Flow substrate and flow substrate mounting structure

Abstract

Alignment fixtures are used to align a flow substrate mounting structure with multiple flow substrates. [Solution] The flow board mounting structure 1002 comprises fastener openings 1004A, 1004B and alignment features. The alignment features comprise at least one of an alignment pin 1016A, an alignment slot 1216, and an alignment step 1116, which are detachably coupled to the flow board mounting structure. A structure for coupling multiple flow boards comprises a flow board mounting structure having a first fastener opening 1004A and a second fastener opening 1004B. The first fastener opening is configured to couple with a first fastener 1014A, and the second fastener opening is configured to couple with a second fastener 1014B.

Description

Technical Field

[0001] The present disclosure is directed to mounting structures for fluid delivery systems, and more particularly, to surface-mounted fluid delivery systems for use in semiconductor processing and petrochemical industries with extreme flow rates and / or high temperatures.

Background Art

[0002] Fluid delivery systems are used in many modern industrial processes to regulate and manipulate the flow of fluids in order to provide a controlled reception of a desired substance into a process. Those skilled in the art have developed an entire class of fluid delivery systems having fluid processing components removably attached to flow substrates with fluid path conduits. Many fluid delivery systems utilize some intermediate structure for mounting a flow substrate, manifold, or fluid delivery stick to a support surface. In most cases, these structures are specific to the design of a particular fluid delivery system and are not usable with alternative designs.

[0003] The arrangement of such flow substrates establishes a flow sequence in which the fluid processing components provide the desired fluid regulation and control. The interface between such flow substrates and removable fluid processing components is standardized and has little variation. The design of such fluid delivery systems is often described as modular or surface-mount systems. Typical applications of surface-mount fluid delivery systems include gas panels used in semiconductor manufacturing equipment and sampling systems used in petrochemical refining. Many types of manufacturing equipment used to carry out process steps for manufacturing semiconductors are collectively called tools. Embodiments of this disclosure generally relate to fluid delivery systems, such as fluid delivery systems for semiconductor processing, and in particular to surface-mount fluid delivery systems suitable for use in extreme flow rate and / or high-temperature applications in which the process fluid is heated to a higher temperature than the ambient temperature. Aspects of this disclosure are applicable to structures for mounting surface-mount fluid delivery systems on support structures or manifolds, whether of a local nature or dispersed around semiconductor processing tools.

[0004] Patent Document 1, published on July 30, 2013, which is incorporated herein by reference, describes a fluid delivery system that may include fluid paths that route the fluid not only laterally but also longitudinally from the inlet to the outlet of the flow substrate. As described therein, the fluid paths may be formed on the substrate surface opposite to the surface to which the fluid handling member is attached and sealed with a cap. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] U.S. Patent No. 8496029 [Patent Document 2] U.S. Patent No. 8307854 [Patent Document 3] U.S. Patent No. 6,394,138 [Patent Document 4] U.S. Patent No. 7307247 [Overview of the project] [Problems that the invention aims to solve]

[0006] An assembly of fluid handling components assembled in a sequence intended to handle a single type of fluid is often called a fluid delivery stick. An apparatus subsystem consisting of multiple fluid delivery sticks intended to deliver process fluids to a particular semiconductor processing chamber is often called a gas panel. In the 1990s, several inventors addressed the maintainability and size issues of gas panels by creating fluid delivery sticks in which the fluid flow path is typically composed of a passive metal structure with conduits through which the process fluid travels, and to which valves and similar active (and passive) fluid handling components are detachably attached. Passive fluid flow path elements have been variously referred to as manifolds, substrates, blocks, and so on. In this disclosure, we choose to use the term flow substrate to describe a fluid delivery system element having a passive fluid flow path which may have other attached fluid handling devices. [Means for solving the problem]

[0007] The flow substrate may form part of a fluid delivery stick, the entire fluid delivery stick, or an entire fluid delivery panel, which in conventional designs would comprise a number of individual fluid delivery sticks. Similar to the fluid delivery system described in Patent Document 2, in which the individual fluid delivery stick brackets are mounted on a support surface, the fluid flow substrate described in Patent Document 1 is also mounted on a support surface.

[0008] The applicant appreciates that virtually all fluid delivery systems utilize some kind of intermediate structure to mount the fluid flow substrate, manifold, or fluid delivery stick to the support surface. In most cases, these structures are specific to the design of the particular fluid delivery system and cannot be used in alternative designs. [Brief explanation of the drawing]

[0009] [Figure 1A] A diagram showing an implementation structure consistent with the embodiments of this disclosure. [Figure 1B] A diagram showing an implementation structure consistent with the embodiments of this disclosure. [Figure 1C] A diagram showing an implementation structure consistent with the embodiments of this disclosure. [Figure 1D] A diagram showing an implementation structure consistent with the embodiments of this disclosure. [Figure 2A] A figure showing various fluid flow substrates consistent with embodiments of the present disclosure. [Figure 2B] A figure showing various fluid flow substrates consistent with embodiments of the present disclosure. [Figure 2C] A figure showing various fluid flow substrates consistent with embodiments of the present disclosure. [Figure 3A] A plan view of a portion of a fluid delivery system consistent with an embodiment of the present disclosure is shown. [Figure 3B] An end view of a portion of a fluid delivery system consistent with an embodiment of the present disclosure is shown. [Figure 3C] An end view of a portion of a fluid delivery system consistent with an embodiment of the present disclosure is shown. [Figure 3D] A perspective view of a portion of a fluid delivery system consistent with an embodiment of the present disclosure is shown. [Figure 3E] A perspective view of a portion of a fluid delivery system consistent with an embodiment of the present disclosure is shown. [Figure 4A] Two different isometric views are shown of embodiments of the present disclosure in which a fluid flow substrate and a combination of the fluid flow substrate and manifold may be used to mount a support surface, consistent with the embodiments of the present disclosure. [Figure 4B] Two different isometric views of aspects in which embodiments of the present disclosure can be used to mount a fluid flow substrate, and a combination of a fluid flow substrate and a manifold, on a support surface are shown. [Figure 5] An aspect is shown in which a fluid flow substrate and a manifold may be aligned and attached to each other in accordance with an embodiment of the present disclosure. [Figure 6] A method is illustrated in which an implementation structure of the present disclosure may be used with an integrated fluid flow substrate that may form part or all of a fluid delivery panel in accordance with an embodiment of the present disclosure. [Figure 7A] A fluid delivery stick bracket that is no longer required in accordance with an embodiment of the present disclosure, as described in Patent Document 1, is illustrated. [Figure 7B] A method is illustrated in which an embodiment of the present disclosure may be used with conventional fluid delivery flow substrates and manifolds such as K1S. [Figure 8A] A modular flow substrate 800 to which one or more implementation structures of the present disclosure are attached is illustrated in accordance with an embodiment of the present disclosure. [Figure 8B] A modular flow substrate 800 to which one or more implementation structures of the present disclosure are attached is illustrated in accordance with an embodiment of the present disclosure. [Figure 8C] A modular flow substrate 800 to which one or more implementation structures of the present disclosure are attached is illustrated in accordance with an embodiment of the present disclosure. [Figure 8D] A modular flow substrate 800 to which one or more implementation structures of the present disclosure are attached is illustrated in accordance with an embodiment of the present disclosure. [Figure 8E] A modular flow substrate 800 to which one or more implementation structures of the present disclosure are attached is illustrated in accordance with an embodiment of the present disclosure. [Figure 8F] A modular flow substrate 800 to which one or more implementation structures of the present disclosure are attached is illustrated in accordance with an embodiment of the present disclosure. [Figure 8G] In accordance with the embodiments of this disclosure, a modular flow board 800 to which one or more mounting structures of this disclosure are attached is shown. [Figure 8H] In accordance with the embodiments of this disclosure, a modular flow board 800 to which one or more mounting structures of this disclosure are attached is shown. [Figure 8I] In accordance with the embodiments of this disclosure, a modular flow board 800 to which one or more mounting structures of this disclosure are attached is shown. [Figure 8J] In accordance with the embodiments of this disclosure, a modular flow board 800 to which one or more mounting structures of this disclosure are attached is shown. [Figure 9A] An exemplary top view of a flow substrate coupled to a substrate mounting structure, consistent with the embodiments of this disclosure, is shown. [Figure 9B1] Figure 9A shows a perspective view of the implementation structure consistent with the embodiments of this disclosure. [Figure 9B2] Figures 9A to 9B1 show perspective views of the mounting structure having an alignment fixture, consistent with the embodiments of this disclosure. [Figure 9C] Figures 9A to 9B1 show cross-sectional views of the mounting structure, which are consistent with the embodiments of this disclosure. [Figure 9D] Figures 9A to 9B1 show bottom views of the mounting structure, which is consistent with the embodiments of this disclosure. [Figure 10A] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 10B] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 10C] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 10D] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 10E] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 11A] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 11B]Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 11C] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 11D] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 12A] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 12B] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 12C] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 12D] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 12E] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 13A] An example of a mounting structure having an alignment frame for oriented and supporting the mounting structure with respect to a flow substrate, consistent with embodiments of this disclosure, is shown. [Figure 13B] An example of a mounting structure having an alignment frame for oriented and supporting the mounting structure with respect to a flow substrate, consistent with embodiments of this disclosure, is shown. [Figure 13C] An example of a mounting structure having an alignment frame for oriented and supporting the mounting structure with respect to a flow substrate, consistent with embodiments of this disclosure, is shown. [Figure 13D] An example of a mounting structure having an alignment frame for oriented and supporting the mounting structure with respect to a flow substrate, consistent with embodiments of this disclosure, is shown. [Figure 13E] An example of a mounting structure having an alignment frame for oriented and supporting the mounting structure with respect to a flow substrate, consistent with embodiments of this disclosure, is shown. [Figure 14A] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 14B] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 14C]Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Figure 14D] Another example of an implementation structure consistent with the embodiments of this disclosure is shown. [Modes for carrying out the invention]

