Electronic components

Abstract

To provide electronic components that suppress the growth of silver migration. [Solution] The electronic component includes a base body 3 and an external electrode 5 disposed on the base body 3. The external electrode 5 includes a second electrode layer E2 containing a plurality of conductive particles 11 and a resin 21, and a plating layer E disposed on the second electrode layer E2. PL The plurality of conductive particles 11 include a core 13a which is less prone to migration than silver, and a film 13b which contains silver and covers the core, a plurality of conductive particles 13 which include a plurality of conductive particles 15, 17 which are made of silver. Plating layer E PL There is a gap G between the base body 3 and the base body 3. E3 ,G E4 It holds.

Description

[Technical Field]

[0001] This invention relates to electronic components. [Background technology]

[0002] Known electronic components include a base body and external electrodes disposed on the base body (see, for example, Patent Document 1). The external electrodes include a conductive resin layer comprising a plurality of conductive particles made of silver (Ag) and a resin, and a plating layer disposed on the conductive resin layer. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-162771 [Overview of the project] [Problems that the invention aims to solve]

[0004] In a configuration where the conductive particles consist of silver, there is a risk of silver migration occurring at the external electrodes. Silver migration is thought to occur, for example, due to the following events: An electric field or heat acts on conductive particles, causing the silver to ionize. Silver can also be ionized under the influence of oxygen. The generated silver ions are attracted by the electric field between the external electrodes and move away from the conductive resin layer. The electric field acting on the silver includes, for example, the electric field between the external electrodes, or the electric field between the external electrodes and the internal conductor placed within the substrate. The silver ions moving away from the conductive resin layer react with electrons supplied, for example, from the internal conductor or external electrodes, and deposit as silver on the surface of the substrate.

[0005] One aspect of the present invention aims to provide an electronic component that suppresses the growth of silver migration. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention includes a body and external electrodes disposed on the body. The external electrodes include a conductive resin layer containing a plurality of conductive particles and resin, and a plating layer disposed on the conductive resin layer. The plurality of conductive particles include a plurality of first conductive particles each including a core that is less likely to migrate than silver and a film containing silver and covering the core, and a plurality of second conductive particles made of silver. The plating layer has a gap between it and the body.

[0007] In the above aspect, the first conductive particles include a core that is less likely to migrate than silver. The first conductive particles are the same size as the first conductive particles and have a lower silver content than conductive particles made of silver. The conductive resin layer including the plurality of first conductive particles and the plurality of second conductive particles tends to have a lower silver content than a conductive resin layer including only the plurality of second conductive particles, that is, not including the first conductive particles. Even in an environment where silver migration can occur, a configuration with a low silver content reduces the rate at which silver migration grows. Accordingly, the above aspect suppresses the growth of silver migration.

[0008] The resin tends to absorb moisture. When the electronic component is solder-mounted on an electronic device, the moisture absorbed by the resin may gasify and expand in volume. In this case, stress may act on the conductive resin layer, and the conductive resin layer may peel off. An electronic device includes, for example, a circuit board or an electronic component. In the above aspect, when the electronic component is solder-mounted, even if the moisture absorbed by the resin gasifies, the gas generated from the moisture moves outside the external electrode through the gap between the plating layer and the body. Accordingly, it is difficult for stress to act on the conductive resin layer. As a result, the above aspect suppresses peeling of the conductive resin layer.

[0009] In one of the above aspects, the ratio of the first conductive particles to the total of the first conductive particles and the second conductive particles in the first region including the tip of the conductive resin layer in the conductive resin layer may be larger than the ratio of the first conductive particles to the total of the first conductive particles and the second conductive particles in the second region away from the first region in the conductive resin layer. Silver ions tend to move from the tip of the conductive resin layer. In a configuration where the first region including the tip of the conductive resin layer has a larger "ratio of the first conductive particles" than the "ratio of the first conductive particles" possessed by the second region, the silver content in the first region tends to be low. This configuration surely reduces the rate at which silver migration grows. Therefore, this configuration surely suppresses the growth of silver migration. The second region has a smaller "ratio of the first conductive particles" than the "ratio of the first conductive particles" possessed by the first region. Therefore, in the second region, the silver content tends to be high. Silver has high conductivity. The second region ensures the conductivity in the conductive resin layer. This configuration suppresses an increase in the ESR (equivalent series resistance) of the electronic component.

[0010] In one of the above aspects, the body may include end faces and side faces adjacent to each other. The conductive resin layer may be disposed on the end face and the side face. The first region may be located on the side face, and the second region may be located on the end face. In an electronic component, for example, an internal conductor tends to be exposed on the end face. The configuration in which the second region is located on the end face ensures the conductivity of the portion of the conductive resin layer located on the end face. Therefore, this configuration surely suppresses an increase in the ESR of the electronic component.

[0011] In one of the above aspects, the body may include end faces and side faces adjacent to each other. The conductive resin layer may be disposed on the side face. With the plane including the end face as a reference plane, the second region may be closer to the reference plane than the first region. In electronic components, for example, internal conductors tend to be exposed at the end face. A configuration in which the second region is closer to the reference plane than the first region ensures conductivity in the vicinity of the portion located on the end face of the conductive resin layer. Therefore, this configuration can reliably suppress the increase in ESR of the electronic component.

[0012] In one of the above embodiments, the external electrode may include a sintered metal layer that is positioned between the substrate and the conductive resin layer and covered by the conductive resin layer. The first region may be directly located on the substrate, and the second region may be directly located on the sintered metal layer. A configuration in which the second region is directly located on the sintered metal layer tends to reduce the electrical resistance in the conductive path between the plating layer and the sintered metal layer. Therefore, this configuration reliably suppresses the increase in ESR of the electronic component.

[0013] In one of the above embodiments, the particle size of the first conductive particle may be smaller than the particle size of the second conductive particle. A configuration in which the first conductive particles have a smaller particle size than the second conductive particles can increase the content of the first conductive particles in the first region. Therefore, this configuration can further suppress the growth of silver migration.

[0014] In one of the above embodiments, the plurality of second conductive particles may include a plurality of flake-shaped second conductive particles. A configuration containing multiple secondary conductive particles, specifically multiple flake-shaped secondary conductive particles, further suppresses the increase in ESR of electronic components.

[0015] In one embodiment described above, in the conductive resin layer, in the first region including the leading edge of the conductive resin layer, the ratio of first conductive particles to the total of first conductive particles and flake-shaped second conductive particles may be greater than the ratio of flake-shaped second conductive particles to the total of first conductive particles and flake-shaped second conductive particles. In the first region, a configuration in which the proportion of the first conductive particles is greater than the proportion of the flake-like second conductive particles can increase the content of the first conductive particles in the first region. Therefore, this configuration can further suppress the growth of silver migration.

[0016] In one of the above embodiments, the plurality of second conductive particles may include a plurality of spherical second conductive particles. A configuration containing multiple second conductive particles, specifically multiple spherical second conductive particles, can increase the content of second conductive particles in the second region. Therefore, this configuration can reliably suppress the increase in ESR of the electronic component.

[0017] In one of the above embodiments, the particle size of the spherical second conductive particle may be smaller than the particle size of the flake-shaped second conductive particle, and the particle size of the first conductive particle may be smaller than the particle size of the spherical second conductive particle. A configuration in which the first conductive particles have a particle size smaller than that of the flake-shaped and spherical second conductive particles can increase the content of the first conductive particles in the first region. Therefore, this configuration can further suppress the growth of silver migration. A configuration in which the particle size of the spherical second conductive particles is smaller than the particle size of the flake-shaped second conductive particles can increase the content of the second conductive particles in the second region. Therefore, this configuration can reliably suppress the increase in ESR of the electronic component.

