Component mounting device, component mounting system, and component mounting method

Abstract

The present invention provides a component mounting device, a component mounting system, and a component mounting method capable of detecting holes formed in a film. [Solution] The component mounting device mounts a component onto a substrate by adsorbing it through a component adsorption hole in a tool, via a film having a first surface that contacts the component and a second surface opposite to the first surface. The component mounting device includes a hole-punching device having a needle that pushes the film from the first surface toward the second surface to create a through hole in the thickness direction of the film, an illumination unit that irradiates illumination light onto the first surface of the film, an imaging unit that images the first surface, and a recognition unit that recognizes the presence or absence of a push-up mark based on an image of the first surface captured while the first surface, which has been pushed up by the needle, is illuminated by illumination light.

Description

Technical Field

[0001] The present disclosure relates to a component mounting device, a component mounting system, and a component mounting method.

Background Art

[0002] Conventionally, in a component mounting device for mounting electronic components such as ICs on a substrate, in order to remove oxides or dirt on bumps on the lower surface of chip-type electronic components or electrode portions for performing solder bonding on the substrate before solder-bonding the components to the substrate, flux is adhered. Also, electronic components are mounted on the substrate using an adhesive.

[0003] For example, in Patent Document 1, it is described that in order to prevent an adhesive between an electronic component and a substrate from adhering to a tool for adsorbing the electronic component, the tool adsorbs the electronic component through a film (tape). Holes for component adsorption are formed in the film.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] When holes are not formed in the film, the tool cannot adsorb the electronic component. Also, when the formed holes in the film are small, the tool cannot normally adsorb the electronic component, and the mounting accuracy on the substrate decreases. Therefore, it is desirable to detect the holes formed in the film before the tool adsorbs the electronic component.

[0006] Therefore, an object of the present disclosure is to provide a component mounting device, a component mounting system, and a component mounting method capable of detecting holes formed in a film. [Means for solving the problem]

[0007] The component mounting device of this disclosure mounts a component onto a substrate by adsorbing it through a component adsorption hole in a tool via a film having a first surface that contacts the component and a second surface opposite to the first surface. The component mounting device includes a hole-punching device having a needle that pushes the film from the first surface toward the second surface to create a through hole in the thickness direction of the film, an illumination unit that irradiates illumination light onto the first surface of the film, an imaging unit that images the first surface, and a recognition unit that recognizes the presence or absence of a push-up mark on the first surface based on an image of the first surface taken while the first surface has been pushed up by the needle and illuminated by illumination light.

[0008] The component mounting system of this disclosure mounts a component onto a substrate by adsorbing it through a component adsorption hole in a tool via a film having a first surface that contacts the component and a second surface opposite to the first surface. The component mounting system includes a hole-punching device having a needle that pushes the film from the first surface toward the second surface to create a through hole in the thickness direction of the film, an illumination unit that irradiates illumination light onto the first surface of the film, an imaging unit that images the first surface, and a recognition unit that recognizes the presence or absence of a push-up mark on the first surface based on an image of the first surface taken while the first surface has been pushed up by the needle and illuminated by illumination light.

[0009] The component mounting method of this disclosure mounts a component onto a substrate by adsorbing it through a component suction hole in a tool via a film having a first surface that contacts the component and a second surface opposite to the first surface. The component mounting method comprises a feeding step of placing a film on the lower surface of a tool; a drilling step of pushing up a needle from the first surface to the second surface of the film placed on the lower surface of the tool to make a through hole in the thickness direction of the film; an imaging step of illuminating the first surface with illumination light after the needle's thrusting motion and acquiring an image of the first surface; and a recognition step of determining whether or not there is a thrust mark on the first surface based on the image. If it is determined in the recognition step that there is a thrust mark, the component is adsorbed through the film by the component suction hole in the tool and mounted onto the substrate. If it is determined in the recognition step that there is no thrust mark, the feeding step, drilling step, imaging step, and recognition step are performed again in order. [Effects of the Invention]

[0010] This disclosure provides a component mounting device, a component mounting system, and a component mounting method capable of detecting holes formed in a film. [Brief explanation of the drawing]

[0011] [Figure 1] Side view showing the schematic configuration of a component mounting device according to an embodiment. [Figure 2] Plan view showing the underside of the tool. [Figure 3] Diagram illustrating the state in which the underside of the tool is in contact with the drilling device. [Figure 4] Perspective view of a drilling device [Figure 5] Figure 4 shows a perspective view of the drilling head from the direction of arrow V. [Figure 6] Enlarged view of region At in Figure 4 [Figure 7] Diagram illustrating the operation of the drilling head. [Figure 8] Diagram illustrating the operation of the drilling head. [Figure 9] Diagram illustrating the operation of the drilling head. [Figure 10]Explanatory drawing of the state where the lower surface of the tool is pressing down the upper surface of the drilling head [Figure 11] Explanatory drawing of the state where the drilling head is rising after the drilling operation is completed [Figure 12] Side view of the component mounting device in the state where the mounting head is located at the imaging position [Figure 13] Side view of the component mounting device in the state where the mounting head is located at the transfer position [Figure 14] Side view of the component mounting device in the state where the mounting head is receiving a component [Figure 15] Side view of the component mounting device in the state where the mounting head is located at the flux application position [Figure 16] Side view of the component mounting device in the state where the mounting head is applying flux to the adsorbed component [Figure 17] Side view of the component mounting device in the state where the mounting head is located at the mounting position [Figure 18] Side view of the component mounting device in the state where the mounting head is mounting a component on the substrate [Figure 19] Side view of the component mounting device in the state where the vertical recognition camera is imaging the substrate [Figure 20] Side view of the component mounting device in the state where the vertical recognition camera is moving above the drilling device [Figure 21] Block diagram showing the functional configuration of the component mounting device according to the embodiment [Figure 22] Explanatory drawing showing the configuration of the imaging device [Figure 23] It is a longitudinal sectional view around the through hole [Figure 24] Explanatory drawing explaining various through holes [Figure 25] Explanatory drawing showing the image of the first surface of the film [Figure 26] Flowchart showing the flow of inspection of the through hole [Figure 27] Explanatory drawing showing the image of the entire film set on the lower surface of the tool [Figure 28] Explanatory drawing showing the image around the pushed-up mark extracted [Figure 29]Diagram showing a binarized image of the area around the impact mark. [Figure 30] An explanatory diagram showing an image of a circular impact mark. [Figure 31] An explanatory diagram showing an image of edge detection of an impact mark. [Figure 32] An explanatory diagram showing an image of the edge of the impact mark. [Modes for carrying out the invention]

[0012] A component mounting device according to a first aspect of this disclosure mounts a component onto a substrate by adsorbing it through a component adsorption hole in a tool via a film having a first surface that contacts the component and a second surface opposite to the first surface. The component mounting device includes a hole-punching device having a needle that pushes the film up from the first surface toward the second surface to create a through hole in the thickness direction of the film; an illumination unit that irradiates illumination light onto the first surface of the film; an imaging unit that images the first surface; and a recognition unit that recognizes the presence or absence of a push-up mark on the first surface based on an image of the first surface captured while the first surface, which has been pushed up by the needle, is illuminated by illumination light.

