Power converter

Abstract

To provide a power conversion device that can suppress the induction of noise into circuit boards and low-voltage wires. [Solution] The power converter 100 is configured to be mounted on the housing 200. The power converter 100 includes a circuit board 10, low-voltage wires 14 electrically connected to the circuit board 10, and a capacitor 31 to which a higher voltage than that applied to the circuit board is applied. The power converter 100 also includes metal members 20 and 40, which are different from the housing 200, and are mainly made of metal and connected to ground. The metal members 20 and 40 are arranged at least between the circuit board 10 and the capacitor 31, and between the low-voltage wires 14 and the capacitor 31.

Description

Technical Field

[0001] This disclosure relates to a power conversion device.

Background Art

[0002] As shown in Patent Document 1, there is a power conversion device in which a wire is disposed between a case and a frame. The frame holds a semiconductor module and a cooler inside. A circuit board for controlling the semiconductor module is disposed in the opening direction of the frame. The wire is electrically connected to the circuit board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, a configuration in which high - voltage components such as semiconductor modules and capacitors are arranged so as to be exposed from the frame is conceivable for the power conversion device. In such a configuration, due to the electric field around the high - voltage components, a parasitic capacitance is created between the high - voltage components and the low - voltage wires or the circuit board, and there is a risk that noise is induced in the low - voltage wires or the circuit board. Also, from the above viewpoints or other viewpoints not mentioned, further improvement of the power conversion device is required.

[0005] One object of the disclosure is to provide a power conversion device capable of suppressing noise induction in a circuit board and low - voltage wires.

Means for Solving the Problems

[0006] The power conversion device disclosed herein is a power conversion device that can be mounted on a housing, a circuit board (10), A low-voltage wire (14) electrically connected to the circuit board, High-voltage components (31, 32) to which a higher voltage is applied than that to the circuit board, It is a component different from the housing, and comprises metal components (20, 40) that are mainly made of metal and connected to the ground, The metal components are positioned at least between the circuit board and the high-voltage components, and between the low-voltage wires and the high-voltage components.

[0007] According to the power conversion device disclosed herein, the arrangement of metal components can suppress the induction of noise into the circuit board and low-voltage wires.

[0008] The various embodiments disclosed in this specification employ different technical means to achieve their respective objectives. The claims and the reference numerals in parentheses in this section are intended to illustrate an example of correspondence with parts of the embodiments described later, and are not intended to limit the technical scope. The objectives, features, and effects disclosed in this specification will become clearer by referring to the subsequent detailed description and the accompanying drawings. [Brief explanation of the drawing]

[0009] [Figure 1] This is a plan view showing the schematic configuration of a power conversion device in an embodiment. [Figure 2] This is a plan view from the direction of arrow II in Figure 1. [Figure 3] This is a plan view from the direction of arrow III in Figure 1. [Figure 4] This is a cross-sectional view along the line IV-IV in Figure 1. [Figure 5] This is a plan view showing the schematic configuration of the power conversion device in modified example 1. [Figure 6] This is a plan view showing the schematic configuration of the power converter in modified example 2. [Figure 7] This is a plan view showing the schematic configuration of the power conversion device in modified example 3. [Modes for carrying out the invention]

[0010] In the following, several embodiments for implementing this disclosure will be described with reference to the drawings. In each embodiment, parts corresponding to matters described in a prior embodiment may be denoted by the same reference numerals, and redundant descriptions may be omitted. If only a part of the configuration is described in each embodiment, other parts of the configuration can be referred to and applied to other embodiments described in advance.

[0011] In the following, the three mutually orthogonal directions are referred to as the X, Y, and Z directions. When the power converter 100 is located at the front of the vehicle, the X1 direction indicates the front of the vehicle, and the X2 direction indicates the center of the vehicle. When the power converter 100 is located at the rear of the vehicle, the X1 direction indicates the rear of the vehicle, and the X2 direction indicates the center of the vehicle. The front of the vehicle is the side in front of the center of the vehicle (the forward direction side). The rear of the vehicle is the side in rear of the center of the vehicle (the reverse direction side). The Y direction coincides with the axle axis of the vehicle.

[0012] (Embodiment) The power converter 100 of this embodiment will be described with reference to Figures 1 to 4. As shown in Figure 1, the power converter 100 is configured to be mounted on a housing 200. The power converter 100 is also configured to be mounted on a vehicle. Vehicles include electric vehicles, hybrid vehicles, and fuel cell vehicles. However, the power converter 100 can also be mounted on flying objects such as electric vertical take-off and landing aircraft and drones, as well as mobile objects such as ships, construction machinery, and agricultural machinery.

