Modules and electronic equipment

Abstract

This technology offers advantages in improving the reliability of joints. [Solution] The module comprises a wiring member, a first wiring board, and a second wiring board laminated on the first wiring board via the wiring member. A plurality of first pads are arranged on the first main surface of the first wiring board, which are joined to the wiring member by a plurality of first joining members. A plurality of second pads are arranged on the second main surface of the second wiring board, which are joined to the wiring member by a plurality of second joining members. The second wiring board has lower bending rigidity than the first wiring board. The total area of ​​the portions of the plurality of second pads that are in contact with the plurality of second joining members is larger than the total area of ​​the portions of the plurality of first pads that are in contact with the plurality of first joining members.

Description

[Technical Field]

[0001] This disclosure relates to modules and electronic devices comprising modules. [Background technology]

[0002] In electronic devices, advancements are being made in the speed of communication and the density of mounting of semiconductor devices, and technologies for mounting semiconductor devices and printed circuit boards in three dimensions are being used. A semiconductor device is a semiconductor package having semiconductor elements and an interposer, and examples include digital signal processors and memory.

[0003] Semiconductor devices used in electronic equipment process large amounts of data at high speeds. As a result, the temperature of the semiconductor device rises significantly during operation, and the thermal deformation of the semiconductor device and printed circuit board increases the stress on joints such as solder.

[0004] Patent Document 1 discloses a three-dimensional circuit device in which at least a first circuit board and a second circuit board are connected via a three-dimensional inter-substrate connection structure consisting of a frame-shaped housing having an outer periphery and an inner periphery with a recess. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2008-159984 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] In modules where two wiring boards are stacked with wiring members in between, stress can concentrate at the joints between the wiring boards and the wiring members, and there has been a desire to improve the reliability of the joints in the module.

[0007] The present disclosure provides a technique advantageous for improving the reliability of bonding.

Means for Solving the Problems

[0008] One aspect of the present disclosure includes a wiring member, a first wiring board, and a second wiring board laminated on the first wiring board via the wiring member. On a first main surface of the first wiring board, a plurality of first pads joined to the wiring member by a plurality of first bonding members are arranged. On a second main surface of the second wiring board, a plurality of second pads joined to the wiring member by a plurality of second bonding members are arranged. The second wiring board has a lower bending rigidity than the first wiring board, and the total area of portions of the plurality of second pads that contact the plurality of second bonding members is larger than the total area of portions of the plurality of first pads that contact the plurality of first bonding members. A module characterized by this.

Effects of the Invention

[0009] According to the present disclosure, a technique advantageous for improving the reliability of bonding is provided.

Brief Description of the Drawings

[0010] [Figure 1] It is an explanatory diagram of a digital camera which is an example of an electronic device according to the first embodiment. [Figure 2] (a) is a perspective view of a processing module according to the first embodiment. (b) is a side view of a processing module according to the first embodiment. [Figure 3] It is a plan view of a part of a processing module according to the first embodiment. [Figure 4] (a) is a cross-sectional view of a processing module according to the first embodiment. (b) is a cross-sectional view of a processing module according to the first embodiment. [Figure 5] (a) is a cross-sectional view of a second wiring board according to the first embodiment. (b) is a cross-sectional view of a wiring member according to the first embodiment. (c) is a cross-sectional view of a wiring member according to the first embodiment. (d) is a cross-sectional view of a first wiring board according to the first embodiment. [Figure 6](a) is a cross-sectional view of a second wiring board according to Modification Example 1 of the first embodiment. (b) is a cross-sectional view of a wiring member according to Modification Example 1 of the first embodiment. (c) is a cross-sectional view of a wiring member according to Modification Example 1 of the first embodiment. (d) is a cross-sectional view of a first wiring board according to Modification Example 1 of the first embodiment. [Figure 7] (a) is a cross-sectional view of a second wiring board according to Modification Example 2 of the first embodiment. (b) is a cross-sectional view of a wiring member according to Modification Example 2 of the first embodiment. (c) is a cross-sectional view of a wiring member according to Modification Example 2 of the first embodiment. (d) is a cross-sectional view of a first wiring board according to Modification Example 2 of the first embodiment. [Figure 8] It is a cross-sectional view of a processing module according to Modification Example 3 of the first embodiment. [Figure 9] It is a cross-sectional view of a processing module according to the second embodiment. [Figure 10] (a) is a cross-sectional view of a second wiring board according to the second embodiment. (b) is a cross-sectional view of a wiring member according to the second embodiment. (c) is a cross-sectional view of a wiring member according to the second embodiment. (d) is a cross-sectional view of a first wiring board according to the second embodiment. [Figure 11] It is a cross-sectional view of a processing module according to the third embodiment. [Figure 12] (a) is a cross-sectional view of a second wiring board according to the third embodiment. (b) is a cross-sectional view of a wiring member according to the third embodiment. (c) is a cross-sectional view of a wiring member according to the third embodiment. (d) is a cross-sectional view of a first wiring board according to the third embodiment. [Figure 13] It is a cross-sectional view of a processing module according to the fourth embodiment. [Figure 14] (a) is a cross-sectional view of a second wiring board according to the fourth embodiment. (b) is a cross-sectional view of a wiring member according to the fourth embodiment. (c) is a cross-sectional view of a wiring member according to the fourth embodiment. (d) is a cross-sectional view of a first wiring board according to the fourth embodiment. [Figure 15] It is a cross-sectional view of a processing module according to the fifth embodiment. [Figure 16](a) is a cross-sectional view of the second wiring board according to the fifth embodiment. (b) is a cross-sectional view of the wiring member according to the fifth embodiment. (c) is a cross-sectional view of the wiring member according to the fifth embodiment. (d) is a cross-sectional view of the first wiring board according to the fifth embodiment. [Figure 17] This graph shows the results of the thermal fatigue tests in Test Examples 1-4. [Modes for carrying out the invention]

[0011] Hereinafter, exemplary embodiments of this disclosure will be described in detail with reference to the drawings. In each drawing, the same reference numeral is used for the same component, and redundant descriptions are omitted. In the following embodiments, directions are indicated by the XYZ coordinate system, which is a Cartesian coordinate system. The X, Y, and Z axes are orthogonal to each other. The direction of the X axis is also called the X direction, the direction of the Y axis is also called the Y direction, and the direction of the Z axis is also called the Z direction. For example, when referring to the positive direction of the X axis, it refers to the same direction as indicated by the X-axis arrow in the illustrated coordinate system, and when referring to the negative direction of the X axis, it refers to the direction 180° opposite to the direction indicated by the X-axis arrow in the illustrated coordinate system. Furthermore, when simply referring to the X direction, it refers to the direction parallel to the X axis, regardless of whether it is the same as or different from the direction indicated by the X-axis arrow in the illustrated coordinate system. The same applies to the Y and Z axes other than the X axis. Furthermore, for example, a plane containing the X and Y axes is expressed as the XY plane.

[0012] [First Embodiment] Figure 1 is an explanatory diagram of a digital camera 600, which is an example of a system to which the module according to the first embodiment is applied. In this example, the digital camera 600, which is an imaging device, is a lens-interchangeable digital camera and comprises a camera body 601, which is an electronic device. A lens unit 602, including a lens, is detachable from the camera body 601. Note that the digital camera 600 is not limited to a lens-interchangeable digital camera, but may also be a lens-integrated digital camera in which the camera body 601 and the lens unit 602 are integrated. The camera body 601 comprises an outer casing 611 and a processing module 500 and a sensor module 900 arranged inside the outer casing 611. The outer casing 611 has a lens mount for detaching the lens unit 602. The processing module 500 is an example of a module. The processing module 500 and the sensor module 900 are electrically connected by a wiring component 950. The processing module 500 is an example of a first module, and the sensor module 900 is an example of a second module. The wiring component 950 is preferably flexible (conductive), such as a flexible printed circuit board or a flexible flat cable.

[0013] The sensor module 900 includes an imaging device, an image sensor 700, and a printed circuit board 800. The image sensor 700 is mounted on the printed circuit board 800. The image sensor 700 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor 700 has the function of converting light incident on it via the lens unit 602 into an electrical signal.

[0014] The processing module 500 is an electronic module and has a three-dimensional mounting structure. It has a processing unit 103, which is an example of a third electronic component. The processing unit 103 is a semiconductor device. The processing unit 103 is, for example, a digital signal processor. The processing unit 103 is an image processing device (image processing engine) that has the function of acquiring electrical signals from the image sensor 700, correcting the acquired electrical signals, and generating image data.

[0015] Furthermore, the processing module 500 has multiple (for example, four) memories 102. Each memory 102 is an example of an electronic component. Each memory 102 is a semiconductor device. Each memory 102 is a storage device such as a DRAM (Double Data Rate) 5 or flash memory.

[0016] The processing unit 103 also functions as a memory controller that controls the memory 102. The processing unit 103 can temporarily store image data in the memory 102 and read image data stored in the memory 102.

[0017] Each of the processing unit 103 and the memory 102 is a semiconductor package including a semiconductor integrated circuit, and may be an area array semiconductor package such as a BGA (Ball Grid Array) or LGA (Land Grid Array).

[0018] While the semiconductor package is preferably one of these types, it is not limited to these types. For example, any type of semiconductor package is applicable, such as QFP (Quad Flat Package), QFN (Quad Flat Non-leaded Package), QFJ (Quad Flat J-leaded Package), or CSP (Chip Size Package).

[0019] Figure 2(a) is a perspective view of the processing module 500 according to the first embodiment, and Figure 2(b) is a side view of the processing module 500 according to the first embodiment. The processing module 500 includes a wiring board 101 and two mounting structures 510. The wiring board 101 is an example of a first wiring board. The wiring board 101 is a printed circuit board. The wiring board 101 is, for example, a rigid substrate. Each of the two mounting structures 510 is mounted on the wiring board 101 via a wiring member 11. By making the processing module 500 such a three-dimensional mounting structure, it is possible to miniaturize the processing module 500.

[0020] Each mounting structure 510 has a wiring board 201 and two memories 102 mounted on the wiring board 201. The wiring board 201 is an example of a second wiring board. The wiring board 201 is a printed circuit board. The wiring board 201 is, for example, a rigid substrate. The processing module 500 has a three-dimensional mounting structure in which the wiring board 101 and the wiring board 201 are stacked via wiring members 11.

[0021] The wiring member 11 is a plate-shaped member. The wiring member 11 is a printed circuit board smaller than the wiring boards 101 and 201. The wiring member 11 is a rigid substrate in the shape of a rectangular parallelepiped. The wiring member 11 is placed between the wiring boards 101 and 201 and is used for electrical and mechanical connections between them. The wiring member 11 also functions as a spacer between the wiring boards 101 and 201.

[0022] The wiring board 101 has two main surfaces 1011 and 1012. Main surface 1011 is an example of a first main surface. Main surface 1012 is the main surface opposite to main surface 1011. Main surface 1012 is an example of a sixth main surface. Main surfaces 1011 and 1012 are mounting surfaces on which electronic components can be mounted. Main surfaces 1011 and 1012 have the same area as each other. Each of the two mounting structures 510 is mounted on the main surface 1011 of the wiring board 101 via a wiring member 11. The processing unit 103 is mounted on the main surface 1012 of the wiring board 101. Main surface 1012 is parallel to main surface 1011. The processing unit 103 is surface-mounted on the main surface 1012 of the wiring board 101. The Z direction is perpendicular to the main surface 1011. The X and Y directions are parallel to the main surface 1011. Here, the Z direction is an example of a first direction, the Y direction is an example of a second direction, and the X direction is an example of a third direction. The Y direction intersects the Z direction. The X direction intersects the Z and Y directions. In this embodiment, the X, Y, and Z directions are orthogonal to each other.

[0023] The wiring board 201 is rectangular when viewed from above (i.e., in the Z direction). The longitudinal direction of the wiring board 201 is the X direction, the short direction is the Y direction, and the thickness direction of the wiring board 201 is the Z direction. The thickness direction of the wiring board 101 and the thickness direction of the wiring member 11 are also in the Z direction.

