Coating apparatus and coating method

Abstract

To provide a coating apparatus capable of reducing variations in film thickness in the resulting coated film. [Solution] The coating apparatus of the embodiment comprises a coating module, a powder spraying unit, a plurality of exhaust ducts, a suction drive unit, and a partition member. The coating module forms a suction chamber adjacent to the support and a coating chamber adjacent to the support from the opposite side of the suction chamber, and the plurality of exhaust ducts communicate with the suction chambers independently of each other. The suction drive unit allows a coating film to be formed on the supported substrate by the powder sprayed into the coating chambers by introducing gas into each of the plurality of exhaust ducts. The partition member divides the suction chamber into the same number of partition spaces as the exhaust ducts, so that the plurality of exhaust ducts communicate with each other to different partition spaces.

Description

Technical Field

[0001] Embodiments of the present invention relate to a coating apparatus and a coating method.

Background Art

[0002] A coating film such as a particle film may be formed on a substrate using a coating apparatus. In such a coating apparatus, a coating module, which is an assembly of a suction table and a coating housing, is provided, and the coating module is provided with a support capable of supporting a substrate. In the coating module, the suction table forms a suction chamber adjacent to the support, and the coating housing forms a coating chamber adjacent to the support from the side opposite to the suction chamber. In forming the coating film, with the substrate supported by the support, a gas mixed with powder is injected into the coating chamber. Then, with the powder being injected into the coating chamber, gas is allowed to flow from the coating chamber through the suction chamber into an exhaust duct communicating with the suction chamber. As a result, the injected powder accumulates on the substrate supported by the support, and a coating film is formed by the accumulated powder.

[0003] When forming a coating film on a substrate as described above, it is required to reduce the variation in film thickness in the formed coating film. In particular, it is required that the variation in film thickness in the formed coating film is reduced even when the injection state of the powder into the coating chamber changes due to maintenance or the like.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem to be solved by the present invention is to provide a coating apparatus and a coating method capable of reducing the variation in film thickness in the formed coating film. [Means for solving the problem]

[0006] According to the embodiment, the coating apparatus comprises a coating module, a powder spraying unit, a plurality of exhaust ducts, a suction drive unit, and a partition member. The coating module includes a support capable of supporting a substrate, and forms a suction chamber adjacent to the support and a coating chamber adjacent to the support from the opposite side of the suction chamber. The powder spraying unit is capable of spraying powder into the coating chamber, and the plurality of exhaust ducts communicate with the suction chamber independently of each other. The suction drive unit allows a coating film to be formed on the substrate supported by the support by introducing gas from the coating chamber through the suction chamber to each of the plurality of exhaust ducts. The partition member partitions the suction chamber into the same number of divided spaces as the plurality of exhaust ducts, such that the plurality of exhaust ducts communicate with each other to different divided spaces. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic diagram showing an example of the configuration of a coating apparatus according to an embodiment. [Figure 2] Figure 2 is a schematic diagram showing the coating module of an example shown in Figure 1, with the support structure viewed from above in the height direction. [Figure 3] Figure 3 is a schematic cross-sectional view of an example coating module shown in Figure 1, passing through the suction chamber and perpendicular or approximately perpendicular to the height direction. [Figure 4] Figure 4 is a schematic flowchart illustrating an example of the control of the operation of each exhaust volume adjustment unit of the exhaust duct, performed by the control unit in the coating apparatus according to the embodiment. [Figure 5] Figure 5 is a schematic diagram showing an example of a coating apparatus according to a comparative example, in which the flow rate in each of the multiple exhaust ducts is controlled based on variations in film thickness between multiple regions. [Figure 6] Figure 6 is a schematic diagram showing an example of a coating apparatus according to an embodiment in which the flow rate in each of the multiple exhaust ducts is controlled based on variations in film thickness between multiple regions. [Figure 7] Figure 7 is a schematic diagram showing the film thickness on each of the four substrates for the coated film formed in each of the six film formation processes in Example α1, as a result of verification in the verification of the embodiments, etc. [Figure 8] Figure 8 is a schematic diagram showing the gas flow rates in each of the four exhaust ducts during each of the six film formation processes in Example α1, as a result of verification in the verification of the embodiments, etc. [Figure 9] Figure 9 is a schematic diagram showing the film thickness on each of the four substrates for the coated film formed in each of the six film formation processes in Comparative Example β1, as a result of verification in the verification of the embodiments, etc. [Figure 10] Figure 10 is a schematic diagram showing the gas flow rates in each of the four exhaust ducts during each of the six film formation processes in Comparative Example β1, as a result of verification in the verification of the embodiments, etc. [Modes for carrying out the invention]

[0008] The embodiments will be described below with reference to the drawings.

[0009] Figure 1 is a schematic diagram showing an example of the configuration of a coating apparatus 1 according to an embodiment. As shown in Figure 1, the coating apparatus 1 includes a coating module 2, in which the height direction (directions indicated by arrows H1 and H2) is defined, and a central axis C along the height direction is defined. In the coating module 2, one side in the height direction is the upper side (arrow H1 side), and the side opposite to the upper side in the height direction is the lower side (arrow H2 side). In addition, in the coating module 2, the direction around the central axis C is defined as the circumferential direction, and a radial direction that intersects (is orthogonal or nearly orthogonal to) both the height direction and the circumferential direction is defined. In the coating module 2, the side approaching the central axis C in the radial direction is the inner circumferential side, and the side moving away from the central axis C in the radial direction is the outer circumferential side. In one example, the coating film is formed when the upper side in the height direction coincides with or nearly coincides with the vertically upper side.

