Apparatus for forming a film, method for forming a film, and method for manufacturing an article

Abstract

To provide a film forming apparatus capable of forming films of curable compositions with high precision. [Solution] A film forming apparatus for forming a film of a curable composition on a substrate by bringing a member into contact with the curable composition, comprising: a holding part that holds the member by adsorption while in contact with the central part of the member; and a pressure control part that applies pressure to the side of the holding part opposite to the side that holds the member so as to deform the holding part and the member.

Description

Technical Field

[0001] The present invention relates to a film forming apparatus, a film forming method, a method for manufacturing an article, etc. applicable to the semiconductor manufacturing field and the like.

Background Art

[0002] In order to manufacture semiconductor devices, film forming apparatuses such as imprint apparatuses and planarization apparatuses that form a film of a curable composition disposed on a substrate using a member are known. Here, the member is a mold having an uneven contact surface that contacts the curable composition, a planarization member having a flat contact surface, or the like.

[0003] Incidentally, the planarization apparatus is used to planarize a substrate during a lamination process in a semiconductor manufacturing process. That is, in the process for manufacturing a semiconductor device, as more layers are added, the height of the substrate fluctuates. When the height fluctuates, it has an adverse effect when further layers are added.

[0004] To address this problem, a planarization apparatus that planarizes a substrate during a lamination process is used. In laser-based lithography, planarization reduces the influence of the depth of focus (DOF) constraint and improves the critical dimension (CD) and the uniformity of the critical dimension.

[0005] For example, in inkjet-based adaptive planarization (IAP), a liquid organic material (curable composition) is dropped based on the step of the substrate, and a planarization member (a mold for planarization) called a super straight is pressed onto the dropped liquid organic material. Then, the liquid organic material is irradiated with ultraviolet rays or the like and cured while the substrate and the mold are in contact to improve the planarization accuracy.

[0006] In Patent Document 1, a method is described in which by using an annular chuck assembly including a flexible portion having a central opening, the curvature of the super straight during pressing is kept constant, thereby improving the spread of the liquid organic material and reducing unfilled defects.

Prior Art Documents

[0007] [Patent Document 1] Japanese Patent Publication No. 2022-64288 [Overview of the project] [Problems that the invention aims to solve]

[0008] However, as described in Patent Document 1, if air pressure is directly applied to the super straight material to pressurize it and form a convex shape, the convex shape will fluctuate significantly due to variations in pressure control if the super straight material is thin and has low rigidity.

[0009] Furthermore, if the shape changes significantly, the timing of the start of contact during stamping also changes, leading to the problem of unfilled defects occurring in the central region of the super-straight material. This problem of unfilled defects in the central region of the material can occur not only in film forming devices such as planarization devices, but also in film forming devices such as imprinting devices.

[0010] Therefore, one of the objectives of the present invention is to provide a film forming apparatus that can accurately form films of curable compositions. [Means for solving the problem]

[0011] A film forming apparatus for forming a film of a curable composition by bringing a member into contact with a curable composition on a substrate, A holding portion that holds the member by adsorption while in contact with the central part of the member, A pressure control unit that applies pressure to the surface of the holding portion opposite to the surface that holds the member, so as to deform the holding portion and the member, It is characterized by having the following features. [Effects of the Invention]

[0012] According to the present invention, it is possible to provide a film forming apparatus that can accurately form films of curable compositions. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic diagram showing an example of a planarization system according to Embodiment 1 of the present invention. [Figure 2] This figure shows an example of a schematic cross-section of a chuck assembly 118 according to Embodiment 1 of the present invention. [Figure 3] This figure shows an example of a schematic cross-section of the chuck assembly 118 when the super straight is curved, according to Embodiment 1 of the present invention. [Figure 4] This figure shows an example of a schematic cross-section of a chuck assembly 118 with a hollowed-out central portion, according to Embodiment 2 of the present invention. [Figure 5] This figure shows an example of a schematic cross-section of a chuck assembly 118 with the central part of the back surface hollowed out, according to Embodiment 3 of the present invention. [Figure 6] This figure shows an example of a schematic cross-section of a chuck assembly 118 made up of multiple members according to Embodiment 4 of the present invention. [Figure 7] This flowchart shows an example of a planarization method according to Embodiment 5 of the present invention. [Figure 8] This figure shows an example of a schematic cross-section of the chuck assembly 118 when releasing the Super Straight 108 from the plate 130. [Modes for carrying out the invention]

[0014] Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following embodiments. In each drawing, the same reference numeral is used for the same member or element, and redundant explanations are omitted or simplified.

