Piezoelectric vibration device

Abstract

To provide a piezoelectric vibration device that can improve yield, offers excellent mass productivity, and possesses high operational reliability. [Solution] The present invention provides a piezoelectric vibration device comprising a piezoelectric vibrator, an integrated circuit chip 4 having a plurality of integrated circuit terminals including a ground terminal, a package including a first mounting area on which the piezoelectric vibrator is mounted, and a second mounting area R2 on which the integrated circuit is mounted, wherein a pair of mounted electrodes 40 that conduct to the excitation electrode of the piezoelectric vibrator are formed in the first mounting area, and a plurality of integrated circuit electrodes 81 that conduct to the integrated circuit terminals are formed in the second mounting area, and the plurality of integrated circuit electrodes include a ground electrode 82 that conducts to the ground terminal and a pair of monitor electrodes 83 that conduct to the mounted electrodes respectively, and the ground electrode is formed to have an area S1 that is larger than the area S3 to S5 of the remaining integrated circuit electrodes excluding the ground electrode and monitor electrode.

Description

Technical Field

[0001] The present invention relates to a piezoelectric vibration device.

Background Art

[0002] Conventionally, for example, in electronic devices such as mobile phones, piezoelectric vibration devices including piezoelectric vibration pieces using quartz have been used. As this type of piezoelectric vibration device, for example, in Patent Document 1, a crystal oscillator (oscillator) including a quartz piece (piezoelectric vibration piece), an IC chip having an oscillation circuit, and a container body housing the quartz piece and the IC chip is known.

[0003] On one main surface of the container body, a first recess for housing the quartz piece is formed, and on the other main surface, a second recess for housing the IC chip is formed. The IC chip has a plurality of IC terminals including a pair of quartz terminals. The plurality of IC terminals include, in addition to the pair of quartz terminals, for example, a power supply terminal, an output terminal, a ground terminal, a signal terminal, and the like. On the bottom surface of the second recess, a plurality of mounting electrodes corresponding to the plurality of IC terminals formed on the IC chip are formed. Among the plurality of mounting electrodes, a pair of mounting electrodes electrically connected to the pair of quartz terminals respectively are used as combined electrodes that also serve as monitor electrodes.

[0004] The combined electrodes are electrodes that conduct to the excitation electrodes of the quartz piece, and are used, for example, when measuring (inspecting) the vibration characteristics of the quartz piece during the manufacturing process or the like. The mounting electrodes other than the combined electrodes are electrically connected to each IC terminal (power supply terminal, output terminal, ground terminal, signal terminal, etc.) other than the quartz terminals. In particular, the combined electrodes that also serve as monitor electrodes are formed with a larger area than the other mounting electrodes.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

[0006] Incidentally, this type of crystal oscillator has become smaller in size due to recent technological advancements. As a result, the area of ​​the multiple mounting electrodes, including the multi-purpose electrodes, is also decreasing. Consequently, it is becoming increasingly difficult to evaluate the vibration characteristics of the crystal pieces using the inspection probes commonly used during the manufacturing process.

[0007] In addition, when the size of a crystal oscillator is miniaturized, problems are likely to arise such as the insulation resistance between the excitation electrode of the crystal (piezoelectric vibrator) and the external connection electrode becoming smaller due to unintended spreading of conductive adhesive during the manufacturing process, leading to oscillation failure of the crystal. Specifically, during the manufacturing process, when mounting the crystal to the package (container body) via the bump portion (conductive adhesive), if the bump portion spreads to an unintended area due to variations, there is a risk of electrical contact with the external connection electrode, for example, through the joint surface of the lid of the package. In this case, the electrical path between the excitation electrode of the crystal and the external connection electrode becomes shorter than the original path, resulting in lower insulation resistance. This leads to oscillation failure of the crystal.

[0008] Therefore, in order to further miniaturize the size of the crystal oscillator, it is necessary to evaluate the insulation resistance in addition to evaluating the vibration characteristics of the crystal element. For example, when evaluating the insulation resistance of the conventional crystal oscillator described above, after mounting the crystal, the resistance between the mounted electrode (the electrode to which the ground terminal is electrically connected) and the shared electrode is measured by applying a voltage while the test probe is in contact with both electrodes, and the insulation resistance is evaluated.

[0009] As mentioned above, in order to further reduce the size of the crystal oscillator, it is necessary to evaluate the insulation resistance in addition to evaluating the vibration characteristics of the crystal. In this regard, the conventional crystal oscillator described above deliberately makes the area of ​​the shared electrode large in order to facilitate contact between the test probe and the shared electrode. However, due to the large area of ​​the shared electrode, the area of ​​the other mounted electrodes (including the ground electrode electrically connected to the ground terminal) is made small. Consequently, it becomes even more difficult to make contact between the test probe and the ground electrode, making it difficult to efficiently evaluate the insulation resistance. As a result, the yield is poor, and there is room for improvement.

[0010] This invention has been made in consideration of these circumstances, and its purpose is to provide a piezoelectric vibration device that can improve yield, has excellent mass-producibility, and possesses high operational reliability. [Means for solving the problem]

[0011] (1) The piezoelectric vibration device according to the present invention comprises a piezoelectric vibrator, an integrated circuit having a plurality of integrated circuit terminals including a ground terminal, and a package including a first mounting area on which the piezoelectric vibrator is mounted and a second mounting area on which the integrated circuit is mounted, wherein a pair of mounted electrodes that are conductive to the excitation electrode of the piezoelectric vibrator are formed in the first mounting area, and a plurality of integrated circuit electrodes that are conductive to the integrated circuit terminals are formed in the second mounting area, and the plurality of integrated circuit electrodes include a ground electrode that is conductive to the ground terminal and a pair of monitor electrodes that are conductive to the mounted electrodes, and the ground electrode is formed to have a larger area than the area of ​​the remaining integrated circuit electrodes excluding the ground electrode and the monitor electrode from the plurality of integrated circuit electrodes.

[0012] According to the piezoelectric vibration device of the present invention, the piezoelectric vibrating piece is mounted via a pair of mounting electrodes formed in a first mounting area of ​​the package, so that the excitation electrode is fixed in a state of electrical contact with the mounting electrode. The integrated circuit is mounted via a plurality of integrated circuit electrodes formed in a second mounting area of ​​the package, so that a plurality of integrated circuit terminals are fixed in a state of electrical contact with each of the plurality of integrated circuit electrodes. Therefore, by supplying current to the excitation electrode, the piezoelectric vibrator can be vibrated in a predetermined resonant frequency band, and this can be converted into an electrical signal due to its piezoelectric properties. Then, using an integrated circuit, an output signal such as a clock signal can be generated based on the electrical signal. This allows it to function, for example, as an oscillator.

