Light-emitting device

Abstract

To improve the noise immunity of the light-emitting device. [Solution] This light-emitting device comprises a substrate made of ceramic material and having through holes, a first wiring arranged on the upper surface of the substrate, a second wiring arranged on the lower surface of the substrate, a conductive member arranged in the through holes and connecting the first wiring and the second wiring, a light-emitting element arranged on and connected to the first wiring, and an integrated circuit arranged on and connected to the first wiring.

Description

[Technical Field]

[0001] This disclosure relates to a light-emitting device. [Background technology]

[0002] There are light-emitting devices in which light-emitting elements and electronic components are mounted on a substrate. For example, a vehicle light fixture may have a wiring board with a wiring pattern mounted on a metal base, various circuit components that constitute a current control circuit and input connectors mounted on the wiring board, and an LED chip mounted via an auxiliary substrate on a protrusion of the metal base surrounded by a notch in the wiring board. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2010-113849 [Overview of the project] [Problems that the invention aims to solve]

[0004] This disclosure aims to improve the noise immunity of light-emitting devices. [Means for solving the problem]

[0005] A light-emitting device according to one embodiment of the present disclosure comprises a substrate made of a ceramic material and having through holes; a first wiring arranged on the upper surface of the substrate; a second wiring arranged on the lower surface of the substrate; a conductive member arranged in the through holes and connecting the first wiring and the second wiring; a light-emitting element arranged on and connected to the first wiring; and an integrated circuit arranged on and connected to the first wiring. [Effects of the Invention]

[0006] According to one embodiment of the present disclosure, the noise immunity of the light-emitting device can be improved. [Brief explanation of the drawing]

[0007] [Figure 1] It is a perspective view illustrating the light-emitting device according to the first embodiment. [Figure 2] It is a partial cross-sectional view taken along line II-II of FIG. 1. [Figure 3] It is a top view illustrating the light-emitting device according to the first embodiment. [Figure 4] It is a bottom view illustrating the light-emitting device according to the first embodiment. [Figure 5] It is a partial cross-sectional view taken along line V-V of FIG. 3. [Figure 6] It is a circuit diagram of the light-emitting device according to the first embodiment. 1] [Figure 7] It is a diagram for explaining the ground delay. [Figure 8] It is a diagram showing the measurement result of the illuminance change rate in the BCI test. [Figure 9] It is a top view illustrating the light-emitting device according to Modification 1 of the first embodiment. [Figure 10] It is a bottom view illustrating the light-emitting device according to Modification 2 of the first embodiment. [Figure 11] It is a bottom view illustrating the light-emitting device according to Modification 3 of the first embodiment. [Figure 12] It is a bottom view illustrating the light-emitting device according to Modification 4 of the first embodiment. [Figure 13] It is a top view illustrating the light-emitting device according to the second embodiment. [Figure 14] It is a top view of the light-emitting device according to the second embodiment, in which the illustration of the light source, the frame member, and the electronic components is omitted, and the position of the frame member is shown by a broken line. [Figure 15] It is a bottom view illustrating the light-emitting device according to the second embodiment. [Figure 16] It is a circuit diagram of the light-emitting device according to the second embodiment. [Figure 17] It is a top view illustrating the light-emitting device according to Modification 1 of the second embodiment. [Figure 18]The figure is a top view of a light-emitting device according to Modification 1 of the second embodiment, with the illustration of the light source, the frame member, and the electronic components omitted, and the position of the frame member illustrated by a dashed line. [Figure 19] The figure is a bottom view illustrating a light-emitting device according to Modification 1 of the second embodiment.

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (for example, "up", "down", and other terms including those terms) are used as necessary. However, the use of those terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of those terms. Also, parts denoted by the same reference numerals in a plurality of drawings indicate the same or equivalent parts or members.

[0009] Also, the embodiments shown below exemplify light-emitting devices and the like for embodying the technical idea of the present invention, and do not limit the present invention thereto. Also, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention only thereto without specific description, but are intended to be illustrative. Also, the content described in one embodiment is applicable to other embodiments and modifications. Also, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid excessive complexity of the drawings, schematic diagrams with some elements omitted or end views showing only the cut surfaces as cross-sectional views may be used. In this specification, "rectangle" means that a variation of ±5 degrees is allowed for the angles of the four corners, and includes shapes approximating these rectangles such as chamfered or rounded corners of the rectangle. Also, in this specification, "parallel" includes not only the case where two straight lines, sides, surfaces, etc. do not intersect even when extended, but also the case where the angle formed by two straight lines, sides, surfaces, etc. intersects within a range of 10° or less. Also, in this specification, "connection" means electrical connection unless otherwise specified.

[0010] <First Embodiment> Figure 1 is a perspective view illustrating a light-emitting device according to the first embodiment. Figure 2 is a partial cross-sectional view taken along line II-II in Figure 1. Figure 3 is a top view illustrating a light-emitting device according to the first embodiment. In Figure 3, for convenience, the light source, frame member, and electronic components are omitted from the illustration, and the position of the frame member is indicated by a dashed line. Figure 4 is a bottom view illustrating a light-emitting device according to the first embodiment. Figure 5 is a partial cross-sectional view taken along line VV in Figure 3. Figure 6 is a circuit diagram of the light-emitting device according to the first embodiment.

[0011] In each drawing, for reference, mutually orthogonal X, Y, and Z axes are shown as needed. The direction parallel to the X-axis is called the first direction X, the direction parallel to the Y-axis is called the second direction Y, and the direction parallel to the Z-axis is called the third direction Z. Furthermore, in the first direction X, the direction the arrow is pointing is called the +X direction, and the opposite direction of the +X direction is called the -X direction. In the second direction Y, the direction the arrow is pointing is called the +Y direction, and the opposite direction of the +Y direction is called the -Y direction. In the third direction Z, the direction the arrow is pointing is called the +Z direction, and the opposite direction of the +Z direction is called the -Z direction. However, these do not restrict the orientation of the light-emitting device when it is in use, and the orientation of the light-emitting device is arbitrary.

