Integrated encapsulation sheet, light-emitting electronic component, and method for manufacturing a light-emitting electronic component

Abstract

The present invention provides an integrated sealing sheet that not only fills the spaces between multiple light-emitting elements with a light-diffusion-preventing resin in a single pressing operation, but also completes the sealing process, while not obstructing the light from the light-emitting elements from reaching the viewer, as well as a light-emitting electronic component using this integrated sealing sheet and a method for manufacturing the light-emitting electronic component. [Solution] An integrated sealing sheet 1 is pressed onto the surface on which a plurality of light-emitting elements are arranged on an element-equipped substrate 10 having a plurality of light-emitting elements arranged on a substrate 11, and is characterized by comprising a black curable resin layer 2, a transparent curable resin layer 3, a film layer 4, and a hard coat layer 5, which are sequentially laminated from the side that is in contact with the element-equipped substrate 10 when pressed.

Description

[Technical Field]

[0001] The present invention relates to an integrated sealing sheet, a light-emitting electronic component, and a method for manufacturing a light-emitting electronic component. [Background technology]

[0002] In recent years, display technologies using extremely small light-emitting diodes, known as mini-LEDs or micro-LEDs, have been attracting attention. Mini LEDs and micro LEDs have two applications. One is a technology that enables localized control of the brightness of a liquid crystal display by configuring the backlight with a large number of LEDs arranged on a substrate. The other method involves using LEDs of each color to emit light for the red (R), green (G), and blue (B) components that make up the pixels, and the high-purity colors emitted by each color LED are directly delivered to the eye.

[0003] Mini-LEDs and micro-LEDs use electronic components in which multiple light-emitting elements are arranged on a substrate. In such electronic components, a dry film is used to fill the spaces between the multiple light-emitting elements with a light-diffusion-preventing resin (Patent Document 1). The dry film is a resin film obtained by coating a curable resin composition onto a protective film and drying it. This film is then pressed onto the surface of the substrate on which the light-emitting elements are arranged, filling the spaces between the light-emitting elements, and then cured.

[0004] When a dry film is pressed onto the surface of a substrate where light-emitting elements are arranged, a light-diffusion-preventing resin layer is inevitably formed not only between the light-emitting elements but also on the light-emitting elements themselves. If the light-diffusion-preventing resin layer formed on the light-emitting element is left as is, not only will light diffusion between the light-emitting elements be blocked, but light that should be emitted towards the viewer will also be blocked. Therefore, Patent Document 1 describes a method in which, after pressing a dry film, the resin on the light-emitting element is removed by etching such as plasma treatment, and the exposed light-emitting element is covered with a light-transmitting encapsulant. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-22562 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] However, etching processes such as plasma treatment are extremely time-consuming, contributing to increased manufacturing costs. Furthermore, it is difficult to completely remove the resin from the light-emitting element through etching, making it challenging to completely prevent the diffusion of light that should be emitted towards the viewer.

[0007] Furthermore, in order to create a sealing layer on the outermost surface, it is also necessary to further laminate the dry film of the sealing material. In view of the above circumstances, the present invention aims to provide an integrated sealing sheet that not only fills the spaces between multiple light-emitting elements with a light-diffusion-preventing resin in a single pressing operation, but also completes the sealing process, and moreover, does not prevent light from the light-emitting elements from reaching the viewer, as well as a light-emitting electronic component using this integrated sealing sheet and a method for manufacturing a light-emitting electronic component. [Means for solving the problem]

[0008] The inventors of the present invention have conducted sincere research to achieve the above objectives and have found that the above objectives can be solved by providing an integrated sealing sheet comprising sequentially laminated black curable resin layers, a transparent curable resin layer, a film layer, and a hard coat layer, thereby completing the present invention.

[0009] The present invention encompasses the following embodiments. [1] An integrated sealing sheet that is pressed onto the surface on which the plurality of light-emitting elements are arranged of an element-equipped substrate, wherein the plurality of light-emitting elements are arranged on the substrate, An integrated sealing sheet, comprising a black curable resin layer, a transparent curable resin layer, a film layer, and a hard coat layer, which are sequentially laminated from the side arranged in contact with the substrate with elements during the crimping.

[0010] [2] The integrated sealing sheet according to [1], wherein the black curable resin layer and the transparent curable resin layer are in an uncured state. [3] The integrated sealing sheet according to [1] or [2], wherein at 100 °C, the storage modulus of the transparent curable resin layer in the uncured state is greater than the storage modulus of the black curable resin layer in the uncured state.

[0011] [4] At 100 °C, the storage modulus of the black curable resin layer in the uncured state is 1.0×10 2 Pa or more and 1.0×10 5 Pa or less. The integrated sealing sheet according to any one of [1] to [3]. [5] At 100 °C, the storage modulus of the transparent curable resin layer in the uncured state is 1.0×10 4 Pa or more and 1.0×10 7 Pa or less. The integrated sealing sheet according to any one of [1] to [4]. [6] At 100 °C, the storage modulus of the film layer is 1.0×10 9 Pa or more and 1.0×10 10 Pa or less. The integrated sealing sheet according to any one of [1] to [5].

[0012] [7] The integrated sealing sheet according to any one of [1] to [6], wherein the black curable resin layer has Lab values in the cured state of L: 3 to 15, a: -3 to 5, and b: -3 to 10. [8] The integrated sealing sheet according to any one of [1] to [7], wherein the black curable resin layer contains a black pigment or a black dye. [9] The integrated sealing sheet according to any one of [1] to [8], wherein the total light transmittance of the transparent curable resin layer in the cured state is 30 to 99%.

[0013]

[10] The integrated encapsulation sheet according to any one of [1] to [9], wherein at least one of the black curable resin layer and the transparent curable resin layer contains at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin and a curing agent.

[11] The integrated encapsulation sheet according to any one of [1] to

[10] , wherein the black curable resin layer contains at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin and a curing agent.

[12] The integrated encapsulation sheet according to any one of [1] to

[11] , wherein the transparent curable resin layer contains at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin and a curing agent.

[0014]

[13] The integrated encapsulation sheet according to any one of [1] to

[12] , wherein the total light transmittance of the film layer is 30 to 99%.

[14] The integrated encapsulation sheet according to any one of [1] to

[13] , wherein the film layer contains at least one resin selected from a polyethylene terephthalate resin, a polyethylene 2,6-naphthalate resin, and a polycarbonate resin.

[15] The integrated encapsulation sheet according to any one of [1] to

[14] , wherein the thickness of the film layer is 10 to 250 μm.

[0015]

[16] The integrated encapsulation sheet according to any one of [1] to

[15] , wherein the hard coat layer contains one or more selected from an acrylic resin, a urethane resin, a silicone resin, and a melamine resin.

[17] The integrated encapsulation sheet according to any one of [1] to

[16] , wherein the total light transmittance of the hard coat layer is 30 to 99%.

[0016]

[18] The integrated encapsulation sheet according to any one of [1] to

[17] , wherein the pencil hardness of the surface of the hard coat layer is H or more.

[19] The integrated encapsulation sheet according to any one of [1] to

[18] , wherein the surface roughness Ra of the surface of the hard coat layer is 0.1 to 1 μm.

[20] The integrated sealing sheet according to any one of [1] to

[19] , wherein the reflectance of the hard coat layer side is 10 to 50%.

[0017]

[21] The integrated sealing sheet according to any one of [1] to

[20] , wherein the total light transmittance of the three layers, the transparent curable resin layer, the film layer, and the hard coat layer, is 30 to 95%.

[22] An integrated sealing sheet according to any one of [1] to

[21] , having a protective film on either the surface of the curable resin layer and the hard coat layer or both of them.

[0018]

[23] A substrate with elements on which a plurality of light-emitting elements are arranged, and an integrated sealing sheet according to any one of [1] to

[22] is pressed onto the surface of the substrate with elements on which the plurality of light-emitting elements are arranged. The black curable resin layer and the transparent curable resin layer have been cured. A light-emitting electronic component characterized in that the black curable resin layer and a portion of the transparent curable resin layer are filled between the plurality of light-emitting elements.

[0019]

[24] An integrated sealing sheet according to any of [1] to

[23] is placed on the surface of the element-equipped substrate on which the plurality of light-emitting elements are arranged, such that the black curable resin layer is in contact with it. The black curable resin layer and a portion of the transparent curable resin layer are filled between the plurality of light-emitting elements by press bonding. A method for manufacturing a light-emitting electronic component, comprising curing the black curable resin layer and the transparent curable resin layer by heating.

[0020]

[25] The method for manufacturing a light-emitting electronic component according to

[24] , wherein the thickness of the black curable resin layer before pressing is 10 to 95% of the height of the light-emitting element.

[26] The method for manufacturing a light-emitting electronic component according to

[24] or

[25] , wherein the thickness of the transparent curable resin layer before pressing is 10 to 500% of the height of the light-emitting element.

[27] A method for manufacturing a light-emitting electronic component according to any one of

[24] to

[26] , wherein the total thickness of the black curable resin layer and the transparent curable resin layer before bonding is 110 to 550% of the height of the light-emitting element. [Effects of the Invention]

[0021] According to the integrated sealing sheet of the present invention, not only is a light-diffusion-preventing resin filled between multiple light-emitting elements in a single pressing operation, but the sealing process is also completed without preventing light from the light-emitting elements from reaching the viewer. Furthermore, by using this integrated sealing sheet to produce a light-emitting electronic component and a method for producing a light-emitting electronic component, a light-emitting electronic component with sufficient brightness can be easily obtained. [Brief explanation of the drawing]

[0022] [Figure 1] This is a schematic cross-sectional view of an integrated sealing sheet according to one embodiment of the present invention. [Figure 2] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention. [Figure 3] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention. [Figure 4] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention. [Figure 5] This is a schematic diagram illustrating a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention. [Modes for carrying out the invention]

[0023] In this specification and the claims, "main component" means a component that accounts for 50% or more by mass of the total solid content of the entire composition. A numerical range represented by "~" means a numerical range with the numbers before and after the "~" as the lower and upper limits, respectively.

