Coating equipment

Abstract

To provide a coating apparatus that can apply a coating solution to a substrate with a more uniform thickness. [Solution] According to the embodiment, the coating apparatus comprises a coating liquid application section, a gas injection section, and a flow straightening section having a flow straightening plate. The coating liquid application section faces a substrate that moves relatively from the upstream side to the downstream side and applies the coating liquid supplied from the coating liquid supply section to the substrate. The gas injection section is equipped with a gas injection port that ejects gas toward the coating liquid, and the gas from the gas injection port gradually dries the coating liquid along the direction of movement of the substrate. The flow straightening plate is located downstream of the coating liquid application section and is positioned on the gas flow path between the gas injection port and the coating liquid application section. It has a surface that deflects the gas away from the direction toward the coating liquid application section and forms a space between itself and the coating liquid application section used for drying the coating liquid.

Description

Technical Field

[0001] Embodiments of the present invention relate to a coating apparatus.

Background Art

[0002] A coating apparatus applies a coating liquid (liquid) with a substantially uniform thickness over a predetermined range in the width direction and the length direction of the substrate surface while transporting the substrate in the length direction, for example. When applying a solution containing an active material to a substrate in the manufacture of a light-emitting element, a battery element, or the like, a high-speed gas is blown toward the substrate to form a high-speed flow field near the substrate, and the solvent is volatilized in a short time.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The problem to be solved by the present invention is to provide a coating apparatus capable of coating the thickness of the coating liquid on the substrate more uniformly.

Means for Solving the Problems

[0005] According to an embodiment, a coating apparatus includes a coating liquid application unit, a gas injection unit, and a rectifying unit having a first rectifying plate. The coating liquid application unit faces a substrate that moves from an upstream side to a downstream side relatively, and applies the coating liquid supplied from a coating liquid supply unit to the substrate. The gas injection unit includes a gas ejection port for drying the coating liquid toward the coating liquid, and gradually dries the coating liquid along the moving direction of the substrate by the gas from the gas ejection port. The rectifying unit is located on the downstream side of the coating liquid application unit and is disposed on the gas flow path between the gas ejection port and the coating liquid application unit. The first rectifying plate has a surface that deflects the gas from the direction toward the coating liquid application unit, and forms a space portion for drying the coating liquid between the first rectifying plate and the coating liquid application unit.

Brief Description of the Drawings

[0006] [Figure 1] A schematic side view showing a coating apparatus according to the first embodiment. [Figure 2] A schematic top view of the coating apparatus shown in Figure 1. [Figure 3] A magnified view of a part of the coating apparatus shown in Figure 1. [Figure 4] This figure shows the gas velocity when gas is injected from the injection nozzle using the coating apparatus shown in Figure 1, and the flow of gas toward the coating liquid application area is suppressed by a flow straightening plate. [Figure 5] A schematic side view showing a coating apparatus according to a first modification of the first embodiment. [Figure 6] Figure 1 shows a schematic diagram of the third rectifier plate of the coating apparatus shown in Figure 1, viewed along the X-axis, illustrating a rectifier plate of a coating apparatus according to a second modified example of the first embodiment. [Figure 7] A schematic side view showing a coating apparatus according to a third modification of the first embodiment. [Figure 8] A schematic side view showing a coating apparatus according to the second embodiment. [Figure 9] A schematic side view showing a coating apparatus according to the first modified example of the second embodiment. [Figure 10] A schematic side view showing a coating apparatus according to a second modification of the second embodiment. [Figure 11] A schematic side view showing a coating apparatus according to the third embodiment. [Modes for carrying out the invention]

[0007] The following describes each embodiment with reference to the drawings.

[0008] (First Embodiment) A coating apparatus 100 according to the first embodiment will be described with reference to Figures 1 to 4. Figure 1 is a side view of the coating apparatus 100 having a flow velocity control unit that controls the flow velocity of gas on the substrate 8. The arrows extending from the gas nozzle 41 of the gas injection unit 40 in Figure 1 represent the direction of gas injection, the direction of gas flow, and the strength of gas flow (relative magnitude of velocity). Figure 2 is a top view of the coating apparatus 100 shown in Figure 1. Figure 3 is an enlarged view of a part of the coating apparatus 100 shown in Figure 1. Figure 4 shows the results of a fluid simulation when gas is injected from the gas injection unit 40 using the coating apparatus 100 shown in Figure 1, and the flow of gas toward the coating liquid application unit 30 is suppressed by the flow straightening unit 50, and is a diagram showing the gas movement velocity.

[0009] Note that the coating apparatus 100 in Figures 1 to 3 uses an XYZ Cartesian coordinate system. The X-axis direction is along the direction in which the substrate 8 moves, for example, horizontally, by the transport unit 10. The Y-axis direction is a horizontal direction, for example, perpendicular to the direction in which the substrate 8 moves by the transport unit 10 (transport direction), and is along the width direction of the substrate 8. The Z-axis direction is perpendicular to the X-axis and Y-axis directions and is along the vertical direction (up and down direction in this case).

[0010] In this embodiment, an example is described in which the transport direction of the substrate 8 by the transport surface 10a of the transport unit 10 is horizontal, but the transport direction of the substrate 8 by the transport surface 10a of the transport unit 10 may be inclined as appropriate.

[0011] The coating apparatus 100 according to this embodiment includes a transport unit 10, a coating liquid supply unit 20, a coating liquid application unit 30, a gas injection unit 40, and a flow straightening unit 50. The coating apparatus 100 preferably includes, for example, a suction unit 60 that sucks gas above the coating liquid application unit 30. The coating apparatus 100 also includes a control unit 70 that controls the transport unit 10, the coating liquid supply unit 20, the gas injection unit 40, the suction unit 60, etc.

[0012] In this embodiment, the transport unit 10 will be described as an example in which a conveyor such as a precision stage driven by a ball screw driven by a motor is used as a stage on which a single-wafer glass substrate 8 moves horizontally. The upper surface 10a of the transport unit 10, which is the transport surface, is formed so that the length along the X-axis is longer than the length (width) along the Y-axis. Specifically, on the upper surface 10a, the length along the X-axis is longer than the length of the substrate 8 along the X-axis, and the length (width) along the Y-axis is longer than the length of the substrate 8 along the Y-axis.

[0013] In Figures 1 to 3, the substrate 8 represents a single-wafer glass substrate. When applying a coating solution to a single-wafer glass substrate 8, the size of the glass substrate 8 along the X-axis direction is limited to, for example, several hundred to several thousand mm or less. However, if the substrate 8 is, for example, a flexible resin film with a length exceeding tens of thousands of mm, it may be possible to continuously apply the coating solution L to a substrate 8 of such length. Single-wafer glass or resin film substrates 8 are fixed to a stage, which serves as a transport unit 10, by vacuum suction or the like, and transported.

[0014] The coating liquid supply unit 20 supplies the coating liquid L to the coating liquid application unit 30. The coating liquid supply unit 20 has the function of supplying the coating liquid L in a substantially uniform distribution in the width direction near the upper surface of the substrate 8, and various mechanisms are employed depending on the purpose of coating. The coating liquid application unit 30 may use, for example, a slit die (slot die) method that supplies the coating liquid L from a linear gap extending in the width direction, a meniscus coating method that supplies the coating liquid L from the surface of a rod-shaped member extending in the Y-axis direction (width direction), or an inkjet method that flies the coating liquid L from a head that moves back and forth in the Y-axis direction (width direction).

[0015] In this embodiment, the coating liquid application unit 30 will be described as using the slit die method. The coating liquid application unit 30 that applies the coating liquid L supplied from the coating liquid supply unit 20 to the substrate 8 faces the conveyance path 10a of the conveyance unit 10 and the upper surface of the substrate 8. The coating liquid application unit 30 has a function of continuously applying the coating liquid L supplied through the coating liquid supply unit 20 onto the substrate 8 through the discharge unit 31. The coating liquid application unit 30 faces the substrate 8 that moves relatively from the upstream side to the downstream side, and applies the coating liquid L supplied from the coating liquid supply unit 20 to the substrate 8. As shown in FIG. 2, the discharge unit 31 extends in the width direction of the substrate 8, which is the depth direction, and the coating liquid L is uniformly discharged in the width direction (Y-axis direction) of the substrate 8. It is preferable that the length in which the coating liquid L is discharged in the width direction is formed shorter than the length in the width direction of the substrate 8.

[0016] Note that the discharge unit 31 of the coating liquid application unit 30 has an appropriate distance from the upper surface of the substrate 8. For this reason, a space is formed for the coating liquid L to move from the coating liquid application unit 30 to the substrate 8.

[0017] In the discharge unit 31 of the coating liquid application unit 30, the liquid gathers due to the surface tension of the coating liquid L, forming a gas-liquid interface shape called a meniscus. The shape of the gas-liquid interface changes according to the pressure distribution of the atmosphere. In order to obtain a highly uniform liquid film of the coating liquid L on the substrate 8 from the coating liquid application unit 30, the gas-liquid interface needs to be in a stable state, and it is necessary to suppress the pressure distribution and air flow in the vicinity of the discharge unit 31 of the coating liquid application unit 30.

[0018] The gas injection unit 40 has a function of injecting gas (dry gas) from the gas injection port (injection surface) 41. The gas injection unit 40 is fixed, for example, to the frame body at the width direction end of the conveyance unit 10. The arrangement of the gas injection unit 40 is at a position that does not affect the movement of the conveyance surface 10a of the conveyance unit 10.

