Substrate processing apparatus, substrate drying method, and article manufacturing method

Abstract

This invention provides a substrate transport technology that offers advantages in terms of uniformity of film thickness formed on the substrate. [Solution] The substrate processing apparatus comprises an airtight container, a substrate stage disposed inside the airtight container and holding a substrate, a depressurization mechanism for depressurizing the inside of the airtight container, a cover portion disposed inside the airtight container and covering the upper part of the substrate, the cover portion having a plurality of openings formed therein to control the pressure distribution around the substrate held by the substrate stage when the pressure is depressurized by the depressurization mechanism, a holding member disposed on the lower surface of the outer peripheral wall of the cover portion and holding the substrate by contacting the outer peripheral region of the surface of the substrate, and a drive mechanism that performs a downward operation to lower the cover portion so that the holding member and the substrate come into contact, and an upward operation to raise the cover portion so that the holding member and the substrate come into contact.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, a substrate drying method, and an article manufacturing method.

Background Art

[0002] The prior art in the process of manufacturing an article such as a panel (organic EL panel) having an OLED (Organic Light Emitting Diode) which is an organic EL (Electro Luminescence) element will be introduced. In such a process, for example, using an inkjet device, a solution (processing solution) containing a solute and a solvent is applied to a desired location on a substrate. The applied solution forms a solution film (liquid film). By drying this liquid film, a cured film (layer) is formed on the substrate. For drying the liquid film, a vacuum drying device which is a substrate processing device is used.

[0003] Patent Document 1 discloses a technique for making the film shape uniform by arranging an air flow regulating portion (cover) at a position facing the liquid film on the substrate and making the evaporation rate of the solvent uniform. The substrate holding portion is divided, and a lifting mechanism is provided for the divided substrate holding portion. When loading and unloading the substrate, the substrate can be transferred by raising and lowering a part of the divided portion of the substrate holding portion. Also, Patent Document 1 discloses a substrate transfer method in the case where the substrate holding portion is integrally formed. In this case, a plurality of lift pins that protrude from and retract into the upper surface of the substrate holding portion are provided, and the substrate can be transferred by raising and lowering the plurality of lift pins.

Prior Art Documents

Patent Documents

[0006] If there are gaps or holes in the substrate holder, when the substrate is placed on the holder, there will be areas on the underside of the substrate that are in contact with the holder and areas that are not. During vacuum drying, heat of vaporization is removed from the substrate as the processing liquid vaporizes, but due to the difference in effective heat capacity between the contact and non-contact areas, the drying rate of the liquid film on the substrate will vary locally, which may result in uneven film thickness on the substrate after drying. Uneven film thickness leads to uneven display and is undesirable.

[0007] Therefore, it is desirable that the substrate holding portion be integrally formed, without lift pin storage holes, and having a uniform flat surface. However, if the substrate holding portion is integrally formed and lacks lift pin storage holes, there is a problem in that transporting the substrate becomes difficult.

[0008] This invention provides a substrate transport technology that is advantageous in terms of uniformity of film thickness formed on the substrate. [Means for solving the problem]

[0009] According to one aspect of the present invention, a substrate processing apparatus is provided, comprising: an airtight container; a substrate stage disposed inside the airtight container and holding a substrate; a depressurization mechanism for reducing the pressure inside the airtight container; a cover portion disposed inside the airtight container and covering the upper part of the substrate, the cover portion having a plurality of openings formed therein to control the pressure distribution around the substrate held by the substrate stage when the pressure is reduced by the depressurization mechanism; a holding member disposed on the lower surface of the outer peripheral wall of the cover portion and holding the substrate by contacting the outer peripheral region of the surface of the substrate; and a drive mechanism that performs a downward operation to lower the cover portion so that the holding member and the substrate come into contact, and an upward operation to raise the cover portion so that the holding member and the substrate come into contact. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a substrate transport technology that is advantageous in terms of uniformity of the thickness of the film formed on the substrate. [Brief explanation of the drawing]

[0011] [Figure 1] A schematic cross-sectional view showing the configuration of a substrate processing unit. [Figure 2] A diagram illustrating a cover component. [Figure 3] A diagram illustrating a cover component. [Figure 4] A diagram showing the configuration of the buffering mechanism. [Figure 5] A diagram showing the configuration to be placed outside the airtight container. [Figure 6] A diagram showing the configuration of a robotic fork. [Figure 7] Flowchart of the substrate drying method. [Figure 8] A graph showing an example of pressure control in drying processes. [Modes for carrying out the invention]

[0012] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0013] FIG. 1 is a schematic cross-sectional view showing the configuration of a substrate processing apparatus SPA according to an embodiment. In this specification and the drawings, directions are indicated in an XYZ coordinate system with the horizontal plane being the XY plane. Generally, a substrate S to be processed is placed on a substrate stage 20 such that its surface is parallel to the horizontal plane (XY plane). Thus, hereinafter, in the plane along the surface of the substrate S placed on the substrate stage 20, the directions orthogonal to each other are defined as the X-axis and the Y-axis, and the direction perpendicular to the X-axis and the Y-axis is defined as the Z-axis. Further, hereinafter, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively.

[0014] In the following description, unless otherwise specified, the term "film" does not necessarily mean a solid, and may also refer to a case where it exists on a substrate containing components that can evaporate in a state such as a liquid, sol, gel, etc.

[0015] The substrate processing apparatus SPA can be configured to process a substrate S having a film F. More specifically, the substrate processing apparatus SPA can be configured to perform a drying process for drying the film F of the substrate S.

[0016] The film F can be, for example, a film (hereinafter referred to as a solution film) composed of a solution (processing liquid) containing a solute and a solvent for forming an organic film. The solvent can have a property that its evaporation is promoted in a reduced-pressure environment lower than atmospheric pressure (1 atm). The evaporation of the solvent can be promoted, for example, at a temperature higher than room temperature (25°C).

