Liquid cooling processing system with replaceable modules

Abstract

To provide a modular processing system that improves the performance of its components and operates without failure in high-temperature environments. [Solution] The modular processing system 300 includes a first electronic module comprising a first PCB 307 and a first electronic component 314 on the first PCB, a second electronic module comprising a second PCB 313 and a second electronic component 304 on the second PCB, and a cold plate 305 positioned between the first and second electronic modules. The cold plate circulates a coolant to cool the first and second PCBs. At least a portion of the cold plate is provided in the first electronic module. The first electronic module is detachably fixed to the second electronic module.

Description

Technical Field

[0001] The present disclosure generally relates to a processing system, and more specifically to a processing system having a module design.

Background Art

[0002] A processing system can include multiple components such as a system-on-chip (SOC), an application-specific integrated circuit (ASIC), etc. Such components can generate heat during operation, and as a result, by cooling the components, the performance of the components can be improved and / or the components can be enabled to operate in a high-temperature environment without failure. When the processing system fails, it may be desirable to provide the ability to service the processing system in order to extend the life of the processing system.

Summary of the Invention

[0003] In one aspect, a modular processing system is provided, including a first electronic device module including a first printed circuit board (PCB) and a first electronic component on the first PCB, a second electronic device module including a second PCB and a second electronic component on the second PCB, and a cold plate disposed between the first electronic device module and the second electronic device module and configured to circulate a coolant to cool the first PCB and the second PCB, at least a part of the cold plate being provided in the first electronic device module, and the first electronic device module being removably fixed to the second electronic device module.

[0004] In some embodiments, the cold plate is attached to the first PCB using one or more thermal interface materials (TIMs) to form a thermal path between the cold plate and the first electronic component on the first PCB, the second electronic device module further includes an interposer attached to the second PCB, and the interposer is thermally coupled to the first cold plate.

[0005] In some embodiments, the modular processing system further comprises one or more thermal gap pads that connect a second electronic module to a cold plate, the one or more thermal gap pads configured to provide a thermal interface between the second electronic component on the second PCB and the cold plate.

[0006] In some embodiments, the interposer is in direct contact with the cold plate, and the interposer is clamped to the cold plate.

[0007] In some embodiments, the interposer defines a notch and a thermal path between a second electronic component on a second PCB and a cold plate through the notch.

[0008] In some embodiments, the interposer is coupled to a cold plate via one or more gap pads, and the modular processing system further comprises a heat spreader thermally coupled to the interposer, having a higher thermal conductivity than the interposer, and configured to transfer heat from a second electronic component on a second PCB to one or more gap pads.

[0009] In some embodiments, the modular processing system further includes a second cold plate, the first electronic module comprises the cold plate, and the second electronic module comprises the second cold plate.

[0010] In some embodiments, the cold plate includes a first port, the second cold plate includes a second port, and the first port is connected to the second port to provide a coolant path for coolant to flow from the cold plate to the second cold plate.

[0011] In some embodiments, the modular processing system further comprises a cold plate including a first opening, a second cold plate including a second opening, a first PCB including a male board-to-board connector, a second PCB including a female board-to-board connector, and the male and female board-to-board connectors being configured to provide an electrical connection between the first and second PCBs.

[0012] In some embodiments, the first electronic module and the second electronic module are directly coupled to the cold plate.

[0013] In some embodiments, the cold plate comprises a first frame and a second frame configured to be attached to each other to form a coolant path through which the coolant flows.

[0014] In some embodiments, a first electronic component on a first PCB comprises a system-on-a-chip configured to perform at least some of the calculations associated with autonomous vehicle functions, and a second electronic component on a second PCB is configured to perform at least some of the calculations associated with infotainment.

[0015] In another embodiment, a method for replacing a module in a modular processing system, comprising removing a first electronic module from a second electronic module, wherein the first electronic module comprises a first printed circuit board (PCB), the second electronic module comprises a second PCB, the first electronic module being fixed to the second electronic module prior to the removal, and the modular processing system comprising a cold plate configured to cool the first and second PCBs, and attaching a new first electronic module to the second electronic module using one or more fasteners.

[0016] In some embodiments, the method further includes identifying that the first electronic module has failed before installation.

[0017] In some embodiments, the method further includes removing the modular processing system from the vehicle before the removal described above.

[0018] In some embodiments, the modular processing system is installed in the vehicle before being removed as described above.

[0019] In some embodiments, the cold plate is located between a first electronics module and a second electronics module.

[0020] In some embodiments, the method further includes applying one or more gap pads to the interposer of the modular processing system before mounting as described above.

[0021] In some embodiments, the modular processing system further includes a second cold plate, the cold plate being provided in a first electronic module and the second cold plate being provided in a second electronic module, and the mounting includes mounting the first electronic module to the second electronic module.

[0022] In another embodiment, a modular processing system comprising a first electronic module comprising a first PCB and a first electronic component on the first PCB, a second electronic module comprising a second PCB and a second electronic component on the second PCB, and a cold plate configured to circulate a coolant for cooling the first PCB and the second PCB, wherein the cold plate comprises a portion of the first electronic module and a portion of the second electronic module, and the first electronic module is detachably attached to at least one of the second electronic module or the cold plate by one or more fasteners. [Brief explanation of the drawing]

[0023] [Figure 1A] Provide a schematic decomposition diagram of the processing system. [Figure 1B] Provide a schematic decomposition diagram of the processing system.

[0024] [Figure 2A] Provide a schematic diagram of a modular processing system according to an aspect of the present disclosure. [Figure 2B] Provide a schematic diagram of a modular processing system according to an aspect of the present disclosure.

