Object detection device

Abstract

To provide an object detection device that suppresses a decrease in detection performance and can be miniaturized. [Solution] The object detection device 100 of the present disclosure comprises a housing 10, a millimeter-wave radar device that transmits and receives millimeter-wave radio waves, a camera device positioned below the millimeter-wave radar device, a radome 20 attached to the housing 10 that covers the millimeter-wave radar device from the front, which is the direction of irradiation of millimeter-wave radio waves by the millimeter-wave radar device, and has a first inclined portion 22 that is inclined downward and rearward including an intersection portion that intersects with the field of view of the millimeter-wave radar device, and a second inclined portion 23 connected below the first inclined portion 22 and further inclined downward and rearward relative to the first inclined portion 22, and a camera cover 90 attached to the second inclined portion 23 that covers the camera device from the front.

Description

Technical Field

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[0001] This disclosure relates to an object detection device.

Background Art

[0002] As a conventional object detection device, Patent Document 1 discloses a device including a millimeter-wave radar device, an infrared sensor, and a camera arranged in a column in the vertical direction, and a cover that covers these from the front, which is the irradiation direction of the millimeter-wave radar, and the cover is curved so as to bulge forward.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described conventional object detection device, since the portion of the cover located in front of the millimeter-wave radar is inclined upward, the cover is easily damaged by flying objects from above, and there is a problem that the detection performance of the millimeter-wave radar deteriorates.

[0005] This disclosure has been made to solve the above problems, and an object thereof is to provide an object detection device that suppresses a decrease in detection performance and can be miniaturized.

Means for Solving the Problems

[0006] A housing, A millimeter-wave radar device attached to the housing for transmitting and receiving millimeter-wave radio waves, A camera device disposed below the millimeter-wave radar device and attached to the housing, A radome, which is attached to the housing, covers the millimeter-wave radar device from the front, which is the direction of irradiation of millimeter-wave radio waves by the millimeter-wave radar device, and has a first inclined portion whose intersection with the field of view of the millimeter-wave radar device is inclined downward and rearward, and a second inclined portion connected below the first inclined portion and further inclined downward and rearward with respect to the first inclined portion, A camera cover attached to the second inclined section and covering the camera device from the front, An object detection device equipped with the following features. [Effects of the Invention]

[0007] The object detection device of this disclosure can suppress a decrease in detection performance and can be miniaturized. [Brief explanation of the drawing]

[0008] [Figure 1] This figure shows an example of how to use an object detection device. [Figure 2] This is a cross-sectional view of the object detection device in Embodiment 1. [Figure 3] This is a perspective view of an object detection device. [Figure 4] This is a side view of the object detection device. [Figure 5] This is a perspective view of the enclosure. [Figure 6] This is a diagram simulating the layout of a circuit board. [Figure 7] This is a flowchart showing the operation of the object detection device. [Figure 8] This is a cross-sectional view of an object detection device with a different radome inclination. [Figure 9] This is a side view of an object detection device with a different radome inclination. [Figure 10] This is a diagram illustrating the wiring. [Figure 11] This is a cross-sectional view of the object detection device in Embodiment 2. [Figure 12] This is a cross-sectional view of the object detection device in Embodiment 3. [Figure 13] This is a cross-sectional view of the object detection device in Embodiment 4. [Figure 14]Cross-sectional view of the object detection device in Embodiment 5. [Figure 15] Cross-sectional view of the object detection device in Embodiment 6. [Figure 16] Cross-sectional view of the object detection device in Embodiment 7. [Figure 17] Cross-sectional view of the object detection device in Embodiment 8. [Figure 18] Cross-sectional view of the object detection device in Embodiment 9. [Figure 19] Cross-sectional view of the object detection device in Embodiment 10. [Figure 20] Cross-sectional view of the object detection device in Embodiment 11. [Figure 21] Cross-sectional view of the object detection device in Embodiment 12. [Figure 22] Cross-sectional view of the object detection device in Embodiment 13.

Embodiments for Carrying out the Invention

[0009] As sensors for collision prevention mounted on a vehicle, millimeter-wave radar, cameras, lasers, and infrared devices are used. When mounting the sensors on construction machinery, resistance to flying objects such as small stones generated at the construction site from above is important. The object detection device of the present disclosure suppresses the collision of flying objects mainly from above with the radome covering the millimeter-wave radar or the camera cover covering the camera when mounted on construction machinery as a collision prevention sensor. That is, it suppresses the deterioration of detection performance due to damage to the radome or camera cover and can be miniaturized.

[0010] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following description, the same reference numerals are assigned to and illustrated for similar components, and their names and functions are also the same or similar. Therefore, detailed descriptions thereof may be omitted.

[0011] Embodiment 1. ***Description of the Configuration*** The configuration of the object detection device 100 in Embodiment 1 will now be described. Figure 1 shows an example of how the object detection device 100 is used. As shown in Figure 1, the object detection device 100 is used by attaching it to the front or rear of the construction machine 200. In Figure 1, the object detection device 100 is attached to the rear of the construction machine 200.

[0012] Figure 2 is a cross-sectional view of the object detection device 100 in Embodiment 1. The object detection device 100 comprises a housing 10, a radome 20, a high-frequency circuit board 30, an antenna circuit board 40, a camera 50, a camera circuit board 60, a signal processing circuit board 70, a power supply circuit board 80, and a camera cover 90.

[0013] Hereafter, the high-frequency substrate 30 and the antenna substrate 40 will be collectively referred to as the millimeter-wave device. The camera 50 and the camera substrate 60 will be collectively referred to as the camera device. In Figure 2, the dashed lines indicate the upper or lower edge of the field of view of the millimeter-wave radar device or the camera device. In Figure 2, the x-direction, i.e., the radar irradiation direction of the millimeter-wave radar device, will be referred to as the forward direction.

