Electronic device and method for manufacturing the same

Abstract

To provide technology that can achieve high heat dissipation performance with a simple configuration. [Solution] The electronic device 1 comprises a housing 3, a circuit board 5 disposed inside the housing 3, and a package component 45 mounted on the circuit board 5. The package component 45 comprises an interposer 7 and a chip 9 and stiffener 11 disposed on the interposer 7. A heat sink 13 is provided between the chip 9 and the housing 3. A compressible heat dissipation material 53 is provided between the chip 9 and the heat sink 13. The stiffener 11 and the heat sink 13 are joined together with an adhesive that shrinks when cured.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a chip or the like.

Background Art

[0002] Conventionally, a technique of mounting a semiconductor chip on a substrate and using a heat sink to efficiently dissipate heat from the semiconductor chip is known. For example, a technique of mounting a semiconductor chip on a substrate, disposing a heat sink on the surface of the semiconductor chip, and fixing the heat sink to the substrate using a leaf spring, a screw, or the like is known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, as a result of the inventors' detailed examination, the following problems were found in the conventional technology. In the above-described technology, in order to improve the heat dissipation performance, a structure is adopted in which a support is provided on the substrate and the heat sink is fixed using a leaf spring or a screw, so there is a problem that the structure of the electronic device becomes complicated.

[0005] One aspect of the present disclosure aims to provide a technology capable of realizing high heat dissipation performance with a simple configuration.

Means for Solving the Problems

[0006] a) One aspect of the present disclosure includes a housing (3), a substrate (5) disposed in the housing, and a package component (45) mounted on the substrate. The package component includes an interposer (7), a chip (9) disposed on the interposer, and a stiffener (11).

[0007] Furthermore, a compressible heat dissipation material (53) is provided between the chip and the housing or the heat sink (13) which is arranged to conduct heat, and the chip and the housing or heat sink are joined together with an adhesive (55) that shrinks when cured.

[0008] This disclosure provides a compressible heat dissipation material between the chip and the housing or heat sink, and the stiffener and the housing or heat sink are joined with an adhesive that shrinks during curing. With this configuration, when the stiffener and the housing or heat sink are joined with an adhesive, the adhesive shrinks during curing, so the heat dissipation material is pressed and compressed by the chip and adheres tightly to the housing or heat sink. In other words, the heat dissipation material adheres tightly to the housing or heat sink while under pressure from the chip. Therefore, even with such a simple configuration, high heat dissipation performance can be achieved.

[0009] b) Another aspect of the present disclosure is a method for manufacturing an electronic device. The electronic device (1) comprises a housing (3), a substrate (5) disposed within the housing, and a package component (45) mounted on the substrate. The package component comprises an interposer (7), a chip (9) and a stiffener (11) disposed on the interposer. Furthermore, a compressible heat dissipation material (53) is provided between the chip and the housing or a heat sink (13) that is thermally conductively disposed between the housing and the housing.

[0010] In this method of manufacturing the electronic device, a compressible heat dissipation material (53) is placed between the chip and the housing or heat sink, and an adhesive (55) that shrinks during curing is applied between the stiffener and the housing or heat sink to bond the stiffener to the housing or heat sink. Subsequently, as the adhesive shrinks during curing, the chip presses against the heat dissipation material. This compresses the heat dissipation material.

[0011] With this configuration, when the stiffener is bonded (i.e., joined) to the housing or heatsink with adhesive, the heat dissipation material is compressed by the chip as the adhesive (i.e., the adhesive applied to the stiffener, housing, or heatsink being joined) shrinks, causing it to adhere tightly to the housing or heatsink. In other words, the heat dissipation material adheres tightly to the housing or heatsink while under pressure from the chip. Therefore, even with such a simple configuration, high heat dissipation performance can be achieved.

[0012] The order in which the step of placing a compressible heat dissipation material between the chip and the housing or heat sink, and the step of applying an adhesive that shrinks during curing between the stiffener and the housing or heat sink, does not matter.

