Method for manufacturing filaments and resin molded products, and method for material recycling thermosetting polymers.

Abstract

To provide a method for manufacturing filaments and resin molded products that can recycle recovered thermosetting polymers, and a method for material recycling thermosetting polymers. [Solution] The filament for 3D modeling comprises a thermoplastic polymer and a filler containing a reusable thermosetting polymer. The mass ratio of the thermoplastic polymer in the filament is 50% by mass or more. The mass ratio of the filler in the filament is greater than 0% by mass and 50% by mass or less.

Description

Technical Field

[0001] The present disclosure relates to a filament, a method for manufacturing a resin molded product, and a material recycling method for a thermosetting polymer.

Background Art

[0002] Technologies for manufacturing recycled resin compositions using resin waste materials are disclosed in Patent Documents 1 to 3. In the technology described in Patent Document 1, a fishing net is cited as the resin waste material. In the technology described in Patent Document 2, a plastic packaging material is cited as the resin waste material. In the technology described in Patent Document 3, an engineering plastic is cited as the resin waste material.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] Windings such as enameled wires include a conductor and an insulator that coats the conductor. The insulator contains a thermosetting polymer. It is desirable to recycle the thermosetting polymer recovered from the insulator of the winding or the like. In one aspect of the present disclosure, it is preferable to provide a filament capable of recycling the recovered thermosetting polymer, a method for manufacturing a resin molded product, and a material recycling method for a thermosetting polymer.

Means for Solving the Problems

[0005] (1) One aspect of the present disclosure is a filament for three-dimensional printing. The filament comprises a thermoplastic polymer and a filler containing a reusable thermosetting polymer. The mass ratio of the thermoplastic polymer in the filament is 50% by mass or more. The mass ratio of the filler in the filament is greater than 0% by mass and 50% by mass or less.

[0006] One aspect of this disclosure, the filament, includes a reusable thermosetting polymer. The recovered thermosetting polymer can be made into a reusable thermosetting polymer. Therefore, by manufacturing the filament, one aspect of this disclosure, the recovered thermosetting polymer can be recycled.

[0007] (2) Another aspect of the present disclosure is a method for manufacturing a resin molded product by three-dimensional molding using a filament. The filament comprises a thermoplastic polymer and a filler containing a reusable thermosetting polymer. The mass ratio of the thermoplastic polymer in the filament is 50% by mass or more. The mass ratio of the filler in the filament is greater than 0% by mass and 50% by mass or less.

[0008] According to another aspect of this disclosure, the method for manufacturing resin molded articles, the recovered thermosetting polymer can be recycled by using the recovered thermosetting polymer as a reusable thermosetting polymer.

[0009] (3) Another aspect of the present disclosure is a method for material recycling of thermosetting polymers. In this method for material recycling of thermosetting polymers, powder of an insulator is obtained from a winding comprising a conductor and an insulator containing a thermosetting polymer covering the conductor. The powder is kneaded with a thermoplastic polymer to produce a compound. A filament for three-dimensional molding is manufactured by extruding the compound.

[0010] According to another aspect of this disclosure, a method for material recycling thermosetting polymers, thermosetting polymers recovered from windings can be recycled. [Brief explanation of the drawing]

[0011] [Figure 1] This is an explanatory diagram showing the configuration of the enameled wire and the stripping system. [Figure 2] Figures 2(a) and 2(b) are explanatory diagrams illustrating the compression process, respectively. [Figure 3] Figure 3(a) is a photograph showing the enameled wire after one press. Figure 3(b) is a photograph showing the enameled wire after two presses. Figure 3(c) is a photograph showing the enameled wire after two presses and then a cut in the insulator with a blade. [Figure 4] Figure 4(a) is a photograph showing a cross-section of the enameled wire before compression processing. Figure 4(b) is a photograph showing a cross-section of the enameled wire after compression processing and further cutting of the insulator with a blade. [Figure 5] This is an explanatory diagram illustrating the rolling process. [Figure 6] This is a perspective view showing the configuration of the removal device. [Figure 7] This graph shows the relationship between processing conditions in the peeling process and the ease with which the insulator peels off. [Figure 8] This is a cross-sectional view showing the structure of the filament. [Modes for carrying out the invention]

[0012] Exemplary embodiments of this disclosure will be described with reference to the drawings. <First Embodiment> 1. Method for manufacturing filaments (1-1) Peeling off of insulator 22 Prepare the enameled wire 2 shown in FIG. 1. The enameled wire 2 corresponds to the winding. The enameled wire 2 is, for example, an electric wire used in a motor for a vehicle, a transformer, an induction heating coil, or the like. The enameled wire 2 may be a round wire having a circular cross section, or may be a flat wire having a rectangular cross section. The cross section is a cross section perpendicular to the longitudinal direction of the enameled wire 2. Further, the cross-sectional shape of the enameled wire 2 is not particularly limited, and may be, for example, an elliptical shape or a triangular shape.

