Radiation-sensitive composition, cured film, semiconductor element, display element, and method for manufacturing the cured film.

Abstract

The problem that the present invention aims to solve is to provide a radiation-sensitive composition capable of forming a cured film that can achieve both radiation sensitivity and dry etching resistance, a cured film formed from the composition, a semiconductor element and a display element equipped with the cured film, and a method for manufacturing the cured film. [Solution] The present invention relates to a radiation-sensitive composition comprising a polymer (A) containing a structural unit (I) derived from a compound having a heterocyclic structure with 5 or more ring members, an alkali-soluble polymer (B), a quinone diazide compound (C), and a solvent (S), wherein the heterocyclic structure is at least one selected from the group consisting of a cyclic ether structure, a cyclic ester structure, a cyclic imide structure, and a triazole ring-containing structure, and the content of the structural unit (I) is 50% by mass or more relative to the total structural units constituting the polymer (A).

Description

[Technical Field]

[0001] The present invention relates to a radiation-sensitive composition, a cured film, a semiconductor element, a display element, and a method for manufacturing a cured film. Regarding. [Background technology]

[0002] Cured films (e.g., interlayer insulating films, spacers, protective films, etc.) on semiconductor elements and display elements are generally formed using radiation-sensitive compositions containing polymer components and radiation-sensitive compounds (e.g., photoacid generators, photopolymerization initiators). For example, a cured film with a patterned shape can be obtained by irradiating a coating film formed from a radiation-sensitive composition with radiation, then developing it to form a pattern, and finally heat-curing it.

[0003] Conventionally, various photosensitive compositions have been proposed as materials for forming cured films on semiconductor elements and display elements. For example, a positive-type photosensitive resin composition containing an alkali-soluble resin, a 1,2-quinone diazide compound, and an active ester-based curing agent is known (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2014-016553 [Overview of the project] [Problems that the invention aims to solve]

[0005] In recent years, due to reasons such as improving productivity, there has been a demand for higher radiation sensitivity in radiation-sensitive compositions in order to shorten exposure time. Furthermore, in some manufacturing processes, dry etching is performed on the formed cured film, but this can cause roughness in the cured film. Therefore, dry etching resistance has been required for the cured film.

[0006] Therefore, the problem to be solved by the present invention is to provide a radiation-sensitive composition capable of forming a cured film that can achieve both radiation sensitivity and dry etching resistance, a cured film formed from the composition, a semiconductor device and a display device including the cured film, and a method for manufacturing the cured film.

Means for Solving the Problems

[0007] According to the present invention, there are provided the following radiation-sensitive composition, cured film, semiconductor device, display device, and method for manufacturing the cured film.

[0008] In one embodiment, the present invention a polymer (A) containing a structural unit (I) derived from a compound having a heterocyclic structure with 5 or more ring members, an alkali-soluble polymer (B), a quinonediazide compound (C), a solvent (S), and containing the heterocyclic structure is at least one selected from the group consisting of a cyclic ether structure, a cyclic ester structure, a cyclic imide structure, and a triazole ring-containing structure, relates to a radiation-sensitive composition in which the content of the structural unit (I) is 50% by mass or more based on all the structural units constituting the polymer (A).

[0009] In another embodiment, the present invention relates to a cured film formed using the above radiation-sensitive composition, and a semiconductor device and a display device including the cured film.

[0010] In another embodiment, the present invention a step of forming a coating film using the above radiation-sensitive composition, a step of exposing at least a part of the coating film, a step of developing the exposed coating film, a step of heating the developed coating film, and relates to a method for manufacturing a cured film including

Advantages of the Invention

[0011] The radiation-sensitive composition of the present invention contains a polymer (A) containing a structural unit (I) derived from a compound having a heterocyclic structure with 5 or more ring members in a specific amount, an alkali-soluble polymer (B), and a quinone diazide compound (C), thereby forming a cured film with excellent radiation sensitivity and dry etching resistance. [Modes for carrying out the invention]

[0012] The embodiments of the present invention will be described in detail below, but the present invention is not limited to these embodiments.

[0013] The following describes in detail matters related to the embodiments. In this specification, numerical ranges indicated using "~" include the values ​​indicated before and after "~" as the lower and upper limits, respectively. "Structural unit" refers to a unit that mainly constitutes the main chain structure and is included in the main chain structure in pairs or more.

[0014] In this specification, "hydrocarbon group" includes linear hydrocarbon groups, alicyclic hydrocarbon groups, and aromatic hydrocarbon groups. "Linear hydrocarbon group" means a linear hydrocarbon group or a branched hydrocarbon group that does not contain a cyclic structure in its main chain and consists only of a linear structure. However, linear hydrocarbon groups may be saturated or unsaturated. "Alicyclic hydrocarbon group" means a hydrocarbon group that contains only the structure of an alicyclic hydrocarbon as its ring structure and does not contain an aromatic ring structure. However, an alicyclic hydrocarbon group does not have to consist only of the structure of an alicyclic hydrocarbon; it may also include a linear structure as part of it. "Aromatic hydrocarbon group" means a hydrocarbon group that contains an aromatic ring structure as its ring structure. However, an aromatic hydrocarbon group does not have to consist only of an aromatic ring structure; it may also include a linear structure or an alicyclic hydrocarbon structure as part of it. The ring structure of an alicyclic hydrocarbon group or an aromatic hydrocarbon group may have substituents consisting of hydrocarbon structures.

[0015] In this specification, "(meth)acryloyl" encompasses "acryloyl" and "methacryloyl," and "(meth)acrylic" encompasses "acrylic" and "methacrylic." "(meth)acrylate" encompasses "acrylate" and "methacrylate."

[0016] ≪Radiation-sensitive composition≫ The radiation-sensitive composition according to this embodiment (hereinafter also referred to as "this composition") is A polymer (A) containing structural units (I) derived from a compound having a heterocyclic structure with 5 or more ring members, Alkali-soluble polymer (B), Quinone diazide compound (C) and Solvent (S) and, It contains, The above heterocyclic structure is at least one selected from the group consisting of cyclic ether structures, cyclic ester structures, cyclic imide structures, and triazole ring-containing structures. The content of the above structural unit (I) is 50% by mass or more relative to the total structural units constituting polymer (A).

[0017] The following describes each component contained in this composition, as well as any other components that may be added as needed.

[0018] <Polymer (A)> The polymer (A) described above is an aggregate of polymerization chains (hereinafter, this aggregate is also referred to as the "base polymer (A)"). The polymer (A) described above contains structural unit (I) derived from a compound having a heterocyclic structure with 5 or more ring members, and the content of structural unit (I) is 50% by mass or more relative to the total structural units constituting polymer (A). Preferably, polymer (A) contains structural unit (II) having a crosslinkable group. When polymer (A) contains structural unit (II) together with structural unit (I), structural unit (I) and structural unit (II) may be contained in the same polymerization chain, or structural unit (I) may be contained in one polymerization chain and structural unit (II) may be contained in another polymerization chain. That is, it is sufficient that the polymerization chain constituting polymer (A) as a whole contains structural unit (I) and structural unit (II). The polymer (A) described above may contain structural units other than structural unit (I) and structural unit (II). The same applies to other structural units of structural unit (I) and structural unit (II). The following describes each structural unit.

[0019] (Structural Unit (I)) The above structural unit (I) is derived from a compound having a heterocyclic structure with 5 or more ring members.

[0020] The heterocyclic structure with 5 or more ring members is at least one selected from the group consisting of cyclic ether structures, cyclic ester structures, cyclic imide structures, and triazole ring-containing structures. Among these, the cyclic ether structure is preferred from the viewpoint of the radiation sensitivity of the radiation-sensitive composition.

[0021] The above cyclic ether structure is preferably such that it contains two or more oxygen atoms (-O-) in the ring skeleton, in order to further increase the sensitivity of the radiation-sensitive composition. The cyclic ether structure is particularly preferably a dioxolane structure, in order to further increase the radiation sensitivity of the radiation-sensitive composition.

[0022] The upper limit of the number of ring members in the above heterocyclic structure is not particularly limited, but 20 is preferred, and 15 is more preferred.

[0023] The above complex ring structure is preferably a structure represented by at least one selected from the group consisting of the following formulas (a1) to (a5).

[0024] [Chemical Formula] (In formulas (a1) to (a5), R 11 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or two Rs 11 bonded to the same or adjacent carbons together with the carbon atom to which they are bonded form a ring structure. When there are a plurality of Rs 11 , the plurality of Rs 11 are each the same or different. R 12 is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms. R 13 is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms. When there are a plurality of Rs 13 , the plurality of Rs 13 are each the same or different. n1 and n2 are each independently an integer of 0 to 2. m1 is an integer of 1 to 3.)

[0025] In the above formulas (a1) to (a5), examples of the hydrocarbon group having 1 to 10 carbon atoms represented by R 11 , R 12 and R 13 include a chain hydrocarbon group having 1 to 10 carbon atoms, a monovalent alicyclic hydrocarbon group having 3 to 10 carbon atoms, a monovalent aromatic hydrocarbon group having 6 to 10 carbon atoms, and the like.