[0013] Furthermore, the reference numerals in parentheses in this section and in the claims indicate a correspondence with the specific means described later in the embodiments, and do not limit the technical scope of this disclosure. [Brief explanation of the drawing]

[0014] [Figure 1] This is an explanatory diagram showing the schematic structure of the electronic device of the first embodiment, with the electronic device cut in the thickness direction (i.e., vertical direction). [Figure 2] This is an explanatory diagram that shows a magnified view of the area around the package components of an electronic device, and illustrates the electronic device as if it were fractured in the thickness direction. [Figure 3] This is a bottom view showing the enclosure as seen from the opening side. [Figure 4] This is an explanatory diagram showing the arrangement of the cover, heat sink, and interposer when viewed from the thickness direction of the electronic device. [Figure 5] Figure 5A is a plan view showing the package component from above, Figure 5B is a plan view showing the package component with adhesive applied to a part of the stiffener from above, and Figure 5C is a plan view showing the package component with adhesive applied to the entire circumference of the stiffener from above. [Figure 6]FIG. 6A is a plan view showing the heat sink as viewed from below, and FIG. 6B is a plan view showing the heat sink provided with grooves as viewed from below. [Figure 7] FIG. 3 is an explanatory view showing a schematic structure of the electronic device according to the second embodiment, in which the electronic device is broken in the thickness direction. [Figure 8] FIG. 6 is a perspective view showing the lower side of the integrated lid. [Figure 9] FIG. 9 is an explanatory view showing a main part of a modification example cut off in the thickness direction. [Embodiments for Carrying Out the Invention]

[0015] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings. [1. First Embodiment] [1-1. Configuration of Electronic Device] As shown in FIGS. 1 and 2, an electronic device (for example, an electronic control device) 1 includes a housing 3, a substrate 5, an interposer 7, a plurality of chips 9 (for example, chips 9A and 9B), a stiffener 11, a heat sink 13, and the like.

[0016] The housing 3 has a rectangular parallelepiped shape and includes a box body 17 and a cover 19. The substrate 5 is attached inside the housing 3 by a plurality of fixtures 21. The interposer 7 is mounted on the substrate 5. The plurality of chips 9 are mounted on the interposer 7. The chip 9 is, for example, a semiconductor chip as a heat generating component.

[0017] In the following, as shown in FIG. 1, in the thickness direction of the substrate 5, the side of the heat sink 13 is referred to as the upper side, and the side of the cover 19 is referred to as the lower side. Also, the case of viewing from the thickness direction (that is, the vertical direction in FIG. 1) is referred to as view A.

[0018] [1-2. Each Configuration] Hereinafter, each configuration will be described in detail. As shown in Figure 1, the box body 17 of the housing 3 comprises a rectangular plate-like portion 23 and a side portion 25 surrounding the plate-like portion 23, with an opening at the bottom. The box body 17 is, for example, a die-cast product made of aluminum alloy. The cover 19 is a rectangular plate material, as seen from view A, configured to cover the opening 17a of the box body 17. For example, aluminum alloy or iron can be used as the material for the cover 19.

[0019] A rectangular parallelepiped-shaped cooling section 27 is provided at the lower part of the central portion of the plate-like section 23 of the box body 17, and is integral with the box body 17, protruding downwards. The cooling unit 27 is, for example, a water-cooled cooler. Specifically, a portion is provided at the center of the lower side of the box body 17 that protrudes downward, and this protruding portion is the cooling unit 27. A cavity is formed inside the cooling unit 27, and it is configured so that cooling water, which serves as a refrigerant, can be introduced into the cooling unit 27. As shown in Figure 3, an inlet 29 and an outlet 31 for the cooling water are provided on the side 25 of the box body 17.