[0013] By imaging the first surface, which has been subjected to the needle-punching action, while illumination light is shining on it, the recognition unit can accurately recognize the presence or absence of a punching mark on the first surface and detect the hole formed in the film.

[0014] According to a second aspect of this disclosure, in the component mounting device of the first aspect, a needle is positioned directly below the component suction hole. The hole-punching device forms a push-up portion including a through-hole by inserting a needle that has penetrated the film into the inside of the component suction hole. The recognition unit extracts an image including the component suction hole based on the positional information of the component suction hole in the captured image, and recognizes the presence or absence of a push-up mark based on the extracted image including the component suction hole.

[0015] According to a third aspect of this disclosure, in the component mounting device of the first or second aspect, the recognition unit recognizes the presence or absence of a push-up mark in the captured image based on the captured portion in which reflected light reflected from an edge that rises inclined along the contour of the push-up mark of the film is captured.

[0016] According to a fourth aspect of this disclosure, in a component mounting device according to any one of the first to third aspects, the recognition unit extracts the captured portion by binarizing the captured image.

[0017] According to a fifth aspect of this disclosure, in any one of the component mounting devices of the first to fourth aspects, when a recognition unit recognizes that there is an indentation mark in the captured image, the device further includes a calculation unit that calculates the size of the indentation mark based on the captured image.

[0018] According to the sixth aspect of this disclosure, in the component mounting device of the fifth aspect, the calculation unit calculates the size of the indentation based on the diameter of the indentation in a first direction and the diameter in a second direction intersecting the first direction.

[0019] According to a seventh aspect of this disclosure, the component mounting device of the sixth aspect further includes a determination unit that determines whether the size of the indentation is greater than or equal to a predetermined size, based on the size of the indentation calculated by the calculation unit and the size of the component suction hole.

[0020] According to the eighth aspect of this disclosure, in any one of the first to seventh aspects, the component mounting device further comprises a tool, a mounting head for mounting components held by the tool onto a substrate, a mounting head moving mechanism for moving the mounting head to a component supply unit that supplies components via a drilling device, and a mounting head lifting mechanism for raising and lowering the mounting head.

[0021] A component mounting system according to a ninth aspect of this disclosure mounts a component onto a substrate by adsorbing it through a component adsorption hole in a tool via a film having a first surface that contacts the component and a second surface opposite to the first surface. The component mounting system includes a hole-punching device having a needle that pushes the film from the first surface toward the second surface to create a through hole in the thickness direction of the film; an illumination unit that irradiates the first surface of the film with illumination light; an imaging unit that images the first surface; and a recognition unit that recognizes the presence or absence of a push-up mark based on an image of the first surface captured while the first surface, which has been pushed up by the needle, is illuminated with illumination light.

[0022] By illuminating the first surface where the needle has been thrust into with illumination light while imaging is performed, the recognition unit can accurately recognize the presence or absence of thrust marks based on the captured image, and can detect holes formed in the film.

[0023] A component mounting method according to a tenth aspect of this disclosure involves mounting a component onto a substrate by adsorbing it through a component suction hole in a tool via a film having a first surface that contacts the component and a second surface opposite to the first surface. The component mounting method includes a feeding step of placing a film on the lower surface of a tool; a drilling step of pushing up a needle from the first surface to the second surface of the film placed on the lower surface of the tool to make a through hole in the thickness direction of the film; an imaging step of capturing an image of the first surface while illuminating the first surface with illumination light after the needle's thrusting motion; and a recognition step of determining whether or not there is a thrust mark based on the captured image. If it is determined in the recognition step that there is a thrust mark, the component is adsorbed through the film by the component suction hole in the tool and mounted onto the substrate. If it is determined in the recognition step that there is no thrust mark, the feeding step, drilling step, imaging step, and recognition step are performed again in order.

[0024] By illuminating the first surface where the needle has been thrust into with illumination light while imaging is performed, the recognition unit can accurately recognize the presence or absence of thrust marks based on the captured image, and can detect holes formed in the film.

[0025] Hereinafter, exemplary embodiments of the component mounting device and component mounting method relating to this disclosure will be described with reference to the attached drawings. This disclosure is not limited to the specific configurations of the embodiments described below, but includes configurations based on similar technical ideas.

[0026] [Embodiment] (Overall structure) The component mounting device 1 in the embodiment of this disclosure will be described below with reference to Figure 1. Figure 1 is a side view showing a schematic configuration of the component mounting device 1 equipped with a drilling device 16 according to the embodiment of this disclosure.

[0027] As shown in Figure 1, the component mounting device 1 comprises a component supply unit 11, a mounting head 12, a stage 13, a flux supply device 15, a drilling device 16, and a beam 17. The component mounting device 1 further comprises an imaging device 18, a control unit 19, a touch panel 20, a base 21, a component supply unit moving unit 23, a pickup head 31, a stage moving unit 25, a stage tilt adjustment unit 29, and a film transport mechanism 47.

[0028] The component mounting device 1 mounts components 203, such as semiconductor chips, onto a substrate 201, which serves as a workpiece. On the base 21, a stage 13 for holding the substrate 201 and a component supply unit 11 are arranged side by side in the Y-axis direction.

[0029] The parts supply unit 11 supplies parts 203. The parts supply unit 11 is mounted on the parts supply unit moving unit 23. The parts supply unit moving unit 23 is controlled by the control unit 19 and moves the parts supply unit 11 in the X and Y directions. The parts supply unit moving unit 23 is, for example, a rack and pinion. Multiple parts 203 are held on the upper part of the parts supply unit 11. The parts 203 are held on the upper part of the parts supply unit 11 either placed on a tray or attached to an adhesive sheet.

[0030] Stage 13 is located above the stage moving unit 25. The stage moving unit 25 is controlled by the control unit 19, which moves Stage 13 in the X and Y directions. Stage 13 receives the substrate 201, for example, via a transport rail, and positions and holds the substrate 201 at the location where the components 203 will be mounted. Stage 13 also transports the substrate 201 with the components 203 mounted to the next process, for example, via a transport rail.

[0031] Inside the stage 13 are a stage heating unit 27 for heating the held substrate 201 and a temperature sensor (not shown) for measuring the temperature of the heated stage 13. The stage heating unit 27 is controlled by the control unit 19 and heats the stage 13 to a specified temperature. The temperature measured by the thermometer inside the stage 13 is transmitted to the control unit 19.

[0032] The stage tilt adjustment unit 29 is located inside the stage movement unit 25 and can adjust the tilt relative to the transfer head 113 by rotating the stage 13 around two orthogonal axes (X axis and Y axis). The stage tilt adjustment unit 29 has a mechanism in which, for example, cam mechanisms are provided at each of the four corners of the stage 13, and a linear cam provided for each cam mechanism moves in the left-right direction, causing the cam follower to move up and down, and each moves independently in the up and down direction.

[0033] Component 203 is held on the component supply unit 11 with the bumps formed on the back surface of component 203 facing upwards. A pickup head 31 is positioned above the component supply unit 11. The pickup head 31 picks up component 203 from the component supply unit 11 by suction. The pickup head 31 rotates around the X axis by a pickup head drive unit (not shown) controlled by the control unit 19, and then moves to a transfer position Pd, which will be described later. That is, at the transfer position Pd, the pickup head 31 holds component 203 with the bumps facing downwards.