[0013] In particular, in the multiple integrated circuit electrodes formed on the package, the area of ​​the ground electrode is formed to be larger than the area of ​​the remaining integrated circuit electrodes excluding the ground electrode and the monitor electrode. This allows the inspection probe to be easily and properly pressed against the ground electrode and monitor electrode after the piezoelectric vibrator is mounted in the package during the manufacturing process of the piezoelectric vibration device. Therefore, even if the piezoelectric vibration device is miniaturized, the resistance value between the ground electrode and monitor electrode can be easily and appropriately measured, and insulation resistance evaluation can be performed. Therefore, yield can be improved, piezoelectric vibration devices can be manufactured efficiently with excellent mass production capabilities, and piezoelectric vibration devices can be produced with high operational reliability.

[0014] (2) At least one of the monitor electrodes may be formed to have a larger area than the remaining integrated circuit electrodes.

[0015] In this case, it becomes easier to apply the inspection probe to the monitor electrode, which has a large surface area, so that the inspection probe can be properly contacted with both the ground electrode and the monitor electrode. Therefore, insulation resistance evaluation can be easily performed. Furthermore, even when performing vibration characteristic evaluation, the inspection probe can be easily applied to the monitor electrode, which has at least a large surface area, allowing for easy and appropriate measurement of the piezoelectric vibrator's frequency and other parameters, thereby enabling vibration characteristic evaluation. Consequently, this also improves yield and results in a piezoelectric vibration device with high operational reliability.

[0016] (3) The pair of monitor electrodes may include a first monitor electrode formed to have an area larger than the area of ​​the remaining integrated circuit electrodes, and a second monitor electrode formed to have an area smaller than the area of ​​the remaining integrated circuit electrodes.

[0017] In this case, the difference in area allows for clear distinction and recognition between the first and second monitor electrodes, making it easier to determine, for example, input (in) and output (out). Consequently, it becomes easier to mount the integrated circuit in the second mounting area of ​​the package. Furthermore, by making the area of ​​the second monitor electrode smaller, the area of ​​the first monitor electrode can be made larger, thus making the above-mentioned effects even more effective. It is also possible to make the area of ​​the first monitor electrode larger than, for example, the area of ​​the ground electrode.

[0018] (4) The pair of monitor electrodes may be formed to have a smaller area than the area of ​​the ground electrode.

[0019] In this case, since the ground electrode has the largest surface area among the multiple integrated circuit electrodes, it is easier to position the test probe when performing insulation resistance evaluation. That is, when pressing the test probe against the ground electrode and the monitor electrode, the surface area of ​​the ground electrode is sufficiently large, so particular care only needs to be taken when pressing the test probe against the monitor electrode. Therefore, it is easier to properly position the test probe and perform insulation resistance evaluation efficiently. Furthermore, since the surface area of ​​the monitor electrode can be reduced, heat transfer through the monitor electrode can be suppressed.

[0020] (5) In a plan view of the package, the pair of monitor electrodes may be formed to each have a certain electrode width and may be arranged parallel to each other with a certain interval between them along the width direction of the electrode width.

[0021] In this case, since a pair of monitor electrodes are formed to be arranged in parallel with a certain electrode width and at a certain interval, for example, when evaluating vibration characteristics, it becomes easier to press the inspection probe against them, which can result in further improvement in yield. Particularly, since a pair of monitor electrodes are arranged at a certain interval, it is possible to suppress the generation of stray capacitance (parasitic capacitance), which is an unintended capacitance between the pair of monitor electrodes. Therefore, it is possible to suppress deterioration of voltage characteristics caused by the influence of stray capacitance, and the piezoelectric vibrating piece can be vibrated with stable frequency characteristics. Accordingly, an output signal can be stably generated, and a piezoelectric vibration device having high operating reliability can be obtained. Furthermore, it is possible to suppress unintentional conduction between the pair of monitor electrodes, which can lead to prevention of short circuits.

[0022] (6) The pair of monitor electrodes may be arranged so as to be parallel to each other with an interval of at least 140 μm.

[0023] In this case, since a pair of monitor electrodes are arranged with an interval of at least 140 μm, not only can the generation of stray capacitance be further suppressed, but also, for example, when the inspection probe is pressed against each of the pair of monitor electrodes, it is possible to suppress the inspection probes from contacting each other.

[0024] (7) The piezoelectric vibrating piece may include a piezoelectric plate having a pair of vibrating arm portions arranged parallel to each other and a base portion integrally fixing the base end portions of the vibrating arm portions, and excitation electrodes formed on an outer surface of the piezoelectric plate for vibrating the pair of vibrating arm portions when a voltage is applied.

[0025] In this case, by supplying current to the excitation electrodes, the pair of vibrating arm portions can be vibrated in a direction approaching and separating from each other within a predetermined frequency band. Particularly, as the piezoelectric vibrating piece, a general tuning fork type vibrating piece having a pair of vibrating arm portions can be used, and the component cost can be reduced.

Advantages of the Invention

[0026] According to the present invention, it is possible to create a piezoelectric vibration device that can improve yield, has excellent mass-producibility, and possesses high operational reliability. [Brief explanation of the drawing]

[0027] [Figure 1] This is an external perspective view showing an embodiment of the oscillator (piezoelectric vibration device) according to the present invention. [Figure 2] Figure 1 is a top view of the oscillator, with the lid and seal ring shown in Figure 1 removed. [Figure 3] Figure 1 is an exploded perspective view of the oscillator shown. [Figure 4] Figure 2 is a longitudinal cross-sectional view of the oscillator along the AA line. [Figure 5] Figure 2 is a top view of the piezoelectric vibrator (including each electrode). [Figure 6] Figure 1 is a bottom view of the oscillator shown. [Figure 7] This figure shows the inspection probe being pressed against the ground electrode and monitor electrode shown in Figure 6. [Figure 8] This figure shows the inspection probe being pressed against the pair of monitor electrodes shown in Figure 6. [Figure 9] This figure shows a modified example of the oscillator shown in Figure 1, and is a bottom view of the oscillator. [Modes for carrying out the invention]

[0028] Hereinafter, embodiments of the piezoelectric vibration device according to the present invention will be described with reference to the drawings. In this embodiment, an oscillator will be used as an example of a piezoelectric vibration device. As shown in Figures 1 to 4, the oscillator (piezoelectric vibration device according to the present invention) 1 of this embodiment comprises a package 2, a piezoelectric vibrator 3 mounted on the package 2, and an integrated circuit chip (integrated circuit according to the present invention) 4 mounted on the package 2. The piezoelectric vibrator 3 functions as a so-called oscillator. The integrated circuit chip 4 is electrically connected to the piezoelectric vibrator 3 and has an oscillation circuit (not shown). The oscillation circuit has the function of generating output signals such as a clock signal (reference signal) based on the electrical signal from the piezoelectric vibrator 3.