[0020] As shown in Figure 1, the heat sink 13 is a plate-shaped component used to efficiently transfer heat from the chip 9 to the cooling unit 27, and is made of a metal such as copper, which has excellent thermal conductivity. The upper surface of the heat sink 13 and the lower surface of the cooling unit 27 are joined together by an adhesive such as solder or resin, which has high heat dissipation properties.

[0021] As shown in Figures 1 and 3, four support columns 33 used to fix the substrate 5 are erected on the lower surface of the plate-like portion 23 of the box body 17, extending downwards. As shown in Figure 3, the support columns 33 are provided at the four corners of the plate-like portion 23 (i.e., corresponding to the four vertices of the rectangle) in view A. At the tip of each support column 33, there is a screw hole 33a into which the tip of the fixing device 21 that secures the substrate 5 is screwed.

[0022] The substrate 5 is a well-known printed circuit board (i.e., a PCB) and is rectangular in view A. As shown in Figure 4, fixing through holes 39 are provided at the four corners of the substrate 5 through which the fixing devices 21 are inserted.

[0023] Therefore, in order to fix the circuit board 5 to the casing 17 of the housing 3, the fixing devices 21 are positioned at the locations of the fixing through holes 39 at the four corners of the circuit board 5. In other words, the fixing devices 21 are positioned at locations corresponding to the vertices of the rectangle in view A.

[0024] Now, let's explain the structure for fixing the substrate 5. As shown in Figure 1, the substrate 5 is fixed to four support columns 33 erected on the box body 17 by four fasteners 21. The fasteners 21 are screws with heads 21a. Specifically, washers 41 are placed between the support columns 33 and the upper surface of the substrate 5, and springs 43 are placed between the lower surface of the substrate 5 and the heads 21a of the fasteners 21. For the washers 41, for example, elastic spring washers or resin materials can be used.

[0025] Therefore, the substrate 5 can be fixed to the box body 17 by passing the tip of the fixing device 21 through the fixing through hole 39 of the substrate 5 via the spring 43 and screwing it into the screw hole 33a of the support column 33 via the washer 41. Note that the spring 43 or washer 41 can be omitted.

[0026] Next, we will describe the configuration provided in the central part of the substrate 5. As shown in Figures 1 and 2, in view A, a component comprising an interposer 7, stiffener 11, chip 9, etc., is arranged in the central part of the upper surface of the substrate 5. Here, this integrated component is referred to as a package component (e.g., semiconductor package) 45.

[0027] The interposer 7 has wiring formed therein to electrically connect multiple chips 9 and wiring formed therein to electrically connect multiple chips 9 to the substrate 5. The interposer 7 and the substrate 5 are electrically connected via solder balls 47 (i.e., BGA solder) arranged in a grid. In addition, side fill 49 is provided around the periphery of the interposer 7 and the substrate 5 to reinforce the bonding strength between the interposer 7 and the substrate 5.

[0028] As shown in Figure 5A, the stiffener 11 is made of, for example, copper, and is a reinforcing material for increasing the rigidity of the interposer 7. The stiffener 11 is joined to the upper surface of the interposer 7 along the outer circumference of the interposer 7. In other words, the stiffener 11 is in the shape of a rectangular frame, and in view A, the stiffener 11 and the interposer 7 are arranged overlapping at the position shown in Figure 5A.

[0029] More specifically, the shape and dimensions of the stiffener 11 are configured such that the outer circumference of the stiffener 11 is positioned inside the outer circumference of the interposer 7 throughout its entire circumference. In other words, the stiffener 11 is slightly smaller than the interposer 7. The multiple chips 9 are positioned so that their entire circumference (i.e., the outer circumference) is surrounded by the rectangular frame-shaped stiffener 11.

[0030] As shown in Figure 6A, the heat sink 13 is a rectangular plate in view A. For example, a metal with high heat dissipation properties, such as copper or a copper alloy, can be used as the material for the heat sink 13. The heat sink 13 is joined (i.e., integrally fixed) to the lower surface of the cooling unit 27 using a bonding material with high heat dissipation properties, such as solder.

