Method for processing wafers and apparatus for processing wafers

Abstract

To provide wafer processing equipment that can improve productivity without becoming uneconomical. [Solution] The wafer processing apparatus 2 includes a cassette table on which a cassette is placed that houses a frame unit 14 in which the wafer 16 and the frame 18 are integrated by tape 20, with the wafer 16 positioned in the opening 18a of the frame 18 which has an opening 18a in the center for housing the wafer 16; a holding means 6 which includes a chuck table 30 having a ring-shaped protrusion 34 formed therein for sucking and fixing the outer circumference of the wafer 16 via tape 20 and a recess 36 formed in the center, and a frame support part 32 for supporting and fixing the frame 18; a division starting point forming means which forms a starting point for division corresponding to the planned division line 24 of the wafer 16; and a division means 10 which supplies air to the recess 36 of the chuck table 30 to inflate the tape 20 and divide the wafer 16 into individual device chips 22.

Description

Technical Field

[0001] The present invention relates to a wafer processing method and a wafer processing apparatus for dividing a wafer formed on a surface, in which a plurality of devices are partitioned by a division planned line, into individual device chips.

Background Art

[0002] A wafer formed on a surface, in which a plurality of devices such as ICs and LSIs are partitioned by a division planned line, is divided into individual device chips, and the divided device chips are used in electric devices such as mobile phones and personal computers. Examples of a dividing device for dividing a wafer into individual device chips include a dicing device, a laser processing device, and a scribing device.

[0003] The dicing device includes: holding means for holding a frame unit in which a wafer is positioned in an opening of a frame having an opening for accommodating the wafer at the center and the wafer and the frame are integrated by a tape; cutting means for positioning a cutting blade on the wafer held by the holding means and cutting a division planned line while supplying cutting water; and cleaning means for cleaning the frame unit in which the wafer is divided into individual device chips. When the wafer is subjected to cutting processing in the dicing device, the wafer in a state of being divided into individual device chips is carried out of the dicing device.

[0004] The laser processing device includes: holding means for holding a wafer; and laser beam irradiation means for irradiating a laser beam having a wavelength that is transmissive to the wafer held by the holding means to form a modified layer serving as a starting point of division inside the division planned line. When the wafer is subjected to laser processing in the laser processing device, the wafer in which the modified layer serving as the starting point of division is formed inside the division planned line is carried out of the laser processing device. Thereafter, the wafer in which the starting point of division is formed is transported to a dividing device for dividing the wafer into individual device chips (see, for example, Patent Document 1).

[0005] The scribe apparatus includes a holding means for holding a wafer and a scribe groove forming means for forming scribe grooves that serve as the starting points for division on the wafer held by the holding means along the division line. When the wafer is processed in the scribe apparatus, the wafer with scribe grooves forming on the division line is discharged. Subsequently, the wafer with the division starting points formed is transported to a division apparatus that divides the wafer into individual device chips (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2013-058671 [Overview of the project] [Problems that the invention aims to solve]

[0007] When using laser processing equipment or scribe equipment, the wafer with the starting point for splitting must be transported to the splitting equipment, which results in poor productivity. Furthermore, integrating a splitting device with laser processing equipment or scribe equipment makes the equipment large and costly, making it uneconomical.

[0008] The object of the present invention is to provide a wafer processing method and a wafer processing apparatus that can improve productivity without being uneconomical. [Means for solving the problem]

[0009] According to the present invention, the following wafer processing method is provided that solves the above problems. That is, A wafer processing method for dividing a wafer, which has multiple devices partitioned by division lines and formed on its surface, into individual device chips, A frame unit forming step involves positioning a wafer in the opening of a frame having an opening in the center for housing the wafer, and integrating the wafer and frame with tape to form a frame unit, A mounting step involves placing and fixing a frame unit onto a holding means that includes a chuck table having a ring-shaped protrusion formed therein for sucking and fixing the outer circumference of the wafer via tape and a recess formed in the center, and a frame support part for supporting and fixing the frame. A division starting point formation process that forms a division starting point corresponding to the planned division line of the wafer, A splitting step in which air is supplied to the recess of the chuck table to inflate the tape and split the wafer into individual device chips, A method for processing wafers including is provided.

[0010] In the splitting starting point formation process, the focal point of a laser beam with a wavelength that is transparent to the wafer is positioned inside the planned splitting line, and the laser beam is irradiated onto the wafer to form a modified layer that will serve as the starting point for splitting. In the splitting starting point formation process, a scribe groove that will serve as the starting point for splitting may be formed corresponding to the planned splitting line.

