a perspective view showing another arrangement of the heat dissipation structure according to the embodiment to be applied to an electronic device housing. [Figure 3] Figure 3 is a perspective view showing another arrangement of the heat dissipation structure according to the embodiment to be applied to an electronic device housing. [Figure 4] Figure 4 is a front view of the heat dissipation structure according to the embodiment. [Figure 5] Figure 5 is a cross-sectional view of AA in Figure 4. [Figure 6] Figure 6 is a front view of another example of the heat dissipation structure according to the embodiment. [Figure 7] Figure 7 is a cross-sectional view of BB in Figure 6. [Figure 8] Figure 8 is a cross-sectional view of another form of BB shown in Figure 6. [Figure 9] Figure 9 is a front view of another example of the heat dissipation structure according to the embodiment. [Modes for carrying out the invention]

[0009] Hereinafter, embodiments for carrying out the invention (hereinafter referred to as "embodiments") will be described in detail with reference to the drawings. However, the present invention is not limited to the embodiments described below. Furthermore, the components in the embodiments described below include those that are easily conceivable by those skilled in the art, those that are substantially the same, and those that fall within the so-called equivalent range. Moreover, the components disclosed in the embodiments described below can be combined as appropriate.

[0010] [Electronic device enclosure] Figures 1 to 3 show electronic device housings to which the heat dissipation structure according to this embodiment is applied.

[0011] In the following description, we define the directions of the electronic device housing 10. Specifically, the electronic device housing 10 is constructed as a rectangular parallelepiped (rectangular hexahedron), and a first direction X, a second direction Y, and a third direction Z are defined based on a pair of faces facing opposite directions. The first direction X, the second direction Y, and the third direction Z are mutually orthogonal in three dimensions.

[0012] The electronic equipment housing 10 is exemplified as being composed of 1 DIN according to the DIN standard. The electronic equipment housing 10 has a rectangular parallelepiped (rectangular hexahedron) shape and has six wall portions 11. The wall portions 11 include a first wall portion 11A and a second wall portion 11B facing the first direction X, a third wall portion 11C and a fourth wall portion 11D facing the second direction Y, and a fifth wall portion 11E and a sixth wall portion 11F facing the third direction Z.

[0013] The electronic device housing 10 is configured such that a connection connector (not shown) is located on at least one of its walls 11, allowing the display unit to be electrically connected via this connector. The electronic device housing 10 houses electronic components inside in order to display various information on the display unit. Examples of electronic devices including this electronic device housing 10 and display unit include car navigation systems and car audio systems.

[0014] When there are constraints on the placement of the electronic device housing 10 based on the structure of the vehicle to which it is mounted, it is mainly arranged in the configurations shown in Figures 1 to 3. Specifically, in the configuration shown in Figure 1, the electronic device housing 10 is positioned with the first wall portion 11A and the second wall portion 11B in the first direction X facing the front-rear direction of the vehicle, the third wall portion 11C and the fourth wall portion 11D in the second direction Y facing the left-right direction of the vehicle, and the fifth wall portion 11E and the sixth wall portion 11F in the third direction Z facing the up-down direction of the vehicle. In addition, in the configuration shown in Figure 2, the electronic device housing 10 is positioned with the first wall portion 11A and the second wall portion 11B in the first direction X facing the front-rear direction of the vehicle, the third wall portion 11C and the fourth wall portion 11D in the second direction Y facing the up-down direction of the vehicle, and the fifth wall portion 11E and the sixth wall portion 11F in the third direction Z facing the left-right direction of the vehicle. Furthermore, in the configuration shown in Figure 3, the electronic equipment housing 10 is arranged with the first wall portion 11A and the second wall portion 11B in the first direction X facing the vertical direction of the vehicle, the third wall portion 11C and the fourth wall portion 11D in the second direction Y facing the left-right direction of the vehicle, and the fifth wall portion 11E and the sixth wall portion 11F in the third direction Z facing the front-rear direction of the vehicle.

