Substrate processing apparatus and repair apparatus

Abstract

To suppress the decline in device productivity. [Solution] The substrate processing apparatus includes a camera for imaging a substrate, and a plurality of nozzles arranged around the camera, which perform the loading of an object to a predetermined position or the removal of an object from a predetermined position, while the predetermined position on the surface of the substrate is within the camera's field of view.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a substrate processing apparatus and a repair apparatus.

Background Art

[0002] In the technical field related to substrate processing apparatuses, a substrate processing apparatus as disclosed in Patent Document 1 is known. In Patent Document 1, the substrate processing apparatus includes a camera that acquires image information used for inspecting whether solder balls are properly mounted by imaging a substrate, and a repair nozzle that performs re-mounting or removal or re-mounting of solder balls based on the image information from the camera.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Depending on the relative positions of the camera and the repair nozzle, for example, the tact time indicating the time required to process one substrate may increase, and the productivity of the device may decrease. When the camera and the repair nozzle are separated as in Patent Document 1, after moving the camera directly above the inspection target area of the substrate, it is necessary to move the repair nozzle directly above the inspection target area. That is, in Patent Document 1, since it is necessary to move each of the camera and the repair nozzle significantly during the period from imaging the inspection target area by the camera to re-mounting or removing the solder balls by the repair nozzle, the tact time may increase.

[0005] The technology disclosed in this specification aims to suppress a decrease in the productivity of the device.

Means for Solving the Problems

[0006] This specification discloses a substrate processing apparatus. The substrate processing apparatus comprises a camera for imaging a substrate, and a plurality of nozzles arranged around the camera, which perform the loading of an object to or removal of an object from a predetermined position, while the predetermined position on the surface of the substrate is within the camera's field of view. [Effects of the Invention]

[0007] The technology disclosed herein helps to suppress the decline in device productivity. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic diagram showing a substrate processing system according to the first embodiment. [Figure 2] Figure 2 is a diagram illustrating the flux printing process in a flux printing apparatus according to the first embodiment. [Figure 3] Figure 3 is a diagram illustrating the solder ball mounting process in a solder ball mounting apparatus according to the first embodiment. [Figure 4] Figure 4 is a diagram illustrating the inspection process for the condition of a substrate in a full-surface inspection apparatus according to the first embodiment. [Figure 5] Figure 5 is a schematic diagram showing a repair device according to the first embodiment. [Figure 6] Figure 6 is a view of the head according to the first embodiment, seen from above. [Figure 7] Figure 7 is a hardware configuration diagram showing the controller according to the first embodiment. [Figure 8] Figure 8 is a functional block diagram showing the controller according to the first embodiment. [Figure 9] Figure 9 is a diagram illustrating the operation of the repair device according to the first embodiment in which a solder ball is mounted. [Figure 10] Figure 10 is a diagram illustrating the operation of the repair device according to the first embodiment in which a solder ball is mounted. [Figure 11] Figure 11 is a diagram illustrating the operation of the repair device according to the first embodiment in which a solder ball is mounted. [Figure 12] Figure 12 is a diagram illustrating the operation of the repair device according to the first embodiment in which a solder ball is removed. [Figure 13] Figure 13 is a diagram illustrating the operation of the repair device according to the first embodiment in which a solder ball is removed. [Figure 14] Figure 14 is a diagram illustrating the operation of the repair device according to the first embodiment in which a solder ball is removed. [Figure 15] Figure 15 is a schematic diagram showing a repair device according to the second embodiment. [Figure 16] Figure 16 is a view of the head according to the second embodiment, seen from above. [Figure 17] Figure 17 is a schematic diagram showing a component mounting apparatus according to the third embodiment. [Figure 18] Figure 18 is a diagram illustrating the operation of a component mounting apparatus according to the second embodiment in which components are mounted onto a substrate. [Figure 19] Figure 19 is a diagram illustrating the operation of a component mounting apparatus according to the third embodiment in which components are mounted onto a substrate. [Modes for carrying out the invention]

[0009] The embodiments will be described below with reference to the drawings. The components of the embodiments described below can be combined as appropriate. Some components may be omitted.

[0010] In the following description, an XYZ orthogonal coordinate system is set for the substrate processing system 1, and the positional relationship of each part will be described while referring to this XYZ orthogonal coordinate system. The direction parallel to the X-axis (first axis) on the predetermined plane is defined as the X-axis direction (first axis direction). The direction parallel to the Y-axis (second axis) orthogonal to the X-axis on the predetermined plane is defined as the Y-axis direction (second axis direction). The direction parallel to the Z-axis (third axis) orthogonal to the predetermined plane is defined as the Z-axis direction (third axis direction). The rotational direction or tilting direction centered on the X-axis is defined as the θX direction. The rotational direction or tilting direction centered on the Y-axis is defined as the θY direction. The rotational direction or tilting direction centered on the Z-axis is defined as the θZ direction. The predetermined plane is the XY plane. In the embodiment, it is assumed that the predetermined plane is parallel to the horizontal plane. The Z-axis direction is the vertical direction (up and down direction). The +Z side is the upper side, and the -Z side is the lower side.

[0011] [First Embodiment] The first embodiment will be described.

[0012] <Substrate Processing System> FIG. 1 is a diagram schematically showing a substrate processing system 1 according to the first embodiment. The substrate processing system 1 forms solder bumps on a substrate 7. A solder bump refers to a protruding terminal made of solder. As shown in FIG. 1, the substrate processing system 1 includes a flux printing device 2, a solder ball mounting device 3, a full inspection device 4, and a repair device 5. A controller 18 is provided in each of the flux printing device 2, the solder ball mounting device 3, the full inspection device 4, and the repair device 5. The controller 18 includes a controller 181 of the flux printing device 2, a controller 182 of the solder ball mounting device 3, a controller 183 of the full inspection device 4, and a controller 184 of the repair device 5.

[0013] The flux printing device 2 prints flux 8 on the substrate 7. After the substrate 7 is printed with the flux 8 in the flux printing device 2, it is conveyed to the solder ball mounting device 3.