[0013] The enameled wire 2 includes a conductor 21 made of copper or a copper alloy, and an insulator 22 that coats the conductor 21. The insulator 22 is formed by applying an enamel paint around the conductor 21 and baking it. The insulator 22 contains a thermosetting polymer. The thermosetting polymer contained in the insulator 22 is, for example, polyimide, polyamideimide, polyester, polyurethane, polyesterimide, or a combination of two or more of them.

[0014] The thermosetting polymer contained in the insulator 22 is preferably polyimide, polyamideimide, or a combination of them. Polyimide and polyamideimide have a high heat resistance temperature and a high tensile strength. In addition, since polyimide and polyamideimide have a high polarity, they are easily compatible with thermoplastic polymers. In the enameled wire 2, it is known that the adhesion of the insulator 22 to the conductor 21 is high. Therefore, conventionally, it has been difficult to peel the insulator 22 from the conductor 21.

[0015] Prepare the peeling system 1 shown in FIG. 1. The peeling system 1 has a function of peeling the insulator 22 from the conductor 21 of the enameled wire 2. The peeling system 1 includes a peeling device 3 and a removing device 4 described below.

[0016] (Peeling device 3) The peeling device 3 is a device that performs a peeling process. The peeling process is a process of applying compression processing (for example, pressing) or rolling processing to the enameled wire 2 to peel the insulator 22 from the conductor 21. [[ID=!9]]

[0017] <000009!5>Figs. 2(a) and 2(b) are diagrams for explaining compression processing (e.g., press working). When performing compression processing with the peeling device 3, the peeling device 3 includes a press machine 31 for performing compression processing. Compression processing is a process of pressing and crushing the enameled wire 2 in a direction perpendicular to the longitudinal direction of the enameled wire 2. The pressing direction is hereinafter referred to as the press direction. It is preferable to move the enameled wire 2 along the longitudinal direction and continuously perform compression processing along the longitudinal direction of the enameled wire 2.

[0018] In this embodiment, a rectangular wire is used as the enameled wire 2. In the peeling process, compression processing is performed by pressing in the minor axis direction of the enameled wire 2. The minor axis direction of the enameled wire 2 is a direction perpendicular to the longitudinal direction of the enameled wire 2 and parallel to the short side in the cross section of the enameled wire 2. When performing compression processing, as shown in Fig. 2(a), by arranging a gauge block 311 between the press machines 31, the enameled wire 2 is formed to have the same thickness as the gauge block 311.

[0019] By performing compression processing, as shown in Fig. 2(b), the enameled wire 2 is deformed so as to be expanded in a direction perpendicular to the press direction, and compressive stress acts in the press direction. In this embodiment, the press direction is the minor axis direction of the enameled wire 2.

[0020] Further, tensile stress acts in the major axis direction of the enameled wire 2, and the enameled wire 2 is stretched in the major axis direction of the enameled wire 2. The major axis direction of the enameled wire 2 is a direction perpendicular to the longitudinal direction of the enameled wire 2 and parallel to the long side in the cross section of the enameled wire 2. The major axis direction of the enameled wire 2 is perpendicular to the minor axis direction of the enameled wire 2.

[0021] When performing compression processing, due to the difference in the ease of elongation between the conductor 21 and the insulator 22, shear stress is generated at the interface between the conductor 21 and the insulator 22. As a result, partial peeling occurs between the conductor 21 and the insulator 22. The surface where peeling occurs is the surface where compressive stress acts.

[0022] Multiple pressing operations may be performed at any point along the longitudinal direction of the enameled wire 2. Performing multiple pressing operations makes it easier for partial delamination to occur between the conductor 21 and the insulator 22. Alternatively, the entire longitudinal direction of the enameled wire 2 can be sequentially pressed by alternating between pressing and running the enameled wire 2.

