Chip manufacturing method and splitting apparatus

Abstract

The ability to split wafers through a protective sheet while keeping the complexity of the device configuration under control. [Solution] The chip manufacturing method includes a protective sheet facing step 302 in which a roll-shaped protective sheet installed in a sheet installation section is pulled out and passed to a winding section that winds the protective sheet, and the protective sheet is brought to face the surface side of the wafer; a fixing step 303 in which the protective sheet facing the surface side is fixed to at least the first region of a first region adjacent to the planned division line of the wafer and a second region adjacent to the first region on the opposite side of the planned division line; a clamping step 304 in which the wafer and the protective sheet overlapping the second region in a plan view are clamped with a pair of clamping members; and a division step 305 in which the wafer is divided along the planned division line by pressing a pressure bar against the protective sheet fixed in the first region.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a chip and a dicing apparatus.

Background Art

[0002] As a method for manufacturing a chip by dicing a semiconductor wafer, a method is known in which the focus point of a laser beam having a wavelength that penetrates the wafer is positioned inside the wafer and moved along a planned dicing line to form a modified layer serving as a dicing starting point, and the wafer is diced by applying an external force to this modified layer (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In order to prevent the divided devices from colliding with each other, in the method disclosed in Patent Document 1, the wafer is diced by disposing an adhesive sheet on the back surface of the wafer and a protective sheet on the front surface, and pressing a dicing blade against the planned dicing line from the protective sheet side.

[0005] Attaching and peeling the protective sheet over the entire wafer in a wafer dicing apparatus complicates the apparatus configuration.

[0006] An object of the present invention is to provide a method for manufacturing a chip and a dicing apparatus that can dice a wafer through a protective sheet while suppressing complication of the apparatus configuration.

Means for Solving the Problems

[0007] To solve the above-mentioned problems and achieve the objective, the present invention provides a chip manufacturing method in a chip manufacturing apparatus that manufactures chips by dividing a wafer having a first surface and a second surface opposite to the first surface and having a division starting point formed along a division starting line, the method comprising: a protective sheet facing step of pulling out a roll-shaped protective sheet wound in a roll shape installed in a sheet installation section, passing the protective sheet to a winding section that winds the protective sheet, and facing the protective sheet toward the first surface side of the wafer, and the wafer toward the division starting line The invention is characterized by comprising: a fixing step of fixing the protective sheet facing the first surface to at least the first region, which is adjacent to the first region and adjacent to the second region on the opposite side of the planned division line with respect to the planned division line; a clamping step of clamping the wafer and the protective sheet overlapping the second region in a plan view with a pair of clamping bars after the fixing step has been performed; and a division step of dividing the wafer along the planned division line by pressing a pressing member against the protective sheet fixed to the first region after the clamping step has been performed.

[0008] In the chip manufacturing method described above, the fixing step may be performed by clamping the wafer and the protective sheet with the pair of clamping bars to bring the first region of the wafer into contact with each other.

[0009] In the chip manufacturing method described above, an alignment step may be further provided before the fixing step for imaging the first surface to detect the planned division lines.

[0010] In the chip manufacturing method described above, a peeling step may be further provided after the dividing step, in which the protective sheet is peeled off from the first region of the wafer.

[0011] In the chip manufacturing method described above, the peeling step may be carried out by the winding unit winding up the protective sheet.

[0012] In the chip manufacturing method described above, the clamping step and the peeling step may be performed each time the splitting step is performed.

[0013] In the method for manufacturing the chip, the protective sheet may be self-adhesive.

[0014] The splitting device of the present invention is characterized by comprising: a frame fixing unit for fixing the frame of a wafer unit consisting of a wafer having a plurality of planned splitting lines set and a splitting starting point formed along each planned splitting line, a sheet to which the wafer is attached, and a frame to which the outer circumference of the sheet is attached; a detection unit for detecting the planned splitting lines of the wafer unit whose frame is fixed by the frame fixing unit; a pair of clamping bars for clamping the wafer in a region adjacent to the planned splitting line to be split from above and below the wafer unit; a pressing bar for pressing the wafer in a region adjacent to the planned splitting line to be split on the opposite side of the pair of clamping bars, thereby braking the wafer along the planned splitting line to be split; a sheet installation section for installing a strip-shaped protective sheet wound into a roll shape; and a winding section for winding up the protective sheet that has been pulled out from the protective sheet installed in the sheet installation section and passed between the pair of clamping bars. [Effects of the Invention]

[0015] This invention has the effect of being able to split wafers through a protective sheet while suppressing the complexity of the device configuration. [Brief explanation of the drawing]

[0016] [Figure 1] Figure 1 is a schematic perspective view showing an example of the configuration of a braking device according to Embodiment 1. [Figure 2] Figure 2 is a schematic perspective view showing the wafer to be divided by the braking device shown in Figure 1. [Figure 3] Figure 3 is a schematic side view showing a partial cross-section of the braking device configuration shown in Figure 1. [Figure 4] Figure 4 is a schematic perspective view showing the configuration of the lower clamping unit of the clamping unit of the braking device shown in Figure 1. [Figure 5] FIG. 5 is a side view schematically showing, in partial cross section, the configuration of the upper clamping unit of the clamping unit of the braking device shown in FIG. 1. [Figure 6] FIG. 6 is a side view schematically showing, in partial cross section, the pressing bar of the braking device shown in FIG. 1. [Figure 7] FIG. 7 is a front view schematically showing, in partial cross section, the load measuring unit as viewed from the direction of arrow VII shown in FIG. 6. [Figure 8] FIG. 8 is a flowchart showing the process flow of the method for manufacturing a chip according to Embodiment 1. [Figure 9] FIG. 9 is a view schematically showing, in partial cross section, the fixing step of the method for manufacturing a chip shown in FIG. 8. [Figure 10] FIG. 10 is a view schematically showing, in partial cross section, the clamping step of the method for manufacturing a chip shown in FIG. 8. [Figure 11] FIG. 11 is a view schematically showing, in partial cross section, the dividing step of the method for manufacturing a chip shown in FIG. 8. [Figure 12] FIG. 12 is a view schematically showing, in partial cross section, the peeling step of the method for manufacturing a chip shown in FIG. 8. [Figure 13] FIG. 13 is a view schematically showing, in partial cross section, the fixing step of the method for manufacturing a chip according to Embodiment 2. [Figure 14] FIG. 14 is a view schematically showing, in partial cross section, the clamping step of the method for manufacturing a chip according to Embodiment 2. [Figure 15] FIG. 15 is a view schematically showing, in partial cross section, the dividing step of the method for manufacturing a chip according to Embodiment 2. [Figure 16] FIG. 16 is a view schematically showing, in partial cross section, the peeling step of the method for manufacturing a chip according to Embodiment 2. DETAILED DESCRIPTION OF THE INVENTION

[0017] Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by those skilled in the art, and those that are substantially the same. In addition, the components described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the components can be made without departing from the spirit of the present invention.