[0014] Figure 3 is a perspective view of the object detection device 100. Figure 4 is a side view of the object detection device 100. As shown in Figures 2, 3, and 4, a radome 20 is attached to the front of the housing 10. In Figures 2, 3, 4, and Figure 5 (described later), points A and B indicate corresponding points on the housing 10. A camera cover 90 is attached to the lower part of the radome 20.

[0015] The housing 10 is fixed to a vehicle, including construction machinery, via fasteners (e.g., brackets). Heat generated from the internal components of the housing 10 is dissipated from the housing 10 into the air and fasteners (not shown).

[0016] The housing 10 is made of, for example, an aluminum alloy, glass fiber reinforced resin and shield plating, or carbon fiber reinforced resin. If the housing 10 is made of an aluminum alloy, it may be manufactured by die casting or other casting methods, or by a metal 3D printer. If the housing 10 is made of resin, it may be manufactured by injection molding or a 3D printer.

[0017] Figure 5 is a perspective view of the housing 10. The housing 10 is a box-shaped structure with an open front and has a substrate mounting surface 11 inside. The substrate mounting surface 11 includes a high-frequency substrate mounting surface 11a, a camera substrate mounting surface 11b, a connection surface 11c, and a connection surface 11d.

[0018] The high-frequency substrate mounting surface 11a is a flat plate and is positioned approximately perpendicular to the ground. The camera substrate mounting surface 11b is a flat plate and is positioned at an angle to the rear and downward relative to the high-frequency substrate mounting surface 11a. The top surface of the housing 10 is connected to the high-frequency substrate mounting surface 11a. The lower part of the high-frequency substrate mounting surface 11a and the upper part of the camera substrate mounting surface 11b are connected by a connecting surface 11c. The lower part of the camera substrate mounting surface 11b and the bottom surface of the housing 10 are connected by a connecting surface 11d. In other words, the housing 10 has a storage section, which is a closed space behind the substrate mounting surface 11, and an open section, which is in front of the substrate mounting surface 11.

[0019] Furthermore, the high-frequency board mounting surface 11a is provided with a wiring port 12a for connecting the high-frequency board 30 and the signal processing board 70. The camera board mounting surface 11b is provided with a wiring port 12b for connecting the camera board 60 and the signal processing board 70. The position and shape of the wiring ports 12a and 12b shall be determined by other design specifications.

[0020] The radome 20 is watertightly attached to the opening of the housing 10 and protects the internal components. As shown in Figures 2, 3, and 4, the radome 20 has an upper connecting portion 21, a first inclined portion 22, a second inclined portion 23, and a lower connecting portion 24. In the object detection device 100, the upper connecting portion 21, the first inclined portion 22, the second inclined portion 23, and the lower connecting portion 24 are each flat plates and are integrally formed.

[0021] The upper connection section 21 is connected at one end to the upper part of the housing 10 and at the other end to the first inclined section 22. The first inclined section 22 is connected at one end to the upper connection section 21 and at the other end to the second inclined section 23. The 23 is connected at one end to the first inclined section 22 and at the other end to the second inclined section 23. The lower connection section 24 is connected at one end to the second inclined section 23 and at the other end to the lower part of the housing 10. In other words, in the radome 20, the upper connection section 21, the first inclined section 22, the second inclined section 23, and the lower connection section 24 are arranged in order from top to bottom.

[0022] The first inclined section 22 is inclined downward and rearward. The first inclined section 22 also includes an intersection section 25 that intersects with the field of view of the millimeter-wave device. That is, the upper end of the field of view of the millimeter-wave device intersects with the upper end of the intersection section 25. Also, the lower end of the field of view of the millimeter-wave device intersects with the lower end of the intersection section 25. Figure 3 illustrates the case where the intersection section 25 is rectangular in shape. Note that the shape of the intersection section 25 may be other shapes.

[0023] The second inclined section 23 is inclined further rearward and downward relative to the first inclined section 22. In the object detection device 100, the angle between the vertical direction and the second inclined section 23 is 15 degrees or more greater than the angle between the vertical direction and the first inclined section 22. Furthermore, the second inclined section 23 has a cutout 26 for attaching the camera cover 90.

[0024] Furthermore, as shown in Figure 4, the connection between the lower connection part 24 and the housing 10 is inclined downward and rearward from the connection between the upper connection part 21 and the housing 10.

[0025] Furthermore, the radome 20 may have any other shape as long as it covers the millimeter-wave radar device from the front, which is the direction of irradiation of millimeter-wave radio waves by the millimeter-wave radar device, and has a first inclined section 22 inclined downward and rearward at an intersection 25 that intersects with the field of view of the millimeter-wave radar device, and a second inclined section 23 connected below the first inclined section 22 and further inclined downward and rearward relative to the first inclined section 22.

[0026] For example, the radome 20 may have an upper connecting portion 21, a first inclined portion 22, a second inclined portion 23, and a lower connecting portion 24 integrally formed with curved surfaces, covering the millimeter-wave radar device from the front, which is the direction of irradiation of millimeter-wave radio waves by the millimeter-wave radar device, and having a first inclined portion 22 that is inclined downward and rearward at an intersection portion 25 that intersects with the field of view of the millimeter-wave radar device, and a second inclined portion 23 that is connected below the first inclined portion 22 and is inclined further downward and rearward with respect to the first inclined portion 22.

