Ceramic core inductor component

Abstract

We provide ceramic core inductor components that can be configured for mounting on printed circuit boards for radio frequency applications. [Solution] The ceramic core inductor component 100 comprises a conductive coil 120 which is arranged around a portion of a ceramic core 110 with a dielectric constant of 8 or less, and is electrically connected to conductive pads arranged on corresponding standoffs 124, 126.

Description

Technical Field

[0001] Field of Disclosure The present disclosure generally relates to non-magnetic inductor components, and more particularly to ceramic core inductor components configured to be mounted on a printed circuit board for radio frequency (RF) applications.

[0002] Background Ceramic core inductor components are increasingly integrated with electrical circuits and host devices that are being miniaturized for use in certain radio frequency (RF) applications where size reduction and performance are of utmost importance. Such applications include, among others, handheld communication devices, laptop computers, military and civilian aircraft, and spacecraft. In these and other applications, ceramic core inductors generally exhibit better performance than ferrite core inductors. The performance improvement is largely due to the low magnetic permeability of the ceramic core. Ceramic core inductors store energy more efficiently than ferrite core inductors and have a higher quality (Q) factor, a higher self-resonant frequency (SRF), and better temperature stability. Nevertheless, further performance improvement of ceramic core inductor components is continuously required.

[0003] Brief Description of the Drawings The objects, features, and advantages of the present disclosure will become more fully apparent by considering the following detailed description in conjunction with the accompanying drawings and the appended claims. The drawings illustrate only representative embodiments and implementations and are not considered to limit the application of the teachings of the present disclosure or the present invention, the scope of which is indicated by the appended claims.

Brief Description of the Drawings

[0004] [Figure 1] A perspective view of a representative ceramic core inductor component. [Figure 2]Figure 1 is a side view of the inductor component. [Figure 3] Figure 2 is a partial side cross-sectional view of an inductor component. [Figure 4] Figure 2 is a bottom view of the inductor component. [Figure 5] This is a typical ceramic core blank. [Figure 6] Figure 5 is an end view of the ceramic core blank. [Figure 7] This is an alternative ceramic core blank. [Figure 8] Figure 7 is a side view of the ceramic core blank, which includes an electrical termination formed on a standoff. [Figure 9] Figure 8 is a bottom view of the ceramic core blank. [Figure 10] A comparative plot of the Q coefficient versus frequency for the prior art and the 1 microhenry (μH) ceramic core inductor component of this disclosure is shown. [Figure 11] Figure 10 shows a comparison plot of inductance versus frequency for a 1μH ceramic core inductor component. [Figure 12] A comparative plot of the Q coefficient versus frequency for the prior art and the 470 nanohenry (nH) ceramic core inductor component of this disclosure is shown. [Figure 13] Figure 12 shows a comparison plot of inductance versus frequency for a 470 nH ceramic core inductor component. [Figure 14] A comparative plot of the Q coefficient versus frequency for the prior art and the 12 nanohenry (nH) ceramic core inductor components of this disclosure is shown. [Figure 15] Figure 14 shows a comparison plot of inductance versus frequency for a 12nH ceramic core inductor component.

[0005] A person skilled in the art will understand that drawings are provided for simplification and clarity and are therefore not drawn to scale, may not include well-known features, the order in which actions or processes occur may differ from the typical order in which they are described, some or all of such actions or processes may be performed simultaneously unless otherwise specified, and that terms and expressions used herein have meanings to be understood by a person skilled in the art unless different meanings are specifically given to them.

[0006] Detailed explanation This disclosure relates to ceramic core inductor components for radio frequency (RF) applications, generally characterized by improved performance. The ceramic core inductor components described herein are suitable for use in a variety of other electrical circuits, including filters, low-noise amplifiers (LNAs), power supplies, oscillators, impedance matching circuits, servos, and other controllers. Such circuits are found in many other systems and applications, including space and ground communication systems, radar systems, and automotive, medical, industrial, and consumer electronics.