[0024] The wiring board 201 has two rectangular main surfaces 2011 and 2012. Main surface 2012 is an example of a second main surface. Main surface 2011 is the main surface opposite to main surface 2012. Main surface 2011 is an example of a fifth main surface. Main surfaces 2011 and 2012 are mounting surfaces on which electronic components can be mounted. Main surfaces 2011 and 2012 have the same area. Two memory modules 102 are surface-mounted on main surface 2011 of the wiring board 201. The size of the wiring board 101 is larger than the size of the wiring board 201. That is, the area of ​​the main surface 1011 of the wiring board 101 is larger than the area of ​​the main surface 2011 of the wiring board 201. And, in the Z direction, the entirety of the wiring board 201 overlaps with a part of the wiring board 101. In this embodiment, the two wiring boards 201 are arranged on the main surface 1011 with a gap in the Y direction between them, so that the longer sides of each wiring board 201 are parallel to the X direction.

[0025] Figure 3 is a plan view of a portion of the processing module 500 according to the first embodiment. Figure 3 shows a portion of the processing module 500 viewed in the negative Z-axis direction toward the main surface 1011 of the wiring board 101. Figure 3 shows one of the two mounting structures 510, while the other is omitted from the illustration.

[0026] Figures 4(a) and 4(b) are cross-sectional views of the processing module 500 according to the first embodiment. Figure 4(a) schematically shows a cross-section of the processing module 500 along the virtual plane AA shown in Figure 3, viewed in the positive direction of the Y axis. The virtual plane AA is a virtual plane parallel to the XZ plane. Figure 4(b) schematically shows a cross-section of the processing module 500 along the virtual plane BB shown in Figure 3, viewed in the positive direction of the X axis. The virtual plane BB is a virtual plane parallel to the YZ plane.

[0027] Figure 5(a) is a cross-sectional view of the wiring board 201 according to the first embodiment. Figure 5(b) is a cross-sectional view of the wiring member 11 according to the first embodiment. Figure 5(c) is a cross-sectional view of the wiring member 11 according to the first embodiment. Figure 5(d) is a cross-sectional view of the wiring board 101 according to the first embodiment. Figure 5(a) schematically illustrates the wiring board 201 as viewed in the negative direction of the Z axis, with the cross section of the wiring board 201 along the ZB1-ZB1 virtual plane shown in Figure 4(a). Figure 5(b) schematically illustrates the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZB2-ZB2 virtual plane shown in Figure 4(a). Figure 5(c) schematically illustrates the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZA2-ZA2 virtual plane shown in Figure 4(a). Figure 5(d) schematically shows a cross-section of the wiring board 101 along the ZA1-ZA1 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z-axis.

[0028] The following describes the stacked structure of a single mounting structure 510 and a wiring board 101. One of the two memories 102 contained in the mounting structure 510 is designated as electronic component 102a, and the other as electronic component 102b. Electronic component 102a is an example of a first electronic component, and electronic component 102b is an example of a second electronic component.

[0029] The electronic components 102a and 102b are mounted on the main surface 2011 of the wiring board 201, spaced apart in the X direction and aligned in the X direction. The wiring member 11 has a main surface 111 on the side that is joined to the main surface 1011 of the wiring board 101, and a main surface 112 on the side that is joined to the main surface 2012 of the wiring board 201. Main surface 111 is an example of a third main surface. Main surface 112 is the main surface opposite to main surface 111. Main surface 112 is an example of a fourth main surface. Main surface 111 is the joining surface that is joined to the wiring board 101, and main surface 112 is the joining surface that is joined to the wiring board 201. The main surface 111 of the wiring member 11 is joined to the main surface 1011 of the wiring board 101 via a plurality of joining members 14, and the main surface 112 of the wiring member 11 is joined to the main surface 2012 of the wiring board 201 via a plurality of joining members 24. Each of the plurality of joining members 14 is made of solder. Each of the plurality of joining members 24 is also made of solder.

[0030] Here, the main surfaces 1011, 1012, 2011, 2012, 111, and 112 are substantially parallel to each other. Therefore, the direction perpendicular to the main surface 1011 of the wiring board 101 is substantially the same as the direction perpendicular to the main surface 1012 of the wiring board 101, the direction perpendicular to the main surface 2011 of the wiring board 201, the direction perpendicular to the main surface 2012 of the wiring board 201, the direction perpendicular to the main surface 111 of the wiring member 11, and the direction perpendicular to the main surface 112 of the wiring member 11.

[0031] The Z direction is also the direction in which the processing module 500 is viewed from above. Viewing in the Z direction, i.e., viewing from above, includes viewing through to the Z direction. The expression "in the Z direction" may also include "viewed in the Z direction." The X direction is also the longitudinal direction of the wiring member 11, the Y direction is also the short direction of the wiring member 11, and the Z direction is also the thickness direction of the wiring member 11. The Z direction is also the thickness direction of the wiring board 101.

[0032] The wiring board 101 has a plurality of pads 13 arranged on its main surface 1011. Pad 13 is an example of a first pad. The wiring board 201 has a plurality of pads 23 arranged on its main surface 2012. Pad 23 is an example of a second pad. The wiring member 11 has a plurality of pads 51 arranged on its main surface 111 and a plurality of pads 52 arranged on its main surface 112. Pad 51 is an example of a third pad. Pad 52 is an example of a fourth pad.

[0033] Multiple pads 13 on the wiring board 101 and multiple pads 51 on the wiring member 11 are joined by multiple connecting members 14. Multiple pads 23 on the wiring board 201 and multiple pads 52 on the wiring member 11 are joined by multiple connecting members 24. Connecting member 14 is an example of a first connecting member, and connecting member 24 is an example of a second connecting member.

[0034] The number of pads 13 on the wiring board 101 is the same as the number of pads 51 on the wiring member 11. The number of pads 23 on the wiring board 201 is the same as the number of pads 52 on the wiring member 11. Each of the pads 13 on the wiring board 101 is joined to the corresponding pad 51 on the wiring member 11 by the corresponding joining member 14 from among the multiple joining members 14. Each of the pads 23 on the wiring board 201 is joined to the corresponding pad 52 on the wiring member 11 by the corresponding joining member 24 from among the multiple joining members 24.

[0035] Each surface of one of the multiple pads 13 on the wiring board 101 is exposed by an opening formed by solder resist (not shown). Each of the multiple pads 13 may be either an SMD (solder mask defined) or an NSMD (non-solder mask defined) pad, but in the first embodiment, it is an SMD pad.

[0036] Furthermore, the surface of each of the multiple pads 23 of the wiring board 201 is exposed by an opening formed by solder resist (not shown). Each of the multiple pads 23 may be either an SMD or an NSMD pad, but in the first embodiment, it is an SMD pad.

[0037] Furthermore, the surface of each of the multiple pads 51 of the wiring member 11 is exposed by an opening formed by solder resist (not shown). Each of the multiple pads 51 may be either an SMD or an NSMD pad, but in the first embodiment, it is an SMD pad.

[0038] Furthermore, the surface of each of the multiple pads 52 of the wiring member 11 is exposed by an opening formed by solder resist (not shown). Each of the multiple pads 52 may be either an SMD or an NSMD pad, but in the first embodiment, it is an SMD pad.

[0039] In the first embodiment, the number of pads 23 on the wiring board 201 is greater than the number of pads 13 on the wiring board 101. In the examples of Figures 5(a) and 5(d), there are 26 pads 23 and 24 pads 13. Also, the number of pads 52 on the wiring member 11 is greater than the number of pads 51 on the wiring member 11. In the examples of Figures 5(b) and 5(c), there are 26 pads 52 and 24 pads 51. Furthermore, the number of connecting members 24 is greater than the number of connecting members 14.

[0040] The multiple pads 23 of the wiring board 201 have two or more pads that do not overlap with any of the multiple pads 13 of the wiring board 101 in the Z direction; in the first embodiment, there are two pads 23b. Of the multiple pads 23, each of the multiple pads other than the two pads 23b is designated as pad 23a. In the example in Figure 5(a), the number of multiple pads 23a is 24 (6 × 4).

[0041] Here, as shown in Figure 5(a), a rectangular region E11 with the minimum area surrounding the multiple pads 23 is defined. Region E11 is an example of the first minimum rectangular region. The outer perimeter of region E11 includes two long sides LS1 extending in the X direction and spaced apart from each other in the Y direction, and two short sides SS1 extending in the Y direction and spaced apart from each other in the X direction.

[0042] Each of the two pads 23b is in contact with at least one, or in the first embodiment both, of the two long sides LS1 of region E11. Also, each of the two pads 23b is in contact with either of the two short sides SS1 of region E11. The two pads 23b are positioned on either side of the plurality of pads 23a in the X direction.

[0043] The wiring member 11 has multiple pads 52, each consisting of two or more pads that do not overlap with any of the multiple pads 51 of the wiring member 11 in the Z direction; in the first embodiment, there are two pads 52b. Each of the multiple pads 52 other than the two pads 52b is designated as pad 52a. In the example shown in Figure 5(b), the number of multiple pads 52a is 24 (6 × 4).

[0044] Each of the multiple pads 13 overlaps with one of the multiple pads 51 in the Z direction. Each of the multiple pads 51 overlaps with one of the multiple pads 52a in the Z direction. Each of the multiple pads 52a overlaps with one of the multiple pads 23a in the Z direction. Also, each of the two pads 52b overlaps with one of the two pads 23b in the Z direction.

[0045] Here, as shown in Figure 5(b), a rectangular region E12 with the smallest area surrounding the multiple pads 52 is defined. Region E12 is an example of a second smallest rectangular region. The perimeter of region E12 includes two long sides LS2 extending in the X direction and spaced apart in the Y direction, and two short sides SS2 extending in the Y direction and spaced apart in the X direction.

[0046] Each of the two pads 52b is in contact with at least one, or in the first embodiment both, of the two long sides LS2 of region E12. Also, each of the two pads 52b is in contact with either of the two short sides SS2 of region E12. The two pads 52b are positioned on either side of the plurality of pads 52a in the X direction.

[0047] The multiple joining members 24 include two joining members 24b corresponding to each of the two pads 23b. Furthermore, the multiple joining members 24 also include multiple joining members 24a corresponding to each of the multiple pads 23a.

[0048] Specifically, each of the two pads 23b is joined to the corresponding pad 52b of the two pads 52b by the corresponding joining member 24b of the two joining members 24b. Similarly, each of the multiple pads 23a is joined to the corresponding pad 52a of the multiple pads 52a by the corresponding joining member 24a of the multiple joining members 24a. Furthermore, each of the multiple pads 13 is joined to the corresponding pad 51 of the multiple pads 51 by the corresponding joining member 14 of the multiple joining members 14.

[0049] The two pads 23b are reinforcing pads and are positioned on both sides of the wiring board 201 in the longitudinal direction (X direction) relative to the multiple pads 23a. Similarly, the two pads 52b are reinforcing pads and are positioned on both sides of the multiple pads 52a in the X direction. The two connecting members 24b are reinforcing connecting members and are positioned on both sides of the multiple connecting members 24a in the X direction.

[0050] The wiring member 11 comprises an insulator 41 and a plurality of through-hole conductors 12. The insulator 41 has a plurality of through-holes formed in the Z direction, and the plurality of through-hole conductors 12 are each arranged in the plurality of through-holes. Each of the plurality of pads 51 is electrically connected to the corresponding pad 52a of the plurality of pads 52a by the corresponding through-hole conductor 12 of the plurality of through-hole conductors 12. That is, pads 51 and pads 52a are arranged at both ends of the through-hole conductor 12 in the Z direction.

[0051] The through-hole conductor 12 is used as signal wiring, power wiring, or ground wiring. Of the multiple pads 13, the pad used as signal wiring, power wiring, or ground wiring is designated as pad 13a. In the first embodiment, all of the multiple pads 13 are pads 13a used as signal wiring, power wiring, or ground wiring. Of the multiple pads 51, the pad used as signal wiring, power wiring, or ground wiring is designated as pad 51a. In the first embodiment, all of the multiple pads 51 are pads 51a used as signal wiring, power wiring, or ground wiring. Of the multiple connecting members 14, the connecting member used as signal wiring, power wiring, or ground wiring is designated as connecting member 14a. In the first embodiment, all of the multiple connecting members 14 are connecting members 14a used as signal wiring, power wiring, or ground wiring.

[0052] In the first embodiment, the two pads 52b are not electrically connected to any of the multiple pads 51, but they may be electrically connected to any of the multiple pads 51.

[0053] The through-hole conductor 12 is formed by plating a through-hole formed in the insulator 41 with a metal such as copper (Cu). The inside of the through-hole conductor 12 may be hollow, but is not limited to this; the inside of the through-hole conductor 12 may be filled with an insulating resin or a conductive resin. Alternatively, the through-hole conductor 12 may be formed by filling a through-hole formed in the insulator 41 with a metal such as copper (Cu).