[0014] The solder ball placement device 3 places solder balls 11 onto the flux 8 printed on the substrate 7. Solder bumps are formed when the solder balls 11 are placed onto the flux 8. After the solder balls 11 are placed on the substrate 7 in the solder ball placement device 3, the substrate 7 is transported to the full surface inspection device 4.

[0015] The full-surface inspection device 4 inspects the condition of the circuit board 7. The condition of the circuit board 7 includes the mounting condition of the solder balls 11 mounted on the circuit board 7. After being inspected by the full-surface inspection device 4, the circuit board 7 is transported to the repair device 5.

[0016] Repair device 5 is a solder ball repair device. Repair device 5 is an example of a circuit board processing device. Repair device 5 repairs predetermined locations on the circuit board 7 where solder balls 11 are not properly mounted. Repair by repair device 5 includes mounting or removing solder balls 11. If solder balls 11 are not mounted at the required locations on the surface of the circuit board 7 where they should be mounted, repair device 5 mounts solder balls 11 at the required locations. If solder balls 11 are mounted at non-required locations on the surface of the circuit board 7 where they should not be mounted, repair device 5 removes the solder balls 11 mounted at the non-required locations.

[0017] Each of the multiple controllers 18 (181, 182, 183, 184) communicates with the flux printing device 2, the solder ball mounting device 3, the full-surface inspection device 4, and the repair device 5. Each of the multiple controllers 181 (181, 182, 183, 184) processes the data received from the flux printing device 2, the solder ball mounting device 3, the full-surface inspection device 4, and the repair device 5. Each of the multiple controllers 18 (181, 182, 183, 184) can output control commands to control the flux printing device 2, the solder ball mounting device 3, the full-surface inspection device 4, and the repair device 5.

[0018] Figure 2 is a diagram illustrating the printing process of flux 8 in the flux printing apparatus 2 according to the first embodiment. The flux printing apparatus 2 prints flux 8 onto electrodes provided on the surface of the substrate 7. Flux 8 is a liquid used to adhere solder balls 11 to the substrate 7 and to prevent oxidation of the solder balls 11 during melting. Flux 8 is viscous. Due to the viscosity of flux 8, the solder balls 11 adhere to the substrate 7 via the flux 8.

[0019] The flux printing apparatus 2 applies flux 8 to the surface of the substrate 7 through the openings 9A of the flux mask 9, which is positioned facing the surface of the substrate 7. As shown in Figure 2, in the flux printing apparatus 2, the flux mask 9 is positioned facing the surface of the substrate 7. Multiple openings 9A are provided to correspond to each of the multiple electrodes on the substrate 7.

[0020] Flux 8 is applied to the surface of the substrate 7 by a squeegee 10. The squeegee 10 applies the flux 8 to the surface of the substrate 7 through the opening 9A of the flux mask 9. The squeegee 10 moves in the XY plane while pressing the flux 8 against the upper surface of the flux mask 9. As the flux 8 is pressed against the squeegee 10, it enters the opening 9A. As the flux 8 enters each of the multiple openings 9A, the flux 8 is applied to the electrodes on the surface of the substrate 7.

[0021] Figure 3 is a diagram illustrating the solder ball mounting process in the solder ball mounting apparatus 3 according to the first embodiment. The solder ball mounting apparatus 3 mounts the solder balls 11 onto the flux 8 printed on the substrate 7.

[0022] The solder ball mounting device 3 mounts solder balls 11 onto the flux 8 printed on the surface of the substrate 7 through openings 12A of the solder ball mask 12, which is positioned facing the surface of the substrate 7. As shown in Figure 3, in the solder ball mounting device 3, the solder ball mask 12 is positioned facing the surface of the substrate 7. Multiple openings 12A are provided to correspond to each of the multiple flux 8 on the surface of the substrate 7.

[0023] The solder balls 11 are placed on the flux 8 by the squeegee 13. The squeegee 13 places the solder balls 11 on the flux 8 through the opening 12A of the solder ball mask 12. The squeegee 13 moves multiple solder balls 11 in the XY plane on the upper surface of the solder ball mask 12. As the solder balls 11 are moved by the squeegee 13, they enter the opening 12A. As the solder balls 11 enter each of the multiple openings 12A, the solder balls 11 are placed on the flux 8 on the surface of the substrate 7.

[0024] Figure 4 is a diagram illustrating the inspection process of the state of the substrate 7 in the full-surface inspection apparatus 4 according to the first embodiment. The full-surface inspection apparatus 4 inspects the state of the substrate 7 after the solder ball 11 mounting process has been completed. The state of the substrate 7 includes the state of solder ball 11 mounting on the substrate 7. The full-surface inspection apparatus 4 inspects the state of solder ball 11 mounting on the substrate 7.

[0025] The full-surface inspection device 4 has a full-surface inspection camera 14. The full-surface inspection camera 14 images the surface of the substrate 7 after the solder ball 11 mounting process is completed. The controller 183 of the full-surface inspection device 4 processes the image data of the substrate 7 surface captured by the full-surface inspection camera 14 to calculate the position of the solder ball 11 on the surface of the substrate 7. In the following description, the position of the solder ball 11 calculated from the image data of the substrate 7 surface captured by the full-surface inspection camera 14 will be appropriately referred to as the actual position. The actual position is the position of the solder ball 11 on the surface of the substrate 7 parallel to the XY plane. The actual position is defined by the actual X and Y coordinates of the solder ball 11.

[0026] The required positions on the surface of the substrate 7 where the solder balls 11 should be mounted are predetermined. The controller 183 of the full-surface inspection device 4 outputs a determination result of whether or not the solder balls 11 are mounted at the required positions, based on the actual positions of the solder balls 11 and the required positions of the solder balls 11. The controller 183 of the full-surface inspection device 4 transmits the solder ball mounting data, including the actual positions of the solder balls 11, the required positions of the solder balls 11, and the determination result of whether or not the solder balls 11 are mounted at the required positions, to the controller 184 of the repair device 5.