[0018] [Embodiment 1] A braking device, which is a splitting device according to Embodiment 1 of the present invention, will be described based on the drawings. Figure 1 is a schematic perspective view showing an example of the configuration of the braking device according to Embodiment 1. Figure 2 is a schematic perspective view showing a wafer to be split by the braking device shown in Figure 1. Figure 3 is a schematic side view showing a partial cross-section of the configuration of the braking device shown in Figure 1. Figure 4 is a schematic perspective view showing the configuration of the lower clamping unit of the clamping unit of the braking device shown in Figure 1. Figure 5 is a schematic side view showing a partial cross-section of the configuration of the upper clamping unit of the clamping unit of the braking device shown in Figure 1. Figure 6 is a schematic side view showing a partial cross-section of the pressing bar of the braking device shown in Figure 1. Figure 7 is a schematic front view showing a partial cross-section of the load measuring section viewed from the direction of arrow VII shown in Figure 6.

[0019] (Waha) The breaking apparatus 1 shown in Figure 1 according to Embodiment 1 is a device that manufactures chips 210 by splitting a wafer 200 shown in Figure 2. The wafer 200 to be split by the breaking apparatus 1 shown in Figure 1 according to Embodiment 1 is, for example, a disc-shaped semiconductor wafer or optical device wafer with a substrate 201 made of glass, sapphire, SiC, etc.

[0020] As shown in Figure 2, the wafer 200 has multiple intersecting division lines 203 on its surface 202 (corresponding to the first surface), and the device 204 is formed in the region demarcated by the division lines 203. Thus, the wafer 200 has multiple division lines 203 parallel to one direction and multiple division lines 203 parallel to the other direction that intersect (orthogonal in Embodiment 1) with the one direction. In this invention, the wafer 200 may be made of a substrate 201 other than glass, sapphire, or SiC, and the device 204 may not be formed on it.

[0021] Device 204 is, for example, an integrated circuit such as an IC (Integrated Circuit) or LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor), an optical element such as an LED (Light-Emitting Diode), or a memory (semiconductor memory device).

[0022] Furthermore, as shown in Figure 2, the wafer 200 has a division starting point 205 formed along the division planned line 203. In Embodiment 1, the division starting point 205 is a modified layer formed inside the substrate 201 along the division planned line 203. The modified layer refers to a region whose density, refractive index, mechanical strength, and other physical properties are different from those of the surrounding area, and examples include a melted region, a cracked region, a dielectric breakdown region, a refractive index change region, and a region where these regions are mixed. The modified layer has lower mechanical strength than other parts of the substrate 201.

[0023] Furthermore, in Embodiment 1, as shown in Figure 2, the wafer 200 comprises a wafer unit 211 consisting of a disc-shaped sheet 207 attached to the back surface 206 (corresponding to the second surface) of the back side of the front surface 202 and having a larger diameter than the wafer 200, and an annular frame 208 attached to the outer circumference of the sheet 207 and having an inner diameter larger than the outer diameter of the wafer 200. Thus, the wafer unit 211 consists of the wafer 200, the sheet 207 to which the back surface 206 of the wafer 200 is attached to the center, and the frame 208.

[0024] The sheet 207 is an adhesive tape comprising a base layer made of a resin having non-adhesive and flexible properties, and an adhesive layer laminated on the base layer and made of a resin having adhesive and flexible properties, with the adhesive layer being attached to the wafer 200 and frame 208. The sheet 207 is also stretchable.

[0025] As described above, in Embodiment 1, the wafer 200 has a circular surface 202 and a circular back surface 206 opposite to the surface 202, and a division starting point 205 is formed along the division line 203. The wafer 200 is divided into individual chips 210 along the division line 203. The chip 210 comprises a part of the substrate 201 and a device 204 formed on the surface of the substrate 201.

[0026] (Braking device) Next, a braking device 1, which is a splitting device according to Embodiment 1, will be described. The braking device 1 shown in Figure 1 is a device that splits a wafer 200 along a planned splitting line 203 to manufacture chips 210. As shown in Figures 1 and 3, the braking device 1 includes a frame fixing unit 10, a detection unit 20, a clamping unit 40, a pressing bar 60, a sheet installation section 80, a winding section 90, a control unit 100, a display unit 110, and an input unit (not shown).

[0027] The frame fixing unit 10 fixes the frame 208 of the wafer unit 211 having the configuration described above. The frame fixing unit 10 comprises a movable frame 11 that is mounted on the device body 2 so as to be movable in the X-axis direction parallel to the horizontal direction by an X-axis moving unit 30, and a frame fixing member 12 disposed on the movable frame 11.

[0028] The frame fixing member 12 is formed in an annular shape with inner and outer diameters equal to the inner and outer diameters of the frame 208. The upper surface of the frame fixing member 12 is a holding surface 13 on which the frame 208 is placed via the outer circumference of the sheet 207. The holding surface 13 is flat along the horizontal direction. In Embodiment 1, the frame fixing member 12 has a suction hole opening in the holding surface 13, which is connected to a suction source (not shown).

[0029] The frame fixing unit 10 fixes the frame 208 placed on the holding surface 13 by attracting it through the attraction of an attraction source through an attraction hole. In this invention, if the frame 208 is made of a magnetic material, the frame fixing unit 10 may have a magnet (permanent magnet or electromagnet) placed inside the frame fixing member 12 and fix the frame 208 placed on the holding surface 13 by magnetic attraction. If the frame 208 is made of a non-magnetic material, the frame fixing unit 10 may be equipped with a clamping mechanism that holds the frame 208 between itself and the holding surface 13 to fix the frame 208. Furthermore, the frame fixing unit 10 is rotatable around an axis parallel to the Z-axis direction (also called the vertical direction) by a rotational drive mechanism (not shown).

[0030] The X-axis movement unit 30 is installed on the main body 2 of the device and includes a well-known ball screw that is rotatable around its axis, a well-known motor that moves the movement frame 11 and the frame fixing member 12 in the X-axis direction by rotating the ball screw around its axis, and a well-known guide rail 31 that supports the movement frame 11 so that it can move in the X-axis direction.

[0031] The detection unit 20 detects the planned division line 203 of the wafer 200 of the wafer unit 211, whose frame 208 is fixed by the frame fixing unit 10. The detection unit 20 is installed on a movable table 4 that is moved in the Y-axis direction, parallel to the horizontal direction and perpendicular to the X-axis direction, by a Y-axis moving unit 32 on a gate-shaped frame 3 which is erected from the main body of the device 2, straddling the guide rail 31 of the X-axis moving unit 30. By being installed on the movable table 4, the detection unit 20 is arranged to be freely movable in the Y-axis direction by the Y-axis moving unit 32.

