Power modules and power converters

Abstract

To provide a power module and power conversion device that can improve the efficiency of space utilization. [Solution] The power module 1 comprises a circuit board 10 having one or more power semiconductor elements (IPMs), and a cooler 11 having a flow path for a cooling medium to cool the circuit board. The cooler is integrated with the circuit board by being bonded to one surface of the circuit board, and connection terminals 101 to 103 connected to an edge connector are provided at the end of the circuit board. The inlet 110a and outlet 111a of the flow path open in the direction of connection of the connection terminals to the edge connector.

Description

Technical Field

[0001] The present invention relates to a power module and a power conversion device.

Background Art

[0002] Regarding a power module and a power conversion device, for example, Patent Document 1 describes that in a PCU (Power Control Unit), a plurality of power modules each mounted with transistors are arranged on a base frame and cooled by a cooling device at the lower part of the base frame.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In recent years, the thickness of switching elements such as transistors has been reduced and power modules have been miniaturized. However, even when the power module is miniaturized, large high-voltage components (such as capacitors) are provided in the power conversion device and are housed in the case together with a plurality of power modules. Therefore, the space generated by the thinning of the power module cannot be efficiently utilized, and it is difficult to miniaturize the power conversion device.

[0005] Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a power module and a power conversion device capable of improving the utilization efficiency of space.

Means for Solving the Problems

[0006] The power module of the present invention comprises a circuit board having one or more power semiconductor elements, and a cooler having a flow path for a cooling medium to cool the circuit board, wherein the cooler is integrated with the circuit board by being bonded to one surface of the circuit board, and connection terminals connected to an edge connector are provided at the end of the circuit board, and the inlet and outlet of the flow path open in the direction of connection of the connection terminals to the edge connector.

[0007] In the power module described above, the one or more power semiconductor elements may be embedded inside the circuit board.

[0008] The power conversion device of the present invention comprises a plurality of power modules, a plate member having a plate channel that communicates with the channel of each of the plurality of power modules, and a plurality of edge connectors arranged on the plate surface of the plate member and connected to the connection terminals of the circuit board of each of the plurality of power modules. The plate surface of the plate member is provided with a plurality of connection holes that communicate with the plate channel and are connected to the inlet and outlet of the channel of each of the plurality of power modules, and the plurality of power modules are arranged with one side of the circuit board overlapping in a direction along the plate surface of the plate member.

[0009] Another power conversion device of the present invention comprises a plurality of power modules, a plate member having a plate channel that communicates with the channel of each of the plurality of power modules, a substantially plate-shaped adapter erected substantially perpendicular to the plate surface of the plate member and having an adapter channel through which the cooling medium flows, connected to the plate channel, and a plurality of connection holes provided on the plate surface of the adapter that communicate with the adapter channel and are connected to the inlet and outlet of the channel of the plurality of power modules, respectively, and are connected to the connection terminals of the circuit board of each of the plurality of power modules, and a plurality of edge connectors arranged alternately with one set of the plurality of connection holes on the plate surface of the adapter in a direction substantially perpendicular to the plate surface of the plate member, wherein the plurality of power modules are arranged with one side of the circuit board overlapping in a direction substantially perpendicular to the plate surface of the plate member.

[0010] In the power conversion device described above, the edge connector may have a fixing portion for fixing the power module to the edge connector. [Effects of the Invention]

[0011] According to the present invention, the efficiency of space utilization can be improved. [Brief explanation of the drawing]