[0034] A mounting head 12 is positioned above the pickup head 31 and the component supply unit 11. The mounting head 12 holds the supplied component 203 and mounts it onto the substrate 201 supported by the stage 13. The mounting head 12 moves in the Y-axis direction by a mounting head moving mechanism 33 controlled by a control unit 19. The mounting head moving mechanism 33 is provided on the beam 17. The mounting head moving mechanism 33 includes, for example, a rail (not shown) arranged along the Y-axis direction on the beam 17 and a linear motor (not shown) for moving the mounting head 12. The amount of drive of the linear motor is controlled by the control unit 19, and the mounting head 12 can move the beam 17 in the Y-axis direction along the rail by the amount of drive of the linear motor.

[0035] The beam 17 is a member that extends in the Y-axis direction and supports the mounting head 12 and the flux supply device 15. Although not shown in Figure 1, both ends of the beam 17 in the Y-axis direction are supported, for example, by a housing that surrounds the components of the component mounting device 1. The lower surface of the beam 17 is positioned, for example, approximately parallel to the horizontal plane.

[0036] A tool 35 for adsorbing and holding the component 203 is provided at the lower end of the mounting head 12. The mounting head moving mechanism 33 moves the mounting head 12 between a mounting position Pa where the component 203 is mounted on the substrate 201, a drilling position Pb where a hole is made in the film 36 placed on the lower surface of the tool 35, a flux application position Pc where flux is applied to the lower surface of the component 203, and a transfer position Pd where the tool 35 adsorbs and receives the component 203 from the pickup head 31.

[0037] The mounting head 12 is equipped with a component heating unit 37 that heats the component 203 held by the tool 35, and a tool temperature sensor 39 that measures the temperature of the tool 35 heated by the component heating unit 37. The component heating unit 37 is controlled by the control unit 19 and heats the tool 35 to a specified temperature. The temperature of the tool 35 measured by the tool temperature sensor 39 is transmitted to the control unit 19.

[0038] The film 36 prevents flux from adhering to the tool 35. The film 36 is, for example, a Teflon® sheet. The film transport mechanism 47 includes a feed roller 48, a take-up roller 49, and a motor (not shown) that drives the take-up roller 49. Since the film transport mechanism 47 is supported integrally with the mounting head 12 on the beam 17, it moves together with the mounting head 12 in the horizontal and vertical directions.

[0039] The feed roller 48 supports an unused film 36 in a roll shape. The take-up roller 49 rotates with a motor to wind up the used film 36 placed on the underside of the tool 35 and sets the unused film 36 from the feed roller 48 onto the underside of the tool 35.

[0040] The mounted head 12 is provided with a mounted head lifting mechanism 41 that raises and lowers the mounted head 12. The mounted head lifting mechanism 41 raises and lowers the film transport mechanism 47 vertically in conjunction with the mounted head 12.

[0041] Furthermore, the mounting head 12 is equipped with a pressure sensor 43 that measures the load applied by the mounting head lifting mechanism 41 to the substrate 201 when the tool 35 that holds the component 203 is pressed against it.

[0042] The mounting head lifting mechanism 41 is driven and controlled by the mounting control unit 93 of the control unit 19, which lowers the mounting head 12 so that the tool 35 mounts the component 203 onto the substrate 201 with a specified load. The mounting head lifting mechanism 41 includes, for example, a linear motor for raising and lowering the mounting head 12 and an encoder for measuring the amount of drive of the linear motor. The mounting head lifting mechanism 41 may also include, for example, a ball screw. The load measured by the pressure sensor 43 is transmitted to the control unit 19.

[0043] The mounting head 12 is equipped with an ultrasonic oscillator 45 that vibrates the tool 35 ultrasonically. The ultrasonic oscillator 45 is driven and controlled by the control unit 19, and when mounting the component 203 to the substrate 201 by ultrasonic crimping, the tool 35 is vibrated ultrasonically with specified ultrasonic power, amplitude, and frequency.

[0044] The touch panel 20, which is communicatively connected to the control unit 19, displays the operation menu and operating status information of the component mounting device 1 on its display screen. Data input to the control unit 19 and operation of the component mounting device 1 can be performed using the operation buttons displayed on the screen. The touch panel 20 may be a portable terminal or it may be installed on the component mounting device 1. A combination of an LCD monitor and an input unit such as an operation button, keyboard, and mouse may be used instead of the touch panel 20.

[0045] The imaging device 18 captures images of the component 203 supported by the mounting head 12 and transmits the captured images to the control unit 19. The imaging device 18 is positioned between the component supply unit 11 and the stage 13. The control unit 19 recognizes the shape of the captured component 203 and the amount of rotation from the reference position. During the component mounting operation in which the mounting head 12 mounts the component 203 onto the substrate 201, the control unit 19 corrects the orientation of the component 203 based on the image of the component 203 captured by the imaging device 18.

[0046] The flux supply device 15 supplies flux to be applied to the part 203. The flux supply device 15 has a recess 50 in which flux 3 is stored, and the recess 50 is slidable in the X-axis direction between a standby position and a supply position.

[0047] (Configuration of the drilling device) The drilling device 16 drills a first through-hole in the film 36, which is placed on the lower surface of the tool 35, in the thickness direction of the film 36. As shown in Figure 2, the lower surface 35a of the tool 35 is provided with a plurality of component suction holes 35b and film suction holes 35c. The component suction holes 35b and film suction holes 35c are each connected to a negative pressure source, and suction is controlled by the control unit 19.

[0048] As shown in Figure 3, when the mounting head 12 descends together with the film transport mechanism 47 at the drilling position Pb, the film 36 is fixed by being sandwiched between the lower surface 35a of the tool 35 and the drilling device 16. As the mounting head 12 descends further, the needle 51 of the drilling device 16 penetrates the film 36 and is inserted into the component suction hole 35b, forming a through hole 36a in the film 36 (see Figure 10).

[0049] The drilling device 16 will be described with reference to Figures 3 and 4. Figure 4 is a perspective view of the drilling device 16. The drilling device 16 comprises a drilling head 52 and a lifting mechanism 53.

[0050] The lifting mechanism 53 raises and lowers the drilling head 52 vertically. The lifting mechanism 53 includes a guide rail 56 extending vertically, a block 57 connected to the drilling head 52, and a drive unit 58 that raises and lowers the block 57. The drive unit 58 is, for example, a ball screw or a linear motor.

[0051] The lifting mechanism 53 raises and lowers the drilling head 52 along the guide rail 56 to a drilling position and a retracted position lower than the drilling position. When a device different from the mounted head 12 moves along the beam 17, the drilling head 52 is positioned in the retracted position, which prevents interference between the drilling head 52 and the device moving along the beam 17.

[0052] For example, as shown in Figure 19, when the vertical recognition camera 181, which captures the placement position of components 203 mounted on the substrate 201, moves along the beam 17 toward the drilling device 16, the lifting mechanism 53 can avoid interference between the vertical recognition camera 181 and the drilling head 52 by lowering the drilling head 52 from the drilling position to the retracted position, as shown in Figure 20.