[0018] In one of the above embodiments, the width of the gap may be smaller than the particle size of the first conductive particle. A configuration in which the gap width between the plating layer and the substrate is smaller than the particle size of the first conductive particles suppresses the growth of silver migration from the leading edge of the conductive resin layer. Therefore, this configuration further suppresses the growth of silver migration.

[0019] In one of the above embodiments, the core may contain resin. The resin is resistant to oxidation. Therefore, a core containing resin suppresses the degradation of the properties of the first conductive particles. The properties of the first conductive particles include, for example, conductivity or heat resistance. [Effects of the Invention]

[0020] One aspect of the present invention provides an electronic component that suppresses the growth of silver migration. [Brief explanation of the drawing]

[0021] [Figure 1] Figure 1 is a perspective view of a multilayer capacitor according to one embodiment. [Figure 2] Figure 2 shows the cross-sectional configuration of the multilayer capacitor according to this embodiment. [Figure 3] Figure 3 shows the cross-sectional configuration of the multilayer capacitor according to this embodiment. [Figure 4] Figure 4 shows the second electrode layer. [Figure 5] Figure 5 shows the cross-sectional structure of the second electrode layer. [Figure 6] Figure 6 shows the cross-sectional structure of the second electrode layer. [Figure 7] Figure 7 shows the cross-sectional structure of the second electrode layer. [Figure 8] Figure 8 shows the composition of conductive particles. [Figure 9] Figure 9 is a perspective view of a modified multilayer capacitor according to this embodiment. [Figure 10] Figure 10 shows a cross-sectional configuration of a multilayer capacitor according to a modified example of this embodiment. [Figure 11] Figure 11 shows the second electrode layer. [Modes for carrying out the invention]

[0022] Embodiments of the present invention will be described in detail below with reference to the attached drawings. In this description, the same reference numerals will be used for the same element or element having the same function, and redundant explanations will be omitted.

[0023] The configuration of the multilayer capacitor C1 according to this embodiment will be described with reference to Figures 1 to 8. Figure 1 is a perspective view of the multilayer capacitor according to this embodiment. Figures 2 and 3 are diagrams showing the cross-sectional configuration of the multilayer capacitor according to this embodiment. Figure 4 is a diagram showing the second electrode layer. Figures 5, 6, and 7 are diagrams showing the cross-sectional configuration of the second electrode layer. Figure 8 is a diagram showing the configuration of conductive particles. The electronic components include, for example, a multilayer capacitor C1.

[0024] As shown in Figure 1, the multilayer capacitor C1 includes a rectangular parallelepiped base body 3 and a plurality of external electrodes 5. The multilayer capacitor C1 includes, for example, a pair of external electrodes 5. The pair of external electrodes 5 are arranged on the outer surface of the base body 3. The pair of external electrodes 5 are spaced apart from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, or a rectangular parallelepiped shape with rounded corners and edges.

[0025] Body 3 includes four sides 3a and a pair of opposite end faces 3e. The four sides 3a and the pair of end faces 3e are rectangular in shape. Each of the four sides 3a includes a pair of opposite sides 3a and another pair of opposite sides 3a. The direction in which the pairs of sides 3a face each other is direction D2. The direction in which the other pair of sides 3a face each other is direction D3. The direction in which the pair of end faces 3e face each other is direction D1. The multilayer capacitor C1 is soldered to an electronic device. The electronic device includes, for example, a circuit board or another electronic component. In the multilayer capacitor C1, one of the four sides 3a faces the electronic device. One side 3a is positioned to constitute the mounting surface. One side 3a is the mounting surface.

[0026] Direction D2 is perpendicular to a pair of sides 3a and perpendicular to direction D3. Direction D1 is parallel to one pair of sides 3a and another pair of sides 3a and perpendicular to directions D2 and D3. Direction D3 is perpendicular to another pair of sides 3a, and direction D1 is perpendicular to each end face 3e. The length of the element 3 in direction D1 is, for example, greater than the length of the element 3 in direction D2 and greater than the length of the element 3 in direction D3. Direction D1 is the longitudinal direction of the element 3. The length of the element 3 in direction D2 and the length of the element 3 in direction D3 may be equal to each other. The length of the element 3 in direction D2 and the length of the element 3 in direction D3 may be different to each other.

[0027] The length of base body 3 in direction D2 is the height of base body 3. The length of base body 3 in direction D3 is the width of base body 3. The length of base body 3 in direction D1 is the length of base body 3. For example, the height of base body 3 is 0.1 to 3.2 mm, the width of base body 3 is 0.1 to 6.3 mm, and the length of base body 3 is 0.2 to 7.5 mm. For example, the height of base body 3 is 2.5 mm, the width of base body 3 is 2.5 mm, and the length of base body 3 is 3.2 mm.

[0028] A pair of sides 3a extend in direction D3 to connect another pair of sides 3a. A pair of sides 3a also extends in direction D1. Another pair of sides 3a extends in direction D2 to connect another pair of sides 3a. Another pair of sides 3a also extends in direction D1. A pair of end faces 3e extend in direction D2 to connect another pair of sides 3a. A pair of end faces 3e extend in direction D3 to connect another pair of sides 3a.

[0029] Body 3 includes a ridge located between the end face 3e and the side face 3a, and a ridge located between one of a pair of side faces 3a and one of another pair of side faces 3a. For example, each ridge is rounded to curve. Body 3 is subjected to so-called R-chamfering. The end face 3e and the side face 3a are indirectly adjacent via the ridge located between the end face 3e and the side face 3a. One of a pair of side faces 3a and one of another pair of side faces 3a are indirectly adjacent via the ridge located between one of a pair of side faces 3a and one of another pair of side faces 3a.

[0030] The base body 3 is constructed by stacking multiple dielectric layers in direction D2. The base body 3 includes multiple stacked dielectric layers. In the base body 3, the stacking direction of the multiple dielectric layers coincides with direction D2. Each dielectric layer is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes dielectric ceramics. Dielectric ceramics include, for example, BaTiO3 systems, Ba(Ti,Zr)O3 systems, or (Ba,Ca)TiO3 systems. In the actual base body 3, each dielectric layer is integrated to such an extent that the boundaries between each dielectric layer are not visible.

[0031] The multilayer capacitor C1 includes a plurality of internal electrodes 7, as shown in Figures 2 and 3. Each internal electrode 7 is an internal conductor located within the element 3. Each internal electrode 7 is made of a conductive material commonly used as an internal conductor in multilayer electronic components. The conductive material includes, for example, a base metal. The conductive material includes, for example, nickel (Ni) or copper (Cu). The internal electrode 7 is constructed as a sintered body of a conductive paste containing the above conductive material. For example, the internal electrode 7 is made of nickel.

[0032] Multiple internal electrodes 7 are arranged in different positions (layers) in direction D2. Multiple internal electrodes 7 are arranged in the base body 3 so as to be spaced apart and facing each other in direction D2. Adjacent internal electrodes 7 in direction D2 have different polarities. One end of an internal electrode 7 is exposed to the corresponding end face 3e of a pair of end faces 3e. An internal electrode 7 includes one end that is exposed to the corresponding end face 3e. Multiple internal electrodes 7 include an internal electrode 7 exposed to one end face 3e of a pair of end faces 3e and an internal electrode 7 exposed to the other end face 3e of a pair of end faces 3e. The internal electrodes 7 exposed to one end face 3e and the internal electrodes 7 exposed to the other end face 3e are arranged alternately in direction D2. Multiple internal electrodes 7 are arranged in the base body 3 so as to be aligned in direction D2. The internal electrodes 7 are located in a plane substantially parallel to a pair of side surfaces 3a. The direction in which the internal electrodes 7 face each other (direction D2) is perpendicular to the direction parallel to the pair of side surfaces 3a (directions D3 and D1).

