Alignment jig, part position correction device, and part position correction method

Abstract

The present invention provides an alignment jig that facilitates alignment, a component position correction device, and a component position correction method. [Solution] The alignment jig comprises a jig body having at least one projection, the at least one projection being insertable into the gap formed between the end of an electronic component mounted in the cavity of a printed circuit board and the side wall of the cavity.

Description

Technical Field

[0001] The present disclosure relates to an alignment jig, a component position correction device, and a component position correction method.

Background Art

[0002] Regarding this type of component position correction device, related techniques are disclosed in Patent Document 1.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the component mounting device described in Patent Document 1, when mounting a semiconductor chip on a substrate, an alignment protrusion located on the lower surface of the semiconductor chip is inserted into a concave portion of the substrate. At this time, the alignment protrusion laterally displaces the semiconductor chip so as to approach the center of the concave portion, thereby performing position correction so that the semiconductor chip reaches a predetermined mounting position.

[0005] However, in the component mounting device described in Patent Document 1, it is necessary to provide an alignment protrusion for each semiconductor chip. Therefore, alignment is difficult.

[0006] An object of the present disclosure is to provide an alignment jig, a component position correction device, and a component position correction method that solve the above problems.

Means for Solving the Problems

[0007] An alignment jig according to one aspect of the present disclosure comprises a jig body having at least one projection, the at least one projection being insertable into a gap formed between the end of an electronic component mounted in a cavity of a printed circuit board and the side wall of the cavity.

[0008] A component position correction method according to one aspect of the present disclosure involves preparing an alignment jig having at least one projection, mounting an electronic component in the cavity of a printed circuit board, and moving the printed circuit board or the alignment jig so that the gap formed between the end of the electronic component and the side wall of the cavity is located on an extension line along the center line of the at least one projection, thereby inserting the at least one projection into the gap. [Effects of the Invention]

[0009] According to the above embodiment, alignment is easy. [Brief explanation of the drawing]

[0010] [Figure 1] This is a front view including a partial cross-sectional view of the component position correction device related to this disclosure. [Figure 2] This is a plan view of the component position correction device related to this disclosure. [Figure 3] This is a schematic diagram of the alignment jig related to this disclosure. [Figure 4] This flowchart shows the steps of the part position correction method related to this disclosure. [Figure 5] This flowchart shows the steps of the part position correction method related to this disclosure. [Modes for carrying out the invention]

[0011] Each embodiment will be described below with reference to the drawings. In all drawings, identical or equivalent components are denoted by the same reference numerals, and common descriptions are omitted.

[0012] <First Embodiment> An embodiment of this disclosure will be described below with reference to the figures. As shown in the schematic diagrams of Figures 1 and 2, the component position correction device 1 according to this embodiment mainly consists of an alignment jig 2 and a moving means 3.

[0013] In these figures, reference numeral 10 denotes a printed circuit board, on which electronic components C are mounted via solder 11 on circuits (not shown) located on the surface. Reference numeral 12 denotes a cavity formed in a concave shape on the surface of the printed circuit board 10. Reference numeral 13 denotes the lead portion of the electronic component C, which is connected to the printed circuit board 10 via solder 11.

[0014] The alignment jig 2 comprises a jig body 5 having at least one projection 4. As shown in Figure 1, the projection 4 has a conical shape with its diameter gradually decreasing toward the bottom, and is positioned on the surface 5A (bottom surface in the drawing) of the jig body 5 that faces the printed circuit board 10. In this embodiment, as shown in Figure 2, there is an example in which there are multiple protrusions 4 (in this example, three protrusions 4A to 4C). Furthermore, these protrusions 4 have a dimension longer than the depth dimension h of the cavity 12 (see Figure 1).

[0015] The moving means 3 moves the alignment jig 2 in the directions of arrow a1 and arrow a2 in order to align it with the cavity 12 of the printed circuit board 10, and also moves it in the direction of arrow b in order to insert the projection 4 into the cavity 12. In this example, the directions of arrows a1 and a2 represent the planar direction of the printed circuit board 10 (horizontal direction in the drawing). Also, the direction of arrow b represents the direction in which the projection 4 extends (downward direction in the drawing).

