electronic machinery

Abstract

We will provide a novel electronic device that can perform various processes with simple operation. We provide sub-devices. We provide electronic devices with a high level of security. [Solution] The electronic device has a control unit, a detection unit, and a storage unit. The detection unit is touch It has a function to detect operation and a function to acquire fingerprint information of the touching finger. The memory unit is It has the function of storing fingerprint information of multiple fingers that have been registered in advance. The control unit is the detection unit When a touch operation is detected, the detection unit acquires fingerprint information of the touching finger and the fingerprints of multiple fingers. The fingerprint information of the touching finger is compared with the pattern information, and if it matches any one of the fingerprints of multiple fingers, If this occurs, the fingerprint information of the touching finger or a combination of the touching finger's fingerprint information and the touch operation will be used. It has the function to perform the appropriate processing.

Description

[Technical Field]

[0001] One aspect of the present invention relates to electronic equipment. Another aspect of the present invention relates to a display device. One aspect relates to a program.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. For example, semiconductor devices, display devices, light-emitting devices, energy storage devices, memory devices, electronic devices, lighting devices, Input devices (e.g., touch sensors), input / output devices (e.g., touch panels), and Examples of these driving methods, or methods for manufacturing them, can be given. [Background technology]

[0003] Mobile phones such as smartphones, tablet devices, and notebook PCs (personal computers) Information terminal devices such as computers are widely used. Many of these information terminal devices are It enables intuitive screen operation by allowing the user to touch the screen with their finger. For example Multi-touch and touch gestures such as touch, swipe, pinch in with two fingers, pinch out, etc. By utilizing the difference in time, it is possible to distribute functions and actions such as zooming in and out. They are making it happen.

[0004] Furthermore, such information terminal devices often contain personal information, and preventing their unauthorized use is crucial. Various authentication technologies are being developed to prevent this.

[0005] For example, Patent Document 1 describes an electronic device equipped with a fingerprint sensor in the push-button switch section. It has been disclosed. [Prior art documents] [Patent Documents]

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, in multi-touch operations, there are some functions that are difficult to execute, such as functions that can be executed by operating with four or more fingers. included.

[0008] One aspect of the present invention aims to provide a novel electronic device. One aspect of the present invention aims to provide an electronic device that can execute various processes with simple operations. Or, one aspect of the present invention aims to provide an electronic device with a high security level. This is one of the problems.

[0009] Note that the description of these problems does not prevent the existence of other problems. One aspect of the present invention is not necessarily required to solve all of these problems. Other problems can be extracted from the descriptions of the specification, drawings, and claims.

Means for Solving the Problems

[0010] One aspect of the present invention is an electronic device having a control unit, a detection unit, and a storage unit. The detection unit has a function of detecting a touch operation and a function of acquiring fingerprint information of the touched finger. The storage unit has a function of holding fingerprint information of a plurality of pre-registered fingers. The control unit collates the fingerprint information of the touched finger with each of the fingerprint information of the plurality of fingers, and when the fingerprint information of the touched finger matches any of the fingerprint information of the plurality of fingers, among the fingerprint information of the plurality of fingers, the touched finger ​It has the function of performing processing according to the fingerprint information that matches the fingerprint information.

[0011] Another aspect of the present invention is an electronic device having a control unit, a detection unit, and a storage unit. The detection unit has the function of detecting touch operations and the function of acquiring fingerprint information of the touching finger. The memory unit has the function of storing fingerprint information of multiple fingers that have been registered in advance. The official compares the fingerprint information of the finger that touched the object with the fingerprint information of multiple fingers, and then determines the finger that touched the object. If the fingerprint information matches any of the fingerprint information of multiple fingers, The system executes processing based on the combination of fingerprint information that matches the fingerprint information of the finger that touched the surface and the touch operation. It has the function of [doing something].

[0012] Another aspect of the present invention is an electronic device having a control unit, a display unit, and a storage unit. The display unit has the function of displaying images, the function of detecting touch operations, and the fingerprint information of the touching finger. It has the function of acquiring and the memory unit stores fingerprint information of multiple fingers that have been registered in advance. It has the function of holding. The control unit has the fingerprint information of the touching finger and the fingerprint information of multiple fingers. The system compares the fingerprints of the touching finger, and if the fingerprint information of the touching finger matches any of the fingerprint information of multiple fingers, then... The system performs processing based on the fingerprint information of the fingers that matched the fingerprint information of the finger that touched the surface. It has a function.

[0013] Another aspect of the present invention is an electronic device having a control unit, a display unit, and a storage unit. The display unit has the function of displaying images, the function of detecting touch operations, and the fingerprint information of the touching finger. It has the function of acquiring and the memory unit stores fingerprint information of multiple fingers that have been registered in advance. It has the function of holding. The control unit has the fingerprint information of the touching finger and the fingerprint information of multiple fingers. The system compares the fingerprints of the touching finger, and if the fingerprint information of the touching finger matches any of the fingerprint information of multiple fingers, then... The combination of fingerprint information from multiple fingers that matches the fingerprint information of the finger that touched the screen, and the touch operation. It has the function to perform processing according to the situation.

[0014] Furthermore, in the above case, the fingerprint information of the touching finger does not match any of the fingerprint information of multiple fingers. In some cases, it is preferable to have a function that transitions the system to a locked state.

[0015] Furthermore, in the above, the display unit has a function to authenticate fingerprint information using multiple pixels and the entire display area. It is preferable to have a pixel. In this case, the pixel has a light-emitting element and a light-receiving element, and the light-emitting element It is preferable that the child and the light-receiving element are located on the same plane.

[0016] Furthermore, in the above, the light-emitting element is formed by stacking a first electrode, a light-emitting layer, and a common electrode. It is preferable to have a layered structure. The photodetector also has a second electrode, an active layer, and a common electrode. It is preferable to have a laminated structure in which the and are stacked. In this case, the light-emitting layer and the active layer are It is preferable that each contains different organic compounds. Also, the first electrode and the second electrode The electrodes are provided spaced apart on the same plane, and the common electrode is provided covering the light-emitting layer and the active layer. It is preferable to do so.

[0017] Alternatively, in the above, the light-emitting element comprises a first electrode, a common layer, a light-emitting layer, and a common electrode. It is preferable to have a laminated structure in which the following are stacked. The light-receiving element also has a second electrode and a common layer It is preferable that the structure has a laminated structure in which the active layer and the common electrode are stacked. Preferably, the light-emitting layer and the active layer each contain different organic compounds. Electrode 1 and electrode 2 are provided on the same plane, spaced apart, and the common electrode is connected to the light-emitting layer and active The common layer is provided covering the first electrode and the second electrode. preferable.

[0018] Furthermore, in the above, the light-emitting element has the function of emitting visible light, and the light-receiving element is the light-emitting element It is preferable that the device has the function of receiving the visible light it emits.

[0019] Alternatively, in the above, the light-emitting element has the function of emitting infrared light, and the light-receiving element is the light-emitting element. It is preferable that the device has the function of receiving infrared light emitted by the device.

[0020] Another aspect of the present invention is to have an electronic device having a control unit and a detection unit perform the operation. This is the program. Here, the detection unit has the function of detecting touch operations and the fingerprint of the touching finger. The present invention has a function to acquire information. In one aspect of the present invention, the program has a detection unit that detects touch operations When an action is detected, the control unit obtains the fingerprint information of the touching finger. The steps involve comparing the pattern information with the fingerprint information of multiple fingers that have been registered in advance, and the touched finger If the fingerprint information of one of the multiple fingers matches the fingerprint information of any one of the multiple fingers, the control unit will... Steps that perform processing according to the fingerprint information that matches the fingerprint information of the finger that touched the surface. It has a pu.

[0021] Another aspect of the present invention is to have an electronic device having a control unit and a detection unit perform the operation. This is the program. Here, the detection unit has the function of detecting touch operations and the fingerprint of the touching finger. The present invention has a function to acquire information. In one aspect of the present invention, the program has a detection unit that detects touch operations When an action is detected, the control unit obtains the fingerprint information of the touching finger. The steps involve comparing the pattern information with the fingerprint information of multiple fingers that have been registered in advance, and the touched finger If the fingerprint information of one of the multiple fingers matches the fingerprint information of any one of the multiple fingers, the control unit will... The combination of fingerprint information that matches the fingerprint information of the finger that touched the surface and the touch operation. The process includes the step of performing the appropriate processing.

[0022] Furthermore, in the above, the program of one aspect of the present invention collects fingerprint information of a touching finger from multiple fingers. If none of the fingerprint information matches, the control unit will switch the system to a locked state. It is preferable to have a step that involves doing so. [Effects of the Invention]

[0023] According to one aspect of the present invention, by setting different processing for each type of finger, various operations can be performed with simple operation. We can provide electronic devices that can perform various processes. Or, a high level of security. We can provide existing electronic devices. Or, we can provide novel electronic devices.

[0024] Furthermore, the description of these effects does not preclude the existence of other effects. One aspect of the present invention is It is not necessarily required to have all of these effects. It is possible to extract effects other than those listed above. [Brief explanation of the drawing]

[0025] [Figure 1] Figure 1 shows an example of the configuration of an electronic device. [Figure 2] Figure 2 illustrates an example of how an electronic device operates. [Figure 3] Figures 3A and 3B show examples of electronic device configurations. [Figure 4] Figures 4A and 4B illustrate examples of the configuration of electronic equipment and examples of its operation. [Figure 5] Figures 5A to 5C illustrate examples of electronic device configurations and their operating methods. [Figure 6] Figures 6A to 6D and 6F are cross-sectional views showing an example of a display device. Figures 6E and 6G show examples of images captured by the display device. Figures 6H and 6J to 6L are top views showing an example of a pixel. [Figure 7] Figures 7A to 7G are top views showing an example of a pixel. [Figure 8] Figures 8A and 8B are cross-sectional views showing an example of a display device. [Figure 9] Figures 9A and 9B are cross-sectional views showing an example of a display device. [Figure 10] Figures 10A to 10C are cross-sectional views showing an example of a display device. [Figure 11] Figure 11A is a cross-sectional view showing an example of a display device. Figures 11B and 11C show an example of the top surface layout of the resin layer. [Figure 12] Figure 12 is a perspective view showing an example of a display device. [Figure 13] Figure 13 is a cross-sectional view showing an example of a display device. [Figure 14] Figure 14 is a cross-sectional view showing an example of a display device. [Figure 15] Figure 15A is a cross-sectional view showing an example of a display device. Figure 15B is a cross-sectional view showing an example of a transistor. [Figure 16] Figures 16A and 16B are circuit diagrams showing an example of a pixel circuit. [Figure 17] Figures 17A and 17B show examples of electronic devices. [Figure 18] Figures 18A to 18D show examples of electronic devices. [Figure 19] Figures 19A to 19F show examples of electronic devices. [Modes for carrying out the invention]

[0026] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The interpretation is not limited to the content stated herein.

[0027] In the configuration of the invention described below, the same part or part having a similar function is used. The same symbol is used consistently across different drawings, and explanations of its repetition are omitted. When referring to a function, the same hatch pattern may be used, and a specific symbol may not be assigned.

[0028] Furthermore, the position, size, and extent of each component shown in the drawings are, for the sake of ease of understanding, actually The location, size, and range may not be described. Therefore, the disclosed invention is not always Furthermore, it is not limited to the location, size, scope, etc., disclosed in the drawings.

[0029] Furthermore, the words "membrane" and "layer" may differ depending on the context or situation. And they can be interchanged. For example, the term "conductive layer" can be replaced with "conductive film." It is possible to change the term to this. Or, for example, the term "insulating film" can be changed to It is possible to change the term to "insulating layer".

[0030] (Embodiment 1) This embodiment describes an electronic device and a method of operating the electronic device according to one aspect of the present invention. .

[0031] In the drawings attached to this specification, the components are classified by function and are shown as independent blocks. Although a block diagram is shown as an example, the actual components are not completely separated by function. This is difficult because one component can be involved in multiple functions, or one function can be involved in multiple components. It could potentially be achieved.

[0032] In the following section, a more specific configuration example of an electronic device according to one aspect of the present invention will be described with reference to the drawings. I will reveal it.

[0033] In one embodiment of the present invention, an electronic device is used to obtain fingerprint information and then determine which fingers are touching, such as the index finger and middle finger. By incorporating a function that recognizes the difference between fingers being used, simple and versatile operations become possible. For example, you can zoom in on the display screen by tapping with your index finger, and then tap with your middle finger. This allows you to reduce the size of the display screen.

[0034] Furthermore, in an electronic device according to one aspect of the present invention, the acquired fingerprint information is used to determine the index finger, middle finger, etc. It recognizes the difference between the fingers touching the surface and combines that fingerprint information with the detected touch operation. This enables simple and versatile operations. For example, double-tapping with your index finger By doing so, you can launch any application, and by double-tapping with your middle finger... This allows you to close any applications that were running.

[0035] Furthermore, in an electronic device according to one aspect of the present invention, the detection of touch operation and the acquisition of fingerprint information are performed on the display unit. This can be done. Therefore, there is no need to provide a separate fingerprint sensor, etc., and the electronic device is configured The number of components required can be minimized.

[0036] [Example of electronic device configuration] Figure 1 shows a block diagram of device 10, which is an example of an electronic device according to one aspect of the present invention. The chair 10 has a control unit 11, a display unit 12, and a storage unit 13. The display unit 12 is a check It has a protrusion 21. Device 10 can be used as an electronic device such as an information terminal. It is possible.

[0037] The display unit 12 has the function of displaying an image, the function of detecting touch operations, and the function of detecting a finger touching the screen, etc. It has a function to acquire fingerprint information. Here, the display unit 12 has a detection unit 21. An example is shown. The detection unit 21 is a device that detects touch operations, which is one of the functions of the display unit 12. This part is responsible for acquiring the function and fingerprint information. The display unit 12 has a fingerprint information acquisition function. It can also be called a touch panel. For example, the display unit 12 is as described in detail in Embodiment 2. A display device can be used.

[0038] The detection unit 21 has the function of outputting the position information of the finger touching the screen to the control unit 11. Furthermore, the detection unit 21 captures the fingerprint of the finger that touches the screen and uses that image information as fingerprint information. It has the function of outputting to unit 11.

[0039] The display unit 12 can acquire fingerprint information of the finger that touches the screen, regardless of its position. It is preferable that the area on the screen where the touch sensor functions and the fingerprint information It is preferable that the range within which the data can be obtained matches or roughly matches.

[0040] The storage unit 13 stores the fingerprint information of a user that has been registered in advance, and the fingerprint information or the It has a function to store processing information corresponding to the combination of fingerprint information and touch operation. Storage Unit 1 3 can output the information to the control unit 11 in response to a request from the control unit 11. Even if the processing information is set individually by an application within the electronic device, good.

[0041] To enable a wide range of operations, the memory unit 13 stores all the fingers the user uses to operate the screen. It is preferable that fingerprint information is retained. For example, the index finger of the user's right hand and the index finger of their left hand In addition to the fingerprint information of the index finger, the system also stores the fingerprint information of the user's right middle finger and left middle finger. It is preferable that this be done. In addition, one or more fingers from the ring finger, little finger, and thumb It is preferable to retain pattern information, and to retain fingerprint information for all five fingers of the user's hands. That's fine.

[0042] When the detection unit 21 detects a touch operation, the control unit 11 sends fingerprint information to the detection unit 21. It has a function to request acquisition. The control unit 11 receives fingerprint information input from the detection unit 21. It has a function to compare the report with the fingerprint information of multiple fingers that have been registered in advance. Control Unit 11 This occurs when the fingerprint information input from the detection unit 21 matches any one of the fingerprint information of the multiple fingers. If it is determined that this is the case, the processing will be carried out according to the pre-configured procedures for the fingerprint information, or The control unit 11 performs processing according to the combination of the fingerprint information and the touch operation. If it is determined that the entered fingerprint information does not match any of the registered fingerprint information. Preferably, the system has a function to transition to any desired state. Any desired state is: Here, for example, if the device is locked or if there is a warning on the screen that the fingerprint information does not match... This refers to the state in which the notice is displayed, etc. Note that this function may differ from the examples described in this specification. It may be a transition to the following. Alternatively, it may not have to have the function in question.

[0043] The fingerprint authentication method performed by the control unit 11 is, for example, to compare two images. This involves using template matching methods or pattern matching methods that utilize similarity. The method can be used. Furthermore, fingerprint authentication can be performed using machine learning-based inference. This is also acceptable. In this case, it is particularly preferable to perform the inference using a neural network. It seems so.

[0044] Furthermore, the control unit 11 is, for example, a central processing unit (CPU). The control unit 11 can function as an ng Unit. By interpreting and executing instructions from a program, various data processing and program control operations are performed. The programs that can be executed by the processor are stored in the memory area of ​​the processor. It may be stored in memory unit 13, or it may be stored in memory unit 13.

[0045] [Examples of electronic device operation] The following describes an example of the operation of the device 10. Figure 2 shows the operation of device 10. This is a flowchart related to the process. The flowchart shown in Figure 2 is a flowchart of steps S1 to step It has a PU S6.

[0046] In step S1, the detection unit 21 detects a touch operation. If this is done, proceed to step S2. If no touch operation is performed, proceed to step S2. Wait until the operation is completed (return to step S1).

[0047] Furthermore, if no touch operation is performed for a certain period of time in step S1, the control unit 11 will The system may be switched to a locked state.

[0048] In step S2, the detection unit 21 acquires fingerprint information. The detection unit 21 The acquired fingerprint information is output to the control unit 11.

[0049] In step S3, the control unit 11 performs fingerprint authentication processing. Specifically, the storage unit 1 The fingerprint information acquired by the detection unit 21 is compared with the multiple fingerprint information pre-stored in 3. The system determines whether the latter matches any of the former. Multiple fingerprint information stored in the memory unit 13 If, among the reports, it is determined that the fingerprint information of finger A matches the fingerprint information acquired by the detection unit 21 Then, proceed to step S4. Also, among the multiple fingerprint information stored in the memory unit 13, If it is determined that the fingerprint information of finger B matches the fingerprint information acquired by the detection unit 21, then The process moves to step S5. Meanwhile, any of the multiple fingerprint information stored in the memory unit 13 is If the detection unit 21 determines that the fingerprint information acquired does not match, the process proceeds to step S6. do.

[0050] In step S4, the control unit 11, based on the touch operation detected by the detection unit 21, The control unit 11 executes process A according to the fingerprint information of A. Alternatively, the control unit 11 detects the fingerprint information of A. Based on the touch operation, process A is executed according to the combination of fingerprint information of finger A and the touch operation. Yes. Touch operations include tap, long tap, swipe, flick, slide, and do There are operations such as rags.

[0051] In step S5, the control unit 11, based on the touch operation detected by the detection unit 21, The control unit 11 executes process B according to the fingerprint information of B. Alternatively, the control unit 11 detects the fingerprint information of the detection unit 21. Based on the touch operation, process B is executed according to the combination of fingerprint information of finger B and the touch operation. Yes. Touch operations include tap, long tap, swipe, flick, slide, and do There are operations such as rags.

[0052] Note that finger A and finger B here refer to fingers that have fingerprint information pre-stored in the memory unit 13. This refers to any finger, for example, any of the index finger, middle finger, ring finger, little finger, or thumb. This refers to the process when fingerprint information for finger A and finger B is detected. The document describes the flow of information, but it is appropriate to adjust the flow depending on the number of fingerprints stored in the memory unit 13. The following may be changed. For example, the memory unit 13 stores the fingerprint information of any finger C that has been pre-registered. The detection unit 21 has the fingerprint information of finger C, and when it detects the fingerprint information of finger C, the control unit 11 has the fingerprint information of finger C A flow that executes a process C according to the combination of the report or finger C's fingerprint information and touch operation. It is preferable to have it.

[0053] Having the above functions, when the same operation is performed with different fingers, each finger has its own characteristics. Different processes can be performed depending on the fingerprint information. This allows for two-finger operations, for example. For example, processes that previously required operations such as pinch-in and pinch-out can now be performed with a single finger. This allows for simple and versatile operation.

[0054] Furthermore, it's possible to perform a variety of operations using only taps, for example. By doing so, you can also perform screen scrolling that previously required a slide operation. This means that a variety of operations become possible without having to perform a sliding motion with your finger. This makes it possible to create devices that are easy to operate for the elderly and people with disabilities. .

[0055] Note that processing based on a combination of fingerprint information and touch operation is a function of the application. It can also be linked to this. For example, in one application, tapping the screen with your ring finger Then you can close the application, and in another application, press the f[] with your ring finger. You can delete a file by tapping the image or icon associated with it. It is also possible to execute the process.

[0056] In step S6, the control unit 11 executes an arbitrary process X. For example, process X is This process locks the system and displays a warning message on the screen indicating that the fingerprint information does not match. It is preferable to perform processing, etc. This allows the user operating the electronic device to... The device may become unusable, or its available functions may be limited.