[0011] Furthermore, the present invention provides the following wafer processing apparatus that solves the above problems. That is, A wafer processing apparatus for dividing a wafer, which has multiple devices partitioned by division lines and formed on its surface, into individual device chips, A cassette table on which a cassette is placed houses a frame unit in which the wafer and frame are integrated by tape, with the wafer positioned in the opening of the frame having an opening in the center for housing the wafer, and A holding means comprising a chuck table having a ring-shaped protrusion formed therein for suctioning and fixing the outer circumference of the wafer via tape, and a recess formed in the center, and a frame support part for supporting and fixing the frame, A splitting starting point forming means that forms a splitting starting point corresponding to the planned splitting line of the wafer, A splitting means that supplies air to the recess of the chuck table to inflate the tape and split the wafer into individual device chips, A wafer processing apparatus including the following is provided.

[0012] The division starting point forming means is preferably a laser beam irradiation means that positions the focal point of a laser beam with a wavelength that is transparent to the wafer inside the division line and irradiates the wafer with the laser beam to form a modified layer that will serve as the starting point for division. The division starting point forming means may also be a scribe groove forming means that forms a scribe groove that will serve as the starting point for division, corresponding to the division line. [Effects of the Invention]

[0013] The wafer processing method of the present invention is A wafer processing method for dividing a wafer, in which multiple devices are partitioned by division lines and formed on the surface, into individual device chips, A frame unit forming step involves positioning a wafer in the opening of a frame having an opening in the center for housing the wafer, and integrating the wafer and frame with tape to form a frame unit, A mounting step involves placing and fixing a frame unit onto a holding means that includes a chuck table having a ring-shaped protrusion formed therein for sucking and fixing the outer circumference of the wafer via tape and a recess formed in the center, and a frame support part for supporting and fixing the frame. A division starting point formation process that forms a division starting point corresponding to the planned division line of the wafer, A splitting step in which air is supplied to the recess of the chuck table to inflate the tape and split the wafer into individual device chips, Since this is included, the splitting process can be carried out by supplying air to the recess of the chuck table while the frame unit is held in place by the holding means used in the mounting process. Therefore, the effort of transporting the wafer with the splitting starting point formed to the splitting device is eliminated, and productivity can be improved without being uneconomical.

[0014] The wafer processing apparatus of the present invention is a wafer processing apparatus for dividing a wafer having a plurality of devices formed on its surface and partitioned by a division planned line into individual device chips, a cassette table on which a cassette for accommodating a frame unit in which a wafer is positioned in an opening of a frame having an opening for accommodating the wafer at the center and the wafer and the frame are integrated by a tape is placed, holding means including a chuck table having a ring-shaped convex portion for sucking and fixing the outer periphery of the wafer through a tape and a concave portion formed at the center, and a frame support portion for supporting and fixing the frame, division starting point forming means for forming a starting point of division corresponding to the division planned line of the wafer, division means for supplying air to the concave portion of the chuck table to expand the tape and divide the wafer into individual device chips, [[ID= twelfth]]Since it includes, by supplying air to the concave portion of the chuck table in a state where the frame unit is held by the holding means, the wafer can be divided into individual device chips. Therefore, the labor of transporting the wafer with the division starting point formed to the dividing apparatus can be saved, and the productivity can be improved without being uneconomical.

Brief Description of the Drawings

[0015] [Figure 1] Perspective view of the wafer processing apparatus according to the present invention. [Figure 2] Perspective view of the frame unit. [Figure 3] Perspective view of the holding means shown in FIG. 1. [Figure 4] Schematic cross-sectional view of the chuck table shown in FIG. 3. [[ID=3 of]] [Figure 5] Schematic diagram showing the frame unit forming process. [Figure 6] Schematic diagram showing the mounting process. [Figure 7] Schematic diagram of the frame unit held by the holding means. [Figure 8] Schematic diagram showing the division starting point forming process. [Figure 9] (a) Partial cross-sectional view of a wafer in which a modified layer has been formed as a splitting starting point, (b) Partial cross-sectional view of a wafer in which a scribe groove has been formed as a splitting starting point. [Figure 10] A schematic diagram illustrating the division process. [Modes for carrying out the invention]

[0016] (Wafer processing equipment 2) First, preferred embodiments of the wafer processing apparatus according to the present invention will be described with reference to the drawings. As shown in Figure 1, the wafer processing apparatus 2 includes a cassette table 4, a holding means 6, a splitting starting point forming means 8, and a splitting means 10.