[0054] The insulator 41 is formed from a resin material such as FR4, which is composed of glass epoxy. However, the insulating material constituting the insulator 41 is not limited to a resin material as long as it has electrical insulating properties; it may also be an inorganic material such as ceramic.

[0055] Each of the wiring boards 101 and 201 is a multilayer substrate including an insulating substrate made of a resin material such as FR4 composed of glass epoxy, and a plurality of wiring layers having wirings made of a metal such as copper (Cu).

[0056] In the first embodiment, the wiring board 201 is a wiring board having a lower bending rigidity than the wiring board 101. And since the electronic components 102a and 102b having a coefficient of linear expansion different from that of the wiring board 201 are mounted on the wiring board 201, the wiring board 201 is more likely to be deformed than the wiring board 101.

[0057] In the plurality of pads 13 of the wiring board 101, let the total area (bonding area) of the portions contacting the plurality of bonding members 14 be S1. Also, in the plurality of pads 23 of the wiring board 201, let the total area (bonding area) of the portions contacting the plurality of bonding members 24 be S2. The total area S1 is an example of the first total area, and the total area S2 is an example of the second total area. In the first embodiment, S1 < S2, that is, the total area S2 is wider than the total area S1.

[0058] By setting S1 < S2, the wiring board 201 having a relatively lower bending rigidity compared to the wiring board 101 is reinforced by the plurality of bonding members 24 having a wider bonding area than the plurality of bonding members, and the warpage of the wiring board 201 is reduced in the thermal fatigue test. Since the warpage of the wiring board 201 is reduced, the stress applied to the plurality of bonding members 24a is reduced. Also, by strengthening the reinforcement of the wiring board 201 having a low bending rigidity, the stress applied to the bonding members 24a located at the outer peripheral corner portions of the plurality of bonding members 24a can be dispersed to the bonding members 24a located at the central portion of the plurality of bonding members 24a or the plurality of bonding members 14, and it is possible to prevent stress from concentrating on the bonding members 24a located at the outer peripheral corner portions, so the reliability of the bonding is improved.

[0059] Here, a description will be given by focusing on one pad 13 and one joining member 14. It is preferable that the entire surface of the pad 13 exposed from an opening of a solder resist (not shown) contacts the joining member 14, but it is not always the case that the entire surface of the pad 13 contacts the joining member 14, and a part of the surface of the pad 13 may not contact the joining member 14. The same applies to the pad 23 and the joining member 24.

[0060] In addition, when the entire surface of each of the plurality of pads 13 contacts the corresponding joining member 14 among the plurality of joining members 14, the total area S1 is equal to the sum of the surface areas of the plurality of pads 13. The same applies to the total area S2.

[0061] In the plurality of pads 51 of the wiring member 11, let the total area (joint area) of the portions contacting the plurality of joining members 14 be S3. Also, in the plurality of pads 52 of the wiring member 11, let the total area (joint area) of the portions contacting the plurality of joining members 24 be S4. The total area S3 is an example of the third total area, and the total area S4 is an example of the fourth total area. In the first embodiment, S3 < S4, that is, the total area S4 is larger than the total area S3.

[0062] By setting S3 < S4, the wiring board 201 having a relatively low bending rigidity compared to the wiring board 101 is reinforced by the plurality of joining members 24 having a larger joint area than the plurality of joining members 14, and the warp of the wiring board 201 in the thermal fatigue test is reduced. Since the warp of the wiring board 201 is reduced, the stress applied to the plurality of joining members 24a is reduced. In addition, by strengthening the reinforcement of the wiring board 201 having a low bending rigidity, the stress applied to the joining members 24a located at the outer peripheral corner portions of the plurality of joining members 24a can be dispersed to the joining members 24a located at the central portions of the plurality of joining members 24a and the plurality of joining members 14, and it is possible to prevent the stress from concentrating on the joining members 24a located at the outer peripheral corner portions, so the reliability of the joint is improved.

[0063] Here, we will focus on one pad 51 and one bonding member 14. It is preferable that the entire surface of the pad 51 exposed from the opening of the solder resist (not shown) is in contact with the bonding member 14, but it is not necessarily the case that the entire surface of the pad 51 is in contact with the bonding member 14, and a part of the surface of the pad 51 may not be in contact with the bonding member 14. The same applies to the pad 52 and the bonding member 24.

[0064] Furthermore, if the entire surface of each of the multiple pads 51 is in contact with the corresponding joining member 14 among the multiple joining members 14, the total area S3 is equal to the sum of the surface areas of the multiple pads 51. The same applies to the total area S4.

[0065] Furthermore, it is preferable that the area S22 of each of the two pads 23b shown in Figure 5(a) is larger than the area S21 of one pad 23a among the multiple pads 23 other than the two pads 23b. As a result, the wiring board 201 is firmly reinforced by the joining member 24b shown in Figure 4(a), further improving the reliability of the joint.

[0066] Furthermore, it is preferable that the area S22 of each of the two pads 23b shown in Figure 5(a) is larger than the area S11 of any one of the multiple pads 13 shown in Figure 5(d). This allows the wiring board 201 to be firmly reinforced by the joining member 24b shown in Figure 4(a), further improving the reliability of the joint.

[0067] Viewed in the Z direction, each pad 13 is circular. Viewed in the Z direction, each pad 23a is circular. The area S21 of each pad 23a is the same as the area S11 of each pad 13. That is, the size of each pad 23a is the same as the size of each pad 13. Also, viewed in the Z direction, each pad 23b is rectangular.

[0068] Furthermore, it is preferable that the area S42 of each of the two pads 52b shown in Figure 5(b) is larger than the area S41 of the one pad 52a other than the two pads 52b among the multiple pads 52. As a result, the wiring board 201 is firmly reinforced by the joining member 24b shown in Figure 4(a), further improving the reliability of the joint.

[0069] Furthermore, it is preferable that the area S42 of each of the two pads 52b shown in Figure 5(b) is larger than the area S31 of any one of the multiple pads 51 shown in Figure 5(c). This allows the wiring board 201 to be firmly reinforced by the joining member 24b shown in Figure 4(a), further improving the reliability of the joint.

[0070] Viewed in the Z direction, each pad 51 is circular. Viewed in the Z direction, each pad 52a is circular. The area S41 of each pad 52a is the same as the area S31 of each pad 51. That is, the size of each pad 52a is the same as the size of each pad 51. Also, viewed in the Z direction, each pad 52b is rectangular.

[0071] Furthermore, the area S21 of each pad 23a is the same as the area S41 of each pad 52a. Also, the area S11 of each pad 13 is the same as the area S31 of each pad 51.

[0072] The bending stiffness of the wiring board 101 and the bending stiffness of the wiring board 201 may be determined by measurement, but they can also be determined by calculation. Each of the wiring boards 101 and 201 has a Young's modulus of, for example, several tens [Gpa]. Let W1 be the length of the wiring board 101 in the X direction, and W2 be the length of the wiring board 201 in the X direction. In the first embodiment, W1 > W2, i.e., the length W2 of the wiring board 201 in the X direction is shorter than the length W1 of the wiring board 101 in the X direction. Also, let H1 be the thickness of the wiring board 101 in the Z direction, and H2 be the thickness of the wiring board 201 in the Z direction. In the first embodiment, H1 > H2, i.e., the thickness H2 of the wiring board 201 in the Z direction is thinner than the thickness H1 of the wiring board 101 in the Z direction.

[0073] Furthermore, let E1 be the Young's modulus of circuit board 101, E2 be the Young's modulus of circuit board 201, K1 be the bending stiffness of circuit board 101, and K2 be the bending stiffness of circuit board 201. The bending stiffness K1 is E1 × W1 × H1 3 The bending stiffness K2 is expressed as E2 × W2 × H2 3It is expressed as / 12. Note that E1 and E2 in the formula are the same as Young's moduli E1 and E2, W1 and W2 are the same as lengths W1 and W2, and H1 and H2 are the same as thicknesses H1 and H2. Thus, the bending rigidity K1 of the wiring board 101 is E1 × W1 × H1 3 The bending stiffness K2 of the wiring board 201 is calculated as E2 × W2 × H2 3 It can be calculated by dividing by 12.

[0074] When each of the wiring boards 101 and 201 is constructed with multiple wiring layers including FR4 made of glass epoxy and wiring made of copper (Cu), the Young's modulus E1 of wiring board 101 and the Young's modulus E2 of wiring board 201 can be approximately the same value. The relationship between the bending stiffness K1 of wiring board 101 and the bending stiffness K2 of wiring board 201 can be such that K1 > K2. Thus, the bending stiffness K1 of wiring board 101 and the bending stiffness K2 of wiring board 201 can be determined using the above formula, and by comparing the determined bending stiffness K1 and bending stiffness K2, the relationship between the bending stiffness K1 and bending stiffness K2 can be determined. Satisfying K1 > K2 means E1 × W1 × H1 3 / 12>E2×W2×H2 3 This satisfies / 12, so E1×W1×H1 3 >E2×W2×H2 3 This means that the condition is met.

[0075] When the processing module 500 is viewed from above, that is, when the processing module 500 is viewed in the Z direction, the projected areas of the electronic components 102a and 102b projected onto a virtual XY plane are larger than the projected area of ​​the wiring member 11 when the wiring member 11 is projected onto a virtual XY plane. Furthermore, as shown in Figure 3, in the Z direction, a portion of the electronic component 102a overlaps with a portion of the wiring member 11. Also, in the Z direction, a portion of the electronic component 102b overlaps with a portion of the wiring member 11.

[0076] Furthermore, as shown in Figures 3 and 4(b), the electronic component 102a has sides 1021a and 1022a spaced apart from each other in the Y direction. Side 1021a is an example of a first side, and side 1022a is an example of a second side. The wiring member 11 is positioned between a virtual plane V1 including side 1021a and a virtual plane V2 including side 1022a. Virtual plane V1 is an example of a first virtual plane, and virtual plane V2 is an example of a second virtual plane.

[0077] Thus, the electronic components 102a and 102b are arranged so as to straddle the wiring member 11 on the wiring board 201, which has relatively low bending rigidity. Therefore, due to the difference in the coefficient of thermal expansion between the wiring board 201 and the electronic components 102a and 102b, and the thermal deformation of the electronic components 102a and 102b, the wiring board 201 is more susceptible to deformation. However, according to the first embodiment, the deformation (warping) of the wiring board 201 is more effectively reduced by the joining member 24b that is joined to the pads 23b and 52b, and the reliability of the joint is further improved.

[0078] The shapes and sizes of each pad 13, 23a, 23b, 51, 52a, and 52b are not limited to the examples above. For example, in the first embodiment, the shape and size of pad 23a are the same as, but may be different from, the shape and size of pad 13. Also, in the first embodiment, the shape and size of pad 23a are the same as, but may be different from, the shape and size of pad 52a. Also, in the first embodiment, the shape and size of pad 52a are the same as, but may be different from, the shape and size of pad 51. Also, in the first embodiment, the shape and size of pad 13 are the same as, but may be different from, the shape and size of pad 51. Also, in the first embodiment, the shape and size of pad 23b are the same as, but may be different from, the shape and size of pad 52b.

[0079] Furthermore, in the wiring member 11, the set of pads 51, through-hole conductor 12, and pad 52a that are electrically conductive with each other can be used for signal wiring, power wiring, or ground wiring, but pad 52b may be a dummy pad that is not used for any of the signal wiring, power wiring, or ground wiring.

[0080] [Modification 1 of the First Embodiment] A modification 1 of the first embodiment will now be described. In the first embodiment, the case in which the pad 23b is rectangular, as shown in Figure 5(a), and the pad 52b is rectangular, as shown in Figure 5(b), was described as an example, but the invention is not limited to this.

[0081] Figure 6(a) is a cross-sectional view of a wiring board 201 according to Modification 1 of the First Embodiment. Figure 6(b) is a cross-sectional view of a wiring member 11 according to Modification 1 of the First Embodiment. Figure 6(c) is a cross-sectional view of a wiring member 11 according to Modification 1 of the First Embodiment. Figure 6(d) is a cross-sectional view of a wiring board 101 according to Modification 1 of the First Embodiment. Figure 6(a) schematically illustrates a cross-section of the wiring board 201 along the ZB1-ZB1 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z axis. Figure 6(b) schematically illustrates a cross-section of the wiring member 11 along the ZB2-ZB2 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z axis. Figure 6(c) schematically illustrates a cross-section of the wiring member 11 along the ZA2-ZA2 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z axis. Figure 6(d) schematically shows a cross-section of the wiring board 101 along the ZA1-ZA1 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z-axis.