[0015] <Embodiment 1> FIG. 1 is a schematic diagram showing an example of a planarization system according to Embodiment 1 of the present invention. Note that some of the functional blocks shown in FIG. 1 are realized by causing a CPU or the like, which is a computer (not shown) included in the planarization system, to execute a computer program stored in a memory, which is a storage medium (not shown).

[0016] However, some or all of them may be realized by hardware. As the hardware, a dedicated circuit (ASIC), a processor (reconfigurable processor, DSP), or the like can be used. Also, each of the functional blocks shown in FIG. 1 does not have to be built in the same housing, and may be constituted by separate devices connected to each other via signal paths.

[0017] Note that, in the following description, an example of a planarization system 100 (planarization device) is used as an example of a film forming device that forms a film of a curable composition by bringing a member into contact with the curable composition disposed on a substrate.

[0018] That is, an example of a planarization system 100 as a planarization device in which a member of the film forming device includes a planarization member whose main part of the contact surface that contacts the curable composition is a flat surface, and a flat film is formed by bringing the planarization member into contact with the curable composition disposed on the substrate will be described below.

[0019] However, the film forming device according to the present invention is not limited to the planarization system 100, and includes, for example, an imprint device. Here, a member of the imprint device includes a mold whose contact surface that contacts the curable composition has irregularities, and an irregular film is formed by bringing the mold into contact with the curable composition disposed on the substrate.

[0020] The planarization system 100 is used to planarize a film of a curable composition 124 applied on a substrate 102. The substrate 102 is held by a substrate chuck 104. The substrate chuck 104 may be a vacuum chuck, a pin type chuck, a groove type chuck, an electrostatic chuck, an electromagnetic chuck, or the like, but is not limited thereto.

[0021] The substrate 102 and the substrate chuck 104 are further supported by the substrate positioning stage 106. The substrate positioning stage 106 is capable of translational motion along mutually orthogonal x, y, and z axes, or rotational motion around the x, y, and z axes.

[0022] Furthermore, the substrate positioning stage 106, substrate 102, and substrate chuck 104 may be positioned on a base (not shown), and the substrate positioning stage 106 may be part of a positioning system.

[0023] Opposite the substrate 102 is a superstraight 108, which has a flat working surface (contact surface) 112 facing the substrate 102 and forms a film of the curable composition by contacting the curable composition placed on the substrate. The substrate 102 and the superstraight 108 each have a disc shape.

[0024] Super Straight 108 is formed from materials including, but not limited to, fused silica, quartz, silicon, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers, metals, and hardened sapphire.

[0025] In this embodiment, the disc-shaped superstraight 108 is sufficiently transparent to UV light. Furthermore, the working surface 112 has the same area size as, or slightly smaller than, the surface of the disc-shaped substrate 102. The superstraight 108 may be coupled to or held by the chuck assembly 118, as will be described in more detail below.

[0026] The chuck assembly 118 is coupled to a flattening head 120, which is part of a positioning system. The flattening head 120 may be movably coupled to a bridge (not shown). The bridge is a structure that supports the flattening head 120 so that it can move, for example, in the z-axis direction.

[0027] The flattening head 120 is configured to move the chuck assembly 118 relative to the substrate 102 in translational motion along at least the z-axis, as well as along the x and y axes, and rotational motion around the x, y, and z axes. The flattening head 120 also includes one or more actuators such as a voice coil motor, piezoelectric motor, linear motor, nut, and screw motor.

[0028] The flattening system 100 may further include a fluid dispenser 122. The fluid dispenser 122 may also be movably coupled to the aforementioned bridge. In this embodiment, the fluid dispenser 122 and the flattening head 120 share one or more of all positioning components.

[0029] Furthermore, the fluid dispenser 122 and the planarizing head may be configured to move independently of each other. The fluid dispenser 122 is used to deposit droplets of the curable composition 124 (curable composition) onto the substrate 102. The curable composition 124 is, for example, a resin such as a photocurable polymerizable material.

[0030] Furthermore, the volume of material deposited varies across the substrate 102, at least partially based on its topographic profile. Additionally, the fluid dispenser 122 may use inkjet technology to coat (dispense) the curable composition 124.