[0033] When the stacking direction of multiple dielectric layers is direction D3, the multiple internal electrodes 7 are arranged at different positions (layers) in direction D3. When the stacking direction of multiple dielectric layers is direction D3, the internal electrodes 7 exposed on one end face 3e and the internal electrodes 7 exposed on the other end face 3e are arranged alternately in direction D3. The internal electrodes 7 are located in a plane substantially parallel to another pair of side surfaces 3a. The internal electrodes 7 face each other in direction D3.

[0034] The external electrodes 5 are located at both ends of the body 3 in direction D1, as shown in Figure 1. Each external electrode 5 is located on the corresponding end face 3e side of the body 3. For example, each external electrode 5 is located on four sides 3a and one end face 3e. The external electrode 5 includes multiple electrode portions 5a, 5e, as shown in Figures 2 and 3. Electrode portions 5a are located on the sides 3a and on the ridge between the sides 3a and the end face 3e. Electrode portions 5e are located on the end face 3e. The external electrode 5 also includes electrode portions located on the ridge between adjacent sides 3a. For example, the ridge between the sides 3a and the end face 3e is referred to as the first ridge, and the ridge between adjacent sides 3a is referred to as the second ridge.

[0035] The external electrode 5 is formed on five surfaces: four side surfaces 3a and one end surface 3e, as well as on the edges. Adjacent electrode portions 5a and 5e are physically connected and electrically connected. Electrode portion 5e covers one end of a corresponding internal electrode 7 among a plurality of internal electrodes 7. Electrode portion 5e is directly connected to the corresponding internal electrode 7. The external electrode 5 is electrically connected to the corresponding internal electrode 7. The external electrode 5 includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4, as shown in Figures 2 and 3. The fourth electrode layer E4 is the outermost layer of the external electrode 5. Each electrode portion 5a, 5e includes the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4.

[0036] The first electrode layer E1 of electrode portion 5a is positioned on the first edge and on the side surface 3a. In electrode portion 5a, the first electrode layer E1 does not necessarily have to be positioned on the side surface 3a. The first electrode layer E1 of electrode portion 5a covers the entire first edge and a portion of the side surface 3a. The first electrode layer E1 of electrode portion 5a is in contact with the first edge and the aforementioned portion of the side surface 3a. The side surface 3a is exposed from the first electrode layer E1, except for the aforementioned portion covered by the first electrode layer E1. The aforementioned portion covered by the first electrode layer E1 of electrode portion 5a is located closer to the end surface 3e. The second electrode layer E2 of electrode portion 5a is positioned on the first electrode layer E1 and on the side surface 3a. In electrode portion 5a, the second electrode layer E2 covers the entire first electrode layer E1 and a portion of the side surface 3a. The second electrode layer E2 of electrode portion 5a indirectly covers the first edge and the aforementioned portion of the side surface 3a such that the first electrode layer E1 is positioned between the second electrode layer E2 and the base body 3. In electrode portion 5a, the second electrode layer E2 is in direct contact with the first electrode layer E1. The aforementioned portion of the side surface 3a covered by the second electrode layer E2 is located closer to the end face 3e. The side surface 3a is exposed from the second electrode layer E2 in the remaining portion excluding the aforementioned portion covered by the second electrode layer E2. In electrode portion 5a, the second electrode layer E2 is in direct contact with the side surface 3a. In electrode portion 5a, the second electrode layer E2 directly covers the side surface 3a. The second electrode layer E2 of electrode portion 5a is located on the side surface 3a and the first edge. In electrode portion 5a, the second electrode layer E2 is directly located on the side surface 3a and the first electrode layer E1.

[0037] The third electrode layer E3 of electrode portion 5a is positioned on the second electrode layer E2. In electrode portion 5a, the third electrode layer E3 covers the second electrode layer E2. In electrode portion 5a, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in electrode portion 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. The fourth electrode layer E4 of electrode portion 5a is positioned on the third electrode layer E3. In electrode portion 5a, the fourth electrode layer E4 covers the third electrode layer E3. In electrode portion 5a, the fourth electrode layer E4 is in contact with the third electrode layer E3. That is, in electrode portion 5a, the fourth electrode layer E4 is in direct contact with the third electrode layer E3. In electrode portion 5a, the third electrode layer E3 and the fourth electrode layer E4 do not contact the side surface 3a. In electrode portion 5a, the third electrode layer E3 is located away from the side surface 3a and outside the second electrode layer E2. In electrode portion 5a, the fourth electrode layer E4 is located away from the side surface 3a and outside the second electrode layer E2. The fourth electrode layer E4 of electrode portion 5a is located outside the third electrode layer E3 of electrode portion 5a. The third electrode layer E3 and the fourth electrode layer E4 of electrode portion 5a are located on the side surface 3a.

[0038] The first electrode layer E1 of the electrode portion 5e is positioned on the end face 3e. The first electrode layer E1 of the electrode portion 5e covers the entire end face 3e. The first electrode layer E1 of the electrode portion 5e is in contact with the entire end face 3e. In other words, in the electrode portion 5e, the first electrode layer E1 is in direct contact with the end face 3e. The second electrode layer E2 of electrode portion 5e is positioned on the first electrode layer E1. In electrode portion 5e, the second electrode layer E2 covers the first electrode layer E1. In electrode portion 5e, the second electrode layer E2 is in direct contact with the first electrode layer E1. In electrode portion 5e, the second electrode layer E2 indirectly covers the end face 3e such that the first electrode layer E1 is positioned between the second electrode layer E2 and the end face 3e. The second electrode layer E2 of electrode portion 5e is located on the end face 3e. In electrode portion 5e, the second electrode layer E2 is directly located on the first electrode layer E1.

[0039] The third electrode layer E3 of electrode portion 5e is positioned on the second electrode layer E2. In electrode portion 5e, the third electrode layer E3 covers the second electrode layer E2. In electrode portion 5e, the third electrode layer E3 is in contact with the second electrode layer E2. That is, in electrode portion 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In electrode portion 5e, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The fourth electrode layer E4 of electrode portion 5e is positioned on the third electrode layer E3. In electrode portion 5e, the fourth electrode layer E4 covers the third electrode layer E3. In electrode portion 5e, the fourth electrode layer E4 is in contact with the third electrode layer E3. That is, in electrode portion 5e, the fourth electrode layer E4 is in direct contact with the third electrode layer E3. In electrode portion 5e, the third electrode layer E3 and the fourth electrode layer E4 are located outside the second electrode layer E2. The fourth electrode layer E4 of electrode portion 5e is located outside the third electrode layer E3 of electrode portion 5e. The third electrode layer E3 and the fourth electrode layer E4 of electrode portion 5e are located on the end face 3e.

[0040] As shown in Figure 4, the second electrode layer E2, when viewed from a direction perpendicular to the side surface 3a, extends along the edge 6 of the external electrode 5 on the side surface 3a. The second electrode layer E2 includes a tip E2e that extends along the edge 6 of the external electrode 5. The second electrode layer E2 includes multiple regions RE1, RE2, RE3. For example, the second electrode layer E2 includes three regions RE1, RE2, RE3. Region RE1 includes the tip E2e. Region RE1 is directly located on the element 3. Region RE1 is directly located on the side surface 3a. The width of region RE1, i.e., the length of region RE1 in direction D1, is, for example, 100 μm or less. The width of region RE1 is, for example, 30 μm.