[0017] The solvent is preferably an organic solvent. The solvent contains at least one kind of organic solvent. Examples of the organic solvent can include, for example, the following.

[0018] N,N-Dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, diethylene glycol monomethyl ether, cyclohexanone, N,N-dimethylisobutyramide, N-methylformamide, N-methylacetamide, N-diethylformamide, cyclohexanol, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, 1,3-butanediol, 1,4-butanediol, propylene glycol, hexylene glycol, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate, N-hexyl acetate, ethyl cellosolve acetate, cyclohexylbenzene

[0019] The organic film can be, for example, any of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, and electron injection layer of an organic EL element (OLED). The manufacture of an organic EL element can include a step of forming each organic film such as the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, and electron injection layer on a substrate. The step of forming each organic film on the substrate can include a coating step of disposing or coating a solution containing a solute and a solvent on the substrate by an inkjet method or a printing method or the like, a drying step of drying the film containing the solvent to form a dried film, and a firing step of firing the dried film.

[0020] The PCB processing unit (SPA) is equipped with a controller 90 that controls the operation of each part of the device. The controller 90 is a computer for controlling the operation of the PCB processing unit (SPA), and internally includes a CPU, ROM, RAM, I / O ports, etc. The ROM stores a program that controls the operation of the PCB processing unit (SPA).

[0021] The program for executing various processes of the substrate processing method (article manufacturing method) according to this embodiment may be stored in ROM, like other operation programs, but may also be loaded into RAM from an external source via a network. Alternatively, it may be loaded into RAM via a recording medium readable by the computer on which the program is stored. The program may be stored on any recording medium that is readable by a computer. Examples of recording media that can be used to supply the program include flexible disks, hard disks, optical disks, magneto-optical disks, magnetic tapes, non-volatile memory, etc. Note that the functions of the controller 90 may be realized by dedicated hardware rather than by the execution of software (program). For example, the functions of the controller 90 may be realized by a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array). Alternatively, the functions of the controller 90 may be realized by an ASIC (Application Specific Integrated Circuit).

[0022] The substrate processing apparatus SPA may be equipped with an airtight container 10. The airtight container 10 is a component that defines a space that is separated from the external space and can be depressurized. Hereinafter, the space whose outer edge is defined by the airtight container 10 will also be referred to as the internal space of the airtight container 10. Of the internal space of the airtight container 10, the space surrounded by the substrate S and the cover portion 40 will be called the substrate housing space SP2, and the other space (for example, the space between the airtight container 10 and the cover portion 40) will be called the internal space SP1. The substrate housing space SP2 inside the cover portion 40 and the internal space SP1 are in communication with each other, but by surrounding the substrate S with the cover portion 40, the pressure distribution in the internal space SP2 can be adjusted to be as uniform as possible.

[0023] The airtight container 10 may be equipped with at least one gate valve 12. A substrate S coated with a film F to be dried is transported from the external space of the airtight container 10 into the internal space SP1 through the gate valve 12. After drying, the substrate S can be transported from the internal space SP1 to the external space through the gate valve 12. The loading and unloading of the substrate S can be performed by a robotic fork 220 (Figure 5) placed outside the airtight container 10.

[0024] The substrate processing apparatus SPA may further include a depressurization mechanism 30 for depressurizing the internal space SP1 of the airtight container 10. By operating the depressurization mechanism 30, the gas in the internal space SP1 of the airtight container 10 is exhausted through an exhaust duct, thereby reducing the pressure of the internal space SP1 of the airtight container 10. The depressurization mechanism 30 may include, for example, a plurality of pumps, which may include, for example, at least one of a dry pump and a diaphragm vacuum pump. The plurality of pumps may further include, for example, at least one of a turbomolecular pump, cryopump, sorption pump, oil diffusion pump, mechanical booster pump, ejector pump, and oil rotary vacuum pump.

[0025] The substrate processing apparatus SPA may further include a substrate stage 20 located inside the airtight container 10 (internal space SP1). The substrate stage 20 is a substrate holding unit that holds and moves a substrate S on which a film F is formed by vacuum suction or electrostatic adsorption. The substrate processing apparatus SPA may further include a temperature control unit 75 that adjusts the temperature distribution of the substrate S held by the substrate stage 20.

[0026] For example, the temperature control unit 75 may be located within the substrate stage 20. The temperature control unit 75 adjusts the temperature distribution of the substrate S or the film F on the substrate S by controlling the temperature of the substrate stage 20. The temperature control unit 75 may include a heater for heating the substrate stage 20. The temperature control unit 75 may also include a cooler for cooling the substrate stage 20. The temperature control unit 75 controls the temperature of the substrate stage 20 by performing at least one of heating and / or cooling on the substrate stage 20. The temperature control unit 75 controls the temperature of each of several regions of the substrate stage 20 so that the temperature distribution of the substrate S is uniform. Preferably, the temperature control unit 75 controls the temperature so that the temperature difference between several regions of the substrate S held by the substrate stage 20 is within 10°C. More preferably, the temperature control unit 75 controls the temperature so that the temperature between several regions of the substrate S held by the substrate stage 20 is within 5°C. The temperature control unit 75 controls the temperature of the substrate stage 20 so that the temperature of the substrate S is a predetermined temperature within the range of 0°C to 100°C. By heating the substrate stage 20, the drying speed of the film F coated on the substrate S can be improved.

