Inspection jig

Abstract

To obtain an inspection jig that can prevent a decrease in contact quality. [Solution] A metal frame 14 is provided on a substrate 2. Contact pins 3 are attached to the metal frame 14. A rod-shaped rubber 15 is inserted into the hollow portion 14a of the metal frame 14. A resin retainer 5 is provided on the substrate 2 and presses the rubber 15 that protrudes from the metal frame 14 toward the substrate 2, holding the metal frame 14 via the rubber 15. The metal frame 14 and the contact pins 3 are housed in the opening 5a of the resin retainer 5. Washers 16 sandwich the contact pins 3 from both sides and are inserted between the sides of the contact pins 3 and the sides of the opening 5a of the resin retainer 5.

Description

Technical Field

[0001] The present disclosure relates to an inspection jig.

Background Art

[0002] When inspecting a semiconductor element, contact pins are brought into contact with the electrodes of the semiconductor element. An inspection jig has been proposed in which contact pins are attached to a metal frame and mounted on a substrate (see, for example, Patent Document 1). In order to buffer the force generated by the movement of the contact pins, a rod-shaped rubber is inserted into the cavity of the metal frame. The rubber protruding from the metal frame is pressed against the substrate by a resin retainer, and the metal frame is held via the rubber. The metal frame and the contact pins are housed in the opening of the resin retainer.

[0003] The metal frame is formed by cutting off a metal cylinder processed into a rod shape or punching out a metal flat plate. Therefore, the metal frame has a simple shape that does not change in the direction (lateral direction) penetrating the cavity. For this reason, it is difficult to perform processing on the metal frame for positioning the contact pins in the lateral direction. Therefore, conventionally, the width of the opening of the resin retainer has been made substantially the same as the width of the contact pins. The lateral positioning of the contact pins is performed by the contact of the side surfaces of the contact pins with the side surfaces of the opening of the resin retainer.

Prior Art Documents

Patent Documents

[0004]

Patent Document Ⅰ

Summary of the Invention

Problems to be Solved by the Invention

[0005] When the contact pins move, the entire side surface of the contact pins rubs against the side surface of the opening of the resin retainer, generating resin chips. There is a problem that these resin chips inhibit the movement of the contact pins, thereby degrading the contact between the contact pins and the semiconductor element.

[0006] This disclosure was made to solve the problems described above, and its purpose is to obtain an inspection jig that can prevent a decrease in contactability. [Means for solving the problem]

[0007] The inspection jig according to this disclosure is characterized by comprising: a substrate; a metal frame provided on the substrate and having a cavity that penetrates laterally and a slit provided diagonally upward from the cavity; a contact pin attached to the metal frame so as to pass through the slit; a rod-shaped rubber inserted into the cavity of the metal frame and cushioning the force generated by the movement of the contact pin; a resin retainer provided on the substrate and having an opening that accommodates the metal frame and the contact pin, which holds the metal frame via the rubber by pressing the rubber that protrudes from the metal frame toward the substrate; and a washer that sandwiches the contact from both sides and is inserted between the side surface of the contact pin and the side surface of the opening of the resin retainer. [Effects of the Invention]