[0041] Region RE2 is separate from region RE1. Region RE2 is located directly on, for example, the first electrode layer E1. In a configuration where region RE2 is located directly on the first electrode layer E1, region RE2 is located indirectly on the element 3. Region RE2 is located indirectly on, for example, the side surface 3a. Region RE2 is closer to the reference plane PL1 than region RE1. The reference plane PL1 is a plane that includes the end face 3e. Region RE2 is located closer to the end face 3e than region RE1. Region RE3 is separate from region RE1. Region RE3 is located directly on, for example, the first electrode layer E1. In a configuration where region RE3 is located directly on the first electrode layer E1, region RE3 is located indirectly on the element 3. Region RE3 is located indirectly on, for example, the end face 3e. Region RE3 is closer to the reference plane PL1 than region RE1. For example, the second electrode layer E2 of electrode portion 5a includes region RE1 and region RE2, and the second electrode layer E2 of electrode portion 5e includes region RE3. For example, if region RE1 includes the first region, then region RE2 includes the second region. For example, if region RE1 includes the first region, then region RE3 includes the second region.

[0042] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the base body 3. The conductive paste is applied to a portion of the side surface 3a, one end surface 3e, and the first edge. The first electrode layer E1 is formed to cover a portion of each of the four side surfaces 3a, one end surface 3e, and the first edge. The first electrode layer E1 is formed by sintering the metal component (metal powder) contained in the conductive paste. The first electrode layer E1 includes, for example, a sintered metal layer. The first electrode layer E1 includes a sintered metal layer formed on the base body 3. The first electrode layer E1 includes, for example, a sintered metal layer made of copper. The first electrode layer E1 may also include a sintered metal layer made of nickel. The first electrode layer E1 may also include a base metal. The conductive paste may include, for example, powder made of copper or nickel, a glass component, an organic binder, and an organic solvent. The first electrode layers E1 included in the electrode portions 5a and 5e are, for example, formed integrally with each other.

[0043] The second electrode layer E2 is formed by curing a conductive resin paste applied to the first electrode layer E1. The conductive resin paste is applied to the first electrode layer E1 and a portion of the side surface 3a. The second electrode layer E2 is formed across the first electrode layer E1 and the substrate 3. The conductive resin paste includes, for example, a plurality of conductive particles, a resin, and an organic solvent. The resin may include a thermosetting resin. The thermosetting resin may include a phenolic resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 is in contact with a portion of the second edge. The second electrode layer E2 included in the electrode portions 5a and 5e is formed integrally with each other, for example.

[0044] As shown in Figures 5 to 7, the second electrode layer E2 includes a plurality of conductive particles 11 and a resin 21. The plurality of conductive particles 11 form conductive paths within the second electrode layer E2. The second electrode layer E2 includes a conductive resin layer. The plurality of conductive particles 11 includes a plurality of conductive particles 13, a plurality of conductive particles 15, and a plurality of conductive particles 17. Figures 5 to 7 schematically show the cross-sectional configuration of the second electrode layer E2. The shape and size of the conductive particles 11 (conductive particles 13, 15, 17) shown in Figures 5 to 7 may differ from the actual shape and size of conductive particles. In Figures 5 to 7, hatching indicating the cross-section is omitted.

[0045] As shown in Figure 8, the conductive particle 13 includes a core 13a and a film 13b covering the core 13a. The core 13a is less prone to migration than silver. The core 13a is made of, for example, a resin. That is, the core 13a contains, for example, a resin. The resin contained in the core 13a is heat resistant. The resin contained in the core 13a includes, for example, acrylic resin, styrene resin, phenolic resin, silicone resin, melamine resin, fluororesin, polyamide resin, polyimide resin, silicone rubber, fluororubber, or copolymers thereof. The film 13b is made of silver. That is, the film 13b contains silver. The film 13b is in contact with, for example, the core 13a. The film 13b directly covers, for example, the core 13a. The thickness of the film 13b is, for example, 50 to 700 nm. The film 13b includes the outermost layer of the conductive particle 13. The conductive particle 13 includes the surface where the film 13b is exposed. Adjacent conductive particles 13 conduct electricity to each other by contact or proximity of the films 13b. The conductive particles 13 are, for example, spherical in shape. The particle size of the conductive particles 13, for example, the average particle size of the conductive particles 13, is 0.5 to 10 μm. The average particle size of the conductive particles 13 is, for example, 2 μm.

[0046] The conductive particles 15 are made of silver; that is, the conductive particles 15 contain silver. The conductive particles 15 are, for example, flake-shaped. The particle size of the conductive particles 15, for example, the average particle size of the conductive particles 15, is 2 to 10 μm. The average particle size of the conductive particles 15 is, for example, 5 μm. The conductive particles 17 are made of silver; that is, the conductive particles 17 contain silver. The conductive particles 17 are, for example, spherical. The particle size of the conductive particles 17, for example, the average particle size of the conductive particles 17, is 1 to 5 μm. The average particle size of the conductive particles 17 is, for example, 3 μm. For example, the particle size of conductive particle 17 is smaller than the particle size of conductive particle 15. For example, the particle size of conductive particle 13 is smaller than the particle sizes of conductive particles 15 and 17. For example, if conductive particle 13 contains a first conductive particle, conductive particle 15 contains a second conductive particle. For example, if conductive particle 13 contains a first conductive particle, conductive particle 17 may contain a second conductive particle. The particle size of conductive particle 11 may be defined by its equivalent circular diameter.

[0047] The term "spherical" as described above may include shapes other than a perfect sphere. For example, a spherical shape may include a shape having a major axis and a minor axis of different lengths. For instance, the difference between the lengths of the major axis and the minor axis may be 50% or less of the length of the major axis. The "flake-like" shape described above includes shapes having major and minor axes of different lengths. The ratio of the length of the minor axis to the length of the major axis (length of minor axis / length of major axis) may be, for example, 1 / 5 or less. Each conductive particle 13, 15, and 17 may have a smooth surface or a rough surface.

[0048] As shown in Figures 5 to 7, the ratio of conductive particles 13 to the sum of conductive particles 13 and 15 in region RE1 is greater than the ratio of conductive particles 13 to the sum of conductive particles 13 and 15 in region RE2, and the ratio of conductive particles 13 to the sum of conductive particles 13 and 15 in region RE1 is greater than the ratio of conductive particles 13 to the sum of conductive particles 13 and 15 in region RE3. The ratio of conductive particles 13 to the sum of conductive particles 13 and conductive particles 15 and 17 in region RE1 is greater than the ratio of conductive particles 13 to the sum of conductive particles 13 and conductive particles 15 and 17 in region RE2, and the ratio of conductive particles 13 to the sum of conductive particles 13 and conductive particles 15 and 17 in region RE1 is greater than the ratio of conductive particles 13 to the sum of conductive particles 13 and conductive particles 15 and 17 in region RE3. As shown in Figure 5, in region RE1, the ratio of conductive particles 13 to the sum of conductive particles 13 and conductive particles 15 is greater than the ratio of conductive particles 15 to the sum of conductive particles 13 and conductive particles 15. In region RE1, the ratio of conductive particles 13 to the sum of conductive particles 13 and conductive particles 15,17 is greater than the ratio of conductive particles 15 to the sum of conductive particles 13 and conductive particles 15,17.