[0027] The substrate processing apparatus SPA may further include a cover portion 40 that covers the upper part of the substrate S in the internal space SP1. The cover portion 40 is positioned to control (e.g., homogenize) the pressure distribution around the substrate S held by the substrate stage 20 (internal space SP2) when the pressure is reduced by the depressurization mechanism 30. The cover portion 40 may include an outer peripheral wall 41 that protrudes downward on the outer periphery of the cover portion 40, and a top plate member 43 supported by the outer peripheral wall 41. The cover portion 40 may further include a partition wall 42 that protrudes downward on the inner periphery side of the outer peripheral wall 41 and divides the region. The partition wall 42 may be composed of a plurality of pin-shaped members. The outer peripheral wall 41 and the partition wall 42 are arranged in a direction perpendicular to the upper surface of the substrate stage 20. The top plate member 43 is positioned in the Z direction opposite to the film F coated on the surface of the substrate S. The top plate member 43, the outer peripheral wall 41, and the partition wall 42 may be formed integrally, or they may be composed as separate members. If the top plate member 43, the outer perimeter wall 41, and the partition wall 42 are each configured as separate components, the top plate member 43 can be fastened to the outer perimeter wall 41 and the partition wall 42 with fastening members such as bolts.

[0028] As illustrated in Figure 1, the top plate member 43 has a plurality of openings 60. The arrangement and dimensions of the plurality of openings 60 can be determined so that the film F on the substrate S dries uniformly. When the cover portion 40 covers the substrate S, the substrate housing space SP2 surrounded by the cover portion 40 can be defined. The cover portion 40 only needs to have a configuration that allows the substrate housing space SP2 and the internal space SP1 to communicate when it covers the substrate S, and does not necessarily need to have openings.

[0029] The substrate processing apparatus SPA may further include a holding member 50 positioned on the lower surface of the outer peripheral wall 41 of the cover portion 40. The holding member 50 holds the substrate S by contacting the outer peripheral region of the surface of the substrate S. The holding member 50 can hold the substrate S by at least one of the following: an adhesive, vacuum suction, or electrostatic suction. In this embodiment, the holding member 50 is also positioned on the lower surface of the partition wall 42. The holding member 50 can hold the substrate S by the outer peripheral wall 41 of the cover portion 40 and the partition wall 42 contacting the substrate S via the holding member 50.

[0030] The holding of the substrate S by the holding member 50 is controlled by the controller 90. For example, the substrate processing apparatus SPA includes a lifting mechanism 80 for raising and lowering the cover portion 40, as illustrated in Figure 1. The lifting mechanism 80 is a drive mechanism that performs a downward movement to lower the cover portion 40 and an upward movement to raise the cover portion 40. The downward movement is performed, for example, when bringing the holding member 50 into contact with the substrate S. The upward movement is performed, for example, when separating the holding member 50 from the substrate S. The lifting mechanism 80 can be used when loading the substrate S, when setting the substrate S on the substrate stage 20, and when transporting the substrate S from the substrate stage 20 to the external space of the airtight container 10 after the drying process.

[0031] Furthermore, the substrate processing apparatus SPA may include a first gas introduction section 31 for introducing an inert gas into the internal space SP1 and a second gas introduction section 32 for introducing an inert gas into the substrate housing space SP2. Each of the first gas introduction section 31 and the second gas introduction section 32 may include, for example, a flexible tube and a valve. The first gas introduction section 31 is provided so as to penetrate the airtight container 10 and supplies an inert gas to the internal space SP1. The second gas introduction section 32 is provided so as to penetrate the airtight container 10 and the outer peripheral wall 41 of the cover section 40 and supplies an inert gas to the substrate housing space SP2.

[0032] The inert gas is, for example, nitrogen. While it is preferable that the gas supplied to the inside of the airtight container 10 from the first gas inlet 31 and the second gas inlet 32 ​​be an inert gas, any gas with a different composition from the solvent of the membrane F may be used. Such a gas other than an inert gas could be, for example, clean dry air.

[0033] The pressure in the internal space SP1 of the airtight container 10 is adjusted by supplying gas to the internal space SP1 via the first gas introduction section 31. In addition, the pressure in the internal space SP1 of the airtight container 10, particularly the pressure in the substrate housing space SP2, is adjusted by supplying gas to the space SP2 via the second gas introduction section 32.

[0034] The substrate processing apparatus SPA may further include an ionizer 85 that supplies ions into the airtight container 10 to suppress static electricity in the internal space SP1. The controller 90 can control the ON / OFF status of the ionizer 85 according to the progress of the drying process. For example, the controller 90 turns on the ionizer 85 when loading and unloading substrates S to suppress static electricity.

[0035] The cover portion 40 will be described with reference to Figure 2. Figure 2 is a cross-sectional view along line AA in Figure 1, and is a plan view of the cover portion 40 seen from above. The outer peripheral wall 41 of the cover portion 40 may overlap with the outer peripheral region of the substrate S. The partition wall 42 of the cover portion may overlap with the scribe line region of the substrate S. The outer peripheral region and the scribe line region of the substrate S are basically non-effective regions to which the solution is not applied. The scribe line region is a region that is planned to be cut along the scribe line in a later process. The scribe line region partitions multiple regions surrounded by the outer peripheral region. Note that the region partitioned by the scribe line region may include multiple effective regions that are not planned to be cut, for example. Effective regions may be regions on the substrate where a solution film is formed, printing regions, light-emitting regions, etc.

[0036] Referring to Figure 3, a cover portion 40 relating to another example will be described. Figure 3 is a cross-sectional view along line AA in Figure 1, similar to Figure 2, and is a plan view of the cover portion 40 seen from above. As shown in Figure 3, the cover portion 40 may include a first region R1 enclosed in a rectangle by the outer peripheral wall 41 and partition wall 42, and a second region R2 which is larger than the first region R1. The outer peripheral wall 41 of the cover portion 40 may overlap with the outer peripheral region of the substrate S. The partition wall 42 of the cover portion 40 may overlap with the scribe line region of the substrate S. Multiple openings 60 are formed in the top plate member 43. The diameters of the multiple openings 60 do not have to be the same. For example, the diameters of the multiple openings 60 may be different in the first region R1 and the second region R2.