[0029] (package) Package 2 comprises a package body 10 and a lid (sealing plate) 12 that is joined to the package body 10 via a sealing ring 11 so as to overlap it. The package body 10 and the lid 12 overlap in the thickness direction T of the package 2. In this embodiment, two mutually orthogonal directions are defined as the first direction L1 and the second direction L2 in a plan view from the thickness direction T. Furthermore, in the thickness direction T, the direction from the package 2 toward the lid 12 is defined as upward, and the opposite direction is defined as downward.

[0030] (Package itself) The package body 10 comprises a mounting substrate 20 having a first mounting surface 20a and a second mounting surface 20b facing each other in the thickness direction T, and a frame-shaped first frame 21 and a frame-shaped second frame 22 joined to the mounting substrate 20. These mounting substrate 20, first frame 21 and second frame 22 are formed of an insulating material, for example, ceramic. Examples of ceramic materials include HTCC (High Temperature Co-Fired Ceramic) made from alumina and LTCC (Low Temperature Co-Fired Ceramic) made from glass ceramics.

[0031] The mounting board 20 is a laminated board in which a first mounting board 30 and a second mounting board 31 are joined together vertically. The first mounting substrate 30 is a flat substrate having a predetermined thickness, and is formed in a rectangular shape in a plan view from the thickness direction T, where the length along the first direction L1 is longer than the length along the second direction L2.

[0032] The second mounting substrate 31 is positioned above the first mounting substrate 30 and is integrally bonded to the upper surface of the first mounting substrate 30 by sintering or the like. The second mounting substrate 31 is a flat substrate having a predetermined thickness, and its external shape is formed to be the same as that of the first mounting substrate 30. In the illustrated example, the second mounting substrate 31 is slightly thinner than the first mounting substrate 30. However, this is not the only example, and the thickness of the second mounting substrate 31 may be changed as appropriate.

[0033] The second mounting substrate 31 has a through hole 32 that penetrates the substrate 31 in the thickness direction T. The through hole 32 is formed in a rectangular shape corresponding to the outer shape of the second mounting substrate 31, with a length along the first direction L1 being longer than the length along the second direction L2 in a plan view. The four corners of the through hole 32 are formed in a rounded, curved shape. As a result, the second mounting substrate 31 is formed in a frame shape having through holes 32. Furthermore, on the inner surface of the second mounting substrate 31, a pair of mounting portions 33 are formed on the portion facing the second direction L2 so as to protrude inward toward the through holes 32. The pair of mounting portions 33 are formed in a rectangular shape in plan view, with a length along the first direction L1 being longer than the length along the second direction L2, and the corners are formed in a curved shape with rounded edges.

[0034] In the mounting substrate 20 configured as described above, the upper surface of the second mounting substrate 31, including the upper surfaces of the pair of mounting portions 33, functions as the first mounting surface 20a of the mounting substrate 20. The lower surface of the first mounting substrate 30 functions as the second mounting surface 20b of the mounting substrate 20. Furthermore, in this embodiment, the mounting substrate 20 is a laminated substrate in which a first mounting substrate 30 and a second mounting substrate 31 are stacked, but it is not limited to this case, and a single-layer mounting substrate 20 may also be used. In this case, for example, a pair of mounting portions 33 may be provided by forming a recess that is indented downward on the upper surface of the mounting substrate 20.

[0035] The first frame 21 is formed such that, in a plan view, its outer shape is the same as that of the second mounting substrate 31. Therefore, the first frame 21 is formed in a frame shape that is longer in the first direction L1 than in the second direction L2. In the illustrated example, the first frame 21 has the same thickness as the second mounting substrate 31. However, this is not limited to this case, and the thickness of the first frame 21 may be changed as appropriate. The first frame 21 is positioned above the second mounting board 31 and is superimposed on the upper surface of the second mounting board 31, and is integrally joined by sintering or the like.

[0036] The first frame 21 is not mandatory and does not need to be included. For example, the first frame 21 can be omitted, and the portion of the second mounting substrate 31 excluding the pair of mounting portions 33 can be made to protrude upward, thereby making it even thicker. However, by including the first frame 21, it becomes possible to easily form the second mounting substrate 31 from a substrate with a uniform thickness. The region (internal space) enclosed by the first frame 21 configured as described above functions as the first mounting region R1 (see Figure 4) on which the piezoelectric vibrator 3 is mounted.

[0037] The second frame 22 is formed such that, in a plan view, its outer shape is the same as that of the first frame 21. Therefore, the second frame 22 is formed in a frame shape that is longer in the first direction L1 than in the second direction L2. In the illustrated example, the second frame 22 is thicker than the first mounting substrate 30. However, this is not limited to this case, and the thickness of the second frame 22 may be changed as appropriate. The second frame 22 is positioned below the first mounting substrate 30 and is superimposed on the lower surface of the first mounting substrate 30, and is integrally joined by sintering or the like. The area (internal space) enclosed by the second frame 22 functions as the second mounting area R2 (see Figure 4) on which the integrated circuit chip 4 is mounted.

[0038] The package body 10, configured as described above, is a rectangular parallelepiped in which the mounting substrate 20 (first mounting substrate 30, second mounting substrate 31), the first frame 21, and the second frame 22 are stacked vertically. The first mounting area R1 and the second mounting area R2 are arranged to face each other vertically with the first mounting substrate 30 in between.

[0039] Furthermore, notches 23, which are cut out in the shape of a quarter-circle arc in plan view, are formed at each of the four corners of the main body of package 2. The notches 23 are formed throughout the entire package body 10 (first mounting substrate 30, second mounting substrate 31, first frame 21, and second frame 22) in the thickness direction T. The notches 23 are formed, for example, due to the manufacturing process of the package body 10.

[0040] Specifically, when manufacturing the package body 10, four wafer-shaped ceramic substrates for forming the first mounting substrate 30, the second mounting substrate 31, the first frame 21, and the second frame 22 are stacked and joined together. Then, multiple through-holes are formed in a matrix so as to penetrate the laminate of joined ceramic substrates. Subsequently, by using each through-hole as a reference hole (pilot hole) and cutting the laminate of ceramic substrates in a grid pattern, it becomes possible to manufacture multiple package bodies 10. In this manufacturing process, the through-holes are divided into four sections, forming notches 23.

