Substrate transport apparatus, substrate processing apparatus, and substrate state detection method

Abstract

The present invention provides a substrate transport device, a substrate processing device, and a substrate condition detection method that can detect the inclination of a substrate separately from the thickness of the substrate. [Solution] The substrate transport device 1 comprises a stage 9 on which a carrier C is placed, a mapping sensor 27 having a light-emitting unit 27A and a light-receiving unit 27B, a lifting unit, and a control unit. The control unit moves the light-emitting unit 27A and the light-receiving unit 27B to the lifting unit so that the light-emitting unit 27A and the light-receiving unit 27B pass through the substrate W inside the carrier C. The control unit acquires waveform information of at least one of two peaks in the signal waveform output from the mapping sensor 27 that are in contact with both ends of a trough where the light from the light-emitting unit 27A is blocked by the substrate W and the signal value becomes smaller. Based on the waveform information of the peaks, the control unit detects the tilt of the substrate W around an axis extending in the loading and unloading direction.

Description

Technical Field

[0001] The present invention relates to a substrate transfer device, a substrate processing device for loading and unloading substrates, and a substrate state detection method. Substrates include, for example, semiconductor substrates, substrates for FPD (Flat Panel Display), glass substrates for photomasks, substrates for optical discs, substrates for magnetic discs, ceramic substrates, substrates for solar cells, and the like. Examples of FPDs include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like.

Background Art

[0002] Conventional substrate processing devices include a load port for loading and unloading substrates into and out of the substrate processing device (see, for example, Patent Document 1). The load port includes a stage for placing a carrier for storing substrates and a mapping unit. The mapping unit includes a pair of sensors (a light projecting unit and a light receiving unit). The mapping unit lowers the pair of sensors while forming an optical axis by the pair of sensors. Based on the output from the light receiving unit, the presence or absence of a substrate, the presence or absence of abnormal substrate thickness, and the height position of the substrate, which are mapping data, are acquired.

[0003] Patent Document 2 discloses a substrate processing device including a substrate detection unit and a determination unit. The substrate detection unit includes a light projector and a light receiver. The determination unit determines the thickness of the substrate in the vertical direction and also determines the center position of this thickness as the actual accommodation position of the substrate. Further, the determination unit determines whether the posture (tilt of the substrate) of the detected substrate is normal or abnormal based on the thickness of the substrate.

[0004] Patent Document 3 discloses that when the thickness of a substrate is greater than or equal to a predetermined threshold value, it is determined that the storage state of the substrate is inclined so that the substrate is stored across two upper and lower slots.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] However, conventional methods have the following problems. Conventional methods acquire substrate thickness information during the period when the optical axis of a descending sensor pair is obstructed by the substrate. For example, if a substrate is stored at a large tilt across two slots, the substrate thickness information obtained by the sensor pair will show an abnormal value. Therefore, conventional methods detected that the substrate storage condition was abnormal (the substrate was tilted significantly) when the substrate thickness was above a predetermined threshold. However, conventional substrate thickness information cannot accurately distinguish between the substrate thickness and the substrate tilt in principle. For example, even if a substrate is stored in one slot within the carrier, the substrate thickness information will increase if the substrate is slightly tilted due to poor placement in the slot. It is not possible to distinguish whether this increase in substrate thickness information is due to the substrate thickness or the substrate tilt.

[0007] The present invention has been made in view of these circumstances, and aims to provide a substrate transport device, a substrate processing device, and a substrate state detection method that can detect the inclination of a substrate separately from the thickness of the substrate. [Means for solving the problem]

[0008] As a result of diligent research to solve the above problem, the inventors have found that, in the signal waveform from the mapping sensor, when the substrate is horizontal, the signal waveforms of the two peaks at both ends of the valley where the light from the light-emitting part is blocked by the substrate and the signal value decreases become larger, and when the substrate is tilted, the signal waveforms of the two peaks become smaller.

[0009] Based on these findings, the present invention has the following configuration. That is, the substrate transport device according to the present invention is a substrate transport device for loading and unloading substrates, comprising: a stage on which a carrier for storing the substrate is placed; a mapping sensor having a light-emitting unit and a light-receiving unit arranged in a horizontal direction perpendicular to the loading and unloading direction for loading and unloading the substrate from the carrier through an opening in the carrier, wherein the light-emitting unit and the light-receiving unit are arranged on the opening side so as to face each other via the peripheral edge of the substrate in a plan view; a lifting unit for moving the light-emitting unit and the light-receiving unit in the vertical direction; and a control unit, wherein the control unit controls the light-emitting unit. The device is characterized in that, when the light-emitting unit is emitting light and the light-receiving unit is in a state where it can receive the light, the light-emitting unit and the light-receiving unit are moved in the lifting unit so that they pass through the substrate in the carrier, waveform information of at least one of the two peaks in the signal waveform output from the mapping sensor that are in contact with both ends of the trough where the light from the light-emitting unit is blocked by the substrate and the signal value becomes smaller, is obtained, and the tilt of the substrate occurring around the axis extending in the insertion / removal direction is detected based on the waveform information of the peak.

[0010] According to the substrate transport apparatus of the present invention, the control unit acquires waveform information of at least one of two peaks in the signal waveform output from the mapping sensor, which is adjacent to both ends of a valley where the light from the light-emitting unit is blocked by the substrate and the signal value becomes smaller. Based on the waveform information of that peak, the control unit detects the tilt of the substrate around the axis extending in the loading and unloading direction. This makes it possible to detect the tilt of the substrate separately from the thickness of the substrate.

[0011] Furthermore, in the above-described substrate transport device, it is preferable to further include a transport robot equipped with a hand for holding the substrate, which uses the hand to remove the substrate from the carrier placed on the stage. This allows the transport robot to be operated while taking into account the tilt of the substrate that occurs around the axis extending in the loading and unloading direction.

[0012] Furthermore, in the above-described substrate transport device, it is preferable that the control unit acquires the amount of inclination of the substrate around the axis extending in the loading / unloading direction, which corresponds to the signal value at the peak of the peak. This makes it possible to acquire the amount of inclination of the substrate corresponding to the signal value at the peak of the peak.

[0013] Furthermore, in the above-described substrate transport device, the carrier has a first slot for storing the first substrate, which is the substrate, and a second slot for storing the second substrate, which is located one slot below the first slot. The control unit calculates the clearance reduction amount, which is the vertical displacement amount relative to when the first substrate is in a horizontal position, from the tilt amount of the first substrate, and calculates the total clearance between the first substrate and the hand, and between the second substrate and the hand, assuming that the hand is positioned between the first substrate and the second substrate, using the following formula. The clearance = (height position of the lower surface of the first substrate - height position of the upper surface of the second substrate) - thickness of the hand - amount of clearance reduction Preferably, the control unit controls the transport robot to remove the first substrate from the carrier when the clearance is greater than or equal to a preset reference value, and controls the transport robot not to remove the first substrate from the carrier when the clearance is less than a preset reference value.

[0014] The amount of clearance reduction can be calculated from the tilt of the first substrate, and the clearance can be calculated taking this reduction into account. Even when the first substrate is tilted, if the calculated clearance is greater than or equal to the standard value, the transport robot can remove the first substrate from the carrier. Conversely, if the calculated clearance is less than the standard value, the transport robot will not remove the first substrate from the carrier. For example, this can prevent the first substrate from being damaged by the transport robot's hand coming into contact with it.

[0015] Furthermore, in the above-described substrate transport device, it is preferable to further include a notification unit, and the control unit shall notify the notification unit when the clearance is smaller than a preset reference value. This allows the operator to know that the clearance is smaller than the reference value due to the tilting of the substrate. The operator can also know, for example, that there is a possibility of the substrate being damaged.

[0016] Furthermore, in the above-described substrate transport device, it is preferable that the control unit, when it detects that the substrate is tilted beyond a preset threshold, controls the transport robot to prevent the substrate from being removed from the carrier. This prevents the transport robot's hand from contacting the substrate and damaging it.

[0017] Furthermore, in the above-described substrate transport device, it is preferable to further include a height sensor for measuring the height position of the light-emitting unit and the light-receiving unit, and for the control unit to obtain the thickness of the substrate by measuring the distance corresponding to the width of the trough of the signal waveform using the height sensor. This makes it possible to obtain the thickness of the substrate.