[0082] The number of pads 23 on the wiring board 201 shown in Figure 6(a) is greater than the number of pads 13 on the wiring board 101 shown in Figure 6(d). Similarly, the number of pads 52 on the wiring member 11 shown in Figure 6(b) is greater than the number of pads 51 on the wiring member 11 shown in Figure 6(c). Furthermore, similar to the first embodiment, the total area S2 is larger than the total area S1, and the total area S4 is larger than the total area S3. And, similar to the first embodiment, the reliability of the joint is improved.

[0083] As shown in Figure 6(a), the plurality of pads 23 of the wiring board 201 have two or more pads that do not overlap with any of the plurality of pads 13 of the wiring board 101 in the Z direction, and in the modified example 1 of the first embodiment, there are four pads 23b. Of the plurality of pads 23, each of the plurality of pads other than the four pads 23b is a pad 23a.

[0084] Similar to the first embodiment, the shape and size of pad 23a are the same as those of pad 13. Also, similar to the first embodiment, the shape and size of pad 52a are the same as those of pad 51. Furthermore, similar to the first embodiment, the shape and size of pad 23a are the same as those of pad 52a, and the shape and size of pad 13 are the same as those of pad 51.

[0085] As shown in Figure 6(a), each of the four pads 23b is in contact with at least one of the two long sides LS1 of region E11, or one of them in the modified example 1 of the first embodiment. Also, each of the four pads 23b is in contact with either one of the two short sides SS1 of region E11. The four pads 23b are arranged in pairs on each side of the plurality of pads 23a in the X direction.

[0086] As shown in Figure 6(b), the wiring member 11 has two or more pads 52 that do not overlap with any of the multiple pads 51 of the wiring member 11 in the Z direction, and in the modified example 1 of the first embodiment, there are four pads 52b. Each of the multiple pads 52 other than the four pads 52b is designated as pad 52a. Each of the multiple pads 52a overlaps with one of the corresponding pads 51 in the Z direction.

[0087] As shown in Figure 6(b), each of the four pads 52b is in contact with at least one of the two long sides LS2 of region E12, or one in the modified example 1 of the first embodiment. Also, each of the two pads 52b is in contact with either one of the two short sides SS2 of region E12. The four pads 52b are arranged in pairs on each side of the plurality of pads 52a in the X direction.

[0088] Viewed in the Z direction, each pad 23b shown in Figure 6(a) is a circular pad. Preferably, the area S22 of each of the four pads 23b is larger than the area S21 of one pad 23a other than the four pads 23b among the multiple pads 23. This allows the wiring board 201 to be firmly reinforced by the joining member 24b shown in Figure 4(a), further improving the reliability of the joint.

[0089] Furthermore, it is preferable that the area S22 of each of the four pads 23b shown in Figure 6(a) is larger than the area S11 of any one of the multiple pads 13 shown in Figure 6(d). This allows the wiring board 201 to be firmly reinforced by the joining member 24b shown in Figure 4(a), further improving the reliability of the joint.

[0090] Furthermore, when viewed in the Z direction, each pad 52b shown in Figure 6(b) is a circular pad. Preferably, the area S42 of each of the four pads 52b is larger than the area S41 of the one pad 52a other than the four pads 52b among the multiple pads 52. As a result, the wiring board 201 is firmly reinforced by the joining member 24b shown in Figure 4(a), further improving the reliability of the joint.

[0091] Furthermore, it is preferable that the area S42 of each of the four pads 52b shown in Figure 6(b) is larger than the area S31 of any one of the multiple pads 51 shown in Figure 6(c). This allows the wiring board 201 to be firmly reinforced by the joining member 24b shown in Figure 4(a), further improving the reliability of the joint.

[0092] The size of pad 23b is preferably larger than the size of pad 23a, but they may be the same. Similarly, the size of pad 52b is preferably larger than the size of pad 52a, but they may be the same.

[0093] Furthermore, the shapes of pad 23b and pad 52b are identical, but may be different. Also, the sizes of pad 23b and pad 52b are identical, but may be different.

[0094] [Modification 2 of the First Embodiment] A second modification of the first embodiment will now be described. In the first modification of the first embodiment described above, as shown in Figure 6(a), the pad 23b is circular in shape, but the case where it is larger in size than the pad 23a was described. In the second modification of the first embodiment described above, as shown in Figure 6(b), the pad 52b is circular in shape, but the case where it is larger in size than the pad 52a was described.

[0095] Figure 7(a) is a cross-sectional view of a wiring board 201 according to a modified example 2 of the first embodiment. Figure 7(b) is a cross-sectional view of a wiring member 11 according to a modified example 2 of the first embodiment. Figure 7(c) is a cross-sectional view of a wiring member 11 according to a modified example 2 of the first embodiment. Figure 7(d) is a cross-sectional view of a wiring board 101 according to a modified example 2 of the first embodiment. Figure 7(a) schematically illustrates a cross-section of the wiring board 201 along the ZB1-ZB1 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z axis. Figure 7(b) schematically illustrates a cross-section of the wiring member 11 along the ZB2-ZB2 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z axis. Figure 7(c) schematically illustrates a cross-section of the wiring member 11 along the ZA2-ZA2 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z axis. Figure 7(d) schematically shows a cross-section of the wiring board 101 along the ZA1-ZA1 virtual plane shown in Figure 4(a), viewed in the negative direction of the Z-axis.

[0096] The number of pads 23 on the wiring board 201 shown in Figure 7(a) is greater than the number of pads 13 on the wiring board 101 shown in Figure 7(d). Similarly, the number of pads 52 on the wiring member 11 shown in Figure 7(b) is greater than the number of pads 51 on the wiring member 11 shown in Figure 7(c). Furthermore, as in the first embodiment, the total area S2 is larger than the total area S1, and the total area S4 is larger than the total area S3. And, as in the first embodiment, the reliability of the joint is improved.

[0097] As shown in Figure 7(a), the plurality of pads 23 of the wiring board 201 have two or more pads that do not overlap with any of the plurality of pads 13 of the wiring board 101 in the Z direction, and in the modified example 2 of the first embodiment, there are 16 pads 23b. Of the plurality of pads 23, each of the plurality of pads other than the 16 pads 23b is a pad 23a.

[0098] Similar to the first embodiment, the shape and size of pad 23a are the same as those of pad 13. Also, similar to the first embodiment, the shape and size of pad 52a are the same as those of pad 51. Furthermore, similar to the first embodiment, the shape and size of pad 23a are the same as those of pad 52a, and the shape and size of pad 13 are the same as those of pad 51.

[0099] In Modification 2 of the First Embodiment, the shape and size of pad 23b are the same as those of pad 23a. Also in Modification 2 of the First Embodiment, the shape and size of pad 52b are the same as those of pad 52a. Even in such cases, the reliability of the bond is improved.

[0100] [Modification 3 of the First Embodiment] A third modification of the first embodiment will now be described. Figure 8 is a cross-sectional view of the processing module 500A according to the third modification of the first embodiment. In Figure 8, the processing module 500 shown in Figure 3 is replaced with the processing module 500A, and the cross-section of the processing module 500A along the AA virtual plane is schematically shown in the positive direction of the Y axis. The AA virtual plane is a virtual plane parallel to the XZ plane.

[0101] The processing module 500A in the modified example 3 is a processing module 500 with the addition of a resin member 60. The resin member 60 is a reinforcing resin member that joins the wiring board 201 and the wiring member 11. Specifically, the resin member 60 is positioned on the outer circumference of the wiring member 11 and is in contact with the side surface of the wiring member 11 and the main surface 2012 of the wiring board 201. The resin member 60 is also in contact with the joining member 24b.

[0102] In this way, the reinforcement of the wiring board 201 by the resin member 60 reduces the warping of the wiring board 201, improving the reliability of the joints in the processing module 500A.

[0103] [Second Embodiment] A second embodiment will now be described. Hereinafter, elements denoted by the same reference numerals as those in the first embodiment will have substantially the same configuration and function as those described in the first embodiment unless otherwise specified. The differences from the first embodiment will be the main focus of this description.

[0104] Figure 9 is a cross-sectional view of the processing module 500B according to the second embodiment. Figure 9 schematically shows the processing module 500B, with the processing module 500 shown in Figure 3 replaced by the processing module 500B, and the cross-section of the processing module 500B along the AA virtual plane viewed in the positive direction of the Y axis. The AA virtual plane is a virtual plane parallel to the XZ plane.

[0105] Figure 10(a) is a cross-sectional view of the wiring board 201 according to the second embodiment. Figure 10(b) is a cross-sectional view of the wiring member 11 according to the second embodiment. Figure 10(c) is a cross-sectional view of the wiring member 11 according to the second embodiment. Figure 10(d) is a cross-sectional view of the wiring board 101 according to the second embodiment. Figure 10(a) schematically illustrates the wiring board 201 as viewed in the negative direction of the Z axis, with the cross section of the wiring board 201 along the ZB1-ZB1 virtual plane shown in Figure 9. Figure 10(b) schematically illustrates the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZB2-ZB2 virtual plane shown in Figure 9. Figure 10(c) schematically illustrates the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZA2-ZA2 virtual plane shown in Figure 9. Figure 10(d) schematically shows a cross-section of the wiring board 101 along the ZA1-ZA1 virtual plane shown in Figure 9, viewed in the negative direction of the Z-axis.

[0106] The wiring member 11 has a plurality of pads 51 arranged on the main surface 111, and two or more pads arranged on the main surface 111. In the second embodiment, the two or more pads arranged on the main surface 111 are four pads 51c. The four pads 51c are pads that are not used for joining with the wiring board 101. That is, the four pads 51c are not joined to the wiring board 101. The wiring member 11 also has a plurality of pads 52 arranged on the main surface 112.

[0107] The relative numbers of the pads 13 on the wiring board 101, the pads 51 on the wiring member 11, the pads 23 on the wiring board 201, and the pads 52 on the wiring member 11 in the second embodiment are as described in the first embodiment.

[0108] In other words, in the second embodiment, the number of pads 23 on the wiring board 201 is greater than the number of pads 13 on the wiring board 101. In the examples of Figures 10(a) and 10(d), there are 36 pads 23 and 32 pads 13. Also, the number of pads 52 on the wiring member 11 is greater than the number of pads 51 on the wiring member 11. In the examples of Figures 10(b) and 10(c), there are 36 pads 52 and 32 pads 51. Furthermore, the number of joining members 24 is greater than the number of joining members 14. Note that there are 4 pads 51c that are not used for joining.

[0109] The multiple pads 23 of the wiring board 201 have two or more pads, four pads 23b in the second embodiment, that do not overlap with any of the multiple pads 13 of the wiring board 101 in the Z direction. Of the multiple pads 23, each of the multiple pads other than the four pads 23b is a pad 23a. In the example of Figure 10(a), the number of multiple pads 23a is 32 (8 × 4).

[0110] Here, as shown in Figure 10(a), a rectangular region E11 with the minimum area surrounding the multiple pads 23 is defined. Region E11 is an example of the first minimum rectangular region. The outer perimeter of region E11 includes two long sides LS1 extending in the X direction and spaced apart from each other in the Y direction, and two short sides SS1 extending in the Y direction and spaced apart from each other in the X direction.

[0111] Each of the four pads 23b is in contact with at least one of the two long sides LS1 of region E11, or one in the second embodiment. Each of the four pads 23b is also in contact with either one of the two short sides SS1 of region E11. The four pads 23b are arranged in pairs on each side of the plurality of pads 23a in the X direction.

[0112] The wiring member 11 has multiple pads 52, each consisting of two or more pads that do not overlap with any of the multiple pads 51 of the wiring member 11 in the Z direction; in the second embodiment, there are four pads 52b. Each of the multiple pads 52 other than the four pads 52b is a pad 52a. In the example shown in Figure 10(b), there are 32 (8 × 4) multiple pads 52a.

[0113] Each of the multiple pads 13 overlaps with one of the multiple pads 51 in the Z direction. Each of the multiple pads 51 overlaps with one of the multiple pads 52a in the Z direction. Each of the multiple pads 52a overlaps with one of the multiple pads 23a in the Z direction. Also, each of the two pads 52b overlaps with one of the two pads 23b in the Z direction. In the second embodiment, each of the four pads 51c overlaps with one of the four pads 52b in the Z direction.