[0019] The gas injection unit 40 is equipped with a gas injection port 41 downstream of the coating liquid application unit 30 along the direction of movement of the substrate 8. The gas injected from the gas injection port 41 in the direction of gas injection passes near the upper surface 8a of the substrate 8. The gas injection unit 40 ejects gas from the gas injection port 41 toward the coating liquid L to dry the coating liquid L, gradually drying the coating liquid L along the direction of movement of the substrate 8.

[0020] The height of the gas nozzle 41 is preferably higher than the lower ends 511, 521, and 531 of the rectifier plates 51, 52, and 53, and the rectifier surfaces 51a, 52a, and 53a of each rectifier plate 51, 52, and 53 intersect a virtual line connecting the gas nozzle 41 and the coating liquid application section 30. As long as the gas nozzle 41 does not come into contact with the surface of the coating liquid L, the height of the gas nozzle 41 may be, for example, the same height as any of the lower ends 511, 521, and 531 of the rectifier plates 51, 52, and 53, or it may be lower than the lower ends 511, 521, and 531 of the rectifier plates 51, 52, and 53. Furthermore, it is preferable that the gas nozzle 41 is directed so that a portion of the gas hits the coating liquid L when the coating liquid L is being transported.

[0021] The gas injection unit 40 may be an air knife, which is a structure made of a metal block, or a fan, which is made of rotating blades. In an air knife, a gas at a higher pressure than the surroundings is injected from a long, straight gas injection port (gap) 41 in the Y-axis direction, for example, in the opposite direction to the transport direction of the substrate 8, thereby creating a velocity field on the substrate 8 with a flow velocity of, for example, several m / s to tens of m / s. As the dry gas passes near the coating liquid (liquid film) L, the volatilization of the solvent contained in the coating liquid L is promoted.

[0022] In this embodiment, the gas injection unit 40 is positioned downstream of the coating liquid application unit 30 and the flow straightening unit 50, and spaced apart from the flow straightening unit 50. The gas injection unit 40 is capable of injecting dry gas as compressed gas from the gas injection port 41, which extends in the depth direction of Figure 1, with high uniformity in the width direction of the substrate 8, along the transport direction of the transport unit 10, from downstream to upstream.

[0023] The flow straightening section 50 is fixed, for example, to the frame at the widthwise end of the conveying section 10. The arrangement of the flow straightening section 50 is such that it does not affect the movement of the conveying surface 10a of the conveying section 10. The flow straightening section 50 has the function of preventing the gas ejected from the gas injection section 40 from flowing near the coating liquid application section 30.

[0024] In this embodiment, the rectifier 50 comprises a first rectifier plate 51, a second rectifier plate 52, and a third rectifier plate 53.

[0025] The first rectifier plate 51 is positioned adjacent to the coating liquid supply unit 20 on the downstream side in the direction of transport of the substrate 8 by the transport unit 10, so as to be in contact with or without a gap from the coating liquid supply unit 20. The first rectifier plate 51 may be in contact with the coating liquid supply unit 20 or may be away from the coating liquid supply unit 20, as long as it is located downstream of the coating liquid application unit 30. The first rectifier plate 51 is positioned between the gas nozzle 41 of the gas injection unit 40 and the coating liquid application unit 30, and is positioned on the flow path of the gas from the gas nozzle 41 of the gas injection unit 40. The second rectifier plate 52 is positioned adjacent to the first rectifier plate 51 on the downstream side in the direction of transport of the substrate 8 by the transport unit 10. The second rectifier plate 52 is positioned between the gas nozzle 41 of the gas injection unit 40 and the coating liquid application unit 30, and is positioned on the flow path of the gas from the gas nozzle 41 of the gas injection unit 40. The third rectifier plate 53 is positioned adjacent to the second rectifier plate 52 on the downstream side in the direction of transport of the substrate 8 by the transport unit 10. The third rectifier plate 53 is positioned between the gas nozzle 41 of the gas injection unit 40 and the coating liquid application unit 30, and is positioned on the gas flow path from the gas nozzle 41 of the gas injection unit 40.

[0026] Each of the rectifier plates 51, 52, and 53 is made of a material that is not affected by the atmosphere of the coating apparatus 100 and is designed in a shape that does not deform under the pressure of the gas injected by the gas injection unit 40. As an example, each of the rectifier plates 51, 52, and 53 may be made of a molded sheet metal material such as stainless steel or aluminum. The shape of each of the rectifier plates 51, 52, and 53 is designed in various ways according to the specifications of the coating apparatus 100.

[0027] As shown in Figure 2, it is preferable that the width of each rectifier plate 51, 52, and 53 is greater than the width of the coating liquid L applied to the substrate 8.

[0028] Figure 3 is an enlarged view of a portion of the side view shown in Figure 1. As shown in Figure 3, the rectifier plates 51, 52, and 53 have rectifier surfaces 51a, 52a, and 53a on the side facing the gas injection port 41 of the gas injection unit 40, and deflect the gas away from the direction toward the coating liquid application unit 30. The rectifier surfaces 51a, 52a, and 53a of each rectifier plate 51, 52, and 53 are arranged to intersect a virtual line between the gas injection port 41 of the gas injection unit 40 and the coating liquid application unit 30. The rectifier surface 51a of the first rectifier plate 51 suppresses the generation of a pressure distribution of gas near the discharge port 31 of the coating liquid application unit 30 and prevents the airflow from directly hitting it. The rectifier plate 53a of the third rectifier plate 53 and the rectifier plate 52a of the second rectifier plate 52 deflect a portion of the gas flowing over the coating liquid L away from the direction toward the coating liquid application section 30, thereby reducing the flow velocity of the gas flowing over the coating liquid L toward the discharge section 31 of the coating liquid application section 30.

[0029] The first rectifier plate 51 is provided adjacent to the downstream side of the coating liquid application section 30 and is located between the coating liquid application section 30 and the gas injection section 40. The first rectifier plate 51 forms a space S between itself and the coating liquid application section 30, which is used for drying the coating liquid L. A component of the normal direction N1 of a part of the surface (rectifying surface) 51a of the first rectifier plate 51 is oriented in the direction of movement of the substrate 8 (+X axis direction) and in the direction away from the substrate 8 (+Z axis direction).

[0030] In addition, there may be a gap between the upper end 512 of the first rectifier plate 51 and the coating liquid supply unit 20, but it is preferable that there is no gap. It is preferable that the upper end 512 of the first rectifier plate 51 has a portion formed therein that prevents the passage of gas (passage in the vertical direction in Figure 1) through the outer surface of the coating liquid supply unit 20.

[0031] The first distance D1 between the coating liquid L applied to the upper surface 8a of the substrate 8 and the lower end (downstream end) 511 of the first rectifier plate 51, that is, between the end portion 511 of the first rectifier plate 51 that is close to the substrate 8 and the surface of the coating liquid L, is set to a first distance D1 that allows the coating liquid L to pass through without coming into contact with the lower end 511 of the first rectifier plate 51.

[0032] For example, it is preferable that the distance between the lower end (downstream end) 511 of the first rectifier plate 51 and the upper surface 8a of the substrate 8 be 10 mm or less. The first distance D1 between the lower end 511 of the first rectifier plate 51 and the upper surface of the coating liquid L is designed to be narrow, preferably 5 mm or less.

[0033] The second rectifier plate 52 is provided adjacent to the first rectifier plate 51 on its downstream side, between the first rectifier plate 51 and the gas injection section 40. The second rectifier plate 52 forms a space between itself and the first rectifier plate 51, and between itself and the coating section 30, which is used for drying the coating liquid L. A normal N2 of a portion of the surface (rectifying surface) 52a of the second rectifier plate 52 is oriented in the direction of movement of the substrate 8 and away from the substrate 8.

[0034] The second distance D2 between the coating liquid L applied to the upper surface 8a of the substrate 8 and the lower end (downstream end) 521 of the second rectifier plate 52, that is, between the end portion 521 of the second rectifier plate 52 that is close to the substrate 8 and the surface of the coating liquid L, is preferably set so that the second distance D2 ≥ the first distance D1. For example, the distance between the lower end (downstream end) 521 of the second rectifier plate 52 and the upper surface 8a of the substrate 8 may be 10 mm or less, or it may not be 10 mm or less.

[0035] The third rectifier plate 53 is provided adjacent to the downstream side of the second rectifier plate 52 and is located between the second rectifier plate 52 and the gas injection section 40. The third rectifier plate 53 forms spaces for drying the coating liquid L between itself and the second rectifier plate 52, between itself and the first rectifier plate 51, and between itself and the coating liquid application section 30. A normal N3 of a portion of the surface (rectifying surface) 53a of the third rectifier plate 53 is oriented in the direction of movement of the substrate 8 and away from the substrate 8.

[0036] The third distance D3 between the coating liquid L applied to the upper surface 8a of the substrate 8 and the lower end (downstream end) 531 of the third rectifier plate 53, that is, between the end portion 531 of the third rectifier plate 53 that is close to the substrate 8 and the surface of the coating liquid L, is preferably set so that the third distance D3 ≥ the second distance D2. For example, the distance between the lower end (downstream end) 531 of the third rectifier plate 53 and the upper surface 8a of the substrate 8 may be 10 mm or less, or it may not be 10 mm or less.

[0037] The rectifying surfaces 51a, 52a, and 53a of each rectifier plate 51, 52, and 53 extend, for example, in the depth direction (Y-axis direction) of Figure 1, and are formed by two vertically adjacent planes 55a and 55b. The two planes 55a and 55b are connected by a bent portion 55c. The normal direction of the upper plane 55a is closer to the X-axis direction, or coincides with the X-axis direction, than the normal direction of the lower plane 55b. In other words, the normal direction of the lower plane 55b is closer to the Y-axis direction than the normal direction of the upper plane 55a.