[0026] Examples of monovalent linear hydrocarbon groups having 1 to 10 carbon atoms include monovalent linear or branched saturated hydrocarbon groups having 1 to 10 carbon atoms, or monovalent linear or branched unsaturated hydrocarbon groups having 2 to 10 carbon atoms. Examples of monovalent linear or branched saturated hydrocarbon groups having 1 to 10 carbon atoms include alkyl groups such as methyl, ethyl, n-propyl, i-propyl, n-butyl, 2-methylpropyl, 1-methylpropyl, t-butyl, n-pentyl, isopentyl, and neopentyl groups. Examples of monovalent linear or branched unsaturated hydrocarbon groups having 2 to 10 carbon atoms include alkenyl groups such as ethenyl, propenyl, and butenyl groups; and alkynyl groups such as ethynyl, propynyl, and butynyl groups.

[0027] Examples of monovalent alicyclic hydrocarbon groups having 3 to 10 carbon atoms include monocyclic or polycyclic saturated hydrocarbon groups, or monocyclic or polycyclic unsaturated hydrocarbon groups. Examples of monocyclic saturated hydrocarbon groups include cycloalkyl groups such as cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl groups. Examples of polycyclic saturated hydrocarbon groups include bridged alicyclic hydrocarbon groups such as norbornyl and adamantyl groups. Examples of monocyclic unsaturated hydrocarbon groups include monocyclic cycloalkenyl groups such as cyclopropenyl, cyclobutenyl, cyclopentenyl, and cyclohexenyl groups. Examples of polycyclic unsaturated hydrocarbon groups include polycyclic cycloalkenyl groups such as norborneyl and tricyclodecenyl groups. A bridged alicyclic hydrocarbon group refers to a polycyclic alicyclic hydrocarbon group in which two non-adjacent carbon atoms constituting the alicyclic ring are linked by a linking group containing one or more carbon atoms.

[0028] Examples of the above-mentioned monovalent aromatic hydrocarbon groups having 6 to 10 carbon atoms include aryl groups such as phenyl, tolyl, xyl, and naphthyl groups; and aralkyl groups such as benzyl and phenethyl groups.

[0029] The above R 11 , R 12 and R 13The hydrocarbon group having 1 to 10 carbon atoms represented by may have substituents. Examples of the substituents include halogen atoms such as fluorine, chlorine, bromine, and iodine atoms; hydroxyl groups; carboxyl groups; cyano groups; nitro groups; alkyl groups, alkoxy groups, alkoxycarbonyl groups, alkoxycarbonyloxy groups, acyl groups, acyloxy groups, or groups in which the hydrogen atoms of these groups are substituted with halogen atoms; and substituents (T) such as oxo groups (=O).

[0030] The two Rs mentioned above 11 Examples of ring structures formed by combining these elements with the carbon atoms to which they are bonded include alicyclic structures and aromatic ring structures. Examples of alicyclic structures include structures corresponding to the monovalent alicyclic hydrocarbon groups having 3 to 10 carbon atoms, and examples of aromatic ring structures include structures corresponding to the monovalent aromatic hydrocarbon groups having 6 to 10 carbon atoms. Among these, benzene rings are preferred.

[0031] n1 and n2 are integers between 0 and 2, preferably 0 or 1. m1 is an integer between 1 and 3, preferably 1 or 2.

[0032] Specific examples of the above complex algebra structure include, for example, Cyclic ether structures such as tetrahydrofuran, methyltetrahydrofuran, ethyltetrahydrofuran, tetrahydropyran, methyltetrahydropyran, ethyltetrahydropyran, dioxolane, methyldioxolane, ethyldioxolane, dioxane, methyldioxane, ethyldioxane, 1,4,6-trioxaspiro[4.6]undecane, 1,4,6-trioxaspiro[4.4]nonane, and 1,4,6-trioxaspiro[4.5]decane; Cyclic ester structures such as γ-butyrolactone, γ-valerolactone, δ-valerolactone, and ε-caprolactone; Cyclic imide structures such as phthalimide and hexahydrophthalimide; Triazole ring-containing structures such as triazoles and benzotriazoles; One could list these:

[0033] The structural unit (I) is preferably a structural unit represented by the following formula (1). [ka] (In formula (1), R A These are a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. L 1 It is a single bond or a divalent linking group. R 2 (This refers to a monovalent group having a heterocyclic structure with 5 or more members.)

[0034] R in equation (1) above 2 As a monovalent group having a heterocyclic structure with 5 or more members represented by , a group obtained by removing one arbitrary hydrogen atom from the above heterocyclic structure with 5 or more members can be suitably adopted.

[0035] L in equation (1) above 1 Examples of divalent linking groups represented by include alkanediyl groups such as methanediyl, ethanediyl, and 1,3-propanediyl groups, as well as groups containing -O- between the carbon-carbon bonds of the alkanediyl group.

[0036] Specific examples of monomers that give structural units (I) include: For example, tetrahydrofurfuryl (meth)acrylate, tetrahydrofuranylmethyl (meth)acrylate, tetrahydropyranyl (meth)acrylate, 5-ethyl-1,3-dioxan-5-ylmethyl (meth)acrylate, 1,3-dioxan-5-ylmethyl (meth)acrylate, 5-methyl-1,3-dioxan-5-ylmethyl (meth)acrylate, (2-methyl-2-ethyl-1,3-dioxolan-4-yl)methyl (meth)acrylate, (2,2 Compounds having a cyclic ether structure with 5 or more ring members, such as (dimethyl-1,3-dioxolan-4-yl)methyl, (meth)acrylate (2,2-dimethyl-1,3-dioxolan-4-yl)ethyl, 2-(meth)acryloyloxymethyl-1,4,6-trioxaspiro[4,6]undecane, 2-(meth)acryloyloxymethyl-1,4,6-trioxaspiro[4,4]nonane, and 2-(meth)acryloyloxymethyl-1,4,6-trioxaspiro[4,5]decane; For example, compounds having a cyclic ester structure with 5 or more ring members, such as (meth)acrylic acid (γ-butyrolactone-2-yl), (meth)acrylic acid (γ-butyrolactone-2-yl)methyl, (meth)acrylic acid (δ-valerolacton-2-yl)ethyl, and (meth)acrylic acid mevalonate lactone; For example, compounds having a cyclic imide structure with 5 or more ring members, such as N-(meth)acryloyloxyethylhexahydrophthalimide; For example, compounds having a triazole ring-containing structure with 5 or more members, such as 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole; Examples include:

[0037] Polymer (A) may contain one or more structural units (I) in combination.

[0038] The content of the above structural unit (I) (the total if there are multiple types of structural unit (I)) is 50% by mass or more relative to all structural units constituting the base polymer (A). Having 50% by mass or more of the above structural unit (I) allows for both sensitivity and dry etching resistance. Preferably, the content of the above structural unit (I) is greater than 60% by mass, more preferably 70% by mass or more, and even more preferably 80% by mass or more. Preferably, the upper limit of the above content is 98% by mass, more preferably 95% by mass, and even more preferably 90% by mass. Setting the content of structural unit (I) within the above range is preferable because it allows for high sensitivity of the above radiation-sensitive composition while maintaining good transmittance and dry etching resistance of the cured film.

[0039] (Structural Unit (II)) Structural unit (II) has a crosslinkable group. Polymer (A) is preferred because it has structural unit (II), which allows it to be crosslinked with alkali-soluble polymer (B), which will be described later.

[0040] The crosslinkable group is preferably a group selected from the group consisting of carboxyl groups, amino groups, epoxy groups, oxetanyl groups, and ethylenically unsaturated groups, more preferably a group selected from the group consisting of carboxyl groups, amino groups, epoxy groups, and oxetanyl groups, and even more preferably having both a carboxyl group and an epoxy group.

[0041] (Structural unit containing a carboxyl group (II-1)) When the above crosslinking group is a carboxyl group, structural unit (II) is preferably a structural unit derived from an unsaturated monomer having a carboxyl group. Specifically, for example, unsaturated monocarboxylic acids such as (meth)acrylic acid, crotonic acid, and 4-vinylbenzoic acid; unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, and itaconic acid; These are some examples. Among these, (meth)acrylic acid is preferred.

[0042] (Structural unit having an oxetanyl group and an epoxy group (oxyranyl group) (II-2)) When the above crosslinkable groups are an oxetanyl group and an epoxy group, structural unit (II) is preferably a structural unit derived from an unsaturated monomer having an oxetanyl group and an epoxy group. Specifically, for example, a structural unit represented by the following formula (a1) or formula (a2) is preferred.

[0043] [ka] (In formulas (a1) and (a2), R 21 This is a monovalent group having an oxiranyl group or an epoxy group. R α This is a hydrogen atom, a methyl group, a hydroxymethyl group, a cyano group, or a trifluoromethyl group. X 1 (This is a single bond or a divalent linking group.)

[0044] In the above equations (a1) and (a2), R 21 Examples include oxyranyl group, oxetanyl group, 3,4-epoxycyclohexyl group, and 3,4-epoxytricyclo[5.2.1.0 2,6 Examples include decyl groups, 3-methyloxetanyl groups, and 3-ethyloxetanyl groups.

[0045] X 1 Examples of divalent linking groups include alkanediyl groups such as methanediyl, ethanediyl, and 1,3-propanediyl groups, as well as groups containing -O- between the carbon-carbon bonds of the alkanediyl group.