[0015] [Heat dissipation structure] In the various arrangements described above, the electronic device housing 10 needs to discharge the heat released from the internal electronic components to the outside. In the exhaust heat structure of the embodiment, a ventilation port 12 penetrating the wall portion 11 inside and outside is provided. The ventilation port 12 includes a pair of first ventilation ports 12a arranged along two opposite rectangular sides in one wall portion 11, and a pair of second ventilation ports 12b arranged along two other opposite rectangular sides. In the form of the arrangement of the electronic device housing 10 shown in FIGS. 1 to 3, one of the first ventilation ports 12a or one of the second ventilation ports 12b is arranged along the upper side in the wall portion 11 arranged vertically. Since the heat released from the electronic components in the electronic device housing 10 goes upward inside, it is discharged from the ventilation ports 12a and 12b arranged along the upper side in the wall portion 11 arranged vertically. In the case of the electronic device housing 10 configured without a fan (not shown) for exhaust heat inside, the upward heat flow is remarkable, and the exhaust heat from the ventilation ports 12a and 12b arranged along the upper side in the wall portion 11 arranged vertically is particularly effective. Although the ventilation ports 12a and 12b are shown as one long hole along the side of the wall portion 11, they may be configured as a plurality of holes along the side of the wall portion 11.

[0016] Here, if the ventilation ports 12a and 12b are arranged in all the wall portions 11 of the electronic device housing 10, in the form of the arrangement of the electronic device housing 10 shown in FIGS. 1 to 3, they will inevitably be arranged along the upper side of the wall portion 11 arranged vertically. However, if the ventilation ports 12a and 12b are provided in all the wall portions 11 of the electronic device housing 10, the shielding property of the electronic device and the rigidity as a housing will be reduced. Therefore, the exhaust heat structure of the embodiment includes a lid portion 13 that can cover the ventilation ports 12a and 12b.

[0017] As shown in FIGS. 4 and 5, the exhaust heat structure of the embodiment has, in the wall portion 11 of the electronic device housing 10, in addition to the above-described ventilation ports 12 (12a, 12b), a lid portion 13, a guide portion 14, a weight portion 15, and a holding portion 16. In FIGS. 4 and 5, the wall portion 11A is shown.

[0018] The lid portion 13 opens and closes the ventilation openings 12. The lid portion 13 includes a first lid portion 13a corresponding to the first ventilation opening 12a and a second lid portion 13b corresponding to the second ventilation opening 12b, respectively. The first lid portions 13a are arranged in a pair along two opposite rectangular sides of one wall portion 11. The second lid portions 13b are arranged in a pair along two other opposite rectangular sides. The lid portions 13a and 13b are formed in a plate shape along the surface of the wall portion 11 so as to cover the ventilation openings 12a and 12b. In the embodiment, the lid portions 13a and 13b are formed in a rectangular plate shape.

[0019] The guide portion 14 guides the movement of the lid portion 13. The guide portion 14 includes a first guide portion 14a corresponding to the first lid portion 13a and a second guide portion 14b corresponding to the second lid portion 13b, respectively. The first guide portion 14a guides the movement of the lid portion 13a by covering both ends which are part of the lid portion 13a with the ventilation opening 12a left open and supporting the lid portion 13a so as to be movable along the surface of the wall portion 11. The second guide portion 14b guides the movement of the lid portion 13b by covering both ends which are part of the lid portion 13b with the ventilation opening 12b left open and supporting the lid portion 13b so as to be movable along the surface of the wall portion 11. The guide portions 14a and 14b guide the movement of the lid portions 13a and 13b to positions where the lid portions 13a and 13b move away from the sides of the wall portion 11 and deviate from the positions of the ventilation openings 以便开放the ventilation openings 12a and 12b, and to positions where the lid portions 13a and 13b approach the sides of the wall portion 11 and cover the ventilation openings 12a and 12b to close the ventilation openings 12a and 12b.

[0020] The weight portion 15 is configured such that the lid portion 13 itself serves as a weight. The weight portion 15 is moved downward according to the guide portion 14 by the weight of the lid portions 13 which are vertically arranged in the wall portion 11 standing upright. For this reason, the lid portion 13 is moved so as to open the ventilation opening 12 arranged on the upper side by two opposite rectangular sides in the wall portion 11 standing upright, while closing the ventilation opening 12 arranged on the lower side.

