Films, display panels, display devices, and home appliances

Abstract

The objective is to provide films, display panels, display devices, and home appliances that improve display effectiveness. [Solution] Embodiments of the present disclosure provide a film (10), a display panel (100), a display device (1000), and a home appliance, wherein the film (10) comprises a base layer (11), a pattern layer (13), and a circuit layer (12), both of which are printed on the base layer (11), and the circuit layer (12) and the pattern layer (13) are integrated by integrated printing on the base layer, thereby eliminating gaps between the circuit layer (12) and the pattern layer (13), satisfying the requirements for clarity of patterns and character displays after illumination, improving the film (10) from problems such as reduced touch sensitivity and malfunction due to the effects of moisture, and matching the position of electronic devices on the circuit layer (12) with the corresponding patterns on the pattern layer (13) to improve the accuracy of the matching position.

Description

Technical Field

[0001] (Cross - reference to related applications) This application claims the priority of a Chinese patent application with application number 202221550221.2 filed with the Chinese Patent Office on June 20, 2022, and a Chinese patent application with application number 202210701741.7 filed with the Chinese Patent Office on June 20, 2022, and all the contents of the Chinese patent application are incorporated herein by reference.

[0002] This disclosure relates to the technical field of mold interior decoration, and particularly relates to films, display panels, display devices, and household electrical appliances.

Background Art

[0003] Taking the display panel of household electrical appliances as an example, the process adopted in the related art is to first attach a color film to the surface of the display board box, attach a touch film to the inner surface of the mold inner, and then attach the mold inner with the touch film attached to the outer surface of the display board box so that the touch film is aligned with the color film. After that, the gap between the color film and the touch film is defoamed to meet the requirements of color display and touch. For this reason, the patterns and characters after brightening are not clearly displayed, and the touch film is affected by moisture, and it is easy to cause a decrease in touch sensitivity and failure.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In view of the above, an embodiment of this disclosure aims to provide a film, a display panel, a display device, and a household electrical appliance that improve the display effect.

Means for Solving the Problems

[0005] An embodiment of this disclosure provides a film used for a display panel, and the film includes a base material layer, and A pattern layer printed on the substrate layer, The system comprises a circuit layer printed on the substrate layer.

[0006] In some embodiments, the pattern layer is provided outside the circuit layer.

[0007] In some embodiments, the substrate layer includes an inner surface and an outer surface, the pattern layer is provided on the outer surface of the substrate layer, and the circuit layer is provided on the inner surface of the substrate layer.

[0008] In some embodiments, the base material layer includes an outer surface and an inner surface, the pattern layer and the circuit layer are both provided on the outer surface of the base material layer, and the circuit layer is provided between the pattern layer and the base material layer.

[0009] In some embodiments, the film includes a light homogenization layer for homogenizing light, and both the pattern layer and the circuit layer are located outside the light homogenization layer.

[0010] In some embodiments, the light homogenization layer is printed on the inner surface of the substrate layer.

[0011] In some embodiments, the light homogenization layer, the substrate layer, the circuit layer, and the pattern layer are arranged sequentially in a direction from the inside out.

[0012] In some embodiments, the light homogenization layer, the circuit layer, the substrate layer, and the pattern layer are arranged sequentially in a direction from the inside outwards.

[0013] In some embodiments, the light homogenization layer is provided on the outermost inner layer of the film.

[0014] In some embodiments, the light homogenization layer is an ink diffusion layer.

[0015] In some embodiments, the film comprises an isolation sheet and a substrate connecting band provided on the side of the substrate layer, wherein the substrate connecting band is provided with a connecting circuit electrically connected to a circuit in the circuit layer, and the isolation sheet covers at least the connecting circuit printed on one end of the substrate connecting band closest to the substrate layer.

[0016] Embodiments of this disclosure provide a display panel, the display panel is, An inner film which is a film as described in any embodiment of this disclosure, The device comprises an injection-molded layer formed by injection molding onto the outer surface of the inner film.

[0017] In some embodiments, the display panel comprises an outer film, and the injection-molded layer is injection-molded between the inner surface of the outer film and the outer surface of the inner film.

[0018] Embodiments of this disclosure provide a display device, the display device is A display panel box equipped with a light source, The display panel box comprises a display panel as described in any embodiment of the present disclosure, wherein the display panel box is provided inside the display panel, and the light source is used to output light to the display panel.

[0019] In some embodiments, the display device comprises a mounting frame, the mounting frame having a mounting space, the display panel box being fitted into the mounting space, and the display panel being connected to the mounting frame and covering the mounting space.

