Terminals and methods for manufacturing terminals

Abstract

To reduce the insertion / removal resistance between the terminal and the mating terminal. [Solution] The present invention discloses a terminal and a method for manufacturing a terminal. The terminal comprises a terminal body 10 having a mating portion 11 for mating with a mating terminal. A first bottom plating layer 11a is formed on the contact surface of the mating portion 11 of the terminal body 10, and a first silver-graphite plating layer 11c is formed on the first bottom plating layer 11a. Graphite particles are uniformly dispersed in the first silver-graphite plating layer 11c to improve the wear resistance and conductivity of the mating portion 11 of the terminal body 10. In the present invention, the silver-graphite plating layer has excellent wear resistance and conductivity, can significantly increase the number of mating cycles between the terminal and the mating terminal, and can reduce the insertion and removal resistance between the terminal and the mating terminal.

Description

Technical Field

[0001] Cross - reference to related applications This application claims the benefit of Chinese Patent Application No. CN202411630940.9, filed with the China National Intellectual Property Administration on November 14, 2024, the entire disclosure of which is incorporated herein by reference.

[0002] The present invention relates to terminals and a terminal manufacturing method.

Background Art

[0003] In the prior art, conventional power terminals and signal terminals generally use the ordinary silver plating method and have a silver plating layer on their surfaces. However, the silver plating layer has drawbacks such as low wear resistance and high insertion - extraction resistance. As a result, the number of insertion - extraction times of ordinary silver - plated terminals is usually only dozens of times, and at most only hundreds of times. However, in some application fields, it is necessary to frequently insert and remove the terminals, and the required number of insertion - extraction times of the terminals reaches thousands of times, or even hundreds of thousands of times. Ordinary silver - plated terminals cannot meet this requirement.

[0004] In addition, due to the low wear resistance of the ordinary silver plating layer, after multiple insertions and removals, the plating layer of ordinary silver - plated terminals wears severely, and the plating layer may peel off, exposing the base material of the terminal. The exposed terminal base material oxidizes and corrodes, increasing the contact resistance between the terminal and the mating terminal. When power is applied, excessive heat is generated, and in extreme cases, there is a risk of causing a fire.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present invention is made to overcome or mitigate at least one aspect of the above - mentioned drawbacks.

Means for Solving the Problems

[0006] According to an aspect of the present invention, a terminal is provided. The terminal comprises a terminal body having a mating portion for mating with a mating terminal. A first bottom plating layer is formed on the contact surface of the mating portion of the terminal body, and a first silver-graphite plating layer is formed on the first bottom plating layer, wherein graphite particles are uniformly dispersed in the first silver-graphite plating layer to improve the wear resistance and conductivity of the mating portion of the terminal body.

[0007] According to an exemplary embodiment of the present invention, the Ag content of the first silver-graphite plating layer is greater than 99%.

[0008] According to another exemplary embodiment of the present invention, the thickness of the first silver-graphite plating layer is 1 to 5 μm.

[0009] According to another exemplary embodiment of the present invention, the terminal body is a copper component that serves as a substrate for electroplating a first bottom layer, the first bottom layer being a nickel plating layer having a thickness of 1 to 5 μm.

[0010] According to another exemplary embodiment of the present invention, the terminal body is a copper component that serves as a substrate for electroplating a first bottom layer, the first bottom layer being a silver plating layer having a thickness of 0.1 to 0.5 μm.

[0011] According to another exemplary embodiment of the present invention, the terminal body is made of aluminum and serves as a substrate for electroplating a first bottom layer, the first bottom layer being a copper plating layer having a thickness of 1 to 3 μm.

[0012] According to another exemplary embodiment of the present invention, the terminal body is made of aluminum and serves as a substrate for electroplating a first bottom layer, the first bottom layer being a nickel plating layer having a thickness of 1 to 5 μm.