[0032] The detection unit 20 includes an imaging camera 21 equipped with an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor, which images objects facing each other in the Z-axis direction parallel to the vertical direction. The detection unit 20 acquires the image captured by the image sensor and outputs the acquired image to the control unit 100. The detection unit 20 also images the wafer 200 housed in the aperture 209 of the frame 208 of the wafer unit 211 fixed by the frame fixing unit 10, detects the planned division line 203 of the wafer 200, and acquires an image for performing alignment, which involves aligning the planned division line 203 of the wafer 200 with the pressure bar 60, etc.

[0033] The gantry frame 3 and the mobile table 4 are flat plates with both surfaces parallel to the vertical and parallel to the Z-axis direction, and are stacked parallel to each other with a gap between them. The Y-axis movement unit 32 is installed on the gantry frame 3 and includes a well-known ball screw that is rotatable around its axis, a well-known motor that moves the mobile table 4 in the Y-axis direction by rotating the ball screw around its axis, and a well-known guide rail 33 that supports the mobile table 4 so that it can move in the Y-axis direction.

[0034] The clamping unit 40 clamps the device 204 of the wafer 200 in the region adjacent to the division line 203 to be divided, from above and below along the Z-axis direction. As shown in Figure 1, the clamping unit 40 comprises a lower clamping unit 41 and an upper clamping unit 50.

[0035] The lower clamping unit 41 is positioned below the frame fixing unit 10 and presses from below the device 204 of the wafer 200, which is a region of the wafer 200 housed in the opening 209 of the frame 208 of the wafer unit 211 fixed to the frame fixing unit 10, that is adjacent to the division line 203 to be divided. As shown in Figure 4, the lower clamping unit 41 comprises a bracket 42 that is provided to be able to move up and down in the Z-axis direction by a Z-axis movement unit 34, a rotating body 43 that is rotatably supported by the bracket 42 around its axis, and a plurality of rectangular clamping members 44 (corresponding to clamping bars) of different lengths that protrude from the outer circumferential surface of the rotating body 43.

[0036] The rotating body 43 has its axis positioned parallel to the Y-axis direction, and both ends are rotatably supported by brackets 42. The rotating body 43 is rotated around its axis by a rotation mechanism (not shown). The multiple rectangular clamping members 44 are each formed as a straight rectangular plate in the Y-axis direction with a constant thickness, and are formed to have various lengths in the Y-axis direction. The length of the longest rectangular clamping member 44 is approximately the diameter of the wafer 200 (i.e., the maximum length of the planned division line 203) + 10 mm. The rotating body 43 is equipped with several types (for example, a total of four) of rectangular clamping members 44 that are shorter than the longest rectangular clamping member 44, so that the lengths of the rectangular clamping members 44 do not collide with the frame 208 when the planned division line 203 is divided.

[0037] The orientation in which the multiple rectangular clamping members 44 protrude is changed by the rotation of the rotating body 43. Of the multiple rectangular clamping members 44, the rectangular clamping member 44 positioned upward along the Z-axis direction from the rotating body 43 has its upper end below the sheet 207 attached to the wafer 200 housed in the opening 209 of the frame 208 fixed by the frame fixing unit 10 when it is lowered by the Z-axis moving unit 34, and its upper end has its upper end above the wafer 200 housed in the opening 209 of the frame 208 fixed by the frame fixing unit 10 when it is raised by the Z-axis moving unit 34. Of the multiple rectangular clamping members 44, the rectangular clamping member 44 positioned upward along the Z-axis direction from the rotating body 43 has its upper end press upward from the back surface 206 side against the device 204 adjacent to the division line 203 of the wafer 200 that is to be divided.

[0038] In other words, the lower clamping unit 41 can select the length of the upward-facing rectangular clamping member 44 by changing the orientation of the rotating body 43 around its axis, and uses the selected rectangular clamping member 44 to press upward from the back surface 206 side of the device 204 adjacent to the division line 203 of the wafer 200 that is to be divided.

[0039] The Z-axis movement unit 34 includes a well-known ball screw rotatably mounted around its axis, a well-known motor that raises and lowers the bracket 42 in the Z-axis direction by rotating the ball screw around its axis, and a well-known guide rail 35 that supports the bracket 42 so that it can be raised and lowered in the Z-axis direction.

[0040] The upper clamping unit 50 is positioned above the frame fixing unit 10 and clamps the device 204 between itself and the lower clamping unit 41, in the region of the wafer 200 housed in the opening 209 of the frame 208 fixed by the frame fixing unit 10 that is adjacent to the planned division line 203 to be divided and is being pressed from below by the lower clamping unit 41. The upper clamping unit 50 is mounted on the movable base 5 and positioned next to the detection unit 20 in the Y-axis direction. The movable base 5 is moved in the Z-axis direction by the lifting unit 36 ​​mounted on the movable table 4.

[0041] The movable base 5 is formed as a flat plate with both surfaces parallel to the Z-axis direction and is stacked on the movable table 4 with gaps between them. A horizontal member 6, with both surfaces parallel to the horizontal direction, is fixed to the movable base 5.

[0042] The lifting unit 36 ​​is installed on the movable table 4 and includes a well-known ball screw that is rotatable around its axis, a well-known motor 37 that raises and lowers the movable base 5 in the Z-axis direction by rotating the ball screw around its axis, and a well-known guide rail 38 that supports the movable base 5 so that it can be raised and lowered in the Z-axis direction.

[0043] As shown in Figure 5, the upper clamping unit 50 comprises a cylinder unit 51, an upper clamping member 52 (corresponding to a clamping bar), and a slide unit 53. The cylinder unit 51 comprises a cylinder 54 fixed to the horizontal member 6, and a rod 55 formed in the shape of a rod parallel to the Z-axis direction, which is extendable and retractable from the cylinder 54, and whose lower end descends when extended from the cylinder 54.

[0044] The upper clamping member 52 is formed in the shape of a rectangular plate with a constant thickness, a straight line in the Y-axis direction, and both surfaces parallel to the Z-axis direction, and its length in the Y-axis direction is equivalent to the length of the longest planned division line 203 of the wafer 200. The lower end of the rod 55 of the cylinder unit 51 is fixed to the upper end of the upper clamping member 52, and it is stacked on the movable base 5 with a gap between them. The upper clamping member 52 faces the rectangular clamping member 44, which is facing upward from the rotating body 43, in the Z-axis direction.

[0045] Furthermore, the slide unit 53 supports the upper clamping member 52 so that it can slide relative to the movable base 5 in the Z-axis direction. The slide unit 53 includes a linear guide rail 56 fixed to the movable base 5, which is one of the movable base 5 and the upper clamping member 52, and parallel to the Z-axis direction, and a slider 57 fixed to the upper clamping member 52, which is the other of the movable base 5 and the upper clamping member 52, and slidably supported by the guide rail 56 in the longitudinal direction of the guide rail 56, i.e., in the Z-axis direction.

