Copolymers, resin compositions, their uses, and methods for producing copolymers

A copolymer with specific structural units and additives enhances adhesion and reduces dielectric properties, addressing the adhesion issues of conventional resins in printed wiring boards.

JP2026063995APending Publication Date: 2026-04-13NIPPON SHOKUBAI CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
NIPPON SHOKUBAI CO LTD
Filing Date
2024-10-01
Publication Date
2026-04-13

AI Technical Summary

Technical Problem

Conventional resins used in printed wiring boards exhibit unsatisfactory adhesion to metal foils, despite the need for both low dielectric properties and improved adhesion to meet the increasing performance requirements of communication devices.

Method used

A copolymer comprising structural units derived from an aromatic vinyl monomer and a specific substituent with a polymerizable double bond, combined with a crosslinking agent, inorganic filler, and organic solvent, to enhance adhesion and reduce dielectric properties.

Benefits of technology

The copolymer achieves excellent low dielectric properties and improved adhesion to metal foils, suitable for use in electronic materials such as printed circuit boards.

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Abstract

This invention provides a copolymer with excellent low dielectric properties and adhesion to metal foils. [Solution] A copolymer having a structural unit (A) represented by the following general formula (1) and a structural unit (B) derived from an aromatic vinyl monomer. [C1] TIFF2026063995000019.tif40156 (in formula (1), R 1 R represents a substituent having a polymerizable double bond at its terminal end. 2 and R 3 Each of these independently represents either a hydrogen atom or a methyl group. n represents either 0 or 1.
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Citation Information

Patent Citations

  • Thermosetting resin composition, prepreg, copper-clad laminate, printed wiring board and semiconductor package

    JP2021011535A