Component mounting apparatus and component mounting method

Abstract

The objective is to provide a component mounting apparatus and component mounting method that can efficiently mount large components, specially shaped components, or assembled components onto a circuit board, thereby improving productivity. [Solution] A component mounting device for mounting components BH onto a circuit board KB comprises a carrier CR on which the circuit board KB and components BH before mounting onto the circuit board KB are placed, a transport unit 12 that transports the circuit board KB and the carrier CR on which the components BH are placed to a predetermined mounting work area AR, and a mounting head 15 that uses the carrier CR transported to the mounting work area AR by the transport unit 12 as a work stage to mount the components BH onto the circuit board KB.

Description

Technical Field

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method for mounting components on a substrate.

Background Art

[0002] Conventionally known component mounting apparatuses carry a substrate into a mounting work area by a conveyance unit such as a conveyor, pick up components supplied from a parts feeder by a mounting head, and mount them on the substrate. When the components to be mounted on the substrate are small components, tape feeders or stick feeders are often used for the parts feeder. When the components are large components or special-shaped components with special shapes, tray feeders that use trays on which the components can be placed are often used. Further, according to the tray feeder, it is also possible to use a part of the tray as a work stage to mount a plurality of components vertically and mount the assembled components thus obtained on the substrate (for example, Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the tray feeder is a relatively large-scale device, its operation is troublesome, and there is a problem that the work efficiency is not good. For this reason, there has been a need for a device that can mount large components, special-shaped components, or assembled components on a substrate with a simpler configuration (method).

[0005] Therefore, an object of the present disclosure is to provide a component mounting apparatus and a component mounting method that can efficiently mount large components, special-shaped components, or assembled components on a substrate.

Means for Solving the Problems

[0006] The component mounting apparatus of this disclosure is a component mounting apparatus for mounting components on a substrate, comprising: a substrate and a carrier on which the components are placed before being mounted on the substrate; a loading means for loading the substrate and the carrier on which the components are placed into a predetermined mounting work area; and a mounting head that uses the carrier loaded into the mounting work area by the loading means as a work stage to perform the operation of mounting the components onto the substrate.

[0007] The component mounting method of this disclosure is a component mounting method for mounting components on a substrate, comprising: a loading step of loading the substrate and a carrier on which the components, before being mounted on the substrate, are placed into a predetermined mounting work area; and a mounting step of using the carrier loaded into the mounting work area in the loading step as a work stage to mount the components onto the substrate. [Effects of the Invention]

[0008] According to this disclosure, it is possible to efficiently mount large components, specially shaped components, or assembled components onto a substrate and improve productivity. [Brief explanation of the drawing]

[0009] [Figure 1] This is a partial perspective view of a component mounting apparatus in Embodiment 1 of the present disclosure. [Figure 2] Block diagram showing the control system of a component mounting device in Embodiment 1 of the present disclosure. [Figure 3] (a) is a perspective view showing a mounting substrate, on which components are mounted by a component mounting apparatus according to Embodiment 1 of the present disclosure, together with a carrier, and (b) is a perspective view showing the substrate and components together with a carrier. [Figure 4] (a)(b)(c)(d) These are plan views showing the procedure for mounting components using the component mounting apparatus in Embodiment 1 of the present disclosure. [Figure 5](a) and (b) are perspective views showing a mounted substrate, which has assembled components mounted by a component mounting apparatus in Embodiment 2 of the present disclosure, together with a carrier, where (b) is a perspective view showing the substrate and components before assembly together with a carrier. [Figure 6] (a)(b)(c)(d) These are plan views showing the procedure for mounting assembled components using the component mounting apparatus in Embodiment 2 of the present disclosure. [Figure 7] (a)(b)(c)(d) These are plan views showing the procedure for mounting assembled components using the component mounting apparatus in Embodiment 3 of the present disclosure. [Figure 8] (a) and (b) are perspective views showing a mounted substrate, which has assembled components mounted by a component mounting apparatus in an application example of Embodiment 2 of the present disclosure, together with a carrier, where (b) is a perspective view showing the substrate and components before assembly together with a carrier. [Modes for carrying out the invention]

[0010] (Embodiment 1) Figure 1 shows a component mounting apparatus 10 in Embodiment 1 of the present disclosure. The component mounting apparatus 10 is a device for mounting components BH onto a substrate KB, and comprises a base 11, a transport unit 12, a plurality of parts feeders 13, a head moving mechanism 14, a mounting head 15, and a control unit 16 that controls the operation of each of these parts. For the sake of explanation, the left-right direction of the component mounting apparatus 10 as seen from the operator OP is the X direction, the front-back direction of the component mounting apparatus 10 as seen from the operator OP is the Y direction, and the up-down direction is the Z direction.