[0049] Each of the above-mentioned proportions can be calculated, for example, as follows: A cross-sectional photograph of the external electrode 5, including the second electrode layer E2, is obtained. The cross-sectional photograph is, for example, a photograph of the cross-section of the external electrode 5 when it is cut by a plane perpendicular to the end face 3e and a pair of opposing side faces 3a. This cross-sectional photograph is, for example, a photograph of the cross-section of the external electrode 5 when it is cut by a plane parallel to another pair of side faces 3a and equidistant from that other pair of side faces 3a. The cross-sectional photograph is, for example, a scanning electron microscope (SEM) photograph. The obtained cross-sectional photograph is processed by software to determine the boundaries of the conductive particles 13, 15, and 17, and the total area of ​​the conductive particles 13, 15, and 17 within the cross-sectional photograph is calculated for each of the regions RE1, RE2, and RE3. In each of regions RE1, RE2, and RE3, divide the total area of ​​conductive particles 13 by the sum of the total area of ​​conductive particles 13 and the total area of ​​conductive particles 15. In each of regions RE1, RE2, and RE3, divide the total area of ​​conductive particles 13 by the sum of the total area of ​​conductive particles 13, the total area of ​​conductive particles 15, and the total area of ​​conductive particles 17. In each of regions RE1, RE2, and RE3, divide the total area of ​​conductive particles 15 by the sum of the total area of ​​conductive particles 13 and the total area of ​​conductive particles 15. In each of regions RE1, RE2, and RE3, divide the total area of ​​conductive particles 15 by the sum of the total area of ​​conductive particles 13, the total area of ​​conductive particles 15, and the total area of ​​conductive particles 17. In each of regions RE1, RE2, and RE3, divide the total area of ​​conductive particles 17 by the sum of the total area of ​​conductive particles 13, the total area of ​​conductive particles 15, and the total area of ​​conductive particles 17. Each of the divided values ​​may be expressed as a percentage. The value expressed as a percentage may also be expressed in units of "vol%", representing the content of the corresponding conductive particles among conductive particles 13, 15, and 17.

[0050] In region RE1, the ratio of conductive particles 13 to the total of conductive particles 13 and conductive particles 15 is, for example, 3 / 5 to 5 / 6. In region RE1, the ratio of conductive particles 13 to the total of conductive particles 13 and conductive particles 15 is, for example, 4 / 5. In region RE1, the ratio of conductive particles 13 to the total of conductive particles 15 and 17 is, for example, 1 / 2 to 4 / 5. In region RE1, the ratio of conductive particles 13 to the total of conductive particles 15 and 17 is, for example, 3 / 4. In region RE2, the ratio of conductive particles 13 to the total of conductive particles 13 and conductive particles 15 is, for example, 1 / 2 to 4 / 5. In region RE1, the ratio of conductive particles 13 to the total of conductive particles 13 and conductive particles 15 is, for example, 3 / 5. In region RE2, the ratio of conductive particles 13 to the total of conductive particles 15 and 17 is, for example, 4 / 9 to 3 / 4. In region RE1, the ratio of conductive particles 13 to the total of conductive particles 15 and 17 is, for example, 1 / 2. In region RE3, the ratio of conductive particles 13 to the total of conductive particles 13 and conductive particles 15 is, for example, 3 / 8 to 3 / 5. In region RE1, the ratio of conductive particles 13 to the total of conductive particles 13 and conductive particles 15 is, for example, 1 / 2. In region RE3, the ratio of conductive particles 13 to the total of conductive particles 15 and 17 is, for example, 2 / 7 to 1 / 2. In region RE1, the ratio of conductive particles 13 to the total of conductive particles 15 and 17 is, for example, 4 / 9.

[0051] In region RE1, the ratio of conductive particles 15 to the total of conductive particles 13 is, for example, 1 / 6 to 2 / 5. In region RE1, the ratio of conductive particles 15 to the total of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 7 to 1 / 3. In region RE1, the ratio of conductive particles 15 to the total of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 6. In region RE2, the ratio of conductive particles 15 to the total of conductive particles 13 is, for example, 1 / 5 to 1 / 2. In region RE2, the ratio of conductive particles 15 to the total of conductive particles 13 is, for example, 2 / 5. In region RE2, the ratio of conductive particles 15 to the total of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 6 to 2 / 5. In region RE2, the ratio of conductive particles 15 to the total of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 3. In region RE3, the ratio of conductive particles 15 to the total of conductive particles 13 is, for example, 2 / 5 to 5 / 8. In region RE3, the ratio of conductive particles 15 to the total of conductive particles 13 is, for example, 1 / 2. In region RE3, the ratio of conductive particles 15 to the total of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 3 to 1 / 2. In region RE3, the ratio of conductive particles 15 to the total of conductive particles 13 and conductive particles 15 and 17 is, for example, 2 / 5.

[0052] In region RE1, the ratio of conductive particles 17 to the sum of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 20 to 1 / 7. In region RE1, the ratio of conductive particles 17 to the sum of conductive particles 13 and conductive particles 15 and 17 is, for example, 3 / 40. In region RE2, the ratio of conductive particles 17 to the sum of conductive particles 13 and conductive particles 15 and 17 is, for example, 3 / 40 to 1 / 6. In region RE2, the ratio of conductive particles 17 to the sum of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 7. In region RE3, the ratio of conductive particles 17 to the sum of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 7 to 1 / 5. In region RE3, the ratio of conductive particles 17 to the sum of conductive particles 13 and conductive particles 15 and 17 is, for example, 1 / 6.

[0053] The particle sizes of the conductive particles 13, 15, and 17 may be determined based on the cross-sectional photographs described above. The particle size may be calculated for all conductive particles 13, 15, and 17 included in the cross-sectional photograph, which is used to calculate the particle size converted to an equivalent circular diameter from the area of ​​each conductive particle 13, 15, and 17. Alternatively, the particle size may be calculated for any number of conductive particles 13, 15, and 17 included in the cross-sectional photograph. For example, any number could be 100. The average value of the obtained particle sizes is taken as the average particle size.

[0054] Each of the above proportions can be adjusted, for example, by preparing multiple conductive resin pastes with different mixing ratios of conductive particles 13, 15, and 17, and using different conductive resin pastes for each region RE1, RE2, and RE3. Each of the above proportions can be adjusted, for example, by adjusting the rheological properties of the conductive resin paste prepared. For example, when the conductive resin paste is applied to the substrate 3 by immersion, the amount of movement of the conductive particles 13, 15, and 17 within the conductive resin paste from the time the paste is applied until it hardens is adjusted according to the rheological properties, due to differences in the size or mass of the conductive particles 13, 15, and 17. For example, conductive particle 13 is less mobile than conductive particles 15 and 17. By adjusting the amount of movement of conductive particles 13, 15, and 17, each of the above proportions can be adjusted.

[0055] The third electrode layer E3 is formed on the second electrode layer E2 by a plating method. The third electrode layer E3 includes, for example, a metal plating layer. The third electrode layer E3 may also include a nickel plating layer. The third electrode layer E3 may contain nickel. The nickel plating layer tends to have better solder corrosion resistance than the conductive particles 13 contained in the second electrode layer E2. The third electrode layer E3 covers the second electrode layer E2. The fourth electrode layer E4 is formed on the third electrode layer E3 by a plating method. The fourth electrode layer E4 includes, for example, a metal plating layer. The fourth electrode layer E4 may also include a solder plating layer. The solder plating layer may include a tin (Sn) plating layer. The fourth electrode layer E4 may contain tin. The fourth electrode layer E4 may be a tin-silver alloy (Sn-Ag) plating layer, a tin-bismuth alloy (Sn-Bi) plating layer, or a tin-copper alloy (Sn-Cu) plating layer.

