Substrate and method for manufacturing the same

The substrate with a glass core and controlled surface properties, combined with an epoxy resin and filler insulating layer, addresses peel resistance and thermal expansion issues, enhancing electrical reliability and stability in semiconductor packaging.

JP2026079750APending Publication Date: 2026-05-15ABSOLICS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
ABSOLICS INC
Filing Date
2025-10-22
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Existing semiconductor packaging technologies face challenges in achieving high electrical reliability due to insufficient peel resistance and mismatched thermal expansion characteristics between insulating layers and glass cores, leading to potential detachment and damage during manufacturing and use.

Method used

A substrate design featuring a glass core with controlled surface roughness and energy characteristics, combined with an insulating layer containing epoxy resin and fillers, which enhances peel resistance and thermal expansion compatibility, thereby stabilizing electrical connections.

Benefits of technology

The substrate achieves improved peel resistance and electrical reliability by ensuring strong bonding and reduced thermal stress, facilitating stable electrical connections and reduced damage during manufacturing and use.

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Abstract

This invention provides a substrate and a method for manufacturing the same, which can embody an insulating layer with improved peel resistance on a glass core, thereby further improving electrical reliability. [Solution] The substrate 100 includes a glass core 10 having an upper surface 11. The Rmax value, which is the maximum height roughness of the upper surface 11 of the glass core 10, is 3 nm to 7 nm. The surface energy of the upper surface 11 of the glass core 10 is 50 mN / m to 63 mN / m. In this case, an insulating layer with improved peel resistance can be realized on the glass core 10, further improving the electrical reliability of the substrate.
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