[0023] Figures 3(a) to 3(c) are photographs showing examples of enameled wire 2 after compression processing. Figure 3(a) is a photograph after one press. Figure 3(b) is a photograph after two presses. Figure 3(c) is a photograph after two presses, when a cut 22a is made in the insulator 22 with the blade 41.

[0024] Figure 4(a) is a photograph showing a cross-section of the enameled wire 2 before compression processing. Figure 4(b) is a photograph showing a cross-section of the enameled wire 2 after compression processing and further cutting of the insulator 22a with the blade 41. As shown in Figures 3(a) to 3(c) and Figures 4(a) to 4(b), it was confirmed that the insulator 22 is separated from the conductor 21 by compression processing. The optimal processing conditions for compression processing will be described later.

[0025] Figure 5 is a diagram illustrating the rolling process. When rolling is performed in the peeling process, the peeling device 3 is equipped with a rolling mill 32 for performing the rolling process. The rolling mill 32 compresses and stretches the enameled wire 2 by passing it between two rollers 321.

[0026] In the rolling mill 32, the two rollers 321 rotate independently. The direction of rotation of the rollers 321 is such that, at the point where the rollers 321 and the enameled wire 2 are in contact, the outer surface of the rollers 321 moves in the same direction as the direction in which the enameled wire 2 travels. In the rolling process, similar to the compression process described above, the enameled wire 2 is stretched in a direction perpendicular to the compression direction (i.e., the direction in which the two rollers 321 face each other). At this time, shear stress is generated at the interface between the conductor 21 and the insulator 22 due to the difference in their elasticity. As a result, partial delamination occurs between the conductor 21 and the insulator 22.

[0027] (Removal device 4) The removal device 4 is a device that performs the removal process. The removal process is the process of peeling off and removing the insulator 22 that has been peeled off from the conductor 21 by the peeling device 3. Figure 6 is a diagram showing an example of the removal device 4. As shown in Figure 6, the removal device 4 removes the insulator 22 from the conductor 21 by making continuous cuts 22a along the longitudinal direction of the insulator 22 after the peeling process with the blade 41, and continuously peeling off the insulator 22 that has been divided by the cuts 22a.

[0028] In this embodiment, the longitudinal direction of the enameled wire 2 is horizontal. The removal device 4 is equipped with two blades 41 positioned above and below the center of the enameled wire 2. Each blade 41 continuously divides the insulator 22 into two halves, left and right, by forming a cut 22a in the insulator 22 along the longitudinal direction of the enameled wire 2.

[0029] The removal device 4 then opens the divided insulator 22 to the left and right, and guides each insulator 22 to the winding roller 43 via the guide roller 42. As the enameled wire 2 is run along the track, the insulator 22 is wound up by the winding roller 43, causing the insulator 22 to be pulled to the left and right, and the insulator 22 to be continuously stripped from the conductor 21. Note that the up and down and left and right directions here are relative and are not limited to the vertical and horizontal directions.

[0030] The winding tension when winding the insulator 22 with the winding roller 43 is preferably 5% to 90% of the breaking strength of the insulator 22. The breaking strength of the insulator 22 is the value measured by performing a tensile test using an autograph after cutting the insulator 22 from the enameled wire 2 into strips with a width of 1 mm, at a gauge length of 30 mm and a tensile speed of 10 mm / min. When the winding tension is within the above range, the insulator 22 is less likely to bend or break, and the insulator 22 can be peeled off stably.

[0031] Furthermore, the angle θ between the direction in which the insulator 22 is pulled when stripping it from the conductor 21 and the direction in which the enameled wire 2 runs is preferably 30 degrees or more and 160 degrees or less, and more preferably 90 degrees or more and 160 degrees or less. When the angle θ is within the above range, the insulator 22 is easier to strip from the conductor 21 and the insulator 22 is less likely to break during winding. Note that the removal device 4 shown in Figure 6 is merely an example, and the specific structure of the removal device 4 can be changed as appropriate.

