Method for manufacturing molds and molded products

Abstract

The present invention provides a molding die and a method for manufacturing a molded product that can prevent cracking or chipping of the upper edge portion of the molded product. [Solution] The molding die 1 used to obtain the electronic control device 100 has a cavity 8 for molding the electronic control device 100 and a protruding portion 32 that faces the cavity 8 and is directed toward the bottom 2 of the cavity 8.

Description

Technical Field

[0001] The present invention relates to a molding die used to obtain a molded product and a method for manufacturing a molded product obtained using this molding die.

Background Art

[0002] In recent years, in vehicles such as automobiles, an electronic control device for controlling the operating state of an electric motor or the operating state of vehicle-mounted components has come to be used. In such an electronic control device, in order to protect a circuit board or electronic components, etc., it is common to adopt a configuration in which the periphery of the circuit board or electronic components, etc. is covered with resin.

[0003] In such a situation, Patent Document 1 discloses, in a conventional example, a method for manufacturing an electronic circuit block in which a part of a substrate is inserted into a resin receiving container, resin is poured into the resin receiving container from an upper opening, and the resin is injected so that the liquid surface of the resin reaches a position for sealing the electronic components mounted on the substrate, and after the resin is solidified or cured, the electronic circuit block is removed from the resin receiving container.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in Patent Document 1, since an edge portion is formed outside the upper end portion of the molded product, there is a problem that the edge portion cracks or chips during mold release or the like. In particular, when an edge portion having an acute angle is formed outside the upper end portion of the molded product, the above problem becomes prominent.

[0006] The present invention aims to provide a molding die and a method for manufacturing a molded product that can suppress cracking or chipping of the edge portion at the upper end of the molded product. [Means for solving the problem]

[0007] To achieve the above objectives, the present invention provides a molding die used to obtain a molded product, wherein the mold has a cavity for molding the molded product and a first wall portion that faces the cavity and faces the bottom of the cavity. [Effects of the Invention]

[0008] According to one aspect of the present invention, a molding die used to obtain a molded product has a cavity for molding the product and a first wall portion that faces the cavity and is directed toward the bottom of the cavity, thereby preventing the edge portion of the upper end of the molded product from cracking or chipping. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a side view of a molding die according to the first embodiment of the present invention. [Figure 2] Figure 2 is a plan view of a molding die according to the first embodiment of the present invention. [Figure 3] Figure 3 is a cross-sectional view of AA in Figure 2. [Figure 4] Figure 4 is a cross-sectional view of a molded product formed by a molding die according to the first embodiment of the present invention. [Figure 5] Figure 5 is a cross-sectional view of a part of a molded product formed by a molding die according to the first embodiment of the present invention. [Figure 6] Figure 6 is a cross-sectional view of a molding die according to a second embodiment of the present invention. [Figure 7] Figure 7 is a cross-sectional view of a part of a molded product formed by a mold according to a second embodiment of the present invention. [Figure 8] Figure 8 is a partial cross-sectional view of a mold for molding according to a third embodiment of the present invention. [Figure 9] Figure 9 is a cross-sectional view of a part of a molded product formed by a mold according to the third embodiment of the present invention. [Modes for carrying out the invention]

[0010] Hereinafter, the molding die in the embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the drawings, the x, y, and z axes form a three-axis orthogonal coordinate system, with the positive y-axis being the forward direction, the negative y-axis being the backward direction, the positive x-axis being the rightward direction, the negative x-axis being the leftward direction, the positive z-axis being the upward direction, and the negative z-axis being the downward direction.

[0011] (First embodiment) <Configuration of the molding die> The configuration of the molding die 1 according to the first embodiment of the present invention will be described in detail with reference to Figures 1 to 3.

[0012] The molding die 1 is integrally formed from a flexible and breakable sheet-like or plate-like member such as a synthetic resin material, and has a bottom portion 2, a right side wall portion 3, a left side wall portion 4, an inclined wall portion 5, a front wall portion 6, a rear wall portion 7, a cavity 8, an opening 9, a protrusion 10, a row of recesses 31, and an overhang 32. The bottom portion 2, the right side wall portion 3, the left side wall portion 4, the inclined wall portion 5, the front wall portion 6, and the rear wall portion 7 constitute the cavity 8.