[0037] It is preferable that a buffer mechanism 70 be placed between the lifting mechanism 80 and the cover portion 40 so as not to place a load on the substrate S and the robot fork 220 when the cover portion 40 is lowered and the substrate S is covered with the cover portion 40. The buffer mechanism 70 is configured to mitigate the impact when the holding member 50 and the substrate S come into contact. The buffer mechanism 70 placed between the lifting mechanism 80 and the cover portion 40 will be described with reference to Figures 4(a) and 4(b). Figures 4(a) and 4(b) are cross-sectional views of the buffer mechanism 70, where Figure 4(a) shows the state in which the holding member 50 is away from the substrate S, and Figure 4(b) shows the state in which the holding member 50 is in contact with the substrate S. The buffer mechanism 70 may include, for example, a main shaft 73 extending in the Z direction, and a spring 71 and a bush 72 inserted through the main shaft 73. The presence of a buffer mechanism 70 between the lifting mechanism 80 and the cover portion 40 reduces the impact on the substrate S when the cover portion 40 is lowered by the lifting mechanism 80 and comes into contact with the holding member 50.

[0038] Referring to Figure 5, the configuration of the substrate processing apparatus SPA other than the airtight container 10 will be described. As shown in Figure 5, the substrate processing apparatus SPA may further include a substrate transfer chamber 100 located in an external space connected via the gate valve 12 of the airtight container 10 for transferring substrates to and from other devices. The substrate processing apparatus SPA may also further include a transport robot chamber 200 that houses a transport robot 210 for transporting substrates between the substrate transfer chamber 100 and the airtight container 10 via the gate valve 12 of the airtight container 10. The substrate transfer chamber 100 may have lift pins 110 that support the substrate S from below. The transport robot 210 housed in the transport robot chamber 200 is equipped with a robot fork 220 that grips and moves the substrate, and the robot fork 220 can enter the interior of the substrate transfer chamber 100 and the airtight container 10. The robot fork 220 is configured so as not to interfere with the lift pins 110 when it enters the substrate transfer chamber 100.

[0039] The robot fork 220 of the transport robot 210 will be described with reference to Figures 6(a), 6(b), and 6(c). Figure 6(a) is a top view of the robot fork 220, Figure 6(b) is a top view of the robot fork 220 with the substrate S and cover portion 40 placed on it, and Figure 6(c) is a cross-sectional view along line BB in Figure 6(b).

[0040] When the robot fork 220 enters the internal space SP1 of the airtight container 10, it may have a substrate mounting surface at a location facing the outer peripheral wall 41 and the partition wall 42. Specifically, the substrate mounting surface is the location on the opposite side of the non-effective region of the substrate S that is in contact with the outer peripheral wall 41 and the partition wall 42.

[0041] The robot fork 220 may include a main frame 221 and a subframe 222, which constitute the substrate mounting surface. The main frame 221 is configured to grip the back surface portion of the outer peripheral region of the substrate. The subframe 222 is configured to grip the back surface portion of the scribe line region of the substrate. Preferably, the robot fork 220 is configured so that the position of the subframe 222 can be changed to match the positions of the effective and ineffective regions of the substrate S. Alternatively, multiple robot forks with different subframe 222 positions may be provided, and the robot fork that matches the positions of the effective and ineffective regions of the substrate S may be selected from the multiple robot forks. In addition, the main frame 221 and the subframe 222 may each be equipped with a suction mechanism 223 for holding the substrate. The suction mechanism 223 may include at least one of a vacuum suction mechanism and an electrostatic suction mechanism. The holding force of the substrate using the suction mechanism 223 by the main frame 221 and the subframe 222 is stronger than the holding force of the substrate by the holding member 50. As a result, the transfer of the substrate from the substrate held by the cover portion 40 to the robot fork 220 can be performed by the upward movement of the lifting mechanism 80.

[0042] Referring to Figure 7, a substrate drying method using a substrate processing apparatus (SPA) will be described. Figure 7 is a flowchart showing the procedure for a substrate drying method using a substrate processing apparatus (SPA). Each step shown in the flowchart is controlled by a controller 90. First, in a pre-treatment step (not shown) before the start, a film F containing an evaporable material is formed on the substrate S by a liquid-phase process, such as an inkjet method.

[0043] In the loading process S1, the controller 90 loads the substrate S into the airtight container 10. A specific example of the loading process S1 is described below. The substrate S, coated with a film F to be dried, is loaded into the substrate transfer chamber 100 via the gate valve 120 while placed on a robot fork of another device (not shown). The substrate S is supported on the lift pins 110 in the substrate transfer chamber 100. Subsequently, the controller 90 controls the transport robot 210 of the transport robot chamber 200 to move the robot fork 220 into the substrate transfer chamber 100. At this time, the robot fork 220 enters the substrate transfer chamber 100 at a lower position than the robot fork of the other device that was loaded earlier. The controller 90 raises the lift pins 110 in the substrate transfer chamber 100. As the lift pins 110 rise, the substrate S is isolated from the robot fork of the other device. In this state, the robot fork of the other device retracts from the substrate transfer chamber 100. Subsequently, the controller 90 lowers the lift pin 110 on which the substrate S is placed. This places the substrate S onto the robot fork 220. The controller 90 turns on the suction mechanism 223 (Figure 6(a)) of the robot fork 220, causing the substrate S to be held by the robot fork 220. As shown in Figures 6(a) and 6(b), the robot fork 220 may have a substrate mounting surface facing the outer peripheral wall 41 and partition wall 42, which are formed on the upper surfaces of the main frame 221 and subframe 222. As described above, the substrate S is transported by the robot fork 220, which consists of a main frame 221 having a size that fits the outer peripheral region of the substrate S and a subframe 222 positioned to fit the scribe line region of the substrate S. In other embodiments, a stocker for storing multiple subframes arranged differently is provided in the transport robot chamber 200. The transport robot 210 may select a subframe from among several subframes stored in the stocker that corresponds to the position of the scribe line area of ​​the substrate to be processed, and assemble it onto the main frame 221.