[0057] Furthermore, the process X in step S6 may be a process different from the example shown herein. Alternatively, no processing is required.

[0058] By repeating the flow shown in Figure 2, device 10 can perform various processes.

[0059] The above is an explanation of the flowchart shown in Figure 2.

[0060] Although Figure 2 shows an example of processing performed according to the fingerprint information of one finger, this is an embodiment of the present invention. The details are not limited to these. In one aspect of the present invention, fingerprint information (or fingerprint information) of two or more fingers Processing may be performed according to the combination of information and touch operation. For example, processing may be performed with each finger. The available touch operations include tap, long tap, swipe, flick, slide, and drag. There are various touch gestures, including pinch-in and pinch-out, which can be performed with two fingers. This includes things like rotation. Specifically, there are cases where you tap with your index and middle fingers, and cases where you tap with your index and ring fingers. You may perform different actions depending on whether you tapped or not.

[0061] Furthermore, processing methods, operation methods, and operating methods performed by an electronic device according to one aspect of the present invention, The display method, etc., can be described, for example, as a program. For example, the device exemplified above The processing methods, operation methods, behavioral methods, or display methods that are executed by S10 etc. are described. The program is stored in a non-temporary storage medium and the control unit 11 of device 10 performs calculations It can be read by a device, etc., and executed. That is, the operation methods, etc., exemplified above, A program to be executed by hardware, and a non-uniform storage device in which the program is stored. A time-storage medium is one aspect of the present invention.

[0062] [Differentiation] In the above example, the display unit 12 includes the detection unit 21, but these can be provided separately. This is also acceptable. The device 10A shown in Figure 3A is an example in which the detection unit 21 is not included in the display unit 12. They are doing it.

[0063] The detection unit 21 of device 10A may be, for example, a touchpad that does not have an image display function. These are some examples.

[0064] Alternatively, device 10A may have a display unit 12 that does not have a function to acquire fingerprint information, and display an image. The configuration may also include two detection units 21 having the function shown. That is, the input means One detection unit 21 uses a touch panel with a fingerprint information acquisition function, and separately from this, image The configuration may also include a display unit 12 as a means of display.

[0065] Alternatively, a detection unit used for touch detection and a detection unit used for acquiring fingerprint information may be provided separately. It may be. The device 10B shown in Figure 3B has a detection unit 21A that acquires fingerprint information. This example shows a case where a detection unit 21B, which performs touch detection, is included in the display unit 12 and is provided independently. For example, the display unit 12 uses the display device described in detail in Embodiment 2, and the detection unit 21B A capacitive touch sensor may also be used.

[0066] In device 10B, the display unit 12 includes a detection unit 2 that performs touch detection. It may also be 1B, and the detection unit 21A that acquires fingerprint information is provided independently. That's fine.

[0067] [Specific example] The following describes a specific example of an electronic device according to one aspect of the present invention.

[0068] Figure 4A schematically shows the electronic device 30 and the first finger 25 for operating the electronic device 30. The device 30 has a display unit 31. The electronic device 30 functions, for example, as a smartphone. It is a portable information terminal device.

[0069] As electronic device 30, the aforementioned device 10, device 10A, or device 10B is applied. It is possible.

[0070] In Figure 4A, the fingertip of the first finger 25 is touching the display unit 31. At this time, the display unit 31 This allows us to obtain the fingerprint information 26 of the first finger 25.

[0071] Furthermore, Figure 4A shows the fingerprint information 26 acquired by the display unit 31 and the electronic device 30. This shows the fingerprint information of multiple fingers of the previously registered user 27. If one of the fingerprints, fingerprint information 27A, matches the fingerprint information 26 acquired by the display unit 31, Based on the determination made by the control unit 11, the fingerprint information 27A (or the combination of fingerprint information 27A and touch operation) Processing is executed according to the combination. For example, as shown in Figure 4A, the user is first By tapping with finger 25, you can perform operations such as zooming in on image 35.

[0072] Figure 4B schematically shows the electronic device 30 and the second finger 28 for operating the electronic device 30. ru.

[0073] In Figure 4B, the fingertip of the second finger 28 is touching the display unit 31. At this time, the display unit 31 This allows us to obtain the fingerprint information 29 of the second finger 28.

[0074] Furthermore, Figure 4B shows, similar to Figure 4A, the fingerprint information 29 acquired by the display unit 31, and electronic The device 30 shows the fingerprint information 27 of multiple fingers of the user that have been pre-registered. Fingerprint information 27B, which is one of the fingerprint information of the number of fingers, and fingerprint information 2 acquired by the display unit 31 As a result of the control unit 11 determining that 9 matches, the fingerprint information 27B (or the fingerprint information 27B and Processing is executed according to the combination of touch operations. For example, as shown in Figure 4B, The user can perform operations such as shrinking the image 35 by tapping with their second finger 28. It is possible.

[0075] Figure 5A shows an electronic device 40, which is a specific example of one aspect of the present invention. The electronic device 40 is It functions as a notebook-type personal computer.

[0076] The electronic device 40 includes a display unit 41, an input unit 42, multiple input keys 43, a housing 44, a housing 45, It has a hinge portion 46, etc. The display unit 41 is provided on the housing 44. Input unit 42 and input keys 43 is provided in the housing 45. Housing 44 and housing 45 are connected by a hinge portion 46. It is.

[0077] The input unit 42 functions as a touchpad. The input unit 42 receives information about the position where the fingertip of the finger 24 touches. It has a function to acquire information and touch operations, and a function to acquire fingerprint information of the fingertip.

[0078] When a touch panel is applied to the display unit 41, it must have a function to acquire fingerprint information. preferable.

[0079] Figure 5B shows an electronic device 40A in which a flexible display is applied to the display unit 41A. The display unit 41A is provided across the housing 44 and the housing 45. This allows for seamless display across two enclosures.

[0080] The display unit 41A has the function of displaying images and the position information and touch operation of the fingertips of the fingers 24. It has a function to acquire a fingertip and a function to acquire fingerprint information of the fingertip.

[0081] Figure 5C shows an electronic device 40B in which a display unit is provided in each of the two enclosures. A display unit 41B is provided on body 44. A display unit 41C is provided on housing 45.

[0082] At least one, preferably both, of the display unit 41B and the display unit 41C displays an image. The functions include: a function to obtain location information of the fingertips of 24 fingers, and a function to obtain fingerprint information of those fingertips. It has the function of doing so.

[0083] The above is an explanation of the specific example.

[0084] This embodiment can be appropriately combined with other embodiments. Furthermore, this specification Furthermore, if multiple configuration examples are shown within a single embodiment, the configuration examples may be combined as appropriate. It is possible to do so.

[0085] (Embodiment 2) In this embodiment, a display device according to one aspect of the present invention will be described with reference to Figures 6 to 15.

[0086] The display device of this embodiment is suitably used in the display unit of the device described in Embodiment 1. It is possible.

[0087] The display unit of a display device according to one aspect of the present invention uses a light-emitting element (also called a light-emitting device) to display an image. It has a function to display [something]. Furthermore, the display unit has either an imaging function or a sensing function. Both sides possess it.

[0088] A display device according to one aspect of the present invention has a light-receiving element (also called a light-receiving device) and a light-emitting element. Alternatively, a display device according to one aspect of the present invention comprises a light-receiving element (also called a light-receiving device) and a light-emitting element. It has an element.

[0089] First, a display device having a light-receiving element and a light-emitting element will be described.

[0090] A display device according to one aspect of the present invention has a light-receiving element and a light-emitting element in its display section. The display device has a display section in which light-emitting elements are arranged in a matrix, and the display section displays images. It can display an image. In addition, light-receiving elements are arranged in a matrix within the display unit. The display unit has either an imaging function or a sensing function, or both. It can be used in image sensors and touch sensors. In other words, it can detect light in the display unit. This allows for the capture of images and the detection of proximity or contact with objects (such as fingers or pens). This is possible. Furthermore, a display device according to one aspect of the present invention utilizes a light-emitting element as a light source for a sensor. Therefore, it is not necessary to provide a light receiving unit and a light source separately from the display device, and electronic This allows for a reduction in the number of parts in the equipment.

[0091] In one aspect of the present invention, a display device has a light-emitting element in the display unit, and the light emitted by that element is reflected by the object ( When light is scattered, the light-receiving element can detect the reflected (or scattered) light, so in dark places However, it can capture images and detect touch operations (contact or proximity).

[0092] A display device according to one aspect of the present invention has the function of displaying an image using a light-emitting element. The light-emitting element functions as a display element (also called a display device).

[0093] As a light-emitting element, OLED (Organic Light Emitting Diode) de) and QLED(Quantum-dot Light Emitting Diod) It is preferable to use EL elements (also called EL devices) such as e). Examples of light-emitting materials include fluorescent materials, phosphorescent materials, Inorganic compounds (such as quantum dot materials), substances that exhibit thermally activated delayed fluorescence (thermally activated delayed fluorescence ( Thermally Activated Delayed Fluorescence Examples include TADF materials. Also, as a light-emitting element, micro-LEDs (Lig LEDs such as the (Ht Emitting Diode) can also be used.

[0094] A display device according to one aspect of the present invention has the function of detecting light using a light-receiving element.

[0095] When a light-receiving element is used as an image sensor, the display device uses the light-receiving element to capture an image. For example, the display device of this embodiment can be used as a scanner. ru.

[0096] For example, using an image sensor, it is possible to acquire data related to biometric information such as fingerprints and palm prints. This means that a biometric authentication sensor can be built into the display device. By incorporating a biometric authentication sensor into the device, the location where a separate biometric authentication sensor is installed in addition to the display device is not required. Compared to conventional designs, this method allows for a reduction in the number of components in electronic devices, enabling miniaturization and weight reduction of electronic devices. ru.

[0097] Furthermore, when a light-receiving element is used as a touch sensor, the display device uses the light-receiving element to detect the object It can detect proximity or contact.

[0098] For example, a pn-type or pin-type photodiode can be used as the light-receiving element. To do so. A photodetector is a photoelectric conversion element that detects light incident on it and generates an electric charge. It functions as a (also called a conversion device). Based on the amount of light incident on the photodetector, it converts the light into the photodetector. The amount of charge generated is determined by this.

[0099] In particular, using an organic photodiode having a layer containing an organic compound as the light-receiving element. This is preferable. Organic photodiodes are easy to make thin, light, and large in area, and Furthermore, its high degree of freedom in shape and design allows it to be applied to various display devices.

[0100] In one aspect of the present invention, an organic EL element (also called an organic EL device) is used as the light-emitting element. Organic photodiodes are used as light-receiving elements. The elements can be formed on the same substrate. Therefore, a display device using organic EL elements An organic photodiode can be incorporated into it.

[0101] When attempting to fabricate all the layers that make up an organic EL element and an organic photodiode, The number of film-forming processes becomes very large. Organic photodiodes can share a common configuration with organic EL elements. Because there are many layers, layers that can share a common structure are deposited in a single process to suppress the increase in the number of deposition steps. It is possible.

[0102] For example, one of a pair of electrodes (the common electrode) is made a common layer for both the light-receiving element and the light-emitting element. This is possible. Also, for example, hole injection layer, hole transport layer, electron transport layer and electron injection layer It is preferable that at least one layer be a common layer for both the light-receiving element and the light-emitting element. Also, for example, However, the light-receiving element has an active layer and the light-emitting element has a light-emitting layer, except that the light-receiving element and the light-emitting element This also allows for the same configuration. In other words, the light-emitting layer of the light-emitting element is replaced with the active layer. In this way, a light-receiving element can also be fabricated. Thus, the light-receiving element and the light-emitting element are in the same layer. Having this allows for a reduction in the number of film deposition cycles and the number of masks, and improves the manufacturing process of the display device. Manufacturing costs can be reduced. Furthermore, existing manufacturing equipment and methods for display devices can be used. This allows for the fabrication of a display device having a light-receiving element.

[0103] Furthermore, the layers that are common to both the light-receiving element and the light-emitting element have functions in both the light-emitting element and the light-receiving element. The functions may differ. In this specification, the configuration is based on the functions of the light-emitting element. It is referred to as an element. For example, a hole injection layer functions as a hole injection layer in a light-emitting element, and is light-receiving. It functions as a hole transport layer in the device. Similarly, the electron injection layer functions as an electron transport layer in a light-emitting device. It functions as an injection layer and as an electron transport layer in the photodetector. The layers that are common to all optical elements have the same function in both the light-emitting element and the light-receiving element. In some cases, the hole transport layer is present in both the light-emitting element and the photodetector. The electron transport layer functions as an electron transport layer in both the light-emitting element and the light-receiving element. It functions.

[0104] Next, a display device having a light-receiving element and a light-emitting element will be described.

[0105] In a display device according to one aspect of the present invention, a subpixel exhibiting any of the colors replaces a light-emitting element. Sub-pixels that exhibit other colors also have light-emitting and light-receiving elements. The offspring possesses both the ability to emit light (luminescence function) and the ability to receive light (photoreception function). For example, in a case where a pixel has three subpixels: a red subpixel, a green subpixel, and a blue subpixel. In addition, a configuration in which at least one subpixel has an light-emitting element and the other subpixels have light-emitting elements. Therefore, the display unit of a display device according to one aspect of the present invention has a dual light-receiving and light-emitting element. It has the function of displaying images using a method.

[0106] By having the light-emitting element serve as both a light-emitting element and a light-receiving element, the number of subpixels included in the pixel can be increased. Without doing so, light-receiving functionality can be added to the pixels. This allows for a reduction in the aperture ratio of each sub-pixel. While maintaining the aperture ratio and resolution of the display device, the display unit of the display device is equipped with an imaging function. One or both of the sensing functions can be added. Therefore, one aspect of the present invention In a display device, a sub-pixel having a light-receiving element is provided in addition to the sub-pixel having a light-emitting element. Compared to conventional methods, this method allows for a higher aperture ratio of pixels and facilitates high-resolution imaging.

[0107] A display device according to one aspect of the present invention has a display unit in which light-emitting and light-receiving elements and light-emitting elements are arranged in a matrix. The display unit is equipped with an image sensor, and can display images on it. It can be used as a touch sensor. A display device according to one aspect of the present invention uses a light-emitting element as a sensor. It can be used as a light source. Therefore, a light receiving unit and light source are provided separately from the display device. It can be omitted, reducing the number of components in electronic devices.

[0108] In one aspect of the present invention, a display device has a light-emitting element in the display unit, and the light emitted by that element is reflected by the object ( When light is scattered, the light-emitting element can detect the reflected (or scattered) light, so in dark places... In addition, imaging and detection of touch operations (contact or proximity) are possible.

[0109] The light-emitting and receiving device can be fabricated by combining an organic EL element and an organic photodiode. For example, adding an active layer of an organic photodiode to the stacked structure of an organic EL element. This allows for the fabrication of light-emitting and receiving devices. Furthermore, organic EL elements and organic photodiodes can be used. The light-emitting and receiving elements fabricated by combining these elements can have layers that share a common configuration with organic EL elements, all in one piece. By applying a film, the number of film formation steps can be suppressed.

[0110] For example, one of the pair of electrodes (the common electrode) is made into a layer common to both the light-emitting and light-receiving elements. This can be done. Also, for example, a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. It is preferable that at least one of these be a common layer for the light-receiving and light-emitting elements. For example, the light-receiving element and the light-emitting element can have the same configuration except for the presence or absence of an active layer in the light-receiving element. It is also possible to create a light-emitting / receiving device simply by adding the active layer of a light-receiving element to the light-emitting element. It is also possible to do this. In this way, by having the light-emitting and light-receiving elements and the light-emitting element have a common layer, This reduces the number of film layers and masks, thereby reducing the manufacturing process and cost of the display device. It is possible to use existing manufacturing equipment and methods for display devices to create light-emitting and receiving devices. A display device can be manufactured.

[0111] Furthermore, the layer of the light-receiving element is used when the light-receiving element functions as a light-receiving element and when it emits light. When it functions as a child, its function may differ. In this specification, when the light-receiving element is Components are named based on their function when they function as light-emitting elements. For example, holes. The injection layer functions as a hole injection layer when the light-emitting device functions as a light-emitting device, and When an optical element functions as a photodetector, it also functions as a hole transport layer. Similarly, electron injection The layer functions as an electron injection layer when the light-emitting element is functioning as a light-emitting element, and the light-emitting element When the child functions as a light-receiving element, it functions as an electron transport layer. Also, the light-receiving element has The layer is determined by whether the light-receiving element functions as a light-receiving element or as a light-emitting element. And, in some cases, their functions are identical. The hole transport layer is used in both the light-emitting element and the light-receiving element. Even when functioning as such, it functions as a hole transport layer, and the electron transport layer functions as a light-emitting element and an electron transport layer. Regardless of whether it functions as an optical element, it functions as an electron transport layer.

[0112] The display device of this embodiment has a function of displaying an image using a light-emitting element and a light-receiving element. In other words, the light-emitting element and the light-receiving element function as display elements.

[0113] The display device of this embodiment has the function of detecting light using a light-emitting / receiving element. The child can detect light with a shorter wavelength than the light emitted by the light-emitting element itself.

[0114] When an image sensor is used with an image sensor, the display device of this embodiment uses an image sensor And it can capture images. For example, the display device of this embodiment is a scanner It can be used.

[0115] Furthermore, when the light-emitting element is used as a touch sensor, the display device of this embodiment is a light-emitting element. This can be used to detect the proximity or contact of an object.

[0116] A light-emitting element is a photoelectric conversion element that detects light incident on it and generates an electric charge. It is possible. The amount of charge generated from the light-emitting element is determined based on the amount of light incident on the light-emitting element.

[0117] The light-emitting element is fabricated by adding an active layer for a photodetector to the above-described light-emitting element configuration. It is possible.

[0118] For example, a pn-type or pin-type photodiode structure can be applied to the light-emitting / receiving element. It is possible.

[0119] In particular, the light-emitting element uses the active layer of an organic photodiode having a layer containing an organic compound. It is preferable that it is. Organic photodiodes are easy to make thin, light, and large in area. Furthermore, due to its high degree of freedom in shape and design, it can be applied to various display devices.

[0120] In the following section, a display device according to one aspect of the present invention will be described in more detail with reference to the drawings.

[0121] [Display device] Figures 6A to 6D and 6F show cross-sectional views of a display device according to one embodiment of the present invention.

[0122] The display device 200A shown in Figure 6A has a light-receiving element between substrate 201 and substrate 209. It has a layer 203, a functional layer 205, and a layer 207 having an light-emitting element.

[0123] The display device 200A emits red (R), green (G), and blue light from a layer 207 having light-emitting elements. This configuration emits light of color (B).

[0124] The light-receiving element included in layer 203, which has a light-receiving element, is incident from outside the display device 200A. It can detect light.

[0125] The display device 200B shown in Figure 6B has light-emitting and receiving elements between substrate 201 and substrate 209. It has a light-emitting layer 204, a functional layer 205, and a light-emitting layer 207.

[0126] The display device 200B emits green (G) light and blue (B) light from a layer 207 having light-emitting elements. Light is emitted, and red (R) light is emitted from layer 204 which has a light-receiving element. Furthermore, in a display device according to one aspect of the present invention, the light emitted by the layer 204 having a light-receiving element The color is not limited to red. Also, the color of the light emitted by the light-emitting layer 207 is green. It is not limited to combinations of blue.

[0127] The light-receiving elements included in the layer 204 having light-receiving elements are incident from outside the display device 200B. It can detect light. The light-receiving element can detect, for example, green (G) light and blue ( It is possible to detect one or both of the lights in B).

[0128] The functional layer 205 includes a circuit for driving a light-receiving element or light-emitting element, and a circuit for driving a light-emitting element. It has a circuit. Functional layer 205 includes switches, transistors, capacitors, resistors, wiring, terminals, etc. Features such as these can be provided. Furthermore, the light-emitting element and light-receiving element are driven using a passive matrix method. In such cases, a configuration without switches or transistors may be used.

[0129] A display device according to one aspect of the present invention has a function to detect an object such as a finger that is in contact with the display device. It may also have a touch panel function. For example, as shown in Figure 6C, light-emitting element In the layer 207 having a light-emitting element, the light emitted by the light-emitting element is directed to the finger 20 in contact with the display device 200A. As 2 is reflected, the light-receiving element in layer 203, which has a light-receiving element, detects the reflected light. This allows detection of contact between the finger 202 and the display device 200A. Furthermore, in the display device 200B, the light emitted by the light-emitting element in the layer 207 having the light-emitting element is The reflection of the finger that has come into contact with the display device 200B causes the layer 204 having the light-receiving and light-emitting elements to... The light-emitting element can detect its reflected light. In the following, the light-emitting element is We will explain using the example of light being reflected by an object, but light is also scattered by an object. There are also others.

[0130] A display device according to one aspect of the present invention, as shown in Figure 6D, is located close to (in contact with) the display device. It may have a function to detect or image objects (that are not present).