[0010] This disclosure is directed toward fluid delivery systems, and more particularly toward structures for mounting fluid delivery system components, such as flow substrates and manifolds, onto support surfaces. Several embodiments of systems comprising modular flow substrates, mounting structures, and combinations thereof are disclosed herein. Details of various embodiments of this disclosure are described below with specific reference to the figures. The modular flow substrates, mounting structures, and systems disclosed herein are not limited to the specific examples described below, nor are they illustrated in the drawings. Furthermore, the expressions and terms used herein are for illustrative purposes only and should not be considered limiting. The terms “equipment,” “constitute,” “have,” “contain,” “include,” and their variations as used herein are intended to encompass the items and equivalents described thereafter, as well as additional items.

[0011] It should be understood that the fluid substance operated in the fluid delivery flow substrate of this embodiment may be a gas, a liquid, or a vapor substance that can change between liquid and gas phases depending on the specific temperature and pressure of the substance. Typical fluid substances may be pure elements such as argon (Ar), gaseous compounds such as boron trichloride (BC13), mixtures of silicon tetrachloride (SiC14) in a carrier gas that is normally liquid, or aqueous reagents.

[0012] Patent Document 2, published on November 13, 2012, incorporated herein by reference, describes a surface-mount fluid delivery system in which individual fluid flow substrates having fluid handling components mounted on top are mounted on standardized brackets to form fluid delivery sticks in which fluid passages within the flow substrates route fluid longitudinally from the inlet to the outlet of the fluid delivery sticks. As described therein, a second layer forming below the plane of the flow substrate, and a manifold mountable to the flow substrate from above the flow substrate, may be used to route fluid laterally between a plurality of adjacent fluid delivery sticks and along each fluid delivery stick. Advantageously, the fluid flow substrates, manifolds, and fluid delivery stick brackets may be manufactured in a cost-effective manner, and individual fluid delivery sticks may be removed and replaced as an integrated unit by simply removing fasteners associated with one or more manifolds and any fasteners associated with mounting the fluid delivery stick brackets to a support surface.

[0013] Patent Document 1, published on July 30, 2013, incorporated herein by reference, describes an alternative surface-mount fluid delivery system in which a fluid flow substrate may have fluid paths that route fluid not only laterally but also longitudinally from the inlet to the outlet of the flow substrate. As described therein, the fluid paths may be formed on the substrate surface opposite to the surface on which the fluid handling member is mounted and sealed with a cap. These flow substrates may form part of a fluid delivery stick, form an entire fluid delivery stick, or form an entire fluid delivery panel, which in conventional designs would consist of a number of individual fluid delivery sticks. Similar to the fluid delivery system described in Patent Document 2, in which individual fluid delivery stick brackets are mounted on a support surface, the fluid flow substrate described in Patent Document 1 is also mounted on a support surface.

[0014] The applicant understands that virtually all fluid delivery systems utilize some kind of intermediate structure to mount a fluid flow substrate, manifold, or fluid delivery stick to a support surface. In most cases, these structures are specific to a particular fluid delivery system design and cannot be used in alternative designs. In light of this understanding, the embodiments described herein are directed toward a mounting structure that can be used to mount a wide variety of fluid flow substrates, and combinations of fluid flow substrates and manifolds, to a support surface. According to one aspect of the embodiments described herein, the mounting structure can be used with conventional fluid substrate designs, such as those described in Patent Document 3, incorporated herein by reference, and known in the semiconductor processing industry as "K1S," as well as with more current designs, such as those described in Patent Documents 2 and 1, and shown in Figures 1 to 14 herein. As described in further detail herein, the embodiments described herein can raise the substrate and combinations of substrates and manifolds above the surface on which they are mounted to allow for the circulation of ambient air as well as below the fluid substrate and manifold. This mounting structure can be used to mount either a substrate or a combination of substrates and manifolds to a support surface using minimal amounts of material, being compact, and using interchangeable components.

[0015] The attached drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in various figures is represented by similar numbers. For clarity, not all components may be labeled in all drawings.

[0016] Figures 1A to 1D show mounting structures according to embodiments of the present disclosure, where Figure 1A shows a mounting structure comprising a unit-type mounting body that can be used to mount a substrate to a support surface, Figure 1B shows a multi-component mounting body that can be used to mount a substrate and a manifold to a support surface, and Figure 1C shows a portion of a multi-component mounting body that can be used to mount a manifold to a substrate. The substrate, combinations of substrates and manifolds, and embodiments in which multiple manifolds can be mounted to a support surface and to each other are shown in Figures 2 to 7.