[0044] After the loading process S1, a holding process S2 is performed in which a holding member 50, positioned on the lower surface of the outer peripheral wall 41 of the cover portion 40 that covers the upper part of the substrate S, is brought into contact with the outer peripheral region of the substrate S's surface, and the substrate S is held by the holding member 50. In the holding process S2 of this embodiment, the holding member 50 positioned on the lower surface of the outer peripheral wall 41 of the cover portion 40 is brought into contact with the outer peripheral region of the substrate S's surface, and the holding member 50 positioned on the lower surface of the partition wall 42 is brought into contact with the scribe line region of the substrate S's surface. A specific example of the holding process S2 will be described below.

[0045] The controller 90 first opens the gate valve 12. Then, the controller 90 controls the transport robot 210 to move the robot fork 220, which is carrying the substrate S, into the internal space SP1 inside the airtight container 10 via the gate valve 12. The controller 90 controls the lifting mechanism 80 to lower the cover portion 40, bringing the holding member 50 into contact with the substrate S placed on the robot fork 220. As a result, the substrate S is held in place by the holding member 50.

[0046] The holding force of the substrate S by the holding member 50 will be explained. The dimensions of the substrate S are 260 cm on the long side, 225 cm on the short side, and 0.5 mm in thickness. The density of the glass is 2.38 g / cm³. 3 Let's assume that the weight of the substrate S is 6962g. Also, the area of ​​the outer wall 41 and the partition wall 42 that come into contact with the substrate S is 787.25cm². 2 Therefore, the force acting on the glass substrate per unit area is 8.84 gf / cm². 2 This is the result. In this case, if we set the safety factor to 3, it becomes 26.53 gf / cm². 2 If it has sufficient holding power, it can support the substrate S.

[0047] The retaining members 50, which are positioned on the lower surface of the outer peripheral wall 41 and the lower surface of the partition wall 42, can be, for example, an adhesive material. The retaining members 50 can hold the substrate S by coming into contact with the substrate S. As the adhesive material, a rubber material with a special resin coating on its surface can be used.

[0048] Instead of adhesive, or in addition to adhesive, a holding means by vacuum suction or electrostatic suction may be used. In the case of vacuum suction or electrostatic suction, after the substrate S placed on the robot fork 220 is covered with the cover portion 40, the controller 90 starts suction. In the case of electrostatic suction, a voltage is applied to the surface of the substrate S, so it is necessary to control the process so as not to damage the elements formed on the substrate S. Also, different holding means may be used for the outer peripheral wall 41 and the partition wall 42. For example, the substrate may be held by vacuum suction at the outer peripheral wall 41 and by adhesive at the partition wall 42.

[0049] After the holding process S2, with the substrate S held by the holding member 50, a driving process S3 is performed to drive the cover portion 40 so that the substrate S is placed on the substrate stage 20. A detailed example of the driving process S3 is described below.

[0050] The controller 90 turns off the suction mechanism 223 (Figure 6(a)) of the robot fork 220, controls the lifting mechanism 80 to raise the cover portion 40, and isolates the substrate S from the robot fork 220.

[0051] The larger the substrate S becomes, the more prone it is to bending. In this embodiment, however, the substrate S is held using the holding member 50 not only on the outer peripheral wall 41 but also on the partition wall 42. This allows the substrate S to be lifted with minimal bending, even when it is a large substrate.

[0052] When lifting the substrate S, it is necessary to raise the cover portion 40 while taking into account the amount of deflection. For example, in the case of a panel with an effective range of 90 inches, the substrate will deflect in the range of 50 mm to 80 mm, so it is preferable to leave a gap of 90 mm or more between the lower end of the cover portion 40 (the lower end of the holding member 50) and the robot fork 220.

[0053] After the substrate S is separated from the robot fork 220, the controller 90 drives the transport robot 210 to retract the robot fork 220 and close the gate valve 12 of the airtight container 10. Then, the controller 90 controls the lifting mechanism 80 to lower the cover 40 and place the substrate S on the substrate stage 20. The substrate stage 20 holds the substrate S. This completes the drive process S3.

[0054] After the driving process S3, a drying process S4 is performed to dry the substrate (and the film F on it) by reducing the pressure inside the airtight container 10. In the drying process S4, the controller 90 controls the pressure reduction mechanism 30 to reduce the pressure in the internal space SP1 of the airtight container 10 and starts the drying process to dry the film F on the substrate S. The drying process may include a plurality of pressure control processes. The controller 90 controls the pressure reduction mechanism 30 in each pressure control process. At this time, the controller 90 may also control the temperature adjustment unit 75 of the substrate stage 20 to control the temperature of the substrate S to a temperature suitable for the drying process.

[0055] The drying process will be described in detail below. Figure 8 is a graph showing an example of pressure control in the internal space SP1 of the airtight container 10 during the drying process. In Figure 8, the horizontal axis represents time, and the vertical axis represents the pressure in the internal space SP1. In the example in Figure 8, the multiple pressure control processes include four pressure control processes D1 to D4. However, the number of pressure control processes is not limited to four. The substrate processing apparatus SPA may further include a pressure gauge 15 for detecting the pressure in the internal space SP1 of the airtight container 10 (Figure 1). The pressure gauge 5 is located inside the airtight container 10. The controller 90 controls the pressure reduction mechanism 30 so that the pressure in the internal space SP1, i.e., the pressure value detected by the pressure gauge 15, approaches a predetermined value.

[0056] First, the controller 90 controls the depressurization mechanism 30 so that the pressure in the internal space SP1 of the airtight container 10, i.e., the pressure indicated by the pressure gauge 15, decreases from atmospheric pressure (1 atmosphere) to a first pressure P1 (pressure control step D1). As a result, the pressure inside the airtight container 10 is reduced to a first pressure P1. Pressure control step D1 is the process of reducing the pressure from atmospheric pressure to a first pressure P1. The first pressure P1 is a pressure lower than atmospheric pressure and higher than a predetermined pressure (for example, the vapor pressure of the solvent). The first pressure P1 depends on the vapor pressure of the solvent, but for example, it is 10 Pa. After the pressure indicated by the pressure gauge 15 reaches the first pressure P1, the controller 90 controls the depressurization mechanism 30 so that the pressure in the internal space SP1, i.e., the pressure indicated by the pressure gauge 15, is maintained at the first pressure P1 for a first time (pressure control step D2).