[0018] Furthermore, in the substrate transport device described above, it is preferable to further include a height sensor for measuring the height position of the light-emitting unit and the light-receiving unit, and for the control unit to obtain the height position of the substrate by measuring the height position corresponding to the minimum value of the trough in the signal waveform using the height sensor.

[0019] For example, suppose that the height of the substrate is obtained by measuring two height positions on the top and bottom surfaces of the substrate, and then calculating the center position of the two height positions. In this case, obtaining the height of the substrate requires two measurement operations for the two heights and a calculation operation for the center position. According to the present invention, since the height position corresponding to the minimum value of the valley is measured by the height sensor, the height of the substrate can be obtained in a single measurement operation.

[0020] Furthermore, in the substrate transport apparatus described above, when the minimum value of the valley is located between the first reference point of the first pulse and the second reference point of the second pulse, the control unit obtains the difference between the pulse time corresponding to the first reference point of the first pulse and the mapping time corresponding to the minimum value of the valley, and further obtains the internal distance from the first reference point to the minimum value of the valley by integrating the difference value with the moving speed of the light-emitting unit and the light-receiving unit, and preferably uses the internal distance when obtaining the height position of the substrate. This makes it possible to measure distance and position with a higher resolution than the resolution of the height sensor.

[0021] Furthermore, the substrate processing apparatus according to the present invention is characterized by comprising the above-described substrate transport device and a substrate processing unit that processes the substrate transported by the transport robot.

[0022] Furthermore, the substrate state detection method according to the present invention is a substrate state detection method in a substrate transport device for loading and unloading substrates, wherein the substrate transport device comprises a stage on which a carrier for storing the substrate is placed, a light-emitting unit and a light-receiving unit arranged in a horizontal direction perpendicular to the loading and unloading direction for loading and unloading the substrate from the carrier through an opening in the carrier, a mapping sensor having the light-emitting unit and the light-receiving unit arranged on the opening side so as to face each other via the peripheral edge of the substrate in a plan view, and a lifting unit for moving the light-emitting unit and the light-receiving unit in the vertical direction, wherein the substrate state detection method is a substrate state detection method in which the light-emitting unit emits light The invention is characterized by comprising: a mapping step of moving the light-emitting unit and the light-receiving unit to the lifting unit so that the light-emitting unit and the light-receiving unit pass through the substrate in the carrier when the light is emitted and the light-receiving unit is in a state where the light is able to receive the light; a waveform information acquisition step of acquiring waveform information of at least one of two peaks in the signal waveform output from the mapping sensor that is in contact with both ends of a trough where the light from the light-emitting unit is blocked by the substrate and the signal value becomes smaller; and a detection step of detecting the tilt of the substrate around an axis extending in the insertion / removal direction based on the waveform information of the peaks. [Effect of the Invention]

[0023] According to the substrate transfer device, substrate processing device, and substrate state detection method according to the present invention, the inclination of the substrate can be detected separately from the thickness of the substrate. [Brief Description of the Drawings]

[0024] [Figure 1] It is a plan view showing a substrate processing device according to an embodiment. [Figure 2] It is a cross-sectional view of a carrier. [Figure 3] It is a front view of a carrier. [Figure 4] It is a longitudinal sectional view showing a substrate processing device according to an embodiment. [Figure 5] It is a side view showing a lid attaching / detaching part. [Figure 6] It is a plan view showing a mapping sensor located at a standby position. [Figure 7] It is a plan view showing a mapping sensor located at a detection position. [Figure 8] It is a block diagram showing a control system of a substrate processing device. [Figure 9] It is a flowchart for explaining the operation of a substrate processing device. [Figure 10] It is a side view showing the state where the light irradiated from a light projecting part travels toward a light receiving part. [Figure 11] It is a longitudinal sectional view showing the operation of mapping. [Figure 12] (a) is a diagram showing a signal waveform output from a mapping sensor, and (b) is a diagram showing pulses output from a rotary encoder. [Figure 13] It is a diagram for explaining a method of measuring the thickness of a substrate. [Figure 14] (a) is a diagram showing the state where the light reflected from the upper surface of a substrate enters a light receiving part immediately before a light projecting part and a light receiving part pass through the substrate, and (b) is a diagram showing the first peak immediately before the valley part in the case of (a). [Figure 15] (a) is a diagram showing how light reflected from the bottom surface of the substrate enters the light-receiving part immediately after the light-emitting and light-receiving parts pass through the substrate, and (b) is a diagram showing the second peak immediately after the trough in (a). [Figure 16] (a) is a diagram showing the state in which light reflected from the upper surface of the substrate does not enter the light-receiving part just before the light-emitting and light-receiving parts pass through the substrate, and (b) is a diagram showing the first peak just before the trough in (a). [Figure 17] (a) is a diagram showing the state immediately after the light-emitting and light-receiving parts pass through the substrate, where light reflected from the underside of the substrate does not enter the light-receiving part, and (b) is a diagram showing the second peak immediately after the trough in (a). [Figure 18] This is an experimental result showing the signal waveform when the tilt amount of the circuit board is changed. [Figure 19] This diagram illustrates a method for obtaining the tilt amount of the circuit board based on the signal value at the peak of the mountain section. [Figure 20] This is a side view illustrating the basic method for calculating clearance. [Figure 21] (a) is a front view illustrating the method for calculating the clearance reduction due to the tilt of the substrate, and (b) is a diagram showing the details of the method for calculating the clearance reduction. [Figure 22] This diagram illustrates the method for calculating internal distance in a modified example. [Figure 23] This is a side view showing the sensor movement part related to another modified example. [Figure 24] This is a side view showing the sensor movement part related to another modified example. [Modes for carrying out the invention]

[0025] Examples of the present invention will be described below. [Examples]

[0026] The embodiments of the present invention will be described below with reference to the drawings. Figure 1 is a plan view showing a substrate processing apparatus 1 according to an embodiment. Figure 2 is a cross-sectional view of the carrier C, and Figure 3 is a front view of the carrier C. Figure 4 is a longitudinal cross-sectional view showing the substrate processing apparatus 1 according to an embodiment. Figure 5 is a side view showing the lid attachment / detachment section 11.

[0027] <1. Configuration of substrate processing equipment> Refer to Figure 1. The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 comprises an indexer block 2 and a processing block 3.

[0028] The horizontal direction in which the indexer block 2 and processing block 3 are positioned is called the front-to-back direction (X direction). The direction from processing block 3 towards indexer block 2 is forward, and the opposite direction is backward. The horizontal direction perpendicular to the front-to-back direction is called the width direction (Y direction). The direction perpendicular to both the front-to-back direction and the width direction is called the up-and-down direction (Z direction).

[0029] <1-1. Indexer Block> The indexer block 2 comprises at least one (e.g., two or four) load ports (openers) 5, a housing 7, and a transport robot IR. The load ports 5 are used for loading and unloading substrates W. Each load port 5 is equipped with a stage 9 and a lid attachment / detachment section 11 (see Figure 4). A carrier C is placed on the stage 9.

[0030] The carrier C houses multiple (e.g., 25) substrates W in a horizontal orientation, aligned vertically (Z-direction) at a predetermined pitch (e.g., 10 mm pitch) according to the design. The substrates W are formed, for example, in a disc shape. A Front Opening Unify Pod (FOUP) is used as the carrier C, but is not limited to this. For example, the carrier may be a cassette (open cassette) without a lid portion 17 (described later) that closes the opening 14 (described later).

[0031] Refer to Figures 2 and 3. The carrier C comprises a container (carrier body) 13, an opening 14, multiple pairs (e.g., 25 pairs) of shelves 15, 16, and a lid 17. The container 13 houses multiple substrates W. The opening 14 is provided on the front of the container 13. Each of the multiple substrates W is removed from and placed back into the carrier C through the opening 14. When the carrier C is being transported, the lid 17 that closes the opening 14 is attached to the container 13. When removing the substrates W from the carrier C, the lid 17 is removed from the container 13.

[0032] Multiple pairs of shelves 15, 16 are provided vertically within the container 13. In the vertical direction, the multiple pairs of shelves 15, 16 are arranged at a predetermined pitch (for example, a 10 mm pitch) according to the design. One substrate W is placed horizontally on each pair of shelves 15, 16. As shown in Figure 3, for example, 25 shelves 15 are provided on the left inner wall 13A of the container 13, and 25 shelves 16 are provided on the right inner wall 13B of the container 13.