[0011] In Figure 1, the transport unit 12 consists of a pair of conveyors 12a arranged opposite each other in the Y direction. The transport unit 12 uses the pair of conveyors 12a to support both ends of the substrate KB in the Y direction from below and transports it in the X direction, bringing it into a predetermined mounting work area.

[0012] In Figure 1, each parts feeder 13 is detachably attached to a feeder base 11F connected to the Y-direction end of the base 11. Each parts feeder 13 supplies parts BH to a parts retrieval position 13T set at the far end (towards the transport section 12) as seen from the operator OP.

[0013] In Figure 1, the head movement mechanism 14 comprises a fixed beam 14a extending in the Y direction and a movable beam 14b extending in the X direction. The fixed beam 14a is fixed at both ends to the base 11. One end of the movable beam 14b is attached to the fixed beam 14a. The movable beam 14b is moved in the Y direction by a drive mechanism (not shown) provided within the fixed beam 14a.

[0014] In Figure 1, the mounting head 15 is attached to the movable beam 14b. The mounting head 15 is moved in the X direction by a drive mechanism (not shown) provided within the movable beam 14b. The mounting head 15 can move in the horizontal plane (XY plane) within the upper region of the base 11 by the movement of the movable beam 14b in the Y direction relative to the fixed beam 14a, and the movement of the mounting head 15 itself in the X direction relative to the movable beam 14b.

[0015] The mounting head 15 is equipped with multiple nozzles 15a extending downward. The mounting head 15 generates a vacuum suction force at the lower end of each nozzle 15a, thereby attracting and picking up the parts BH supplied by the parts feeder 13 to the parts picking position 13T.

[0016] In Figure 2, the control unit 16 of the component mounting device 10 controls the transport unit 12, the multiple parts feeders 13, the head movement mechanism 14, and the mounting head 15. Specifically, the control unit 16 controls the transport unit 12 to transport (load and unload) the substrate KB, and controls each parts feeder 13 to supply components BH to the component pick-up position 13T. It also controls the head movement mechanism 14 to move the mounting head 15, and controls the mounting head 15 to pick up (apply) components BH to each nozzle 15a.

[0017] When the component mounting device 10 executes a component mounting operation of mounting a component BH on a substrate KB, first, the conveyance unit 12 is operated from the control unit 16, and the substrate KB sent from a device on the upstream side of the component mounting device 10 is received and carried into the mounting work area.

[0018] When the substrate KB is carried into the mounting work area, the control unit 16 operates each parts feeder 13 to supply the component BH to the component take-out position 13T, and operates the head movement mechanism 14 to repeatedly perform a component transfer operation on the mounting head 15. In the component transfer operation, the mounting head 15 moves above the parts feeder 13, picks up the component BH supplied by the parts feeder 13 with the nozzle 15a, then moves above the substrate KB, and mounts the component BH on the substrate KB.

[0019] When the component mounting device 10 mounts the component BH to be mounted on the substrate KB by repeatedly executing the component transfer operation by the mounting head 15, the conveyance unit 12 is operated to carry out the substrate KB to the downstream side. Thereby, the component mounting operation per sheet of the substrate KB is completed.

[0020] In the component mounting device 10 in the above-described Embodiment 1, when manufacturing a mounting substrate JK (FIG. 3(a)) formed by mounting the component BH on the substrate KB, instead of supplying the component BH from the parts feeder 13 as described above, the substrate KB and the component BH are placed on a flat carrier CR (FIG. 3(b)), and the carrier CR is carried into the mounting work area AR by the conveyance unit 12 (FIG. 4(a) → FIG. 4(b). Loading process). Thereby, the component BH is supplied into the mounting work area AR together with the substrate KB by one carrier CR. Thus, in Embodiment 1, the conveyance unit 12 serves as a loading means for loading the carrier CR on which the substrate KB and the component BH are placed into a predetermined mounting work area AR.