[0016] Alternatively, as the means of movement 3, a suction nozzle (indicated as 3A in Figure 1) of a component mounting device for adsorbing electronic components C and mounting them onto the printed circuit board 10 may be used, or a dedicated gripping means for gripping the alignment jig 2 may be provided. Alternatively, as the moving means 3, the alignment jig 2 may be fixed, and the printed circuit board 10 may be moved relative to the alignment jig 2 to adjust the insertion position of the protrusion 4 into the cavity 12.

[0017] As shown in FIGS. 1 and 2, this moving means 3 can insert the protrusions 4 (4A to 4C) of the alignment jig 2 into the gaps 15 (15A to 15C) formed between the end portions 14 (14A to 14C) of the electronic component C mounted in the cavity 12 and the respective side wall portions of the cavity 12. Note that for the end portion 14 of the electronic component C, the end portion 14A on one side of the electronic component C is in a positional relationship adjacent to the end portions 14B and 14C on the other side. Therefore, regarding the gaps 15, the gap 15A located at the end portion 14A on one side of the electronic component C is in a positional relationship adjacent to the gaps 15B and 15C located at the end portions 14B and 14C on the other side.

[0018] In the cavity 12, insertion holes 16 for receiving the protrusions 4 (4A to 4C) of the alignment jig 2 inserted into the gaps 15 (15A to 15C) are formed. The insertion holes 16 are formed in a hemispherical shape in plan view on the respective side wall portions of the cavity 12 in accordance with the conical shape of the protrusions 4 which are the inserted bodies, and are respectively installed at positions corresponding to the protrusions 4 (4A to 4C).

[0019] Further, the jig main body portion 5 of the alignment jig 2 is further provided with a pressing member 6 for pressing the surface of the electronic component C. The pressing member 6 is installed on the opposing surface 5A of the jig main body portion 5 with respect to the printed circuit board 10, and by pressing the electronic component C from above, the position correction of the electronic component C by the protrusion 4 of the alignment jig 2 is stabilized.

[0020] And in the component position correction device 1 as described above, after mounting the electronic component C in the cavity 12 of the printed circuit board 10 via the solder 11, the protrusion 4 of the alignment jig 2 is relatively moved with respect to the gap 15 of the cavity 12 by the moving means 3. At this time, the moving means 3 moves the printed circuit board 10 in the direction of arrow a1 and arrow a2, as shown in Figure 1, so that the gap 15 formed between the end 14 of the electronic component C and the side wall portion of the cavity 12 is located on the extension line along the center line O of the protrusions 4 (4A to 4C). Figure 2 shows the stage before the projection 4 of the alignment jig 2 is moved relative to the gap 15 in the cavity 12.

[0021] Subsequently, the moving means 3 lowers the alignment jig 2 in the direction of arrow b, inserting the projections 4 (4A~4C) into the gaps 15 (15A~15C) within the cavity 12 (state shown in Figure 1).

[0022] Here, the projection 4 has a conical shape that tapers downwards in the figure. Therefore, when it descends through the gap 15 of the cavity 12 in the direction of arrow b, it presses against the end 14 of the electronic component C, correcting its position in the directions of arrows a1 and a2 so that the electronic component C is in the correct position. At this time, the pressing member 6 located on the lower side of the jig body 5 can stabilize the position correction of the electronic component C by the projection 4 of the alignment jig 2 by pressing down on the electronic component C from above.

[0023] Furthermore, since the component position correction device 1 described above has a configuration specifically designed for correcting the position of electronic components C, consisting of an alignment jig 2 and a moving means 3, there is no need to provide protrusions for each electronic component as in the past, and the overall configuration for mounting components on the printed circuit board 10 can be simplified. Therefore, alignment is easier.

[0024] Furthermore, in the above-described component position correction device 1, at least one projection 4 is provided on the alignment jig 2. The projection 4 presses against the end 14 of the electronic component C, thereby correcting the position of the electronic component C to the correct position. Therefore, alignment is easier.