[0053] Next, refer to Figures 5 to 7. Figure 5 is a perspective view taken from the direction of arrow V in Figure 4. Figure 6 is an enlarged view of region At in Figure 4. Figure 7 is an explanatory diagram illustrating the drilling head 52 in its initial position.

[0054] The drilling head 52 comprises a needle 51, a drilling mechanism 54, an impact reduction mechanism 55, and a housing 59. The drilling mechanism 54 is a mechanism for extending and retracting the tip of the needle 51, which is supported by the impact reduction mechanism 55. The impact reduction mechanism 55 reduces the load applied to the needle 51 by lowering the needle 51 when the lower surface 35a of the mounting head 12 comes into contact with the needle 51. The housing 59 houses the drilling mechanism 54 and the impact reduction mechanism 55.

[0055] The housing 59 has a roughly rectangular parallelepiped shape and has openings 59a and 59b on its top and bottom surfaces, respectively. The housing 59 has a first side surface 59c and a second side surface 59d that are parallel to each other, and a third side surface 59e that is perpendicular to the first side surface 59c and the second side surface 59d. A drilling mechanism 54 is attached to the first side surface 59c, and an impact reduction mechanism 55 is attached to the second side surface 59d.

[0056] The needle 51 is supported by the impact reduction mechanism 55. The needle 51 has a tapered shape, with its diameter decreasing towards the tip (upper end). Therefore, the needle 51 can easily come out of the film 36, and the burrs formed around the through hole 36a can be reduced from turning inside out. In addition, the size of the diameter of the through hole 36a formed in the film 36 can be adjusted by the amount the film 36 is pushed (descended) onto the needle 51.

[0057] The amount the film 36 is pressed into the needle 51 is, for example, about 0.5 mm. The diameter of the through hole 36a is, for example, about 0.2 to 0.3 mm. The diameter of the needle 51 is, for example, 0.5 mm, and the diameter of the component suction hole 35b is 0.7 to 0.8 mm. The number of needles 51 provided in the punching head 52 may be one or multiple.

[0058] Next, the drilling mechanism 54 will be described. The drilling mechanism 54 comprises a slide mechanism 60, a plate 63, a support block 64, a biasing member 65, a rod 66, and a stopper 67.

[0059] The sliding mechanism 60 allows the plate 63 to slide vertically between a first position P1 in which the upper end of the needle 51 is housed in the through hole 63c and a second position P2 (see Figure 8) which is below the first position P1 in which the needle 51 is exposed from the through hole 63c. The sliding mechanism 60 comprises, for example, a guide rail 61 and a block 62.

[0060] The guide rail 61 is attached to the inner surface of the first side surface 59c and extends vertically, guiding the block 62 and plate 63 in the vertical direction.

[0061] Block 62 is mounted so as to be movable longitudinally along the guide rail 61 and supports plate 63.

[0062] The plate 63 has, for example, an inverted L-shape and is fixed to the block 62. The plate 63 has a first plate portion 63a that is fixed to the block 62 and extends vertically, a second plate portion 63b that extends from the upper end of the first plate portion 63a toward the second side surface 59d, and a through hole 63c that extends vertically inside the second plate portion 63b. Under normal circumstances, the needle 51 is housed in the through hole 63c (see Figures 6 and 7), and the needle 51 is inserted into and removed from the upper surface of the second plate portion 63b.

[0063] The support block 64 is fixed to the third side surface 59e and is positioned below the plate 63. A biasing member 65 is positioned between the upper surface of the support block 64 and the lower surface of the rod 66.

[0064] One end of the rod 66 is formed in a flat shape and is fixed to the lower surface of the first plate portion 63a of the plate 63, and is biased upward by a biasing member 65. The other end of the rod 66 is inserted into a first slot 59f, which is a vertically extending through hole provided in the first side surface 59c, and is exposed to the outside of the housing 59.

[0065] The biasing member 65 is installed between the support block 64 and the plate 63. The biasing member 65 is, for example, a coil spring, but it may also be a leaf spring.

[0066] The stopper 67 is attached to the outer surface of the first side surface 59c and restricts the upward movement of the rod 66 by the biasing member 65. At the first position P1, where the rod 66 and plate 63 are at their highest position, the upward movement of the rod 66 is stopped when a portion of the upper surface of the other end of the rod 66 comes into contact with the stopper 67.

[0067] Next, the impact reduction mechanism 55 will be described. The impact reduction mechanism 55 comprises a slide mechanism 70, a plate 73, a support block 74, a biasing member 75, a rod 76, and a stopper 77.

[0068] The sliding mechanism 70 allows the plate 73 to slide vertically and lowers the plate 73 in accordance with the descending first plate 63. The sliding mechanism 70 comprises, for example, a guide rail 71 and a block 72.

[0069] The guide rail 71 is attached to the inner surface of the second side surface 59d and extends vertically, guiding the block 72 and plate 73 in the vertical direction.

[0070] Block 72 is mounted so as to be movable longitudinally along the guide rail 71 and supports plate 73.

[0071] The plate 73 has, for example, an inverted L-shape and is fixed to the block 72. The plate 73 has a first plate portion 73a that is fixed to the block 72 and extends in the vertical direction, and a second plate portion 73b that extends from the upper end of the first plate portion 73a toward the first side surface 59c. The needle 51 is supported on the upper surface of the second plate portion 73b. The second plate portion 73b of plate 73 is located below the second plate portion 63b of plate 63.

[0072] The support block 74 is fixed to the third side surface 59e and is located below the plate 73. A biasing member 75 is positioned between the upper surface of the support block 74 and the lower surface of the rod 76. The support block 74 is located below the support block 64.

[0073] One end of the rod 76 is formed in a flat shape and is fixed to the lower surface of the first plate portion 73a of the plate 73, and is biased upward by a biasing member 75. The other end of the rod 76 is inserted into a second slot 59g, which is a vertically extending through hole provided in the second side surface 59d, and is exposed to the outside of the housing 59. The second slot 59g is provided below the first slot 59f.

[0074] The biasing member 75 is installed between the support block 74 and the plate 73. The biasing member 75 is, for example, a coil spring, but it may also be a leaf spring.

[0075] The stopper 77 is attached to the outer surface of the second side surface 59d and restricts the upward movement of the rod 76 by the biasing member 75. At the third position P3, where the rod 76 and plate 73 are at their highest position, the upward movement of the rod 76 is stopped when a portion of the upper surface of the other end of the rod 76 comes into contact with the stopper 77. The lower end of the stopper 77 is located below the lower end of the stopper 67.

[0076] As shown in Figure 7, in the initial position before the drilling head 52 is pushed downward by the lower surface of the tool 35, the plate 63 is biased upward by the biasing member 65, so the upper surface of the second plate portion 63b of the plate 63 is at the height of the highest position, the first position P1. At the first position P1, the upper surface of the second plate portion 63b is higher than the upper end of the needle 51, so the needle 51 is housed in the through hole 63c of the second plate portion 63b, and the upper end of the needle 51 is not exposed. Therefore, the tip of the needle 51 is not exposed except when forming the through hole 63c in the film 36, thus improving safety for the operator. Also, since the tip of the needle 51 is not exposed, the film 36 can be tightly sandwiched between the lower surface 35a of the tool 35 and the upper surface of the plate 63.