[0007] The ceramic core inductor components described herein generally comprise a conductive coil wound around a ceramic core. In Figures 1 to 3, a typical inductor component 100 comprises a ceramic core 110 supporting a conductive coil 120 wound around a body portion of the ceramic core between a first ceramic standoff and a second ceramic standoff of the ceramic core. The conductive coil has ends electrically connected to corresponding electrical terminals (also referred to herein as “terminants”) integrated with the ceramic core. These and other embodiments of ceramic core inductor components are further described herein.

[0008] The ceramic core inductor components described herein have a dielectric constant (κ) selected to reduce parasitic losses (e.g., parasitic capacitance) and thereby improve inductor performance. The improved performance is characterized by a higher quality (Q) coefficient and a higher self-resonant frequency (SRF) than comparable conventional ceramic core inductors. The Q coefficient is the ratio of the inductive reactance to the resistance of the inductor X L / R L Therefore, inductive reactance is a function of inductance L and parasitic capacitance. The reason SRF is large is because the parasitic capacitance is small.

[0009] Dielectric constant is a material property considered in the design of capacitors, not inductors. However, the inventors of the ceramic core inductors described herein have recognized that the self-resonant frequency (SRF) of a ceramic core inductor is inversely proportional to the dielectric constant (κ) of the ceramic core, and that the performance of the inductor can be improved by appropriately selecting the ceramic core based on the κ value. Representative ceramic core inductor components described herein with a κ value of 8 or less have been shown to have improved quality (Q) coefficient and SRF compared to conventional ceramic core inductors with higher κ values. Representative ceramic core inductors and ceramic compositions therefor are described herein.

[0010] In Figures 5 and 6, a typical ceramic core blank 122 comprises a body portion 112 between a first flange 114 and a second flange 116 that extend radially beyond the outer circumference 113 of the body portion. Each flange or part thereof includes a mounting surface that constitutes a standoff for mounting on the host mounting surface 102. In Figure 5, the standoffs 124 and 126 each include corresponding end faces 115 and 117 on which electrical terminals can be located, as will be further described herein. Alternatively, the termination can be located on a portion of the ceramic core away from the standoffs 124 and 126.

[0011] Both the body portion and the radial flange may have a polygonal cross-section, for example, a square cross-section as shown in Figure 6. In other embodiments, both the body portion and the flange may have a circular cross-section, and each flange may have one or more flat surfaces for surface mounting or electrical terminals, as described herein. Alternatively, the body portion may have a circular cross-section and the flange may have a polygonal cross-section. In yet another embodiment, the ceramic core blank does not have a flange extending radially outward from the body portion.

[0012] In Figure 7, the alternative ceramic core blank 128 comprises a body portion 112 located between a first flange and a second flange, the first flange and the second flange comprising corresponding standoffs 124 and 126, the standoffs 124 and 126 having corresponding mounting surfaces 115 and 117, respectively. The alternative ceramic core blank 128 has a quadrilateral polygonal cross-section, and the standoffs extend beyond the outer perimeter portion 113 of at least one side of the body portion.

[0013] The ceramic cores shown in Figures 5 to 9 may include other shapes and configurations and can be formed by hydrostatic pressure, mechanical pressing, or molding, among other known and future ceramic molding operations before firing.

[0014] The components of a ceramic core composition generally depend on the required performance characteristics of the inductor component. A ceramic core may contain one or more of the following, either alone or in combination with other elements or compounds: calcium tungstate-strontium silicate, magnesium silicate, magnesium aluminate, magnesium aluminum silicate, calcium silicate, zinc silicate, aluminum silicate, or silica, or two or more combinations thereof. All of the above elements or compounds have a dielectric constant (κ) of 8 or less. Aluminum silicate, magnesium aluminum silicate, and silica all have a dielectric constant of 6 or less. Magnesium aluminum silicate and silica have a dielectric constant of 5 or less.