[0013] <Housing> The housing 200 houses rotating parts such as motors and gears, which are the drive source of the vehicle. The power converter 100 is mounted, for example, in the housing 200 and is integrally provided with the rotating parts. The structure in which the power converter 100 and the rotating parts are integrated can also be called a rotating body device.

[0014] The power conversion device 100 rotates the wheels via the axle by driving and controlling a motor. In the present embodiment, as an example, a power conversion device 100 electrically connected to a three-phase motor is adopted. Note that, in the present embodiment, as an example, an example in which a rotating body device is mounted in front of the vehicle is adopted.

[0015] The housing 200 is mounted, for example, under the floor of the front seat foot area of the vehicle or under the luggage compartment of the vehicle. The housing 200 may be mounted under the braking mechanism of the vehicle. Also, the housing 200 is disposed on the axle connecting the left and right wheels in the vehicle. The housing 200 is mainly composed of a metal such as aluminum or copper.

[0016] As shown in FIGS. 1, 2, and 3, the housing 200 has a bottom wall portion 210 and side wall portions 220. The bottom wall portion 210 is a portion that partitions the housing 200 from the accommodating portion of the rotating body. The side wall portions 220 are provided so as to protrude with respect to the bottom wall portion 210. The power conversion device 100 is disposed in the accommodating space defined by the bottom wall portion 210 and the side wall portions 220.

[0017] As shown in FIG. 4, the housing 200 may include a lid member 250. The lid member 250 is attached to the side wall portions 220. In this case, the accommodating space is surrounded by the bottom wall portion 210, the side wall portions 220, and the lid member 250. Note that the housing 200 is electrically connected to the ground.

[0018] As shown in FIG. 1, a vehicle-side connector 300 is attached to the side wall portions 220. The vehicle-side connector 300 is a portion for electrically connecting an electronic control device provided in the vehicle and the power conversion device 100.

[0019] As shown in Figure 3, the housing 200 (side wall portion 220) has a connector mounting portion 230 where the vehicle-side connector 300 is attached. The connector mounting portion 230 has terminals and a connector case surrounding the terminals. The connector mounting portion 230 is provided with a vehicle-side connector opening 230h. The vehicle-side connector opening 230h is a hole that penetrates the side wall portion 220. A portion of the low-voltage wire 14, which will be explained later, is placed in the vehicle-side connector opening 230h. In Figure 3, the state in which the low-voltage wire 14 is not placed is shown in order to clarify the relationship between the side wall portions 22 and 42, which will be explained later.

[0020] As shown in Figure 1, the housing 200 is provided with a PN fastening portion 240. The side wall portion 220 is provided with a through hole similar to the vehicle-side connector opening 230h at the position where the PN fastening portion 240 is provided.

[0021] The PN fastening section 240 is where the ends of the PN busbar 51 in the power converter 100 are located. The PN fastening section 240 is the part where the PN busbar 51 is fastened to the positive and negative busbars connected to the vehicle's battery. In other words, the PN fastening section 240 is a connector to which the battery is connected. The PN busbar 51 includes a high-potential busbar and a low-potential busbar. The high-potential busbar is fastened to the positive busbar. The low-potential busbar is fastened to the negative busbar. The PN fastening section 240 corresponds to a power connector.

[0022] <Power converter> As shown in Figures 1, 2, 3, and 4, the power converter 100 includes a circuit board 10, a frame 20, a capacitor 31, a semiconductor device 32, a board stay 40, and the like. The power converter 100 also includes a PN busbar 51, a three-phase busbar 52, and a capacitor busbar 53. The power converter 100 constitutes an inverter circuit with the semiconductor device 32, the PN busbar 51, the three-phase busbar 52, etc. The capacitor 31 is a smoothing capacitor connected to the inverter circuit.

[0023] The three-phase busbar 52 includes phase busbars for the three phases that are connected to the U-phase terminal, V-phase terminal, and W-phase terminal of the three-phase motor. The part indicated by reference numeral 52 indicates, for example, the part where each phase busbar and each phase terminal are fastened together. Therefore, reference numeral 52 can also be called the fastening part. As shown in Figure 1, the PN busbar 51 and the three-phase busbar 52 protrude in the same direction from the circuit board 10.

[0024] The capacitor busbar 53 includes a first busbar connected to one electrode of the capacitor 31 and a second busbar connected to the other electrode of the capacitor 31. The first busbar is connected to the high-potential busbar. The second busbar is connected to the low-potential busbar.

[0025] <Circuit board> As shown in Figures 1 and 2, the circuit board 10 includes a wiring board 11, circuit elements 12, and a board-side connector 13. The wiring board 11 has an electrically insulating base material and conductive wiring provided on the base material. Multiple circuit elements 12 and a board-side connector 13 are mounted on the wiring board 11.