[0025] [Figure 3A] Provide a schematic cross-sectional view of a modular processing system according to different embodiments of the present disclosure. [Figure 3B] Provide a schematic cross-sectional view of a modular processing system according to different embodiments of the present disclosure. [Figure 3C] Provide a schematic cross-sectional view of a modular processing system according to different embodiments of the present disclosure.

[0026] [Figure 4A] Provide a schematic diagram of another modular processing system according to an aspect of the present disclosure. [Figure 4B] Provide a schematic diagram of another modular processing system according to an aspect of the present disclosure.

[0027] [Figure 5] Provide a schematic cross-sectional view of a modular processing system according to an embodiment of the present disclosure.

[0028] [Figure 6A] Provide a schematic cross-sectional view of a modular processing system according to another embodiment of the present disclosure. [Figure 6B] Provide a schematic cross-sectional view of a modular processing system according to another embodiment of the present disclosure.

[0029] [Figure 7]This disclosure provides a schematic cross-sectional view of yet another modular processing system according to this disclosure.

[0030] [Figure 8] This disclosure provides a schematic cross-sectional view of yet another modular processing system according to an aspect of this disclosure.

[0031] [Figure 9] Figure 8 provides a schematic cross-sectional view of an alternative embodiment of the modular processing system compared to the modular processing system shown in Figure 8.

[0032] [Figure 10] This is a flowchart illustrating a method for replacing modules in a modular processing system according to the embodiments of this disclosure. [Modes for carrying out the invention]

[0033] The following detailed description of a particular embodiment presents various descriptions of that particular embodiment. However, the technological innovations described herein can be embodied in numerous different ways, for example, as defined and encompassed by the claims. In this description, similar reference numbers and / or terms refer to drawings in which identical or functionally similar elements may be shown. It will be understood that the elements shown in the drawings are not necessarily drawn to scale. Furthermore, it will be understood that a particular embodiment may include more elements and / or subsets of elements shown in the drawings than those shown. Furthermore, some embodiments may incorporate any suitable combination of features from two or more drawings.

[0034] A processing system can include multiple components such as a System of Control (SOC) and an Associated System (ASIC). These components can generate heat during operation, and consequently, cooling them can improve their performance and / or allow them to operate in high-temperature environments without failure. These types of processing systems can enable a variety of capabilities involving relatively powerful processing, including advanced driver-assistance systems (ADAS) and autonomous vehicles. If a processing system fails, it may be desirable to provide the ability to service the processing system to extend its lifespan. This is becoming an increasingly relevant issue to address in current industry trends. Furthermore, it may be desirable to provide the ability to upgrade one or more individual components of the processing system.

[0035] One important design consideration for processing systems (e.g., high-performance computing systems, multi-chip modules, integrated circuit assemblies, etc.) is the cooling of electronic components located on one or more printed circuit boards (PCBs). Electronic components can operate most efficiently within a given temperature range. Therefore, the heat generated by electronic components can raise their temperature beyond the optimal operating range, potentially leading to a decrease in performance and / or failure of the electronic components. Typically, cooling is desirable to maintain the temperature of electronic components within or near a desired temperature range, thereby improving the performance of the processing system.

[0036] A computing system (also called a “processing system”) may include two or more electronic printed circuit board assemblies (PCBAs). As used herein, a PCBA generally refers to a printed circuit board (PCB) on which one or more electronic components are mounted. Two or more PCBAs in a processing system can be cooled via a shared cold plate. Curable or other thermal interface material (TIM) can be used to bond the PCBAs to the cold plate, providing a thermal path that allows excess heat generated by the electronic components and / or PCBs to flow into the cold plate. While such a processing system can provide sufficient cooling for two PCBs and the electronic components mounted thereon, one drawback of this design is that replacing a failed component in the processing system can be costly. For example, replacing a curable TIM may involve the use of automated distribution equipment, which is typically not available outside the manufacturing environment. Furthermore, removing one of the PCBs from the cold plate may expose the PCB(s) to stressors that could damage the electronic components on it. Therefore, since service centers typically lack the specialized equipment used to apply curable TIM and / or cannot reduce the stress factors involved in removing PCBs from cold plates, it may be impossible to replace any part of the processing system in a service center.

[0037] Aspects of this disclosure relate to a modular computing system comprising two modules, one of which can be separately replaced. The first electronic module comprises a first PCB and first electronic components on the first PCB. The second electronic module comprises a second PCB and second electronic components on the second PCB. The second electronic module can be stacked with the first electronic module and can be stacked perpendicularly with the first electronic module. A cold plate can be placed between the first and second electronic modules and can circulate a coolant to cool the first and second PCBs and the electronic components mounted on the first and second PCBs. The cold plate can be provided in the first electronic module and / or the second electronic module. The first electronic module can be removably secured to the second electronic module using one or more fasteners.

[0038] Figures 1A and 1B provide schematic exploded views of the processing system 100. In particular, Figure 1A provides a schematic exploded view of the processing system 100, and Figure 1B provides a schematic exploded view of a part of the processing system 100.

[0039] In Figures 1A and 1B, the processing system 100 includes a first cover 102, a first PCB 104, a cold plate 106, a second PCB 108, a second cover 110, a hose assembly 112, and a mounting bracket 114. The first cover 102 is configured to cover and protect the first PCB 104, and the second cover 110 is configured to cover and protect the second PCB 108.

[0040] The cold plate 106 can be implemented as a monolithic cold plate (e.g., as a single component) that defines a coolant path between the inlet 116 and outlet 118 of the cold plate 106. The cold plate 106 is configured to circulate coolant through the cooling path to cool the first PCB 104 and the second PCB 108.