[0031] Inkjet technologies such as thermal inkjet, microelectromechanical system (MEMS) inkjet, valve jet, and piezoelectric inkjet may be used.

[0032] The planarization system 100 has a radiation source 126 for irradiating chemical radiation energy, such as UV (ultraviolet) radiation, along the exposure path 128. The planarization head 120 and the substrate positioning stage 106 are configured to position the superstraight 108 and the substrate 102 while superimposed on the exposure path 128.

[0033] The radiation source 126 irradiates chemical ray energy along the exposure path 128 after the superstraight 108 has come into contact with the curable composition 124. Although Figure 1 shows the exposure path 128 when the superstraight 108 is not in contact with the curable composition 124, the exposure path 128 does not substantially change even when the superstraight 108 comes into contact with the curable composition 124.

[0034] The planarization system 100 further includes a camera 136, which is used to inspect the spread of the curable composition 124 while the superstraight 108 is in contact with the curable composition 124 during the planarization process.

[0035] In Figure 1, 138 indicates the optical axis of the imaging field of the camera 136. As shown in Figure 1, the planarization system 100 includes one or more optical components 139 for combining radiation with light to be detected by the camera 136. The optical components 139 include, for example, dichroic mirrors, beam combiners, prisms, lenses, mirrors, etc.

[0036] The camera 136 is configured to detect the contrast between the area in contact with the curable composition 124 and the area not in contact with it on the lower surface of the super straight 108. The camera 136 is composed of a CCD sensor, a CMOS sensor, a line camera, and a photodetector, etc.

[0037] Camera 136 can acquire images showing the spreading state of the curable composition 124 beneath the Super Straight 108, and the state of separation of the Super Straight 108 from the cured curable composition 124. Camera 136 is configured to measure interference fringes that change as the curable composition 124 spreads in the gap between the working surface 112 and the substrate surface.

[0038] 140 is a processor including a CPU and memory as a computer, and each part of the flattening system 100 is coordinated and controlled by the processor 140. The processor 140 may also include an MPU, GPU, ASIC, FPGA, DSP, etc.

[0039] Furthermore, the processor 140 may be a dedicated controller or a general-purpose computer device configured to function as a controller. The memory mentioned above includes RAM, ROM, etc.

[0040] 143 is a pressure control unit that supplies a predetermined air pressure to the chuck assembly 118, thereby adhering and holding the Super Straight 108 to the plate 130 (holding part), which will be described later. It also deforms both the plate 130 (holding part) and the Super Straight 108 (member) into convex or concave shapes.

[0041] Specifically, the pressure control unit 143 deforms both the holding part and the member by applying pressure to the plate 130 (holding part) from the side opposite to the side that holds the Super Straight 108 (member). Furthermore, a predetermined pressure is also supplied when peeling the Super Straight 108 from the plate 130, etc.

[0042] In the planarization process, the distance between the superstraight 108 and the substrate 102 is varied by either the planarization head 120, the substrate positioning stage 106, or both. For example, the planarization head 120 is moved toward the substrate so that the superstraight 108 comes into contact with and spreads droplets of the curable composition 124.

[0043] Figure 2 shows an example of a schematic cross-section of a chuck assembly 118 according to Embodiment 1 of the present invention. In Figure 2, 130 is a disc-shaped plate, 134 is a disc-shaped lid, 135 is a ring, and 152 is the space enclosed by the plate 130, the lid 134, and the ring, and these constitute the chuck assembly 118.

[0044] Here, the plate 130 functions as a holding portion that holds the member by adsorption while in contact with at least the central portion of the Super Straight 108, which is the member.

[0045] Here, the central portion includes the area from the center of the disc-shaped superstraight 108 as a component up to 50% of its maximum radius. Furthermore, the center of the disc-shaped superstraight 108 as a component and the center of the disc-shaped plate 130 as a holding part are aligned to coincide.

[0046] Furthermore, it is desirable for the plate 130 to adsorb and hold the Super Straight 108 while being in contact with its entire surface area, and the radius of the plate 130 is larger than the radius of the Super Straight 108.

[0047] Furthermore, the Super Straight 108 as a component is made of a material that can transmit UV light and visible light. In addition, at least the portions of the plate 130 and the lid 134 that face the Super Straight 108 are made of a material that can transmit UV light and visible light. In other words, the portions of the Super Straight 108 as a component, and the plates 130 and the lid 134 that face the component, are made of light-transmitting material.