[0038] In this embodiment, the suction unit 60 is provided above the coating liquid supply unit 20. The suction unit 60 is provided distal to the distance of the coating liquid application unit 30 to the substrate 8, and sucks in the coating liquid L and the gas that comes into contact with the surface 51a of the first rectifier plate 51, the surface 52a of the second rectifier plate 52, and the surface 53a of the third rectifier plate 53 of the rectifier unit 50.

[0039] The control unit 70 controls the movement and stopping of the transport surface (stage) 10a of the transport unit 10 by speed control or torque control, etc. The control unit 70 controls the amount of coating liquid L supplied per unit time from the coating liquid supply unit 20 to the coating liquid application unit 30, the amount of coating liquid L discharged per unit time (thickness of coating liquid L) onto the surface of the substrate 8 by the coating liquid application unit 30, etc. The control unit 70 controls the amount of gas injected per unit time and the injection speed from the gas injection port 41 of the gas injection unit 40, etc. In addition, the control unit 70 controls the suction strength and ON / OFF of the suction unit 60, etc.

[0040] The control unit 70 is composed of one or more processors, such as a CPU (Central Processing Unit). Each control unit 70 performs various processes based on programs stored in memory or storage. In other words, the control unit 70 executes various programs as a software function unit. The control unit 70 may use an ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array) as a hardware function unit instead of a CPU, for example. The programs executed by the processors of the control unit 70 may be stored on a computer (server) connected to the control unit 70 via a network such as the Internet, or on a server in a cloud environment.

[0041] An example of coating solution L is a perovskite compound (perovskite ink) used to create the photoelectric conversion layer of a photoelectric conversion element such as a perovskite solar cell. Coating solution L as a perovskite compound includes a perovskite precursor that becomes the perovskite compound and a solvent. Coating solution L as a perovskite compound may also contain a first compound. The first compound includes, for example, at least one selected from the group consisting of pyrrolidone derivatives, urea derivatives, imidazole derivatives, pyridine derivatives, fullerene derivatives, carboxylic acid derivatives, thiophene derivatives, hydroxy derivatives, and diamine derivatives.

[0042] The boiling point of the solvent is, for example, 200°C or less. The solvent includes, for example, at least one selected from the group consisting of aliphatic hydrocarbons, aromatic hydrocarbons, alicyclic hydrocarbons, alcohols, aliphatic ketones, esters, nitriles, halogenated hydrocarbons, ethers, amides, and sulfoxides.

[0043] In coating solution L, the perovskite precursor that becomes a perovskite-type compound includes, for example, at least one selected from the group consisting of methylammonium iodide, methylammonium bromide, methylammonium chloride, methylammonium acetate, formamidinium iodide, formamidinium bromide, formamidinium chloride, cesium iodide, cesium bromide, cesium chloride, rubidium iodide, and potassium iodide. Alternatively, the perovskite precursor that becomes a perovskite-type compound includes, for example, at least one selected from the group consisting of guanidium iodide, guanidium bromide, guanidium thiocyanate, phenylethylammonium iodide, and butylammonium iodide. Alternatively, a perovskite precursor that becomes a perovskite-type compound includes, for example, at least one selected from the group consisting of lead(II) iodide, lead(II) bromide, lead(II) chloride, lead(II) acetate, lead(II) thiocyanate, tin(II) iodide, tin(II) bromide, tin(II) chloride, tin(II) fluoride, and germanium(II) iodide. Alternatively, a perovskite precursor that becomes a perovskite-type compound includes at least one selected from the group consisting of benzylamine hydroiodide, formamidinium tetrafluoroborate, aniline hydroiodide, 2,2'-(1,2-phenylene)bis(ethane-1-amine) diiodide, formamidine thiocyanate, 2-(4-methoxyphenyl)ethylamine hydroiodide, and morpholine hydroiodide.

[0044] In addition to perovskite-type compounds, various other materials can be used as the coating solution L, for example, to be coated onto the substrate 8. The coating solution L should be one that precipitates and crystals grow on the substrate 8, for example, as the solvent dries.

[0045] The operation of the coating apparatus 100 will be described below. Note that the term "conveying direction" can refer to either the +X axis direction or the -X axis direction (opposite to the conveying direction).

[0046] The control unit 70 of the coating apparatus 100 moves the upper surface 10a of the transport unit 10 in the +X axis direction with the substrate 8 placed on its upper surface, and while moving the substrate 8 in the +X axis direction, applies the coating liquid L from the coating liquid application unit 30 through the coating liquid supply unit 20 to the substrate 8. At this time, the coating liquid L is applied from the downstream end (front end; left side in Figure 2) to the upstream end (rear end; right side in Figure 2) of the substrate 8. Also, as the substrate 8 moves in the transport direction (length direction) and passes through the coating liquid application unit 30 which extends in the width direction, a liquid film of coating liquid L is formed in a predetermined area on the substrate 8. The control unit 70 adjusts the thickness of the coating liquid L based on the relationship between, for example, the transport speed of the transport surface 10a of the transport unit 10 and the amount of coating liquid L discharged per unit time from the coating liquid application unit 30.

[0047] The volatile components contained in the solvent of the coating liquid L begin to dry, for example, from the moment the coating liquid is applied from the coating application section 30 to the substrate 8. Therefore, from the moment the coating liquid L is applied to the substrate 8, a portion of the solvent contained in the coating liquid L evaporates in the space S from the coating liquid L to the lower end 511 of the first rectifier plate 51, and drying progresses.

[0048] Furthermore, the gas injection unit 40 is positioned further downstream from the three rectifier plates 51, 52, and 53, which are arranged sequentially from upstream to downstream. Above the substrate 8 coated with the coating liquid L that has passed through the rectifier unit 50, an empty space is created. Therefore, for example, the space above the rectifier unit 50 and the gas injection unit 40 can be used as a space for photographing the state of the coating liquid L applied on the substrate 8 with a camera controlled by the control unit 70.

[0049] The control unit 70 controls the gas injection unit 40 and injects gas (dry air) in the -X-axis direction at a predetermined flow rate per unit time from a gas injection nozzle 41 that is long in the width direction (Y-axis direction). Therefore, the gas injection nozzle 41 injects, for example, dry air as gas, across the entire width direction of the substrate 8 from downstream to upstream. A portion of the gas is continuously directed onto the coating liquid L before reaching the rectifier unit 50. The velocity of the gas injected from the gas injection nozzle 41 decreases as it moves away from the gas injection nozzle 41 along the transport direction (-X-axis direction), but it is preferable that the velocity remains the same in the width direction at a predetermined position in the transport direction from the gas injection nozzle 41. In this way, by injecting gas from the gas injection unit 40 and directing the gas onto the coating liquid L on the substrate 8, the volatilization of the solvent contained in the coating liquid L is promoted.

[0050] Furthermore, the second distance D2 (≥ the first distance D1) between, for example, the lower side of the lower end 521 of the second rectifier plate 52 and the surface of the coating liquid L is formed to be appropriately narrow, and the third distance D3 (≥ the second distance D2) between, for example, the lower side of the lower end 531 of the third rectifier plate 53 and the surface of the coating liquid L is formed to be appropriately narrow. Therefore, by appropriately setting these distances D1, D2, and D3, the velocity of the gas flowing in the space S between the first rectifier plate 51 and the coating liquid application section 30 can be adjusted.

[0051] Figure 4 shows the results of a fluid simulation when air is injected as a gas from the gas injection unit 40 using the coating apparatus 100 shown in Figures 1 to 3. Here, the velocity distribution of the airflow is shown. In the velocity distribution in Figure 4, 0 represents 0 m / s, but the value "10" does not simply represent 10 m / s, but includes values ​​of 10 m / s or more. In the simulation example shown in Figure 4, the injection velocity of the gas injection port 41 was set to 20 m / s.

[0052] When gas is injected from the gas nozzle 41 of the gas injection unit 40, a portion of the gas is directed onto the surface 53a of the third rectifier plate 53. A portion of the gas, containing volatile components, is guided towards the suction unit 60 through, for example, the upper side of the upper end 532 of the third rectifier plate 53. Another portion of the gas is directed onto the surface 52a of the second rectifier plate 52 through, for example, the lower side of the lower end 531 of the third rectifier plate 53. It is also directed towards the first rectifier plate 51 through, for example, the lower side of the lower end 521 of the second rectifier plate 52.

[0053] When a portion of the gas is directed onto the surface 52a of the second rectifier plate 52, a portion of the gas is guided towards the suction section 60, for example, through the upper side of the upper end 522 of the second rectifier plate 52. Another portion of the gas is directed onto the surface 51a of the first rectifier plate 51, for example, through the lower side of the lower end 521 of the second rectifier plate 52.

[0054] When a portion of the gas is directed onto the surface 51a of the first rectifier plate 51, a portion of the gas is guided toward the suction section 60, for example, through the upper side of the upper end 512 of the first rectifier plate 51. Another portion of the gas flows toward the coating section 30, for example, through the lower side of the lower end 511 of the first rectifier plate 51. At this time, the first distance D1 between the lower side of the lower end 511 of the first rectifier plate 51 and the surface of the coating liquid L is formed to be appropriately narrow. Furthermore, a space S separates the lower end 511 of the first rectifier plate 51 from the coating section 30. As a result, the gas from the gas nozzle 41 of the gas injection section 40 can reach the coating section 30 with a flow velocity of 0 or nearly 0. That is, the air flow velocity between the first rectifier plate 51 and the coating section 30 is 0 or nearly 0. Therefore, the gas injected from the gas nozzle 41 of the gas injection unit 40 can minimize its influence on the gas-liquid interface shape formed by the coating liquid L discharged from the discharge unit 31 of the coating liquid application unit 30. As a result, when coating liquid L is applied from the discharge unit 31 of the coating liquid application unit 30 to the substrate 8, as shown in Figure 1, the gas from the gas injection unit 40 is prevented from hitting the coating liquid L, and the shape of the gas-liquid interface of the liquid pool of coating liquid L between the coating liquid application unit 30 and the substrate 8 is prevented from being disturbed. Using the coating apparatus 100 according to this embodiment, it becomes easier to maintain uniformity in the thickness of the coating liquid L applied from the coating liquid application unit 30 to the upper surface of the substrate 8 while appropriately drying the coating liquid L applied from the coating liquid application unit 30 to the upper surface of the substrate 8.