[0114] Here, as shown in Figure 10(b), a rectangular region E12 with the smallest area surrounding the multiple pads 52 is defined. Region E12 is an example of a second smallest rectangular region. The perimeter of region E12 includes two long sides LS2 extending in the X direction and spaced apart in the Y direction, and two short sides SS2 extending in the Y direction and spaced apart in the X direction.

[0115] Each of the four pads 52b is in contact with at least one of the two long sides LS2 of region E12, or one in the second embodiment. Each of the four pads 52b is also in contact with either one of the two short sides SS2 of region E12. The four pads 52b are arranged in pairs on each side of the plurality of pads 52a in the X direction.

[0116] The multiple joining members 24 include four joining members 24b corresponding to each of the four pads 23b. Furthermore, the multiple joining members 24 also include multiple joining members 24a corresponding to each of the multiple pads 23a.

[0117] That is, each of the four pads 23b is joined to the corresponding one of the four pads 52b by the corresponding one of the four joining members 24b. Also, each of the plurality of pads 23a is joined to the corresponding one of the plurality of pads 52a by the corresponding one of the plurality of joining members 24a. Incidentally, each of the plurality of pads 13 is joined to the corresponding one of the plurality of pads 51 by the corresponding one of the plurality of joining members 14.

[0118] In the second embodiment, similar to the first embodiment, S1 < S2, that is, the total area S2 is larger than the total area S1. Also, in the second embodiment, similar to the first embodiment, S3 < S4, that is, the total area S4 is larger than the total area S3. Thus, the reliability of the joining is improved. Incidentally, the magnitude relationship among the area S21 of the pad 23a, the area S22 of the pad 23b, the area S41 of the pad 52a, the area S42 of the pad 52b, the area S31 of the pad 51, and the area S11 of the pad 13 is as described in the first embodiment.

[0119] The insulator 41 of the wiring member 11 has end face through-holes formed in the end face (side face). An end face through-hole is a groove formed in at least one side face of the insulator 41 and connected to the main faces 111, 112. In the second embodiment, the end face through-hole is formed at a position corresponding to the corner between the two side faces of the insulator 41 and is a groove extending in the Z direction from the main face 111 to the main face 112. That is, in the second embodiment, the end face through-hole (groove) has a shape obtained by vertically dividing a cylindrical hole into four parts.

[0120] The wiring member 11 has a conductor pattern 53 disposed in the end face through-hole. The conductor pattern 53 is connected to the pad 52b and the pad 51c. In the second embodiment, the conductor pattern 53 is integral with the pad 52b and the pad 51c. Incidentally, the end face through-hole may be formed in one side face of the insulator 41. That is, the end face through-hole (groove) may have a shape obtained by vertically dividing a cylindrical hole into two parts.

[0121] Pad 52b is located at the end of the main surface 112 in either the X or Y direction. Pad 52b is an example of a first end pad. Pad 51c is located at the end of the main surface 111 in either the X or Y direction. Pad 51c is an example of a second end pad.

[0122] In the second embodiment, pad 52b is located at the corner of the main surface 112. That is, pad 52c is located at the X and Y ends of the main surface 112. Also in the second embodiment, pad 51c is located at the corner of the main surface 111. That is, pad 51c is located at the X and Y ends of the main surface 111.

[0123] The method for forming end face through-holes involves first preparing a sheet-like substrate (not shown) for multiple wiring members 11 before they are separated into individual pieces. Through-holes and through-hole conductors are provided on the substrate at positions corresponding to the outer corners of the wiring members 11. The positions corresponding to the through-hole conductors on the substrate are then cut with a cutting device such as a dicer, thereby forming end face through-holes and conductor patterns 53 at each of the four corners of the wiring member 11 when viewed in the Z direction.

[0124] Of the multiple joining members 24, the joining member 24b that contacts the pad 52b is in contact with the conductor pattern 53. In other words, the joining member 24b covers at least a portion of the conductor pattern 53 located on the side surface of the wiring member 11. Preferably, the joining member 24b covers an area of ​​1 / 2 or more of the conductor pattern 53.

[0125] Since the end-face through-hole conductor pattern 53 used for reinforcement can be manufactured using the same process as the through-hole conductor 12 used for signal wiring, power wiring, or ground wiring, there is no need to add any extra process steps, thus reducing manufacturing costs.

[0126] Since the conductor pattern 53 is formed on the side surface (end face) of the insulator 41 in this way, the joining member 24b can be joined not only to the pad 52b placed on the main surface 112, but also to the conductor pattern 53 placed on the side surface. This further reduces warping of the wiring board 201 due to thermal deformation and improves the reliability of the joint.

[0127] The method for forming the conductor pattern 53 is not limited to the above example; the conductor pattern 53 may also be formed, for example, by metal plating on the side surface (end face) of the insulator 41 of the wiring member 11.

[0128] [Third Embodiment] A third embodiment will now be described. Hereinafter, elements denoted by reference numerals common to the first or second embodiment will have substantially the same configuration and function as those described in the first or second embodiment unless otherwise specified. The differences from the first and second embodiments will be primarily described.

[0129] Figure 11 is a cross-sectional view of the processing module 500C according to the third embodiment. Figure 11 schematically shows the processing module 500C, with the processing module 500 shown in Figure 3 replaced by the processing module 500C, and the cross-section of the processing module 500C along the AA virtual plane viewed in the positive direction of the Y axis. The AA virtual plane is a virtual plane parallel to the XZ plane.

[0130] Figure 12(a) is a cross-sectional view of the wiring board 201 according to the third embodiment. Figure 12(b) is a cross-sectional view of the wiring member 11 according to the third embodiment. Figure 12(c) is a cross-sectional view of the wiring member 11 according to the third embodiment. Figure 12(d) is a cross-sectional view of the wiring board 101 according to the third embodiment. Figure 12(a) schematically shows the wiring board 201 as viewed in the negative direction of the Z axis, with the cross section of the wiring board 201 along the ZB1-ZB1 virtual plane shown in Figure 11. Figure 12(b) schematically shows the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZB2-ZB2 virtual plane shown in Figure 11. Figure 12(c) schematically shows the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZA2-ZA2 virtual plane shown in Figure 11. Figure 12(d) schematically shows a cross-section of the wiring board 101 along the ZA1-ZA1 virtual plane shown in Figure 11, viewed in the negative direction of the Z-axis.

[0131] In the processing module 500 of the first embodiment described above, the case where all of the multiple pads 13 are pads 13a used as signal wiring, power wiring, or ground wiring, all of the multiple pads 51 are pads 51a used as signal wiring, power wiring, or ground wiring, and all of the multiple connecting members 14 are connecting members 14a used as signal wiring, power wiring, or ground wiring was described.

[0132] In the processing module 500C of the third embodiment, of the multiple pads 13, two or more pads, for example, four pads 13b, are pads other than pad 13a. Also, in the processing module 500C of the third embodiment, of the multiple pads 51, two or more pads, for example, four pads 51b, are pads other than pad 51a. Also, in the processing module 500C of the third embodiment, of the multiple joining members 14, two or more joining members, for example, four joining members 14b, are joining members other than joining member 14a.

[0133] In the processing module 500C of the third embodiment, among the plurality of pads 23, two or more pads, for example, four pads 23b, are pads other than the pad 23a. Also, in the processing module 500C of the third embodiment, among the plurality of pads 52, two or more pads, for example, four pads 52b, are pads other than the pad 52a. Further, in the processing module 500C of the third embodiment, among the plurality of joining members 24, two or more joining members, for example, four joining members 24b, are joining members other than the joining member 24a.

[0134] The four pads 13b and the four pads 51b are joined by four joining members 14b. The four pads 23b and the four pads 52b are joined by four joining members 24b.

[0135] The four pads 13b of the wiring board 101, the four joining members 14b, the four pads 51b of the wiring member 11, and the four pads 52b of the wiring board 201 are not used for any of the signal wiring, power supply wiring, and ground wiring. That is, the pad 13b and the pad 52b are not connected by a through-hole conductor. In the third embodiment, the four pads 13b of the wiring board 101 are joined to the four pads 51b of the wiring member 11 by four joining members 14b.

[0136] In the third embodiment, similar to the first embodiment, S1 < S2, that is, the total area S2 is larger than the total area S1. By setting S1 < S2, the wiring board 201 having a relatively low bending rigidity compared to the wiring board 101 is reinforced by a plurality of joining members 24 having a larger joining area than the plurality of joining members 14, and the warping of the wiring board 201 is reduced in the thermal fatigue test.

[0137] Also, by appropriately adjusting the area S12 of each pad 13b and the area S22 of each pad 23b so that the size of each pad 13b is smaller than the size of each pad 23b, the total areas S1 and S2 are adjusted. As a result, among the plurality of joining members 24a, the stress applied to the joining member 24a located at the outer peripheral corner portion of the plurality of joining members 24a can be dispersed to the joining member 24a located at the central portion of the plurality of joining members 24a and the plurality of joining members 14, and the reliability of the joining is improved.

[0138] Also, in the third embodiment, similar to the first embodiment, S3 < S4, that is, the total area S4 is wider than the total area S3. By setting S3 < S4, the wiring board 201 having a relatively low bending rigidity compared to the wiring board 101 is reinforced by the plurality of joining members 24 having a wider joining area than the plurality of joining members 14, and the warping of the wiring board 201 in the thermal fatigue test is reduced.

[0139] Also, by appropriately adjusting the area S32 of each pad 51b and the area S42 of each pad 52b so that the size of each pad 51b is smaller than the size of each pad 52b, the total areas S3 and S4 are adjusted. As a result, among the plurality of joining members 24a, the stress applied to the joining member 24a located at the outer peripheral corner portion of the plurality of joining members 24a can be dispersed to the joining member 24a located at the central portion of the plurality of joining members 24a and the plurality of joining members 14, and the reliability of the joining is improved.

[0140] Note that any one of the four pads 13b of the wiring board 101, the four joining members 14b, the four pads 51b of the wiring member 11, the four pads 52b of the wiring member 11, the four joining members 24b, and the four pads 23b of the wiring board 201 may be used for any of the signal wiring, power supply wiring, or ground wiring. For example, the pad 51b and the pad 52b may be connected by a through-hole conductor, and the combination of the pad 51b, the pad 52b, and the through-hole conductor may be used for any of the signal wiring, power supply wiring, or ground wiring.

[0141] [Fourth Embodiment] A fourth embodiment will now be described. Hereinafter, elements denoted by reference numerals common to any of the first to third embodiments will have substantially the same configuration and function as those described in any of the first to third embodiments unless otherwise specified. The differences from the first to third embodiments will be primarily described.

[0142] Figure 13 is a cross-sectional view of the processing module 500D according to the fourth embodiment. Figure 13 schematically illustrates the processing module 500D, with the processing module 500 shown in Figure 3 replaced by the processing module 500D, and the cross-section of the processing module 500D along the AA virtual plane viewed in the positive direction of the Y axis. The AA virtual plane is a virtual plane parallel to the XZ plane.

[0143] Figure 14(a) is a cross-sectional view of the wiring board 201 according to the fourth embodiment. Figure 14(b) is a cross-sectional view of the wiring member 11 according to the fourth embodiment. Figure 14(c) is a cross-sectional view of the wiring member 11 according to the fourth embodiment. Figure 14(d) is a cross-sectional view of the wiring board 101 according to the fourth embodiment. Figure 14(a) schematically illustrates the wiring board 201 as viewed in the negative direction of the Z axis, with the cross section of the wiring board 201 along the ZB1-ZB1 virtual plane shown in Figure 13. Figure 14(b) schematically illustrates the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZB2-ZB2 virtual plane shown in Figure 13. Figure 14(c) schematically illustrates the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZA2-ZA2 virtual plane shown in Figure 13. Figure 14(d) schematically shows a cross-section of the wiring board 101 along the ZA1-ZA1 virtual plane shown in Figure 13, viewed in the negative direction of the Z-axis.

[0144] In the fourth embodiment, the plurality of pads 13 of the wiring board 101 have four pads 13b, which are two or more pads. The plurality of joining members 14 have four joining members 14b, which are two or more joining members.