[0017] (Cassette table 4 of processing device 2) A cassette 11 containing multiple frame units spaced apart vertically is placed on the cassette table 4. The cassette table 4 is vertically movable, and by raising or lowering the cassette table 4, any frame unit within the cassette 11 can be moved to the temporary storage table 13 by the loading / unloading means 12. The loading / unloading means 12 moves the frame units before processing from the cassette 11 to the temporary storage table 13, and also moves the processed frame units positioned on the temporary storage table 13 back into the cassette 11.

[0018] Figure 2 shows a frame unit 14 that can be housed in a cassette 11. The frame unit 14 is formed by positioning a disc-shaped wafer 16 in the opening 18a of an annular frame 18, which has a circular opening 18a in the center for housing the wafer 16, and integrating the wafer 16 and the frame 18 with a tape 20. The wafer 16 may be formed from a suitable semiconductor material such as silicon. Multiple devices 22 such as ICs and LSIs are demarcated on the surface 16a of the wafer 16 by grid-like division lines 24. The back surface 16b of the wafer 16 is attached to the circular tape 20, and the periphery of the tape 20 is attached to the inner periphery of the frame 18, thereby integrating the wafer 16 and the frame 18 with the tape 20. Alternatively, the surface 16a of the wafer 16 may be attached to the tape 20.

[0019] (Holding means 6 of processing device 2) The holding means 6 will be described with reference to Figures 3 and 4. The holding means 6 comprises a chuck table 30 that supports the wafer 16 and a frame support portion 32 that supports and fixes the frame 18.

[0020] (Chuck table 30 of holding means 6) The upper surface of the chuck table 30 has a ring-shaped protrusion 34 that sucks and fixes the outer circumference of the wafer 16 via the tape 20, and a circular recess 36 in the center. The diameter of the ring-shaped protrusion 34 corresponds to the diameter of the wafer 16, and the outer circumference of the wafer 16 is placed on the upper end of the protrusion 34. In addition, multiple suction holes 34a are provided at intervals in the circumferential direction on the upper end of the protrusion 34. As shown in Figure 4, the suction holes 34a are connected to the suction source 40 via a first flow path 38. A first on-off valve 42 is installed in the first flow path 38. In the chuck table 30, the first on-off valve 42 is opened, and suction force is generated in the suction holes 34a by the suction source 40, thereby sucking and fixing the outer circumference of the wafer 16 via the tape 20. As shown in Figure 4, the suction holes 34a are also connected to the air source 46 via a second flow path 44, and a second on-off valve 48 is installed in the second flow path 44.

[0021] Furthermore, the chuck table 30 is machine-feeded in the X-axis direction indicated by arrow X in Figure 1 by an X-axis feed mechanism (not shown), and indexed-feeded in the Y-axis direction indicated by arrow Y in Figure 1 by a Y-axis feed mechanism (not shown). The X-axis feed mechanism and Y-axis feed mechanism may be ball screw type feed mechanisms. Note that the XY plane defined by the X-axis direction and Y-axis direction is substantially horizontal.

[0022] (Frame support portion 32 of the holding means 6) As shown in Figure 3, the frame support portion 32 in this embodiment is configured as a clamp that grips the outer circumference of the frame 18 of the frame unit 14. Multiple frame support portions 32 (four in this embodiment) are provided on the outer circumference of the chuck table 30 at intervals in the circumferential direction.

[0023] (Means for forming the dividing starting point of the processing device 2 8) The splitting starting point forming means 8 forms a splitting starting point corresponding to the planned splitting line 24 of the wafer 16. The splitting starting point forming means 8 may be configured, for example, as a laser beam irradiation means that forms a modified layer 50 (see Figure 9(a)) which will serve as the splitting starting point inside the wafer 16 along the planned splitting line 24. In this case, the splitting starting point forming means 8 (laser beam irradiation means) comprises an oscillator (not shown) that emits a laser beam LB with a wavelength that is transparent to the wafer 16, and a concentrator 52 (see Figures 1 and 8) that focuses the laser beam LB emitted by the oscillator and irradiates the wafer 16 of the frame unit 14 held by the holding means 6.

[0024] Alternatively, the division starting point forming means 8 may be configured as a scribe groove forming means that forms a scribe groove 54 (see Figure 9(b)) on the upper surface of the wafer 16, which will serve as the starting point for division, corresponding to the planned division line 24. The scribe groove forming means may form the scribe groove 54 by ablation processing using laser irradiation, or it may form the scribe groove 54 with a diamond cutter (not shown). The scribe groove forming means that forms the scribe groove 54 by ablation processing comprises an oscillator (not shown) that emits a laser beam with a wavelength absorbed by the wafer 16, and a concentrator 52 that focuses the laser beam emitted by the oscillator and irradiates the wafer 16 of the frame unit 14 held by the holding means 6.