[0024] <Integrated sealing sheet> An integral sealing sheet 1 according to one aspect of the present invention will be described with reference to Figures 1 and 2. As shown in Figure 1, the integral sealing sheet 1 is basically composed of a black curable resin layer 2, a transparent curable resin layer 3, a film layer 4, and a hard coat layer 5 laminated together.

[0025] The integrated sealing sheet 1 of this embodiment may further have a protective film on either or both of the surfaces of the black curable resin layer 2 and the hard coat layer 5 for ease of handling. Figure 1 shows an example in which protective films are present on both the black curable resin layer 2 and the hard coat layer 5. Specifically, the black curable resin layer 2, transparent curable resin layer 3, film layer 4, hard coat layer 5, and second protective film 7 are sequentially laminated onto the first protective film 6.

[0026] As shown in Figure 2, the integrated sealing sheet 1 is used to fill the spaces between multiple light-emitting elements (light-emitting elements 12, 13, and 14) in the element-equipped substrate 10, which has multiple light-emitting elements arranged on the substrate 11. Details of the element-equipped substrate 10 will be described later. The integrated sealing sheet 1 is used such that, during compression, the black curable resin layer 2 is in contact with the element-equipped substrate 10, as shown in Figure 2.

[0027] Until the bonding to the substrate 10 with the element is complete, the black curable resin layer 2 and the transparent curable resin layer 3 of the integrated sealing sheet 1 remain in an uncured state. A specific method for obtaining a light-emitting electronic component by pressing the integrated sealing sheet 1 onto the element-equipped substrate 10 will be described later.

[0028] <Black curable resin layer> The black curable resin layer 2 is a layer that prevents light diffusion between light-emitting elements and improves the contrast of the display. Furthermore, in the thermocompression bonding process, this layer sufficiently fills the spaces between multiple light-emitting elements arranged on the element-equipped substrate 10, preventing appearance defects due to expansion of unfilled voids during the thermocuring process and damage to the light-emitting elements due to external factors in subsequent processes.

[0029] [Lab value] The black curable resin layer 2 preferably has Lab values in the cured state of L: 3 to 15, a: -3 to 5, and b: -3 to 10, and more preferably L: 3 to 10, a: -2 to 4, and b: -2 to 5. By having the Lab values in the cured state within the preferred range, it is possible to further prevent light diffusion between the light-emitting elements and improve the contrast of the display.

[0030] [Total light transmittance] The black curable resin layer 2 has a low total light transmittance in its cured state. Specifically, it is prepared so that the total light transmittance in its cured state is 0 to 50%. The black curable resin layer 2 is preferably prepared so that the total light transmittance in its cured state is 0 to 40%, and more preferably adjusted so that it is 0 to 30%. By having the total light transmittance in the cured state of the black curable resin layer 2 below the upper limit value, it is possible to prevent light diffusion between the light-emitting elements.

[0031] The total light transmittance in this specification can be measured by a haze meter. The total light transmittance in the cured state can be mainly adjusted by the presence or absence of carbon black blending or the blending amount. It can also be adjusted by the thickness of the resin layer and the resin type.

[0032] [Storage elastic modulus] The storage elastic modulus of the black curable resin layer 2 in the uncured state is preferably smaller than the storage elastic modulus of the transparent curable resin layer 3 in the uncured state. The storage elastic modulus of the black curable resin layer 2 in the uncured state is preferably 1.0×10 5 Pa or less at 100 °C, preferably 1.0×10 2 Pa or more and 1.0×10 5 Pa or less, and more preferably 1.0×10 3 Pa or more and 5.0×10 4 Pa or less.

[0033] In its uncured state, the storage modulus of the black curable resin layer 2 at 100°C is below a preferred upper limit, which ensures sufficient fluidity when pressed onto the element-mounted substrate 10. This allows the layer to follow the unevenness of the element-mounted substrate 10 caused by the multiple light-emitting elements, and adequately fill the spaces between the multiple light-emitting elements. In its uncured state, the storage modulus of the black curable resin layer 2 at 100°C is above a preferred lower limit, which prevents uneven pressure distribution during thermocompression bonding and maintains a uniform appearance. Furthermore, it prevents resin leakage outside the specified range and ensures sufficient film thickness after bonding.

[0034] [Curable resin composition] The black curable resin layer 2 is composed of a curable resin composition. Examples of curable resin compositions include a curable resin composition comprising at least one resin selected from epoxy resin, acrylic resin, polyester resin, and polyurethane resin, and a curing agent.

[0035] In particular, epoxy resin compositions are preferred because they can achieve curing at low temperatures and have excellent heat resistance and reliability. In this specification, an epoxy resin composition is a composition mainly comprising an epoxy resin, or a composition mainly comprising an epoxy resin and a curing agent.

[0036] (Epoxy resin) In this specification and in the claims, an epoxy resin is a compound having epoxy groups in its molecule. The epoxy resin used in the present invention is preferably one having two or more epoxy groups in a single molecule. This is because a crosslinked structure can be formed by the reaction with a modified resin having functional groups that can react with epoxy groups, resulting in a cured product with high heat resistance. Furthermore, when an epoxy resin with two or more epoxy groups is used, the degree of crosslinking with the curing agent having functional groups that can react with epoxy groups is sufficient, resulting in a cured product with sufficient heat resistance.

[0037] (Epoxy resin) Examples of epoxy resins include bifunctional epoxy resins having two epoxy groups in the molecule, polyfunctional epoxy resins having three or more epoxy groups in the molecule, and high molecular weight epoxy resins with a weight-average molecular weight of 10,000 or more. Hydrogenated epoxy resins of these types may also be used. In this specification and in the claims, high molecular weight epoxy resins are classified as phenoxy-type epoxy resins, regardless of the number of epoxy groups in the molecule, and are not classified as difunctional epoxy resins or polyfunctional epoxy resins. The weight-average molecular weight of epoxy resin is the molecular weight in polystyrene terms, measured by gel permeation chromatography.

[0038] Examples of epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, or phenoxy type epoxy resins which are high molecular weight versions thereof, and hydrogenated versions thereof; glycidyl ester epoxy resins such as diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, glycidyl p-hydroxybenzoate, diglycidyl tetrahydrophthalate, diglycidyl succinate, diglycidyl adipic acid, diglycidyl sebacate, and triglycidyl trimellitic acid; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, Examples of glycidyl ether epoxy resins include, but are not limited to, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, sorbitol polyglycidyl ether, and polyglycerol polyglycidyl ether; glycidylamine epoxy resins such as triglycidyl isocyanurate and tetraglycidyldiaminodiphenylmethane; and linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil. Novolac-type epoxy resins such as xylene structure-containing novolac epoxy resin, naphthol novolac-type epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, and bisphenol A novolac epoxy resin can also be used.

[0039] Furthermore, examples of epoxy resins that can be used include brominated bisphenol A type epoxy resin, phosphorus-containing epoxy resin, fluorine-containing epoxy resin, dicyclopentadiene skeleton-containing epoxy resin, naphthalene skeleton-containing epoxy resin, anthracene type epoxy resin, tert-butylcatechol type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, biphenyl type epoxy resin, bisphenol S type epoxy resin, and the like.

[0040] As high molecular weight epoxy resins, phenoxy epoxy resins, epoxy-modified polybutadiene, copolymers of glycidyl methacrylate and methyl methacrylate, and modified polymers obtained by epoxy modification of other resins can be used. These epoxy resins may be used individually or in combination of two or more.

[0041] Among the epoxy resins mentioned above, the epoxy resin used in the black curable resin layer 2 is preferably a polyfunctional epoxy resin, from the viewpoint of increasing the crosslinking density after curing. Among polyfunctional epoxy resins, novolac-type epoxy resins are particularly preferred because they allow for the introduction of a moderately flexible skeleton and enable adjustment of flexibility and softening point, making the cured product less susceptible to brittle fracture, improving the stability of the performance of the cured epoxy resin composition for long-term use, increasing the crosslinking density, and improving heat resistance.

[0042] Specific examples of novolac-type epoxy resins include, for example, "YX7700" from Mitsubishi Chemical Corporation, "NC7000L," "XD1000," and "EOCN-1020" from Nippon Kayaku Co., Ltd., "ESN485" from Nippon Steel Chemical & Material Co., Ltd., and "N-690," "N-695," and "HP-7200H" from DIC Corporation.

[0043] The amount of polyfunctional epoxy resin blended in the black curable resin layer 2 is preferably 10 to 99% by mass, more preferably 40 to 95% by mass, and even more preferably 60 to 90% by mass, based on 100% by mass of the total resin solids content of the black curable resin layer 2. If the amount is above the lower limit, the crosslinking density can be increased to impart chemical resistance and heat resistance. If the amount is below the upper limit, the storage modulus during thermocompression bonding can be adjusted, and the fluidity of the black curable resin layer 2 can be ensured.