[0021] The holding portion 16 maintains the position of the moved lid portions 13a and 13b. As shown in Figure 5, the holding portion 16 is positioned on the guide portion 14a (14b) and is provided to contact the lid portion 13a (13b). The holding portion 16 is elastically deformable, for example, like felt, and contacts the lid portion 13a (13b) by generating a frictional force. Therefore, the holding portion 16 maintains the position of the moved lid portion 13a (13b) by frictional force. In addition, since the holding portion 16 moves the lid portions 13a and 13b by the weight portion 15 as described above in the vertically positioned wall portion 11, it is preferable that the holding portion 16 generates a frictional force smaller than the gravity of the weight portion 15.

[0022] The lid portion 13, guide portion 14, weight portion 15, and holding portion 16 described above may be positioned either on the outside or on the inside of the wall portion 11 (electronic device housing 10).

[0023] The heat dissipation structure of the embodiment described above is characterized by being provided in an electronic device housing 10 which is composed of a plurality of wall portions 11 arranged in different directions, and includes a plurality of vents 12 arranged in the wall portions 11, and a lid portion 13 which is provided so as to be movable in a manner that opens and closes each vent 12. Here, in the heat dissipation structure of the embodiment, the wall portions 11 on which the vents 12 are provided may be all of the wall portions 11 that make up the electronic device housing 10, or it may be some of the wall portions 11.

[0024] With this heat dissipation structure, for example, if the electronic equipment housing 10 is arranged as shown in Figure 1, the upper vent 12a can be opened in the vertically arranged wall sections 11A, 11B, 11C, and 11D, while the lower vent 12a and other vents 12b can be closed. Furthermore, with this heat dissipation structure, if the electronic equipment housing 10 is arranged as shown in Figure 1, the vents 12a and 12b in the other wall sections 11E and 11F can be closed. Therefore, the heat dissipation structure can open only the upper vent 12a in the vertically arranged wall sections 11A, 11B, 11C, and 11D, and dissipate the heat rising inside the electronic equipment housing 10 through this vent 12a. Furthermore, the heat dissipation structure closes the vents 12a and 12b other than the upper vent 12a on the vertically arranged wall sections 11A, 11B, 11C, and 11D, thereby ensuring the shielding and rigidity of the electronic equipment housing 10 in the areas where the closed vents 12a and 12b are located.

[0025] Furthermore, with this heat dissipation structure, for example, if the electronic equipment housing 10 is arranged as shown in Figure 2, the upper vent 12b can be opened in the vertically arranged wall sections 11A, 11B, 11E, and 11F, while the lower vent 12b and other vents 12a can be closed. Also, with this heat dissipation structure, if the electronic equipment housing 10 is arranged as shown in Figure 2, the vents 12a and 12b in the other wall sections 11C and 11D can be closed. Therefore, the heat dissipation structure can open only the upper vent 12b in the vertically arranged wall sections 11A, 11B, 11E, and 11F, and dissipate the heat rising inside the electronic equipment housing 10 through this vent 12b. Furthermore, the heat dissipation structure closes off the other vents 12a, 12b except for the upper vents 12b on the vertically arranged wall sections 11A, 11B, 11E, and 11F, thereby ensuring the shielding and rigidity of the electronic equipment housing 10 in the areas where the closed vents 12a, 12b are located.

[0026] Furthermore, with this heat dissipation structure, for example, if the electronic equipment housing 10 is arranged as shown in Figure 3, the upper vents 12a and 12b can be opened in the vertically arranged wall sections 11C, 11D, 11E, and 11F, while the lower vents 12a and 12b and other vents 12a and 12b can be closed. Also, with this heat dissipation structure, if the electronic equipment housing 10 is arranged as shown in Figure 3, the vents 12a and 12b in the other wall sections 11A and 11B can be closed. Therefore, the heat dissipation structure can open only the upper vents 12a and 12b in the vertically arranged wall sections 11C, 11D, 11E, and 11F, and dissipate the heat rising inside the electronic equipment housing 10 through these vents 12a and 12b. Furthermore, the heat dissipation structure closes off the other vents 12a, 12b except for the upper vents 12a, 12b on the vertically arranged wall sections 11C, 11D, 11E, and 11F, thereby ensuring the shielding and rigidity of the electronic equipment housing 10 in the areas where the closed vents 12a, 12b are located.