[0013] The bottom section 2 has its longitudinal direction in the front-to-back direction and its short direction in the left-to-right direction. The bottom section 2 connects the lower end of the right side wall section 3, the lower end of the inclined wall section 5, the lower end of the front wall section 6, and the lower end of the rear wall section 7. The bottom section 2 constitutes the bottom of the cavity 8, which closes the lower end side of the cavity 8.

[0014] The right side wall section 3 connects the front end of the bottom section 2, the right end of the front wall section 6, and the right end of the rear wall section 7. The right side wall section 3 is connected to the bottom section 2 side relative to the overhang section 32. The right side wall section 3 faces the left side wall section 4. The right side wall section 3 faces the cavity 8.

[0015] The left side wall portion 4 connects the upper end portion of the inclined wall portion 5, the left end portion of the front wall portion 6, and the left end portion of the rear wall portion 7. The left side wall portion 4 is continuous with the bottom portion 2 side with respect to the protruding portion 32. The left side wall portion 4 faces the right side wall portion 3. The left side wall portion 4 faces the cavity 8.

[0016] The inclined wall portion 5 connects the left end portion of the bottom portion 2, the lower end portion of the left side wall portion 4, the left end portion of the front wall portion 6, and the left end portion of the rear wall portion 7. The inclined wall portion 5 is inclined in a direction approaching the right side wall portion 3 downward from the lower end portion of the left side wall portion 4. The inclined wall portion 5 faces the cavity 8.

[0017] The front wall portion 6 connects the front end portion of the right side wall portion 3, the front end portion of the left side wall portion 4, and the front end portion of the bottom portion 2. The front wall portion 6 is continuous with the bottom portion 2 side with respect to the protruding portion 32. The front wall portion 6 faces the rear wall portion 7. The front wall portion 6 faces the cavity 8.

[0018] The rear wall portion 7 connects the rear end portion of the right side wall portion 3, the rear end portion of the left side wall portion 4, and the rear end portion of the bottom portion 2. The rear wall portion 7 is continuous with the bottom portion 2 side with respect to the protruding portion 32. The rear wall portion 7 faces the front wall portion 6. The rear wall portion 7 faces the cavity 8.

[0019] The cavity 8 is a space surrounded by the bottom portion 2, the right side wall portion 3, the left side wall portion 4, the inclined wall portion 5, the front wall portion 6, and the rear wall portion 7. The cavity 8 molds the electronic control device 100 described later as a molded product.

[0020] The opening 9 communicates the upper side of the cavity 8 to the outside.

[0021] The convex portion 10 protrudes rightward from the upper end portion of the right side wall portion 3 to thicken the right side wall portion 3. The convex portion 10 is provided from the viewpoints of improving the strength of the right side wall portion 3 and improving the gripping property of the operator.

[0022] The recessed row 31 is formed continuously from the lower end of the right side wall 3, through the upper end of the right side wall 3, to the right end of the protrusion 10. The recessed row 31 is formed in pairs with a gap between them in the front and back. Note that the recessed row 31 is not limited to being formed in pairs; one or three or more may be formed.

[0023] The protruding portion 32, which serves as a wall or first wall, is bent inward from the upper ends of each of the right wall portion 3, left wall portion 4, front wall portion 6, and rear wall portion 7 at an angle of approximately 90 degrees relative to each of the right wall portion 3, left wall portion 4, front wall portion 6, and rear wall portion 7, protruding into the cavity 8 and facing the cavity 8. The protruding portion 32 is provided along the opening 9.

[0024] The mold 1 having the above configuration is a container-shaped member into which molten potting resin material is injected from the opening 9 into the cavity 8, and which can accommodate the potting resin material inside the cavity 8. It is used when manufacturing the electronic control device 100.

[0025] <Manufacturing method for electronic control devices> A method for manufacturing an electronic control device 100 using a molding die 1 according to the first embodiment of the present invention will be described in detail with reference to Figures 1 to 5.