[0021] Once the carrier CR is brought into the mounting work area AR, the control unit 16 causes the mounting head 15 (nozzle 15a) to pick up the component BH and mount it onto the substrate KB (Figure 4(c) → Figure 4(d). Mounting process). In this way, the component BH is mounted onto the substrate KB, and the mounted substrate JK is manufactured on the carrier CR (Figure 3(a)). Thus, in Embodiment 1, the mounting head 15 uses the carrier CR, which has been brought into the mounting work area AR by the transport unit 12, as a work stage to mount the component BH onto the substrate KB.

[0022] Once the component BH is mounted on the carrier CR (the mounted substrate JK is manufactured) as described above, the control unit 16 operates the transport unit 12 to transport the mounted substrate JK along with the carrier CR to the outside of the component mounting device 10.

[0023] Thus, the component mounting apparatus 10 in Embodiment 1 is an apparatus for mounting components BH onto a substrate KB, and comprises a substrate KB and a carrier CR on which components BH are placed before being mounted onto the substrate KB, a transport unit 12 as a transport means for transporting the substrate KB and the carrier CR on which components BH are placed to a predetermined mounting work area AR, and a mounting head 15 that uses the carrier CR, which has been transported to the mounting work area AR by the transport unit 12, as a work stage to mount the components BH onto the substrate KB.

[0024] Furthermore, the component mounting method in Embodiment 1 is a method for mounting component BH on a substrate KB, and comprises a loading step of loading the substrate KB and a carrier CR on which component BH is placed before being mounted on the substrate KB into the mounting work area AR, and a mounting step of using the carrier CR loaded into the mounting work area AR in the loading step as a work stage to mount component BH onto the substrate KB.

[0025] In the component mounting apparatus 10 (component mounting method) of Embodiment 1, the substrate KB constituting the mounting substrate JK and the component BH before mounting on the substrate KB are placed on the same carrier CR and supplied to the mounting work area AR. The carrier CR is used as a work stage where the component BH is mounted on the substrate KB. In this case, the parts feeder 13 is unnecessary, and work efficiency can be improved. In particular, when the component BH is a large component or a specially shaped component, a tray feeder was conventionally indispensable, but with the component mounting apparatus 10 (component mounting method) of Embodiment 1, a tray feeder is unnecessary, and the effect is very significant.

[0026] In the above-described embodiment 1, the mounting board JK had a configuration in which two component BHs were mounted on board KB, but this is just an example, and the number of component BHs mounted on board KB may be one or three or more. Also, when multiple component BHs are mounted on board KB, these multiple component BHs may be of the same type or of different types. By placing multiple component BHs of different types together with board KB on the same carrier CR, component management before starting component mounting work becomes easier.

[0027] (Embodiment 2) Next, Embodiment 2 will be described. The configuration of the component mounting device 10 in Embodiment 2 is the same as in Embodiment 1, but the difference is that the component BH mounted on the substrate KB is not a single component, but an assembled component (referred to as "KBH") made up of multiple layers (two layers in this case) stacked vertically. In Embodiment 2, component BH consists of a lower component BH1 that is mounted directly on the substrate KB, and an upper component BH2 that is mounted on the lower component BH1 (Figure 5(a)).

[0028] In Embodiment 2, as shown in Figure 5(b), the substrate KB and the lower component BH1 and upper component BH2, which are components of the assembled component KBH, are placed on a single flat carrier CR, and the carrier CR is transported by the transport unit 12 and brought into the mounting work area AR (Figure 6(a) → Figure 6(b). Transport process). As a result, the substrate KB and the lower component BH1 and upper component BH2, which are components of the component BH to be mounted on the substrate KB, are supplied into the mounting work area AR with the substrate KB and the component BH2 placed on a single carrier CR.

[0029] Once the carrier CR is brought into the mounting work area AR, the control unit 16 causes the mounting head 15 to pick up the lower component BH1 and mount it onto the substrate KB, and then causes the mounting head 15 to pick up the upper component BH2 and mount it onto the lower component BH1 (Figure 6(c) → Figure 6(d). Mounting process). In this way, the component BH, which is the assembled component KBH, is mounted onto the substrate KB, and the mounted substrate JK is manufactured on the carrier CR (Figure 5(a)).