[0020] Embodiments of the present disclosure provide a home appliance comprising a housing and a display device as described in any embodiment of the present disclosure, wherein the display device is provided in the housing.

[0021] In some embodiments, the household appliance is a clothing treatment device, the clothing treatment device includes a knob for selecting a washing and care program, the display panel is provided with a mounting hole penetrating the display panel, and the knob is rotatably provided in the mounting hole.

[0022] According to the film of the embodiment of the present disclosure, the circuit layer and the pattern layer are integrally printed and integrated on the substrate layer. In this way, the gap between the circuit layer and the pattern layer is eliminated, that is, the gap between the circuit layer and the pattern layer in the related art can be absolutely removed, and the requirements for the sharpness of the pattern and character display after brightening can be met. Furthermore, since air and steam do not penetrate between the circuit layer and the pattern layer, the problem that the film is susceptible to moisture, resulting in a decrease in touch sensitivity and frequent occurrence of failures, can be effectively improved.

[0023] According to the film of the embodiment of the present disclosure, the pattern layer may be formed first and then the circuit layer, or the circuit layer may be formed first and then the pattern layer. In any case, when the circuit layer or the pattern layer is formed later, the position of the electronic device in the circuit layer and the corresponding pattern in the pattern layer can be preferably matched, and the accuracy of the matching position can be improved.

Brief Description of the Drawings

[0024] [Figure 1] It is a schematic structural diagram of the film according to the first embodiment of the present disclosure. [Figure 2] It is a schematic structural diagram of the film according to the second embodiment of the present disclosure. [Figure 3] It is a schematic structural diagram of the film according to the third embodiment of the present disclosure. [Figure 4] It is a schematic structural diagram of the film according to the fourth embodiment of the present disclosure. [Figure 5] It is a schematic structural diagram of the film according to the fifth embodiment of the present disclosure. [Figure 6] It is a schematic structural diagram of the film according to the sixth embodiment of the present disclosure. [Figure 7] This is a schematic diagram of the film relating to the seventh embodiment of this disclosure. [Figure 8] This is a schematic diagram of a display panel relating to one embodiment of the present disclosure. [Figure 9] Figure 8 is an exploded view of the structure shown. [Figure 10] This is a schematic diagram of a display device relating to one embodiment of the present disclosure. [Figure 11] This is a structural diagram of the structure shown in Figure 10 from a different perspective. [Figure 12] Figure 10 is an exploded view of the structure shown. [Modes for carrying out the invention]

[0025] Embodiments of the present disclosure will be described in further detail below with reference to the drawings and examples. The following embodiments are for illustrative purposes only and are not intended to limit the scope of the present disclosure.

[0026] In the description of the embodiments of this disclosure, the orientations or positional relationships indicated by the terms "inside" and "outside" are based on the orientations or positional relationships shown in the drawings and are used solely to facilitate and simplify the description of the embodiments of this disclosure. They do not indicate or imply that the specified devices or elements necessarily have a specific orientation or must be configured and operate in a specific orientation, and therefore should not be understood as limitations on the embodiments of this disclosure. Furthermore, terms such as "first," "second," and "third" are used solely for explanatory purposes and should not be understood as indicating or implying their relative importance.

[0027] Embodiments of this disclosure provide a film 10 used in a display panel.

[0028] For example, in the in-mold decoration (IMD) process, injection molding material is injected onto the outer surface of a film to form a display panel. Of course, it is understandable that the film 10 may be applied to the display panel by other processes.

[0029] Referring to Figures 1 to 7, the film comprises a base layer 11, a pattern layer 13, and a circuit layer 12, with both the pattern layer 13 and the circuit layer 12 printed on the base layer 11.

[0030] The base layer 11 is a sheet used as a carrier for printing and has a certain structural strength.

[0031] The raw material for the base layer 11 may be a resin such as PET (Polyethylene terephthalate), PMMA (Polymethyl methacrylate), PC (Polycarbonate), PVC (Polyvinyl chloride), PP (Polypropylene), or acrylic resin.

[0032] The specific types of patterns in the pattern layer are not particularly limited and include, for example, any one of the following, or any combination thereof: any type of language character (such as Chinese characters, English letters, French letters, etc.), numbers, color combinations, patterns, patterns displayed in different areas of grayscale values.

[0033] The pattern in pattern layer 13 may be in color or in black and white; it is not limited to this.

[0034] Since the circuit layer 12 has printed circuits, the circuit layer 12 as a whole takes the form of a flexible circuit.