[0055] Furthermore, air containing volatile components from the coating liquid L is guided toward the suction section 60 above the coating liquid supply section 20 by the rectifying surface 53a of the third rectifier plate 53, the rectifying surface 52a of the second rectifier plate 52, and the rectifying surface 51a of the first rectifier plate 51. This suppresses the volatile components contained in the coating liquid L from affecting the coating apparatus 100.

[0056] Incidentally, if the rectifier section 50 is not present, the gas from the gas injection section 40 is more likely to directly hit the coating section 30. When gas at an appropriate velocity from the gas injection section 40 hits the coating section 30, the gas-liquid interface of the coating liquid L reservoir in the coating section 30 becomes wavy, that is, the shape of the gas-liquid interface of the reservoir becomes disordered, which may reduce the uniformity of the thickness of the coating liquid L.

[0057] In the coating apparatus 100 according to this embodiment, the flow straightening section 50 prevents the gas from the gas injection section 40 from passing through the flow straightening section 50 and directly reaching the coating liquid application section 30. In this way, the flow straightening section 50 appropriately dries the coating liquid L with the gas injected from the gas injection section 40, while appropriately blocking the gas from reaching the coating liquid application section 30, thereby changing the direction of gas flow and preventing gas from flowing into the vicinity of the coating liquid application section 30.

[0058] When applying a coating liquid (solution) with low solvent viscosity onto a substrate 8, if the gas flow rate near the top surface of the substrate 8 is high, the coating liquid L may undulate, resulting in an uneven thickness of the active material after drying. Conversely, if the gas flow rate near the top surface of the substrate 8 is slow, the time required for the solvent to evaporate increases, causing the active material to aggregate, which may also result in an uneven thickness of the coating liquid L.

[0059] By using the coating apparatus 100 according to this embodiment, the coating liquid L on the side closer to the gas injection unit 40 is away from the coating liquid application unit 30, and the solvent contained in the coating liquid L is drying, so there is no problem in applying gas at an appropriate velocity to the coating liquid L. On the side upstream from the gas injection unit 40 and farther from the gas injection unit 40, the drying of the solvent has not progressed as much as on the downstream side, so gas at a slower velocity can be applied. Therefore, the coating apparatus 100 according to this embodiment can create an appropriate air velocity distribution on the upper surface of the substrate 8 according to the degree to which the solvent in the coating liquid L is drying. For this reason, the gas injection unit 40 of the coating apparatus 100 according to this embodiment can form a flow velocity distribution to which the air knife strikes. The gas injection unit 40 of the coating apparatus 100 according to this embodiment works in cooperation with the flow straightening unit 50 to slow down the flow velocity on the upstream side of the coating film L and increase the flow velocity on the downstream side. Thus, a coating apparatus 100 is provided that can coat the coating liquid L on the substrate 8 with a more uniform thickness.

[0060] According to this embodiment, for example, by appropriately setting the first distance D1 between the lower end (downstream end) 511 of the first rectifier plate 51 and the coating liquid application section 30, it is possible to prevent the gas from the gas injection section 40 from flowing into the coating liquid application section 30 at an appropriate flow rate. On the other hand, after the coating liquid L on the substrate 8 has passed through the space S between the lower end (downstream end) 511 of the rectifier plate 51 and the coating liquid application section 30, gas at an appropriate flow rate from the gas injection section 40 can be actively applied to volatilize the volatile components of the solvent in the coating liquid L. Furthermore, by using one or more rectifier plates 51, 52, 53, the gas flow rate can be reduced, allowing gas at an appropriate flow rate to be applied to the coating liquid L that has not yet dried.

[0061] Furthermore, by using the third rectifier plate 53 and the second rectifier plate 52, the flow velocity of the gas injected from the gas injection port 41 toward the coating liquid application section 30 can be gradually reduced so that the gas is directed toward the first rectifier plate 51. For this reason, when using the coating apparatus 100 according to this embodiment, when coating a coating liquid (solution) with low solvent viscosity onto the substrate 8, even if the gas flow velocity near the downstream side of the upper surface of the substrate 8 is appropriately fast, the gas-liquid interface of the liquid pool of coating liquid L on the upstream side of the substrate 8 surface can be prevented from becoming wavy by appropriately using the rectifier plates 51, 52, and 53, and the thickness of the active material after drying can be prevented. In addition, by using the coating apparatus 100 according to this embodiment, the gas flow velocity near the downstream side of the upper surface of the substrate 8 can be appropriately increased, the time required for solvent evaporation can be further shortened, and the active material can be prevented from agglomerating, thus preventing the thickness of the coating liquid L from becoming uneven.

[0062] Therefore, by using the coating apparatus 100 according to this embodiment, in order to obtain an active material with a highly uniform film thickness using an appropriate coating liquid L, the flow velocity of the gas flowing over the upper surface of the substrate 8 is controlled by the flow straightening unit 50, and the solvent can be evaporated uniformly and in a short time.

[0063] The space S between the back surface of the first rectifier plate 51 and the coating liquid application section 30 has the function of ensuring time for a specific position on the surface of the substrate 8 to move from the coating liquid application section 30 to the lower end of the first rectifier plate 51. Immediately after passing through the coating liquid application section 30, the liquid film on the substrate 8 is thick, so there is a high possibility that the liquid film will ripple due to the gas flow. By allowing the substrate 8 to pass through the space S between the back surface of the first rectifier plate 51 and the coating liquid application section 30, and ensuring time for the solvent to evaporate through natural drying, the thickness of the coating liquid (liquid film) L can be reduced to a thickness that is less likely to cause ripple due to the passage of airflow. When the substrate 8 passes the lower end 511 of the first rectifier plate 51, gas from the gas injection port 41 of the gas injection section 40 passes over the upper surface of the substrate 8, promoting the volatilization of volatile components contained in the coating liquid L.

[0064] The space S between the back surface of the first rectifier plate 51 and the coating liquid application section 30 refers to a space where gas from the gas injection port 41 of the gas injection section 40 is less likely to flow in. The size of the space S is designed according to the transport speed of the transport section 10. For example, when the transport speed of the substrate 8 by the transport section 10 is about 0.1 m / s to 5 m / s, it is preferable that the size of the space S (the distance between the lower end 511 of the first rectifier plate 51 and the coating liquid application section 30) be about 1 m in the transport direction of the substrate 8 in order to ensure an appropriate amount of time for natural drying. However, if the transport speed is slow, around 0.1 m / s, the distance may be set to about 100 mm.

[0065] The transport unit 10 has the function of moving the relative positions of the coating liquid supply unit 20 and the substrate 8 while maintaining the distance between them. Specifically, the transport unit 10 refers to a film transport mechanism consisting of a moving stage on which the substrate 8 is movably placed, and transport rollers, etc.

[0066] In this embodiment, it was explained that the third distance D3 ≥ the second distance D2 ≥ the first distance D1. For example, it is also preferable that the third distance D3 ≥ the first distance D1 ≥ the second distance D2.

[0067] In this embodiment, an example of transporting the substrate 8 by the transport unit 10 has been described. For example, with the positional relationship of the coating liquid supply unit 20, coating liquid application unit 30, gas injection unit 40, and flow straightening unit 50 fixed, the coating liquid supply unit 20, coating liquid application unit 30, gas injection unit 40, and flow straightening unit 50 may be moved relative to the substrate 8 without moving the substrate 8.

[0068] Alternatively, it is also preferable to move the coating liquid supply unit 20, the coating liquid application unit 30, the gas injection unit 40, the flow straightening unit 50, and the substrate 8 relative to each other.

[0069] According to this embodiment, the gas injection unit 40 of the coating apparatus 100 can form a flow velocity distribution that is struck by the air knife. The gas injection unit 40 of the coating apparatus 100 according to this embodiment works in cooperation with the flow straightening unit 50 to slow down the flow velocity on the upstream side of the coating film L and increase the flow velocity on the downstream side. Thus, a coating apparatus 100 is provided that can coat the coating liquid L on the substrate 8 with a more uniform thickness.

[0070] Incidentally, in order to control the film quality of, for example, a perovskite layer (perovskite-type compound) deposited and crystallized on the substrate 8, it is necessary to control the deposition and crystallization of the perovskite layer as the solvent of the coating liquid L on the substrate 8 dries. To this end, it is considered effective to control the time profile of the drying rate of the coating liquid L applied to the substrate 8 by the coating apparatus 100. By using the coating apparatus 100 according to this embodiment, the flow velocity of the gas flowing over the upper surface of the substrate 8 can be controlled by the flow straightening unit 50, and the solvent of the coating liquid L can be evaporated uniformly and in a relatively short time. Therefore, by using the coating apparatus 100 according to this embodiment, it is possible to deposit and crystallize, for example, a perovskite layer on the substrate 8 and obtain the desired film quality of the perovskite layer.