[0027] Thus, according to the heat dissipation structure of this embodiment, heat dissipation can be ensured in various installation positions of the electronic device housing 10 without compromising shielding or rigidity.

[0028] Furthermore, the heat dissipation structure of the embodiment includes a guide portion 14 that allows the lid portion 13 to slide along the wall portion 11, and a weight portion 15 that is placed on the lid portion 13, and the lid portion 13 is moved by the weight of the weight portion 15 on the vertically positioned wall portion 11.

[0029] This heat dissipation structure allows for the automatic opening of the upper vents 12a and 12b of the vertically positioned wall portion 11 and the automatic closing of the lower vents 12a and 12b in various installation positions of the electronic equipment housing 10.

[0030] Furthermore, in the heat dissipation structure of this embodiment, the weight portion 15 is composed of the lid portion 13 itself.

[0031] With this heat dissipation structure, by configuring the lid portion 13 as the weight portion 15, the configurations of the lid portion 13 and the weight portion 15 can be integrated, simplifying the overall structure.

[0032] Furthermore, the heat dissipation structure of the embodiment further includes a holding portion 16 that holds the lid portion 13 in its moved position.

[0033] This heat dissipation structure allows the lid 13 to maintain its position even when it is moved. For example, when the electronic equipment housing 10 is installed on a moving object such as a vehicle, it is possible to suppress the lid 13 from moving unintentionally due to the movement and vibration of the vehicle, and to suppress the generation of rattle noises when it hits the wall 11 or the like.

[0034] [Other examples of heat dissipation structures] Figures 6 to 9 show other examples of heat dissipation structures.

[0035] As shown in Figure 6, the heat dissipation structure of the embodiment has, in addition to the ventilation openings 12 (12a, 12b) described above, a lid portion 13, a guide portion 14', weight portions 15', 15'', and holding portions 16', 16'' in the wall portion 11 of the electronic equipment housing 10. Note that Figure 6 shows the wall portion 11A of Figure 1.

[0036] The ventilation opening 12 and the cover portion 13 are as described above.

[0037] The guide section 14' guides the movement of the lid section 13. The guide section 14' includes a first guide section 14a corresponding to the first lid section 13a and a second guide section 14b corresponding to the second lid section 13b. The first guide section 14a guides the movement of the lid section 13a by opening the ventilation opening 12a and covering the lid section 13a, thereby supporting the lid section 13a so that it can move along the surface of the wall section 11. The second guide section 14b guides the movement of the lid section 13b by opening the ventilation opening 12b and covering the lid section 13b, thereby supporting the lid section 13b so that it can move along the surface of the wall section 11. The guides 14a and 14b guide the lids 13a and 13b to move to positions where they move away from the edge of the wall 11 and away from the position of the vents 12a and 12b, opening the vents 12a and 12b, and to positions where they move closer to the edge of the wall 11 and cover the vents 12a and 12b, closing the vents 12a and 12b.

[0038] The weight portion 15' is configured as a weight fixed to the lid portion 13. As shown in Figure 7, the weight portion 15' is fixed to the lid portion 13. In this configuration, the weight portion 15' is formed in a rod shape that is inserted into and supported by an elongated hole 14c formed in the guide portion 14'. The elongated hole 14c is formed to be elongated in the direction of movement of the lid portion 13, corresponding to the range of movement of the lid portion 13. Therefore, the weight portion 15' moves along the elongated hole 14c together with the lid portion 13.

