Indication device

Abstract

The present invention provides a display device suitable for high-resolution displays and a method for manufacturing the same. Low power consumption operation is possible. To provide a functional display device. To provide a thin display device. [Solution] The display device includes a reflective liquid crystal element, and the liquid crystal layer reflects visible light and purple light. The first portion overlaps with the reflective electrode that shields from the external rays, and the region between two adjacent reflective electrodes overlaps with it. It has a second part which is a monomer and a liquid crystal, and the second part is It contains a polymer formed by the polymerization of monomers. In the second part, the polymer adheres a pair of substrates. It forms the framework of a columnar partition. The partition uses reflective electrodes as a light-shielding mask when light is irradiated. By being present, it can be formed in a self-aligned manner. Furthermore, the polymer is provided with reflective electrodes. It is positioned to fit into the recess of the insulating layer.

Description

Technical Field

[0001] One aspect of the present invention relates to a display device. One aspect of the present invention relates to a method for manufacturing a display device. In particular, one aspect of the present invention relates to a display device having a liquid crystal element and a method for manufacturing the display device.

[0002] Note that one aspect of the present invention is not limited to the above technical field. Examples of the technical field of one aspect of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices, electronic devices, lighting devices, input devices, input / output devices, driving methods thereof, or manufacturing methods thereof.

[0003] In this specification and the like, the semiconductor device generally refers to a device that can function by utilizing semiconductor characteristics. Transistors, semiconductor circuits, arithmetic units, storage devices, etc. are one aspect of semiconductor devices. In addition, imaging devices, electro-optical devices, power generation devices (including thin-film solar cells, organic thin-film solar cells, etc.), and electronic devices may have semiconductor devices.

Background Art

[0004] As one type of display device, there is a liquid crystal display device including a liquid crystal element. For example, an active matrix liquid crystal display device in which pixel electrodes are arranged in a matrix and transistors are used as switching elements connected to each of the pixel electrodes has attracted attention.

[0005] For example, an active matrix liquid crystal display device using a transistor having a metal oxide as a channel formation region as a switching element connected to each of the pixel electrodes is known. (Patent Documents 1 and 2)

[0006]

[0006] ​​​ Active-matrix liquid crystal displays are broadly divided into two types: transmissive and reflective. P is known.

[0007] Transmissive liquid crystal displays use cold cathode fluorescent lamps or LEDs (Light Emitting). Using a backlight such as a diode, and utilizing the optical modulation effect of liquid crystals, The state in which light from the source passes through the liquid crystal and is output to the outside of the liquid crystal display device, and the state in which no light is output. By selecting options, displaying light and dark areas, and then combining them, an image is displayed. It is.

[0008] Furthermore, reflective liquid crystal display devices utilize the optical modulation effect of liquid crystals to reflect ambient light, i.e., incident light. The state in which the light is reflected by the pixel electrode and output to the outside of the device, and the state in which the incident light is not output to the outside of the device. By selecting and then displaying light and dark, and further combining them, an image can be displayed. This is the case. Reflective liquid crystal displays have a backlight compared to transmissive liquid crystal displays. Because it does not use a tortoise, it has the advantage of low power consumption. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Japanese Patent Publication No. 2007-123861 [Patent Document 2] Japanese Patent Publication No. 2007-96055 [Overview of the project] [Problems that the invention aims to solve]

[0010] There is a demand for sharper images to be displayed on display devices, and in response to this, high There is a demand for high-resolution display devices.

[0011] Also, especially for portable use such as mobile phones, smartphones, tablet devices, and smartwatches. In these devices, the display devices incorporated are designed to reduce thickness, reduce weight, and reduce power consumption. Movable and operable features are required.

[0012] One aspect of the present invention aims to provide a display device suitable for high-resolution displays and a method for manufacturing the same. One of the issues is to provide a display device that can be operated with low power consumption. Alternatively, one of the objectives is to provide a thin display device. Alternatively, a lightweight display One of the objectives is to provide a device.

[0013] Furthermore, one aspect of the present invention aims to improve the display quality of a display device. One of the challenges is to display images with high display quality regardless of the usage environment.