[0027] <Repair device> Figure 5 is a schematic diagram showing a repair device 5 according to the first embodiment. The repair device 5 repairs predetermined locations on the substrate 7 where solder balls 11 are not properly mounted. Repair by the repair device 5 includes mounting or removing solder balls 11. If solder balls 11 are not mounted at the required locations on the surface of the substrate 7 where they should be mounted, the repair device 5 mounts solder balls 11 at the required locations. If solder balls 11 are mounted at non-required locations on the surface of the substrate 7 where they should not be mounted, the repair device 5 removes the solder balls 11 mounted at the non-required locations.

[0028] In the repair apparatus 5, the substrate 7 is supported by a substrate table (not shown). When the substrate 7 is supported by the substrate table, the surface of the substrate 7 faces upward (+Z direction). When the substrate 7 is supported by the substrate table, the surface of the substrate 7 is substantially parallel to the XY plane.

[0029] The repair device 5 comprises a camera 15, a head 16, a nozzle 17, and a controller 184.

[0030] Camera 15 images the substrate 7. Camera 15 images the surface of the substrate 7 after the flux 8 printing process and the solder ball 11 mounting process have been completed. Camera 15 has an optical system including a plurality of optical elements and an image sensor into which light that has passed through the optical system is incident. The image sensor acquires an image of the substrate 7 via the optical system. Examples of image sensors include a CCD (Couple Charged Device) image sensor and a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0031] Camera 15 is positioned opposite the surface of the substrate 7. Camera 15 images the substrate 7 from above. The incident plane of the optical system of camera 15 faces downward (-Z direction). The optical axis AX of the optical system of camera 15 is parallel to the Z axis. The optical axis AX of camera 15 and the surface of the substrate 7 are substantially perpendicular. The optical system of camera 15 has a field of view FV. The field of view FV includes the imaging range of camera 15. In the XY plane, the optical axis AX passes through the center of the field of view FV.

[0032] The nozzle 17 is a repair nozzle that repairs predetermined locations on the substrate 7 where solder balls 11 are not properly mounted. The nozzle 17 is positioned around at least a portion of the camera 15. Multiple nozzles 17 are positioned around the camera 15. The nozzle 17 performs the mounting of solder balls 11 to the surface of the substrate 7 or the removal of solder balls 11 from the surface of the substrate 7. If solder balls 11 are not mounted at the required locations on the surface of the substrate 7 where they should be mounted, the nozzle 17 mounts the solder balls 11 at the required locations. If solder balls 11 are mounted at non-required locations on the surface of the substrate 7 where they should not be mounted, the nozzle 17 removes the solder balls 11 mounted at the non-required locations.

[0033] The nozzle 17 holds the solder ball 11 in a releaseable manner. A suction port is provided at the tip (lower end) of the nozzle 17. The suction port is connected to a vacuum system (not shown). The vacuum system includes a vacuum pump. When the vacuum system is activated while the solder ball 11 is in contact with the tip of the nozzle 17, the solder ball 11 is attracted and held at the tip of the nozzle 17. When the operation of the vacuum system is stopped, the solder ball 11 is released from the tip of the nozzle 17.

[0034] The head 16 supports the camera 15 and the nozzle 17, respectively. The head 16 is a plate-shaped or block-shaped member.

[0035] Figure 6 is a view of the head 16 according to the first embodiment, seen from above. In the XY plane, the outer shape of the head 16 is circular. However, in the XY plane, the outer shape of the head 16 may also be a polygon, such as a quadrilateral, hexagon, or octagon.

[0036] In the XY plane, the camera 15 is positioned in the center of the head 16. In the XY plane, an opening 16A is provided in the center of the head 16. At least a portion of the camera 15 is positioned in the opening 16A. At least a portion of the outer surface of the camera 15 is supported by the inner surface of the opening 16A.

[0037] In the XY plane, multiple nozzles 17 are arranged around the camera 15 at intervals. In one embodiment, eight nozzles 17 are arranged around the camera 15 at equal intervals. Alternatively, four, ten, or twelve nozzles 17 may be arranged around the camera 15. Any number of nozzles 17 may be arranged. The head 16 also has multiple openings 16B provided around the opening 16A. The number of openings 16B is the same as the number of nozzles 17. One nozzle 17 is placed in each opening 16B. Multiple openings 16B are provided around the opening 16A at intervals. At least a portion of the nozzle 17 is placed in an opening 16B. At least a portion of the outer surface of the nozzle 17 is supported by the inner surface of the opening 16B.

[0038] Camera 15 is fixed to head 16. The relative position between camera 15 and head 16 does not change substantially.

[0039] The nozzle 17 is movably supported by the head 16. Multiple nozzles 17 are independently movable. The nozzle 17 moves from a retracted position toward a processing position. As shown in Figure 5, the retracted position of the nozzle 17 is a position where the nozzle 17 is located above the substrate 7. When the nozzle 17 is in the retracted position, it is located outside the field of view FV. The processing position of the nozzle 17 is a position where the tip of the nozzle 17 is close to the surface of the substrate 7. When the nozzle 17 is in the processing position, it performs the loading of solder balls 11 onto the surface of the substrate 7 or the removal of solder balls 11 from the surface of the substrate 7. When the nozzle 17 is in the processing position, the tip of the nozzle 17 is located inside the field of view FV.

[0040] When the nozzle 17 moves from the retracted position to the processing position, that is, when it moves to approach the surface of the substrate 7, it moves in a direction inclined with the optical axis AX of the camera 15. The nozzle 17 moves in a direction inclined with the optical axis AX of the camera 15 to approach the surface of the substrate 7. The nozzle 17 moves so that the tip of the nozzle 17 approaches the optical axis AX as it approaches the surface of the substrate 7.

[0041] When the nozzle 17 moves from the processing position to the retracted position, that is, when it moves away from the surface of the substrate 7, it moves in a direction inclined with the optical axis AX of the camera 15. The nozzle 17 moves in a direction inclined with the optical axis AX of the camera 15 so as to move away from the surface of the substrate 7. The nozzle 17 moves so that the tip of the nozzle 17 moves away from the optical axis AX as it moves away from the surface of the substrate 7.