[0039] The weight portion 15” is configured separately from the lid portion 13 and is positioned to move along the direction of movement of the lid portion 13 relative to the wall portion 11. As shown in Figure 8, the weight portion 15” is formed in a spherical shape and is supported by being inserted through an elongated hole 14c formed in the guide portion 14'. The weight portion 15” is also provided so as to be inserted through a through hole 13c formed in the lid portion 13 and in contact with the surface of the wall portion 11. The through hole 13c is formed in a circular shape through which the spherical weight portion 15” passes. Therefore, the weight portion 15” moves along the elongated hole 14c while rolling in contact with the surface of the wall portion 11, accompanied by the lid portion 13.

[0040] The retaining portion 16' holds the lid portion 13 in its moved position. As shown in Figure 6, the retaining portion 16' is formed as a bulge in the middle of the elongated hole 14c of the guide portion 14' and is provided as a recess on which the weight portion 15' or weight portion 15'' catches.

[0041] In Figure 6, the lid 13a moves downward due to the weight of the weights 15' and 15''. At this time, the weights 15' and 15'' are inserted into the elongated slot 14c in the third direction Z, which is the vertical direction, and are therefore held in place so as not to move in the second direction Y, which is the horizontal direction. On the other hand, in Figure 6, the weights 15' and 15'' related to the lid 13b are inserted into the elongated slot 14c in the second direction Y, which is the horizontal direction, and are therefore able to move horizontally along the slot 14c. Consequently, for example, if the electronic equipment housing 10 is installed on a moving object such as a vehicle, the lid 13b may move along the slot 14c due to the movement and vibration of the vehicle.

[0042] Therefore, as shown in Figure 6, the holding part 16' holds the lid 13b in its moved position by hooking the weights 15' and 15'' attached to the lid 13b. When hooking the weights 15' and 15'' onto the holding part 16', the position of the lid 13b will be shifted from its position at the end of the elongated hole 14c, but it is sufficient that the lid 13b still covers the ventilation opening 12b even if its position is shifted.

[0043] Furthermore, as shown in Figure 6, the holding portion 16' is configured to hook onto the weight portion 15' and weight portion 15'' related to the lid portion 13a. This is because, when the lid portion 13a is tilted 90 degrees from the state shown in Figure 6, the weight portion 15' and weight portion 15'' related to the lid portion 13a are then inserted into the elongated hole 14c in the second direction Y, which is the left-right direction, allowing them to move left and right along the elongated hole 14c.

[0044] The retaining portion 16" holds the lid portion 13 in its moved position. As shown in Figure 9, the retaining portion 16" is provided at the end of the elongated hole 14c of the guide portion 14' and is configured as a permanent magnet to which the weight portion 15' and weight portion 15'' are magnetically attached.

[0045] As shown in Figure 9, the lid 13a moves downward due to the weight of the weights 15' and 15''. At this time, the weights 15' and 15'' are inserted into the elongated slot 14c in the third direction Z, which is the vertical direction, and are therefore held in place so as not to move in the second direction Y, which is the left-right direction. On the other hand, in Figure 9, the weights 15' and 15'' related to the lid 13b are inserted into the elongated slot 14c in the second direction Y, which is the left-right direction, and are therefore able to move left-right along the slot 14c. Consequently, for example, if the electronic equipment housing 10 is installed on a moving object such as a vehicle, the lid 13b may move along the slot 14c due to the movement and vibration of the vehicle.

[0046] Therefore, as shown in Figure 9, the holding part 16" holds the lid 13b in its moved position by magnetically attaching the weights 15' and 15'' related to the lid 13b.

[0047] Furthermore, as shown in Figure 9, the holding portion 16" is configured to magnetically attach the weight portion 15' and weight portion 15" to the lid portion 13a. This is because, when the lid portion 13a is tilted 90 degrees from the state shown in Figure 9, the weight portion 15' and weight portion 15" to the lid portion 13a are then inserted into the elongated hole 14c in the second direction Y, which is the left-right direction, allowing them to move left and right along the elongated hole 14c.

[0048] Furthermore, by keeping the magnetic force of the holding portion 16" smaller than the gravity of the weight portion 15' and the lid portion 13 including the weight portion 15'', it is possible to automatically open the upper vent 12 in the vertically positioned wall portion 11.