[0145] The wiring member 11 of the fourth embodiment has the same configuration as the wiring member 11 of the second embodiment, but has four pads 51b corresponding to the four pads 51c of the second embodiment. That is, the four pads 51c of the second embodiment are not joined to the wiring board 101, but the four pads 51b of the fourth embodiment are joined to the four pads 13b of the wiring board 101 by four joining members 14b respectively. The four pads 51b are included in the plurality of pads 51.

[0146] In the fourth embodiment, the number of the plurality of pads 13 of the wiring board 101, the number of the plurality of pads 51 of the wiring member 11, the number of the plurality of pads 23 of the wiring board 201, and the number of the plurality of pads 52 of the wiring member 11 are the same as each other.

[0147] In the fourth embodiment, similar to the first embodiment, S1 < S2, that is, the total area S2 is larger than the total area S1. Also, in the fourth embodiment, similar to the first embodiment, S3 < S4, that is, the total area S4 is larger than the total area S3. Therefore, the reliability of joining is improved. Note that the area S12 of the pad 13b is larger than the area S11 of the pad 13a. Also, the area S32 of the pad 51b is larger than the area S31 of the pad 51a.

[0148] The insulator 41 of the wiring member 11 has end face through holes formed in the end face (side face). The end face through hole is a groove formed in at least one side face of the insulator 41 and connected to the main surfaces 111, 112. In the fourth embodiment, the end face through hole is formed at a position corresponding to the corner between the two side faces of the insulator 41, and is a groove extending in the Z direction from the main surface 111 to the main surface 112. That is, in the fourth embodiment, the end face through hole (groove) has a shape obtained by longitudinally dividing a cylindrical hole into four parts.

[0149] The wiring member 11 has a conductor pattern 53 arranged in an end face through hole. The conductor pattern 53 is connected to pads 52b and 51b. In the fourth embodiment, the conductor pattern 53 is integrated with pads 52b and 51b. The end face through hole may be formed on one side of the insulator 41. That is, the end face through hole (groove) may be shaped like a cylindrical hole that is vertically divided into two.

[0150] Pad 52b is located at the end of the main surface 112 in either the X or Y direction. Pad 52b is an example of a first end pad. Pad 51b is located at the end of the main surface 111 in either the X or Y direction. Pad 51b is an example of a second end pad.

[0151] In the fourth embodiment, pad 52b is located at the corner of the main surface 112. That is, pad 52c is located at the X and Y ends of the main surface 112. Also in the fourth embodiment, pad 51b is located at the corner of the main surface 111. That is, pad 51b is located at the X and Y ends of the main surface 111.

[0152] Of the multiple joining members 14, the joining member 14b that contacts the pad 51b is in contact with the conductor pattern 53. In other words, the joining member 14b covers at least a portion of the conductor pattern 53 located on the side surface of the wiring member 11.

[0153] Of the multiple joining members 24, the joining member 24b that contacts the pad 52b is in contact with the conductor pattern 53. In other words, the joining member 24b covers at least a portion of the conductor pattern 53 located on the side surface of the wiring member 11.

[0154] Since the end-face through-hole conductor pattern 53 used for reinforcement can be manufactured using the same process as the through-hole conductor 12 used for signal wiring, power wiring, or ground wiring, there is no need to add any extra process steps, thus reducing manufacturing costs.

[0155] Since the conductor pattern 53 is formed on the side surface (end surface) of the insulator 41 in this way, the joining member 24b can be joined not only to the pad 52b disposed on the main surface 112 but also to the conductor pattern 53 disposed on the side surface. As a result, the warping due to thermal deformation of the wiring board 201 can be further reduced, and the reliability of the joining is improved.

[0156] Also, in the fourth embodiment, similar to the first embodiment, S1 < S2, that is, the total area S2 is larger than the total area S1. By setting S1 < S2, the wiring board 201 having a relatively low bending rigidity compared to the wiring board 101 is reinforced by a plurality of joining members 24 having a larger joining area than the plurality of joining members 14, and the warping of the wiring board 201 in the thermal fatigue test is reduced.

[0157] Further, by appropriately adjusting the area S12 of each pad 13b and the area S22 of each pad 23b so that the size of each pad 13b is smaller than the size of each pad 23b, the total areas S1 and S2 are adjusted. As a result, among the plurality of joining members 24a, the stress applied to the joining member 24a located at the outer peripheral corner portion of the plurality of joining members 24a can be dispersed to the joining member 24a located at the central portion of the plurality of joining members 24a and the plurality of joining members 14, and the reliability of the joining is improved.

[0158] Also, in the fourth embodiment, similar to the first embodiment, S3 < S4, that is, the total area S4 is larger than the total area S3. By setting S3 < S4, the wiring board 201 having a relatively low bending rigidity compared to the wiring board 101 is reinforced by a plurality of joining members 24 having a larger joining area than the plurality of joining members 14, and the warping of the wiring board 201 in the thermal fatigue test is reduced.

[0159] Furthermore, the total areas S3 and S4 are adjusted by appropriately adjusting the area S32 of each pad 51b and the area S42 of each pad 52b so that the size of each pad 51b is smaller than the size of each pad 52b. As a result, the stress applied to the joint members 24a located at the outer corners of the multiple joint members 24a can be distributed to the joint members 24a located in the center of the multiple joint members 24a and to the multiple joint members 14, thereby improving the reliability of the joint.

[0160] The method for forming the conductor pattern 53 is not limited to the above example. For example, the conductor pattern 53 may be formed by metal plating on the side surface (end face) of the insulator 41 of the wiring member 11. Also, the joining member 14b may be connected to the joining member 24b in the conductor pattern 53 and become one unit.

[0161] [Fifth Embodiment] A fifth embodiment will now be described. Hereinafter, elements denoted by reference numerals common to any of the first to fourth embodiments will have substantially the same configuration and function as those described in any of the first to fourth embodiments unless otherwise specified. The differences from the first to fourth embodiments will be primarily described.

[0162] Figure 15 is a cross-sectional view of the processing module 500E according to the fifth embodiment. Figure 15 schematically illustrates the processing module 500E, with the processing module 500 shown in Figure 3 replaced by the processing module 500E, and the cross-section of the processing module 500E along the AA virtual plane viewed in the positive direction of the Y axis. The AA virtual plane is a virtual plane parallel to the XZ plane.

[0163] Figure 16(a) is a cross-sectional view of the wiring board 201 according to the fifth embodiment. Figure 16(b) is a cross-sectional view of the wiring member 11 according to the fifth embodiment. Figure 16(c) is a cross-sectional view of the wiring member 11 according to the fifth embodiment. Figure 16(d) is a cross-sectional view of the wiring board 101 according to the fifth embodiment. Figure 16(a) schematically illustrates the wiring board 201 as viewed in the negative direction of the Z axis, with the cross section of the wiring board 201 along the ZB1-ZB1 virtual plane shown in Figure 15. Figure 16(b) schematically illustrates the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZB2-ZB2 virtual plane shown in Figure 15. Figure 16(c) schematically illustrates the wiring member 11 as viewed in the negative direction of the Z axis, with the cross section of the wiring member 11 along the ZA2-ZA2 virtual plane shown in Figure 15. Figure 16(d) schematically shows a cross-section of the wiring board 101 along the ZA1-ZA1 virtual plane shown in Figure 15, viewed in the negative direction of the Z-axis.

[0164] In the fifth embodiment, the pads 52b, 23b and joining members 24b shown in the first embodiment are not provided. That is, all of the multiple pads 13 are pads 13a, all of the multiple pads 51 are pads 51a, all of the multiple pads 23 are pads 23a, all of the multiple pads 52 are pads 52a, all of the multiple joining members 14 are joining members 14a, and all of the multiple joining members 24 are joining members 24a.

[0165] Multiple pads 13a are all formed to be the same size, for example. Similarly, multiple pads 23a are all formed to be the same size, for example. Furthermore, the size of each pad 23a is larger than the size of each pad 13a. That is, the area S21 of each pad 23a is larger than the area S11 of each pad 13a.

[0166] While the multiple pads 13a are all the same size as an example, this is not limited to that, and the multiple pads 13a may be of different sizes. Similarly, while the multiple pads 23a are all the same size as an example, this is not limited to that, and the multiple pads 23a may be of different sizes.

[0167] The plurality of pads 51a are formed, for example, all with the same size. Also, the plurality of pads 52a are formed, for example, all with the same size. Further, the size of each pad 52a is larger than the size of each pad 51a. That is, the area S41 of each pad 52a is larger than the area S31 of each pad 51a.

[0168] Note that the plurality of pads 51a are, for example, all of the same size, but are not limited thereto, and the plurality of pads 51a may have different sizes from each other. Also, the plurality of pads 52a are, for example, all of the same size, but are not limited thereto, and the plurality of pads 52a may have different sizes from each other.

[0169] The plurality of pads 51a of the wiring member 11 are joined to the plurality of pads 13a of the wiring board 101 by the plurality of joining members 14a. The plurality of pads 52a of the wiring member 11 are joined to the plurality of pads 23a of the wiring board 201 by the plurality of joining members 24a.

[0170] According to the fifth embodiment, similar to the first embodiment, S1 < S2, that is, the total area S2 is wider than the total area S1. By setting S1 < S2, the wiring board 201 having a relatively low bending rigidity compared to the wiring board 101 is reinforced by the plurality of joining members 24 having a larger joining area than the plurality of joining members 14, and the warping of the wiring board 201 in the thermal fatigue test is reduced. Thereby, the reliability of the joining is improved.

[0171] Also, similar to the first embodiment, S3 < S4, that is, the total area S4 is wider than the total area S3. By setting S3 < S4, the wiring board 201 having a relatively low bending rigidity compared to the wiring board 101 is reinforced by the plurality of joining members 24 having a larger joining area than the plurality of joining members 14, and the warping of the wiring board 201 in the thermal fatigue test is reduced. Thereby, the reliability of the joining is improved.

[0172] Furthermore, since the area S21 of each of the plurality of pads 23a is larger than the area S11 of each of the plurality of pads 13a, the wiring board 201 is fixed more firmly, thermal deformation is further reduced, and the reliability of the bonding is further improved.

[0173] Also, since the area S41 of each of the plurality of pads 52a is larger than the area S31 of each of the plurality of pads 51a, the wiring board 201 is fixed more firmly, thermal deformation is further reduced, and the reliability of the bonding is further improved.

[0174] [Example 1] Example 1 corresponding to the first embodiment will be described with reference to FIGS. 3, FIGS. 4(a), FIGS. 4(b), FIGS. 5(a) to FIGS. 5(d). The size of the wiring board 101 was set to 50 [mm] × 50 [mm], and the size of the wiring board 201 was set to 27 [mm] × 16 [mm]. The size of the wiring member 11 was set to 20 [mm] × 3.6 [mm]. Each of the electronic components 102a and 102b mounted on the wiring board 201 is a BGA memory component. The size of each of the electronic components 102a and 102b was 12.4 [mm] × 15 [mm]. The pitch in the X direction between the electronic component 102a and the electronic component 102b was set to 0.8 [mm], and the pitch in the Y direction was set to 0.7 [mm]. In Example 1, the same components were used for both the electronic components 102a and 102b.

[0175] Each of the wiring board 101 and the wiring board 201 is composed of an FR4 insulator 41 made of glass epoxy and a wiring layer made of Cu, and is a wiring board having a Young's modulus of about 18 [GPa]. The length W1 in the X direction of the wiring board 101 was set to 50 [mm], and the thickness H1 was set to 0.9 [mm]. The length W2 in the X direction of the wiring board 201 was set to 20 [mm], and the thickness H2 was set to 0.7 [mm].

[0176] Here, assuming that the Young's modulus of the wiring board is E, the width of the wiring board is W, and the thickness of the wiring board is H, the bending rigidity K of the wiring board is E × W × H 3 / 12. Note that the length in the X direction of the wiring board 101 and the wiring board 201 is W1 > W2, and the thickness is H1 > H2.

[0177] The bending rigidity K1 of the wiring board 101 is 0.05467 [N·m] 2 ] was (18×10 9 [N / m 2 ]×(50×10 -3 [m] × (0.9 × 10 -3 [m]) 3 ) / 12). The bending rigidity K2 of the wiring board 201 is 0.01389 [N·m]. 2 ] was (18×10 9 [N / m 2 ]×(27×10 -3 [m] × (0.7 × 10 -3 [m]) 3 ) / 12). In other words, comparing the bending stiffness K1 of the wiring board 101 with the bending stiffness K2 of the wiring board 201, K1 > K2, meaning the bending stiffness of the wiring board 201 is lower than that of the wiring board 101.