[0044] The black curable resin layer 2 preferably does not contain high molecular weight epoxy resin, or if it does, it contains it in a smaller amount than the transparent curable resin layer 3. This makes it easier to ensure sufficient fluidity during heat bonding. The amount of high molecular weight epoxy resin blended in the black curable resin layer 2 is preferably less than 50% by mass, more preferably less than 30% by mass, and even more preferably less than 10% by mass, based on 100% by mass of the total resin solids content of the black curable resin layer 2.

[0045] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, it is preferable that the black curable resin layer 2 contains an epoxy resin with a softening or melting point of 100°C or lower. From the viewpoint of handling properties and heat resistance of the cured product, it is more preferable that it contains an epoxy resin with a softening or melting point of 50 to 95°C. By including an epoxy resin having a softening or melting point within the above range, it becomes possible to control the storage modulus.

[0046] The total amount of epoxy resin in the black curable resin layer 2 is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass, based on 100% by mass of the total resin solids content of the black curable resin layer 2. Within this range, it is possible to control the storage modulus and ensure appropriate fluidity during heat bonding. Furthermore, if it is above the lower limit, the heat resistance after curing can be improved.

[0047] (Elastomer) The black curable resin layer 2 preferably contains an elastomer in addition to a resin such as epoxy resin. Including an elastomer makes it easier to control the storage modulus, i.e., control the fluidity.

[0048] As for the elastomer, a thermosetting elastomer, generally called "rubber," is preferred because it provides excellent heat resistance. Examples of thermosetting elastomers include acrylonitrile butadiene rubber (NBR), which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene butadiene rubber, vinyl acetate resin, and silicone resin. Among these, NBR is preferred because it has good compatibility with epoxy resin, allows control of the fluidity of the black curable resin layer 2 around 100°C, and has good adhesion to the transparent curable resin layer 3 and the element-equipped substrate 10.

[0049] The weight-average molecular weight of the elastomer is preferably 100,000 to 1,000,000, more preferably 120,000 to 500,000, and even more preferably 150,000 to 300,000. If the weight-average molecular weight of the elastomer is within the above range, the storage modulus of the black curable resin layer 2 can be controlled, and fluidity during thermal bonding can be ensured. If the weight-average molecular weight of the elastomer is below the above upper limit, the compatibility with the epoxy resin is improved, and the flow during thermal curing can be controlled more effectively.

[0050] In particular, when the black curable resin layer 2 is composed of an epoxy resin composition, it is preferable to include a modified elastomer having functional groups that can react with epoxy groups. If a modified elastomer having functional groups that can react with epoxy groups is present, it also acts as a curing agent for the epoxy resin. Furthermore, because it can react and bond with the epoxy resin, its heat resistance and reliability against thermal shock are improved. In addition, the difference in polarity between the functional groups that can react with the epoxy resin and the resin skeleton has a good effect on dispersibility, and good dispersibility can be obtained when carbon black is included in the black curable resin layer 2.

[0051] Functional groups that can react with epoxy groups include acidic groups such as carboxyl groups, sulfo groups, nitro groups, and phosphoric acid groups, as well as their acid anhydride groups, hydroxyl groups, and amino groups. Among these, acidic groups or acid anhydride groups are preferred because they allow curing at low temperatures and ensure a long pot life, and carboxyl groups or carboxylic acid anhydride groups are particularly preferred.

[0052] In other words, when the black curable resin layer 2 is composed of an epoxy resin composition, it is preferable to contain an acid-modified elastomer having acid groups or acid anhydride groups, and more preferable to contain an acid-modified elastomer having carboxyl groups. It is particularly preferable to contain modified NBR having carboxyl groups.

[0053] As modified NBR having a carboxyl group, carboxylated acrylonitrile rubber into which acrylic acid, methacrylic acid, maleic anhydride, etc. have been introduced is preferred. Examples of commercially available carboxylated acrylonitrile rubber include Nipol® NX775 and Nipol 1072CGJ manufactured by Nippon Zeon Co., Ltd. Two or more modified elastomers having functional groups that can react with epoxy groups may be used in combination.

[0054] It is preferable that the amount of elastomer in the black curable resin layer 2 is greater than the amount of elastomer in the transparent curable resin layer 3. This allows the storage modulus of the black curable resin layer 2 during thermocompression bonding to be adjusted to a suitable range lower than that of the transparent curable resin layer 3, especially in formulations where the black curable resin layer 2 contains a large amount of low molecular weight components such as polyfunctional epoxy, and also suppresses flow during thermosetting. As a result, the black curable resin layer 2 can have sufficient fluidity during thermocompression bonding and suppress flow during thermosetting.

[0055] The amount of elastomer in the black curable resin layer 2 is preferably 0.01 to 90% by mass, more preferably 1 to 80% by mass, and even more preferably 5 to 65% by mass, based on 100% by mass of the total resin solids content of the black curable resin layer 2. Within this range, it is possible to control the storage modulus and ensure appropriate fluidity during thermocompression bonding. Furthermore, above the lower limit, the dispersibility of carbon black improves. In addition, film formation is improved, and the film thickness distribution can be narrowed when coating and forming a film with the epoxy resin composition.

[0056] (Hardening agent) When the black curable resin layer 2 is composed of an epoxy resin composition, it may contain other curing agents for epoxy resins other than modified elastomers having functional groups that can react with epoxy groups. Examples of other curing agents include known curing agents such as phenolic curing agents, acid anhydride curing agents, and amine curing agents. Other hardening agents may be used in combination of two or more types.

[0057] (curing catalyst) If the black curable resin layer 2 is composed of an epoxy resin composition, it may also contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of curing catalysts include imidazole-based, tertiary amine-based, and phosphorus compound-based catalysts. Among these, imidazole-based catalysts are preferred because they have good compatibility with epoxy resins and are less likely to cause yellowing. Among imidazole-based curing catalysts, those having a cyanoethyl group are particularly preferred because they dissolve easily in epoxy resins.

[0058] The amount of curing catalyst added is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, per 100 parts by mass of the total resin solids of the black curable resin layer 2. Within this range, curing can proceed sufficiently, and the pot life of the integrated sealing sheet 1 can be ensured. Two or more curing catalysts may be used in combination.

[0059] (Black pigment or black dye) The black curable resin layer 2 is colored black. For coloring, it is preferable to include a black pigment or black dye, more preferably a black pigment, and even more preferably carbon black. The black coloring provides light diffusion prevention between the multiple light-emitting elements of the element-equipped substrate 10.

[0060] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and particularly preferably 10 to 100 nm. Note that the particle size refers to the average particle size and can be determined using a dynamic light scattering measurement device. An example of a dynamic light scattering measurement device is the NanotracWave II UT151 manufactured by Microtrac-Bell.

[0061] As the carbon black, one or more known types of carbon black, such as gas black, channel black, furnace black, thermal black, and lamp black, can be used. Resin-coated carbon black may also be used. Furthermore, carbon nanofibers and carbon nanotubes may be used.

[0062] Among these, gas black is preferred because it has a large amount of surface functional groups, high dispersibility, and exhibits sufficient light diffusion prevention function with only a small amount added. Furthermore, when the black curable resin layer 2 contains a modified elastomer having functional groups that can react with epoxy resin, the interaction between the surface functional groups of gas black and the functional groups of the modified elastomer having functional groups that can react with epoxy resin further enhances dispersibility, ensuring good light diffusion prevention and coating stability.

[0063] The amount of carbon black added is preferably 0.1 to 15% by mass, and more preferably 1.0 to 10% by mass, based on the total solid content of the black curable resin layer 2. Sufficient light shielding can be obtained if the amount of carbon black added is equal to or greater than the lower limit. If the amount of carbon black added exceeds the upper limit, the thixotropy of the black curable resin layer 2 increases, reducing its fluidity during thermocompression bonding, and making it impossible to adequately fill the spaces between the multiple light-emitting elements of the substrate 10 with the elements.

[0064] (Other ingredients) The black curable resin layer 2 may contain inorganic fillers to improve flame retardancy and heat resistance, and to adjust the refractive index. The black curable resin layer 2 may further contain, if necessary, resins other than epoxy resin and elastomer, thickeners, defoamers and / or leveling agents, coupling agents and other adhesion-enhancing agents, and flame retardants.

[0065] <Transparent curable resin layer> The transparent curable resin layer 3 is a layer used in the thermocompression bonding process to sufficiently press the black curable resin layer 2 between the multiple light-emitting elements arranged on the element-equipped substrate 10.

[0066] [Total light transmittance] The transparent curable resin layer 3 is preferably prepared so that its total light transmittance in the cured state is 30 to 99%. More preferably, the transparent curable resin layer 3 is prepared so that its total light transmittance in the cured state is 35 to 95%, and even more preferably so that it is 40 to 90%.

[0067] Because the total light transmittance of the transparent curable resin layer 3 in its cured state is above the lower limit, even if the transparent curable resin layer 3 remains on top of the light-emitting element in its cured state, the reach of light to the viewer is not obstructed.

[0068] [Storage modulus] Preferably, the storage modulus of the transparent curable resin layer 3 in its uncured state is greater than the storage modulus of the black curable resin layer 2 in its uncured state. At 100°C, it is preferable that the storage modulus of the transparent curable resin layer 3 in its uncured state is greater than the storage modulus of the black curable resin layer 2 in its uncured state. Furthermore, at 150°C, it is preferable that the storage modulus of the transparent curable resin layer 3 in its uncured state is greater than the storage modulus of the black curable resin layer 2 in its uncured state.