[0013] According to another exemplary embodiment of the present invention, the terminal body is made of aluminum and serves as a substrate for electroplating a first bottom layer, the first bottom layer being a silver plating layer having a thickness of 0.1 to 0.5 μm.

[0014] According to another exemplary embodiment of the present invention, the terminal also has a first silver alloy plating layer formed between the first bottom plating layer and the first silver graphite plating layer, the first silver alloy plating layer having a thickness of 1 to 8 μm.

[0015] According to another exemplary embodiment of the present invention, the terminal also has a second silver alloy plating layer formed on a first silver graphite plating layer, the thickness of the second silver alloy plating layer being 1 μm or more.

[0016] According to another exemplary embodiment of the present invention, the terminal body also has a crimping portion for crimping onto a cable conductor, a second bottom plating layer formed on the contact surface of the crimping portion with the cable conductor, a second silver-graphite plating layer formed on the second bottom plating layer, and graphite particles uniformly dispersed in the second silver-graphite plating layer to improve the wear resistance and conductivity of the crimping portion of the terminal body.

[0017] According to another exemplary embodiment of the present invention, the Ag content of the first silver-graphite plating layer and the second silver-graphite plating layer is greater than 99%.

[0018] According to another exemplary embodiment of the present invention, the thickness of the first silver-graphite plating layer is 1 to 5 μm, and the thickness of the second silver-graphite plating layer is 1 μm or more and less than or equal to the thickness of the first silver-graphite plating layer.

[0019] According to another exemplary embodiment of the present invention, the terminal body is a copper component that serves as a substrate for electroplating a first bottom layer and a second bottom layer, the first bottom layer and the second bottom layer being nickel plating layers, and the thickness of the first bottom layer and the second bottom layer being 1 to 5 μm.

[0020] According to another exemplary embodiment of the present invention, the terminal body is a copper component that serves as a substrate for electroplating a first bottom layer and a second bottom layer, the first bottom layer and the second bottom layer being silver plating layers, and the thickness of the first bottom layer and the second bottom layer being 0.1 to 0.5 μm.

[0021] According to another exemplary embodiment of the present invention, the terminal body is an aluminum component that serves as a substrate for electroplating a first bottom layer and a second bottom layer, the first bottom layer and the second bottom layer being copper plating layers, and the thickness of the first bottom layer and the second bottom layer being 1 to 3 μm.

[0022] According to another exemplary embodiment of the present invention, the terminal body is an aluminum component that serves as a substrate for electroplating a first bottom layer and a second bottom layer, the first bottom layer and the second bottom layer being nickel plating layers, and the thickness of the first bottom layer and the second bottom layer being 1 to 5 μm.

[0023] According to another exemplary embodiment of the present invention, the terminal body is an aluminum component that serves as a substrate for electroplating a first bottom layer and a second bottom layer, the first bottom layer and the second bottom layer being silver plating layers, and the thickness of the first bottom layer and the second bottom layer being 0.1 to 0.5 μm.

[0024] According to another aspect of the present invention, a method for manufacturing terminals, S11: Step of installing the terminal body, S12: A step of forming the first bottom plating layer on the contact surface of the mating portion of the terminal body for mating with the mating terminal, S13: A step of forming a first silver alloy plating layer on the first bottom plating layer, S14: A step of forming a first silver-graphite plating layer on a first silver alloy plating layer, S15: Step of forming a second silver alloy plating layer on the first silver graphite plating layer A terminal manufacturing method including the above is provided.

[0025] According to an exemplary embodiment of the present invention, step S12 further includes forming a second bottom plating layer on a contact surface of a crimping portion of a terminal body for crimping to a cable conductor, and step S14 further includes forming a second silver graphite plating layer on the second bottom plating layer.

[0026] According to another exemplary embodiment of the present invention, the terminal manufacturing method further includes performing ultrasonic cleaning on the terminal after step S15, and then performing drying and anti-oxidation treatment after cleaning.