[0014] Furthermore, the description of these problems does not preclude the existence of other problems. One aspect of the present invention It is not necessary to solve all of these issues. Also, based on the description in the specification, etc. It is possible to identify issues other than those listed above. [Means for solving the problem]

[0015] One aspect of the present invention is a display device having a first electrode, a liquid crystal layer, a light-shielding layer, and an insulating layer. The first electrode has the function of reflecting visible light and blocking ultraviolet light, and has an insulating layer on top of it. It is provided. The liquid crystal layer is provided with a first portion that overlaps with the first electrode and a portion that surrounds the first portion. It has a second part that is cut off, and the second part overlaps with the light-shielding layer. The first part is mono The second part includes a polymer formed by the polymerization of monomers. To use as a sign.

[0016] One aspect of the present invention comprises a first electrode, a second electrode, a liquid crystal layer, a light-shielding layer, and an insulating layer. It is a display device having a first electrode and a second electrode, respectively, which reflect visible light and purple light. It has the function of shielding from external rays. The first electrode and the second electrode are spaced apart on an insulating layer. An insulating layer is provided. The insulating layer has a recess, and the first electrode and the second electrode are positioned so as not to overlap with the recess. It is provided in place. The light-shielding layer has a portion between the first electrode and the second electrode, and a portion that overlaps with the recess. The liquid crystal layer has a first portion and a second portion, the first portion overlapping with the first electrode. The second part overlaps with the space between the first electrode and the second electrode, the recess, and the light-shielding layer. The first part contains monomers and liquid crystals, and the second part contains polymers formed by the polymerization of monomers.

[0017] Furthermore, it is preferable to have an insulating structure in contact with the above polymer. It is preferable that it has a light-shielding layer and a portion that overlaps with the recess.

[0018] Furthermore, it is preferable to have a third electrode that overlaps the first electrode with the liquid crystal layer in between. Electrode 3 preferably has the function of transmitting visible light. Also, in this case, the first electrode It has a first alignment film covering the third electrode and a second alignment film covering the second portion of the liquid crystal layer It is preferable that the first orientation film and the second orientation film are provided in contact with each of them. Furthermore, at this time, the structure is provided in contact with the first or second alignment layer. It is preferable.

[0019] Furthermore, it is preferable to have a first substrate and a second substrate in the above. The first electrode and the second electrode are located between the first substrate and the liquid crystal layer, and the light-shielding layer is located between the second substrate and the first substrate. It is preferable that it be located between the liquid crystal layer and the first substrate and the second substrate, respectively It is preferable that it be flexible.

[0020] Furthermore, it is preferable to have a light-emitting element in the above. In this case, the insulating layer is light-emitting Located between the element and the liquid crystal element, the light-emitting element transmits visible light from the insulating layer side to the fourth element The light-emitting element has a laminated structure of a pole, a layer containing a light-emitting material, and a fifth electrode, and the light-emitting element is on the insulating layer side It is preferable that it has the function of emitting light. In this case, it is electrically connected to the first electrode and It is preferable that the conductive film has a transparency that transmits visible light.

[0021] Furthermore, in the above, the first transistor is electrically connected to the first electrode, and the fourth electrode Preferably, the first transistor is electrically connected to the pole. Preferably, the first transistor and the second transistor are located on the same plane. Alternatively, the first transistor and the second transistor may be located on different surfaces. This is preferable.

[0022] Another aspect of the present invention involves forming an insulating layer on a first substrate, and on the insulating layer, The first electrode and the second electrode, respectively, have the function of reflecting visible light and blocking ultraviolet light. The first step involves forming the insulating layer at intervals, and the insulating layer does not overlap with the first and second electrodes. A second step involves etching a portion of the area to form a recess, and then applying a light-shielding layer to the second substrate. A third step in which the first substrate and the second substrate are subjected to polymerization initiation of liquid crystal, monomer and liquid crystal. The fourth step involves bonding a liquid crystal layer containing the agent in between, and irradiating light from the first substrate side, Polymerization of monomers in the liquid crystal layer occurs in a region not shielded by electrode 1 and electrode 2. A method for manufacturing a display device, comprising a fifth step.