[0048] During the planarization process, when the SuperStraight and the substrate come into contact and droplets of the curable composition 124 spread, if air or gas bubbles are trapped between the SuperStraight 108 and the substrate 102, the filling of the droplets is hindered.

[0049] To resolve this problem, in the planarization process of this embodiment, the superstraight 108 first comes into contact with the curable composition 124 at the center of the substrate 102, and then the contact area progresses radially from the center toward the periphery.

[0050] To achieve this, a predetermined air pressure is supplied from the pressure control unit 143 to the space 152 on the back of the plate 130 that constitutes the chuck assembly 118, thereby pre-curving the plate 130 into a convex shape, and thus the super straight 108 is curved into a convex shape.

[0051] In other words, the pressure control unit 143 deforms both the plate 130, which serves as the holding part, and the superstraight 108, which serves as the component, into a convex shape toward the curable composition 124.

[0052] In this embodiment, as shown in Figure 2, the plate 130 includes a pressure space 148 (adsorption portion) surrounded by the plate 130 and the superstraight 108 in order to adsorb and hold the superstraight 108.

[0053] The pressure space 148 (adsorption section) is configured as an annular space that adsorbs the outer edge of the Super Straight 108. The pressure space 148 may be composed of multiple annular spaces provided on the plate 130, multiple scattered spaces, or a combination thereof.

[0054] Figure 3 shows an example of a schematic cross-section of the chuck assembly 118 when the super straight is curved in Embodiment 1 of the present invention. As shown in Figure 3, the super straight 108 is curved into a convex shape by supplying positive pressure P to the space 152. However, if the amount of deformation in response to pressure is too sensitive, fluctuations in pressure control will cause the position of the deflection portion at the center of the super straight 108, that is, the position of the contact initiation point, to fluctuate.

[0055] Therefore, in this embodiment, it is desirable that the sensitivity of the deflection at the center of the Super Straight 108 to the pressure in the space 152 be 0.01 to 1 μm / Pa. That is, it is desirable that the amount of deflection at the center of the Super Straight 108 as a member to pressure be 0.01 to 1 μm / Pa.

[0056] Furthermore, it is even more desirable that the amount of deflection in the central part of the Super Straight 108 as a component under pressure be 0.01 to 0.1 μm / Pa.

[0057] The following equation (1) defines the bending stiffness D. In equation (1), H is the thickness of Super Straight 108 or Plate 130, ν is the Poisson's ratio of Super Straight 108 or Plate 130, and E is the Young's modulus of Super Straight 108 or Plate 130.

[0058]

number

[0059] In this embodiment, it is desirable that the combined bending rigidity of the Super Straight 108 and the plate 130 be 1 to 200 Pa·m³. That is, it is desirable that the combined bending rigidity at the central part of the Super Straight 108 as a member and the plate 130 as a holding part be 1 to 200 Pa·m³.

[0060] In equation (1), for example, if the elastic modulus of Super Straight 108 is 70 GPa, the thickness is 0.7 mm, and the Poisson's ratio is 0.23, the bending stiffness will be 2.12 Pa·m3.

[0061] In this case, if the combined bending stiffness of Super Straight 108 and Plate 130 is to be 20 Pa·m³, it is desirable that the bending stiffness of Plate 130 be between 3 and 18 Pa·m³, depending on the degree of contact and friction with Super Straight.

[0062] In other words, it is desirable to set the bending stiffness of the central part of the plate 130, which serves as the holding part, in accordance with the bending stiffness of the Super Straight 108, which serves as the member, so that the combined bending stiffness at the central part of the member and the holding part falls within a predetermined range.

[0063] Furthermore, the plate 130 may be made of the following materials having an elastic modulus (Young's modulus) of 1 to 210 GPa, 50 to 150 GPa, or 60 to 100 GPa. Specifically, the plate 130 may be made of plastic (e.g., acrylic), glass (e.g., fused silica, borosilicate), metal (e.g., aluminum, stainless steel), or ceramic (e.g., zirconia, sapphire, alumina), etc.

[0064] However, in the configuration shown in Figures 2 and 3 according to Embodiment 1, the rigidity changes in the outer circumference of the super straight, and the curvature of the bending due to positive pressure P may also change in the outer circumference.