[0026] The circuit element 12 and the board-side connector 13 are mounted on the surface of the wiring board 11 that aligns with the XY plane. The circuit element 12 and the board-side connector 13 are electrically connected to the wiring. The thickness of the wiring board 11 is its width in the Z direction. The XY plane is a virtual plane defined by the X-axis extending in the X direction and the Y-axis extending in the Y direction. The direction along the XY plane is also called the planar direction.

[0027] The circuit elements 12 include switching elements, resistors, capacitors, and coils. The switching elements are semiconductor switching elements such as MOSFETs and IGBTs. The circuit elements 12, together with the wiring, constitute the circuit. The circuit board 10 is equipped with control circuits and other components that control each arm element of the semiconductor device 32, which will be explained later, through the circuit elements 12 and the wiring.

[0028] The board-side connector 13 has terminals connected to the wiring and a connector case surrounding the terminals. One end of the low-voltage wire 14 is electrically connected to the terminals of the board-side connector 13. The other end of the low-voltage wire 14 is electrically connected to the terminals of the vehicle-side connector 300. The low-voltage wire 14 is electrically connected to the circuit board 10 via the board-side connector 13.

[0029] As shown in Figure 1, the low-voltage wire 14 is positioned between the substrate-side connector 13 and the vehicle-side connector 300. As shown in Figures 1 and 2, the low-voltage wire 14 is routed in the X, Y, and Z directions relative to the substrate-side connector 13. Figure 4 mainly shows a cross-section of the low-voltage wire 14 to illustrate the positional relationship between the low-voltage wire 14 and the substrate stay 40.

[0030] The circuit board 10 is electrically connected to an electronic control unit and the like via a board-side connector 13, a low-voltage wire 14, and a vehicle-side connector 300. The circuit board 10 receives control signals and is supplied with low voltage via the low-voltage wire 14. The circuit board 10 and the low-voltage wire 14 are subjected to a lower voltage than the high-voltage components 31 and 32, which will be explained later. The circuit board 10 and the low-voltage wire 14 can be considered low-voltage components.

[0031] As shown in Figures 1, 2, and 4, the circuit board 10 is fixed to the board stay 40. The circuit board 10 is fixed to the board stay 40 by a fixing member 10f. By fixing the circuit board 10 to the board stay 40, deformation and problems caused by deformation are suppressed. The fixing member 10f can be a screw member, a crimping pin, or a fixing device that utilizes elastic deformation.

[0032] <Circuit board bracket> As shown in Figures 1, 2, and 4, the substrate stay 40 has a mounting portion 41 and a side wall portion 42. The substrate stay 40 is mainly composed of metals such as aluminum and copper.

[0033] The circuit board stay 40 is fixed to the frame 20, which will be explained later. The circuit board stay 40 is fixed to the frame 20 by a fixing member 40f. The circuit board stay 40 is fixed to the frame 20 in contact with the boss 25, which will be explained later.

[0034] Furthermore, the circuit board stay 40 is in contact with the frame 20 and electrically connected to it. The frame 20 is electrically connected to ground. Therefore, the circuit board stay 40 is electrically connected to ground. The circuit board stay 40 is fixed to the housing 200 or the like. The circuit board stay 40 can also be described as a component for attaching the circuit board 10 to the housing 200.

[0035] The fixing member 40f can be a screw member, a crimping pin, a fixing device that utilizes elastic deformation, etc. Furthermore, it is preferable that the fixing member 40f is mainly composed of metal in order to facilitate the electrical connection between the substrate stay 40 and the frame 20. In this embodiment, a metal screw member is used as an example of the fixing member 40f.

[0036] As shown in Figure 4, the mounting section 41 is the area on which the circuit board 10 is mounted. In other words, the circuit board 10 is fixed to the mounting section 41. The mounting section 41 has a facing surface S41 that faces the high-voltage components 31 and 32, and a surface S42 opposite to the facing surface. The circuit board 10 is positioned facing the opposite surface S42. The mounting section 41 is also positioned between the circuit board 10 and the high-voltage components 31 and 32. The facing surface S41 and the opposite surface S42 are surfaces that align with the XY plane.

[0037] In this embodiment, a flat mounting portion 41 is used as an example. The mounting portion 41 is provided over the entire area of ​​the opposing regions of the high-pressure components 31 and 32. Here, the opposing region is the region facing one side in the Z direction. However, the mounting portion 41 may have a through hole that penetrates from the opposing surface S41 to the opposite surface S42. The mounting portion 41 corresponds to the stay base.

[0038] As shown in Figure 4, the side wall portion 42 is provided in connection with the mounting portion 41. The side wall portion 42 may be an integral part of the mounting portion 41 or it may be a separate part from the mounting portion 41. The side wall portion 42 is provided projecting from the end of the mounting portion 41. Also, the side wall portion 42 is provided projecting in a direction intersecting the mounting portion 41.