[0041] The hose assembly 112 is configured to supply coolant to the inlet 116 of the cold plate 106 and to receive the coolant back from the outlet 118 of the cold plate 106. The hose assembly 112 may be coupled to a heat exchanger (not shown) configured to cool the coolant received from the cold plate 106 before recirculating the coolant back to the cold plate 106.

[0042] The mounting bracket 114 can be directly or indirectly coupled to the first cover 102, the first PCB 104, the cold plate 106, the second PCB 108, and the second cover 110. The mounting bracket 114 provides a structure that allows the processing system 100 to be mounted in a fixed position when in use.

[0043] The processing system 100 further includes a plurality of curable TIM 120s positioned between the cold plate 106 and each of the first PCB 104 and the second PCB 108. The curable TIM 120s provide relatively high thermal conduction paths between the electronic components formed on each of the first and second PCBs 104 and 108 and the cold plate 106. These thermal paths allow excess heat generated by the electronic components formed on the first PCB 104 and the second PCB 108 to flow into the cold plate 106. The curable TIM 120s can be bonded to the cold plate 106 and the first and second PCBs 104 and 108 using an automatic distribution device.

[0044] The processing system 100 shown in Figures 1A and 1B allows two different processing systems to be used for desired applications. For example, an automotive application may have one processing system for infotainment and another for assistance and / or autonomous driving. These processing systems can generate excess heat so that active cooling of the processing system can improve performance. Instead of using two separate processing systems, each having its own individual cooling system, the processing system 100 shown in Figures 1A and 1B can be used to reduce the cost, weight, and packaging associated with providing two processing systems.

[0045] Multiple curable TIM120s can impart minimal strain (e.g., below threshold strain) to the first and second PCBs 104 and 108 and the electronic components formed thereon, while simultaneously providing good thermal performance (e.g., up to 10-15 W / mK), making dispenseable curable TIM120s a reliable choice for automotive electronics. However, one drawback to the use of curable TIM120s is that they are typically applied using an automated dispenser. Without an automated dispenser, the curable TIM120s may not be applied with sufficient consistency, which can lead to insufficient cooling of the electronic components formed on the first and second PCBs 104 and 108s, ultimately potentially resulting in failure.

[0046] If either the first or second PCB 104 or 108 fails, the service center may not have an automated dispenser for the curable TIM 120, making it impossible to replace only the failed PCB 104 or 108 at the service center. Furthermore, service technicians may not be qualified to use such equipment. Another risk is that service technicians may mishandle the first or second PCB 104 or 108, respectively, leading to damage to the electronics. Manual replacement of the failed PCB 104 or 108 at the service center may not be feasible and / or possible without an automated TIM dispenser. Removing residue from the curable TIM 120 can be cumbersome and time-consuming. Therefore, the entire processing system 100 may be replaced even if one of the first or second PCB 104 or 108 is still fully functional.

[0047] However, due to the cost of the individual first and second PCBs 104 and 108, it may be desirable to be able to manually replace one of the faulty first and second PCBs 104 and 108 rather than replacing the entire processing system 100. Aspects of this disclosure relate to a modular processing system that enables reliable and efficient manual replacement of a faulty PCB among the first and second PCBs 104 and 108.

[0048] Aspects of the present disclosure relate to systems and methods for enabling the individual replacement of a first electronic module or a second electronic module for a processing system comprising two modules. Embodiments of the present disclosure relate to a modular processing system having i) a single cold plate with separable electronic modules, or ii) two electronic modules having two connected independent cold plates. Further aspects of the present disclosure provide alternative process-oriented technologies for reworking adhesive bonded curable TIM to reduce both hardware and service costs.

[0049] Figures 2A and 2B provide diagrams of a modular processing system 200 according to an embodiment of the present disclosure. In particular, Figure 2A provides an isometric view of the modular processing system 200, and Figure 2B provides a diagram of the processing system 200 with two separate modules.

[0050] Referring to Figures 2A and 2B, the modular processing system 200 includes a first electronic module 202 and a second electronic module 204. The first electronic module 202 includes a cold plate 206, a first PCB 208, and a first cover 210. The second electronic module 204 includes an interposer 212, a second PCB 214, and a second cover 216.

[0051] The first PCB 208 is positioned between the first cover 210 and the cold plate 206 so that the first cover 210 and the cold plate 206 can protect the first PCB 208. Similarly, the second PCB 214 is positioned between the interposer 212 and the second cover 216 so that the interposer 212 and the second cover 216 can protect the second PCB 214.

[0052] In some embodiments, the interposer 212 is configured to be removably secured to the cold plate 206 using one or more fasteners (e.g., screws, bolts, deformable eyelets, etc.) so that the first electronic module 202 can be removed from the second electronic module 204 in order to facilitate the replacement of either the first or second electronic modules 202 and 204. The interposer 212 is also configured to protect the second PCB 214 when the second electronic module 204 is removed from the first electronic module 202 (e.g., during replacement).

[0053] The modular processing system 200 also includes one or more gap pads 218 configured to provide a thermal path between electronic components (e.g., SOC) formed on the second PCB 214 and the cold plate 206. The interposer 212 allows for pressure preloading of the gap pads 218 (e.g., during the installation of one or more gap pads 218) and provides rigid backing to one or more gap pads 218 to enhance the reliability of the electronic components on the second PCB 214. In some embodiments, one or more gap pads 218 may be adhesive and / or bonding layers, and one or more gap pads 218 may be pre-applied onto the first or second electronic module 202 or 204 to be replaced. In such embodiments, service technicians can avoid handling and contamination risks of the gap pads 218.