[0042] As shown in Figure 5, in this embodiment, the nozzle 17 moves along a linear trajectory DL to approach the substrate 7. The nozzle 17 moves along the linear trajectory DL from a retracted position to a processing position. The nozzle 17 moves along the linear trajectory DL from a processing position to a retracted position.

[0043] <Controller> Figure 7 is a hardware configuration diagram showing a controller 18 according to the first embodiment. The controller 18 includes a computer system. The controller 18 has a processor 18A such as a CPU (Central Processing Unit), a main memory 18B including non-volatile memory such as ROM (Read Only Memory) and volatile memory such as RAM (Random Access Memory), a storage 18C, and an interface 18D including input / output circuits and communication circuits. The functions of the controller 18 are stored in the storage 18C as a computer program. The processor 18A reads the computer program from the storage 18C, loads it into the main memory 18B, and executes processing according to the computer program. The computer program may be distributed to the controller 18 via a network.

[0044] Figure 8 is a functional block diagram showing a controller 184 according to the first embodiment. The controller 184 controls the repair device 5. The repair device 5 includes a head moving device 19 and a nozzle moving device 20. The camera 15, the head moving device 19, and the nozzle moving device 20 are each connected to the controller 184. The controller 184 outputs control commands to control at least the head moving device 19 and the nozzle moving device 20.

[0045] The head moving device 19 generates power to move the head 16. The head moving device 19 moves the head 16 in a direction parallel to the surface of the substrate 7. The head moving device 19 moves the head 16 in the XY plane. The head moving device 19 moves the head 16 in at least one of the X-axis direction and the Y-axis direction. The head moving device 19 includes, for example, an X-axis guide member that guides the head 16 in the X-axis direction, a Y-axis guide member that guides the head 16 in the Y-axis direction, an X-axis actuator that generates power to move the head 16 in the X-axis direction, and a Y-axis actuator that generates power to move the head 16 in the Y-axis direction.

[0046] The nozzle moving device 20 generates power to move the nozzle 17 relative to the head 16. The nozzle moving device 20 can move multiple nozzles 17 separately. The nozzle moving device 20 moves the nozzle 17 from a retracted position to a processing position. The nozzle moving device 20 moves the nozzle 17 from a processing position to a retracted position. The nozzle moving device 20 moves the nozzle 17 along a trajectory DL. The nozzle moving device 20 includes, for example, a nozzle guide member that guides the nozzle 17 along the trajectory DL, and a nozzle actuator that generates power to move the nozzle 17 along the trajectory DL.

[0047] The controller 184 has multiple functional units. The functions of the controller 184's functional units are performed by the processor 18A. In this embodiment, the controller 184 has, as functional units, an image acquisition unit 21, an inspection unit 22, a head control unit 23, and a nozzle control unit 24.

[0048] The image acquisition unit 21 acquires image data representing the image captured by the camera 15. The image acquisition unit 21 acquires the image of the substrate 7 captured by the camera 15.

[0049] The inspection unit 22 determines the state of the substrate 7 based on the image of the substrate 7 captured by the camera 15. The state of the substrate 7 includes the mounting state of the solder balls 11 on the substrate 7. The inspection unit 22 determines the mounting state of the solder balls 11 on the substrate 7 based on the image of the substrate 7 captured by the camera 15. The determination of the mounting state of the solder balls 11 includes determining whether the solder balls 11 are properly mounted on the electrodes of the substrate 7 via the flux 8. The determination of the mounting state of the solder balls 11 includes determining whether the solder balls 11 are mounted at the required positions on the surface of the substrate 7 where they should be mounted, and determining whether the solder balls 11 are mounted at non-required positions on the surface of the substrate 7 where they should not be mounted.

[0050] As described above, the mounting status of the solder balls 11 is inspected in the full-surface inspection device 4. The controller 183 of the full-surface inspection device 4 outputs a determination result of whether or not the solder balls 11 are mounted at the requested position, based on the actual position of the solder balls 11 and the requested position of the solder balls 11. The controller 183 of the full-surface inspection device 4 transmits the solder ball mounting data, including the actual position of the solder balls 11, the requested position of the solder balls 11, and the determination result of whether or not the solder balls 11 are mounted at the requested position, to the controller 184 of the repair device 5. The inspection unit 22 receives the mounting data from the controller 183 of the full-surface inspection device 4. The inspection unit 22 verifies the mounting data transmitted from the controller 183 of the full-surface inspection device 4 based on the image of the substrate 7 captured by the camera 15. The inspection unit 22 verifies whether or not the mounting data is correct based on the image of the substrate 7 captured by the camera 15. The inspection unit 22 checks the result of determining whether or not solder balls 11 are mounted at the required position, based on the image of the substrate 7 captured by the camera 15.

[0051] The head control unit 23 outputs control commands to control the movement of the head 16. The head control unit 23 also outputs control commands to control the head moving device 19.

[0052] The nozzle control unit 24 outputs control commands to control the operation of the nozzle 17. The operation of the nozzle 17 includes a holding operation in which the tip of the nozzle 17 attracts and holds the solder ball 11, and a release operation in which the solder ball 11 held by the tip of the nozzle 17 is released. The nozzle control unit 24 outputs control commands to control the nozzle moving device 20.

[0053] <Operation> Next, the operation of the repair device 5 will be described. If the solder balls 11 are not placed at the required location on the surface of the circuit board 7, the repair device 5 will place the solder balls 11 at the required location.

[0054] Figure 9 is a diagram illustrating the operation of the repair device 5 according to the first embodiment in which solder balls 11 are mounted. In this embodiment, the required locations where solder balls 11 should be mounted are the locations on the surface of the substrate 7 where flux 8 is present. In the example shown in Figure 9, solder balls 11 are not mounted on the required locations of flux 8A and flux 8B. The full-surface inspection device 4 detects that solder balls 11 are not mounted on flux 8A and flux 8B. The controller 183 of the full-surface inspection device 4 transmits mounting data indicating that solder balls 11 are not mounted on flux 8A and flux 8B to the controller 184 of the repair device 5. The inspection unit 22 receives the mounting data indicating that solder balls 11 are not mounted on flux 8A and flux 8B.