[0069] Preferably, the storage modulus of the transparent curable resin layer 3 in its uncured state is greater than the storage modulus of the black curable resin layer 2 at temperatures between 100°C and 150°C. Furthermore, if the storage modulus of the transparent curable resin layer 3 in its uncured state is greater than the storage modulus of the black curable resin layer 2 in its uncured state at 100°C and 150°C, then typically the storage modulus of the transparent curable resin layer 3 in its uncured state is greater than the storage modulus of the black curable resin layer 2 in its uncured state across the entire temperature range from 100°C to 150°C.

[0070] Preferably, the storage modulus of the transparent curable resin layer 3 in its uncured state is greater than the storage modulus of the black curable resin layer 2 in its uncured state. The storage modulus of the transparent curable resin layer 3 in its uncured state is 1.0 × 10⁻⁶ at 100°C.5 It is preferable that it is less than or equal to Pa, and 1.0 × 10 4 Pa or more, 1.0×10 7 It is preferable that it is less than or equal to Pa, 5.0 × 10 4 Pa or more, 5.0×10 6 It is more preferable that the value be less than or equal to Pa.

[0071] In its uncured state, the storage modulus of the transparent curable resin layer 3 at 100°C is below a preferred upper limit, which provides sufficient fluidity that does not hinder the flow of the black curable resin layer 2 when pressed onto the element-mounted substrate 10. This allows the layer to follow the irregularities of the element-mounted substrate 10 caused by the multiple light-emitting elements and adequately fill the spaces between them.

[0072] If the storage modulus of the transparent curable resin layer 3 at 100°C exceeds a preferred upper limit, the fluidity of the transparent curable resin layer 3 becomes insufficient, making it impossible to adequately press the black curable resin layer 2 between multiple light-emitting elements. Furthermore, cracks may occur in the transparent curable resin layer 3 during thermocompression bonding, leading to a higher likelihood of crack-like defects.

[0073] In its uncured state, the storage modulus of the transparent curable resin layer 3 at 100°C is above a preferred lower limit. This makes it easier to avoid the high fluidity of the transparent curable resin layer 3, which can cause the surface of the transparent curable resin layer 3 to become uneven after thermal bonding to match the light-emitting element, resulting in poor appearance, and also helps to avoid appearance defects such as streaks occurring during thermal curing.

[0074] In its uncured state, the storage modulus of the transparent curable resin layer 3 is 1.0 × 10⁻⁶ at 150°C. 4 Preferably Pa or higher, 1.0 × 10 4 ~5.0×10 7 It is preferably Pa, 1.0 × 10 5 ~5.0×10 6 It is more preferable that it be Pa. If the storage modulus of the transparent curable resin layer 3 at 150°C exceeds a preferred upper limit in the uncured state, cracks are more likely to occur due to curing shrinkage during thermal curing. If the storage modulus of the transparent curable resin layer 3 at 150°C is above a preferred lower limit in the uncured state, flow during thermal curing can be suppressed, post-curing appearance defects such as repellency can be suppressed, and furthermore, problems are less likely to occur when etching is performed in a subsequent process.

[0075] In the uncured state, the storage modulus of the transparent curable resin layer 3 at 100°C is preferably 10 to 1000 times, and more preferably 30 to 500 times, the storage modulus of the black curable resin layer 2. In the uncured state, the storage modulus of the transparent curable resin layer 3 at 150°C is preferably 5 to 10000 times, and more preferably 10 to 1000 times, the storage modulus of the black curable resin layer 2. If the storage modulus of the transparent curable resin layer 3 is greater than that of the black curable resin layer 2 at 100°C and 150°C, then usually the storage modulus of the transparent curable resin layer 3 is greater than that of the black curable resin layer 2 across the entire range from 100°C to 150°C.

[0076] [Curable resin composition] The transparent curable resin layer 3 is composed of a curable resin composition. Similar to the black curable resin layer 2, the curable resin composition may include at least one resin selected from epoxy resin, acrylic resin, polyester resin, and polyurethane resin, and a curing agent. Among these, an epoxy resin composition is preferred because it enables curing at low temperatures and exhibits excellent heat resistance and reliability.

[0077] (Epoxy resin) Examples of epoxy resins used in the transparent curable resin layer 3 include those of the same type as those used in the black curable resin layer 2. From the viewpoint of imparting an appropriate viscosity during compression to the transparent curable resin layer 3, it is preferable that the transparent curable resin layer 3 contains a high molecular weight epoxy resin with a weight-average molecular weight of 10,000 to 100,000. From the viewpoint of good compatibility with other resin components and the ability to dissolve without mixing in high-boiling-point solvents that may remain in the dry film after drying, it is more preferable that the transparent curable resin layer 3 contains a high molecular weight epoxy resin with a weight-average molecular weight of 10,000 to 35,000.

[0078] The epoxy resin used in the transparent curable resin layer 3 includes a high molecular weight epoxy resin with a weight-average molecular weight of 10,000 to 100,000. Because it has an appropriate viscosity when heated, the storage modulus of the transparent curable resin layer 3 in the range of 100°C to 150°C can be adjusted to a desirable range. The high molecular weight epoxy resin used in the transparent curable resin layer 3 is preferably a phenoxy-type epoxy resin because it has good compatibility with other epoxy resins.

[0079] Phenoxy epoxy resins have a relatively large molecular weight compared to other epoxy resins and possess a suitable viscosity when heated, allowing the storage modulus of the transparent curable resin layer 3 in the 100°C to 150°C range to be adjusted to a desirable range. Furthermore, unlike other thermoplastic resins such as polyester, phenoxy epoxy resins can be cured as epoxy resins, allowing for increased crosslinking density and maintaining the heat resistance and reliability of the cured product's performance over long periods of use. From the viewpoint of ensuring sufficient storage modulus to press the black curable resin layer 2 during thermocompression bonding, it is preferable that the glass transition temperature of the phenoxy epoxy resin used in the transparent curable resin layer 3 be 100°C or higher.

[0080] Specific examples of phenoxy epoxy resins include, for example, "1256," "YX7200," "YX8100," and "YX7180" from Mitsubishi Chemical Corporation, "YP-50," "YP-50S," and "YP-70" from Nippon Steel Chemical & Material Corporation, and "N-690," "H-157," and "EXA-192" from DIC Corporation.

[0081] The amount of high molecular weight epoxy resin in the transparent curable resin layer 3 is preferably 30 to 80% by mass, more preferably 40 to 70% by mass, and even more preferably 45 to 60% by mass, based on 100% by mass of the total resin solids content of the transparent curable resin layer 3. The same applies to the preferred amount of phenoxy-type epoxy resin in the transparent curable resin layer 3.

[0082] Within the above range, the storage modulus can be controlled, ensuring that the storage modulus is sufficient to press the transparent curable resin layer 3 during thermocompression bonding. Furthermore, flow during thermosetting can be suppressed, reducing the appearance defects after curing such as repellency, and minimizing interference when etching is performed in subsequent processes. In addition, toughness is improved, making it less likely for crack-like defects to occur during thermocompression bonding. Furthermore, if the value is below the above upper limit, the crosslinking density of the transparent curable resin layer 3 in the cured state can be increased, improving heat resistance and chemical resistance.

[0083] Furthermore, it is preferable that the epoxy resin used in the transparent curable resin layer 3 includes a polyfunctional epoxy resin. By increasing the crosslinking density of the polyfunctional epoxy resin, the stability of the performance of the cured epoxy resin composition for long-term use is further improved, and the heat resistance is also improved. In addition, because it has a lower viscosity in the range of 100°C to 150°C than phenoxy-type epoxy resin, the storage modulus of the transparent curable resin layer 3 can be adjusted by combining it with a phenoxy-type epoxy resin.

[0084] Specific examples of polyfunctional epoxy resins include, for example, "YX7700," "157S70," and "1032S60" from Mitsubishi Chemical Corporation, "NC7000L," "XD1000," and "EOCN-1020" from Nippon Kayaku Co., Ltd., "ESN485" from Nippon Steel Chemical & Material Co., Ltd., and "N-690," "N-695," and "HP-7200H" from DIC Corporation.

[0085] The amount of polyfunctional epoxy resin blended in the transparent curable resin layer 3 is preferably 90% by mass or less, more preferably 10 to 80% by mass, and even more preferably 35 to 70% by mass, based on 100% by mass of the total resin solids content of the transparent curable resin layer 3. Within this range, the storage modulus of the transparent curable resin layer 3 during thermocompression bonding can be controlled, and heat resistance and chemical resistance can be imparted in the cured state.

[0086] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, it is preferable that the transparent curable resin layer 3 contains an epoxy resin with a softening or melting point of 120°C or lower. From the viewpoint of handling properties and heat resistance of the cured product, it is more preferable that it contains an epoxy resin with a softening or melting point of 50 to 105°C. By including an epoxy resin having a softening or melting point within the above range, it becomes possible to control the storage modulus.

[0087] The total amount of epoxy resin in the transparent curable resin layer 3 is preferably 10 to 100% by mass, more preferably 30 to 99% by mass, and even more preferably 50 to 95% by mass, based on 100% by mass of the total resin solids content of the transparent curable resin layer 3. Within this range, it is possible to control the storage modulus and ensure the storage modulus necessary to press the black curable resin layer 2 during thermal bonding. Furthermore, it is possible to suppress flow during thermal curing, which reduces appearance defects after curing such as repulsion, and also minimizes interference when etching is performed in a subsequent process. Moreover, if the value is above the lower limit, the heat resistance in the cured state is improved.