[0054] In some embodiments, the first PCB 208 may have higher-power electronic components compared to the second PCB 214. Therefore, it may be desirable to provide more cooling to the electronic components formed on the first PCB 208 than to the electronic components formed on the second PCB 214. To provide additional cooling, a cold plate 206 can be provided within the first electronic module 202. This reduces the distance and number of thermal layers between the electronic components formed on the first PCB 208 and the cold plate 206, allowing the electronic components formed on the first PCB 208 to be cooled to a higher level.

[0055] In some applications, the electronic components on the first PCB 208 include a high-power processor (e.g., an autopilot (AP) processor) configured to perform at least some of the calculations associated with the vehicle's driver assistance, autopilot driving, other autonomous vehicle functions, and / or advanced driver-assistance system (ADAS) functions. In some embodiments, the electronic components on the second PCB 214 include a low-power processor (e.g., a media control unit (MCU) processor) configured to perform at least some of the calculations associated with the vehicle's infotainment system and / or media control. Higher-power processors may generate more heat than lower-power processors.

[0056] Figures 3A to 3C provide cross-sectional views of modular processing systems 300 according to different embodiments of the present disclosure.

[0057] Figure 3A provides a cross-sectional view of one embodiment of a modular processing system 300 in which the interposer 312 includes one or more bases 302. One or more bases 302 can be thermally connected to one or more electronic components 304 formed on a second PCB 313 via one or more curable TIM 306. The second PCB 313 may also include a processor 308 that can generate more heat than the one or more electronic components 304. The processor 308 can be thermally coupled to the interposer 312 via the curable TIM 306 and a floating cover 310. The floating cover 310 may include copper in certain applications.

[0058] The first PCB 307 may have one or more electronic components 314 and one or more processors 316 placed thereon. One or more electronic components 314 may be connected to one or more pedestals 318 on the cold plate 305 via one or more curable TIM 306. Each of the one or more processors 316 may be bonded to the cold plate 305 via a curable TIM 306, a floating lid 320, and another curable TIM 306.

[0059] The embodiment shown in Figure 3A can be used to simplify the assembly of the modular processing system 300. For example, the interposer 312 can be in direct contact with the cold plate 305. A relatively low thermal resistance interface can be achieved without a gap pad through relatively high pressure contact (e.g., a threshold pressure of 100 psi or more) between the interposer 312 and the cold plate 305. Since the interposer 312 and the cold plate 305 can be formed from metal, they can be made rigid enough to clamp with a threshold pressure. The force involved in achieving the threshold pressure can be provided by a clamping load at the interface between the interposer 312 and the cold plate 305, so that the electronics (e.g., one or more electronic components 304 and / or processor 308) are not significantly affected.

[0060] Figure 3B provides a cross-sectional view of one embodiment of a modular processing system 300 in which the interposer 312 has a notch 322. Since certain components of the modular processing system 300 are similar to those in Figure 3A, not all similar components are numbered in Figure 3B. The descriptions of these components provided in relation to Figure 3A may apply to these components in Figure 3B.

[0061] The embodiment in Figure 3B allows for increased cooling of the processor 308 because the interposer material node is located between the floating lid 310 and the cold plate 305. The floating lid 310 can be configured to function as a floating head spreader, and the gap pad 317 can be directly connected to both the floating lid 310 and the cold plate 305. This configuration allows for reduced thermal resistance between the processor 308 and the cold plate 305. This can be achieved, for example, by changing the composition of the layers and / or by reducing the number of layers between the processor 308 and the cold plate 305. To cool these components 304, one or more gap pads 317 may also be provided between the interposer 312 and the cold plate 305 aligned with one or more electronic components 304. In some other applications (not shown), two or more notches may be provided in the interposer 312.

[0062] Figure 3C provides a cross-sectional view of one embodiment of a modular processing system 300 in which the interposer 312 has one or more heat spreaders 326. Since certain components of the modular processing system 300 are similar to those in Figures 3A and / or 3B, not all similar components are numbered in Figure 3C. The descriptions of these components provided in relation to Figures 3A and 3B may apply to these components in Figure 3C.

[0063] One or more heat spreaders 326 are configured to transfer heat from a local heat source (e.g., one or more electronic components 304) to the location(s) of one or more gap pads 317. One or more heat spreaders 326 can transfer heat more efficiently than the interposer 312 alone by having a higher thermal conductivity than the interposer 312, for example. In some embodiments, one or more heat spreaders 326 may include conductive plates (e.g., copper plates), heat pipes, or vapor chambers. Since one or more gap pads 317 are coupled to the cold plate 305, the heat transferred to the location(s) of one or more gap pads 317 can be removed more effectively through the combination of one or more heat spreaders 326 and one or more gap pads 317. In some embodiments, by appropriately arranging one or more heat spreaders 326, the number of gap pads 317 can be reduced, thereby reducing costs and the pressure applied to the interposer 312.

[0064] One or more heat spreaders 326 may include structures with higher thermal conductivity than the interposer 312. In certain embodiments, the interposer 312 may include aluminum (e.g., having a thermal conductivity in the range of 90 W / mK to 200 W / mK). In some embodiments, one or more heat spreaders 326 may include copper blocks (e.g., having a thermal conductivity of about 390 W / mK), heat pipes, and / or vapor chambers (e.g., having a thermal conductivity of about 2000 W / mK or more). Embodiments of one or more heat spreaders 326 may include one or more heat spreaders 326 soldered and / or press-fitted within the interposer 312, one or more heat spreaders 326 spring-biased over corresponding components of one or more electronic components 304 and thermally coupled to the interposer 312 via one of the curable TIMs 306 and / or a gap pad 317, one or more heat spreaders 326 directly interface with the cold plate 305 via the curable TIM 306 through a notch 322 in the interposer 312 (see, for example, the notch 322 in Figure 3B), and / or any suitable combination thereof.