[0055] The inspection unit 22 outputs a control command to mount the solder balls 11 at the requested position based on the mounting data transmitted from the controller 183 of the full-surface inspection device 4. The repair device 5 has a solder ball housing section that houses a plurality of solder balls 11. The solder ball housing section is located away from the substrate 7. Flux 8 may be pre-applied to the solder balls 11 housed in the solder ball housing section. The inspection unit 22 outputs a control command to cause the nozzle 17 to attract and hold the solder balls 11 in the solder ball housing section. The head control unit 23 moves the head 16 so that the nozzle 17 approaches the solder ball housing section. The nozzle control unit 24 controls the nozzle 17 so that it attracts and holds the solder balls 11 in the solder ball housing section. As shown in Figure 9, after the solder balls 11 in the solder ball housing section are attracted and held by the nozzle 17, the head 16 is positioned above the substrate 7.

[0056] The head control unit 23 controls the position of the head 16 so that the flux 8A is positioned within the field of view FV of the camera 15, based on the mounting data. The mounting data includes the actual position of the solder ball 11, the desired position of the solder ball 11, and the determination result of whether or not the solder ball 11 is mounted at the desired position. Therefore, the head control unit 23 can control the position of the head 16 so that the flux 8A is positioned within the field of view FV of the camera 15, based on the mounting data.

[0057] Camera 15 captures a predetermined area of ​​the surface of the substrate 7, including the flux 8A. The inspection unit 22 checks whether the mounting data is correct based on the image of the substrate 7 captured by camera 15. The inspection unit 22 checks the result of determining whether the solder balls 11 are mounted on the flux 8A at the required location based on the image of the substrate 7 captured by camera 15. If the inspection unit 22 determines that the solder balls 11 are not mounted on the flux 8A based on the image of the substrate 7 captured by camera 15, it determines that the mounting data is correct. If the inspection unit 22 determines that the solder balls 11 are not mounted on the flux 8A, it outputs a mounting command to mount the solder balls 11 on the flux 8A.

[0058] Figure 10 is a diagram illustrating the operation of the repair device 5 according to the first embodiment in which solder balls 11 are mounted. The nozzle control unit 24 controls the nozzle 17 so that the solder balls 11 are mounted on the flux 8A based on the mounting command output from the inspection unit 22. In the example shown in Figure 10, the nozzle control unit 24 outputs a mounting command so that nozzle 17A, one of the multiple nozzles 17, mounts the solder balls 11 on the flux 8A.

[0059] As shown in Figure 10, the nozzle 17A places solder balls 11 onto the flux 8A when the flux 8A, which is located at a required position (predetermined position) on the surface of the substrate 7, is within the field of view FA of the camera 15. When the nozzle 17A places the solder balls 11 onto the flux 8A, the head 16 is stopped. When the nozzle 17A places the solder balls 11 onto the flux 8A, the position of the head 16 is fixed. In this embodiment, the position of the head 16 is fixed from the time the camera 15 starts imaging a predetermined area on the surface of the substrate 7 including the flux 8A until the nozzle 17A completes the placement of the solder balls 11 onto the flux 8A.

[0060] With the head 16 stopped and the flux 8A positioned in the field of view FV, the nozzle 17A is moved along the trajectory DL so as to approach the flux 8A for loading the solder ball 11. The nozzle 17A moves along the trajectory DL from the retracted position to the processing position while holding the solder ball 11 by suction. The nozzle 17A is moved in a direction that is inclined toward the optical axis AX of the camera 15 so as to approach the flux 8A.

[0061] After the solder ball 11, which is held by the nozzle 17A, comes into contact with the flux 8A, the nozzle 17A releases its hold on the solder ball 11. As a result of the release of the nozzle 17A's hold on the solder ball 11, the solder ball 11 is loaded onto the flux 8A.

[0062] After the solder balls 11 are mounted on the flux 8A, the nozzle 17A moves from the processing position to the retracted position along the trajectory DL. The flux 8A remains within the field of view FV even during the period when the nozzle 17A moves from the processing position to the retracted position. After the nozzle 17A moves outside the field of view FV, the inspection unit 22 can confirm whether or not the solder balls 11 have been mounted on the flux 8A based on the image of the substrate 7 captured by the camera 15.

[0063] Before the nozzle 17A places the solder balls 11 onto the flux 8A, it is positioned in a retracted position outside the field of view FV. With the nozzle 17A in the retracted position, the camera 15 starts imaging a predetermined area of ​​the surface of the substrate 7, including the flux 8A. Based on the image of the predetermined area of ​​the substrate 7 surface captured by the camera 15, if it is determined that no solder balls 11 are present on the flux 8A, the nozzle 17A starts placing the solder balls 11. The nozzle 17A moves from the retracted position to the processing position along the trajectory DL and then places the solder balls 11 onto the flux 8A. After the solder balls 11 are placed on the flux 8A, the nozzle 17A moves from the processing position back to the retracted position along the trajectory DL. During the period from when the nozzle 17A moves from the retracted position to the processing position and places the solder balls 11 onto the flux 8A until it moves back from the processing position to the retracted position, the position of the head 16 remains fixed, and the camera 15 continues to image a predetermined area of ​​the surface of the substrate 7, including the flux 8A. The inspection unit 22 can confirm, based on the image of the substrate 7 captured by the camera 15, that no solder balls 11 were placed on the flux 8A before the solder balls 11 were placed by the nozzle 17A, and that solder balls 11 were placed on the flux 8A after the solder balls 11 were placed by the nozzle 17A.

[0064] Figure 11 is a diagram illustrating the operation of the repair device 5 according to the first embodiment in which the solder balls 11 are mounted. After the solder balls 11 are mounted on the flux 8A, the inspection unit 22 outputs a mounting command to mount the solder balls 11 on the flux 8B.