[0046] Specific examples of monomers that give structural unit (II) represented by the above formulas (a1) and (a2) include, for example, glycidyl (meth)acrylate, 3,4-epoxycyclohexyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, 2-(3,4-epoxycyclohexyl)ethyl (meth)acrylate, and 3,4-epoxytricyclo[5.2.1.0 2,6Examples include decyl (meth)acrylate, (3-methyloxetan-3-yl)methyl (meth)acrylate, (3-ethyloxetan-3-yl)(meth)acrylate, (oxetan-3-yl)methyl (meth)acrylate, (3-ethyloxetan-3-yl)methyl (meth)acrylate, o-vinylbenzylglycidyl ether, m-vinylbenzylglycidyl ether, p-vinylbenzylglycidyl ether, etc. Among these, glycidyl (meth)acrylate is preferred.

[0047] (Structural unit containing an amino group (II-3)) When the above crosslinking group is an amino group, structural unit (II) is preferably a structural unit derived from an unsaturated monomer having an amino group. Specifically, for example, a structural unit represented by the following formula (b1) or formula (b2) is preferred.

[0048] [ka] (In equations (b1) and (b2), R 12 and R 13 This refers to a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms. R α This is a hydrogen atom, a methyl group, a hydroxymethyl group, a cyano group, or a trifluoromethyl group. X 11 (This is a single bond or a divalent linking group.)

[0049] In the above equations (b1) and (b2), R 12 and R 13 The substituted or unsubstituted C1-C10 hydrocarbon group in the above formulas (a1) and (a2) is R 11 , R 12 and R 13 A substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, represented by [the formula shown], can be suitably used.

[0050] Specific examples of monomers that give structural units (II) represented by the above formulas (b1) and (b2) include, for example, dimethylaminoethyl (meth)acrylate and diethylaminoethyl (meth)acrylate.

[0051] (Structural unit having an ethylenically unsaturated group (II-4)) When the above crosslinkable group is an ethylenically unsaturated group, structural unit (II) preferably has an ethylenically unsaturated group in its side chain, and more preferably has a side chain structure with 3 to 20 carbon atoms having an ethylenically unsaturated group at its terminal. Specifically, for example, a structural unit represented by the following formula (a3) ​​is preferred.

[0052] [ka] (In formula (a3), R 22 This is either a hydrogen atom or a methyl group. R α This is a hydrogen atom, a methyl group, a hydroxymethyl group, a cyano group, or a trifluoromethyl group. X 2 (This is a divalent linking group.)

[0053] X in the above formula (a3) 2 Examples of divalent linking groups represented by include divalent hydrocarbon groups having 1 to 12 carbon atoms, divalent groups having -O-, -COO-, -OCO-, -NHCO-, -CONH-, -OCONH-, or -NHCOO- between any carbon-carbon bonds or at any terminal of the divalent hydrocarbon group (hereinafter also referred to as "divalent heteroatom-containing groups"), and divalent groups in which any hydrogen atom in the divalent hydrocarbon group or divalent heteroatom-containing group is substituted with a hydroxyl group, a carboxyl group, etc.

[0054] Polymer (A) may contain one or more structural units (II) in combination.

[0055] When polymer (A) contains structural unit (II), the lower limit of the content of structural unit (II) (total if there are multiple types of structural unit (II)) is preferably 1% by mass, more preferably 5% by mass, and still more preferably 8% by mass, relative to the total structural units constituting the base polymer (A). The upper limit of the content is preferably 50% by mass, more preferably 40% by mass, and still more preferably 30% by mass. Setting the content of structural unit (II) within the above range is preferable because it is possible to increase the sensitivity of the radiation-sensitive composition while improving the transmittance and etching resistance of the cured film.

[0056] The polymer (A) described above may further contain structural units other than structural units (I) and structural unit (II). The other structural units are not particularly limited, but examples include structural units (III) to (IV) of polymer (B1) described below.

[0057] (Method for synthesizing polymer (A)) Polymer (A) can be produced, for example, by using an unsaturated monomer into which each of the above-mentioned structural units can be introduced, in a suitable solvent in the presence of a polymerization initiator, according to known methods such as radical polymerization.

[0058] Examples of polymerization initiators include azo compounds such as 2,2'-azobis(isobutyronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), and 2,2'-azobis(isobutyric acid)dimethyl. The amount of polymerization initiator used is preferably 0.01 to 30 parts by mass per 100 parts by mass of the total amount of monomers used in the reaction.

[0059] Examples of polymerization solvents include alcohols, ethers, ketones, esters, and hydrocarbons. The amount of polymerization solvent used is preferably such that the total amount of monomers used in the reaction is 0.1 to 60% by mass of the total amount of the reaction solution.

[0060] In polymerization, the reaction temperature is typically 30°C to 180°C. The reaction time varies depending on the type of polymerization initiator and monomer and the reaction temperature, but is usually 0.5 to 10 hours. The polymer obtained by the polymerization reaction may be used in the preparation of the radiation-sensitive composition while still dissolved in the reaction solution, or it may be isolated from the reaction solution before being used in the preparation of the radiation-sensitive composition. The polymer can be isolated by known isolation methods, such as pouring the reaction solution into a large amount of poor solvent and drying the resulting precipitate under reduced pressure, or by distilling the reaction solution under reduced pressure using an evaporator.

[0061] The weight-average molecular weight (Mw) of the polymer (A) in terms of polystyrene, determined by gel permeation chromatography (GPC), is preferably 2,000 or more. An Mw of 2,000 or more is preferable because it allows for the production of a cured film with sufficiently high heat resistance and chemical resistance, as well as good developability. The Mw of the polymer is more preferably 5,000 or more, even more preferably 6,000 or more, and particularly preferably 7,000 or more. Furthermore, from the viewpoint of improving film-forming properties, the Mw is preferably 50,000 or less, more preferably 30,000 or less, even more preferably 20,000 or less, and particularly preferably 15,000 or less.

[0062] Furthermore, the molecular weight distribution (Mw / Mn), expressed as the ratio of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn), is preferably 4.0 or less, more preferably 3.0 or less, and even more preferably 2.5 or less. When polymer (A) consists of two or more polymers, it is preferable that the Mw and Mw / Mn of each polymer satisfy the above ranges.

[0063] The content of polymer (A) is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 5% by mass or more, based on the total amount of solids contained in the radiation-sensitive composition. Furthermore, the content of polymer (A) is preferably 50% by mass or less, and more preferably 40% by mass or less, based on the total amount of solids contained in the radiation-sensitive composition. Setting the content of polymer (A) within the above range is advantageous because it allows for the acquisition of a cured film with excellent permeability.

[0064] The content of polymer (A) is preferably 1% by mass or more and 30% by mass or less, relative to the total solid content of polymers (A) and polymer (B), and more preferably 10% by mass or more and 30% by mass or less. It is preferable that the content of polymer (A) be within the above range because it is possible to improve radiation sensitivity and form a cured film with good transmittance.

[0065] <Alkali-soluble polymer (B)> The alkali-soluble polymer (B) is an aggregate of polymerization chains (hereinafter, this aggregate is also referred to as the "base polymer (B)"). The alkali-soluble polymer (B) is preferably at least one selected from the group consisting of polymers containing structural units (III) having alkali-soluble groups (B1), polyimide polymers (B2), and siloxane polymers (B3), more preferably at least one selected from the group consisting of polymers containing structural units (III) having alkali-soluble groups (B1) and polyimide polymers (B2), and the polymer containing structural units (III) having alkali-soluble groups (B1) is particularly preferred. Hereinafter, in this specification, "alkali-soluble polymer" means a polymer that can dissolve or swell in a 2.38% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) at 25°C.

[0066] (Polymer (B1)) The polymer (B1) described above is preferably a (meth)acrylic polymer containing structural unit (III) having an alkali-soluble group. The polymer (B1) may also contain structural units other than structural unit (III). The following describes each structural unit included in polymer (B1).

[0067] [Structural Unit (III)] By including structural unit (III) having an alkali-soluble group in polymer (B1), the solubility (alkali solubility) of polymer (B1) in an alkaline developer can be increased, and the curing reactivity can be enhanced. Structural unit (III) is not particularly limited as long as it has an alkali-soluble group, but it is preferably at least one selected from the group consisting of structural units having a carboxyl group, structural units having a sulfonic acid group, structural units having a phenolic hydroxyl group, and maleimide units. In this specification, "phenolic hydroxyl group" means a hydroxyl group directly bonded to an aromatic ring (e.g., a benzene ring, naphthalene ring, anthracene ring, etc.).

[0068] Structural unit (III) is preferably a structural unit derived from an unsaturated monomer having a carboxyl group, a sulfonic acid group, or a phenolic hydroxyl group.

[0069] Specific examples of the above unsaturated monomers include: Examples of monomers constituting structural units having a carboxyl group include unsaturated monocarboxylic acids such as (meth)acrylic acid, crotonic acid, and 4-vinylbenzoic acid; and unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, and itaconic acid. Examples of monomers constituting structural units having a sulfonic acid group include vinyl sulfonic acid, (meth)allyl sulfonic acid, styrene sulfonic acid, (meth)acryloyloxyethyl sulfonic acid, etc. Examples of monomers constituting structural units having phenolic hydroxyl groups include 4-hydroxystyrene, o-isopropenylphenol, m-isopropenylphenol, p-isopropenylphenol, hydroxyphenyl (meth)acrylate, etc. Each of these can be listed.