[0015] In certain embodiments, the ceramic core includes magnesium aluminum silicate, magnesium silicate, and magnesium aluminate, each exceeding 5 percent (5%) by weight. In more specific embodiments, the ceramic core includes magnesium aluminum silicate exceeding 15 percent (15%) by weight, magnesium aluminate exceeding 5 percent (5%) by weight, and magnesium silicate exceeding 10 percent (10%) by weight, and the dielectric constant of the ceramic core is 6 or less. In these and other embodiments, the ceramic core can optionally include other components, such as fillers or additives.

[0016] In an alternative embodiment, the ceramic core includes 41 - 54% silicon dioxide, 27 - 38% aluminum oxide, and 10 - 17% magnesium oxide by weight, and the dielectric constant of the ceramic core is 5 or less. Other components of this alternative composition can include up to 12% tin oxide, up to 7% titanium oxide, and up to 2% lanthanum oxide, among other additives. These or other additives to the ceramic core composition can increase the dielectric constant slightly and can exceed 5.

[0017] The conductive coil has an end electrically connected to a corresponding electrical terminal integrated with the ceramic core. The terminal can be configured as a corresponding standoff or a metallization or other conductive pad located on other parts of the ceramic core, depending on how the component is electrically integrated (e.g., mounted) with the host device. In FIGS. 8 - 9, the first terminals and the second terminals 130, 132 are formed on the end faces of the first standoff and the second standoff (shown in FIGS. 5 and 7). FIGS. 2 - 4 show different views of the electrical terminals 130 and 132. Each electrical terminal can optionally wrap around and cover the side wall portion of the corresponding standoff to increase the contact area between the terminal and the ceramic core, as shown in FIGS. 2 - 3 and FIGS. 8 - 9. In FIGS. 8 - 9, the terminals 130, 132 on the end face of the standoff constitute the mounting surface. When configured in this way, the ceramic core inductor component can be electrically and mechanically integrated with a host device (e.g., a PCB) by reflow or wave soldering or some other electrical and mechanical integration operation.

[0018] In other embodiments, the electrical terminal can be located on a surface other than the mounting surface of the ceramic core. When configured in this way, the mounting surface of the ceramic core inductor component can be mechanically fixed to the host device (e.g., by a bonding material), and the electrical terminals located on different parts of the ceramic core can be electrically integrated with the host device by wire bonding, soldering, or some other conductor connection means.

[0019] In one embodiment, the electrical terminal comprises a conductive base layer plated with one or more conductive outer layers. The base layer can include silver or some other highly conductive metal or alloy. In one embodiment, the base layer includes a silver (Ag) frit deposited on a selected portion of the ceramic core (e.g., the standoff mounting surface). Other conductors can be used alternatively. The base layer can be applied to the ceramic core by dipping or other known or future operations.

[0020] The outermost conductive layer can be formed directly on the base layer or on the intermediate conductive layer. The outermost conductive layer composition can be selected to improve solderability (e.g., improved wettability) and oxidation resistance, among other properties of the termination. In one embodiment, the outermost conductive layer is tin (Sn) or a tin alloy (e.g., SnPb). Other conductors can be used as alternatives. The conductive outermost layer can be applied to the base layer or intermediate layer in an electroplating operation, among other known or future processes.

[0021] In some embodiments, an intermediate conductive layer is located between the base layer and the outermost conductive layer to protect the base layer. For example, the intermediate layer may have a higher melting temperature than the base layer. In one embodiment, the intermediate layer contains copper (Cu). Alternatively, the intermediate layer may be nickel (Ni) or some other conductor or alloy. The conductive intermediate layer can be applied to the base layer in an electroplating operation, among other known or future processes.

