Method for manufacturing molds and molded products
A flexible sheet-like molding die with a cavity and protruding portion facilitates easy demolding of molded products, addressing the inefficiencies of large equipment in existing resin removal processes.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-13
- Publication Date
- 2026-03-26
AI Technical Summary
Existing molding processes require large equipment to remove cured resin products, leading to inefficiencies.
A flexible sheet-like molding die with a cavity and a protruding portion that communicates with the cavity, allowing for easy demolding using simple equipment.
Enables the demolding of molded products using simple equipment by leveraging the flexibility of the molding die, reducing the need for large-scale machinery.
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Figure 2026054185000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a molding die used for obtaining a molded product and a method for manufacturing a molded product obtained using this molding die.
Background Art
[0002] In recent years, in vehicles such as automobiles, an electronic control device for controlling the operating state of an electric motor or the operating state of vehicle-mounted components has come to be used. In such an electronic control device, in order to protect a circuit board or electronic components, etc., it is common to adopt a configuration in which the periphery of the circuit board or electronic components is covered with resin.
[0003] In such a situation, Patent Document 1 discloses a substrate on which a conductor pattern is formed, a solder bump for electrical check provided on the substrate and electrically connected to the conductor pattern, a plurality of surface-mounted electronic components and a microcomputer mounted on the substrate, and a waterproof connector provided with a plurality of terminals for electrically connecting to the outside and connected to the conductor pattern formed on the substrate, and an electronic control device configured by resin integrally sealing at least a part of the substrate, the solder bump, the plurality of surface-mounted electronic components, the microcomputer and the waterproof connector.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] However, in Patent Document 1, after the resin is cured, since the molded product is removed using an ejector mechanism that pushes out the molded product, there is a problem that the equipment becomes large-sized.
[0006] The present invention aims to provide a mold for releasing molded products using simple equipment, and a method for manufacturing molded products. [Means for solving the problem]
[0007] To achieve the above objectives, the present invention provides a flexible sheet-like molding die used to obtain a molded product, comprising a cavity for molding the molded product and a protruding portion that protrudes outward from the bottom of the cavity and has a space communicating with the cavity. [Effects of the Invention]
[0008] According to one aspect of the present invention, a flexible sheet-like molding die used to obtain a molded product has a cavity for molding the product and a protruding portion that protrudes outward from the bottom of the cavity and has a space that communicates with the cavity, so that the molded product can be demolded with simple equipment. [Brief explanation of the drawing]
[0009] [Figure 1] Figure 1 is a side view of a molding die according to an embodiment of the present invention. [Figure 2] Figure 2 is a plan view of a molding die according to an embodiment of the present invention. [Figure 3] Figure 3 is a cross-sectional view of AA in Figure 2. [Figure 4] Figure 4 is a partial bottom view of a mold for molding according to an embodiment of the present invention. [Figure 5] Figure 5 is a cross-sectional view of BB in Figure 4. [Figure 6] Figure 6 is a cross-sectional view illustrating the procedure for removing a molded product, formed by a mold according to an embodiment of the present invention, from the mold. [Figure 7] Figure 7 is a cross-sectional view of a molded product formed by a mold according to an embodiment of the present invention. [Modes for carrying out the invention]
[0010] Hereinafter, the molding die in the embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the drawings, the x, y, and z axes form a three-axis orthogonal coordinate system, with the positive y-axis being the forward direction, the negative y-axis being the backward direction, the positive x-axis being the rightward direction, the negative x-axis being the leftward direction, the positive z-axis being the upward direction, and the negative z-axis being the downward direction.
[0011] <Configuration of the molding die> The configuration of the molding die 1 according to the first embodiment of the present invention will be described in detail with reference to Figures 1 to 4.
[0012] The molding die 1 is integrally formed from a flexible and breakable soft sheet-like or plate-like member such as a synthetic resin material, and has a bottom portion 2, a right side wall portion 3, a left side wall portion 4, an inclined wall portion 5, a front wall portion 6, a rear wall portion 7, a cavity 8, an opening 9, and a protrusion 10. The bottom portion 2, the right side wall portion 3, the left side wall portion 4, the inclined wall portion 5, the front wall portion 6, and the rear wall portion 7 constitute the cavity 8.
[0013] The bottom section 2 has its longitudinal direction in the front-to-back direction and its short direction in the left-to-right direction. The bottom section 2 connects the lower end of the right side wall section 3, the lower end of the inclined wall section 5, the lower end of the front wall section 6, and the lower end of the rear wall section 7. The bottom section 2 constitutes the bottom of the cavity 8, which closes the lower end side of the cavity 8.
[0014] The bottom portion 2 includes a protruding portion 21 and a recessed portion 22.