[0077] Furthermore, in the initial position of the drilling head 52, the plate 73 is biased upward by the biasing member 65, so the upper surface of the second plate portion 73b of the plate 73 is at the height of the third position P3, which is the highest position.

[0078] Next, the operation of the drilling head 52 when a through hole 36a is formed in the film 36 will be explained with reference to Figures 3, 8, and 10. Figure 8 is an explanatory diagram illustrating the operation of the drilling head 52. Figure 10 is an explanatory diagram showing the state in which the lower surface of the tool 35 is pressing down on the upper surface of the drilling head 52.

[0079] With the lower surface 35a of the tool 35 in contact with the upper surface of the second plate portion 63b of the plate 63 of the drilling head 52 via the film 36, when the tool 35 pushes down the second plate portion 63b, the plate 63 and block 62 move downward along the guide rail 61 against the biasing force of the biasing member 65. As a result, the upper part of the needle 51 supported on the second plate portion 73b of the plate 73 of the impact reduction mechanism 55 is exposed through the through hole 63c, forming a through hole 36a in the film 36, and is inserted into the part suction hole 35b of the tool 35.

[0080] When the needle 51 is inserted into the component suction hole 35b of the tool 35, the burrs around the through hole 36a formed in the film 36 are also inserted into the component suction hole 35b. When the tool 35 pushes down the second plate portion 63b, the control unit 19 may perform air suction on the component suction hole 35b. When air suction is performed on the component suction hole 35b, the burrs around the through hole 36a can be reliably sucked into the component suction hole 35b. When air suction is not performed on the component suction hole 35b, it is possible to prevent film debris generated when the through hole 36a is formed from being sucked into the component suction hole 35b.

[0081] Since the upper part of the needle 51 is housed within the component suction hole 35b, the second plate portion 73b of the plate 73 of the impact reduction mechanism 55 does not receive a downward force from the lower surface 35a of the tool 35, and therefore the needle 51 maintains its height without descending.

[0082] The tool 35 pushes down plate 63 to such an extent that the second plate portion 63b of plate 63 does not come into contact with the second plate portion 73b of plate 73, causing the upper surface of the second plate portion 63b of plate 63 to drop to the height of the second position P2. At this time, the biasing member 65 receives the pushing force of the tool 35.

[0083] When the tool 35 pushes down the plate 63 of the drilling head 52, if the alignment between the needle 51 and the part suction hole 35b of the tool 35 is not proper, the needle 51 exposed from the through hole 63c will not be inserted into the part suction hole 35b and will instead hit the lower surface 35a of the tool 35. In this case, the pushing force of the tool 35 is transmitted via the needle 51 to the plate 73 of the impact reduction mechanism 55 that supports the needle 51, so the tool 35 pushes down both the plate 63 of the drilling mechanism 54 and the plate 73 of the impact reduction mechanism 55.

[0084] The plate 73 of the impact reduction mechanism 55 moves downward along the guide rail 71 against the biasing force of the biasing member 75, together with the block 72. In this way, the biasing members 65 and 75 receive the downward force of the tool 35, preventing the force from concentrating on the needle 51 and causing it to break.

[0085] When the upper part of the needle 51 is inserted into the component suction hole 35b of the tool 35, as shown in Figures 8 and 10, the tool 35 pushes down the plate 63 of the drilling mechanism 54 to the second position P2, forming a through hole 36a in the film 36. Then, as shown in Figure 11, the mounting head 12 is raised by the mounting head lifting mechanism 41, and the film 36 moves away from the mounting head 12.

[0086] The through-holes 36a formed in the film 36 by the hole-punching device 16 are not limited to round holes, but also include openings, tears, and cracks. Therefore, the through-holes 36a only need to be communication portions that communicate from one surface of the film 36 to the other surface in the thickness direction of the film 36.

[0087] After the drilling operation is complete, as shown in Figure 12, the mounting head 12 moves directly above the imaging device 18, and the imaging device 18 images the through-hole 36a of the film 36. Once imaging of the through-hole 36a is complete, the mounting head 12 moves toward the transfer position Pd.

[0088] Next, as shown in Figure 13, when the mounting head 12 arrives at the transfer position Pd, the control unit 19 starts to pick up the film 36 from the film suction hole 35c of the tool 35 using a negative pressure source. This suppresses the movement of the film 36 on the lower surface 35a of the tool 35.

[0089] As shown in Figure 14, the mounting head 12 descends at the transfer position Pd, and the tool 35 picks up and receives the part 203 from the pickup head 31. The mounting head moving mechanism 33 moves the mounting head 12 from the transfer position Pd to the flux application position Pc, where flux adheres to the underside of the part 203.

[0090] As shown in Figure 15, when the mounting head 12, which has picked up the component 203, arrives at the flux application position Pc from the transfer position Pd, the mounting head 12 lowers the tool 35 by the mounting head lifting mechanism 41, as shown in Figure 16. As a result, the flux 3 in the recess 50 of the flux supply device 15, which is located at the supply position, adheres to the bumps on the back surface of the component 203 that has been picked up by the tool 35. In this specification, flux 3 may include not only flux alone, but also solder paste containing flux.

[0091] After applying flux 3 to the back surface of component 203, the mounting head 12 is raised by the mounting head lifting mechanism 41, and the mounting head moving mechanism 33 moves the mounting head 12 from the flux application position Pc to the mounting position Pa where the stage 13 holds the substrate 201. The imaging device 18 may also image the component 203 that the tool 35 of the mounting head 12 is adsorbing.

[0092] As shown in Figure 17, when the mounting head 12, which has attracted the component 203, arrives at the mounting position Pa, the mounting head 12 is lowered by the mounting head lifting mechanism 41, as shown in Figure 18, to mount the component 203 onto the substrate 201.

[0093] As described above, the tool 35 adsorbs the component 203 via the film 36 and mounts it onto the substrate 201. This prevents flux from creeping up between the component 203 and the tool 35, even for components with a small thickness, thus preventing poor bonding between the substrate 201 and the component 203.

[0094] Next, the control unit 19 will be described with reference to Figure 21. The control unit 19 is communicated with the touch panel 20, the parts supply unit movement unit 23, the stage movement unit 25, the stage heating unit 27, the mounting head movement mechanism 33, the parts heating unit 37, the tool temperature sensor 39, the mounting head lifting mechanism 41, the pressure sensor 43, the ultrasonic oscillator 45, the film transport mechanism 47, the lifting mechanism 53, and the imaging device 18.

[0095] The control unit 19 is configured to control the component mounting device 1. The control unit 19 is a circuit including semiconductor elements, and includes a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that realizes predetermined functions by executing a program. The control unit 19 has a storage unit 97 such as memory, a hard disk, or an SSD, and realizes its functions by executing a program stored in the storage unit 97.

[0096] The control unit 19 includes a mounting control unit 93 that controls the operation of the parts supply unit moving unit 23, the stage moving unit 25, the mounting head moving mechanism 33, and the mounting head lifting mechanism 41, based on the production program 98 in the memory unit 97. The control unit 19 also includes a recognition unit 94, a calculation unit 95, and a determination unit 96 for evaluating the through holes 36a formed in the film 36.