[0071] In this embodiment, the coating unit 30 is described as using a slit die method, but a meniscus coating method or an inkjet method may also be used. Specifically, in the slit die method and the meniscus coating method, a liquid reservoir may be formed between the ejection unit 31 of the coating unit 30 and the upper surface of the substrate 8. The ejection unit 31 of the coating unit 30 forms a liquid reservoir of the coating liquid L. In the inkjet method, a region (space) is formed between the ejection unit 31 of the coating unit 30 and the upper surface 8a of the substrate 8, from which droplets (coating liquid L) fly from the coating unit 30 toward the upper surface 8a of the substrate 8.

[0072] For example, when an inkjet method is used for the coating unit 30, similar to when a slit die method is used, the rectifier unit 50 prevents gas from the gas injection unit 40 from hitting the coating liquid when the coating liquid is applied from the coating unit 30 to the substrate 8, thereby preventing disruption to the flight path of the droplets (coating liquid L) between the coating unit 30 and the substrate 8.

[0073] In this embodiment, an example in which the rectifier section 50 uses three rectifier plates 51, 52, and 53 has been described, but for example, two rectifier plates 51 and 52 may be used, or four or more rectifier plates may be used.

[0074] For example, looking at the gas movement speed shown in Figure 4, it is clear that the suction unit 60 according to this embodiment sucks up gas that has flowed over part or all of the surface of the coating liquid L downstream of the first rectifier plate 51. It is also preferable that a suction duct be connected to the suction unit 60 shown in Figure 1, or to a suction unit placed at an appropriate position, so that gas at an appropriate position facing the conveying surface 10a of the conveying unit 10 can be locally sucked up. Furthermore, the suction unit 60 may have a structure that allows gas to be sucked up through part or all of the surface of a punching plate installed at a position facing the conveying surface 10a of the conveying unit 10. Thus, the form of the suction unit 60 can be as appropriate.

[0075] (First variation) A coating apparatus 100 according to the first modification of the first embodiment will be described with reference to Figure 5. Figure 5 is a side view of the coating apparatus 100. In Figure 5, the suction unit 60 and control unit 70 shown in Figure 1 are omitted from the illustration. In Figure 5, the arrows extending from the gas nozzle 41 of the gas injection unit 40 represent the direction of gas injection, the direction of gas flow, and the strength of gas flow (relative magnitude of velocity).

[0076] As shown in Figure 5, in this modified example, the rectifier section 50 includes one rectifier plate 51. Of the rectifier plate 51, the rectifier surface 51a facing the gas injection section 40 is, for example, a flat surface.

[0077] The coating apparatus 100 has a space S formed between the first rectifier plate 51 and the coating liquid application section 30, which allows an appropriate amount of time for the coating liquid L to pass from the coating liquid application section 30 to the lower end (downstream end) 511 of the rectifier plate 51. The gas injection section 40 and the rectifier section 50 are arranged so that the gas injected from the gas injection port 41 of the gas injection section 40 does not directly hit the coating liquid application section 30.

[0078] Therefore, the rectifier plate of the rectifier section 50 may be one, or it may be multiple, as described in the first embodiment.

[0079] Therefore, the gas injection unit 40 of the coating apparatus 100 according to this modified example can form a flow velocity distribution that the air knife strikes. The gas injection unit 40 of the coating apparatus 100 according to this modified example works in cooperation with the flow straightening unit 50 to slow down the flow velocity on the upstream side of the coating film L and speed up the flow velocity on the downstream side. As described in the first embodiment, this modified example provides a coating apparatus 100 that can coat the substrate 8 with a more uniform thickness of coating liquid L.

[0080] (Second variation) A second modified example of the first embodiment will be explained with reference to Figure 6.

[0081] Figure 6 shows a modified example of the rectifier plate 52 or rectifier plate 53 of the coating apparatus 100 according to the first embodiment (Figures 1 to 4). Figure 6 shows the rectifier plate 53 as viewed from the downstream side to the upstream side in the conveying direction of the conveying section 10.

[0082] In Figure 6, it is preferable that a plurality of recesses 56 are formed at the lower end 531 of the rectifier plate 53 to adjust the amount of gas that passes through from the gas injection port 41 of the gas injection unit 40. Here, the recesses 56 are shown on the left side of the lower end of the rectifier plate 53, but it is preferable that they be formed over the entire length of the lower end of the rectifier plate 53 in the depth direction (Y-axis direction). Furthermore, it is preferable that the recesses 56 are formed at equal intervals and of the same size in the depth direction (Y-axis direction).

[0083] Similarly, it is preferable that a plurality of openings 57 are formed near the lower end 531 of the rectifier plate 53 in Figure 6 to adjust the amount of gas that passes through from the gas injection port 41 of the gas injection unit 40. Here, the openings 57 are shown to the right of the lower end of the rectifier plate 53, but it is preferable that they are formed over the entire length of the lower end 531 of the rectifier plate 53 in the depth direction (Y-axis direction). Furthermore, it is preferable that the openings 57 here are formed at equal intervals and of the same size in the depth direction (Y-axis direction) of the rectifier plate 53.

[0084] As shown in this modified example, even if the coating apparatus 100 uses such a rectifier plate 53, the gas injection section 40 of the coating apparatus 100 can form a flow velocity distribution that the air knife strikes. The gas injection section 40 of the coating apparatus 100 according to this modified example works in cooperation with the rectifier section 50 to slow down the flow velocity on the upstream side of the coating film L and speed up the flow velocity on the downstream side. And, as described in the first embodiment, this modified example provides a coating apparatus 100 that can coat the substrate 8 with a more uniform thickness of coating liquid L.

[0085] Furthermore, it is also preferable that the rectifier plate 52 be formed in the same manner as the rectifier plate 53.

[0086] (Third variation) A coating apparatus 100 according to a third modification of the first embodiment will be described with reference to Figure 7. Figure 7 is a side view of the coating apparatus 100. In Figure 7, the suction unit 60 and control unit 70 shown in Figure 1 are omitted from the illustration. In Figure 7, the arrows extending from the gas nozzle 41 of the gas injection unit 40 represent the direction of gas injection, the direction of gas flow, and the strength of gas flow (relative magnitude of velocity).

[0087] In this modified example, the rectifier section 50 comprises two rectifier plates 51 and 52. The rectifier surfaces 51a and 52a of each rectifier plate 51 and 52 are curved surfaces that are convex downwards.

[0088] It is preferable that the second distance D2 ≥ the first distance D1. In this modified example, we will explain assuming that the second distance D2 > the first distance D1.

[0089] The coating apparatus 100 has a space S formed between the first rectifier plate 51 and the coating liquid application section 30, which allows an appropriate amount of time for the coating liquid L to pass from the coating liquid application section 30 to the lower end 511 of the first rectifier plate 51. The gas injection section 40 and the rectifier section 50 are arranged so that the gas injected from the gas injection port 41 of the gas injection section 40 does not directly hit the coating liquid application section 30.

[0090] On the rectifying surface 52a of the second rectifier plate 52 of the coating apparatus 100 shown in Figure 7, when gas from the gas injection port 41 of the gas injection unit 40 is directed onto the rectifying surface 52a of the second rectifier plate 52, a portion of the gas is deflected along the rectifying surface 52a away from the direction toward the coating liquid application unit 30 and directed upward. A portion of the gas is then guided toward the suction unit 60, for example, by passing over the upper end 522 of the second rectifier plate 52.

[0091] Furthermore, a portion of the gas that hits the rectifying surface 52a flows towards the first rectifying plate 51 through a gap of second distance D2 between the lower end 521 of the second rectifying plate 52 and the upper surface of the coating liquid L. At this time, the second distance D2 > the first distance D1, and the first distance D1 is set to, for example, 5 mm or less. Therefore, almost all of the gas that flows to the first rectifying plate 51 through the lower end 521 of the second rectifying plate 52 hits the rectifying surface 51a of the first rectifying plate 51. A portion of the gas is deflected away from the direction toward the coating liquid application section 30 along the rectifying surface 51a and directed upward. Then, a portion of the gas is guided toward the suction section 60 through, for example, the upper side of the upper end 512 of the first rectifying plate 51.

[0092] Furthermore, the gas attempting to reach the coating area 30 by passing under the lower end 511 of the first rectifier plate 51 has a velocity of 0 or nearly 0 when it reaches the coating area 30 because of the space S, which creates a distance (for example, about 1 m) between the lower end 511 of the first rectifier plate 51 and the coating area 30, and therefore does not affect the coating area 30.

[0093] The gas injection unit 40 of the coating apparatus 100 according to this modified example can form a flow velocity distribution that the air knife strikes. The gas injection unit 40 of the coating apparatus 100 according to this modified example works in cooperation with the flow straightening unit 50 to slow down the flow velocity on the upstream side of the coating film L and speed up the flow velocity on the downstream side. As described in the first embodiment, this modified example provides a coating apparatus 100 that can coat the substrate 8 with a more uniform thickness of coating liquid L.

[0094] The surface (rectifying surface) 51a of the rectifier plate 51 may be flat, a shape formed by combining multiple flat surfaces at a bent portion, or a curved surface. When the rectifier section 50 of the coating apparatus 100 is equipped with multiple rectifier plates 51, 52, 53, the rectifier plates 51, 52, 53 shown in Figures 1 to 3 of the first embodiment, the rectifier plate 51 shown in Figure 5 of the first modified example, and the rectifier plate 51 shown in Figure 6 of the second modified example may be used in appropriate combinations.

[0095] Furthermore, the rectifying surfaces 51a and 52a of the rectifier plates 51 and 52 are designed in a downward-convex arc shape in order to continuously change the direction of the airflow onto the horizontal substrate 8.