[0012] [Figure 1] Figure 1(A) is a plan view showing the front of the power module of the embodiment. Figure 1(B) is a plan view showing the side of the power module of the embodiment. Figure 1(C) is a plan view showing the rear of the power module of the embodiment. Figure 1(D) is a plan view showing the bottom of the power module of the embodiment. Figures 1(E) and 1(F) are cross-sectional views showing an example of the internal configuration of the cooler. [Figure 2] Figure 2(A) is a plan view showing the connection structure of the power module's destination from above. Figures 2(B) and 2(C) are plan views showing an example of how the power module is connected to the connection structure. [Figure 3]Figure 3(A) is a plan view showing the front of the power module and edge connector of another embodiment. Figure 3(B) is a plan view showing the top of the power module and edge connector of another embodiment. Figure 3(C) is a plan view showing the front of the power module and edge connector of yet another embodiment. Figure 3(D) is a plan view showing the top of the power module and edge connector of yet another embodiment. [Figure 4] Figure 4(A) is a top view showing an example of a PCU. Figure 4(B) is a side view showing an example of a PCU. [Figure 5] Figure 5(A) is a top view showing an example of another PCU. Figure 5(B) is a side view showing an example of another PCU. Figure 5(C) is a cross-sectional view along the DD line in Figure 5(A). [Figure 6] Figure 6(A) is a plan view showing an example of an adapter in a front view. Figure 6(B) is a cross-sectional view along the EE line in Figure 6(A). [Modes for carrying out the invention]

[0013] (Power module) Figure 1(A) is a plan view showing the front of the power module 1 of the embodiment. Figure 1(B) is a plan view showing the side of the power module 1 of the embodiment. Figure 1(C) is a plan view showing the rear of the power module 1 of the embodiment. Figure 1(D) is a plan view showing the bottom of the power module 1 of the embodiment. The power module 1 has an integrated circuit board 10 and a cooler 11. The circuit board 10 is provided on the front side of the power module 1, and the cooler 11 is provided on the rear side of the power module 1. Figures 1(A) to 1(D) show the X, Y, and Z directions which are orthogonal to each other. The X, Y, and Z directions are similarly shown in the other drawings thereafter.

[0014] The circuit board 10 has, for example, a rectangular shape. Two IPMs (Intelligent Power Modules) 100 are mounted on the circuit board 10 as an example of power semiconductor elements. The IPMs 100 are embedded inside the circuit board 10. The IPMs 100 include switching elements such as IGBTs (Insulated Gate Bipolar Transistors) and freewheeling diodes connected in parallel to the switching elements, and these are incorporated into the circuit board 10. Therefore, the power module 1 can be made thinner compared to when the IPMs 100 are surface-mount type chips. Note that the IPMs 100 may also be formed as surface-mount type chips.

[0015] The Z-direction end 10a of the circuit board 10, which is one side in the longitudinal direction (X-direction), is provided with a plurality of connection terminals 101 to 103 that are connected to an edge connector, which will be described later. For example, connection terminal 101 is the positive side input terminal, connection terminal 102 is the negative side input terminal, and connection terminal 103 is the output terminal.

[0016] The cooler 11 has a substantially rectangular parallelepiped shape. The cooler 11 cools the circuit board 10. The cooler 11 has a bonding surface 11s that is joined to the board surface 10s of the circuit board 10. The board surface 10s of the circuit board 10 and the bonding surface 11s of the cooler 11 are joined in a state where they face each other in the Y direction. In this case, the bonding means may include, but is not limited to, adhesives or fastening mechanisms such as bolts.

[0017] The cooler 11 is integrated with the circuit board 100 by being bonded to the board surface 10s of the circuit board 10. Therefore, the circuit board 100 can dissipate heat from the board surface 10s. Note that the end portion 10a of the board surface 10s, on which the connection terminals 101 to 103 are provided, is not bonded to the bonding surface 11s, but is exposed so that it can be connected to an edge connector. Here, the board surface 10s of the circuit board 10 is an example of one side of the circuit board 10.

[0018] On the side surface 11e of the cooler 11 located on the end 10a side of the circuit board 10, an inflow portion 110 and an outflow portion 111 of the cooling water for cooling the circuit board 10 are provided. The inflow portion 110 and the outflow portion 111 each have a cylindrical shape and project from the side surface 11e toward the negative side in the Z direction. The inflow portion 110 has an inlet 110a through which the cooling water flows in, and the outflow portion 111 has an outlet 111a through which the cooling water flows out. The inlet 110a and the outlet 111a have, for example, a circular shape, but are not limited to this shape.