[0033] Furthermore, within the carrier C, for example, the space between two pairs of vertically adjacent shelf sections 15 and 16 that accommodates one circuit board W is called a slot. Therefore, the carrier C is equipped with multiple (e.g., 25) slots SL1 to SL25, each accommodating multiple (e.g., 25) circuit boards W. The 25 slots SL1 to SL25 are arranged in order from bottom to top. Slot SL1 is the lowest slot, and slot SL25 is the highest slot.

[0034] Refer to Figures 1, 4, and 5. The two load ports 5 are arranged in the width direction (Y direction). The two load ports 5 are located at the front of the indexer block 2. Specifically, the two load ports 5 are located on the outside of the housing 7, on the front wall portion 7A of the housing 7. The wall portion 7A is provided with a passage opening 7B corresponding to the opening 14 of the carrier C placed on the stage 9 of each load port 5. For example, the transport robot IR removes the substrate W from the carrier C placed on the stage 9 through the passage opening 7B.

[0035] The lid attachment / detachment section 11 of the load port 5 includes a shutter section 19, a shutter forward / backward section 21, a shutter lifting / lowering section 23, and a rotary encoder (height sensor) 25. The shutter section 19 opens and closes the corresponding passage opening 7B. The shutter section 19 can also hold the lid section 17 of the carrier C. Therefore, the shutter section 19 can remove the lid section 17 from the carrier C or attach the lid section 17 to the carrier C.

[0036] The shutter advancement / retraction mechanism 21 moves the shutter unit 19 forward and backward in the front-rear direction (X direction). The shutter advancement / retraction mechanism 21 comprises, for example, an electric motor 21A, a screw shaft 21B, a slider 21C, and a guide rail 21D. Alternatively, the shutter advancement / retraction mechanism 21 may be equipped with an air cylinder instead of the electric motor 21A and screw shaft 21B. The slider 21C supports the shutter unit 19.

[0037] The shutter lifting unit 23 moves the shutter unit 19 and the mapping sensor 27 (described later) in the vertical direction (Z direction). The shutter lifting unit 23 includes, for example, an electric motor 23A, two pulleys 23B and 23C, a timing belt 23D, a slider 23E, and a guide rail 23F.

[0038] Two pulleys 23B and 23C are arranged vertically. The two pulleys 23B and 23C are rotatably supported around two horizontal axes AX1 and AX2, respectively. The two horizontal axes AX1 and AX2 each extend, for example, in the width direction (Y direction). A ring-shaped timing belt 23D is wrapped around the two pulleys 23B and 23C. A slider 23E is attached (fixed) to the timing belt 23D. A guide rail 23F is arranged to extend vertically. The slider 23E is guided vertically by the guide rail 23F. The slider 23E supports the shutter advance / return section 21.

[0039] The rotating output shaft of the electric motor 23A is connected, for example, to the lower pulley 23B. The electric motor 23A rotates the pulley 23B around the horizontal axis AX1. When the lower pulley 23B is rotated, the timing belt 23D rotates the upper pulley 23C around the horizontal axis AX2. When the electric motor 23A rotates the pulley 23B in the forward direction, the slider 23E, the shutter advance / retraction section 21, the shutter section 19, and the light-emitting section 27A (described later) and light-receiving section 27B (described later) rise along with the movement of the timing belt 23D. Conversely, when the electric motor 23A rotates the pulley 23B in the reverse direction, the slider 23E and the other components descend along with the movement of the timing belt 23D.

[0040] The rotary encoder 25 measures the height positions of the shutter unit 19, the light-emitting unit 27A, and the light-receiving unit 27B. The rotary encoder 25 is connected, for example, to the upper pulley 23C. The rotary encoder 25 detects the amount of mechanical displacement of the rotation of the pulley 23C and outputs it as a pulse (pulse signal). By counting the number of pulses from the rotary encoder 25, the vertical movement of the shutter unit 19, the light-emitting unit 27A, and the light-receiving unit 27B is obtained, as well as the height positions of the shutter unit 19, the light-emitting unit 27A, and the light-receiving unit 27B from their reference positions.

[0041] The rotary output shaft of the electric motor 23A may be connected to the upper pulley 23C instead of the lower pulley 23B. The rotary encoder 25 may also be connected to the lower pulley 23B instead of the upper pulley 23C to detect the mechanical displacement of the lower pulley 23B. Furthermore, if the rotary output shaft of the electric motor 23A is connected to the lower pulley 23B, the rotary encoder 25 may also be connected to the lower pulley 23B. Additionally, a linear encoder may be provided as a height sensor instead of the rotary encoder 25.

[0042] Refer to Figures 6 and 7. The lid attachment / detachment unit 11 further includes a mapping sensor 27 and a sensor movement unit 29. The mapping sensor 27 is used for mapping (mapping operation) to measure (detect) the state of the substrate W (e.g., height position, thickness, and inclination of the substrate W). The mapping sensor 27 includes a light-emitting unit 27A and a light-receiving unit 27B.

[0043] As the mapping sensor 27, for example, a transmissive fiber sensor is used. Therefore, the mapping sensor 27 further comprises a light-emitting element (e.g., an LED: light-emitting diode), a light-receiving element, a first optical fiber, and a second optical fiber. The first optical fiber sends light from the light-emitting element to the light-emitting unit 27A. The second optical fiber sends the light received by the light-receiving unit 27B to the light-receiving element. The light-receiving element converts the received light into an electrical signal. The mapping sensor 27 outputs a signal corresponding to the amount of light (received intensity) of the light received by the light-receiving unit 27B.

[0044] The light-emitting unit 27A and the light-receiving unit 27B are provided on the upper surface of the shutter unit 19, for example, via a sensor movement unit 29. The sensor movement unit 29 includes a sensor support member 31. The sensor support member 31 is formed, for example, in a C-shape in plan view.

[0045] The light-emitting unit 27A and the light-receiving unit 27B are arranged in the width direction (Y direction). Specifically, the light-emitting unit 27A and the light-receiving unit 27B are arranged in the horizontal direction (Y direction) perpendicular to the insertion / removal direction TD in which the substrate W is inserted into and removed from the carrier C through the opening 14 of the carrier C. The light-emitting unit 27A is provided at the first end of the C-shaped sensor support member 31, and the light-receiving unit 27B is provided at the second end of the sensor support member 31. The light-emitting unit 27A is positioned at the same height as the light-receiving unit 27B. The light-emitting unit 27A and the light-receiving unit 27B face each other. If there are no obstacles blocking the light, the light emitted from the light-emitting unit 27A is received by the light-receiving unit 27B. The optical axis LT connecting the light-emitting unit 27A and the light-receiving unit 27B extends in the width direction (Y direction).

[0046] The sensor moving unit 29 further includes, for example, an electric motor, a screw shaft, and a guide rail. Alternatively, the sensor moving unit 29 may be equipped with an air cylinder. The sensor moving unit 29 moves the light-emitting unit 27A, the light-receiving unit 27B, and the sensor support member 31 linearly in the front-rear direction (X direction). Normally, the light-emitting unit 27A and the light-receiving unit 27B are in standby position (see Figure 6). When mapping is performed, the sensor moving unit 29 moves the light-emitting unit 27A and the light-receiving unit 27B into the carrier C placed on the stage 9 (see Figure 7). When the light-emitting unit 27A and the light-receiving unit 27B are in the detection position, they are positioned on the opening 14 side so that, in a plan view, they face each other across the periphery of the substrate W. That is, the optical axis LT intersects the periphery of the substrate W in a plan view.

[0047] Note that the load port 5, or the load port 5 and the transport robot IR, corresponds to the substrate transport device of the present invention. The shutter lifting unit 23 corresponds to the lifting unit of the present invention.

[0048] Refer to Figures 1 and 4. Next, the transport robot IR will be described. The transport robot IR is located inside the housing 7. The transport robot IR transports the substrate W between the two carriers C of the two load ports 5 and the substrate mounting section PS (described later). For example, a horizontal articulated robot is used as the transport robot IR. The transport robot IR is equipped with a hand 41, an articulated arm 43, a lifting platform 45, and a height sensor 47.

[0049] The hand 41 holds the substrate W in a horizontal position. The transport robot IR uses the hand 41 to remove the substrate W from the carrier C placed on the stage 9 and to place the substrate W back into the carrier C.