[0039] The side wall portion 42 can also be described as a portion that is bent relative to the mounting portion 41. In this embodiment, as an example, a side wall portion 42 that protrudes in the Z direction relative to the mounting portion 41 is used. The side wall portion 42 is positioned opposite the side surface S33 of the high-voltage components 31 and 32, for example. The side wall portion 42 corresponds to the stay side wall portion. In Figure 4, the side wall portion 42 is shown positioned opposite the side surface S33 of the capacitor 31.

[0040] As shown in Figure 1, the side wall portion 42 only needs to be provided on at least a part of the annular end (edge) of the mounting portion 41. The side wall portion 42 is provided on two consecutive ends of the mounting portion 41. The side wall portion 42 may be divided into a portion provided on one end and a portion provided on the other end, etc. In other words, the substrate stay 40 may have multiple side wall portions 42.

[0041] Reference numerals 42a and 42b in Figure 1 indicate the side wall ends 42a and 42b of the side wall portion 42. Therefore, it can be said that the side wall portion 42 is provided between the side wall ends 42a and 42b. Furthermore, the side wall portion 42 is provided at a position facing the low-voltage wire 14 in the X or Y direction. It can also be said that the side wall portion 42 is provided over the entire routing section of the low-voltage wire 14. Note that the side wall portion 42 may be provided around the entire circumference of the annular end of the mounting portion 41.

[0042] The substrate stay 40 corresponds to a metal component. In this embodiment, the frame 20, which will be described later, also corresponds to a metal component. Therefore, the substrate stay 40 will be described in detail later along with the frame 20.

[0043] <High-pressure components, frames> High-voltage components 31 and 32 are components to which a higher voltage than that applied to the circuit board 10 is applied. In this embodiment, a capacitor 31 and a semiconductor device 32 are used as examples of high-voltage components 31 and 32. In addition, reactors and the like can also be used for high-voltage components 31 and 32.

[0044] The capacitor 31 and the semiconductor device 32 are high-voltage circuit elements. As shown in Figure 1, the capacitor 31 and the semiconductor device 32 are arranged opposite each other on the substrate stay 40 in the Z direction.

[0045] As shown in Figure 4, the capacitor 31 has an opposing surface S31, a surface S32 opposite to the opposing surface S31, and a side surface S33 that is connected to both the opposing surface S31 and the opposite surface S32. The opposing surface S31 is the surface facing the substrate stay 40. The opposing surface S31 faces the opposing surface S41. Capacitor busbars 53 are connected to one electrode and the other electrode of the capacitor 31. The distance between the opposing surface S31 and the opposite surface S32 corresponds to the height (thickness) of the capacitor 31.

[0046] The semiconductor device 32 includes three phase upper and lower arm circuits in the inverter circuit. Each upper and lower arm circuit includes an upper arm element and a lower arm element. Each arm element can be a MOSFET, IGBT, or the like. The semiconductor device 32 can also be called a power module or power semiconductor module.

[0047] As shown in Figures 2 and 4, the capacitor 31 is mounted on the frame 20. The semiconductor device 32 is mounted on the frame 20 together with the capacitor 31. The frame 20 corresponds to a component case. The frame 20 is mainly composed of metals such as aluminum and copper.

[0048] As shown in Figures 1 and 4, the frame 20 has a bottom wall portion 21 and a side wall portion 22 connected to the bottom wall portion 21. The side wall portion 22 is a portion that protrudes from the bottom wall portion 21. The side wall portion 22 is provided in an annular shape. The frame 20 forms a housing portion 23 with the bottom wall portion 21 and the side wall portion 22. In other words, the high-voltage components 31 and 32 are housed in the housing portion 23. The side wall portion 22 is positioned opposite the side surface S33 of the capacitor 31. The side wall portion 22 corresponds to the case side wall portion.

[0049] As shown in Figures 2, 3, and 4, the side wall portion 22 has a portion that is lower than the height of the capacitor 31. In other words, the second virtual straight line VL2 along the opposing surface S31 is at a higher position than a portion of the side wall portion 22. Therefore, the capacitor 31 is mounted on the frame 20 so as to protrude from a portion of the side wall portion 22. Also, the side surface S33 includes a portion that is not positioned opposite the side wall portion 22. It can also be said that the side surface S33 includes a portion that is opposite the side wall portion 22 and a portion that is not opposite the side wall portion 22. It can also be said that the side surface S33 includes a portion that is exposed from the frame 20.