[0035] The printing method is not limited to spray printing, laser printing, or painting, but is not limited to these. In short, each printed layer printed on the substrate layer 11 does not have a film-like support; that is, the circuit layer 12 does not have a film-like support, and the pattern layer 13 does not have a film-like support. Each printed layer is obtained by using the substrate layer 11 as a support and printing on the substrate layer 11 layer by layer.

[0036] According to the film of the embodiment of this disclosure, the circuit layer 12 and the pattern layer 13 are printed integrally on the substrate layer. In this way, there is no gap between the circuit layer 12 and the pattern layer 13, that is, the gap between the circuit layer 12 and the pattern layer 13 in related technologies can be absolutely eliminated, and the requirement for clarity of the pattern display after illumination can be met. Furthermore, since air and vapor do not penetrate between the circuit layer 12 and the pattern layer 13, the problem in related technologies in which the film is affected by moisture and suffers from reduced touch sensitivity or malfunction can be effectively improved.

[0037] According to the film 10 of the embodiment of this disclosure, the pattern layer 13 may be formed first and then the circuit layer 12 may be formed, or the circuit layer 12 may be formed first and then the pattern layer 13 may be formed. In either case, when the circuit layer 12 or the pattern layer 13 is formed later, the position of the electronic device in the circuit layer 12 and the corresponding pattern in the pattern layer 13 can be suitably matched, thereby improving the accuracy of the matching position.

[0038] Illustratively, referring to Figures 8 and 9, the film 10 comprises a substrate connecting strip 15 provided on the side of the substrate layer 11 and a connecting circuit printed on the substrate connecting strip 15, the connecting circuit being used to electrically connect a circuit within the printed circuit layer to an external circuit.

[0039] Furthermore, both the base material connecting band 15 and the base material layer 11 are cut to the desired shape during the cutting process. In other words, the base material connecting band 15 and the base material layer 11 have an integrated structure.

[0040] In the process of printing each printing layer onto the substrate layer 11, only the connection circuits need to be printed on the substrate connection zone 15. There is no need to print pattern layers or other layers on the substrate connection zone 15.

[0041] An embodiment of the present disclosure further provides a display panel 100, referring to Figures 8 and 12, the display panel 100 comprising an inner film and an injection-molded layer 20, where the inner film is the film 10 of any embodiment of the present disclosure.

[0042] The injection-molded layer 20 is injection-molded onto the outer surface of the inner film; in other words, the inner film is located inside the injection-molded layer 20.

[0043] With respect to the injection-molded layer 20, the outside refers to the side facing the user, and the inside refers to the side away from the user.

[0044] The circuitry within the circuit layer 12 is used to respond to touches on the display panel 100. In this embodiment, the display panel 100 is a touch panel.

[0045] The display panel 100 is molded using an injection molding process within a mold. Before injection, the film 10 is first placed and fixed in the mold cavity, for example, by vacuum suction so that the outer surface of the inner film faces inward into the cavity. Next, liquid resin material is injected into the mold, and after cooling, the mold is opened. The resin material forms an injection-molded layer 20 after cooling, and the film 10 is bonded to the inner surface of the injection-molded layer 20. In the molding process, the base layer 11 of the film 10 is not peeled off, and the film 10 as a whole is bonded to the inner surface of the injection-molded layer 20.

[0046] In the display panel 100 of the embodiment of this disclosure, the film 10 is bonded as a whole to the inner surface of the injection-molded layer 20. That is, both the pattern layer 13 and the circuit layer 12 are firmly attached to the inner surface of the injection-molded layer 20, eliminating the need to manually attach the film layer by layer, thereby improving efficiency and reducing manufacturing costs. Furthermore, because there is no gap between the pattern layer 13 and the circuit layer 12, moisture-proof and waterproof performance is improved, and touch sensitivity and reliability are enhanced. In addition, the position of the electronic device in the circuit layer 12 and the corresponding pattern in the pattern layer 13 can be suitably matched, resulting in greater consistency in the appearance of the display panel.

[0047] Illustratively, referring to Figures 3 and 12, the display panel 100 further comprises an outer film 30, and the injection-molded layer 20 is injection-molded between the outer film 30 and the inner film.

[0048] Here, the specific configuration of the outer film 30 is not limited, and any one of the films in the prior art can be used.

[0049] In the in-mold injection molding process, liquid resin material is injected into the inner surface of the outer film 30 and the outer surface of the inner film. After in-mold injection molding, the inner film, the injection-molded layer 20, and the outer film 30 are integrated, with the inner film bonded to the inner surface of the injection-molded layer 20 and the outer film 30 bonded to the outer surface of the injection-molded layer 20.