[0026] Here, the molded electronic control device 100 is a control device such as an ECU (Electronic Control Unit) that controls the operating state of a drive source such as an internal combustion engine or electric motor of a vehicle such as an automobile, and has a configuration in which a part of the device body C is protected by a potting resin body 200. Specifically, the device body C includes, as an example, a circuit board 101 having a conductive part (not shown), various electronic components 102a, 102b, 102c and 102d such as a CPU (Central Processing Unit), memory and capacitor mounted on the circuit board 101, and a connector 103 in which a pin terminal 103a that electrically connects the conductive part of the circuit board 101 to an external connection device (not shown) is surrounded by a mating part 103b. The circuit board 101, electronic components 102a, 102b, 102c and 102d, and a part of the pin terminal 103a of the device body C are protected by a potting resin body 200.

[0027] First, the device body C is positioned in a predetermined location within the cavity 8 of the molding mold 1. Then, molten potting resin material, in liquid form, is supplied from the opening 9 into the gaps between the device body C and each of the bottom 2, right side wall 3, left side wall 4, inclined wall 5, front wall 6, and rear wall 7, until the protruding portion 32 is submerged in the molten potting resin material, and the gaps are filled by gravity. Here, the position where the protruding portion 32 is submerged in the molten potting resin material is above the lower end of the protruding portion 32. As a result, the entire circuit board 101, electronic components 102a, 102b, 102c, and 102d are submerged in the potting resin material, while only a portion of the connector 103 on the circuit board 101 side is submerged in the potting resin material.

[0028] Next, after a predetermined time has elapsed under predetermined environmental conditions, the potting resin material filled in the gaps between the main body of the device C and each of the bottom 2, right side wall 3, left side wall 4, inclined wall 5, front wall 6, and rear wall 7 hardens, and as shown in Figure 4, the main body of the device C and the potting resin body 200 become one, resulting in an electronic control device 100 in which the main body of the device C is protected by the potting resin body 200.

[0029] Next, for example, an external force is applied to the right side wall 3 such that a tensile force acting in the front-rear direction and a tensile force acting in the left-right direction are applied, and the row of recesses 31 is pulled in the front-rear direction, concentrating stress in the row of recesses 31. As a result, the right side wall 3 breaks starting from the row of recesses 31, and the molding mold 1 is split, so the electronic control device 100 can be removed from the molding mold 1. At this time, the shape of the potting resin body 200 is molded to match the shape of the cavity 8 of the molding mold 1.

[0030] In the manufacturing method of the electronic control device 100 described above, since the molding mold 1 is a flexible sheet-like material, the structure of the molding mold 1 can be simplified, and the electronic control device 100 can be easily released from the molding mold 1. Furthermore, since the molding mold 1 is integrally formed, the electronic control device 100 can be easily released from the molding mold 1.

[0031] Furthermore, in the electronic control device 100, by providing the protruding portion 32 on the molding die 1, the outer edge portion of the upper end portion 200a of the potting resin body 200 can be recessed, as shown in Figure 5, thereby suppressing cracking or chipping of the edge portion of the upper end portion 200a of the potting resin body 200. Also, by providing the protruding portion 32 along the opening 9, the outer edge portion of the upper end portion 200a of the potting resin body 200 along the opening 9 can be recessed.

[0032] According to the molding die 1 of this embodiment, since it has a cavity 8 for molding the electronic control device 100 and a protruding portion 32 that faces the cavity 8 and faces the bottom portion 2 of the cavity 8, it is possible to suppress cracking or chipping of the edge portion of the upper end portion 200a of the electronic control device 100.

[0033] In this embodiment, the electronic control device 100 was molded using the molding mold 1, but the invention is not limited to this, and molded products other than the electronic control device 100 can be molded using the molding mold 1.

[0034] (Embodiment 2) <Configuration of the molding die> The configuration of the molding die 51 according to the second embodiment of the present invention will be described in detail with reference to Figure 6.

[0035] In Figure 6, parts that have the same configuration as those in Figure 3 are denoted by the same reference numerals, and their descriptions are omitted. Furthermore, in the configuration of the molding die 51 according to this embodiment, parts that have the same configuration as those in the molding die 1 are described using the same reference numerals, and their illustration and detailed description are omitted.

[0036] The molding die 51 is integrally formed from a flexible and breakable sheet-like or plate-like member such as a synthetic resin material, and has a bottom portion 2, a right side wall portion 3, a left side wall portion 4, an inclined wall portion 5, a front wall portion 6, a rear wall portion 7, a cavity 8, an opening 9, a protrusion 10, a row of recesses 31, and an overhang 33.