[0057] In pressure control step D2, the controller 90 operates the depressurization mechanism 30 and controls the supply of inert gas from the first gas inlet 31 to the internal space SP1 so that the pressure indicated by the pressure gauge 15 exceeds the vapor pressure of the solvent, i.e., becomes the first pressure P1. Note that the supply of inert gas from the first gas inlet 31 to the internal space SP1 may be performed not only in pressure control step D2, but also in any of the other pressure control steps D1, D3, or D4, for example, in pressure control step D4. Note that in pressure control steps D1 and D2, the introduction of inert gas from the second gas inlet 32 ​​is stopped.

[0058] In this embodiment, to control the pressure distribution around the substrate S, for example, to uniformly adjust the evaporation rate of the solvent in the film F on the substrate S, the substrate S is surrounded by a cover portion 40. When the solvent evaporates from the film F, the solvent vapor temporarily accumulates in the substrate housing space SP2 surrounded by the cover portion 40. Then, the solvent vapor flows from the substrate housing space SP2 to the internal space SP1 through a plurality of openings 60. The vapor that has flowed into the internal space SP1 is exhausted by the decompression mechanism 30.

[0059] In the pressure control process D2, the pressure in the internal space SP1 is maintained at the first pressure P1, allowing the film F to dry uniformly. That is, the film F can be dried so that its thickness is uniform. Therefore, the surface of the film F can be made flat. As shown in Figure 3, when the cover portion 40 is viewed from above, it may include a first region R1 enclosed in a rectangle by the outer peripheral wall 41 and the partition wall 42, and a second region R2 which is larger than the first region. Therefore, the substrate housing space in the first region R1 and the substrate housing space in the second region R2 are of different sizes.

[0060] The size and number of openings 60 are adjusted so that the pressure distribution in the substrate housing space SP2 becomes uniform, while maintaining the pressure in the substrate housing space in the first region R1 and the second region R2 at predetermined pressures. Therefore, in the pressure control process D2, the pressure in the substrate housing space SP2 is finely adjusted, allowing the film F to be dried more effectively and uniformly. The shape of the film F is roughly determined by the time of the pressure control process D2.

[0061] The first gas introduction unit 31 supplies an inert gas to the internal space SP1 of the airtight container 10 in the pressure control step D2 so that the internal space SP1 exceeds a predetermined pressure. Here, the predetermined pressure is the vapor pressure of the solvent contained in the film F, but the predetermined pressure may be a different pressure from the vapor pressure of the solvent contained in the film F, as long as it is a value based on the vapor pressure of the solvent contained in the film F. For example, in order to further stabilize and flatten the film thickness of the film F, the predetermined pressure may be a pressure slightly higher than the vapor pressure of the solvent contained in the film F. The second gas introduction unit 32 may also supply an inert gas to the substrate containment space SP2 in the pressure control step D2.

[0062] After the first hour has elapsed, the controller 90 controls the depressurization mechanism 30 so that the pressure in the internal space SP1 of the airtight container 10, i.e., the pressure indicated by the pressure gauge 15, decreases from the first pressure P1 to the second pressure P2 (pressure control step D3). As a result, the pressure inside the airtight container 10 is reduced to the second pressure P2. Pressure control step D3 is the process of reducing the pressure from the first pressure P1 to the second pressure P2. The second pressure P2 is a pressure lower than the first pressure P1 and is a pressure lower than the vapor pressure of the solvent. The second pressure P2 depends on the vapor pressure of the solvent, but for example, 10 -3 The pressure is Pa. Then, after the pressure indicated by the pressure gauge 15 reaches the second pressure P2, the controller 90 controls the pressure reduction mechanism 30 so that the pressure in the internal space SP1, i.e., the pressure indicated by the pressure gauge 15, is maintained at the second pressure P2 for a second period of time (pressure control process D4).

[0063] From pressure control step D3 onward, the film F on the substrate S is further dried while the pressure inside the airtight container 10 is reduced to the second pressure P2. In particular, in pressure control step D4, the film F on the substrate S is further dried while the pressure in the internal space SP1 is maintained at the second pressure P2. As a result, a flat film is formed on the substrate S.

[0064] The second gas introduction unit 32 can maintain the pressure in the substrate housing space SP2 at the second pressure by supplying inert gas even when the depressurization mechanism 30 is operating during the pressure control process D4. The inert gas output from the second gas introduction unit 32 can also function as a means of discharging solvent accumulated in the substrate housing space SP2. The first gas introduction unit 31 may also supply inert gas to the internal space SP1 during the pressure control process D4.

[0065] After the drying process S4, an unloading process S5 is performed to separate the substrate S from the substrate stage 20 and the holding member 50 and unload the substrate S to the outside of the airtight container 10. In the unloading process S5, the controller 90 first releases the substrate S from the substrate stage 20, and then controls the lifting mechanism 80 to raise the cover portion 40 while the substrate S is still held by the holding member 50, thereby separating the substrate S from the substrate stage 20. At this time, the controller 90 raises the cover portion 40 until the substrate S, separated from the substrate stage 20, is at a height that does not interfere with the robot fork 220.

[0066] Next, the controller 90 first opens the gate valve 12, and then controls the transport robot 210 in the transport robot chamber 200 to move the robot fork 220 into the internal space SP1 of the airtight container 10 through the gate valve 12. The controller 90 controls the lifting mechanism 80 to lower the cover 40 and place the substrate S on the robot fork 220.