[0070] Furthermore, maleimide can be used as the monomer constituting structural unit (III).

[0071] Among these, monomers constituting structural units having a carboxyl group and monomers constituting structural units having a phenolic hydroxyl group are preferred, with (meth)acrylic acid and p-isopropenylphenol being more preferred. In polymer (A), the structural unit having a carboxyl group corresponds to structural unit (II) having a crosslinkable group, and in polymer (B1), it corresponds to structural unit (III) having an alkali-soluble group.

[0072] The base polymer may contain one or more structural units (III) in combination.

[0073] The lower limit of the content of structural unit (III) (total content if multiple types are included) is preferably 5% by mass, more preferably 10% by mass, and even more preferably 20% by mass, relative to the total structural units constituting the base polymer (B1). The upper limit of the above content is preferably 60% by mass, more preferably 50% by mass, and even more preferably 40% by mass. Setting the content of structural unit (III) within the above range is preferable because it allows for good solubility in alkaline developing solutions.

[0074] [Structural Units (IV)] The polymer (B1) described above may further contain structural units (IV) derived from at least one monomer selected from the group consisting of alkyl (meth)acrylates, alicyclic (meth)acrylates, aromatic rings, aromatic vinyl compounds, N-substituted maleimide compounds, heterocyclic vinyl compounds, conjugated dienes, nitrogen-containing vinyl compounds, and unsaturated dialkyl dicarboxylate compounds. Introducing these structural units (IV) into the polymer is preferable because it allows for adjusting the glass transition temperature of the polymer (B1) components and improving the pattern shape of the resulting cured film.

[0075] Examples of the alkyl (meth)acrylate esters mentioned above include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-lauryl (meth)acrylate, and n-stearyl (meth)acrylate.

[0076] Examples of (meth)acrylic acid esters having the above alicyclic structure include cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, and tricyclo(meth)acrylate. 2,6 ] Decane-8-yl, (meth)acrylate tricyclo[5.2.1.0 2,5 Examples include decane-8-yloxyethyl and isobornyl (meth)acrylate.

[0077] Examples of (meth)acrylic acid esters having the above aromatic ring structure include phenyl (meth)acrylate and benzyl (meth)acrylate.

[0078] Examples of the above aromatic vinyl compounds include styrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, α-methylstyrene, 2,4-dimethylstyrene, 2,4-diisopropylstyrene, 5-t-butyl-2-methylstyrene, divinylbenzene, trivinylbenzene, t-butoxystyrene, vinylbenzyldimethylamine, (4-vinylbenzyl)dimethylaminoethyl ether, N,N-dimethylaminoethylstyrene, N,N-dimethylaminomethylstyrene, 2-ethylstyrene, 3-ethylstyrene, 4-ethylstyrene, 2-t-butylstyrene, 3-t-butylstyrene, 4-t-butylstyrene, diphenylethylene, vinylnaphthalene, vinylpyridine, and the like.

[0079] Examples of the above N-substituted maleimide compounds include N-cyclohexylmaleimide, N-cyclopentylmaleimide, N-(2-methylcyclohexyl)maleimide, N-(4-methylcyclohexyl)maleimide, N-(4-ethylcyclohexyl)maleimide, N-(2,6-dimethylcyclohexyl)maleimide, N-norbornylmaleimide, N-tricyclodecylmaleimide, N-adamantylmaleimide, N-phenylmaleimide, N-(2-methylphenyl)maleimide, N-(4-methylphenyl)maleimide, N-(4-ethylphenyl)maleimide, N-(2,6-dimethylphenyl)maleimide, N-benzylmaleimide, and N-naphthylmaleimide.

[0080] Examples of vinyl compounds having the above heterocyclic structure include (meth)acrylate glycerin carbonate. Furthermore, compounds that provide the structural unit (I) of polymer (A) can also be used as vinyl compounds having the above heterocyclic structure. However, if polymer (B1) contains the structural unit (I) of polymer (A), the upper limit of its content (total amount if multiple types are included) is preferably 50% by mass, more preferably 40% by mass, and even more preferably 30% by mass, relative to the total structural units constituting the base polymer (B1). The lower limit of the above content is preferably 0.5% by mass, more preferably 1% by mass, and even more preferably 1.5% by mass.

[0081] Examples of the above-mentioned conjugated diene compounds include 1,3-butadiene and isoprene; examples of the above-mentioned nitrogen-containing vinyl compounds include (meth)acrylonitrile and (meth)acrylamide; and examples of the above-mentioned unsaturated dicarboxylate dialkyl ester compounds include diethyl itaconate. In addition to the above, other monomers constituting the structural units include, for example, vinyl chloride, vinylidene chloride, and vinyl acetate.

[0082] The monomer that gives the above structural unit (IV) preferably includes at least one selected from the group consisting of alkyl (meth)acrylates, (meth)acrylates having an alicyclic structure, N-substituted maleimide compounds, and vinyl compounds having a heterocyclic structure.

[0083] The base polymer (B1) may contain one or more structural units (IV).

[0084] When polymer (B1) contains structural unit (IV), the lower limit of the content of structural unit (IV) (total content if multiple types are included) is preferably 5% by mass, more preferably 10% by mass, even more preferably 15% by mass, and particularly preferably 20% by mass, relative to the total structural units constituting the base polymer (B1). The upper limit of the above content is preferably 90% by mass, and more preferably 80% by mass. Setting the content of structural unit (IV) within the above range is preferable because it allows the glass transition temperature of polymer (B1) to be raised to a moderate level.

[0085] In addition to the above, polymer (B1) may also contain structural units (II-2) having oxetanyl groups and epoxy groups (oxyranyl groups) in the structural unit (II) described in polymer (A).

[0086] The polymer (B1) is preferable because it contains structural unit (II-2), which can further enhance radiation sensitivity and adhesion of the cured film. Among these, glycidyl (meth)acrylate and 3,4-epoxycyclohexylmethyl (meth)acrylate are more preferred.

[0087] When polymer (B1) contains structural unit (II-1), the lower limit of its content (total content if multiple types are included) is preferably 5% by mass, more preferably 10% by mass, even more preferably 20% by mass, and particularly preferably 25% by mass, relative to the total structural units constituting the base polymer (B1). The upper limit of the above content is preferably 90% by mass, more preferably 85% by mass, and even more preferably 80% by mass. Setting the content within the above range is preferable because it allows the coating film to exhibit better resolution and the resulting cured film to have sufficiently high heat resistance and chemical resistance.

[0088] (Method for synthesizing polymer (B1)) As a method for synthesizing polymer (B1), the synthesis method for polymer (A) described above can be suitably employed.

[0089] (Polyimide polymer (B2)) Polyimide polymer (B2) is a polycondensate of a tetracarboxylic dianhydride and a diamine compound, and has an imide ring structure.

[0090] The imidization rate of the polyimide polymer (B2) is preferably 10% or more, more preferably 30% or more, and even more preferably 50% or more. When the imidization rate is within the above range, the solubility of the polyimide polymer (B2) in the alkaline developer does not become too high, and a radiation-sensitive composition exhibiting good resolution can be obtained. From the viewpoint of ease of synthesis, the imidization rate is preferably 99% or less, and more preferably 95% or less. The imidization rate is expressed as a percentage of the ratio of the number of imid ring structures to the total number of amic acid structures and imid ring structures of the polyimide.

[0091] Polyimide polymers (B2) can be obtained by synthesizing polyamic acid by reacting a tetracarboxylic dianhydride with a diamine compound, and then imidizing the polyamic acid by dehydration and cyclization.

[0092] (Tetracarboxylic acid dianhydride) Examples of tetracarboxylic dianhydrides that constitute the polyimide polymer (B2) include aliphatic tetracarboxylic dianhydrides and aromatic tetracarboxylic dianhydrides.

[0093] Herein, in this specification, "aliphatic tetracarboxylic dianhydride" means a tetracarboxylic dianhydride in which the two acid anhydride groups (-CO-O-CO-) of the tetracarboxylic dianhydride are bonded to a linear or cyclic aliphatic group. That is, an aliphatic tetracarboxylic dianhydride may be a linear tetracarboxylic dianhydride in which the two acid anhydride groups of the tetracarboxylic dianhydride are bonded to a linear structure, or it may be an alicyclic tetracarboxylic dianhydride in which the two acid anhydride groups of the tetracarboxylic dianhydride are bonded to the same or different aliphatic rings, or one of the two acid anhydride groups is bonded to an aliphatic ring and the other is bonded to a linear structure. In addition, an aliphatic tetracarboxylic dianhydride may have an aromatic ring structure insofar as the two acid anhydride groups of the tetracarboxylic dianhydride are bonded to a linear or cyclic aliphatic group. "Aromatic tetracarboxylic dianhydride" means a tetracarboxylic dianhydride in which one or more of the two acid anhydride groups of the tetracarboxylic dianhydride are bonded to an aromatic ring. In aromatic tetracarboxylic dianhydrides, when two acid anhydride groups are both bonded to an aromatic ring, the two acid anhydride groups may be bonded to the same aromatic ring or to different aromatic rings.