[0023] Furthermore, in another aspect of the present invention, a first insulating layer is formed on a first support substrate. The step and the first insulating layer each have the function of reflecting visible light and blocking ultraviolet light. The second step is to form a first electrode and a second electrode spaced apart, and the first insulating layer The first electrode and the second electrode are etched to form a recess. Step 3, and a fourth step of forming a second insulating layer on the second support substrate, and second A fifth step is to form a light-shielding layer on the insulating layer, and the first support substrate and the second support substrate The sixth step involves bonding a liquid crystal layer containing liquid crystal, monomer and polymerization initiator in between, and Light is shone from the support substrate side of 1, in the region not blocked by the first electrode and the second electrode. , a seventh step of polymerizing monomers in the liquid crystal layer, and the first support substrate and the first insulating layer An eighth step delaminates between the first insulating layer and bonds the third substrate to the first insulating layer via the first adhesive layer. The second support substrate and the second insulating layer are separated, and the second insulating layer is bonded to the second adhesive layer. A method for manufacturing a display device, comprising a ninth step of bonding a fourth substrate to the fourth substrate.

[0024] Another aspect of the present invention involves a third support substrate that reflects visible light and violet light, respectively. A first electrode and a second electrode having a function of shielding from external rays, and the first electrode and the second electrode A first step of forming a third insulating layer to cover, and an opening in the third insulating layer that reaches the first electrode The second step is to form a mouth, and the first electrode is electrically connected to the third insulating layer. A third step of forming a conductive layer and a fourth electrode that transmits visible light, and on the fourth electrode The fourth step involves stacking a layer containing a luminescent material and a fifth electrode to form the fifth electrode. A fifth step involves bonding the first substrate to the electrode via a third adhesive layer, and The support substrate 3 and the fourth insulating layer are separated, exposing a portion of the first electrode and the second electrode. The sixth step involves the portion of the fourth insulating layer that does not overlap with the first and second electrodes. A seventh step involves etching a portion to form a recess, and forming a light-shielding layer on the second substrate. The eighth step involves a first substrate and a second substrate containing liquid crystal, monomer and polymerization initiator. The ninth step involves bonding the liquid crystal layer in between, and irradiating light from the first substrate side, and the first electrode and a 10th polymerizing monomers in the liquid crystal layer in a region not shielded by the second electrode This is a method for manufacturing a display device, comprising the steps of

[0025] Another aspect of the present invention is a fourth support substrate on which a fourth electrode that transmits visible light is provided, A first step of forming a fifth insulating layer covering the fourth electrode, and a fifth insulating layer covering the fourth electrode A second step of forming an opening that reaches the electrode, and on the fifth insulating layer, electrically to the fourth electrode A second conductive layer to be connected, and each having the function of reflecting visible light and blocking ultraviolet light. A third step of forming a first electrode and a second electrode having a fifth insulating layer, and a first A fourth electrode is formed by etching a portion of the electrode and a portion of the electrode that does not overlap with the second electrode to form a recess. Step, a fifth step of forming a light-shielding layer on a second substrate, and a fourth support substrate and a second The sixth step involves bonding the substrate with a liquid crystal layer containing liquid crystal, monomer, and polymerization initiator sandwiched between them. The area where light is irradiated from the fourth support substrate side and is not blocked by the first and second electrodes. In this, the seventh step involves polymerizing monomers in the liquid crystal layer, and the fourth support substrate and the fifth An eighth step involves peeling between the insulating layers to expose a portion of the fourth electrode, and covering the fourth electrode. The method comprises a layer containing a light-emitting substance and a ninth step of sequentially forming a fifth electrode. This is a method for manufacturing a display device.

[0026] Another aspect of the present invention involves a fifth support substrate that reflects visible light and violet light, respectively. A first electrode and a second electrode having a function of shielding from external rays, and the first electrode and the second electrode The first step is to form a covering sixth insulating layer, and peel off the gap between the fifth support substrate and the sixth insulating layer. The second step involves separating the electrodes and exposing a portion of the first and second electrodes, and the sixth insulating layer. The first electrode and the second electrode are etched to form a recess. Step 3, Step 4 of forming a light-shielding layer on the second substrate, Step 6 of forming an insulating layer A fifth substrate is bonded to the second substrate with a liquid crystal layer containing liquid crystal, monomer, and polymerization initiator sandwiched between them. The step and the area where light is shone from the sixth insulating layer side and is not blocked by the first electrode and the second electrode In the region, a sixth step is to polymerize monomers in the liquid crystal layer, and a fourth step is to place on the first substrate. A seventh step involves stacking an electrode, a layer containing a luminescent material, and a fifth electrode to form the second electrode. The method comprises an eighth step of bonding the substrate and the first substrate via a fourth adhesive layer. This is a method for manufacturing a display device. [Effects of the Invention]

[0027] According to one aspect of the present invention, a display device suitable for high-definition display and a method for manufacturing the same can be provided. Alternatively, a display device capable of low-power operation can be provided. Or, a thin display device can be provided. We can provide that. Or, we can provide a lightweight display device.