[0041] (Seal ring, lid) A sealing ring 11 is positioned above the package body 10 and is joined to the package body 10 from above. The seal ring 11 is formed in a frame shape having a predetermined thickness. Specifically, the seal ring 11 is formed such that its outer shape is slightly smaller than the outer shape of the first frame 21, and its inner shape is the same as the inner shape of the first frame 21. The seal ring 11 is joined to the upper surface of the first frame 21 around its entire circumference. Specifically, the seal ring 11 is integrally joined to the first frame 21 by baking with a soldering material such as silver solder or a soldering material, or by welding to a metal bonding layer (not shown) formed on the first frame 21. The metal bonding layer can be formed by electrolytic plating, electroless plating, vapor deposition, sputtering, etc.

[0042] The material of the seal ring 11 is not particularly limited, but examples include nickel-based alloys, and specifically, it can be selected from Kovar, Elinvar, Invar, 42-alloy, etc. In particular, it is preferable to select a material for the seal ring 11 that has a thermal expansion coefficient close to that of the ceramic material forming the package body 10. For example, if alumina with a thermal expansion coefficient of 6.8 × 10⁻⁶ / °C is used for the package body 10, it is preferable to use Kovar with a thermal expansion coefficient of 5.2 × 10⁻⁶ / °C or 42-alloy with a thermal expansion coefficient of 4.5 to 6.5 × 10⁻⁶ / °C for the seal ring 11.

[0043] The lid 12 is positioned above the seal ring 11 and is integrally bonded to the seal ring 11 so as to cover the seal ring 11 from above. The lid 12 is, for example, a thin, flat conductive substrate, and is formed so that its outer shape is the same as the outer shape of the seal ring 11. The lid 12 is tightly bonded to the upper surface of the seal ring 11 around its entire circumference, thereby hermetically sealing the first mounting area R1 of the piezoelectric vibrator 3. Therefore, the internal space (including the first mounting area R1) surrounded by the first mounting substrate 30, the second mounting substrate 31, the first frame 21, the seal ring 11, and the lid 12 constitutes a hermetically sealed cavity C.

[0044] The method for joining the lid 12 is not particularly limited, but examples include seam welding using roller electrodes, laser welding, ultrasonic welding, etc. Furthermore, in order to increase the joint strength between the lid 12 and the seal ring 11, a joining layer made of nickel, gold, or the like may be formed on at least the lower surface of the lid 12 and the upper surface of the seal ring 11.

[0045] (Mounted electrodes) On the first mounting surface 20a, which is the upper surface of a pair of mounting portions 33 in the second mounting substrate 31 that constitutes package 2, mounting electrodes 40 are formed over the entire upper surface of each mounting portion 33. The pair of mounted electrodes 40 are designed to conduct electricity with the pair of excitation electrodes 60 and 61, described later, when the piezoelectric vibrator 3 is mounted. The mounted electrodes 40 may be, for example, a single-layer metal film made of a single metal, or a multilayer metal film made of stacked different metals.

[0046] The mounted electrode 40 is electrically connected to the external connection electrode 41 formed on the surface of the notch 23. The external connection electrode 41 is formed to cover the surface of each of the notches 23 located at the four corners of the package body 10, and in this embodiment, it is formed across the lower surface of the second frame 22. However, the external connection electrode 41 does not need to be formed on both the outer surface of the notch 23 and the lower surface of the second frame 22; it is sufficient if it is formed on at least one of the outer surface of the notch 23 and the lower surface of the second frame 22. Furthermore, the external connection electrode 41 may be, for example, a single-layer metal film made of a single metal, or a multilayer metal film made of stacked different metals.

[0047] Furthermore, the mounting electrode 40 formed on one mounting portion 33 is electrically connected to, for example, two of the four external connection electrodes 41, while the mounting electrode 40 formed on the other mounting portion 33 is electrically connected to the remaining two external connection electrodes 41. Furthermore, the mounted electrode 40 and the external connection electrode 41 are electrically connected via conductive electrodes (not shown) formed on the surface or inside the mounting substrate 20 and the second frame 22.

[0048] (Piezoelectric vibrator) The piezoelectric vibrator 3 is housed within the cavity C and positioned above the second mounting substrate 31, and is mounted on the first mounting surface 20a, which is the upper surface of the pair of mounting portions 33. Specifically, the piezoelectric vibrator 3 is supported in a state where it is floating above the upper surface of the mounting portion 33, while being electrically connected to the mounted electrode 40 via bump portions 42 such as metal bumps or conductive adhesive.

[0049] As shown in Figures 2 to 5, the piezoelectric vibrator 3 comprises a piezoelectric plate 50 having a pair of vibrating arms 51 arranged parallel to each other and a base 52 that integrally fixes the base ends of the pair of vibrating arms 51, and various electrodes (excitation electrodes 60, 61, mounting electrodes 62, 63, weight electrodes 64, 65) formed on the outer surface of the piezoelectric plate 50. Therefore, the piezoelectric vibrator 3 of this embodiment is a so-called tuning fork type vibrator in which a pair of vibrating arms 51 vibrate when a voltage is applied. Furthermore, the piezoelectric vibrator 3 of this embodiment is a so-called side-arm type, equipped with a pair of support arms (side arms) 53 integrally formed with the base 52.

[0050] The piezoelectric vibrator 3 is sized to fit within the first mounting area R1 enclosed by the first frame 21, and is miniaturized in both the first direction L1 and the second direction L2. The piezoelectric plate 50 is formed from a piezoelectric material such as quartz, lithium tantalate, or lithium niobate. For example, when forming the piezoelectric plate 50 from quartz, a Lambert crystal ore is sliced ​​at predetermined angles with respect to the X, Y, and Z axes, which are mutually orthogonal to each other, to form a wafer, and then the piezoelectric plate 50 is produced by etching this wafer.

[0051] The pair of vibrating arms 51 are spaced apart in the second direction L2 and are formed to extend parallel to each other from the base 52 along the first direction L1. In this embodiment, the pair of vibrating arms 51 are of the so-called hammerhead type, in which the width dimension of the free end tip 51a is wider than the width dimension of the fixed end base (base 52 side). By making the pair of vibrating arms 51 of the hammerhead type, the weight and moment of inertia during vibration of the tip 51a of the vibrating arms 51 can be increased. Therefore, the vibrating arms 51 can be made to vibrate more easily, and even if the length of the vibrating arms 51 is shortened, it is possible to prevent the vibration frequency from becoming too high. Thus, it becomes possible to vibrate the piezoelectric vibrating piece 3 within a predetermined frequency band while miniaturizing it.