[0031] In the central portion of the heatsink 13 as seen from view A, a rectangular plate-shaped projection 51 is provided so as to protrude downwards in Figure 1. Figure 6A shows the shape of the heatsink 13 viewed from below, and in this figure, the interposer 7 and stiffener 11 are shown superimposed. In other words, as shown in Figure 6A, in view A, the protruding portion 51 of the heatsink 13 is positioned in the central part of the interposer 7 and is surrounded by the stiffener 11.

[0032] As shown in Figures 1 and 2, a compressible gel-like or similar heat dissipation material 53 is placed between the multiple chips 9 and the heat sink 13. More specifically, the heat dissipation material 53 sandwiched between the multiple chips 9 and the protruding portion 51 of the heat sink 13 is in close contact with the multiple chips 9 and the protruding portion 51 under pressure.

[0033] Furthermore, in view A, the area of ​​the heat dissipation material 53 is larger than the area of ​​the protrusion 51, so the thickness of the portion of the heat dissipation material 53 pressed by the protrusion 51 is thinner than the thickness around the protrusion 51. In other words, the central part of the heat dissipation material 53 that is in contact with the protrusion 51 is concave.

[0034] Examples of the heat dissipation material 53 include compressible gel-like heat dissipation resins (i.e., well-known heat dissipation gels). Examples include silicone resins, epoxy resins, and acrylic resins. These resins may also contain highly thermally conductive fillers such as alumina particles.

[0035] Furthermore, the rectangular upper surface of the stiffener 11 is joined to the lower surface of the heat sink 13 by an adhesive (i.e., adhesive layer 55) that has the property of shrinking when cured. In other words, since the stiffener 11 is rectangular, the stiffener 11 and the heat sink 13 are joined by adhesive in a rectangular area facing the stiffener 11, surrounding the periphery of the protruding portion 51 of the heat sink 13.

[0036] As this adhesive, for example, an adhesive that has the property of hardening and shrinking upon heating (for example, an adhesive containing a thermosetting resin) can be used. Specifically, a thermosetting adhesive such as a thermosetting epoxy resin can be used. The curing shrinkage rate of this thermosetting epoxy resin adhesive is 2-3 volume%. Examples of thermosetting adhesives include adhesives made of thermosetting epoxy resin or adhesives in which thermosetting epoxy resin is the main component (for example, the main component is 50% or more by volume), i.e., adhesives made of thermosetting epoxy resin.

[0037] Furthermore, as an adhesive, any type of non-thermosetting adhesive (for example, acrylic adhesives) that exhibits shrinkage during bonding (i.e., during curing) can be used.

[0038] <Configuration for compressing heat dissipation material> Next, we will describe the configuration for compressing the heat dissipation material 53. In this first embodiment, a compressible gel-like or similar heat dissipation material 53 is placed between the multiple chips 9 and the protruding portion 51 of the heat sink 13. Furthermore, the lower surface of the heat sink 13 and the upper surface of the stiffener 11 are joined together with an adhesive that has the property of hardening and shrinking during bonding (i.e., shrinking during hardening).

[0039] Therefore, during the manufacture of the electronic device 1, for example, an adhesive having the property of shrinking during curing is applied to the upper surface of the stiffener 11, and a heat dissipation material 53 is sandwiched between the multiple chips 9 and the protruding portion 51 of the heat sink 13, and the adhesive between the heat sink 13 and the stiffener 11 is cured. When a thermosetting epoxy resin adhesive is used as the adhesive, the adhesive is cured by heating to perform bonding.

[0040] As the adhesive hardens, it shrinks, reducing the gap between the heat sink 13 and the stiffener 11. The heat dissipation material 53 is then compressed and shrinks from both sides by the heat sink 13 and the stiffener 11. In other words, the thickness of the heat dissipation material 53 in the compressed area decreases (i.e., the heat dissipation material 53 is compressed).