[0065] Figures 4A and 4B provide diagrams of another modular processing system 400 according to an aspect of the present disclosure. In particular, Figure 4A provides an isometric view of the modular processing system 400, and Figure 4B provides a diagram of the processing system 400 with two separate modules.

[0066] As shown in Figures 4A and 4B, the modular processing system 400 includes a first electronic module 402, a second electronic module 404, and a frame 406. The first electronic module 402 includes a first cold plate 408, a first PCB 410, and a first cover 412. The second electronic module 404 includes a second cold plate 414, a second PCB 416, and a second cover 418. The first electronic module 402 can be removably fixed to the second electronic module 404 using fasteners, with the frame 406 positioned between them.

[0067] The first PCB 410 is positioned between the first cold plate 408 and the first cover 412 so that the first cold plate 408 and the first cover 412 can protect the first PCB 410. Similarly, the second PCB 416 is positioned between the second cold plate 414 and the second cover 418 so that the second cold plate 414 and the second cover 418 can protect the second PCB 416. As shown in the figure, the second cold plate 414 is positioned between the first PCB 410 and the second PCB 416.

[0068] The first cold plate 408 includes an inlet 420 configured to receive coolant from a heat exchanger (not shown). The second cold plate 414 includes an outlet 422 configured to return the coolant to the heat exchanger. The first cold plate 408 includes a first port 424, and the second cold plate 414 includes a second port 426. The first port 424 is configured to connect to the second port 426 to form a connection that provides a coolant path for the coolant to flow from the first cold plate 408 to the second cold plate 414. The first port 424 can be sealed to the second port 426 to prevent coolant leakage. In some embodiments, the first port 424 and the second port 426 are configured to form a seal when the first electronic module 402 is mounted to the second electronic module 404 (e.g., a push-to-seal connection).

[0069] The coolant design of the modular processing system 400 simplifies the coolant connection by allowing a single inlet 420 and a single outlet 422 to cool electronic components formed on both the first 410 and the second PCB 416. For example, the coolant can flow in series from the first cold plate 408 to the second cold plate 414.

[0070] The modular processing system 400 shown in Figures 4A and 4B eliminates the need to use curable TIM for module replacement, and therefore, replacement of either the first electronic module 402 or the second electronic module 404 can be performed at a service center. The modular approach to the modular processing system 400 is designed to prevent leakage through connections with O-ring seals at the first port 424 and the second port 426.

[0071] Although the modular processing system 400 in Figures 4A and 4B shows two modules, this design can be modified to have one or more additional modules stacked in series. Ports (for example, the first port 424 and the second port 426) can be provided between the cold plates of each adjacent module, allowing the coolant to flow in series through all the cold plates in the stack. Thus, the coolant can be supplied to the cold plates of the entire stack using a single inlet 420 and a single outlet 422. Advantageously, since the first cold plate 408 faces outward, the first PCB 410 can be protected without a separate cover piece.

[0072] Figure 5 provides a cross-sectional view of a modular processing system 500 according to one embodiment of the present disclosure. Similar to the modular processing system 400 of Figure 4, the modular processing system 500 of Figure 5 includes a first electronics module 502, a second electronics module 504, and a frame 506. The first electronics module 502 includes a first cold plate 508, a first PCB 510, and a first cover 512. The second electronics module 504 includes a second cold plate 514, a second PCB 516, and a second cover 518. The first electronics module 502 can be removably fixed to the second electronics module 504 using fasteners with the frame 506 positioned between them.

[0073] In contrast to the modular processing system 400 in Figure 4, in the modular processing system 500 in Figure 5, the first cold plate 508 of the first electronics module 502 is positioned adjacent to the second cold plate 514 of the second electronics module 504. Furthermore, the first port 524 of the first cold plate 508 and the second port 526 of the second cold plate 514 can be positioned on opposite sides of the first cold plate 408 and the second cold plate 414 with respect to a single inlet 420 and a single outlet 422, compared to the modular processing system 400 in Figure 4. This arrangement allows the first cold plate 508 to be coupled to the second cold plate 514 via pressure to seal the connection between the first port 524 and the second port 526. As shown in the embodiment of Figure 5, by arranging the first cold plate 508 and the second cold plate 514 adjacent to each other, the modular processing system 500 better isolates the electronic equipment from fluid connections (e.g., the first port 524 and the second port 526), ​​thereby preventing any dripping of coolant due to a seal failure from coming into contact with the electronic equipment located on the first PCB 510 or the second PCB 516.

[0074] Although the modular processing system 500 in Figure 5 shows two modules, this design can be modified to have one or more additional modules stacked in series. Ports (for example, the first port 524 and the second port 526) can be provided between the cold plates of each adjacent module, allowing the coolant to flow in series through all the cold plates in the stack. Thus, the coolant can be supplied to the cold plates of the entire stack using a single inlet 520 and a single outlet 522.

[0075] Figures 6A and 6B provide cross-sectional views of a modular processing system 600 according to another embodiment of the present disclosure. In particular, Figure 6A provides a side cross-sectional view of the modular processing system 600, and Figure 6B provides a top cross-sectional view of the modular processing system 600.