[0030] Once the assembled component KBH is mounted on the carrier CR as described above (the mounted circuit board JK is manufactured), the control unit 16 operates the transport unit 12 to transport the mounted circuit board JK along with the carrier CR to the outside of the component mounting device 10.

[0031] Thus, the component mounting apparatus 10 in Embodiment 2, similar to Embodiment 1, includes a substrate KB and a carrier CR on which components BH are placed before being mounted on the substrate KB, a transport unit 12 as a transport means for transporting the substrate KB and the carrier CR on which the components BH are placed to a predetermined mounting work area AR, and a mounting head 15 that uses the carrier CR, which has been transported to the mounting work area AR by the transport unit 12, as a work stage to mount the components BH onto the substrate KB. Furthermore, the component mounting method in Embodiment 2, similar to Embodiment 1, includes a transport step of transporting the substrate KB and the carrier CR on which components BH are placed before being mounted to the substrate KB to the mounting work area AR, and a mounting step of using the carrier CR, which has been transported to the mounting work area AR in the transport step, as a work stage to mount the components BH onto the substrate KB.

[0032] In Embodiment 2, component BH consists of an assembled component KBH having a lower component BH1 mounted on the substrate KB and an upper component BH2 mounted on the lower component BH1. Therefore, the substrate KB and the lower component BH1 and upper component BH2 before assembly are placed on the carrier CR. The mounting head 15 (mounting process) uses the carrier CR, which has been transported to the mounting work area AR by the transport unit 12, as a work stage to mount the lower component BH1 onto the substrate KB, and then mounts the upper component BH2 onto the lower component BH1 mounted on the substrate KB.

[0033] In the component mounting apparatus 10 (component mounting method) of Embodiment 2, as in Embodiment 1, the substrate KB constituting the mounting substrate JK and the component BH before mounting on the substrate KB are placed on the same carrier CR and supplied to the mounting work area AR, where the carrier CR is used as a work stage to mount the component BH onto the substrate KB. Therefore, in Embodiment 2, as in Embodiment 1, the effect of efficiently mounting the component BH (in this case, assembled component KBH) onto the substrate KB is obtained, but in addition, the effect of being able to mount the assembled component KBH onto the substrate KB without using a tray feeder as in the conventional method is obtained.

[0034] In the above-described embodiment 2, an example was shown in which two components BH (two assembled components KBH) were mounted on board KB of the mounting board JK. However, this is just one example, and the number of assembled components KBH mounted on board KB may be one or three or more.

[0035] (Embodiment 3) Next, Embodiment 3 will be described. The configuration of the component mounting apparatus 10 in Embodiment 3 is the same as in Embodiment 1 or Embodiment 2. Also, the configuration of the manufactured mounting board JK is the same as in Embodiment 2 (Figure 5(a)), but the method of assembling component BH (assembled component KBH) is different from that in Embodiment 2.

[0036] In Embodiment 3, similar to Embodiment 2, the substrate KB and the lower component BH1 and upper component BH2, which are components of the assembled component KBH, are placed on a single flat carrier CR (Figure 5(b)), and the carrier CR is transported by the transport unit 12 and brought into the mounting work area AR (Figure 7(a) → Figure 7(b). Transport process). As a result, the substrate KB and the lower component BH1 and upper component BH2, which are components of the component BH to be mounted on the substrate KB, are supplied into the mounting work area AR with the substrate KB and the component BH2 placed on a single carrier CR.

[0037] Once the carrier CR is brought into the mounting work area AR, the control unit 16 has the mounting head 15 pick up the upper component BH2 and mount it onto the lower component BH1, and then has the mounting head 15 pick up the lower component BH1 (the lower component BH1 with the upper component BH2 mounted on it) and mount it onto the substrate KB (Figure 7(c) → Figure 7(d). Mounting process). In this way, the component BH, which is the assembled component KBH, is mounted onto the substrate KB, and the mounted substrate JK is manufactured on the carrier CR (Figure 5(a)).

[0038] Once the assembled component KBH is mounted on the carrier CR as described above (the mounted circuit board JK is manufactured), the control unit 16 operates the transport unit 12 to transport the mounted circuit board JK along with the carrier CR to the outside of the component mounting device 10.