[0010] The coating module 2 comprises a suction table 3 and a coating housing 5 such as a coating tower. The coating housing 5 is attached to the suction table 3 from the upper side in the height direction, and the coating module 2 is formed from the assembly of the suction table 3 and the coating housing 5. In the coating apparatus 1, the coating film is formed with the coating housing 5 attached to the suction table 3. The coating housing 5 is separable (removable) from the suction table 3. A suction chamber 6 is formed inside the suction table 3. The suction table 3 covers the suction chamber 6 from both the upper and lower sides in the height direction, and also covers the suction chamber 6 from the outer periphery around its entire circumference in the circumferential direction. In the example shown in Figure 1, the suction table 3 is formed in the shape of a rectangular parallelepiped or a substantially rectangular parallelepiped with a suction chamber 6 inside.

[0011] The suction table 3 is equipped with a support 7 capable of supporting substrates P, and the support 7 covers the suction chamber 6 from above in the height direction. Therefore, in the suction table 3, the suction chamber 6 is adjacent to the support 7 from below in the height direction. The support 7 may support only one substrate P, or it may support multiple substrates P. The support 7 supports one or more substrates P from below in the height direction. In the example in Figure 1, four substrates P1 to P4 are supported by the support 7. In the suction table 3, through holes are formed in the support 7 through which gas can pass, and in one example, the support 7 is formed as a porous plate with many through holes. Therefore, gas can pass through the support 7 and can flow between the outside of the suction table 3 and the suction chamber 6 through the support 7.

[0012] A coating chamber 8 is formed inside the coating housing 5. The coating housing 5 covers the coating chamber 8 from above in the height direction, and also covers the coating chamber 8 from the outer periphery along its entire circumference in the circumferential direction. In the coating housing 5, the coating chamber 8 opens toward the bottom in the height direction. In the example shown in Figure 1, the coating housing 5 is formed in a truncated square pyramid shape or a roughly truncated square pyramid shape, with the dimensions along the radial direction decreasing toward the top in the height direction. In the coating module 2, in which the suction table 3 and the coating housing 5 are assembled, the support 7 of the suction table 3 covers the coating chamber 8 from below in the height direction. Therefore, in the coating module 2, the coating chamber 8 is adjacent to the support 7 from above in the height direction, and adjacent to the support 7 from the opposite side from the suction chamber 6.

[0013] Here, as described above, the support 7 has through holes through which gas can pass, so in the coating module 2, gas can flow through the support 7 between the coating chamber 8 and the suction chamber 6. Also, in the coating module 2 to which the suction table 3 and coating housing 5 are assembled, the substrate P supported by the support 7 is placed in the coating chamber 8. In the coating chamber 8, the substrate P is placed at the lower end in the height direction.

[0014] The coating apparatus 1 includes a powder spraying unit 11. The powder spraying unit 11 is formed, for example, from a spray nozzle and has a spray opening 12. The powder spraying unit 11 is capable of spraying a gas mixed with powder Q from the spray opening 12 into the coating chamber 8. The powder Q includes, for example, particulate material, and the gas into which the powder Q is mixed can be, for example, air or nitrogen gas. The spray opening 12 is formed at the upper end in the height direction of the coating chamber 8. In the coating module 2, to which the suction table 3 and coating housing 5 are assembled, the spray opening 12 of the powder spraying unit 11 faces the support 7 and the substrate P supported by the support 7, with the coating chamber 8 in between.

[0015] In the coating device 1, a supply line 13 is formed, and a gas mixed with the powder Q is supplied to the powder injection unit 11 from a supply source (not shown) through the supply line 13. Then, the powder injection unit 11 injects the powder Q supplied through the supply line 13 together with the gas into the coating chamber 8. In an example of FIG. 1, the powder Q and the gas are injected downward in the height direction from the injection port 12 and are injected toward the substrate P supported by the support 7. Further, in an example of FIG. 1, a supply amount adjustment unit 15 is provided in the supply line 13, and the supply amount adjustment unit 15 includes a flow rate adjustment valve. In the coating device 1, corresponding to the operation of the supply amount adjustment unit 15, the supply amount of the gas mixed with the powder Q to the powder injection unit 11 and the pressure of the supplied gas in the powder injection unit 11 change. Therefore, corresponding to the operation of the supply amount adjustment unit 15, the injection amount, the injection pressure, etc. in the powder injection unit 11 are adjusted.

[0016] Also, in the coating device 1 of the embodiment, an exhaust line 16 is formed, and the exhaust line 16 communicates with the suction chamber 6. Further, a suction drive unit 17 is provided in the exhaust line 16. The suction drive unit 17 is constituted by, for example, either a blower or a suction pump. By driving the suction drive unit 17, in the coating module 2, a gas flow from the coating chamber 8 through the suction chamber 6 toward the exhaust line 16 is formed. Hereinafter, in the coating chamber 8, the suction chamber 6, etc., the direction in which the gas flows due to the drive of the suction drive unit 17 is also referred to as the "downstream side", and the side opposite to the downstream side is also referred to as the "upstream side". In the coating chamber 8, the suction chamber 6, etc., the downstream side corresponds to the side toward the exhaust line 16 and the suction drive unit 17.

[0017] In the coating apparatus 1 of this embodiment, a plurality of exhaust ducts D are provided between the suction chamber 6 and the exhaust line 16. In the example shown in Figure 1, four exhaust ducts D1 to D4 are provided. Each of the plurality of exhaust ducts D has an opening 21 that opens toward the suction chamber 6, and communicates with the suction chamber 6 through the opening 21. Due to this configuration, the plurality of exhaust ducts D communicate with the suction chamber 6 independently of each other. In the coating apparatus 1, the plurality of exhaust ducts D are arranged in parallel to each other and extend in parallel between the suction chamber 6 and the exhaust line 16. The flow path through which gas flows due to the drive of the suction drive unit 17 branches into the plurality of exhaust ducts D at the downstream end of the suction chamber 6. The number of exhaust ducts D is not particularly limited, as long as there are two or more.