[0050] The outer film 30 and the injection-molded layer 20 are both made of light-transmitting material so that the pattern in the pattern layer 13 is visible from the outside when the display panel 100 is lit.

[0051] The outer film 30 provides good protection and reduces the probability of the surface of the display panel 100 being scratched.

[0052] In the display panel 100 of the embodiment of this disclosure, since the circuit layer 12 and the pattern layer 13 are provided on the inner film, when the display panel 100 is not lit, the pattern layer 13 and the circuit layer 12 are hardly visible from the view outside the display panel 100 due to the outer film 30 and the injection-molded layer 20. In other words, when it is not lit, the user can hardly see the pattern layer 13 and the circuit layer 12 from the outside, and the user can only see the pattern on the pattern layer 13 when the display panel 100 is lit.

[0053] Furthermore, after the inner film is formed, a protective layer that can be easily peeled off can be applied to both the inside and outside of the inner film to provide protection to the inner film.

[0054] After the outer film 30 is formed, a protective layer that can be easily peeled off can be applied to both the inside and outside of the outer film 30 to provide protection to the outer film 30.

[0055] For example, the above display panel 100 can be molded using the following process.

[0056] First, after printing and molding the inner film and the outer film 30, the protective film on both sides of the inner film is peeled off, and the protective film on both sides of the outer film 30 is peeled off. The surfaces of the inner film and the outer film 30 are then dusted, for example, by a combination of manual dust removal and electrostatic dust removal.

[0057] Next, the dust-removed inner film is placed on one side of the mold cavity of the mold and fixed by vacuum suction, and the dust-removed outer film 30 is placed on the other side of the mold cavity of the mold and fixed by vacuum suction. For example, the inner film is placed in the mold cavity of the fixed mold and the outer film 30 is placed in the mold cavity of the movable mold, or the inner film is placed in the mold cavity of the movable mold and the outer film 30 is placed in the mold cavity of the fixed mold.

[0058] Subsequently, the mold is closed, resin material is injected into the mold, and the inner film and outer film 30 are simultaneously pressed into the injected resin material to form a predetermined shape.

[0059] After the resin has cooled, the mold is opened to obtain the injection-molded product.

[0060] In some embodiments, the injection-molded product may be the final finished product, meaning that no additional processes are required.

[0061] In some other embodiments, the injection-molded product is a semi-finished product that requires further processing, such as irradiating the injection-molded product with ultraviolet light.

[0062] Illustratively, referring to Figures 1, 3, 5, and 6, the film includes a light homogenization layer 14 for homogenizing light, and the circuit layer 12 and pattern layer 13 are both located outside the light homogenization layer 14. When the display panel 100 becomes bright, light passes through the display panel 100 from the inside out, passing through the light homogenization layer 14 first, and then through the circuit layer 12 and pattern layer 13. Note that the order of the circuit layer 12 and pattern layer 13 is not limited; for example, the light may pass through the circuit layer 12 first, then the pattern layer 13, or the pattern layer 13 first, then the circuit layer 12. As the light passes through the light homogenization layer 14, the light homogenization layer 14 provides a good light homogenization effect, so the brightness exhibited by the display panel 100 is uniform and soft, and the user cannot easily see the light source behind the display panel.

[0063] The light homogenization layer plays a role in homogenizing light, and the printing material used for the light homogenization layer is not limited. For example, in some embodiments, the light homogenization layer is an ink diffusion layer, meaning that the printing material of the light homogenization layer is ink, and the ink is diffused and printed by the printing means. The ink diffusion layer is capable of transmitting light.

[0064] The light homogenization layer 14 may be provided on the outer surface of the substrate layer 11 (see Figure 5) or on the inner surface of the substrate layer 11.

[0065] For example, referring to Figures 1, 3, and 6, the light homogenization layer 14 is provided on the inner surface of the substrate layer 11.

[0066] The ink in the light-homogenized layer 14 has powdery particles, and the bonding force between the particles and the substrate layer 11 or other adjacent layers is relatively weak. Furthermore, since the substrate layer 11 serves as a carrier for the inner film, if the bonding force between the substrate layer 11 and the injection-molded layer 20 is insufficient, the substrate layer 11 becomes prone to peeling, resulting in a defective product.

[0067] In this embodiment, since the light homogenization layer 14 is provided on the inner surface of the injection-molded layer 20, after the inner film is bonded to the injection-molded layer 20, the weak bonding force of the light homogenization layer 14 does not affect the bonding force between the base layer 11 and the injection-molded layer 20. This results in a favorable bonding force between the base layer 11 and the injection-molded layer 20, and in stages such as environmental testing after molding the display panel 100, the base layer 11 is not easily peeled off from the injection-molded layer 20, thus ensuring the reliability of the display panel 100.