[0094] Specific examples of tetracarboxylic dianhydrides that constitute polyimide polymers (B2) include, as chain-like tetracarboxylic dianhydrides, 1,2,3,4-butanetetracarboxylic dianhydride and ethylenediaminetetraacetic acid dianhydride. Examples of alicyclic tetracarboxylic dianhydrides include 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,3-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-tetramethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 2,3,5-tricarboxycyclopentylacetic acid dianhydride, and 5-(2,5-dioxotetrahydrofuran-3-yl)-3a,4,5,9b-tetrahydronaphtho[1,2-c]furan-1,3 Examples include -dione, 5-(2,5-dioxotetrahydrofuran-3-yl)-8-methyl-3a,4,5,9b-tetrahydronaphtho[1,2-c]furan-1,3-dione, 2,4,6,8-tetracarboxybicyclo[3.3.0]octane-2:4,6:8-dianhydride, cyclopentanetetracarboxylic acid dianhydride, cyclohexanetetracarboxylic acid dianhydride, and 3,5,6-tricarboxy-2-carboxymethylnorbornane-2:3,5:6-dianhydride. Examples of aromatic tetracarboxylic acid dianhydrides include pyromellitic acid dianhydride, 4,4'-(hexafluoroisopropylidene)diphthalic acid anhydride, ethylene glycol bisanhydrotrimellitate, 4,4'-carbonyldiphthalic acid anhydride, 4,4'-oxydiphthalic acid anhydride, and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride. Among these, 1,3-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 2,4,6,8-tetracarboxybicyclo[3.3.0]octane-2:4,6:8-dianhydride, and 4,4'-oxydiphthalic anhydride are preferred.

[0095] For the polyimide polymer (B2), the content of structural units derived from aliphatic tetracarboxylic dianhydride is 60 mol% or more relative to the total amount of structural units derived from tetracarboxylic dianhydride in the polyimide polymer (B2). If the content of structural units derived from aliphatic tetracarboxylic dianhydride is less than 60 mol%, the solubility of the polyimide polymer (B2) in the solvent is insufficient, and the coatability of the composition and the surface flatness of the cured film obtained from the composition tend to be poor. In addition, the solubility of tetracarboxylic dianhydride in the polymerization solvent is insufficient, resulting in a low monomer concentration in the polymerization solvent, which tends to lead to poor productivity of the polyimide polymer (B2). From this viewpoint, the content of structural units derived from aliphatic tetracarboxylic dianhydride is preferably 70 mol% or more, more preferably 80 mol% or more, and even more preferably 90 mol% or more, relative to the total amount of structural units derived from tetracarboxylic dianhydride in the polyimide polymer (B2).

[0096] (Diamine compounds) Examples of diamine compounds that constitute polyimide polymers (B2) include aliphatic diamines and aromatic diamines.

[0097] Hereinafter, in this specification, "aliphatic diamine" means a diamine compound in which two primary amino groups (-NH2) of the diamine compound are bonded to a linear or cyclic aliphatic group. That is, an aliphatic diamine may be a linear diamine in which two primary amino groups of the diamine compound are bonded to a linear structure, or it may be an alicyclic diamine in which two primary amino groups of the diamine compound are bonded to the same or different aliphatic rings, or one of the two primary amino groups is bonded to an aliphatic ring and the other is bonded to a linear structure. In addition, an aliphatic diamine may have an aromatic ring structure as long as the two primary amino groups of the diamine compound are bonded to a linear or cyclic aliphatic group. "Aromatic diamine" means a diamine compound in which one or more of the two primary amino groups of the diamine compound are bonded to an aromatic ring. In an aromatic diamine, when two primary amino groups are both bonded to an aromatic ring, the two primary amino groups may be bonded to the same aromatic ring or to different aromatic rings.

[0098] [Specific Diamines] The diamine constituting the polyimide polymer (B2) preferably has at least one functional group selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group, and a sulfo group (-SO3H) (hereinafter also referred to as "functional group (F1)"). The number of functional groups (F1) that the specific diamine has is not particularly limited. The number of functional groups (F1) that the specific diamine has is preferably 1 to 6, and more preferably 2 to 4. Among the above, the functional group (F1) is preferably a phenolic hydroxyl group in terms of solubility in alkaline developer and transparency of the cured film.

[0099] The molecular weight of the specific diamine is not particularly limited. In terms of high solubility in the polymerization solvent and the ability to achieve a high monomer concentration in the polymerization solvent, the molecular weight of the specific diamine is preferably 300 or higher, more preferably 350 or higher, even more preferably 450 or higher, and particularly preferably 500 or higher. Furthermore, from the viewpoint of improving the coatability of the composition and the surface flatness of the cured film obtained from this composition, the molecular weight of the specific diamine is preferably 850 or lower, and more preferably 750 or lower.

[0100] In terms of high solubility in polymerization solvents and, consequently, the ability to increase the polyimide concentration in the reaction solution obtained by polymerization, it is preferable that the specific diamine has at least one substructure selected from the group consisting of a fluorene ring structure, an indene ring structure, an indan ring structure, a lactone ring structure, a steroid structure, and an alkyl halide structure. Among these, diamines having a fluorene ring structure are preferred due to their high solubility in polymerization solvents.

[0101] From the viewpoint of ensuring solubility in the polymerization solvent while improving the surface flatness of the cured film obtained with this composition, the specific diamine is preferably an aromatic diamine. Specific examples of the specific diamine include compounds represented by the following formulas (B2-1) to (B2-7). [ka]

[0102] [Other diamines] The diamine compound constituting the polyimide polymer (B2) may consist solely of a specific diamine, or it may be a combination of a specific diamine and a diamine without a functional group (F1) (hereinafter also referred to as "other diamines"). Examples of other diamines include aliphatic diamines, aromatic diamines, and diaminoorganosiloxanes. Examples of aliphatic diamines include linear diamines and alicyclic diamines.

[0103] Other specific examples of diamines include, as chain-like diamines, metaxylylenediamine and hexamethylenediamine. Examples of alicyclic diamines include 1,4-diaminocyclohexane and 4,4'-methylenebis(cyclohexylamine). Examples of aromatic diamines include 1,1-bis(4-aminophenyl)cyclopentane, 1,1-bis(4-aminophenyl)cyclohexane, 1,1-bis(4-aminophenyl)cycloheptane, p-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylethane, 4-aminophenyl-4-aminobenzoate, 4,4'-diaminoazobenzene, 1,5-bis(4-aminophenoxy)pentane, 1,2-bis(4-aminophenoxy)ethane, and 1,3 -Bis(4-aminophenoxy)propane, 1,6-bis(4-aminophenoxy)hexane, 6,6'-(pentamethylenedioxy)bis(3-aminopyridine), N,N'-di(5-amino-2-pyridyl)-N,N'-di(tert-butoxycarbonyl)ethylenediamine, bis[2-(4-aminophenyl)ethyl]hexanediic acid, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylamine, 4,4'-diaminodiphenethylurea, 2,2-bis[4-(4- [aminophenoxy)phenyl]propane, 2,2-bis(4-aminophenyl)hexafluoropropane, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 4,4'-(phenylenediisopropylidene)bisaniline, 2,6-diaminopyridine, 2,4-diaminopyrimidine, 3,6-diaminocarbazole, N-methyl-3,6-diaminocarbazole, 3,6-diamino Cryzine, N4,N4'-bis(4-aminophenyl)-N4,N4'-dimethylbenzidine, N,N'-bis(5-aminopyridine-2-yl)-N,N'-di(tert-butoxycarbonyl)ethylenediamine, hexadecanoxy-2,4-diaminobenzene, octadecanoxy-2,4-diaminobenzene, octadecanoxy-2,5-diaminobenzene, cholestanyloxy-3,5-diaminobenzene, cholesteryloxy-3,5-diaminobenzene, cholestanyloxy-2,Examples include 4-diaminobenzene, cholesteryloxy-2,4-diaminobenzene, cholestanil 3,5-diaminobenzoate, cholesteryl 3,5-diaminobenzoate, lanostanil 3,5-diaminobenzoate, 3,6-bis(4-aminobenzoyloxy)cholestane, 3,6-bis(4-aminophenoxy)cholestane, 4-(4'-trifluoromethoxybenzoyloxy)cyclohexyl-3,5-diaminobenzoate, 1,1-bis(4-((aminophenyl)methyl)phenyl)-4-butylcyclohexane, 3,5-diaminobenzoate=5ξ-cholestane-3-yl, 1,3,3a,4,5,9b-hexahydro-8-methyl-5-(tetrahydro-2,5-dioxo-3-furanyl)naphtho[1,2-C]furan-1,3-dione, etc. Examples of diaminoorganosiloxanes include 1,3-bis(3-aminopropyl)-tetramethyldisiloxane and 1,3-bis(4-anilino)tetramethyldisiloxane.