[0017] As shown in Figure 1A, in one embodiment of the present disclosure, the mounting structure comprises a modular mounting body 100 which may be used to mount a K1S flow substrate, such as that shown in Figures 1A and 1B of Patent Document 2, or a flow substrate, such as that described in Patent Document 1, onto a support surface. Although not specifically shown, the flow substrates shown in Figures 3 to 10 of Patent Document 2 may be adapted for use with the modular mounting body 100, as will be further described below. The modular mounting body 100 comprises an opening 140 extending through the modular mounting body 100, adapted to receive a fastener 110 and a fastener retainer 120, such as a helical spring. Although not shown in Figure 1A, the fastener 110 is threaded at its distal end and will be received in the threaded opening inside the support surface (not shown). The fastener retainer 120 is received within the opening 140 and acts to hold the fastener 110 in place. The modular mounting body 100 also includes openings 145, 146 adapted to receive locking pins 130 extending through openings 202 formed within recesses 201 (see Figure 2A) in the body of the fluid flow substrate 200B. As can be seen from Figure 3, access from only one direction (e.g., from above) is all that is needed to mount the substrate, fluid handling components, multiple manifolds, and mounting body to each other and to the support surface.

[0018] Figure 1B shows a mounting structure comprising a multi-component mounting body with clamps 101 and standoffs 102. As best shown in Figure 4, the multi-component mounting body is adapted to mount a fluid flow substrate, such as a fluid flow substrate 200B, and a manifold 300 as a fluid manifold to its support surface. Clamp 101 has an opening 140 extending through the body of clamp 101 and is adapted to receive fasteners 110 and fastener holders 120 in the same manner as described above with respect to Figure 1A. Clamp 101 also has an opening 145 adapted to receive a lock pin 130 extending into an opening 302 on the upper surface of the manifold 300 through an opening 202 formed in a recess 201 (see Figure 2A) in the body of the fluid flow substrate 200B, as shown in Figure 5. The opening 302 extends through the body of the manifold 300, as shown in Figure 3D. The standoff 102 further includes an opening 141 extending through the body of the standoff 102 and adapted to receive the fastener 110. The standoff 102 further includes an opening 146 adapted to receive a second locking pin 131, which is also received in an opening 302 provided on the underside of the manifold 300. The second locking pin 131 is used to hold the standoff 102 on the underside of the manifold 300 during assembly. It should be understood that when the multi-component mounting body is combined with the body of the manifold 300, it forms a mounting structure that is structurally and dimensionally similar to the unit mounting body 100, as illustrated in Figure 3B. As can be seen from Figure 3, for example, access from only one direction (e.g., from above) is all that is needed to mount the flow substrate, fluid handling components, multiple manifolds, and mounting body to each other and to the support surface.

[0019] Figure 1C illustrates that a portion of the multi-component mounting body, specifically clamp 101, may be used to mount a manifold, such as manifold 300, to the underside of a flow substrate, such as fluid flow substrate 200B. Fastener 111 is similar to fastener 110 described with respect to Figures 1A and 1B, and although not shown, has a threaded distal end. However, fastener 111 is shorter than fastener 110 and is received in a threaded opening 340 on the upper surface of manifold 300, instead of being received in a threaded opening inside the support surface (see Figure 5). When fastener 111 is tightened, it pulls the upper surface of manifold 300 into registration with the lower surface of fluid flow substrate 200B, compressing a metal seal (not shown) that will be received in a counterbore surrounding the manifold port 305a formed on the upper surface of manifold 300, thereby forming a fluid-tight seal with the corresponding manifold connection conduit port 205b formed on the lower surface of fluid flow substrate 200B.

[0020] Figures 2A to 2C illustrate various fluid flow substrates 200 in which embodiments of the present disclosure may be used. For example, a conventional fluid flow substrate such as the K1S flow substrate 200A may be modified to include a recess 201 that receives a projection of a modular mounting body 100 or clamp 101, as shown in Figure 2A. As shown, an opening 202 for receiving a locking pin 130 is formed within the recess 201. Modular fluid flow substrates such as those shown in Figures 2B and 2C may also be adapted for use in embodiments of the present disclosure. For example, Figure 2B illustrates a modular fluid flow substrate 200B having a recess 201 and an opening 202, which can be used to form part of a fluid delivery stick. Figure 2C illustrates a modular fluid flow substrate 200C, as described in Patent Document 1, having a recess 201 and an opening 202, which can be used to form part of or all of a fluid delivery panel. Although not depicted, it should be understood that the various substrates shown in Figures 3 to 10 of Patent Document 2 can be modified in a similar manner to include recesses 201 and openings 202.

[0021] Figures 3A to 3E show various plan views, perspective views, and end views of a portion of a fluid delivery system in which embodiments of the present disclosure may be used. For example, Figures 3D and 3E illustrate embodiments in which fluid handling components 350, such as valves and pressure regulators, may be mounted on a fluid flow substrate 200B, and in which unit-type mounting bodies and multi-component mounting bodies may be used. As specified in the drawing of Figure 3, the upper surface of the mounting body is dimensioned to be lower than the upper surface of the fluid flow substrate 200B to ensure that a leak-tight seal may be formed between the fluid handling components and component conduit ports formed on the upper surface of the flow substrate.

[0022] Figure 4 shows two different isometric views of embodiments of the present disclosure that may be used to mount the fluid flow substrate 200B and the combination of the fluid flow substrate 200B and the manifold 300 to a support surface. In Figure 4, a unit mounting body 100 is used to mount the fluid flow substrate 200B to the support surface, and clamps 101 and standoffs 102 are used to mount the combination of the fluid flow substrate 200B and the manifold 300 to the support surface.

[0023] Figure 5 shows a possible configuration in which the fluid flow substrate 200B and the manifold 300 are mounted in alignment with each other. As seen in Figure 5, the fluid flow substrate 200B includes a manifold connection conduit port 205b that extends through the body of the fluid flow substrate and is fluidly connected to a component conduit port 205a (Figure 4) on the upper surface of the fluid flow substrate. The manifold connection conduit port 205b is aligned with a manifold port 305a formed on the upper surface of the manifold 300, with a metal seal between them. When fully assembled, the ports of the fluid processing component 350 are fluidly connected to the manifold port 305a by a passage formed between the component conduit port 205a and the manifold connection conduit port 205b.

[0024] Figure 6 illustrates how the implementation structure of this disclosure may be used in conjunction with an integrated fluid flow substrate that can form part or all of a fluid delivery panel. Figure 7A illustrates a fluid delivery stick bracket, such as that described in Patent Document 1, which is no longer required according to the embodiments of the present disclosure. Figure 7B illustrates how embodiments of the present disclosure may be used with conventional fluid delivery flow substrates and manifolds such as K1S.

[0025] Figures 8A to 8J illustrate a modular flow substrate 800 to which one or more mounting structures of the present disclosure are attached, according to embodiments of the present disclosure. In exemplary embodiments, the modular flow substrate 800 can be used with a fluid processing component (e.g., a C-seal component) having an asymmetric port arrangement in which one of the ports of the fluid processing component is axially aligned with the center of the fluid processing component and the other is located out-of-axis. Although not shown, embodiments of the present disclosure should be understood to be modifiable for use with fluid processing components having a symmetric port arrangement, such as a W-seal component.