[0012] As shown in Figures 1 to 6, the light-emitting device 1 comprises a base material 10, a light source 20, a frame member 30, and a circuit 50. The light source 20, the frame member 30, and the circuit 50 are arranged on the base material 10. The frame member 30 is arranged around the light source 20. The light-emitting device 1 can be used, for example, in an on-board lighting device such as a tail lamp and / or stop lamp for automobiles, motorcycles, etc.

[0013] The base material 10 is a flat plate-shaped member having insulating properties. The base material 10 has an upper surface 10a and a lower surface 10b. Examples of materials that make up the base material 10 include ceramic materials such as aluminum oxide, aluminum nitride, and silicon nitride, and insulating resin materials such as phenolic resin, epoxy resin, polyimide resin, BT resin, and polyphthalamide. In particular, it is preferable that the base material 10 is made of a ceramic material such as aluminum oxide, aluminum nitride, or silicon nitride, which has a relatively high dielectric constant. This allows the first wiring 11 and the second wiring 12, which will be described later, to capacitively couple, making it easier to obtain a relatively large capacitance. The base material 10 is, for example, rectangular in plan view. In the illustrated example, the upper surface 10a and the lower surface 10b of the base material 10 are flat surfaces, and the first side 10s of the upper surface 10a is parallel to the first direction X. Also, the normal to the upper surface 10a is parallel to the third direction Z. Note that the shape of the base material 10 is not limited to a rectangle in plan view. Unless otherwise specified, a plan view refers to viewing the light-emitting device 1 from the direction normal to the upper surface 10a of the substrate 10.

[0014] The upper surface 10a of the substrate 10 has a first wiring 11 and a land 14 for mounting components. The land 14 is part of the first wiring 11, but the portion of the first wiring 11 that is specifically connected to an electronic component is referred to as the land 14. Protective glass is provided on the upper surface 10a of the substrate 10, covering the first wiring 11 and exposing the land 14. Alternatively, the protective glass may be omitted, leaving the portions of the first wiring 11 other than the land 14 exposed.

[0015] The second wiring 12 is arranged on the lower surface 10b of the base material 10. As shown in Figure 4, the second wiring 12 can be arranged on almost the entire surface of the lower surface 10b of the base material 10, excluding the outer edge.

[0016] As shown in Figure 5, the base material 10 has a through hole 10x that penetrates from the upper surface 10a to the lower surface 10b. The conductive member 13 is placed inside the through hole 10x and connects the first wiring 11 and the second wiring 12. In the illustrated example, the upper surface of the conductive member 13 exposed from the through hole 10x is in contact with the lower surface of the first wiring 11, and the lower surface of the conductive member 13 exposed from the through hole 10x is in contact with the upper surface of the second wiring 12. The first wiring 11 and the second wiring 12 may also be provided with through holes that communicate with the through hole 10x. In that case, the conductive member 13 may extend from inside the through hole 10x into the through holes provided in the first wiring 11 and the second wiring 12.

[0017] In the illustrated example, the base material 10 has three through holes 10x, but the base material 10 may have one, two, or four or more through holes 10x. The base material 10 may not even have through holes 10x. In this case, for example, the first wiring 11 and the second wiring 12 can be connected by a conductive member placed on the side surface of the base material 10.

[0018] The light-emitting device 1 may have a plurality of connection terminals connected to the circuit 50. In the examples of Figures 1 and 3, the light-emitting device 1 has a power terminal 15a located on the upper surface 10a of the substrate 10 and a ground terminal 15b located on the upper surface 10a of the substrate 10 as connection terminals.

[0019] As shown in Figures 1 and 3, when the power terminal 15a and ground terminal 15b are arranged parallel to the first direction X along the first side 10s of the upper surface 10a of the substrate 10, it is preferable that the maximum width of the second wiring 12 in the first direction X is greater than the distance between the centers of the power terminal 15a and the ground terminal 15b in the first direction X when viewed from above. When viewed from below, the area of ​​the second wiring 12 is preferably 70% or more of the area of ​​the lower surface 10b, more preferably 80% or more, and even more preferably 90% or more. The larger the area of ​​the second wiring 12, the better the noise immunity of the light-emitting device 1 can be. Details of noise immunity will be described later.

[0020] The light source 20 is positioned above the upper surface 10a of the substrate 10. The light source 20 includes, for example, a plurality of light-emitting elements 21 and a light-transmitting member 22. The plurality of light-emitting elements 21 may be arranged in a matrix such that they form a rectangular light-emitting region as a whole in plan view. In the example of Figure 1, four rectangular light-emitting elements 21a, 21b, 21c, and 21d are arranged in a 2x2 grid such that they form a rectangle as a whole in plan view. The light-emitting elements 21a to 21d are connected to the first wiring 11. The light-emitting elements 21a to 21d may be connected in series with each other.

[0021] The light-transmitting member 22 is located inside the outer edge of the frame member 30 in a plan view and covers the light-emitting elements 21a to 21d. The frame member 30 is placed on the upper surface 10a of the base material 10 and is positioned around the light source 20 in a plan view.

[0022] Circuit 50 is composed of multiple electronic components. The electronic components that make up circuit 50 include a resistor 50a, a MOSFET 50b, a capacitor 50c, a Zener diode 50d, a Zener diode 50e, a resistor 50f, a capacitor 50g, a capacitor 50h, a resistor 50i, a resistor 50j, a resistor 50k, an integrated circuit 50l, a resistor 50m, a thermistor 50n, a capacitor 50o, and a capacitor 50p. Circuit 50 may also include other electronic components.

[0023] The electronic components constituting the circuit 50 are arranged on and connected to the first wiring 11, which is located on the upper surface 10a of the substrate 10. Each electronic component is mounted on a corresponding component mounting land 14. For example, each electrode of the electronic component is connected to the component mounting land 14 by a bonding material such as solder. The electronic components may also be connected to the land 14 via bonding wires.

[0024] Furthermore, it is preferable that the conductive member 13 is not in contact with the bonding material used to join the electronic component to the first wiring. This reduces the risk of increased resistance in the conductive member 13 by preventing the metal atoms of the conductive member 13 from diffusing into the bonding material used to join the electronic component. As a result, the first wiring 11 and the second wiring 12 can be connected with low impedance using the conductive member 13.

