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A novel bonding method for micro LED displays enhances productivity by temporarily bonding semiconductor chips in a sealed bag and pressurizing within a heating furnace, addressing the inefficiencies of traditional bonding methods.

JP2026084252APending Publication Date: 2026-05-21KK TOKAI RIKA DENKI SEISAKUSHO

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Patent Information

Authority / Receiving Office: JP · JP
Patent Type: Applications
Current Assignee / Owner: KK TOKAI RIKA DENKI SEISAKUSHO
Filing Date: 2024-11-11
Publication Date: 2026-05-21

Application Information

Patent Timeline

11 Nov 2024

Application

21 May 2026

Publication

JP2026084252A

IPC: H10W72/00; H10H20/852

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Technology Topics

Semiconductor chip Heating furnace

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AI Technical Summary

Technical Problem

The bonding process for large numbers of LED chips on a circuit board in micro LED displays requires significant pressing force and time, leading to reduced productivity.

Method used

A bonding method involving temporary bonding of semiconductor chips to a circuit board with an adhesive layer, storing in a gas barrier sealed bag, and heating and pressurizing the sealed bag within a medium-filled heating furnace to bond the chips to the board.

Benefits of technology

This method increases productivity by allowing uniform and precise bonding without the need for precise pressure control, simplifying the process and reducing defects.

✦ Generated by Eureka AI based on patent content.

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Figure 2026084252000001_ABST

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Abstract

This will improve productivity when bonding semiconductor chips to circuit boards. [Solution] A bonding method comprising the steps of: temporarily bonding at least one semiconductor chip to a circuit board provided with a plurality of bump electrodes via an adhesive layer so as to face the bump electrodes; placing the circuit board with the temporarily bonded semiconductor chips in a gas barrier sealed bag and sealing the bag; and placing at least one of the sealed bags containing the circuit boards into a heating furnace filled with a medium, and bonding the semiconductor chips to the circuit board by heating and pressurizing the sealed bags via the medium.

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