[0008] In this disclosure, the lateral positioning of the contact pin is achieved by sandwiching both sides of the contact pin with washers. Because the sides of the contact pin do not rub against the resin retainer when the contact pin moves, resin debris is not generated. As a result, a decrease in contact performance can be prevented. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view showing the semiconductor device to be inspected. [Figure 2] This is a plan view showing an inspection jig according to Embodiment 1. [Figure 3] This is a cross-sectional view showing a semiconductor inspection apparatus according to Embodiment 1. [Figure 4] This is a cross-sectional view showing a semiconductor inspection apparatus according to Embodiment 1. [Figure 5]It is a plan view showing a contactor of an inspection jig according to Embodiment 1. [Figure 6] It is a cross-sectional view taken along the line I-II of FIG. 5. [Figure 7] It is a cross-sectional view taken along the line III-IV of FIG. 5. [Figure 8] It is a cross-sectional view taken along the line V-VI of FIG. 5. [Figure 9] It is a plan view showing a contactor of an inspection jig according to the comparative example. [Figure 10] It is a cross-sectional view showing a contactor of an inspection jig according to the comparative example. [Figure 11] It is a plan view showing a modified example of a contactor of an inspection jig according to Embodiment 1. [Figure 12] It is a cross-sectional view taken along the line I-II of FIG. 11. [Figure 13] It is a cross-sectional view taken along the line III-IV of FIG. 11. [Figure 14] It is a plan view showing a contactor of an inspection jig according to Embodiment 2. [Figure 15] It is a cross-sectional view taken along the line I-II of FIG. 14. [Figure 16] It is a cross-sectional view taken along the line III-IV of FIG. 14. [Figure 17] It is a plan view showing a contactor of an inspection jig according to Embodiment 3. [Figure 18] It is a cross-sectional view taken along the line I-II of FIG. 17. [Figure 19] It is a cross-sectional view taken along the line III-IV of FIG. 18. [Figure 20] It is a plan view showing a contactor of an inspection jig according to Embodiment 4.

Modes for Carrying Out the Invention

[0010] The inspection jig according to the embodiment will be described with reference to the drawings. The same or corresponding components may be denoted by the same reference numerals, and the repeated description may be omitted.

[0011] <00xxx094>Embodiment 1. FIG. 1 is a plan view showing a semiconductor element to be inspected. A GND pattern 1a is provided at the central portion of the surface of the semiconductor element 1. A plurality of electrodes 1b are provided at the outer peripheral portion of the surface of the semiconductor element 1. The semiconductor element 1 is a high-frequency product of a surface-mount package such as a GaAs power amplifier or a 5G module. However, the semiconductor element 1 is not limited to high-frequency products.

[0012] FIG. 2 is a plan view showing an inspection jig according to Embodiment 1. A plurality of contact pins 3 and a GND block 4 are provided on an insulating substrate 2. A resin retainer 5 is provided on the upper surface of the substrate 2. The plurality of contact pins 3 and the GND block 4 are exposed from the plurality of openings of the resin retainer 5, respectively.

[0013] FIGS. 3 and 4 are cross-sectional views showing a semiconductor inspection apparatus according to Embodiment 1. FIG. 3 shows a state in which the semiconductor element 1 is picked up with the plurality of contact pins 3 and the GND block 4 facing downward. FIG. 4 shows a state in which the semiconductor element 1 is pressed against an inspection jig 6.

[0014] A suction hole 8 is provided at the central portion of the lower surface of the collet 7. An external vacuum pump sucks through the vacuum pipe 9 from the suction hole 8. Thereby, the collet 7 sucks the upper surface of the semiconductor element 1. The upper end portion of the collet 7 is attached to a pressing jig 11 via a spring 10. A wiring pattern 12 is provided on the insulating substrate 2 and is electrically connected to the contact pin 3. A heat sink 13 is provided on the lower surface of the substrate 2 and is thermally connected to the GND block 4.

[0015] The pressing jig 11 pushes down the collet 7 to press the semiconductor element 1 against the inspection jig 6. The plurality of contact pins 3 of the inspection jig 6 contact the plurality of electrodes 1b of the semiconductor element 1, respectively. The GND block 4 contacts the GND pattern 1a of the semiconductor element 1. The characteristic inspection of the semiconductor element 1 is performed in this state. The heat absorbed by the GND block 4 from the semiconductor element 1 is radiated by the heat sink 13.

[0016] Figure 5 is a plan view showing the contactor of the inspection jig according to Embodiment 1. Figure 5 is an enlarged view of area A in Figure 2. Figure 6 is a cross-sectional view along line I-II in Figure 5. Figure 7 is a cross-sectional view along line III-IV in Figure 5. Figure 8 is a cross-sectional view along line V-VI in Figure 5. A wiring pattern 12 is provided on the insulating substrate 2. A metal frame 14 is provided on the wiring pattern 12 and is electrically connected to the wiring pattern 12.