[0019] FIG. 1(E) and FIG. 1(F) are cross-sectional views showing an example of the internal configuration of the cooler 11. FIG. 1(E) shows a cross-section taken along the line A-A in FIG. 1(C), and FIG. 1(F) shows a cross-section taken along the line B-B in FIG. 1(D). Inside the cooler 11, a flow path 112 through which the cooling water flows is provided. The flow path 112 communicates with the inlet 110a and the outlet 111a.

[0020] The cooler 11 has a cover portion 11a and a base portion 11b connected to each other. The base portion 11b is formed of a metal with high thermal conductivity and has a rectangular plate shape. The cover portion 11a has a box shape with one side of a hollow substantially rectangular parallelepiped open, and by sealing the open surface with the base portion 11b, a substantially rectangular parallelepiped-shaped flow path 112 is formed inside. The inflow portion 110 and the outflow portion 111 are provided on the side surface 11e of the cover portion 11a, and the cooling water enters the flow path 112 from the inlet 110a (see reference sign Cin) and exits to the outside from the outlet 111a (see reference sign Cout). Note that, as a connecting means between the cover portion 11a and the base portion 11b, a waterproof adhesive can be mentioned, but it is not limited to this.

[0021] On the plate surface of the base portion 11b, a plurality of cylindrical fins 113 are provided so as to be immersed in the flow path 112. The fins 113 are erected in a direction substantially perpendicular to the plate surface of the base portion 11b (the negative side in the X direction). The opposite surface of the fin 113 is a joint surface 11s, and the heat generated from the circuit board 10 is transmitted from the joint surface 11s to the fins 113 and cooled by the cooling water. Thus, since the cooler 11 includes a plurality of fins 113, the heat dissipation area increases as compared with the case where there are no fins 113. Note that the cooling water is an example of a cooling medium.

[0022] The inlet 110a and outlet 111a of the flow path 112 open in the direction of connection (negative side in the Z direction) to the connection terminals 101-103 for the edge connector. Therefore, by providing an opening for the cooling water passage adjacent to the edge connector to which it is connected, the power module 1 can be connected in any direction. The connection structure of the destination to which the power module 1 is connected is described below.

[0023] (Connection structure) Figure 2(A) is a top view plan showing the connection structure 2 to which the power module 1 is connected. Figures 2(B) and 2(C) are plan views showing an example of how the power module 1 and the connection structure 2 are connected. In Figure 2(B), the cross section of the base plate 3 along the CC line in Figure 2(A) and the cooler 11 are shown in a front view along the Y direction, and in Figure 2(C), the circuit board 10 and the edge connector 20 are shown in a front view along the Y direction. In Figures 2(A) and 2(B), components common to Figures 1(A) to 1(F) are denoted by the same reference numerals, and their explanations are omitted.

[0024] The connection structure 2 is provided, for example, on the base plate 3 of the PCU and has an edge connector 20 and connection holes 21 and 22. The base plate 3 is the bottom plate of the PCU and is made of, for example, a highly rigid metal. The plate surface 3a of the base plate 3 is provided with a pedestal portion 30 that protrudes from the plate surface 3a to the positive side in the Z direction. The pedestal portion 30 supports the cooler 11 in the Z direction. Note that the base plate 3 is an example of a plate member.

[0025] The edge connector 20 is formed of, for example, resin. The edge connector 20 has a main body 200 and a pair of plate parts 23. The main body 200 has a box shape with one side of a roughly rectangular parallelepiped open. The main body 200 has a slot 200a that opens in the Z direction and extends in the X direction. The end 10a of the circuit board 10 is inserted into the slot 200a. Connector terminals 201 to 203 are provided on the inner wall of the slot 20a, which are connected to the connection terminals 101 to 103 of the circuit board 10, respectively. The connector terminals 201 to 203 are each formed as a pair of leaf springs that hold and fix the connection terminals 101 to 103 in place.