[0068] In this embodiment, since the light homogenization layer 14 is provided on the inside of the base layer 11, even if the bonding force between the light homogenization layer 14 and the base layer 11 is still weak, the base layer 11, as a structural carrier, is not easily peeled off from the injection-molded layer 20, and the light homogenization layer 14 itself is a thin coating layer and does not have a sheet like the base layer 11, so the light homogenization layer 14 itself does not lift up or peel off from the base layer 11.

[0069] For example, referring to Figures 1 to 7, the pattern layer 13 is provided on the outer surface of the circuit layer 12. In this embodiment, the pattern layer 13 acts as a shielding layer for the circuit layer 12, preventing the user from easily viewing the circuit in the circuit layer 12.

[0070] Furthermore, the pattern layer 13 can completely shield the circuit layer 12, or the pattern regions within the pattern layer 13 can shield the electronic devices within the circuit layer 12.

[0071] In some embodiments, the pattern layer 13 is provided on the outer surface of the base layer 11, and the circuit layer 12 is provided on the inner surface of the base layer 11. In other words, the pattern layer 13 and the circuit layer 12 are located on opposing surfaces of the base layer 11.

[0072] In this embodiment, the substrate layer 11 employs a double-sided printing manufacturing process, which reduces the defect rate by concentrating all printed layers on the same side of the substrate layer 11. Furthermore, the pattern layer 13 is located outside the circuit layer 12, providing a shielding effect to the circuit layer 12.

[0073] In related technologies, each printed layer is located outside the substrate layer 11, and because each layer is arranged separately, errors that occur in each printed layer tend to accumulate and be amplified, resulting in a higher defect rate.

[0074] In this embodiment, the substrate layer 11 employs double-sided printing. When the total number of printed layers is the same, double-sided printing can reduce the number of printed layers on one side, thereby reducing the defect rate due to an excessive number of printed layers on one side.

[0075] In some embodiments, as shown in Figure 3, the pattern layer 13 is provided on the outer surface of the base layer 11, the circuit layer 12 is provided on the inner surface of the base layer 11, and the circuit layer 12 is provided between the light homogenization layer 14 and the base layer 11. In this embodiment, the light homogenization layer 14 does not affect the bonding force between the circuit layer 12 and the base layer 11 and can also perform the role of homogenizing light. Furthermore, since the pattern layer 13 is on the outer surface of the base layer 11, the ink on the pattern layer 13 can adhere better to the injection-molded layer 20, resulting in a clearer appearance.

[0076] In some other embodiments, referring to Figures 1 and 2, both the pattern layer 13 and the circuit layer 12 are provided on the outer surface of the base layer 11, and the circuit layer 12 is provided between the pattern layer 13 and the base layer 11.

[0077] In this embodiment, both the circuit layer 12 and the pattern layer 13 can be well adhered by the injection-molded layer 20, and furthermore, the base layer 11 is located inside the circuit layer 12 and can provide good protection to the circuit layer 12 as well.

[0078] In some embodiments, the light homogenization layer 14 is provided on the outermost inner layer of the film.

[0079] In the embodiments of this disclosure, the outermost layer refers to the outermost layer, and there are no other printed layers on the side of the outermost layer away from the substrate layer 11.

[0080] In this embodiment, the light homogenization layer 14 plays a role in homogenizing light, and since there are no scratches on the light homogenization layer 14 caused by the user or the external environment, there is no need to apply another layer to the surface of the light homogenization layer 14. In this way, costs can be reduced while still meeting the performance requirements.

[0081] Illustratively, referring to Figures 8 and 12, the film comprises an isolation sheet 16, which is provided on the outer surface of the substrate connection band 15 and covers at least the connection circuit printed on one end of the substrate connection band 15 closest to the substrate layer 11.

[0082] The isolation sheet 16 serves to protect the circuit and prevent the resin material injected during injection molding from burning.

[0083] Specifically, during injection molding, the inner film is placed inside the mold cavity, with one end of the substrate connecting band 15 near the substrate layer 11 located inside the cavity and the other end away from the substrate layer 11 located outside the cavity. Since the portion located inside the cavity comes into contact with the injected resin, the isolation sheet 16 must at least cover the portion of the substrate connecting band 15 located inside the cavity. This isolates the circuit from the resin material and prevents the resin material from burning the circuit during injection.

[0084] Furthermore, the portion of the substrate connection band 15 located outside the cavity may or may not be covered by the isolation sheet 16.

[0085] As an example, the main manufacturing steps of the inner film in one embodiment are briefly described below.