[0032] (Regarding suitable processing conditions for the peeling process) Compression processing (in this case, press processing) was performed while changing the processing conditions, and it was confirmed whether the insulator 22 could be easily stripped off the processed enameled wire 2. The results are shown in Figure 7. In Figure 7, the areas from which the insulator 22 could be easily stripped off are indicated by hatching. In addition, a flat rectangular wire was used as the enameled wire 2, and the press was applied in the direction of its short axis.

[0033] As shown in Figure 7, when performing compression processing, it is preferable to process the material so that the rate of change in thickness is 54.5% or more. The rate of change in thickness can be obtained by the following formula, where A is the thickness of the enameled wire 2 before processing and B is the thickness of the enameled wire 2 after processing. The thickness of the enameled wire 2 is, for example, the thickness in the short axis direction of a rectangular wire. Percentage change in thickness (%) = {(AB) / A} × 100

[0034] Furthermore, as shown in Figure 7, when performing compression processing, it is preferable to perform the processing so that the rate of change in Vickers hardness is 105.5% or more. The rate of change in Vickers hardness can be obtained by the following formula, where C is the Vickers hardness before processing and D is the Vickers hardness after processing. Change in Vickers hardness (%) = {(DC) / C} × 100

[0035] Vickers hardness was measured according to the method described in JIS Z2244 (2009). The measurement conditions for Vickers hardness were a load of 200g and a holding time of 15 seconds. The cross-section of the sample was mirror-polished. Vickers hardness was measured at two locations near the center of the conductor 21. The average of the measurements taken at the two locations was used as the Vickers hardness.

[0036] Figure 7 shows the processing conditions for compression processing, but it is preferable that the processing conditions for rolling processing be the same. That is, when rolling processing is performed in the peeling process, it is preferable to perform the processing so that the rate of change in thickness is 54.5% or more and the rate of change in Vickers hardness is 105.5% or more, just as when compression processing is performed in the peeling process.

[0037] (1-2) Manufacturing of fillers Next, the stripped insulator 22 is converted into a powder. The powdered insulator 22 is a filler. The filler contains a thermosetting polymer. The thermosetting polymer contained in the filler is a reused thermosetting polymer. A reused thermosetting polymer is a thermosetting polymer recovered from products such as enameled wire 2.

[0038] Methods for converting the insulator 22 into a powder include, for example, pulverizing the insulator 22 or chemical treatment. To pulverize the insulator 22, for example, a nanojet pulverizer can be used. A commercially available nanojet pulverizer is, for example, the nanojet pulverizer manufactured by Aisin Nanotechnologies Corporation. As a chemical treatment, for example, there is the method disclosed in publication WO2012 / 096374. In this method, polyimide is dissolved in a treatment solution containing a basic substance, and then this treatment solution is mixed with an acidic substance to precipitate polyimide fine particles and obtain a powder. Next, the basic substance is removed from this powder. Another example of a chemical treatment is the method disclosed in Japanese Patent Publication No. 2011-162570. In this method, polyimide film is used as a raw material and is powdered using an acid and an alkaline solvent.

[0039] The average particle size of the powder is preferably 100 μm or less, and more preferably 50 μm or less. When the average particle size of the powder is below these upper limits, the filler acting as a foreign substance and causing filament breakage can be suppressed. The lower limit of the average particle size of the powder is not particularly limited, but when the average particle size of the powder is 1 μm or more, it is easier to produce the powder. The method for measuring the average particle size is as follows: Observe the filler with a scanning electron microscope (SEM) and obtain an SEM image. The magnification of the SEM image is preferably set in the range of 1000x to 5000x. Determine the particle size of the filler in the SEM image. The particle size of the filler is the average value of the major axis and the minor axis of the filler. The method for determining the particle size of the filler is to measure the major axis and minor axis of the filler and calculate the average value of these major and minor axes. The minor axis of the filler is the length of the filler on a straight line perpendicular to the major axis, passing through the center point of the major axis of the filler. In this way, the particle sizes of any 50 fillers are determined, and the average of these particle sizes is taken as the average particle size. As described above, stripping the insulator 22 from the conductor 21 and crushing the stripped insulator 22 to produce the filler corresponds to the process of obtaining powder of the insulator 22 from the enameled wire 2.

[0040] (1-3) Mixing of base resin and filler Next, the thermoplastic polymer and the filler are kneaded together to produce a mixture. The thermoplastic polymer is, for example, a base resin.