[0049] The lid portion 13, guide portion 14', weight portions 15', 15'', and holding portions 16', 16'' described above may be positioned on the outside or inside of the wall portion 11 (electronic device housing 10).

[0050] Another example of the heat dissipation structure described above is provided in an electronic device housing 10 which is composed of a plurality of walls 11 arranged in different directions, and includes a plurality of vents 12 arranged in the walls 11, and a lid 13 which is movable in such a manner as to open and close each vent 12. Here, in the heat dissipation structure of the embodiment, the walls 11 on which the vents 12 are provided may be all of the walls 11 that make up the electronic device housing 10, or it may be some of the walls 11.

[0051] With this heat dissipation structure, for example, if the electronic equipment housing 10 is arranged as shown in Figure 1, the upper vent 12a can be opened in the vertically arranged wall sections 11A, 11B, 11C, and 11D, while the lower vent 12a and other vents 12b can be closed. Furthermore, with this heat dissipation structure, if the electronic equipment housing 10 is arranged as shown in Figure 1, the vents 12a and 12b in the other wall sections 11E and 11F can be closed. Therefore, the heat dissipation structure can open only the upper vent 12a in the vertically arranged wall sections 11A, 11B, 11C, and 11D, and dissipate the heat rising inside the electronic equipment housing 10 through this vent 12a. Furthermore, the heat dissipation structure closes the vents 12a and 12b other than the upper vent 12a on the vertically arranged wall sections 11A, 11B, 11C, and 11D, thereby ensuring the shielding and rigidity of the electronic equipment housing 10 in the areas where the closed vents 12a and 12b are located.

[0052] Furthermore, with this heat dissipation structure, for example, if the electronic equipment housing 10 is arranged as shown in Figure 2, the upper vent 12b can be opened in the vertically arranged wall sections 11A, 11B, 11E, and 11F, while the lower vent 12b and other vents 12a can be closed. Also, with this heat dissipation structure, if the electronic equipment housing 10 is arranged as shown in Figure 2, the vents 12a and 12b in the other wall sections 11C and 11D can be closed. Therefore, the heat dissipation structure can open only the upper vent 12b in the vertically arranged wall sections 11A, 11B, 11E, and 11F, and dissipate the heat rising inside the electronic equipment housing 10 through this vent 12b. Furthermore, the heat dissipation structure closes off the other vents 12a, 12b except for the upper vents 12b on the vertically arranged wall sections 11A, 11B, 11E, and 11F, thereby ensuring the shielding and rigidity of the electronic equipment housing 10 in the areas where the closed vents 12a, 12b are located.

[0053] Furthermore, with this heat dissipation structure, for example, if the electronic equipment housing 10 is arranged as shown in Figure 3, the upper vents 12a and 12b can be opened in the vertically arranged wall sections 11C, 11D, 11E, and 11F, while the lower vents 12a and 12b and other vents 12a and 12b can be closed. Also, with this heat dissipation structure, if the electronic equipment housing 10 is arranged as shown in Figure 3, the vents 12a and 12b in the other wall sections 11A and 11B can be closed. Therefore, the heat dissipation structure can open only the upper vents 12a and 12b in the vertically arranged wall sections 11C, 11D, 11E, and 11F, and dissipate the heat rising inside the electronic equipment housing 10 through these vents 12a and 12b. Furthermore, the heat dissipation structure closes off the other vents 12a, 12b except for the upper vents 12a, 12b on the vertically arranged wall sections 11C, 11D, 11E, and 11F, thereby ensuring the shielding and rigidity of the electronic equipment housing 10 in the areas where the closed vents 12a, 12b are located.

[0054] Thus, according to the heat dissipation structure of this embodiment, heat dissipation can be ensured in various installation positions of the electronic device housing 10 without compromising shielding or rigidity.

[0055] Furthermore, in another example of the heat dissipation structure of the embodiment, a guide portion 14' that allows the lid portion 13 to slide along the wall portion 11 and weight portions 15', 15'' placed on the lid portion 13 are included, and the lid portion 13 is moved by the weight of the weight portions 15', 15'' on the vertically positioned wall portion 11.