[0086] The manufacturing process for the inner film includes the following steps: Material cutting step: The roll of film is cut into base sheets according to the designed shape, such as a rectangle. The sheet corresponding to the base layer 11 and the base connecting band 15 are cut together. Pre-shrinking step: Before printing, the cut substrate sheets are heated in an oven to reduce the probability of shrinkage. Printing process step: A gloss oil, circuit layer 12, pattern layer 13, light homogenization layer 14, etc. are applied to the cut substrate sheet. After printing, the substrate sheet is placed in a high-temperature oven to dry, harden the ink, and evaporate the solvent in the ink. Protective film application step: A protective film is applied to both sides of the base sheet to prevent damage to the printed surface of the base sheet when punching out the positioning holes. Positioning hole punching step: Positioning holes for punching and positioning holes for hot press molding are punched into the base sheet. The positioning holes for punching and positioning holes for hot press molding should be punched accurately. Hot press molding step: The base sheet is hot-press molded using a hot press molding die to form the outer shape of the product. Die-cutting step: The waste material from the heat-press molded base sheet is cut to obtain the inner film.

[0087] Hereinafter, several embodiments of the inner film of this disclosure will be described with reference to the drawings.

[0088] Regarding the first embodiment Referring to Figure 1, the inner film comprises a base layer 11, a pattern layer 13, a circuit layer 12, and a light homogenization layer 14.

[0089] The light homogenization layer 14, substrate layer 11, circuit layer 12, and pattern layer 13 are arranged sequentially from the inside out.

[0090] In the manufacturing process of the inner film, a layer of gloss oil may be applied to the base layer 11 before applying the circuit layer 12. The gloss oil has an insulating effect and can isolate the printing medium between two adjacent layers. After applying a layer of gloss oil, the circuit layer 12 is applied, and after applying a layer of gloss oil to the circuit layer 12, the pattern layer 13 is applied. It is not necessary to apply gloss oil outside the pattern layer 13, but of course, another layer of gloss oil may be applied.

[0091] The arrangement of the light homogenization layer 14, substrate layer 11, circuit layer 12, and pattern layer 13 described above refers to the arrangement order of these four printing layers. Other layers may be selectively added between the light homogenization layer 14 and the substrate layer 11, between the substrate layer 11 and the circuit layer 12, and between the circuit layer 12 and the pattern layer 13, or they may not be added at all.

[0092] Regarding the second example Referring to Figure 2, the main structure in the second embodiment is almost the same as that of the first embodiment, the main difference being that this embodiment does not include the light homogenization layer 14.

[0093] The base layer 11, circuit layer 12, and pattern layer 13 are arranged sequentially from the inside out.

[0094] For example, a light homogenization effect may be achieved by adding a component such as a film or frosted glass between the light source and the display panel 100 to homogenize the light.

[0095] The arrangement of the base layer 11, circuit layer 12, and pattern layer 13 described above refers to the arrangement order of these three printed layers. Other layers may be selectively added between the base layer 11 and the circuit layer 12, and between the circuit layer 12 and the pattern layer 13, or they may not be added at all.

[0096] Regarding the third embodiment Referring to Figure 3, the inner film comprises a base layer 11, a pattern layer 13, a circuit layer 12, and a light homogenization layer 14.

[0097] The light homogenization layer 14, circuit layer 12, substrate layer 11, and pattern layer 13 are arranged sequentially from the inside out.

[0098] It is understandable that the gloss oil described above may be applied between any two layers.

[0099] The arrangement of the light homogenization layer 14, circuit layer 12, substrate layer 11, and pattern layer 13 described above refers to the arrangement order of these four printing layers. Other layers may be selectively added between the light homogenization layer 14 and the circuit layer 12, between the circuit layer 12 and the substrate layer 11, and between the substrate layer 11 and the pattern layer 13, or they may not be added at all.

[0100] Regarding the fourth embodiment Referring to Figure 4, the main structure in the fourth embodiment is almost the same as that of the third embodiment, the main difference being that this embodiment does not include the light homogenization layer 14.

[0101] The circuit layer 12, substrate layer 11, and pattern layer 13 are arranged sequentially from the inside out.

[0102] For example, a light homogenization effect may be achieved by adding a component such as a film or frosted glass between the light source and the display panel 100 to homogenize the light.

[0103] The arrangement of the circuit layer 12, substrate layer 11, and pattern layer 13 described above refers to the arrangement order of these three printed layers. Other layers may be selectively added between the circuit layer 12 and the substrate layer 11, and between the substrate layer 11 and the pattern layer 13, or they may not be added at all.