[0131] A display device according to one aspect of the present invention may have a function for detecting the fingerprint of finger 202. Figure 6 Figure 6E shows an image diagram of an image captured by a display device according to one embodiment of the present invention. Within range 263, the contour of finger 202 is shown with a dashed line, and the contour of contact area 261 is shown with a dashed line. Within the contact portion 261, the difference in the amount of light incident on the light-receiving element (or light-receiving element) This allows for the capture of high-contrast images of 262 fingerprints.

[0132] A display device according to one aspect of the present invention can also function as a pen tablet. (Figure 6F) With the tip of the stylus 208 in contact with the substrate 209, slide it in the direction of the dashed arrow. This shows the state of being.

[0133] As shown in Figure 6F, scattering occurs at the contact surface between the tip of the stylus 208 and the substrate 209. Light is incident on a light-receiving element (or light-emitting element) located in the area that overlaps with the contact surface. This allows for high-precision detection of the tip position of the stylus 208.

[0134] Figure 6G shows an example of the trajectory 266 of a stylus 208 detected by a display device according to one aspect of the present invention. The present invention provides a display device that accurately detects objects such as a stylus 208 with high positional accuracy. Because it is possible to detect the position of objects, it is possible to perform high-resolution drawing in drawing applications, etc. It is also possible to use capacitive touch sensors or electromagnetic induction type styluses. Unlike in other cases, position detection is possible even for highly insulating objects, so style The material of the tip of the Lath 208 is not restricted, and it can be used with various writing instruments (e.g., brushes, glass pens, quill pens). etc.) can also be used.

[0135] [Pixel] The display device according to one aspect of the present invention has a plurality of pixels arranged in a matrix. One pixel has a plurality of sub-pixels. One sub-pixel has one light-emitting element, one light-emitting and receiving element, or one light-receiving element.

[0136] Each of the plurality of pixels has one or more of a sub-pixel having a light-emitting element, a sub-pixel having a light-receiving element, and a sub-pixel having a light-emitting and receiving element.

[0137] For example, a pixel has a plurality (e.g., three or four) of sub-pixels having a light-emitting element and one sub-pixel having a light-receiving element.

[0138] Note that the light-receiving element may be provided in all pixels, or may be provided in some pixels. Also, one pixel may have a plurality of light-receiving elements. Further, one light-receiving element may be provided across a plurality of pixels. The fineness of the light-receiving element and the fineness of the light-emitting element may be different from each other.

[0139] When a pixel has three sub-pixels having a light-emitting element, examples of the three sub-pixels include sub-pixels of three colors, R, G, B, and sub-pixels of three colors, yellow (Y), cyan (C), and magenta (M). When a pixel has four sub-pixels having a light-emitting element, examples of the four sub-pixels include sub-pixels of four colors, R, G, B, white (W), and sub-pixels of four colors, R, G, B, Y.

[0140] In FIGS. 6H, 6J, 6K, and 6L, there are a plurality of sub-pixels having a light-emitting element and a ​​​​​​​​​An example of a pixel having one subpixel is shown. The subpixel arrangement shown in this embodiment is shown in Figure The order is not limited to the one shown. For example, the positions of sub-pixel (B) and sub-pixel (G) can be reversed. No.

[0141] The pixels shown in Figures 6H, 6J, and 6K are all sub-pixels (PDs) with light-receiving capabilities, and red pixels. A subpixel that emits colored light (R), a subpixel that emits green light (G), and a subpixel that emits blue light It has a sub-pixel (B).

[0142] The pixels shown in Figure 6H have a matrix array applied, and the pixels shown in Figure 6J have a stock A ripe array is applied. Also, Figure 6K shows a row of subpixels (R) that emit red light. A sub-pixel (G) that emits green light and a sub-pixel (B) that emits blue light are arranged. This is an example where a sub-pixel (PD) with light-receiving function is placed below it. In other words, Figure 6K In this arrangement, subpixel (R), subpixel (G), and subpixel (B) are arranged in the same row as each other. It is placed in a different row from the pixels (PD).

[0143] The pixels shown in Figure 6L, in addition to the pixel configuration shown in Figure 6K, have sub-elements that emit light other than R, G, and B. It has pixels (X). Other light colors besides R, G, and B include white (W), yellow (Y), and cyan ( Examples of light include C), magenta (M), and infrared (IR). Subpixels (X) emit infrared light. In such cases, it is preferable that the subpixels (PDs) with light-receiving capabilities also have the ability to detect infrared light. Sub-pixels (PDs) with light-receiving capabilities have the ability to detect both visible light and infrared light. It may have. Depending on the application of the sensor, the wavelength of light detected by the light-receiving element may be determined. It is possible.

[0144] Alternatively, for example, a pixel has a plurality of sub-pixels each having a light-emitting element and has one sub-pixel having a light-receiving and emitting element.

[0145] A display device having a light-receiving and emitting element does not need to change the pixel arrangement in order to incorporate a light-receiving function into the pixel, and thus can add one or both of an imaging function and a sensing function to the display unit without reducing the aperture ratio and the resolution.

[0146] Note that the light-receiving and emitting elements may be provided in all pixels or may be provided in some pixels. Also, one pixel may have a plurality of light-receiving and emitting elements.

[0147] FIGS. 7A to 7D show an example of a pixel having a plurality of sub-pixels each having a light-emitting element and having one sub-pixel having a light-receiving and emitting element.

[0148] The pixel shown in FIG. 7A has a stripe arrangement, exhibits red light, and has a sub-pixel (R·PD) having a light-receiving function, a sub-pixel (G) exhibiting green light, and a sub-pixel (B) exhibiting blue light. In a display device in which a pixel is composed of three sub-pixels of R, G, and B, by replacing the light-emitting element used for the R sub-pixel with a light-receiving and emitting element, a display device having a light-receiving function can be manufactured for the pixel.

[0149] The pixel shown in FIG. 7B has a sub-pixel (R·PD) that exhibits red light and has a light-receiving function, a sub-pixel (G) that exhibits green light, and a sub-pixel (B) that exhibits blue light. The sub-pixel (R·PD) is arranged in a column different from the sub-pixels (G) and (B). The sub-pixels (G) and (B) are alternately arranged in the same column, with one provided in odd rows and the other provided in even rows. ​​​​​​​​​​​​It will be provided. Note that subpixels placed in a different column from subpixels of other colors are not limited to red (R). It is not limited to green (G) or blue (B).

[0150] The pixels shown in Figure 7C have a matrix arrangement applied, emit red light, and have a light-receiving function. Subpixels that emit green light (R·PD), subpixels that emit green light (G), subpixels that emit blue light (B ), and subpixels (X) that emit light other than R, G, and B. In a display device consisting of four subpixels, the light-emitting element used for the subpixel of R is a light-receiving element. By replacing the pixels with child pixels, it is possible to create a display device in which the pixels have a light-receiving function.

[0151] Figure 7D shows two pixels, and one pixel is formed by three subpixels enclosed by dotted lines. It is composed of the following: The pixels shown in Figure 7D are sub-pixels that emit red light and have a light-receiving function. (R·PD), a subpixel (G) that emits green light, and a subpixel (B) that emits blue light It possesses. In the left pixel shown in Figure 7D, the sub-pixel (G) is located in the same row as the sub-pixel (R·PD). Furthermore, the sub-pixel (B) is located in the same column as the sub-pixel (R·PD). As shown in Figure 7D on the right... In a pixel, the sub-pixel (G) is placed in the same row as the sub-pixel (R·PD), and the sub-pixel (G) is the same Sub-pixels (B) are placed in the column. In the pixel layout shown in Figure 7D, odd rows and even rows In all of these cases, the subpixels (R·PD), (G), and (B) are repeated They are arranged such that, within each column, odd-numbered rows and even-numbered rows have subpixels of different colors. It is placed.

[0152] Figure 7E shows four pixels to which a pentile arrangement has been applied, and two adjacent pixels It has subpixels that emit two different colors of light in different combinations. Note that the shape of the subpixels is shown in Figure 7E. The shape shows the upper surface shape of the light-emitting or light-receiving element of the subpixel. Figure 7F is This is a modified version of the pixel arrangement shown in Figure 7E.

[0153] The upper left and lower right pixels shown in Figure 7E are sub-pixels that emit red light and have light-receiving capabilities. It has a primary pixel (R·PD) and a secondary pixel (G) that emits green light. The lower left image is shown in Figure 7E. The top and upper right pixels are sub-pixels (G) that emit green light and sub-pixels (B) that emit blue light. ) has.

[0154] The upper left and lower right pixels shown in Figure 7F are sub-pixels that emit red light and have light-receiving capabilities. It has a primary pixel (R·PD) and a secondary pixel (G) that emits green light. The lower left image is shown in Figure 7F. The main and upper right pixels are sub-pixels (R·PD) that emit red light and have light-receiving capabilities, and It has a sub-pixel (B) that emits blue light.

[0155] In Figure 7E, each pixel is provided with a sub-pixel (G) that emits green light. On the other hand, in Figure 7F... Each pixel is provided with a sub-pixel (R·PD) that emits red light and has a light-receiving function. Because each pixel is equipped with a sub-pixel that has a light-receiving function, in the configuration shown in Figure 7F, Compared to the configuration shown in Figure 7E, imaging can be performed with higher resolution. This allows for, for example, This can improve the accuracy of biometric authentication.

[0156] Furthermore, the top surface shape of the light-emitting element and the light-receiving element is not particularly limited and can be a circle, ellipse, polygon, or have rounded corners. It can be a polygon, etc. Regarding the upper surface shape of the light-emitting element of the subpixel (G), see Figure Figure 7E shows an example of a circular shape, and Figure 7F shows an example of a square shape. Each color of light-emitting element. The top shapes of the light-emitting and receiving elements may be different from each other, and may be the same for some or all colors. It's okay to have it.

[0157] Furthermore, the aperture ratios of the subpixels of each color may be different from each other, and may be the same for some or all colors. This may also be the case. For example, sub-pixels provided for each pixel (sub-pixel (G) in Figure 7E, Figure 7F So, is it okay to make the aperture ratio of the sub-pixel (R·PD) smaller than that of the sub-pixels of other colors? stomach.

[0158] Figure 7G shows a modified version of the pixel arrangement shown in Figure 7F. Specifically, the configuration in Figure 7G is the same as that in Figure 7F. This is obtained by rotating the configuration by 45°. In Figure 7F, two subpixels make up one pixel. Although it was explained that this is how it is constructed, as shown in Figure 7G, one image is made up of four subpixels. It can also be seen as being composed of fundamental elements.

[0159] In Figure 7G, it is explained that one pixel is composed of four subpixels enclosed by dotted lines. This is done. One pixel consists of two subpixels (R·PD), one subpixel (G), and one sub Pixel (B) and has a sub-pixel that has a light-receiving function. This allows for imaging with high resolution. Therefore, it improves the accuracy of biometric authentication. For example, the resolution of the image can be set to the square root of 2 times the resolution of the display. ru.

[0160] The display device to which the configuration shown in Figure 7F or Figure 7G is applied has p elements (where p is an integer of 2 or more) One light-emitting element, q (where q is an integer greater than or equal to 2) second light-emitting elements, and r (where r is greater than p) It has a light-emitting and receiving element (an integer greater than q) and a r such that p and r satisfy r = 2p. Also, p, q, and r satisfy r = p + q. One of the first and second light-emitting elements is green. One emits light, and the other emits blue light. The light-receiving element emits red light and also has a light-receiving function. To possess.

[0161] For example, when using a light-emitting / light-receiving device to perform touch detection, the light emitted from the light source is visible to the user. It is preferable that it is difficult to do so. Because blue light is less visible than green light, blue light It is preferable to use an emitting light-emitting element as the light source. Therefore, the receiving light-emitting element receives blue light. It is preferable that it has a light-emitting function.

[0162] As described above, various pixel arrangements can be applied to the display device of this embodiment. .

[0163] [Device Structure] Next, a light-emitting element, a light-receiving element, and a light-receiving element that can be used in a display device according to one aspect of the present invention. The detailed configuration of the optical element will be explained.

[0164] A display device according to one aspect of the present invention emits light in the direction opposite to the substrate on which the light-emitting element is formed. A top-emission type, a bottom-emission type that emits light towards the substrate side where the light-emitting element is formed. It may be either a single-emitting type or a dual-emission type that emits light from both sides.

[0165] In this embodiment, a top-emission type display device will be used as an example for explanation.

[0166] In this specification, unless otherwise specified, multiple elements (light-emitting elements, light-emitting layers, etc.) are used. Even when describing the configuration, when describing matters common to each element, The letters will be omitted in the explanation. For example, the light-emitting layer 283R and the light-emitting layer 283G are used together. When explaining the process, it may be referred to as the light-emitting layer 283.

[0167] The display device 280A shown in Figure 8A consists of a light-receiving element 270PD and a light-emitting element that emits red (R) light. Child 270R, light-emitting element 270G that emits green (G) light, and light-emitting element 270R that emits blue (B) light It has a light-emitting element 270B.

[0168] Each light-emitting element consists of a pixel electrode 271, a hole injection layer 281, a hole transport layer 282, a light-emitting layer, and an electron transport layer. The device has a transmitting layer 284, an electron injection layer 285, and a common electrode 275 stacked in this order. The sub-element 270R has an emissive layer 283R, and the light-emitting element 270G has an emissive layer 283G, The optical element 270B has an emissive layer 283B. The emissive layer 283R emits red light. The material is present, and the light-emitting layer 283G has a light-emitting material that emits green light, and the light-emitting layer 283B has, It contains a light-emitting substance that emits blue light.

[0169] The light-emitting element is activated by applying a voltage between the pixel electrode 271 and the common electrode 275, thereby activating the common electrode This is an electroluminescent element that emits light towards the 275 side.

[0170] The photodetector 270PD consists of a pixel electrode 271, a hole injection layer 281, a hole transport layer 282, and an active layer Layers 273, electron transport layer 284, electron injection layer 285, and common electrode 275 are stacked in this order. To possess.

[0171] The light-receiving element 270PD receives light incident from outside the display device 280A and converts it into an electrical signal. It is a photoelectric conversion element that performs conversion.

[0172] In this embodiment, in both the light-emitting element and the light-receiving element, the pixel electrode 271 is the anode and It functions as such, and the common electrode 275 is described as functioning as the cathode. In other words, the photodetector The receiver is driven by applying a reverse bias between the pixel electrode 271 and the common electrode 275. By detecting light incident on an optical element, it is possible to generate an electric charge and extract it as an electric current.

[0173] In the display device of this embodiment, an organic compound is used in the active layer 273 of the light-receiving element 270PD. The light-receiving element 270PD has layers other than the active layer 273 that share the same configuration as the light-emitting element. Yes, it is possible. Therefore, the only addition required to the manufacturing process of the light-emitting element is the step of depositing the active layer 273. Therefore, the light-receiving element 270PD can be formed in parallel with the formation of the light-emitting element. The element and the photodetector 270PD can be formed on the same substrate. Therefore, the manufacturing process The 270PD light-receiving element can be incorporated into the display device without significantly increasing the size.

[0174] In the display device 280A, the active layer 273 of the light-receiving element 270PD and the light-emitting layer 283 of the light-emitting element Aside from differentiating between the two, this example shows a common configuration for the light-receiving element 270PD and the light-emitting element. However, the configuration of the light-receiving element 270PD and the light-emitting element is not limited to this. D and the light-emitting element have layers that can be differentiated from each other, in addition to the active layer 273 and the light-emitting layer 283. It is acceptable. The light-receiving element 270PD and the light-emitting element have one or more layers that are used in common (common layer). It is preferable to have the above. This allows the display device to receive without significantly increasing the manufacturing process. It can incorporate a 270PD optical element.

[0175] Of the pixel electrode 271 and the common electrode 275, the electrode that extracts light transmits visible light. A conductive film is used. In addition, a conductive film that reflects visible light is used on the electrode that does not extract light. It is preferable to do so.

[0176] The light-emitting element of the display device of this embodiment has a micro-cavity structure It is preferable that the construction is applied. Therefore, one of the pair of electrodes of the light-emitting element is , having electrodes that transmit and reflect visible light (semitransmissive / semireflective electrodes) Preferably, the other preferably has an electrode that is reflective to visible light (reflective electrode). It is difficult. The light-emitting element has a microcavity structure, which allows the light emitted from the light-emitting layer to be used in both ways. By causing resonance between the electrodes, the light emitted from the light-emitting element can be intensified.

[0177] Furthermore, semi-transmissive / semi-reflective electrodes are electrodes that transmit visible light (transparent electrodes) and reflective electrodes. It can be made into a laminated structure (also known as).

[0178] The light transmittance of the transparent electrode shall be 40% or more. For example, the light-emitting element shall emit visible light (wavelength 40 It is preferable to use electrodes with a transmittance of 40% or more for light (between 0 nm and less than 750 nm). The reflectance of the semi-transparent / semi-reflective electrode for visible light is 10% to 95%, preferably 30%. The above shall be 80% or less. The visible light reflectance of the reflective electrode shall preferably be between 40% and 100%. The resistivity shall be between 70% and 100%. Furthermore, the resistivity of these electrodes shall be 1 × 10⁻⁶. -2 Ωc m or less is preferred. Note that the light-emitting element emits near-infrared light (wavelength 750 nm to 1300 nm or less). When emitting light, the transmittance or reflectance of near-infrared light from these electrodes is equal to the transmittance of visible light. Alternatively, similar to reflectance, it is preferable that the above numerical range is satisfied.

[0179] The light-emitting element has at least a light-emitting layer 283. The light-emitting element has layers other than the light-emitting layer 283. , materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential Substances, substances with high electron injection properties, or bipolar substances (with electron transport and hole transport properties) It may further have a layer containing a high-quality substance, etc.

[0180] For example, a light-emitting element and a light-receiving element include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. One or more layers can have a common configuration. Also, the light-emitting element and the light-receiving element are positive One or more of the following layers are created: a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. It is possible.

[0181] The hole injection layer is a layer that injects holes from the anode into the hole transport layer, and materials with high hole injection capabilities are used. It is a layer containing. Materials with high hole injection properties include aromatic amine compounds and hole transport materials. A composite material containing an acceptor material (electron-accepting material) can be used.

[0182] In a light-emitting device, the hole transport layer emits light by converting holes injected from the anode by the hole injection layer. It is a layer that transports light to another layer. In a photodetector, the hole transport layer transports light that is incident on the active layer to the active layer. This layer transports the resulting holes to the anode. The hole transport layer is a layer containing a hole-transporting material. Therefore, as a hole transport material, 10 -6 cm 2 Substances having a hole mobility of / Vs or greater This is preferable. However, other materials may also be used if they have higher hole transport capabilities than electron transport. It is possible. As a hole transport material, π-electron-rich heteroaromatic compounds (e.g., ka (e.g., ruvacole derivatives, thiophene derivatives, furan derivatives) and aromatic amines (aromatic amines) Materials with high hole transport properties, such as compounds having a rib skeleton, are preferred.

[0183] In a light-emitting device, the electron transport layer emits light by receiving electrons injected from the cathode through the electron injection layer. It is a layer that transports light to another layer. In a photodetector, the electron transport layer transports light that has been incident on the active layer. This layer transports electrons generated based on the electrons to the cathode. The electron transport layer is a layer containing an electron transport material. Therefore, as an electron transport material, 1 × 10 -6 cm 2 Having an electron mobility of / Vs or greater A material is preferred. However, any material that has higher electron transport capabilities than holes is also acceptable. It can also be used. As electron transport materials, metal complexes having a quinoline skeleton, ben Metal complexes having a zoquinoline skeleton, metal complexes having an oxazole skeleton, thiazole skeleton In addition to metal complexes having the following properties, oxadiazole derivatives, triazole derivatives, imidazole Derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives Ligand-containing quinoline derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzox Noxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other nitrogen-containing derivatives Materials with high electron transport capabilities, such as π-electron-deficient heteroaromatic compounds containing elementary heteroaromatic compounds, are used. It is possible to be there.

[0184] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer, and is made of a material with high electron injection properties. It is a layer containing electrons. Materials with high electron injection include alkali metals, alkaline earth metals, and These compounds can be used. Materials with high electron injection properties include electron transport materials. Composite materials containing both a material and a donor material (electron-donating material) can also be used.

[0185] The light-emitting layer 283 is a layer containing light-emitting material. The light-emitting layer 283 contains one or more types of light-emitting materials. It can possess qualities. Examples of luminescent materials include blue, purple, bluish-purple, green, yellowish-green, and yellow. Substances that emit light in colors such as orange and red are used as appropriate. In addition, near-infrared light is used as the light-emitting material. It is also possible to use substances that emit a certain emission.

[0186] Examples of luminescent materials include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials. ru.

[0187] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, and triphenylene derivatives. fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran Derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidi Examples include phenanthrene derivatives, naphthalene derivatives, and naphthalene derivatives.