[0050] Furthermore, the frame 20 has a fixing portion 24 and a boss 25. The boss 25 is the portion to which the substrate stay 40 is fixed. In other words, the boss 25 is the portion that engages with the fixing member 40f. In this embodiment, a female screw corresponding to the fixing member 40f is provided.

[0051] The fixing portion 24 is the part of the frame 20 that is fixed to the housing 200. The fixing portion 24 is fixed to the housing 200 by a fixing member 20f. The fixing portion 24 is in contact with the housing 200 and is electrically connected to it. Therefore, the frame 20 is electrically connected to ground.

[0052] The fixing member 20f can be a screw member, a crimping pin, a fixing device that utilizes elastic deformation, etc. Furthermore, it is preferable that the fixing member 20f is primarily made of metal to facilitate electrical connection between the frame 20 and the housing 200. In this embodiment, a metal screw member is used as an example of the fixing member 20f.

[0053] <Metal components> Now, let's explain the metal components. The metal components are components that suppress the induction of noise (electrostatic induction) into the low-voltage wires 14, which is caused by the electric field around the high-voltage components 31 and 32 creating stray capacitance between the high-voltage components 31 and 32 and the low-voltage wires 14. Similarly, the metal components are components that suppress the induction of noise into the circuit board 10. In other words, the metal components can be said to be components that suppress the generation of noise from the high-voltage components 31 and 32 into the circuit board 10 and the low-voltage wires 14. Furthermore, the metal components can be said to be components that partition the space where the high-voltage components 31 and 32 are located from the space where the circuit board 10 and the low-voltage wires 14 are located. In other words, the two spaces are separated by the metal components.

[0054] In the following explanation, capacitor 31 is used as an example of high-voltage components 31 and 32. However, capacitor 31 can also be replaced with semiconductor device 32.

[0055] As described above, the power converter 100 includes a frame 20 and a substrate stay 40 as metal components. The frame 20 and the substrate stay 40 are different components from the housing 200. The frame 20 and the substrate stay 40 are mainly composed of metal. The frame 20 and the substrate stay 40 are electrically connected to ground.

[0056] As shown in Figures 1, 2, and 4, the metal members are positioned at least between the circuit board 10 and the high-voltage components 31 and 32, and between the low-voltage wires 14 and the high-voltage components 31 and 32. It can also be said that the power converter 100 shields at least a portion of the routing section of the low-voltage wires 14 and the circuit board 10 with the metal members.

[0057] As shown in Figures 1 and 4, the mounting portion 41, which is part of the metal member, is positioned between the circuit board 10 and the high-voltage components 31 and 32. More specifically, the mounting portion 41 is positioned between the circuit board 10 and the opposing surface S31 in the Z direction. In other words, the mounting portion 41 can be said to shield the circuit board 10 from the high-voltage components 31 and 32. The mounting portion 41 can also be said to demarcate the space where the high-voltage components 31 and 32 are located from the space where the circuit board 10 is located in the Z direction.

[0058] The circuit board 10 may be positioned facing only one of the capacitor 31 or the semiconductor device 32 in the Z direction. In this case, the mounting portion 41 may be positioned between the circuit board 10 and the capacitor 31 or semiconductor device 32 positioned facing the circuit board 10.

[0059] Furthermore, as shown in Figures 1, 2, and 4, the substrate stay 40 and frame 20, which are part of the metal components, are positioned between the low-voltage wire 14 and the capacitor 31. More specifically, the mounting section 41 is positioned in the Z direction between the low-voltage wire 14 and the opposing surface S31.

[0060] Furthermore, the side walls 22 and 42 are positioned adjacent to the capacitor 31 in the planar direction. In the planar direction, the side walls 22 and 42 separate the space where the high-voltage components 31 and 32 are located from the space where the low-voltage wires 14 are located.

[0061] In particular, the side wall portion 42 is positioned between the low-voltage wire 14 and the side surface S33 in the planar direction. The portion where the mounting portion 41 and the side wall portion 42 are connected is positioned between the low-voltage wire 14 and the capacitor 31 in a direction inclined with respect to the XY plane. Therefore, it can be said that the mounting portion 41 and the side wall portion 42 shield the low-voltage wire 14 from the capacitor 31.

[0062] The side wall portion 42 is provided extending from the side wall end 42a to the side wall end 42b. Furthermore, in the planar direction, the side wall portion 42 is positioned between the side surface S33 of the portion of the capacitor 31 exposed from the frame 20 and the low-voltage wire 14. Thus, the side wall portion 42 is positioned between the routing section of the low-voltage wire 14 in the Y direction and the capacitor 31. In addition, the side wall portion 42 is positioned between the routing section of the low-voltage wire 14 in the X direction and the capacitor 31.

