Measuring components and measuring methods

By bonding a thin thermocouple to a mold groove and plugging it in place, the method addresses thermal resistance issues, allowing for precise mold temperature measurement.

JP2026067450APending Publication Date: 2026-04-21TOYOTA JIDOSHA KK
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
TOYOTA JIDOSHA KK
Filing Date
2024-10-09
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

Existing mold temperature measurement techniques using thermocouples inserted into holes in molds suffer from increased thermal resistance, leading to discrepancies between measured and actual mold temperatures.

Method used

A thermocouple is materially bonded to a groove or hole in the mold, with a thin design and reduced heat capacity, and is plugged in place to improve heat conduction and reduce thermal resistance.

Benefits of technology

Enables accurate measurement of mold temperatures closer to the actual mold temperature, enhancing temperature control precision.

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Abstract

To provide a measuring element and a measuring method that can measure mold temperature that is closer to the actual mold temperature. [Solution] The measuring member 200 according to this disclosure measures the temperature of the mold 100 when molding the molten material 70 poured into the mold 100, and includes a thermocouple 20 placed in a groove 11 provided in the mold 100. The thermocouple 20 has its hot junction 21 materially bonded to the mold 100 at the position where the temperature of the groove 11 is to be measured, and the thermocouple 20 is as thin as possible so that it can measure the temperature inside the groove 11, and the groove 11 is plugged with the thermocouple 20 in place.
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Description

Technical Field

[0001] The present disclosure relates to a measurement member and a measurement method.

Background Art

[0002] When a molten material is poured into a mold to form a molded body, a technique for accurately measuring the mold temperature plays an important role. In the molding process, since the mold temperature greatly affects the quality and production efficiency of the product, temperature control is very important. For this reason, various techniques for measuring and controlling the mold temperature in real time have been developed.

[0003] For example, Patent Document 1 discloses a technique of inserting thermocouples into each of a plurality of holes formed in a mold for measurement. With this technique, since the temperature can be measured at a plurality of points inside the mold, it is possible to more accurately grasp the temperature distribution of the entire mold. By using a plurality of thermocouples, not only a specific part of the mold but also the overall temperature fluctuation can be monitored in detail, and the accuracy of temperature control can be improved.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The inventors have found the following problems regarding the measurement member and the measurement method. In the technology disclosed in Patent Document 1, a thermocouple is inserted into a hole drilled in the mold and fixed in place. However, simply inserting a thermocouple into a hole drilled in the mold creates an interface between the thermocouple and the mold, which may reduce the efficiency of heat conduction and increase thermal resistance. Since the temperature measured by the thermocouple is affected by thermal resistance, an increase in thermal resistance may cause a discrepancy between the mold temperature measured by the thermocouple and the actual mold temperature.

[0006] This disclosure has been made in view of these issues and aims to provide a measuring member and a measuring method that can measure mold temperatures that are closer to the actual mold temperature. [Means for solving the problem]

[0007] One embodiment for achieving the above objective is: A measuring member for measuring the temperature of a mold when molding molten material poured into the mold, The mold is equipped with a thermocouple placed in a groove or hole provided in the mold, The thermocouple is materially bonded to the mold at the position where the temperature of the groove hole is to be measured. The thermocouple is capable of measuring temperature within the groove and is as thin as possible. The grooves are plugged with the thermocouples in place.

[0008] One embodiment for achieving the above objective is: A method for measuring the temperature of a mold when molding molten material poured into the mold, The mold is provided with grooves for arranging thermocouples. The thermocouple's hot junction, which is as thin as possible and capable of measuring temperature within the groove, is materially bonded to the mold at the position where the temperature of the groove is to be measured. With the thermocouple in place, the groove is plugged, and the temperature of the mold is measured using the thermocouple. [Effects of the Invention]

[0009] According to this disclosure, it is possible to provide a measuring member and a measuring method that can measure a mold temperature that is closer to the actual mold temperature. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic cross-sectional view showing an example of the configuration of a mold including a measuring member according to an embodiment. [Figure 2] This is a schematic cross-sectional view of a dummy pin with a grooved hole. [Figure 3] This is a schematic cross-sectional view of a dummy pin on which thermocouples are arranged. [Figure 4] This is a schematic cross-sectional view of a dummy pin that has been plugged. [Figure 5] This is a schematic cross-sectional view of the mold during measurement. [Modes for carrying out the invention]

[0011] The embodiments of this disclosure will be described in detail below with reference to the drawings. In each drawing, the same or corresponding elements are denoted by the same reference numerals, and redundant explanations are omitted where necessary for clarity. Also, for ease of understanding, the scale of each part in the drawings may differ from that of actual parts.

[0012] Figure 1 is a schematic cross-sectional view showing an example of the configuration of a mold 100 including a measuring member 200 according to an embodiment. The mold 100 comprises a measuring member 200, an insert 40, and a main mold 50. The mold 100 is a mold for obtaining a molded body by cooling and solidifying a molten material 70 (see Figure 5) in a predetermined shape. The molten material 70 is poured into the space formed by the measuring member 200 and the insert 40 and cooled to become a molded body. The insert 40 is provided with a through hole 41. The measuring member 200 is fitted into the through hole 41. The measuring member 200 and the insert 40 constitute a single surface at the surface that contacts the molten material. That is, the shape of the tip portion of the measuring member 200 matches the shape of the end of the through hole 41 that contacts the molten material. The main mold 50 is used in combination with the insert 40.