[0041] As shown in Figure 5B, the adhesive can be applied to a portion of the upper surface of the stiffener 11, for example, to the four corners of the rectangular frame-shaped stiffener 11 (i.e., the shaded areas). Alternatively, as shown in Figure 5C, the adhesive can be applied to the entire circumference of the upper surface of the stiffener 11 (i.e., the shaded areas of the rectangular frame).

[0042] <Structure for pressing the substrate> Next, we will explain the structure for pressing the substrate 5. As shown below, the substrate 5 is pressed upward by the fixing device 21. Furthermore, the substrate 5 is positioned in its thickness direction (i.e., vertical direction) to press the package component 45 toward the heat sink 13.

[0043] As shown in Figure 1, the substrate 5 is fixed to four support columns 33 erected on the plate-shaped portion 23 of the box body 17 by four fasteners 21. More specifically, the fasteners 21 are fixed to the support columns 33 via elastic washers 41 and springs 43 (i.e., the substrate 5 is sandwiched between the washers 41 and springs 43), so the substrate 5 is fixed to the support columns 33 in an upward biased position as shown in Figure 1.

[0044] Then, by screwing in the fixing device 21, the washer 41 and spring 43 compress, allowing the circuit board 5 to be moved slightly upward while biased upward. This allows the circuit board 5, as well as the package components 45 and heat sink 13 located on the top surface of the circuit board 5, to be pressed upward.

[0045] Therefore, even if the heat dissipation material 53 is compressed due to the shrinkage of the adhesive during curing, causing the package components 45 to move slightly upward in Figure 1, the package components 45 remain firmly fixed to the substrate 5.

[0046] [1-2. Methods for Manufacturing Electronic Devices] Next, a brief explanation of the manufacturing method for the electronic device 1 will be given. Note that the following manufacturing method is merely an example, and various other manufacturing methods capable of producing the electronic device 1 described above can be employed.

[0047] First, the box body 17 is positioned so that its opening 17a faces upwards, and the heat sink 13 is placed on the surface of the cooling section 27 and joined together with solder or the like. Next, the heat dissipation material 53 is placed on the surface of the protruding portion 51 of the heat sink 13.

[0048] Meanwhile, a package component 45, equipped with a chip 9 and a stiffener 11, is placed on the substrate 5, and the package component 45 is reflow mounted onto the substrate 5 as is well known. That is, solder balls 47 are heated and melted to electrically connect the wiring of the package component 45 to the wiring of the substrate 5.

[0049] Next, an adhesive that shrinks during curing is applied to the upper surface of the stiffener 11. Alternatively, the adhesive may be applied to the position on the surface of the heat sink 13 where the stiffener 11 will be placed. Then, the circuit board 5 is placed inside the box 17 with the side on which the package components 45 are mounted facing downwards. At this time, the circuit board 5 is positioned so that the positions of the chip 9 and the protrusion 51 coincide (i.e., so that the heat dissipation material 53 is sandwiched between the chip 9 and the protrusion 51). This causes the adhesive on the upper surface of the stiffener 11 to come into contact with the heat sink 13.

[0050] Subsequently, as the adhesive hardens, the stiffener 11 and the heat sink 13 are joined together. At the same time, as the adhesive hardens and shrinks, the heat dissipation material 53 sandwiched between the heat sink 13 and the chip 9 is compressed.

[0051] Next, the circuit board 5 is fixed to the box body 17 using the fastener 21. After that, the cover 19 is fixed to the box body 17. [1-3. Effects] Next, the effects of this first embodiment will be described.

[0052] (1a) In the electronic device 1 of the first embodiment, a compressible heat dissipation material 53 is provided between the chip 9 and the heat sink 13, and the stiffener 11 and the heat sink 13 are joined with an adhesive that shrinks when cured. Therefore, when the stiffener 11 and the heat sink 13 are joined with an adhesive, the heat dissipation material 53 is pressed and compressed by the chip 9 as the adhesive shrinks, and adheres tightly to the heat sink 13. In other words, the heat dissipation material 53 adheres tightly to the heat sink 13 while being subjected to pressure from the chip 9. Therefore, even with such a simple configuration, high heat dissipation performance can be achieved.