[0015] The protruding portion 21 has a space S communicating with the cavity 8 and protrudes downward. The protruding portion 21 extends downward and is rod-shaped. The protruding portion 21 is provided at the central portion in the longitudinal direction and the central portion in the short-side direction of the bottom portion 2 when viewed from above, and is formed in a circular shape centered on the central portion in the longitudinal direction and the central portion in the short-side direction of the bottom portion 2 (see FIG. 2). Note that the protruding portion 21 is not limited to the configuration provided at the central portion in the longitudinal direction and the central portion in the short-side direction of the bottom portion 2, and may be provided at a position deviated from the central portion in the longitudinal direction and the central portion in the short-side direction of the bottom portion 2.
[0016] The recessed portion 22 is recessed in the upward direction opposite to the downward direction, which is the protruding direction of the protruding portion 21, around the protruding portion 21. The recessed portion 22 is formed in an annular shape when viewed from below.
[0017] The right side wall portion 3 connects the front end portion of the bottom portion 2, the right end portion of the front wall portion 6, and the right end portion of the rear wall portion 7. The right side wall portion 3 faces the left side wall portion 4. The right side wall portion 3 faces the cavity 8.
[0018] The left side wall portion 4 connects the upper end portion of the inclined wall portion 5, the left end portion of the front wall portion 6, and the left end portion of the rear wall portion 7. The left side wall portion 4 faces the right side wall portion 3. The left side wall portion 4 faces the cavity 8.
[0019] The inclined wall portion 5 connects the left end portion of the bottom portion 2, the lower end portion of the left side wall portion 4, the left end portion of the front wall portion 6, and the left end portion of the rear wall portion 7. The inclined wall portion 5 is inclined in a direction approaching the right side wall portion 3 downward from the lower end portion of the left side wall portion 4. The inclined wall portion 5 faces the cavity 8.
[0020] The front wall portion 6 connects the front end portion of the right side wall portion 3, the front end portion of the left side wall portion 4, and the front end portion of the bottom portion 2. The front wall portion 6 faces the rear wall portion 7. The front wall portion 6 faces the cavity 8.
[0021] The rear wall 7 connects the rear end of the right wall 3, the rear end of the left wall 4, and the rear end of the bottom 2. The rear wall 7 faces the front wall 6. The rear wall 7 faces the cavity 8.
[0022] Cavity 8 is a space enclosed by the bottom portion 2, the right side wall portion 3, the left side wall portion 4, the inclined wall portion 5, the front wall portion 6, and the rear wall portion 7. Cavity 8 is used to mold the electronic control device 100, which will be described later, as a molded product.
[0023] The opening 9 connects the upper side of the cavity 8 to the outside.
[0024] The protrusion 10 extends to the right from the upper end of the right side wall 3, increasing the thickness of the right side wall 3. The protrusion 10 is provided from the viewpoint of improving the strength of the right side wall 3 and improving the grip of the worker.
[0025] The mold 1 having the above configuration is a container-shaped member into which potting resin material is injected from the opening 9 into the cavity 8 and which can accommodate the potting resin material inside the cavity 8, and is used when manufacturing the electronic control device 100.
[0026] <Manufacturing method for electronic control devices> A method for manufacturing an electronic control device 100 using a molding die 1 according to an embodiment of the present invention will be described in detail with reference to Figures 1 to 7.
[0027] Here, the molded electronic control device 100 is a control device such as an ECU (Electronic Control Unit) that controls the operating state of a drive source such as an internal combustion engine or electric motor of a vehicle such as an automobile, and has a configuration in which a part of the device body C is protected by a potting resin body 200. Specifically, the device body C includes, as an example, a circuit board 101 having a conductive part (not shown), various electronic components 102a, 102b, 102c and 102d such as a CPU (Central Processing Unit), memory and capacitor mounted on the circuit board 101, and a connector 103 in which a pin terminal 103a that electrically connects the conductive part of the circuit board 101 to an external connection device (not shown) is surrounded by a mating part 103b. The circuit board 101, electronic components 102a, 102b, 102c and 102d, and a part of the pin terminal 103a of the device body C are protected by a potting resin body 200.
[0028] First, the device body C is positioned within the cavity 8 of the molding mold 1 so that it is located in a predetermined position within the cavity 8. Then, molten potting resin material is supplied from the opening 9 into the gaps between the device body C and each of the bottom 2, right side wall 3, left side wall 4, inclined wall 5, front wall 6, and rear wall 7, and filled by gravity. At this time, the molten potting resin material is filled into the cavity 8 to a predetermined height. The potting resin material is also filled into the space S of the protruding portion 21 via the cavity 8. As a result, the entire circuit board 101, electronic components 102a, 102b, 102c, and 102d are immersed in the potting resin material, while only a portion of the connector 103 on the circuit board 101 side is immersed in the potting resin material.
[0029] Next, after a predetermined time has elapsed under predetermined environmental conditions, the potting resin material filled in the gaps between the main body of the device C and each of the bottom 2, right side wall 3, left side wall 4, inclined wall 5, front wall 6, and rear wall 7 hardens, and as shown in Figure 7, the main body of the device C and the potting resin body 200 become one, resulting in an electronic control device 100 in which the main body of the device C is protected by the potting resin body 200.