[0027] Furthermore, the radome 20 may not include a configuration corresponding to the upper connection portion 21 or the lower connection portion 24, and the upper part of the first inclined portion 22 may be connected to the upper part of the housing 10, and the lower part of the second inclined portion 23 may be connected to the lower part of the housing 10.

[0028] The radome 20 is made of, for example, PBT-GF30, which is a material synthesized from polybutylene terephthalate with 30% glass fibers, or PC (polycarbonate). The radome 20 may be manufactured by injection molding. In millimeter-wave radar, irregularities in the radio wave transmission surface have a significant impact on detection performance, so injection molding is more suitable for the radome 20 than manufacturing by a 3D printer.

[0029] In the object detection device 100, the high-frequency circuit board 30, antenna circuit board 40, camera 50, and camera circuit board 60 are housed in the space formed by the open section of the housing 10, the radome 20, and the camera cover 90. In addition, the signal processing circuit board 70 and power supply circuit board 80 are housed in the housing section of the housing 10 and are electromagnetically shielded. Since the housing 10 and the radome 20 are connected at the outer circumference to form an integrated unit, each component housed inside is protected from dust and water.

[0030] The high-frequency circuit board 30 generates millimeter-wave radio waves and transmits them to the antenna circuit board 40. The high-frequency circuit board 30 also processes the millimeter-wave radio waves received by the antenna circuit board 40 internally. The high-frequency circuit board 30 is a printed circuit board equivalent to FR-4. The high-frequency circuit board 30 may also use MEGTRON6, MEGTRONX, or XPEDION, which are substrate materials with lower dielectric constants than FR-4 (MEGTRON and XPEDION are registered trademarks).

[0031] The antenna substrate 40 transmits millimeter-wave radio waves generated by the high-frequency substrate 30 through the radome 20 and also receives reflected waves. The antenna substrate 40 is made of LCP (liquid crystal polymer), PTEE (polytetrafluoroethylene), and other low dielectric constant materials. In short, the millimeter-wave device is a device that generates and transmits millimeter-wave radio waves, receives reflected waves, and processes them internally.

[0032] Camera 50 collects light from around the vehicle on which the object detection device 100 is mounted. Camera 50 includes a lens 51, a lens barrel 52 connected to the lens 51, and a holder 53 that fixes camera 50 to camera substrate 60.

[0033] The lens 51 is made of glass or resin. Multiple lenses 51 may be housed within the lens barrel 52. The lens barrel 52 is made of, for example, an aluminum alloy. The holder 53 is made of, for example, an aluminum alloy or resin. To suppress unwanted reflections, it is desirable that the parts of the camera 50 excluding the lens 51 be given a black surface treatment.

[0034] The camera board 60 receives light captured by the camera 50 with a photodetector to acquire an image signal and convert it into an electrical signal. The photodetector is mounted on the camera board 60 on the mounting surface of the camera 50 and on the central axis of the lens 51. The camera board 60 is made of a printed circuit board equivalent to, for example, FR-4. In other words, the camera device receives light from the surroundings of the vehicle on which the object detection device 100 is mounted and converts the acquired image signal into an electrical signal.

[0035] The signal processing board 70 is connected to the high-frequency board 30 and the camera board 60, and performs fusion processing on the received signals from the millimeter-wave radar device and the image signals from the camera device. Fusion processing is the process of integrating information about objects around the vehicle obtained by the millimeter-wave radar device with information about those objects in the image obtained by the camera device. The information about objects obtained by the millimeter-wave radar device is, for example, the object's position, velocity, and reflectivity. The information about objects obtained by the camera device is, for example, the object's position, shape, and color. The camera device may also identify the type of object from its shape or color.

[0036] In the fusion process, the signal processing board 70 uses the positions of the objects detected by the millimeter-wave radar system and the camera system to determine whether the object detected by the millimeter-wave radar system and the object detected by the camera system are the same. If they are determined to be the same, the information obtained by the millimeter-wave radar system and the camera system is associated for each object. If they are determined not to be the same, the information obtained by either the millimeter-wave radar system or the camera system is associated for that object. The information that has been fused and associated with an object and the information obtained by the millimeter-wave radar system or the camera system for that object is called fusion information. The signal processing board 70 is, for example, a printed circuit board equivalent to FR-4.

[0037] The power supply board 80 is electrically connected to the signal processing board 70 and the power supply outside the housing 10. The power supply board 80 converts the voltage supplied from the power supply and supplies power to the signal processing board 70. The power supply board 80 also outputs the fusion information and image signals generated by the signal processing board 70 to the outside of the housing 10. The power supply board 80 is, for example, a printed circuit board equivalent to FR-4.

[0038] The camera cover 90 is attached to the radome 20 so as to cover the field of view of the camera 50. The camera cover 90 is made of, for example, glass, PC (polycarbonate), acrylic, or other visible light-transmitting material. In Embodiment 1, the camera cover 90 is a flat plate.

[0039] Figure 6 is a diagram illustrating the layout of the circuit boards. The high-frequency circuit board 30, antenna circuit board 40, signal processing circuit board 70, and power supply circuit board 80 are arranged approximately perpendicular to the ground. The camera circuit board 60 is positioned so that its lower part is tilted backward relative to the high-frequency circuit board 30. That is, in the camera circuit board 60, the central axis that coincides with the optical axis of the lens 51 is tilted downward from a direction horizontal to the ground.

[0040] As shown in Figures 2 and 6, the high-frequency substrate 30 is positioned between the first inclined portion 22 and the high-frequency substrate mounting surface 11a, and is mounted on the high-frequency substrate mounting surface 11a. The antenna substrate 40 is mounted in front of the high-frequency substrate 30. In other words, the millimeter-wave device is mounted on the high-frequency substrate mounting surface 11a of the housing 10. Here, care is taken to ensure that the first inclined portion 22 and the high-frequency substrate 30 are not parallel in order to prevent multiple reflections of radio waves between the antenna substrate 40 and the radome 20.