[0067] The controller 90 turns on the suction mechanism 223 of the robot fork 220, causing the substrate S to be held by the robot fork 220. The suction mechanism 223 provided on the robot fork 220 will now be described. As shown in Figure 6(a), the suction mechanism 223 is arranged on the main frame 221 and the subframe 222, and the frame portion has through holes for air suction. Specifically, as shown in Figures 6(b) and 6(c), the suction mechanism 223 has through holes for air suction so that the main frame 221 and the subframe 222 can suction the surface of the substrate S opposite to the non-effective area. The suction mechanisms 223 arranged on the main frame 221 and the subframe 222 may be controlled by the same suction pump, or they may be controlled by separate suction pumps.

[0068] After the substrate S is held by the robot fork 220, the controller 90 controls the lifting mechanism 80 to raise the cover portion 40. As described above, the holding force of the substrate using the suction mechanism 223 by the main frame 221 and subframe 222 is stronger than the holding force of the substrate by the holding member 50. Therefore, the lifting operation by the lifting mechanism 80 separates the substrate S from the cover portion 40 (holding member 50) without separating it from the robot fork 220. At this time, it is preferable for the controller 90 to turn on the ionizer 85 to obtain a static-free environment in which static electricity is suppressed.

[0069] After the substrate S is separated from the cover portion 40 (holding member 50), the controller 90 controls the transport robot 210 to remove the robot fork 220 carrying the substrate S from the airtight container 10 and transport it to the substrate transfer chamber 100. After the robot fork 220 has been transported to the substrate transfer chamber 100, the controller 90 releases the suction holding of the substrate S by the robot fork 220. Then, the controller 90 raises the lift pin 110 of the substrate transfer chamber 100, lifting the substrate S off the robot fork 220. Next, the controller 90 allows the robot fork of another device to enter the substrate transfer chamber 100 via the gate valve 120. As the robot fork of the other device enters, it moves between the substrate S, which is lifted by the lift pin 110, and the robot fork 220. The controller 90 lowers the lift pin 110 of the substrate transfer chamber 100, placing the substrate S on the robot fork of the other device. Subsequently, the robotic fork 220 retracts from the substrate transfer chamber 100. The above is a detailed description of the unloading process S5.

[0070] The substrate S, after being removed from the substrate transfer room 100, undergoes further necessary processing to manufacture the desired article. Such processing may include, for example, a firing process for the dried film, the formation of further films, the formation of electrodes, and the formation of a sealing film.

[0071] As described above, this embodiment provides a configuration in which a substrate is transported using a cover member that can adsorb and grip the ineffective area of ​​the substrate surface. With this characteristic configuration, the substrate processing apparatus of this embodiment can perform drying and substrate transport without causing display irregularities such as pin unevenness.

[0072] <Embodiment of Article Manufacturing Method> The article manufacturing method in the embodiment of the present invention is suitable for manufacturing articles such as display panels for organic ELs, microdevices such as semiconductor devices, and elements having fine structures. A liquid film is formed on a substrate using the above-mentioned substrate processing apparatus or external apparatus. The article manufacturing method of this embodiment includes a first step of drying the liquid film formed on the substrate using the above-mentioned substrate processing apparatus to form a dry film, and a second step of manufacturing an article from the substrate on which the dry film has been formed. Furthermore, such an article manufacturing method includes other well-known steps (such as firing, cooling, washing, oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0073] The disclosures herein include at least the following technologies: (Item 1) Airtight container and A substrate stage is placed inside the aforementioned airtight container to hold the substrate, A depressurization mechanism for reducing the pressure inside the airtight container, A cover portion disposed inside the airtight container and covering the upper part of the substrate, the cover portion having a plurality of openings formed therein in order to control the pressure distribution around the substrate held by the substrate stage when the pressure is reduced by the depressurization mechanism, A holding member is positioned on the lower surface of the outer peripheral wall of the cover portion and holds the substrate by contacting the outer peripheral region of the surface of the substrate, A drive mechanism that performs a downward operation to lower the cover portion so as to bring the holding member and the substrate into contact, and an upward operation to raise the cover portion so as to separate the holding member and the substrate, A substrate processing apparatus characterized by having (Item 2) The cover portion further has a partition wall that divides the area on the inner side of the outer peripheral wall, The retaining member is positioned on the lower surface of the outer peripheral wall and the lower surface of the partition wall. A substrate processing apparatus according to item 1, characterized in that it is a substrate processing apparatus. (Item 3) The substrate includes scribe line regions that demarcate a plurality of regions surrounded by the outer peripheral region, As a result of the downward movement, the retaining member positioned on the lower surface of the outer peripheral wall of the cover portion comes into contact with the outer peripheral region, and the retaining member positioned on the lower surface of the partition wall of the cover portion comes into contact with the scribe line region. A substrate processing apparatus according to item 2, characterized in that (Item 4) The substrate processing apparatus according to any one of items 1 to 3, characterized in that the holding member holds the substrate by at least one of an adhesive, vacuum suction, or electrostatic suction. (Item 5) The cover portion has a top plate member, The top plate member has the plurality of openings formed therein. A substrate processing apparatus according to any one of items 1 to 4, characterized by the features described in item 1 to 4. (Item 6) A substrate processing apparatus according to any one of items 1 to 5, further comprising a buffering mechanism for mitigating the impact when the holding member and the substrate come into contact. (Item 7) A substrate processing apparatus according to any one of items 1 to 6, further comprising a temperature adjustment unit for adjusting the temperature distribution of the substrate held by the substrate stage. (Item 8) A substrate transfer room is located in an external space connected via the gate valve of the aforementioned airtight container, where substrates are transferred to and from other devices. A transport robot room housing a transport robot that transports the substrate between the substrate transfer chamber and the airtight container via the gate valve, A substrate processing apparatus according to item 1, characterized by having the following features. (Item 9) The substrate includes an outer peripheral region of the surface and a scribe line region that demarcates a plurality of regions surrounded by the outer peripheral region. The transport robot has a robotic fork that grips and moves the substrate, The aforementioned robotic fork is A main frame that grips the back surface portion of the outer peripheral region of the substrate, A subframe that grips the back surface portion of the scribe line region of the substrate, A substrate processing apparatus according to item 8, characterized by including the following: (Item 10) The substrate processing apparatus according to item 9, characterized in that the holding force of the substrate by the main frame and the subframe is stronger than the holding force of the substrate by the holding member. (Item 11) The substrate processing apparatus according to any one of items 1 to 10, further comprising an ionizer that supplies ions to the inside of the airtight container while the upward movement is being performed. (Item 12) A method for drying a circuit board, A loading process for loading the aforementioned substrate into the airtight container, After the above loading process, a holding process is performed in which a holding member, positioned on the lower surface of the outer peripheral wall of the cover portion covering the upper part of the substrate, is brought into contact with the outer peripheral region of the surface of the substrate, and the substrate is held by the holding member. After the holding step, a driving step is performed to drive the cover portion so that the substrate is placed on the substrate stage while the substrate is held by the holding member, After the above driving step, a drying step is performed to dry the substrate by reducing the pressure inside the airtight container, After the drying step, the removal step involves separating the substrate from the substrate stage and the holding member and removing the substrate from the airtight container. A substrate drying method characterized by having the following features. (Item 13) A first step involves drying a liquid film formed on a substrate using a substrate processing apparatus described in any one of items 1 to 11 to form a dry film, A second step of manufacturing an article from the substrate on which the dried film has been formed, A method for manufacturing articles, characterized by having the following features.