[0053] (1b) In the electronic device 1 of the first embodiment, a thermosetting epoxy resin can be used as the adhesive. Also, copper or a copper alloy can be used as the material for the heat sink 13. (1c) In the electronic device 1 of the first embodiment, the stiffener 11 can be provided so as to surround the entire circumference of the multiple chips 9 in view A, that is, so as to surround the multiple chips 9 from the outside.

[0054] (1d) In the electronic device 1 of the first embodiment, the stiffener 11 may be bonded to the heat sink 13 around its entire circumference with an adhesive. Alternatively, it may be bonded to the heat sink 13 only at a part of the stiffener 11 (for example, at the corners of the square frame or their surroundings).

[0055] (1e) In the electronic device 1 of the first embodiment, when the substrate 5 is fixed by the fixing device 21, the substrate 5 is configured to press the package component 45 and the heat sink 13 upward. That is, the substrate 5 is positioned in its thickness direction to press the package component 45 toward the heat sink 13 (for example, a predetermined position in the thickness direction of the substrate 5). In other words, the substrate 5 is configured to press the package component 45 toward the heat sink 13 by itself. The substrate 5 is biased upward by the spring 43 when it is fixed by the fixing device 21. The substrate 5 is also movable in the vertical direction by the amount of deflection of the washer 41.

[0056] Therefore, even if the adhesive hardens and shrinks, causing the package components 45 to move slightly upward in Figure 1, it is possible to suppress the peeling of the package components 45 from the substrate 5. (1f) As shown in Figure 6B, a rectangular groove 59 may be provided on the lower surface of the heat sink 13, facing the rectangular stiffener 11, so as to surround the protrusion 51, as seen from view A. This has the advantage of making it easier to maintain the shape of the adhesive.

[0057] [1-4. Correspondence] Next, the relationship between this disclosure and this first embodiment will be described. The electronic device corresponds to electronic device 1, the enclosure corresponds to enclosure 3, the circuit board corresponds to circuit board 5, the interposer corresponds to interposer 7, the chips correspond to chips 9, 9A, and 9B, the stiffener corresponds to stiffener 11, the heat sink corresponds to heat sink 13, the package component corresponds to package component 45, the heat dissipation material corresponds to heat dissipation material 53, and the adhesive corresponds to adhesive layer 55.

[0058] [2. Second Embodiment] Since the basic configuration of the second embodiment is the same as that of the first embodiment, the differences from the first embodiment will be described below. Reference numerals that are the same as those in the first embodiment indicate the same components, and refer to the preceding description.

[0059] As shown in Figure 7, the electronic device 101 of this second embodiment includes a housing 103, a circuit board 105, package components 107, etc., similar to the first embodiment. The housing 103, like the first embodiment, comprises a box 109 and a cover 111, and the box 109 is equipped with a cooling unit 113. A heat sink 114 is attached to the cooling unit 113.

[0060] The circuit board 105 is fixed to each of the four support columns 117 by four fasteners (i.e., screws) 115, similar to the first embodiment. The circuit board 105 is fixed to the support columns 117 while being sandwiched between washers 119 and springs 121.

[0061] The package component 107 includes an interposer 123, an integrated lid 125, multiple chips 127, etc., and is mounted on the substrate 105 by an array of solder balls 129. Side fill 130 is provided around the interposer 123 and solder balls 129.

[0062] As shown in Figure 8, the integrated lid 125 is integrally constructed from a rectangular frame-shaped stiffener 131 and a rectangular plate-shaped lid (i.e., cover) 133 provided on one side of the stiffener 131 in the thickness direction (i.e., the lower side in Figure 8) to cover the central opening 135. The integrated lid 125 is made of a metal such as copper and is joined to the interposer 123 by adhesive on the other side (i.e., the upper side in Figure 8) of the stiffener 131A.