[0022] In other embodiments, the electrical terminals include a silver-platinum-palladium (AgPtPd) alloy deposited on a selected portion of the ceramic core. Other platinum group metals or alloys can be used as alternatives. Representative low-melting-point solders developed for surface-mount ceramic component terminations containing such alloys include solder type Sn62, among others. The electrical terminals can be applied to the ceramic core by immersion or other known or future operations.

[0023] Conductive coils can comprise solid or hollow core wires. In one embodiment, the conductive coil is formed from solid copper wire, among other good conductors. In another embodiment, the conductive coil comprises a non-copper (e.g., aluminum) inner core plated with copper or silver. The wire may optionally comprise a non-conductive outer sheath, such as enameled, for electrical insulation. In the coil winding operation after terminal formation, it can be wound around a ceramic core. The ends of the conductive coil can be electrically connected to corresponding terminals by spot welding or other welding operations, soldering, wire bonding or any other electrical integration operation. In some embodiments, the ends of the conductive coil are flattened before electrical integration. In Figure 4, each end 121, 123 of the conductive coil 120 is electrically integrated with corresponding terminals 130, 132 located on the end faces of the corresponding standoffs.

[0024] The ceramic core inductor components described herein can be configured for surface mounting or other integration with a host device. In Figure 2, the first and second standoffs are positioned so that the axis of the conductive coil is parallel to the host's mounting surface 102 when the ceramic core inductor component 100 is mounted on the mounting surface. The first and second standoffs 124 and 126 are sized to separate the conductive coil from the mounting surface when the ceramic core inductor component is mounted on the mounting surface.

[0025] In some embodiments, the ceramic core inductor component includes a non-conductive handle to accommodate automated pick-and-place assemblies and other component handling operations. The non-conductive handle covers at least a portion of the inductor component. In Figures 2–4, the ceramic core inductor component 100 includes a non-conductive handle 136 located on the portion of the ceramic core opposite the standoff. In other embodiments, the non-conductive handle covers all portions of the inductor component except for the electrical terminals. The non-conductive handle may include epoxy, plastic, resin, or other non-conductive materials. The non-conductive handle can be applied by dipping, spraying, or other application operations after the coil has been assembled around the ceramic core.

[0026] Typical dimensions of the ceramic core inductor components described herein are shown in Table I below. “Size” refers to the length and width dimensions of the mounting surface area of ​​the component. The size range disclosed below is typical for surface mount components and is not intended to limit the scope of this disclosure. In other embodiments, the ceramic core inductors described herein may be larger or smaller than the sizes shown below, depending on the electrical and performance requirements and integration constraints of the intended use case.

[0027] [Table 1]

[0028] The inductance of a ceramic core inductor component is a function of the coil shape (e.g., the number of coil turns, length, and cross-sectional area) and the permeability of the ceramic core and surrounding materials. Therefore, the range of inductance values ​​for ceramic core inductor components described herein is generally constrained by the size of the component and the properties of the ceramic core and surrounding materials. Typical minimum inductance values ​​for representative ceramic core inductor component sizes in Table I range from 0.8 nH to 3 μH. However, the inductance may be larger or smaller depending on the electrical and performance requirements of the intended use case and integration constraints.

[0029] Table II below shows the measured characteristics of a conventional 1 μH ceramic core inductor and a 1 μH ceramic core inductor with a dielectric constant of 5 or less according to the present invention. Both inductors have an inductance of 1 μH and a tolerance of 10% or less. The inductor according to the present invention has higher minimum and maximum Q coefficients, as well as a higher SRF, than the conventional inductor. Size refers to the length and width dimensions of the component (i.e., 2.5 mm × 2.0 mm).

[0030] [Table 2]

[0031] Figure 11 shows a plot of Q coefficient versus frequency measured for the 1 μH ceramic core inductor shown in Table II. The higher Q coefficient of the ceramic core inductor of the present invention indicates higher efficiency (i.e., reduced parasitic losses) and therefore improved performance compared to conventional inductors. Figure 12 shows a plot of inductance versus frequency measured for the 1 μH ceramic core inductor shown in Table II.