[0026] As illustrated, the flow substrate 800 comprises a flow substrate body 801 formed from a solid block of material and an associated cap 895 (see Figure 8I), each of which may be formed from a suitable material (e.g., stainless steel, aluminum, brass, polymer, etc.) depending on the intended use of the flow substrate. The flow substrate 800 includes a component mounting surface 805 to which fluid processing components (valves, pressure transducers, filters, regulators, mass flow controllers, etc.) can be mounted. One or more component conduit ports 820 may be located within the component mounting surface 805 of the flow substrate 800. In the examples of Figures 8A to 8J, component conduit port 820a may be fluidically connected to a first port (inlet or outlet) of a first fluid processing component, and component conduit port 820b may be fluidically connected to a second port (outlet or inlet) of the first fluid processing component. Component conduit port 820c may be fluidically connected to a port (outlet or inlet) of a second fluid processing component of a different form from the first fluid processing component.

[0027] The component conduit ports 820c and 820d, as well as the component conduit ports 820e and 820f, are connected to the inlets and outlets of their respective fluid processing components, illustrating that the flow substrate 800 is particularly well-suited for fluid processing components having an asymmetric port arrangement. The component conduit port 820g is associated with an inlet or outlet port of a device such as a mass flow controller and may typically be used to communicate the flow of process fluid between multiple flow substrates of a fluid delivery stick.

[0028] Multiple internally threaded component mounting openings 810a, 810b, 810c, and 810d, each of which will receive the threaded ends of fasteners (not shown) used to seally mount fluid processing components to the flow substrate 800, are associated with component conduit ports 820a, 820b. A pair of internally threaded component mounting openings 810y, 810z, each of which will receive the threaded ends of fasteners (not shown) used to seally mount ports of fluid processing components, such as mass flow controllers, to the flow substrate 800, are associated with component conduit port 820g. It should be understood that adjacent flow substrates within the fluid delivery stick will typically provide an additional pair of mounting openings necessary to seally mount other ports of fluid processing components to adjacent flow substrates. Leak ports 825a (for component conduit ports 820a and 820b) and 825b (for component conduit ports 820c and 820d) are associated with each pair of component conduit ports, allowing for the detection of any leaks to be detected between the conduit ports and their respective fluid handling components.

[0029] The flow substrate 800 comprises a number of fluid paths 875a, 875b, 875c, and 875d used to transport fluid longitudinally along the flow substrate 800 (i.e., from left to right in Figure 8A). For example, fluid path 875a extends between the tube stub connection 835 and the component conduit port 820a; fluid path 875b extends between component conduit ports 820b and 820c; fluid path 875c extends between component conduit ports 820d and 820e; and fluid path 875d extends between component conduit ports 820f and 820g. The tube stub connection 835 would typically be fluidically connected (e.g., by welding) to a source or sink of process fluid.

[0030] Multiple dowel pin openings 850a to 850h are formed in the flow substrate 800 so as to extend from the component mounting surface 805 to the connection mounting surface 815 on the side of the flow substrate opposite to the component mounting surface 805. The connection mounting surface 815 may be used to connect the flow substrate 800 to a fluid delivery stick mounting structure, to a manifold, or to both, as described in Patent Document 2. Each of these dowel pin openings 850a to 850h can receive a dowel pin (not shown) which may be used to perform a different function. A first function is to align the cap 895 to the flow substrate body 801 of the flow substrate 800, and a second function is to align the flow substrate to the fluid delivery stick mounting structure in a manner similar to that described in Patent Document 2. In certain embodiments, only the first of these functions may be performed, in which case it should be understood that after alignment (and welding as described in further detail below), the dowel pin may be removed and reused with another flow substrate body and cap. In accordance with further aspects of this disclosure, the location of the dowel pins may be backward compatible with existing modular flow substrate systems, such as the K1S system.

[0031] Figure 8C is a view of the flow board 800 from below, showing multiple flow board mounting openings 830. The multiple flow board mounting openings 830 are formed within a cap 895 and can extend through the cap 895 into the flow board body 801 (shown more clearly in Figure 8I). In some examples where the cap 895 covers only a portion of the flow board body 801, one or more of the multiple flow board mounting openings may be located within the flow board body 801. Within the flow board body 801, the flow board mounting openings 830 are internally threaded to receive fasteners (not shown) for mounting the flow board 800 from below onto a mounting surface such as a fluid delivery stick mounting structure. The arrangement of the flow board mounting openings 830 may vary depending on the arrangement of mounting openings on the mounting surface to which the flow board 800 is to be mounted.

[0032] As can be seen from the figures, the component conduit ports 820 and fluid paths 875 can be machined in a cost-effective manner. Thus, the component conduit ports 820a to 820g may be formed by machining from the component mounting surface 805 to the first surface or top surface of the flow substrate body 801 of the flow substrate 800, respectively, and the fluid paths 875b, 875c, and 875d may be formed by machining from the second surface or bottom surface of the flow substrate body 801, respectively, as shown in Figure 8F, and the fluid path 875a may be formed by machining from the side surface of the flow substrate body, as shown in Figure 8E. In some examples, the fluid paths 875 may be treated to enhance corrosion resistance. It should be understood that the dimensions of the illustrated fluid paths 875 are particularly suitable for higher flow rates, such as those exceeding approximately 50 SLM (standard liters per minute) (approximately 3 cubic meters per hour). In fact, the dimensions of the illustrated fluid paths allow the flow substrate 800 to be used not only in high-flow applications (e.g., between approximately 50 SLM (approximately 3 cubic meters per hour) and approximately 100 SLM (approximately 6 cubic meters per hour)) but also in extremely high-flow applications (e.g., applications exceeding approximately 200 SLM (approximately 12 cubic meters per hour)). Therefore, the flow substrate may be used in emerging semiconductor manufacturing equipment designed to operate at very high flow rates between approximately 200 SLM (approximately 12 cubic meters per hour) and approximately 1000 SLM (approximately 60 cubic meters per hour). It should be understood that the dimensions of the fluid paths may be scaled down for lower-flow applications in a straightforward manner, for example, by simply reducing the cross-sectional area of ​​one or more of the fluid paths 875b, 875c, and 875d. In fact, since the component conduit ports 820 are formed in a different process step than the fluid path, the dimensions of the fluid path are not constrained by the dimensions of the component conduit ports, and therefore the cross-sectional area of ​​the fluid path may be considerably larger, smaller, or the same as the cross-sectional area of ​​the component conduit ports to accommodate a wide range of flow rates.

[0033] Figures 8H and 8I illustrate various details of the cap 895. According to one embodiment particularly adapted for use with semiconductor process fluids that may frequently be heated to temperatures exceeding ambient temperature, the cap 895 can be formed from a sheet of stainless steel with a thickness of approximately 0.02 inches (0.5 mm). The thinness of the stainless steel sheet allows heat to be easily transferred to the process fluid flowing through the flow substrate by applying heat to the substrate connection mounting surface 815. The heat source may be provided by a block heater, a cartridge heater inserted into a groove of a fluid delivery stick mounting structure to which the flow substrate is mounted in a manner similar to that described in Patent Document 2, or a thin-film heater similar to that described in Patent Document 4. It should be understood that the thinness of the cap also allows for cooling of the fluid flowing through the flow substrate, if desired.