[0050] The hand 41 is connected to the tip of the articulated arm 43. The base of the articulated arm 43 is connected to a lifting platform 45 so as to be rotatable around a vertical axis. The articulated arm 43 moves the hand 41 horizontally (XY direction). The articulated arm 43 can also change the orientation of the hand 41. The lifting platform 45 moves the hand 41 and the articulated arm 43 vertically (Z direction). The articulated arm 43 and the lifting platform 45 are each equipped with electric motors. A height sensor 47 measures the height position of the hand 41. The height sensor 47 is equipped with, for example, a rotary encoder or a linear encoder.

[0051] <1-2. Processing Block> Refer to Figure 1. Processing block 3 comprises at least one processing unit 51, a center robot CR, and a substrate mounting section (shelf) PS. The substrate mounting section PS is located between the transport robot IR and the center robot CR. The substrate mounting section PS can hold one or more substrates W.

[0052] The processing unit 51 performs a pre-set process on the substrate W. The processing unit 51 performs at least one of the following processes: coating a processing solution such as a resist, developing, washing, and polishing (grinding). For example, the processing unit 51 includes, for example, a holding and rotating unit 53 and a nozzle 55. The holding and rotating unit 53 includes a spin chuck that holds one substrate W in a horizontal position and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The nozzle 55 discharges the processing solution onto the upper surface of the substrate W held by the holding and rotating unit 53.

[0053] Furthermore, if the processing unit 51 performs a cleaning process, it may be equipped with a brush. Also, if the processing unit 51 performs a polishing (grinding) process, it may be equipped with a polishing tool. In addition, the processing unit 51 may perform a dry etching process, an ashing process, or a film formation process.

[0054] The center robot CR is configured similarly to the transport robot IR. Briefly, the center robot CR is equipped with a hand 61 that holds the substrate W in a horizontal position. The center robot CR moves the hand 61 that holds the substrate W in the horizontal direction (XY direction) and the vertical direction (Z direction). The center robot CR also changes the orientation of the hand 61 around the vertical axis. The center robot CR transports the substrate W between at least one processing unit 51 and the substrate mounting section PS. Note that at least one of the center robot CR and the transport robot IR may have a reciprocating mechanism having, for example, a screw shaft and a guide rail instead of a multi-joint arm. This reciprocating mechanism moves the hand 61 forward and backward.

[0055] <1-3. Control System for Substrate Processing Equipment> Refer to Figure 8. The substrate processing apparatus 1 comprises a control unit 71, a storage unit (storage medium) 73, and a notification unit 75. The control unit 71 controls each component of the substrate processing apparatus 1. The control unit 71 comprises one or more processors, such as a central processing unit (CPU). The storage unit 73 comprises at least one of the following: ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The storage unit 73 stores computer programs necessary to control each component of the substrate processing apparatus 1. The storage unit 73 also stores various operations (for example, steps S01 to S08 described later). The notification unit 75 comprises at least one of the following: a buzzer, a speaker, a lamp (light), a display such as a liquid crystal.

[0056] <2. Operation of the substrate processing device> The operation of the substrate processing apparatus 1 will be explained with reference to the flowchart in Figure 9. The carrier C has 25 slots SL1 to SL25 and is assumed to house 25 substrates W.

[0057] [Step S01] Placing the carrier onto the stage Carrier C is transported to one of the two load ports 5 shown in Figure 1, on stage 9. When carrier C is placed on stage 9, a sensor (not shown) detects that carrier C has been placed on stage 9 and notifies the control unit 71 of this.

[0058] Subsequently, the shutter portion 19 of the lid attachment / detachment portion 11 holds the lid portion 17 of the carrier C. Then, the shutter advance / retract portion 21 retracts the shutter portion 19 that is holding the lid portion 17. As a result, the lid portion 17 is removed from the carrier C and the passage opening 7B is opened. Then, the shutter lifting portion 23 lowers the shutter portion 19 and the light-emitting portion 27A and light-receiving portion 27B slightly in order to allow the light-emitting portion 27A and light-receiving portion 27B to enter the carrier C.

[0059] [Step S02] Mapping As shown in Figure 6, the light-emitting unit 27A and the light-receiving unit 27B are in a standby position. The sensor moving unit 29 moves the light-emitting unit 27A and the light-receiving unit 27B forward. As a result, as shown in Figure 7, the light-emitting unit 27A and the light-receiving unit 27B are moved to the detection position. At this time, the light-emitting unit 27A and the light-receiving unit 27B are positioned on the opening 14 side so that they face each other across the periphery of the substrate W in a plan view.

[0060] Subsequently, the mapping sensor 27 is activated. This activates the light-emitting unit 27A to emit light and the light-receiving unit 27B to receive light. The light emitted from the light-emitting unit 27A spreads out towards the light-receiving unit 27B, for example, in a conical shape, as shown in Figure 10. Alternatively, the light emitted from the light-emitting unit 27A may spread out towards the light-receiving unit 27B, for example, in a fan shape, at least in the vertical direction. The light emitted from the light-emitting unit 27A is received by the light-receiving unit 27B. As a result, the mapping sensor 27 outputs a signal corresponding to the amount of light received by the light-receiving unit 27B.

[0061] For example, if the light emitted from the light-emitting unit 27A is not blocked by an obstacle including the substrate W, the light-receiving unit 27B receives a certain amount of light, and the mapping sensor 27 outputs a signal value S1 of a certain magnitude. This signal value S1 will be called the "signal value S1 when light is not blocked". In contrast, if the light from the light-emitting unit 27A is blocked by the substrate W, the amount of light received by the light-receiving unit 27B decreases. Therefore, the mapping sensor 27 outputs a signal with a value smaller than the signal value S1.

[0062] Subsequently, as shown in Figure 11, when the mapping sensor 27 is operating, the shutter lifting unit 23 lowers the light-emitting unit 27A and the light-receiving unit 27B so that they pass through the 25 substrates W in the carrier C. As a result, the mapping sensor 27 outputs the signal waveform shown in Figure 12(a). The rotary encoder 25 also outputs pulses (pulse signals) corresponding to the amount of movement of the light-emitting unit 27A and the light-receiving unit 27B, as shown in Figure 12(b). The signal waveform output from the mapping sensor 27 and the pulses output from the rotary encoder 25 are sent to the control unit 71.

[0063] In Figure 12(a), the horizontal axis represents time, and the vertical axis represents signal intensity (voltage (mV)). In Figure 12(b), the horizontal axis represents time, and the vertical axis represents pulse ON (1) and OFF (0). After mapping, the sensor movement unit 29 moves the light-emitting unit 27A and the light-receiving unit 27B from the detection position (see Figure 7) to the standby position (see Figure 6). Subsequently, the shutter lifting unit 23 lowers the shutter unit 19 to a position that does not obstruct the transport of the substrate W by the transport robot IR, as shown by the solid line in Figure 4.

[0064] [Step S03] Obtain the height, thickness, and inclination of the substrate. The control unit 71 acquires (detects) the state of the substrate W within the carrier C (e.g., the height, thickness, and tilt of the substrate W) based on the signal waveform from the mapping sensor 27 and the pulse from the rotary encoder 25. The order in which the height, thickness, and tilt of the substrate W are acquired is not limited. Furthermore, the thickness of the substrate W may include the warp of the substrate W.

[0065] (1) First, the operation of acquiring the height position of the substrate W will be explained. The signal waveform output from the mapping sensor 27 contains 25 valleys VL1 to VL25 corresponding to the 25 substrates W. Each of the valleys VL1 to VL25 is a part in which the light from the light-emitting unit 27A is blocked by the corresponding substrate W, and the signal value becomes smaller. Figure 12(a) shows two valleys VL1 and VL2 corresponding to the two substrates W1 and W2 shown in Figure 11.

[0066] When the light-emitting unit 27A and the light-receiving unit 27B pass through the center position in the thickness direction of the substrate W, the signal output from the mapping sensor 27 has the property of becoming a minimum value. Therefore, the control unit 71 obtains the height position HT1 of the substrate W by measuring the height position corresponding to the minimum value MN1 of the signal in the valley VL1, for example, in the signal waveform from the mapping sensor 27 using the rotary encoder 25.

[0067] For example, when the starting height position HTS of the mapping is used as a reference (see Figure 11), the control unit 71 counts the number of pulses from the starting height position HTS to obtain the downward movement amount MV1 (= movement amount per pulse × number of pulses) from the starting height position HTS to the signal minimum value MN1. The control unit 71 can also obtain the height position HT1 of the substrate W1 corresponding to the signal minimum value MN1 of the valley VL1 from the starting height position HTS and the movement amount MV1.