[0028] Furthermore, one aspect of the present invention does not necessarily have to possess all of these effects. It is possible to extract effects other than those mentioned above from the detailed descriptions, drawings, and claims. [Brief explanation of the drawing]

[0029] [Figure 1] An example of the configuration of a display device according to an embodiment. [Figure 2] An example of a touch panel configuration according to an embodiment. [Figure 3] An example of the configuration of a display device according to an embodiment. [Figure 4] An example of the configuration of a display device according to an embodiment. [Figure 5] An example of the configuration of a display device according to an embodiment. [Figure 6] An example of the configuration of a display device according to an embodiment. [Figure 7] An example of the configuration of a display device according to an embodiment. [Figure 8] An example of the configuration of a display device according to an embodiment. [Figure 9] An example of the configuration of a display device according to an embodiment. [Figure 10] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 11] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 12] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 13] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 14] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 15] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 16]A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 17] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 18] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 19] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 20] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 21] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 22] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 23] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 24] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 25] A diagram illustrating a method for manufacturing a display device according to an embodiment. [Figure 26] An example of the configuration of a display device according to an embodiment. [Figure 27] An example of the configuration of a display device according to an embodiment. [Figure 28] An example of the configuration of a display device according to an embodiment. [Figure 29] An example of the configuration of a display device according to an embodiment. [Figure 30] An example of the configuration of a display device according to an embodiment. [Figure 31] An example of the configuration of a display device according to an embodiment. [Figure 32] An example of transistor configuration according to an embodiment. [Figure 33] An example of the configuration of a display device according to an embodiment. [Figure 34] Circuit diagram of a display device according to an embodiment. [Figure 35] A circuit diagram of a display device according to an embodiment, and an example of the pixel configuration. [Figure 36] An example of the configuration of a display module according to an embodiment. [Figure 37] A diagram showing an example of an electronic device and lighting device according to an embodiment. [Figure 38] A diagram showing an example of an electronic device according to an embodiment. [Figure 39] A diagram showing an example of an electronic device according to an embodiment. [Modes for carrying out the invention]

[0030] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. Those skilled in the art will readily understand what is possible. Therefore, the present invention is as shown in the following embodiments. It should not be interpreted as being limited to the contents described herein.

[0031] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0032] In each figure described herein, the size, layer thickness, or area of ​​each component is as follows: It may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. stomach.

[0033] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0034] A transistor is a type of semiconductor device that amplifies current and voltage, and controls conduction or non-conductivity. It is possible to realize controlled switching operations, etc. Transistors in this specification are , IGFET(Insulated Gate Field Effect Trans istors and thin-film transistors (TFTs) ) includes.

[0035] (Embodiment 1) In this embodiment, an example of the configuration of a display device according to one aspect of the present invention, and a method for manufacturing the display device are provided. I will explain about that.

[0036] A display device according to one aspect of the present invention includes a plurality of reflective liquid crystal elements. The liquid crystal elements are a pair of electric It has electrodes and a liquid crystal layer. At least one of the pair of electrodes reflects visible light and ultraviolet light. A material that blocks (reflects or absorbs) light can be used. The liquid crystal layer is between a pair of substrates. It can be established.

[0037] The liquid crystal layer is an electrode that reflects visible light and blocks ultraviolet light (hereinafter referred to as a reflective electrode). The first part overlaps with (there is a crossover), and the second part overlaps with the region between two adjacent reflective electrodes. It has a first part comprising monomer and liquid crystal, and the second part comprising the monomer. It contains a combined polymer. In the second part, the polymer is a columnar separator that adheres a pair of substrates together. It constitutes the main part of the wall. The second part is provided to suppress color mixing between adjacent pixels. It is preferable to place it in superimposed with a light-shielding layer. The second part also contains liquid crystal. Alternatively, the columnar partition may contain a polymer and a liquid crystal.