[0037] The protruding portion 33, which serves as the first wall, is provided along the opening 9. The protruding portion 33 extends into the cavity 8 from the upper ends of the right wall portion 3, the left wall portion 4, the front wall portion 6, and the rear wall portion 7, and faces the cavity 8. The protruding portion 33 is inclined toward the inside of the cavity 8, away from the bottom 2. The protruding portion 33 is inclined toward the right wall portion 3, the left wall portion 4, the front wall portion 6, and the rear wall portion 7, which serve as the second wall portion. Each of the right wall portion 3, the left wall portion 4, the front wall portion 6, and the rear wall portion 7 is connected to the bottom 2 side relative to the protruding portion 33.

[0038] The molding die 51 having the above configuration is a container-shaped member that can accommodate potting resin material inside the cavity 8 by injecting molten potting resin material into the cavity 8 from the opening 9, and is used when manufacturing the electronic control device 100.

[0039] <Manufacturing method for electronic control devices> A method for manufacturing an electronic control device 100 using a molding die 51 according to a second embodiment of the present invention will be described in detail with reference to Figures 6 and 7.

[0040] After positioning the device body C in a predetermined location within the cavity 8 of the molding die 51, molten potting resin material is supplied from the opening 9 into the gaps between the device body C and each of the bottom 2, right side wall 3, left side wall 4, inclined wall 5, front wall 6, and rear wall 7, until the protruding portion 33 is submerged in the molten potting resin material, and then filled by gravity. Here, the position where the protruding portion 33 is submerged in the molten potting resin material is above the lower end of the protruding portion 33. As a result, the entire circuit board 101, electronic components 102a, 102b, 102c, and 102d are submerged in the potting resin material, while only a portion of the connector 103 on the circuit board 101 side is submerged in the potting resin material.

[0041] At this time, the molten potting resin rises as it fills the cavity 8 and reaches the protruding portion 33, and then moves along the protruding portion 33 to the inside of the cavity 8. The potting resin that has moved to the inside of the cavity 8 is held in place at the end of the protruding portion 33 in the protruding direction by surface tension. As the potting resin that has filled the cavity 8 in this way hardens, an edge portion E2 is formed on the inside of the potting resin body 200.

[0042] Furthermore, the manufacturing methods of the electronic control device 100 using the molding die 51 according to this embodiment, other than those described above, are the same as the manufacturing methods of the electronic control device 100 using the molding die 1, so their explanation will be omitted.

[0043] In the electronic control device 100 manufactured using the molding die 51 according to this embodiment, by providing a protruding portion 33 along the opening 9, the outer edge portion of the upper end 200a of the potting resin body 200 along the opening 9 can be recessed. Furthermore, by inclining the protruding portion 33 with respect to each of the right wall portion 3, left wall portion 4, front wall portion 6, and rear wall portion 7, and by inclining the protruding portion 33 toward the inside of the cavity 8 away from the bottom portion 2, the angle α1 of the edge portion E1 and the angle α2 of the edge portion E2 on the upper end 200a side of the potting resin body 200 can be made obtuse, thereby suppressing cracking or chipping of the edge portions E1 and E2 of the potting resin body 200. In addition, the direction of burr generation can be controlled by the protruding portion 33, allowing burrs to be formed on the inner edge portion E2 of the potting resin body 200. Furthermore, by suppressing the formation of burrs that protrude outward from the potting resin body 200, the process of removing burrs from the electronic control device 100 can be eliminated. Furthermore, by controlling the direction of burr formation with the protruding portion 33, it is possible to prevent the burrs formed on the edge portion E2 from becoming thin and needle-shaped.

[0044] With the molding die 51 according to this embodiment, the protruding portion 33 is inclined toward the inside of the cavity 8 and away from the bottom portion 2. Therefore, in addition to the effects of the first embodiment described above, it is possible to suppress the formation of burrs that protrude outward from the potting resin body 200.

[0045] Furthermore, although the electronic control device 100 was molded using the molding die 51 in this embodiment, the invention is not limited to this, and molded products other than the electronic control device 100 can be molded using the molding die 51.

[0046] (Embodiment 3) <Configuration of the molding die> The configuration of the molding die 61 according to the third embodiment of the present invention will be described in detail with reference to Figures 8 and 9.