[0039] Thus, the component mounting apparatus 10 in Embodiment 3, similar to Embodiments 1 and 2, includes a substrate KB and a carrier CR on which components BH are placed before being mounted on the substrate KB, a transport unit 12 as a transport means for transporting the substrate KB and the carrier CR on which the components BH are placed to a predetermined mounting work area AR, and a mounting head 15 that uses the carrier CR, which has been transported to the mounting work area AR by the transport unit 12, as a work stage to mount the components BH onto the substrate KB. Furthermore, the component mounting method in Embodiment 3, similar to Embodiments 1 and 2, includes a transport step of transporting the substrate KB and the carrier CR on which components BH are placed before being mounted to the substrate KB to the mounting work area AR, and a mounting step of using the carrier CR, which has been transported to the mounting work area AR in the transport step, as a work stage to mount the components BH onto the substrate KB.

[0040] In Embodiment 3, as in Embodiment 2, the component BH consists of an assembled component KBH having a lower component BH1 mounted on the substrate KB and an upper component BH2 mounted on the lower component BH1. Therefore, the substrate KB and the lower component BH1 and upper component BH2 before assembly are placed on the carrier CR. However, unlike Embodiment 2, the mounting head 15 (mounting process) uses the carrier CR, which has been transported to the mounting work area AR by the transport unit 12, as a work stage to mount the upper component BH2 onto the lower component BH1, and then mounts the lower component BH1 with the upper component BH2 mounted onto it onto the substrate KB. In Embodiment 3, although the procedure for assembling the component BH on the carrier CR differs from that in Embodiment 2, the effect obtained is the same as in Embodiment 2, and the component BH (assembled component KBH) can be efficiently mounted onto the substrate KB.

[0041] The description of this embodiment is as described above, and it includes the following technologies (component mounting device 10 and component mounting method).

[0042] (Item 1) A component mounting apparatus (component mounting apparatus 10) for mounting components (components BH) onto a substrate (substrate KB), comprising: a substrate and a carrier (carrier CR) on which the components are placed before being mounted on the substrate; a transport means (transport unit 12) for transporting the substrate and the carrier on which the components are placed into a predetermined mounting work area (mounting work area AR); and a mounting head (mounting head 15) that uses the carrier, which has been transported into the mounting work area by the transport means, as a work stage to mount the components onto the substrate.

[0043] As mentioned above, the component mounting device described in item 1 eliminates the need for the parts feeder that was previously required, thus improving work efficiency. Even when the component backing is a large part, a specially shaped part, or an assembled part, a tray feeder is not required, and the effect is very significant.

[0044] (Item 2) The component assembly apparatus according to item 1, wherein the component consists of an assembly component (assembly component KBH) having a lower component (lower component BH1) mounted on the substrate and an upper component (upper component BH2) mounted on the lower component, the substrate and the lower and upper components before assembly are placed on the carrier, and the mounting head uses the carrier, which has been brought into the mounting work area by the loading means, as a work stage to perform the work of mounting the lower component on the substrate and the work of mounting the upper component on the lower component mounted on the substrate.

[0045] (Item 3) The component assembly apparatus according to item 1, wherein the component consists of an assembly having a lower component mounted on the substrate and an upper component mounted on the lower component, the substrate, the lower component and the upper component before assembly are placed on the carrier, and the mounting head uses the carrier, which has been brought into the mounting work area by the transport means, as a work stage to perform the work of mounting the upper component onto the lower component and the work of mounting the lower component with the upper component mounted onto it onto the substrate.

[0046] (Item 4) A component mounting method for mounting components on a circuit board, comprising: a loading step of loading the circuit board and a carrier on which the components to be mounted on the circuit board are placed into a predetermined mounting work area; and a mounting step of using the carrier loaded into the mounting work area in the loading step as a work stage to mount the components onto the circuit board.

[0047] (Item 5) The component assembly method according to item 4, wherein the component consists of an assembly having a lower component mounted on the substrate and an upper component mounted on the lower component, the substrate and the lower and upper components before assembly are placed on the carrier, and the mounting process involves using the carrier, which was brought into the mounting work area in the loading process, as a work stage, to mount the lower component onto the substrate and to mount the upper component onto the lower component mounted on the substrate.