[0052] Of the pair of vibrating arms 51, the upper and lower surfaces facing each other in the thickness direction T have elongated grooves 51b of a certain width formed from the base end to the tip end 51a of the vibrating arm 51. As a result, the portion of the pair of vibrating arms 51 in which the grooves 51b are formed has an H-shaped cross-section. However, the groove 51b is not essential, and it is not necessary to provide a groove 51b on the vibrating arm 51.

[0053] The pair of support arms 53 are formed to extend outward from the base 52 along a second direction L2, and then extend along a first direction L1. As a result, the pair of support arms 53 are formed in an L-shape in plan view and are positioned outward in the second direction L2 than the pair of vibrating arms 51. Therefore, the pair of support arms 53 extend parallel to the pair of vibrating arms 51 along the first direction L1, with a gap between them.

[0054] Furthermore, the pair of support arms 53 are formed so that their length from the base 52 is shorter than the length of the pair of vibrating arms 51. In particular, the pair of support arms 53 are formed so as to overlap the pair of mounting parts 33 from above in a plan view (see Figure 2). This makes it possible to mount the piezoelectric vibrating piece 3 using the pair of support arms 53. Therefore, since it is not necessary to make the length of the base 52 longer in the first direction L1 for the implementation of the piezoelectric vibrator 3, the length of the piezoelectric vibrator 3 along the first direction L1 can be shortened accordingly. Consequently, by making the piezoelectric vibrator 3 a side-arm type equipped with a pair of support arms 53, it is designed to be easily miniaturized.

[0055] As shown in Figure 5, various electrodes (excitation electrodes 60, 61, mounting electrodes 62, 63, and weight electrodes 64, 65) are patterned on the outer surface of the piezoelectric vibrator 3 configured as described above. The excitation electrodes 60 and 61 are electrodes that vibrate a pair of vibrating arms 51 at a predetermined resonant frequency in a direction (second direction L2) that moves them closer together or further apart from each other when a voltage is applied, and are mainly patterned on the outer surfaces of the pair of vibrating arms 51 in an electrically isolated state. Specifically, one excitation electrode 60 is mainly formed over the side and upper and lower surfaces of one vibrating arm 51, and also formed inside the groove 51b and over the upper and lower surfaces of the other vibrating arm 51. The other excitation electrode 61 is mainly formed inside the groove 51b and over the upper and lower surfaces of one vibrating arm 51, and also formed over the side and upper and lower surfaces of the other vibrating arm 51.

[0056] Mount electrodes 62 and 63 are formed on the outer surfaces of a pair of support arms 53. Specifically, one mount electrode 62 is formed on the outer surface of one support arm 53, and the other mount electrode 63 is formed on the outer surface of the other support arm 53. Furthermore, the pair of mounting electrodes 62 and 63 are also formed on the base 52 so as to be electrically connected to the pair of excitation electrodes 60 and 61 via the base 52. Specifically, one mounting electrode 62 is electrically connected to one excitation electrode 60, and the other mounting electrode 63 is electrically connected to the other excitation electrode 61.

[0057] The weight electrodes 64 and 65 are formed on the outer surface of the tip portion 51a (head portion) of the pair of vibrating arm portions 51, and are configured to be electrically connected to the excitation electrodes 60 and 61, respectively. The weight electrodes 64 and 65 primarily function as adjustment electrode films used to adjust the frequency of the piezoelectric vibrator 3. For example, during the assembly process of the oscillator 1, a voltage is applied to the piezoelectric vibrator 3 using the monitor electrode 83 (described later) to vibrate the pair of vibrating arms 51 and check the vibration status. Then, by partially removing the weight electrodes 64 and 65 using laser trimming or the like, according to the difference between the measured actual frequency and the preset target frequency, it is possible to adjust the frequency band of the piezoelectric vibrator 3 so that it falls within the target frequency band. However, the weight electrodes 64 and 65 are not essential and do not need to be provided.

[0058] As described above, the piezoelectric vibrator 3 is mounted on a pair of mounting parts 33 via bump parts 42, as shown in Figures 2 to 4. This allows the piezoelectric vibrator 3 to be supported while suspended above the upper surfaces of the mounting parts 33, while housed within the cavity C. Furthermore, a pair of mounting electrodes 62 and 63 are electrically connected to the mounted electrode 40 via the bump parts 42. Therefore, the pair of excitation electrodes 60 and 61 and the mounted electrode 40 are electrically connected via the bump parts 42 and the mounting electrodes 62 and 63.

[0059] (Integrated circuit chip) As shown in Figures 3 and 4, the integrated circuit chip 4 is positioned below the first mounting substrate 30 and is mounted on the second mounting surface 20b, which is the lower surface of the first mounting substrate 30, within the second mounting area R2 surrounded by the second frame 22. Specifically, the integrated circuit chip 4 is mounted on the second mounting surface 20b via bumps (not shown), such as metal bumps or conductive adhesives. The integrated circuit chip 4 is formed in a rectangular parallelepiped shape in plan view, with a length along the first direction L1 being longer along the second direction L2, corresponding to the shape of the package 2. Note that the illustration of the integrated circuit chip 4 is simplified in each drawing.

[0060] As mentioned earlier, the integrated circuit chip 4 has at least an oscillator circuit (not shown) that generates an output signal based on an electrical signal from the piezoelectric vibrator 3. Furthermore, a plurality of integrated circuit terminals 80 are provided on the upper surface of the integrated circuit chip 4 so as to be exposed (see Figure 3). The integrated circuit terminals 80 include at least a ground terminal 80a. In addition to the ground terminal 80a, the integrated circuit terminals 80 also include, for example, a power input terminal, a signal output terminal, a signal terminal that is conductive with the piezoelectric vibrator 3, a switch signal input terminal, etc. However, the integrated circuit terminals 80 are not limited to these terminals.

[0061] In this embodiment, the case in which six integrated circuit terminals 80 are provided on the integrated circuit chip 4 is used as an example, but the invention is not limited to this case, and the number and position of the integrated circuit terminals 80 may be changed as appropriate.

[0062] (Integrated circuit electrodes) As shown in Figures 4 and 6, multiple integrated circuit electrodes 81 are formed on the portion of the second mounting surface 20b, which is the lower surface of the first mounting substrate 30, that is located inside the second frame 22. The integrated circuit electrodes 81 are formed in a position that overlaps the integrated circuit terminals 80 formed on the integrated circuit chip 4 from above. As a result, the multiple integrated circuit electrodes 81 are electrically connected to the multiple integrated circuit terminals 80. The integrated circuit electrode 81 includes a ground electrode 82 that is conductive to the ground terminal 80a of the integrated circuit chip 4, and a pair of monitor electrodes 83 that are conductive to a pair of mounted electrodes 40 formed on the second mounting substrate 31. The pair of monitor electrodes 83 and the pair of mounted electrodes 40 are electrically connected, for example, via conductive electrodes (not shown) formed inside the mounting substrate 20.