[0025] As shown in Figures 3 and 6, the first wiring 11 may include a ground wire 11G connected to the ground terminal 15b, a power wire 11B connected to the power terminal 15a, and a signal wire 11S connected to the integrated circuit 50l. The signal wire 11S may also connect electronic components other than the integrated circuit 50l.

[0026] At least a portion of each of the ground wire 11G, power wire 11B, and signal wire 11S overlaps with the second wire 12 in a plan view. Alternatively, all of each of the ground wire 11G, power wire 11B, and signal wire 11S may overlap with the second wire 12 in a plan view. For convenience, in Figure 3, the ground wire 11G is shown as a light dot pattern, the land 14 as a dark dot pattern, and the power wire 11B and signal wire 11S are shown as diagonal lines with different slope directions.

[0027] The ground wiring 11G may include a first ground wiring 11G1 connecting the ground terminal 15b and the integrated circuit 50l. It is preferable that the conductive member 13 is located in a position that overlaps with the first ground wiring 11G1 in a plan view. This allows the second wiring 12 to be at the same potential as the first ground wiring 11G1, thereby stabilizing the ground potential of the integrated circuit 50l. For example, in Figure 1, the portion connecting the ground terminal 15b and the MOSFET 50b is part of the first ground wiring 11G1, and the three conductive members 13 are located in a position that overlaps with this portion of the first ground wiring 11G1 in a plan view. This makes it easier for the second wiring 12 to be at the same potential as the first ground terminal 11b, thereby stabilizing the ground potential of the integrated circuit 50l. The portion connecting the ground terminal 15b and the MOSFET 50b corresponds to the position indicated by the dashed line A in the circuit diagram of Figure 6.

[0028] As described above, in the light-emitting device 1, the base material 10 is made of ceramic material, the first wiring 11 is arranged on the upper surface 10a of the base material 10, and the second wiring 12 is arranged on the lower surface 10b. The first wiring 11 and the second wiring 12 are connected by a conductive member 13. Since the first wiring 11 and the second wiring 12 have opposing portions with the base material 10 in between, the first wiring 11 and the second wiring 12 are capacitively coupled. Because the base material 10 is made of ceramic material, the first wiring 11 and the second wiring 12 are more easily capacitively coupled, and a relatively large capacitance can be obtained. Therefore, for example, noise entering the first wiring 11 from the power terminal 15a can be discharged to the second wiring 12 side. This improves the noise immunity of the light-emitting device 1. For example, if noise enters the first wiring 11 from the power terminal 15a, the voltage applied to the integrated circuit 50l will fluctuate, and the integrated circuit 50l may not be able to properly drive the light-emitting elements 21a to 21d, which may cause a change in illuminance. Therefore, by diverting noise entering the first wiring 11 to the second wiring 12, changes in illuminance can be reduced.

[0029] In a plan view, it is preferable that the area of ​​the portion of the first wiring 11 where no electronic components are placed is larger than the area of ​​the portion of the first wiring 11 where electronic components are placed. In particular, it is preferable to enlarge the area of ​​the ground wiring 11G. Specifically, it is preferable that the area of ​​the ground wiring 11G is 40% or more of the area of ​​the lower surface 10b of the substrate 10. By enlarging the area of ​​the ground wiring 11G, it is possible to strengthen its role as a ground plane and improve the shielding effect on the upper surface 10a side of the substrate 10. Furthermore, it is preferable that the thickness of the ground wiring 11G is 10 μm or more and 105 μm or less. A thickness of 10 μm or more for the ground wiring 11G reduces the impedance of the ground wiring 11G, improving noise immunity. Also, a thickness of 105 μm or less for the ground wiring 11G improves the heat dissipation of the light-emitting device 1.

[0030] In a plan view, it is preferable that the first area of ​​the substrate 10 where the first wiring 11 and the second wiring 12 overlap is larger than the second area of ​​the substrate 10 where the first wiring 11 and the second wiring 12 do not overlap. It is preferable that the first area is 50% or more of the sum of the first area and the second area. By increasing the first area, the capacitance of the capacitor formed by the first wiring 11, the substrate 10, and the second wiring 12 can be increased. This makes it easier to dissipate noise entering the first wiring 11 from the power terminal 15a to the second wiring 12, thereby further improving the noise immunity of the light-emitting device 1.

[0031] Furthermore, in the light-emitting device 1, if the first wiring 11 includes the ground wiring 11G and the second wiring 12 is connected to the ground wiring 11G by a conductive member 13, ground delay due to noise can be reduced. Figure 7 is a diagram illustrating ground delay. For example, suppose a voltage of +B shown in Figure 7 is input from the power terminal 15a. The voltage of +B fluctuates periodically due to noise. In this case, if the voltage at the ground terminal 15b is GND(1) with the same amplitude and phase as +B, then +B relative to GND(1) will be a constant voltage V1, and no voltage fluctuation will occur.

[0032] In contrast, when noise causes a ground delay, the voltage at the ground terminal 15b becomes GND(2) with a different phase from +B, and the voltage V2 of +B relative to GND(2) becomes inconsistent. In other words, voltage fluctuations occur. The ground delay is thought to be caused by an impedance mismatch between the wiring connected to the power terminal 15a and the wiring connected to the ground terminal 15b. When the fluctuating voltage V2 is applied to the integrated circuit 50l, when the voltage V2 decreases, the integrated circuit 50l cannot properly drive the light-emitting elements 21a to 21d, resulting in changes in illumination. According to the inventors' investigation, the ground delay due to noise is thought to occur when the second wiring 12 is not placed on the lower surface 10b of the substrate 10, and can be reduced by placing the second wiring 12 on the lower surface 10b of the substrate 10. The results of tests conducted by the inventors are shown below.

[0033] The inventors conducted a BCI test in accordance with ISO 11452-4. The BCI test evaluates the resistance of automotive products such as light-emitting devices to magnetic field noise. In this test, the rate of change in illuminance of the light-emitting device was measured when magnetic field noise in the range of 1 MHz to 500 MHz was simultaneously induced at the power terminal and ground terminal of the light-emitting device. For the measurement, sample 1, which has the same structure as light-emitting device 1 shown in Figures 1 to 6, and sample 2, which is light-emitting device 1 from which the second wiring 12 and conductive member 13 have all been removed, were used.