[0056] The third electrode layer E3 and the fourth electrode layer E4 are formed on the second electrode layer E2. PL This constitutes the external electrode 5, which is the plating layer E PL Includes plating layer E PL This includes the third electrode layer E3 and the fourth electrode layer E4. PLcovers the second electrode layer E2. The third electrode layer E3 included in the electrode portions 5a and 5e is, for example, integrally formed with each other. The fourth electrode layer E4 included in the electrode portions 5a and 5e is, for example, integrally formed with each other. The plating layer E PL may include another plating layer between the second electrode layer E2 and the third electrode layer E3. The plating layer E PL may include another plating layer between the third electrode layer E3 and the fourth electrode layer E4. The plating layer E PL may be a single layer.

[0057] The plating layer E covering the second electrode layer E2 PL tends to adhere to the second electrode layer E2 but tends not to adhere to the base body 3. Therefore, the plating layer E PL is separated from the base body 3 and has a gap therebetween. The third electrode layer E3 has a gap G E3 with the side surface 3a. The gap G E3 is formed between the end of the third electrode layer E3 and the side surface 3a. The fourth electrode layer E4 has a gap G E4 with the side surface 3a. The gap G E4 is formed between the end of the fourth electrode layer E4 and the side surface 3a. The third electrode layer E3 and the fourth electrode layer E4 also have a gap with the second ridge portion. The gap G E3 , G E4 has a width that is, for example, greater than 0 and 3 μm or less. The gap G E3 , G E4 has a width that is, for example, greater than 0 and less than 2 μm. The width of the gap between each of the third electrode layer E3 and the fourth electrode layer E4 and the second ridge portion is, for example, greater than 0 and 3 μm or less. The width of the gap between each of the third electrode layer E3 and the fourth electrode layer E4 and the second ridge portion is, for example, greater than 0 and less than 2 μm. The width of the gap G E3 and the width of the gap G E4 may be different. The gap G E3 , G E4 and the gap between the third electrode layer E3 and the fourth electrode layer E4 and the second ridge portion may be different. In a configuration where the gap G E3 and the gap G E4 are different, the plating layer E PLThe gap is gap G E3 or gap G E4 It may be defined by the smaller of the two values. Gap G E3 ,G E4 The width is, for example, smaller than the particle size of the conductive particle 13.

[0058] In the multilayer capacitor C1, the conductive particles 13 include a core 13a that is less prone to migration than silver. The conductive particles 13 are the same size as the conductive particles 13, and have a lower silver content compared to conductive particles made of silver. The second electrode layer E2, which contains multiple conductive particles 13 and multiple conductive particles 15,17, tends to have a lower silver content compared to the second electrode layer E2, which contains only multiple conductive particles 15,17, i.e., does not contain conductive particles 13. Even in environments where silver migration can occur, a configuration with a low silver content reduces the rate at which silver migration grows. Therefore, the multilayer capacitor C1 suppresses the growth of silver migration.

[0059] Resin tends to absorb moisture. When a multilayer capacitor C1 is soldered into an electronic device, the moisture absorbed by the resin may gasify and expand in volume. In this case, stress acts on the second electrode layer E2, which may cause the second electrode layer E2 to delaminate. Electronic devices include, for example, circuit boards or electronic components. In the multilayer capacitor C1, the plating layer E PL However, there is a gap G between it and base body 3. E3 ,G E4 It has. When the multilayer capacitor C1 is soldered, even if the moisture absorbed by the resin turns into gas, the gas generated from the moisture is contained within the gap G E3 ,G E4 Therefore, it moves outside the external electrode 5. Consequently, stress is less likely to act on the second electrode layer E2. As a result, the multilayer capacitor C1 suppresses delamination of the second electrode layer E2.

[0060] In the multilayer capacitor C1, the ratio of conductive particles 13 to the total of conductive particles 15 and 17 in region RE1 may be greater than the ratio of conductive particles 13 to the total of conductive particles 15 and 17 in regions RE2 and RE3. Silver ions tend to migrate from the tip E2e of the second electrode layer E2. In a configuration where region RE1, which includes tip E2e, has a higher proportion of conductive particles than regions RE2 and RE3, the silver content in region RE1 tends to be lower. This configuration reliably reduces the rate at which silver migration grows. Therefore, this configuration reliably suppresses the growth of silver migration. Regions RE2 and RE3 have a smaller proportion of conductive particles than region RE1. Therefore, regions RE2 and RE3 tend to have a higher silver content. Silver has high conductivity. Regions RE2 and RE3 ensure conductivity in the second electrode layer E2. This configuration suppresses the increase in ESR in the multilayer capacitor C1.

[0061] In environments where silver migration can occur, the silver contained in region RE1 is ionized, and the silver ions move from region RE1 to the outside of the external electrode 5. In this case, among the conductive particles 11 contained in region RE1, the silver contained in the conductive particles 11 closer to the tip E2e tends to be ionized. In the conductive particles 13, the silver contained in the film 13b is ionized, and when the generated silver ions move, the core 13a remains. As mentioned above, the core 13a is less prone to migration than silver. As the growth of silver migration progresses, a large amount of core 13a remains in the region of RE1 closer to the tip E2e. The remaining core 13a tends to hinder the movement of silver ions from the region of RE1 further away from the tip E2e. Therefore, the multilayer capacitor C1 can further suppress the growth of silver migration.

[0062] In the multilayer capacitor C1, the element 3 may include adjacent end faces 3e and side faces 3a. The second electrode layer E2 may be placed on the end face 3e and the side face 3a. Region RE1 may be located on the side face 3a, and region RE3 may be located on the end face 3e. In the multilayer capacitor C1, for example, the internal electrode 7 is exposed on the end face 3e. The configuration in which region RE3 is located on the end face 3e ensures conductivity in the second electrode layer E2 of the electrode portion 5e. Therefore, this configuration reliably suppresses the increase in ESR in the multilayer capacitor C1.

[0063] In the multilayer capacitor C1, the element 3 may include adjacent end faces 3e and side faces 3a. The second electrode layer E2 may be placed on the side face 3a. Region RE2 may be closer to the reference plane PL1 than region RE1. In the multilayer capacitor C1, for example, the internal electrode 7 is exposed on the end face 3e. The configuration in which region RE2 is closer to the reference plane PL1 than region RE1 ensures conductivity in the vicinity of the second electrode layer E2 of the electrode portion 5e. Therefore, this configuration can reliably suppress the increase in ESR in the multilayer capacitor C1.

[0064] In the multilayer capacitor C1, the external electrode 5 may include the first electrode layer E1. Region RE1 may be directly located on the element 3, and region RE2 or region RE3 may be directly located on the first electrode layer E1. The configuration in which regions RE2 and RE3 are directly located on the first electrode layer E1 is such that the plating layer E PL This tends to reduce the electrical resistance in the conductive path between the first electrode layer E1 and the first electrode layer E1. Therefore, this configuration reliably suppresses the increase in ESR of the multilayer capacitor C1.

[0065] In the multilayer capacitor C1, the particle size of the conductive particle 13 may be smaller than the particle size of the conductive particle 15. A configuration in which the conductive particles 13 have a particle size smaller than that of the conductive particles 15 can increase the content of conductive particles 13 in region RE1. Therefore, this configuration can further suppress the growth of silver migration.

[0066] In the multilayer capacitor C1, the multiple conductive particles 11 may also include multiple conductive particles 15. The configuration in which the conductive particles 15 exhibit a flake-like shape further suppresses the increase in the ESR of the multilayer capacitor C1.

[0067] In the multilayer capacitor C1, in region RE1, the ratio of conductive particles 13 to the total of conductive particles 13 and conductive particles 15 may be greater than the ratio of conductive particles 15 to the total of conductive particles 13 and conductive particles 15. In region RE1, a configuration in which the proportion of conductive particles 13 is greater than the proportion of conductive particles 15 can increase the content of conductive particles 13 in region RE1. Therefore, this configuration can further suppress the growth of silver migration.