[0068] Furthermore, for example, in the case of valley VL2, the height position HT2 of substrate W2 corresponding to the signal minimum value MN2 is obtained. By counting the number of pulses between the signal minimum value MN1 of valley VL1 and the signal minimum value MN2 of the next valley VL2, the amount of movement (distance) MV2 between two adjacent substrates W1 and W2 is obtained. Similarly, for the remaining 23 valleys VL3 to VL25, the height positions HT3 to HT25 of the 23 substrates W corresponding to the signal minimum values ​​MN3 to MN25 are obtained.

[0069] (2) Next, the operation for obtaining the thickness of the substrate W will be described. For example, the thickness TK1 of the substrate W1 shown in Figure 11 will be obtained. The control unit 71 obtains the thickness TK1 of the substrate W1 by measuring the distance corresponding to the width of the valley VL1 of the signal waveform using the rotary encoder 25.

[0070] Refer to Figure 13. When the light-emitting unit 27A and the light-receiving unit 27B pass through the interface (upper and lower surfaces) of the substrate W, the signal output from the mapping sensor 27 has the property of being approximately half the depth from the signal value S1 when light is not blocked to the minimum signal value. Therefore, the control unit 71 obtains the thickness TK1 of the substrate W1 by measuring the distance corresponding to the section in the trough VL1 of the signal waveform that is approximately half or less of the depth DP1 from the signal value S1 when light is not blocked to the minimum signal value MN1 using the rotary encoder 25.

[0071] Let me explain in detail. The control unit 71 determines that when the signal value of the output signal from the mapping sensor 27 is below the threshold SK (or less than the threshold SK), it is approximately half the depth DP of each valley VL1 to VL25. This threshold SK is set in advance through experimentation. The control unit 71 obtains the thickness TK1 of the substrate W1 (= amount of movement per pulse × number of pulses) by counting the number of pulses in the section where the depth is approximately half or less. In other words, the control unit 71 measures the width in the signal waveform where, for example, the signal value of valley VL1 is below the threshold SK using the rotary encoder 25.

[0072] Furthermore, the 24 thicknesses TK2 to TK25 of the remaining 24 substrates W are obtained in the same way as thickness TK1. In Figure 13, the symbol TT corresponds to the height position on the top surface of substrate W, and the symbol TB corresponds to the height position on the bottom surface of substrate W.

[0073] (3) Next, the operation for acquiring the tilt of the substrate W will be explained. The tilt of the substrate W is the tilt (amount of tilt) around the axis extending in the insertion / removal direction TD as shown in Figures 6 and 7. In other words, the tilt of the substrate W is the left-right tilt when the carrier C is viewed from the side of the opening 14. For example, the amount of tilt KA1 of the substrate W1 shown in Figure 11 will be acquired.

[0074] As will be explained below, a correlation has been confirmed between the tilt amount of the substrate W and the signal value (received light intensity). See Figure 14(a). Just before the light-emitting unit 27A and the light-receiving unit 27B pass through the horizontal substrate W1 housed in the carrier C, a portion of the light emitted from the light-emitting unit 27A is reflected from the upper surface of the substrate W, and this reflected light is incident on the light-receiving unit 27B. As a result, the signal value from the mapping sensor 27 becomes larger.

[0075] Refer to Figure 15(a). Similarly, immediately after the light-emitting unit 27A and the light-receiving unit 27B pass through the horizontal substrate W1, a portion of the light emitted from the light-emitting unit 27A is reflected from the underside of the substrate W, and this reflected light is incident on the light-receiving unit 27B. As a result, the signal value from the mapping sensor 27 becomes larger.

[0076] Therefore, as shown in Figures 14(b) and 15(b), the signal waveform output from the mapping sensor 27 has two peaks MU1 and MU2. The two peaks MU1 and MU2 are adjacent to both ends of the valley VL1. Peak MU1 is adjacent to the valley VL1, for example, in time ahead of the valley VL1. Peak MU2 is adjacent to the valley VL1 in time behind the valley VL1. That is, peaks MU1, VL1, and MU2 are consecutive in this order.

[0077] Refer to Figures 16(a) and 17(a). When the substrate W1 is tilted, reflected light reflected from the top and bottom surfaces of the substrate W1 becomes less likely to enter the circuit. As a result, as shown in Figures 16(b) and 17(b), the signal values ​​(maximum values) at the peaks of the two peaks MU1 and MU2 become smaller compared to Figures 14(b) and 15(b).

[0078] Figure 18 shows experimental results illustrating the signal waveforms when the tilt of the substrate W is changed. Here, the tilt of the substrate W under condition 1 is 0.27 degrees, the tilt of the substrate W under condition 2 is 0.43 degrees, and the tilt of the substrate W under condition 3 is 0.57 degrees. The experimental results shown in Figure 18 indicate that when the tilt of the substrate W (absolute value) is small within the carrier C, the signal values ​​(maximum values) at the peaks of the two peaks MU1 and MU2 become larger. Conversely, when the tilt of the substrate W (absolute value) is large, the signal values ​​(maximum values) at the peaks of the two peaks MU1 and MU2 become smaller.

[0079] Therefore, the control unit 71 uses this property to acquire the tilt amount KA1 of the substrate W1. First, the control unit 71 acquires the signal value of, for example, the peak of peak MU1, one of the two peaks MU1 and MU2 that are adjacent to both ends of the valley VL1 where the light from the light-emitting unit 27A is blocked by the substrate W1 and the signal value becomes smaller, in the signal waveform output from the mapping sensor 27.

[0080] Next, the control unit 71 acquires the tilt amount KA1 of the substrate W1 around the axis extending in the insertion / removal direction TD, which corresponds to the signal value at the peak of the peak MU1. This will be explained in detail. As shown in Figure 19, multiple (e.g., three) ranges RG1 to RG3 corresponding to multiple tilt amounts are set in advance. Range RG1 is a range that is less than the first threshold TH1 and greater than or equal to the second threshold TH2. Range RG2 is a range that is less than the second threshold TH2 and greater than or equal to the third threshold TH3. Range RG3 is a range that is less than the third threshold TH3 and greater than or equal to the fourth threshold TH4.

[0081] For example, when the signal value at the peak of the peak MU1 is greater than or equal to the first threshold TH1, the control unit 71 determines that the substrate W1 is not tilted, that is, the tilt of the substrate W1 is 0 degrees. Conversely, when the signal value at the peak of the peak MU1 is less than the preset first threshold TH1, the control unit 71 detects that the substrate W1 is tilted around the axis extending in the insertion / removal direction TD.

[0082] For example, when the signal value at the peak of the peak MU1 falls within the range RG1, the control unit 71 determines that the tilt amount KA1 of the substrate W1 is, for example, 0.27 degrees. Also, when the signal value at the peak of the peak MU1 falls within the range RG2, the control unit 71 determines that the tilt amount KA1 of the substrate W1 is, for example, 0.43 degrees. Also, when the signal value at the peak of the peak MU1 falls within the range RG3, the control unit 71 determines that the tilt amount KA1 of the substrate W1 is, for example, 0.57 degrees.

[0083] The 24 tilt values ​​KA2 to KA25 for the remaining 24 boards W are obtained in the same way as the tilt value KA1 for board W1. Each tilt value KA1 to KA25 is the clockwise or counterclockwise angle (absolute value) of the axis extending in the insertion / removal direction TD. For example, the tilt value KA25 for board W in the bottom slot SL1 does not need to be obtained.

[0084] [Step S04] Is the clearance above the standard value? Next, the control unit 71 calculates clearances CL1 to CL24 for the 25 substrates W and determines whether each of the clearances CL1 to CL24 is greater than or equal to a preset reference value. Each clearance CL is the sum of the clearance between substrate WA and hand 41, and the clearance between substrate WB and hand 41, assuming that hand 41 is placed between substrate WA and substrate WB, as shown in Figure 20.

[0085] Furthermore, the pitch of the 25 substrates W within carrier C shall be within the SEMI (Semiconductor Equipment and Materials International) standard (e.g., 10 mm ± 0.5 mm).

[0086] First, let's explain how to calculate clearances CL1 to CL24. When clearances CL1 to CL24 and CL0 are not specifically distinguished, they are referred to as "clearance CL".