[0025] Furthermore, the component position correction device 1 can correct the position of the electronic component C to the correct position by inserting the projection 4 (4A) into the gap 15 (15A) formed on one side of the electronic component C, thereby pressing the end 14 of the electronic component C along the direction of arrow a1. Furthermore, the component position correction device 1, by inserting the projections 4 (4B, 4C) into the gaps 15 (15B, 15C) formed on the other side adjacent to one side of the electronic component C, presses the end portion 14 of the electronic component C in the direction of arrow a2, thereby enabling position correction in the planar direction. In other words, the component position correction device 1, by providing multiple protrusions 4 (4A to 4C), can press the end portion 14 (14A to 14C) of the electronic component C at multiple locations, thereby correcting the position of the electronic component C to a more appropriate position.

[0026] Furthermore, since the projection 4 of the component position correction device 1 has a dimension longer than the depth dimension h of the cavity 12, the projection 4 can constantly press against the end 14 of the electronic component C when it descends, enabling efficient position correction of the electronic component C.

[0027] Furthermore, since the component position correction device 1 has a hemispherical insertion hole 16 formed in the side wall of the cavity 12 into which the projection 4 is inserted, even if the gap 15 is narrow, the projection 4 can be inserted into the gap 15 through the insertion hole 16. Furthermore, the above-mentioned component position correction device 1 is further equipped with a pressing member 6 that presses against the surface of the electronic component C on the jig body 5 of the alignment jig 2, thereby enabling stable position correction of the electronic component C by the projection 4.

[0028] (Variation 1) In the above embodiment, as shown in Figure 2, one projection 4 (4A to 4C) is inserted into each of the gaps 15 (15A to 15C) located on three sides of the electronic component C to correct the position of the electronic component C. In this embodiment, three protrusions 4 (4A to 4C) are provided, but at least one is sufficient. That is, by inserting at least one protrusion 4 (4A to 4C) into a single gap 15, the position of the electronic component C can be corrected.

[0029] (Modification 2) In the above embodiment, as shown in Figure 2, one projection 4 (4A to 4C) is inserted into each of the gaps 15 (15A to 15C) located on three sides of the electronic component C to correct the position of the electronic component C. However, this is not the only option; multiple protrusions 4 may be inserted into the gaps 15 (15A to 15C) located on each side of the electronic component C, and the number of protrusions to be installed is not limited.

[0030] (Variation 3) In the above embodiment, a conical projection 4 that tapers downwards is used. Here, the inclination angle of the surface of the projection 4 may be varied according to the size of the gap 15 located on each side of the electronic component C.

[0031] <Second Embodiment> An embodiment of this disclosure will be described below with reference to the figures.

[0032] As shown in the schematic diagram of Figure 3, the alignment jig 100 according to this embodiment includes a jig body 102 having at least one projection 101. At least one projection 101 can be inserted into the gap formed between the end of an electronic component mounted in the cavity of the printed circuit board and the side wall of the cavity.

[0033] According to the alignment jig 100 of this embodiment, the projection 101 can be inserted into the gap in the cavity of the printed circuit board. Therefore, alignment is easy.

[0034] <Third Embodiment> An embodiment of this disclosure will be described below with reference to the figures. Figure 4 is a flowchart showing step S of the part position correction method according to this disclosure. Furthermore, in describing the part position correction method according to this embodiment, we will refer to the structure shown in the first embodiment.

[0035] [Step S1] Prepare an alignment jig 2 having at least one cone-shaped projection 4.

[0036] [Step S2] An electronic component C is mounted inside the cavity 12 of the printed circuit board 10 using a suction nozzle 3A or the like.

[0037] [Step S3] The alignment jig 2 is moved in the directions of arrows a1 and a2 using a suction nozzle 3A or the like so that the gap 15 formed between the end 14 of the electronic component C and the side wall portion of the cavity 12 is located on the extension line along the center line O of at least one projection 4.

[0038] [Step S4] By lowering the alignment jig 2 toward the printed circuit board 10 in the direction of arrow b, at least one projection 4 is inserted into the gap 15.

[0039] Furthermore, the above-described component position correction method can utilize an alignment jig 2 having at least one conical projection 4, that is, an alignment jig 2 specifically designed for correcting the position of electronic components C. As a result, the component position correction method according to this embodiment makes it possible to correct the position of electronic components C without providing a protrusion for each electronic component C as in the past, and simplifies the configuration related to component position correction on the printed circuit board 10.