[0065] <Embodiment 2> Figure 4 shows an example of a schematic cross-section of a chuck assembly 118 with a hollowed-out central portion according to Embodiment 2 of the present invention. As shown in Figure 4, the portion of the plate 130 that holds the super straight 108 is hollowed out. In this way, in Embodiment 2 of the present invention, the overall rigidity of the super straight 108 and the plate 130 is made uniform.

[0066] In other words, by making the rigidity of the plate 130, which serves as the holding part, uneven, the overall uniformity of rigidity when the Super Straight 108, which serves as the component, is held is enhanced. Furthermore, to achieve this, the thickness of the region of the holding part corresponding to the shape of the component is made uneven, thereby making the rigidity of the holding part uneven and enhancing the overall uniformity of rigidity when the component is held.

[0067] As an example, the bending stiffness of a single Super Straight 108 is set to 2.12 Pa·m³, and the overall uniform bending stiffness of the Super Straight 108 and Plate 130 is set to 20 Pa·m³.

[0068] Furthermore, if plate 130 is made of the same material as Super Straight (elastic modulus of 70 GPa, Poisson's ratio of 0.23), the thickness of the cut-out section should be 0.8 to 1.4 mm depending on the degree of bonding with Super Straight, and the thickness of the parts other than the cut-out section should be 1.5 mm.

[0069] Furthermore, the cutout in Figure 4 is a circular recess, and its radius is larger than the radius of the Super Straight 108. This is to slow down the deformation of the edge of the Super Straight 108.

[0070] <Embodiment 3> Figure 5 shows an example of a schematic cross-section of a chuck assembly 118 with a hollowed-out central portion on the back surface according to Embodiment 3 of the present invention. As shown in Figure 5, the hollowed-out portion of the plate 130 may be configured on the side opposite to the side that holds the Super Straight.

[0071] In this embodiment as well, by making the thickness of the holding portion in the region corresponding to the shape of the member uneven, the rigidity of the holding portion is made uneven, thereby improving the overall uniformity of rigidity when the member is held.

[0072] Furthermore, the cutout in Figure 5 is a circular recess, and its radius is larger than the radius of the Super Straight 108. This is to slow down the deformation of the edge of the Super Straight 108.

[0073] As an example, the bending stiffness of a single Super Straight 108 is set to 2.12 Pa·m³, and the overall uniform bending stiffness of the Super Straight 108 and Plate 130 is set to 20 Pa·m³.

[0074] Furthermore, if plate 130 is softer than Super Straight, with an elastic modulus of 3.2 GPa and a Poisson's ratio of 0.35, the thickness of the cut-out section should be 2 to 3.9 mm depending on the degree of bonding with Super Straight 108, and the thickness of the parts other than the cut-out section should be 4 mm.

[0075] Furthermore, the difference between the thickness of the cut-out portion and the thickness of the area outside the cut-out portion determines the depth of the cut-out. However, if this depth exceeds the thickness of the Super Straight 108, the Super Straight 108 will be embedded in the plate 130 in the configuration shown in Figure 4. Therefore, the configuration shown in Figure 5, relating to Embodiment 3, is more suitable.

[0076] <Embodiment 4> Figure 6 shows an example of a schematic cross-section of a chuck assembly 118 made up of multiple members according to Embodiment 4 of the present invention. In Embodiment 4, multiple plates are used to make the rigidity of the central part of the plate lower than that of the peripheral part.

[0077] In this embodiment as well, by making the thickness of the holding portion in the region corresponding to the shape of the member uneven, the rigidity of the holding portion is made uneven, thereby improving the overall uniformity of rigidity when the member is held.

[0078] Considering that the combined rigidity of the plate increases when the Super Straight 108 is adsorbed, the combined rigidity of the central part of the Super Straight 108 can be reduced by combining plate 131 and plate 132.

[0079] In other words, by constructing the holding part by combining multiple plates 131 and 132 with uneven rigidity, the overall uniformity of rigidity of the holding part when holding a member can be improved.

[0080] In the example shown in Figure 6, plates 131 and 132 are disc-shaped plates, and together with the lid 134, ring 135, and space 152, they constitute the chuck assembly 118.

[0081] In the example shown in Figure 6, the rigidity of plate 131 is lower than that of plate 132. Also, the thickness of the convex circular portion in the center of plate 131 is greater than the thickness of the outer (periphery) portion of the circular portion in the center of plate 131.

[0082] Furthermore, the radius of the convex circular portion in the center of plate 131 is larger than the radius of Super Straight 108. This is to slow down the deformation of the edge portion of Super Straight 108.