[0038] A columnar partition containing polymer, located in the second portion of the liquid crystal layer, separates two adjacent liquid crystals. It is placed between the elements and has the function of separating the liquid crystal layers of the two liquid crystal elements. The columnar partitions containing polymer can also be called polymer walls. One liquid crystal element is The first part has a configuration in which a liquid crystal is surrounded by the partition wall and a pair of substrates. This is possible. The partition makes it less susceptible to the influence of the liquid crystal orientation state of the adjacent liquid crystal element. Therefore, it is possible to create a display device that can display images with improved contrast and other characteristics, resulting in a more vivid display. Furthermore, the liquid crystal of one liquid crystal element does not need to be completely separated from the liquid crystal of an adjacent liquid crystal element. If there is no partition between two adjacent liquid crystal elements, Yes.

[0039] When manufacturing a display device according to one aspect of the present invention, the liquid crystal layer sandwiched between a pair of substrates comprises liquid crystal and A material containing monomers and polymerization initiators is used. Then, a portion of the liquid crystal layer is irradiated with light. This causes the monomers to polymerize and change into polymers. At this time, the reflective electrode is shielded from light. By using it as a polymer, a polymer is formed in a region that does not overlap with the reflective electrode of the liquid crystal layer. Therefore, a partition containing polymer, located between adjacent reflective electrodes, is used with a light-shielding mask or the like. It can be formed in a self-consistent manner.

[0040] A display device according to one aspect of the present invention includes a partition wall containing a polymer that adheres a pair of substrates to adjacent pixels. Because it can be placed in between, the adhesive strength between the substrates is extremely high. Also, the partition wall is a pair It can also function as a gap spacer to maintain the distance between substrates. Furthermore, when external force is applied, such as pressing on the display surface or bending the display device, or when the display device vibrates... When this is done, the cell gap of the liquid crystal element does not change easily, so the cell gap does not change. Interference fringes and color changes are less likely to occur.

[0041] Furthermore, by using the method described above, the region not shielded by the reflective electrode, i.e., the reflective liquid crystal element, can be identified. Because polymers can be formed self-aligned in areas that do not affect the display using children. For example, compared to forming polymers using a light-shielding mask, smaller diameter partitions are formed. This makes it possible to arrange them at high density. Therefore, it is possible to manufacture extremely high-resolution display devices. This becomes possible. For example, if the resolution of the display area is 300 ppi or higher, or 500 ppi or higher, Or poles with 800 ppi or higher, or 1000 ppi or higher, and 3000 ppi or lower. It can also be applied to high-definition display devices.

[0042] Furthermore, the reflective electrodes are provided on an insulating layer. Here, the space between two adjacent reflective electrodes overlaps In the region, it is preferable that a recess is formed in the insulating layer. In the portion that does not overlap with the reflective electrode, the height of the upper surface is lower than in the portion that overlaps with the reflective electrode. The insulating layer has a region, or a region where a part of its upper surface is closer to the substrate surface than other parts. This can also be rephrased as "to possess" or "to have."

[0043] In this case, it is preferable that the columnar partition wall is provided in a position that overlaps with the recess in the insulating layer. For example, it is preferable that a columnar partition wall is provided so as to fit into a recess in the insulating layer. This increases the surface area of ​​the adhesive surface on the insulating layer side of the columnar partition, thereby increasing the adhesive strength between the substrates. It can be improved.

[0044] Furthermore, the first substrate side or the second substrate side has a convex structure in contact with a columnar partition wall. It is preferable that the convex structure is, for example, a gap to maintain the distance between a pair of substrates. A structure that functions as a spacer can be used. A columnar partition wall and a convex structure Because they are installed in close contact, the surface area of ​​the contact surface of the columnar partition wall increases, thus creating an anchoring effect. This occurs, further increasing the adhesive strength. In particular, a convex structure on the inside of a columnar partition wall. When positioned correctly, it can more effectively increase the adhesive strength between substrates.

[0045] Furthermore, if there is an insulating layer with a recess formed therein, the convex structure is positioned to overlap with the recess. It is preferable that it is provided in the part where both a recess in the insulating layer and a convex structure are provided. By providing columnar partitions, the anchoring effect is further enhanced, and the adhesive strength between the substrates is increased. It can be increased exponentially.

[0046] Furthermore, one aspect of the present invention has both a reflective display element and a light-emitting element, and the light emission mode, A display device (display panel) capable of displaying reflective mode and hybrid mode. It is preferable that such a display panel is ER-Hybrid Display. ay(Emission and Reflection Hybrid Display y, or Emission / Reflection Hybrid Display ) can also be called.