[0018] Furthermore, each of the multiple exhaust ducts D is connected to the exhaust line 16 at the end opposite to the opening 21, i.e., at the downstream end. At the upstream end of the exhaust line 16, the multiple exhaust ducts D merge. Due to this configuration, when the aforementioned gas flow is formed in the coating chamber 8 and the suction chamber 6 by the drive of the suction drive unit 17, gas flows from the coating chamber 8 through the suction chamber 6 into each of the multiple exhaust ducts D. At this time, gas flows into each of the exhaust ducts D from the suction chamber 6 through the opening 21. Then, in each of the exhaust ducts D, the gas flows downstream toward the exhaust line 16. Note that when gas is flowing from the coating chamber 8 through the suction chamber 6 into each of the multiple exhaust ducts D, the pressure in the suction chamber 6 becomes lower than the pressure in the coating chamber 8.

[0019] In the formation of the coating film on the substrate P, with the powder Q being injected from the powder injection unit 11 into the coating chamber 8, the suction drive unit 17 is driven to cause gas to flow into each of the plurality of exhaust ducts D from the coating chamber 8 through the suction chamber 6. As a result, the injected powder Q accumulates on the substrate P supported by the support 7, and a coating film is formed by the accumulated powder Q. Further, in the coating apparatus 1, an exhaust volume adjustment unit 22 is provided for each of the plurality of exhaust ducts D, and each of the exhaust volume adjustment units 22 includes a flow rate adjustment valve. In each of the plurality of exhaust ducts D, the exhaust volume of the gas flowing in from the suction chamber 6 changes in response to the operation of the exhaust volume adjustment unit 22. Therefore, in each of the exhaust ducts D, the flow rate of the gas flowing downstream toward the exhaust line 16 is adjusted in response to the operation of the exhaust volume adjustment unit 22.

[0020] In the coating apparatus 1, when the formation of the coating film on the substrate P is completed, the substrate P on which the coating film is formed is removed from the support 7 and taken out from the coating module 2. At this time, by separating the coating housing 5 from the suction table 3, the substrate P on which the coating film is formed is taken out from the coating module 2. In one example, the substrate P is conveyed to the coating apparatus 1 including the coating module 2 by a conveying unit such as a conveying line. Then, in the coating apparatus 1, the substrate P conveyed by the conveying unit is supported by the support 7, and the coating housing 5 is attached to the suction table 3 that supports the substrate P by the support 7. Then, in the coating module 2 in which the suction table 3 and the coating housing 5 are assembled, a coating film is formed on the substrate P as described above. Then, the substrate P on which the coating film is formed is taken out from the coating module 2 and conveyed to the next process by the conveying unit.

[0021] The coating apparatus 1 includes a control unit 23. The control unit 23 controls the operation of the coating apparatus 1 in the formation of the coating film. At this time, for example, the operations of the supply amount adjustment unit 15, the suction drive unit 17, and the exhaust volume adjustment unit 22, etc., are controlled by the control unit 23. In each of the plurality of exhaust ducts D, the operation of the exhaust volume adjustment unit 22 is controlled by the control unit 23, so that the exhaust volume of the gas flowing in from the suction chamber 6 is controlled. Therefore, the control unit 23 controls the flow rate of the gas flowing downstream in each of the exhaust ducts D.

[0022] The control unit 23 includes a processor or integrated circuit (control circuit) including a CPU (Central Processing Unit), ASIC (Application Specific Integrated Circuit), or FPGA (Field Programmable Gate Array), and a storage medium such as memory. The control unit 23 may include only one integrated circuit or multiple integrated circuits. The control unit 23 performs processing by executing programs stored in the storage medium, and controls the operation of the coating apparatus 1 in the formation of a coated film. The processing by the control unit 23 may be performed by an integrated circuit of a single computer, or by integrated circuits of multiple computers working together. Furthermore, the processing by the control unit 23 may be performed by a server in a cloud environment. In this case, the processing by the control unit 23 is performed by a virtual processor of the cloud server.

[0023] Figure 2 is a schematic diagram showing the coating module 2 of an example in Figure 1, with the support 7 viewed from above in the height direction. Figure 2 shows the state in which the four substrates P1 to P4 are supported by the support 7. Figure 3 is a schematic cross-sectional view of the coating module 2 of an example in Figure 1, showing a cross section that passes through the suction chamber 6 and is perpendicular or approximately perpendicular to the height direction. Figure 3 shows the aforementioned cross section viewed from above in the height direction.

[0024] As shown in Figures 1 to 3, a partition member 25 is placed in the suction chamber 6 of the suction table 3. The partition member 25 divides the suction chamber 6 into multiple divided spaces A, dividing it into the same number of divided spaces A as there are exhaust ducts D. In the example shown in Figures 1 to 3, four exhaust ducts D1 to D4 are provided, and the suction chamber 6 is divided into four divided spaces A1 to A4 by the partition member 25. In each of the divided spaces A, there is little to no inflow of gas from or outflow of gas into other divided spaces A. Therefore, in the suction chamber 6, the partition member 25 acts as a barrier between the multiple divided spaces A.