[0027] According to another aspect of the present invention, there is provided a terminal manufacturing method, comprising: S21: Step of providing a terminal body; S22: Step of forming a first bottom plating layer on a contact surface of a fitting portion of the terminal body for fitting to a mating terminal; S23: Step of forming a first silver graphite plating layer on the first silver alloy plating layer A terminal manufacturing method including the above is provided.

[0028] According to an exemplary embodiment of the present invention, step S22 further includes forming a second bottom plating layer on a contact surface of a crimping portion of the terminal body for crimping to a cable conductor, and step S23 further includes forming a second silver graphite plating layer on the second bottom plating layer.

[0029] According to another exemplary embodiment of the present invention, the terminal manufacturing method further includes performing ultrasonic cleaning on the terminal after step S23, and then performing drying and anti-oxidation treatment after cleaning.

[0030] In the above exemplary embodiment of the present invention, the silver-graphite plating layer has excellent wear resistance and conductivity, can significantly increase the number of mating cycles between the terminal and the mating terminal, and can reduce the insertion and removal resistance between the terminal and the mating terminal.

[0031] The above and other features of the present invention will become clearer by describing exemplary embodiments of the present invention in detail with reference to the attached drawings. [Brief explanation of the drawing]

[0032] [Figure 1] This is an explanatory diagram of the terminal body according to the first embodiment of the present invention. [Figure 2] This is an explanatory diagram of the terminals according to the first embodiment of the present invention. [Figure 3] This is a partially enlarged explanatory diagram of the mating portion of a terminal according to the first embodiment of the present invention. [Figure 4] This is a partially enlarged explanatory diagram of the crimped portion of a terminal according to the first embodiment of the present invention. [Figure 5] This is an explanatory diagram of a terminal, a mating terminal, and a cable conductor according to a first embodiment of the present invention, in which the mating portion of the terminal is mated with the mating terminal and the crimping portion of the terminal is crimped to the cable conductor. [Figure 6] This is an explanatory diagram of the terminal body according to a second embodiment of the present invention. [Figure 7] This is an explanatory diagram of the terminals according to a second embodiment of the present invention. [Figure 8] This is a partially enlarged explanatory diagram of the mating portion of a terminal according to a second embodiment of the present invention. [Figure 9] This is a partially enlarged explanatory diagram of the crimped portion of a terminal according to a second embodiment of the present invention. [Figure 10] This is an explanatory diagram of a terminal, a mating terminal, and a cable conductor according to a second embodiment of the present invention, in which the mating portion of the terminal is mated with the mating terminal and the crimping portion of the terminal is crimped to the cable conductor. [Modes for carrying out the invention]

[0033] Illustrative embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the drawings, the same reference numerals refer to the same elements. However, the present disclosure can be embodied in many different forms and should not be construed as being limited to the embodiments described herein. Rather, these embodiments are provided so as to make the present disclosure thorough and complete and so as to fully convey the concepts of the present disclosure to those skilled in the art.

[0034] The following detailed description includes numerous specific details for illustrative purposes to provide a thorough understanding of the disclosed embodiments. However, it will be apparent that one or more embodiments can be carried out without these specific details. In other examples, well-known structures and devices are shown schematically for the sake of simplifying the drawings.

[0035] According to an aspect of the present invention, a terminal is provided. The terminal comprises a terminal body having a mating portion for mating with a mating terminal. A first bottom plating layer is formed on the contact surface of the mating portion of the terminal body, and a first silver-graphite plating layer is formed on the first bottom plating layer, wherein graphite particles are uniformly dispersed in the first silver-graphite plating layer to improve the wear resistance and conductivity of the mating portion of the terminal body.

[0036] According to another aspect of the present invention, a terminal manufacturing method is provided, comprising the steps of: providing a terminal body; forming a first bottom plating layer on the contact surface of a mating portion of the terminal body for mating with a mating terminal; forming a first silver alloy plating layer on the first bottom plating layer; forming a first silver graphite plating layer on the first silver alloy plating layer; and forming a second silver alloy plating layer on the first silver graphite plating layer.