[0032] Table III below shows the measured characteristics of a 470 nH ceramic core inductor of the prior art and a 470 nH ceramic core inductor with a dielectric constant of 5 or less according to the present invention. Both inductors have an inductance of 470 nH and a tolerance of 5% or less. The inductor according to the present invention has higher minimum and maximum Q coefficients, as well as a higher SRF, than the inductor of the prior art. Size refers to the length and width dimensions of the component (i.e., 2.5 mm × 2.0 mm).

[0033] [Table 3]

[0034] Figure 13 shows a plot of Q coefficient versus frequency measured for the 470 nH ceramic core inductor shown in Table III. The higher Q coefficient of the ceramic core inductor of the present invention indicates higher efficiency (e.g., reduced parasitic losses) and therefore improved performance compared to conventional inductors. Figure 14 shows a plot of inductance versus frequency measured for the 470 nH ceramic core inductor shown in Table III.

[0035] Table IV below shows the measured characteristics of a 12nH ceramic core inductor of the prior art and a 12nH ceramic core inductor with a dielectric constant of 5 or less according to the present invention. Both inductors have an inductance of 470nH and a tolerance of 5% or less. The inductor according to the present invention has higher minimum and maximum Q coefficients, as well as a higher SRF, than the inductor of the prior art. Size refers to the length and width dimensions of the component (i.e., 2.5mm × 2.0mm).

[0036] [Table 4]

[0037] Figure 15 shows a plot of Q coefficient versus frequency measured for the 12 nH ceramic core inductor shown in Table IV. The higher Q coefficient of the ceramic core inductor of the present invention indicates higher efficiency (e.g., reduced parasitic losses) and therefore improved performance compared to conventional inductors. Figure 16 shows a plot of inductance versus frequency measured for the 12 nH ceramic core inductor shown in Table IV.

[0038] While the present disclosure and what is now considered its best form have been described in a manner that demonstrates ownership and enables a person skilled in the art to manufacture and use it, it is understood and recognized that there are many equivalents to the representative embodiments described herein, and that countless modifications and variations can be made without departing from the scope and spirit of the invention, and that should be limited not by the described embodiments but by the appended claims and their equivalents.

[0039] Claims

Claims

1. A ceramic core inductor component, A ceramic core comprising a ceramic body portion located between a first ceramic standoff and a second ceramic standoff, A ceramic core containing a dielectric constant of less than 8, A conductive coil is arranged around the ceramic body portion, A first terminal disposed on the first surface of the first ceramic standoff and a second terminal disposed on the second surface of the second ceramic standoff, The first end of the conductive coil electrically connected to the first terminal and the second end of the conductive coil electrically connected to the second terminal, A ceramic core inductor component equipped with the following features.

2. The ceramic core inductor component according to claim 1, wherein the first terminal and the second terminal each have conductive pads, and the first ceramic standoff and the second ceramic standoff are each positioned so that the axis of the conductive coil is parallel to the mounting surface when the ceramic core inductor component is mounted on the mounting surface.

3. The ceramic core inductor component according to claim 2, further comprising a non-conductive handle fixed to the ceramic core and covering at least partially the conductive coil.

4. The ceramic core inductor component according to any one of claims 1 to 3, wherein the ceramic core has a dielectric constant of 6 or less.

5. The ceramic core inductor component according to claim 4, which is a 1 μH inductor having a tolerance of 10% or less, including a Q coefficient greater than 50 and a self-resonant frequency greater than 400 MHz.

6. The ceramic core inductor component according to claim 4, which is a 470 nH inductor having a tolerance of 5% or less, including a Q coefficient greater than 60 and a self-resonant frequency greater than 550 MHz.

7. The ceramic core inductor component according to claim 4, which is a 12 nH inductor having a tolerance of 5% or less, including a Q coefficient greater than 80 and a self-resonant frequency greater than 3000 MHz.