[0087] Figure 20 is a side view showing the basic method for calculating the clearance CL0. The clearance CL0 is the clearance when the inclination of the substrate W is not taken into consideration. The clearance CL0 is calculated by the following equation (1) or equation (2). Clearance CL0 = (Height position of board WA HTA - Thickness of board WA TKA ÷ 2) - (Height position of board WB HTB + Thickness of board WB TKB ÷ 2) - Thickness of hand 41 HH ... (1) Clearance CL0 = (Height position of the bottom surface of board WA - Height position of the top surface of board WB) - Thickness HH of hand 41 ... (2)

[0088] Here, the two circuit boards WA and WB are two circuit boards that are adjacent to each other, one above the other. Circuit board WA is located above circuit board WB. Circuit board WA is housed in slot SL(n) (for example, slot SL25) of carrier C. Circuit board WB is housed in slot SL(n-1) (for example, slot SL24), which is located one slot below slot SL(n). Note that "n" is a natural number greater than or equal to 2.

[0089] Figure 21(a) is a front view illustrating the method for calculating the clearance reduction amount GN due to the tilt of the substrate W, and Figure 21(b) is a diagram showing the details of the method for calculating the clearance reduction amount GN. The control unit 71 calculates the clearance reduction amount GN from the tilt amount of the substrate WA. The clearance reduction amount GN is the vertical displacement amount relative to when the substrate WA is in a horizontal state. Here, the clearance reduction amount GN is calculated by the following equation (3).

[0090] Clearance reduction GN = Outermost hand width HX × tanθ - (Thickness of substrate WA TKA ÷ 2) + (Thickness of substrate WA TKA ÷ 2) × cosθ =Handle outermost width HX × tanθ + (Thickness of circuit board WA TKA ÷ 2) × (cosθ - 1) ... (3) Here, the outermost width HX of the hand is the width from the support position of one shelf section (e.g., shelf section 15) of a pair of shelf sections 15 and 16 to the outermost end of the hand 41 on the other shelf section (e.g., shelf section 16). The outermost width HX of the hand is given a preset design value. The variable θ is the tilt amount of the substrate WA (e.g., tilt amount KA1). The tilt amount of the substrate WA is the angle (e.g., 0.27 degrees) obtained in correspondence with the signal value at the peak of the peak MU1. When the tilt amount of the substrate WA is 0 degrees, the clearance reduction amount GN becomes 0 from equation (3).

[0091] The control unit 71 then calculates the clearance CL, taking into account the inclination of the substrate W, using the following equation (4). Note that even if the substrate WB is actually inclined, the clearance CL is calculated as if the substrate WB were not inclined. Clearance CL = (Height position of the bottom surface of substrate WA - Height position of the top surface of substrate WB) - Thickness HH of hand 41 - Clearance reduction GN ... (4)

[0092] As described above, the control unit 71 calculates the clearance reduction amount GN1 from the tilt amount KA1 of the substrate W1 shown in Figure 11. Then, using equation (4) above, the control unit 71 calculates the total clearance CL1 between substrate W1 and the hand 41, and between substrate W2 and the hand 41, assuming that the hand 41 is placed between the two substrates W1 and W2. Similarly, the remaining 23 clearance reduction amounts GN2 to GN24 are calculated, and the 23 clearances CL2 to CL24 are calculated.

[0093] Next, the control unit 71 determines whether each of the 24 calculated clearances CL1 to CL24 is equal to or greater than a preset reference value. If at least one of the 24 clearances CL1 to CL24 is less than the reference value, the process proceeds to step S05. If all 24 clearances CL1 to CL24 are equal to or greater than the reference value, the process proceeds to step S06.

[0094] Each substrate W corresponds to the substrate of the present invention and the first substrate. When the substrate of the present invention and the first substrate are substrate W1, substrate W2 corresponds to the second substrate of the present invention. Also, when substrate W1 is housed in slot SL25, slot SL24, in which substrate W2 is housed, corresponds to the second slot of the present invention.

[0095] [Step S05] Stop transporting the circuit board and trigger an alarm. The control unit 71 controls the transport robot IR to prevent any substrate W from being removed from the carrier C when at least one of the 24 clearances CL is smaller than a preset reference value. In other words, the transport robot IR stops removing any substrate W from the carrier C.

[0096] If the clearance CL is small, when the hand 41 is inserted between the two circuit boards W, the hand 41 may come into contact with at least one of the two circuit boards W, potentially damaging that board W. Reasons for a small clearance CL (i.e., reasons for the circuit boards W being slightly tilted) include, for example, poor placement of the circuit boards W in the slot, a tilted top surface of the stage 9, the presence of an object between the carrier C and the stage 9, or the carrier C being distorted due to deterioration over time.

[0097] Furthermore, if at least one of the 24 clearances CL1 to CL24 is smaller than a preset reference value, the control unit 71 causes the notification unit 75 to notify that the clearance CL is smaller than the reference value. For example, the operator is notified by the sound of a buzzer or the flashing of a lamp. This allows the operator to know that the clearance CL is smaller than the reference value due to the tilting of the circuit board W, and to take action to address the cause. The operator can also know, for example, that the circuit board W may be damaged.

[0098] [Step S06] Hand enters the carrier and the circuit board is retrieved. If all 24 clearances CL1 to CL24 are above the standard value, the transport robot IR uses its hand 41 to insert it between, for example, two substrates W1 and W2 in the carrier C placed on the stage 9. As a result, the transport robot IR removes substrate W1 from the carrier C and transports the removed substrate W1 to the substrate mounting section PS. The transport robot IR then transports the remaining 24 substrates W in the carrier C to the substrate mounting section PS in order.

[0099] [Step S07] Substrate processing The central robot CR removes the substrate W1 from the substrate mounting section PS and transports it to the processing unit 51. The processing unit 51 performs pre-set processing on the substrate W1 transported by the transport robot IR and the central robot CR. The central robot CR returns the substrate W1 processed by the processing unit 51 to the substrate mounting section PS. The remaining 24 substrates W are also transported by the central robot CR and processed by the processing unit 51.

[0100] [Step S08] Transport of the substrate to the carrier and transport of the carrier from the stage. The transport robot IR sequentially transports the 25 substrates W processed by the processing unit 51 from the substrate placement section PS to the carrier C placed on the stage 9. After the 25 substrates W are stored in the carrier C, the lid attachment / detachment section 11 attaches the lid 17, held by the shutter section 19, to the carrier C (container 13), and closes the passage opening 7B with the shutter section 19. The shutter section 19 then releases its hold on the lid 17. The carrier C is then transported from the stage 9 of the load port 5 to the next destination.

[0101] In this embodiment, the control unit 71 acquires the signal value of, for example, the peak of peak MU1, one of two peaks MU1 and MU2 that are in contact with both ends of a valley VL1 where the light from the light-emitting unit 27A is blocked by the substrate W1 and the signal value becomes smaller, in the signal waveform output from the mapping sensor 27. The control unit 71 then detects that the substrate W1 is tilted around an axis extending in the insertion / removal direction TD when the signal value of peak MU1 is smaller than a preset threshold TH1. This makes it possible to detect the tilt (amount of tilt) of the substrate W1 separately from the thickness TK1 of the substrate W1.

[0102] Furthermore, the indexer block 2 is equipped with a transport robot IR. This allows the transport robot IR to be operated while taking into account the tilt (amount of tilt) of the substrate W that occurs around the axis extending in the loading / unloading direction TD.

[0103] Furthermore, the control unit 71 can acquire the amount of tilt KA1 of the substrate W1 around the axis extending in the insertion / removal direction TD, which corresponds to the signal value at the peak of the peak MU1.

[0104] Furthermore, the clearance reduction GN1 can be calculated from the tilt amount KA1 of the substrate W1, and the clearance CL1 considering the clearance reduction GN1 can be calculated. Even when the substrate W1 is tilted, if the calculated clearance CL1 is greater than or equal to the standard value, the transport robot IR can take the substrate W1 from the carrier C. Also, if the calculated clearance CL1 is less than the standard value, the transport robot IR will not take the substrate W1 from the carrier C. For example, this prevents the transport robot IR's hand 41 from contacting the substrate W1 and damaging it.