[0047] In Figure 8, parts that have the same configuration as those in Figure 3 are denoted by the same reference numerals, and their descriptions are omitted. Furthermore, in the configuration of the molding die 61 according to this embodiment, parts that have the same configuration as those in the molding die 1 are described using the same reference numerals, and their illustration and description are omitted.

[0048] The molding die 61 is integrally formed from a flexible and breakable sheet-like or plate-like member such as a synthetic resin material, and has a bottom portion 2, an inclined wall portion 5, a front wall portion 6, a rear wall portion 7, a cavity 8, an opening 9, a protrusion 10, a row of recesses 31, an overhang 34, a right side wall portion 62, and a left side wall portion 63.

[0049] The bottom section 2 connects the lower end of the right side wall section 62, the lower end of the inclined wall section 5, the lower end of the front wall section 6, and the lower end of the rear wall section 7.

[0050] The right side wall 62 connects the front end of the bottom 2, the right end of the front wall 6, and the right end of the rear wall 7. The right side wall 62 is inclined downwards towards the left side wall 63.

[0051] The left side wall section 63 connects the upper end of the inclined wall section 5, the left end of the front wall section 6, and the left end of the rear wall section 7. The left side wall section 63 is inclined downwards so as to approach the right side wall section 62.

[0052] The inclined wall section 5 connects the left end of the bottom section 2, the lower end of the left side wall section 63, the left end of the front wall section 6, and the left end of the rear wall section 7. The inclined wall section 5 slopes downward from the lower end of the left side wall section 63 toward the right side wall section 62.

[0053] The front wall section 6 connects the front end of the right wall section 62, the front end of the left wall section 63, and the front end of the bottom section 2.

[0054] The rear wall section 7 connects the rear end of the right wall section 62, the rear end of the left wall section 63, and the rear end of the bottom section 2.

[0055] Cavity 8 is a space enclosed by the bottom 2, the right side wall 62, the left side wall 63, the inclined wall 5, the front wall 6, and the rear wall 7.

[0056] The protrusion 10 extends to the right from the upper end of the right side wall 62, increasing the thickness of the right side wall 62. The protrusion 10 is provided from the viewpoint of improving the strength of the right side wall 62 and improving the grip of the worker.

[0057] The row of recesses 31 is formed continuously from the lower end of the right side wall portion 62, through the upper end of the right side wall portion 62, to the right end of the protrusion 10.

[0058] The protruding portion 34, which serves as the first wall, is provided along the opening 9. The protruding portion 34 extends into the cavity 8 from the upper ends of the right wall portion 62, the left wall portion 63, the front wall portion 6, and the rear wall portion 7, and faces the cavity 8. The protruding portion 34 is inclined toward the inside of the cavity 8, away from the bottom 2. The protruding portion 34 is inclined toward the right wall portion 62, the left wall portion 63, the front wall portion 6, and the rear wall portion 7, which serve as the second wall portion. The right wall portion 62, the left wall portion 63, the front wall portion 6, and the rear wall portion 7 are each connected to the bottom 2 side relative to the protruding portion 34.

[0059] <Manufacturing method for electronic control devices> A method for manufacturing an electronic control device 100 using a molding die 61 according to a third embodiment of the present invention will be described in detail with reference to Figures 8 and 9.

[0060] After positioning the device body C in a predetermined location within the cavity 8 of the molding die 61, molten potting resin material is supplied from the opening 9 into the gaps between the device body C and each of the bottom 2, right side wall 62, left side wall 63, inclined wall 5, front wall 6, and rear wall 7, until the protruding portion 34 is submerged in the molten potting resin material, and then filled by gravity. Here, the position where the protruding portion 34 is submerged in the molten potting resin material is above the lower end of the protruding portion 34. As a result, the entire circuit board 101, electronic components 102a, 102b, 102c, and 102d are submerged in the potting resin material, while only a portion of the connector 103 on the circuit board 101 side is submerged in the potting resin material.

[0061] At this time, the molten potting resin rises as it fills the cavity 8 and reaches the protruding portion 34, and then moves along the protruding portion 34 to the inside of the cavity 8. The potting resin that has moved to the inside of the cavity 8 is held in place at the end of the protruding portion 34 in the protruding direction by surface tension. As the potting resin that has filled the cavity 8 in this way hardens, an edge portion E4 is formed on the inside of the potting resin body 200.