[0074] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0075] SPA: Substrate processing apparatus, S: Substrate, 10: Airtight container, 20: Substrate stage, 30: Pressure reduction mechanism, 40: Cover section, 41: Outer peripheral wall, 42: Partition wall, 43: Top plate member, 50: Holding member, 80: Lifting mechanism

Claims

1. Airtight container and A substrate stage is placed inside the aforementioned airtight container to hold the substrate, A depressurization mechanism for reducing the pressure inside the airtight container, A cover portion disposed inside the airtight container and covering the upper part of the substrate, the cover portion having a plurality of openings formed therein in order to control the pressure distribution around the substrate held by the substrate stage when the pressure is reduced by the depressurization mechanism, A holding member is positioned on the lower surface of the outer peripheral wall of the cover portion and holds the substrate by contacting the outer peripheral region of the surface of the substrate, A drive mechanism that performs a downward operation to lower the cover portion so as to bring the holding member and the substrate into contact, and an upward operation to raise the cover portion so as to separate the holding member and the substrate, A substrate processing apparatus characterized by having

2. The cover portion further has a partition wall that divides the area on the inner side of the outer peripheral wall, The retaining member is positioned on the lower surface of the outer peripheral wall and the lower surface of the partition wall. The substrate processing apparatus according to claim 1.

3. The substrate includes scribe line regions that demarcate a plurality of regions surrounded by the outer peripheral region, As a result of the downward movement, the retaining member positioned on the lower surface of the outer peripheral wall of the cover portion comes into contact with the outer peripheral region, and the retaining member positioned on the lower surface of the partition wall of the cover portion comes into contact with the scribe line region. The substrate processing apparatus according to feature 2.

4. The substrate processing apparatus according to claim 1, characterized in that the holding member holds the substrate by at least one of an adhesive, vacuum suction, or electrostatic suction.

5. The cover portion has a top plate member, The top plate member has the plurality of openings formed therein. The substrate processing apparatus according to claim 1.

6. The substrate processing apparatus according to claim 1, further comprising a buffering mechanism for mitigating the impact when the holding member and the substrate come into contact.

7. The substrate processing apparatus according to claim 1, further comprising a temperature adjustment unit for adjusting the temperature distribution of the substrate held by the substrate stage.

8. A substrate transfer room is located in an external space connected via the gate valve of the aforementioned airtight container, where substrates are transferred to and from other devices. A transport robot room housing a transport robot that transports the substrate between the substrate transfer chamber and the airtight container via the gate valve, A substrate processing apparatus according to claim 1, characterized by having the following features.

9. The substrate includes an outer peripheral region of the surface and a scribe line region that demarcates a plurality of regions surrounded by the outer peripheral region. The transport robot has a robotic fork that grips and moves the substrate, The aforementioned robotic fork is A main frame that grips the back surface portion of the outer peripheral region of the substrate, A subframe that grips the back surface portion of the scribe line region of the substrate, A substrate processing apparatus according to claim 8, characterized in that it includes the following:

10. The substrate processing apparatus according to claim 9, characterized in that the holding force of the substrate by the main frame and the subframe is stronger than the holding force of the substrate by the holding member.

11. The substrate processing apparatus according to claim 1, further comprising an ionizer that supplies ions into the airtight container while the upward movement is being performed.

12. A method for drying a circuit board, A loading process for loading the aforementioned substrate into the airtight container, After the above loading process, a holding process is performed in which a holding member, positioned on the lower surface of the outer peripheral wall of the cover portion covering the upper part of the substrate, is brought into contact with the outer peripheral region of the surface of the substrate, and the substrate is held by the holding member. After the holding step, a driving step is performed to drive the cover portion so that the substrate is placed on the substrate stage while the substrate is held by the holding member, After the above driving step, a drying step is performed to dry the substrate by reducing the pressure inside the airtight container, After the drying step, the removal step involves separating the substrate from the substrate stage and the holding member and removing the substrate from the airtight container. A substrate drying method characterized by having the following features.

13. A first step of forming a dried film by drying a liquid film formed on a substrate using a substrate processing apparatus according to any one of claims 1 to 11, A second step of manufacturing an article from the substrate on which the dried film has been formed, A method for manufacturing articles, characterized by having the following features.

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