[0088] (Elastomer) The transparent curable resin layer 3 preferably contains an elastomer in addition to a resin such as epoxy resin. Including an elastomer makes it easier to control the storage modulus. Examples of elastomers include those of the same type as those used for the black curable resin layer 2. Among these, NBR is preferred because it has good compatibility with epoxy resin, can increase the storage modulus of the transparent curable resin layer 3 at around 150°C, and has good adhesion to the black curable resin layer 2. The preferred weight-average molecular weight of the elastomer is also the same as that of the black curable resin layer 2.

[0089] In particular, when the transparent curable resin layer 3 is composed of an epoxy resin composition, it is preferable to include a modified elastomer having functional groups that can react with epoxy groups. If a modified elastomer having functional groups that can react with epoxy groups is present, it also acts as a curing agent for the epoxy resin. Furthermore, because it can react and bond with the epoxy resin, its heat resistance and reliability against thermal shock are improved. In addition, the difference in polarity between the functional groups that can react with the epoxy resin and the resin skeleton has a good effect on dispersibility, and good dispersibility can be obtained when carbon black is included in the transparent curable resin layer 3.

[0090] Functional groups that can react with epoxy groups include those of the same type as those in the black curable resin layer 2. Among these, acid groups or acid anhydride groups are preferred, and carboxyl groups or carboxylic acid anhydride groups are particularly preferred, as they allow curing at low temperatures and ensure a long pot life.

[0091] When the transparent curable resin layer 3 is composed of an epoxy resin composition, it is particularly preferable that it contains modified NBR having a carboxyl group. Examples of modified NBR containing carboxyl groups include those similar to those of the black curable resin layer 2. Two or more modified elastomers having functional groups that can react with epoxy groups may be used in combination.

[0092] The amount of elastomer in the transparent curable resin layer 3 is preferably 0 to 50% by mass, more preferably 1 to 70% by mass, and even more preferably 5 to 50% by mass, based on 100% by mass of the total resin solids content of the transparent curable resin layer 3. Within this range, the storage modulus can be controlled. If it is below the upper limit, the storage modulus that compresses the black curable resin layer during heat bonding can be ensured. Furthermore, flow during heat curing can be suppressed, preventing post-curing appearance defects such as repulsion, and minimizing problems when etching is performed in a subsequent process. Furthermore, if it is above the lower limit, the dispersibility of carbon black is improved. In addition, film formation is improved, and the film thickness distribution when coating and forming an epoxy resin composition can be narrowed.

[0093] (Hardening agent) When the transparent curable resin layer 3 is composed of an epoxy resin composition, it may contain other curing agents for epoxy resins other than modified elastomers having functional groups that can react with epoxy groups. Examples of other curing agents include those similar to those used for the black curable resin layer 2. Two or more of these other curing agents may be used in combination.

[0094] (curing catalyst) If the transparent curable resin layer 3 is composed of an epoxy resin composition, it may also contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of curing catalysts include those similar to those used in the transparent curable resin layer 3, and preferred embodiments are also similar.

[0095] The amount of curing catalyst added is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, per 100 parts by mass of the total resin solids of the transparent curable resin layer 3. Within this range, curing can proceed sufficiently, and the pot life of the integrated sealing sheet 1 can be ensured. Two or more curing catalysts may be used in combination.

[0096] (Other ingredients) The transparent curable resin layer 3 may contain a black pigment or black dye to suppress uneven light emission and color unevenness.

[0097] From the viewpoint of increasing the total light transmittance, if the transparent curable resin layer 3 contains carbon black, the amount of carbon black added is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and even more preferably 0.1 parts by mass or less, per 100 parts by mass of total resin solids. The transparent curable resin layer 3 may also optionally contain resins other than epoxy resin and elastomer, thickeners, defoamers and / or adhesion-enhancing agents such as leveling agents and coupling agents, and flame retardants.

[0098] <Film layer> The film layer 4 is a layer that protects the light-emitting element from external physical shocks, humidity, moisture, etc.

[0099] [Total light transmittance] The film layer 4 is preferably prepared to have a total light transmittance of 30-99%. The film layer 4 is preferably prepared to have a total light transmittance of 35-95%, and more preferably to have a total light transmittance of 40-95%. Because the total light transmittance of film layer 4 is above the lower limit, the reach of light to the viewer is not obstructed.

[0100] [Storage modulus] The storage modulus of film layer 4 is 1.0 × 10⁻⁶. 9 Pa or more, 1.0×10 10 It is preferable that it is less than or equal to Pa, and 2.0 × 10 9 Pa or higher, 9.0×10 9 It is preferable that it is less than or equal to Pa, 3.0 × 10 9 Pa or higher, 8.0×10 9 It is more preferable that the value be less than or equal to Pa.

[0101] By having the storage modulus of the film layer 4 at 100°C be below a preferred upper limit, a moderate flexibility is obtained that does not hinder the flow of the black curable resin layer 2 when pressed onto the element-equipped substrate 10, allowing it to follow the unevenness of the element-equipped substrate 10 caused by multiple light-emitting elements and sufficiently fill the spaces between the multiple light-emitting elements. By ensuring that the storage modulus of the film layer 4 at 100°C is above a preferred lower limit, pressure can be reliably transmitted to the curable resin layer without deformation during bonding to the element-equipped substrate 10, preventing defects such as cracking or deformation in the hard coat layer.

[0102] [resin] The film layer 4 may be composed of a thermoplastic resin or a thermosetting resin. Examples of resins that make up the film layer 4 include polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, polycarbonate resin, triacetylcellulose resin, polymethylpentene resin, phenoxy resin, syndiotactic polystyrene resin, and polyimide resin. It is preferable that the film layer 4 contains at least one resin selected from polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, and polycarbonate resin, considering factors such as heat resistance, weather resistance, availability, and cost. The inclusion of these resins prevents deformation during compression. The film layer 4 may contain a black pigment or black dye to suppress uneven light emission and color unevenness.

[0103] [film thickness] The thickness of the film layer 4 is preferably 10 to 250 μm, more preferably 20 to 200 μm, and even more preferably 25 to 150 μm. If the thickness of the film layer 4 is above a preferred lower limit, it has sufficient strength to protect the element. If the thickness of the film layer 4 is below a preferred upper limit, visibility is improved and costs can be reduced.

[0104] <Hard coat layer> [hardness] The hard coat layer 5 is a layer that protects the light-emitting electronic component from scratches. The pencil hardness of the surface of the hard coat layer 5 is preferably H or higher, more preferably 2H or higher, and even more preferably 3H or higher.

[0105] [Surface roughness] The surface roughness Ra of the hard coat layer 5 surface is preferably 0.1 to 1 μm, more preferably 0.2 to 1 μm, and even more preferably 0.3 to 1 μm. By ensuring the surface roughness of the hard coat layer 5 is above a preferred lower limit, the reflectivity of the surface of the hard coat layer 5 can be reduced. By ensuring the surface roughness of the hard coat layer 5 is below a preferred upper limit, manufacturing becomes easier.

[0106] [Total light transmittance] The hard coat layer 5 is preferably prepared to have a total light transmittance of 30-99%, more preferably 50-99%, and even more preferably 60-99%. Because the total light transmittance of the hard coat layer 5 is above the lower limit, the reach of light to the viewer is not obstructed.

[0107] [Thermosetting resin] The hard coat layer 5 is preferably composed of a thermosetting resin. Examples of thermosetting resins that make up the hard coat layer 5 include acrylic resin, urethane resin, silicone resin, melamine resin, and may contain one or more of these.

[0108] [Fine particles] The hard coat layer 5 preferably contains fine particles. Inorganic fine particles and / or organic fine particles can be used as the fine particles. Examples of inorganic microparticles include silica microparticles and titanium microparticles. Examples of organic microparticles include polymethyl methacrylate resin (PMMA resin) and urethane resin. Among these, silica fine particles are preferred. By including fine particles, it is possible to adjust the surface roughness and improve the surface hardness.

[0109] [film thickness] The thickness of the hard coat layer 5 is preferably 1 to 20 μm, more preferably 2 to 10 μm, and even more preferably 3 to 8 μm. If the thickness of the hard coat layer 5 is above a preferred lower limit, sufficient hardness can be ensured. If the thickness of the hard coat layer 5 is below a preferred upper limit, problems such as curling will not occur.

[0110] <Optical properties of the three layers> [Total light transmittance] The total light transmittance of the three layers, consisting of the transparent curable resin layer 3, the film layer 4, and the hard coat layer 5, is preferably 30-95%, more preferably 35-95%, and even more preferably 40-95%. Because the total light transmittance of the three layers is above the lower limit, the reach of light to the viewer is not obstructed.

[0111] [Reflectance] The reflectance measured by a gloss meter (JIS-Z-8741) on the hard coat layer 5 side is preferably 1 to 50%, more preferably 3 to 30%, and even more preferably 5 to 25%. Manufacturing is easier if the reflectivity of the hard coat layer 5 is above the lower limit. The visibility of the display is improved if the reflectivity of the hard coat layer 5 is below a desirable upper limit.

[0112] <Protective film> The first protective film 6 and the second protective film 7 (hereinafter, the first protective film 6 and the second protective film 7 may be collectively referred to simply as "protective film") serve to protect the integrated sealing sheet 1, and can also be used as films to which a coating liquid of the curable resin composition is applied when forming the integrated sealing sheet 1.

[0113] As protective films, for example, films made of thermoplastic resins such as polyester films like polyethylene terephthalate and polyethylene naphthalate, polyimide films, polyamide-imide films, polyethylene films, polytetrafluoroethylene films, polypropylene films, and polystyrene films, as well as surface-treated paper, can be used.