[0104] Regarding the fifth embodiment Referring to Figure 5, the inner film comprises a base layer 11, a pattern layer 13, a circuit layer 12, and a light homogenization layer 14.

[0105] The substrate layer 11, the photo-homogenization layer 14, the circuit layer 12, and the pattern layer 13 are arranged sequentially from the inside out.

[0106] The arrangement of the base layer 11, photo-homogenization layer 14, circuit layer 12, and pattern layer 13 described above refers to the arrangement order of these four printing layers. Other layers may be selectively added between the base layer 11 and the photo-homogenization layer 14, between the photo-homogenization layer 14 and the circuit layer 12, and between the circuit layer 12 and the pattern layer 13, or they may not be added at all.

[0107] Regarding the sixth embodiment Referring to Figure 6, the inner film comprises a base layer 11, a pattern layer 13, a circuit layer 12, and a light homogenization layer 14.

[0108] The light homogenization layer 14, circuit layer 12, pattern layer 13, and substrate layer 11 are arranged sequentially from the inside out.

[0109] The arrangement of the light homogenization layer 14, circuit layer 12, pattern layer 13, and substrate layer 11 described above refers to the arrangement order of these four printing layers. Other layers may be selectively added between the light homogenization layer 14 and the circuit layer 12, between the circuit layer 12 and the pattern layer 13, and between the pattern layer 13 and the substrate layer 11, or they may not be added at all.

[0110] Regarding the 7th embodiment Referring to Figure 7, the main structure of the seventh embodiment is almost the same as that of the sixth embodiment, the main difference being that this embodiment does not include the light homogenization layer 14.

[0111] The circuit layer 12, pattern layer 13, and substrate layer 11 are arranged sequentially from the inside out.

[0112] For example, a light homogenization effect may be achieved by adding a component such as a film or frosted glass between the light source and the display panel 100 to homogenize the light.

[0113] The arrangement of the circuit layer 12, pattern layer 13, and substrate layer 11 described above refers to the arrangement order of these three printed layers. Other layers may be selectively added between the circuit layer 12 and the pattern layer 13, and between the pattern layer 13 and the substrate layer 11, or they may not be added at all.

[0114] Each embodiment of this disclosure may have only the circuit layer 12, pattern layer 13, substrate layer 11, ink layer, and gloss oil layer, and may not have any other printing layers. Of course, other printing layers may be added as needed.

[0115] An embodiment of the present disclosure provides a display device 1000, which, referring to Figures 10, 11, and 12, comprises a display panel box 300 and a display panel 100 relating to any embodiment of the present disclosure.

[0116] The display panel box 300 integrates a PCB board and a light source.

[0117] The type of light source is not limited and can include, for example, light beads or light strips.

[0118] The circuits within circuit layer 12 are electrically connected to the PCB board.

[0119] The PCB board is used to control the light source so that it outputs light to the display panel 100, and when the light source emits light, the display panel 100 becomes bright. In this way, the display panel 100 can be made to exhibit a constant brightness so that the user can see the pattern layer 13.

[0120] When the light source is turned off, the user can barely see the pattern layer 13.

[0121] For example, the display device 1000 further comprises a mounting frame 200, and both the display panel box 300 and the display panel 100 are attached to the mounting frame 200.

[0122] The mounting frame 200 provides mounting support for the display board box 300 and the display panel 100.

[0123] For example, the mounting frame 200 is basically a frame-type structure, and the mounting frame 200 has a mounting space 200a into which the display panel box 300 is fitted. During assembly, the display panel box 300 is fitted into the mounting space 200a from the rear side of the mounting frame 200 and fixed to the mounting frame 200 by means of screws, snaps, etc.

[0124] The display panel 100 is connected to the mounting frame 200 and covers the mounting space 200a. The display panel 100 is attached to the mounting space 200a from the front side of the mounting frame 200.

[0125] The application field of the display panel 100 of the embodiments of this disclosure is not limited, and it can be used in any suitable product. Examples include the consumer electronics, communication terminals, automobiles, and medical industries.

[0126] An embodiment of the present disclosure provides a home appliance comprising a housing and a display device 1000 relating to any embodiment of the present disclosure, wherein the display device 1000 is provided in the housing.

[0127] The display panel 100 of the display device 1000 is used as part of the exterior surface of a home appliance, and the user can perform human interaction by operating the display panel 100.

[0128] The types of home appliances are not limited; for example, they could include refrigerators, air conditioners, electric rice cookers, and clothing processing devices.

[0129] Here, the specific type of clothing processing device is not limited; for example, it may be a washing machine, a clothes dryer, or a washer-dryer, or it may be a set device formed by stacking a washing machine and a clothes dryer vertically.