[0034] Figure 8 shows the measurement results of the illuminance change rate in the BCI test. As shown in Figure 8, in sample 1, which has the second wiring 12, no change in illuminance occurred even when magnetic field noise was induced in the range of 1 MHz to 500 MHz. In contrast, in sample 2, which does not have the second wiring 12, a large change in illuminance of more than 20% was observed when magnetic field noise of 150 MHz or less was induced, and a small change in illuminance of a few percent was observed even when magnetic field noise of 200 MHz or more was induced. In sample 2, it is thought that the induction of magnetic field noise caused a ground delay, which reduced the voltage applied to the integrated circuit 50l, preventing the integrated circuit 50l from properly driving the light-emitting elements 21a to 21d, resulting in the change in illuminance. On the other hand, in Sample 1, by placing the second wiring 12 on the lower surface 10b of the substrate 10, the ground wiring 11G connected to the ground terminal 15b became low impedance, and the capacitive coupling between the first wiring 11 and the second wiring 12 allowed noise to escape to the second wiring 12 side, thereby reducing ground delay due to noise and preventing any change in illuminance.

[0035] The following describes each component of the light-emitting device 1.

[0036] (Base material 10) When the base material 10 is rectangular in plan view, the length of each side of the top surface 10a and the bottom surface 10b can be, for example, 10 mm to 30 mm. The thickness of the base material 10 can be, for example, 0.1 mm to 2.0 mm. The top surface 10a and the bottom surface 10b may also be circular or polygonal.

[0037] (First wiring 11, second wiring 12, conductive member 13, land 14) The first wiring 11, the second wiring 12, and the land 14 may be made of a conductive material such as gold, silver, copper, or aluminum. The conductive member 13 may be made of a conductive material such as copper paste or silver paste. In a plan view, the width of the ground wiring 11G in the first direction X and the width in the second direction Y are preferably 1.5 mm or more. This reduces the impedance of the ground wiring 11G, thereby further improving the noise immunity of the light-emitting device 1. In a plan view, the total area of ​​the conductive member 13 is 0.03 mm². 2 The above is preferable. As a result, the conductive member 13 has a low impedance, and the first wiring 11 and the second wiring 12 are connected via the low-impedance conductive member 13, thereby further improving the noise immunity of the light-emitting device 1.

[0038] (Power terminal 15a, ground terminal 15b) The power terminal 15a and the ground terminal 15b may be arranged, for example, along the first side 10s located on the outer edge of the upper surface 10a of the base material 10. The power terminal 15a and the ground terminal 15b may be provided, for example, around a through hole 10y that penetrates the base material 10. The power terminal 15a and the ground terminal 15b may be made of a conductive material such as a metal such as gold, silver, copper, or aluminum. Three or more connection terminals may be arranged in a plan view, for example, along the outer edge of the upper surface 10a.

[0039] (Emitting elements 21a~21d) The light-emitting elements 21a to 21d are mounted on land 14 for component mounting. Preferably, the light-emitting elements 21a to 21d are flip-chip mounted on first wiring 11 located on the upper surface 10a of the substrate 10. In flip-chip mounting, the electrodes of the light-emitting elements 21a to 21d and the land 14 on the substrate 10 can be electrically joined using bonding materials such as eutectic solder, conductive paste, or bumps.

[0040] The light-emitting elements 21a to 21d are, for example, light-emitting diodes. The specific configuration of the light-emitting elements 21a to 21d is arbitrary as long as they can emit light of a predetermined wavelength. For example, the light-emitting elements 21a to 21d may be LED chips housed in a package, or they may be individual LED chips (bare chips). Preferably, the light-emitting elements 21a to 21d are bare chips flip-chip mounted on the substrate 10. This makes it possible to miniaturize the light-emitting device 1.

[0041] The wavelength of light emitted from the light-emitting elements 21a to 21d is set appropriately according to the application of the light-emitting device 1. The multiple light-emitting elements 21 are, for example, blue light-emitting elements that emit blue light. In this case, the light-emitting elements 21a to 21d are, for example, nitride semiconductors (In X Al Y Ga 1-X-Y N includes (0 ≤ X, 0 ≤ Y, X + Y ≤ 1). If the light-emitting elements 21a to 21d are nitride semiconductor light-emitting elements that emit blue light, the forward voltage of the light-emitting elements 21a to 21d is, for example, 2.4V or higher.

[0042] (Translucent member 22) The upper surface of the light-transmitting member 22 is approximately rectangular. This allows the frame member 30 to be arranged in a rectangular frame shape surrounding the light source 20, so that multiple electronic components, which are rectangular in plan view, can be efficiently arranged along the frame member 30 on the upper surface 10a of the base material 10.

[0043] The upper surface of the translucent member 22 is located above the upper surface of the frame member 30 and constitutes the light-emitting surface of the light source 20 (i.e., the light-emitting surface of the light-emitting device 1). The translucent member 22 is translucent so that light emitted from the light-emitting elements 21a to 21d can be transmitted through it. The translucent member 22 includes, for example, a resin. Examples of resins include known translucent resins such as silicone resin and epoxy resin. Among these, silicone resins with excellent reliability (specifically, phenyl silicone resin and dimethyl silicone resin) can be suitably used.

[0044] The light-transmissive member 22 may be a wavelength conversion member containing a phosphor. The phosphor is excited by the light emitted by the light-emitting elements 21a to 21d and emits light having a wavelength different from the wavelength of the light emitted by the light-emitting elements 21a to 21d. As an example, when the light-emitting elements 21a to 21d emit blue light, the wavelength conversion member may contain a red phosphor. Thereby, in the light-emitting device 1, the wavelength conversion member can be excited by blue light and emit red light. In this configuration, since the driving voltage is higher compared to the configuration of using a red light-emitting element to emit red light, the light-emitting elements 21a to 21d themselves are less affected by noise.