8. The ceramic core inductor component according to claim 4, wherein the ceramic core comprises more than 5 percent (5%) by weight of magnesium aluminum silicate, magnesium silicate, and magnesium aluminate, respectively.

9. The ceramic core inductor component according to claim 4, wherein the ceramic core comprises, by weight, more than 15 percent (15%) of magnesium aluminum silicate, more than 5 percent (5%) of magnesium aluminate, and more than 10 percent (10%) of magnesium silicate.

10. The ceramic core inductor component according to claim 4, wherein the ceramic core comprises, by weight, 41% to 54% silicon dioxide, 27% to 38% aluminum oxide, and 10% to 17% magnesium oxide.

11. The ceramic core inductor component according to claim 10, wherein the ceramic core comprises, by weight, up to 12% tin oxide, up to 7% titanium oxide, and up to 2% lanthanum oxide.

12. The ceramic core inductor component according to any one of claims 1 to 3, wherein the ceramic core comprises one or more of calcium tungstate-strontium silicate, magnesium silicate, magnesium aluminate, magnesium aluminum silicate, calcium silicate, zinc silicate, aluminum silicate, or silica. ＞ ＞ ＞

20. A press-formed ceramic core containing a dielectric constant of 6 or less, A wire coil arranged around the ceramic core, The first end of the wire coil is electrically connected to the first terminal of the ceramic core, and the second end of the wire coil is electrically connected to the second terminal of the ceramic core, A ceramic core inductor component equipped with the following features.

21. The ceramic core inductor component according to claim 20, wherein the ceramic core comprises, by weight, 41% to 54% silicon dioxide, 27% to 38% aluminum oxide, and 10% to 17% magnesium oxide.

22. The ceramic core inductor component according to claim 21, wherein the ceramic core comprises, by weight, up to 12% tin oxide, up to 7% titanium oxide, and up to 2% lanthanum oxide.

23. The ceramic core inductor component according to claim 20, wherein the ceramic core comprises, by weight, more than 15 percent (15%) of magnesium aluminum silicate, more than 5 percent (5%) of magnesium aluminate, and more than 10 percent (10%) of magnesium silicate.

24. A ceramic core inductor component according to any one of claims 20 to 23, which is a 1 μH inductor having a tolerance of 10% or less, including a Q coefficient greater than 50 and a self-resonant frequency greater than 400 MHz.

25. A ceramic core inductor component according to any one of claims 20 to 23, which is a 470 nH inductor having a tolerance of 5% or less, including a Q coefficient greater than 60 and a self-resonant frequency greater than 550 MHz.

26. A ceramic core inductor component according to any one of claims 20 to 23, which is a 12 nH inductor having a tolerance of 5% or less, including a Q coefficient greater than 80 and a self-resonant frequency greater than 3000 MHz.

27. The ceramic core inductor component according to any one of claims 20 to 23, wherein the first terminal is a first metallized pad integrated with the first portion of the press-formed ceramic core, and the second terminal is a second metallized pad integrated with the second portion of the ceramic core.

28. The ceramic core inductor component according to claim 27, further comprising a non-conductive handle fixed to the press-formed ceramic core and covering at least partially the wire coil.

29. The ceramic core inductor component according to claim 27, which is a surface mount component of size 2520. ＞ ＞ ＞

30. A ceramic core inductor component, A ceramic core comprising a ceramic body portion located between a first ceramic standoff and a second ceramic standoff, A ceramic core having a dielectric constant of 5 or less, A wire coil arranged around the aforementioned ceramic body portion, A first conductive pad disposed on the first surface of the first ceramic standoff and a second conductive pad disposed on the second surface of the second ceramic standoff, The first standoff and the second standoff are positioned such that the axis of the wire coil is parallel to the mounting surface when the ceramic core inductor component is mounted on the mounting surface, and the first conductive pad and the second conductive pad are positioned accordingly. The first end of the wire coil electrically connected to the first conductive pad and the second end of the wire coil electrically connected to the second conductive pad, A ceramic core inductor component equipped with the following features.