[0114] Among these, polyester film is suitably used from the viewpoint of heat resistance, mechanical strength, and ease of handling. The thickness of the protective film is not particularly limited, but is generally selected appropriately in the range of 10 to 150 μm depending on the application. The surface on which the resin layer of the protective film is provided may be treated with a release agent.

[0115] <Method for manufacturing an integrated sealing sheet> To obtain the integrated sealing sheet 1, first, a coating liquid of a curable resin composition for the black curable resin layer 2 is applied to the first protective film 6 and dried, and a coating liquid of a curable resin composition for the transparent curable resin layer 3 is applied to the side opposite the hard coat layer of a film layer 4 that has a hard coat layer 5 formed on it in advance and dried.

[0116] Subsequently, these are stacked so that the transparent curable resin layer 3 and the black curable resin layer 2 are in contact with each other, and laminated to obtain a laminate in which the black curable resin layer 2, the transparent curable resin layer 3, the film layer 4, and the hard coat layer 5 are sequentially laminated on the first protective film 6. A second protective film 7 may be laminated onto the surface of this hard coat layer 5 as needed.

[0117] A film layer 4 with a hard coat layer 5 formed on it can be obtained by applying a hard coat coating agent to the surface of the film layer 4 and curing it. Methods for applying coating agents for hard coat layers include various types of coaters such as die coaters, gravure coaters, roll coaters, curtain flow coaters, spin coaters, bar coaters, reverse coaters, kiss coaters, fountain coaters, rod coaters, air doctor coaters, knife coaters, blade coaters, cast coaters, and screen coaters. Curing methods for hard coat layers include thermal curing, ultraviolet curing, and electron beam curing.

[0118] The coating liquid of the curable resin composition preferably contains an amount of organic solvent that results in a viscosity that allows for application without hindrance. There are no particular restrictions on organic solvents, but examples include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents. Specifically, these include ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; and ethyl acetate, butyl acetate, isobutyl acetate, and ethyl acetate. Esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum-based solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha; and other substances such as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine oil. When incorporating carbon black into the coating solution, either carbon black powder or carbon black dispersion may be added.

[0119] Examples of coating methods for curable resin compositions include various coaters such as die coaters, gravure coaters, roll coaters, curtain flow coaters, spin coaters, bar coaters, reverse coaters, kiss coaters, fountain coaters, rod coaters, air doctor coaters, knife coaters, blade coaters, cast coaters, and screen coaters. The drying temperature is preferably 60 to 160°C, preferably 80 to 130°C, and more preferably 90 to 120°C.

[0120] The lamination temperature is preferably 20 to 120°C, more preferably 30 to 100°C, and even more preferably 40 to 80°C. By setting the lamination temperature above the preferred lower limit, sufficient adhesion between the black curable resin layer 2 and the transparent curable resin layer 3 can be ensured, allowing for handling even before curing. Furthermore, by setting the lamination temperature below the preferred upper limit, the formation of air bubbles and wrinkles can be prevented. Lamination can be performed using a roll laminator, press, vacuum press, etc.

[0121] <Substrate with this component> As shown in Figure 2, the element-equipped substrate 10 has multiple light-emitting elements arranged on the substrate 11. In Figure 2, etc., a schematic representation is shown of the portion where three light-emitting elements (light-emitting element 12, light-emitting element 13, and light-emitting element 14) are arranged.

[0122] There are no limitations on the material of the substrate 11, but known printed circuit boards can be suitably used. Examples of known printed circuit boards include glass epoxy substrates, fluororesin substrates, and ceramic substrates.

[0123] The light-emitting element is typically a light-emitting diode. The present invention is particularly suitable for cases where the light-emitting element is extremely small. For example, light-emitting diodes with a height of 1000 nm to 200 μm and a side length of 0.001 to 0.5 mm can be used. For the substrate 10 with elements to obtain mini LEDs or micro LEDs, three colored light-emitting diodes (R, G, and B) can be used as light-emitting elements, or a blue light-emitting diode can be used as a light-emitting element.

[0124] <Manufacturing method for light-emitting electronic components> The present invention provides a method for manufacturing a light-emitting electronic component, which involves placing the integrated sealing sheet 1 of the present invention on the surface of a substrate with multiple light-emitting elements arranged on it, such that its black curable resin layer 2 is in contact with the surface of the substrate with multiple light-emitting elements arranged on it, pressing and compressing it to fill the spaces between the multiple light-emitting elements with the black curable resin layer 2 and a portion of the transparent curable resin layer 3, and then heating it to cure the black curable resin layer 2 and the transparent curable resin layer 3. The following describes a method for manufacturing a light-emitting electronic component according to one embodiment of the present invention, with reference to Figures 2 to 4.

[0125] In the manufacturing method of this embodiment, first, as shown in Figure 2, an integrated sealing sheet 1, on which the first protective film 6 has been peeled off to expose the black curable resin layer 2, is placed on the surface of the element-equipped substrate 10 on which the light-emitting elements 12, 13, and 14 are arranged, so that the black curable resin layer 2 is in contact with the sheet.

[0126] At this time, that is, before pressing, the thickness of the black curable resin layer 2 is preferably 10 to 95% of the height of the light-emitting element. The lower limit is more preferably 15% or more, and even more preferably 30% or more. The upper limit is more preferably 85% or less, even more preferably 65% ​​or less, and particularly preferably 55% or less.

[0127] If the thickness of the black curable resin layer 2 is 10% or more of the height of the light-emitting element, it will have sufficient function in preventing light diffusion between the light-emitting elements. Also, if the black curable resin layer 2 has a relatively low storage modulus and ensures fluidity, the resin can be sufficiently filled between the light-emitting elements. If the thickness of the black curable resin layer 2 is less than 15% of the height of the light-emitting element, crack-like defects may occur on the surface if the fluidity of the transparent curable resin layer 3 is relatively low. If the thickness of the black curable resin layer 2 is 30% or more of the height of the light-emitting element, the black curable resin layer 2, which has a light diffusion prevention function, can be appropriately filled between the light-emitting elements.

[0128] If the thickness of the black curable resin layer 2 is 95% or less of the height of the light-emitting element, leakage of the black curable resin layer to the outside during thermocompression bonding can be prevented, and the light from the light-emitting element will not be obstructed from reaching the viewer. If the thickness of the black curable resin layer 2 exceeds 85% of the height of the light-emitting element, variations in the thickness of the black color may be observed due to fluctuations in the film thickness of the black curable resin layer 2 that has flowed after pressing. If the thickness of the black curable resin layer 2 is 55% or less of the height of the light-emitting element, the black curable resin layer 2, which has a light diffusion prevention function, can be appropriately filled between the light-emitting elements.

[0129] The thickness of the transparent curable resin layer 3 before pressure bonding is preferably 10 to 500% of the height of the light-emitting element. The lower limit is more preferably 40% or more, and even more preferably 50% or more. The upper limit is more preferably 200% or less, and even more preferably 150% or less.

[0130] If the thickness of the transparent curable resin layer 3 is 10% or more of the height of the light-emitting element, it is likely to function as a sealing layer covering the light-emitting element. Furthermore, if the transparent curable resin layer 3 has a relatively high storage modulus and suppressed fluidity, it will not flow together with the black curable resin layer 2 during thermal curing, making surface defects less likely. If the thickness of the transparent curable resin layer 3 is less than 40% of the height of the light-emitting element, the range of permissible flow of the transparent curable resin layer 3 is insufficient, and crack-like defects may occur on the surface. If the thickness of the transparent curable resin layer 3 is 50% or more of the height of the light-emitting element, it is likely to function as a sealing layer covering the light-emitting element. Furthermore, if the transparent curable resin layer 3 has a relatively high storage modulus and suppressed fluidity, the black curable resin layer 2 can be sufficiently pressed into place.

[0131] The total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 before bonding is preferably 110-550%, 120-400%, and more preferably 150-300% of the height of the light-emitting element. If the total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 is equal to or greater than the lower limit value above relative to the height of the light-emitting element, the integrated sealing sheet 1 can be sufficiently embedded between the light-emitting elements. If the total thickness of the black curable resin layer 2 and the transparent curable resin layer 3 is less than or equal to the above upper limit relative to the height of the light-emitting element, thickness variations are less likely to occur during bonding, and surface defects are less likely to occur.

[0132] The ratio of the thickness of the black curable resin layer 2 before pressing to the total thickness of the transparent curable resin layer 3 and the black curable resin layer 2 before pressing is preferably 10-90%, more preferably 15-70%, and even more preferably 20-50%. If the ratio of the thickness of the black curable resin layer 2 before bonding to the total thickness of the transparent curable resin layer 3 and the black curable resin layer 2 is greater than or equal to the lower limit above, the blackness can be increased and the contrast of the display can be sufficiently improved. If it is less than or equal to the upper limit above, less of the black curable resin layer 2 will remain on the light-emitting element during bonding, and the brightness can be sufficiently improved.

[0133] In the state shown in Figure 2, the sheet is heat-pressed to embed a portion of the black curable resin layer 2 and the transparent curable resin layer 3 of the integrated sealing sheet 1 between the light-emitting elements as shown in Figure 3. In this case, it is preferable that the black curable resin layer 2 has a relatively low storage modulus and ensures fluidity, as this allows it to easily follow the irregularities caused by the light-emitting elements, fill the spaces between them, and not remain on the light-emitting elements.