[0045] Examples of the phosphor include yttrium aluminum garnet-based phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 "" :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride-based phosphors, LSN-based phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Alx )F 6-x :Mn Here, x satisfies 0 < x < 1. ) or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 Here, FA and MA represent formamidinium and methylammonium, respectively.), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) can be used.

[0046] [[ID=*6]] (Frame member 30) The frame member ۳۰ preferably has light-shielding properties. The frame member 30 includes, for example, a resin. In order to impart light-shielding properties to the frame member 30, a resin obtained by adding a pigment to the light-transmitting resin exemplified by the light-transmitting member 22 can be used. In the frame member 30, in order to enhance light reflectivity, a filler such as a white pigment may be added to the resin. As the filler, titanium oxide, aluminum oxide, zinc oxide, barium carbonate, barium sulfate, boron nitride, aluminum nitride, glass filler, etc. can be preferably used. Further, the frame member 30 may further contain a black pigment such as carbon black, graphite, titanium black, etc.

[0047] (Circuit 50) The circuit 50 includes a drive circuit 51 that drives the light-emitting element 21 included in the light source 20, and a protection circuit 52 that protects the drive circuit 51 and the light-emitting element 21. In the example of FIG. 6, the drive circuit 51 is composed of a resistor 50i, a resistor 50j, a resistor 50k, an integrated circuit 50l, a resistor 50m, and a thermistor 50n.

[0048] The light-emitting elements 21a to 21d are connected in series to the output side of the integrated circuit 50l. It is preferable that the integrated circuit 50l is supplied with voltage from an external source without the need for active elements that cause voltage drops (such as rectifier diodes). This allows more of the externally supplied voltage to be used to drive the light-emitting elements 21a to 21d. When the light-emitting elements 21a to 21d are blue light-emitting diodes, the forward voltage is relatively high, so it is particularly significant to supply voltage to the integrated circuit 50l from an external source without the need for active elements. By including the integrated circuit 50l, the drive circuit 51 can control the current flowing through the light-emitting elements 21a to 21d.

[0049] Resistors 50i, 50j, and 50k set the operating voltage of the integrated circuit 50l. Resistor 50m sets the output current of the integrated circuit 50l. Thermistor 50n detects the ambient temperature of the integrated circuit 50l. Based on the temperature detected by thermistor 50n, the integrated circuit 50l can control the current flowing through the light-emitting elements 21a to 21d, for example, when the temperature of the substrate 10 rises.

[0050] The drive circuit 51 may have a first operating mode in which all of the series-connected light-emitting elements 21a to 21d are illuminated simultaneously, and a second operating mode in which the series-connected light-emitting elements 21a, 21b, and 21c are illuminated, but the light-emitting element 21d is not illuminated. The second operating mode is effective, for example, when the voltage applied between the power supply terminal 15a and the ground terminal 15b drops, making it difficult to drive all four light-emitting elements simultaneously.

[0051] In the example shown in Figure 6, the protection circuit 52 consists of a Zener diode 50e connected between the power supply terminal 15a and the ground terminal 15b. The protection circuit 52 may also consist of multiple Zener diodes connected in series with reverse polarity. The protection circuit 52 is connected in parallel with the drive circuit 51. The protection circuit 52 is located on the input side of the drive circuit 51. The protection circuit 52 protects the integrated circuit 50l and the light-emitting element 21, etc., from overvoltage.

[0052] From the viewpoint of supplying the necessary voltage to the drive circuit 51 to drive the light-emitting element 21, and from the viewpoint of protecting the drive circuit 51 and the light-emitting element 21 from excessive voltage, the Zener voltage range of the Zener diode 50e is preferably about 16 to 40V.

[0053] Circuit 50 may include circuits other than the drive circuit 51 and the protection circuit 52 as needed. In the example in Figure 6, circuit 50 includes, in addition to the drive circuit 51 and the protection circuit 52, a resistor 50a, a MOSFET 50b, a capacitor 50c, a Zener diode 50d, a resistor 50f, a capacitor 50g, a capacitor 50h, a capacitor 50o, and a capacitor 50p.

[0054] The resistor 50a, MOSFET 50b, capacitor 50c, and Zener diode 50d form a reverse connection protection circuit and are connected to the output sides of the power supply terminal 15a and the ground terminal 15b. The resistor 50a controls the current flowing through MOSFET 50b. MOSFET 50b is a field-effect transistor and prevents current from flowing from the ground terminal 15b to the power supply terminal 15a. Capacitor 50c protects MOSFET 50b in the event of a sudden overvoltage application in the reverse direction. The Zener diode 50d protects MOSFET 50b from exceeding its maximum rating when current flows from the power supply terminal 15a to the ground terminal 15b.

[0055] One end of resistor 50a is connected to power terminal 15a, and the other end is connected to the gate of MOSFET 50b, one end of capacitor 50c, and the cathode of Zener diode 50d. The source of MOSFET 50b is connected to ground terminal 15b, and the other end of capacitor 50c and the anode of Zener diode 50d are connected to the drain of MOSFET 50b. In this circuit, because the gate of MOSFET 50b is biased, the voltage drop between the drain and source of MOSFET 50b is reduced, thus enabling a reverse connection protection circuit with reduced voltage consumption.

[0056] Resistor 50f is a pull-down resistor and is connected between the power terminal 15a and the ground terminal 15b. Capacitors 50g and 50h are noise suppression capacitors for the integrated circuit 50l and are connected in series between the power terminal 15a and the ground terminal 15b. Capacitors 50o and 50p are noise suppression capacitors for the light-emitting element 21 and are connected in parallel with the light-emitting element 21. Capacitors 50g, 50h, 50o, and 50p can reduce, for example, radio wave noise such as wireless noise and noise induced in cables.

[0057] Note that the circuit configuration shown in Figure 6 is just one example, and the light-emitting device 1 may have a different circuit configuration. The circuit configuration of the light-emitting device 1 can be changed as appropriate depending on the application of the light-emitting device 1.

[0058] <Variation 1 of the First Embodiment> Figure 9 is a top view illustrating a light-emitting device according to Modification 1 of the First Embodiment. For convenience, in Figure 9, the light source, frame member, and electronic components are omitted from the illustration, and the position of the frame member is indicated by a dashed line.