[0063] Furthermore, the integrated circuit electrode 81 includes, in addition to the ground electrode 82 and the pair of monitor electrodes 83, a power electrode that conducts to the power input terminal, a signal output electrode that conducts to the signal output terminal, a signal electrode that conducts to the signal terminal, a switch electrode that conducts to the switch signal input terminal, and so on. However, the integrated circuit electrode 81 is not limited to these electrodes. In this embodiment, we have taken the example of providing three integrated circuit electrodes 81 in addition to the ground electrode 82 and the pair of monitor electrodes 83, but we are not limited to this case and may modify it as appropriate. In this embodiment, of the multiple integrated circuit electrodes 81, the three integrated circuit electrodes 81 other than the ground electrode 82 and the pair of monitor electrodes 83 are defined as the remaining integrated circuit electrodes 84.

[0064] The six integrated circuit electrodes 81 are arranged with intervals in the first direction L1 and the second direction L2, respectively. However, the number and position of the integrated circuit electrodes 81 may be changed as appropriate to correspond to the integrated circuit terminals 80. These integrated circuit electrodes 81 are electrically connected to the mounted electrodes 40 and external connection electrodes 41 via conductive electrodes (not shown) formed on the surface or inside the mounting substrate 20 and the second frame 22.

[0065] The ground electrode 82 is positioned at a location corresponding to one of the four corners of the integrated circuit chip 4. Furthermore, the ground electrode 82 is formed in a rectangular shape, with the second direction L2 being longer than the first direction L1 in a plan view. The ground electrode 82 is electrically connected to the lead electrode 85 formed on the second mounting surface 20b.

[0066] The pair of monitor electrodes 83 are arranged to correspond to the pair of mounted electrodes 40. Specifically, the pair of monitor electrodes 83 are spaced apart in the second direction L2 and positioned between the adjacent ground electrode 82 and the remaining integrated circuit electrodes 84, or between the two remaining integrated circuit electrodes 84, in the first direction L1. Each of the pair of monitor electrodes 83 is formed in a rectangular shape that is longer in the first direction L1 than in the second direction L2 when viewed from above. Therefore, each of the pair of monitor electrodes 83 is formed to have a constant electrode width W along the second direction L2, and is arranged parallel to each other with a constant gap H along the second direction L2, which is the width direction of the electrode width W. The pair of monitor electrodes 83 are electrically connected to the lead-out electrodes 86 formed on the second mounting surface 20b.

[0067] The constant interval H is not particularly limited, but it is preferable to set it to a distance equal to or greater than the electrode width W, or a distance equal to or greater than the diameter of the tip (contact portion) 91 of the inspection probe 90 described later. More specifically, it is preferable to set the constant interval H to a distance of at least 140 μm.

[0068] The remaining three integrated circuit electrodes 84 are positioned at three of the four corners of the integrated circuit chip 4, excluding the corner where the ground electrode 82 is located. The remaining integrated circuit electrodes 84 are formed in a square shape when viewed from above. Each of the remaining integrated circuit electrodes 84 is also electrically connected to a lead electrode 87 formed on the second mounting surface 20b.

[0069] (Area of ​​integrated circuit electrodes) In this embodiment, the ground electrode 82 is formed such that its area S1 is larger than the areas S3, S4, and S5 of the remaining three integrated circuit electrodes 84. The pair of monitor electrodes 83 are both formed to have the same area S2. The pair of monitor electrodes 83 are formed such that their area S2 is larger than the areas S3, S4, and S5 of the remaining three integrated circuit electrodes 84, and smaller than the area S1 of the ground electrode 82.

[0070] (The function of an oscillator) Next, the operation of oscillator 1, configured as described above, will be explained. The oscillator 1 is used by being mounted on, for example, a control board of an electronic device (not shown). In this case, it is possible to mount the oscillator 1 with the external connection electrodes 41 electrically connected to the terminals of the control board by using external electrodes such as metal bumps or solder (not shown).

[0071] By applying a predetermined drive voltage to the external connection electrode 41 of the oscillator 1 implemented in this manner, current can be passed through the pair of mounted electrodes 40 to the excitation electrodes 60, 61 of the pair of vibrating arms 51, as shown in Figure 2. This allows the pair of vibrating arms 51 to vibrate in a predetermined resonant frequency band in a direction (second direction L2) that moves them closer to and further apart from each other, utilizing the interaction of the excitation electrodes 60, 61, and can also be converted into an electrical signal due to the piezoelectric properties.

[0072] Therefore, the oscillation circuit of the integrated circuit chip 4 can be used to generate output signals such as clock signals based on the above electrical signals. This allows the output signals to be used as, for example, a time source, a timing source for control signals, a reference signal source, etc., and can function as an oscillator 1. Furthermore, since a general tuning fork-type vibrator having a pair of vibrating arms 51 can be used as the piezoelectric vibrator 3, component costs can be reduced.

[0073] In particular, in the oscillator 1 of this embodiment, as shown in Figure 6, among the multiple integrated circuit electrodes 81 formed on the package 2, the area S1 of the ground electrode 82 is formed to be larger than the area S3 to S5 of the remaining integrated circuit electrodes 84 excluding the ground electrode 82 and the monitor electrode 83. As a result, in the manufacturing process (assembly process) of the oscillator 1, after mounting the piezoelectric vibrator 3 on the package 2, as shown in Figure 7, when the tip 91 of the inspection probe 90 is pressed against the ground electrode 82 and the monitor electrode 83, it is possible to press it against at least the ground electrode 82 and make proper contact. In each drawing, including Figure 7, the diameter of the inspection probe 90 is shown as a dashed line (two-dotted line), and the diameter of the tip 91 of the inspection probe 90 is shown as a solid line.

[0074] Therefore, even if the size of the oscillator 1 is reduced, the resistance value between the ground electrode 82 and the monitor electrode 83 can be easily and appropriately measured, and the insulation resistance can be evaluated. Insulation resistance evaluation is an inspection that measures and evaluates the insulation resistance between the excitation electrodes 60 and 61 of the piezoelectric vibrator 3 and the external connection electrode 41. For example, in the manufacturing process of the oscillator 1, when mounting the piezoelectric vibrator 3 on the upper surface of the mounting portion 33 of the package 2 via the bump portion 42, if the bump portion 42 extends to an unintended area due to variations, it may become electrically connected to the external connection electrode 41, for example, through the joint surface of the lid 12. In this case, the conductive path between the excitation electrodes 60 and 61 and the external connection electrode 41 becomes shorter than the original path, resulting in a lower insulation resistance. This may lead to oscillation failure of the piezoelectric vibrator 3.