[0178] The thickness of the wiring component 11 was set to 0.5 mm. The diameter of the through-hole conductor 12 was set to 0.15 mm, and the pitch of the through-hole conductor 12 was set to 0.4 mm. The size (diameter) of the pads 51a and 52a connected to the through-hole conductor 12 was set to φ0.23 mm. The pads 51a and 52a have an SMD structure.

[0179] The size (diameter) of multiple pads 23a on the wiring board 201 was set to φ0.23 [mm]. The number of multiple pads 23a was set to 313. The size of multiple reinforcing pads 23b that are not connected to the through-hole conductor 12 was set to 1.1 [mm] × 2.9 [mm]. Two of these multiple pads 23b were placed on the left and right sides in the longitudinal direction (X direction) of the wiring member 11.

[0180] In Example 1, the area S21 per pad of the multiple signal pads 23a is 0.042 [mm²]. 2 ]. Also, the area S22 per pad of the multiple reinforcing pads 23b was 3.190 [mm²]. 2 In this way, the area S22 of each of the multiple pads 23b was set to be approximately 77 times larger than the area S21 of each of the multiple pads 23a.

[0181] The sizes (diameters) of the plurality of signal pads 13a on the wiring board 101 were set to φ0.23 [mm]. The number of the plurality of pads 13a was 313. Reinforcement pads not connected to the through-hole conductor 12 were not provided on the wiring board 101. Each of the pads 23a, 23b, 13a has an SMD structure.

[0182] The plurality of pads 51a of the wiring member 11 are joined to the plurality of pads 13a of the wiring board 101 by a plurality of joining members 14a. The plurality of pads 52a of the wiring member 11 are joined to the plurality of pads 23a of the wiring board 201 by a plurality of joining members 24a.

[0183] When the total area of the portions where the plurality of joining members 14 contact the plurality of pads 13 of the wiring board 101 is S1, S1 = 13.00 [mm 2 . When the total area of the portions where the plurality of joining members 24 contact the plurality of pads 23 of the wiring board 201 is S2, S2 = 19.38 [mm 2 . That is, S1 < S2. In Example 1, the total area S2 was set 49% more than the total area S1.

[0184] In Example 1, S1 < S2, that is, the total area S2 is larger than the total area S1. By setting S1 < S2, the wiring board 201 having a relatively low bending rigidity compared to the wiring board 101 is reinforced by the plurality of joining members 24 having a larger joining area than the plurality of joining members 14, and the warpage of the wiring board 201 in the thermal fatigue test is reduced. Further, by strengthening the reinforcement of the wiring board 201 having a low bending rigidity, the stress applied to the joining members 24a located at the outer peripheral corner portions of the plurality of joining members 24a can be dispersed to the joining members 24a located at the central portions of the plurality of joining members 24a and the plurality of joining members 14, and it is possible to prevent stress from concentrating on the joining members 24a located at the outer peripheral corner portions, thereby improving the reliability of the joining.

[0185] [Example 2] Example 2 corresponding to the second embodiment will be described with reference to FIGS. 9, 10(a) to 10(d). Matters not described are the same as those in Example 1.

[0186] The thickness of the wiring member 11 was set to 0.5 [mm]. The wiring member 11 includes, for reinforcement, a plurality of pads 52b and a plurality of conductor patterns 53 formed in the end face through-holes. The end face through-holes are sized such that the size of the through-hole center obtained by dividing the through-hole with a pad 52b size of φ1.1 [mm] and a drill diameter of φ0.85 [mm] into four parts. The area per one of the plurality of conductor patterns 53 located on the side surface of the wiring member 11 was set to 0.67 [mm 2 (2×π×r×h / 4).

[0187] The size (diameter) of the plurality of reinforcing pads 23b was set to φ1.1 [mm]. The plurality of pads 23b are arranged at the four corners of the outer shape in a plan view of the wiring member 11. In Example 2, the area S21 per one pad of the plurality of signal pads 23a is 0.042 [mm 2 . Also, the area S22 per one pad of the plurality of reinforcing pads 23b is 0.95 [mm 2 . Thus, the area S22 of each of the plurality of pads 23b was set to be approximately 23 times larger than the area S22 of each of the plurality of pads 23a.

[0188] On the main surface 1011 of the wiring board 101, no pads are provided that are joined to the plurality of pads 51c of the wiring member 11. That is, the plurality of pads 51c are not joined to the wiring board 101.

[0189] When the total area of the portions where the plurality of joining members 14 contact the plurality of pads 13 of the wiring board 101 is S1, S1 = 13.00 [mm 2 . When the total area of the portions where the plurality of joining members 24 contact the plurality of pads 23 of the wiring board 201 is S2, S2 = 16.81 [mm 2 . That is, A < B. In Example 2, the total area S1 was set 29% larger than the total area S1.

[0190] Here, we have described the case where the total area S2 is set to be 29% larger than the total area S1, but it is preferable that the total area S2 be 7% to 100% larger than the total area S1. For example, if we try to manufacture the wiring boards 101 and 201 so that the total area S1 and the total area S2 are the same, that is, so that the size of each of the multiple pads 13 and each of the multiple pads 23 are the same, a difference of about 7% may occur between pads 13 and pads 23 due to manufacturing tolerances of the pads. For this reason, it is preferable to set the total area S2 to be 7% or more of the total area S1. Also, if the total area S2 is formed to be in a range that exceeds 100% of the total area S1, there is a risk of short-circuit failures occurring between pads in the area of ​​total area S2, so it is preferable to set it to 100% or less.

[0191] Thermal fatigue tests were conducted using the processing module 500B from Example 2 and a modified version thereof. Figure 17 is a graph showing the results of the thermal fatigue tests in Test Examples 1 to 4. The vertical axis represents the number of cycles.

[0192] The processing module in Test Example 1 is structured in the same way as the processing module 500B in Example 2, but without the multiple reinforcing pads 23b, multiple pads 52b, and multiple reinforcing joining members 24b (no reinforcing pads).

[0193] The processing module in Test Example 2 has a structure in which the multiple pads 13b, multiple pads 51b, and multiple joining members 14b shown in the fourth embodiment are provided only on the side of the wiring board 101, compared to the processing module in Test Example 1 (reinforcement pads only on the lower side).

[0194] The processing module in Test Example 3 is configured such that the total area S1 and total area S2 are equal in the processing module of Test Example 2, with each of the multiple pads 13b and each of the multiple pads 23b being the same size, each of the multiple pads 51b and each of the multiple pads 52b being the same size, the multiple pads 13b and the multiple pads 51b being joined by multiple joining members 14b, and the multiple pads 23b and the multiple pads 52b being joined by multiple joining members 24b (reinforcement pads of the same size above and below). The processing module in Test Example 4 is the processing module 500B of Example 2.

[0195] As shown in Figure 17, solder fracture was suppressed more in Test Example 2 than in Test Example 1, more in Test Example 3 than in Test Example 2, and more in Test Example 4 than in Test Example 3. The difference between Test Example 1 and Test Example 2 is less than 100 cycles. The difference between Test Example 2 and Test Example 3 is more than 200 cycles. The difference between Test Example 3 and Test Example 4 is more than 100 cycles. From the results shown in Figure 17, Test Example 4 suppressed solder fracture by approximately 400 cycles more than in Test Example 1, and more than 100 cycles more than in Test Example 3, ensuring high reliability as an electronic device.

[0196] [Other variations] This disclosure is not limited to the embodiments described above, and many modifications are possible within the technical concept of this disclosure. For example, at least two of the embodiments and modifications described above may be combined. Furthermore, the effects described in this embodiment are merely a list of the most preferred effects arising from the embodiments of this disclosure, and the effects of the embodiments of this disclosure are not limited to those described in this embodiment.

[0197] Furthermore, while the above embodiments described the application of the module of this disclosure to imaging devices such as digital cameras, the invention is not limited to this. The module of this disclosure can also be applied to information devices such as smartphones and personal computers, and communication devices such as modems and routers. Alternatively, the module of this disclosure can also be applied to office equipment such as printers and photocopiers, medical equipment such as X-ray imaging devices and endoscopes, industrial equipment such as robots and semiconductor manufacturing equipment, and transportation equipment such as vehicles, airplanes, and ships.

[0198] The disclosures in this specification include not only what is explicitly stated herein, but also all matters that can be inferred from this specification and the drawings attached thereto. Furthermore, the disclosures in this specification include the complement of the individual concepts described herein. That is, if this specification states, for example, "A is B," then even if it omits the statement "A is not B," it can be said that this specification discloses "A is not B." This is because the statement "A is B" presupposes that the case "A is not B" is being considered.

[0199] The above disclosure of embodiments includes the following sections.

[0200] (Section 1) Wiring components and First wiring board and The system comprises a second wiring board laminated on the first wiring board via the aforementioned wiring member, Multiple first pads are arranged on the first main surface of the first wiring board, which are joined to the wiring member by multiple first joining members. Multiple second pads are arranged on the second main surface of the second wiring board, which are joined to the wiring member by multiple second joining members. The second wiring board has lower bending rigidity than the first wiring board. The second total area of ​​the portion of the plurality of second pads that contacts the plurality of second joining members is larger than the first total area of ​​the portion of the plurality of first pads that contacts the plurality of first joining members. A module characterized by the following features.

[0201] (Section 2) The plurality of second pads include two or more second pads that do not overlap any of the plurality of first pads in a first direction perpendicular to the first main surface. The module according to item 1, characterized in that it is a module according to item 1.

[0202] (Section 3) The area of ​​each of the two or more second pads is larger than the area of ​​one of the multiple second pads other than the two or more second pads. The module according to item 2, characterized in that it is a module according to item 2.

[0203] (Section 4) The area of ​​each of the two or more second pads is larger than the area of ​​any one of the plurality of first pads. The module according to item 2 or 3, characterized in that it is a module according to item 2 or 3.

[0204] (Section 5) The plurality of second pads include two or more second pads that are in contact with at least one of the two long sides of the first minimum rectangular region surrounding the plurality of second pads, and that are in contact with either one of the two short sides of the first minimum rectangular region. The area of ​​each of the two or more second pads is larger than the area of ​​one of the multiple second pads other than the two or more second pads. The module according to item 1, characterized in that it is a module according to item 1.

[0205] (Section 6) The area of ​​each of the two or more second pads is larger than the area of ​​any one of the plurality of first pads. The module according to item 5, characterized in that it is a module according to item 5.

[0206] (Section 7) The number of the aforementioned multiple second pads is greater than the number of the aforementioned multiple first pads. A module according to any one of claims 1 to 6, characterized in that it is a module according to any one of claims 1 to 6.

[0207] (Section 8) The area of ​​each of the plurality of second pads is larger than the area of ​​each of the plurality of first pads. The module according to item 1, characterized in that it is a module according to item 1.

[0208] (Section 9) Multiple third pads are arranged on the third main surface of the wiring member, which are joined to the first wiring board by the multiple first joining members. On the fourth main surface of the wiring member opposite to the third main surface, a plurality of fourth pads are arranged, which are joined to the second wiring board by the plurality of second joining members. The fourth total area of ​​the portion of the plurality of fourth pads that contacts the plurality of second joining members is larger than the third total area of ​​the portion of the plurality of third pads that contacts the plurality of first joining members. A module according to any one of claims 1 to 8, characterized in that it is a module according to any one of claims 1 to 8.

[0209] (Section 10) The plurality of fourth pads include two or more fourth pads that do not overlap any of the plurality of third pads in a first direction perpendicular to the first main surface. The module according to item 9, characterized in that it is a module according to item 9.

[0210] (Section 11) The area of ​​each of the two or more fourth pads is larger than the area of ​​one of the four fourth pads other than the two or more fourth pads. The module according to item 10, characterized in that

[0211] (Section 12) The area of ​​each of the two or more fourth pads is larger than the area of ​​any one of the plurality of third pads. The module according to item 11, characterized in that

[0212] (Section 13) The plurality of fourth pads include two or more fourth pads that are in contact with at least one of the two long sides of the second minimum rectangular region surrounding the plurality of fourth pads, and that are in contact with either one of the two short sides of the second minimum rectangular region. The area of ​​each of the two or more fourth pads is larger than the area of ​​one of the four fourth pads other than the two or more fourth pads. The module according to item 9, characterized in that it is a module according to item 9.