[0065] Before the nozzle 17B places the solder balls 11 onto the flux 8B, it is positioned in a retracted position outside the field of view FV. With the nozzle 17B in the retracted position, the camera 15 begins imaging a predetermined area of ​​the substrate 7 surface, including the flux 8B. Based on the image of the predetermined area of ​​the substrate 7 surface captured by the camera 15, if it is determined that no solder balls 11 are present on the flux 8B, the nozzle 17B begins to place the solder balls 11. The nozzle 17B moves from the retracted position to the processing position along the trajectory DL and then places the solder balls 11 onto the flux 8B. After the solder balls 11 are placed on the flux 8B, the nozzle 17B moves from the processing position back to the retracted position along the trajectory DL. During the period from when the nozzle 17B moves from the retracted position to the processing position and places the solder balls 11 onto the flux 8B until it moves back from the processing position to the retracted position, the position of the head 16 remains fixed, and the camera 15 continues to image a predetermined area of ​​the substrate 7 surface, including the flux 8B. The inspection unit 22 can confirm, based on the image of the substrate 7 captured by the camera 15, that no solder balls 11 were placed on the flux 8B before the solder balls 11 were placed by the nozzle 17B, and that solder balls 11 were placed on the flux 8B after the solder balls 11 were placed by the nozzle 17B.

[0066] Next, the operation of removing solder balls 11 located in non-requested positions will be described. If solder balls 11 are located in non-requested positions on the surface of the substrate 7, the repair device 5 removes the solder balls 11 located in the non-requested positions.

[0067] Figure 12 is a diagram illustrating the operation of the repair device 5 according to the first embodiment to remove solder balls 11. In this embodiment, non-request locations where solder balls 11 should not be mounted include locations on the surface of the substrate 7 where flux 8 is absent. In the example shown in Figure 12, solder balls 11C are mounted in non-request locations where flux 8 is absent. The full-surface inspection device 4 detects that solder balls 11C are mounted in non-request locations. The controller 183 of the full-surface inspection device 4 transmits mounting data indicating that solder balls 11C are mounted in non-request locations to the controller 184 of the repair device 5. The inspection unit 22 receives mounting data indicating that solder balls 11C are mounted in non-request locations.

[0068] The inspection unit 22 outputs a control command to remove solder balls 11C from non-requested positions based on mounting data transmitted from the controller 183 of the full-surface inspection device 4. As shown in Figure 12, a head 16 supporting a nozzle 17 that does not hold solder balls 11 is positioned above the substrate 7.

[0069] The head control unit 23 controls the position of the head 16 based on the mounting data so that solder balls 11C mounted at non-requested positions are positioned within the field of view FV of the camera 15. The mounting data includes the actual position of the solder ball 11, the non-requested positions of the solder ball 11, and the determination result of whether or not the solder ball 11 is mounted at the non-requested positions. Therefore, the head control unit 23 can control the position of the head 16 based on the mounting data so that the solder balls 11C are positioned within the field of view FV of the camera 15.

[0070] Camera 15 captures a predetermined area of ​​the surface of the substrate 7, including the solder ball 11C. The inspection unit 22 checks whether the mounting data is correct based on the image of the substrate 7 captured by camera 15. The inspection unit 22 checks the result of determining whether the solder ball 11C is mounted at an unrequired location based on the image of the substrate 7 captured by camera 15. If the inspection unit 22 determines that the solder ball 11C is mounted at an unrequired location based on the image of the substrate 7 captured by camera 15, it determines that the mounting data is correct. If the inspection unit 22 determines that the solder ball 11C is mounted at an unrequired location, it outputs a removal command to remove the solder ball 11C from the unrequired location.

[0071] Figure 13 is a diagram illustrating the operation of the repair device 5 according to the first embodiment to remove the solder ball 11. The nozzle control unit 24 controls the nozzle 17 so that the solder ball 11C is removed based on the removal command output from the inspection unit 22. In the example shown in Figure 13, the nozzle control unit 24 outputs a removal command so that nozzle 17A among the plurality of nozzles 17 removes the solder ball 11C.

[0072] As shown in Figure 13, the nozzle 17A removes the solder ball 11 from a non-requested position (a predetermined position) on the surface of the substrate 7 when that position is within the field of view FV of the camera 15. When the nozzle 17A is about to remove the solder ball 11C, the head 16 is stopped. When the nozzle 17A removes the solder ball 11C from the substrate 7, the position of the head 16 is fixed. In this embodiment, the position of the head 16 is fixed from the time the camera 15 starts imaging a predetermined area on the surface of the substrate 7 including the solder ball 11C until the nozzle 17A completes the removal of the solder ball 11C.

[0073] With the head 16 stopped and the solder ball 11C positioned in the field of view FV, the nozzle 17A is moved along the trajectory DL so as to approach the solder ball 11C in order to remove the solder ball 11C. The nozzle 17A moves along the trajectory DL from a retracted position to a processing position. The nozzle 17A is moved in a direction that is inclined toward the optical axis AX of the camera 15 so as to approach the solder ball 11C.

[0074] After the tip of the nozzle 17A comes into contact with the solder ball 11C, the nozzle 17A begins to attract and hold the solder ball 11C.

[0075] Figure 14 is a diagram illustrating the operation of the repair apparatus 5 according to the first embodiment to remove the solder ball 11. As shown in Figure 14, after the solder ball 11C is attracted and held by the nozzle 17A, the nozzle 17A moves from the processing position to the retracted position along the trajectory DL. Even during the period when the nozzle 17A moves from the processing position to the retracted position, the non-requested position remains within the field of view FV. After the nozzle 17A moves outside the field of view FV, the inspection unit 22 can confirm whether or not the solder ball 11C has been removed from the non-requested position based on the image of the substrate 7 captured by the camera 15.