[0034] A thin sheet of stainless steel may be chemically etched to form grooves 823 that surround and define fluid paths 875b, 875c, and 875d. Such chemical etching may be precise and may be less expensive than other methods of forming grooves, such as by machining, which may be used as an alternative. According to one embodiment, the grooves may be etched to a thickness of about 0.01 inches (0.25 mm). The presence of grooves 823 surrounding and defining each fluid path 875b, 875c, and 875d can serve several purposes. For example, the thinness of the grooves allows the cap to be welded to the flow substrate body 801 of the flow substrate 800, for example, by electron beam welding, using less time and energy than if grooves 823 were absent. The welding would be performed by tracing around each fluid path defined by the grooves, thereby forming a fluid tight seal. The electron beam welding may be performed in a vacuum environment to minimize contamination. If the materials used for the flow substrate body 801 and cap 895 are high-purity metals such as stainless steel, a vacuum welding environment will further remove contaminants (carbon, sulfur, manganese, etc.) at the welding point. While electron beam welding is generally preferred, it should be understood that other types of welding, such as laser welding, may also be used.

[0035] The presence of groove 823 also serves as a guide during welding, as the groove defines the periphery of the fluid path. Dowel pin holes 850a, 850b of the flow substrate body 801 and corresponding dowel pin holes 850a', 850b' of the cap 895 receive dowel pins that allow the cap 895 to align with the body of the flow substrate 800 and be held in a registered state during welding. The dowel pins may be removed and reused after welding is complete, or they may be held in place as an aid to align the flow substrate to the mounting surface.

[0036] In various examples, the flow substrate may have other configurations, such as those illustrated and discussed in Patent Document 1. Although only four fluid paths are illustrated in the drawings, it should be understood that the ease and low cost of the manufacturing embodiments of this disclosure make it easy to define any number of fluid paths and component ports within the flow substrate. In this regard, all of the fluid paths and component connection ports for the entire fluid delivery stick may be formed within a single flow substrate. Alternatively, the fluid delivery stick may be formed using two or more flow substrates, such as the flow substrate 800 described above.

[0037] Figure 9A shows an exemplary top view of a flow substrate 900 coupled to a substrate mounting structure 902. In the examples illustrated herein, a mounting structure such as the mounting structure 902 may be detachably coupled to the flow substrate 900. Figure 9B1 shows a perspective view of the mounting structure 902, Figure 9C shows a cross-sectional view of the mounting structure 902, and Figure 9D shows a bottom view of the mounting structure 902.

[0038] As shown in the examples in Figures 9B1 to 9D, the mounting structure 902 may include a first opening 904A and a second opening 904B. The first opening 904A and the second opening 904B may be configured to fasten the mounting structure 902 between the flow substrate 900 and a support surface. A first fastener may be positioned through the first opening 904A to secure the mounting structure 902 to the flow substrate 900, and a second fastener may be positioned through the second opening 904B to secure the mounting structure 902 to a support surface, a backup plate, a fluid delivery stick mounting structure, a manifold, or a combination thereof as further described in Patent Document 2. In one example, fasteners may engage with each mounting opening 930 (e.g., opening 830 as further described herein) of the flow substrate 900 for mounting the mounting structure 902 to the flow substrate 900. The fasteners may include, but are not limited to, bolts, screws, quick-release connections (e.g., bayonet or other 1 / 4-turn fasteners), rivets, snap-fits, latches, and the like. Thus, the mounting structure 902 can support the flow substrate 900 along the support surface.

[0039] As shown in the example in Figure 9C, the first opening 904A, the second opening 904B, or both may comprise a countersink or counterbore. The first counterbore 906A may be located at the first end 908 of the mounting structure 902, and the second counterbore 906B may be located at the second end 910 of the mounting structure 902. The second end 910 may interface with the flow substrate 900, such as the body or cap of the flow substrate 900. In other words, as shown in the examples in Figures 9A to 9D, the first opening 904A may be oriented in the opposite direction from the second opening 904B. A bearing surface may be provided by the internal end of the counterbore. For example, a first fastener may clamp the mounting structure 902 to the flow substrate 900 between the second end 910 and the first bearing surface 912A. The second fastener can clamp the mounting structure 902 to a support surface or other mounting surface between the first end 908 and the second bearing surface 912B.

[0040] In one embodiment, one or more mounting structures, such as mounting structure 902, can support the flow substrate 900 at a position away from the support surface. For example, the height H of the mounting structure 902 can position the flow substrate at a distance above the support surface. This distance can be configured to provide airflow for heat transfer or to route a fluid line or manifold between the flow substrate 900 and the support surface.

[0041] In various examples, as shown in Figure 9A, when the mounting structure 902 is coupled (e.g., fastened) to the flow substrate 900, the flow substrate 900 can cover a portion of the second opening 904B or the second counterbore 906B. For example, when the mounting structure 902 is coupled to the flow substrate 900, the flow substrate 900 can capture fasteners within the mounting structure 902. In the example in Figure 9B1, a fastener can be captured between the second end 910 of the mounting structure 902 and the second bearing surface 912B of the second counterbore 906B.

[0042] In one example, the longitudinal axis of the second opening 904B (and the corresponding second fastener) may be positioned at an offset distance from the side surface 901 of the flow substrate 900 to facilitate tool access for engaging the fastener head. The fastener head may feature a hexagonal, hexagonal interior (Torx®), or other type of screw drive. In one embodiment, the longitudinal axis of the opening may be offset from the side surface 901 by at least the radius of the corresponding screw drive of the fastener. The radius of the fastener head may be greater than the offset distance so that the fastener can be captured by the flow substrate 900 within the mounting structure 902 (e.g., within the second counterbore 906B of the second opening 904B). The fluid delivery stick 903 can be pre-assembled by coupling one or more of the mounting structures 902 to the flow substrate 900. Therefore, when the flow substrate 900 is coupled to the mounting structure 902, the fasteners used to secure the mounting structure 902 (and the corresponding flow substrate 900) to the support surface can be retained within the mounting structure 902 by a portion of the flow substrate 900 (see Figure 9A) where the heads of the fasteners remain accessible by tools. A pre-assembled configuration in which the fasteners are retained within the mounting structure by the flow substrate is beneficial, for example, during transport or installation. Retaining the fasteners within the mounting structure prevents displacement of the fasteners or replacement or modification by the customer. In another example, the fasteners may be recessed or partially recessed within the mounting structure, for example, recessed with respect to the top surface of the flow substrate.

[0043] In further examples, the mounting structure 902 can be aligned with the flow substrate 900. For example, a fixture 907 can be used to align the mounting structure 902 with the flow substrate 900. In the examples of Figures 9A to 9D, the longitudinal axis A1 of the mounting structure 902 may be configured perpendicular to the longitudinal axis A2 of the flow substrate 900 (e.g., along the first direction of flow). As shown in Figure 9B2, the fixture 907 can align the mounting structure 902 at a 90° angle with respect to the flow substrate 900. In other examples, the longitudinal axis A1 or other axis of the mounting structure 902 may be configured in other orientations such as 30 degrees, 45 degrees, 60 degrees, or other angles in between with respect to the longitudinal axis A2 of the flow substrate 900. Fasteners, such as a first fastener positioned through a first opening 904A, can fix the position and orientation of the mounting structure 902 with respect to the flow substrate 900. In some cases, the fasteners can ensure proper alignment of the mounting structure 902 (from the manufacturer) to mitigate improper installation or customer modifications. Further examples of aligning the mounting structure 902 with respect to the flow substrate 900 are shown in Figures 10A–10E, 11A–11D, 12A–12E, 13A–13E, and 14A–14D.