[0075] Therefore, by using the inspection probe 90 to measure the insulation resistance between the ground electrode 82, which is conductive to the external connection electrode 41, and the monitor electrode 83, which is conductive to the excitation electrodes 60, 61 via the mounted electrode 40, the insulation resistance between the excitation electrodes 60, 61 and the external connection electrode 41 can be evaluated. Therefore, by increasing the area S1 of the ground electrode 82, insulation resistance evaluation can be performed easily and appropriately, thereby improving yield and enabling efficient manufacturing of the oscillator 1 with excellent mass productivity. Furthermore, it is possible to produce an oscillator 1 with high operational reliability.

[0076] Furthermore, in the oscillator 1 of this embodiment, the area S2 of the pair of monitor electrodes 83 is set to be larger than the areas S3 to S5 of the remaining integrated circuit electrodes 81, and smaller than the area S1 of the ground electrode 82. Therefore, the area S1 of the ground electrode 82 is set to be the largest among the multiple integrated circuit electrodes 81. Consequently, it is easy to position the inspection probe 90 when performing insulation resistance evaluation. That is, when pressing the inspection probe 90 against the ground electrode 82 and the monitor electrode 83, since the area S1 of the ground electrode 82 is sufficiently large, special care only needs to be taken when pressing the inspection probe 90 against the monitor electrode 83. Consequently, it is easy to properly position the inspection probe 90, and insulation resistance evaluation can be performed efficiently. Furthermore, since the area S2 of the monitor electrode 83 can be made smaller than the area S1 of the ground electrode 82, heat transfer through the monitor electrode 83 can be suppressed.

[0077] In addition, since the area S2 of the pair of monitor electrodes 83 is larger than the areas S3 to S5 of the remaining integrated circuit electrodes 81, it becomes easier to apply the inspection probe 90 to the monitor electrodes 83 as well. Therefore, the inspection probe 90 can be properly brought into contact with both the ground electrode 82 and the monitor electrodes 83, making it easier to perform insulation resistance evaluation.

[0078] Furthermore, even when evaluating vibration characteristics during the manufacturing process of the oscillator 1, it becomes easier to apply the inspection probe 90 to the monitor electrode 83, allowing for easy and appropriate measurement of the frequency of the piezoelectric vibrator 3. Specifically, as shown in Figure 8, the tip 91 of the inspection probe 90 is pressed against a pair of monitor electrodes 83, and then a voltage is applied. This allows current to be supplied to the excitation electrodes 60 and 61 via the mounted electrode 40, and the vibration status of the piezoelectric vibrator 3 can be confirmed. Therefore, this also improves the yield and results in an oscillator 1 with high operational reliability. Furthermore, based on the results of the vibration characteristic evaluation, the vibration of the piezoelectric vibrator 3 can be adjusted to vibrate within a predetermined frequency band by trimming the weight electrodes 64 and 65 as needed. This vibration adjustment process for the piezoelectric vibrator 3 may be performed before the integrated circuit chip 4 is mounted on the package 2, or it may be performed after the integrated circuit chip 4 is mounted on the package 2.

[0079] Furthermore, since the pair of monitor electrodes 83 are arranged parallel to each other with a constant electrode width W and a constant distance H between them, it becomes easier to press the inspection probe 90 against them when, for example, performing vibration characteristic evaluation, which can lead to further improvements in yield. In particular, since a pair of monitor electrodes 83 are arranged with a certain interval H between them, it is possible to suppress the generation of unintended capacitance, or parasitic capacitance, between the pair of monitor electrodes 83. Therefore, deterioration of voltage characteristics caused by the influence of parasitic capacitance can be suppressed, and the piezoelectric vibrator 3 can be vibrated with stable frequency characteristics. Consequently, the output signal can be generated stably, resulting in an oscillator 1 with high operational reliability.

[0080] Furthermore, by arranging a pair of monitor electrodes 83 with a gap H of at least 140 μm between them, the generation of stray volume can be further suppressed. In addition, when, for example, an inspection probe 90 is pressed against each of the pair of monitor electrodes 83, contact between the inspection probes 90 can be suppressed.

[0081] Furthermore, since the pair of monitor electrodes 83 are arranged parallel to each other with a certain distance H between them and having a certain electrode width W, unintended conductivity between the pair of monitor electrodes 83 can be suppressed, which helps prevent short circuits.

[0082] (Modified oscillator) In the above embodiment, the case in which the area S2 of the pair of monitor electrodes 83 is set to be larger than the areas S3 to S5 of the remaining integrated circuit electrodes 81 and smaller than the area S1 of the ground electrode 82 was described as an example, but the embodiment is not limited to this case. In the present invention, it is sufficient that the area S1 of the ground electrode 82 is set to be larger than the areas S3 to S5 of the remaining integrated circuit electrodes 84. For example, the relationship between the area S1 of the ground electrode 82 and the area S2 of the monitor electrode 83, and the relationship between the area S2 of the monitor electrode 83 and the areas S3 to S5 of the remaining integrated circuit electrodes 84 are not particularly limited.

[0083] For example, as shown in Figure 9, the oscillator 100 may also be configured to have a pair of monitor electrodes 101, which include a first monitor electrode 102 having an area S2A larger than the area S3 to S5 of the remaining integrated circuit electrodes 84, and a second monitor electrode 103 having an area S2B smaller than the area S3 to S5 of the remaining integrated circuit electrodes 84. In the illustrated example, the area S2A of the first monitor electrode 102 is set to be larger than the area S1 of the ground electrode 82.

[0084] In this case, the oscillator 100 allows for clear distinction and recognition of the first monitor electrode 102 and the second monitor electrode 103 based on the area difference, making it easier to determine, for example, input (in) and output (out). Therefore, it is easier to mount the integrated circuit chip 4 in the second mounting area R2 of package 2. Furthermore, by making the area S2B of the second monitor electrode 103 smaller, the area S2A of the first monitor electrode 102 can be made larger. Therefore, by using the first monitor electrode 102, insulation resistance evaluation can be performed appropriately, and the same effects as in the above embodiment can be achieved.

[0085] Although embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. Embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. Embodiments and their modifications include, for example, those that can be easily imagined by those skilled in the art, those that are substantially the same, and those that are equivalent.