[0134] The temperature for thermocompression bonding is preferably 80 to 120°C, and more preferably 90 to 110°C. Setting the temperature for thermocompression bonding to 80°C or higher makes it easier to ensure the fluidity of the integrated sealing sheet 1. Setting the temperature for thermocompression bonding to 120°C or lower makes it less likely to damage the light-emitting element. Setting the temperature for thermocompression bonding to 90 to 110°C allows for more precise control of fluidity, suppressing the occurrence of unevenness and crack-like defects.

[0135] The pressure used in thermocompression bonding is preferably 0.05 to 1.0 MPa, and more preferably 0.1 to 0.5 MPa. By setting the pressure in thermocompression bonding above the preferred lower limit, no black curable resin layer 2 remains on the light-emitting element, and the light from the light-emitting element does not obstruct the viewer. By setting the pressure below the preferred upper limit, damage to the light-emitting element is minimized. Thermocompression bonding is preferably performed using a vacuum press capable of forming under vacuum. This makes it easier to avoid defects caused by air being incorporated into the resulting light-emitting electronic component.

[0136] After pressing, as shown in Figure 4, the second protective film 7 is peeled off and then heat-cured, so that as shown in Figure 5, the black curable resin layer 2 of the integrated sealing sheet 1 becomes a cured black curable resin product 22 (cured black curable resin layer 2), and the transparent curable resin layer 3 becomes a cured transparent curable resin product 23 (cured transparent curable resin layer 3). This gives rise to the light-emitting electronic component 30.

[0137] The curing temperature is 100 to 160°C, preferably 120 to 150°C. By setting the curing temperature to 100°C or higher, the integrated sealing sheet 1 can be cured. By setting the curing temperature to 120°C or higher, the curing time of the integrated sealing sheet 1 can be shortened. Furthermore, by setting the curing temperature below the above upper limit, damage to the light-emitting element is less likely to occur.

[0138] The curing time depends on the curing temperature, but is preferably 30 to 360 minutes, and more preferably 45 to 180 minutes. At the curing temperature, it is preferable that the transparent curable resin layer 3 has a relatively high storage modulus and suppressed fluidity, as this suppresses defects in appearance after curing.

[0139] This results in a light-emitting electronic component 30 in which an integrated sealing sheet 1 is pressed onto the surface of an element-equipped substrate 10, on which multiple light-emitting elements are arranged on a substrate 11, and on which the light-emitting elements are arranged. In the resulting light-emitting electronic component 30, the black curable resin layer 2 and the transparent curable resin layer 3 are cured, and a portion of the black curable resin layer 2 and the transparent curable resin layer 3 are filled between multiple light-emitting elements. [Examples]

[0140] The present invention will be described in detail below with reference to examples, but the present invention is not limited to the descriptions in these examples.

[0141] <Raw materials> The details of the raw materials used in each example and comparative example are as follows. [Epoxy resin] jER 1032H60: Manufactured by Mitsubishi Chemical Corporation, high-purity polyfunctional epoxy resin (solid), softening point 62°C, epoxy equivalent 168 g / eq. HP-7200H: Manufactured by DIC Corporation, cyclopentadiene novolac type polyfunctional epoxy resin (solid), softening point 82°C, epoxy equivalent 227 g / eq. jER YX7200B35: Manufactured by Mitsubishi Chemical Corporation, phenoxy epoxy resin (MEK solution, solid content 35% by mass), glass transition temperature 150°C, epoxy equivalent 8781 g / eq., weight-average molecular weight 35,000. jER 828EL: Manufactured by Mitsubishi Chemical Corporation, bisphenol A type bifunctional epoxy resin (liquid), epoxy equivalent 186 g / eq. NC-3000H: Manufactured by Nippon Kayaku Co., Ltd., bisphenyl novolac type polyfunctional epoxy resin (solid), softening point 71°C, epoxy equivalent 290 g / eq.

[0142] [Elastomer] • NX775: Manufactured by Zeon Corporation, carboxy-modified nitrile rubber, weight-average molecular weight 208,000. • Teisan Resin SG-80H: Manufactured by Nagase ChemteX Corporation, acrylic ester copolymer resin (functional groups: epoxy group, amide group), MEK cut product, solids content 18% by mass, weight-average molecular weight 850,000.

[0143] [resin] • HF-1M: HF-1M manufactured by Meiwa Kasei Co., Ltd., a phenol novolac resin.

[0144] [Curing catalyst] • 2PZ-CN: Manufactured by Shikoku Chemicals Co., Ltd., 1-cyanoethyl-2-phenylimidazole. • 2E4MZ: Manufactured by Shikoku Chemicals Co., Ltd., 2-ethyl-4-methylimidazole.

[0145] [Carbon Black] • Special Black 4: Gas black manufactured by ORION ENGINEERED CARBONS.

[0146] [Additives] • KBM-403: Epoxysilane coupling agent manufactured by Shin-Etsu Silicone Co., Ltd.

[0147] [solvent] • MEK: Methyl ethyl ketone, manufactured by Junsei Chemicals. PGM: Propylene glycol monomethyl ether, manufactured by Junsei Chemicals.

[0148] [Film layer] • Film layer 1: PET film (Cosmoshine A4300) manufactured by Toyobo Co., Ltd., 50 μm thick. • Film layer 2: Polycarbonate film manufactured by Shin-Etsu Polymer Co., Ltd., containing 0.1% by mass of carbon, 50 μm thick. • Protective film: Manufactured by Nippa Co., Ltd., release PET 1-TRE, 50μm thick.

[0149] [Resin for hard coat layer] • CS-1: Manufactured by Dainichi Seika Kogyo Co., Ltd., Seika Beam EXF-L203 (CS-1) [Solid content concentration 70% by mass, active energy ray curable compound containing monofunctional monomer and polyfunctional acrylate 65% by mass, photopolymerization initiator 5% by mass, propylene glycol monomethyl acetate 30% by mass].

[0150] [Fine particles] • Silica microparticles: Manufactured by Tosoh Silica, silica microparticles, product name "NipSeal SS50B", average particle size 2000 nm (2 μm). ·Organic fine particles: Sekisui Plastics Co., Ltd., spherical PMMA fine particles [average particle size 4.5 μm, refractive index 1.49].

[0151] <Example 1> [Preparation of films with a hard coat layer] A hard coat coating agent with a solid content of approximately 38% was uniformly mixed with parts by mass of CS-1100, 4.5 parts by mass of silica fine particles, and 5 parts by mass of organic fine particles. This hard coat coating agent was applied to one side of the film layer 1 to a thickness of 15 μm, dried at 120°C for 5 minutes, and then subjected to a 2000 mJ / cm² test. 2 The film was cured by irradiation with ultraviolet light to obtain a film 1 with a hard coat layer.

[0152] [Formation of a transparent curable resin layer] Raw material 1, as shown in Table 1, was mixed with a solvent of MEK / PGM = 80 / 20 to prepare coating solution 1 with a solid content concentration of 25% by mass. That is, the total amount of raw material 1 (in terms of solid content) as shown in Table 1 was set to 25% by mass of the total amount of the resulting coating solution.

[0153] The obtained coating solution 1 was applied to the side of the film 1 with a hard coat layer opposite to the hard coat layer using a bar coater to achieve a dry film thickness of 40 μm, and dried at 120°C for 5 minutes to obtain a laminated sheet 1 in which a transparent curable resin layer was supported on the film 1 with a hard coat layer.

[0154] [Formation of a black curable resin layer] The raw materials 2 shown in Table 1 were mixed with a solvent of MEK / PGM = 80 / 20 to prepare coating solution 2 with a solid content concentration of 25% by mass. That is, the total amount of raw materials 2 shown in Table 1 (in terms of solid content) was set to 25% by mass of the total amount of the resulting coating solution.

[0155] The obtained coating solution 2 was applied to the release surface of the protective film using a bar coater to a dry film thickness of 40 μm, and dried at 120°C for 5 minutes to obtain a laminated sheet 2 in which a black curable resin layer was supported on the protective film.

[0156] [Preparation of integrated sealing sheets] Laminated sheet 1 and laminated sheet 2 were stacked so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to produce an integrated sealing sheet 1 in which a protective film, black curable resin layer, transparent curable resin layer, film layer 1, and hard coat layer were sequentially laminated.

[0157] [Manufacturing of light-emitting electronic components] The resulting integrated sealing sheet 1 was placed on a substrate with an element mounted on it, on which a light-emitting element (50 μm high, 100 μm long, 200 μm wide) was mounted, so that the black curable resin layer from which the protective film had been peeled off was in contact with the substrate. In this state, the material was laminated using a vacuum laminator MVLP-500 (manufactured by Meiki Seisakusho) at a temperature of 80-110°C and a pressure of 0.3 MPa. Then, the curable resin layer was cured in a hot air circulating drying oven at 150°C for 60 minutes to obtain an luminescent electronic component.

[0158] <Example 2> [Preparation of films with a hard coat layer] A hard coat coating agent with a solid content of approximately 38% was uniformly mixed with parts by mass of CS-1100, 4.5 parts by mass of silica fine particles, and 5 parts by mass of organic fine particles. This hard coat coating agent was applied to one side of the film layer 2 to a thickness of 15 μm, dried at 120°C for 5 minutes, and then subjected to a 2000 mJ / cm² test. 2 The film was cured by irradiation with ultraviolet light to obtain a film 2 with a hard coat layer.