[0063] As shown in Figure 7, multiple chips 127 mounted on the interposer 123 are arranged in the space enclosed by the interposer 123 and the integrated lid 125, and the multiple chips 127 are bonded to the lower surface of the lid 133 with a highly heat-dissipating bonding material such as solder.

[0064] Furthermore, a compressible gel-like or similar heat dissipation material 137 is placed between the upper surface of the lid 133 and the lower surface of the heat sink 114, similar to the first embodiment. In addition, the upper surface of the square frame-shaped portion of the stiffener 131 of the integrated lid 125 is joined to the lower surface of the heat sink 114 by an adhesive (i.e., adhesive layer 139) that has the property of shrinking when cured, similar to the first embodiment.

[0065] This second embodiment provides the same effects as the first embodiment. Specifically, the adhesive shrinks during curing, and this shrinkage compresses the heat dissipation material 137, causing it to adhere firmly to the lid 133 and the heat sink 114. This enables excellent heat dissipation performance with a simple configuration.

[0066] [3. Other Embodiments] While embodiments of this disclosure have been described above, it goes without saying that this disclosure is not limited to the embodiments described above and can take various forms.

[0067] (3a) In this disclosure, the shape of the substrate and heat sink is not limited to a rectangle, but may be other polygons, etc. In other words, the planar shape is not particularly limited. (3b) In this disclosure, the number of fasteners is not limited to four, and multiple fasteners can be used.

[0068] (3c) In the above embodiment, a heat sink was used, but the heat sink may be omitted. For example, as shown in Figure 9, a protrusion 207 having a shape similar to the protrusion of the heat sink in the first embodiment may be provided on the cooling section 205 provided on the box body 203 of the housing 201, that is, on the plate material 205a on the lower side of the cooling section 205, and a compressible heat dissipation material may be placed between this protrusion 207 and the chip, similar to the first embodiment. In this case, the lower surface of the cooling section 205 and the upper surface of the stiffener are joined by an adhesive that shrinks when cured. Alternatively, the cooling section 205 may be omitted, and the protrusion 207 may be provided on the lower surface of the plate-like part 203a of the box body 203. The protrusion 207 may also be omitted.

[0069] (3d) The cooling unit may be integrated with the housing or it may be separate from the housing. If it is separate from the housing, the housing and the cooling unit may be joined together, for example, to allow for suitable heat conduction between the housing and the cooling unit. As mentioned above, the cooling unit may also be omitted.

[0070] (3e) Multiple functions of one component in each of the above embodiments may be realized by multiple components, or one function of one component may be realized by multiple components. Also, multiple functions of multiple components may be realized by one component, or one function realized by multiple components may be realized by one component. Furthermore, some of the configurations of each of the above embodiments may be omitted. Furthermore, at least some of the configurations of each of the above embodiments may be added to or replaced with the configurations of other embodiments. [Technical Concept Disclosed in This Specified Specification] [Item 1] The enclosure (3) and A circuit board (5) is placed inside the aforementioned housing, Package components (45) mounted on the aforementioned substrate, Equipped with, The package component comprises an interposer (7), a chip (9) and a stiffener (11) disposed on the interposer, A compressible heat dissipation material (53) is provided between the chip and the housing or a heat sink (13) that is heat-conductively arranged with the housing. The stiffener and the housing or the heat sink are joined together with an adhesive (55) that shrinks when cured. electronic equipment.

[0071] [Item 2] The electronic device described in item 1, The aforementioned adhesive is a thermosetting epoxy resin adhesive. electronic equipment.

[0072] [Item 3] An electronic device as described in item 1 or item 2, The stiffener is provided so as to surround the entire circumference of the chip. electronic equipment.

[0073] [Item 4] The electronic device described in item 3, The stiffener is bonded to the heat sink over its entire circumference by the aforementioned adhesive. electronic equipment.