[0076] Before removing the solder balls 11C from the substrate 7, the nozzle 17A is positioned in a retracted position outside the field of view FV. With the nozzle 17A in the retracted position, the camera 15 starts imaging a predetermined area of ​​the substrate 7 surface, including the solder balls 11C. Based on the image of the predetermined area of ​​the substrate 7 surface captured by the camera 15, if it is determined that the solder balls 11C are located in an undesired position, the removal of the solder balls 11C by the nozzle 17A is started. The nozzle 17A moves from the retracted position to the processing position along the trajectory DL and then attracts and holds the solder balls 11C. After the solder balls 11C are attracted and held by the nozzle 17A, the nozzle 17A moves from the processing position to the retracted position along the trajectory DL. During the period from when the nozzle 17A moves from the retracted position to the processing position and attracts and holds the solder balls 11C until it moves from the processing position to the retracted position, the position of the head 16 remains fixed, and the camera 15 continues to image a predetermined area of ​​the substrate 7 surface, including the undesired position. The inspection unit 22 can confirm, based on the image of the substrate 7 captured by the camera 15, that the solder balls 11C were mounted in non-requested positions before removal by the nozzle 17A, and that the solder balls 11C were removed from the substrate 7 after removal by the nozzle 17A.

[0077] <Effects> As described above, the repair device 5 includes a camera 15 that images the substrate 7 after the solder ball 11 mounting process has been completed, and a plurality of nozzles 17 arranged around at least a portion of the camera 15, which perform the mounting of solder balls 11 to a predetermined position (required position) or removal of solder balls 11 from a predetermined position (non-required position) when a predetermined position (required position or non-required position) on the surface of the substrate 7 is located within the field of view FV of the camera 15.

[0078] According to this embodiment, the cycle time, which is the time required for repair processing of one substrate 7 (processing of mounting solder balls 11 or removing solder balls 11), is suppressed to be prolonged. Since the mounting of solder balls 11 to the required position or removal of solder balls 11 from the non-required position is performed by the nozzle 17 while the required or non-required position on the surface of the substrate 7 is located within the field of view FV of the camera 15, there is no need to move the camera 15 and the nozzle 17 significantly between the start of imaging of a predetermined position (required or non-required position) by the camera 15 and the mounting or removal of solder balls 11 by the nozzle 17. Therefore, the cycle time is suppressed to be prolonged. Since the cycle time is suppressed to be prolonged, the decrease in device productivity is suppressed.

[0079] Furthermore, during the period in which the nozzle 17 is mounting the solder balls 11 or the period in which the nozzle 17 is removing the solder balls 11, the camera 15 can continue to image a predetermined position (required position or non-required position). By the camera 15 continuously imaging the required position, the inspection unit 22 can confirm that the solder balls 11 are not mounted at the required position before the nozzle 17 mounts them, and that the solder balls 11 are mounted at the required position after the nozzle 17 mounts them. By the camera 15 continuously imaging the non-required position, the inspection unit 22 can confirm that the solder balls 11 are mounted at the non-required position before the nozzle 17 removes them, and that the solder balls 11 are not mounted at the non-required position after the nozzle 17 removes them.

[0080] [Second Embodiment] A second embodiment will now be described. In the following description, components that are the same as or equivalent to those in the first embodiment described above will be denoted by the same reference numerals, and the descriptions of those components will be simplified or omitted.

[0081] Figure 15 is a schematic diagram showing a repair device 105 according to the second embodiment. Figure 16 is a view of the head 16 according to the second embodiment from above. In the second embodiment, the head 16 supports a plurality of projectors 25. The projectors 25 are arranged around at least a portion of the camera 15. In this embodiment, four nozzles 17 and four projectors 25 are arranged around the camera 15. One nozzle 17 and one projector 25 are arranged alternately. At least a portion of the projectors 25 are arranged in an opening 16C provided in the head 16. One projector 25 is arranged in one opening 16C. The projectors 25 are supported on the inner surface of the opening 16C.

[0082] In this embodiment, the repair device 105 can detect the three-dimensional shape of the substrate 7. The repair device 105 detects the three-dimensional shape of the surface of the substrate 7 based on the phase shift method. The projector 25 projects sinusoidal stripe pattern light onto the surface of the substrate 7 in order to detect the three-dimensional shape of the surface of the substrate 7 based on the phase shift method. The projector 25 has an optical modulation element such as a digital mirror device (DMD) or a liquid crystal panel. The optical modulation element generates the stripe pattern light. The camera 15 images the substrate 7 onto which the stripe pattern light is projected. The inspection unit 22 can calculate the three-dimensional shape of the substrate 7 by performing calculations on the image of the substrate 7 onto which the stripe pattern light is projected based on the phase shift method.

[0083] [Third Embodiment] A third embodiment will now be described. In the following description, components that are the same as or equivalent to those in the first and second embodiments described above will be denoted by the same reference numerals, and their descriptions will be simplified or omitted.

[0084] In the embodiments described above, the substrate processing apparatus was assumed to be a repair apparatus 5(105). In the third embodiment, an example in which the substrate processing apparatus is a component mounting apparatus 205 will be described.

[0085] Figure 17 is a schematic diagram showing a component mounting apparatus 205 according to the third embodiment. The component mounting apparatus 205 includes a camera 15, a nozzle 217, a projector 25, and a head 16. The head 16 supports the camera 15, the nozzle 217, and the projector 25, respectively. In this embodiment, the nozzle 217 is a mounting nozzle that mounts a component 26 to a mounting position (predetermined position) on the surface of a substrate 27. The nozzle 217 mounts the component 26 to the mounting position on the surface of the substrate 27. The nozzle 217 holds the component 26 in a releaseable manner. The component 26 is held by suction at the tip of the nozzle 217.

[0086] The nozzle 217 is positioned in an opening 16D provided in the head 16. The nozzle 217 is movably supported on the inner surface of the opening 16D. In this embodiment, the nozzle 217 is moved in a direction parallel to the optical axis AX of the camera 15 to approach the mounting position on the surface of the substrate 27. The trajectory DL of the nozzle 17 is parallel to the optical axis AX.