[0059] In the light-emitting device 1A shown in Figure 9, the position of the conductive member 13 differs from that of the light-emitting device 1 shown in Figure 3. In the light-emitting device 1A, the conductive member 13 is located at position B, indicated by the dashed line in the circuit diagram of Figure 6, that is, near the integrated circuit 50l. Position B, indicated by the dashed line in the circuit diagram of Figure 6, is included in the first ground wiring 11G1.

[0060] Thus, the position of the conductive member 13 is not limited and can be placed at any position on the base material 10. Regardless of where the conductive member 13 is placed on the base material 10, the noise immunity of the light-emitting device 1 can be improved.

[0061] <Modification 2 of the First Embodiment> Figure 10 is a bottom view illustrating a light-emitting device according to a modification 2 of the first embodiment. The light-emitting device 1B shown in Figure 10 differs from the light-emitting device 1 shown in Figure 4 in that it has an insulating film 16 on the lower surface 10b of the substrate 10, which is located on the lower surface of the second wiring 12. The insulating film 16 may be arranged to cover the entire second wiring 12 when viewed from below. The insulating film 16 may also be arranged to cover part or all of the lower surface 10b of the substrate 10 that is exposed from the second wiring 12 when viewed from below. Glass may be used as the material for the insulating film 16.

[0062] In this way, by placing the insulating film 16 on the underside of the second wiring 12, the capacitance between the first wiring 11, the substrate 10, and the second wiring 12 is stabilized. Furthermore, when the light-emitting device 1 is placed on a conductive material such as a metal plate, it becomes possible to insulate the second wiring 12 from the conductive material. This makes it possible, for example, to place the light-emitting device 1 on a metal plate for heat dissipation.

[0063] <Modification 3 of the First Embodiment> Figure 11 is a bottom view illustrating a light-emitting device according to a modification 3 of the first embodiment. In the light-emitting device 1C shown in Figure 11, the bottom surface 10b of the substrate 10 has a first region 121 that overlaps with the light-emitting elements 21a to 21d in a plan view and where the second wiring 12 is not located. The bottom surface 10b of the substrate 10 also has a second region 122 that overlaps with the integrated circuit 50l in a plan view and where the second wiring 12 is not located. The first region 121 and the second region 122 are located apart. At least a portion of the first region 121 and the second region 122 are exposed from the insulating film 16.

[0064] For example, if the insulating film 16 is made of glass, since glass has relatively low thermal conductivity, if the insulating film 16 is placed on the underside of the light-emitting elements 21a to 21d and the integrated circuit 50l, which tend to generate heat during operation, the heat dissipation may be reduced.

[0065] Therefore, by providing a first region 121 in which the second wiring 12 is not located, in a position that overlaps with the light-emitting elements 21a to 21d in a plan view, and exposing at least a part of the first region 121 from the insulating film 16, the heat dissipation of the heat emitted by the light-emitting elements 21a to 21d can be improved. As a result, temperature fluctuations of the light-emitting elements 21a to 21d are reduced, and they can operate more stably against noise.

[0066] Similarly, by providing a second region 122 in which the second wiring 12 is not located, at a position overlapping with the integrated circuit 50l in a plan view, and exposing at least a portion of the second region 122 from the insulating film 16, the heat dissipation of the heat generated by the integrated circuit 50l can be improved. As a result, temperature fluctuations of the integrated circuit 50l are reduced, and it can operate more stably against noise.

[0067] It is preferable that the first region 121 is continuously surrounded by the second wiring 12. This allows the heat generated by the light-emitting elements 21a to 21d to be diffused by the second wiring 12, improving the heat dissipation of the heat generated by the light-emitting elements 21a to 21d. As a result, temperature fluctuations of the light-emitting elements 21a to 21d and the integrated circuit 50l are reduced, allowing for more stable operation against noise. It is preferable that the second wiring 12 and the insulating film 16 do not continuously surround at least a portion of the second region 122. This makes it easier to position the integrated circuit 50l away from the light-emitting elements 21a to 21d, which tend to generate heat during operation. As a result, temperature fluctuations of the integrated circuit 50l are reduced, allowing for more stable operation against noise.

[0068] Furthermore, in the second direction Y, it is preferable that at least a portion of the first region 121 does not overlap with the second region 122. In the illustrated example, the first region 121 does not overlap with the second region 122 in the range L. This makes it easier to separate the light-emitting elements 21a to 21d, which tend to generate heat during operation, from the integrated circuit 50l, thereby improving heat dissipation and enabling more stable operation against noise.

[0069] Note that either the first region 121 or the second region 122 may be provided.

[0070] <Modification 4 of the First Embodiment> Figure 12 is a bottom view illustrating a light-emitting device according to a modification 4 of the first embodiment. In the light-emitting device 1D shown in Figure 12, the bottom surface 10b of the substrate 10 does not have the first region 121 and the second region 122 shown in Figure 11. The position where the insulating film 16 is arranged is the same as in Figure 11.

[0071] In other words, in the light-emitting device 1D, the second wiring 12 is positioned at locations that overlap with the light-emitting elements 21a to 21d and at locations that overlap with the integrated circuit 50l in a plan view. At least a portion of the second wiring 12 positioned at locations that overlap with the light-emitting elements 21a to 21d in a plan view is exposed from the insulating film 16. Also, at least a portion of the second wiring 12 positioned at locations that overlap with the integrated circuit 50l in a plan view is exposed from the insulating film 16. In Figure 12, the portions of the second wiring 12 exposed from the insulating film 16 are shown with a dark dot pattern for convenience.

[0072] Since the area of ​​the second wiring 12 in the light-emitting device 1D is larger than the area of ​​the second wiring in the light-emitting device 1C, the light-emitting device 1D can have improved noise immunity compared to the light-emitting device 1C. On the other hand, in the light-emitting device 1D, at least a portion of the second wiring 12, which is positioned to overlap with the light-emitting elements 21a to 21d and the integrated circuit 50l in a plan view, is exposed from the insulating film 16, so it can have heat dissipation performance comparable to that of the light-emitting device 1C.