[0083] Furthermore, the sum of the thicknesses of plate 131 and plate 132 is approximately constant overall. Therefore, the composite strength around the center of plate 131 can be made lower compared to the outer (peripheral) parts. Note that plates 131 and 132 are transparent to UV light.

[0084] <Embodiment 5> Figure 7 is a flowchart illustrating an example of a flattening method according to Embodiment 5 of the present invention. The CPU and other components within the processor 140 execute computer programs stored in memory, sequentially performing each step of the flowchart in Figure 7. Although Figure 7 uses the configuration of Embodiment 1 shown in Figures 2 and 3 to illustrate an example of the flattening method, it can also be applied to the configurations of Embodiments 2 to 4.

[0085] In step S101, the substrate 102, to which droplets of the curable composition 124 have been applied, is transported and positioned under the superstraight 108. Prior to step S101, droplets of the curable composition 124 have been applied to the substrate by the fluid dispenser 122. Also prior to step S101, the chuck assembly 118 holds the superstraight 108 by suction through the pressure space 148.

[0086] In step S102, as shown in Figure 3, a positive pressure P is applied to the space 152, causing the super straight 108 to bend into a convex shape. That is, while the plate 130 remains attracted to and held by the super straight 108 through the pressure space 148, the plate 130 bends, as shown in Figure 3, and the super straight 108 in contact with the plate 130 also bends.

[0087] In step S103, the planarizing head 120 is driven in the -z axis direction, bringing the superstraight 108 into contact with droplets of the curable composition 124 on the substrate 102. At this time, the positive pressure P is still maintained, and the adsorption pressure to the pressure space 148 is still applied.

[0088] Furthermore, as contact between the superstraight 108 and the substrate 102 progresses, the positive pressure P may be increased or maintained to control the curvature of the non-contact area of ​​the superstraight 108.

[0089] As the superstraight 108 and the substrate 102 gradually come into contact, the contact area of ​​the superstraight 108 flattens to match the substrate 102, while the curvature of the non-contact area decreases.

[0090] Therefore, in order to improve the filling properties of the curable composition 124, it is necessary to control the amount of curvature by controlling the positive pressure P. As contact progresses further, the flattening head 120 is driven in the -z axis direction until the entire super straight 108 is flat.

[0091] In the final stage, the positive pressure P is no longer needed, so it is controlled to be the same as atmospheric pressure or released, but the adsorption pressure to the pressure space 148 is still maintained.

[0092] In step S104, the film layer formed by the curable composition 124 filled between the superstraight 108 and the substrate 102 is cured. For example, the film layer is cured by irradiating it with UV light from the radiation source 126 in Figure 1 along the exposure path 128. As mentioned above, the plate 130 is transparent to UV light so as not to interfere with the curing process.

[0093] As another example of step S104, the Super Straight 108 may be released from the plate 130, and the Super Straight 108 and the substrate may be transported together to a UV irradiation device at another location, where the curable composition 124 may be cured in the UV irradiation device at the destination.

[0094] In that case, when releasing the Super Straight 108 from the plate 130, the suction pressure in the pressure space 148 is cut off. Also, if the adhesive force due to the contact area between the Super Straight 108 and the plate 130 is large, release may be promoted by applying positive pressure to the pressure space 148 (suction part), as shown in Figure 8. That is, the pressure control unit may apply positive pressure to the pressure space 148 (suction part) of the holding part when releasing the member from the holding part.

[0095] Figure 8 shows an example of a schematic cross-section of the chuck assembly when demolding the Super Straight 108 from the plate 130. As mentioned above, after demolding the Super Straight 108 from the plate 130, the Super Straight 108 / film layer / substrate 102 may be transported to a UV irradiation device at another location while still in an integrated state. Then, the film layer may be cured by irradiating it with UV light at the destination UV irradiation device.

[0096] Furthermore, in the UV irradiation device at the destination of transport described above, the film layer is cured by irradiating it with UV light via the Super Straight 108, as described above. After curing is complete, the Super Straight 108, the cured film layer, and the substrate 102 may be returned to their original position in the planarization system 100 while still integrated.

[0097] Then, in the original position described above, the super straight 108 may be subjected to suction pressure in the pressure space 148, causing it to be reattached to the plate 130, after which the process may proceed to step S105.