[0097] The memory unit 97 contains a production program 98 and data 99 of the impact marks. The production program 98 is a program necessary to operate the component mounting device 1. The production program 98 also includes information such as the component mounting positions (coordinates) on the substrate 201, the names and mounting order of the components 203 to be mounted there, and the amount the mounting head 12 descends when punching holes in the film 36 according to the components 203.

[0098] Data 99 of the impact mark is data that serves as the evaluation criterion for the through hole 36a. Data 99 of the impact mark will be explained later.

[0099] (Configuration of the imaging device) Next, the imaging device 18 will be described with reference to Figure 22. The imaging device 18 includes a camera 81 that captures an image of the object to be captured, and an illumination unit 83 that illuminates the object to be captured with light.

[0100] The camera 81 is a solid-state image sensor such as a CCD image sensor, a CMOS image sensor, or an infrared image sensor. The camera 81 images the through-hole 36a of the film 36, the part 203 that is attracted to the tool 35, the flux applied to the part 203, etc., and sends the captured image data to the control unit 19. Based on the received image data, the control unit 19 determines whether the shape of the through-hole 36a, the orientation of the part 203, the application state of the flux, etc. are appropriate, and controls the operation of the mounting head moving mechanism 33 and the mounting head lifting mechanism 41 according to the determination result.

[0101] The illumination unit 83 is, for example, a ring illumination unit, in which LED (Light Emitting Diode) elements are arranged in a ring shape. When multiple rows of LED elements are arranged in a ring shape, the LED elements in the outer rows are positioned above the LED elements in the inner rows. Therefore, the LED elements in each row are arranged at an angle from the inside out. By illuminating the object to be imaged with light from the illumination unit 83, the contrast in the image of the object can be enhanced, allowing the camera 81 to capture a clear image. Furthermore, because it is a ring illumination unit, light can be uniformly irradiated onto the through-hole 36a.

[0102] (Through hole) Next, the through hole 36a will be described in detail with reference to Figure 23. Figure 23 is a longitudinal cross-sectional view of the area around the through hole 36a.

[0103] Around the through hole 36a, a protruding portion 36d is formed when a part of the film 36 is pushed up into the component suction hole 35b by the needle 51 of the drilling device 16. The film 36 has a first surface 36b which becomes the lower surface when set on the tool 35, and a second surface 36c which becomes the upper surface. The second surface 36c is in contact with the lower surface of the tool 35. The protruding portion 36d has an edge portion 36da that slopes inward and rises from the first surface 36b to the second surface 36c of the film 36 along the needle 51 that is pushed up from below, and a surface 36db that extends inward from the upper part of the sloped portion 36da. For example, if a circular through hole 36a is formed near the center of surface 36db, surface 36db is annular, and if a slit-shaped through hole 36a is formed on surface 36db, surface 36db is circular.

[0104] When light is shone onto the edge 36da from the illumination unit 83 of the imaging device 18, the shone light is scattered. Therefore, in the image captured by the camera 81, the edge 36da appears to glow white. By recognizing this edge 36da in the image, it is possible to determine whether the size of the through hole 36a is appropriate.

[0105] Next, various shapes of the through-hole 36a will be described with reference to Figure 24. Figure 24 is an explanatory diagram illustrating various through-holes.

[0106] As shown in Figure Ct1, when the tool 35 is pressed against the film 36, a suction hole mark 35ba exists on the film 36, which is the mark left by the edge of the component suction hole 35b being pressed against the film 36. On the film 36, a protruding portion 36d exists inside the suction hole mark 35ba. On the protruding portion 36d, an edge portion 36da exists on the outside, and a surface 36db exists inside the edge portion 36da. Furthermore, a through hole 36a exists inside the surface 36db.

[0107] The through-hole 36a in Figure Ct1 is a crack or fissure, not a circle. The through-hole 36a in Figure Ct2 is an opening, not a circle. The through-hole 36a in Figure Ct3 is circular, but not large enough, and therefore unsuitable as a through-hole. The through-holes 36a in Figures Ct4 and Ct5 are circular and of sufficient size.

[0108] Next, refer to Figure 25. Figure 25 is an explanatory diagram showing an image of the first surface of the film captured by the camera 81. In image Ct6, on the film 36m, which is an image of the film 36, a suction hole mark 35ba is captured, which is the mark left by the component suction hole 35b pressing against the film 36. Inside the suction hole mark 35ba, a push-up mark 36df is captured, which is an image of the push-up portion 36d. The circular edge 36daa inside the push-up mark 36df corresponds to the outer edge of the through hole 36a, so the diameter of the inner edge 36daa of the push-up mark 36df corresponds to the diameter of the through hole 36a. The camera 81 cannot directly image the through hole 36a, but since the inner edge 36daa of the push-up mark 36df is captured, the size of the through hole 36a can be detected. If the size of the circle of the edge 36daa, for example, the diameter or area, is greater than or equal to a predetermined size, it is presumed that the opening of the through hole 36a is formed to an appropriate size. The relationship between the size of the circle at the edge 36daa in image Ct6 and the size of the opening of the actual through hole 36a has been measured and established in advance.

[0109] For example, the size of the through-hole 36a is determined by comparing the ratio of the diameter DB of the edge 36daa of the up-touch mark 36df of the film 36m to the diameter DA of the suction hole mark 35ba on the image Ct6 with a predetermined threshold, as shown in Figure 25. For example, the determination unit 96 determines that the size of the up-touch mark 36df (through-hole 36a) is normal if the diameter DB is 50% or more of the diameter DA, and determines that the size of the through-hole 36a is an error if it is less than 50%. This threshold is included in the up-touch mark data 99 of the storage unit 97. In the following, the edge 36daa of the up-touch mark 36df coincides with the outer edge of the through-hole 36a as an image, so it may also be described as the through-hole 36daa.

[0110] (Inspection method for through holes) Next, the inspection method for the through hole 36a will be described with reference to Figures 26 to 32. Figure 26 is a flowchart showing the inspection flow of the through hole 36a. Figure 27 is an explanatory diagram showing an image of the entire film 36 set on the lower surface 35a of the tool 35. Figure 28 is an explanatory diagram showing an image of the area around the extracted puncture mark 36df. Figure 29 is an explanatory diagram showing a binarized image of the area around the puncture mark 36df. Figure 30 is an explanatory diagram showing an image of the circle of the puncture mark 36df. Figure 31 is an explanatory diagram showing an image of edge detection of the puncture mark 36df. Figure 32 is an explanatory diagram showing an image of the edge 36daa of the puncture mark 36df.

[0111] In step S1, the mounting control unit 93 drives and controls the film transport mechanism 47 to feed out the film 36, and sets the film 36 on the lower surface 35a of the tool 35 without a through hole 36a formed therein.

[0112] In step S2, the needle 51 is pushed up from the first surface 36b toward the second surface 36c of the film 36, which is placed on the lower surface 35a of the tool 35, to create a through hole 36a in the thickness direction of the film 36.