[0213] (Section 14) The area of ​​each of the two or more fourth pads is larger than the area of ​​any one of the plurality of third pads. The module according to item 13, characterized in that

[0214] (Section 15) The plurality of fourth pads include first end pads located at the ends of the fourth main surface, The wiring member has a conductor pattern arranged in grooves on its side surface that connect to the third main surface and the fourth main surface, and connected to the first end pad. Of the plurality of second joining members, the joining member in contact with the first end pad is in contact with the conductor pattern. The module according to item 9, characterized in that it is a module according to item 9.

[0215] (Section 16) The first end pad is located at the corner of the third main surface. The module according to item 15, characterized in that

[0216] (Section 17) A second end pad, which is not joined to the first wiring board, is provided at the end of the third main surface of the wiring member. The conductor pattern is connected to the second end pad, The module according to item 15 or 16, characterized in that it is a module according to item 15 or 16.

[0217] (Section 18) The plurality of third pads include second end pads located at the ends of the third main surface, Of the plurality of first joining members, the joining member in contact with the second end pad is in contact with the conductor pattern. The module according to item 15 or 16, characterized in that it is a module according to item 15 or 16.

[0218] (Section 19) The plurality of fourth pads are greater than the number of the plurality of third pads. A module according to any one of claims 9 to 18, characterized in that it is a module according to any one of claims 9 to 18.

[0219] (Section 20) The area of ​​each of the plurality of fourth pads is larger than the area of ​​each of the plurality of third pads. The module according to item 9, characterized in that it is a module according to item 9.

[0220] (Section 21) The invention further comprises a first electronic component mounted on a fifth main surface of the second wiring board, on the side opposite to the second main surface. A module according to any one of claims 1 to 20, characterized in that it is a module according to any one of claims 1 to 20.

[0221] (Section 22) In a first direction perpendicular to the first main surface, a portion of the first electronic component overlaps a portion of the wiring member. The module according to item 21, characterized in that

[0222] (Section 23) The first electronic component has a first side surface and a second side surface that are spaced apart from each other in a second direction intersecting the first direction, The wiring member is positioned between a first virtual plane including the first side surface and a second virtual plane including the second side surface. The module according to item 22, characterized by the features described herein.

[0223] (Section 24) The second circuit board further comprises a second electronic component mounted on the fifth main surface of the second circuit board, The second electronic component is positioned at a distance from the first electronic component in a third direction intersecting a first direction perpendicular to the first main surface. A module according to any one of claims 21 to 23, characterized in that it is a module according to any one of claims 21 to 23.

[0224] (Section 25) In a first direction perpendicular to the first main surface, a portion of the second electronic component overlaps a portion of the wiring member. The module according to item 24, characterized by the features described herein.

[0225] (Section 26) The thickness of the second wiring board in the first direction perpendicular to the first main surface is thinner than the thickness of the first wiring board in the first direction. A module according to any one of claims 1 to 25, characterized in that it is a module according to any one of claims 1 to 25.

[0226] (Section 27) The length of the second wiring board in the third direction intersecting the first direction perpendicular to the first main surface is shorter than the length of the first wiring board in the third direction. A module according to any one of claims 1 to 26, characterized in that it is a module according to any one of claims 1 to 26.

[0227] (Section 28) The third direction is the longitudinal direction of the second wiring board. The module according to item 27, characterized in that

[0228] (Section 29) The device further includes a resin member that joins the second wiring board and the wiring member. A module according to any one of claims 1 to 28, characterized in that it is a module according to any one of claims 1 to 28.

[0229] (Section 30) The total area of ​​the portion of the plurality of second pads that contacts the plurality of second joining members is 7% to 100% larger than the total area of ​​the portion of the plurality of first pads that contacts the plurality of first joining members. A module according to any one of items 1 to 29, characterized in that it is a module according to any one of items 1 to 29.

[0230] (Item 31) Let the Young's modulus of the first wiring board be E1, the thickness of the first wiring board in the first direction perpendicular to the first main surface be H1, and the length of the first wiring board in the third direction intersecting the first direction be W1. When the Young's modulus of the second wiring board is E2, the thickness of the second wiring board in the first direction is H2, and the length of the second wiring board in the third direction is W2. E1×W1×H1 3 >E2×W2×H2 3 Satisfying The module according to any one of Items 1 to 30, characterized in that.

[0231] (Item 32) The first electronic component is a memory device. The module according to any one of Items 21 to 25, characterized in that.

[0232] (Item 33) The second electronic component is a memory device. The module according to Item 24 or 25, characterized in that.

[0233] (Item 34) Further comprising a third electronic component mounted on the first wiring board. The module according to any one of Items 1 to 33, characterized in that.

[0234] (Item 35) The third electronic component is a processing device. The module according to Item 34, characterized in that.

[0235] (Item 36) An exterior and The module according to any one of Items 1 to 35 disposed inside the exterior, comprising. An electronic device characterized in that.

[0236] (Item 37) An exterior and A first module disposed inside the exterior; A second module disposed inside the exterior; A wiring component that electrically connects the first module and the second module, and the first module is the module according to any one of items 1 to 35, the second module has an image sensor, characterized in that it is an electronic device.

Explanation of Signs

[0237] K1... Rigidity, K2... Rigidity, S1... Total area (First total area), S2... Total area (Second total area), S3... Total area (Third total area), S4... Total area (Fourth total area), 11... Wiring member, 13... Pad (First pad), 14... Joining member (First joining member), 23... Pad (Second pad), 24... Joining member (Second joining member), 51... Pad (Third pad), 52... Pad (Fourth pad), 101... Wiring board (First wiring board), 102a... Electronic component (First electronic component), 102b... Electronic component (Second electronic component), 201... Wiring board (Second wiring board), 500... Processing module (Module), 600... Digital camera (Electronic device), 1011... Main surface (First main surface), 2012... Main surface (Second main surface)

Claims

1. Wiring components and First wiring board and The system comprises a second wiring board laminated on the first wiring board via the aforementioned wiring member, Multiple first pads are arranged on the first main surface of the first wiring board, which are joined to the wiring member by multiple first joining members. Multiple second pads are arranged on the second main surface of the second wiring board, which are joined to the wiring member by multiple second joining members. The second wiring board has lower bending rigidity than the first wiring board. The total area of ​​the portions of the plurality of second pads that contact the plurality of second joining members is larger than the total area of ​​the portions of the plurality of first pads that contact the plurality of first joining members. A module characterized by the following features.

2. The plurality of second pads include two or more second pads that do not overlap any of the plurality of first pads in a first direction perpendicular to the first main surface. The module according to feature 1.

3. The area of ​​each of the two or more second pads is larger than the area of ​​one of the multiple second pads other than the two or more second pads, and / or The area of ​​each of the two or more second pads is larger than the area of ​​any one of the plurality of first pads. The module according to feature 2.

4. The plurality of second pads include two or more second pads that are in contact with at least one of the two long sides of the first minimum rectangular region surrounding the plurality of second pads, and that are in contact with either one of the two short sides of the first minimum rectangular region. The area of ​​each of the two or more second pads is larger than the area of ​​one of the multiple second pads other than the two or more second pads, and / or The area of ​​each of the two or more second pads is larger than the area of ​​any one of the plurality of first pads. The module according to feature 1.

5. The number of the aforementioned multiple second pads is greater than the number of the aforementioned multiple first pads. The module according to feature 1.

6. The area of ​​each of the plurality of second pads is larger than the area of ​​each of the plurality of first pads. The module according to feature 1.

7. Multiple third pads are arranged on the third main surface of the wiring member, which are joined to the first wiring board by the multiple first joining members. On the fourth main surface of the wiring member opposite to the third main surface, a plurality of fourth pads are arranged, which are joined to the second wiring board by the plurality of second joining members. The total area of ​​the portions of the plurality of fourth pads that contact the plurality of second joining members is greater than the total area of ​​the portions of the plurality of third pads that contact the plurality of first joining members. The module according to feature 1.

8. The plurality of fourth pads include two or more fourth pads that do not overlap any of the plurality of third pads in a first direction perpendicular to the first main surface. The module according to feature 7.

9. The area of ​​each of the two or more fourth pads is larger than the area of ​​one of the four fourth pads other than the two or more fourth pads, and / or The area of ​​each of the two or more fourth pads is larger than the area of ​​any one of the plurality of third pads. The module according to feature 8.

10. The plurality of fourth pads include two or more fourth pads that are in contact with at least one of the two long sides of the second minimum rectangular region surrounding the plurality of fourth pads, and that are in contact with either one of the two short sides of the second minimum rectangular region. The area of ​​each of the two or more fourth pads is larger than the area of ​​one of the four fourth pads other than the two or more fourth pads, and / or The area of ​​each of the two or more fourth pads is larger than the area of ​​any one of the plurality of third pads. The module according to feature 7.

11. The plurality of fourth pads include first end pads located at the ends of the fourth main surface, The wiring member has a conductor pattern arranged in grooves on its side surface that connect to the third main surface and the fourth main surface, and connected to the first end pad. Of the plurality of second joining members, the joining member in contact with the first end pad is in contact with the conductor pattern. The module according to feature 7.

12. The first end pad is located at the corner of the third main surface. The module according to feature 11.

13. A second end pad, which is not joined to the first wiring board, is provided at the end of the third main surface of the wiring member. The conductor pattern is connected to the second end pad, The module according to feature 11.

14. The plurality of third pads include second end pads located at the ends of the third main surface, Of the plurality of first joining members, the joining member in contact with the second end pad is in contact with the conductor pattern. The module according to feature 11.

15. The plurality of fourth pads are greater than the number of the plurality of third pads. The module according to feature 7.

16. The area of ​​each of the plurality of fourth pads is larger than the area of ​​each of the plurality of third pads. The module according to feature 7.

17. The invention further comprises a first electronic component mounted on a fifth main surface of the second wiring board, on the side opposite to the second main surface. The module according to feature 1.

18. In a first direction perpendicular to the first main surface, a portion of the first electronic component overlaps a portion of the wiring member. The module according to feature 17.

19. The first electronic component has a first side surface and a second side surface that are spaced apart from each other in a second direction intersecting the first direction, The wiring member is positioned between a first virtual plane including the first side surface and a second virtual plane including the second side surface. The module according to feature 18.

20. The second circuit board further comprises a second electronic component mounted on the fifth main surface of the second circuit board, The second electronic component is positioned at a distance from the first electronic component in a third direction intersecting a first direction perpendicular to the first main surface. The module according to feature 17.

21. In a first direction perpendicular to the first main surface, a portion of the second electronic component overlaps a portion of the wiring member. The module according to feature 20.

22. The first wiring board further comprises a third electronic component mounted on it. The module according to feature 20.

23. The first electronic component is a memory device. The module according to feature 17, or The second electronic component is a memory device. The module according to feature 20, The third electronic component is a processing unit. The module according to feature 22.

24. The thickness of the second wiring board in the first direction perpendicular to the first main surface is thinner than the thickness of the first wiring board in the first direction. The module according to any one of claims 1 to 22.

25. The length of the second wiring board in the third direction intersecting the first direction perpendicular to the first main surface is shorter than the length of the first wiring board in the third direction. The module according to any one of claims 1 to 22.

26. The third direction is the longitudinal direction of the second wiring board. The module according to feature 25.

27. The device further includes a resin member that joins the second wiring board and the wiring member. The module according to any one of claims 1 to 22.

28. The total area of ​​the portion of the plurality of second pads that contacts the plurality of second joining members is 7% to 100% larger than the total area of ​​the portion of the plurality of first pads that contacts the plurality of first joining members. The module according to any one of claims 1 to 22.

29. The Young's modulus of the first wiring board is E １ The thickness of the first wiring board in the first direction perpendicular to the first main surface is H １ The length of the first wiring board in the third direction intersecting the first direction is W. １ year, The Young's modulus of the second wiring board is E ２ , the thickness of the second wiring board in the first direction is H ２ The length of the second wiring board in the third direction is W ２ In that case, E １ ×W １ ×H １ ３ >E ２ ×W ２ ×H ２ ３ Satisfying The module according to any one of claims 1 to 22.

30. Exterior and The exterior is disposed inside the module according to any one of claims 1 to 22, An electronic device characterized by the following features.

31. Exterior and A first module is located inside the aforementioned exterior, A second module is located inside the aforementioned exterior, The first module and the second module are electrically connected by wiring components, The first module is the module according to any one of claims 1 to 22, The second module has an image sensor. An electronic device characterized by the following features.

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