[0063] Furthermore, it can be said that the low-voltage wire 14 is positioned in at least a portion of the opposing region of the mounting section 41 in the Z direction. Also, it can be said that the low-voltage wire 14 is positioned in at least a portion of the opposing region of the side wall section 42 in the planar direction.

[0064] Preferably, the mounting section 41 and the side wall sections 22 and 42 are positioned between the low-voltage wire 14 and the capacitor 31 throughout the entire routing section of the low-voltage wire 14. The entire routing section of the low-voltage wire 14 is the entire low-voltage wire 14 between the board-side connector 13 and the vehicle-side connector 300.

[0065] In this embodiment, an example is adopted in which the side wall portion 42 is positioned between the low-voltage wire 14 and the capacitor 31. However, in this disclosure, the side wall portion 22 may be positioned between the low-voltage wire 14 and the capacitor 31. Furthermore, in this disclosure, the side wall portions 22 and 42 may be positioned between the low-voltage wire 14 and the capacitor 31.

[0066] The low-voltage wire 14 may be positioned opposite the semiconductor device 32 in the planar direction. In this case, it is preferable that the side wall portion 42 is also positioned between the low-voltage wire 14 and the semiconductor device 32.

[0067] The metal components are not limited to the frame 20 and the substrate stay 40. The metal components may consist of only one of the frame 20 or the substrate stay 40.

[0068] <Effects> As described above, the power converter 100 has a configuration in which at least the circuit board 10 and the capacitor 31, and a metal member is placed between the low-voltage wire 14 and the capacitor 31.

[0069] The capacitor 31, which is part of the high-voltage component, creates an electric field around itself. However, the power converter 100 can block the electric field around the capacitor 31 using a metal component. In other words, the power converter 100 can block the electric field between the capacitor 31 and the low-voltage wire 14 and the circuit board 10.

[0070] Therefore, the power converter 100 can suppress the induction of noise in the low-voltage wire 14 by preventing the creation of stray capacitance between the capacitor 31 and the low-voltage wire 14 in the electric field around the capacitor 31. Similarly, the power converter 100 can suppress the induction of noise in the circuit board 10.

[0071] Furthermore, the power converter 100 can suppress noise induction by using the circuit board stay 40 for attaching the circuit board 10 to the housing 200. Therefore, the power converter 100 can suppress noise induction without providing dedicated noise countermeasures (such as magnetic shielding seeds) to the low-voltage wires 14, etc.

[0072] As shown in Figures 4 and 5, it is preferable that the portions of the side wall 22 and side wall 42 located between the low-voltage wire 14 and the capacitor 31 lie on the first virtual straight line VL1. In other words, the side wall 22 and side wall 42 are provided on the same straight line. Also, the side wall 22 and side wall 42 are positioned opposite each other in the Z direction. A gap 60 is provided between the side wall 22 and the side wall 42. The first virtual straight line VL1 is a virtual straight line extending in the Z direction.

[0073] The low-voltage wire 14 is positioned outside the gap 60. Furthermore, the low-voltage wire 14 is located outside the region enclosed by the two dashed lines passing through the gap 60 from the capacitor 31. This allows the power converter 100 to further suppress noise induction in the low-voltage wire 14 due to the electric field around the capacitor 31. The narrower the gap 60, the more effectively the power converter 100 can suppress noise induction in the low-voltage wire 14.

[0074] As shown in Figure 3, it is preferable that the side wall portions 22 and 42 are positioned in at least a portion of the space between the capacitor 31 and the vehicle-side connector opening 230h. This allows the power converter 100 to suppress the electric field around the capacitor 31 from affecting the outside of the housing 200. However, this disclosure also states that it is sufficient if either one of the side wall portions 22 and 42 is positioned in at least a portion of the space between the capacitor 31 and the vehicle-side connector opening 230h. In this case, the power converter 100 can still achieve a similar effect.

[0075] The power converter 100 is positioned either forward or backward of the vehicle's center. In this case, it is preferable that the board-side connector 13 and the vehicle-side connector 300 are positioned towards the center of the vehicle, or to the side of the vehicle's center. For example, in Figure 1, the power converter 100 is mounted at the front of the vehicle. Therefore, the board-side connector 13 is mounted on the wiring board 11 at a position that is biased towards the center (rear) of the vehicle's front. The vehicle-side connector 300 is also provided on the housing 200 to the side of the vehicle's center.

[0076] The power converter 100 can prevent damage to the low-voltage wire 14 in the event of a vehicle collision. In other words, the power converter 100 can easily continue to receive control signals on the circuit board 10 and supply low-voltage power to the circuit board 10, even in the event of a frontal or rear-end collision. Therefore, the power converter 100 can easily move the vehicle by rotating the wheels via the motor. In other words, the power converter 100 can prevent the vehicle from becoming unable to move under its own power.