[0041] The camera 50 is positioned below the high-frequency substrate 30 and the antenna substrate 40, that is, below the millimeter-wave device, between the second inclined section 23 and the camera substrate mounting surface 11b. In this case, the optical axis of the lens 51 of the camera 50 is tilted downward from a direction horizontal to the ground. This is because, when detecting objects in front of and below the vehicle, if the millimeter-wave device is tilted downward, it will receive reflected waves from the ground, so the camera 50 is used to image the area below.

[0042] A camera circuit board 60 is mounted behind the holder 53 of the camera 50. The camera circuit board 60 is mounted on the camera circuit board mounting surface 11b. In other words, the camera device is mounted on the camera circuit board mounting surface 11b of the housing 10.

[0043] The signal processing board 70 is located above the camera board 60 and behind the board mounting surface 11. The power supply board 80 is located behind the signal processing board 70 and the camera board 60.

[0044] The camera cover 90 is attached to the cutout 26 of the radome 20 and covers the camera device from the front.

[0045] ***Explanation of operation*** The operation of the object detection device 100 will be explained using Figure 7. Figure 7 is a flowchart of the operation of the object detection device 100. In ST1, the high-frequency board 30 generates millimeter-wave radio waves and transmits them to the antenna board 40. In ST2, the antenna board 40 transmits the millimeter-wave radio waves generated by the high-frequency board 30 through the radome 20. In ST3, the antenna board 40 receives the reflected waves through the radome 20. In ST4, the high-frequency board 30 processes the reflected waves received by the antenna board 40 internally, converts them into an electrical signal, and transmits it to the signal processing board 70.

[0046] In ST5, camera 50 collects light from around the vehicle. In ST6, camera board 60 acquires an image signal from the light received by camera 50. In ST7, camera board 60 converts the image signal into an electrical signal and transmits it to signal processing board 70. Here, ST1 to ST4 and ST5 to ST7 operate in parallel.

[0047] At ST8, the signal processing board 70 fuses the electrical signal received at ST4 with the electrical signal received at ST7 and transmits it to the power supply board 80. At ST9, the power supply board 80 outputs the fusion information to an external device.

[0048] ***Explanation of Effects*** Thus, Cabinet 10 and A millimeter-wave radar device is mounted on the aforementioned housing 10 and transmits and receives millimeter-wave radio waves, A camera device is positioned below the millimeter-wave radar device and mounted on the housing 10, A radome 20, which is attached to the housing, covers the millimeter-wave radar device from the front, which is the direction of irradiation of millimeter-wave radio waves by the millimeter-wave radar device, and has a first inclined portion 22 whose intersection portion 25 intersecting the field of view of the millimeter-wave radar device is inclined downward and rearward, and a second inclined portion 23 connected below the first inclined portion 22 and inclined further downward and rearward relative to the first inclined portion 22, A camera cover 90 is attached to the second inclined portion 23 and covers the camera device from the front, The object detection device 100, which includes the following, The first inclined portion 22 of the radome 20, including the intersection portion 25 that intersects with the field of view of the millimeter-wave radar, is inclined downward and rearward, so that the field of view of the millimeter-wave radar device is inclined downward and rearward. This suppresses damage to the radome 20 within the field of view of the millimeter-wave radar device by flying objects in front of it, and suppresses a decrease in detection performance.

[0049] Furthermore, the object detection device 100 is connected below the first inclined section 22, and the camera cover 90 is attached to the second inclined section 23, which is inclined further rearward and downward than the first inclined section 22. In other words, the camera cover 90 is inclined further rearward and downward relative to the first inclined section 22. This prevents the camera cover 90 from being damaged by flying objects in front and suppresses a decrease in detection performance.

[0050] Furthermore, because the second inclined section 23 and the camera cover 90 are inclined downward and rearward, the camera device is less likely to be exposed to direct sunlight, thus suppressing a decrease in detection performance due to backlighting.

[0051] In addition, generally, the camera device is positioned to face the camera cover 90 in order to suppress unwanted reflections. Furthermore, since the constraints regarding the transparency of the radome 20 or camera cover 90 differ between the field of view of the millimeter-wave device and the field of view of the camera device, the intersection portion 25 of the radome 20 that intersects with the field of view of the millimeter-wave device and the camera cover 90, i.e., the cutout portion 26 to which the camera cover 90 is attached, must be positioned at a distance from each other.

[0052] Figure 8 is a cross-sectional view of an object detection device with different inclinations of the radome 20. Figure 8(a) shows the object detection device 100. Figure 8(b) shows an object detection device in which the inclinations of the first inclined section 22 and the second inclined section 23 are the same as the inclination of the first inclined section 22 in the object detection device 100. Figure 8(c) shows an object detection device with a larger housing 10 and radome 20. In Figure 8, dotted line A indicates the lower end of the object detection device 100. Also, dotted line B indicates the lower end of the enlarged object detection device.

[0053] As shown in Figure 8(b), when the inclination of the first inclined section 22 and the second inclined section 23 are the same, the field of view of the millimeter-wave device and the upper edge of the mounting position of the camera cover 90 are closer together compared to when the inclinations are different. In Figure 8(b), the field of view of the millimeter-wave device and the upper edge of the mounting position of the camera cover 90 coincide.