31. The ceramic core inductor component according to claim 30, which is a 1 μH inductor having a tolerance of 10% or less, including a Q coefficient greater than 50 and a self-resonant frequency greater than 400 MHz.

32. The ceramic core inductor component according to claim 30, which is a 470 nH inductor having a tolerance of 5% or less, including a Q coefficient greater than 60 and a self-resonant frequency greater than 550 MHz.

33. The ceramic core inductor component according to claim 30, which is a 12 nH inductor having a tolerance of 5% or less, including a Q coefficient greater than 80 and a self-resonant frequency greater than 3000 MHz.

34. A ceramic core inductor component according to any one of claims 30 to 33, further comprising a non-conductive handle fixed to the ceramic core and covering at least partially the wire coil.

35. The ceramic core inductor component according to claim 34, which is a surface mount component of size 2520.

36. The ceramic core inductor component according to claim 35, wherein the ceramic core comprises, by weight, 41% to 54% silicon dioxide, 27% to 38% aluminum oxide, and 10% to 17% magnesium oxide.

37. The ceramic core inductor component according to claim 36, wherein the ceramic core comprises, by weight, up to 12% tin oxide, up to 7% titanium oxide, and up to 2% lanthanum oxide. ＞ ＞ ＞

1. A ceramic core inductor component subassembly, A ceramic core comprising a main body portion located between a first standoff and a second standoff, A ceramic core containing a dielectric constant of less than 8, A first conductive terminal positioned on the end face of the first standoff, A second conductive terminal positioned on the end face of the second portion of the second standoff, A ceramic core inductor component subassembly comprising the above.

2. The ceramic core inductor component subassembly according to claim 1, wherein the first conductive terminal and the second conductive terminal each comprise a base layer on the end face of the corresponding standoff and an outermost conductive layer covering the base layer.

3. The ceramic core inductor component subassembly according to claim 2, wherein the base layer contains silver and the outermost conductive layer contains tin.

4. The ceramic core inductor component subassembly according to claim 3, wherein each of the first conductive terminal and the second conductive terminal further comprises an intermediate conductive layer between the base layer and the outermost conductive layer.

5. The ceramic core inductor component subassembly according to claim 4, wherein the intermediate conductive layer comprises nickel or copper.

6. The ceramic core inductor component subassembly according to claim 1, wherein the first conductive terminal and the second conductive terminal each comprise a silver-platinum-palladium alloy deposited on the end face of the corresponding standoff.

7. The ceramic core inductor component subassembly according to claim 1, wherein the ceramic core is a press-formed ceramic, and the first conductive terminal and the second conductive terminal cover the sides of the corresponding first standoff and second standoff.

8. The ceramic core inductor component subassembly according to any one of claims 1 to 7, wherein the ceramic core has a dielectric constant of 6 or less.

9. The ceramic core inductor component subassembly according to claim 8, wherein the ceramic core comprises, by weight, more than 15 percent (15%) magnesium aluminum silicate, more than 5 percent (5%) magnesium aluminate, and more than 10 percent (10%) magnesium silicate.

10. The ceramic core inductor component subassembly according to any one of claims 1 to 7, wherein the ceramic core comprises, by weight, 41% to 54% silicon dioxide, 27% to 38% aluminum oxide, and 10% to 17% magnesium oxide, and the ceramic core has a dielectric constant of 6 or less.

11. The ceramic core inductor component subassembly according to claim 10, wherein the ceramic core comprises, by weight, up to 12% tin oxide, up to 7% titanium oxide, and up to 2% lanthanum oxide.

12. The ceramic core inductor component subassembly according to claim 10, wherein the ceramic core has a dielectric constant of 5 or less.

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