[0047] In this specification, hybrid display (hybrid mode) refers to a single panel displaying By using reflected light and self-illuminating light in combination, the color tone or light intensity is complemented by each other, and the characters or This is a method of displaying images. Alternatively, hybrid display refers to the use of the same pixel or the same sub-pixel. A method for displaying characters or images using light from multiple display elements. However, this is only true if you locally view a hybrid display that is performing hybrid display. Then, a pixel or sub-pixel displayed using one of multiple display elements, and multiple display It may have pixels or sub-pixels that are displayed using two or more elements.

[0048] Furthermore, in this specification, etc., if any one or more of the above expressions of the configuration are used This is called a hybrid display.

[0049] Furthermore, hybrid displays have multiple display elements in the same pixel or the same sub-pixel. The display elements include, for example, a reflective element that reflects light and an element that emits light. Examples include self-luminous elements. Note that reflective elements and self-luminous elements can be controlled independently. It can be controlled. The hybrid display uses reflected light and spontaneous light in the display section. It has the function of displaying text or images using either or both of light.

[0050] The following describes an example of the configuration and manufacturing method of a display device according to one aspect of the present invention, with reference to the drawings. I will explain by referring to it.

[0051] In the following, expressions indicating direction, such as "up" and "down," generally correspond to the orientation shown in the drawing. It shall be used in this manner. However, for the purpose of making explanations easier, etc., the following may be included in the specification. The direction indicated by "up" or "down" may not always match that shown in the drawing. For example, When explaining the stacking order (or formation order) of a laminate, etc., the drawing should show the laminate as being constructed. The side being attacked (the surface to be formed, the support surface, the adhesive surface, the flat surface, etc.) is positioned above the laminate. Even when something is simply placed down, it may be described as having that orientation down, or the opposite orientation as up.

[0052] [Configuration Example 1] Figure 1(A) is a schematic perspective view of a display device 10 according to one embodiment of the present invention. The display device 10 is The substrate 21 and substrate 31 are bonded together. In Figure 1(A), substrate 31 is shown as a dashed line. It is explicitly stated there.

[0053] The display device 10 has a display unit 32, a circuit 34, wiring 35, etc. The substrate 21 has, for example A conductive layer 23, which functions as a pixel electrode, is included in the circuit 34, wiring 35, and display unit 32. It can be done. Also, Figure 1(A) shows an example in which IC37 and FPC36 are mounted on the substrate 21. This indicates that the configuration shown in Figure 1(A) can also be called a display module. .

[0054] Circuit 34 can be, for example, a circuit that functions as a scan line driving circuit.

[0055] The wiring 35 has the function of supplying signals and power to the display unit 32 and the circuit 34. Power is input to wiring 35 from an external source via FPC36, or from IC37 via wiring. It will be entered into field 35.

[0056] Furthermore, in Figure 1(A), the substrate 2 is formed using the COG (Chip On Glass) method, etc. This shows an example where IC37 is provided in 1. IC37 is, for example, in a signal line driving circuit. An IC with the function of being a signal line drive circuit can be applied. If a circuit is provided to do so, or if a circuit that functions as a signal line drive circuit is provided externally, FPC36 When inputting a signal to drive the display device 10 via this, IC37 is not provided. It may also be configured as follows. In addition, IC37 may be used in COF (Chip On Film) or similar systems. Therefore, it may be implemented in FPC36.

[0057] Figure 1(A) shows a magnified view of a part of the display unit 32. The display unit 32 has multiple tables The conductive layers 23 of the display element are arranged in a matrix. The conductive layers 23 are, for example, pixels. It functions as an electrode. Here, the conductive layer 23 reflects visible light and blocks ultraviolet light. To have the ability.

[0058] Figure 2 shows an example of a touch panel 10a having a display device 10.

[0059] The touch panel 10a has a touch sensor panel 15 on the display side. Between the display device 10 and the touch sensor panel 15, a diffuser plate 38 is placed from the display device 10 side, and It has a light plate 39.

[0060] The diffuser plate 38 can preferably be made of a film that has the function of diffusing visible light. For example, a film on which a hemispherical lens or microlens array is formed, or a film with a bumpy structure A film, light-diffusing film, etc., can be used. For example, the substrate 31 or the film Using an adhesive having a refractive index similar to that of mu, such a film is brought into contact with the display device 10. By attaching it, a light extraction structure can be formed.