[0017] The metal frame 14 is rectangular in shape when viewed from the side and has a hollow section 14a that penetrates horizontally. A slit 14b is provided at the upper corner of the metal frame 14, extending diagonally upward from the hollow section 14a. The contact pin 3 is attached to the metal frame 14 so as to pass through the slit 14b. The tip 3a of the contact pin 3 protrudes diagonally upward from the upper corner of the metal frame 14. The central part 3b of the contact pin 3 passes through the slit 14b of the metal frame 14 and contacts the bottom surface of the slit 14b, thereby electrically connecting the contact pin 3 and the metal frame 14. Therefore, the contact pin 3 is electrically connected to the wiring pattern 12 via the metal frame 14. The base 3c of the contact pin 3 is housed in the hollow section 14a of the metal frame 14. The vertical width of the tip 3a and the central part 3b of the contact pin 3 is approximately the same as the vertical width of the slit 14b. This prevents vertical misalignment of the contact pin 3 relative to the metal frame 14. On the other hand, the vertical width of the base portion 3c of the contact pin 3 is wider than the vertical width of the slit 14b. This prevents the contact pin 3 from falling out of the slit 14b.

[0018] A rod-shaped rubber 15 is inserted into the hollow portion 14a of the metal frame 14. A resin retainer 5 is provided on the substrate 2. The metal frame 14 and the contact pin 3 are housed in the opening 5a of the resin retainer 5. The upper surface of the metal frame 14 and the tip 3a of the contact pin 3 are higher than the upper surface of the resin retainer 5. A straight groove 5b is provided on the lower surface of the resin retainer 5. The rubber 15 is housed in the groove 5b. The resin retainer 5 holds the metal frame 14 by pressing the rubber 15 that protrudes from the metal frame 14 toward the substrate 2. Alternatively, a single long rubber 15 may be used for multiple metal frames 14 arranged in a row.

[0019] Signals or operating voltages are individually input and output to multiple electrodes 1b of the semiconductor element 1 via multiple wiring patterns 12, multiple metal frames 14, and multiple contact pins 3 on the substrate 2. A single resin retainer 5 is used in common for multiple metal frames 14 provided on the substrate 2. Therefore, if the resin retainer 5 is made of an electrically conductive material, the multiple metal frames 14 and multiple contact pins 3 will short-circuit with each other, making inspection impossible. For this reason, an insulating resin is used as the material for the resin retainer 5. In addition, since signals from the microwave band to the millimeter-wave band are transmitted to the wiring patterns 12, metal frames 14, and contact pins 3, these materials are metals such as gold that have good high-frequency characteristics.

[0020] When the tip of the contact pin 3 contacts the electrode 1b of the semiconductor element 1, the contact pin 3 is pushed inward into the metal frame 14, and the base 3c of the contact pin 3 is pressed against the rubber 15, causing the rubber 15 to contract. The rubber 15 is a cushioning material that dampens the force generated by the movement of the contact pin 3. The rubber 15 has a simpler structure compared to other cushioning materials such as springs.

[0021] The metal frame 14 is formed by cutting a metal cylinder that has been processed into a rod shape or by punching out a metal plate. Therefore, the metal frame 14 has a simple shape that does not change in the direction that penetrates the cavity 14a (the lateral direction of the metal frame 14). For this reason, it is difficult to perform processing on the metal frame 14 to position the contact pin 3 in the lateral direction. In this embodiment, a U-shaped washer 16, when viewed from above, sandwiches the contact pin 3 from both sides to position the contact pin 3 in the lateral direction. The washer 16 is also U-shaped when viewed from the side, and rubber 15 is passed through the opening 16a on the side of the washer 16. The washer 16 is held in place by being sandwiched between the rubber 15 and the substrate 2 in the vertical direction, and by being sandwiched between the resin retainer 5 and the metal frame 14 in the horizontal direction. Since the metal frame 14 and the washer 16 are separate components, each can be formed into a simple shape. The material of the washer 16 is the same metal as the contact pin 3. In addition to this, the material of the washer 16 can be any material that is harder than the resin retainer 5, for example, ceramic. Also, if the height of the washer 16 is too high, it may come into contact with the semiconductor element 1 and cause scratches, so the height of the washer 16 should be lower than the height of the metal frame 14.