[0046] When the rod 55 is extended, the upper clamping member 52 is raised by the lifting unit 36 ​​so that its lower end is above the wafer 200 housed in the opening 209 of the frame 208 of the wafer unit 211, which is fixed by the frame fixing unit 10. When it is lowered by the lifting unit 36, its lower end clamps a device 204 adjacent to the planned division line 203 of the wafer 200, which is pressed by the rectangular clamping member 44 positioned upward along the Z-axis from the rotating body 43, between the upper clamping member 52 and the rectangular clamping member 44.

[0047] Thus, the clamping members 44 and 52, which are the clamping bars of the clamping unit 40, correspond to a pair of clamping members that clamp the device 204 of the wafer 200 in the region adjacent to the division line 203 to be divided, from above and below the wafer unit 211.

[0048] The pressing bar 60 presses the area adjacent to the dividing line 203 on the opposite side in the Y-axis direction of the clamping members 44 and 52 of the clamping unit 40, thereby braking (also called dividing) the wafer 200 along the dividing line 203. As shown in Figure 5, the pressing bar 60 is installed on the pressing and moving base 62.

[0049] The pressing and moving base 62 is formed with both surfaces parallel to the Z-axis direction and integrally comprising a thick-walled portion 63 at the upper end and a thin-walled portion 64 at the lower end, and is stacked on the upper clamping member 52 with a gap between them. In Embodiment 1, the pressing and moving base 62 has surfaces on the side of the thick-walled portion 63 and the thin-walled portion 64 away from the upper clamping member 52 that are in the same plane, and a step is formed between the thick-walled portion 63 and the thin-walled portion 64 on the upper clamping member 52 side. Also in Embodiment 1, the pressing and moving base 62 is provided with a rectangular opening 65 that penetrates the thin-walled portion 64. The pressing and moving base 62 is moved in the X-axis direction by the second X-axis moving unit 61.

[0050] The second X-axis movement unit 61 is attached to the horizontal member 6. The second X-axis movement unit 61 comprises a well-known ball screw rotatably mounted around its axis, a well-known motor 66 that moves the pressing movement base 62 in the X-axis direction by rotating the ball screw around its axis, and a well-known guide rail 67 that supports the pressing movement base 62 so that it can move in the X-axis direction.

[0051] The pressing bar 60 is formed in a rectangular plate shape that is linear in the Y-axis direction and has both surfaces parallel to the Z-axis direction, and its length in the Y-axis direction is equivalent to the length of the longest planned division line 203 of the wafer 200. The pressing bar 60 has a tapered portion 68 formed at its lower end, which gradually becomes thinner as it goes downwards. In Embodiment 1, the tapered portion 68 has a surface on the upper clamping member 52 side that is formed flat along the Z-axis direction, and the surface on the side away from the upper clamping member 52 is inclined with respect to both the horizontal and Z-axis directions in a direction that gradually approaches the upper clamping member 52 as it goes downwards.

[0052] Furthermore, the pressing bar 60 is supported by a pair of slide units 69 so as to be slidable in the Z-axis direction on the pressing movement base 62. The pair of slide units 69 are spaced apart in the Y-axis direction. Each slide unit 69 comprises a linear guide rail 691 fixed to the pressing movement base 62, which is one of the pressing movement base 62 and the pressing bar 60, and parallel to the Z-axis direction, and a slider 692 fixed to the pressing bar 60, which is the other of the pressing movement base 62 and the pressing bar 60, and supported by the guide rail 691 so as to be slidable in the longitudinal direction of the guide rail 691, i.e., in the Z-axis direction.

[0053] The pressing bar 60 is raised by the lifting unit 36 ​​so that its lower end is above the wafer 200 housed in the opening 209 of the frame 208, which is fixed by the frame fixing unit 10. When lowered by the lifting unit 36, it presses downward the device 204 of the wafer 200, which positions the division line 203 to be divided between the clamping members 44 and 52. In Embodiment 1, the pressing bar 60 presses downward at a position where the distance in the X-axis direction from the upper clamping member 52 of the wafer 200 is approximately 75% to 85% of the width of the chip 210. In the present invention, however, the pressing bar 60 only needs to press downward at a position where the distance in the Y-axis direction from the upper clamping member 52 of the wafer 200 is approximately 65% ​​to 95% of the width of the chip 210.

[0054] Furthermore, if the pressing position of the pressing bar 60 is too close to the upper clamping member 52 in the Y-axis direction, it is less likely to crack, and if it is too far, the pressing bar 60 will move toward the already cracked division line 203 and will not crack. Therefore, it is desirable for the pressing bar 60 to press downwards at a position where the distance in the Y-axis direction from the upper clamping member 52 of the wafer 200 is approximately 65% ​​to 95% of the width of the chip 210, preferably approximately 75% to 85% of the width of the chip 210. When the pressing bar 60 is lowered by the lifting unit 36, it presses downwards in the Y-axis direction, positioning the device 204 of the wafer 200 between the clamping members 44 and 52 and the division line 203 to be divided, thereby dividing the division line 203 to be divided.

[0055] Furthermore, the pressing bar 60 is fixed to the pressing and moving base 62 by a load measuring unit 70 shown in Figure 6. The load measuring unit 70 is located between a pair of slide units 69. As shown in Figures 6 and 7, the load measuring unit 70 includes a load meter 71 for measuring the value of the load applied by the pressing bar 60 to the wafer 200 (hereinafter referred to as the load value), a holding member 72, a support member 73, a spring 75, and a support part 74 (shown only in Figure 7).

[0056] The load cell 71 measures the load value applied by the pressing bar 60 in the Z-axis direction to the wafer 200. In Embodiment 1, it is a well-known load cell, but it is not limited to a load cell. The load cell 71 outputs the measured load value to the control unit 100. The load cell 71 is located inside the opening 65 of the pressing and moving base 62.

[0057] The holding member 72 has one end fixed to the pressing bar 60, extends from the pressing bar 60 toward the pressing movable base 62, and has its other end positioned within the opening 65 of the pressing movable base 62. The other end of the holding member 72 supports the lower end of the load cell 71.

[0058] The support member 73 is positioned within the opening 65 of the pressing and moving base 62, with its upper end fixed to the upper inner surface of the opening 65 and its lower end supporting the upper end of the load cell 71. The support portion 74 is positioned within the opening 65 of the pressing and moving base 62, with its lower end fixed to the lower inner surface of the opening 65 and its upper end supporting the lower end of the holding member 72.

[0059] The spring 75 is positioned between the lower inner surface of the opening 65 and the other end of the holding member 72, and biases the pressing bar 60 upward relative to the pressing and moving base 62 via the other end of the holding member 72. In Embodiment 1, the spring 75 biases the holding member 72 and the pressing bar 60 upward with a force corresponding to the combined mass of the pressing bar 60, the holding member 72 and the load cell 71. By biasing with the aforementioned force, the combined mass of the pressing bar 60, the holding member 72 and the load cell 71 cancels out, and the load cell 71 can measure a load value smaller than the combined mass of the pressing bar 60, the holding member 72 and the load cell 71. Thus, the braking device 1 is equipped with a load cell 71 that measures the load value at which the pressing bar 60 presses the wafer 200.