[0068] In the multilayer capacitor C1, the multiple conductive particles 11 may also include multiple conductive particles 17. A configuration in which multiple conductive particles 11 also include multiple conductive particles 17 can increase the content of conductive particles 11 in region RE2 or region RE3. Therefore, this configuration can reliably suppress the increase in ESR in the multilayer capacitor C1.

[0069] In the multilayer capacitor C1, the particle size of the conductive particle 17 may be smaller than the particle size of the conductive particle 15, and the particle size of the conductive particle 15 may be smaller than the particle size of the conductive particle 17. A configuration in which conductive particles 13 have a particle size smaller than that of conductive particles 15 and 17 can increase the content of conductive particles 13 in region RE1. Therefore, this configuration can further suppress the growth of silver migration. A configuration in which the particle size of conductive particles 17 is smaller than that of conductive particles 15 can increase the content of conductive particles 11 in region RE2 or region RE3. Therefore, this configuration can reliably suppress the increase in ESR in the multilayer capacitor C1.

[0070] In the multilayer capacitor C1, the gap G E3 ,G E4The width may be smaller than the particle size of the conductive particle 13. Gap G E3 ,G E4 A configuration in which the width is smaller than the particle size of the conductive particles 13 suppresses the growth of silver migration from the tip of the second electrode layer E2. Therefore, this configuration further suppresses the growth of silver migration.

[0071] In the multilayer capacitor C1, the core 13a may contain resin. The resin is resistant to oxidation. Therefore, a configuration in which the core 13a contains resin suppresses the degradation of the properties of the conductive particles 13. The properties of the conductive particles 13 include, for example, conductivity or heat resistance.

[0072] The second electrode layer E2 is formed, for example, by curing a conductive resin paste. The conductive resin paste contains, for example, a thermosetting resin and an organic solvent. The organic solvent vaporizes. The vaporization of the organic solvent generates gas within the conductive resin paste. The gas generated by the vaporization of the organic solvent travels directly from any point in the conductive resin paste where the organic solvent is present to the surface of the conductive resin paste and escapes from the conductive resin paste. As the gas generated by the vaporization of the organic solvent moves within the conductive resin paste, flake-like conductive particles tend to obstruct the gas movement. Therefore, the second electrode layer E2 tends to contain multiple voids. In a configuration in which multiple conductive particles 11 are present, the content of conductive particles 15 tends to be lower compared to a configuration in which multiple conductive particles 11 are present. Therefore, this configuration tends to suppress the obstruction of gas movement generated by the vaporization of organic solvents. A configuration in which the conductive particles 13 have a particle size smaller than the individual particle sizes of conductive particles 15 and 17 can increase the content of conductive particles 13 in the second electrode layer E2. This configuration can increase the content of conductive particles 11 in the second electrode layer E2. As a result, the second electrode layer E2 is unlikely to contain multiple voids.

[0073] Next, the configuration of the multilayer capacitor C11 according to a modified example of this embodiment will be described with reference to Figures 9 to 11. Figure 9 is a perspective view of the multilayer capacitor according to this modified example. Figure 10 is a diagram showing the cross-sectional configuration of the multilayer capacitor according to this modified example. Figure 11 is a diagram showing the second electrode layer. The multilayer capacitor C11 is generally similar to or identical to the multilayer capacitor C1 described above, but differs from the multilayer capacitor C11 in the configuration of the external electrodes 5. The differences between the multilayer capacitor C11 and the multilayer capacitor C1 will be explained below.

[0074] The multilayer capacitor C11 is arranged such that, for example, one of the pair of sides 3a constitutes the mounting surface. The aforementioned one side 3a is the mounting surface. In the multilayer capacitor C11, for example, multiple internal electrodes 7 are arranged in different positions (layers) in direction D3. The electrode portion 5a located on the side surface 3a facing the mounting surface includes a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4, but does not include a second electrode layer E2. In the electrode portion 5a located on the side surface 3a facing the mounting surface, the plating layer E PL However, it directly covers the first electrode layer E1. The side 3a facing the mounting surface is not covered by the second electrode layer E2 and is exposed from the second electrode layer E2.

[0075] The second electrode layer E2 of the electrode portion 5a located on another pair of sides 3a covers only a portion of the edge between each of the other pair of sides 3a and the end face 3e, and only a portion of each of the other pair of sides 3a. The portion of the edge between each of the other pair of sides 3a and the end face 3e is located, for example, closer to the side 3a which is the mounting surface. The portion of each of the other pair of sides 3a is located, for example, closer to the corners of the side 3a which is the mounting surface and the end face 3e. An electrode portion 5a located on another pair of sides 3a has the following configuration: The second electrode layer E2 of the electrode portion 5a located on another pair of sides 3a indirectly covers a portion of the ridge between each of the other pair of sides 3a and the end face 3e, such that the first electrode layer E1 is located between the second electrode layer E2 and the first ridge. The second electrode layer E2 of the electrode portion 5a located on another pair of sides 3a directly covers a portion of each of the other pair of sides 3a. The second electrode layer E2 of the electrode portion 5a located on another pair of sides 3a directly covers a portion of the portion of the first electrode layer E1 located on the ridge between each of the other pair of sides 3a and the end face 3e. The electrode portion 5a located on another pair of sides 3a includes a region where the first electrode layer E1 is exposed from the second electrode layer E2 and a region where the first electrode layer E1 is covered by the second electrode layer E2.

[0076] The second electrode layer E2 of the electrode portion 5e covers only a portion of the end face 3e. This portion of the end face 3e is located, for example, closer to the side surface 3a, which is the mounting surface. The electrode portion 5e may have the following configurations: The second electrode layer E2 of the electrode portion 5e indirectly covers a portion of the end face 3e such that the first electrode layer E1 is located between the second electrode layer E2 and the end face 3e. The second electrode layer E2 of the electrode portion 5e directly covers only a portion of the first electrode layer E1 located on the end face 3e. That is, the electrode portion 5e includes a region where the first electrode layer E1 is exposed from the second electrode layer E2 and a region where the first electrode layer E1 is covered by the second electrode layer E2.

[0077] In the multilayer capacitor C11, the second electrode layer E2 continuously covers only a portion of the mounting surface side 3a, only a portion of the end face 3e, and only portions of each of the other pair of side faces 3a. The second electrode layer E2 includes portions that are provided to continuously cover only a portion of the mounting surface side 3a, only a portion of the end face 3e, and only portions of each of the other pair of side faces 3a. A portion of the first electrode layer E1 is exposed from the second electrode layer E2. As shown in Figure 11, the second electrode layer E2 of the electrode portion 5a located on the mounting surface side 3a includes, for example, region RE1. The second electrode layer E2 of the electrode portion 5a located on the mounting surface side 3a may also include region RE2. The second electrode layer E2 of the electrode portion 5a located on each of another pair of sides 3a includes, for example, region RE1. The second electrode layer E2 of the electrode portion 5a located on each of another pair of sides 3a may also include region RE2. The second electrode layer E2 of the electrode portion 5e includes, for example, region RE3.

[0078] In the multilayer capacitor C11, as in the multilayer capacitor C1, the second electrode layer E2 tends to have a low silver content. Therefore, the multilayer capacitor C11 suppresses the growth of silver migration. In the multilayer capacitor C11, just like in the multilayer capacitor C1, the third electrode layer E3 has a gap G between it and the side surface 3a. E3 In addition, the fourth electrode layer E4 has a gap G between it and the side surface 3a. E4 It has. Even when moisture absorbed by the resin turns into gas, the gas generated from the moisture is in the gap G E3 ,G E4 Therefore, it moves outside the external electrode 5. Consequently, the multilayer capacitor C11 suppresses the peeling of the second electrode layer E2.