[0086] For example, in the above embodiment, a side-arm type piezoelectric vibrator 3 having a pair of support arms 53 was described as an example, but the pair of support arms 53 is not essential, and a piezoelectric vibrator 3 having a base 52 and a pair of vibrating arms 51 may also be used. In this case, mounting electrodes 62 and 63 are formed on the base 52, and the mounted electrodes 40 are positioned so as to face the mounting electrodes 62 and 63 from above and below. Furthermore, although the above embodiment was described using a hammerhead type piezoelectric vibrator 3 as an example, the invention is not limited to this case, and a piezoelectric vibrator 3 in which the width of the vibrating arm portion 51 is constant from the base end to the tip portion 51a may also be used.

[0087] Furthermore, in the above embodiment, a tuning fork-shaped vibrating piece having a pair of vibrating arms 51 was used as an example of the piezoelectric vibrating piece 3, but the invention is not limited to this case. For example, a piezoelectric vibrating piece formed by AT cutting a quartz crystal and whose main vibration is thickness-sliding vibration (a so-called AT-cut vibrating piece) may be used. Even in this case, the mounted electrodes should be positioned so that they face upwards and downwards relative to the mounting electrodes of the AT cut vibrator.

[0088] Furthermore, the present invention includes the following embodiments. <1> Piezoelectric vibrating element and An integrated circuit having multiple integrated circuit terminals including a ground terminal, A package comprising a first mounting area on which the piezoelectric vibrator is mounted, and a second mounting area on which the integrated circuit is mounted, A pair of mounting electrodes are formed in the first mounting region, each of which is electrically connected to the excitation electrode of the piezoelectric vibrator. Multiple integrated circuit electrodes that conduct to the integrated circuit terminals are formed in the second mounting region. Each of the multiple integrated circuit electrodes includes a ground electrode that is in conductivity with the ground terminal, and also includes a pair of monitor electrodes that are in conductivity with each of the mounted electrodes. The piezoelectric vibration device is characterized in that the ground electrode is formed to have a larger area than the area of ​​the remaining integrated circuit electrodes, excluding the ground electrode and the monitor electrode from the plurality of integrated circuit electrodes. <2> <1> In the piezoelectric vibration device described above, A piezoelectric vibrating device wherein at least one of the monitor electrodes is formed to have a larger area than the remaining integrated circuit electrodes. <3> <2> In the piezoelectric vibration device described above, The pair of monitor electrodes are A first monitor electrode formed to have an area larger than the area of ​​the remaining integrated circuit electrodes, A piezoelectric vibration device comprising a second monitor electrode formed to have a smaller area than the area of ​​the remaining integrated circuit electrodes. <4> <1> or <2> In the piezoelectric vibration device described above, A piezoelectric vibration device in which a pair of monitor electrodes are formed to have a smaller area than the area of ​​the ground electrode. <5> <1> from <4> In a piezoelectric vibration device described in any one of the following, A piezoelectric vibration device in which, in a plan view of the package, a pair of monitor electrodes are formed to each have a certain electrode width and are arranged parallel to each other with a certain interval between them along the width direction of the electrode width. <6> <5> In the piezoelectric vibration device described above, A piezoelectric vibration device in which a pair of monitor electrodes are arranged parallel to each other with a distance of at least 140 μm between them. <7> <1> from <6> In a piezoelectric vibration device described in any one of the following, The piezoelectric vibrating piece is A piezoelectric plate having a pair of vibrating arms arranged parallel to each other, and a base that integrally fixes the base ends of the vibrating arms, A piezoelectric vibration device comprising: an excitation electrode formed on the outer surface of the piezoelectric plate, which vibrates a pair of vibrating arms when a voltage is applied. [Explanation of Symbols]

[0089] R1…First Implementation Domain R2…Second implementation area 1, 100... Oscillator (piezoelectric vibration device) 2…Package 3… Piezoelectric vibrator 4… Integrated circuit chip (integrated circuit) 40… Mounted electrodes 50… Piezoelectric plate 51...Vibrating arm part 52...Base 60, 61...excitation electrode 80… Integrated circuit terminals 80a...Ground terminal 81… Integrated circuit electrodes 82...Ground electrode 83, 101… Monitor electrodes 102...First monitor electrode 103...Second monitoring electrode

Claims

1. Piezoelectric vibrating element and An integrated circuit having multiple integrated circuit terminals including a ground terminal, The package includes a first mounting area on which the piezoelectric vibrator is mounted, and a second mounting area on which the integrated circuit is mounted. A pair of mounting electrodes are formed in the first mounting region, each of which is electrically connected to the excitation electrode of the piezoelectric vibrator. Multiple integrated circuit electrodes that conduct to the integrated circuit terminals are formed in the second mounting region. Each of the multiple integrated circuit electrodes includes a ground electrode that is in conductivity with the ground terminal, and also includes a pair of monitor electrodes that are in conductivity with each of the mounted electrodes. The piezoelectric vibration device is characterized in that the ground electrode is formed to have a larger area than the area of ​​the remaining integrated circuit electrodes, excluding the ground electrode and the monitor electrode from the plurality of integrated circuit electrodes.

2. In the piezoelectric vibration device according to claim 1, A piezoelectric vibrating device wherein at least one of the monitor electrodes is formed to have a larger area than the remaining integrated circuit electrodes.

3. In the piezoelectric vibration device according to claim 2, The pair of monitor electrodes are A first monitor electrode is formed to have an area larger than the area of ​​the remaining integrated circuit electrodes, A piezoelectric vibration device comprising: a second monitor electrode formed to have an area smaller than the area of ​​the remaining integrated circuit electrodes.

4. In the piezoelectric vibration device according to claim 1 or 2, A piezoelectric vibration device in which a pair of monitor electrodes are formed to have a smaller area than the area of ​​the ground electrode.

5. In the piezoelectric vibration device according to claim 1 or 2, A piezoelectric vibration device in which, in a plan view of the package, a pair of monitor electrodes are formed to each have a certain electrode width and are arranged parallel to each other with a certain interval between them along the width direction of the electrode width.

6. In the piezoelectric vibration device according to claim 5, A piezoelectric vibration device in which a pair of monitor electrodes are arranged parallel to each other with a distance of at least 140 μm between them.

7. In the piezoelectric vibration device according to claim 1, The piezoelectric vibrating piece is A piezoelectric plate having a pair of vibrating arms arranged parallel to each other, and a base that integrally fixes the base ends of the vibrating arms, A piezoelectric vibration device comprising: an excitation electrode formed on the outer surface of the piezoelectric plate, which vibrates a pair of vibrating arms when a voltage is applied.

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