[0188] Examples of phosphorescent materials include 4H-triazole skeletons, 1H-triazole skeletons, and imida. Organometallic complexes having a zole skeleton, pyrimidine skeleton, pyrazine skeleton, or pyridine skeleton. (Especially iridium complexes), ligands of phenylpyridine derivatives having electron-withdrawing groups Examples include metallochemical complexes (especially iridium complexes), platinum complexes, and rare earth metal complexes.

[0189] The light-emitting layer 283 contains one or more organic compounds (H) in addition to the light-emitting substance (guest material). It may contain (strengthening material, assisting material, etc.) as one or more types of organic compounds. This can utilize either or both hole-transporting materials and electron-transporting materials. Using one or more types of organic compounds, bipolar materials or TADF materials That's good too.

[0190] The light-emitting layer 283 is, for example, a combination of a phosphorescent material and a hole channel that readily forms an excitation complex. It is preferable to have a material that allows for electron transport and an electron transport material. Furthermore, the energy transfer from the excited complex to the light-emitting material (phosphorescent material) is called ExTET(Exc Efficiently generate light using iplex-triplet energy transfer. It can be obtained by emitting light that overlaps with the wavelength of the lowest energy absorption band of the luminescent material. By selecting combinations that form excited complexes exhibiting smooth energy transfer, This configuration allows for efficient emission of light. Voltage drive and long lifespan can be achieved simultaneously.

[0191] As for combinations of materials that form excited complexes, the HOMO level (highest level) of the hole transport material is... It is preferable that the occupied orbital level is greater than or equal to the HOMO level of the electron-transporting material. The LUMO level (lowest unoccupied orbital level) of the material is greater than or equal to the LUMO level of the electron-transporting material. This is preferable. The LUMO and HOMO levels of the material are determined by cyclic voltammetry (C V) Derived from the electrochemical properties (reduction potential and oxidation potential) of the material measured by the measurement. It is possible.

[0192] The formation of excited complexes is observed, for example, in the emission spectra of hole transport materials and electron transport materials. The emission spectra of the individual material and the mixed film made by mixing these materials were compared, and the emission spectrum of the mixed film was determined. The culprit shifts to a longer wavelength than the emission spectrum of each material (or a new peak is added on the longer wavelength side). This can be confirmed by observing phenomena (with a hole). Alternatively, hole transport materials Transient photoluminescence (PL) of materials, transient PL of electron transport materials, and mixing of these materials The transient PL of the combined mixed film was compared, and the transient PL lifetime of the mixed film was found to be longer than the transient PL lifetime of each individual material. We observed differences in transient responses, such as the presence of long-lived components or a larger proportion of delayed components. This can be confirmed by doing so. Also, the transient PL mentioned above is transient electroluminescent It can also be read as EL. That is, transient EL of hole transport materials, electron The transient EL of transportable materials and the transient EL of mixed films thereof were compared to determine the difference in transient response. The formation of excited complexes can also be confirmed by observing the reaction.

[0193] The active layer 273 contains a semiconductor. This semiconductor may be an inorganic semiconductor such as silicon, and Examples include organic semiconductors containing organic compounds. In this embodiment, the active layer 273 has An example of using an organic semiconductor as the semiconductor is shown. By using an organic semiconductor, the light-emitting layer 283 The active layer 273 and the manufacturing equipment can be formed in the same way (for example, by vacuum deposition). This is preferable because it allows for the standardization of placement.

[0194] The n-type semiconductor material of the active layer 273 is fullerene (for example, C 60 , C 70 etc. Examples include electron-accepting organic semiconductor materials such as fullerene derivatives. Fullerenes are... It has a ball-like shape, and this shape is energetically stable. Fullerenes are Both the HOMO and LUMO levels are deep (low). Fullerenes have a deep LUMO level. Because of its depth, it has extremely high electron-accepting properties. Usually, like benzene, it is planar. When π-electron conjugation (resonance) spreads, electron-donating ability (donor ability) increases, but fullerenes Despite the large spread of π electrons due to its spherical shape, its electron-accepting property is high. A high electron-accepting property is beneficial for a light-receiving element because it causes charge separation efficiently at high speed. C 60 and C 70 both have a broad absorption band in the visible light region. In particular, C 70 is preferable because it has a larger π-electron conjugation system and a broader absorption band in the long wavelength region compared to C 60 .

[0195] In addition, as materials for the n-type semiconductor, metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, quinone derivatives, etc. can be mentioned.

[0196] As materials for the p-type semiconductor included in the active layer 273, electron-donating organic semiconductor materials such as copper(II) phthalocyanine (Copper(II) phthalocyanine; CuPc), tetraphenyldibenzoperiflanthene (Tetraphenyldibenzoperiflanthene; DBP), zinc phthalocyanine (Zinc Phthalocyanine; ZnPc), tin phthalocyanine (SnPc), quinacridone, etc. can be mentioned.

[0197] Furthermore, p-type semiconductor materials include carbazole derivatives, thiophene derivatives, and furan derivatives. Examples include compounds having an aromatic amine skeleton. Furthermore, as a material for p-type semiconductors... These include naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, and f Luorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, y Dole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazol Calcium derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, quinine Cridone derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyful Examples include olene derivatives, polyvinylcarbazole derivatives, and polythiophene derivatives.

[0198] The HOMO level of electron-donating organic semiconductor materials is the same as the HOMO level of electron-accepting organic semiconductor materials. It is preferable that the level be shallower (higher). The LUMO level of electron-donating organic semiconductor materials is It is preferable that the LUMO level is shallower (higher) than that of the electron-accepting organic semiconductor material.

[0199] As an electron-accepting organic semiconductor material, spherical fullerenes are used, and electron-donating organic semiconductors are used. It is preferable to use organic semiconductor materials with a shape close to that of a plane as the material. Similar shaped molecules Like molecules tend to gather together, and when molecules of the same type aggregate, the energy levels of their molecular orbitals change. Because of its proximity, it can improve carrier transportability.

[0200] For example, the active layer 273 is preferably formed by co-depositing an n-type semiconductor and a p-type semiconductor. .

[0201] Both low-molecular-weight compounds and high-molecular-weight compounds can be used for the light-emitting and light-receiving elements. It may also contain inorganic compounds. The layers constituting the light-emitting element and the light-receiving element are, Formed by methods such as vapor deposition (including vacuum deposition), transfer, printing, inkjet, and coating. It is possible.

[0202] The display device 280B shown in Figure 8B has the same configuration for both the light-receiving element 270PD and the light-emitting element 270R. In this respect, it differs from the display device 280A.

[0203] The light-receiving element 270PD and the light-emitting element 270R share an active layer 273 and a light-emitting layer 283R. do.

[0204] Here, the light-receiving element 270PD is common to the light-emitting element that emits light with a longer wavelength than the light to be detected. It is preferable to have the following configuration. For example, the photodetector 270PD configured to detect blue light is The same configuration can be used for one or both of the light-emitting elements 270R and 270G. For example, the photodetector 270PD, which is configured to detect green light, is the same as the light-emitting element 270R. It can be configured in various ways.

[0205] By making the light-receiving element 270PD and the light-emitting element 270R have a common configuration, the light-receiving element 27 Compared to a configuration in which the 0PD and the light-emitting element 270R have layers that are created separately from each other, the film deposition process The number of and masks can be reduced. Therefore, the manufacturing process and manufacturing of the display device It can reduce costs.

[0206] Furthermore, by making the light-receiving element 270PD and the light-emitting element 270R have a common configuration, Compared to a configuration in which the sub-unit 270PD and the light-emitting element 270R have layers that mutually create different layers, The margin for misalignment can be narrowed. This allows for an increase in the aperture ratio of the pixels. This can improve the light extraction efficiency of the display device, thereby extending the lifespan of the light-emitting element. It is possible. In addition, the display device can display high brightness. High-resolution image processing is also possible.

[0207] The light-emitting layer 283R has a light-emitting material that emits red light. The active layer 273 has a shorter duration than red light. The organic compound absorbs light of a specific wavelength (for example, green light and blue light, or one or both). The active layer 273 is less likely to absorb red light and absorbs light with wavelengths shorter than red light. It is preferable that the organic compound is present. This allows the light-emitting element 270R to emit red light. Efficiently extracted, the photodetector 270PD detects light with wavelengths shorter than red with high precision. It is possible.

[0208] Furthermore, in the display device 280B, the light-emitting element 270R and the light-receiving element 270PD have the same configuration. To illustrate with an example, the light-emitting element 270R and the light-receiving element 270PD each receive light of different thicknesses. It may be acceptable to have a coordinating layer for academic affairs.

[0209] The display device 280C shown in Figures 9A and 9B emits red (R) light and has a light receiving function. A light-emitting element 270R·PD that emits green (G) light, and a light-emitting element 270G that emits blue light, It has a light-emitting element 270B that emits light (B).

[0210] Each light-emitting element consists of a pixel electrode 271, a hole injection layer 281, a hole transport layer 282, a light-emitting layer, and an electron transport layer. The device has a transmitting layer 284, an electron injection layer 285, and a common electrode 275 stacked in this order. The sub-element 270G has a light-emitting layer 283G, and the light-emitting element 270B has a light-emitting layer 283B. The light-emitting layer 283G has a light-emitting material that emits green light, and the light-emitting layer 283B emits blue light. It has a light-emitting substance.

[0211] The light-emitting element 270R·PD consists of a pixel electrode 271, a hole injection layer 281, and a hole transport layer 282. Active layer 273, light-emitting layer 283R, electron transport layer 284, electron injection layer 285, and common electrode 2 It has 75 stacked in this order.

[0212] Furthermore, the light-emitting / receiving element 270R·PD of the display device 280C is the same as that of the display device 280B. The light-emitting element 270R and the light-receiving element 270PD have the same configuration. Also, the display device 280 Regarding the light-emitting elements 270G and 270B that C possesses, as well as the light-emitting elements that the display device 280B possesses It has the same configuration as the 270G and 270B.

[0213] Figure 9A shows the case where the light-emitting element 270R·PD functions as a light-emitting element. The light-emitting element 270B emits blue light, the light-emitting element 270G emits green light, and the light-receiving element This shows an example where the 270R·PD emits red light.

[0214] Figure 9B shows the case where the light-receiving element 270R·PD functions as a light-receiving element. This involves the blue light emitted by the light-emitting element 270B and the green light emitted by the light-emitting element 270G, This shows an example of detection by the light-emitting / receiving element 270R·PD.

[0215] The light-emitting element 270B, the light-emitting element 270G, and the receiving light-emitting element 270R·PD are each, It has a primary electrode 271 and a common electrode 275. In this embodiment, the pixel electrode 271 is the anode and We will explain this using the example of a case where the common electrode 275 functions as the cathode.

[0216] In this embodiment, similar to the light-emitting element, the light-receiving element 270R·PD also has a pixel electrode. This explanation assumes that electrode 271 functions as the anode and the common electrode 275 functions as the cathode. In other words, the light-emitting element 270R·PD has a reverse beam between the pixel electrode 271 and the common electrode 275. By applying an axle and driving it, the light incident on the light-emitting element 270R·PD is detected, and the charge is... It can be generated and extracted as electric current.

[0217] Furthermore, the light-emitting element 270R·PD shown in Figures 9A and 9B has an active layer 273 on the light-emitting element. It can be said that this is an added configuration. In other words, the active layer 273 is deposited in the manufacturing process of the light-emitting element. By simply adding a step, the light-emitting element 270R·PD is formed in parallel with the formation of the light-emitting element. This is possible. Furthermore, the light-emitting element and the light-receiving element can be formed on the same substrate. Therefore, without significantly increasing the manufacturing process, the display unit can be equipped with imaging and sensing functions. One or both of these may be granted.

[0218] The stacking order of the light-emitting layer 283R and the active layer 273 is not limited. In Figures 9A and 9B, An active layer 273 is provided on the hole transport layer 282, and a light-emitting layer 283R is provided on the active layer 273. An example is shown. An emissive layer 283R is provided on the hole transport layer 282, and the emissive layer 283R An active layer 273 may be provided on top.

[0219] As shown in Figures 9A and 9B, the active layer 273 and the light-emitting layer 283R are in contact with each other. That's good. Alternatively, a buffer layer may be sandwiched between the active layer 273 and the light-emitting layer 283R. Buffer layers include hole injection layers, hole transport layers, electron transport layers, electron injection layers, and hole blocks. At least one of the layers, such as the layer and the electronic block layer, can be used.

[0220] By providing a buffer layer between the active layer 273 and the light-emitting layer 283R, from the light-emitting layer 283R The transfer of excitation energy to the active layer 273 can be suppressed. Furthermore, by using a buffer layer Furthermore, the optical path length (cavity length) of the microcavity structure can also be adjusted. Therefore, from a light-emitting / receiving element having a buffer layer between the active layer 273 and the light-emitting layer 283R, high This allows for improved luminescence efficiency.

[0221] Furthermore, the light-emitting and receiving element includes a hole injection layer 281, a hole transport layer 282, an electron transport layer 284, and an electron At least one of the sub-injection layers 285 may not be present. Also, the light-emitting element is positive It may also have other functional layers, such as a hole-blocking layer or an electron-blocking layer.

[0222] Furthermore, the light-emitting element does not have an active layer 273 and a light-emitting layer 283R, and the light-emitting layer and active layer are combined. It may have a layer that serves as both the light-emitting layer and the active layer. For example, the active layer 273 may have An n-type semiconductor that can be used, and a p-type semiconductor that can be used in the active layer 273, A layer containing three materials, including a light-emitting substance that can be used in the light layer 283R, can be used. Cut.

[0223] Furthermore, the absorption spectrum of a mixed material of n-type and p-type semiconductors shows the absorption at the lowest energy side. The banding and the maximum peak of the emission spectrum (PL spectrum) of the luminescent material do not overlap. It is preferable that they are not present, and even more preferable that they are sufficiently far apart.

[0224] In a light-receiving device, a conductive film that transmits visible light is used on the electrode that extracts light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light.

[0225] The functions and materials of each layer constituting the light-emitting and light-receiving elements are as follows: Since it is the same as the Noh and materials, a detailed explanation will be omitted.

[0226] The following describes the detailed configuration of a display device according to one embodiment of the present invention using Figures 10 and 11. I will reveal it.

[0227] [Display device 100A] Figure 10A shows a cross-sectional view of the display device 100A.

[0228] The display device 100A has a light-receiving element 110 and a light-emitting element 190.

[0229] The light-emitting element 190 consists of a pixel electrode 191, a buffer layer 192, a light-emitting layer 193, and a buffer layer 19 4, and the common electrode 115 are stacked in this order. The buffer layer 192 is a hole injection layer and It may have one or both of the hole transport layers. The light-emitting layer 193 contains an organic compound. The buffer layer 194 may have one or both of the electron injection layer and the electron transport layer. Yes, it is possible. The light-emitting element 190 has the function of emitting visible light. The display device 100A is Furthermore, it may have a light-emitting element that has the function of emitting infrared light.

[0230] The light-receiving element 110 consists of a pixel electrode 191, a buffer layer 182, an active layer 183, and a buffer layer 18 4, and the common electrode 115 are stacked in this order. The buffer layer 182 is a hole transport layer It can have. The active layer 183 has an organic compound. The buffer layer 184 has electrons It may have a transport layer. The light-receiving element 110 has the function of detecting visible light. The light-receiving element 110 may also have a function for detecting infrared light.

[0231] In this embodiment, both the light-emitting element 190 and the light-receiving element 110 have a pixel electrode 1 This explanation assumes that 91 functions as the anode and the common electrode 115 functions as the cathode. Furthermore, the light-receiving element 110 is subjected to a reverse bias between the pixel electrode 191 and the common electrode 115. By being driven, the display device 100A detects the light incident on the light receiving element 110 and generates an electric charge. It can be generated and extracted as electric current.

[0232] Pixel electrode 191, buffer layer 182, buffer layer 192, active layer 183, light-emitting layer 193, The buffer layer 184, buffer layer 194, and common electrode 115 each have a single-layer structure. It can be either a simple or a layered structure.

[0233] Each pixel electrode 191 is located on the insulating layer 214. It can be formed in a single step. The end of the pixel electrode 191 is covered by the partition wall 216. The two adjacent pixel electrodes 191 are electrically insulated from each other by a partition wall 216. They are (or are electrically isolated).

[0234] An organic insulating film is preferred as the partition wall 216. For example, acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimide Mido resins, siloxane resins, benzocyclobutene resins, phenolic resins, and these resins Examples include lipid precursors. The septum 216 is a layer that transmits visible light. Alternatively, a partition that blocks visible light may be provided.

[0235] The common electrode 115 is a layer used in common by the light-receiving element 110 and the light-emitting element 190.

[0236] The materials and film thickness of the pair of electrodes of the light-receiving element 110 and the light-emitting element 190 shall be the same. This allows for a reduction in the manufacturing cost of the display device and a simplification of the manufacturing process.

[0237] The display device 100A has a light-receiving element 110 between a pair of substrates (substrate 151 and substrate 152). It includes a light-emitting element 190, a transistor 131, and a transistor 132, etc.

[0238] In the light-receiving element 110, the bars located between the pixel electrode 191 and the common electrode 115 are The buffer layer 182, the active layer 183, and the buffer layer 184 are organic layers (layers containing organic compounds). It can also be said that the pixel electrode 191 preferably has the function of reflecting visible light. The common electrode 115 has the function of transmitting visible light. The light-receiving element 110 detects infrared light. In this configuration, the common electrode 115 has the function of transmitting infrared light. Furthermore, pixels Electrode 191 preferably has the function of reflecting infrared light.

[0239] The light-receiving element 110 has the function of detecting light. Specifically, the light-receiving element 110 is a display device A photoelectric conversion element that receives light 122 incident from outside the device 100A and converts it into an electrical signal. Therefore, light 122 can also be described as light reflected by the object from the light-emitting element 190. Furthermore, the light 122 is transmitted to the light-receiving element 110 via a lens or the like provided in the display device 100A. It may be injected.

[0240] In the light-emitting element 190, the bars located between the pixel electrode 191 and the common electrode 115 are The buffer layer 192, the light-emitting layer 193, and the buffer layer 194 can be collectively referred to as the EL layer. Yes, it is possible. The EL layer has at least an emissive layer 193. As mentioned above, the pixel electrode 19 It is preferable that 1 has the function of reflecting visible light. Also, the common electrode 115 transmits visible light. It has the function of passing through. Furthermore, the display device 100A has a configuration that includes an infrared light-emitting element. In this case, the common electrode 115 has the function of transmitting infrared light. Furthermore, the pixel electrode 191 It is preferable that it has the function of reflecting infrared light.

[0241] The light-emitting element of the display device of this embodiment has a micro-cavity structure It is preferable that the construction method is applied.

[0242] Buffer layer 192 or buffer layer 194 may also function as an optical adjustment layer. i. By varying the film thickness of buffer layer 192 or buffer layer 194, each light-emitting element can be controlled. By doing so, it is possible to intensify and extract light of a specific color.

[0243] The light-emitting element 190 has the function of emitting visible light. Specifically, the light-emitting element 190 is a pixel By applying a voltage between electrode 191 and common electrode 115, light is emitted towards substrate 152. It is an electroluminescent element (see Light Emission 121).

[0244] The pixel electrode 191 of the light-receiving element 110 is connected to the insulating layer 214 through an opening. It is electrically connected to the source or drain of the transistor 131.

[0245] The pixel electrode 191 of the light-emitting element 190 is connected through an opening in the insulating layer 214. It is electrically connected to the source or drain of the transistor 132.

[0246] Transistors 131 and 132 are on the same layer (substrate 151 in Figure 10A). It is in contact with it.

[0247] At least a portion of the circuit electrically connected to the light-receiving element 110 is electrically connected to the light-emitting element 190. It is preferable that the circuit connected to it be formed using the same material and the same process. Compared to forming the two circuits separately, the thickness of the display device can be reduced, Furthermore, the manufacturing process can be simplified.

[0248] The light-receiving element 110 and the light-emitting element 190 are preferably covered with a protective layer 116. In Figure 10A, the protective layer 116 is provided in contact with the common electrode 115. By providing the protective layer 116, impurities such as water can enter the light-receiving element 110 and the light-emitting element 190. This suppresses congestion and improves the reliability of the light-receiving element 110 and the light-emitting element 190. Furthermore, the protective layer 116 and the substrate 152 are bonded together by the adhesive layer 142.

[0249] A light-shielding layer 158 is provided on the surface of substrate 152 that faces substrate 151. The light-shielding layer 158 is The element has openings in positions that overlap with the light-emitting element 190 and in positions that overlap with the light-receiving element 110.