[0040] In this embodiment of the component position correction method, the position of the electronic component C in the cavity 12 of the printed circuit board 10 can be corrected by inserting the projection 4 (4A) of the alignment jig 2 into the gap 15 (15A) formed in the end portion 14 (14A) that forms one side of the electronic component C. However, the above-described component position correction method can also correct the position of electronic component C by inserting the projections 4 (4B, 4C) of the alignment jig 2 into the gap 15 (15B, 15C) on the side of the end 14 (14B, 14C) adjacent to the end 14 (14A) of electronic component C. In other words, in the above-described component position correction method, by providing multiple protrusions 4 (4A to 4C), the ends 14 (14A to 14C) of the electronic component C can be pressed at multiple points, thereby correcting the position of the electronic component C to a more appropriate location.

[0041] Furthermore, in the component position correction method according to this embodiment, when inserting the projection 4 into the gap 15, the pressing member 6 located on the lower side of the jig body 5 presses down on the electronic component C from above, thereby stabilizing the position correction of the electronic component C.

[0042] Furthermore, in the component position correction method according to this embodiment, the projection 4 of the alignment jig 2 is moved relative to the printed circuit board 10 using a suction nozzle 3A or the like, but the method is not limited to this, and the alignment jig 2 may be fixed in place, and the printed circuit board 10 may be moved relative to the alignment jig 2.

[0043] <Fourth Embodiment> An embodiment of this disclosure will be described below with reference to the figures. Figure 5 is a flowchart showing step S of the part position correction method according to this disclosure.

[0044] [Step S11] Prepare an alignment jig that includes a jig body having at least one projection.

[0045] [Step S12] Electronic components are mounted within the cavities of the printed circuit board.

[0046] [Step S13] The printed circuit board or alignment jig is moved so that the gap formed between the edge of the electronic component and the side wall of the cavity is located on the extension of the center line of at least one protrusion.

[0047] [Step S14] By moving the alignment jig toward the printed circuit board, at least one protrusion is inserted into the gap.

[0048] According to the position correction method of this embodiment, a protrusion can be inserted into the gap in the cavity of the printed circuit board. Therefore, alignment is easier.

[0049] Although the present disclosure has been described above with reference to embodiments, the present disclosure is not limited to the embodiments described above. Various modifications can be made to the structure and details of the present disclosure as can be understood by those skilled in the art. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0050] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0051] (Note 1) The jig body comprises at least one projection, The at least one projection is insertable into the gap formed between the end of an electronic component mounted in the cavity of the printed circuit board and the side wall of the cavity. Alignment jig.

[0052] (Note 2) The aforementioned at least one projection includes a plurality of projections, The alignment jig described in Appendix 1.

[0053] (Note 3) The at least one projection is inserted into the gap formed on one side of the electronic component. Alignment jig as described in Appendix 1 or 2.

[0054] (Note 4) The plurality of protrusions are inserted into the gap formed on one side of the electronic component and on the other side adjacent to that side. The alignment jig described in Appendix 2.

[0055] (Note 5) The jig body comprises three projections, each inserted into a gap located on a different side of the electronic component. Alignment jig as described in Appendix 2 or 4.

[0056] (Note 6) The at least one projection has a conical shape, A hemispherical insertion hole into which at least one projection is inserted is formed in the side wall portion of the cavity. The alignment jig described in any one of the appendices 1 to 5.

[0057] (Note 7) The jig body further comprises a pressing member for pressing the surface of the electronic component. The alignment jig described in any one of the appendices 1 through 6.

[0058] (Note 8) A positioning jig described in any one of the appendices 1 to 7, The system includes a moving means for adsorbing the alignment jig and moving it into the gap, Component position correction device.

[0059] (Note 9) Prepare an alignment jig that includes a jig body having at least one projection, Electronic components are mounted in the cavities of the printed circuit board. Move the printed circuit board or the alignment jig so that the gap formed between the end of the electronic component and the side wall of the cavity is located on the extension line along the center line of the at least one protrusion. Insert the at least one projection into the gap, Method for correcting component position.

[0060] (Note 10) The aforementioned end is one side of the electronic component. The part position correction method described in Appendix 9.