[0105] Furthermore, the control unit 71 acquires the thickness TK1 of the substrate W1. When the light-emitting unit 27A and the light-receiving unit 27B pass over the top and bottom surfaces of the substrate W1, the signal value from the mapping sensor 27 becomes half of the depth DP1 from the signal value S1 when light is not blocked to the minimum value MN1 of the valley VL1. Therefore, the thickness TK1 of the substrate can be measured by measuring the distance of the section in which the signal value is less than or equal to half of the depth DP1 of the valley VL1.

[0106] Furthermore, the control unit 71 obtains the height position HT1 of the substrate W1 from the minimum value MN1 of the valley VL1. For example, the height position HT1 of the substrate W1 may be obtained by measuring two height positions on the top and bottom surfaces of the substrate W1, and then calculating the center position of the two height positions. In this case, two measurement operations for the two heights and a calculation operation for the center position are required to obtain the height position HT1 of the substrate W1. According to this embodiment, since the height position corresponding to the minimum value MN1 of the valley VL1 is measured by the rotary encoder 25, the height position HT1 of the substrate W1 can be obtained in a single measurement operation.

[0107] When substrates W1, W2, W3, WA, and WB are not specifically distinguished, they are written as "Substrate W". When depths DP1 to DP25 are not specifically distinguished, they are written as "DP". When clearance reduction amounts GN2 to GN24 are not specifically distinguished, they are written as "Clearance Reduction Amount GN". When height positions HT1 to HT25 are not specifically distinguished, they are written as "Height Position HT". When thicknesses TK1 to TK25 are not specifically distinguished, they are written as "Thickness TK".

[0108] The present invention is not limited to the embodiments described above, and can be modified and implemented as follows.

[0109] (1) In the above-described embodiment, the control unit 71 obtained the height position HT1 of the substrate W1 by measuring the height position HT1 corresponding to the minimum value MN1 of the signal in the valley VL1 of the signal waveform using the rotary encoder 25. Here, the measurement resolution of the height position depends on the resolution of the rotary encoder 25. Therefore, the measurement resolution can be increased by increasing the resolution of the rotary encoder 25. However, generally, high-resolution rotary encoders 25 are relatively expensive.

[0110] Therefore, for example, when mapping is being performed, the control unit 71 counts the number of pulses output from the rotary encoder 25 within a certain period of time and measures the frequency. Then, the control unit 71 calculates the speed IC (increasing gradient) by multiplying the measured frequency by the amount of movement per pulse (distance (unit: μm)). This speed IC is the vertical (Z-direction) movement speed of the mapping sensor 27 (light-emitting unit 27A and light-receiving unit 27B).

[0111] Refer to Figure 22. For example, when the minimum value MN1 of the valley VL1 is located between the first reference point P1 of the first pulse PL1 output continuously from the rotary encoder 25 and the second reference point P2 of the second pulse PL2, the control unit 71 obtains the difference value DF (= mapping time T2 - pulse time T1) between the pulse time T1 corresponding to the first reference point P1 of the first pulse PL1 and the mapping time T2 corresponding to the minimum value MN1 of the valley VL1.

[0112] Subsequently, the control unit 71 acquires the internal distance DS2 from the first reference point P1 to the minimum value MN1 of the valley VL1 by integrating the difference value DF with the moving speed (speed IC) of the light-emitting unit 27A and the light-receiving unit 27B. For example, the control unit 71 uses the internal distance DS2 when acquiring the height position of the substrate W1. For example, when acquiring the height position of the substrate W from the amount of movement between a preset height position P0 (e.g., the starting height position HTS) and the minimum value MN1 of the valley VL1, the control unit 71 calculates the distance (amount of movement) DS1 by counting the number of pulses (including the first pulse) included between the preset height position P0 and the minimum value MN1 of the valley VL1. Then, the control unit 71 acquires the amount of movement of the first pulse PL1 between the first reference point P1 and the minimum value MN1, i.e., the internal distance DS2. This makes it possible to measure the distance (distance DS1 + internal distance DS2) with a higher resolution than the resolution of the rotary encoder 25.

[0113] This modified version can be applied not only to measuring the height of the substrate W, but also to measuring the thickness (warpage) of the substrate W.

[0114] (2) In step S05 shown in Figure 9 of the above-described embodiment and modification (1), the control unit 71 controlled the transport robot IR so as not to remove any substrate W from the carrier C when at least one of the 24 clearances CL was smaller than a preset reference value. The control unit 71 also activated the notification unit 75. In this regard, the removal of each substrate W may be determined individually.

[0115] For example, when the clearance CL1 is smaller than a preset reference value, the control unit 71 controls the transport robot IR to prevent the substrate W1 from being removed from the carrier C and activates the notification unit 75. Also, when the clearance CL2 is larger than a preset reference value, the control unit 71 controls the transport robot IR to remove the substrate W2 from the carrier C and does not activate the notification unit 75.

[0116] Furthermore, when the clearance CL3 is smaller than a preset reference value, the control unit 71 controls the transport robot IR to prevent the substrate W3 from being removed from the carrier C, and activates the notification unit 75.

[0117] (3) In the embodiments and modifications described above, the control unit 71 acquired the signal value of the peak MU1 of the two peaks MU1 and MU2 that are in contact with both ends of the valley VL1 in the signal waveform output from the mapping sensor 27. In this regard, the control unit 71 may acquire the signal value of the peak MU2. Alternatively, the control unit 71 may acquire the average value of the signal values ​​of the peaks of the two peaks MU1 and MU2.

[0118] In other words, the control unit 71 only needs to acquire the signal value of the peak of at least one of the two peaks MU1 and MU2 that are in contact with both ends of the valley VL1 in the signal waveform output from the mapping sensor 27.

[0119] (4) In the embodiments and modifications described above, the control unit 71 acquires the signal value at the peak of the peak MU1, and when the signal value at the peak of the peak MU1 is smaller than a preset threshold TH1, it detects that the substrate W1 is tilted around the axis extending in the insertion / removal direction TD. Here, the waveform information acquired from the peak MU1 is not limited to the peak. For example, the control unit 71 may acquire the degree of tilt of the peak MU1 as waveform information.

[0120] In other words, the control unit 71 only needs to acquire waveform information from at least one of the two peaks MU1 and MU2, for example, peak MU1. Then, based on the waveform information of peak MU1, the control unit 71 detects the tilt of the substrate W around the axis extending in the insertion / removal direction TD.

[0121] (5) In the embodiments and modifications described above, the light-emitting unit 27A and the light-receiving unit 27B were moved linearly in the front-rear direction and the extension / retraction direction TD (X direction) by the sensor moving unit 29. In this respect, as shown in Figure 23, the light-emitting unit 27A and the light-receiving unit 27B may be rotated by the sensor moving unit 80 around a horizontal axis AX5 extending in the width direction. The sensor moving unit 80 comprises an arm 81 and a drive unit 83. The tip 81A of the arm 81 fixes the sensor support member 31 that supports the light-emitting unit 27A, etc.

[0122] Furthermore, a drive unit 83 is provided at the base end 81B of the arm 81, which is located on the opposite side of the tip end 81A via the horizontal axis AX5. The drive unit 83 causes the base end 81B to rotate around the horizontal axis AX5, thereby rotating the light-emitting unit 27A and the light-receiving unit 27B around the horizontal axis AX5. This may move the light-emitting unit 27A and the light-receiving unit 27B between a standby position and a detection position. The drive unit 83 includes, for example, an air cylinder or a linear encoder including an electric motor.

[0123] Furthermore, as shown in Figure 24, the light-emitting unit 27A and the light-receiving unit 27B may each be moved by the sensor movement unit 90. The sensor movement unit 90 comprises horizontally extending arms 91 and 92, and a drive unit 95. The light-emitting unit 27A and the light-receiving unit 27B are attached to the arms 91 and 92, respectively. The drive unit 95 comprises an electric motor. The drive unit 95 rotates the light-emitting unit 27A around the vertical axis AX7 via arm 91. The drive unit 95 also rotates the light-receiving unit 27B around the vertical axis AX8 via arm 92. As a result, the light-emitting unit 27A and the light-receiving unit 27B are moved between a standby position and a detection position.

[0124] (6) In the embodiments and modifications described above, the light-emitting unit 27A and the light-receiving unit 27B moved together with the shutter unit 19. However, the light-emitting unit 27A and the light-receiving unit 27B may move independently of the shutter unit 19.