[0025] Each of the multiple exhaust ducts D communicates with only one corresponding of the multiple divided spaces A, and the multiple exhaust ducts D communicate with different divided spaces A relative to each other. Furthermore, each opening 21 of the exhaust duct D opens toward one corresponding of the divided spaces A, and for the multiple exhaust ducts D, the divided spaces A that the opening 21 opens toward are different relative to each other. In the example shown in Figures 1 to 3, exhaust duct D1 communicates only with divided space A1, exhaust duct D2 communicates only with divided space A2, exhaust duct D3 communicates only with divided space A3, and exhaust duct D4 communicates only with divided space A4. In another example, the volumes of the multiple divided spaces A separated by the partition member 25 are the same or approximately the same relative to each other.

[0026] When gas is flowing from the coating chamber 8 through the support 7 to the suction chamber 6 due to the drive of the suction drive unit 17, gas flows into each of the multiple exhaust ducts D from one of the multiple divided spaces A through the opening 21. In other words, gas is exhausted into each of the multiple exhaust ducts D from one of the corresponding divided spaces A. In the example shown in Figures 1 to 3, gas is exhausted from divided space A1 to exhaust duct D1, from divided space A2 to exhaust duct D2, from divided space A3 to exhaust duct D3, and from divided space A4 to exhaust duct D4.

[0027] Here, in a single film formation process, multiple substrates P, the same number as the exhaust duct D, are supported by a support 7, similar to the example in Figures 1 to 3, and a coated film is formed on the multiple supported substrates P. In this case, one corresponding divided space A is adjacent to each of the multiple supported substrates P from below in the height direction, and the adjacent divided spaces A are different for each of the multiple substrates P. Each of the multiple supported substrates P is positioned opposite to one of the multiple exhaust ducts D, with one corresponding divided space A in between. The opposing exhaust ducts D are different for each of the multiple substrates P. In the example in Figures 1 to 3, divided spaces A1, A2, A3, and A4 are adjacent to substrates P1, P2, P3, and P4 from below in the height direction, and substrates P1, P2, P3, and P4 are positioned opposite to exhaust ducts D1, D2, D3, and D4, respectively.

[0028] Furthermore, the entirety of one or more substrates P supported by the support 7 is divided into multiple regions B, the same number as the exhaust ducts D. In the one or more substrates P supported by the support 7, each of the multiple regions B is positioned opposite to one of the multiple exhaust ducts D, with one of the multiple divided spaces A in between. Also, in the multiple regions B, the opposite exhaust ducts D are different from each other. Here, if multiple substrates P are supported by the support 7, the entirety of the supported multiple substrates P is divided into multiple regions B, the same number as the exhaust ducts D. Also, if the same number of multiple substrates P as the exhaust ducts D are supported by the support 7, each of the multiple regions B is defined by one of the multiple substrates P. In the example in Figures 1 to 3, regions B1, B2, B3, and B4 are defined by substrates P1, P2, P3, and P4, respectively.

[0029] The coating apparatus 1 of this embodiment is provided with a film thickness measuring unit 27 for measuring the film thickness of the formed coating film. The film thickness measuring unit 27 removes one or more substrates P on which the coating film has been formed from the coating module 2 and measures the film thickness of the formed coating film on the removed one or more substrates P. In one example, the film thickness measuring unit 27 is equipped with a laser displacement meter. The film thickness measuring unit 27 irradiates the formed coating film with laser light and measures the film thickness of the coating film by analyzing the transmitted light that has passed through the coating film or the reflected light that has been reflected from the coating film. The film thickness measuring unit 27 measures the film thickness for each of the multiple regions B, which are the same number as the exhaust duct D, on one or more substrates P on which the coating film has been formed. If the coating film has been formed on multiple substrates P, which are the same number as the exhaust duct D, the film thickness is measured for each of the multiple substrates P.

[0030] For each of the multiple regions (multiple substrates P), the measurement value at one location may be measured as the film thickness measurement result, or the average or median value of the measurement values ​​at multiple locations may be measured as the film thickness measurement result. In the example shown in Figure 1, two film thickness measurement units 27A and 27B are provided. Film thickness measurement unit 27A measures the film thickness of the coated film in regions B1 and B3, and measures the film thickness of the coated film on substrates P1 and P3. Film thickness measurement unit 27B measures the film thickness of the coated film in regions B2 and B4, and measures the film thickness of the coated film on substrates P2 and P4.

[0031] The control unit 23 acquires the measurement result of the film thickness from the film thickness measurement unit 27. Then, while powder Q is being sprayed into the coating chamber 8, the control unit 23 controls the operation of each of the exhaust volume adjustment units 22 based on the measurement result of the film thickness from the film thickness measurement unit 27, and controls the flow rate of gas downstream in each of the multiple exhaust ducts D. At this time, the control unit 23 acquires the measurement result of the film thickness in each of the multiple regions B for the coating film formed in the previous film formation process. Then, based on the measurement result of the film thickness of the coating film formed in the previous film formation process, the control unit 23 controls the flow rate of gas in each of the multiple exhaust ducts D in real time, and controls the amount of gas flowing into each of the multiple exhaust ducts D from the corresponding one of the divided spaces A.

[0032] Figure 4 is a schematic flowchart showing an example of the control of the operation of each exhaust volume adjustment unit 22 of the exhaust duct D, performed by the control unit 23 in the coating apparatus 1 according to the embodiment. The process in the example in Figure 4 is executed each time a film formation process is performed by the coating apparatus 1. When the process in the example in Figure 4 is started, the control unit 23 acquires the measurement results of the film thickness in each of the multiple regions B for the coated film formed in the previous film formation process (S101). For example, in the example configuration in Figures 1 to 3, the measurement results of the film thickness in each of regions B1 to B4 for the coated film formed in the previous film formation process are acquired, that is, the measurement results of the film thickness in each of the substrates P1 to P4.