[0077] As shown in Figure 1, the vehicle-side connector 300 is provided on the side wall portion 220 of the housing 200. The board-side connector 13 is provided at a position perpendicular to the side wall portion 220 on which the vehicle-side connector 300 is provided. This also makes it easier for the power converter 100 to receive control signals from the circuit board 10 and to continue supplying low-voltage power to the circuit board 10, as described above.

[0078] Furthermore, as shown in Figure 1, it is preferable that at least a portion of the low-voltage wire 14 is positioned on the opposite side of the circuit board 10 from the fastening portion 52 and the PN fastening portion 240. In other words, it is preferable that the low-voltage wire 14 is routed from the board-side connector 13 to the opposite side of the fastening portion 52 and the PN fastening portion 240, rather than to the fastening portion 52 and the PN fastening portion 240.

[0079] Preferred embodiments of the present disclosure have been described above. However, the present disclosure is not limited in any way to the above embodiments, and various modifications are possible without departing from the spirit of the present disclosure. Below, modifications 1 to 3 are described as other forms of the present disclosure. The above embodiments and modifications 1 to 3 can be implemented individually, but they can also be implemented in various combinations as appropriate. The present disclosure can be implemented in various combinations, not limited to the combinations shown in the embodiments.

[0080] (Variation 1) As shown in the modified example 1 of Figure 5, the substrate stay 40 has a protrusion 421 at the end of the side wall portion 42. The side wall portion 42 has a mounting portion 41 on one end in the Z direction and a protrusion 421 on the other end. The protrusion 421 protrudes relative to the side wall portion 42. The protrusion 421 protrudes in a direction away from the high-voltage components 31 and 32. As a result, the power converter 100 can further suppress the induction of noise into the circuit board 10 and low-voltage wires 14. Note that Figure 5 is a cross-sectional view corresponding to Figure 4.

[0081] (Modification 2) As shown in Modification 2 of Figure 6, the substrate stay 40 may include a side wall portion 422 that is inclined with respect to the mounting portion 41. The side wall portion 422 is also inclined with respect to the first virtual straight line VL1. Modification 2 can achieve the same effects as the above embodiment. Figure 6 is a cross-sectional view corresponding to Figure 4.

[0082] Furthermore, in addition to the side wall portion 422, the power converter 100 may also have a side wall portion 22 that is inclined with respect to the first virtual straight line VL1 (Z-axis). Alternatively, only the side wall portion 22 of the power converter 100 may be inclined with respect to the first virtual straight line VL1.

[0083] (Variation 3) As shown in Modification 3 of Figure 7, the power converter 100 may have a mounting portion 41 and a side wall portion 22 in contact. In Modification 3, the substrate stay 40 does not have a side wall portion 42.

[0084] Modification 3 can achieve the same effects as the above embodiment. Furthermore, in Modification 3, since the substrate stay 40 and the frame 20 are in contact, the induction of noise into the circuit board 10 can be further suppressed. Figure 7 is a cross-sectional view corresponding to Figure 4.

[0085] This disclosure is described in accordance with embodiments, but it is understood that this disclosure is not limited to such embodiments or structures. This disclosure also includes various modifications and variations within the scope of equivalents. In addition, while various combinations and forms are shown in this disclosure, other combinations and forms that include one, more, or fewer of those elements also fall within the scope and idea of ​​this disclosure.

[0086] (Disclosure of technical ideas) This specification discloses several technical concepts, as listed in the following paragraphs. Some paragraphs are written in a multiple dependent form, where subsequent paragraphs optionally refer to preceding paragraphs. Furthermore, some paragraphs are written in a multiple dependent form, referring to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical concepts.

[0087] (Technical thought 1) A power conversion device that can be mounted in a housing, Circuit board (10) and A low-voltage wire (14) electrically connected to the circuit board, High-voltage components (31, 32) to which a higher voltage is applied than that to the circuit board, A component different from the aforementioned housing, comprising a metal component (20, 40) whose main component is metal and connected to the ground, The metal member is a power conversion device located at least between the circuit board and the high-voltage component, and between the low-voltage wire and the high-voltage component.

[0088] (Technical thought 2) The power conversion device according to technical concept 1, wherein the metal member is positioned between the entire routing section of the low-voltage wire and the high-voltage component.

[0089] (Technical Thought 3) The power conversion device according to technical concept 1 or 2, wherein the metal member comprises a circuit board stay to which the circuit board is attached and a component case to which the high-voltage component is attached.