[0060] The sheet installation section 80 installs a strip-shaped protective sheet 220 wound into a roll. The protective sheet 220 installed by the sheet installation section 80 is formed with a width equal to or greater than the outer diameter of the wafer 200 (in this embodiment, equal to the outer diameter of the wafer 200) and is wound into a roll. The protective sheet 220 consists only of a base material made of a resin that is non-adhesive and flexible, and the base material is self-adhesive. That is, the protective sheet 220 is self-adhesive without the need for adhesive. The protective sheet 220 may also be stretchable.

[0061] The sheet installation section 80 is formed in a cylindrical shape with a constant outer diameter and an axis parallel to the Y-axis direction, and is supported by the movable table 4. It is provided integrally with the movable table 4 by a Y-axis movement unit 32 so as to be movable in the Y-axis direction. The sheet installation section 80 rotates around its axis by a motor (not shown) or the like. The sheet installation section 80 has one end of the inner circumference of the protective sheet 220 fixed to its outer surface and is inserted into the inner circumference of the rolled protective sheet 220 to install the protective sheet 220. The sheet installation section 80 feeds the protective sheet 220 between the clamping members 44 and 52 along the X-axis direction, passing below the upper clamping member 52 and the pressing bar 60.

[0062] The winding unit 90 is pulled out from the protective sheet 220 installed on the sheet installation unit 80 and winds up the protective sheet 220 after it has passed between the clamping members 44 and 52. The winding unit 90 is formed in a cylindrical shape with a constant outer diameter and an axis parallel to the Y-axis direction, and is supported by the movable table 4. It is provided to move freely in the Y-axis direction by a Y-axis moving unit 32, integrally with the movable table and the sheet installation unit 80.

[0063] The winding unit 90 rotates around its axis by a motor (not shown) or the like. The other end of the protective sheet 220 is fixed to the outer surface of the winding unit 90. By rotating around its axis by the motor, the winding unit 90 winds up the protective sheet 220 that has passed between the clamping members 44 and 52 onto its outer surface.

[0064] Furthermore, a pair of cylindrical guide rollers 91 are provided between the sheet installation section 80 and the winding section 90 to bring the protective sheet 220 closer to the surface 202 of the wafer 200 of the wafer unit 211 fixed to the frame fixing unit 10. The guide rollers 91 are supported on a movable table 4 with their axes parallel to the sheet installation section 80 and the winding section 90 and rotatable about their axes. The guide rollers 91 are integrally provided with the winding section 90 and the sheet installation section 80 by a Y-axis moving unit 32 so as to be movable in the Y-axis direction.

[0065] The control unit 100 controls each of the aforementioned components of the braking device 1 to cause the braking device 1 to perform a splitting operation to split each of the planned splitting lines 203 of the wafer 200. The control unit 100 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (central processing unit), a storage device with memory such as ROM (read-only memory) or RAM (random access memory), and an input / output interface device.

[0066] The arithmetic processing unit of the control unit 100 performs calculations according to the computer program stored in the memory device and outputs control signals for controlling the braking device 1 to the aforementioned units of the braking device 1 via the input / output interface device. The control unit 100 also determines the division result of the planned division line 203 based on the load value measured by the load cell 71 and stores the division result in a one-to-one correspondence with the planned division line 203.

[0067] The display unit 110 is connected to the control unit 100 and includes a display screen 111 that displays various information. The input unit is used when an operator inputs information to the control unit 100 of the braking device 1. The input unit is connected to the control unit 100 and outputs the input information to the control unit 100. The input unit includes a touch panel superimposed on the display screen 111 of the display unit 110.

[0068] (Method of manufacturing chips) Next, a chip manufacturing method according to Embodiment 1 will be described. Figure 8 is a flowchart showing the flow of the chip manufacturing method according to Embodiment 1. The chip manufacturing method according to Embodiment 1 is a chip manufacturing method in a breaking apparatus 1 that manufactures chips 210 by dividing a wafer 200 along division lines 203. The chip manufacturing method according to Embodiment 1 is also a method of dividing a wafer 200 along a division line 203 that is parallel to one direction among a plurality of division lines 203 that intersect each other. In Embodiment 1, as shown in Figure 8, the chip manufacturing method comprises an alignment step 301, a protective sheet facing step 302, a fixing step 303, a clamping step 304, a division step 305, and a peeling step 306.

[0069] (Alignment process) The alignment process 301 is a process that takes place before the fixing process 303 and involves imaging the surface 202 of the wafer 200, not through the protective sheet 220, to detect the planned division lines 203. In Embodiment 1, in the alignment process 301, the braking device 1 first has an operator or the like operate an input unit to input the division conditions, and the control unit 100 receives and registers the division conditions.

[0070] In Embodiment 1, during the alignment process 301, the braking device 1 fixes one end of the protective sheet 220 on its inner circumference to the outer circumferential surface of the sheet installation section 80, inserts the sheet installation section 80 into the inner circumference of the roll-shaped protective sheet 220, and fixes the other end of the protective sheet 220 to the outer circumferential surface of the winding section 90 by passing it between the clamping members 44 and 52 and below the guide roller 91. In this way, the roll-shaped protective sheet 220 installed in the sheet installation section 80 is pulled out and passed to the winding section 90 which winds up the protective sheet 220. In Embodiment 1, during the alignment process 301, when the control unit 100 receives an instruction from an operator or the like to start a split operation, the braking device 1 starts the split operation, i.e., the alignment process 301 in Embodiment 1.

[0071] In Embodiment 1, during the alignment process 301, the braking device 1 controls the Z-axis movement unit 34 via the control unit 100 to lower the lower clamping unit 41, the cylinder unit 51 of the upper clamping unit 50 to retract the rod 55, and the lifting unit 36 ​​to raise the upper clamping unit 50 and the pressing bar 60. Also in Embodiment 1, during the alignment process 301, the braking device 1 controls the second X-axis movement unit 61 via the control unit 100 to adjust the position of the pressing bar 60 in the X-axis direction so that the distance in the X-axis direction between the lower end of the upper clamping member 52 and the lower end of the pressing bar 60 is 75% to 85% of the width of the chip 210 included in the division conditions. However, in the present invention, it is sufficient to adjust the position of the pressing bar 60 in the X-axis direction so that the distance in the X-axis direction between the lower end of the upper clamping member 52 and the lower end of the pressing bar 60 is 65% to 95% of the width of the chip 210.