[0096] (Second Embodiment) A coating apparatus 100 according to the second embodiment will be described with reference to Figure 8. Figure 8 is a side view of the coating apparatus 100. In Figure 8, the control unit 70 shown in Figure 1 is omitted from the illustration. In Figure 8, the arrows extending from the gas nozzle 41 of the gas injection unit 40 represent the direction of gas injection, the direction of gas flow, and the strength of gas flow (relative magnitude of velocity).

[0097] As shown in Figure 8, the gas injection unit 40 of the coating apparatus 100 according to this embodiment is located adjacent to the downstream side of the coating liquid supply unit 20 and above the flow straightening unit 50. The gas injection unit 40 may also be located above the coating liquid supply unit 20.

[0098] The suction unit 60 is positioned, for example, at a location separated downstream from the flow straightening unit 50. The suction unit 60 is also positioned at a location separated upward from the upper surface of the coating liquid L.

[0099] The rectifier plate 51 of the rectifier section 50 is, for example, the rectifier plate 51 shown in Figure 7 of the third modified example of the first embodiment.

[0100] The rectifier plate 51 is positioned between the gas nozzle 41 of the gas injection unit 40 and the coating liquid application unit 30, and is positioned on the gas flow path from the gas nozzle 41 of the gas injection unit 40. Of the rectifier plate 51, the position to which the gas injected from the gas nozzle 41 of the gas injection unit 40 is directed is the rectifier surface (surface) 51a side of the rectifier plate 51. The upper end 512 of the rectifier plate 51 is adjacent to, for example, the coating liquid supply unit 20, and there may be a gap between the upper end 512 of the first rectifier plate 51 and the coating liquid supply unit 20, but it is preferable that there is no gap. It is preferable that the upper end 512 of the first rectifier plate 51 has a portion formed that prevents gas from passing back and forth (vertical movement in Figure 8) through the outer circumferential surface of the coating liquid supply unit 20.

[0101] Preferably, the lower end 511 of the rectifier plate 51 is brought close to the upper surface of the substrate 8, and the surface of the rectifier plate 51 on the lower end 511 side is brought close to being parallel to the upper surface of the substrate 8. Therefore, the gas injected from the gas nozzle 41 of the gas injection unit 40 and flowing along the rectifier plate 51 passes the lower end 511 of the rectifier plate 51 and then flows along the upper surface 8a of the substrate 8 in the conveying direction.

[0102] Furthermore, a component of the normal direction N1 of a portion of the surface (rectifying surface) 51a of the first rectifier plate 51 is directed in the direction of movement of the substrate 8 and away from the substrate 8.

[0103] The gas nozzle 41 of the gas injection unit 40 is directed in a direction perpendicular to the direction of movement of the substrate 8 (-Z axis direction), or from the upstream side to the downstream side of the coating liquid application unit 30. The surface 51a of the first rectifier plate 51 is provided between the gas nozzle 41 and the region between the coating liquid application unit 30 and the substrate 8.

[0104] The operation of the coating apparatus 100 will now be described. Details of the parts described in the first embodiment will be omitted as appropriate.

[0105] The gas injected from the gas nozzle 41 of the gas injection unit 40 does not reach the space S because there is no gap between the upper end 512 of the first rectifier plate 51 and the coating liquid supply unit 20. Therefore, the gas from the gas nozzle 41 of the gas injection unit 40 can reach the coating liquid application unit 30 with a flow velocity of 0 or nearly 0. Consequently, the influence of the gas injected from the gas nozzle 41 of the gas injection unit 40 on the shape of the gas-liquid interface formed by the coating liquid L discharged from the discharge unit 31 of the coating liquid application unit 30 can be minimized.

[0106] When gas is injected from the gas nozzle 41 of the gas injection unit 40, a portion of the gas is directed onto the surface 51a of the first rectifier plate 51. A portion of the gas, which contains volatile components, is guided along the upper surface 8a (the surface of the coating liquid L) of the substrate 8, passing under the lower end 511 of the first rectifier plate 51, towards the suction unit 60 which is spaced apart downstream of the rectifier plate 51.

[0107] The coating apparatus 100 has a space S between the first rectifier plate 51 and the coating liquid application section 30 that allows an appropriate amount of time for the coating liquid L to pass from the coating liquid application section 30 to the lower end 511 of the rectifier plate 51, and the gas injection section 40 and the first rectifier plate 51 of the rectifier section 50 are positioned so that the gas injected from the gas injection port 41 of the gas injection section 40 does not directly hit the coating liquid application section 30.

[0108] By using the coating apparatus 100 according to this embodiment, the coating liquid L on the side furthest from the gas injection section 40 moves away from the coating liquid application section 30, and the solvent contained in the coating liquid L dries out, so there is no problem in applying gas at an appropriate velocity to the coating liquid L. Therefore, the coating apparatus 100 according to this embodiment can generate an appropriate velocity distribution on the upper surface of the substrate 8 according to the degree to which the solvent in the coating liquid L dries out.

[0109] The gas injection unit 40 of the coating apparatus 100 according to this embodiment can form a flow velocity distribution that is struck by the air knife. The gas injection unit 40 of the coating apparatus 100 according to this embodiment works in cooperation with the flow straightening unit 50 to slow down the flow velocity on the upstream side of the coating film L and increase the flow velocity on the downstream side. Therefore, according to this embodiment, a coating apparatus 100 is provided that can coat the substrate 8 with a more uniform thickness of coating liquid L.

[0110] Furthermore, in this embodiment, the suction unit 60 is positioned further downstream from the rectifier plate 51. Above the substrate 8 coated with the coating liquid L that has passed through the rectifier unit 50, an empty space is formed. Therefore, for example, the space above the rectifier unit 50 and the suction unit 60 can be used as a space for photographing the state of the coating liquid L applied on the substrate 8 with a camera controlled by the control unit 70.

[0111] Furthermore, by using the coating apparatus 100 according to this embodiment, it is possible to perform deposition and crystal growth of, for example, a perovskite layer on the substrate 8, and obtain a desired film quality such as a perovskite layer.

[0112] (First variation) A coating apparatus 100 according to the first modification of the second embodiment will be described with reference to Figure 9. Figure 9 is a side view of the coating apparatus 100. In Figure 9, the control unit 70 shown in Figure 1 and the suction unit 60 shown in Figure 8 are omitted from the illustration. The arrows extending from the gas nozzles 41 of the gas injection units 40a, 40b, and 40c in Figure 9 represent the direction of gas injection, the direction of gas flow, and the strength of gas flow (relative magnitude of velocity).

[0113] As shown in Figure 9, the coating apparatus 100 according to this modified example comprises a plurality of rectifier plates 51, 52, 53 and a plurality of gas injection units 40a, 40b, 40c.

[0114] The rectifier plate 51 is positioned between the gas nozzle 41 of the gas injection unit 40a and the coating liquid application unit 30, and is positioned on the gas flow path from the gas nozzle 41 of the gas injection unit 40a. The gas injection unit 40a injects gas toward the rectifying surface 51a of the rectifier plate 51. The rectifier plate 52 is positioned between the gas nozzle 41 of the gas injection unit 40b and the coating liquid application unit 30, and is positioned on the gas flow path from the gas nozzle 41 of the gas injection unit 40b. The gas injection unit 40b injects gas toward the rectifying surface 52a of the rectifier plate 52. The rectifier plate 53 is positioned between the gas nozzle 41 of the gas injection unit 40c and the coating liquid application unit 30, and is positioned on the gas flow path from the gas nozzle 41 of the gas injection unit 40c. The gas injection unit 40c injects gas toward the rectifying surface 53a of the rectifying plate 53.

[0115] For example, assume that the distance from the upper surface 8a of the substrate 8 to the gas injection port 41 of the multiple gas injection units 40a, 40b, and 40c is approximately the same for each. Also assume that the positional relationship of the first gas injection unit 40a with respect to the upper end 512 of the first rectifier plate 51, the positional relationship of the second gas injection unit 40b with respect to the upper end 522 of the second rectifier plate 52, and the positional relationship of the third gas injection unit 40c with respect to the upper end 532 of the third rectifier plate 53 are the same for each.

[0116] Furthermore, it is preferable that the flow rate of gas injected per unit time from the gas nozzle 41 of the first gas injection unit 40a is less than that of the gas nozzle 41 of the second gas injection unit 40b. Also, it is preferable that the flow rate of gas injected per unit time from the gas nozzle 41 of the second injection unit 40b is less than that of the gas nozzle 41 of the third gas injection unit 40c.

[0117] Furthermore, when gas is injected from the first gas injection unit 40a, the gas strikes the rectifying surface 51a of the first rectifier plate 51, but is positioned so that the gas does not directly strike the rectifying surface 52a of the second rectifier plate 52 or the rectifying surface 53a of the third rectifier plate 53. Similarly, when gas is injected from the second gas injection unit 40b, the gas strikes the rectifying surface 52a of the second rectifier plate 52, but is positioned so that the gas does not directly strike the rectifying surface 51a of the first rectifier plate 51 or the rectifying surface 53a of the third rectifier plate 53. The third gas injection unit 40c is positioned such that when gas is injected from the third gas injection unit 40c, the gas strikes the straightening surface 53a of the third straightening plate 53, but the gas does not directly strike the straightening surface 51a of the first straightening plate 51 or the straightening surface 52a of the second straightening plate 52.

[0118] The coating apparatus 100 has a space S formed between the first rectifier plate 51 and the coating liquid application section 30, which allows an appropriate amount of time for the coating liquid L to pass from the coating liquid application section 30 to the lower end 511 of the rectifier plate 51. The gas injection section 40a and the rectifier section 50 are arranged so that the gas injected from the gas injection port 41 of the gas injection section 40a does not directly hit the coating liquid application section 30.