[0098] Furthermore, when releasing the Super Straight 108 from the plate 130 in step S104 as described above, static electricity may be generated on at least one of the Super Straight 108 and the plate 130, causing it to attract surrounding foreign matter with electrostatic force.

[0099] Therefore, it is desirable to perform the above-mentioned demolding while removing static electricity with an ionizer (not shown). In other words, it is desirable to provide a means for removing static electricity from at least one of the member and the holding part when demolding the member and the holding part.

[0100] Furthermore, when irradiating with UV light using a UV irradiation device located in a separate location as described above, the plates 130, 131, 132, the lid 134, etc. do not need to be made of a material that can transmit UV light, and the radiation source 126 and exposure path 128, etc., are also unnecessary.

[0101] Next, in step S105, the super straight 108 is peeled off the cured film layer. When peeling it off, the planarizing head 120 may be driven in the z-axis direction to lift the super straight 108 upward so that it is separated from the substrate 102, or the substrate may be lowered in the -z-axis direction.

[0102] During this time, the suction pressure in the pressure space 148 is maintained so that the plate 130 continues to be adsorbed onto the super straight 108. At the same time, a negative pressure may be applied to the space 152 to deform the lower surface of the super straight 108 into a concave shape, thereby assisting the separation process.

[0103] In other words, the pressure control unit may deform both the plate 130 (or 131, 132) as a holding part and the super straight 108 as a component into a convex shape facing away from the curable composition.

[0104] Although the present invention has been described in detail above based on its preferred embodiments, the present invention is not limited to the above embodiments, and various modifications and combinations of the above embodiments are possible in accordance with the spirit of the present invention, and these are not excluded from the scope of the present invention. Furthermore, some of the above embodiments may be combined as appropriate.

[0105] Furthermore, the present invention includes, for example, a system that realizes the functions of the above embodiment using at least one processor such as a CPU, memory, and circuitry (e.g., an ASIC). Alternatively, multiple processors may be used for distributed processing.

[0106] Furthermore, in order to implement some or all of the control in the above embodiment, a computer program that realizes the functions of the above embodiment may be supplied to the film forming apparatus, etc., via a network or various storage media.

[0107] Furthermore, the computer (or CPU, MPU, etc.) in the film forming apparatus may read and execute the program. In that case, the program and the storage medium storing the program constitute the present invention. The present invention includes the following combinations.

[0108] (Configuration 1) A film forming apparatus for forming a film of a curable composition by bringing a member into contact with a curable composition on a substrate, comprising: a holding part that holds the member by adsorption while in contact with the central part of the member; and a pressure control part that applies pressure to the side of the holding part opposite to the side that holds the member so as to deform the holding part and the member.

[0109] (Configuration 2) The film forming apparatus according to Configuration 1, characterized in that the pressure control unit deforms both the holding portion and the member into a convex shape toward the curable composition.

[0110] (Configuration 3) The film forming apparatus according to Configuration 1 or 2, characterized in that the pressure control unit deforms both the holding portion and the member into a convex shape toward the opposite side from the curable composition.

[0111] (Configuration 4) A film forming apparatus according to any one of Configurations 1 to 3, characterized in that the amount of deflection of the central part of the member in response to the pressure is 0.01 to 1 μm / Pa.

[0112] (Configuration 5) The film forming apparatus according to Configuration 4, characterized in that the amount of deflection of the central part of the member in response to the pressure is 0.01 to 0.1 μm / Pa.

[0113] (Configuration 6) A film forming apparatus according to any one of Configurations 1 to 5, characterized in that the combined bending rigidity at the central part of the member and the holding part is 1 to 200 Pa·m3.

[0114] (Configuration 7) A film forming apparatus according to any one of Configurations 1 to 6, characterized in that the bending rigidity of the central part of the holding part is set in accordance with the bending rigidity of the member, such that the combined bending rigidity of the member and the central part of the holding part is within a predetermined range.

[0115] (Configuration 8) A film forming apparatus according to any one of Configurations 1 to 7, characterized in that the uniformity of the overall rigidity when the member is held is increased by making the rigidity of the holding part non-uniform.

[0116] (Configuration 9) The film forming apparatus according to Configuration 8, characterized in that the thickness of the region of the holding portion corresponding to the shape of the member is made uneven, thereby making the rigidity of the holding portion uneven and improving the overall uniformity of rigidity when the member is held.