[0037] According to another aspect of the present invention, a terminal manufacturing method is provided, comprising the steps of: providing a terminal body; forming a first bottom plating layer on the contact surface of the mating portion of the terminal body for mating with a mating terminal; and forming a first silver-graphite plating layer on the first silver alloy plating layer.

[0038] First Embodiment Figures 1 to 5 show a first embodiment according to the present invention. Of these figures, Figure 1 is an explanatory diagram of the terminal body 10 according to the first embodiment of the present invention, Figure 2 is an explanatory diagram of the terminal 1 according to the first embodiment of the present invention, Figure 3 is an enlarged explanatory diagram of part A of the mating portion 11 of the terminal 1 according to the first embodiment of the present invention, Figure 4 is an enlarged explanatory diagram of part B of the crimping portion 12 of the terminal 1 according to the first embodiment of the present invention, and Figure 5 is an explanatory diagram of the terminal 1, mating terminal 2, and cable conductor 3 according to the first embodiment of the present invention, in which the mating portion 11 of the terminal 1 is mated to the mating terminal 2 and the crimping portion 12 of the terminal 1 is crimped to the cable conductor 3.

[0039] As shown in Figures 1 to 5, a terminal 1 is disclosed in an exemplary embodiment of the present invention. The terminal 1 comprises a terminal body 10. The terminal body 10 has a mating portion 11 for mating with a mating terminal 2. A first bottom plating layer 11a is formed on the contact surface of the mating portion 11 of the terminal body 10, and a first silver alloy plating layer 11b is formed on the first bottom plating layer 11a. For example, the first silver alloy plating layer 11b may be a silver antimony (AgSb) alloy plating layer. A first silver graphite plating layer (or referred to as the first Ag-C plating layer) 11c is formed on the first silver alloy plating layer 11b, and a second silver alloy plating layer 11d is formed on the first silver graphite plating layer 11c. For example, the second silver alloy plating layer 11d may be a silver antimony alloy plating layer.

[0040] As shown in Figures 1 to 5, in the illustrated embodiment, graphite particles are uniformly dispersed in the first silver-graphite plating layer 11c, thereby improving the wear resistance and conductivity of the mating portion 11 of terminal 1 and reducing the insertion resistance between the mating portion 11 of terminal 1 and the mating terminal 2.

[0041] As shown in Figures 1 to 5, in the illustrated embodiment, the Ag content of the first silver-graphite plating layer 11c is greater than 99% by weight, and the thickness of the first silver-graphite plating layer 11c is 1 to 5 μm.

[0042] As shown in Figures 1 to 5, in an exemplary embodiment of the present invention, the terminal body 10 is a copper component and functions as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a nickel plating layer and has a thickness of 1 to 5 μm.

[0043] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component and serves as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a silver plating layer having a thickness of 0.1 to 0.5 μm.

[0044] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the terminal body 10 is made of aluminum and serves as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a copper plating layer having a thickness of 1 to 3 μm.

[0045] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the terminal body 10 is made of aluminum and serves as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a nickel plating layer having a thickness of 1 to 5 μm.

[0046] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the terminal body 10 is made of aluminum and serves as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a silver plating layer having a thickness of 0.1 to 0.5 μm.

[0047] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the thickness of the first silver alloy plating layer 11b is 1 to 8 μm, and the thickness of the second silver alloy plating layer 11d is 1 μm or more.

[0048] As shown in Figures 1 to 5, in the illustrated embodiment, the terminal body 10 also has a crimping portion 12 for crimping onto the cable conductor 3. A second bottom plating layer 12a is formed on the contact surface of the crimping portion 12 with the cable conductor 3, and a second silver-graphite plating layer 12c is formed on the second bottom plating layer 12a. Graphite particles are uniformly dispersed in the second silver-graphite plating layer 12c to improve the wear resistance and conductivity of the crimping portion 12 of the terminal body 10.