[0062] Furthermore, the manufacturing methods of the electronic control device 100 using the molding die 61 according to this embodiment, other than those described above, are the same as the manufacturing methods of the electronic control device 100 using the molding die 1, so their explanation will be omitted.

[0063] In the electronic control device 100 manufactured using the molding die 61 according to this embodiment, by providing a protruding portion 33 along the opening 9, the outer edge portion of the upper end 200a of the potting resin body 200 along the opening 9 can be recessed. Furthermore, by inclining the protruding portion 34 with respect to each of the right wall portion 62, left wall portion 63, front wall portion 6, and rear wall portion 7, and by inclining the protruding portion 34 toward the inside of the cavity 8 away from the bottom portion 2, the angle α3 of the edge portion E3 and the angle α4 of the edge portion E4 on the upper end 200a side of the potting resin body 200 can be made obtuse, thereby suppressing cracking or chipping of the edge portions E3 and E4 of the potting resin body 200. In addition, the direction of burr generation can be controlled by the protruding portion 34, allowing burrs to be formed on the inner edge portion E4 of the potting resin body 200. Furthermore, by suppressing the formation of burrs that protrude outward from the potting resin body 200, the process of removing burrs from the electronic control device 100 can be eliminated. Furthermore, by controlling the direction of burr generation with the protruding portion 34, it is possible to prevent the burrs formed on the edge portion E4 from becoming thin and needle-shaped. In particular, in the electronic control device 100 molded by the molding die 61, the sharp-angled edge portion of the upper end portion 200a of the potting resin body 200 that would be formed if the protruding portion 34 were not provided can be eliminated, thus reliably preventing the sharp-angled edge portion of the potting resin body 200 from cracking or chipping.

[0064] Furthermore, although the electronic control device 100 was molded using the molding die 61 in this embodiment, the invention is not limited to this, and molded products other than the electronic control device 100 can be molded using the molding die 61.

[0065] The present invention is not limited to the embodiments described above in terms of the type, shape, arrangement, number, etc. of the components, and it is of course possible to modify them as appropriate without departing from the spirit of the invention, such as by appropriately substituting the components with those that produce equivalent effects. [Industrial applicability]

[0066] As described above, the present invention can suppress cracking or chipping of the edge portion at the upper end of a molded product, and due to its general-purpose and universal nature, it is expected to be widely applicable to molds for obtaining molded products such as electronic control devices and to methods for manufacturing molded products. [Explanation of symbols]

[0067] 1…Mold for molding 2…Bottom 3...Right side wall 4...Left side wall 5…Slanted wall part 6...Front wall part 7...Rear wall part 8... Cavity 9…Opening 10…Convex part 31…Recessed row 32...Protruding part 33...Protruding part 34...Protruding part 51…Molding mold 61...Molding mold 62...Right side wall 63...Left side wall 100... Electronic control unit 200...potting resin

Claims

1. A mold used to obtain a molded product, A cavity for molding the aforementioned molded product, A first wall portion facing the cavity and facing the bottom of the cavity, A molding die characterized by having [a certain feature].

2. It has a second wall portion that faces the cavity and is connected to the bottom side with respect to the first wall portion, The first wall portion is, It is inclined with respect to the second wall and is inclined toward the inside of the cavity, away from the bottom. The molding die according to claim 1, characterized in that it is a molding die.

3. The cavity has an opening that communicates with the outside, The first wall portion is, Provided along the aforementioned opening, The molding die according to claim 1, characterized in that it is a molding die.

4. The aforementioned molding die is It is formed from a flexible sheet-like member. The molding die according to claim 1, characterized in that it is a molding die.

5. The aforementioned molding die is Formed as one, A molding die according to any one of claims 1 to 4.

6. A method for manufacturing molded products using a molding die, A first step of supplying a liquid material to the cavity for molding the molded product of the molding mold, A second step of curing the liquid material supplied to the cavity in the first step, It has, The aforementioned molding die is It comprises a wall portion that faces the cavity and is directed toward the bottom of the cavity, The first step described above is, The liquid material is supplied until the wall portion is immersed in the liquid material. A method for manufacturing molded articles characterized by the following.

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