[0022] Next, the effects of this embodiment will be explained in comparison with the comparative example. Figure 9 is a plan view showing the contactor of the inspection jig according to the comparative example. Figure 10 is a cross-sectional view showing the contactor of the inspection jig according to the comparative example. The comparative example does not have a washer 16. The width of the opening 5a of the resin retainer 5 is approximately the same as the width of the contact pin 3. Lateral positioning of the contact pin 3 is performed by the side surface of the contact pin 3 contacting the side surface of the opening 5a of the resin retainer 5. However, when the contact pin 3 moves, the entire side surface of the contact pin 3 rubs against the side surface of the opening 5a of the resin retainer 5, generating resin debris. This resin debris hinders the movement of the contact pin 3, reducing the contact between the contact pin 3 and the semiconductor element 1.

[0023] In contrast, in this embodiment, a U-shaped washer 16 sandwiches the contact pin 3 from both sides to position the contact pin 3 laterally. The washer 16 is inserted between the side of the contact pin 3 and the side of the opening 5a of the resin retainer 5. As a result, the side of the contact pin 3 does not rub against the resin retainer 5, so no resin debris is generated when the contact pin 3 moves. Also, since the washer 16 is harder than the resin retainer 5, debris is less likely to be generated even if the contact pin 3 rubs against the washer 16. As a result, a decrease in contact performance can be prevented.

[0024] Figure 11 is a plan view showing a modified contactor of the inspection jig according to Embodiment 1. Figure 12 is a cross-sectional view along line I-II in Figure 11. Figure 13 is a cross-sectional view along line III-IV in Figure 11. In Figures 5 and 7, the U-shaped washer 16 is attached to the metal frame 14 from the side of the rubber 15, but in the modified form, the U-shaped washer 16 is attached to the metal frame 14 from the side of the protruding contact pin 3. Both methods produce similar effects.

[0025] Embodiment 2 Figure 14 is a plan view showing the contactor of the inspection jig according to Embodiment 2. Figure 15 is a cross-sectional view along line I-II in Figure 14. Figure 16 is a cross-sectional view along line III-IV in Figure 14. In this embodiment, two separate plate-shaped washers 17 and 18 sandwich the contact pin 3 from both sides to position the contact pin 3 laterally. The washers 17 and 18 are U-shaped in side view, and rubber 15 is passed through the opening 16a on the side of the washers 17 and 18. The washers 17 and 18 are held in place by being sandwiched between the rubber 15 and the substrate 2 in the vertical direction, and by being sandwiched between the resin retainer 5 and the metal frame 14 in the horizontal direction.

[0026] Washers 17 and 18 are inserted between the side of the contact pin 3 and the side of the opening 5a of the resin retainer 5. This prevents the side of the contact pin 3 from rubbing against the resin retainer 5, thus preventing the generation of resin debris when the contact pin 3 moves. As a result, a decrease in contact performance can be prevented. In addition, washers 17 and 18 have a simpler structure compared to the U-shaped washer 16 of Embodiment 1, making them easier to manufacture.

[0027] Embodiment 3 Figure 17 is a plan view showing the contactor of the inspection jig according to Embodiment 3. Figure 18 is a cross-sectional view along line I-II in Figure 17. Figure 19 is a cross-sectional view along line III-IV in Figure 18. In this embodiment, there is no washer as in Embodiments 1 and 2, and a tapered groove 14c is provided on the bottom surface of the cut 14b of the metal frame 14 along the direction of movement of the contact pin 3. This groove 14c positions the contact pin 3 laterally. That is, by the central part 3b of the contact pin 3 moving along the groove 14c, lateral displacement of the contact pin 3 can be prevented. The tapered groove 14c is easier to manufacture than a rectangular recess. Also, because the groove 14c is tapered, it is easy to attach the contact pin 3 to the cut 14b from the side of the metal frame 14. The other configurations are the same as in Embodiments 1 and 2.