[0026] A pair of plate portions 23 are provided at both ends of the main body portion 200 in the longitudinal direction (X direction). The plate portions 23 are located at the bottom of the edge connector 20 in the Z direction so as to contact the plate surface 3a of the base plate 3. Through holes 23a for inserting bolts BT are formed in the plate portions 23, and the edge connector 20 is fixed to the base plate 3 by bolts BT inserted through the plate portions 23. Note that the illustration of the bolt BT holes on the base plate 3 side is omitted.

[0027] Furthermore, the connection holes 21 and 22 are circular in shape and are provided on the base portion 30 of the base plate 3 so as to be adjacent to the edge connector 20 in the Y direction. In the Z direction, the dimensions of the base portion 30 are substantially equal to the distance from the side surface 11e of the cooler 11 to the end surface 10a of the circuit board 10. The connection holes 21 and 22 are arranged side by side in the X direction near both ends of the main body portion 200 in the X direction. The connection holes 21 and 22 communicate with plate flow paths 210 and 220 provided inside the base plate 3, respectively. Cooling water flows between the plate flow paths 210 and 220 and a cooling system (not shown) including an external pump.

[0028] The inlet 110 and outlet 111 of the cooler 11 are inserted into the connection holes 21 and 22, respectively (see dotted arrows). Here, a sealing structure such as a ring-shaped rubber member is provided between the inlet 110 and outlet 111 and the connection holes 21 and 22 to prevent leakage of cooling water. As the inlet 110 and outlet 111 are inserted into the connection holes 21 and 22, respectively, the inlet 110a of the flow path 112 of the cooler 11 is connected to the connection hole 21, and the outlet 111a of the flow path 112 of the cooler 11 is connected to the connection hole 22.

[0029] As a result, the flow path 112 of the cooler 11 and the plate flow paths 210 and 220 of the base plate 3 are connected. Cooling water flows from one plate flow path 210 into the flow path 112 of the cooler 11 to cool the circuit board 10, and is discharged from flow path 112 into the other plate flow path 220. The plate flow paths 210 and 220 extend along the Y direction inside the base plate 3.

[0030] The power module 1 is connected by moving in the connection direction d relative to the connection structure 2. The connection direction d is approximately perpendicular to the plate surface 3a of the base plate 3. When the power module 1 is connected, the connection terminals 101 to 103 of the circuit board 10 are connected to the connector terminals 201 to 203 of the edge connector 20, respectively, and the inlet 110a and outlet 111a of the flow path 112 of the cooler 11 are connected to the connection holes 21 and 22 of the base plate 3, respectively.

[0031] Thus, the power module 1 has a configuration in which the cooler 11 and the circuit board 10, which have the same connection direction d to the connection structure 2, are integrated by surface-to-surface bonding. Therefore, in devices such as PCUs, it can be connected in any direction while having the function to sufficiently cool the IPM 100, which generates a lot of heat. Thus, the power module 1 can improve the efficiency of space utilization within the device. Note that the orientation of each power module 1 is not limited to the orientation in which the surface 10s of the circuit board 10 is perpendicular to the surface 5a of the base plate 3 as in this example, but may also be in an orientation in which the surface 10s of the circuit board 10 is tilted at a certain angle with respect to the surface 5a of the base plate 3.

[0032] (Other examples) Figure 3(A) is a plan view showing the front of the power module 1 and edge connector 20 of another embodiment. Figure 3(B) is a plan view showing the top of the power module 1 and edge connector 20 of another embodiment. Figures 3(A) and 3(B) show the state in which the circuit board 10 is inserted into the edge connector 20. In Figures 3(A) and 3(B), components common to Figures 1(A) to 1(F) and Figures 2(A) to 2(C) are denoted by the same reference numerals, and their descriptions are omitted.

[0033] The edge connector 20 has a pair of claws 24 for securing the circuit board 10. The claws 24 are elastic and extend from both ends of the main body 200 in the longitudinal direction (X direction) toward the connection direction (Z direction) of the circuit board 10. The tips 24a of the claws 24 are bent in the X direction and engage with notches 10b formed on both ends of the circuit board 10 in the X direction. This secures the circuit board 10 to the edge connector 20. The claws 24 are an example of a fixing part for securing the power module 1 to the edge connector 20.