[0072] Furthermore, in Embodiment 1, during the alignment process 301, the braking device 1 controls the X-axis movement unit 30 via the control unit 100 to retract the frame fixing unit 10 from between the clamping units 41 and 50. In Embodiment 1, during the alignment process 301, the braking device 1 places the frame 208 of the wafer unit 211, which houses the wafer 200 in its opening 209, onto the holding surface 13 of the frame fixing unit 10. In Embodiment 1, during the alignment process 301, the braking device 1 uses the control unit 100 to operate a suction source to suck and fix the frame 208 to the holding surface 13 of the frame fixing unit 10.

[0073] In Embodiment 1, during the alignment process 301, the braking device 1 controls the X-axis movement unit 30 and the Y-axis movement unit 32 via the control unit 100 to position the detection unit 20 above the wafer 200 of the wafer unit 211. With the protective sheet 220 installed on the sheet installation section 80 retracted from between the wafer 200 and the detection unit 20, the imaging camera 21 of the detection unit 20 captures an image of the surface 202 of the wafer 200. In Embodiment 1, during the alignment process 301, the braking device 1 detects the division line 203 based on the image captured by the imaging camera 21 of the detection unit 20 via the control unit 100. In Embodiment 1, the alignment process 301 may be performed at predetermined timings, such as each division line 203 is divided, or every five division lines 203 are divided.

[0074] (Protective sheet facing process) The protective sheet facing process 302 is a process in which the protective sheet 220, which has been installed in the sheet installation section 80, pulled out from the sheet installation section 80, and passed to the winding section 90, is brought to face the surface 202 of the wafer 200. In Embodiment 1, in the protective sheet facing process 302, the braking device 1 controls the X-axis movement unit 30 and the Y-axis movement unit 32 via the control unit 100 to position the protective sheet 220, which has been installed in the upper clamping unit 50 and the sheet installation section 80, above the surface 202 of the wafer 200 of the wafer unit 211, whose frame 208 is fixed to the frame fixing unit 10. In Embodiment 1, in the protective sheet facing process 302, the braking device 1 brings the protective sheet 220 to face the surface 202 of the wafer 200.

[0075] (Fixed process) Figure 9 is a schematic diagram showing a partial cross-section of the fixing process of the chip manufacturing method shown in Figure 8. Figure 9 omits the sheet 207. The fixing process 303 is a process of fixing a protective sheet 220 facing the surface 202 side to at least the first region 212 of the device 204, which is a second region adjacent to the planned division line 203 of the wafer 200 on the opposite side of the first region 212 to the planned division line 203. In Embodiment 1, in the protective sheet facing process 302, the braking device 1 controls the rotational drive mechanism of the frame fixing unit 10 by the control unit 10, so that the frame fixing unit 10 positions the planned division line 203 of the wafer unit 211 to which the frame 208 is fixed, parallel to one direction of the wafer 200, parallel to the Y-axis direction.

[0076] In Embodiment 1, during the fixing step 303, the braking device 1 is positioned upward from the rotating body 43 by a control unit 100 controlling the rotation mechanism to place a rectangular clamping member 44, having a length corresponding to the division line 203 (hereinafter indicated by reference numeral 203-1) that will be divided first. In Embodiment 1, the chip is divided sequentially from the division line 203-1 located at one end of the plurality of division lines 203 toward the division line 203 located at the other end, and in Figure 9, the division is explained assuming that the division line 203-1 located at the very end is divided first.

[0077] In Embodiment 1, during the fixing step 303, the braking device 1 controls the X-axis movement unit 30 and the Y-axis movement unit 32 based on the position of the division line 203 detected by the control unit 100 in the alignment step 301, and positions the lower end of the upper clamping member 52 above the first region 212 (in Embodiment 1, the region on the outer periphery of the wafer 200 where device 204 is not formed) adjacent to the division line 203-1 and away from the other end of the division line 203-1, and the lower end of the rectangular clamping member 44 below the first region 212, and the upper end of the rectangular clamping member 44 below the first region 212.

[0078] In Embodiment 1, during the fixing step 303, the braking device 1 controls the Z-axis movement unit 34 via the control unit 100 to raise the rotating body 43 and the rectangular clamping member 44, thereby pressing the first region 212 adjacent to the planned division line 203-1 of the wafer 200 upward via the sheet 207. As a result, the wafer 200 rises, and the first region 212 contacts the lower end of the upper clamping member 52 via the protective sheet 220. In this invention, during the fixing step 303, the braking device 1 may either lower the upper clamping member 52 after the rotating body 43 and the rectangular clamping member 44 have risen, or it may lower the upper clamping member 52 simultaneously with the rising of the rotating body 43 and the rectangular clamping member 44 to clamp the wafer 200. Furthermore, in the present invention, in the fixing step 303, the upper clamping member 52 and the rectangular clamping member 44 may be positioned to grip the wafer 200 at a position where the wafer 200 neither rises nor falls. In this case, there is the advantage that no unnecessary load is placed on the wafer 200.

[0079] Thus, in Embodiment 1, in the fixing step 303, as shown in Figure 9, the braking device 1 clamps the first region 212 adjacent to the planned division line 203-1 of the wafer 200 between the clamping members 44 and 52 via the protective sheet 220 and sheet 207, thereby fixing the protective sheet 220 to the surface 202 side of the first region 212. In this way, in Embodiment 1, the fixing step 303 is performed by clamping the wafer 200 and the protective sheet 220 between the pair of clamping members 44 and 52 to bring them into contact.

[0080] (Pinching process) Figure 10 is a schematic diagram showing a partial cross-section of the clamping process of the chip manufacturing method shown in Figure 8. Figure 10 omits the sheet 207. The clamping process 304 is a process in which, after performing the fixing process 303, the wafer 200 and the protective sheet 220 that overlaps the device 204-1, which is the second region adjacent to the first region 212 on the opposite side of the planned division line 203-1 in a plan view, are clamped by a pair of clamping members 44 and 52.

[0081] In Embodiment 1, during the clamping process 304, the braking device 1 has a control unit 100 that controls the Z-axis movement unit 34 to lower the rotating body 43 and the rectangular clamping member 44. In Embodiment 1, during the clamping process 304, the braking device 1 has a control unit 100 that controls the X-axis movement unit 30 and the Y-axis movement unit 32 to position the lower end of the upper clamping member 52 above the device 204-1 and the upper end of the rectangular clamping member 44 below the device 204-1.