[0073] <Second Embodiment> The second embodiment shows an example of a light-emitting device having two drive circuits. Figures 13 and 14 are top views illustrating a light-emitting device according to the second embodiment. In Figure 13, for convenience, the light-transmitting member and frame member are omitted from the illustration, and the position of the frame member is indicated by a dashed line. Similarly, in Figure 14, for convenience, the light source, frame member, and electronic components are omitted from the illustration, and the position of the frame member is indicated by a dashed line. Figure 15 is a bottom view illustrating a light-emitting device according to the second embodiment. Figure 16 is a circuit diagram of the light-emitting device according to the second embodiment.

[0074] As shown in Figures 13 to 16, the light-emitting device 2 has a light-emitting element 41 in addition to the light-emitting elements 21a to 21d of the light-emitting device 1. The light-emitting element 41 includes, for example, light-emitting elements 41a and 41b. The light-emitting elements 41a and 41b may be arranged on the upper surface 10a of the substrate 10, for example, inward from the light-emitting elements 21a to 21d. Furthermore, the light-emitting device 2 has a circuit 60 that includes peripheral circuits for the light-emitting elements 41a and 41b, instead of the circuit 50 of the light-emitting device 1. In addition, the light-emitting device 2 has a second power terminal 15c located on the upper surface 10a of the substrate 10, in addition to the power terminal 15a and ground terminal 15b of the light-emitting device 1 as connection terminals. The light-emitting device 2 can be used, for example, as a lighting device such as a stop lamp and / or tail lamp for automobiles, motorcycles, etc.

[0075] The circuit 60 shown in Figure 16 has the same configuration as the circuit 50 shown in Figure 6, plus a drive circuit 61 and light-emitting elements 41a and 41b. The drive circuit 61 consists of a rectifier diode 60a and resistors 60b and 60c. The rectifier diode 60a, resistors 60b and 60c, and light-emitting elements 41a and 41b are connected in series.

[0076] The anode of the rectifier diode 60a is connected to the second power supply terminal 15c. The rectifier diode 60a provides protection against reverse connection and also protects the light-emitting elements 41a and 41b from negative surges. Resistors 60b and 60c are connected between the cathode of the rectifier diode 60a and the light-emitting element 41a, and regulate the current flowing through the light-emitting elements 41a and 41b.

[0077] Thus, the drive circuit 61 does not have an integrated circuit or a transistor, but has a rectifier diode 60a and resistors 60b and 60c connected in series with the cathode of the rectifier diode. The light-emitting elements 41a and 41b emit light due to the current supplied from the second power supply terminal 15c via the rectifier diode 60a and resistors 60b and 60c.

[0078] Circuit 60 may include peripheral circuits of the drive circuit 61 as needed. In the illustrated example, circuit 60 includes capacitors 60d and 60e and a Zener diode 60f as peripheral circuits of the drive circuit 61. Capacitors 60d and 60e are noise suppression capacitors and are connected in series between the second power supply terminal 15c and the ground terminal 15b. Capacitors 60d and 60e can reduce, for example, radio wave noise such as wireless noise and noise induced in cables. The Zener diode 60f is connected between the second power supply terminal 15c and the ground terminal 15b and protects the light-emitting elements 41 and 41b from positive terminal surges.

[0079] In the light-emitting device 2, since the drive circuit 51 and the drive circuit 61 can be driven independently, the light-emitting elements 21a to 21d and the light-emitting elements 41a and 41b can be illuminated simultaneously, or they can be illuminated at different timings. The light-emitting elements 21a to 21d can be used, for example, as stop lamps in a car, and the light-emitting elements 41a and 41b can be used, for example, as taillights in a car.

[0080] In the light-emitting device 2, similar to the light-emitting device 1, the first wiring 11 is arranged on the upper surface 10a of the substrate 10, and the second wiring 12 is arranged on the lower surface 10b of the substrate 10. The first wiring 11 and the second wiring 12 are connected via conductive members 13. For example, in Figure 13, the portion connecting the ground terminal 15b and the MOSFET 50b is part of the first ground wiring 11G1, and the four conductive members 13 are located in positions that overlap with this portion of the first ground wiring 11G1 in a plan view. The portion connecting the ground terminal 15b and the MOSFET 50b corresponds to the position indicated by the dashed line C in the circuit diagram of Figure 16.

[0081] Thus, in the light-emitting device 2, the base material 10 is made of ceramic material, the first wiring 11 is arranged on the upper surface 10a of the base material 10, and the second wiring 12 is arranged on the lower surface 10b. The first wiring 11 and the second wiring 12 are connected by a conductive member 13. As a result, the light-emitting device 2 can improve noise immunity in the same way as the light-emitting device 1.

[0082] <Modification 1 of the second embodiment> Figures 17 and 18 are top views illustrating a light-emitting device according to Modification 1 of the second embodiment. In Figure 17, for convenience, the light-transmitting member and frame member are omitted from the illustration, and the position of the frame member is indicated by a dashed line. Similarly, in Figure 18, for convenience, the light source, frame member, and electronic components are omitted from the illustration, and the position of the frame member is indicated by a dashed line. Figure 19 is a bottom view illustrating a light-emitting device according to Modification 1 of the second embodiment.

[0083] In the light-emitting device 2A shown in Figures 17 to 19, the position of the conductive member 13 differs from that of the light-emitting device 1 shown in Figure 14. In the light-emitting device 2A, the conductive member 13 is arranged in three regions E1, E2, and E3, indicated by the dashed lines in the circuit diagram of Figure 16. The positions of E1, E2, and E3, indicated by the dashed lines in the circuit diagram of Figure 16, are included in the first ground wiring 11G1.

[0084] Thus, the position of the conductive member 13 is not limited and can be placed at any position on the base material 10. Regardless of where the conductive member 13 is placed on the base material 10, the noise immunity of the light-emitting device can be improved.