[0034] Figure 3(C) is a plan view showing the front of the power module 1 and edge connector 20 in yet another embodiment. Figure 3(D) is a plan view showing the top of the power module 1 and edge connector 20 in yet another embodiment. Figures 3(C) and 3(D) show the state in which the circuit board 10 is inserted into the edge connector 20. In Figures 3(C) and 3(D), components common to Figures 1(A) to 1(F) and Figures 2(A) to 2(C) are denoted by the same reference numerals, and their descriptions are omitted.

[0035] The edge connector 20 is provided with a pair of roughly columnar fixing parts 25 for securing the cooler 11. The fixing parts 25 are adjacent to the positive side in the Y direction at both ends of the main body 200 in the longitudinal direction (X direction). The cooler 11 is also provided with a pair of plate-shaped overhangs 114 that extend outward from both ends in the X direction so as to overlap with the fixing parts 25 in the Z direction.

[0036] The fixing portion 25 and the protruding portion 114 are provided with fastening holes 25a and 114a, respectively, for fastening bolts (not shown). When the circuit board 10 is inserted into the edge connector 20, the fastening holes 25a and 114a overlap each other. The cooler 11 is fixed to the edge connector 20 by fastening bolts into the fastening holes 25a and 114a.

[0037] In this way, when the power module 1 is fixed to the edge connector 20, it is prevented from coming off the edge connector 20 due to external forces such as vibration.

[0038] (PCU configuration) Figure 4(A) is a top view showing an example of the PCU8. Figure 4(B) is a side view showing an example of the PCU8. In Figures 4(A) and 4(B), components common to Figures 1(A) to 2(C) are denoted by the same reference numerals, and their descriptions are omitted.

[0039] PCU8 is an example of a power conversion device. PCU8 comprises a base plate 3, three sets of power modules 1 and edge connectors 20, an external connector 40, EMC (Electromagnetic Compatibility) filters 41 and 42, wiring 43, capacitors 44, and terminal blocks 45 and 46. The three sets of power modules 1 and edge connectors 20, the external connector 40, the EMC filters 41 and 42, the wiring 43, capacitors 44, and terminal blocks 45 and 46 are mounted on the plate surface 3a of the base plate 3. Inside the base plate 3, plate channels 210 and 220 are provided that extend in the Y direction so as to overlap with the edge connectors 20 when viewed from the front.

[0040] Each power module 1's circuit board 10 is equipped with two IPM100s, forming an inverter. Of the two IPM100s, one switch element functions as the upper arm of the inverter, and the other switch element functions as the lower arm. As a result, the circuit board 10 of each power module 1 converts the DC current input from the connector terminals 201 and 202 of each edge connector 20 into AC current and outputs it to the connector terminal 203 of each edge connector 20. There is no limit to the number of IPM100s that can be mounted on the circuit board 10.

[0041] Furthermore, the capacitor 44 is, for example, a film capacitor, and is connected in parallel to the two IPM100 switching elements to smooth the voltage. The pair of terminals 44a of the capacitor 44 are electrically connected to lead terminals (not shown) drawn out from the connector terminals 201 and 202 of each edge connector 20 at the terminal block 45.

[0042] The EMC filters 41 and 42 are electrically connected to the terminals 44a of the external connector 40 and capacitor 44 via wiring 43 to reduce electromagnetic radiation generated by energization. The external connector 40 is electrically connected to, for example, a lithium-ion battery via a cable (not shown).

[0043] The other terminal block 46 is provided with lead terminals (not shown) that extend from the connector terminals 203 of each edge connector 20. Each lead terminal of the terminal block 46 is electrically connected to, for example, a three-phase AC motor (not shown).