[0130] As an example, let's consider a case where a home appliance is a clothing processing device.

[0131] The garment processing device is equipped with a knob, which the user can rotate to select washing and care programs such as standard wash, quick wash, wool wash, and automatic drum wash.

[0132] Referring to Figures 8 and 12, the display panel 100 is provided with a mounting hole 10a that penetrates it, and the knob is rotatably mounted within the mounting hole 10a.

[0133] In this embodiment, the user can select parameters corresponding to each washing and care program, such as temperature and water volume, by touching the display panel 100.

[0134] In this specification, reference terms such as “one example,” “some examples,” “exemplary,” “specific example,” or “some example” mean that the specific features, configurations, materials, or properties described in this example or example are included in at least one example or example of the examples of this disclosure. In this disclosure, exemplary expressions of the above terms do not necessarily refer to the same example or example. Furthermore, the specific features, configurations, materials, or properties described may be combined in an appropriate manner in any one or more examples or examples. Also, without contradiction, a person skilled in the art may combine different examples or examples and features of different examples or examples described in this disclosure.

[0135] The above description is merely a preferred embodiment of the Disclosure and is not intended to limit the Disclosure, and various modifications and changes can be made to those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the Disclosure are within the scope of protection of the Disclosure. [Explanation of Symbols]

[0136] 10 Film, 10a Mounting hole, 11 Substrate layer, 12 Circuit layer, 13 Pattern layer, 14 Light homogenization layer, 15 Substrate connection band, 16 Isolation sheet, 20 Injection molded layer, 30 Outer film, 100 Display panel, 200 Mounting frame, 200a Mounting space, 300 Display panel box, 1000 Display device

Claims

1. A film used for display panels, A base layer and A pattern layer printed on the substrate layer, The substrate layer comprises a circuit layer printed on the substrate layer, film.

2. The pattern layer is provided outside the circuit layer, The film according to claim 1.

3. The substrate layer includes an inner surface and an outer surface, the pattern layer is provided on the outer surface of the substrate layer, and the circuit layer is provided on the inner surface of the substrate layer. The film according to claim 1.

4. The substrate layer includes an outer surface and an inner surface, the pattern layer and the circuit layer are both provided on the outer surface of the substrate layer, and the circuit layer is provided between the pattern layer and the substrate layer. The film according to claim 1.

5. The film comprises a light homogenization layer for homogenizing light, and both the pattern layer and the circuit layer are located outside the light homogenization layer. The film according to claim 1.

6. The light homogenization layer is printed on the inner surface of the substrate layer. The film according to claim 5.

7. The light homogenization layer, the substrate layer, the circuit layer, and the pattern layer are arranged sequentially in a direction from the inside out. The film according to claim 6.

8. The light homogenization layer, the circuit layer, the substrate layer, and the pattern layer are arranged sequentially in a direction from the inside out. The film according to claim 6.

9. The light homogenization layer is provided on the outermost inner layer of the film. The film according to any one of claims 5 to 8.

10. The aforementioned light homogenization layer is an ink diffusion layer. The film according to any one of claims 5 to 8.

11. The film comprises an isolation sheet and a substrate connecting band provided on the side of the substrate layer, wherein the substrate connecting band is provided with a connecting circuit electrically connected to the circuit in the circuit layer, and the isolation sheet covers at least the connecting circuit printed on one end of the substrate connecting band closest to the substrate layer. The film according to claim 1.

12. It is a display panel, An inner film which is a film according to any one of claims 1 to 11, The inner film comprises an injection-molded layer formed by injection molding onto the outer surface of the inner film, Display panel.

13. The display panel comprises an outer film, and the injection-molded layer is injection-molded between the inner surface of the outer film and the outer surface of the inner film. The display panel according to claim 12.

14. A display device, A display panel box equipped with a light source, A display panel according to claim 12 or 13, comprising, The display panel box is provided inside the display panel, and the light source is used to output light to the display panel. Display device.

15. The display device comprises a mounting frame, the mounting frame having a mounting space, the display panel box being fitted into the mounting space, and the display panel being connected to the mounting frame and covering the mounting space. The display device according to claim 14.

16. It is a home appliance, Housing and The display device according to claim 14 or 15, The display device is provided in the housing, Home appliances.

17. The aforementioned home appliance is a clothing processing device, The garment processing apparatus is equipped with a knob for selecting washing and care programs, the display panel is provided with a mounting hole that penetrates the display panel, and the knob is rotatably mounted within the mounting hole. The home appliance according to claim 16.

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