[0041] Examples of thermoplastic polymers include acrylonitrile butadiene styrene, acrylic, celluloid, cellulose acetate, cyclic olefin copolymers, fluororesins such as ethylene vinyl acetate, ethylene vinyl alcohol, polytetrafluoroethylene and perfluoroalkoxyalkanes, ionomers, liquid crystal polymers, polyoxymethylene, polyacrylate, polyacrylonitrile, polyamide, polyamide-imide, polyimide, polyaryl ether ketone, polybutadiene, polybutylene, polybutylene terephthalate, polycaprolactone, polychlorotrifluoroethylene, polyether ether ketone, polyethylene terephthalate, and polycyclohexylene. Examples include dimethylene terephthalate, polycarbonate, polyhydroxyalkanoate, polyketone, polyester, polyethylene, polyetherketone, polyetherimide, polyethersulfone, polysulfone, chlorinated polyethylene, polylactic acid, polymethyl methacrylate, polymethylpentene, polyphenylene, polyphenylene oxide, polyphenylene sulfide, polyphthalamide, polypropylene, polystyrene, polysulfone, polytrimethylene terephthalate, polyurethane, polyvinyl acetate, polyvinyl chloride, polyvinylidene chloride, styrene acrylonitrile, any thermoplastic elastomer, or a combination of two or more of these.

[0042] Preferred thermoplastic polymers include acrylonitrile butadiene styrene (ABS), polylactic acid (PLA), nylon (aliphatic or aromatic polyamide), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or polycarbonate (PC). Polylactic acid is more preferred as the thermoplastic polymer.

[0043] The mixing temperature (hereinafter referred to as the mixing temperature) when mixing the base resin and the filler is preferably between T1 and T2. T1 is the melting point of the base resin. T2 is the lower of the thermal decomposition temperature of the base resin and the thermal decomposition temperature of the filler. It is even more preferable that the mixing temperature is at least 20°C higher than T1 and at least 10°C lower than T2. ​​When the mixing temperature is at least 20°C higher than T1, mixing is good. When the mixing temperature is T2 or lower, the base resin and filler are less likely to decompose and deteriorate. The mass ratio of thermoplastic polymer in the compound is preferably 50% by mass or more and less than 100% by mass. The mass ratio of filler in the compound is preferably greater than 0% by mass and 50% by mass or less. The mass ratio of reusable thermosetting polymer in the compound is preferably greater than 0% by mass and 50% by mass or less. When the mass ratio of reusable thermosetting polymer in the compound is 50% by mass or less, the filament is less likely to become brittle.

[0044] (1-4) Filament extrusion Next, a linear filament is produced by extruding the mixture. The filament contains a thermoplastic polymer and a filler. The filler contains a reusable thermosetting polymer. As shown in Figure 8, in filament 101, the filler 103 is dispersed in the thermoplastic polymer 105.

[0045] The mass ratio of thermoplastic polymer 105 in filament 101 is preferably 50% by mass or more and less than 100% by mass. The mass ratio of filler 103 in filament 101 is preferably greater than 0% by mass and 50% by mass or less. The mass ratio of reusable thermosetting polymer in filament 101 is preferably greater than 0% by mass and 50% by mass or less.

[0046] The diameter of the filament 101 is preferably between 1.75 mm and 2.85 mm. The filament 101 is used for 3D printing. For example, the filament 101 is used in a 3D printer.

[0047] Furthermore, as described above, manufacturing the filament 101 using the thermosetting polymer contained in the insulator 22 corresponds to a material recycling method for thermosetting polymers.

[0048] 2. Method for manufacturing resin molded articles Next, a resin molded product is manufactured by three-dimensional molding using a filament. For example, a resin molded product is manufactured using a filament and a three-dimensional printer. The resin molded product contains a thermoplastic polymer and a filler. The filler includes a reusable thermosetting polymer. Preferably, the mass ratio of the thermoplastic polymer in the resin molded product is 50% by mass or more and less than 100% by mass. Preferably, the mass ratio of the filler in the resin molded product is greater than 0% by mass and 50% by mass or less. Preferably, the mass ratio of the reusable thermosetting polymer in the resin molded product is greater than 0% by mass and 50% by mass or less.

[0049] 3. Effects of filaments, resin molded articles, and methods for manufacturing them. (1A) The filament contains a reusable thermosetting polymer. The reusable thermosetting polymer is the thermosetting polymer that was contained in the insulator 22. Therefore, by manufacturing the filament, the thermosetting polymer contained in the insulator 22 can be recycled.