[0104] For the polyimide polymer (B2), the content of structural units derived from a specific diamine is preferably 30 mol% or more relative to the total amount of structural units derived from the diamine compound in the polyimide polymer (B2). If the content of structural units derived from a specific diamine is less than 30 mol%, the solubility of the polyimide polymer (B2) in the alkaline developer is insufficient, and the resolution tends to be poor. Furthermore, from the viewpoint of suppressing excessive solubility in the developer of unexposed areas and maintaining good resolution of this composition, the content of structural units derived from a specific diamine is preferably 99 mol% or less, and more preferably 95 mol% or less, relative to the total amount of structural units derived from the diamine compound in the polyimide polymer (B2).

[0105] Polyimide polymers (B2) can be obtained by dehydrating and cyclizing polyamic acid to imidize it. The method for synthesizing polyamic acid is not particularly limited, but for example, the method described in Japanese Patent Application Publication No. 2023-177343 can be suitably employed.

[0106] The weight-average molecular weight (Mw) of the polyimide polymer (B2), measured by gel permeation chromatography (GPC), is preferably 1,000 to 500,000, and more preferably 2,000 to 300,000. Furthermore, the molecular weight distribution (Mw / Mn), expressed as the ratio of Mw to the number-average molecular weight (Mn) measured by GPC, is preferably 5 or less, and more preferably 4 or less.

[0107] (Siloxane polymer (B3)) Examples of the siloxane polymer (B3) mentioned above include hydrolysis condensates of hydrolyzable silane compounds. Here, "hydrolyzable silane compound" refers to a compound containing a group that can be hydrolyzed to produce a silanol group or a group that can form a siloxane condensate, and "hydrolysis condensate" refers to a condensate formed when the silanol groups of a hydrolyzed silane compound are condensed together. Examples of such siloxane polymers include those described in Japanese Patent Publication No. 2017-048355 and Japanese Patent Publication No. 2022-551938.

[0108] The lower limit of the polymer (B) content is preferably 40% by mass, more preferably 50% by mass, and even more preferably 60% by mass, based on the total amount of solids contained in the radiation-sensitive composition. The upper limit of the polymer (B) content is preferably 90% by mass, and more preferably 85% by mass, based on the total amount of solids contained in the radiation-sensitive composition. Setting the polymer (B) content within the above range is advantageous because it allows for the acquisition of a cured film with excellent permeability.

[0109] <Quinone diazide compound (C)> This composition contains polymer (A) and polymer (B) along with a quinone diazide compound (C). A positive pattern can be formed by irradiating this composition with radiation (visible light, ultraviolet light, far ultraviolet light, etc.).

[0110] Quinone diazide compounds are compounds that generate carboxylic acids upon irradiation with radiation. Examples of quinone diazide compounds include condensates of phenolic compounds or alcoholic compounds (hereinafter also referred to as "parent compounds") and orthonaphthoquinone diazide compounds. Of these, the quinone diazide compound used is preferably a condensate of a compound having a phenolic hydroxyl group as the parent compound and an orthonaphthoquinone diazide compound. Specific examples of parent compounds include, for example, the compounds described in paragraphs

[0065] to

[0070] of Japanese Patent Publication No. 2014-186300.

[0111] Specific examples of quinone diazide compounds include 4,4'-dihydroxydiphenylmethane, 2,3,4,2',4'-pentahydroxybenzophenone, tri(p-hydroxyphenyl)methane, 1,1,1-tri(p-hydroxyphenyl)ethane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, 1,3-bis[1-(4-hydroxyphenyl)-1-methylethyl]benzene, and 1,4-bis[1-(4-hydroxyphenyl)-1-methyl Examples include ester compounds of a phenolic hydroxyl group-containing compound selected from ethyl]benzene, 4,6-bis[1-(4-hydroxyphenyl)-1-methylethyl]-1,3-dihydroxybenzene, and 4,4'-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol with 1,2-naphthoquinone diazide-4-sulfonic acid chloride or 1,2-naphthoquinone diazide-5-sulfonic acid chloride. Among these, preferred quinone diazide compounds (C) are a condensate of 1,1,1-tri(p-hydroxyphenyl)ethane and 1,2-naphthoquinone diazide-5-sulfonic acid chloride, and a condensate of 4,4'-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol and 1,2-naphthoquinone diazide-5-sulfonic acid chloride.

[0112] These quinone diazide compounds (C) may be used alone or in combination of two or more.

[0113] The lower limit of the content of the above-mentioned quinone diazide compound (C) is preferably 1 part by mass, more preferably 5 parts by mass, and even more preferably 10 parts by mass, per 100 parts by mass of the total of polymers (A) and polymers (B) blended in this composition. The upper limit of the content of the quinone diazide compound (C) is preferably 50 parts by mass, and more preferably 30 parts by mass, per 100 parts by mass of the total of polymers (A) and polymers (B) blended in this composition. A content of 1 part by mass or more of the quinone diazide compound (C) is preferable because sufficient carboxylic acid is generated upon irradiation of the composition with radiation, the difference in solubility between the irradiated and unirradiated portions in the developer can be sufficiently large, and good patterning can be achieved. Furthermore, it is preferable because the amount of carboxylic acid involved in the reaction with the polymer components can be increased, and sufficient heat resistance and chemical resistance can be ensured. On the other hand, by limiting the content of quinone diazide compound (C) to 50 parts by mass or less, the amount of unreacted quinone diazide compound after exposure can be sufficiently reduced, which is preferable in that it can suppress the decrease in developability due to the residual quinone diazide compound.

[0114] <Solvent (S)> The radiation-sensitive composition of this disclosure is a liquid composition in which polymer (A), polymer (B), and quinone diazide compound (C), and other components as may be added, are preferably dissolved or dispersed in a solvent (S). The solvent used is preferably an organic solvent that dissolves each component of the radiation-sensitive composition and does not react with each component.

[0115] The solvent (S) is not particularly limited and can include, for example, alcohol-based solvents, ether-based solvents, ester-based solvents, ketone-based solvents, amide-based solvents, etc. The solvent (S) may be used alone or in combination of two or more types.

[0116] Examples of alcohol-based solvents include methanol, ethanol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, t-butyl alcohol, 1-hexanol, 1-octanol, 1-nonanol, 1-dodecanol, 1-methoxy-2-propanol, diacetone alcohol, alkyl alcohols such as menthanol, and aromatic alcohols such as benzyl alcohol, with menthanol being preferred.

[0117] Examples of ether-based solvents include ethylene glycol monoalkyl ethers such as diethylene glycol methyl ethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, and propylene glycol monobutyl ether; diethylene glycol monoalkyl ethers such as diethylene glycol monomethyl ether and diethylene glycol monoethyl ether; diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether and diethylene glycol ethyl methyl ether; and dipropylene glycol monoalkyl ethers such as dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, and dipropylene glycol monobutyl ether.

[0118] Examples of ester solvents include carboxylic acid esters such as ethyl acetate, i-propyl acetate, n-butyl acetate, amyl acetate, ethyl lactate, methyl 3-methoxypropionate, and ethyl 3-ethoxypropionate; polyhydric alcohol carboxylate solvents such as propylene glycol diacetate; polyhydric alcohol partial ether carboxylate solvents such as propylene glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate; and lactone solvents such as γ-butyrolactone and valerolactone.

[0119] Examples of ketone-based solvents include acetone, methyl ethyl ketone, diethyl ketone, methyl isobutyl ketone, methyl amyl ketone, diisobutyl ketone, cyclopentanone, cyclohexanone, and cycloheptanone.

[0120] Among these, ether-based solvents and ester-based solvents are preferred, ester-based solvents are more preferred, and polyhydric alcohol partial ether carboxylate-based solvents are even more preferred. Furthermore, among the ether-based solvents and ester-based solvents, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate, γ-butyrolactone, ethyl lactate, and methyl 3-methoxypropionate are preferred.

[0121] The solvent (S) content in this composition is not particularly limited, but it is preferable that the composition be prepared so that the solid content (components other than solvent (S)) concentration is within the following ranges. The lower limit of the solid content concentration in this composition is preferably 5% by mass, more preferably 8% by mass, and even more preferably 15% by mass. On the other hand, the upper limit of the solid content concentration is preferably 60% by mass, and more preferably 40% by mass. A solid content concentration of 5% by mass or more in the radiation-sensitive composition is preferable because it ensures sufficient film thickness when the radiation-sensitive composition is applied to a substrate. Furthermore, a solid content concentration of 60% by mass or less is preferable because it prevents the film thickness from becoming excessively large, and allows for a moderately high viscosity of the radiation-sensitive composition, ensuring good coatability.

[0122] <Other ingredients> The radiation-sensitive composition of this disclosure may further contain, in addition to the polymer (A), polymer (B), quinone diazide compound (C), and solvent (S) described above, other components (hereinafter also referred to as "other components"). Examples of other components include reaction initiators (photoradical polymerization initiators, photocationic polymerization initiators, etc.), polyfunctional polymerizable compounds (polyfunctional (meth)acrylates, etc.), adhesion aids (functional silane coupling agents, etc.), surfactants (fluorinated surfactants, silicone surfactants, nonionic surfactants, etc.), polymerization inhibitors, antioxidants, chain transfer agents, etc. The blending ratio of these components is appropriately selected according to each component, within a range that does not impair the effects of this disclosure.