[0056] This heat dissipation structure allows for the automatic opening of the upper vents 12a and 12b of the vertically positioned wall portion 11 and the automatic closing of the lower vents 12a and 12b in various installation positions of the electronic equipment housing 10.

[0057] Furthermore, in the heat dissipation structure of this embodiment, the weight portion 15' is fixed to the lid portion 13.

[0058] This heat dissipation structure allows the weight portion 15' to be fixed to the lid portion 13, which, compared to using the lid portion 13 itself as a weight, makes the lid portion 13 lighter by using a synthetic resin material, and allows the lid portion 13 to move more smoothly. Moreover, by making the lid portion 13 out of a synthetic resin material, for example, when the electronic equipment housing 10 is installed on a moving object such as a vehicle, it is possible to suppress the generation of rattle noise caused by the lid portion 13 hitting the wall portion 11 or the like due to the movement and vibration of the vehicle.

[0059] Furthermore, in the heat dissipation structure of this embodiment, the weight portion 15" is configured separately from the lid portion 13 and is arranged to be rotatable relative to the wall portion 11 along the direction of movement of the lid portion 13.

[0060] This heat dissipation structure allows the weight portion 15" to be rotatable relative to the wall portion 11 along the direction of movement of the lid portion 13, thereby facilitating the movement of the lid portion 13 and making it suitable for automatic movement of the lid portion 13. Furthermore, by configuring the weight portion 15" separately from the lid portion 13, the lid portion 13 can be made lighter by using a synthetic resin material compared to using the lid portion 13 itself as the weight, further facilitating the movement of the lid portion 13. Moreover, by using a synthetic resin material for the lid portion 13, for example, when the electronic equipment housing 10 is installed on a moving object such as a vehicle, the generation of rattle noise caused by the lid portion 13 hitting the wall portion 11 due to the movement and vibration of the vehicle can be suppressed.

[0061] Furthermore, the heat dissipation structure of the embodiment further includes retaining parts 16', 16'' that hold the lid 13 in its moved position.

[0062] This heat dissipation structure allows the lid 13 to maintain its position even when it is moved. For example, when the electronic equipment housing 10 is installed on a moving object such as a vehicle, it is possible to suppress the lid 13 from moving unintentionally due to the movement and vibration of the vehicle, and to suppress the generation of rattle noises when it hits the wall 11 or the like.

[0063] The guide portion 14 and the elongated hole 14c are shown as being along (parallel to) the edge of the wall portion 11, but they may also be inclined relative to the edge. In other words, as the lid portion 13 moves in the direction that closes the vent 12, if the space in the width direction of the guide portion 14 and the elongated hole 14c perpendicular to that direction expands, the weight of the weight portions 15 on the right and left sides of the vertically positioned wall portion 11 will cause the lid portion 13 to slide down the inclined portion relative to the edge, thereby closing the vent 12. [Explanation of symbols]

[0064] 10 Electronic equipment enclosures 11 Wall 12 Ventilation holes 13 Lid 14,14' Information section 15,15',15” Weight 16,16',16" Holding part

Claims

1. It is provided in an electronic device enclosure that is surrounded by multiple walls arranged in different directions, Multiple ventilation openings are arranged in the aforementioned wall, A lid portion is provided that is movable in such a manner as to open and close each of the aforementioned vents, A heat dissipation structure, including a heat dissipation structure.

2. A guide portion that allows the lid portion to slide along the wall portion, The weight portion is placed on the lid portion, Includes, The heat dissipation structure according to claim 1, wherein the lid portion is moved by the weight of the counterweight portion in the wall portion which is arranged upright.

3. The weight portion is configured to be fixed to the lid portion or to the lid portion. The heat dissipation structure according to claim 2.

4. The weight portion is configured separately from the lid portion and is arranged to be rotatable relative to the wall portion along the direction of movement of the lid portion. The heat dissipation structure according to claim 2.

5. The lid portion further includes a holding portion that holds the moved position, The heat dissipation structure according to any one of claims 1 to 4.

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