[0159] [Formation of a transparent curable resin layer] The raw materials 3 shown in Table 1 were mixed with a solvent of MEK / PGM = 80 / 20 to prepare coating solution 3 with a solid content concentration of 25% by mass. That is, the total amount of raw materials 3 (in terms of solid content) shown in Table 1 was set to 25% by mass of the total amount of the resulting coating solution.

[0160] The obtained coating solution 3 was applied to the side of the film 2 with a hard coat layer opposite to the hard coat layer using a bar coater to achieve a dry film thickness of 40 μm, and dried at 120°C for 5 minutes to obtain a laminated sheet 3 in which a transparent curable resin layer was supported on the film 2 with a hard coat layer.

[0161] [Formation of a black curable resin layer] The raw materials 4 shown in Table 1 were mixed with a solvent of MEK / PGM = 80 / 20 to prepare a coating solution 4 with a solid content concentration of 25% by mass. That is, the total amount of raw materials 4 shown in Table 1 (in terms of solid content) was set to 25% by mass of the total amount of the resulting coating solution.

[0162] The obtained coating liquid 4 was applied to the release surface of the protective film using a bar coater to a dry film thickness of 40 μm, and dried at 120°C for 5 minutes to obtain a laminated sheet 4 in which a black curable resin layer was supported on the protective film.

[0163] [Preparation of integrated sealing sheets] Laminated sheet 3 and laminated sheet 4 were stacked so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to produce an integrated sealing sheet 2 in which a protective film, a black curable resin layer, a transparent curable resin layer, a film layer 2, and a hard coat layer were sequentially laminated.

[0164] [Manufacturing of light-emitting electronic components] A light-emitting electronic component was obtained in the same manner as in Example 1, except that the obtained integrated sealing sheet 2 was used.

[0165] <Example 3> [Formation of a transparent curable resin layer] In the same manner as in Example 1, the coating liquid 1 was applied to the side of the film 1 with a hard coat layer that was opposite to the hard coat layer, and a laminated sheet 1 was obtained in which a transparent curable resin layer was supported by the film 1 with a hard coat layer.

[0166] [Formation of a black curable resin layer] Except for adjusting the amount of coating liquid 2 applied so that the dry film thickness would be 50 μm, the coating liquid 2 was applied to the release surface of the protective film in the same manner as in Example 1, and a laminated sheet 5 in which a black curable resin layer was supported by the protective film was obtained.

[0167] [Preparation of integrated sealing sheets] Laminated sheet 1 and laminated sheet 5 were stacked so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to produce an integrated sealing sheet 3 in which a protective film, a black curable resin layer, a transparent curable resin layer, a film layer 1, and a hard coat layer were sequentially laminated.

[0168] [Manufacturing of light-emitting electronic components] A light-emitting electronic component was obtained in the same manner as in Example 1, except that the obtained integrated sealing sheet 3 was used.

[0169] <Example 4> [Formation of a transparent curable resin layer] In the same manner as in Example 1, the coating liquid 1 was applied to the side of the film 1 with a hard coat layer that was opposite to the hard coat layer, and a laminated sheet 1 was obtained in which a transparent curable resin layer was supported by the film 1 with a hard coat layer.

[0170] [Formation of a black curable resin layer] Except for adjusting the amount of coating liquid 2 applied so that the dry film thickness would be 60 μm, the coating liquid 2 was applied to the release surface of the protective film in the same manner as in Example 1, and a laminated sheet 6 in which a black curable resin layer was supported by the protective film was obtained.

[0171] [Preparation of integrated sealing sheets] Laminated sheet 1 and laminated sheet 6 were stacked so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to produce an integrated sealing sheet 4 in which a protective film, a black curable resin layer, a transparent curable resin layer, film layer 1, and a hard coat layer were sequentially laminated.

[0172] [Manufacturing of light-emitting electronic components] A light-emitting electronic component was obtained in the same manner as in Example 1, except that the obtained integrated sealing sheet 4 was used.

[0173] [Table 1]

[0174] <Rating> [Total light transmittance] The total light transmittance of each obtained layer was measured using a haze meter (NDH5000) manufactured by Nippon Denshoku Industries Co., Ltd., in accordance with JIS K 7136. The results are shown in Table 2. The total light transmittance of the hard coat layer was determined from the transmitted light of the film with the hard coat layer, with the transmitted light of the film layer set to a transmittance of 100%. Furthermore, the total light transmittance of the transparent curable resin layer in its cured state was determined from the transmitted light when the laminated sheet, in which the transparent curable resin layer is supported by the hard coat layer film, was heated at 150°C for 1 hour to cure, with the transmitted light of the hard coat layer film set as 100% transmittance.

[0175] [Lab] The Lab value of the cured black curable resin layer was determined by heating the black curable resin layer, supported by a protective film, at 150°C for 1 hour and then measuring it with a spectrophotometer.

[0176] [Storage modulus] The storage modulus of the coating film in laminated sheets 1-4 at 100°C before curing was measured using a viscoelasticity measuring device (RSA-G2, TA Instruments) under conditions of a measurement frequency of 1 Hz and a heating rate of 5°C / min, in accordance with JIS K7244. The results are shown in Table 2.

[0177] [Reflectance] The reflectance of the hard coat layer surface was determined using a gloss meter (VG8000, JIS-Z-8741, manufactured by Nippon Denshoku Industries Co., Ltd.). The results are shown in Table 2.

[0178] [Pencil hardness] The pencil hardness of the hard coat layer surface was determined using a pencil hardness tester (JIS-K5600-5-4). The results are shown in Table 2.

[0179] [Surface roughness] The surface roughness of the hard coat layer was determined using a laser microscope (Olympus LEXT OLS4000, JIS-B-0601). The results are shown in Table 2.

[0180] [Black curable resin layer residue on the element] The hardened surface was observed and evaluated according to the following criteria. The results are shown in Table 2. ◎: No residue of the black curable resin layer is observed on the light-emitting element. ○: A small amount of residue from the black curable resin layer is visible on top of the light-emitting element, but almost none remains. ×: Residue of a black curable resin layer is visible on the light-emitting element.

[0181] [Table 2]

[0182] The above embodiment demonstrates that, in a single pressing operation, it is possible to not only fill the spaces between multiple light-emitting elements with a light-diffusion-preventing resin but also complete the sealing process, resulting in a light-emitting electronic component that does not hinder light from the light-emitting elements from reaching the viewer and also has sufficient surface hardness. Furthermore, it was confirmed that it is preferable for the thickness of the black curable resin layer to be smaller than the height of the light-emitting element. [Explanation of Symbols]

[0183] 1. Integrated sealing sheet 2 Black curable resin layer 3 Transparent curable resin layer 4 film layers 5. Hard court layer 6. First protective film 7. Second protective film 10-element circuit board 11 circuit boards 12 Light-emitting elements 13 Light-emitting element 14 Light-emitting elements 22 Black curable resin cured product 23 Transparent curable resin cured product 30 Light-emitting electronic components

Claims

1. An integrated sealing sheet that is pressed onto the surface on which the multiple light-emitting elements are arranged of an element-equipped substrate, wherein the multiple light-emitting elements are arranged on the substrate, The system comprises a black curable resin layer, a transparent curable resin layer, a film layer, and a hard coat layer, which are sequentially laminated from the side that is in contact with the substrate with the element attached during the aforementioned crimping process. At 100°C, the storage modulus of the transparent curable resin layer in its uncured state is greater than the storage modulus of the black curable resin layer in its uncured state. At 100°C, the storage modulus of the black curable resin layer in its uncured state is 1.0 × 10⁻⁶. ２ Pa or more, 1.0×10 ５ It is less than or equal to Pa, At 100°C, the storage modulus of the transparent curable resin layer in its uncured state is 1.0 × 10⁻⁶. ４ Pa or more, 1.0×10 ７ An integrated sealing sheet characterized by having a pressure of Pa or less.

2. The integrated sealing sheet according to claim 1, wherein the black curable resin layer and the transparent curable resin layer are in an uncured state.

3. At 100°C, the storage modulus of the film layer is 1.0 × 10⁻⁶. ９ Pa or more, 1.0×10 １０ An integrated sealing sheet according to claim 1 or 2, wherein the pressure is Pa or less.

4. The integrated sealing sheet according to claim 1 or 2, wherein the film layer has a total light transmittance of 30 to 99%.

5. The device comprises an element-equipped substrate on which a plurality of light-emitting elements are arranged, and a crimping body in which an integrated sealing sheet according to claim 1 or 2 is crimped to the surface of the element-equipped substrate on which the plurality of light-emitting elements are arranged. The crimped body comprises a black curable resin cured product obtained by heat curing the black curable resin layer, and a transparent curable resin cured product obtained by heat curing the transparent curable resin layer. A light-emitting electronic component characterized in that the black curable resin cured product and a portion of the transparent curable resin cured product are filled between the plurality of light-emitting elements.

6. On the surface of the element-equipped substrate on which the plurality of light-emitting elements are arranged, the integrated sealing sheet according to claim 1 or 2 is placed so that the black curable resin layer is in contact with it. The black curable resin layer and a portion of the transparent curable resin layer are filled between the plurality of light-emitting elements by press bonding. A method for manufacturing a light-emitting electronic component, comprising curing the black curable resin layer and the transparent curable resin layer by heating.

7. The thickness of the black curable resin layer before bonding is 10 to 95% of the height of the light-emitting element. The method for manufacturing a light-emitting electronic component according to claim 6, wherein the total thickness of the black curable resin layer and the transparent curable resin layer before bonding is 110 to 550% of the height of the light-emitting element.

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