[0044] A fluid delivery stick 903 (as depicted in the examples in Figures 9A-9D, 10A-10E, 11A-11D, 12A-12E, 13A-13E, and 14A-14D) may comprise a flow substrate 900 and one or more mounting structures coupled to the flow substrate 900 (such as mounting structure 902 or other mounting structures described herein and shown in the examples in Figures 10A-10E, 11A-11D, 12A-12E, 13A-13E, or 14A-14D). Each fastener may be incorporated into the mounting structure 902 for mounting the fluid delivery stick 903 to a support surface. Thus, all the hardware for mounting the mounting structure 902 for mounting the fluid delivery stick 903 to a support surface can be provided within the fluid delivery stick 903. The mounting structure 902 can be positioned and aligned with respect to the flow substrate 900 for attachment to the support surface.

[0045] Figures 10A to 10E depict another example of the mounting structure 1002. The mounting structure 1002 may comprise a first opening 1004A, a second opening 1004B, a first counterbore 1006A, and a second counterbore 1006B, as arranged and described in the examples in Figures 9A to 9D and further described herein. A first fastener 1014A may be inserted into the first opening 1004A, as illustrated in the example in Figure 10B. One or more fasteners, such as the first fastener 1014A, can couple the mounting structure 1002 to the flow substrate 1000. For example, the flow substrate 1000 may comprise one or more mounting openings 1030, as previously described. The first fastener 1014A can secure the mounting structure 1002 to the flow substrate 1000 using the mounting openings 1030.

[0046] The mounting structure 1002, the flow substrate 1000, or both may have one or more alignment features for aligning the mounting structure 1002 with the flow substrate 1000. In the examples of Figures 10B to 10E, the alignment features may be alignment pins 1016A to 1016D. The flow substrate 1000 may have one or more alignment openings 1032 located in the cap (e.g., the cap 895 depicted in Figures 8B, 8D to 8E, 8H to 8J, and described herein), in the body of the flow substrate 1000, or both. One or more alignment openings 1032 may be located on the flow substrate 1000 to align the mounting structure 1002 with respect to the flow substrate 1000 when the corresponding alignment pins 1016A to 1016D of the mounting structure 1002 engage with the alignment openings 1032. An example in Figure 10B illustrates a single alignment pin 1016A located on the first side of the first opening 1004A, and an example in Figure 10D illustrates an alignment pin 1016D located on the second side of the first opening 1004A. An example in Figure 10C illustrates an alignment pin 1016B located on the first side of the first opening 1004A and a second alignment pin 1016C located on the second side opposite the first opening 1004A. Alignment features of the mounting structure 1002 or the flow substrate 1000 can alleviate or eliminate the need for alignment fixtures to position or orient the mounting structure 1002 with respect to the flow substrate 1000. In other examples, one or more alignment openings can be located on the mounting structure 1002, one or more corresponding alignment pins can be located on the flow substrate 1000, or various combinations of alignment pins and openings are possible. Other alignment features are also intended. Some further examples of alignment features are shown in Figures 11B–11C, 12B–12E, and 13B–13E, and are further described herein.

[0047] Figure 10E shows an example of a mounting structure 1002 comprising a first fastener 1014A and a second fastener 1014B inserted into a first opening 1004A and a second opening 1004B, respectively. When the mounting structure 1002 is coupled to the flow substrate 1000, the flow substrate 1000 can capture the second fastener 1014B within the second opening 1004B by covering or partially covering the second opening 1004B, such as the second counterbore 1006B of the second opening 1004B. Thus, as previously described, the second fastener 1014B can be retained within the fluid delivery stick 1003 (shown in Figure 10A), such as during transport or installation. In another example, the second fastener 1014B may be recessed or partially recessed within the mounting structure 1002, such as being recessed with respect to the top surface of the flow substrate 1000.

[0048] Figures 11A to 11D show another example of the mounting structure 1102. The mounting structure 1102 may comprise a first opening 1104A, a second opening 1104B, a first counterbore 1106A, and a second counterbore 1106B, as arranged and described in the examples of Figures 9A to 9D and Figures 10A to 10E. A first fastener 111A can be inserted inside the first opening 1104A, as illustrated in the perspective view of Figure 11B and the cross-sectional view of Figure 11C. One or more fasteners, such as the first fastener 111A, can couple the mounting structure 1102 to the flow substrate 1100. For example, the flow substrate 1100 may comprise one or more mounting openings 1130, as previously described. The first fastener 111A can secure the mounting structure 1102 to the flow substrate 1100 using the mounting openings 1130. Figure 11D shows a bottom view of the mounting structure 1102.

[0049] As shown in the example in Figures 11B to 11C, the mounting structure 1102 may have alignment features such as a step 1116 along one end of the mounting structure 1102 (e.g., a second end 1110) so as to interface with the flow substrate 1100 in close proximity to the edge portion 1105 of the flow substrate 1100. For example, the step 1116 may have a raised portion at the second end 1110 of the mounting structure 1102. The raised edge 1118 of the step 1116 may engage with the flow substrate 1100 in close proximity to the edge portion 1105 of the flow substrate 1100, for example, along a side surface 1101 adjacent to the edge portion 1105 of the flow substrate 1100. The step 1116 may be configured to align the mounting structure 1102 with respect to the flow substrate 1100. For example, step 1116 can be configured at an angle such as 90 degrees, 60 degrees, 45 degrees, 30 degrees, or other angles between 10 and 90 degrees with respect to the longitudinal axis of the mounting structure 1102 (for example, an axis along the second end 1110 that extends through the central axis of the first opening 904A and the central axis of the second opening 904B). In another example, step 1116 may be placed on the flow substrate 1100 to align the mounting structure 1102 with respect to the flow substrate 1100. The alignment feature (step 1116) of the mounting structure 1102 or the flow substrate 1100 can mitigate or eliminate the need for alignment fixtures to position or orient the mounting structure 1102 with respect to the flow substrate 1100.

[0050] The raised edge 1118 of step 1116 may be positioned along at least a portion of the second opening 1104B or along at least a portion of the second counterbore 1106B of the second opening 1104B, as shown in Figures 11B to 11C. Figure 11C shows an example cross-section of a mounting structure 1102 comprising a first fastener 1114A inserted into the first opening 1104A and a second fastener 1114B inserted into the second opening 1104B. When the mounting structure 1102 is coupled to the flow substrate 1100, the flow substrate 1100 can capture the second fastener 1114B within the second opening 1104B by covering or partially covering the second opening 1104B, such as the second counterbore 1106B of the second opening 1104B. Therefore, as explained earlier, the second fastener 1114B can be trapped within the system of the flow substrate 1100, such as during transport or installation. In another example, the second fastener 1114B may be recessed or partially recessed within the mounting structure 1102, such as being recessed with respect to the upper surface of the flow substrate 1100.

[0051] Figures 12A to 12E illustrate another example of the mounting structure 1202. The mounting structure 1202 may comprise a first opening 1204A, a second opening 1204B, a first counterbore 1206A, and a second counterbore 1206B, as arranged and described in the examples of Figures 9A to 9D, 10A to 10E, and 11A to 11D. A fastener such as a first fastener 1214A can be inserted inside the first opening 1204A, as illustrated in the perspective view of Figure 12B and the cross-sectional view of Figure 12D. One or more fasteners such as the first fastener 1214A can connect the mounting structure 1202 to the flow substrate 1200. For example, the flow substrate 1200 may comprise one or more mounting openings 1230, as previously described. The first fastener 1214A allows the mounting structure 1202 to be fixed to the flow substrate 1200 using the mounting opening 1230. Figure 12C shows a bottom view of the mounting structure 1202, and Figure 12E shows another cross-sectional view of the mounting structure 1202 without the first fastener 1214A or the second fastener 1214B.