[0061] (Note 11) The jig body further comprises a pressing member, Insert the at least one projection so that the pressing member presses against the surface of the electronic component. The part position correction method described in Appendix 9 or 10.

[0062] (Note 12) The aforementioned at least one projection includes a plurality of projections, The part position correction method described in any one of the appendices 9 to 11.

[0063] (Note 13) The at least one projection is inserted into the gap formed on one side of the electronic component. The part position correction method described in any one of the appendices 9 to 12.

[0064] (Note 14) The plurality of protrusions are inserted into the gap formed on one side of the electronic component and on the other side adjacent to that side. The part position correction method described in Appendix 12.

[0065] (Note 15) The jig body comprises three projections, each inserted into a gap located on a different side of the electronic component. The part position correction method described in Appendix 12 or 14.

[0066] (Note 16) The at least one projection has a conical shape, A hemispherical insertion hole into which at least one projection is inserted is formed in the side wall portion of the cavity. The part position correction method described in any one of the appendices 9 to 13.

[0067] (Note 17) The alignment jig is attracted and moved into the gap. The part position correction method described in any one of the appendices 9 to 16. [Explanation of Symbols]

[0068] 1. Part position correction device 2. Alignment jig 3. Means of transportation 3A Suction Nozzle 4 protrusions 4A protrusion 4B protrusion 4C protrusion 5. Main body of the jig 5A Opposing surface 6 Pressing member 10 Printed circuit boards 11 Solder 12 Cavity 13 Lead section 14 End 14A End 14B End 14C End 15 gaps 15A gap 15B Gap 15C gap 16 Insertion hole 100 Alignment jig 101 Protrusion 102 Jig body C Electronic components

Claims

1. The jig body comprises at least one projection, The at least one projection is insertable into the gap formed between the end of an electronic component mounted in the cavity of the printed circuit board and the side wall of the cavity. Alignment jig.

2. The aforementioned at least one projection includes a plurality of projections, The alignment jig according to claim 1.

3. The at least one projection is inserted into the gap formed on one side of the electronic component. The alignment jig according to claim 1 or 2.

4. The plurality of protrusions are inserted into the gap formed on one side of the electronic component and on the other side adjacent to that side. The alignment jig according to claim 2.

5. The jig body comprises three projections, each inserted into a gap located on a different side of the electronic component. The alignment jig according to claim 2.

6. The at least one projection has a conical shape, A hemispherical insertion hole into which at least one projection is inserted is formed in the side wall portion of the cavity. The alignment jig according to claim 1 or 2.

7. The jig body further comprises a pressing member for pressing the surface of the electronic component. The alignment jig according to claim 1 or 2.

8. The alignment jig according to claim 1 or 2, The system includes a moving means for adsorbing the alignment jig and moving it into the gap, Component position correction device.

9. Prepare an alignment jig that includes a jig body having at least one projection, Electronic components are mounted in the cavities of the printed circuit board. Move the printed circuit board or the alignment jig so that the gap formed between the end of the electronic component and the side wall of the cavity is located on the extension line along the center line of the at least one protrusion. Insert the at least one projection into the gap, Method for correcting component position.

10. The aforementioned end is one side of the electronic component. The part position correction method according to claim 9.

11. The jig body further comprises a pressing member, Insert the at least one projection so that the pressing member presses against the surface of the electronic component. The part position correction method according to claim 9 or 10.

12. The aforementioned at least one projection includes a plurality of projections, The part position correction method according to claim 9 or 10.

13. The at least one projection is inserted into the gap formed on one side of the electronic component. The part position correction method according to claim 9 or 10.

14. The plurality of protrusions are inserted into the gap formed on one side of the electronic component and on the other side adjacent to that side. The part position correction method according to claim 12.

15. The jig body comprises three projections, each inserted into a gap located on a different side of the electronic component. The part position correction method according to claim 12.

16. The at least one projection has a conical shape, A hemispherical insertion hole into which at least one projection is inserted is formed in the side wall portion of the cavity. The part position correction method according to claim 9 or 10.

17. The alignment jig is attracted and moved into the gap. The part position correction method according to claim 9 or 10.

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