[0076] The modular processing system 600 in Figures 6A and 6B is similar to the modular processing system 500 in Figure 5, and includes additional features. Similar to the modular processing system 500 in Figure 5, the modular processing system 600 in Figures 6A and 6B includes a first electronic module 602, a second electronic module 604, and a frame 606. The first electronic module 602 includes a first cold plate 608, a first PCB 610, and a first cover 612. The second electronic module 604 includes a second cold plate 614, a second PCB 616, and a second cover 618. The first cold plate 608 includes a first port 624 configured to seal into the second port 626 of the second cold plate 614, similar to the first port 524 and second port 526 in Figure 5. The first electronic module 602 can be removably fixed to the second electronic module 604 with the frame 606 positioned between them using fasteners. In some embodiments, the fasteners can be snapped into place, which can help align the first electronic module 602 and the second electronic module 604.

[0077] As shown in Figures 6A and 6B, the modular processing system 600 further includes a male board-to-board connector 632 located on the first PCB 610 and a female board-to-board connector 634 located on the second PCB 616. The first cold plate 608 includes a first opening 636, and the second cold plate 614 includes a second opening 638. The first opening 636 and the second opening 638 allow the male board-to-board connector 632 and the female board-to-board connector 634 to connect to each other via the first cold plate 608 and the second cold plate 614. The male board-to-board connector 632 and the female board-to-board connector 634 provide an electrical connection between the first PCB 610 and the second PCB 616, enabling power and / or communication between them. The male and female board-to-board connectors 632 and 634 and / or the first and second ports 624 and 626 can be arranged to self-align in order to facilitate coupling between the first electronic module 602 and the second electronic module 604. In some embodiments, the alignment of the male and female board-to-board connectors 632 and 634 and / or the first and second ports 624 and 626 can cooperate by fasteners snapping into place to align the first electronic module 602 and the second electronic module 604.

[0078] Although the modular processing system 600 in Figure 6A shows two modules, this design can be modified to have one or more additional modules stacked in series. Ports (for example, the first port 624 and the second port 626) can be provided between the cold plates of each adjacent module, allowing the coolant to flow in series through all the cold plates in the stack. Thus, the coolant can be supplied to the cold plates of the entire stack using a single inlet 620 and a single outlet 622.

[0079] Figure 7 provides a cross-sectional view of yet another modular processing system 700 according to an aspect of the present disclosure. As shown in Figure 7, the modular processing system 700 includes a first electronics module 702, a second electronics module 704, and a cold plate frame 706.

[0080] The first electronic device module 702 includes a first cover 708, a first PCB 710, a first processor 712 disposed on the first PCB 710, a first curable TIM 714, and a first enclosure 716. The first enclosure 716 is configured to surround the first PCB 710 together with the first cover 708. The first enclosure 716 includes one or more bases and a plurality of fins 718. The fins 718 are configured to increase heat transfer from the first processor 712 to the coolant. The first processor 712 is thermally coupled to the first enclosure 716 via the first curable TIM 714. In some embodiments, the first processor 712, the first curable TIM 714, and the plurality of fins 718 are vertically aligned (e.g., vertically overlapping) to increase heat transfer to the coolant. The first electronics module 702 is configured to be removably attached to the cold plate frame 706 via one or more fasteners 720. The first electronics module 702 can be sealed to the cold plate frame 706 using the first O-ring 722.

[0081] The second electronic module 704 includes a second cover 724, a second PCB 726, a second processor 728 disposed on the second PCB 726, a second curable TIM 730, and a second enclosure 732. The second enclosure 732 is configured to surround the second PCB 726 together with the second cover 724. The second enclosure 732 includes one or more bases and a plurality of fins 734. The fins 734 are configured to increase heat transfer from the second processor 728 to the coolant. The second processor 728 is thermally coupled to the second enclosure 732 via the second curable TIM 730. In some embodiments, the second processor 728, the second curable TIM 730, and the plurality of fins 734 are vertically aligned (e.g., vertically overlapping) to increase heat transfer to the coolant. The second electronics module 704 is configured to be removably attached to the cold plate frame 706 via one or more fasteners 720. The second electronics module 704 can be sealed to the cold plate frame 706 using a second O-ring 736.

[0082] The cold plate frame 706 is configured to provide a coolant path that allows coolant to flow through the cold plate frame 706 and remove heat from there. Heat paths formed between components in the first electronic module 702 and the second electronic module 704 allow the cold plate frame 706 to cool the first electronic module 702 and the second electronic module 704. The coolant path is formed between the cold plate frame 706 and the first enclosure 716 of the first electronic module 702 and the second enclosure 732 of the second electronic module 704. The cold plate frame 706 includes an inlet 738 and an outlet (hidden behind the inlet 738 in Figure 7) configured to receive coolant from the heat exchanger and return the coolant to the heat exchanger. A coolant plug 740 may be provided at one end of the cold plate frame 706 and can be used to discharge coolant during use of the modular processing system 700.

[0083] Each of the first electronic module 702 and the second electronic module 704 can be removably fixed to the cold plate frame 706, allowing one or more of the first electronic module 702, the second electronic module 704, and the cold plate frame 706 to be replaced at a service center. Since coolant discharge is a typical task performed at a service center, servicing the modular processing system 700 can typically be done by service technicians without the need for specialized equipment specific to the manufacturing process.

[0084] Since each of the first electronic module 702 and the second electronic module 704 is directly coupled to a single cold plate frame 706, the embodiment in Figure 7 can provide substantially the same level of cooling as the processing system 100 in Figures 1A and 1B.