[0033] The control unit 23 then calculates the average film thickness in multiple regions B for the coating film formed in the previous film formation process (S102). In the example configuration shown in Figures 1 to 3, the average film thickness in regions B1 to B4, i.e., the average film thickness in substrates P1 to P4, is obtained for the coating film formed in the previous film formation process. The control unit 23 then sets a reference range for the film thickness of the coating film, including the average value (S103). In this case, for example, a range of ±5% with the average value as the median is set as the reference range. The control unit 23 then determines whether the film thickness in each of the multiple regions B for the coating film formed in the previous film formation process falls within the reference range. For regions where the film thickness does not fall within the reference range, the control unit 23 determines whether the film thickness exceeds the upper limit of the reference range or whether the film thickness falls below the lower limit of the reference range.

[0034] In controlling the operation of the exhaust volume adjustment unit 22, the control unit 23 reduces the flow rate in the real-time film formation process in the exhaust duct D where the region B in which the film thickness exceeded the standard range in the previous film formation process was located opposite to the previous film formation process (S104). The control unit 23 also increases the flow rate in the real-time film formation process in the exhaust duct D where the region B in which the film thickness fell below the standard range in the previous film formation process was located opposite to the previous film formation process (S105). Then, the control unit 23 maintains the flow rate in the real-time film formation process in the exhaust duct D where the region B in which the film thickness fell within the standard range in the previous film formation process was located opposite to the previous film formation process (S106).

[0035] In the example shown in Figure 4, if the film thickness in any of the multiple regions B does not exceed the upper limit of the reference range in the previous film formation process, the S104 process is not performed. Also, if the film thickness in any of the multiple regions B does not fall below the lower limit of the reference range in the previous film formation process, the S105 process is not performed. Furthermore, if the film thickness in any of the multiple regions B does not fall within the reference range in the previous film formation process, the S106 process is not performed.

[0036] For example, similar to the example in Figures 1 to 3, a coated film is formed on four substrates P1 to P4 in a single film formation process. In the previous film formation process, the film thickness in region B1 (substrate P1) falls below the reference range including the average value, the film thicknesses in regions B2 (substrate P2) and B4 (substrate P4) are within the reference range, and the film thickness in region B3 (substrate P3) exceeds the reference range. In this case, in the real-time film formation process, the flow rate downstream in the exhaust duct D1, where region B1 was located opposite in the previous film formation process, increases from the previous film formation process, and the flow rate downstream in the exhaust duct D3, where region B3 was located opposite in the previous film formation process, decreases from the previous film formation process. Then, in the real-time film formation process, the flow rate downstream in exhaust duct D2, where region B2 was positioned opposite in the previous film formation process, and in exhaust duct D4, where region B4 was positioned opposite in the previous film formation process, is maintained at the flow rate from the previous film formation process.

[0037] As described above, in the coating apparatus 1 used for forming a coated film, the spraying state of powder Q from the powder spraying unit 11 to the coating chamber 8 may change due to maintenance, etc. As a result of the change in the spraying state of powder Q to the coating chamber 8, variations in film thickness may increase among multiple regions B (multiple substrates P) in the formed coated film. For this reason, in the coating apparatus 1 of this embodiment, if variations in film thickness among multiple regions B increase in the previous film formation process, the control unit 23 controls the flow rate in each of the multiple exhaust ducts D by performing the same process as in the example in Figure 4 during the real-time film formation process.

[0038] Here, a configuration in which the partition member 25 is removed from the coating apparatus 1 of the example in Figure 1 is considered a comparative example. In the configuration of the comparative example, the suction chamber 6 is not divided into multiple divided spaces A. In the configuration of the comparative example, the coating module 2, etc., are assumed to have the same configuration as the example in Figure 1, except that the partition member 25 is not provided. Figure 5 is a schematic diagram showing an example of the coating apparatus 1 according to the comparative example in which the flow rate in each of the multiple exhaust ducts D is controlled based on the variation in film thickness between multiple regions B (multiple substrates P). Figure 6 is a schematic diagram showing an example of the coating apparatus 1 according to the embodiment in which the flow rate in each of the multiple exhaust ducts D is controlled based on the variation in film thickness between multiple regions B (multiple substrates P). In Figure 6, similar to the example in Figure 1, the suction chamber 6 is divided into four divided spaces A1 to A4 by the partition member 25.

[0039] In both the example in Figure 5 and the example in Figure 6, an example is shown where, in the previous film formation process, the film thickness in region B1 exceeded the standard range, and the film thickness in region B3 fell below the standard range, illustrating an example of large variation in film thickness among multiple regions B. In both the example in Figure 5 and the example in Figure 6, it is assumed that in the previous film formation process, the flow rate to the exhaust duct D1, where region B1 (substrate P1) was positioned opposite, was the same or approximately the same as the flow rate to the exhaust duct D3, where region B3 (substrate P3) was positioned opposite.

[0040] In both the example in Figure 5 and the example in Figure 6, the flow rate (arrow Fa1) during the real-time film formation process in the exhaust duct D1, where region B1 (substrate P1) with a film thickness exceeding the standard range is located opposite, is reduced from the flow rate during the previous film formation process. Conversely, the flow rate (arrow Fa3) during the real-time film formation process in the exhaust duct D3, where region B3 (substrate P3) with a film thickness below the standard range is located opposite, is increased from the flow rate during the previous film formation process. As a result, during the real-time film formation process, the flow rate in exhaust duct D3 becomes greater than the flow rate in exhaust duct D1, and the amount of exhaust from suction chamber 6 to exhaust duct D3 becomes greater than the amount of exhaust from suction chamber 6 to exhaust duct D1.