[0125] (7) In the embodiments and modifications described above, the light-emitting unit 27A and the light-receiving unit 27B are provided on the lid attachment / detachment unit 11. In this regard, the light-emitting unit 27A and the light-receiving unit 27B may be provided, for example, on the tip of the hand 41 or articulated arm 43 of the transport robot IR.

[0126] (8) In the above-described embodiments and modifications, when the clearance CL, taking into account the inclination of the substrate W, is smaller than the reference value, the control unit 71 controls the transport of the substrate W from the carrier C and also notifies the notification unit 75 that the clearance CL is smaller than the reference value.

[0127] In this regard, the control unit 71 detects that the substrate is tilted around the axis extending in the insertion / removal direction when, for example, the signal value at the peak of the peak MU1 is smaller than a preset threshold (for example, threshold TH1 shown in Figure 19). The threshold may be any one of the thresholds TH2 to TH4 shown in Figure 19.

[0128] Then, when the control unit 71 detects that the substrate W is tilted beyond a preset threshold (for example, threshold TH1), it controls the transport robot IR to prevent the substrate W from being removed from the carrier C. This allows the operator to know that the clearance CL is smaller than the reference value due to the tilt of the substrate W. The operator can also know, for example, that there is a possibility of damage to the substrate W.

[0129] (9) In the embodiments and modifications described above, when mapping was performed, the shutter lifting unit 23 lowered the light-emitting unit 27A and the light-receiving unit 27B. In this regard, the shutter lifting unit 23 may raise the light-emitting unit 27A and the light-receiving unit 27B so that they move from bottom to top relative to the multiple substrates W.

[0130] (10) In the embodiments and modifications described above, the substrate processing apparatus 1 is equipped with a control unit 71. The load port 5 or the transport robot IR may be equipped with a second control unit. The second control unit is equipped with one or more processors, such as a central processing unit (CPU). The second control unit is able to communicate with the control unit 71. The second control unit controls the respective components of the load port 5 and the transport robot IR. At least one of the control unit 71 and the second control unit corresponds to the control unit of the present invention.

[0131] Furthermore, the load port 5 or the transport robot IR may have a second storage unit in addition to the second control unit. The second storage unit may include, for example, at least one of ROM, RAM, and a hard disk. The second storage unit is capable of communicating with the second control unit. The second storage unit stores computer programs necessary to control the various components of the load port 5 and the transport robot IR. The storage unit 73 also stores various operations. [Explanation of Symbols]

[0132] 1 ... Substrate processing equipment 5… Load port IR… Transport robot 9… Stage 11 … Lid attachment / detachment part 14…Aperture SL1~SL25 ... Slots 23... Shutter lifting mechanism 25… Rotary encoder 27… Mapping sensor 27A ... Light source 27B … Light receiving section TD… Direction of insertion / removal 41… Hand 51… Processing Unit 71 ... Control Unit 73 … Storage section 75… Hochi Department S1 ... Signal value

Claims

1. A circuit board transport device for loading and unloading circuit boards, A stage on which a carrier for housing the aforementioned substrate is placed, A mapping sensor comprising a light-emitting unit and a light-receiving unit arranged in a horizontal direction perpendicular to the insertion / removal direction in which the substrate is inserted into and removed from the carrier through an opening in the carrier, wherein the light-emitting unit and the light-receiving unit are arranged on the opening side so as to face each other across the peripheral edge of the substrate in a plan view, A lifting mechanism for moving the light-emitting unit and the light-receiving unit in the vertical direction, It comprises a control unit and, When the light-emitting unit is emitting light and the light-receiving unit is in a state where it can receive the light, the control unit moves the light-emitting unit and the light-receiving unit to the lifting unit so that the light-emitting unit and the light-receiving unit pass through the substrate in the carrier. In the signal waveform output from the mapping sensor, waveform information is acquired for at least one of the two peaks that are in contact with both ends of the trough where the light from the light-emitting unit is blocked by the substrate and the signal value becomes smaller. A substrate transport device characterized by detecting the tilt of the substrate around an axis extending in the loading / unloading direction based on the waveform information of the peak portion.

2. In the substrate transport apparatus according to claim 1, A substrate transport device comprising a transport robot equipped with a hand for holding the substrate, and further comprising a transport robot that uses the hand to remove the substrate from the carrier placed on the stage.

3. In the substrate transport apparatus according to claim 1 or 2, The substrate transport device is characterized in that the control unit acquires the amount of tilt of the substrate around an axis extending in the loading / unloading direction, which corresponds to the signal value at the peak of the mountain portion.

4. In the substrate transport apparatus according to claim 3, The carrier has a first slot for housing the first substrate, which is the substrate, and a second slot located one slot below the first slot for housing the second substrate. The control unit calculates a clearance reduction amount, which is the vertical displacement amount relative to when the first substrate is in a horizontal position, from the amount of inclination of the first substrate. The following formula is used to calculate the total clearance between the first substrate and the hand, and between the second substrate and the hand, assuming that the hand is positioned between the first substrate and the second substrate: The clearance = (height position of the lower surface of the first substrate - height position of the upper surface of the second substrate) - thickness of the hand - amount of clearance reduction The control unit, When the clearance is greater than or equal to a preset reference value, the transport robot is controlled to remove the first substrate from the carrier. A substrate transport device characterized in that, when the clearance is smaller than a preset reference value, the transport robot is controlled so as not to remove the first substrate from the carrier.

5. In the substrate transport apparatus according to claim 4, Furthermore, a news department will be added. The substrate transport apparatus is characterized in that the control unit causes the notification unit to notify that the clearance is smaller than the preset reference value when the clearance is smaller than the preset reference value.

6. In the substrate transport apparatus according to claim 2, A substrate transport device characterized in that, when the control unit detects that the substrate is tilted beyond a preset threshold, it controls the transport robot to prevent the substrate from being removed from the carrier.

7. In the substrate transport apparatus according to claim 1 or 2, The system further includes a height sensor for measuring the height position of the light-emitting unit and the light-receiving unit. The substrate transport apparatus is characterized in that the control unit obtains the thickness of the substrate by measuring the distance corresponding to the width of the valley portion of the signal waveform using the height sensor.

8. In the substrate transport apparatus according to claim 1 or 2, The system further includes a height sensor for measuring the height position of the light-emitting unit and the light-receiving unit. The substrate transport apparatus is characterized in that the control unit obtains the height position of the substrate by measuring the height position corresponding to the minimum value of the valley in the signal waveform using the height sensor.

9. In the substrate transport apparatus according to claim 8, The control unit determines when the minimum value of the valley is located between the first reference point of the first pulse and the second reference point of the second pulse, which are output continuously from the height sensor. The difference between the pulse time corresponding to the first reference point of the first pulse and the mapping time corresponding to the minimum value of the valley is obtained, and further, By integrating the difference value into the moving speeds of the light-emitting unit and the light-receiving unit, the internal distance from the first reference point to the minimum value of the valley is obtained. A substrate transport device characterized by using the internal distance when acquiring the height position of the substrate.

10. A substrate transport device according to claim 2, A substrate processing unit that processes the substrate transported by the transport robot, A substrate processing apparatus characterized by comprising:

11. A method for detecting the state of a substrate in a substrate transport device for loading and unloading substrates, The substrate transport device is A stage on which a carrier for housing the aforementioned substrate is placed, A mapping sensor comprising a light-emitting unit and a light-receiving unit arranged in a horizontal direction perpendicular to the insertion / removal direction in which the substrate is inserted into and removed from the carrier through an opening in the carrier, wherein the light-emitting unit and the light-receiving unit are arranged on the opening side so as to face each other across the peripheral edge of the substrate in a plan view, The system includes a lifting mechanism that moves the light-emitting unit and the light-receiving unit in the vertical direction, The substrate state detection method is: A mapping step is performed in which, when the light-emitting unit is emitting light and the light-receiving unit is in a state where the light-receiving unit is able to receive the light, the light-emitting unit and the light-receiving unit are moved to the lifting unit so that the light-emitting unit and the light-receiving unit pass through the substrate in the carrier. A waveform information acquisition step involves acquiring waveform information of at least one of two peaks in the signal waveform output from the mapping sensor, which is located at both ends of a trough where the light from the light-emitting unit is blocked by the substrate and the signal value becomes smaller. A detection step of detecting the tilt of the substrate around an axis extending in the insertion / removal direction based on the waveform information of the peak portion, A substrate state detection method characterized by comprising the following features.

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