[0028] Since the resin retainer 5 does not need to position the contact pin 3 laterally, a sufficient distance can be maintained between the contact pin 3 and the resin retainer 5. As a result, the side of the contact pin 3 does not rub against the resin retainer 5, and therefore no resin debris is generated when the contact pin 3 moves. Consequently, a decrease in contact performance can be prevented.

[0029] Embodiment 4 Figure 20 is a plan view showing the contactor of the inspection jig according to Embodiment 4. In this embodiment, there is no washer as in Embodiments 1 and 2, and the width of the tip portion 3a and the central portion 3b of the contact pin 3 is narrower than the width of the base portion 3c of the contact pin 3. The other configurations are the same as in Embodiments 1 and 2.

[0030] Lateral positioning of the contact pin 3 is achieved when the side of the thick base portion 3c of the contact pin 3 contacts the side of the opening 5a of the resin retainer 5. Furthermore, since only the base portion 3c of the contact pin 3 rubs against the resin retainer 5, the area of ​​friction is reduced, thereby reducing the generation of resin debris. As a result, a decrease in contact performance can be prevented.

[0031] Furthermore, similar to Embodiment 3, a tapered groove 14c may be provided on the bottom surface of the cut 14b of the metal frame 14 along the direction of movement of the contact pin 3. By allowing the central portion 3b of the contact pin 3 to move along the groove 14c, it is possible to prevent the contact pin 3 from becoming slanted.

[0032] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims. Various aspects of this disclosure are described below as appendices. (Note 1) circuit board and A metal frame provided on the substrate, having a cavity that penetrates horizontally and a slit that extends diagonally upward from the cavity, A contact pin attached to the metal frame so as to pass through the aforementioned slit, A rod-shaped rubber is inserted into the cavity of the metal frame and cushions the force generated by the movement of the contact pin, A resin retainer is provided on the substrate and has an opening for housing the metal frame and the contact pins, and presses the rubber that protrudes from the metal frame toward the substrate, thereby holding the metal frame via the rubber, An inspection jig characterized by comprising a washer that sandwiches the contact from both sides and is inserted between the side surface of the contact pin and the side surface of the opening of the resin retainer. (Note 2) The inspection jig according to Appendix 1, characterized in that the washer is a separate component from the metal frame and is made of a material harder than the resin retainer. (Note 3) The inspection jig according to Appendix 1 or 2, characterized in that the metal frame has a shape that does not change in the lateral direction. (Note 4) An inspection jig as described in any of the appendices 1 to 3, characterized in that the height of the washer is lower than the height of the metal frame. (Note 5) The inspection jig described in any of the appendices 1 to 4, characterized in that the washer is U-shaped in plan view. (Note 6) The inspection jig according to any one of the appendices 1 to 4, characterized in that the washers are two separate plate-shaped pieces. (Note 7) circuit board and A metal frame provided on the substrate, having a cavity that penetrates horizontally and a slit that extends diagonally upward from the cavity, A contact pin attached to the metal frame so as to pass through the aforementioned slit, A rod-shaped rubber is inserted into the cavity of the metal frame and cushions the force generated by the movement of the contact pin, The resin retainer is provided on the substrate and has an opening for housing the metal frame and the contact pins, and presses the rubber that protrudes from the metal frame toward the substrate, thereby holding the metal frame via the rubber, An inspection jig characterized in that a tapered groove is provided on the bottom surface of the cut in the metal frame along the direction of movement of the contact pin. (Note 8) circuit board and A metal frame provided on the substrate, having a cavity that penetrates horizontally and a slit that extends diagonally upward from the cavity, A contact pin attached to the metal frame so as to pass through the aforementioned slit, A rod-shaped rubber is inserted into the cavity of the metal frame and cushions the force generated by the movement of the contact pin, The resin retainer is provided on the substrate and has an opening for housing the metal frame and the contact pins, and presses the rubber that protrudes from the metal frame toward the substrate, thereby holding the metal frame via the rubber, The contact pin has a tip portion that protrudes from the metal frame, a central portion that passes through the slit, and a base portion that is housed in the cavity. The width of the tip and the central part is narrower than the width of the base. An inspection jig characterized in that the side surface of the base portion contacts the side surface of the opening of the resin retainer. (Note 9) The inspection jig according to Appendix 8, characterized in that a tapered groove is provided on the bottom surface of the cut in the metal frame along the direction of movement of the contact pin. (Note 10) Multiple metal frames are provided on the substrate, An inspection jig according to any one of the appendices 1 to 9, characterized in that one resin retainer is used in common for multiple metal frames. [Explanation of Symbols]