[0049] As shown in Figures 1 to 5, in the illustrated embodiments, the Ag content of the first silver-graphite plating layer 11c and the second silver-graphite plating layer 12c is greater than 99%. The thickness of the first silver-graphite plating layer 11c is 1 to 5 μm, and the thickness of the second silver-graphite plating layer 12c is 1 μm or more and less than or equal to the thickness of the first silver-graphite plating layer 11c.

[0050] As shown in Figures 1 to 5, in an exemplary embodiment of the present invention, the terminal body 10 is a copper component and functions as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are nickel plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 1 to 5 μm.

[0051] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are silver plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 0.1 to 0.5 μm.

[0052] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are copper plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 1 to 3 μm.

[0053] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are nickel plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 1 to 5 μm.

[0054] As shown in Figures 1 to 5, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are silver plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 0.1 to 0.5 μm.

[0055] As shown in Figures 1 to 5, a terminal manufacturing method is also disclosed in another exemplary embodiment of the present invention. The terminal manufacturing method includes the following steps. S11: Provide the terminal body 10. S12: The first bottom plating layer 11a is formed on the contact surface of the mating portion 11 of the terminal body 10 for mating with the mating terminal 2. S13: The first silver alloy plating layer 11b is formed on the first bottom plating layer 11a. S14: A first silver-graphite plating layer 11c is formed on the first silver alloy plating layer 11b. S15: A second silver alloy plating layer 11d is formed on the first silver graphite plating layer 11c.

[0056] As shown in Figures 1 to 5, in the illustrated embodiment, step S12 further includes forming a second bottom plating layer 12a on the contact surface of the crimping portion 12 of the terminal body 10 for crimping to the cable conductor 3. Step S14 further includes forming a second silver-graphite plating layer 12c on the second bottom plating layer 12a.

[0057] As shown in Figures 1 to 5, in the illustrated embodiment, the above-described terminal manufacturing method further includes ultrasonic cleaning of the terminal 1 after step S15, and drying and oxidation prevention treatment of the terminal 1 after cleaning.

[0058] In the above embodiment, the silver-graphite (Ag-C) plating layer not only possesses all the properties of a pure silver plating layer, but also acquires chemical and mechanical properties that cannot be obtained with a pure silver plating layer, thereby significantly reducing the insertion and removal resistance of the terminals. In addition, the silver-graphite plating layer is non-brittle and has higher wear resistance and conductivity than a pure silver plating layer. At the same time, the silver-graphite plating layer is maintenance-free and self-lubricating, improving efficiency and reducing costs. Its appearance is dark gray.

[0059] Second Embodiment Figures 6 to 10 show a second embodiment according to the present invention. Of these figures, Figure 6 is an explanatory diagram of the terminal body 10 according to the second embodiment of the present invention, Figure 7 is an explanatory diagram of the terminal 1 according to the second embodiment of the present invention, Figure 8 is an enlarged explanatory diagram of part A of the mating portion 11 of the terminal 1 according to the second embodiment of the present invention, Figure 9 is an enlarged explanatory diagram of part B of the crimping portion 12 of the terminal 1 according to the second embodiment of the present invention, and Figure 10 shows an explanatory diagram of the terminal 1, mating terminal 2, and cable conductor 3 according to the second embodiment of the present invention, in which the mating portion 11 of the terminal 1 is mated to the mating terminal 2 and the crimping portion 12 of the terminal 1 is crimped to the cable conductor 3.

[0060] As shown in Figures 6 to 10, a terminal 1 is also disclosed in an exemplary embodiment of the present invention. The terminal 1 comprises a terminal body 10. The terminal body 10 has a mating portion 11 for mating with a mating terminal 2. A first bottom plating layer 11a is formed on the contact surface of the mating portion 11 of the terminal body 10, and a first silver-graphite plating layer 11c is formed on the first bottom plating layer 11a. Graphite particles are uniformly dispersed in the first silver-graphite plating layer 11c to improve the wear resistance and conductivity of the mating portion 11 of the terminal 1.