[0052] As shown in the examples in Figures 12B to 12E, the mounting structure 1202 may have alignment features such as a slot 1216 along one end of the mounting structure 1202 (e.g., a second end 1210). For example, the slot 1216 may extend through the thickness of the second end 1210 of the mounting structure 1202, as shown in the example in Figure 12B. In exemplary embodiments, a fixture 1205 can be used to orient the mounting structure 1202 relative to the flow substrate 1200. For example, the fixture 1205 may comprise a plate positioned along the side of the flow substrate 1200. The fixture 1205 may have an edge extending below the bottom surface of the flow substrate 1200. The fixture 1205 can be inserted into or engaged with the slot 1216. When the fixture 1205 is positioned in the slot 1216, the slot 1216 can be aligned with the side 1201 of the flow substrate 1200, and accordingly, the mounting structure 1202 can be aligned with the flow substrate 1200. Following the alignment and mounting of the mounting structure 1202, the fixture can be removed from the fluid delivery stick 1203. In another example, the flow substrate 1200 may have a flange or other engaging feature to interface with the slot 1216 in order to align the mounting structure 1202 with respect to the flow substrate 1200. In some examples, the fixture 1205 can ensure proper alignment from the manufacturer and mitigate improper installation or customer modifications. The slot 1216 can be configured to align the mounting structure 1202 with respect to the flow substrate 1200. For example, the slot 1216 can be configured at an angle such as 90 degrees, 60 degrees, 45 degrees, 30 degrees, or other angles between 10 and 90 degrees with respect to the longitudinal axis of the mounting structure 1202 (for example, an axis along the second end 1210 that extends through the central axis of the first opening 1204A and the central axis of the second opening 1204B).

[0053] Slot 1216 may be positioned along at least a portion of the second opening 1204B or along at least a portion of the second counterbore 1206B of the second opening 1204B, as shown in Figures 12B to 12E. Figures 12D and 12E show examples of cross-sections of the mounting structure 1202. Figure 12D illustrates the first fastener 1214A inserted into the first opening 1204A and the second fastener 1214B inserted into the second opening 1204B. When the mounting structure 1202 is coupled to the flow substrate 1200, the flow substrate 1200 can capture the second fastener 1214B within the second opening 1204B by covering or partially covering the second opening 1204B, such as the second counterbore 1206B of the second opening 1204B. Therefore, as previously described, the second fastener 1214B may be trapped within the fluid delivery stick 1203, such as during transport or installation. In another example, the second fastener 1214B may be recessed or partially recessed within the mounting structure 1202, such as being recessed with respect to the upper surface of the flow substrate 1200.

[0054] Figures 13A to 13E show an example of a mounting structure 1302 comprising an alignment frame (i.e., alignment clip) 1316 for orienting and supporting the mounting structure 1302 with respect to a flow substrate 1300. In other words, the alignment feature may comprise an alignment frame 1316 coupled between the flow substrate 1300 and the mounting structure 1302. The mounting structure 1302 may comprise a first opening 1304A, a second opening 1304B, a first counterbore 1306A, and a second counterbore 1306B, as arranged and described in the examples of Figures 9A to 9D, 10A to 10E, 11A to 11D, and 12A to 12E. A fastener such as a first fastener 1314A may be inserted inside the first opening 1304A, as illustrated in the perspective view of Figure 13B and the cross-sectional view of Figure 13E. One or more fasteners, such as the first fastener 1314A, can connect the mounting structure 1302 to the flow substrate 1300. For example, the flow substrate 1300 may have one or more mounting openings 1330, as described earlier. The first fastener 1314A can use the mounting openings 1330 to secure the mounting structure 1302 to the flow substrate 1300. Figure 13C shows a top view of the mounting structure 1302.

[0055] The alignment frame 1316 can be positioned on the mounting structure 1302, such as on the second end 1310 of the mounting structure 1302. The opening 1322 can be positioned within the alignment frame 1316. If the first fastener 1314A is positioned within the first opening 1304A, the first fastener 1314A may be positioned through the opening 1322 so as to engage with the mounting opening 1330 to couple the mounting structure 1302 to the flow substrate 1300. In exemplary embodiments, the opening 1322 may allow the first fastener 1314A to register the position of the alignment frame 1316 on the mounting structure 1302. As shown in the examples in Figures 13B to 13E, the alignment frame 1316 may comprise a first flange 1318A and a second flange 1318B. In some examples, the alignment frame 1316 may be composed of a material including, but not limited to, metal or polymer.

[0056] The first flange 1318A and the second flange 1318B can extend from the base portion 1317 of the alignment frame 1316. The base portion 1317 can be positioned along the mounting structure 1302, for example, along the second end portion 1310. In one example, the first flange 1318A and the second flange 1318B may be positioned at angles of 30 to 90 degrees from the base portion 1317. In the example of Figures 13B to 13E, the first flange 1318A can extend at a 90-degree angle toward the mounting structure 1302, and the second flange 1318B can extend at a 90-degree angle away from the mounting structure 1302. For example, the first flange 1318A can interface with the mounting structure 1302 in order to orient the alignment frame 1316 toward the mounting structure 1302. The second flange 1318B can orient the mounting structure 1302 relative to the flow substrate 1300 when the mounting structure 1302 is fixed to the flow substrate 1300.

[0057] The first flange 1318A or the second flange 1318B, or both, can be configured to align the mounting structure 1302 with respect to the flow substrate 1300. For example, the first flange 1318A or the second flange 1318B can be configured at an angle such as 90 degrees, 60 degrees, 45 degrees, 30 degrees, or other angles between 10 and 90 degrees with respect to the longitudinal axis of the mounting structure 1302 (for example, the axis along the second end 1310, extending through the central axis of the first opening 1304A and the central axis of the second opening 1304B). The alignment frame 1316 can mitigate or eliminate the need for alignment fixtures to position or orient the mounting structure 1302 with respect to the flow substrate 1300. In some examples, the alignment frame 1316 can ensure proper alignment from the manufacturer and mitigate improper installation or customer modifications.

[0058] Figure 13E illustrates an example cross-section of a mounting structure 1302 comprising a first fastener 1314A inserted into a first opening 1304A and a second fastener 1314B inserted into a second opening 1304B. The alignment frame 1316 can be positioned to cover at least a portion of the second opening 1304B or at least a portion of the second counterbore 1306B of the second opening 1304B, as depicted in Figures 13B, 13C, and 13E, and thus the second fastener 1314B can be captured within the second opening 1304B. As a result, as previously described, the second fastener 1314B can be retained within the fluid delivery stick 1303, such as during transport or installation. In another example, the second fastener 1314B may be recessed or partially recessed within the mounting structure 1302, such as recessed with respect to the upper surface of the flow substrate 1300.