[0054] As described above, the intersection portion 25 that intersects with the field of view of the millimeter-wave device in the radome 20 and the camera cover 90 need to be positioned separately. Therefore, if the inclination of the first inclined portion 22 and the second inclined portion 23 is the same, the housing 10 and the radome 20 need to be larger than the object detection device 100, as shown in Figure 8(c). In other words, the object detection device 100 can be made smaller compared to the case where the inclinations are the same because the second inclined portion 23 is inclined further rearward and downward relative to the first inclined portion 22.

[0055] Furthermore, when the radome 20 is formed by injection molding, in the case of an object detection device 100 inclined downward and rearward from the connection between the upper connection part 21 and the housing 10 to the connection between the lower connection part 24 and the housing 10, it is possible to achieve a smaller size compared to the case where the connection parts are approximately vertical, i.e., approximately parallel to the antenna substrate 40.

[0056] Figure 9 is a side view of the object detection device 100 with different inclinations of the radome 20. Figure 9(a) shows the object detection device 100. Figure 9(b) shows the object detection device when the connection points are approximately vertical.

[0057] When the radome 20 is formed by injection molding, a draft angle is required. For example, the angle between the upper connection portion 21 and the first inclined portion 22 of the radome 20, and the angle between the second inclined portion 23 and the lower connection portion 24 must be 90 degrees or more.

[0058] Therefore, as shown in Figure 9(b), if the connection between the upper connection part 21 and the housing 10 is approximately vertical from the connection between the lower connection part 24 and the housing 10, the radome 20 and housing 10 of the object detection device 100 will be extended. In other words, the object detection device 100 can be made smaller compared to the case where the connection between the parts is approximately vertical.

[0059] Furthermore, generally speaking, the material for the radome 20 is more expensive than the material for the housing 10. Therefore, the object detection device 100, which has a smaller radome 20 compared to an object detection device where the connection points are approximately vertical, has the effect of reducing overall costs.

[0060] In addition, the object detection device 100 has a camera device installed below the millimeter-wave radar device. This reduces the difference in length between two adjacent sides on the power supply board 80 of the same area compared to when the millimeter-wave radar device and the camera device are placed adjacent to each other on the left and right, thereby increasing the flexibility of wiring.

[0061] Figure 10 shows schematic diagrams of wiring on (a) a horizontally oriented circuit board and (b) a circuit board that is close to a square shape. In Figure 10, wiring is routed from connector 81 to components 82a, 82b, 82c, 82d, 82e, 82f, 82g, 82h, 82i, and component group 83. Component group 83 is a collection of components that have constraints on their arrangement.

[0062] However, in Figure 10(a), due to the constraints of the vertical space of component group 83, the connector 81 is not connected to component 82h and component 82i. To connect component 82h and component 82i to connector 81, for example, the circuit board would need to be multilayered. On the other hand, in Figure 10(b), the vertical space of component group 83 is larger than in Figure 10(a), allowing for the placement of components and wiring, and enabling the connection of all components to the connector.

[0063] In this way, by installing the camera device below the millimeter-wave radar device, the difference in length between two adjacent sides on the power supply board 80 is reduced, resulting in greater wiring flexibility compared to when the millimeter-wave radar device and camera device are placed adjacent to each other on the left and right. In addition, the reduced distance between components allows for a smaller power supply board 80.

[0064] In addition, the object detection device 100 of Embodiment 1 has a flat camera cover 90. This makes it possible to reduce costs compared to when the camera cover 90 is configured as a dome shape.

[0065] Furthermore, in the object detection device 100, the high-frequency circuit board 30, antenna circuit board 40, camera 50, camera circuit board 60, signal processing circuit board 70, and power supply circuit board 80 are housed in the space formed by the housing 10, radome 20, and camera cover 90, forming an integrated unit. Therefore, the object detection device 100 can be independently mounted outside the vehicle.

[0066] Embodiment 2. ***Explanation of the structure*** The configuration of the object detection device 100b of Embodiment 2 will be described with reference to Figure 11. Figure 11 is a cross-sectional view of the object detection device 100b. In Figure 11, the same reference numerals as in Figure 2 indicate equivalent components.

[0067] In the object detection device 100b, the camera board 60 and the signal processing board 70 are connected via a flexible section 71. At this time, a wiring port for the flexible section 71 is provided on the connection surface 11c of the board mounting surface 11. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100b is the same as that of the object detection device 100.

[0068] The flexible section 71 is a flexible rigid substrate and is manufactured integrally with the camera substrate 60 and the signal processing substrate 70. The flexible section 71 is made of, for example, polyimide and copper foil, or a polyimide-free substrate material equivalent to FR-4 and copper foil.

[0069] ***Explanation of Effects*** Even with the object detection device 100b configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0070] Furthermore, the camera board 60 and the signal processing board 70 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing costs can be reduced by manufacturing multiple boards as a single unit.

[0071] Embodiment 3. ***Explanation of the structure*** The configuration of the object detection device 100c of Embodiment 3 will be described with reference to Figure 12. Figure 12 is a cross-sectional view of the object detection device 100c. In Figure 7, the same reference numerals as in Figure 2 indicate equivalent components.

[0072] In the object detection device 100c, the signal processing board 70 and the power supply board 80 are connected via the flexible section 71. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100c is the same as that of the object detection device 100.

[0073] The flexible section 71 is a flexible rigid substrate and is manufactured integrally with the signal processing substrate 70 and the power supply substrate 80. The flexible section 71 is made of, for example, polyimide and copper foil, or a polyimide-free substrate material equivalent to FR-4 and copper foil.

[0074] ***Explanation of Effects*** Even with the object detection device 100c configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0075] Furthermore, the signal processing board 70 and the power supply board 80 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing costs can be reduced by manufacturing multiple boards as a single unit.