[0250] Here, the light-receiving element 110 detects the light emitted by the light-emitting element 190 that has been reflected by the object. However, the light emitted from the light-emitting element 190 is reflected within the display device 100A and does not pass through the object. However, in some cases, stray light may be incident on the light-receiving element 110. The light-shielding layer 158 blocks such stray light. The effects can be suppressed. For example, if the light-shielding layer 158 is not provided, The light 123 emitted by 190 is reflected by the substrate 152, and the reflected light 124 enters the light-receiving element 110. Light may be emitted. By providing the light-shielding layer 158, reflected light 124 is incident on the light-receiving element 110. This can suppress the following. This reduces noise and improves the performance of the sensor using the light-receiving element 110. It can increase sensitivity.

[0251] As the light-shielding layer 158, a material that blocks light emission from the light-emitting element can be used. 58 preferably absorbs visible light. The light-shielding layer 158 can be, for example, a metal material, This involves using resin materials containing pigments (such as carbon black) or dyes to create a black matrix. It is possible to form a rix. The light-shielding layer 158 is a red color filter, green color The structure may also consist of a layered structure of a filter and a blue color filter.

[0252] [Display device 100B] Figures 10B and 10C show cross-sectional views of the display device 100B. Further explanation of the display device follows. In this case, explanations of configurations similar to those described earlier for the display device may be omitted.

[0253] The display device 100B includes a light-emitting element 190B, a light-emitting element 190G, and a light-receiving element 190R. It has PD.

[0254] The light-emitting element 190B consists of a pixel electrode 191, a buffer layer 192B, a light-emitting layer 193B, and a buffer. The element has layers 194B and a common electrode 115 stacked in this order. The light-emitting element 190B is blue. It has the function of emitting light 121B.

[0255] The light-emitting element 190G consists of a pixel electrode 191, a buffer layer 192G, a light-emitting layer 193G, and a buffer. The element has layers 194G and a common electrode 115 stacked in this order. The light-emitting element 190G is green It has the function of emitting light 121G.

[0256] The light-emitting element 190R·PD consists of a pixel electrode 191, a buffer layer 192R, an active layer 183, and The optical layer 193R, buffer layer 194R, and common electrode 115 are stacked in this order. The light-emitting element 190R·PD has the function of emitting red light 121R and the function of detecting light 122. It has, and

[0257] Figure 10B shows the case where the light-emitting element 190R·PD functions as a light-emitting element. Figure 10 In B, light-emitting element 190B emits blue light, and light-emitting element 190G emits green light, and This shows an example of the 190R·PD optical element emitting red light.

[0258] Figure 10C shows the case where the light-emitting element 190R·PD functions as a light-receiving element. Figure 10 In C, the blue light emitted by the light-emitting element 190B and the green light emitted by the light-emitting element 190G, This shows an example where the light-emitting / receiving element 190R·PD detects this.

[0259] The display device 100B has a light-emitting / receiving element 190 between a pair of substrates (substrate 151 and substrate 152). It includes R·PD, light-emitting element 190G, light-emitting element 190B, and transistor 132, etc.

[0260] The pixel electrode 191 is located on the insulating layer 214. Two adjacent pixel electrodes 191 are They are electrically insulated from each other by the partition wall 216. The pixel electrode 191 is in the insulating layer 214. Through the provided opening, the source or drain of transistor 132 is electrically connected. Connected.

[0261] It is preferable that the light-emitting and receiving elements and the light-emitting element are each covered with a protective layer 116. Furthermore, the protective layer 116 and the substrate 152 are bonded together by the adhesive layer 142. A light-shielding layer 158 is provided on the surface of 52 facing the substrate 151.

[0262] [Display device 100C] Figure 11A shows a cross-sectional view of the display device 100C.

[0263] The display device 100C has a light-receiving element 110 and a light-emitting element 190.

[0264] The light-emitting element 190 includes a pixel electrode 191, a common layer 112, a light-emitting layer 193, a common layer 114, and The common electrode 115 is located in this order. The common layer 112 is located between the hole injection layer and the hole transport layer. It can have both. The light-emitting layer 193 has an organic compound. The common layer 114 is The light-emitting element 190 may have one or both of the electron injection layer and the electron transport layer. It has the function of emitting visible light. Furthermore, the display device 100C also has the function of emitting infrared light. It may have a light-emitting element that has the ability to do so.

[0265] The light-receiving element 110 includes a pixel electrode 191, a common layer 112, an active layer 183, a common layer 114, and The common electrode 115 is stacked in this order. The active layer 183 contains an organic compound. The element 110 has the function of detecting visible light. Furthermore, the light-receiving element 110 also detects infrared light. It may also have a function for detecting light.

[0266] Pixel electrode 191, common layer 112, active layer 183, light-emitting layer 193, common layer 114, and common Each electrode 115 may have a single-layer structure or a multi-layer structure.

[0267] The pixel electrode 191 is located on the insulating layer 214. Two adjacent pixel electrodes 191 are They are electrically insulated from each other by the partition wall 216. The pixel electrode 191 is in the insulating layer 214. Through the provided opening, the source or drain of transistor 132 is electrically connected. Connected.

[0268] The common layer 112, common layer 114, and common electrode 115 are connected to the light-receiving element 110 and the light-emitting element 190. This is a layer commonly used in both. At least one of the layers constituting the light-receiving element 110 and the light-emitting element 190 By using a common configuration for some parts, the manufacturing process for the display device can be reduced, which is preferable.

[0269] The display device 100C has a light-receiving element 110 between a pair of substrates (substrate 151 and substrate 152). It includes a light-emitting element 190, a transistor 131, and a transistor 132, etc.

[0270] The light-receiving element 110 and the light-emitting element 190 are preferably covered with a protective layer 116. Furthermore, the protective layer 116 and the substrate 152 are bonded together by the adhesive layer 142. ru.

[0271] A resin layer 159 is provided on the surface of substrate 152 that faces substrate 151. The resin layer 159 is It is provided in a position that overlaps with the light-emitting element 190, but not in a position that overlaps with the light-receiving element 110. .

[0272] The resin layer 159 is provided in a position that overlaps with the light-emitting element 190, for example, as shown in Figure 11B. Furthermore, the configuration can be such that the aperture 159p is located at a position overlapping with the light-receiving element 110. Alternatively, the resin layer 159 may overlap with the light-emitting element 190, for example, as shown in Figure 11C. The configuration is such that the elements are provided in an island-like manner and are not provided in a position that overlaps with the light-receiving element 110. It is possible.

[0273] A light-shielding layer 158 is applied to the surface of the substrate 152 facing the substrate 151 and to the surface of the resin layer 159 facing the substrate 151. A light-shielding layer 158 is provided at a position overlapping with the light-emitting element 190, and the light-receiving element 11 It has an opening at a position that coincides with 0.

[0274] Here, the light-receiving element 110 detects the light emitted by the light-emitting element 190 that has been reflected by the object. However, the light emitted from the light-emitting element 190 is reflected within the display device 100C and does not pass through the object. In some cases, stray light may be incident on the light-receiving element 110. The light-shielding layer 158 blocks such stray light. This can absorb and reduce stray light incident on the light-receiving element 110. For example, the light-shielding layer 158 This absorbs stray light 123a that has passed through the resin layer 159 and been reflected from the substrate 151 side surface of the substrate 152. This is possible. In addition, the light-shielding layer 158 absorbs stray light 123b before it reaches the resin layer 159. This makes it possible to reduce stray light incident on the photodetector 110. Therefore, noise can be reduced and the sensitivity of the sensor using the photodetector 110 can be increased. In particular, if the light-shielding layer 158 is located close to the light-emitting element 190, stray light can be reduced even further. Therefore, it is preferable. Also, if the light-shielding layer 158 is located close to the light-emitting element 190, the display is Since it can suppress dependence on the field angle, it is also preferable from the viewpoint of improving the quality of the labeling.

[0275] Furthermore, by providing the light-shielding layer 158, the range in which the light-receiving element 110 detects light can be controlled. This is possible. If the light-shielding layer 158 is located far from the photodetector 110, the imaging range will be narrowed. This allows for an increase in image resolution.

[0276] If the resin layer 159 has an opening, the light-shielding layer 158 covers at least a portion of the opening and the surrounding area. It is preferable to cover at least a portion of the side surface of the resin layer 159 that is exposed at the opening.

[0277] When the resin layer 159 is arranged in an island shape, the light-shielding layer 158 is located on a small portion of the side surface of the resin layer 159. It is preferable to cover at least a portion of it.

[0278] Thus, the light-shielding layer 158 is provided in accordance with the shape of the resin layer 159, The distance from the light-emitting element 190 (specifically, the light-emitting region of the light-emitting element 190) is the distance from the light-shielding layer 1 Compared to the distance from 58 to the photodetector 110 (specifically, the light-receiving area of ​​the photodetector 110) It becomes shorter. This reduces sensor noise, increases imaging resolution, and improves display. The field of view dependence can be suppressed. Therefore, the display quality and imaging in the display device can be suppressed. It can enhance both quality and dignity.

[0279] The resin layer 159 is a layer that transmits the light emitted from the light-emitting element 190. These include acrylic resin, polyimide resin, epoxy resin, polyamide resin, and polyimide amide. Resins, siloxane resins, benzocyclobutene resins, phenolic resins, and these resins Examples include precursors. The structure provided between the substrate 152 and the light-shielding layer 158 is made of resin. The material is not limited to layers; inorganic insulating films may also be used. The thicker the structure, the greater the light-shielding layer. A difference arises between the distance from the light-receiving element and the distance from the light-shielding layer to the light-emitting element. (e.g., resin) Since the organic insulating film can be easily formed in a thick layer, it is suitable as the structure.

[0280] The distance from the light-shielding layer 158 to the light-receiving element 110, and the distance from the light-shielding layer 158 to the light-emitting element 190 To compare distance and, for example, from the end of the light-shielding layer 158 on the side of the light-receiving element 110 to the common electric current The shortest distance L1 to pole 115, and the common electrode 1 from the end of the light-shielding layer 158 on the light-emitting element 190 side. The shortest distance L2 up to 15 can be used. Compared to the shortest distance L1, the shortest distance L The short length of 2 suppresses stray light from the light-emitting element 190, and the sensor using the light-receiving element 110 Sensitivity can be increased. Furthermore, the display's dependence on the viewing angle can be suppressed. Shortest distance The shorter distance L1 is longer than the distance L2, which narrows the imaging range of the photodetector 110. This allows for an increase in image resolution.

[0281] Furthermore, in the adhesive layer 142, the portion overlapping with the light-emitting element 190 is greater than the portion overlapping with the light-receiving element 110. By making the overlapping parts thicker, the distance from the light-shielding layer 158 to the light-receiving element 110 is also reduced. A difference can be created between the distance from the light-shielding layer 158 to the light-emitting element 190.

[0282] In the following sections, using Figures 12 to 15, we will describe in more detail the configuration of a display device according to one embodiment of the present invention. I will explain.

[0283] [Display device 100D] Figure 12 shows a perspective view of the display device 100D, and Figure 13 shows a cross-sectional view of the display device 100D. .

[0284] The display device 100D has a configuration in which substrate 152 and substrate 151 are bonded together. Figure 12 In this example, circuit board 152 is clearly indicated by a dashed line.

[0285] The display device 100D includes a display unit 162, a circuit 164, wiring 165, etc. Figure 12 shows the table. This shows an example in which IC173 and FPC172 are mounted on device 100D. Therefore, the configuration shown in Figure 12 consists of a display device 100D, an IC (integrated circuit), and an FPC (flexible printed circuit). Flexible Printed Circuit Board It could also be called a display module.

[0286] For example, a scan line drive circuit can be used as circuit 164.

[0287] The wiring 165 has the function of supplying signals and power to the display unit 162 and the circuit 164. The signal and power are supplied externally via FPC172 or from IC173 to wiring 165. It will be entered.

[0288] Figure 12 shows the COG (Chip On Glass) method or COF (Chip On Glass) method. An example is shown in which IC173 is provided on substrate 151 using a film method, etc. 73 can be used to apply an IC having, for example, a scan line drive circuit or a signal line drive circuit. The display device 100D and the display module may be configured without an IC. The IC may be mounted on the FPC using a COF (Cross-of-Fiber) method or similar.

[0289] Figure 13 shows a portion of the region including the FPC 172 of the display device 100D shown in Figure 12, and circuit 1. A portion of the area including 64, a portion of the area including the display unit 162, and a portion of the area including the end An example of the cross-section when each is cut is shown.

[0290] The display device 100D shown in Figure 13 has a transistor 241 between substrate 151 and substrate 152. , transistor 245, transistor 246, transistor 247, light-emitting element 190B, It has a light-emitting element 190G, a light-receiving element 190R·PD, etc.

[0291] The substrate 152 and the protective layer 116 are bonded together by an adhesive layer 142. Light-emitting element 190 B. For sealing the light-emitting element 190G and the light-receiving element 190R·PD, a solid sealing structure or a hollow structure may be used. A sealing structure can be applied. In Figure 13, the substrate 152, adhesive layer 142, and insulating layer 214 The enclosed space is sealed by the adhesive layer 142, and a solid sealing structure is applied. It is.

[0292] The light-emitting element 190B consists of a pixel electrode 191, a common layer 112, and a light-emitting layer 193, from the insulating layer 214 side. It has a stacked structure in which B, a common layer 114, and a common electrode 115 are stacked in that order. Pixel electrode 1 91, through an opening in the insulating layer 214, passes through the conductive layer 2 of the transistor 247. It is connected to 22b. Transistor 247 controls the drive of the light-emitting element 190B. It has the ability. The end of the pixel electrode 191 is covered by a partition wall 216. Pixel electrode 19 Element 1 contains a material that reflects visible light, and the common electrode 115 contains a material that transmits visible light.

[0293] The light-emitting element 190G consists of a pixel electrode 191, a common layer 112, and a light-emitting layer 193, from the insulating layer 214 side. It has a stacked structure in which G, a common layer 114, and a common electrode 115 are stacked in that order. Pixel electrode 1 91, through an opening in the insulating layer 214, passes through the conductive layer 2 of the transistor 246. It is connected to 22b. Transistor 246 controls the drive of the light-emitting element 190G. To have the ability.

[0294] The light-emitting / receiving element 190R·PD consists of a pixel electrode 191, a common layer 112, and an active layer, starting from the insulating layer 214 side. A laminated structure consisting of layer 183, light-emitting layer 193R, common layer 114, and common electrode 115 stacked in that order. It has a structure. The pixel electrode 191 is connected to the transistor through an opening provided in the insulating layer 214. The conductive layer 222b of 245 is electrically connected. Transistor 245 is an oscillator. It has a function to control the driving of the optical element 190R·PD.

[0295] The light emitted by the light-emitting element 190B, light-emitting element 190G, and light-receiving element 190R·PD is transmitted to the substrate 1 It is ejected to side 52. Also, the light-receiving element 190R·PD has a substrate 152 and an adhesive layer 14 Light enters through 2. The substrate 152 and the adhesive layer 142 have transparency to visible light. It is preferable to use high-quality materials.

[0296] Pixel electrodes 19 of light-emitting element 190B, light-emitting element 190G, and light-receiving element 190R·PD 1 can be manufactured using the same materials and the same process. Common layer 112, common layer 114, The common electrode 115 is connected to the light-emitting element 190B, light-emitting element 190G, and light-receiving element 190R·P. Commonly used in D. The light-emitting element 190R·PD is a light-emitting element that emits red light. The configuration is one in which an active layer 183 is added. Also, light-emitting element 190B, light-emitting element 190G, The light-emitting element 190R·PD differs in the configuration of the active layer 183 and the light-emitting layers 193 of each color, except that they are otherwise different. All components can be made to have the same configuration. This allows for a significant increase in the manufacturing process, A light-receiving function can be added to the display unit 162 of the display device 100D.

[0297] A light-shielding layer 158 is provided on the surface of substrate 152 that faces substrate 151. The light-shielding layer 158 is The overlapping positions of each of the light-emitting element 190B, light-emitting element 190G, and light-receiving element 190R·PD It has an opening in the position. By providing a light-shielding layer 158, the light-receiving element 190R·PD can detect light. The range can be controlled. As mentioned above, the position overlaps with the light-emitting element 190R·PD. By adjusting the position of the opening in the light-shielding layer, the light incident on the light-receiving element can be controlled. It is preferable. Furthermore, by having a light-shielding layer 158, the light-emitting element 19 can be illuminated without going through an object. This can suppress direct light incidence from 0 to the light-emitting element 190R·PD. Therefore, This enables the creation of a sensor with low noise and high sensitivity.

[0298] Transistors 241, 245, 246, and 24 7 is formed on the substrate 151. These transistors are made of the same material and They can be manufactured using the same process.

[0299] On the substrate 151, there are insulating layers 211, 213, 215, and 214. They are arranged in the following order. A portion of the insulating layer 211 serves as the gate insulating layer for each transistor. It functions as follows: The insulating layer 213, a portion of which functions as the gate insulating layer for each transistor. The insulating layer 215 is provided covering the transistor. The insulating layer 214 is provided covering the transistor. It is provided as a covering and has the function of a planarization layer. Note that the number of gate insulating layers and transient The number of insulating layers covering the sta is not limited; each layer may be a single layer or two or more layers.

[0300] At least one layer of the insulating layer covering the transistor is made of a material that does not easily diffuse impurities such as water and hydrogen. It is preferable to use a material. This allows the insulating layer to function as a barrier layer. This configuration effectively prevents impurities from diffusing into the transistor from the outside. This allows for effective suppression and improves the reliability of the display device.

[0301] Insulating layers 211, 213, and 215 are each made of inorganic insulating films. It is preferable to do so. Examples of inorganic insulating films include silicon nitride films and silicon oxide nitride films. silicon oxide film, silicon nitride film, aluminum oxide film, aluminum nitride film, etc. It can also be used. In addition, hafnium oxide film, hafnium oxide nitride film, hafnium nitride nium film, yttrium oxide film, zirconium oxide film, gallium oxide film, tantalum oxide film Using magnesium oxide film, lanthanum oxide film, cerium oxide film, neodymium oxide film, etc. It is also possible to use two or more of the above-mentioned insulating films stacked together. Note that the substrate 151 and the tra A base film may be provided between the radiator and the device. The above-mentioned inorganic insulating film may also be used for this base film. It is possible.

[0302] Here, organic insulating films often have lower barrier properties compared to inorganic insulating films. Therefore, organic The insulating film preferably has an opening near the edge of the display device 100D. This allows the display to be displayed. This prevents impurities from entering through the organic insulating film from the end of the device 100D. Alternatively, the edges of the organic insulating film may be positioned inward from the edges of the display device 100D. An insulating film may be formed so that the organic insulating film is not exposed at the edges of the display device 100D.

[0303] An organic insulating film is preferred for the insulating layer 214, which functions as a planarizing layer. Materials that can be used include acrylic resin, polyimide resin, epoxy resin, and polyam resins, polyimideamide resins, siloxane resins, benzocyclobutene resins, phenol Examples include resins and precursors of these resins.

[0304] A protective layer 116 covers the light-emitting element 190B, the light-emitting element 190G, and the light-receiving element 190R·PD. By providing this, water can be used to light-emitting element 190B, light-emitting element 190G, and light-receiving element 190R·PD. This suppresses the intrusion of various impurities, including the light-emitting element 190B, the light-emitting element 190G, and the light-receiving element. This can improve the reliability of the 190R·PD.

[0305] In the region 228 shown in Figure 13, an opening is formed in the insulating layer 214. This provides insulation Even when an organic insulating film is used for layer 214, the display unit 1 can be accessed from the outside via the insulating layer 214. This prevents impurities from entering 62. Therefore, the reliability of the display device 100D is improved. It is possible to do so.

[0306] In the region 228 near the end of the display device 100D, through the opening of the insulating layer 214, It is preferable that layer 215 and protective layer 116 are in contact with each other. In particular, the insulating layer 215 has It is preferable that the inorganic insulating film and the inorganic insulating film of the protective layer 116 are in contact with each other. This further suppresses the entry of impurities into the display unit 162 from the outside via the organic insulating film. This is possible. Therefore, the reliability of the display device 100D can be improved.

[0307] The protective layer 116 may be a single layer or a multilayer structure. For example, the protective layer 116 may be organic A laminated structure of an insulating film and an inorganic insulating film may also be used. In this case, the edges of the organic insulating film are less dense than the edges of the inorganic insulating film. It is preferable to extend the edges of the insulating film outwards.

[0308] Transistors 241, 245, 246, and 24 7 is a conductive layer 221 that functions as a gate, an insulating layer 211 that functions as a gate insulating layer, Conductive layers 222a and 222b, and semiconductor layer 231, which function as source and drain. , an insulating layer 213 that functions as a gate insulating layer, and a conductive layer 22 that functions as a gate It has 3. Here, multiple layers obtained by processing the same conductive film have the same hatching pattern. It has a turn. The insulating layer 211 is located between the conductive layer 221 and the semiconductor layer 231. The insulating layer 213 is located between the conductive layer 223 and the semiconductor layer 231.