[0061] As shown in Figures 6 to 10, in the illustrated embodiment, the Ag content of the first silver-graphite plating layer 11c is greater than 99%. The thickness of the first silver-graphite plating layer 11c is 1 to 5 μm.

[0062] As shown in Figures 6 to 10, in an exemplary embodiment of the present invention, the terminal body 10 is a copper component and functions as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a nickel plating layer and has a thickness of 1 to 5 μm.

[0063] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component and serves as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a silver plating layer having a thickness of 0.1 to 0.5 μm.

[0064] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is made of aluminum and serves as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a copper plating layer having a thickness of 1 to 3 μm.

[0065] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is made of aluminum and serves as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a nickel plating layer having a thickness of 1 to 5 μm.

[0066] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is made of aluminum and serves as a substrate for electroplating a first bottom layer 11a. The first bottom layer 11a is a silver plating layer having a thickness of 0.1 to 0.5 μm.

[0067] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 further has a crimping portion 12 for crimping onto a cable conductor 3. A second bottom plating layer 12a is formed on the contact surface of the crimping portion 12 with the cable conductor 3, and a second silver-graphite plating layer 12c is formed on the second bottom plating layer 12a. Graphite particles are uniformly dispersed in the second silver-graphite plating layer 12c to improve the wear resistance and conductivity of the crimping portion 12 of the terminal body 10.

[0068] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the Ag content of the first silver-graphite plating layer 11c and the second silver-graphite plating layer 12c is greater than 99%.

[0069] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the thickness of the first silver-graphite plating layer 11c is 1 to 5 μm, and the thickness of the second silver-graphite plating layer 12c is 1 μm or more and less than or equal to the thickness of the first silver-graphite plating layer 11c.

[0070] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are nickel plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 1 to 5 μm.

[0071] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are silver plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 0.1 to 0.5 μm.

[0072] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are copper plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 1 to 3 μm.

[0073] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are nickel plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 1 to 5 μm.

[0074] As shown in Figures 6 to 10, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum component and serves as a substrate for electroplating a first bottom layer 11a and a second bottom layer 12a. The first bottom layer 11a and the second bottom layer 12a are silver plating layers, and the thickness of the first bottom layer 11a and the second bottom layer 12a is 0.1 to 0.5 μm.

[0075] As shown in Figures 6 to 10, a terminal manufacturing method is also disclosed in another exemplary embodiment of the present invention. The terminal manufacturing method includes the following steps: S21: Provide the terminal body 10. S22: The first bottom plating layer 11a is formed on the contact surface of the mating portion 11 of the terminal body 10 for mating with the mating terminal 2. S23: A first silver-graphite plating layer 11c is formed on the first silver alloy plating layer 11b.

[0076] As shown in Figures 6 to 10, in the illustrated embodiment, step S22 further includes forming a second bottom plating layer 12a on the contact surface of the crimping portion 12 of the terminal body 10 for crimping to the cable conductor 3. Step S23 further includes forming a second silver-graphite plating layer 12c on the second bottom plating layer 12a.

[0077] As shown in Figures 6 to 10, in the illustrated embodiment, the above-described terminal manufacturing method further includes ultrasonic cleaning of the terminal 1 after step S23, and drying and oxidation prevention treatment of the terminal 1 after cleaning.

[0078] In the above embodiment, the silver-graphite (Ag-C) plating layer not only possesses all the properties of a pure silver plating layer, but also acquires chemical and mechanical properties that cannot be obtained with a pure silver plating layer, thereby significantly reducing the insertion and removal resistance of the terminals. In addition, the silver-graphite plating layer is non-brittle and has higher wear resistance and conductivity than a pure silver plating layer. At the same time, the silver-graphite plating layer is maintenance-free and self-lubricating, improving efficiency and reducing costs. Its appearance is dark gray.