[0123] The radiation-sensitive composition of this disclosure, comprising polymer (A), polymer (B), and quinone diazide compound (C), can exhibit excellent radiation sensitivity, transmittance, and dry etching resistance. Such a radiation-sensitive composition of this disclosure is useful as a radiation-sensitive composition for display elements such as liquid crystal display elements and organic EL display elements.

[0124] <Method for preparing a radiation-sensitive composition> The radiation-sensitive composition of the present invention can be prepared by mixing each component in a predetermined ratio and dissolving it in a solvent (S). The prepared composition is preferably filtered using, for example, a filter with a pore size of about 0.2 μm.

[0125] ≪Cured film≫ The cured film of the present invention (hereinafter also referred to as "this cured film") can be formed by curing the radiation-sensitive composition prepared as described above.

[0126] This cured film exhibits excellent dry etching resistance, and it is preferable that the film surface Ra after RIE dry etching under conditions where the sccm ratio of CF4 to O2 is 1:5 is 10 or less.

[0127] The cured film of the present invention may be a patterned film.

[0128] The thickness of the cured film of the present invention is not particularly limited and can be set as appropriate depending on the purpose of use.

[0129] ≪Semiconductor Devices≫ The semiconductor device of this disclosure comprises a cured film formed using the above-mentioned radiation-sensitive composition. The cured film is preferably an interlayer insulating film that insulates the wiring within the semiconductor device. The semiconductor device of this disclosure can be manufactured using known methods.

[0130] ≪Display Elements≫ The display element of this disclosure comprises a cured film formed using the above-mentioned radiation-sensitive composition. Alternatively, the display element of this disclosure may also comprise a semiconductor element of this disclosure, thereby comprising a cured film formed using the above-mentioned radiation-sensitive composition. Furthermore, the display element of this disclosure may comprise a planarization film formed on a TFT substrate as the cured film formed using the above-mentioned radiation-sensitive composition. Examples of display elements include liquid crystal display elements and organic electroluminescent (EL) display elements.

[0131] ≪Method for manufacturing a cured film≫ The method for manufacturing a cured film according to this embodiment is: (Step 1) A step of forming a coating film using a radiation-sensitive composition, (Step 2) A step of irradiating at least a portion of the above coating film with radiation, (Step 3) A step of developing the above coating after irradiation with radiation, (Step 4) The process includes heating the developed coating film.

[0132] The following provides a detailed explanation of each step.

[0133] <Process 1: Paint film formation process> In this process, a radiation-sensitive composition is applied to the surface on which the coating film will be formed (hereinafter also referred to as the "film-forming surface"), and preferably a heat treatment (pre-bake) is performed to remove the solvent and form a coating film on the film-forming surface. The material of the film-forming surface is not particularly limited. For example, when forming a planarization film using a radiation-sensitive composition, the radiation-sensitive composition is applied to a substrate on which switching elements such as TFTs are provided, and a coating film is formed. As the substrate, for example, a glass substrate or a resin substrate can be used.

[0134] Examples of methods for applying the radiation-sensitive composition include spray coating, roll coating, spin coating, slit die coating, bar coating, and inkjet coating. Among these, spin coating, slit die coating, or bar coating is preferred. Pre-baking conditions vary depending on the type and proportion of each component in the radiation-sensitive composition, but for example, 60 to 130°C for 0.5 to 10 minutes is preferred. The thickness of the formed coating film (i.e., the film thickness after pre-baking) is preferably 1 to 12 μm.

[0135] <Step 2: Exposure Process> In this step, at least a portion of the coating film formed in step 1 is irradiated with radiation. At this time, by irradiating the coating film with radiation through a mask having a predetermined pattern, a cured film with a pattern (e.g., an interlayer insulating film) can be formed. Examples of radiation include charged particle beams such as ultraviolet light, far ultraviolet light, visible light, X-rays, and electron beams. Among these, ultraviolet light is preferred, for example, g-rays (wavelength 436 nm) and i-rays (wavelength 365 nm). The radiation exposure dose is 0.1 to 20,000 J / m². 2 It is preferable.

[0136] <Process 3: Development process> In this step, the coating film irradiated with radiation in step 2 is developed. Specifically, the coating film irradiated with radiation in step 2 is developed with a developer to remove the irradiated portion, performing positive-type development. Examples of the developer include aqueous solutions of alkali (basic compounds). Examples of alkalis include sodium hydroxide, tetramethylammonium hydroxide, and alkalis exemplified in paragraph

[0127] of Japanese Patent Publication No. 2016-145913. From the viewpoint of obtaining appropriate developability, the alkali concentration in the aqueous alkali solution is preferably 0.1 to 5.0% by mass. Appropriate development methods include the liquid-filling method, dipping method, agitation immersion method, and shower method. The development time varies depending on the composition of the composition, but is, for example, 30 to 120 seconds. After the development step, it is preferable to rinse the patterned coating film with running water.

[0137] <Step 4: Heating step> In this step, the coating developed in step 3 is subjected to a heating process (post-bake). This allows the hardening reaction of the film to proceed, resulting in a cured film exhibiting good chemical resistance. Post-bake can be performed using a heating device such as an oven or a hot plate. Regarding the post-bake conditions, the heating temperature is, for example, 120 to 250°C. The heating time is, for example, 5 to 40 minutes when heating on a hot plate, and 10 to 80 minutes when heating in an oven. In this way, a cured film having the desired pattern can be formed on the substrate.

[0138] Furthermore, a post-exposure step may be included between steps 3 and 4 described above. By irradiating the developed coating with radiation, a cured film with excellent melt flow resistance and transparency during the heating process can be formed. Examples of radiation include charged particle beams such as ultraviolet light, far ultraviolet light, visible light, X-rays, and electron beams. Among these, ultraviolet light is preferred, for example, g-rays (wavelength 436 nm) and i-rays (wavelength 365 nm). The radiation exposure dose is 0.1 to 20,000 J / m 2 It is preferable.

[0139] The process may include a step of dry etching the cured film after step 4. Dry etching can be performed, for example, using a known dry etching apparatus. The etching gas used for dry etching can be appropriately selected depending on the mask pattern, the elemental composition of the film to be etched, etc. Examples include fluorine-based gases such as CHF3, CF4, C2F6, C3F8, SF6; chlorine-based gases such as Cl2, BCl3; oxygen-based gases such as O2, O3, H2O; reducing gases such as H2, CO, CO2, CH4, C2H2, C2H4, C2H6, C3H4, C3H6, C3H8, HF, HI, HBr, HCl, NO, NH3, BCl3; and inert gases such as He, N2, Ar. These gases can also be used in mixtures. [Examples]

[0140] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples. In the examples and comparative examples, "parts" and "%" refer to mass unless otherwise specified. In these examples, the weight-average molecular weight (Mw) and number-average molecular weight (Mn) of the polymer were measured by the following method.

[0141] [Weight-average molecular weight (Mw) and number-average molecular weight (Mn)] The Mw and Mn of the polymer were measured by the following method. • Measurement method: Gel permeation chromatography (GPC) method • Equipment: GPC-101 manufactured by Showa Denko Corporation • GPC columns: GPC-KF-801, GPC-KF-802, GPC-KF-803, and GPC-KF-804 manufactured by Shimadzu GLC Co., Ltd. • Mobile phase: tetrahydrofuran Column temperature: 40°C ·Flow rate: 1.0mL / min • Sample concentration: 1.0% by mass • Sample injection volume: 100 μL • Detector: Differential refractometer • Standard material: Monodisperse polystyrene

[0142] [monomer] The abbreviations for the monomers used in the synthesis of the polymer are as follows: (Monomers that give structural units (I)) M-1:N-methacryloyloxyethylhexahydrophthalimide M-2: Lactone methacrylate mevalonate M-3:2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole M-4: Methyl acrylate (2-methyl-2-ethyl-1,3-dioxolan-4-yl)methyl acrylate M-5: Tetrahydrofurfuryl acrylate

[0143] (Monomers that provide structural unit (II) or structural unit (III)) M-7: Methacrylic acid M-8: Glycidyl methacrylate M-9:3,4-Epoxycyclohexylmethyl methacrylate M-11: p-isopropenylphenol

[0144] (Monomers that give structural unit (IV)) M-10: Methyl methacrylate M-12: N-Cyclohexylmaleimide M-13: N-phenylmaleimide M-14: Cyclohexyl methacrylate

[0145] (Monomers that provide other structural units) M-6: Triethoxysilylpropyl methacrylate

[0146] [Synthesis Example 1] Synthesis of Polymer (A-1) In a flask equipped with a condenser and a stirrer, 12 parts of 2,2'-azimonos(isobutyrate)dimethyl, 100 parts of diethylene glycol ethyl methyl ether, and 100 parts of propylene glycol monomethyl ether were charged. Subsequently, 10 parts of methacrylic acid and 90 parts of N-methacryloyloxyethyl hexahydrophthalimide were charged, and after purging with nitrogen, the temperature of the solution was raised to 80°C while gently stirring, and this temperature was maintained for 5 hours to obtain a polymer solution containing polymer (A-1). The solid content concentration of this polymer solution was 32.5% by mass, the Mw of polymer (A-1) was 11,000, and the molecular weight distribution (Mw / Mn) was 2.2.