[0044] The base plate 3 is provided with three connection structures 2, each corresponding to one of the three power modules 1. The three edge connectors 20 are arranged in the Y direction between terminal blocks 45 and 46 on the surface 3a of the base plate 3. Here, the longitudinal direction of each edge connector 20 substantially coincides with the X direction. A circuit board 10 is inserted into each edge connector 20 in a position approximately perpendicular (Z direction) to the surface 3a of the base plate 3. Furthermore, the inlet and outlet of the flow path 112 of the cooler 11 of each power module 1 are connected to connection holes 21 and 22 provided on the surface 3a of the base plate 3, respectively, as described with reference to Figure 2(B). The edge connectors 20 and connection holes 21 and 22 are arranged alternately in the Y direction. Note that the base portion 30 and connection holes 21 and 22 are not shown in Figures 4(A) and 4(B).

[0045] With the above configuration, each power module 1 is arranged with the board surface 10s of the circuit board 10 overlapping in the Y direction along the board surface 3a of the base plate 3. With this arrangement, of the dimensions of the power module 1 in the X, Y, and Z directions, the dimension in the Y direction, which is the thickness direction of the circuit board 10, is the smallest, so the dimension L in the Y direction of the base plate 3 can be reduced. In contrast, if each power module 1 were arranged on the board surface 3a of the base plate 3 with the board surface 10s of the circuit board 10 parallel to the board surface 3a of the base plate 3 in the Y direction, the dimension L in the Y direction of the base plate 3 would increase compared to this example.

[0046] Furthermore, in the Z direction, among the multiple electrical components mounted on the base plate 3, the dimension H of the large component, the capacitor 44, has the greatest influence on the height dimension of the PCU8. For this reason, if, as described above, each power module 1 is arranged in the Y direction on the surface 3a of the base plate 3, with the surface 10s of the circuit board 10 parallel to the surface 3a of the base plate 3, then in the Z direction, there will be wasted space above each power module 1 (on the positive side in the Z direction).

[0047] However, as in this example, if each power module 1 is arranged with the board surface 10s of the circuit board 10 overlapping in the Y direction along the board surface 3a of the base plate 3, the circuit board 10 is held in an upright position relative to the board surface 3a of the base plate 3. Therefore, unlike the above case, wasted space can be eliminated and the space of the PCU 8 can be used effectively, making it possible to miniaturize the PCU 8.

[0048] Furthermore, the power module 1 in the PCU8 is not limited to the above mounting configuration; three power modules 1 may be mounted on the base plate 3a such that they overlap in the Z direction. Other mounting configurations are described below.

[0049] Figure 5(A) is a top view showing another example of PCU9. Figure 5(B) is a side view showing another example of PCU9. Figure 5(C) is a cross-sectional view along line DD in Figure 5(A). In Figures 5(A) to 5(C), components common to Figures 4(A) and 4(B) are denoted by the same reference numerals, and their descriptions are omitted.

[0050] In addition to the configuration similar to the example above, the PCU9 also includes an adapter 5 and a support member 6. The adapter 5 is connected to three power modules 1 in the Y direction, and the support member 6 supports the adapter 5 on the plate surface 3a of the base plate 3. The support member 6 is, for example, a rectangular frame and is fixed to a predetermined position between two terminal blocks 45 and 46 on the plate surface 3a of the base plate 3 using adhesive or the like. The adapter 5 is a roughly rectangular plate-like member, and one end of the adapter 5 is fitted into the frame of the support member 6.

[0051] As a result, the adapter 5 is supported in a position where the plate surface 5a of the adapter 5 is approximately perpendicular to the plate surface 3a of the base plate 3. That is, the adapter 5 is erected in a direction approximately perpendicular to the plate surface 3a of the base plate 3. In this example, the adapter 5 is erected in the Z direction, but the direction in which the adapter 5 is erected does not necessarily have to be the Z direction; for example, it may be inclined by a few degrees with respect to the Z direction. Inside the adapter 5, adapter channels 510 and 520 are provided, each extending in the Z direction along the plate surface 5a of the adapter 5. The adapter channels 510 and 520 are connected to the plate channels 220 and 210, respectively, and cooling water that flows to the cooler 11 flows through the adapter channels 510 and 520.