[0079] In this specification, when an element is described as being placed on another element, that element may be placed directly on the other element or indirectly on it. If an element is placed indirectly on another element, an intervening element exists between the two elements. If an element is placed directly on another element, no intervening element exists between the two elements. In this specification, when an element is described as being located on another element, that element may be located directly on the other element or indirectly on the other element. If an element is located indirectly on another element, an intervening element exists between the two elements. If an element is located directly on another element, no intervening element exists between the two elements. In this specification, when an element is described as covering another element, that element may directly cover the other element or indirectly cover it. If an element indirectly covers another element, an intervening element exists between the two elements. If an element directly covers another element, no intervening element exists between the two elements.

[0080] While embodiments and modifications of the present invention have been described above, the present invention is not necessarily limited to the embodiments and modifications described above, and various modifications are possible without departing from the spirit of the invention.

[0081] The particle size of conductive particle 13 does not have to be smaller than the particle sizes of conductive particles 15 and 17. A configuration in which the particle size of conductive particle 13 is smaller than the particle sizes of conductive particles 15 and 17 can, as described above, further suppress the growth of silver migration. The multiple conductive particles 11 do not necessarily have to include conductive particles 17. The configuration in which the multiple conductive particles 11 include multiple conductive particles 17 can reliably suppress the increase in ESR in the multilayer capacitor C1, as described above. The core 13a does not need to contain resin. The configuration in which the core 13a contains resin suppresses the degradation of the properties of the conductive particles 13, as described above.

[0082] In this embodiment and its modified examples, a multilayer capacitor was used as an example of an electronic component, but the applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, multilayer solid-state battery components, or multilayer composite components, or electronic components other than multilayer electronic components.

[0083] As can be seen from the embodiments and modifications described above, this specification includes disclosures of the following aspects. (Note 1) The base body and, The material comprises a conductive resin layer containing a plurality of conductive particles and a resin, a plating layer disposed on the conductive resin layer, and an external electrode disposed on the substrate, The plurality of conductive particles are A plurality of first conductive particles comprising a core that is less prone to migration than silver, and a film containing silver and covering the core, It comprises a plurality of second conductive particles made of silver, The aforementioned plating layer has a gap between it and the substrate, forming an electronic component. (Note 2) The electronic component according to Appendix 1, wherein the ratio of the first conductive particles to the sum of the first conductive particles and the second conductive particles in a first region of the conductive resin layer including the leading edge of the conductive resin layer is greater than the ratio of the first conductive particles to the sum of the first conductive particles and the second conductive particles in a second region of the conductive resin layer located away from the first region. (Note 3) The aforementioned element includes adjacent end faces and side faces, The conductive resin layer is arranged on the end face and the side surface, The electronic component as described in Appendix 2, wherein the first region is located on the side surface and the second region is located on the end surface. (Note 4) The aforementioned element includes adjacent end faces and side faces, The conductive resin layer is arranged on the side surface, The electronic component described in Appendix 2, wherein the second region is closer to the reference plane than the first region, with the plane including the end face serving as the reference plane. (Note 5) The external electrode further includes a sintered metal layer that is disposed between the substrate and the conductive resin layer and covered by the conductive resin layer. The electronic component as described in Appendix 2, wherein the first region is located directly on the substrate and the second region is located directly on the sintered metal layer. (Note 6) The electronic component described in any one of the appendices 1 to 5, wherein the particle size of the first conductive particle is smaller than the particle size of the second conductive particle. (Note 7) The aforementioned plurality of second conductive particles is an electronic component according to any one of the appendices 1 to 5, comprising a plurality of flake-shaped second conductive particles. (Note 8) The electronic component as described in Appendix 7, wherein in the conductive resin layer, in a first region including the leading edge of the conductive resin layer, the ratio of the first conductive particles to the sum of the first conductive particles and the flake-shaped second conductive particles is greater than the ratio of the flake-shaped second conductive particles to the sum of the first conductive particles and the flake-shaped second conductive particles. (Note 9) The electronic component according to Appendix 7 or 8, wherein the plurality of second conductive particles further comprises a plurality of spherical second conductive particles. (Note 10) The electronic component as described in Appendix 9, wherein the particle size of the spherical second conductive particle is smaller than the particle size of the flake-shaped second conductive particle, and the particle size of the first conductive particle is smaller than the particle size of the spherical second conductive particle. (Note 11) The width of the gap is smaller than the particle size of the first conductive particle, as described in any one of the appendices 1 to 10. (Note 12) The aforementioned core is an electronic component containing resin, as described in any one of the appendices 1 to 11. [Explanation of Symbols]

[0084] 3...base body, 3a...side, 3e...end face, 5...external electrode, 11,13,15,17...conductive particles, 13a...core, 13b...film, 21...resin, C1,C11...multilayer capacitor, E PL ...plating layer, E1...first electrode layer, E2...second electrode layer, E2e...tip of the second electrode layer, G E3 ,G E4 ...gap, PL1...reference plane, RE1, RE2, RE3...regions of the second electrode layer.

Claims

1. The base body and, The material comprises a conductive resin layer containing a plurality of conductive particles and a resin, a plating layer disposed on the conductive resin layer, and an external electrode disposed on the substrate, The plurality of conductive particles are A plurality of first conductive particles comprising a core that is less prone to migration than silver, and a film containing silver and covering the core, It comprises a plurality of second conductive particles made of silver, The aforementioned plating layer has a gap between it and the substrate, forming an electronic component.

2. The electronic component according to claim 1, wherein the ratio of the first conductive particles to the sum of the first conductive particles and the second conductive particles in a first region of the conductive resin layer including the tip of the conductive resin layer is greater than the ratio of the first conductive particles to the sum of the first conductive particles and the second conductive particles in a second region of the conductive resin layer located away from the first region.

3. The aforementioned element includes adjacent end faces and side faces, The conductive resin layer is arranged on the end face and the side surface, The electronic component according to claim 2, wherein the first region is located on the side surface and the second region is located on the end surface.

4. The aforementioned element includes adjacent end faces and side faces, The conductive resin layer is arranged on the side surface, The electronic component according to claim 2, wherein the second region is closer to the reference plane than the first region, with the plane including the end face serving as the reference plane.

5. The external electrode further includes a sintered metal layer that is disposed between the substrate and the conductive resin layer and covered by the conductive resin layer. The electronic component according to claim 2, wherein the first region is located directly on the substrate, and the second region is located directly on the sintered metal layer.

6. The electronic component according to claim 1, wherein the particle size of the first conductive particle is smaller than the particle size of the second conductive particle.

7. The electronic component according to claim 1, wherein the plurality of second conductive particles comprises a plurality of flake-shaped second conductive particles.

8. The electronic component according to claim 7, wherein in the conductive resin layer, in a first region including the leading edge of the conductive resin layer, the ratio of the first conductive particles to the sum of the first conductive particles and the flake-shaped second conductive particles is greater than the ratio of the flake-shaped second conductive particles to the sum of the first conductive particles and the flake-shaped second conductive particles.

9. The electronic component according to claim 7, wherein the plurality of second conductive particles further comprises a plurality of spherical second conductive particles.

10. The electronic component according to claim 9, wherein the particle size of the spherical second conductive particle is smaller than the particle size of the flake-shaped second conductive particle, and the particle size of the first conductive particle is smaller than the particle size of the spherical second conductive particle.

11. The electronic component according to claim 1, wherein the width of the gap is smaller than the particle size of the first conductive particle.

12. The core comprises a resin, as described in any one of claims 1 to 11.

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