[0147] [Synthesis Examples 2-14] Synthesis of polymers (A-2)-(A-11) and alkali-soluble polymers (B1-1)-(B1-3) A polymer solution containing polymers (A-2) to (A-11) having the same solid content concentration, molecular weight, and molecular weight distribution as polymer (A-1), and alkali-soluble polymers (B1-1) to (B1-3) was obtained using the same method as in Synthesis Example 1, except that the components used were of the types and amounts (parts by mass) shown in Tables 1 and 2.

[0148] [Table 1]

[0149] [Table 2] (The numbers in Table 2 represent the amount (in parts) used.)

[0150] [Synthesis Example 15] Synthesis of Polyimide Polymer (B2) The polymer (B2) was synthesized in the same manner as in Synthesis Example 2 of Japanese Patent Publication No. 2023-177343 to obtain a γ-butyrolactone solution containing 25% by mass.

[0151] [Synthesis Example 16] Synthesis of Siloxane Polymer (B3) The siloxane polymer (B3) was synthesized in the same manner as in Synthesis Example 1 of Japanese Patent Publication No. 2022-551938 to obtain a propylene glycol monomethyl ether acetate solution containing 40% by mass.

[0152] <Preparation of radiation-sensitive composition> The polymer (A), alkali-soluble polymer (B), quinone diazide compound (C), and solvent (S) used in the preparation of the radiation-sensitive composition are shown below.

[0153] <Polymer (A)> A-1~A-11: Polymers synthesized in synthesis examples 1~11 (A-1)~(A-11)

[0154] <Alkali-soluble polymer (B)> B1-1~B1-3, B2, B3: Alkali-soluble polymers (B1-1)~(B1-3), polyimide polymer (B2), and siloxane polymer (B3) synthesized in Synthesis Examples 12~16.

[0155] <Quinone diazide compound (C)> C-1: Condensate of 1,1,1-tri(p-hydroxyphenyl)ethane (1.0 mol) and 1,2-naphthoquinone diazide-5-sulfonic acid chloride (2.0 mol) C-2: Condensate of 4,4'-(1-(4-(1-(4-hydroxyphenyl)-1-methylethyl)phenyl)ethylidene)bisphenol (1.0 mol) and 1,2-naphthoquinone diazide-5-sulfonic acid chloride (2.0 mol)

[0156] <Solvent (S)> S-1: Diethylene glycol methyl ethyl ether S-2: Propylene glycol monomethyl ether S-3: Methyl 3-methoxypropionate S-4: γ-Butyrolactone S-5: Ethyl lactate S-6: Propylene glycol monomethyl ether acetate

[0157] [Example 1] When the total solids content of the polymer is assumed to be 100 parts, a polymer solution containing 10 parts by mass of polymer (A-1) (solids) was mixed with 90 parts by mass of polymer (B1-1) (solids), 15 parts by mass of quinone diazide compound (C-1), and 3.5 parts by mass of quinone diazide compound (C-2). Solvent was then added so that the final solids content concentration was 21% by mass, with solvent ratios (S-1):(S-2):(S-3) = 50:25:25% by mass. The mixture was then filtered through a membrane filter with a pore size of 0.2 μm to prepare a radiation-sensitive composition.

[0158] [Examples 2-18, Comparative Examples 1-6] Radiation-sensitive compositions for Examples 2-18 and Comparative Examples 1-6 were prepared using the same method as in Example 1, except that the components used were of the types and amounts (parts by mass) shown in Table 3. The ratio of solvent in the radiation-sensitive composition was as follows: when using an alkali-soluble polymer (B), (meth)acrylic polymer (B1) was added so that (S-1):(S-2):(S-3)=50:25:25% by mass; when using a polyimide polymer (B2), (S-4):(S-5)=60:40% by mass; and when using a siloxane polymer (B3), only (S-6) was added.

[0159] [Table 3]

[0160] <Rating> [Evaluation of radiation sensitivity] A radiation-sensitive composition was applied to a silicon substrate that had been HMDS-treated at 60°C for 60 seconds using a spinner. The substrate was then pre-baked on a hot plate at 95°C for 3 minutes to form a coating with an average thickness of 5.0 μm. This coating was then irradiated with a predetermined amount of ultraviolet light from a mercury lamp through a pattern mask having a 10 μm wide line-and-space pattern. Next, development was performed using a developer consisting of a 0.5% by mass aqueous solution of tetramethylammonium hydroxide at 25°C for 80 seconds, followed by rinsing with ultrapure water for 1 minute. At this time, the minimum exposure required to form a 10 μm wide line-and-space pattern was measured.

[0161] [Evaluation of Transmittance] A radiation-sensitive composition was applied to a glass substrate that had been treated with HMDS at 60°C for 60 seconds using a spinner. The substrate was then pre-baked on a hot plate at 95°C for 3 minutes to form a coating with an average thickness of 5.0 μm. Next, development was performed using a developer consisting of a 0.5% by mass aqueous solution of tetramethylammonium hydroxide at 25°C for 80 seconds, followed by rinsing with ultrapure water for 1 minute. The transmittance was then measured using light at a wavelength of 400 nm.

[0162] [Evaluation of dry etching resistance] A radiation-sensitive composition was applied to a silicon substrate that had been HMDS-treated at 60°C for 60 seconds using a spinner. The substrate was then pre-baked on a hot plate at 95°C for 3 minutes to form a coating with an average thickness of 5.0 μm. Next, development was performed using a developer consisting of a 0.5% by mass aqueous solution of tetramethylammonium hydroxide at 25°C for 80 seconds, followed by rinsing with ultrapure water for 1 minute. Afterward, the coating was exposed to UV light for a total exposure of 300 mJ, and then heated at 230°C for 30 minutes to obtain a cured film. The roughness (Ra) of the resulting cured film was measured using an atomic force microscope after RIE dry etching for 200 seconds at a power output of 250 W and a gas ratio of CF4:O2 = 1:5 as measured by sccm. A smaller Ra value indicates higher dry etching resistance. (Evaluation Criteria) A: Less than 10nm B: 10nm to less than 20nm C:20nm or more

[0163] [Table 4]

[0164] As shown in Table 4, in Examples 1 to 18, cured films with excellent radiation sensitivity, transmittance, and dry etching resistance were formed. On the other hand, in Comparative Examples 1 to 5, radiation sensitivity was inferior compared to the examples using the same alkali-soluble polymer (B), and in Comparative Examples 5 to 6, dry etching resistance was inferior.

Claims

1. A polymer (A) containing a structural unit (I) derived from a compound having a heterocyclic structure with 5 or more ring members, Alkali-soluble polymer (B), Quinone diazide compound (C) and Solvent (S) and, It contains, The above heterocyclic structure is at least one selected from the group consisting of cyclic ether structures, cyclic ester structures, cyclic imide structures, and triazole ring-containing structures. A radiation-sensitive composition in which the content of the above-mentioned structural unit (I) is 50% by mass or more relative to the total structural units constituting the polymer (A).

2. The radiation-sensitive composition according to claim 1, wherein the polymer (A) has a structural unit (II) having a crosslinkable group.

3. The radiation-sensitive composition according to claim 1 or 2, wherein the above heterocyclic structure is a structure selected from the group consisting of the following formulas (a1) to (a5). 【Chemistry 1】 (In formulas (a1) to (a5), R １１ This is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, or two R groups bonded to the same or adjacent carbon atoms. １１ These are ring structures formed by combining with each other and bonding them together with carbon atoms. １１ If multiple R １１ They are either the same or different. R １２ This is a hydrogen atom or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms. R １３ R is a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms. １３ If multiple R １３ They are either the same or different. n1 and n2 are independent integers between 0 and 2. m1 is an integer between 1 and 3.

4. The radiation-sensitive composition according to claim 1 or 2, wherein the heterocyclic structure is a cyclic ether structure.

5. The radiation-sensitive composition according to claim 1 or 2, wherein the heterocyclic structure is a dioxolane structure.

6. The radiation-sensitive composition according to claim 1 or 2, wherein the content of polymer (A) is 1% by mass or more and 30% by mass or less with respect to the total solid content of polymer (A) and polymer (B).

7. The radiation-sensitive composition according to claim 2, wherein the crosslinkable group is a group selected from the group consisting of a carboxyl group, an amino group, an epoxy group, and an oxetanyl group.

8. The radiation-sensitive composition according to claim 1 or 2, wherein the alkali-soluble polymer (B) is a polymer (B1) containing a structural unit (III) having an alkali-soluble group, a polyimide polymer (B2), or a siloxane polymer (B3).

9. A cured film formed using the radiation-sensitive composition according to claim 1 or 2.

10. CF ４ and O ２ The cured film according to claim 9, wherein the Ra of the film surface after RIE dry etching under the condition that the sccm ratio of

11. A step of forming a coating film using the radiation-sensitive composition described in claim 1 or 2, A step of exposing at least a portion of the above coating film, The process of developing the paint film after exposure, A step of heating the developed coating film, A method for manufacturing a cured film, including the following:

12. A method for producing a cured film according to claim 11, comprising a step of dry etching the cured film after the heating step.

13. A semiconductor element comprising the cured film described in claim 9.

14. A display element comprising the cured film described in claim 9.

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