[0013] The measuring member 200 comprises a dummy pin 10, a thermocouple 20, and a plug 30. The dummy pin 10 is an elongated member and has a shape corresponding to the through hole 41 of the insert 40. The dummy pin 10 is provided with a grooved hole 11. The grooved hole 11 is provided along the extension direction of the dummy pin 10, that is, along the extension direction of the through hole 41. The thermocouple 20 is placed in the grooved hole 11. The plug 30 is a plug that fills the grooved hole 11 with the thermocouple 20 in place. The thermocouple 20 is fixed inside the grooved hole 11 by the plug 30.

[0014] The thermocouple 20 operates as a temperature sensor within the groove 11. The thermocouple 20 is a temperature sensor comprising two different metal wires with their ends in contact. The thermocouple 20 measures the temperature difference based on the thermoelectric voltage generated at the contact point between the metal wires. By reducing the heat capacity of the thermocouple 20, the time it takes for the thermocouple 20 to measure the temperature is shortened, improving the responsiveness of the measurement. Furthermore, by reducing the heat capacity of the thermocouple 20, the amount of heat received by the thermocouple 20 from the dummy pin 10 can be reduced, thereby suppressing the temperature drop of the dummy pin 10. Therefore, it is preferable for the heat capacity of the thermocouple 20 to be small. In other words, it is preferable for the thickness of the thermocouple 20 to be as thin as possible within the range that allows temperature measurement within the groove 11 while maintaining mechanical strength.

[0015] A conducting wire 60 is connected to the end of the thermocouple 20. The conducting wire 60 passes through a wire hole 51 provided in the main mold 50 and is connected to a measuring instrument (not shown). The data measured by the measuring instrument is used for adjustments such as temperature control of the mold 100. The hot junction of the thermocouple 20 is materially joined to the dummy pin 10 at the position where the temperature is to be measured. The hot junction is the location within the thermocouple 20 that senses the temperature. Material joining is a method of joining members using materials, and examples include welding, brazing, and the like. By materially joining the dummy pin 10 and the thermocouple 20 at the hot junction of the thermocouple 20, the heat conduction between the dummy pin 10 and the thermocouple 20 is improved. Therefore, the thermal resistance at the interface between the dummy pin 10 and the thermocouple 20 is reduced.

[0016] Incidentally, the mold 100 may be regarded as including the insert 40, the main mold 50, and the dummy pin 10. In this case, the mold 100 shown in FIG. 1 is regarded as having a groove hole 11 provided in the mold 100 and the thermocouple 20 being materially joined to the mold 100.

[0017] Next, referring to FIGS. 2 to 4, a method for creating the measurement member 200 will be described. First, as shown in FIG. 2, a groove hole 11 is provided in the dummy pin 10. The groove hole 11 is provided so as to include the location where the temperature is to be measured using the thermocouple 20. Next, as shown in FIG. 3, the thermocouple 20 is disposed in the groove hole 11 provided in the dummy pin 10. At this time, the hot junction 21 shown in FIG. 3 is disposed at the location where the temperature is to be measured. After the thermocouple 20 is disposed in the groove hole 11, the hot junction 21 is materially joined to the wall constituting the groove hole 11. Next, a predetermined material is poured into the groove hole 11 where the thermocouple 20 is disposed and solidified. By plugging the groove hole 11 in this way, a plug 30 is formed in the groove hole 11. By performing the plugging process, the thermocouple 20 is fixed within the dummy pin 10, and the measurement member 200 is created. In the example shown in FIGS. 2 to 4, in the measurement member 200, the dummy pin 10 and the thermocouple 20 are materially joined in the vicinity of the mold surface, and the temperature in the vicinity of the joining location is measurable.

[0018] FIG. 5 is a schematic cross-sectional view of the measuring member 200 when measuring the temperature of the molten material 70 poured into the mold 100. As shown in FIG. 5, the molten material 70 is poured into a location where the insert 40 and the measuring member 200 form one surface. Since the thermocouple 20 is materially joined to the dummy pin 10 at the temperature contact point 21 and is a thin thermocouple with a small heat capacity, it is possible to measure a temperature close to the actual mold temperature. Thus, the measuring member 200 can measure a mold temperature closer to the actual mold temperature.

[0019] Note that the present disclosure is not limited to the above-described embodiments and can be appropriately modified without departing from the spirit thereof.

Description of Reference Numerals

[0020] 100 Mold 200 Measuring member 10 Dummy pin 11 Groove hole 20 Thermocouple 21 Temperature contact point 30 Plug 40 Insert 41 Through hole 50 Main mold 51 Conductor hole 60 Conductor 70 Molten material

Claims

1. A measuring member for measuring the temperature of a mold when molding molten material poured into the mold, The mold is equipped with a thermocouple placed in a groove or hole provided in the mold, The thermocouple is materially bonded to the mold at the position where the temperature of the groove hole is to be measured. The thermocouple is capable of measuring temperature within the groove and is as thin as possible. The groove is plugged with the thermocouple in place. Measuring components.

2. A method for measuring the temperature of a mold when molding molten material poured into the mold, The mold is provided with grooves for arranging thermocouples. A thermocouple capable of measuring temperature within the groove and having the thinnest possible diameter is placed in the groove. The hot junction of the thermocouple is materially bonded to the mold at the position where the temperature of the groove hole is to be measured. With the thermocouple in place, the groove is plugged, and the temperature of the mold is measured using the thermocouple. Measurement method.

Citation Information

Patent Citations

  • Device and method for measuring temperature

    JP2016065811A