[0033] 2. Circuit board, 3. Contact pin, 3a. Tip, 3b. Center, 3c. Base, 5. Resin retainer, 5a. Opening, 5b. Groove, 6. Inspection jig, 14. Metal frame, 14a. Cavity, 14b. Cut, 15. Rubber, 16, 17, 18. Washers

Claims

1. circuit board and A metal frame provided on the substrate, having a cavity that penetrates horizontally and a slit that extends diagonally upward from the cavity, A contact pin attached to the metal frame so as to pass through the aforementioned slit, A rod-shaped rubber is inserted into the cavity of the metal frame and cushions the force generated by the movement of the contact pin, A resin retainer is provided on the substrate and has an opening for housing the metal frame and the contact pins, and presses the rubber that protrudes from the metal frame toward the substrate, thereby holding the metal frame via the rubber, An inspection jig characterized by comprising a washer that sandwiches the contact from both sides and is inserted between the side surface of the contact pin and the side surface of the opening of the resin retainer.

2. The inspection jig according to claim 1, characterized in that the washer is a separate component from the metal frame and is made of a material harder than the resin retainer.

3. The inspection jig according to claim 1 or 2, characterized in that the metal frame has a shape that does not change in the lateral direction.

4. The inspection jig according to claim 1 or 2, characterized in that the height of the washer is lower than the height of the metal frame.

5. The inspection jig according to claim 1 or 2, characterized in that the washer is U-shaped in plan view.

6. The inspection jig according to claim 1 or 2, characterized in that the washers are two separate plate-shaped pieces.

7. circuit board and A metal frame provided on the substrate, having a cavity that penetrates horizontally and a slit that extends diagonally upward from the cavity, A contact pin attached to the metal frame so as to pass through the aforementioned slit, A rod-shaped rubber is inserted into the cavity of the metal frame and cushions the force generated by the movement of the contact pin, The resin retainer is provided on the substrate and has an opening for housing the metal frame and the contact pins, and presses the rubber that protrudes from the metal frame toward the substrate, thereby holding the metal frame via the rubber, An inspection jig characterized in that a tapered groove is provided on the bottom surface of the cut in the metal frame along the direction of movement of the contact pin.

8. circuit board and A metal frame provided on the substrate, having a cavity that penetrates horizontally and a slit that extends diagonally upward from the cavity, A contact pin attached to the metal frame so as to pass through the aforementioned slit, A rod-shaped rubber is inserted into the cavity of the metal frame and cushions the force generated by the movement of the contact pin, The resin retainer is provided on the substrate and has an opening for housing the metal frame and the contact pins, and presses the rubber that protrudes from the metal frame toward the substrate, thereby holding the metal frame via the rubber, The contact pin has a tip portion that protrudes from the metal frame, a central portion that passes through the slit, and a base portion that is housed in the cavity. The width of the tip and the central part is narrower than the width of the base. An inspection jig characterized in that the side surface of the base portion contacts the side surface of the opening of the resin retainer.

9. The inspection jig according to claim 8, characterized in that a tapered groove is provided on the bottom surface of the cut in the metal frame along the direction of movement of the contact pin.

10. Multiple metal frames are provided on the substrate, The inspection jig according to any one of claims 1, 2, 7 to 9, characterized in that one resin retainer is used in common for multiple metal frames.

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