[0085] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0086] In addition to the embodiments described above, the following further notes are disclosed. (Note 1) A base material made of ceramic material and having through holes, The first wiring arranged on the upper surface of the substrate, A second wiring positioned on the lower surface of the substrate, A conductive member is placed inside the through hole and connects the first wiring and the second wiring, An end-emitting element is arranged on the first wiring and connected to the first wiring, An integrated circuit arranged on and connected to the first wiring, A light-emitting device equipped with the following features. (Note 2) The substrate has a ground terminal located on the upper surface of the substrate, The first wiring includes a ground wire connected to the ground terminal, The ground wiring includes a first ground wiring that connects the ground terminal and the integrated circuit. The conductive member is located in a position that overlaps with the first ground wiring in a plan view, as described in Appendix 1 of the light-emitting device. (Note 3) The substrate has power terminals arranged on the upper surface of the substrate, The first wiring includes power wiring connected to the power terminal and signal wiring connected to the integrated circuit, The light-emitting device as described in Appendix 2, wherein at least a portion of each of the ground wiring, the power wiring, and the signal wiring overlaps with the second wiring in a plan view. (Note 4) Electronic components, including the light-emitting element and the integrated circuit, are arranged on the first wiring. The light-emitting device according to any one of the appendices 1 to 3, wherein, in a plan view, the area of ​​the portion of the first wiring in which the electronic component is not placed is larger than the area of ​​the portion of the first wiring in which the electronic component is placed. (Note 5) The light-emitting device according to Appendix 4, wherein the conductive member is not in contact with the bonding material that joins the electronic component to the first wiring. (Note 6) The light-emitting device according to any one of the appendices 1 to 5, wherein, in a plan view, the area of ​​the portion of the substrate in which the first wiring and the second wiring overlap is greater than the area of ​​the portion in which the first wiring and the second wiring do not overlap. (Note 7) The light-emitting device according to any one of appendices 1 to 6, wherein the lower surface of the substrate has an insulating film disposed on the lower surface of the second wiring. (Note 8) The lower surface of the substrate has a first region that overlaps with the light-emitting element in a plan view and where the second wiring is not arranged. The light-emitting device according to Appendix 7, wherein at least a portion of the first region is exposed from the insulating film. (Note 9) The lower surface of the substrate has a second region that overlaps with the integrated circuit in a plan view and where the second wiring is not located. The light-emitting device according to Appendix 8, wherein at least a portion of the second region is exposed from the insulating film. (Note 10) The first region is enclosed in a manner continuous with the second wiring, and is the light-emitting device according to Appendix 8 or 9. (Note 11) The light-emitting element has a wavelength conversion member covering it, The wavelength conversion member contains phosphor particles, The light-emitting element emits blue light, The wavelength conversion member is excited by blue light and emits red light, as described in any one of Appendix 1 to 10 of the light-emitting device. [Explanation of Symbols]

[0087] 1,1A,1B,1C,1D,2,2A Light-emitting device 10 Base material 10a Top 10b Bottom side 10s First side 10x,10y through hole 11 1st wiring 11B Power wiring 11G ground wiring 11G1 First Ground Wiring 11S signal wiring 12 2nd wiring 13 Conductive material 14 Rand 15a power terminal 15b Ground terminal 15c 2nd power supply terminal 16 Insulating film 20 light source 21, 21a, 21b, 21c, 21d Light-emitting element 22 Translucent material 30 Frame members 41, 41a, 41b Light-emitting element 50, 60 circuits 50A, 50F, 50I, 50J, 50K, 50M resistors 50b MOSFET 50c, 50g, 50h, 50o, 50pF capacitors 50d, 50e Zener diodes 50L Integrated Circuit 50N thermistor 51, 61 Drive Circuit 60A rectifier diode 60b,60c resistance 60d, 60e capacitors 60f Zener diode 121 1st area 122 Second area

Claims

1. A base material made of ceramic material and having through holes, The first wiring arranged on the upper surface of the substrate, The second wiring is arranged on the lower surface of the substrate, A conductive member is placed inside the through hole and connects the first wiring and the second wiring, An end terminal is arranged on the first wiring and connected to the first wiring, An integrated circuit arranged on and connected to the first wiring, A light-emitting device equipped with the following features.

2. The substrate has a ground terminal located on the upper surface of the substrate, The first wiring includes a ground wire connected to the ground terminal, The ground wiring includes a first ground wiring that connects the ground terminal and the integrated circuit. The light-emitting device according to claim 1, wherein the conductive member is located in a position that overlaps with the first ground wiring in a plan view.

3. The substrate has power terminals arranged on the upper surface of the substrate, The first wiring includes a power wiring connected to the power terminal and a signal wiring connected to the integrated circuit, The light-emitting device according to claim 2, wherein at least a portion of each of the ground wiring, the power wiring, and the signal wiring overlaps with the second wiring in a plan view.

4. Electronic components, including the light-emitting element and the integrated circuit, are arranged on the first wiring. The light-emitting device according to any one of claims 1 to 3, wherein, in a plan view, the area of ​​the portion of the first wiring in which the electronic component is not arranged is larger than the area of ​​the portion of the first wiring in which the electronic component is arranged.

5. The light-emitting device according to claim 4, wherein the conductive member is not in contact with the bonding material that joins the electronic component to the first wiring.

6. The light-emitting device according to any one of claims 1 to 3, wherein, in a plan view, the area of ​​the portion of the substrate in which the first wiring and the second wiring overlap is greater than the area of ​​the portion in which the first wiring and the second wiring do not overlap.

7. The light-emitting device according to any one of claims 1 to 3, wherein the lower surface of the substrate has an insulating film disposed on the lower surface of the second wiring.

8. The lower surface of the substrate has a first region that overlaps with the light-emitting element in a plan view and where the second wiring is not arranged. The light-emitting device according to claim 7, wherein at least a portion of the first region is exposed from the insulating film.

9. The lower surface of the substrate has a second region that overlaps with the integrated circuit in a plan view and where the second wiring is not located. The light-emitting device according to claim 8, wherein at least a portion of the second region is exposed from the insulating film.

10. The light-emitting device according to claim 8, wherein the first region is continuously surrounded by the second wiring.

11. The light-emitting element has a wavelength conversion member covering it, The wavelength conversion member contains phosphor particles, The light-emitting element emits blue light, The light-emitting device according to any one of claims 1 to 3, wherein the wavelength conversion member is excited by blue light and emits red light.

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