[0050] (1B) In the method for manufacturing the resin molded product, a filament is used. The filament contains a reusable thermosetting polymer. The reusable thermosetting polymer is the thermosetting polymer that was contained in the insulator 22. Therefore, by manufacturing the resin molded product, the thermosetting polymer contained in the insulator 22 can be recycled.

[0051] (1C) In this embodiment, the enameled wire 2 is subjected to compression or rolling to separate the insulator 22 from the conductor 21. By performing compression or rolling, the difference in the elasticity of the conductor 21 and the insulator 22 can be utilized to separate the insulator 22 from the conductor 21.

[0052] (1D) The reusable thermosetting polymer contained in the filler has a high melting point. Therefore, filaments and resin molded products containing this filler are superior in strength, heat resistance, flame retardancy, and durability.

[0053] <Second Embodiment> 1. Differences from the first embodiment The second embodiment has the same basic configuration as the first embodiment, so the differences will be explained below. Note that the same reference numerals as in the first embodiment indicate the same components, and refer to the preceding description.

[0054] In the first embodiment described above, the insulator 22 was stripped from the conductor 21, and the filler was manufactured from the stripped insulator 22. In contrast, in the second embodiment, the filler is manufactured by cutting the insulator 22 with a rotating body. When the insulator 22 is cut with a rotating body, for example, the insulator 22 is not separated from the conductor 21. The rotating body is equipped with, for example, blades, abrasive grains, etc. on its outer circumferential surface.

[0055] 2. Effects of filaments, resin molded articles, and methods for manufacturing them. The second embodiment described in detail above achieves the effects (1A), (1B), and (1D) of the first embodiment mentioned above.

[0056] <Other Embodiments> Although embodiments of the present disclosure have been described above, the present disclosure is not limited to the embodiments described above and can be implemented in various modified forms.

[0057] (1) In the first and second embodiments, the filler may be obtained from the insulator 22 of a winding other than the enameled wire 2. In the first and second embodiments, the filler may be obtained from a product other than a winding. Examples of products other than windings include motor coils.

[0058] (2) In the first and second embodiments, the method for manufacturing the resin molded product may be a method other than using a 3D printer. (3) In the first and second embodiments, the filament and the resin molded article may further contain other components in addition to the thermoplastic polymer and filler. Examples of other components include pigments. (4) The function of one component in each of the above embodiments may be divided among multiple components, or the function of multiple components may be performed by one component. Also, some of the configurations of each of the above embodiments may be omitted. Also, at least some of the configurations of each of the above embodiments may be added to, replaced with, etc., the configurations of other embodiments.

[0059] (5) In addition to the filament described above, this disclosure can also be realized in various forms, such as a system that uses the filament as a component, a method for manufacturing the filament, etc. [Explanation of Symbols]

[0060] 1... Stripping system, 2... Enamel wire, 3... Stripping device, 4... Removal device, 21... Conductor, 22... Insulator, 22a... Cut, 31... Press machine, 32... Rolling mill, 41... Blade, 42... Guide roller, 43... Winding roller, 101... Filament, 103... Filler, 105... Thermoplastic polymer, 311... Gauge block, 321... Roller

Claims

1. It is a filament for 3D printing, Thermoplastic polymers and A filler containing a reusable thermosetting polymer, Includes, The mass ratio of the thermoplastic polymer in the filament is 50% by mass or more. The mass ratio of the filler in the filament is greater than 0% by mass and 50% by mass or less. filament.

2. A method for manufacturing resin molded products by three-dimensional molding using filaments, The aforementioned filament is Thermoplastic polymers and A filler containing a reusable thermosetting polymer, Includes, The mass ratio of the thermoplastic polymer in the filament is 50% by mass or more. The mass ratio of the filler in the filament is greater than 0% by mass and less than or equal to 50% by mass. A method for manufacturing resin molded products.

3. From a winding comprising a conductor and an insulator containing a thermosetting polymer covering the conductor, powder of the insulator is obtained. The aforementioned powder and a thermoplastic polymer are kneaded together to produce a compound. The aforementioned mixture is extruded to produce a filament for three-dimensional modeling. A method for material recycling thermosetting polymers.

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