[0119] By using the coating apparatus 100 according to this modified example, the coating liquid L on the side furthest from the gas injection sections 40a, 40b, and 40c is separated from the coating liquid application section 30, and the solvent contained in the coating liquid L is drying, so there is no problem in applying gas at an appropriate speed to the coating liquid L. For this reason, by injecting gas at a faster speed than gas injection section 40a from gas injection section 40b, and gas at a faster speed than gas injection section 40b from gas injection section 40c, more gas can be applied to the surface of the coating liquid L, and the drying of the coating liquid L can be promoted.

[0120] Therefore, the coating apparatus 100 according to this modified example can generate a flow velocity distribution of an appropriate speed on the upper surface of the substrate 8, depending on the degree to which the solvent of the coating liquid L is drying. For this reason, the gas injection sections 40a, 40b, and 40c of the coating apparatus 100 according to this modified example can form a flow velocity distribution to which the air knife strikes. The gas injection sections 40a, 40b, and 40c of the coating apparatus 100 according to this modified example can work together with the flow straightening section 50 to slow down the flow velocity on the upstream side of the coating film L and speed up the flow velocity on the downstream side.

[0121] Furthermore, according to the first modification of the second embodiment, a coating apparatus 100 is provided that can coat the substrate 8 with a more uniform thickness of coating liquid L.

[0122] (Second variation) A coating apparatus 100 according to a second modification of the second embodiment will be described with reference to Figure 10. Figure 10 is a side view of the coating apparatus 100. In Figure 10, the control unit 70 shown in Figure 1 and the suction unit 60 shown in Figure 8 are omitted from the illustration. In Figure 10, the arrows extending from the gas nozzle 41 of the gas injection unit 40 represent the direction of gas injection, the direction of gas flow, and the strength of gas flow (relative magnitude of velocity).

[0123] The coating apparatus 100 shown in Figure 10 shows a slit die type coating supply unit 20 and a coating application unit 30 that supply the coating liquid L from a linear gap extending in the width direction. The coating application unit 30 may, for example, use a meniscus coating method that supplies the coating liquid L from the surface of a rod-shaped member extending in the Y-axis direction (width direction).

[0124] The first rectifier plate 51 is positioned between the gas injection port 41 of the gas injection unit 40a and the coating liquid application unit 30, and is positioned on the gas flow path from the gas injection port 41 of the gas injection unit 40. The first rectifier plate 51 is used as a windbreak to prevent the flow of gas from the coating liquid supply unit 20 toward the coating liquid application unit 30. A portion of the rectifying surface 51a of the first rectifier plate 51 (the surface that guides the gas) is formed as an upwardly convex surface. The component of the normal direction N1 of a portion of the surface (rectifying surface) 51a of the first rectifier plate 51 is directed in the direction of movement of the substrate 8 and away from the substrate 8. The first rectifier plate 51 has a bent portion 51b, and the downstream side of the bent portion 51b is formed in a vertical shape (parallel to the YZ plane) or equivalent. Although the bent portion 51b of the rectifying surface 51a of the first rectifier plate 51 is depicted as having an angle, it is also preferable that it be formed as a smooth curved surface.

[0125] Furthermore, the gas injection unit 40 is positioned above the coating liquid supply unit 20. The gas injection port 41 of the gas injection unit 40 is directed downstream and downward.

[0126] More preferably, the gas injection port (slit) 41 of the gas injection unit 40, which serves as the head for flowing the air knife, is of a type that amplifies the flow velocity by drawing in gas from the surrounding area of ​​the slit 41. The direction of the gas injection port (slit) 41 of the gas injection unit 40 for flowing the air knife is oriented so as to strike the rectifying surface 51a of the rectifying plate 51. Alternatively, the direction of the gas injection port (slit) 41 is oriented so as close as possible to the outer shape of the rectifying surface 51a of the rectifying plate 51.

[0127] The gas injected from the gas nozzle 41 of the gas injection unit 40 is supplied toward the coating liquid L on the upper surface 8a side of the substrate 8 by the straightening surface 51a of the straightening plate 51. At this time, the coating apparatus 100 has a space S formed between the first straightening plate 51 and the coating liquid application unit 30, which allows an appropriate amount of time for the coating liquid L to pass from the coating liquid application unit 30 to the lower end 511 of the straightening plate 51, and the gas injection unit 40 and the straightening unit 50 are arranged so that the gas injected from the gas nozzle 41 of the gas injection unit 40 does not directly hit the coating liquid application unit 30.

[0128] On the other hand, dry gas is directed at the downstream side of the first rectifier plate 51 of the coating liquid L that has passed through the space S, causing volatile components to volatilize. A portion of the blow air from the gas injection port (slit) 41 diffracts along the outer shape of the rectifier plate 51 (the bent portion 51b of the rectifier surface 51a). That is, the gas between the blowhead gas injection port 41 and the rectifier surface 51a of the rectifier plate 51 flows more easily along the outer shape of the rectifier plate 51 (rectifier surface 51a), and a portion of it diffracts so that the blow air hits the upstream side of the coating film L and downstream of the rectifier plate 51 at a low flow velocity. At this time, the flow velocity on the upstream side of the coating film L is slower than the flow velocity in a portion further downstream.

[0129] Furthermore, in the coating apparatus 100 shown in Figure 10, the downstream side of the first rectifier plate 51 is designed to be vertical (parallel to the YZ plane). This ensures that the height of the space S between the lower end (downstream end) 511 of the first rectifier plate 51 and the coating liquid application section 30 can be secured.

[0130] The gas injection unit 40 of the coating apparatus 100 according to this modified example can form a flow velocity distribution that the air knife strikes. The gas injection unit 40 of the coating apparatus 100 according to this modified example works in cooperation with the flow straightening unit 50 to slow down the flow velocity on the upstream side of the coating film L and speed up the flow velocity on the downstream side. As described in the second embodiment, this modified example provides a coating apparatus 100 that can coat the coating liquid L on the substrate 8 with a more uniform thickness.

[0131] In the first and second embodiments, including the modified examples described above, it was explained that it is preferable for a portion of the normal direction N1 of the surface (rectifying surface) 51a of the first rectifier plate 51 to be oriented in the direction of movement of the substrate 8 (+X axis direction) and in the direction away from the substrate 8 (+Z axis direction). For example, in relation to the direction of air injection from the gas nozzle 41 of the gas injection unit 40, it is sufficient for a portion of the normal direction N1 of the surface (rectifying surface) 51a of the first rectifier plate 51 to be oriented in the direction of movement of the substrate 8 (+X axis direction).

[0132] (Third embodiment) A coating apparatus 100 according to the third embodiment will be described with reference to Figure 11. Figure 11 is a side view of the coating apparatus 100. In Figure 11, the control unit 70 shown in Figure 1 and the suction unit 60 shown in Figure 8 are omitted from the illustration. In Figure 11, the arrows extending from the gas nozzle 41 of the gas injection unit 40 represent the direction of gas injection, the direction of gas flow, and the strength of gas flow (relative magnitude of velocity).

[0133] The coating apparatus 100 according to this embodiment includes a transport unit 10, a coating liquid supply unit 20, a coating liquid application unit 30, a gas injection unit 40, and a flow straightening unit 50. Note that in Figure 11, the control unit 70 that controls the transport unit 10, the coating liquid supply unit 20, the gas injection unit 40, etc., and the suction unit 60 are not shown.

[0134] Similar to the first and second embodiments, an XYZ Cartesian coordinate system is used in Figure 11. The X-axis direction is along the direction in which the coating liquid L is discharged from the coating liquid application unit 30 via the coating liquid supply unit 20. The Y-axis direction is a horizontal direction perpendicular to the direction in which the substrate 8 moves by the transport unit 10, and is along the width direction of the substrate 8. The Z-axis direction is perpendicular to the X-axis and Y-axis directions and is along the vertical direction (here, the up and down direction).

[0135] The transport unit 10 uses rotating rollers to transport the long, sheet-like resin substrate 8. Preferably, the axis of rotation of the rotating rollers 10 is parallel to the Y-axis direction.

[0136] In this embodiment, the coating liquid L may be continuous and uninterrupted with respect to the upper surface 8a of the substrate 8, and it is preferable that it be formed over an appropriate length range. The depth of the coating liquid L is the same as or narrower than the width of the upper surface 8a of the substrate 8.

[0137] The coating liquid application unit 30 faces the substrate 8, which moves relatively from the upstream side to the downstream side, and applies the coating liquid L supplied from the coating liquid supply unit 20 to the substrate 8. The discharge unit 31 of the coating liquid application unit 30 extends in the Y-axis direction. The discharge unit 31 extends in the width direction of the substrate 8, which is the depth direction, and the coating liquid L is discharged uniformly in the width direction (Y-axis direction) of the substrate 8. Preferably, the length of the coating liquid L discharged in the width direction is shorter than the width direction of the substrate 8.

[0138] The gas injection unit 40 is equipped with a gas injection port 41 downstream of the coating liquid application unit 30 in the direction of movement of the substrate 8. Gas is ejected from the gas injection port 41 toward the coating liquid L to dry the coating liquid, gradually drying the coating liquid L along the direction of movement of the substrate 8. The gas injection port 41 of the gas injection unit 40 is directed from the upstream side to the downstream side of the coating liquid application unit 30.

[0139] The rectifier section 50 is provided adjacent to the downstream side of the coating section 30 and is located between the coating section 30 and the gas injection section 40. The first rectifier plate 51 is positioned between the gas injection port 41 of the gas injection section 40a and the coating section 30, and is located on the gas flow path from the gas injection port 41 of the gas injection section 40. The first rectifier plate 51 has a surface 51a that deflects the gas away from the direction toward the coating section 30, preventing the gas from directly hitting the coating section 30, and forms a space S between it and the coating section 30 used for drying the coating liquid L. The surface 51a of the first rectifier plate 51 is provided between the gas injection port 41 and the region between the coating section 30 and the substrate 8.