[0113] In step S3, after the upward thrusting motion of the needle 51, the illumination unit 83 irradiates illumination light onto the first surface 36b, and the camera 81 captures an image of the first surface 36b, acquiring the image Ct7 shown in Figure 27. The camera 81 transmits the acquired image Ct7 to the control unit 19, where it is stored in the storage unit 97.

[0114] In step S4, the recognition unit 94 extracts image Ct8 of the area surrounding the suction hole 35, including the suction hole mark 35ba, from image Ct7. Figure 28 is an example of image Ct8 including the suction hole 35. When the first surface 36b of the film 36 is imaged, the camera 81 and the lower surface 35a of the tool 35 are positioned in a predetermined positional relationship. Therefore, the coordinate position of the suction hole 35 in image Ct7 is predetermined, and the coordinates of the area of ​​image Ct8 to be extracted are included in the thrust mark data 99. Therefore, the recognition unit 94 can quickly extract image Ct8 of the area surrounding the suction hole 35 by referring to the thrust mark data 99.

[0115] In step S5, the recognition unit 94 performs a binarization process on the extracted image Ct8 to obtain a binarized image Ct9. By creating a binarized image Ct9, the extraction accuracy of the edge 36daa in the thrust mark 36df, which is the imaged portion where reflected light reflected from the edge 36da that rises inclined along the contour of the thrust portion 36d of the film 36 is captured, can be improved.

[0116] In step S6, the recognition unit 94 extracts contour information of the edge portion 36daa of the impact mark 36df based on the binarized image Ct9, as shown in the image Ct10 of Figure 30, and detects the circle 36dab of the edge portion 36daa. The recognition unit 94 also detects the center 36dac of the circle 36dab.

[0117] In step S7, in order to further improve the accuracy of the detected circle, the recognition unit 94 uses the image Ct11 in which the circle 36dab was detected to perform edge scanning, which is the point of change from black to white, radially from the center 36dac of the detected circle 36dab, as shown in image Ct11 in Figure 31, and detects edge 36dad. Note that in Figure 31, edge 36dad is shown inward from its actual position for easier understanding.

[0118] In step S8, based on image Ct11, the calculation unit 95 performs a radial edge scan and calculates the distance between two points from two detected edges 36dad on a straight line in the first direction as the diameter of the circle, and detects the midpoint of the two points as the center of the circle. Furthermore, the calculation unit 95 performs the above process on the two points of edges 36dad in each direction detected by each radial scan and calculates the average of the circle's diameter and center, which is the circle of the inner edge 36daa of the thrust mark 36df, i.e., the through hole 36aa, as shown in image Ct12 in Figure 32. In this way, the calculation unit 95 calculates the diameter of the circle of the edge 36daa as the size of the thrust mark 36df, but it may also calculate the area of ​​the region inside the edge 36daa. In Figure 32, the through hole 36aa is shown further inward than its actual position for easier understanding. If two edges are not found on a straight line, that data is excluded and the average of the circle's diameter and center is calculated.

[0119] In step S9, the determination unit 96 determines whether the number of detected through holes 36aa is a predetermined number, based on image Ct7, each image Ct8 extracted from image Ct7, and the data of the impact marks 99. The number of component suction holes 35b located on the lower surface 35a of the tool 35 is included in the data of the impact marks 99.

[0120] If the determination unit 96 determines that the number of through holes 36aa is not the predetermined number (No. of step S9), it means that the through holes 36a have not been properly formed in the film 36, and the process is repeated again from step S1.

[0121] If the determination unit 96 determines that the number of through holes 36aa is a predetermined number (Yes in step S9), then in step S10, the determination unit 96 determines whether the size of the through holes 36aa is a predetermined size. For example, as described above, the determination unit 96 determines the size of the through holes 36aa by comparing the ratio of the diameter DB of the through holes 36aa in the film 36m to the diameter DA of the adsorption hole marks 35ba with a predetermined threshold.

[0122] If the determination unit 96 determines that the size of the through hole 36aa is the predetermined size (Yes in step S10), then the through hole 36 has been properly made in the film 36, so the inspection of the through hole is terminated and the part 203 is picked up by the tool 35 via the film 36.

[0123] If the determination unit 96 determines that the size of the through hole 36aa is not the predetermined size (No. of step S10), the size of the through hole 36 formed in the film 36 is small, and the process is repeated again from step S1. If, in step S6, the circle 36dab of the edge 36daa of the thrust mark 36df is not detected, the recognition unit 94 recognizes that there is no thrust mark 36df, that is, that the through hole 36aa was not detected, and the process is repeated again from step S1.

[0124] (effect) As described above, the component mounting device 1 of the embodiment mounts the component 203 onto the substrate 201 by adsorbing it with a component adsorption hole 35b of the tool 35 via a film 36 having a first surface 36b that contacts the component 203 and a second surface 36c opposite to the first surface 36b. The component mounting device 1 includes a hole-punching device 16 having a needle 51 that pushes up the film 36 from the first surface 36b toward the second surface 36c to make a through hole 36a in the thickness direction of the film 36, an illumination unit 83 that irradiates illumination light onto the first surface 36b of the film 36, a camera 81 that images the first surface 36b, and a recognition unit 94 that recognizes the presence or absence of a push-up mark 36df based on an image of the first surface 36b taken while the first surface 36b has been pushed up by the needle 51 and is illuminated with illumination light.

[0125] Furthermore, the component mounting method of the embodiment involves mounting the component 203 onto the substrate 201 by adsorbing it with a component adsorption hole 35b of the tool 35 via a film 36 having a first surface 36b that contacts the component 203 and a second surface 36c opposite to the first surface 36b. The component mounting method includes a feeding step (S1) of placing the film 36 on the lower surface 35a of the tool 35, a drilling step (S2) of pushing up the needle 51 from the first surface 36b toward the second surface 36c of the film 36 placed on the lower surface 35a of the tool 35 to make a through hole 36a in the thickness direction of the film 36, an imaging step (S3) of capturing an image of the first surface 36b while illuminating the first surface 36b with illumination light after the needle 51 has been pushed up, and a recognition step (S4-S10) of determining whether or not there is a push-up mark 36df based on the captured image. If it is determined in the recognition process that there is an indentation mark 36df, the component 203 is picked up by the component suction hole 35b of the tool 35 via the film 36 and mounted on the substrate 201. If it is determined in the recognition process that there is no indentation mark 36df, the feeding process (S1), drilling process (S2), imaging process (S3), and recognition process (S4~S10) are performed again in order.

[0126] By imaging the first surface 36b, which has been subjected to the pushing motion by the needle 51, while illumination light is illuminating it, the recognition unit 94 can accurately recognize the presence or absence of the pushing marks 36df on the first surface 36b. By detecting the presence or absence of the pushing marks 36df, the presence or absence of a through hole 36a formed in the film can be detected.

[0127] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood to be included within the scope of this disclosure as defined by the attached claims. Furthermore, variations in combinations and sequences of elements in each embodiment can be realized without departing from the scope and spirit of this disclosure.

[0128] In the embodiment described above, the recognition unit 94, the calculation unit 95, and the determination unit 96 were included in the control unit 19 of the component mounting device 1, but are not limited to this. A separate management device that can communicate with the component mounting device 1 may also be equipped with the recognition unit 94, the calculation unit 95, and the determination unit 96. The management device may be, for example, a computer or a server. The management device may also be equipped with a storage unit and may store the indentation mark data 99. In this way, the component mounting system is configured with the component mounting device 1 and the management device.