[0025] (Dividing means 10 of processing device 2) The splitting means 10 supplies air to the recess 36 of the chuck table 30 to inflate the tape 20 and split the wafer 16 into individual device chips 22. As shown in Figures 3 and 4, the splitting means 10 comprises an opening 56 formed in the recess 36 of the chuck table 30, the air source 46 connected to the opening 56 via a third flow path 58 (see Figure 4), and a third on-off valve 60 installed in the third flow path 58. The splitting means 10 then opens the third on-off valve 60 and supplies air from the air source 46 from the opening 56 to the recess 36 to inflate the tape 20, thereby splitting the wafer 16, where the splitting starting point has been formed, into individual device chips 22.

[0026] As shown in Figure 1, the wafer processing apparatus 2 of this embodiment further includes a transport means 62 for transporting the frame unit 14 between the temporary placement table 13 and the holding means 6, an imaging means 64 for imaging the wafer 16 of the frame unit 14 held by the holding means 6, and a display means 66 for displaying the image captured by the imaging means 64.

[0027] (Wafer processing method) Next, a wafer processing method according to the present invention will be described. Here, a method for dividing the wafer 16 into individual device chips 22 using the processing apparatus 2 described above will be explained.

[0028] (Frame unit formation process) In this embodiment, first, as shown in Figure 5, the wafer 16 is positioned in the opening 18a of a frame 18 which has an opening 18a in the center for housing the wafer 16, and a frame unit forming process is carried out in which the wafer 16 and the frame 18 are integrated with a tape 20 to form a frame unit 14.

[0029] (Placement process) After the frame unit formation process is carried out, a mounting process is performed in which the frame unit 14 is placed on and fixed to a holding means 6 which includes a chuck table 30 having a ring-shaped protrusion 34 formed therein for sucking and fixing the outer circumference of the wafer 16 via the tape 20 and a recess 36 formed in the center, and a frame support part 32 for supporting and fixing the frame 18.

[0030] In the loading process, first, a cassette 11 containing multiple frame units 14 is placed on the cassette table 4 of the processing apparatus 2. Next, the frame units 14 are loaded from the cassette 11 to the temporary storage table 13 by the loading / unloading means 12. Then, the frame units 14 are transported from the temporary storage table 13 to the holding means 6 positioned at the transfer position (position shown in Figure 1) by the transport means 62. At this time, the wafer 16 of the frame unit 14 is positioned on the chuck table 30 of the holding means 6, and the frame 18 of the frame unit 14 is positioned on the frame support portion 32 of the holding means 6 (see Figure 6). Next, with the first on-off valve 42 open and the second and third on-off valves 48 and 60 closed, a suction force is generated by the suction source 40 at the suction hole 34a of the protrusion 34 of the chuck table 30. The generated suction force is used to suck the outer circumference of the wafer 16 via the tape 20 and fix it to the protrusion 34. Furthermore, as shown in Figure 7, the frame 18 is secured by being sandwiched between the frame support portion 32.

[0031] (Split starting point formation process) After the mounting process is performed, a splitting starting point formation process is carried out to form the starting point for splitting corresponding to the planned splitting line 24 of the wafer 16.

[0032] (Forms a modified layer 50 as the starting point for division) In the splitting starting point formation process, for example, the focal point of a laser beam LB with a wavelength that is transparent to the wafer 16 can be positioned inside the planned splitting line 24, and the laser beam LB can be irradiated onto the wafer 16 to form a modified layer 50 that will serve as the starting point for splitting.

[0033] In the process of forming the starting point for splitting, when forming the modified layer 50, first, the holding means 6 that fixes the frame unit 14 is positioned directly below the imaging means 64, and the wafer 16 is imaged by the imaging means 64. Next, the planned splitting line 24 is aligned in the X-axis direction based on the image of the wafer 16 captured by the imaging means 64. Then, the laser beam LB is aimed at the planned splitting line 24 aligned in the X-axis direction, and the focal point of the laser beam LB is positioned inside the wafer 16. Then, as shown in Figure 8, while the chuck table 30 is processed and fed in the X-axis direction, a laser beam LB with a wavelength that is transparent to the wafer 16 is irradiated onto the wafer 16 from the condenser 52. This makes it possible to form the modified layer 50, which will be the starting point for splitting, inside the planned splitting line 24. When forming the modified layer 50, it is preferable to irradiate the laser beam LB with varying heights of the focal point and form multiple modified layers 50 within the same planned division line 24 at vertical intervals (see Figure 9(a)). Adjacent modified layers 50 in the vertical direction may be connected by cracks (not shown) extending from the modified layer 50.