[0140] In Figure 11, the surface 51a of the first rectifier plate 51 is shown as a flat surface, but it may also be a curved surface that is convex downwards (towards the coating liquid application section 30) (see Figure 7), or it may be formed as a surface formed by combining multiple flat surfaces (see Figure 1). A component of the normal direction N1 of a part of the surface 51a of the first rectifier plate 51 is directed in a direction that intersects the direction of movement of the substrate 8 at a certain position. The component of the normal direction N1 may be directed in the direction of the +Z axis, and may also be directed in the direction of the +X axis or the -X axis, provided that the gas from the gas nozzle 41 of the gas injection section 40 is directed along the transport direction of the substrate 8. The normal direction N1 may also be directed in the +Z direction.

[0141] Preferably, the lower end 511 of the rectifier plate 51 is brought close to the upper surface of the substrate 8, and the surface of the rectifier plate 51 on the lower end 511 side is brought close to being parallel to the upper surface of the substrate 8. Therefore, the gas injected from the gas nozzle 41 of the gas injection unit 40 and flowing along the rectifier plate 51 passes the lower end 511 of the rectifier plate 51 and then flows along the upper surface 8a of the substrate 8 in the conveying direction.

[0142] The operation of the coating apparatus 100 will now be described. Details of the parts described in the first embodiment will be omitted as appropriate.

[0143] The control unit 70 of the coating apparatus 100 applies the coating liquid from the coating liquid application unit 30 to the upper surface 8a of the substrate 8 through the coating liquid supply unit 20 while the substrate 8 is being transported by the transport unit 10. At this time, the coating liquid L is applied from the coating liquid application unit 30 to the substrate 8 along the horizontal direction (+X axis direction), from the downstream end to the upstream end in the transport direction. Also, as the substrate 8 moves in the transport direction, it passes through the discharge unit 31 of the coating liquid application unit 30 which extends in the width direction (Y axis direction), forming a liquid film of a predetermined width of coating liquid L on the substrate 8.

[0144] The control unit 70 injects gas from the gas nozzle 41 of the gas injection unit 40. The gas injected from the gas nozzle 41 of the gas injection unit 40 strikes the upper surface 51a of the first rectifier plate 51 and flows through, for example, the downstream end 511 of the first rectifier plate 51 in the direction in which the coating liquid L is transported. The coating liquid application unit 30 is located in a different direction from the direction in which the gas injected from the gas nozzle 41 of the gas injection unit 40 flows after striking the surface 51a of the first rectifier plate 51 and reaching the downstream end 511. For this reason, the gas injected from the gas nozzle 41 of the gas injection unit 40 hardly reaches the space S. For this reason, the gas from the gas nozzle 41 of the gas injection unit 40 can reach the coating liquid application unit 30 with a flow velocity of 0 or nearly 0. Therefore, the gas injected from the gas nozzle 41 of the gas injection unit 40 can minimize its influence on the gas-liquid interface shape formed by the coating liquid L discharged from the discharge unit 31 of the coating liquid application unit 30.

[0145] Then, gas is injected from the gas nozzle 41 of the gas injection unit 40, and when a portion of the gas hits the surface 51a of the first rectifier plate 51, a portion of the gas flows through, for example, the downstream end 511 of the first rectifier plate 51, along the surface of the coating liquid L on the upper surface 8a side of the substrate 8. A portion of the gas volatilizes the volatile components of the coating liquid L, drying the coating liquid L, and flows along the upper surface 8a (the surface of the coating liquid L) of the substrate 8 in a direction away from the downstream side of the rectifier plate 51. The control unit 70 then causes the suction unit 60 to suck up the gas containing the volatile components.

[0146] Furthermore, the end 512 of the first rectifier plate 51, for example, the end opposite to the downstream end 511, is on the opposite side of the flow direction of the gas injected from the gas nozzle 41 of the gas injection unit 40. Therefore, when the gas from the gas nozzle 41 of the gas injection unit 40 attempts to move toward the coating liquid application unit 30 through, for example, the aforementioned end 512 of the first rectifier plate 51, its velocity becomes 0 or nearly 0.

[0147] The coating apparatus 100 has a space S formed between the first rectifier plate 51 and the coating liquid application section 30, which allows an appropriate amount of time for the coating liquid L to pass from the coating liquid application section 30 to the downstream end 511 of the rectifier plate 51. The gas injection section 40 and the rectifier section 50 are arranged so that the gas injected from the gas injection port 41 of the gas injection section 40 does not directly hit the coating liquid application section 30.

[0148] By using the coating apparatus 100 according to this embodiment, the coating liquid L on the side furthest from the gas injection section 40 moves away from the coating liquid application section 30, and the solvent contained in the coating liquid L dries out, so there is no problem in applying gas at an appropriate velocity to the coating liquid L. Therefore, the coating apparatus 100 according to this embodiment can generate an appropriate velocity distribution on the upper surface of the substrate 8 according to the degree to which the solvent in the coating liquid L dries out.

[0149] Therefore, when applying a coating liquid (solution) with low solvent viscosity onto the substrate 8, even if the gas flow rate near the substrate 8 surface is appropriately fast, it is possible to prevent the coating liquid L from undulating and to prevent the occurrence of thickness variations in the active material after drying. Furthermore, by appropriately increasing the gas flow rate near the substrate 8 surface, the time required for solvent evaporation can be further shortened, preventing the active material from agglomerating and thus preventing thickness variations.

[0150] The gas injection unit 40 of the coating apparatus 100 according to this embodiment can form a flow velocity distribution that is struck by the air knife. Therefore, according to this embodiment, a coating apparatus 100 is provided that can coat the substrate 8 with a more uniform thickness of coating liquid L.

[0151] Furthermore, by using the coating apparatus 100 according to this embodiment, it is possible to perform deposition and crystal growth of, for example, a perovskite layer on the substrate 8, and obtain a desired film quality such as a perovskite layer.

[0152] According to the coating apparatus 100 of at least one embodiment described above, the thickness of the coating liquid L on the substrate 8 can be made more uniform, and the deposition and crystal growth of, for example, a perovskite layer can be performed on the substrate 8 to obtain a desired film quality such as a perovskite layer.

[0153] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of Symbols]

[0154] 8...Substrate, 8a...Top surface, 10...Transport section, 10a...Transport surface, 20...Coating liquid supply section, 30...Coating liquid application section, 31...Discharge section, 40...Gas injection section, 41...Gas injection port, 50...Flow straightening section, 51, 52, 53...Flow straightening plate, 511, 521, 531...Lower end (end), 512, 522, 532...Upper end, 51a, 52a, 53a...Flow straightening surface (surface), 55a, 55b...Surface, 55c...Bending section, 60...Suction section, 70...Control section, 100...Coating device.

Claims

1. A coating unit that faces a substrate moving relatively from the upstream side to the downstream side and applies the coating liquid supplied from a coating liquid supply unit to the substrate, A gas injection unit is provided which a gas injection nozzle is used to spray gas toward the coating liquid in order to dry the coating liquid, and the gas from the gas injection nozzle gradually dries the coating liquid along the direction of movement of the substrate, A flow straightening section having a first flow straightening plate located downstream of the coating liquid application section, positioned on the gas flow path between the gas injection port and the coating liquid application section, having a surface that deflects the gas away from the direction toward the coating liquid application section, and forming a space between itself and the coating liquid application section for drying the coating liquid; A coating apparatus having the following features.

2. The normal component of a portion of the surface of the first rectifier plate is directed in a direction perpendicular to the direction of movement of the substrate, or the direction of movement of the substrate at a certain position. The coating apparatus according to claim 1.

3. The gas nozzle of the gas injection unit is directed from the downstream side to the upstream side of the coating liquid application unit along the direction of movement of the substrate. The surface of the first rectifier plate is provided between the gas injection port and the area between the coating liquid application section and the substrate. A coating apparatus according to claim 1 or claim 2.

4. The gas nozzle of the gas injection unit is directed in a direction perpendicular to the direction of movement at a certain position on the substrate, or from the upstream side to the downstream side of the coating liquid application unit. The surface of the first rectifier plate is provided between the gas injection port and the area between the coating liquid application section and the substrate. A coating apparatus according to claim 1 or claim 2.

5. It is provided distal to the distance of the coating liquid application area to the substrate and has a suction unit for sucking up the coating liquid and the gas that has come into contact with the surface of the first rectifier plate, A coating apparatus according to claim 1 or claim 2.

6. The rectifier section is provided downstream of the first rectifier plate in the direction of movement of the substrate, and has a second rectifier plate that directs the normal direction of a portion of the surface to which the gas injected from the gas injection section strikes from the upstream side of the substrate to the downstream side and away from the substrate. A coating apparatus according to claim 1 or claim 2.

7. The first distance D1 between the end of the first rectifier plate closest to the substrate and the surface of the coating liquid, and the second distance D2 between the end of the second rectifier plate closest to the substrate and the surface of the coating liquid are set to distances that allow the coating liquid to pass through without contacting the ends of the first rectifier plate and the ends of the second rectifier plate. The second distance D2 is set to be greater than or equal to the first distance D1. The coating apparatus according to claim 6.

8. The coating liquid supply unit, the gas injection unit, and the transport unit that moves the substrate relative to the rectification unit, The control unit controls the coating liquid supply unit, the gas injection unit, the flow straightening unit, and the transport unit. A coating apparatus according to claim 1 or claim 2, having the following features.

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