[0309] The structure of the transistors in the display device of this embodiment is not particularly limited. For example, Uses na-type transistors, staggered transistors, inverse staggered transistors, etc. It is possible to do this. Also, either top-gate or bottom-gate transistor structure Alternatively, gates may be provided above and below the semiconductor layer in which the channel is formed. That's good too.

[0310] Transistors 241, 245, 246, and 24 In configuration 7, a configuration is applied in which the semiconductor layer on which the channel is formed is sandwiched between two gates. The transistor is driven by connecting two gates and supplying them with the same signal. Alternatively, one of the two gates may be given a potential to control the threshold voltage. Alternatively, the threshold voltage of the transistor may be controlled by applying a potential for driving to the other side.

[0311] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors, Semiconductors with crystalline properties (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or those with a crystalline region in part) Any semiconductor (having a region) may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0312] The semiconductor layer of a transistor preferably contains a metal oxide (also called an oxide semiconductor). i. Alternatively, the semiconductor layer of the transistor may have silicon. This includes amorphous silicon and crystalline silicon (low-temperature polysilicon, single-crystal silicon, etc.). ) are some examples.

[0313] The semiconductor layer is, for example, made of indium and M (where M is gallium, aluminum, silicon, and chlorine). Calcium, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, gel Manium, Zirconium, Molybdenum, Lanthanum, Cerium, Neodymium, Hafnium, Ta (One or more selected from tungsten, magnesium, and zinc) It is preferable that it has the following. In particular, M is aluminum, gallium, yttrium, and s It is preferable that it be one or more types selected from the group.

[0314] In particular, the semiconductor layer contains indium (In), gallium (Ga), and zinc (Zn). It is preferable to use an oxide (also written as IGZO).

[0315] If the semiconductor layer is an In-M-Zn oxide, then the atoms of In in the In-M-Zn oxide... The numerical ratio is preferably greater than or equal to the atomic ratio of M. As for the atomic ratio of elements, In:M:Zn = 1:1:1 or close to it, In:M: Zn=1:1:1.2 or near that composition, In:M:Zn=2:1:3 or near that composition Nearby compositions: In:M:Zn=3:1:2 or compositions in the vicinity: In:M:Zn=4:2 :3 or a composition in its vicinity, In:M:Zn=4:2:4.1 or a composition in its vicinity, I n:M:Zn=5:1:3 or a similar composition, In:M:Zn=5:1:6 or something else Compositions in the vicinity of In:M:Zn=5:1:7 or in the vicinity of In:M:Zn=5 :1:8 or a composition close to it, In:M:Zn=6:1:6 or a composition close to it, I Examples include compositions such as n:M:Zn=5:2:5 or nearby compositions. This includes a range of ±30% of the desired atomic ratio.

[0316] For example, when describing the composition as having an atomic ratio of In:Ga:Zn = 4:2:3 or close to it. When the atomic ratio of In is 4, the atomic ratio of Ga is between 1 and 3, and the atomic number of Zn This includes cases where the ratio is between 2 and 4. Also, the atomic ratio is In:Ga:Zn = 5:1:6. When describing the composition in its vicinity, if the atomic ratio of In is 5, then the atomic ratio of Ga This includes cases where the value is greater than 0.1 and less than or equal to 2, and the atomic ratio of Zn is between 5 and 7. Furthermore, when describing a composition with an atomic ratio of In:Ga:Zn = 1:1:1 or close to it, I When the atomic ratio of n is set to 1, the atomic ratio of Ga is greater than 0.1 and less than or equal to 2, and Zn This includes cases where the atomic ratio is greater than 0.1 and less than or equal to 2.

[0317] The transistors in circuit 164 and the transistors in display unit 162 have the same structure. It may be present, or it may have a different structure. The structure of the multiple transistors in circuit 164 The construction may be the same for all, or there may be two or more types. Similarly, the display unit 162 has The structures of the multiple transistors may all be the same, or there may be two or more different structures.

[0318] A connection portion 244 is provided in the area of ​​substrate 151 where substrate 152 does not overlap. In section 244, the wiring 165 is electrically connected to the FPC 172 via the conductive layer 166 and the connecting layer 242. They are precisely connected. The upper surface of the connection part 244 is made of the same conductive film as the pixel electrode 191. The resulting conductive layer 166 is exposed. This connects the connection part 244 and the FPC 172. It can be electrically connected via the subsequent layer 242.

[0319] Various optical components can be placed on the outside of the substrate 152. Examples of optical components include polarizing plates. Examples include phase difference plates, light diffusion layers (such as diffusion films), anti-reflective layers, and light-gathering films. Furthermore, the outside of the substrate 152 has an antistatic film to suppress the adhesion of dust, and a coating to prevent dirt from adhering. It features a water-repellent coating to prevent scratches during use, a hard coat coating to suppress scratches, and an impact-absorbing layer. You may place it there.

[0320] Substrates 151 and 152 are made of glass, quartz, ceramic, sapphire, and resin, respectively. Oils and other substances can be used. Flexible materials are used for substrates 151 and 152. This increases the flexibility of the display device.

[0321] The adhesive layer can be a photocuring adhesive such as an ultraviolet-curing type, a reaction-curing adhesive, or a thermosetting adhesive. Various types of curing adhesives, such as anaerobic adhesives, can be used. Poxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide Resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, EV Examples include A (ethylene vinyl acetate) resin. In particular, epoxy resins have high moisture permeability. Low-cost materials are preferred. A two-part resin mixture may also be used. Furthermore, adhesive sheets, etc., may be used. It's okay to be there.

[0322] The connecting layer is an anisotropic conductive film (ACF). (Vital Film), Anisotropic Conductive Paste (ACP: Anisotropic Con You can use ductive pasting, etc.

[0323] The configuration and materials of the light-emitting elements 190G, 190B, and the light-receiving elements 190R·PD are as follows: You can refer to the description above.

[0324] In addition to the gate, source, and drain of a transistor, various wirings and electrical components that make up the display device. Materials that can be used for conductive layers such as electrodes include aluminum, titanium, chromium, and nickel. Copper, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten Examples include metals such as tungsten, and alloys in which such metals are the main component. The film containing the material can be used as a single layer or as a multilayer structure.

[0325] Furthermore, examples of conductive materials that are translucent include indium oxide, indium tin oxide, and indium Conductive oxides or graphite such as zinc oxide, zinc oxide, and zinc oxide containing gallium You can use gold, silver, platinum, magnesium, nickel, or tungsten. Metal materials such as chromium, molybdenum, iron, cobalt, copper, palladium, and titanium Alternatively, an alloy material containing the metal material can be used. Or, a nitride of the metal material (for example) For example, titanium nitride may be used. When using the above material, it is preferable to make it thin enough to be translucent. A laminated film of silver and magnesium can be used as a conductive layer. For example, an alloy of silver and magnesium and an index Using a multilayer film of um-tin oxide is preferable because it can improve conductivity. These include conductive layers such as various wirings and electrodes that constitute the display device, as well as light-emitting elements and light-receiving elements. It can also be used in conductive layers (conductive layers that function as pixel electrodes or common electrodes) of light-emitting / receiving elements. It is possible to be there.

[0326] Examples of insulating materials that can be used for each insulating layer include acrylic resin and epoxy resin. resins such as silicon oxide, silicon oxide nitride, silicon nitride, silicon oxide Examples include inorganic insulating materials such as aluminum.

[0327] [Display device 100E] Figures 14 and 15A show cross-sectional views of the display device 100E. A perspective view of the display device 100E is shown below. This is the same as display device 100D (Figure 9). Figure 14 shows the FPC17 of display device 100E. A portion of the area including 2, a portion of circuit 164, and a portion of display unit 162 were cut off. An example of a cross-section is shown. Figure 15A shows a part of the display unit 162 of the display device 100E cut away. An example of a cross-section when broken is shown. In Figure 14, the light-receiving element 11 of the display unit 162 is shown in particular. An example of a cross-section is shown when the region containing 0 and the light-emitting element 190R that emits red light is cut. In Figure 15A, among the display unit 162, in particular, the light-emitting element 190G that emits green light and the blue light An example of a cross-section is shown when the region containing the light-emitting element 190B is cut.

[0328] The display device 100E shown in Figures 14 and 15A has a transistor between substrate 153 and substrate 154. Zistor 243, Transistor 248, Transistor 249, Transistor 240, Light-emitting element It has a sub-element 190R, a light-emitting element 190G, a light-emitting element 190B, and a light-receiving element 110, etc.

[0329] The resin layer 159 and the common electrode 115 are bonded together via the adhesive layer 142, and the display device 10 A solid encapsulation structure is applied to 0E.

[0330] The substrate 153 and the insulating layer 212 are bonded together by the adhesive layer 155. The insulating layer 157 is bonded to the adhesive layer 156.

[0331] The method for fabricating the display device 100E involves first constructing the insulating layer 212, each transistor, and the photodetector. 110, a first fabricated substrate on which each light-emitting element is provided, an insulating layer 157, a resin layer 159, and A second fabricated substrate, which is provided with a light-shielding layer 158, is bonded to the first substrate by an adhesive layer 142. Then, the first fabricated substrate is peeled off, substrate 153 is attached to the exposed surface, and the second fabricated substrate is peeled off. By attaching the substrate 154 to the separated and exposed surface, a shape is formed on the first fabricated substrate and the second fabricated substrate. The assembled components are then transferred to substrates 153 and 154. It is preferable that each of these has flexibility. It can improve.

[0332] Insulating layer 212 and insulating layer 157 are, respectively, insulating layer 211, insulating layer 213, and insulating layer 157. An inorganic insulating film can be used for layer 215.

[0333] The light-emitting element 190R consists of a pixel electrode 191, a common layer 112, and a light-emitting layer 19 from the insulating layer 214b side. It has a stacked structure in which 3R, a common layer 114, and a common electrode 115 are stacked in that order. Pixel electrode 191 is connected to the conductive layer 169 through an opening provided in the insulating layer 214b. The conductive layer 169 is connected to the transistor 248 through an opening provided in the insulating layer 214a. It is connected to the conductive layer 222b. The conductive layer 222b is connected to the opening provided in the insulating layer 215. It is connected to the low-resistance region 231n via the transistor. In other words, the pixel electrode 191 is connected to the transistor It is electrically connected to 248. Transistor 248 controls the driving of the light-emitting element 190R. It has the function of controlling.

[0334] Similarly, the light-emitting element 190G has a pixel electrode 191, a common layer 112, and an emission-emitting element, from the insulating layer 214b side. It has a laminated structure in which the optical layer 193G, the common layer 114, and the common electrode 115 are stacked in that order. The pixel electrode 191 is connected via the conductive layer 169 and the conductive layer 222b of the transistor 249. It is electrically connected to the low-resistance region 231n of the transistor 249. In other words, the pixel electrode 191 It is electrically connected to transistor 249. Transistor 249 is connected to light-emitting element 1 It has a control function for driving at 90G.

[0335] Then, the light-emitting element 190B has a pixel electrode 191, a common layer 112, and a light-emitting element, starting from the insulating layer 214b side. It has a laminated structure in which the optical layer 193B, the common layer 114, and the common electrode 115 are stacked in that order. The pixel electrode 191 is connected via the conductive layer 169 and the conductive layer 222b of the transistor 240. It is electrically connected to the low-resistance region 231n of the transistor 240. In other words, the pixel electrode 191 It is electrically connected to transistor 240. Transistor 240 is connected to light-emitting element 1 It has the function of controlling the drive of the 90B.

[0336] The light-receiving element 110 consists of a pixel electrode 191, a common layer 112, and an active layer 183, from the insulating layer 214b side. It has a laminated structure in which a common layer 114 and a common electrode 115 are stacked in that order.

[0337] The ends of the pixel electrode 191 are covered by a partition wall 216. The pixel electrode 191 receives visible light. The common electrode 115 contains a material that transmits visible light, and the common electrode contains a material that transmits visible light.

[0338] The light emitted by the light-emitting elements 190R, 190G, and 190B is emitted towards the substrate 154. Light is incident on the light-receiving element 110 via the substrate 154 and the adhesive layer 142. For 4, it is preferable to use a material with high transmittance to visible light.

[0339] Each pixel electrode 191 can be manufactured using the same material and the same process. Common layer 112, The common layer 114 and the common electrode 115 are connected to the light-receiving element 110 and the light-emitting elements 190R and 190G. This is used in common with 190B. The light-receiving element 110 and the light-emitting element of each color are connected by the active layer 183. Except for the difference in the configuration of the light-emitting layer, all other components can be the same. The light-receiving element 110 can be incorporated into the display device 100E without significantly increasing the size. .

[0340] A resin layer 159 and a light-shielding layer 158 are provided on the substrate 153 side of the insulating layer 157. The resin layer 159 is provided in a position that overlaps with the light-emitting elements 190R, 190G, and 190B. It is not provided in a position that overlaps with the optical element 110. The light-shielding layer 158 is on the substrate 15 of the insulating layer 157. It is provided to cover the surface on side 3, the side of the resin layer 159, and the surface of the resin layer 159 on the substrate 153 side. The light-shielding layer 158 is positioned to overlap with the light-receiving element 110 and the light-emitting elements 190R, 190G, 1 It has an opening in a position that overlaps with each of 90B. By providing the light-shielding layer 158, the light-receiving element The range in which 110 detects light can be controlled. In addition, by having a light-shielding layer 158 Light is transmitted from the light-emitting elements 190R, 190G, and 190B to the light-receiving element 110 without the need for an object. Direct incidence can be suppressed. Therefore, a sensor with low noise and high sensitivity can be realized. The resin layer 159 is provided, which reduces the distance from the light-shielding layer 158 to the light-emitting elements of each color. The distance is shorter than the distance from the light-shielding layer 158 to the light-receiving element 110. As a result, the sensor It is possible to reduce noise while suppressing the display's viewing angle dependence. Therefore, the display product This allows for improvements in both image quality and image resolution.

[0341] As shown in Figure 14, the partition wall 216 has an opening between the light-receiving element 110 and the light-emitting element 190R. It has. A light-shielding layer 219a is provided to fill the opening. The light-shielding layer 219a is It is located between the light-receiving element 110 and the light-emitting element 190R. The light-shielding layer 219a is located between the light-receiving element 1 It absorbs the light emitted by 90R. This suppresses stray light incident on the photodetector 110. It is possible.

[0342] Spacer 219b is provided on partition wall 216 and is connected to light-emitting element 190G and light-emitting element 190B It is located between the upper surface of the light-shielding layer 158 and the upper surface of the light-shielding layer 219a. It is preferable that the height (thickness) of the partition wall 216 and the height of the spacer 219b are close to each other. The sum of the thicknesses is preferably greater than the height (thickness) of the light-shielding layer 219a. This makes it easier to fill the adhesive layer 142. As shown in Figure 15A, spacer 219b In the portion where the light-shielding layer 158 and the common electrode 115 (or protective layer) overlap, the light-shielding layer 158 is the common electrode 115 (or protective layer ) may be in contact with it.

[0343] A connection portion 244 is provided in the area of ​​the substrate 153 where the substrate 154 does not overlap. In section 244, the wiring 165 is connected to F via the conductive layer 167, conductive layer 166, and connecting layer 242. It is electrically connected to PC172. Conductive layer 167 has the same conductive film as conductive layer 169. It can be obtained by processing. The upper surface of the connecting portion 244 is coated with the same conductive film as the pixel electrode 191. The conductive layer 166 obtained by the process is exposed. As a result, the connection part 244 and FPC 172 These can be electrically connected via the connecting layer 242.

[0344] Transistors 243, 248, 249, and 24 0 is a conductive layer 221 that functions as a gate, and an insulating layer 211 that functions as a gate insulating layer. A semiconductor layer having a channel-forming region 231i and a pair of low-resistance regions 231n, a pair of low-resistance regions The conductive layer 222a connects to one of the resistance regions 231n, and the other of the pair of low-resistance regions 231n connects to the other. A conductive layer 222b is connected, an insulating layer 225 functions as a gate insulating layer, and a gate functions as a gate. It has a conductive layer 223 and an insulating layer 215 covering the conductive layer 223. The insulating layer 211 is It is located between the conductive layer 221 and the channel-forming region 231i. The insulating layer 225 is located between the conductive layer 2 It is located between 23 and the channel-forming region 231i.

[0345] The conductive layer 222a and the conductive layer 222b are separated by openings provided in the insulating layer 215. It is connected to the low-resistance region 231n. Of the conductive layer 222a and conductive layer 222b, one is One acts as the source, and the other as the drain.

[0346] In Figures 14 and 15A, the insulating layer 225 is the channel formation region 23 of the semiconductor layer 231. It overlaps with 1i and does not overlap with the low-resistance region 231n. For example, if the conductive layer 223 is used as a mask By processing the insulating layer 225, the structures shown in Figures 14 and 15A can be fabricated. Figure 1 In Figures 4 and 15A, an insulating layer 215 is provided covering the insulating layer 225 and the conductive layer 223. Through the opening in the insulating layer 215, the conductive layer 222a and the conductive layer 222b each have low resistance regions. It is connected to 231n. Furthermore, on conductive layer 222a and conductive layer 222b, An insulating layer may be provided to cover the sta.

[0347] On the other hand, in the transistor 252 shown in Figure 15B, the insulating layer 225 is located on the top and side surfaces of the semiconductor layer. An example of covering is shown. Conductive layer 222a and conductive layer 222b are, respectively, insulating layer 225 and insulating layer 225 and insulating layer 225. It is connected to the low-resistance region 231n through an opening provided in the edge layer 215.

[0348] As described above, a display device according to one aspect of the present invention has two light-emitting elements (or light-receiving / emitting elements). The difference in distance to the element and the overlap with the light-receiving element (or light-receiving element) of the two light-emitting elements. The difference in distance to the aperture of the light-shielding layer is different from that of the other element. With this configuration, the light-receiving element Alternatively, the light-receiving light-emitting device compares the light originating from one of the two light-emitting devices with the light originating from the other. It can receive a large amount of light. Therefore, for example, in a display device according to one aspect of the present invention, light The element or light-emitting / receiving device is subjected to a large amount of light originating from the light-emitting element used as a light source. It is possible.

[0349] [Example of a pixel circuit] A display device according to one aspect of the present invention includes a display unit comprising a first pixel circuit having a light-receiving element and a light-emitting element. It has a second pixel circuit having a first pixel circuit and a second pixel circuit having a first pixel circuit and a second pixel circuit, They are arranged in a matrix.

[0350] Figure 16A shows an example of a first pixel circuit having a light-receiving element, and Figure 16B shows an example of a first pixel circuit having a light-emitting element. An example of a second pixel circuit is shown.

[0351] The pixel circuit PIX1 shown in Figure 16A consists of a light-receiving element PD, transistor M1, and transistor M 2. It has transistors M3, M4, and capacitor C1. Here, a photodetector element An example using a photodiode as the photodiode (PD) is shown.

[0352] The photodetector PD has its cathode electrically connected to wiring V1 and its anode connected to transistor M1. It is electrically connected to either the source or the drain. Transistor M1 has its gate connected to the wiring T Electrically connected to X, with the other being the source or drain, one electrode of capacitance C1, the transistor Either the source or drain of transistor M2, and the gate of transistor M3 are electrically connected. Transistor M2 has its gate electrically connected to wiring RES, and its source or drain. The other end is electrically connected to wiring V2. Transistor M3 has either a source or a drain. One end is electrically connected to wiring V3, and the other end is the source or drain of transistor M4. Electrically connect to either the gate or the drain. Transistor M4 has its gate connected to the wiring SE. Electrically connect the two wires, with the other being either the source or the drain, electrically connected to the OUT1 wiring.

[0353] A constant potential is supplied to wiring V1, wiring V2, and wiring V3, respectively. The photodetector PD When driving with reverse bias, supply a potential lower than the potential of wiring V1 to wiring V2. Transistor M2 is controlled by the signal supplied to wiring RES, and transistor M A function to reset the potential of the node connected to gate 3 to the potential supplied to wiring V2. It possesses. Transistor M1 is controlled by the signal supplied to wiring TX, and photodetector PD It has a function to control the timing at which the potential of the above node changes in accordance with the current flowing through it. Transistor M3 functions as an amplifying transistor that outputs according to the potential of the above node. Transistor M4 is controlled by a signal supplied to wiring SE, and the power of the above node A selection transistor for reading the output corresponding to the position using an external circuit connected to wiring OUT1, and It functions in this way.

[0354] The pixel circuit PIX2 shown in Figure 16B consists of a light-emitting element EL, transistor M5, and transistor M 6. It has a transistor M7 and a capacitor C2. Here, the light-emitting element EL is a light-emitting element. An example using an ion is shown. In particular, an organic EL element is used as the light-emitting element (EL). This is preferable.