[0117] (Configuration 10) The film forming apparatus according to Configuration 8 or 9, characterized in that the holding portion is constructed by combining a plurality of plates with non-uniform rigidity, thereby increasing the overall uniformity of the rigidity of the holding portion when the member is being held.

[0118] (Configuration 11) A film forming apparatus according to any one of Configurations 1 to 10, characterized in that the member and the holding portion facing the member are made of a light-transmitting material.

[0119] (Configuration 12) The film forming apparatus according to any one of Configurations 1 to 11, characterized in that the pressure control unit applies positive pressure to the adsorption portion of the holding portion when releasing the member from the holding portion.

[0120] (Configuration 13) A film forming apparatus according to any one of Configurations 1 to 12, characterized in that it has a means for removing static electricity from at least one of the member and the holding part when releasing the member and the holding part from the mold.

[0121] (Configuration 14) The film forming apparatus according to any one of Configurations 1 to 13, wherein the member includes a mold having an uneven contact surface that contacts the curable composition, and the film forming apparatus includes an imprint apparatus that brings the mold into contact with the curable composition placed on the substrate to form an uneven film.

[0122] (Configuration 15) The film forming apparatus according to any one of Configurations 1 to 13, wherein the member includes a planarizing member whose main contact surface that contacts the curable composition is a flat surface, and the film forming apparatus includes a planarizing apparatus that brings the planarizing member into contact with the curable composition placed on the substrate to form a flat film. [Explanation of Symbols]

[0123] 108: Super Straight (Component) 130: Plate (holding part) 148: Pressure space (adsorption part) 140: Processor 143: Pressure Control Unit

Claims

1. A film forming apparatus for forming a film of a curable composition by bringing a member into contact with a curable composition on a substrate, A holding portion that holds the member by adsorption while in contact with the central part of the member, A pressure control unit that applies pressure to the surface of the holding portion opposite to the surface that holds the member, so as to deform the holding portion and the member, A film forming apparatus characterized by having the following features.

2. The film forming apparatus according to claim 1, characterized in that the pressure control unit deforms both the holding portion and the member into a convex shape toward the curable composition.

3. The film forming apparatus according to claim 1, characterized in that the pressure control unit deforms both the holding portion and the member into a convex shape toward the opposite side from the curable composition.

4. The film forming apparatus according to claim 1, characterized in that the amount of deflection of the central part of the member in response to the pressure is 0.01 to 1 μm / Pa.

5. The film forming apparatus according to claim 4, characterized in that the amount of deflection of the central part of the member in response to the pressure is 0.01 to 0.1 μm / Pa.

6. The film forming apparatus according to claim 1, characterized in that the combined bending rigidity at the central portion of the member and the holding portion is 1 to 200 Pa·m³.

7. The film forming apparatus according to claim 1, characterized in that the bending rigidity of the central part of the holding part is set in accordance with the bending rigidity of the member, such that the combined bending rigidity of the member and the central part of the holding part is within a predetermined range.

8. The film forming apparatus according to claim 1, characterized in that the uniformity of the overall rigidity when the member is held is increased by making the rigidity of the holding portion non-uniform.

9. The film forming apparatus according to claim 8, characterized in that the thickness of the region of the holding portion corresponding to the shape of the member is made uneven, thereby making the rigidity of the holding portion uneven and improving the overall uniformity of rigidity when the member is held.

10. The film forming apparatus according to claim 8, characterized in that the holding portion is constructed by combining a plurality of plates with non-uniform rigidity, thereby increasing the overall uniformity of the rigidity of the holding portion when the member is being held.

11. The film forming apparatus according to claim 1, characterized in that the member and the holding portion facing the member are made of a light-transmitting material.

12. The film forming apparatus according to claim 1, characterized in that the pressure control unit applies positive pressure to the adsorption portion of the holding portion when releasing the member from the holding portion.

13. The film forming apparatus according to claim 1, characterized in that it has a means for removing static electricity from at least one of the member and the holding part when releasing the member and the holding part from the mold.

14. The film forming apparatus according to claim 1, wherein the member includes a mold having an uneven contact surface that contacts the curable composition, and the film forming apparatus includes an imprint apparatus that brings the mold into contact with the curable composition placed on the substrate to form an uneven film.

15. The film forming apparatus according to claim 1, wherein the member includes a planarizing member whose main contact surface that contacts the curable composition is a flat surface, and the film forming apparatus includes a planarizing apparatus that brings the planarizing member into contact with the curable composition placed on the substrate to form a flat film.

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