[0085] Figure 8 provides a cross-sectional view of yet another modular processing system 800 according to an aspect of the present disclosure. As shown in Figure 8, the modular processing system 800 includes a first electronics module 802 and a second electronics module 804.

[0086] The first electronic module 802 includes a first cover 806, a first PCB 808, a first processor 810, a first curable TIM 812, a first base 814, and a first frame 816. The second electronic module 804 includes a second cover 806, a second PCB 824, a second processor 826, a second curable TIM 828, a second base 830, and a second frame 832. The first PCB 808 can be fastened to the first frame 816, the second PCB 824 to the second frame 832, and the first frame 816 to the second frame 832 using a plurality of fasteners 820.

[0087] The first frame 816 and the second frame 832 are configured as segmented frames that form a coolant path when joined together. The first frame 816 and the second frame 832 can surround a coolant channel 834 that defines the coolant path. The modular processing system 800 allows the coolant to come into direct contact with the first frame 816 and the second frame 832, thereby increasing the cooling level.

[0088] Figure 9 provides a cross-sectional view of an alternative embodiment of modular processing system 900 compared to modular processing system 800 in Figure 8. Modular processing system 900 may have certain similar components to modular processing system 800 in Figure 8, and therefore the description of these components can also be applied to modular processing system 900 in Figure 9.

[0089] As shown in Figure 9, the first frame 816 includes a plurality of first fins 902, and the second frame 832 includes a plurality of second fins 904. The first frame 816 and the second frame 832 can form a cold plate when assembled. In this embodiment, since a separate cold plate is not included, parts can be removed from the modular processing system 900, reducing manufacturing costs.

[0090] In the embodiments shown in Figures 8 and 9, the mounting of the first PCB 808 and the second PCB 824 to the first frame 816 and the second frame 832 in combination with the use of the first base 814 and the second base 830 can contribute to the control of z height and flatness.

[0091] Figure 10 shows a method 1000 for replacing a module in a modular processing system according to an embodiment of the present disclosure. In block 1010, the method 1000 includes identifying that one of the first electronic module and the second electronic module of the modular processing system is faulty. The first electronic module includes a first printed circuit board (PCB), and the second electronic module includes a second PCB. The first electronic module is fixed to the second electronic module. The modular processing system further includes a first cold plate configured to cool the first PCB and the second PCB.

[0092] In block 1020, method 1000 includes removing the first electronic module from the second electronic module.

[0093] In block 1030, method 1000 includes replacing one identified of the first electronic equipment modules with a second electronic equipment module.

[0094] In block 1040, method 1000 includes using fasteners to attach one replaced part of the first electronic equipment module from the second electronic equipment module to the other part of the first electronic equipment module from the second electronic equipment module.

[0095] In some embodiments, the first cold plate is located between the first electronic module and the second electronic module. The first cold plate may be provided in the first electronic module and / or the second electronic module.

[0096] In some embodiments, the method also includes applying one or more gap pads to the interposer of the second electronic module using fasteners before attaching one of the replaced first electronic modules from the second electronic module to the other of the first electronic modules from the second electronic module. In some embodiments, the method also includes removing any residue from one of the replaced gap pads of the first electronic module from the second electronic module using an alcohol wipe.

[0097] In some embodiments, attaching one of the replaced electronic components from the second electronic component module to the other of the first electronic component module from the second electronic component module using fasteners includes clamping the interposer of the second electronic component to the first cold plate at a pressure exceeding a threshold pressure.

[0098] In some embodiments, the modular processing system further includes a second cold plate. The first cold plate may be provided in the first electronic module, and the second cold plate may be provided in the second electronic module. Attaching one of the replaced parts of the first electronic module from the second electronic module to the other part of the first electronic module from the second electronic module using fasteners may include attaching the first electronic module to the second electronic module.

[0099] In some embodiments, the first cold plate includes a first port, and the second cold plate includes a second port. The first port may be configured to connect to the second port to form a connection that provides a coolant path for coolant to flow from the first cold plate to the second cold plate. A seal can be formed between the first port and the second port by attaching the first electronic module to the second electronic module.

[0100] In some embodiments, the method further includes coupling a male board-to-board connector of the first PCB to a female board-to-board connector of the second PCB in order to provide an electrical connection between the first PCB and the second PCB. conclusion

[0101] The foregoing disclosure is not intended to limit this disclosure to the exact form or specific field of use disclosed. Therefore, various alternative embodiments and / or modifications to this disclosure, whether expressly described or implied herein, are possible in light of this disclosure. Having described embodiments of this disclosure in this manner, those skilled in the art will recognize that modifications in form and detail can be made without departing from the scope of this disclosure. Therefore, this disclosure is limited only by the claims.

[0102] The above specification describes the disclosure with reference to specific embodiments. However, as those skilled in the art will understand, the various embodiments disclosed herein can be modified or implemented in various other ways without departing from the spirit and scope of the disclosure. Therefore, this description should be considered illustrative and is intended to teach those skilled in the art how to make and use various embodiments of the disclosed ventilation assemblies. It should be understood that the forms of disclosure shown and described herein should be interpreted as representative embodiments. Equivalent elements, materials, processes, or steps may be substituted for those representatively shown and described herein. Furthermore, certain features of the disclosure can be used independently of the use of other features, so as will become apparent to those skilled in the art after benefiting from this description of the disclosure. Expressions such as “including,” “comprising,” “incorporating,” “consisting of,” “have,” and “is” used to describe and claim this disclosure are intended to be interpreted in a non-exclusive manner, that is, to allow for the existence of items, components, or elements not expressly described herein. References to the singular form should also be interpreted as relating to the plural form.