[0076] Embodiment 4. ***Explanation of the structure*** The configuration of the object detection device 100d of Embodiment 4 will be described with reference to Figure 13. Figure 13 is a cross-sectional view of the object detection device 100d. In Figure 13, the same reference numerals as in Figure 2 indicate equivalent components.

[0077] In the object detection device 100d, the high-frequency circuit board 30 and the signal processing circuit board 70 are connected via the flexible section 71. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100d is the same as that of the object detection device 100.

[0078] The flexible section 71 is a flexible rigid substrate and is manufactured integrally with the high-frequency substrate 30 and the signal processing substrate 70. The flexible section 71 is made of, for example, polyimide and copper foil, or a polyimide-free substrate material equivalent to FR-4 and copper foil.

[0079] ***Explanation of Effects*** Even with the object detection device 100d configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0080] Furthermore, the high-frequency circuit board 30 and the signal processing circuit board 70 are connected by a flexible section 71. This eliminates the need for connectors to connect the circuit boards, reducing the space required for component placement and cable routing on the circuit boards. In addition, manufacturing costs can be reduced by manufacturing multiple circuit boards as a single unit.

[0081] Embodiment 5. ***Explanation of the structure*** The configuration of the object detection device 100e according to Embodiment 5 will be described with reference to Figure 14. Figure 14 is a cross-sectional view of the object detection device 100e. In Figure 14, the same reference numerals as in Figure 2 indicate equivalent components.

[0082] In the object detection device 100e, the high-frequency circuit board 30, the camera circuit board 60, and the signal processing circuit board 70 are connected via a flexible section 71. At this time, a wiring port for the flexible section 71 is provided on the connection surface 11c of the circuit board mounting surface 11. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100e is the same as that of the object detection device 100.

[0083] The flexible section 71 is a flexible rigid substrate and is manufactured integrally with the high-frequency substrate 30, the camera substrate 60, and the signal processing substrate 70. The flexible section 71 is made of, for example, polyimide and copper foil, or a polyimide-free substrate material equivalent to FR-4 and copper foil.

[0084] ***Explanation of Effects*** Even with the object detection device 100e configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0085] Furthermore, the high-frequency board 30, camera board 60, and signal processing board 70 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing costs can be reduced by manufacturing multiple boards as a single unit.

[0086] Embodiment 6. ***Explanation of the structure*** The configuration of the object detection device 100f of Embodiment 6 will be described with reference to Figure 15. Figure 15 is a cross-sectional view of the object detection device 100f. In Figure 15, the same reference numerals as in Figure 2 indicate equivalent components.

[0087] In the object detection device 100f, the high-frequency circuit board 30, the signal processing circuit board 70, and the power supply circuit board 80 are connected via a flexible section 71. At this time, a wiring port for the flexible section 71 is provided on the connection surface 11c of the circuit board mounting surface 11. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100f is the same as that of the object detection device 100.

[0088] The flexible section 71 is a flexible rigid substrate and is manufactured integrally with the high-frequency substrate 30, the signal processing substrate 70, and the power supply substrate 80. The flexible section 71 is made of, for example, polyimide and copper foil, or a polyimide-free substrate material equivalent to FR-4 and copper foil.

[0089] ***Explanation of Effects*** Even with the object detection device 100f configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0090] Furthermore, the high-frequency board 30, the signal processing board 70, and the power supply board 80 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing costs can be reduced by manufacturing multiple boards as a single unit.

[0091] Embodiment 7. ***Explanation of the structure*** The configuration of the object detection device 100g of Embodiment 7 will be described with reference to Figure 16. Figure 16 is a cross-sectional view of the object detection device 100g. In Figure 16, the same reference numerals as in Figure 2 indicate equivalent components.

[0092] In the object detection device 100g, the camera board 60, the signal processing board 70, and the power supply board 80 are connected via a flexible section 71. At this time, a wiring port for the flexible section 71 is provided on the connection surface 11c of the board mounting surface 11. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100g is the same as that of the object detection device 100.

[0093] The flexible section 71 is a flexible rigid substrate and is manufactured integrally with the camera substrate 60, the signal processing substrate 70, and the power supply substrate 80. The flexible section 71 is made of, for example, polyimide and copper foil, or a polyimide-free substrate material equivalent to FR-4 and copper foil.

[0094] ***Explanation of Effects*** Even with the object detection device 100g configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0095] Furthermore, the camera board 60, signal processing board 70, and power supply board 80 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing multiple boards as a single unit reduces manufacturing costs.

[0096] Embodiment 8. ***Explanation of the structure*** The configuration of the object detection device 100h of Embodiment 8 will be described with reference to Figure 17. Figure 17 is a cross-sectional view of the object detection device 100h. In Figure 17, the same reference numerals as in Figure 2 indicate equivalent components.

[0097] In the object detection device 100h, the camera cover 90 is configured in a dome shape. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100h is the same as that of the object detection device 100.

[0098] ***Explanation of Effects*** Even with the object detection device 100h configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0099] Furthermore, in the object detection device 100h, since the camera cover 90 is configured in a dome shape, the field of view of the camera device is secured at 180 degrees around the optical axis, which allows for a wider field of view compared to when the camera cover 90 is a flat plate.

[0100] Embodiment 9. ***Explanation of the structure*** The configuration of the object detection device 100i of Embodiment 9 will be described with reference to Figure 18. Figure 18 is a cross-sectional view of the object detection device 100i. In Figure 18, the same reference numerals as in Figure 17 indicate equivalent components.

[0101] In the object detection device 100i, the camera board 60 and the signal processing board 70 are connected via a flexible section 71. At this time, a wiring port for the flexible section 71 is provided on the connection surface 11c of the board mounting surface 11. Other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100i is the same as that of the object detection device 100.