[0082] In Embodiment 1, during the clamping step 304, the braking device 1 controls the sheet installation section 80 and the Z-axis movement unit 34 via the control unit 100, which feeds the protective sheet 220 from the sheet installation section 80 toward the winding section 90 while raising the rotating body 43 and the rectangular clamping member 44 to press the device 204-1 of the wafer 200 upward via the sheet 207. As a result, the wafer 200 rises, and the device 204-1 contacts the lower end of the upper clamping member 52 via the protective sheet 220. In addition, in the present invention, during the clamping step 304, the braking device 1 may clamp the protective sheet 220 that is overlapping the device 204-1 with the clamping members 44 and 52 without feeding out the protective sheet 220. In this case, the protective sheet 220 may be loosened beforehand, or it may be stretched by the elasticity of the protective sheet 220 without being loosened. Furthermore, in the present invention, in the fixing step 303, the upper clamping member 52 and the rectangular clamping member 44 may be positioned to target a position where the wafer 200 neither rises nor falls, and the protective sheet 220 overlapping the device 204-1 may be clamped by the clamping members 44 and 52. In this case, there is the advantage that no unnecessary load is placed on the wafer 200.

[0083] Thus, in Embodiment 1, during the clamping step 304, the braking device 1 clamps the wafer 200 and the protective sheet 220 overlapping the device 204-1 with clamping members 44 and 52, as shown in Figure 10, and fixes the protective sheet 220 to the surface 202 side of the device 204-1. At this time, in Embodiment 1, the lower end of the pressing bar 60 is located above the surface 202 of the wafer 200. In Embodiment 1, during the clamping step 304, once the braking device 1 clamps the device 204-1, the protective sheet 220 and the sheet 207 with clamping members 44 and 52, it stops feeding the protective sheet 220 from the sheet installation section 80.

[0084] (splitting process) Figure 11 is a schematic diagram showing a partial cross-section of the splitting process of the chip manufacturing method shown in Figure 8. The splitting process 305 is a process in which, after performing the clamping process 304, the wafer 200 is split along the planned splitting line 203-1 by pressing the pressing bar 60 against the protective sheet 220 fixed in the first region 212.

[0085] In Embodiment 1, during the splitting process 305, the braking device 1, based on the splitting conditions, has the control unit 100 control the lifting unit 36 ​​to lower the movable base 5 and the pressing bar 60 of the upper clamping unit 50 while the wafer 200 and protective sheet 220 are clamped between the clamping members 44 and 52. As a result, the upper clamping member 52 clamps the device 204-1 adjacent to the planned splitting line 203-1 of the wafer 200 between itself and the rectangular clamping member 44 via the protective sheet 220 and sheet 207, so the rod 55 of the cylinder unit 51 retracts without the upper clamping member 52 descending, and the upper clamping member 52 rises relative to the movable base 5 by the slide unit 53.

[0086] Furthermore, as the movable base 5 and the pressing bar 60 of the upper clamping unit 50 descend, the lower end of the pressing bar 60 contacts the first region 212 adjacent to the planned division line 203-1 on the opposite side of the clamping units 41 and 50 on the surface 202 of the wafer 200 via the protective sheet 220. As the pressing bar 60 descends further, as shown in Figure 11, the lower end of the pressing bar 60 is positioned below the lower end of the upper clamping member 52, dividing the planned division line 203-1 between the clamping members 44 and 52 and the pressing bar 60.

[0087] In Embodiment 1, during the division process 305, the control unit 100 determines the division result of the division line 203-1 to be divided based on the load value measured by the load cell 71, and stores the determined division result in association with the division line 203-1.

[0088] (Peeling process) Figure 12 is a schematic diagram showing a partial cross-section of the peeling process of the chip manufacturing method shown in Figure 8. The peeling process 306 is a process in which the protective sheet 220 is peeled off from the first region 212 of the wafer 200 after the division process 305 has been carried out. In Embodiment 1, in the peeling process 306, the braking device 1 is controlled by the control unit 100, which controls the lifting unit 36 ​​to raise the movable base 5 and the pressing bar 60.

[0089] In Embodiment 1, during the peeling step 306, the braking device 1 controls the winding unit 90 with the control unit 100, which holds the wafer 200 and the protective sheet 220 between the clamping members 44 and 52, and then winds up the protective sheet 220 with the winding unit 90, peeling the protective sheet 220 from the surface 202 of the first region 212, as shown in Figure 12. In Embodiment 1, during the peeling step 306, once the protective sheet 220 has been peeled from the surface 202 of the first region 212, the braking device 1 stops winding up the protective sheet 220 with the winding unit 90. Thus, in Embodiment 1, the peeling step 306 is performed by the winding unit 90 winding up the protective sheet 220.

[0090] In the chip manufacturing method according to Embodiment 1, the braking device 1 determines whether the control unit 100 has divided all of the division lines 203 parallel to one direction of the wafer 200 (step 307). In the chip manufacturing method according to Embodiment 1, if the braking device 1 determines that the control unit 100 has not divided all of the division lines 203 parallel to one direction of the wafer 200 (step 307: No), it returns to the clamping step 304.

[0091] In the return clamping step 304, the braking device 1 positions a rectangular clamping member 44 upward from the rotating body 43, with a length corresponding to the pre-division division line 203 (hereinafter referred to as reference numeral 203-2) adjacent to the already divided division line 203-1. In the return clamping step 304, the braking device 1 clamps a device 204 (hereinafter referred to as device 204-2), etc., adjacent to the pre-division division line 203-2, which does not have a protective sheet 220 fixed to it, with the clamping members 44 and 52, thereby fixing the protective sheet 220 to device 204-2. Subsequently, in the division step 305, the division line 203-2 is divided by the pressing bar 60, etc., and in the peeling step 306, the protective sheet 220 is peeled off from device 204-1.

[0092] Thus, the chip manufacturing method according to Embodiment 1 repeats the clamping step 304, the splitting step 305, and the peeling step 306, that is, the clamping step 304 and the peeling step 306 are performed each time the splitting step 305 is performed, and the chip is sequentially split from the splitting line 203 located at one end of the plurality of splitting lines 203 toward the splitting line 203 located at the other end, thereby splitting all of the splitting lines 203 that are parallel to one direction.

[0093] In the chip manufacturing method according to Embodiment 1, when the braking device 1 determines that the control unit 100 has divided all of the division lines 203 parallel to one direction of the wafer 200 (Step 307: Yes), the frame fixing unit 10 is rotated 90 degrees around its axis by the rotational drive mechanism, and then the fixing step 303, clamping step 304, division step 305, peeling step 306, etc. of the chip manufacturing method shown in Figure 8 are performed to divide all of the division lines 203 parallel to the other direction. When the braking device 1 has divided all of the division lines 203 of the wafer 200 and divided the wafer 200 into individual chips 210, the division operation is terminated. After that, the divided chips 210 are picked up from the sheet 207.

[0094] The chip manufacturing method and breaking device 1 according to Embodiment 1 described above can be modified by simply installing a sheet installation section 80 and a winding section 90, which allows the pressing bar 60 to be pressed against the protective sheet 220 to split the wafer 200. As a result, the chip manufacturing method and breaking device 1 according to Embodiment 1 has the effect of splitting the wafer 200 through the protective sheet 220 while suppressing the complexity of the device configuration.