[0103] Furthermore, the various embodiments disclosed herein should be interpreted in an illustrative and descriptive sense and not in any way as limiting the disclosure. All references to joinings (e.g., added, attached, combined, connected, etc.) are used solely to aid the reader's understanding of the disclosure and do not imply any limitation in terms of the arrangement, orientation, or use of the systems and / or methods disclosed herein. Therefore, where there is a reference to joining, it should be interpreted broadly. Furthermore, such references to joinings do not necessarily mean that the two elements are directly connected to each other. Furthermore, without limitation, all numerical terms such as “first,” “second,” “third,” “primary,” “secondary,” “principal,” or any other ordinary and / or numerical terms should also be interpreted solely as identifiers to aid the reader's understanding of the various elements, embodiments, variations, and / or modifications of the disclosure, and in particular, no limitation shall arise in terms of the order or preference of any element, embodiment, variation, and / or modification over another element, embodiment, variation, and / or modification.

[0104] It will be understood that, depending on the specific application, one or more of the elements shown in the drawings / figures may be implemented in a more separated or integrated manner, or in certain cases may be removed or rendered as non-functional.

Claims

1. A modular processing system, A first electronic device module comprising a first printed circuit board (PCB) and a first electronic component on the first PCB, A second electronic device module comprising a second PCB and a second electronic component on the second PCB, A cold plate is positioned between the first electronic device module and the second electronic device module and configured to circulate a coolant to cool the first PCB and the second PCB, Equipped with, At least a portion of the cold plate is provided in the first electronic device module, A modular processing system in which the first electronic device module is detachably fixed to the second electronic device module.

2. The cold plate is attached to the first PCB using one or more thermal interface materials (TIMs) such that a thermal path is formed between the cold plate and the first electronic component on the first PCB. The modular processing system according to claim 1, wherein the second electronic device module further comprises an interposer mounted on the second PCB, the interposer being thermally coupled to the first cold plate.

3. The modular processing system according to claim 2, further comprising one or more thermal gap pads for coupling the second electronic module to the cold plate, wherein the one or more thermal gap pads are configured to provide a thermal interface between the second electronic component on the second PCB and the cold plate.

4. The modular processing system according to claim 2, wherein the interposer is in direct contact with the cold plate, and the interposer is clamped to the cold plate.

5. The modular processing system according to claim 2, wherein the interposer defines a notch and a thermal path between the second electronic component on the second PCB and the cold plate through the notch.

6. The interposer is coupled to the cold plate via one or more gap pads, and the modular processing system is The modular processing system according to claim 2, further comprising a heat spreader thermally coupled to the interposer, the heat spreader having a higher thermal conductivity than the interposer, and configured to transfer heat from a second electronic component on the second PCB to one or more gap pads.

7. It is further equipped with a second cold plate, The modular processing system according to claim 1, wherein the first electronic device module includes the cold plate, and the second electronic device module includes the second cold plate.

8. The modular processing system according to claim 7, wherein the cold plate includes a first port, the second cold plate includes a second port, and the first port is connected to the second port to provide a coolant path for the coolant to flow from the cold plate to the second cold plate.

9. The cold plate includes a first opening, and the second cold plate includes a second opening. The first PCB includes a male board-to-board connector, and the second PCB includes a female board-to-board connector. The modular processing system according to claim 7, wherein the male board-to-board connector and the female board-to-board connector are configured to provide an electrical connection between the first PCB and the second PCB.

10. The modular processing system according to claim 1, wherein the first electronic device module and the second electronic device module are directly coupled to the cold plate.

11. The modular processing system according to claim 1, wherein the cold plate comprises a first frame and a second frame configured to be attached to each other so as to form a coolant path through which the coolant flows.

12. The modular processing system according to claim 1, wherein the first electronic component on the first PCB is configured to perform at least a portion of calculations associated with autonomous vehicle functions, and the second electronic component on the second PCB is configured to perform at least a portion of calculations associated with infotainment.

13. A method for replacing modules in a modular processing system, Detaching a first electronic device module from a second electronic device module, wherein the first electronic device module comprises a first printed circuit board (PCB), the second electronic device module comprises a second PCB, the first electronic device module is fixed to the second electronic device module before the detaching, and the modular processing system comprises a cold plate configured to cool the first PCB and the second PCB. Attaching a new first electronic device module to the second electronic device module using one or more fasteners, Methods that include...

14. The method according to claim 13, further comprising identifying that the first electronic device module had failed prior to installation.

15. The method of claim 13, further comprising removing the modular processing system from the vehicle before the aforementioned removal.

16. The method according to claim 13, wherein the modular processing system is installed in the vehicle before being removed.

17. The method according to claim 13, wherein the cold plate is disposed between the first electronic device module and the second electronic device module.

18. The method according to claim 13, further comprising applying one or more gap pads to the interposer of the modular processing system before installation.

19. The modular processing system further includes a second cold plate, The cold plate is provided in the first electronic device module, and the second cold plate is provided in the second electronic device module. The method according to claim 13, wherein the mounting includes mounting the first electronic device module to the second electronic device module.

20. A modular processing system, A first electronic device module comprising a first PCB and a first electronic component on the first PCB, A second electronic device module comprising a second PCB and a second electronic component on the second PCB, A cold plate configured to circulate a coolant to cool the first PCB and the second PCB, Equipped with, The cold plate comprises a part of the first electronic device module and a part of the second electronic device module, A modular processing system in which the first electronic device module is detachably attached to at least one of the second electronic device module or the cold plate by one or more fasteners.

Images