[0041] As shown in Figure 5, in the comparative example configuration, since the suction chamber 6 is not partitioned, when the amount of exhaust to exhaust duct D3 is greater than the amount of exhaust to exhaust duct D1, gas flows in the suction chamber 6 from the region opposite exhaust duct D1 to the region opposite exhaust duct D3 (arrow Fc). Therefore, even if the amount of exhaust to exhaust duct D1 decreases, the amount of gas flowing from coating chamber 8 to suction chamber 6 through region B1 (arrow Fb1) does not change or hardly changes from the previous film formation treatment. Furthermore, even if the amount of exhaust to exhaust duct D3 increases, the amount of gas flowing from coating chamber 8 to suction chamber 6 through region B3 (arrow Fb3) does not change or hardly changes from the previous film formation treatment. Consequently, even if the amount of exhaust to exhaust duct D3 is greater than the amount of exhaust to exhaust duct D1, the amount of gas flowing into suction chamber 6 through region B1 is the same or approximately the same as the amount of gas flowing into suction chamber 6 through region B3.

[0042] As mentioned above, since gas flows, in the comparative example configuration, even if the amount of exhaust to exhaust duct D3 is larger than the amount of exhaust to exhaust duct D1, the injection state of powder Q and gas (arrow F0) from powder injection unit 11 to coating chamber 8 does not change, or hardly changes, from the previous film formation treatment. For this reason, even if the amount of exhaust to exhaust duct D3 is larger than the amount of exhaust to exhaust duct D1, powder Q tends to accumulate more easily in region B1 (substrate P1) than in region B3 (substrate P3), and the coating film thickness tends to be thicker in region B1 than in region B3.

[0043] On the other hand, as shown in Figure 6, in the configuration of the embodiment such as the one in Figure 1, the partition member 25 divides the suction chamber 6 into a plurality of divided spaces A, and gas flow does not occur, or hardly occurs, between the plurality of divided spaces A. Because of this configuration, even if the amount of exhaust to exhaust duct D3 is larger than the amount of exhaust to exhaust duct D1, gas does not flow in the suction chamber 6 from divided space A1, which is connected to exhaust duct D1, to divided space A3, which is connected to exhaust duct D3. As a result, as the amount of exhaust to exhaust duct D1 decreases, the amount of gas flowing from the coating chamber 8 to the suction chamber 6 through region B1 (arrow Fb1) decreases from the previous film formation process. Then, as the amount of exhaust to exhaust duct D3 increases, the amount of gas flowing from the coating chamber 8 to the suction chamber 6 through region B3 (arrow Fb3) increases from the previous film formation process. Therefore, the amount of exhaust into exhaust duct D3 becomes larger than the amount of exhaust into exhaust duct D1, resulting in a larger amount of inflow into suction chamber 6 through region B3 compared to the amount of inflow into suction chamber 6 through region B1.

[0044] As described above, since gas flows, in the configuration of this embodiment, the amount of exhaust to exhaust duct D3 is greater than the amount of exhaust to exhaust duct D1, so the injection state of powder Q and gas (arrow F0) from the powder injection unit 11 to the coating chamber 8 changes from the previous film formation process. At this time, in region B1 (substrate P1) located opposite exhaust duct D1 where the amount of exhaust from suction chamber 6 decreases, powder Q is less likely to accumulate compared to the previous film formation process. And in region B3 (substrate P3) located opposite exhaust duct D3 where the amount of exhaust from suction chamber 6 increases, powder Q is more likely to accumulate compared to the previous film formation process. As a result, the variation in film thickness between regions B1 and B3 is reduced compared to the previous film formation process.

[0045] As described above, in the embodiment, the multiple exhaust ducts D communicate with the suction chamber 6 independently of each other, and the partition member 25 divides the suction chamber 6 into the same number of partition spaces A as the multiple exhaust ducts D, so that the multiple exhaust ducts D communicate with each other to different partition spaces A. With this configuration, it is possible to reduce variations in the thickness of the formed coating film between multiple regions B. For example, when forming a coating film on multiple substrates P in a single film formation process, it is possible to reduce variations in the thickness of the coating film between the multiple substrates P.

[0046] Furthermore, in the embodiment, the film thickness is measured in the formed coating film. When powder Q is being sprayed into the coating chamber 8, the gas flow rate in each of the multiple exhaust ducts D is controlled based on the film thickness measurement result. In this case, for example, in the exhaust duct D where regions B (substrates P) where the film thickness exceeded the standard range in the previous film formation process were located opposite each other, the flow rate in the real-time film formation process decreases from the flow rate in the previous film formation process. Conversely, in the exhaust duct D where regions B where the film thickness fell below the standard range in the previous film formation process were located opposite each other, the flow rate in the real-time film formation process increases from the flow rate in the previous film formation process. In a configuration where the suction chamber 6 is partitioned by a partition member 25, such control is performed so that, in the real-time film formation process, the variation in film thickness between multiple regions B (multiple substrates P) is appropriately reduced compared to the previous film formation process.

[0047] Here, as verification related to the embodiments, the following simulation verification was performed. In the verification, simulations were performed for the formation of a coated film for both the configuration of Example α1, which is the same as the coating apparatus 1 example in Figure 1, and the configuration of Comparative Example β1, which is obtained by removing the partition member 25 from Example α1. In both Example α1 and Comparative Example β1, a coated film was formed on four substrates P1 to P4 in a single coating film formation process. In the coating film formation process, substrates P1, P2, P3, and P4, i.e., the aforementioned regions B1, B2, B3, and B4, were arranged opposite to the exhaust ducts D1, D2, D3, and D4, respectively. Then, in both Example α1 and Comparative Example β1, simulations were performed for the case in which the formation of a coated film on substrates P1 to P4 was performed six times.