[0079] Those skilled in the art should understand that the embodiments described above are illustrative and not limiting. For example, those skilled in the art can make many modifications to the embodiments without structural or principle contradictions and can freely combine the various features described in different embodiments.

[0080] While several exemplary embodiments have been illustrated and described, it will be understood by those skilled in the art that various modifications or changes can be made to these embodiments without departing from the principles and spirit of this disclosure. The scope of this disclosure is defined in the claims and its equivalents.

[0081] When used herein, elements described in the singular form and preceded by the word "a" or "an" should be understood not to exclude the plural forms of such elements or steps unless it is explicitly stated that such exclusion is to be excluded. Furthermore, references to “one embodiment” of the present invention are not intended to be construed as excluding the existence of additional embodiments that likewise incorporate the described features. Moreover, unless it is expressly stated otherwise, embodiments that “compile” or “have” one or more elements having a particular characteristic may include additional such elements that do not possess that characteristic.

Claims

1. It is a terminal, The terminal body (10) has a mating portion (11) for mating with the mating terminal (2), A first bottom plating layer (11a) is formed on the contact surface of the fitting portion (11) of the terminal body (10), and a first silver-graphite plating layer (11c) is formed on the first bottom plating layer (11a). A terminal in which graphite particles are uniformly dispersed in the first silver-graphite plating layer (11c) to improve the wear resistance and conductivity of the mating portion (11) of the terminal body (10).

2. The terminal according to claim 1, wherein the Ag content of the first silver-graphite plating layer (11c) is greater than 99%.

3. The terminal according to claim 1, wherein the thickness of the first silver-graphite plating layer (11c) is 1 to 5 μm.

4. The terminal body (10) is a copper component that functions as a substrate for electroplating the first bottom plating layer (11a), The terminal according to claim 1, wherein the first bottom plating layer (11a) is a nickel plating layer having a thickness of 1 to 5 μm.

5. The terminal body (10) is a copper component that functions as a substrate for electroplating the first bottom plating layer (11a), The terminal according to claim 1, wherein the first bottom plating layer (11a) is a silver plating layer having a thickness of 0.1 to 0.5 μm.

6. The terminal body (10) is made of aluminum and functions as a substrate for electroplating the first bottom plating layer (11a). The terminal according to claim 1, wherein the first bottom plating layer (11a) is a copper plating layer having a thickness of 1 to 3 μm.

7. The terminal body (10) is made of aluminum and functions as a substrate for electroplating the first bottom plating layer (11a). The terminal according to claim 1, wherein the first bottom plating layer (11a) is a nickel plating layer having a thickness of 1 to 5 μm.

8. The terminal body (10) is made of aluminum and functions as a substrate for electroplating the first bottom plating layer (11a). The terminal according to claim 1, wherein the first bottom plating layer (11a) is a silver plating layer having a thickness of 0.1 to 0.5 μm.

9. The terminal according to claim 1, further comprising a first silver alloy plating layer (11b) formed between the first bottom plating layer (11a) and the first silver graphite plating layer (11c), wherein the first silver alloy plating layer (11b) has a thickness of 1 to 8 μm.

10. The terminal according to claim 1 or 9, wherein the terminal also has a second silver alloy plating layer (11d) formed on the first silver graphite plating layer (11c), and the thickness of the second silver alloy plating layer (11d) is 1 μm or more.

11. The terminal body (10) also has a crimping portion (12) for crimping onto the cable conductor (3), a second bottom plating layer (12a) is formed on the contact surface of the crimping portion (12) with the cable conductor (3), and a second silver-graphite plating layer (12c) is formed on the second bottom plating layer (12a). The terminal according to claim 1, wherein graphite particles are uniformly dispersed in the second silver-graphite plating layer (12c) to improve the wear resistance and conductivity of the crimping portion (12) of the terminal body (10).