[0102] ***Explanation of Effects*** Even with the object detection device 100i configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0103] Furthermore, in the object detection device 100i, since the camera cover 90 is configured in a dome shape, the field of view of the camera device can be secured at 180 degrees around the optical axis, and the field of view can be widened compared to when the camera cover 90 is a flat plate.

[0104] Furthermore, the camera board 60 and the signal processing board 70 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing costs can be reduced by manufacturing multiple boards as a single unit.

[0105] Embodiment 10. ***Explanation of the structure*** The configuration of the object detection device 100j of Embodiment 10 will be described with reference to Figure 19. Figure 19 is a cross-sectional view of the object detection device 100j. In Figure 19, the same reference numerals as in Figure 17 indicate equivalent components.

[0106] In the object detection device 100j, the signal processing board 70 and the power supply board 80 are connected via the flexible section 71. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100j is the same as that of the object detection device 100.

[0107] ***Explanation of Effects*** Even with the object detection device 100j configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0108] Furthermore, in the object detection device 100j, since the camera cover 90 is configured in a dome shape, the field of view of the camera device can be secured at 180 degrees around the optical axis, thus widening the field of view compared to when the camera cover 90 is a flat plate.

[0109] Furthermore, the signal processing board 70 and the power supply board 80 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing costs can be reduced by manufacturing multiple boards as a single unit.

[0110] Embodiment 11. ***Explanation of the structure*** The configuration of the object detection device 100k of Embodiment 11 will be described with reference to Figure 20. Figure 20 is a cross-sectional view of the object detection device 100k. In Figure 20, the same reference numerals as in Figure 17 indicate equivalent components.

[0111] In the object detection device 100k, the high-frequency circuit board 30 and the signal processing circuit board 70 are connected via a flexible section 71. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100k is the same as that of the object detection device 100.

[0112] ***Explanation of Effects*** Even with the object detection device 100k configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0113] Furthermore, in the object detection device 100k, since the camera cover 90 is configured in a dome shape, the field of view of the camera device can be secured at 180 degrees around the optical axis, and the field of view can be widened compared to when the camera cover 90 is a flat plate.

[0114] Furthermore, the high-frequency board 30 and the signal processing board 70 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing costs can be reduced by manufacturing multiple boards as a single unit.

[0115] Embodiment 12. ***Explanation of the structure*** The configuration of the object detection device 100m of Embodiment 12 will be described with reference to Figure 21. Figure 21 is a cross-sectional view of the object detection device 100m. In Figure 21, the same reference numerals as in Figure 17 indicate equivalent components.

[0116] In the object detection device 100m, the high-frequency circuit board 30, the camera circuit board 60, and the signal processing circuit board 70 are connected via a flexible section 71. At this time, a wiring port for the flexible section 71 is provided on the connection surface 11c of the circuit board mounting surface 11. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100m is the same as that of the object detection device 100.

[0117] ***Explanation of Effects*** Even with the object detection device 100m configured in this way, it is possible to suppress the decrease in detection performance and reduce the size, just like with the object detection device 100.

[0118] Furthermore, in the object detection device 100m, since the camera cover 90 is configured in a dome shape, the field of view of the camera device can be secured at 180 degrees around the optical axis, and the field of view can be widened compared to when the camera cover 90 is a flat plate.

[0119] Furthermore, the high-frequency board 30, camera board 60, and signal processing board 70 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing costs can be reduced by manufacturing multiple boards as a single unit.

[0120] Embodiment 13. ***Explanation of the structure*** The configuration of the object detection device 100n of Embodiment 13 will be described with reference to Figure 22. Figure 22 is a cross-sectional view of the object detection device 100n. In Figure 22, the same reference numerals as in Figure 17 indicate equivalent components.

[0121] In the object detection device 100n, the camera board 60, the signal processing board 70, and the power supply board 80 are connected via a flexible section 71. At this time, a wiring port for the flexible section 71 is provided on the connection surface 11c of the board mounting surface 11. The other configurations are the same as those of the object detection device 100. Furthermore, the operation of the object detection device 100n is the same as that of the object detection device 100.

[0122] ***Explanation of Effects*** Even with the object detection device 100n configured in this way, the degradation of detection performance can be suppressed and the device can be miniaturized, just like with the object detection device 100.

[0123] Furthermore, in the object detection device 100n, since the camera cover 90 is configured in a dome shape, the field of view of the camera device can be secured at 180 degrees around the optical axis, and the field of view can be widened compared to when the camera cover 90 is a flat plate.

[0124] Furthermore, the camera board 60, signal processing board 70, and power supply board 80 are connected by a flexible section 71. This eliminates the need for connectors to connect the boards, reducing the space required for component placement and cable routing on the boards. In addition, manufacturing multiple boards as a single unit reduces manufacturing costs.

[0125] In the embodiments described herein, the relative arrangement of each component may be described, but these are illustrative in all respects and are not limited to those described in each embodiment. Therefore, countless variations not illustrated are conceivable within the scope of each embodiment. For example, this includes modifying, adding, or omitting any component, or even extracting at least one component from at least one embodiment and combining it with a component from another embodiment. In other words, it is possible to freely combine each embodiment, and to modify or omit each embodiment as appropriate.

[0126] Furthermore, to the extent that it does not create a contradiction, a component described as being provided as "one" in each of the above embodiments may be provided as "one or more." In addition, each component is a conceptual unit, including cases where one component is composed of multiple structures, and cases where one component corresponds to a part of a structure.