[0059] Figures 14A to 14D depict another example of the mounting structure 1402. The mounting structure 1402 may comprise a first opening 1404A, a second opening 1404B, a first counterbore 1406A, and a second counterbore 1406B, as arranged and described in the examples of Figures 9A to 9D, 10A to 10E, 11A to 11D, 12A to 12E, and 13A to 13E. In the example of Figures 14A to 14D, the mounting structure 1402 may comprise a third opening 1404C. In one example, the third opening 1404C may comprise a third counterbore 1406C. As illustrated in the example in Figure 14D, a first fastener 1414A may be inserted into the first opening 1404A, and another third fastener 1414C may be inserted into the third opening 1404C. One or more fasteners, such as the first fastener 1414A and the third fastener 1414C, can connect the mounting structure 1402 to the flow substrate 1400. For example, the flow substrate 1400 may have one or more mounting openings (as described above), such as mounting openings 1430A and 1430B. The first fastener 1414A and the third fastener 1414C can fix the mounting structure 1402 to the flow substrate 1400 using their respective mounting openings 1430A and 1430B.

[0060] As shown in the examples in Figures 14A to 14D, the flow substrate 1400 may include a channel 1416. The channel 1416 may be located between a first opening 1404A and a third opening 1404C. The channel 1416 can provide an opening for a mounting structure 1402 for a fluid delivery line 1418. Thus, one or more fluid delivery lines 1418 can be routed along the underside of the flow substrate 1400 (e.g., along the cap 895 shown in Figures 8B, 8D to 8E, 8H to 8J and described herein). In some examples, the mounting structure 1402 may be located between two ports 1420A and 1420B (e.g., conduit ports) of the flow substrate 1400. The channel 1416 can allow the fluid delivery lines 1418 to be routed along the flow substrate 1400 where one or more mounting structures 1402 are located. In one example, the mounting structure 1402 can protect the fluid delivery line 1418 when the mounting structure 1402 is attached to the flow substrate 1400.

[0061] The first opening 1404A and the third opening 1404C can be positioned within the mounting structure 1402 to align the mounting structure 1402 with respect to the flow substrate 1400. In the examples of Figures 14A to 14D, the longitudinal axis of the mounting structure 1402 may be configured perpendicular to the longitudinal axis of the flow substrate 1400 (e.g., along the first direction of flow). In other examples, the longitudinal axis or other axis of the mounting structure 1402 may be configured in a different direction from the longitudinal axis of the flow substrate 1400, for example, 30 degrees, 45 degrees, 60 degrees, or other angles in between. The first fastener 1414A and the third fastener 1414C can fix the position and orientation of the mounting structure 1402 with respect to the flow substrate 1400. In further examples, the mounting structure 1402, the flow substrate 1400, or both, may have any of the alignment features described herein, such as the alignment features described in the examples of Figures 9A-9D, 10A-10E, 11A-11D, 12A-12E, and 13A-13E, and further described herein.

[0062] When the mounting structure 1402 is coupled to the flow substrate 1400, the flow substrate 1400 can capture the second fastener 1414B within the second opening 1404B by covering or partially covering the second opening 1404B, such as the second counterbore 1406B of the second opening 1404B. Thus, as previously described, the second fastener 1414B can be retained within the fluid delivery stick 1403, such as during transport or installation. In another example, the second fastener 1414B may be recessed or partially recessed within the mounting structure 1402, such as being recessed with respect to the upper surface of the flow substrate 1400.

[0063] In Figures 3-5 and 7, the mounting structure can connect a flow substrate to a manifold (e.g., another flow substrate). In some embodiments, the mounting structure can provide sufficient clamping or compressive force to effectively seal one or more fluid paths of the flow substrate to one or more corresponding fluid paths of the manifold. Therefore, in some examples, the mounting structure can be constructed from a material (high-strength material) that has sufficient strength to provide the clamping or compressive force to seal the fluid paths between the flow substrate and the manifold. Generally, a metallic material with higher strength than aluminum (including aluminum alloys, stainless steel, and nickel alloys) is required. For example, it is desirable that the metallic material has sufficient strength to withstand clamping or compressive forces of at least 150 psi (1.03 MPa) or more in semiconductor applications. In other applications (e.g., medical applications), it is desirable that the metallic material (e.g., aluminum) has sufficient strength to withstand clamping or compressive forces of at least 50 psi (0.34 MPa) or more. In further examples, the dimensions of the implementation structures in the examples of Figures 3-5 and Figure 7 can be configured with sufficient precision to provide a clamping force for sealing the fluid path between the flow substrate and the manifold.

[0064] The mounting structures in Figures 9 to 14 can be used to mount a flow substrate to a support surface or another flow substrate. In applications where lower clamping or compressive forces are acceptable, and therefore the clamping or compressive forces are not required to provide a seal for fluid connection between the flow substrates, the flow substrates can be manufactured from materials of lower precision and lower strength. The mounting structures in the examples in Figures 9 to 14 can be made from a variety of materials, which can be selected based on properties such as cost, manufacturability, material strength, chemical compatibility, and corrosion resistance. In some examples, the cost of such materials can be reduced if lower strength is required. For example, these mounting structures can be made from aluminum, aluminum alloys, polymers, or any material that has sufficient strength to support the flow substrate(s) and associated components when bonded to the mounting structure or another flow substrate.

[0065] While several embodiments have been described above in a certain degree of specificity, those skilled in the art can make numerous modifications to the disclosed embodiments without departing from the spirit of this disclosure. All matters included in the above description or shown in the accompanying drawings are intended to be illustrative only and not limiting. Modifications of detail or structure can be made without departing from the teachings of this disclosure. The foregoing description and the following claims are intended to cover all such modifications and variations.

[0066] Various embodiments of various devices, systems, and methods are described herein. Numerous specific details are provided to provide a complete understanding of the overall structure, function, manufacture, and use of embodiments as described herein and illustrated in the accompanying drawings. However, it will be understood by those skilled in the art that embodiments of the present invention may be carried out without such specific details. In other embodiments, well-known operations, components, and elements are not described in detail so as not to obscure the embodiments described herein. A person of ordinary skill in the art will understand that the embodiments described and illustrated herein are non-limiting examples, and therefore, certain structural and functional details disclosed herein may be representative and not necessarily limit the scope of the embodiments, which is defined only by the appended claims.

[0067] Throughout this specification, any reference to “various embodiments,” “several embodiments,” “one embodiment,” “embodiment,” or similar means that any particular feature, structure, or characteristic described in relation to an embodiment is included in at least one embodiment. Therefore, appearances of “various embodiments,” “several embodiments,” “one embodiment,” “in an embodiment,” or similar expressions throughout this specification do not necessarily all refer to the same embodiment. Furthermore, any particular feature, structure, or characteristic may be combined in any suitable manner in one or more embodiments. Thus, any particular feature, structure, or characteristic illustrated or described in relation to one embodiment may be combined in whole or in part with any feature, structure, or characteristic of one or more other embodiments, without limitation.

[0068] Any patents, publications, or other disclosures incorporated herein by reference, in whole or in part, are incorporated herein only to the extent that the incorporated material does not conflict with any existing definitions, descriptions, or other disclosures contained herein. To this extent, the disclosures expressly contained herein take precedence over any conflicting material incorporated herein by reference. Any material or any part of it that is incorporated herein by reference but conflicts with any existing definitions, descriptions, or other disclosures contained herein is incorporated herein only to the extent that it does not create a conflict between the incorporated material and the existing disclosures.

Claims

[Claim 1] The apparatus as described in the specification or drawings.

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