[0048] (Item 6) The component assembly method according to item 4, wherein the component consists of an assembly having a lower component mounted on the substrate and an upper component mounted on the lower component, the substrate and the lower and upper components before assembly are placed on the carrier, and the assembly process involves using the carrier, which was brought into the assembly work area in the loading process, as a work stage, to perform the work of mounting the upper component onto the lower component and the work of mounting the lower component on which the upper component is placed onto the substrate.

[0049] Although this embodiment has been described so far, the technology of this disclosure is not limited to what has been described above, and various modifications are possible. For example, in embodiments 2 and 3 described above, the assembled component KBH mounted on the substrate KB was a two-tiered assembled component KBH consisting of a lower component BH1 and an upper component BH2 mounted on the lower component BH1, but the assembled component KBH is not limited to two tiers, and may consist of three or more tiers. For example, as shown in Figures 8(a) and 8(b), which are application examples of Embodiment 2, if the assembled component KBH is a three-tiered component having a lower component BH1 and an upper component BH2 in addition to the uppermost component BH3 placed on the upper component BH2, then the uppermost component BH3 can be placed on the carrier CR in advance along with the lower component BH1 and the upper component BH2 (Figure 8(b)), the lower component BH1 is mounted on the substrate KB, then the upper component BH2 is placed on the lower component BH1, and finally the uppermost component BH3 is placed on the upper component BH2 (Figure 8(a)). [Industrial applicability]

[0050] The present invention provides a component mounting apparatus and a component mounting method that can efficiently mount large components, specially shaped components, or assembled components onto a circuit board, thereby improving productivity. [Explanation of Symbols]

[0051] 10. Component mounting equipment 11 Base 11F Feeder Base 12. Transport section (means of loading) 13 Parts Feeder 14. Head movement mechanism 15 Mounting Head 15a Nozzle 16 Control Unit AR implementation work area BH parts KBH assembly parts BH1 Lower section components BH2 Upper section KB board JK mounting board CR Career

Claims

1. A component mounting device for mounting components onto a circuit board, The substrate and the carrier on which the components are placed before being mounted on the substrate, A means for transporting the substrate and the carrier on which the components are placed into a predetermined mounting work area, A mounting head that performs the work of mounting the components onto the substrate using the carrier, which has been brought into the mounting work area by the loading means, as a work stage, A component mounting device equipped with this device.

2. The component assembly apparatus according to claim 1, wherein the component consists of an assembly having a lower component mounted on the substrate and an upper component mounted on the lower component, the substrate, the lower component and the upper component before assembly are placed on the carrier, and the mounting head uses the carrier, which has been brought into the mounting work area by the transport means, as a work stage to perform the work of mounting the lower component on the substrate and the work of mounting the upper component on the lower component mounted on the substrate.

3. The component assembly apparatus according to claim 1, wherein the component consists of an assembly having a lower component mounted on the substrate and an upper component mounted on the lower component, the substrate, the lower component and the upper component before assembly are placed on the carrier, and the mounting head uses the carrier, which has been brought into the mounting work area by the transport means, as a work stage to perform the work of mounting the upper component onto the lower component and the work of mounting the lower component with the upper component mounted onto it onto the substrate.

4. A component mounting method for mounting components onto a circuit board, A transport process involves transporting the substrate and the carrier on which the components are mounted before being mounted onto the substrate to a predetermined mounting work area. A mounting process in which the carrier brought into the mounting work area in the aforementioned loading process is used as a work stage to mount the components onto the substrate, Method for mounting sharp components.

5. The component mounting method according to claim 4, wherein the component consists of an assembled component having a lower component mounted on the substrate and an upper component mounted on the lower component, the substrate and the lower and upper components before assembly are placed on the carrier, and the mounting step involves using the carrier, which was brought into the mounting work area in the loading step, as a work stage, to mount the lower component onto the substrate and to mount the upper component onto the lower component mounted on the substrate.

6. The component mounting method according to claim 4, wherein the component consists of an assembled component having a lower component mounted on the substrate and an upper component mounted on the lower component, the substrate and the lower and upper components before assembly are placed on the carrier, and the mounting step involves using the carrier, which was brought into the mounting work area in the loading step, as a work stage, to perform the work of mounting the upper component onto the lower component and the work of mounting the lower component with the upper component mounted onto it onto the substrate.

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