[0074] [Item 5] An electronic device as described in any one of items 1 through 4, The stiffener (131) is integrally formed with the lid (133) that covers the opening on the heat sink side of the package component. electronic equipment.

[0075] [Item 6] An electronic device as described in any one of items 1 through 5, The substrate is used to press the package component toward the heat sink, and the pressing structure is provided. electronic equipment.

[0076] [Item 7] An electronic device as described in any one of items 1 through 6, The heat sink is made of copper or a copper alloy. electronic equipment.

[0077] [Item 8] An electronic device as described in any one of items 1 through 7, The heat sink is fixed integrally with the housing. electronic equipment.

[0078] [Item 9] A method for manufacturing an electronic device, The aforementioned electronic device (1) is The enclosure (3) and A circuit board (5) is placed inside the aforementioned housing, Package components (45) mounted on the aforementioned substrate, Equipped with, The package component comprises an interposer (7), a chip (9) and a stiffener (11) disposed on the interposer, The configuration includes a compressible heat dissipation material (53) between the chip and the housing or a heat sink (13) arranged to conduct heat with respect to the housing, The compressible heat dissipation material is placed between the chip and the housing or the heat sink, and an adhesive (55) that shrinks when cured is applied between the stiffener and the housing or the heat sink to bond the stiffener and the housing or the heat sink, and as the adhesive shrinks when cured, the chip presses and compresses the heat dissipation material. A method for manufacturing electronic devices. [Explanation of symbols]

[0079] 1, 101…Electronic device, 3, 103, 201…Enclosure, 5, 105…Circuit board, 9, 9A, 9B, 127…Chip, 13, 114…Heat sink, 15, 113, 205…Cooling section, 45, 107…Package component, 53, 137…Heat dissipation material, 55, 139…Adhesive layer

Claims

1. The enclosure (3) and A circuit board (5) is placed inside the housing, Package components (45) mounted on the aforementioned substrate, Equipped with, The package component comprises an interposer (7), a chip (9) and a stiffener (11) disposed on the interposer. A compressible heat dissipation material (53) is provided between the chip and the housing or a heat sink (13) that is heat-conductively arranged between the housing and the chip. The stiffener and the housing or the heat sink are joined together with an adhesive (55) that shrinks when cured. electronic equipment.

2. The electronic device according to claim 1, The aforementioned adhesive is a thermosetting epoxy resin adhesive. electronic equipment.

3. The electronic device according to claim 1, The stiffener is provided so as to surround the entire circumference of the chip. electronic equipment.

4. The electronic device according to claim 3, The stiffener is bonded to the heat sink over its entire circumference by the aforementioned adhesive. electronic equipment.

5. The electronic device according to claim 1, The stiffener (131) is integrally formed with the lid (133) that covers the opening on the heat sink side of the package component. electronic equipment.

6. The electronic device according to claim 1, The substrate is used to press the package component toward the heat sink, and the pressing structure is provided. electronic equipment.

7. The electronic device according to claim 1, The heat sink is made of copper or a copper alloy. electronic equipment.

8. The electronic device according to claim 1, The heat sink is fixed integrally with the housing. electronic equipment.

9. A method for manufacturing an electronic device, The aforementioned electronic device (1) is The enclosure (3) and A circuit board (5) is placed inside the housing, Package components (45) mounted on the aforementioned substrate, Equipped with, The package component comprises an interposer (7), a chip (9) and a stiffener (11) disposed on the interposer. The configuration includes a compressible heat dissipation material (53) between the chip and the housing or a heat sink (13) arranged to conduct heat with respect to the housing, The compressible heat dissipation material is placed between the chip and the housing or the heat sink, and an adhesive (55) that shrinks when cured is applied between the stiffener and the housing or the heat sink to bond the stiffener and the housing or the heat sink, and as the adhesive shrinks when cured, the chip presses and compresses the heat dissipation material. A method for manufacturing electronic devices.

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