[0034] Next, the holding means 6 or the light concentrator 52 is indexed and fed in the Y-axis direction by the amount of the spacing in the Y-axis direction of the division lines 24. Then, by alternately repeating the irradiation of the laser beam LB and indexing and feeding, the modified layer 50 is formed along all of the division lines 24 aligned in the X-axis direction. After rotating the chuck table 30 by 90 degrees, the irradiation of the laser beam LB and indexing and feeding are alternately repeated. In this way, the modified layer 50 is formed along all of the division lines 24 that are orthogonal to the division lines 24 on which the modified layer 50 was previously formed. In this way, the modified layer 50 is formed in a grid pattern inside the wafer 16 along the grid-like division lines 24.

[0035] (A scribe groove 54 is formed as the starting point for division.) In the division starting point formation process, a scribe groove 54 that will serve as the starting point for division may be formed corresponding to the planned division line 24. The scribe groove 54 can be formed by laser ablation or by using a diamond cutter (not shown).

[0036] (Scribing groove 54 is formed by ablation process) When forming the scribe groove 54 by ablation, first, the holding means 6 that fixes the frame unit 14 is positioned directly below the imaging means 64, and the wafer 16 is imaged by the imaging means 64. Next, the division line 24 is aligned in the X-axis direction based on the image of the wafer 16 captured by the imaging means 64. Then, the laser beam is aimed at the division line 24 aligned in the X-axis direction, and the focal point of the laser beam is positioned on the surface 16a of the wafer 16. Then, while the chuck table 30 is fed in the X-axis direction, a laser beam with a wavelength that is absorbed by the wafer 16 is irradiated onto the wafer 16 from the condenser 52. This allows ablation to be performed on the surface 16a of the wafer 16, and the scribe groove 54, which will be the starting point for division, can be formed along the division line 24. Furthermore, similar to the case in which the modified layer 50 is formed, ablation and indexing feed are repeated alternately to form scribe grooves 54 in a grid pattern along the grid-like division lines 24 on the surface 16a of the wafer 16. When forming the scribe grooves 54 by ablation, it is advisable to coat the surface 16a of the wafer 16 with a protective film such as a water-soluble resin beforehand to prevent debris from adhering to the surface 16a of the wafer 16.

[0037] (Scribing groove 54 is formed with a diamond cutter) When forming the scribe grooves 54 with a diamond cutter, first, the holding means 6 that fixes the frame unit 14 is positioned directly below the imaging means 64, and the wafer 16 is imaged by the imaging means 64. Next, the division line 24 is aligned in the X-axis direction based on the image of the wafer 16 captured by the imaging means 64. Then, the cutting edge of the diamond cutter is positioned directly above the division line 24 aligned in the X-axis direction. Then, while the chuck table 30 is machine-feeded in the X-axis direction, the cutting edge of the diamond cutter is made to cut into the surface 16a of the wafer 16. This allows the scribe grooves 54, which will be the starting point of the division, to be formed on the surface 16a of the wafer 16 along the division line 24. Also, similar to when forming the modified layer 50, the formation of the scribe grooves 54 with the diamond cutter and indexing feed are repeated alternately, forming scribe grooves 54 in a grid pattern on the surface 16a of the wafer 16 along the grid-like division line 24.

[0038] (splitting process) After performing the splitting starting point formation process, a splitting process is performed in which air is supplied to the recess 36 of the chuck table 30 to inflate the tape 20 and split the wafer 16 into individual device chips 22. In the splitting process, while maintaining the fixation of the frame unit 14 by the holding means 6 (suction of the wafer 16 and clamping of the frame 18), the third on-off valve 60 is opened and air from the air source 46 is supplied to the recess 36 from the opening 56. As a result, since the fixation of the frame unit 14 by the holding means 6 is maintained, the pressure inside the recess 36 increases and the tape 20 of the frame unit 14 inflates. As a result, the wafer 16 is split into individual device chips 22 along the grid-like splitting starting points (modified layer 50 or scribe groove 54). In Figure 10, the grid-like splitting grooves (splitting grooves from the surface 16a to the back surface 16b of the wafer 16) formed along the planned splitting line 24 of the wafer 16 are indicated by reference numeral 68. Then, once the wafer 16 has been divided into individual device chips 22, the third on / off valve 60 is closed to stop the supply of air to the recess 36.