[0087] Figure 18 is a diagram illustrating the operation of a component mounting apparatus 205 according to the second embodiment in which a component 26 is mounted on a substrate 27. As shown in Figure 18, the nozzle 217 mounts the component 26 to the mounting position (determined position) on the surface of the substrate 27 when the mounting position is located within the field of view FV of the camera 15. When the nozzle 217 mounts the component 26 to the substrate 27, the head 16 is stopped. That is, when the nozzle 217 mounts the component 26 to the substrate 27, the position of the head 16 is fixed. In this embodiment, the position of the head 16 is fixed from the time the camera 15 starts imaging a predetermined area of ​​the surface of the substrate 27 including the mounting position until the nozzle 217 completes mounting the component 26.

[0088] With the head 16 stopped and the mounting position positioned within the field of view FV, the nozzle 217 is moved along the trajectory DL to approach the mounting position on the surface of the substrate 27 in order to mount the component 26. The nozzle 217 moves along the trajectory DL from the retracted position to the processing position. The nozzle 217 is moved in a direction parallel to the optical axis AX of the camera 15 to approach the mounting position on the surface of the substrate 27.

[0089] After the component 26 touches the surface of the substrate 27, the suction holding of the component 26 by the nozzle 217 is released, and the component 26 is mounted in the mounting position on the substrate 27.

[0090] Figure 19 is a diagram illustrating the operation of a component mounting apparatus 205 according to the third embodiment in which a component 26 is mounted on a substrate 27. As shown in Figure 19, after the component 26 is mounted on the substrate 27, the nozzle 217 moves from the processing position to the retracted position along the trajectory DL. Even during the period when the nozzle 217 moves from the processing position to the retracted position, the mounting position on the surface of the substrate 27 remains within the field of view FV. After the nozzle 217 moves outside the field of view FV, the inspection unit 22 can confirm whether or not the component 26 has been mounted on the mounting position on the surface of the substrate 27 based on the image of the substrate 27 captured by the camera 15.

[0091] Before the component 26 is mounted on the substrate 27, the nozzle 217 is positioned in a retracted position outside the field of view FV. With the nozzle 217 in the retracted position, the camera 15 starts imaging a predetermined area of ​​the substrate 27 surface, including the mounting position. Based on the image of the predetermined area of ​​the substrate 27 surface captured by the camera 15, if it is determined that no component is mounted at the mounting position, the nozzle 217 starts mounting the component 26. The nozzle 217 moves from the retracted position to the processing position along the trajectory DL, and then mounts the component 26 at the mounting position on the surface of the substrate 27. After the component 26 is mounted on the substrate 27, the nozzle 217 moves from the processing position to the retracted position along the trajectory DL. During the period from when the nozzle 217 moves from the retracted position to the processing position and mounts the component 26 on the substrate 27, until it moves from the processing position to the retracted position, the position of the head 16 remains fixed, and the camera 15 continues to image a predetermined area of ​​the substrate 27 surface, including the mounting position. The inspection unit 22 can confirm, based on the image of the substrate 27 captured by the camera 15, that no components are mounted at the mounting position before the nozzle 217 mounts the components 26, and that the components 26 are mounted at the mounting position on the surface of the substrate 27 after the nozzle 217 mounts the components 26. [Explanation of Symbols]

[0092] 1... PCB processing system, 2... Flux printing machine, 3... Solder ball mounting machine, 4... Full surface inspection machine, 5... Repair machine (PCB processing machine), 7... PCB, 8... Flux, 8A... Flux, 8B... Flux, 9... Mask for flux, 9A... Opening, 10... Squeegee, 11... Solder ball, 11C... Solder ball, 12... Mask for solder ball, 12A... Opening, 13... Squeegee, 14... Full surface inspection camera, 15... Camera, 16... Head, 16A... Opening, 16B... Opening, 16C... Opening, 16D... Opening, 17... Nozzle, 17A... Nozzle, 17B... Nozzle 18...Controller, 18A...Processor, 18B...Main memory, 18C...Storage, 18D...Interface, 19...Head moving device, 20...Nozzle moving device, 21...Image acquisition unit, 22...Inspection unit, 23...Head control unit, 24...Nozzle control unit, 25...Projector, 26...Components, 27...Substrate, 105...Repair device (substrate processing device), 181...Controller, 182...Controller, 183...Controller, 184...Controller, 205...Component mounting device (substrate processing device), 217...Nozzle, AX...Optical axis, FV...Field of view, DL...Orbit.

Claims

1. A camera for imaging the circuit board, The system includes a plurality of nozzles arranged around at least a portion of the camera, which perform the loading of an object onto or removal of an object from a predetermined position, while the predetermined position on the surface of the substrate is within the field of view of the camera. Circuit board processing equipment.

2. A head supporting the camera and the nozzle, A head moving device that moves the head in a direction parallel to the surface of the substrate, The system includes a nozzle moving device for moving the nozzle relative to the head, With the head stopped and the predetermined position positioned within the field of view, the nozzle is moved to approach the predetermined position for the purpose of loading or removing the object. The substrate processing apparatus according to claim 1.

3. The aforementioned object is a solder ball, The nozzle is moved in a direction inclined toward the optical axis of the camera so as to approach the predetermined position. The substrate processing apparatus according to claim 2.

4. The aforementioned object is a component, The nozzle is moved in a direction parallel to the optical axis of the camera so as to approach the predetermined position. The substrate processing apparatus according to claim 2.

5. A camera that images the circuit board after the solder ball mounting process is complete, The device comprises a plurality of nozzles arranged around the camera, which perform the placement of solder balls to or removal of solder balls from a predetermined position, with the predetermined position on the surface of the substrate located within the camera's field of view. Repair device.

6. A head supporting the camera and the nozzle, A head moving device that moves the head in a direction parallel to the surface of the substrate, The system includes a nozzle moving device for moving the nozzle relative to the head, With the head stopped and the predetermined position positioned within the field of view, the nozzle is moved in a direction inclined toward the optical axis of the camera so as to approach the predetermined position for the purpose of mounting or removing solder balls. The repair device according to claim 5.

Images