[0127] The various aspects of this disclosure are summarized below as an appendix.

[0128] (Note 1) The casing and A millimeter-wave radar device mounted on the aforementioned housing transmits and receives millimeter-wave radio waves, A camera device is positioned below the millimeter-wave radar device and mounted on the housing, A radome, which is attached to the housing, covers the millimeter-wave radar device from the front, which is the direction of irradiation of millimeter-wave radio waves by the millimeter-wave radar device, and has a first inclined portion whose intersection with the field of view of the millimeter-wave radar device is inclined downward and rearward, and a second inclined portion connected below the first inclined portion and further inclined downward and rearward with respect to the first inclined portion, A camera cover attached to the second inclined section and covering the camera device from the front, An object detection device equipped with the following features. (Note 2) A signal processing board that performs fusion processing on the received signal acquired by the millimeter-wave radar device and the image signal acquired by the camera device, A power supply board that supplies power to the signal processing board, Furthermore, The aforementioned millimeter-wave radar device, The device comprises a high-frequency substrate that generates millimeter-wave radio waves and an antenna substrate that transmits the radio waves generated by the high-frequency substrate and receives the reflected waves. The camera device is The system includes a camera that collects light from the surroundings and a camera board that acquires an image signal from the light captured by the camera and converts it into an electrical signal. The housing has a storage section which is a closed space behind the substrate mounting surface, and an open section which is in front of the substrate mounting surface and to which the radome is attached. The signal processing board and the power supply board are housed in the aforementioned storage compartment. The high-frequency circuit board, the antenna circuit board, the camera, and the camera circuit board are housed in the space formed by the opening of the housing, the radome, and the camera cover. The object detection device described in Appendix 1. (Note 3) The camera cover is a flat plate. An object detection device as described in Appendix 1 or 2. (Note 4) From the connection point between the radome and the upper part of the housing to the connection point between the radome and the lower part of the housing, it is inclined downward and rearward. An object detection device as described in Appendix 2 or 3. (Note 5) The high-frequency substrate is connected to the signal processing substrate by a flexible portion which is a flexible rigid substrate, and is formed as an integral part. An object detection device as described in any one of the items 2 to 4 of the appendix. (Note 6) The camera substrate is connected to the signal processing substrate by a flexible portion which is a flexible rigid substrate, and is formed as an integral part. An object detection device as described in any one of the items 2 to 4 of the appendix. (Note 7) The power supply board is connected to the signal processing board by a flexible portion which is a flexible rigid board, and is formed as an integral part. An object detection device as described in any one of the items 2 to 4 of the appendix. [Explanation of Symbols]

[0129] 10 Housing, 11 Board mounting surface, 11a High-frequency board mounting surface, 11b Camera board mounting surface, 11c, 11d Connection surface, 12a, 12b Wiring port, 20 Radome, 21 Upper connection part, 22 First inclined part, 23 Second inclined part, 24 Lower connection part, 25 Intersection part, 26 Cutout part, 30 High-frequency board, 40 Antenna board, 50 Camera, 51 Lens, 52 Lens barrel, 53 Holder, 60 Camera board, 70 Signal processing board, 80 Power supply board, 81 Connector, 82a, 82b, 82c, 82d, 82e, 82f, 82g, 82h, 82i Components, 83 Component group, 90 Camera covers, 100, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j, 100k, 100m, 100n; Object detection devices, 200; Construction machinery.

Claims

1. The casing and A millimeter-wave radar device mounted on the aforementioned housing transmits and receives millimeter-wave radio waves, A camera device is positioned below the millimeter-wave radar device and mounted on the housing, A radome, which is attached to the housing, covers the millimeter-wave radar device from the front, which is the direction of irradiation of millimeter-wave radio waves by the millimeter-wave radar device, and has a first inclined portion whose intersection with the field of view of the millimeter-wave radar device is inclined downward and rearward, and a second inclined portion connected below the first inclined portion and further inclined downward and rearward with respect to the first inclined portion, A camera cover attached to the second inclined section and covering the camera device from the front, An object detection device equipped with the following features.

2. A signal processing board that performs fusion processing on the received signal acquired by the millimeter-wave radar device and the image signal acquired by the camera device, A power supply board that supplies power to the signal processing board, Furthermore, The aforementioned millimeter-wave radar device, The device comprises a high-frequency substrate that generates millimeter-wave radio waves and an antenna substrate that transmits the radio waves generated by the high-frequency substrate and receives the reflected waves. The camera device is The system includes a camera that collects light from the surroundings and a camera board that acquires an image signal from the light captured by the camera and converts it into an electrical signal. The housing has a storage section which is a closed space behind the substrate mounting surface, and an open section which is in front of the substrate mounting surface and to which the radome is attached. The signal processing board and the power supply board are housed in the aforementioned storage compartment. The high-frequency circuit board, the antenna circuit board, the camera, and the camera circuit board are housed in the space formed by the opening of the housing, the radome, and the camera cover. The object detection device according to claim 1.

3. The camera cover is a flat plate. The object detection device according to claim 1.

4. From the connection point between the radome and the upper part of the housing to the connection point between the radome and the lower part of the housing, it is inclined downward and rearward. The object detection device according to claim 2.

5. The high-frequency substrate is connected to the signal processing substrate by a flexible portion which is a flexible rigid substrate, and is formed as an integral part. The object detection device according to claim 2.

6. The camera substrate is connected to the signal processing substrate by a flexible portion which is a flexible rigid substrate, and is formed as an integral part. The object detection device according to claim 2.

7. The power supply board is connected to the signal processing board by a flexible portion which is a flexible rigid board, and is formed as an integral part. The object detection device according to claim 2.

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