[0090] (Technical Thought 4) The substrate stay has a stay base (41) positioned between the circuit board and the high-voltage component, and a stay side wall portion (42, 422) connected to the stay base and positioned opposite the side surface (S33) of the high-voltage component. The aforementioned component case has a case side wall portion (22) that is positioned opposite to the side surface, The power conversion device according to technical concept 3, wherein either the stay side wall portion or the case side wall portion is located in at least a portion of the space between the low-voltage wire and the high-voltage component.

[0091] (Technical Thought 5) The power conversion device according to technical concept 4, wherein the portion of the stay side wall and the case side wall that are located between the low-voltage wire and the high-voltage component are on the same straight line.

[0092] (Technical Thought 6) The circuit board has a board-side connector (13) to which the low-voltage wire is electrically connected. The low-voltage wire is positioned between the board-side connector and the vehicle-side connector (300) in the power conversion device according to technical concept 4 or 5.

[0093] (Technical Thought 7) The housing is provided with a vehicle-side connector opening (230h) at the location where the vehicle-side connector is attached. The power conversion device according to technical concept 6, wherein either the stay side wall portion or the case side wall portion is located in at least a portion of the space between the high-voltage component and the vehicle-side connector opening.

[0094] (Technical Thought 8) A power conversion device located either forward or backward of the center of a vehicle, The power conversion device according to technical concept 6 or 7, wherein the board-side connector and the vehicle-side connector are located on the central side of the vehicle, or on a side more lateral than the center of the vehicle.

[0095] (Technical Thought 9) The vehicle-side connector is provided on the side wall portion (220) of the housing, The power conversion device according to any one of technical ideas 6 to 8, wherein the board-side connector is arranged on a plane perpendicular to the side wall portion of the circuit board.

[0096] (Technical Thought 10) The fastening portion (52) of the phase busbars for each of the three phases, which are electrically connected to each phase terminal of the three-phase motor, A power connector (240) is provided, on which the ends of the low-potential busbar and the ends of the high-potential busbar are located. A power conversion device according to any one of technical ideas 1 to 9, wherein at least a portion of the low-voltage wire is arranged on the circuit board on the side opposite to the fastening portion and the power connector. [Explanation of Symbols]

[0097] 10...Circuit board, 14...Low-voltage wire, 20...Frame, 40...Board stay, 100...Power converter

Claims

1. A power conversion device that can be mounted in a housing, Circuit board (10) and A low-voltage wire (14) electrically connected to the circuit board, High-voltage components (31, 32) to which a higher voltage is applied than that to the circuit board, It is a component different from the aforementioned housing, and comprises metal members (20, 40) whose main component is metal and which are connected to the ground, The metal member is a power conversion device located at least between the circuit board and the high-voltage component, and between the low-voltage wire and the high-voltage component.

2. The power conversion device according to claim 1, wherein the metal member is arranged between the entire routing section of the low-voltage wire and the high-voltage component.

3. The power conversion device according to claim 2, wherein the metal member comprises a circuit board stay to which the circuit board is attached and a component case to which the high-voltage component is attached.

4. The substrate stay has a stay base (41) positioned between the circuit board and the high-voltage component, and stay side wall portions (42, 422) connected to the stay base and positioned opposite the side surface (S33) of the high-voltage component. The aforementioned component case has a case side wall portion (22) that is positioned opposite to the side surface, The power conversion device according to claim 3, wherein either the stay side wall portion or the case side wall portion is located in at least a portion of the space between the low-voltage wire and the high-voltage component.

5. The power conversion device according to claim 4, wherein the portion of the stay side wall and the case side wall that is located between the low-voltage wire and the high-voltage component are on the same straight line.

6. The circuit board has a board-side connector (13) to which the low-voltage wire is electrically connected. The power conversion device according to claim 4 or 5, wherein the low-voltage wire is arranged between the board-side connector and the vehicle-side connector (300).

7. The housing is provided with a vehicle-side connector opening (230h) at the location where the vehicle-side connector is attached. The power conversion device according to claim 6, wherein either the stay side wall portion or the case side wall portion is located in at least a portion of the space between the high-voltage component and the vehicle-side connector opening.

8. A power conversion device located either forward or backward of the center of a vehicle, The power conversion device according to claim 6, wherein the board-side connector and the vehicle-side connector are arranged on the central side of the vehicle, or on a side more to the side of the center of the vehicle.

9. The vehicle-side connector is provided on the side wall portion (220) of the housing, The power conversion device according to claim 6, wherein the board-side connector is arranged on a plane perpendicular to the side wall portion of the circuit board.

10. The fastening portion (52) of the phase busbars for each of the three phases, which are electrically connected to each phase terminal of the three-phase motor, The power connector (240) comprises the ends of a low-potential busbar and a high-potential busbar, The power conversion device according to claim 1, wherein at least a portion of the low-voltage wire is arranged on the opposite side of the circuit board from the fastening portion and the power connector.

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