[0030] Next, the protruding portion 21 is cut off together with the potting resin body 200 that has been filled into the space S of the protruding portion 21 and hardened, thereby forming a hole 211 in the bottom portion 2 that connects the cavity 8 to the outside. At this time, since the molding die 1 is a flexible, soft sheet-like material, the protruding portion 21 can be easily cut off.
[0031] Next, the tip of the air nozzle 300 is engaged with the recessed portion 22. By forming the recessed portion 22 in an annular shape that can engage with the tip of the air nozzle 300, the air nozzle 300 can be stably held in the recessed portion 22.
[0032] Next, with the mold 1 fixed by a fixing member (not shown), air is blown from the air outlet 301 of the air nozzle 300 in the direction of the arrow in Figure 6, pushing the hardened potting resin body 200 upward through the hole 211, thereby removing the electronic control device 100 from the mold 1. At this time, the shape of the potting resin body 200 is molded to match the shape of the cavity 8 of the mold 1. By forming the recessed portion 22 in an annular shape that can engage with the tip of the air nozzle 300, the air blown from the air outlet 301 of the air nozzle 300 can be supplied to the space S through the hole 211 without leaking to the outside. This makes it possible to easily remove the potting resin body 200 from the mold 1.
[0033] According to this embodiment, the molding mold 1 has a cavity 8 for molding the electronic control device 100, and a protruding portion 21 that protrudes outward from the bottom 2 of the cavity 8 and has a space S that communicates with the cavity 8. Therefore, the electronic control device 100 can be demolded using simple equipment.
[0034] The present invention is not limited to the above-described embodiments in terms of the type, shape, arrangement, number, etc. of the components, and it is of course possible to modify them as appropriate without departing from the spirit of the invention, such as by appropriately substituting the components with those that produce equivalent effects.
[0035] Specifically, in the above embodiment, the electronic control device 100 was removed from the molding mold 1 using an air nozzle 300. However, the method is not limited to this. Alternatively, the electronic control device 100 may be removed from the molding mold 1 by inserting a jig into the space S through the hole 211 and pressing the electronic control device 100 upward with the jig, or by supplying a liquid such as water into the cavity 8 through the hole 211 to remove the electronic control device 100 from the molding mold 1.
[0036] Furthermore, although the electronic control device 100 was molded using the molding mold 1 in this embodiment, the invention is not limited to this, and molded products other than the electronic control device 100 can be molded using the molding mold 1.
[0037] Furthermore, in this embodiment, the recessed portion 22 is formed in an annular shape when viewed from below, but it is not limited to this, and the recessed portion 22 can be formed in a shape other than an annular shape that can engage with the air nozzle 300 when viewed from below, depending on the shape of the air nozzle 300.
[0038] Furthermore, in this embodiment, the protruding portion 21 is formed in the shape of a rod extending downward, but it is not limited to this, and can be made into any shape and length as long as the protruding portion 21 can be cut off. [Industrial applicability]
[0039] As described above, the present invention allows for the release of molded products using simple equipment, and due to its general-purpose and universal nature, it is expected to be widely applicable to molds for obtaining molded products such as electronic control devices and to methods for manufacturing molded products. [Explanation of Symbols]
[0040] 1…Mold for molding 2…Bottom 3...Right side wall 4...Left side wall 5…Slanted wall part 6...Front wall part 7...Rear wall part 8... Cavity 9…Opening 10…Convex part 21...Protrusion 22…Recessed section 100... Electronic control unit 200...potting resin 211...hole
Claims
1. A flexible sheet-like molding die used to obtain molded products, A cavity for molding the aforementioned molded product, A protruding portion that extends outward from the bottom of the cavity and has a space that communicates with the cavity, A molding die characterized by having [a certain feature].
2. The bottom portion includes a recessed portion formed around the protruding portion in the direction opposite to the direction of protrusion of the protruding portion. The molding die according to claim 1, characterized in that it is a molding die.
3. The recessed portion is, Formed in a ring shape, The molding die according to claim 2, characterized in that it is a molding die.
4. The aforementioned protrusion is It extends in the direction of projection. A molding die according to any one of claims 1 to 3.
5. A method for manufacturing molded products using a molding die, A first step of supplying a liquid material to the cavity for molding the molded product of the molding mold, A second step of curing the material supplied to the cavity in the first step, A third step involves removing the material hardened in the second step from the molding die, It has, The aforementioned molding die is It has a protruding portion that extends outward from the bottom of the cavity and has a space that communicates with the cavity, The third step described above is: A cutting step in which the protruding portion is removed to form a hole in the bottom portion that allows the cavity to communicate with the outside, A removal step is performed in which the material hardened in the second step is pushed out in the opposite direction to the protruding direction of the protruding portion through the hole formed in the excision step to remove the material from the molding die, Equipped with, A method for manufacturing molded articles characterized by the following.
Citation Information
Patent Citations
Electronic controller
JP2008181989A