12. The terminal according to claim 11, wherein the Ag content of the first silver-graphite plating layer (11c) and the second silver-graphite plating layer (12c) is greater than 99%.

13. The terminal according to claim 11, wherein the thickness of the first silver-graphite plating layer (11c) is 1 to 5 μm, and the thickness of the second silver-graphite plating layer (12c) is 1 μm or more and less than or equal to the thickness of the first silver-graphite plating layer (11c).

14. The terminal body (10) is a copper component that functions as a substrate for electroplating the first bottom layer (11a) and the second bottom layer (12a). The terminal according to claim 11, wherein the first bottom plating layer (11a) and the second bottom plating layer (12a) are nickel plating layers, and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 1 to 5 μm.

15. The terminal body (10) is a copper component that functions as a substrate for electroplating the first bottom layer (11a) and the second bottom layer (12a). The terminal according to claim 11, wherein the first bottom plating layer (11a) and the second bottom plating layer (12a) are silver plating layers, and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 0.1 to 0.5 μm.

16. The terminal body (10) is an aluminum component that functions as a substrate for electroplating the first bottom plating layer (11a) and the second bottom plating layer (12a). The terminal according to claim 11, wherein the first bottom plating layer (11a) and the second bottom plating layer (12a) are copper plating layers, and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 1 to 3 μm.

17. The terminal body (10) is an aluminum component that functions as a substrate for electroplating the first bottom plating layer (11a) and the second bottom plating layer (12a). The terminal according to claim 11, wherein the first bottom plating layer (11a) and the second bottom plating layer (12a) are nickel plating layers, and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 1 to 5 μm.

18. The terminal body (10) is an aluminum component that functions as a substrate for electroplating the first bottom plating layer (11a) and the second bottom plating layer (12a). The terminal according to claim 11, wherein the first bottom plating layer (11a) and the second bottom plating layer (12a) are silver plating layers, and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 0.1 to 0.5 μm.

19. A method for manufacturing terminals, S11: Step of providing the terminal body (10), S12: A step of forming a first bottom plating layer (11a) on the contact surface of the fitting portion (11) of the terminal body (10) for fitting to the mating terminal (2), S13: A step of forming a first silver alloy plating layer (11b) on the first bottom plating layer (11a), S14: A step of forming a first silver-graphite plating layer (11c) on the first silver alloy plating layer (11b), S15: A step of forming a second silver alloy plating layer (11d) on the first silver graphite plating layer (11c) A method for manufacturing terminals, including the manufacturing method.

20. Step S12 further includes forming a second bottom plating layer (12a) on the contact surface of the crimping portion (12) of the terminal body (10) for crimping to the cable conductor (3), The terminal manufacturing method according to claim 19, wherein step S14 further comprises forming a second silver-graphite plating layer (12c) on the second bottom plating layer (12a).

21. The terminal manufacturing method according to claim 19, further comprising ultrasonic cleaning of the terminal (1) after step S15, and then drying and oxidation prevention treatment after cleaning.

22. A method for manufacturing terminals, S21: Step of providing the terminal body (10), S22: A step of forming a first bottom plating layer (11a) on the contact surface of the fitting portion (11) of the terminal body (10) for fitting to the mating terminal (2), S23: Step of forming a first silver-graphite plating layer (11c) on the first silver alloy plating layer (11b) A method for manufacturing terminals, including the manufacturing method.

23. Step S22 further includes forming a second bottom plating layer (12a) on the contact surface of the crimping portion (12) of the terminal body (10) for crimping to the cable conductor (3), The terminal manufacturing method according to claim 22, wherein step S23 further comprises forming a second silver-graphite plating layer (12c) on the second bottom plating layer (12a).

24. The terminal manufacturing method according to claim 22, further comprising ultrasonic cleaning of the terminal (1) after step S23, and then drying and oxidation prevention treatment after cleaning.

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