[0129] Therefore, the component mounting system mounts the component 203 onto the substrate 201 by adsorbing it with the component adsorption hole 35b of the tool 35 via a film 36 having a first surface 36b that contacts the component 203 and a second surface 36c opposite to the first surface 36b. The component mounting system includes a hole-punching device 16 having a needle 51 that pushes the film 36 up from the first surface 36b toward the second surface 36c to make a through hole 36a in the thickness direction of the film 36, an illumination unit 83 that irradiates illumination light onto the first surface 36b of the film 36, a camera 81 that images the first surface 36b, and a recognition unit 94 that recognizes the presence or absence of a push-up mark 36df based on an image of the first surface 36b taken while the first surface 36b has been pushed up by the needle 51 and is illuminated with illumination light.

[0130] Even with this configuration, the same effects as those of the component mounting device 1 in the above-described embodiment can be obtained.

[0131] Furthermore, by appropriately combining any embodiment or modification from the various embodiments and modifications described above, the effects of each can be achieved. [Industrial applicability]

[0132] The component mounting apparatus, component mounting system, and component mounting method relating to this disclosure are applicable to component mounting apparatus and component mounting systems that apply flux or adhesive to components or substrates. [Explanation of Symbols]

[0133] 1. Component mounting device 3. Flux 11. Parts Supply Department 12 mounted heads 13 stages 15. Flux supply device 16. Drilling device 17 Beam 18 Imaging device 19 Control Unit 20 Touch Panel 21 base 23 Parts supply unit moving unit 25 Stage Movement Section 27 Stage heating section 29 Stage tilt adjustment section 31 Pickup head 33. Mounted head movement mechanism 35 Tools 35a Bottom side 35b Component suction hole 35ba Suction hole trace 35c film adhesive holes 36, 36m film 36a, 36aa through hole 36b 1st page 36c 2nd side 36d Push-up section 36da, 36daa edge 36dab yen 36db surface 36df Impact marks 37. Parts heating section 39 Tool Temperature Sensor 41. Mounted head lifting mechanism 43 Pressure Sensor 45 Ultrasonic Oscillator 47 Film transport mechanism 48 Feed roller 49. Winding roller 50 recesses 51 needles 52 Drilling heads 53 Lifting mechanism 54. Drilling mechanism 55 Impact reduction mechanism 56 Guide Rails 57 blocks 58 Drive unit 59 cabinets 59a aperture 59b aperture 59c 1st side 59d 2nd side 59e Third side 59f 1st slot 59g, 2nd slot 60 Slide mechanism 61 Guide Rail 62 blocks 63 Plates 63a First plate section 63b Second plate section 63c through hole 64 Support Blocks 65. Biasing member 66 Rods 67 Stopper 70 Slide mechanism 71 Guide rail 72 blocks 73 Plates 73a First plate section 73b Second plate section 74 Support Blocks 75. Biasing member 76 Rods 77 Stopper 81 Camera 83 Lighting Section 93 Mounted Control Unit 94 Recognition part 95 Calculation Unit 96 Judgment section 97 Storage section 95 98 Production Program 96 99 Data on impact marks 181 Up / Down Recognition Camera 201 circuit board 203 parts Pa mounting position Pb drilling position Pc flux application location Pd handover location P1 1st position P2 2nd position P3 3rd position At area Images Ct7, Ct8, Ct9, Ct10, Ct11, Ct12

Claims

1. A component mounting device that mounts a component onto a substrate by adsorbing it through a component adsorption hole in a tool, via a film having a first surface that contacts the component and a second surface opposite to the first surface, A hole-punching device having a needle that pushes the film upward from the first surface toward the second surface to create a through hole in the thickness direction of the film, An illumination unit that irradiates illumination light onto the first surface of the film, The imaging unit that images the first surface, A recognition unit recognizes the presence or absence of a thrust mark based on an image of the first surface captured while the first surface subjected to the thrusting motion by the needle is illuminated with the illumination light, A component mounting device equipped with the following features.

2. The needle is located directly below the component suction hole, The aforementioned hole-punching device inserts the needle that has penetrated the film into the inside of the component suction hole, thereby forming a push-up portion including the through-hole. The recognition unit extracts an image including the component suction hole based on the position information of the component suction hole in the captured image, and recognizes the presence or absence of the push-up mark based on the extracted image including the component suction hole. The component mounting device according to claim 1.

3. The recognition unit recognizes the presence or absence of the indentation mark in the captured image based on the captured portion in which reflected light reflected from the edge portion that rises inclined along the contour of the indentation of the indentation of the indentation of the film is captured. The component mounting device according to claim 1.

4. The recognition unit extracts the captured portion by binarizing the captured image. The component mounting device according to claim 3.

5. When the recognition unit recognizes that the captured image contains the thrust mark, the system further includes a calculation unit that calculates the size of the thrust mark based on the captured image. The component mounting device according to claim 1.

6. The calculation unit calculates the size of the indentation based on the diameter of the indentation in a first direction and the diameter in a second direction intersecting the first direction. The component mounting device according to claim 5.

7. The system further includes a determination unit that determines whether the size of the indentation is greater than or equal to a predetermined size, based on the size of the indentation calculated by the calculation unit and the size of the component suction hole. The component mounting device according to claim 5.

8. A mounting head comprising the aforementioned tool, which mounts the component held by the tool onto a substrate, A mounting head moving mechanism moves the mounting head to a parts supply unit that supplies the parts via the drilling device, The system further includes a mounting head lifting mechanism for raising and lowering the aforementioned mounting head, The component mounting device according to claim 1.

9. A component mounting system that mounts a component onto a substrate by adsorbing it through a component adsorption hole in a tool, via a film having a first surface that contacts the component and a second surface opposite to the first surface, A hole-punching device having a needle that pushes the film upward from the first surface toward the second surface to create a through hole in the thickness direction of the film, An illumination unit that irradiates illumination light onto the first surface of the film, The imaging unit that images the first surface, A recognition unit recognizes the presence or absence of the thrust marks based on an image of the first surface captured while the first surface subjected to the thrusting motion by the needle is illuminated with the illumination light, A component mounting system equipped with the following features.

10. A component mounting method comprising mounting a component onto a substrate by adsorbing it through a component adsorption hole in a tool, via a film having a first surface that contacts the component and a second surface opposite to the first surface, A feeding step in which the film is placed on the lower surface of the tool, A hole-punching step in which the needle is pushed up from the first surface to the second surface of the film, which is placed on the lower surface of the tool, to make a through hole in the thickness direction of the film, The imaging step involves capturing an image of the first surface while illuminating it with illumination light after the needle thrusting motion, and acquiring the captured image. The system includes a recognition step of determining whether or not the impact mark is present based on the captured image, If it is determined in the recognition step that there is a push mark, the component is picked up by the component suction hole of the tool via the film and mounted on the substrate. If it is determined in the recognition step that there are no push marks, the feeding step, the drilling step, the imaging step, and the recognition step are performed again in order. Component mounting method.

Images