[0052] Figure 6(A) is a plan view showing an example of adapter 5 in a front view. Figure 6(B) is a cross-sectional view along line EE in Figure 6(A). In addition to adapter 5, Figure 6(A) also shows a cross-section of base plate 3 along line segment m in Figure 5(A). Figure 6(B) shows an example of how the cooler 11 is connected to adapter 5. In Figures 6(A) and 6(B), components common to Figures 1(A) to 2(C) and Figures 5(A) to 5(C) are denoted by the same reference numerals, and their explanations are omitted.

[0053] The adapter 5 comprises three connection structures 2 arranged in the Z direction to correspond to three power modules 1. The plate surface 5a of the adapter 5 is provided with three edge connectors 20 arranged at substantially equal intervals in the Z direction. The plate surface 5a of the adapter 5 is also provided with connection holes 21 and 22 that communicate with adapter flow paths 510 and 520. The edge connectors 20 and connection holes 21 and 2 are arranged alternately in the Z direction. Note that the arrangement direction of the edge connectors 20 and connection holes 20 and 21 does not necessarily have to be in the Z direction; for example, they may be inclined by a few degrees with respect to the Z direction.

[0054] The connection holes 21 and 22 are provided on a rectangular base portion 50 that protrudes from the plate surface 5a of the adapter 5 in the positive direction in the Y direction. The dimensions of the base portion 50 are substantially equal to the distance from the side surface 11e of the cooler 11 to the end 10a of the circuit board 10, similar to the base portion 30 described above. When the cooler 11 moves in the connection direction d relative to the plate surface 5a of the adapter 5, the inlet portion 110 and outlet portion 111 are connected to the connection holes 21 and 22, respectively (see dotted lines). This connects the flow path 112 of the cooler 11 to the adapter flow paths 510 and 520. Note that the approximate plate shape of the adapter 5 is not a perfectly flat plate, but rather a plate shape in which convex portions such as the base portion 30 or concave portions (not shown) are formed on the plate surface 5a.

[0055] The adapter channels 510 and 520 extend substantially parallel to each other along the Z direction. The connection holes 21 and 22 are formed extending from the adapter channels 510 and 520 in the Y direction, respectively, and are spaced at the same intervals in the X direction as the inlet and outlet sections 110 and 111. The three sets of connection holes 21 and 22 are also spaced substantially equally in the Z direction. The adapter channels 510 and 520 connect to the plate channels 220 and 210 of the base plate 3 via the outlet section 51 and inlet section 52 provided on the lower surface 5b of the adapter 5 in the Z direction.

[0056] The outlet section 51 and the inlet section 52 have a substantially cylindrical shape to allow cooling water to flow through, and protrude from the lower surface 5b of the adapter 5 to the negative side in the Z direction. The base plate 3 also has openings 31 and 32 that communicate with the plate flow paths 220 and 210, respectively. The openings 31 and 32 are formed facing the Z direction and are connected to the outlet section 51 and the inlet section 52, respectively. Here, the outlet section 51 and the inlet section 52 and the openings 31 and 32 are equipped with a sealing structure to prevent cooling water leakage.

[0057] Cooling water enters the adapter channel 520 from the plate channel 210 through the inlet 52 (see symbol Fin), and then enters the channel 112 from the adapter channel 520 through the connection hole 21. Cooling water also enters the adapter channel 510 from the channel 112 through the connection hole 22, and then enters the plate channel 220 from the adapter channel 510 through the outlet 51 (see symbol Fout). As a result, cooling water circulates between the channel 112 and the plate channels 210 and 220 of the cooler 11.

[0058] Furthermore, electrical wiring 53-55, which is insulated from each other, is embedded inside the adapter 5 along the Z direction. Electrical wiring 53-55 is brought out to electrical terminals (not shown) exposed on the board surface 5a of the adapter 5 and is electrically connected to connector terminals 201-203 of the edge connector 20, respectively. Electrical wiring 54 and 55 are brought out from the lower surface 5b of the adapter 5 to the terminal block 45 and are electrically connected to a pair of terminals 44a of the capacitor 44, and electrical wiring 53 is brought out from the lower surface 5b of the adapter 5 to the terminal block 46 and is electrically connected to, for example, a three-phase AC motor (not shown).