[0039] (Storage process) After the splitting process is carried out, a storage process is performed to house the frame unit 14 in the cassette 11. In the storage process, first the holding means 6 is positioned at the transfer position (the position shown in Figure 1). Next, the first on-off valve 42 is closed to eliminate the suction force of the suction hole 34a, releasing the suction fixation of the wafer 16 and releasing the fixation of the frame 18 by the frame support part 32. Next, the frame unit 14 is transported from the holding means 6 to the temporary storage table 13 by the transport means 62. When transferring the frame unit 14 from the holding means 6 to the transport means 62, the second on-off valve 48 is opened and air from the air source 46 is supplied to the suction hole 34a, making it easier for the frame 18 to separate from the protrusion 34 of the chuck table 30. Then, the frame unit 14 is transported from the temporary storage table 13 to the cassette 11 by the loading / unloading means 12.

[0040] As described above, in this embodiment, the wafer 16 can be divided into individual device chips 22 by supplying air to the recess 36 of the chuck table 30 while the frame unit 14 is held by the holding means 6. Therefore, the effort of removing the wafer 16, on which the starting point for division (modified layer 50 or scribe groove 54) is formed, from the processing apparatus 2 and transporting it to a division apparatus (not shown) that divides the wafer 16 into individual device chips 22 is eliminated, thus improving productivity without being uneconomical. [Explanation of Symbols]

[0041] 2: Wafer processing equipment 4: Cassette Table 6: Holding means 8: Division starting point forming means 10:Dividing means 11: Cassette 14: Frame Unit 16: Wafer 16a: Wafer surface 16b: Back side of the wafer 18: Frame 18a: Frame opening 20: Tape 22: Device (device chip) 24: Planned division line 30: Chuck Table 32: Frame support section 34: Convex part 36: Recess 50: Modified layer 54: Scribe groove

Claims

1. A wafer processing method for dividing a wafer, in which multiple devices are partitioned by division lines and formed on the surface, into individual device chips, A frame unit forming step involves positioning a wafer in the opening of a frame having an opening in the center for housing the wafer, and integrating the wafer and frame with tape to form a frame unit, A mounting step involves placing and fixing a frame unit onto a holding means that includes a chuck table having a ring-shaped protrusion formed therein for sucking and fixing the outer circumference of the wafer via tape and a recess formed in the center, and a frame support part for supporting and fixing the frame. A division starting point formation process that forms a division starting point corresponding to the planned division line of the wafer, A splitting step in which air is supplied to the recess of the chuck table to inflate the tape and split the wafer into individual device chips, A method for processing wafers including [a specific component].

2. The wafer processing method according to claim 1, wherein in the splitting starting point formation step, the focal point of a laser beam with a wavelength that is transparent to the wafer is positioned inside the line to be split, and the laser beam is irradiated onto the wafer to form a modified layer that will serve as the starting point for splitting.

3. The wafer processing method according to claim 1, wherein in the division starting point formation step, a scribe groove that serves as the starting point for division is formed corresponding to the planned division line.

4. A wafer processing apparatus for dividing a wafer, which has multiple devices partitioned by division lines and formed on its surface, into individual device chips, A cassette table on which a cassette is placed houses a frame unit in which the wafer and frame are integrated by tape, with the wafer positioned in the opening of the frame having an opening in the center for housing the wafer, and A holding means comprising a chuck table having a ring-shaped protrusion formed therein for suctioning and fixing the outer circumference of the wafer via tape, and a recess formed in the center, and a frame support part for supporting and fixing the frame, A splitting starting point forming means that forms a splitting starting point corresponding to the planned splitting line of the wafer, A splitting means that supplies air to the recess of the chuck table to inflate the tape and split the wafer into individual device chips, A wafer processing apparatus that includes [a specific component].

5. The wafer processing apparatus according to claim 4, wherein the splitting starting point forming means is a laser beam irradiation means that positions the focal point of a laser beam with a wavelength that is transparent to the wafer inside the line to be split, irradiates the wafer with the laser beam, and forms a modified layer that will serve as the starting point for splitting.

6. The wafer processing apparatus according to claim 4, wherein the division starting point forming means is a scribe groove forming means that forms a scribe groove corresponding to the division line, which serves as the starting point for division.

Images