[0355] Transistor M5 has its gate electrically connected to wiring VG, and one of its sources or drains. The wiring VS is electrically connected, and the other side of the source or drain is one electrode of capacitance C2. And electrically connect to the gate of transistor M6. The source or gate of transistor M6 One end of the rain is electrically connected to wiring V4, and the other end is connected to the anode of the light-emitting element EL, and the traction. Connect electrically to either the source or drain of transistor M7. Transistor M7 is The gate is electrically connected to wiring MS, and the other side, either source or drain, is electrically connected to wiring OUT2. Connect precisely. The cathode of the light-emitting element (EL) is electrically connected to wiring V5.

[0356] A constant potential is supplied to wiring V4 and wiring V5, respectively. The anode side of the light-emitting element EL It is possible to set the cathode side to a lower potential than the anode side at a high potential. Transistor M5 This is controlled by a signal supplied to wiring VG, and controls the selected state of the pixel circuit PIX2. It functions as a selection transistor for that purpose. Also, transistor M6 is supplied to the gate. It functions as a drive transistor that controls the current flowing to the light-emitting element (EL) according to the potential. When transistor M5 is conducting, the potential supplied to wiring VS is the potential of transistor M6. It is supplied to the terminal, and the luminescence brightness of the light-emitting element (EL) can be controlled according to its potential. The transistor M7 is controlled by a signal supplied to the wiring MS, and the transistor M6 and light-emitting element It has the function of outputting the potential difference between itself and the sub-EL to the outside via wiring OUT2.

[0357] The cathode of the light-receiving element PD is electrically connected to wiring V1, and the cathode of the light-emitting element EL is electrically connected to wiring V1. The electrically connected wiring V5 can be on the same layer and at the same potential.

[0358] In one embodiment of the present invention, the display device includes the transistors contained in the pixel circuit PIX1 and the pixel circuit PIX2. In all transistors, the semiconductor layer in which the channel is formed is made of metal oxide (also called oxide semiconductor). It is preferable to use a transistor having (hereinafter also referred to as an OS transistor). OS transistors have extremely low off-currents, and the capacitor connected in series with the transistor It is possible to retain the charge accumulated in a quantity over a long period of time. Also, OS transistors By using this method, the power consumption of the display device can be reduced.

[0359] Alternatively, in a display device according to one aspect of the present invention, the pixel circuit PIX1 and the pixel circuit PIX2 include All transistors have silicon in the semiconductor layer where the channel is formed. It is preferable to use a transistor (hereinafter also called a Si transistor). As for silicon, simple Examples include crystalline silicon, polycrystalline silicon, amorphous silicon, etc. In particular, low temperature Polysilicon (LTPS (Low Temperature Poly-Silicon) It is preferable to use a transistor having (hereinafter also called an LTPS transistor) LTPS transistors have high field-effect mobility and can operate at high speeds.

[0360] Furthermore, by using Si transistors such as LTPS transistors, CMOS circuits can be used. This makes it easy to integrate the various circuits that make up the system onto the same circuit board as the display unit. This allows for the simplification of external circuits implemented in the device, reducing component costs and implementation costs. It is possible.

[0361] Alternatively, in a display device according to one aspect of the present invention, two types of transistors are provided in the pixel circuit PIX1. It is preferable to use it. Specifically, the pixel circuit PIX1 uses an OS transistor and an LTP It is preferable to have an S transistor. Depending on the function required of the transistor, By changing the semiconductor layer material, the quality of the pixel circuit PIX1 is improved, and the precision of sensing and imaging is enhanced. The degree can be increased. At this time, the pixel circuit PIX2 has an OS transistor and an LT Either one of the PS transistors may be used, or both may be used.

[0362] Furthermore, the pixel contains two types of transistors (for example, an OS transistor and an LTPS transistor) Even when using (T), by using LTPS transistors, the circuit is composed of CMOS circuits. This makes it easy to integrate various circuits into the same circuit board as the display unit. This allows for the simplification of the external circuitry being implemented, reducing component costs and implementation costs. can.

[0363] Using metal oxides with a wider band gap and lower carrier density than silicon A transistor can achieve an extremely small off-current. The current allows the charge stored in the capacitor connected in series with the transistor to be maintained over a long period of time. It is possible to maintain this. Therefore, especially when connected in series with capacitance C1 or capacitance C2 OS transistors are used for transistors M1, M2, and M5. It is preferable that they be present.

[0364] Furthermore, it is preferable to use a Si transistor for transistor M3. This allows, The readout operation of image data can be performed at high speed.

[0365] The display unit includes a first pixel circuit having a light-receiving element and a second pixel circuit having a light-emitting element. A display device having a mode for displaying an image, a mode for capturing an image, and a mode for displaying an image and capturing an image. It can be driven in any mode that performs both simultaneously. In the mode that displays images, for example, For example, a light-emitting element can be used to display a full-color image. Also, the image capture is performed by In this system, for example, a light-emitting element is used to display an image for imaging (e.g., a single color green, a single color blue, etc.). Furthermore, it is possible to perform imaging using a light-receiving element. In imaging mode, for example, fingerprint recognition It can perform tasks such as providing proof. Furthermore, in a mode that simultaneously displays and captures images, for example, Some pixels use light-emitting elements to display the image for imaging, and also use light-receiving elements to capture the image. By doing so, the remaining pixels can be used with light-emitting elements to display a full-color image.

[0366] Note that in Figures 16A and 16B, the transistor is assumed to be an n-channel type transistor. Although indicated, p-channel transistors can also be used. The gate is not limited to a single gate; it may also have a back gate.

[0367] A transistor and / or a capacitor are placed in a position overlapping with the photodetector PD or light-emitting element EL. It is preferable to provide one or more layers having the method. This allows for the effective operation of each pixel circuit. This allows for a smaller footprint and enables the realization of a high-definition display.

[0368] This embodiment can be combined with other embodiments as appropriate.

[0369] (Embodiment 3) In this embodiment, the OS transistor described in the above embodiment can be used. This section explains metal oxides (also known as oxide semiconductors).

[0370] The metal oxide preferably contains at least indium or zinc. In particular, indium It is preferable that it also contains aluminum, gallium, and zinc. It is preferable that it contains thorium, tin, etc. Also, boron, silicon, titanium, Iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium One of the following materials is selected from: luminous, hafnium, tantalum, tungsten, magnesium, cobalt, etc. It may contain one or more species.

[0371] Furthermore, metal oxides can be produced by sputtering, metal-organic chemical vapor deposition (MOCVD), and other methods. (e.g., Organic Chemical Vapor Deposition) Chemical vapor deposition (CVD) method, By methods such as Atomic Layer Deposition (ALD) It can be formed.

[0372] <Classification of crystal structures> The crystal structure of oxide semiconductors is amorphous (completely amorphous). (including ous), CAAC (c-axis-aligned crystalline) , nc(nanocrystalline), CAC(cloud-aligned c Polycrystalline materials include polycrystalline materials, single crystals, and polycrystalline materials. Examples include crystal, etc.

[0373] The crystal structure of the film or substrate is determined by X-ray diffraction (XRD). It can be evaluated using the (on) spectrum. For example, GIXD (Grazing- The evaluation can be performed using the XRD spectrum obtained from the Incidence XRD measurement. Yes, it is possible. The GIXD method is also known as the thin-film method or the Seemann-Bohlin method.

[0374] For example, in a quartz glass substrate, the peak shape of the XRD spectrum is almost symmetrical. On the other hand, in IGZO films with a crystalline structure, the peak shapes of the XRD spectra are asymmetrical. It is a term used. The asymmetrical shape of the peaks in the XRD spectrum indicates that the film or substrate is affected. This clearly indicates the presence of crystals inside. In other words, the shape of the peaks in the XRD spectrum is symmetrical. If it is not amorphous, the film or substrate cannot be said to be in an amorphous state.

[0375] Furthermore, the crystal structure of the film or substrate is determined by nano-beam diffraction (NBED). Diffraction patterns observed by electron diffraction (extremely low-voltage electrons) It can be evaluated using the sub-ray diffraction pattern (also called the sub-ray diffraction pattern). For example, diffraction of a quartz glass substrate. The pattern shows a halo, confirming that the quartz glass is in an amorphous state. Furthermore, the diffraction pattern of the IGZO film deposited at room temperature showed a spot-like pattern rather than a halo. A pattern is observed. Therefore, the IGZO film deposited at room temperature is neither crystalline nor amorphous. It is not a state, but an intermediate state, and it cannot be concluded that it is an amorphous state. .

[0376] <<Oxide semiconductor structure>> Note that oxide semiconductors may be classified differently from those described above when considering their structure. Example For example, oxide semiconductors include single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. They can be separated. Examples of non-single-crystal oxide semiconductors include the aforementioned CAAC-OS and nc -OS exists. In addition, non-single-crystal oxide semiconductors include polycrystalline oxide semiconductors and pseudo-amorphous oxides. Amorphous-like oxide semiconductor (a-like OS) This includes conductors, amorphous oxide semiconductors, and so on.

[0377] Here, we will provide details on the CAAC-OS, nc-OS, and a-like OS mentioned above. Give an explanation.

[0378] [CAAC-OS] CAAC-OS has multiple crystalline regions, and these multiple crystalline regions are arranged with their c-axis in a specific direction. It is an oxide semiconductor that is oriented in a particular direction. Note that the specific direction refers to the thickness direction of the CAAC-OS film. The direction normal to the surface on which the CAAC-OS film is formed, or the direction normal to the surface of the CAAC-OS film. Furthermore, a crystalline region is a region in which the atomic arrangement has periodicity. If considered as an arrangement, a crystalline region is also a region with a aligned lattice arrangement. Furthermore, CAAC-O S has a region in the ab-plane direction where multiple crystalline regions are connected, and this region is strained. This can sometimes occur. Note that strain refers to the deformation of the lattice arrangement in a region where multiple crystal regions are connected. Areas where the orientation of the grid arrangement changes between aligned regions and aligned regions with a different grid arrangement. This refers to the fact that CAAC-OS is c-axis oriented and has a clear orientation in the ab-plane direction. It is an oxide semiconductor that does not exist.

[0379] Each of the above multiple crystalline regions is composed of one or more minute crystals (with a maximum diameter of 10n It is composed of crystals that are less than m in size. If the crystalline region is composed of one minute crystal, The maximum diameter of the crystalline region is less than 10 nm. Furthermore, the crystalline region is composed of numerous tiny crystals. If this is the case, the size of the crystalline region may be around several tens of nanometers.

[0380] In addition, In-M-Zn oxide (where M is aluminum, gallium, yttrium, and tin) In one or more types selected from titanium, etc., CAAC-OS is indigenous A layer containing ions (In) and oxygen (hereinafter referred to as the In layer), and an element M, zinc (Zn), and oxygen A layered crystalline structure (also called a layered structure) is formed by stacking layers containing (M,Zn) layers. ) tends to have. Furthermore, indium and element M are mutually substitutable. Therefore, The (M,Zn) layer may contain indium. Additionally, the In layer contains the element M. This may occur. Furthermore, the In layer may also contain Zn. This layered structure is, for example, High-resolution TEM (Transmission Electron Microscope) In the image, it is observed as a grid pattern.

[0381] When structural analysis of a CAAC-OS film is performed using, for example, an XRD instrument, the θ / 2θ skid is observed. Out-of-plane XRD measurements using a champ showed a peak indicating c-axis orientation at 2θ. It is detected at 31° or near that angle. Note that the position of the peak indicating c-axis orientation (value of 2θ) This may vary depending on the type and composition of the metal elements that make up CAAC-OS.

[0382] Furthermore, for example, in the electron diffraction pattern of a CAAC-OS film, multiple bright spots (spots) may be observed. ) is observed. Note that one spot and another spot are determined by the incident electron beam that has passed through the sample. Observed at a point-symmetric position with respect to the spot (also called a direct spot) as the center of symmetry. .

[0383] When the crystal region is observed from the specific direction described above, the lattice arrangement within that crystal region is a hexagonal lattice. While this is the basic principle, the unit cell is not necessarily a regular hexagon and may be a non-regular hexagon. Also, In the distortion described, there may be grid arrangements such as pentagons and heptagons. Note that CAAC- In OS, clear grain boundaries can be observed even near strain. It is not possible. In other words, the formation of grain boundaries is suppressed by the distortion of the lattice arrangement. This can be seen. This is because CAAC-OS has a dense arrangement of oxygen atoms in the ab-plane direction. Due to the absence of certain elements, or because the substitution of metal atoms changes the bond distance between atoms, This is thought to be because it allows for distortion to be tolerated.

[0384] Furthermore, a crystal structure in which clear grain boundaries can be observed is known as polycrystalline. It is called l). The grain boundaries become recombination centers, where carriers are trapped and the transistor is formed This is highly likely to cause a decrease in current, a decrease in field-effect mobility, etc. Therefore, a clear conclusion is reached. CAAC-OS, which lacks visible grain boundaries, has a crystal structure suitable for the semiconductor layer of transistors. It is one of the crystalline oxides. Note that CAAC-OS requires the presence of Zn. The configuration is preferable. For example, In-Zn oxide and In-Ga-Zn oxide are In oxide It is preferable because it can suppress the generation of grain boundaries more effectively than other materials.

[0385] CAAC-OS is an oxide semiconductor with high crystallinity and no clearly defined grain boundaries. Therefore, CAAC-OS is less prone to a decrease in electron mobility caused by grain boundaries. Furthermore, the crystallinity of oxide semiconductors can decrease due to impurities or the formation of defects. Therefore, CAAC-OS is also an oxide semiconductor with few impurities and defects (such as oxygen vacancies). Yes, that's correct. Therefore, oxide semiconductors containing CAAC-OS have stable physical properties. Therefore, oxide semiconductors containing CAAC-OS are highly heat-resistant and reliable. -OS is stable even at high temperatures (so-called thermal budget) during the manufacturing process. Therefore, using CAAC-OS in OS transistors expands the degree of freedom in the manufacturing process. This becomes possible.

[0386] [nc-OS] nc-OS is used in minute regions (for example, regions between 1 nm and 10 nm, especially between 1 nm and 3 nm). It has periodicity in the atomic arrangement in the region of less than nm. In other words, nc-OS is minute It has crystals. The size of these minute crystals is, for example, between 1 nm and 10 nm. In particular, because they are between 1 nm and 3 nm in size, these minute crystals are also called nanocrystals. In nc-OS, no regularity is observed in the crystal orientation between different nanocrystals. Therefore, across the entire film... No orientation is observed. Therefore, nc-OS is a-like OS depending on the analysis method. In some cases, it may be indistinguishable from amorphous oxide semiconductors. For example, XR When performing structural analysis using device D, an out-of-plane scan using θ / 2θ is performed. XRD measurements did not detect any peaks indicating crystallinity. Furthermore, for the nc-OS film, Electron diffraction (control) using an electron beam with a probe diameter larger than that of the crystal (e.g., 50 nm or more) Also called limited-field electron diffraction, when this is performed, a diffraction pattern similar to a halo pattern is observed. On the other hand, for nc-OS films, the particles are close in size to or smaller than the nanocrystals. Electron diffraction using electron beams with a diameter (e.g., 1 nm to 30 nm) (nanobeam electron beam) When diffraction is performed, multiple particles are found within a ring-shaped region centered on the direct spot. In some cases, electron diffraction patterns in which spots are observed can be obtained.

[0387] [a-like OS] a-like OS is an oxide semiconductor having a structure between nc-OS and amorphous oxide semiconductors. It is a conductor. a-like OS has porous or low-density regions. That is, a-like OS has lower crystallinity compared to nc-OS and CAAC-OS. Also, it has a-like properties. OS has a higher hydrogen concentration in the membrane compared to nc-OS and CAAC-OS.

[0388] <<Oxide Semiconductor Composition>> Next, we will explain the details of CAC-OS mentioned above. Note that CAC-OS is a material composition. Regarding.

[0389] [CAC-OS] CAC-OS refers to, for example, metal oxides in which the elements constituting the metal oxide are between 0.5 nm and 10 nm in size. Preferably, a composition of material that is unevenly distributed with a size of 1 nm to 3 nm or near that size. In addition, in the following, in a metal oxide, one or more metal elements are unevenly distributed, The region containing the metallic element is 0.5 nm to 10 nm, preferably 1 nm to 3 nm. The following state, where particles of similar or near-similar size are mixed, is also referred to as a mosaic or patchy appearance.

[0390] Furthermore, CAC-OS is a system where the material separates into a first region and a second region, resulting in a mosaic effect. This results in a cloud-like structure, where the first region is distributed within the membrane (hereinafter also referred to as a cloud-like structure). Therefore, CAC-OS is a mixture of the first region and the second region. It is a composite metal oxide having the following configuration.

[0391] Here, In for the metal elements constituting CAC-OS in In-Ga-Zn oxide The atomic ratios of , Ga, and Zn are denoted as [In], [Ga], and [Zn], respectively. For example, in CAC-OS in In-Ga-Zn oxide, the first region is [ This is the region where [In] is greater than [In] in the composition of the CAC-OS film. Also, the second This region is the region where [Ga] is greater than the [Ga] in the composition of the CAC-OS film. Alternatively, for example, in the first region, [In] is greater than [In] in the second region. Furthermore, the region where [Ga] is smaller than the region where [Ga] is smaller. In region 2, [Ga] is greater than [Ga] in region 1, and [In] is This is a region smaller than [In] in the first region.

[0392] Specifically, the first region mentioned above is mainly composed of indium oxide, indium zinc oxide, etc. This is the region. Furthermore, the second region mentioned above includes gallium oxide, gallium zinc oxide, etc. This is the region in which is the principal component. In other words, the first region described above is called the region in which In is the principal component. It can be replaced. Furthermore, the second region mentioned above can be rephrased as the region with Ga as the main component. It is possible.

[0393] Furthermore, a clear boundary may not be observed between the first region and the second region described above.

[0394] Furthermore, CAC-OS in In-Ga-Zn oxide refers to In, Ga, Zn, and O In the material composition, there is a region where Ga is the main component and a region where In is the main component. This refers to a configuration in which each region is mosaic-like, and these regions exist randomly. Therefore, it is presumed that CAC-OS has a structure in which metallic elements are unevenly distributed. .

[0395] CAC-OS is formed, for example, by sputtering under conditions where the substrate is not heated. This is possible. Also, when forming CAC-OS by sputtering, the film deposition gas is not Select one of the following gases: active gas (typically argon), oxygen gas, and nitrogen gas. One or more may be used. Also, the flow rate of oxygen gas relative to the total flow rate of the film deposition gas during film formation. A lower ratio is preferable; for example, the ratio of the oxygen gas flow rate to the total flow rate of the film deposition gas during film formation is It is preferable that the amount be 0% or more and less than 30%, preferably 0% or more and 10% or less.

[0396] Furthermore, for example, in CAC-OS in In-Ga-Zn oxide, energy-dispersive X Linear spectroscopy (EDX: Energy Dispersive X-ray spectrometer) EDX mapping obtained using scopy revealed a region with In as its main component (1st A structure in which a region (the first region) and a region mainly composed of Ga (the second region) are unevenly distributed and mixed. It can be confirmed that they possess it.

[0397] Here, the first region is a region with higher conductivity compared to the second region. In other words, the first region The flow of carriers through this region causes the metal oxide to exhibit conductivity. Therefore The first region is distributed in a cloud-like manner within the metal oxide, resulting in a high field-effect mobility (μ This can be achieved.

[0398] On the other hand, the second region is a region with higher insulating properties compared to the first region. In other words, the second region By distributing the region within the metal oxide, leakage current can be suppressed.

[0399] Therefore, when CAC-OS is used in a transistor, the conductivity due to the first region and the second region The insulating properties originating from region 2 work complementaryly to create a switching function. (The function to turn it on / off) can be added to CAC-OS. In other words, CAC- OS refers to a material that has both conductive and insulating properties in some parts. The whole structure functions as a semiconductor. The conductive and insulating functions are separated. This allows both functions to be maximized. Therefore, CAC-OS is transistor By using it, a high on-current (I on ), high field effect mobility (μ), and good swim It can perform a clicking motion.

[0400] Furthermore, transistors using CAC-OS are highly reliable. Therefore, CAC-OS is, It is ideal for various semiconductor devices, including display devices.

[0401] Oxide semiconductors can take on diverse structures, each possessing different properties. One embodiment of the present invention Oxide semiconductors include amorphous oxide semiconductors, polycrystalline oxide semiconductors, a-like OS, and CA. It may have two or more of the following: C-OS, nc-OS, and CAAC-OS.

[0402] <Transistors containing oxide semiconductors> Next, we will explain the case where the above oxide semiconductor is used in a transistor.

[0403] By using the above oxide semiconductor in transistors, transistors with high field-effect mobility can be produced. It can be achieved. Furthermore, highly reliable transistors can be realized.