[0059] In the above configuration, each power module 1 in the PCU 9 is arranged with the board surface 10s of the circuit board 10 overlapping in a direction approximately perpendicular to the board surface 3a of the base plate 3 (Z direction). Therefore, space can be used effectively in the Z direction. At this time, the closer the height of the adapter 5 that holds the three power modules 1 is to the height H of the large component capacitor 44, the less wasted space can be saved. In this example, each circuit board 10 is overlapped in the Z direction, but the direction of overlapping does not necessarily have to be the Z direction; for example, it may be tilted by a few degrees relative to the Z direction.

[0060] On the other hand, as described above, if each power module 1 is arranged in the Y direction on the surface 3a of the base plate 3 such that the surface 10s of the circuit board 10 is parallel to the surface 3a of the base plate 3, then there will be wasted space above each power module 1 in the Z direction. In this embodiment, an example is given in which three power modules 1 are mounted on the PCUs 8 and 9, but there is no limit to the number of power modules 1 that can be mounted.

[0061] As described above, power module 1 has the function of adequately cooling the heat-generating IPM100, and can be connected in any direction. Therefore, by arranging multiple power modules 1 in an appropriate direction and mounting them on PCU8,9, the space utilization efficiency of PCU8,9 can be improved.

[0062] The embodiments described above are preferred examples of the present invention. However, the invention is not limited thereto, and various modifications are possible without departing from the spirit of the invention. [Explanation of Symbols]

[0063] 1 Power module, 2 Connection structure, 3 Base plate (plate member), 3a, 10s Plate surface, 5 Adapter, 8, 9 PCU (Power Control Unit), 10 Circuit board, 10a End, 20 Edge connector, 21, 22 Connection holes, 24 Claw part (fixing part), 25 Fixing part 100, IPM (Power Semiconductor Element), 11 Cooler, 11s Bonding surface, 101~103 Connection terminals, 110a Inlet, 111a Outlet, 112 Flow path, 210, 220 Plate flow path, 510, 520 Adapter flow path, d Connection direction

Claims

1. A circuit board having one or more power semiconductor elements, The circuit board has a cooler having a flow path for a cooling medium, The cooler is integrated with the circuit board by being bonded to one surface of the circuit board. The end of the circuit board is provided with a connection terminal that connects to an edge connector. The inlet and outlet of the aforementioned flow path are open in the direction of connection of the connection terminal to the edge connector. Power module.

2. The one or more power semiconductor elements are embedded inside the circuit board. The power module according to claim 1.

3. Each of the following power modules is described in claim 1 or 2: A plate member having a plate channel that communicates with the channel of each of the plurality of power modules, Each of the plurality of power modules has a connection terminal on the circuit board, and each of the plurality of edge connectors is connected to the connection terminal on the circuit board, and the plate member has a plurality of edge connectors arranged on the plate surface, The plate surface of the plate member is provided with a plurality of connection holes that communicate with the plate flow path and are connected to the inlet and outlet of each of the flow paths of the plurality of power modules. The plurality of power modules are arranged so that one side of the circuit board is superimposed in a direction along the plate surface of the plate member. Power converter.

4. Each of the following power modules is described in claim 1 or 2: A plate member having a plate channel that communicates with the channel of each of the plurality of power modules, A substantially plate-shaped adapter is erected in a direction substantially perpendicular to the plate surface of the plate member, and has an adapter channel connected to the plate channel through which the cooling medium flows; The plate surface of the adapter is provided with multiple sets of connection holes that communicate with the adapter's flow path and are connected to the inlet and outlet of the flow path of the multiple power modules, respectively. Each of the plurality of power modules is connected to the connection terminals of the circuit board, and the adapter has a plurality of edge connectors arranged alternately with one set of the plurality of connection holes in a direction substantially perpendicular to the surface of the plate member, The plurality of power modules are arranged so that one side of the circuit board is superimposed in a direction substantially perpendicular to the plate surface of the plate member. Power converter.

5. The edge connector has a fixing portion for fixing the power module to the edge connector. The power conversion device according to claim 3.

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