[0095] Furthermore, the chip manufacturing method and braking device 1 according to Embodiment 1 peel off the protective sheet 220 by winding it up in the winding section 90, thus enabling the peeling off of the protective sheet 220 after division while suppressing complexity of the device configuration.

[0096] [Embodiment 2] A chip manufacturing method and a braking device according to Embodiment 2 will be described based on the drawings. Figure 13 is a schematic diagram showing a partial cross-section of the fixing process of the chip manufacturing method according to Embodiment 2. Figure 14 is a schematic diagram showing a partial cross-section of the clamping process of the chip manufacturing method according to Embodiment 2. Figure 15 is a schematic diagram showing a partial cross-section of the splitting process of the chip manufacturing method according to Embodiment 2. Figure 16 is a schematic diagram showing a partial cross-section of the peeling process of the chip manufacturing method according to Embodiment 2. Note that Figures 13, 14, 15, and 16 use the same reference numerals as Embodiment 1 for the same parts and their descriptions are omitted. Figures 13 and 14 omit sheet 207.

[0097] As shown in Figure 13, the braking device 1 according to Embodiment 2 includes an adhesive roller 81 that rolls on a protective sheet 220 on the surface 202 of the wafer 200 of the wafer unit 211 fixed by the frame fixing unit 10. In Embodiment 2, the adhesive roller 81 may be a fixed roller or a movable roller; in short, it just needs to move relative to the frame fixing unit 10. Also in Embodiment 2, a support or support roller may be provided that contacts the underside of the wafer unit 211 when the protective sheet 220 is attached with the adhesive roller 81. In Embodiment 2, the braking device 1 performs the alignment process 301 and the protective sheet facing process 302 in the same manner as in Embodiment 1. In Embodiment 2, in the fixing process 303, the braking device 1 presses the protective sheet 220 against the surface 202 of the wafer 200 with the rolling adhesive roller 81 to fix the protective sheet 220 to the entire surface 202 of the wafer 200.

[0098] In Embodiment 2, during the clamping step 304, the braking device 1 clamps the wafer 200 and the protective sheet 220 overlapping the device 204-1 with clamping members 44 and 52, as shown in Figure 14, similar to Embodiment 1. In Embodiment 2, during the splitting step 305, the braking device 1, as shown in Figure 15, splits the wafer 200 along the planned splitting line 203-1 by pressing the pressing bar 60 against the protective sheet 220, similar to Embodiment 1. In Embodiment 2, during the peeling step 306, the braking device 1, as shown in Figure 16, peels the protective sheet 220 from the first region 212 by winding it up with the winding unit 90, similar to Embodiment 1. In Embodiment 2, the braking device 1 then splits the wafer 200 into individual chips 210, similar to Embodiment 1. In Embodiment 2, the peeling step 306 may involve peeling off the protective sheet 220 each time a division line 203 is divided, or it may involve peeling off the protective sheet 220 only after all division lines 203 have been completed.

[0099] The chip manufacturing method and breaking device 1 according to Embodiment 2, through a simple improvement of installing a sheet installation section 80 and a winding section 90, makes it possible to press the pressing bar 60 against the protective sheet 220 to split the wafer 200. Similar to Embodiment 1, it has the effect of splitting the wafer 200 through the protective sheet 220 while suppressing the complexity of the device configuration.

[0100] It should be noted that the present invention is not limited to the embodiments described above. That is, it can be implemented with various modifications without departing from the core principles of the present invention. In the present invention, a concave processing groove may be formed on the wafer 200 from the surface 202 along the planned division line 203 as a division starting point 205. The processing groove is formed by cutting along the planned division line 203, or by irradiating the planned division line 203 with a laser beam of a wavelength that is absorbed by the wafer 200. [Explanation of symbols]

[0101] 1. Braking device (split device) 10 Frame Fixing Unit 44 Rectangular clamping member (clamping bar) 52 Upper clamping member (clamping bar) 60 Pressure Bars 80 Seat installation area 90 Winding section 200 wafers 202 Front (first side) 203 planned division lines 204-1 Device (adjacent region, second region) 205 Split starting point 206 Reverse side (page 2) 207 seats 208 frames 211 Wafer Unit 212 1st area 220 protective sheets 301 Alignment Process 302 Protective Sheet Face-to-Face Process 303 Fixed process 304 Clamping process 305 Splitting process 306 Peeling process

Claims

1. A chip manufacturing method in a splitting apparatus for manufacturing chips by splitting a wafer, which has a first surface and a second surface opposite to the first surface and has a splitting starting point formed along a planned splitting line, along the planned splitting line, A protective sheet facing step involves pulling out a roll-shaped protective sheet installed in the sheet installation section, passing it to a winding section that winds the protective sheet, and facing the protective sheet toward the first surface of the wafer. A fixing step of fixing the protective sheet facing the first surface to at least the first region of the wafer, which is adjacent to the planned division line and a second region adjacent to the wafer on the opposite side of the planned division line from the first region, After performing the fixing step, a clamping step is performed in which the wafer and the protective sheet that overlaps the second region in a plan view are clamped by a pair of clamping bars. After performing the clamping step, a dividing step is performed in which the wafer is divided along the planned dividing line by pressing a pressing member against the protective sheet fixed in the first region, A method for manufacturing a chip equipped with the following features.

2. The method for manufacturing a chip according to claim 1, characterized in that the fixing step is carried out by clamping the wafer and the protective sheet with the pair of clamping bars in the first region of the wafer.

3. The method for manufacturing a chip according to claim 1 or 2, further comprising an alignment step for imaging the first surface and detecting the planned division lines before the fixing step.

4. The method for manufacturing a chip according to claim 1 or 2, further comprising a peeling step of peeling the protective sheet from the first region of the wafer after performing the dividing step.

5. The chip manufacturing method according to claim 4, characterized in that the peeling step is carried out by the winding unit winding up the protective sheet.

6. The method for manufacturing a chip according to claim 4, characterized in that the clamping step and the peeling step are performed each time the dividing step is performed.

7. The method for manufacturing a chip according to claim 4, characterized in that the protective sheet is self-adhesive.

8. A wafer unit comprising a wafer having multiple division lines set and division starting points formed along each division line, a sheet to which the wafer is attached, and a frame to which the outer periphery of the sheet is attached, and a frame fixing unit for fixing the frame, A detection unit that detects the planned division lines of the wafer unit to which the frame is fixed using the frame fixing unit, A pair of clamping bars that clamp the wafer in the region adjacent to the division line to be divided from above and below the wafer unit, A pressing bar that presses the wafer in a region adjacent to the division line on the opposite side of the pair of clamping bars, straddling the division line to be divided, thereby braking the wafer along the division line to be divided, A sheet installation section for installing a roll-shaped protective sheet, A winding unit that pulls out the protective sheet installed in the sheet installation section and winds up the protective sheet that has passed between the pair of clamping bars, A dividing device equipped with the following features.

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