[0404] It is preferable to use an oxide semiconductor with a low carrier concentration for the transistor. For example, The carrier concentration of oxide semiconductors is 1 × 10⁻⁶ 17 cm -3 The following is preferably 1 × 10 15 cm -3 More preferably 1 × 10 13 cm -3 More preferably 1 × 10 11 c m -3 More preferably 1 × 10 10 cm -3 It is less than 1 × 10 -9 cm -3 That concludes the explanation. Furthermore, when lowering the carrier concentration of the oxide semiconductor film, The impurity concentration in the conductive film can be reduced to lower the defect level density. In this specification, High-purity intrinsic or substantially high-purity intrinsic refers to a substance with a low impurity concentration and a low defect level density. Furthermore, oxide semiconductors with low carrier concentrations are made of high-purity intrinsic or substantially high-purity intrinsic material. It is sometimes called an oxide semiconductor.

[0405] Furthermore, oxide semiconductor films that are high-purity intrinsic or substantially high-purity intrinsic have a low defect level density. Therefore, the trap level density may also be low.

[0406] Furthermore, the time required for charges trapped in the trap levels of oxide semiconductors to disappear is long. Furthermore, it can behave as if it were a fixed charge. Therefore, it can behave as if it were a fixed charge. Transistors in which a channel formation region is formed in an oxide semiconductor exhibit unstable electrical properties. There are cases where this is the case.

[0407] Therefore, in order to stabilize the electrical characteristics of the transistor, the impurity concentration in the oxide semiconductor must be Reducing it is effective. Also, in order to reduce the impurity concentration in oxide semiconductors, It is also preferable to reduce the concentration of impurities in the contacting film. Examples of impurities include hydrogen, nitrogen, and aluminum. Examples include potash metals, alkaline earth metals, iron, nickel, and silicon.

[0408] <Impurities> Here, we will explain the effects of various impurities in oxide semiconductors.

[0409] In oxide semiconductors, if silicon or carbon, which are among the Group 14 elements, are present, the oxide Defect levels are formed in semiconductors. Therefore, silicon and carbon in oxide semiconductors. The concentration of silicon and carbon near the interface with the oxide semiconductor (by secondary ion mass spectrometry) SIMS (Secondary Ion Mass Spectrometry) The resulting concentration is 2 × 10 18 atoms / cm 3 The following is preferably 2 × 10 17 at oms / cm 3 The following applies:

[0410] Furthermore, if alkali metals or alkaline earth metals are present in the oxide semiconductor, defect levels are formed. This can result in the generation of carriers. Therefore, alkali metals or alkaline earth metals Transistors using oxide semiconductors containing this material tend to exhibit normally-on characteristics. Therefore, alkali metals or alkaline earth metals in oxide semiconductors obtained by SIMS The concentration of 1 × 10 18 atoms / cm 3 The following is preferably 2 × 10 16 atom / cm 3 Do the following:

[0411] Furthermore, in oxide semiconductors, when nitrogen is present, electrons, which are carriers, are generated. The concentration increases, making it easier to convert to n-type. As a result, oxide semiconductors containing nitrogen become semiconductors. The transistor used tends to exhibit normally-on characteristics. Alternatively, in oxide semiconductors... If nitrogen is present, a trap level may be formed. As a result, the transistor Electrical properties may become unstable. For this reason, in oxide semiconductors obtained by SIMS... The nitrogen concentration is 5 × 10 19 atoms / cm 3 Less than 5 × 10 18 Atom s / cm 3More preferably 1 × 10 18 atoms / cm 3 More preferably, is 5 x 10 17 atoms / cm 3 Do the following:

[0412] Furthermore, the hydrogen contained in oxide semiconductors reacts with the oxygen bonded to the metal atoms to form water. This can sometimes form an oxygen vacancy. When hydrogen enters this oxygen vacancy, the electrons, which are carriers, In some cases, this can be generated. Also, some of the hydrogen combines with oxygen that is bonded to a metal atom, resulting in a It can generate electrons, which are rear electrons. Therefore, using an oxide semiconductor containing hydrogen... Transistors tend to exhibit normally-on characteristics. Therefore, hydrogen in oxide semiconductors It is preferable that it be reduced as much as possible. Specifically, in oxide semiconductors, SIM The hydrogen concentration obtained by S is 1 × 10 20 atoms / cm 3 Less than 1 × 1 0 19 atoms / cm 3 Less than 5x10 18 atoms / cm 3 less than, More preferably 1 × 10 18 atoms / cm 3 Make it less than.

[0413] Using oxide semiconductors with sufficiently reduced impurities in the channel formation region of transistors. This allows for the provision of stable electrical characteristics.

[0414] This embodiment can be combined with other embodiments as appropriate.

[0415] (Embodiment 4) In this embodiment, an electronic device according to one aspect of the present invention will be described with reference to Figures 17 to 19. ru.

[0416] An electronic device according to one aspect of the present invention can perform imaging on a display unit and touch operations (contact or proximity). It can detect ( ). This can improve the functionality and convenience of electronic devices. can.

[0417] Electronic devices according to one aspect of the present invention include, for example, television equipment, desktop type or This includes notebook personal computers, monitors for computers, and digital signage. In addition to electronic devices with relatively large screens, such as pachinko machines and other large game machines, digital Digital cameras, digital video cameras, digital photo frames, mobile phones, portable games Examples include mobile phones, personal information terminals, and audio playback devices.

[0418] An electronic device according to one aspect of the present invention includes sensors (force, displacement, position, velocity, acceleration, angular velocity, rotational speed). Distance, light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power, (Includes functions for measuring radiation, flow rate, humidity, gradient, vibration, odor, or infrared radiation) It's okay to do so.

[0419] An electronic device according to one aspect of the present invention can have various functions. For example, various information ( Functions to display still images, videos, text images, etc. on the display unit, touch panel function, calendar A function to display the date or time, and to run various software (programs). Functions include wireless communication and the ability to read programs or data recorded on a recording medium. They may possess abilities such as [specific abilities / skills].

[0420] The electronic device 6500 shown in Figure 17A is a portable information device that can be used as a smartphone. It is a terminal device.

[0421] The electronic device 6500 consists of a housing 6501, a display unit 6502, a power button 6503, and a button 65 04, includes speaker 6505, microphone 6506, camera 6507, and light source 6508, etc. The display unit 6502 is equipped with a touch panel function.

[0422] The display device shown in Embodiment 2 can be applied to the display unit 6502.

[0423] Figure 17B is a schematic cross-sectional view of the housing 6501, including the end on the microphone 6506 side.

[0424] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501. And within the space surrounded by the protective member 6510, the display panel 6511, the optical member 6512, and the touch The sensor panel 6513, printed circuit board 6517, battery 6518, etc. are located here. .

[0425] The protective member 6510 includes a display panel 6511, an optical member 6512, and a touch sensor panel. The 6513 is fixed by an adhesive layer (not shown).

[0426] In the area outside the display unit 6502, a portion of the display panel 6511 is folded back. The FPC6515 is connected to the folded portion. C6516 is mounted. FPC6515 is located on the edge of the printed circuit board 6517. It is connected to the child.

[0427] A flexible display according to one aspect of the present invention can be applied to the display panel 6511. This makes it possible to create extremely lightweight electronic devices. Also, the display panel 6511 is extremely lightweight. Because it is thin, it is possible to keep the thickness of electronic devices down while also equipping them with a large-capacity 6518 battery. Also, a part of the display panel 6511 is folded back, and the FPC6515 is attached to the back of the pixel area. By positioning the connection points, it is possible to realize electronic devices with narrow bezels.

[0428] By using the display device shown in Embodiment 2 on the display panel 6511, the display unit 6502 Image acquisition can be performed. For example, fingerprints can be captured on the display panel 6511 and fingerprint authentication can be performed. It is possible.

[0429] The display unit 6502 further includes a touch sensor panel 6513, so the display unit 650 2. A touch panel function can be added. The touch sensor panel 6513 is Capacitive, resistive, surface acoustic wave, infrared, optical, and pressure-sensitive methods are available. Various methods can be used. Alternatively, the display panel 6511 can be used as a touch sensor. It may be enabled, in which case the touch sensor panel 6513 does not need to be provided.

[0430] Figure 18A shows an example of a television system. The television system 7100 is housed in a casing 7101 The display unit 7000 is incorporated into it. Here, the stand 7103 connects to the housing 7101. This shows a configuration that supports this.

[0431] The display device shown in Embodiment 2 can be applied to the display unit 7000.

[0432] The television device 7100 shown in Figure 18A is operated using the control switches provided on the housing 7101. Alternatively, it can be done using a separate remote control unit 7111. Or, the display unit 7000 can be used. It may also be equipped with a touch sensor, and by touching the display unit 7000 with a finger, etc., the television will be activated. You may operate the unit 7100. The remote control unit 7111 It may have a display unit that displays information output from it. Remote control operator 7111 is equipped Channel and volume can be controlled using the control keys or touch panel. The image displayed on the display unit 7000 can be manipulated.

[0433] The television system 7100 will consist of a receiver and a modem, etc. This allows you to receive regular television broadcasts. Additionally, you can receive them via a modem using either a wired or wireless connection. By connecting to a line communication network, one-way (sender to receiver) or bidirectional communication is possible. It is also possible to communicate information in a direction (between a sender and receiver, or between receivers). ru.

[0434] Figure 18B shows an example of a notebook personal computer. The computer 7200 consists of a chassis 7211, a keyboard 7212, and a pointing device 721. 3. It has external connection ports 7214, etc. The display unit 7000 is incorporated into the housing 7211. It is.

[0435] The display device shown in Embodiment 2 can be applied to the display unit 7000.

[0436] Figures 18C and 18D show examples of digital signage.

[0437] The digital signage 7300 shown in Figure 18C consists of a housing 7301, a display unit 7000, and a screen. It has a Pika 7303, etc. Furthermore, it has an LED lamp, an operation key (power switch, or operation key). It may include a switch, connection terminals, various sensors, a microphone, etc.

[0438] Figure 18D shows a digital signage 7400 mounted on a cylindrical column 7401. The digital signage 7400 has a display unit 7000 that is installed along the curved surface of the column 7401. do.

[0439] In Figures 18C and 18D, the display unit 7000 is fitted with the display device shown in Embodiment 2. It is possible.

[0440] The larger the display area 7000, the more information can be provided at once. The wider the area (7000), the more easily it catches people's attention, which can, for example, enhance the effectiveness of advertising. Cut.

[0441] By applying a touch panel to the display unit 7000, images or videos can be displayed on the display unit 7000. It's desirable that it not only displays information but also allows users to operate it intuitively. Also, route information... Alternatively, if used for purposes such as providing traffic information, intuitive operation is possible. This can improve usability.

[0442] Furthermore, as shown in Figures 18C and 18D, the digital signage 7300 or digital signage Inage 7400 is an information terminal 7311 or a smartphone owned by the user. It is preferable that the information terminal 7411 can be linked via wireless communication. For example, the display unit 7 Information about the advertisement displayed at 000 is shown on the screen of information terminal 7311 or information terminal 7411. It can be displayed on the information terminal 7311 or the information terminal 7411. This allows you to switch the display on the 7000 display unit.

[0443] In addition, the information terminal 7 is connected to the digital signage 7300 or digital signage 7400. Execute a game using the screen of either the 311 or the information terminal 7411 as the control device (controller). It is also possible to allow this. This allows a large number of users to participate in the game simultaneously and enjoy it. It is possible.

[0444] The electronic equipment shown in Figures 19A to 19F consists of a housing 9000, a display unit 9001, and a speaker 900. 3. Operation key 9005 (including power switch or operation switch), connection terminal 9006 Sensor 9007 (force, displacement, position, velocity, acceleration, angular velocity, rotational speed, distance, light, liquid, magnetism) Air, temperature, chemical substances, sound, time, hardness, electric field, electric current, voltage, power, radiation, flow rate, humidity (including functions to measure tilt, vibration, odor or infrared radiation), Microphone 900 8, etc.

[0445] The electronic devices shown in Figures 19A to 19F have various functions. For example, they can display various types of information (static Features include the ability to display images, videos, text, etc. on the display unit, a touch panel function, and a calendar. Functions that display the date or time, etc., processed by various software (programs). Functions to control, wireless communication functions, and reading programs or data recorded on recording media. It may have functions to extract and process data, etc. However, the functions of electronic devices are not limited to these. Furthermore, it can have various functions. Electronic devices may have multiple display units. Furthermore, cameras and other devices are installed in electronic equipment to capture still images and videos, and the recording media (external or camera) It may have functions such as saving to the built-in storage unit and displaying the captured image on the display unit. stomach.

[0446] The details of the electronic equipment shown in Figures 19A to 19F will be explained below.

[0447] Figure 19A is a perspective view showing the personal digital assistant 9101. The personal digital assistant 9101 is, for example, It can be used as a smartphone. Note that the mobile information terminal 9101 has a speaker. 9003, connection terminal 9006, sensor 9007, etc. may be provided. Also, portable information terminal 9 101 can display text and image information on its multiple surfaces. Figure 19A shows three This shows an example of displaying icon 9050. It also shows information 9051, indicated by a dashed rectangle. The display unit 9001 can also be displayed on other sides. An example of information 9051 is electronic mail. Notifications of incoming calls, SNS messages, and phone calls; subject, sender name, and date / time for emails and SNS messages. This includes the time, battery level, and antenna signal strength. Alternatively, information 9051 may be displayed. You may display icons such as icon 9050 in the designated area.

[0448] Figure 19B is a perspective view showing the personal digital assistant 9102. The personal digital assistant 9102 displays It has the function of displaying information on three or more sides of section 9001. Here, information 9052, information 9 This shows an example where information 053 and 9054 are displayed on different sides. For example, the user With the mobile information terminal 9102 stored in the breast pocket of his clothing, the mobile information terminal 9102 Information 9053, displayed in a position that can be observed from above, can also be viewed by the user. Without taking the 9102 personal digital assistant out of your pocket, you can check the display and, for example, answer a phone call. It allows you to decide whether or not to do it.

[0449] Figure 19C is a perspective view showing a wristwatch-type personal information terminal 9200. Personal information terminal 920 0 can be used, for example, as a smartwatch. Also, the display unit 9001 is The display surface is curved, allowing the display to follow the curved surface. The wireless information terminal 9200 communicates with, for example, a wireless headset. It also allows for hands-free calling. Furthermore, the mobile information terminal 9200 has a connection terminal 90 With 06, it is also possible to transmit data to other information terminals and to charge them. Charging may also be performed via wireless power transfer.

[0450] Figures 19D to 19F are perspective views showing a foldable portable information terminal 9201. Figure 19D shows the mobile information terminal 9201 in its unfolded state, Figure 19F shows it in its folded state, Figure 19 Figure E is a perspective view showing the transitional state from one of Figure 19D to the other. The 9201 terminal offers excellent portability when folded and a wide, seamless design when unfolded. The display area provides excellent readability. The display unit 9001 of the portable information terminal 9201 is It is supported by three housings 9000 connected by hinges 9055. For example, the table The indicated portion 9001 can be bent with a radius of curvature of 0.1 mm or more and 150 mm or less.

[0451] This embodiment can be combined with other embodiments as appropriate. [Explanation of Symbols]

[0452] C1: Capacitance, C2: Capacitance, L1: Shortest distance, L2: Shortest distance, M1: Transistor, M2 : Transistor, M3: Transistor, M4: Transistor, M5: Transistor, M6 : Transistor, M7: Transistor, OUT1: Wiring, OUT2: Wiring, PIX1: Image Basic circuit, PIX2: Pixel circuit, V1: Wiring, V2: Wiring, V3: Wiring, V4: Wiring, V5 :Wiring, 10:Device, 10A:Device, 10B:Device, 11:Control Unit, 12: Display unit, 13: Storage unit, 21: Detection unit, 21A: Detection unit, 21B: Detection unit, 24: Finger, 2 5: First finger, 26: Fingerprint information, 27: Fingerprint information, 27A: Fingerprint information, 27B: Fingerprint information 28: Second finger, 29: Fingerprint information, 30: Electronic device, 31: Display unit, 35: Image, 40 :Electronic device, 40A:Electronic device, 40B:Electronic device, 41:Display section, 41A:Display section, 4 1B: Display unit, 41C: Display unit, 42: Input unit, 43: Input keys, 44: Enclosure, 45: Box Body, 46: Hinge part, 100A: Display device, 100B: Display device, 100C: Display device, 100D: Display device, 100E: Display device, 110: Photodetector, 112: Common layer, 114 : Common layer, 115: Common electrode, 116: Protective layer, 121: Light emission, 121B: Light, 121G :Light, 121R:Light, 122:Light, 123:Light, 123a:Stray light, 123b:Stray light, 12 4: Reflected light, 131: Transistor, 132: Transistor, 142: Adhesive layer, 151: Substrate, 152: Substrate, 153: Substrate, 154: Substrate, 155: Adhesive layer, 156: Adhesive layer, 157: Insulating layer, 158: Light-shielding layer, 159: Resin layer, 159p: Opening, 162: Display section, 164: Circuit, 165: Wiring, 166: Conductive layer, 167: Conductive layer, 169: Conductive layer, 17 2: FPC, 173: IC, 182: Buffer layer, 183: Active layer, 184: Buffer layer ,190: light-emitting element, 190B: light-emitting element, 190G: light-emitting element, 190R·PD: receiver / emitting element Optical element, 190R: light-emitting element, 191: pixel electrode, 192: buffer layer, 192B: buffer 192G: Buffer layer, 192R: Buffer layer, 193: Light-emitting layer, 193B: Light-emitting layer Light layer, 193G: Emitting layer, 193R: Emitting layer, 194: Buffer layer, 194B: Buffer Layer, 194G: Buffer layer, 194R: Buffer layer, 200A: Display device, 200B: Surface Display device, 201: substrate, 202: finger, 203: layer having a light-receiving element, 204: light-receiving element 205: Functional layer, 207: Layer having light-emitting element, 208: Stylus, 20 9: Substrate, 211: Insulating layer, 212: Insulating layer, 213: Insulating layer, 214: Insulating layer, 214 a: insulating layer, 214b: insulating layer, 215: insulating layer, 216: partition wall, 219a: light-shielding layer, 2 19b: Spacer, 221: Conductive layer, 222a: Conductive layer, 222b: Conductive layer, 223: Conductive 225: Insulating layer, 228: Region, 231: Semiconductor layer, 231i: Channel formation region 231n: Low resistance region, 240: Transistor, 241: Transistor, 242: Connection Layer, 243: Transistor, 244: Connector, 245: Transistor, 246: Trans Sta, 247: Transistor, 248: Transistor, 249: Transistor, 252: Transistor, 261: Contact area, 262: Fingerprint, 263: Imaging area, 266: Trajectory, 27 0B: Light-emitting element, 270G: Light-emitting element, 270PD: Photodetector, 270R·PD: Light-receiving element Element, 270R: light-emitting element, 271: pixel electrode, 273: active layer, 275: common electrode, 2 80A: Display device, 280B: Display device, 280C: Display device, 281: Hole injection layer, 2 82: Hole transport layer, 283: Emitting layer, 283B: Emitting layer, 283G: Emitting layer, 283R: Light emitting layer, 284: Electron transport layer, 285: Electron injection layer, 6500: Electronic device, 6501: Housing Body, 6502: Display unit, 6503: Power button, 6504: Button, 6505: Speaker 6506: Microphone, 6507: Camera, 6508: Light source, 6510: Protective component, 651 1: Display panel, 6512: Optical component, 6513: Touch sensor panel, 6515: FP C, 6516: IC, 6517: Printed circuit board, 6518: Battery, 7000: Display unit 7100: Television equipment, 7101: Enclosure, 7103: Stand, 7111: Remote Computer control unit, 7200: Notebook personal computer, 7211: Enclosure, 7212: Keyboard, 7213: Pointing device, 7214: External connection port, 7300 : Digital signage, 7301: Enclosure, 7303: Speaker, 7311: Information terminal, 7400: Digital signage, 7401: Pillar, 7411: Information terminal, 9000: Enclosure 9001: Display unit, 9003: Speaker, 9005: Operation keys, 9006: Connection terminals, 9007: Sensor, 9008: Microphone, 9050: Icon, 9051: Information 9052: Information, 9053: Information, 9054: Information, 9055: Hinge, 9101: Mobile Information terminal, 9102: Mobile information terminal, 9200: Mobile information terminal, 9201: Mobile information terminal

Claims

[Claim 1] Electronic device having a display unit, The display unit has pixels, The aforementioned pixel comprises a light-emitting element and a light-receiving element. The light-emitting element and the light-receiving element are provided on the same plane. The light-emitting element has a laminated structure in which a first electrode, a common layer, a light-emitting layer, and a common electrode are stacked. The light-receiving element has a laminated structure in which a second electrode, the common layer, an active layer, and the common electrode are stacked. The light-emitting layer and the active layer each contain different organic compounds. The first electrode and the second electrode are provided spaced apart on the same plane. The common electrode is provided covering the light-emitting layer and the active layer, The common layer is provided covering the first electrode and the second electrode. electronic equipment.

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