[0048] In both Example α1 and Comparative Example β1, in each of the six film-forming treatments, nitrogen gas mixed with powder Q was injected from the powder injection unit 11 into the coating chamber 8. In each of the six film-forming treatments, the pressure of the nitrogen gas at the injection nozzle 12 was set to atmospheric pressure, the amount of nitrogen gas injected was set to 440 L / min, and the duration of the injection of powder Q (the time required for one film-forming treatment) was set to 5.0 s.

[0049] Furthermore, in both Example α1 and Comparative Example β1, the gas flow rates in each of the exhaust ducts D1 to D4 were set as follows during each of the six film formation treatments. Specifically, during the first film formation treatment, the flow rate in each of the exhaust ducts D1 to D4 was set to 110 L / min. Then, for each of the second and subsequent film formation treatments, the flow rates in each of the exhaust ducts D1 to D4 were set based on the film thickness of each of the substrates P1 to P4 during the previous film formation treatment.

[0050] In both Example α1 and Comparative Example β1, the film thickness was calculated for each of the six film formation processes for the coated film formed in each of the substrates P1 to P4 (regions B1 to B4). Then, the average value of the film thickness in each of the six film formation processes was calculated for the coated film formed in each of the six processes, and a range of ±5% of the average value was set as the reference range. In each of the second and subsequent film formation processes, the flow rate was reduced by 10 L / min in the exhaust duct D where the substrate P whose film thickness exceeded the upper limit of the reference range in the previous film formation process was located opposite the substrate P. In addition, in each of the second and subsequent film formation processes, the flow rate was increased by 10 L / min in the exhaust duct D where the substrate P whose film thickness fell below the lower limit of the reference range in the previous film formation process was located opposite the substrate P. In addition, the flow rate was maintained in the exhaust duct D where the substrate P whose film thickness fell within the reference range in the previous film formation process was located opposite the substrate P.

[0051] In the six film formation processes of Example α1 and Comparative Example β1, the orientation of the powder spraying unit 11 was set to be the same for all of them, and the powder spraying unit 11 was tilted with respect to the height direction (central axis C) of the coating module 2 at an inclination angle of 1° or approximately 1°. In all six film formation processes of Example α1 and Comparative Example β1, the orientation of the powder spraying unit 11 was set such that the film thickness was thicker on substrates P3 and P4 than on substrates P1 and P2, assuming that the gas flow rate in the exhaust ducts D1 to D4 was the same for all of them.

[0052] Figure 7 is a schematic diagram showing the film thickness on each of the four substrates P1 to P4 for the coated film formed in each of the six film formation processes in Example α1, as a result of verification in the verification of the embodiments, etc. Figure 8 is a schematic diagram showing the gas flow rate on each of the four exhaust ducts D1 to D4 for each of the six film formation processes in Example α1, as a result of verification in the verification of the embodiments, etc. Figure 9 is a schematic diagram showing the film thickness on each of the four substrates P1 to P4 for the coated film formed in each of the six film formation processes in Comparative Example β1, as a result of verification in the verification of the embodiments, etc. Figure 10 is a schematic diagram showing the gas flow rate on each of the four exhaust ducts D1 to D4 for each of the six film formation processes in Comparative Example β1, as a result of verification in the verification of the embodiments, etc.

[0053] Figures 7 through 10 each show graphs, with the horizontal axis indicating the number of film formation treatments performed. In Figures 7 and 9, the vertical axis shows the film thickness in μm, while in Figures 8 and 10, the vertical axis shows the flow rate in L / min. In Figures 7 and 9, the film thicknesses of substrates P1, P2, P3, and P4 are shown by solid lines and black circles, dotted lines and black squares, dashed lines and black triangles, and dashed lines and black diamonds, respectively. In Figures 7 and 9, the average film thickness across substrates P1 to P4 is shown by dashed lines and black pentagons. In Figures 8 and 10, the flow rates in exhaust ducts D1, D2, D3, and D4 are shown by solid lines and black circles, dotted lines and black squares, dashed lines and black triangles, and dashed lines and black diamonds, respectively.

[0054] As shown in Figures 9 and 10, in Comparative Example β1, in each of the six film formation treatments, the film thickness on substrates P1 and P2 fell below the standard range, while the film thickness on substrates P3 and P4 exceeded the standard range. Therefore, in Comparative Example β1, in each of the second and subsequent film formation treatments, the flow rate in exhaust ducts D1 and D2 was increased by 10 L / min compared to the previous film formation treatment, and the flow rate in exhaust ducts D3 and D4 was decreased by 10 L / min compared to the previous film formation treatment. However, in Comparative Example β1, even when the flow rates in exhaust ducts D1 to D4 were changed as described above, the film thickness on substrates P1 to P4 hardly changed from the first film formation treatment, and the variation in film thickness between substrates P1 to P4 was hardly improved.

[0055] On the other hand, as shown in Figures 7 and 8, in Example α1, in each of the first, second, third, and fourth film formation treatments, the film thickness on substrates P1 and P2 fell below the standard range, while the film thickness on substrates P3 and P4 exceeded the standard range. Therefore, in Example α1, in each of the second, third, fourth, and fifth film formation treatments, the flow rate in exhaust ducts D1 and D2 was increased by 10 L / min compared to the previous film formation treatment, and the flow rate in exhaust ducts D3 and D4 was decreased by 10 L / min compared to the previous film formation treatment. As a result, in each of the second, third, fourth, and fifth film formation treatments, the film thickness on substrates P1 and P2 became thicker compared to the previous film formation treatment, while the film thickness on substrates P3 and P4 became thinner compared to the previous film formation treatment.

[0056] Furthermore, in Example α1, during the fifth film formation treatment, the film thickness on substrates P1 and P2 fell within the standard range. However, during the fifth film formation treatment, the film thickness on substrate P3 exceeded the standard range, while the film thickness on substrate P4 fell below the standard range. Therefore, in Example α1, during the sixth film formation treatment, the flow rates in exhaust ducts D1 and D2 were maintained at those of the previous film formation treatment. During the sixth film formation treatment, the flow rate in exhaust duct D4 was increased by 10 L / min compared to the previous film formation treatment, and the flow rate in exhaust duct D3 was decreased by 10 L / min compared to the previous film formation treatment. As a result, during the sixth film formation treatment, the film thickness on substrate P4 was thicker than during the previous film formation treatment, while the film thickness on substrate P3 was thinner than during the previous film formation treatment.

[0057] In Example α1, the variation in film thickness between substrates P1 to P4 improved with each film formation treatment up to the fifth treatment. Furthermore, in the fifth and sixth film formation treatments, the variation in film thickness between substrates P1 to P4 was reduced compared to the film formation treatments up to the fourth treatment. In fact, in Example α1, the variation in film thickness between substrates P1 to P4 was reduced to about 5% in the sixth film formation treatment.

[0058] From the above verification, it was demonstrated that by partitioning the suction chamber 6 into the same number of partitioned spaces A as there are multiple exhaust ducts D, using the partition member 25 so that each exhaust duct D communicates with a different partitioned space A, it is possible to reduce variations in film thickness between multiple substrates P. Furthermore, it was demonstrated that by partitioning the suction chamber 6 into multiple partitioned spaces A using the partition member 25 and controlling the flow rate in each of the multiple exhaust ducts D in the same manner as in the example in Figure 4, variations in film thickness between multiple substrates P can be appropriately reduced.

[0059] In the embodiments described above, the case in which a coating film is formed on multiple substrates P, the same number as the exhaust ducts D, in a single film formation process was explained, but this is not the only case. In one example, the above-described configuration and process may be applied when a coating film is formed on only one substrate P in a single film formation process. However, in any case, the entirety of one or more substrates P supported by the support 7 is defined into multiple regions B, the same number as the exhaust ducts D. Each of the multiple regions B is positioned opposite to one of the multiple exhaust ducts D, with one of the multiple divided spaces A in between, and the exhaust ducts D positioned opposite each other are different in the multiple regions B. By using such a configuration, it is possible to reduce variations in film thickness between the multiple regions B in the formed coating film.

[0060] According to at least one embodiment or example, the multiple exhaust ducts communicate with the suction chamber independently of each other, and the partition member divides the suction chamber into the same number of partitioned spaces as the multiple exhaust ducts, such that the multiple exhaust ducts communicate with each other into different partitioned spaces. This makes it possible to provide a coating apparatus and coating method that can reduce variations in film thickness in the formed coating film.

[0061] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0062] 1...Coating device, 2...Coating module, 3...Suction table, 5...Coating housing, 6...Suction chamber, 7...Support, 8...Coating chamber, 11...Powder spraying unit, 16...Exhaust line, 17...Suction drive unit, 21...Opening, 22...Exhaust volume adjustment unit, 23...Control unit, 25...Partition member, 27 (27A, 27B)...Film thickness measurement unit, A (A1~A4)...Divided space, B (B1~B4)...Region, D (D1~D4)...Exhaust duct, P (P1~P4)...Substrate, Q...Powder.

Claims

1. A coating module comprising a support capable of supporting a substrate, a suction chamber adjacent to the support, and a coating chamber adjacent to the support on the opposite side from the suction chamber, A powder spraying unit capable of spraying powder into the coating chamber, Multiple exhaust ducts that communicate with the suction chamber independently of each other, A suction drive unit capable of forming a coating film on the substrate supported by the support by introducing gas from the coating chamber through the suction chamber to each of the plurality of exhaust ducts, wherein the powder sprayed into the coating chamber is introduced into the substrate supported by the support. The plurality of exhaust ducts are connected to different partitioned spaces, and the number of partition members that divide the suction chamber into the same number of partitioned spaces as the plurality of exhaust ducts are provided. A coating apparatus comprising the following:

2. A film thickness measuring unit for measuring the film thickness of the formed coating film, In the state in which the powder is being sprayed into the coating chamber, a control unit controls the flow rate of the gas in each of the plurality of exhaust ducts based on the measurement result of the film thickness in the film thickness measurement unit, The coating apparatus according to claim 1, further comprising the above.

3. In the coating module, the suction chamber supports the substrate with an adjacent support, In the coating module, with the substrate supported by the support, powder is sprayed from the opposite side of the suction chamber into a coating chamber adjacent to the support, With the powder being sprayed into the coating chamber, gas is introduced from the coating chamber through the suction chamber into each of the multiple exhaust ducts, each communicating with the suction chamber independently of the others, thereby forming a coating film on the substrate supported by the support, using the powder sprayed into the coating chamber. The suction chamber is partitioned by a partition member into the same number of divided spaces as the plurality of exhaust ducts, and the coating film is formed in such a state that the gas flows into the plurality of exhaust ducts from different divided spaces relative to each other. A coating method comprising the following:

4. The thickness of the coated film that was formed is measured, With the powder being sprayed into the coating chamber, the flow rate of the gas in each of the multiple exhaust ducts is controlled based on the measurement result of the film thickness. The coating method according to claim 3, further comprising the above.

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