[0061] For the polarizing plate 39, for example, a linear polarizing plate or a circular polarizing plate may be used. Especially the display part When 32 has a reflective liquid crystal element, a circular polarizer can be suitably used. For example, a photon plate can be made by laminating a linear polarizing plate and a quarter-wavelength phase difference plate. It is possible. By using a circular polarizer, it is possible to add the effect of suitably suppressing external light reflection. Cut.

[0062] The touch sensor panel 15 is activated when a target object, such as a finger or stylus, touches or approaches it. It has a function to detect this. It also has a function to output location information of the detected object. Good. Figure 2 shows an example where the FPC 16 is mounted on the touch sensor panel 15. The touch sensor panel 15 or FPC 16 is used to drive the touch sensor panel 15. Functions for controlling the system, and functions for calculating position information and other data from signals from the touch sensor panel 15. ICs and the like that may be mounted.

[0063] The detection elements (also called sensor elements) of the touch sensor panel 15 include fingers and stabs. When an object to be detected, such as an illustration, touches or approaches the surface of the touch sensor panel 15. Various sensors capable of detecting this can be applied.

[0064] For example, sensor types include capacitive, resistive, surface acoustic wave, and infrared. Various methods can be used, such as optical, pressure-sensitive, and other similar methods.

[0065] Capacitive capacitance methods include surface capacitance and projected capacitance. Shadow capacitance methods include self-capacitance methods and mutual capacitance methods. This is preferable because it enables simultaneous multi-point detection.

[0066] Figure 2 shows the separately manufactured display device 10 and touch sensor panel 15 being bonded together. This configuration is described as such, but is not limited to this. For example, one of the substrates 21 and 31 of the display device 10 Alternatively, electrodes or the like that constitute the sensing element are provided on both sides, so-called on-cell or in-cell type It could also be used as a touch panel.

[0067] Furthermore, an anti-reflective film can be used for the film used in the touch sensor panel 15. Preferably, an anti-reflective film is applied to the display side of the touch sensor panel 15. It is preferable to attach it. This suppresses the reflection of external light from the surface of the touch panel 10a. This can improve visibility.

[0068] In addition to the above, the display surface side of the display device 10 also has an anti-reflective film, a polarizing film, and a phase-shifting film. Functional films such as light-diffusing films, light-concentrating films, or light-gathering films suppress dust adhesion. It has an antistatic coating, a water-repellent coating that makes it difficult for dirt to adhere, and a coating that suppresses the occurrence of scratches during use. Functional films, including a protective coating, a film with a self-healing function for scratches, etc., may be provided.

[0069] [Cross-sectional configuration example 1-1] Figure 1(B) shows an example of a cross-section corresponding to the cutting line A1-A2 in Figure 1(A). Figure B) shows a cross-section of a region containing two adjacent pixels (sub-pixels). Figure 1(B) shows an example where a reflective liquid crystal element 40 is used as the display element. In this configuration, the substrate 31 side becomes the display side.

[0070] The display device 10 has a configuration in which a liquid crystal layer 24 is sandwiched between substrates 21 and 31. Furthermore, the liquid crystal element 40 has a conductive layer 23 provided on the substrate 21 side and a conductive layer 23 provided on the substrate 31 side. It has a conductive layer 25 and a liquid crystal layer 24 sandwiched between them. Here, the conductive layer 25 is visible It has the function of transmitting light. The conductive layer 25 functions as a common electrode, etc.

[0071] A transistor 70 is provided on the substrate 21, which is electrically connected to the conductive layer 23. On the other hand, the substrate 31 on the substrate 21 side has a colored layer 51a, a colored layer 51b, a light-shielding layer 52, and an insulating layer 6 1. A conductive layer 25 is provided. Also, an alignment film 53a is provided between the conductive layer 23 and the liquid crystal layer 24. An alignment film 53b is provided between the conductive layer 25 and the liquid crystal layer 24. 53a and alignment film 53b may be omitted if they are not needed.

[0072] The transistor 70 consists of a conductive layer 71 that functions as a gate, a semiconductor layer 72, and a gate insulating layer. An insulating layer 73 that functions as a source, a conductive layer 74a that functions as either a source or a drain, It has a conductive layer 74b, etc., which functions as either a drain or the other.

[0073] An insulating layer 81 is provided covering the transistor 70. A conductive layer 2 is also placed on the insulating layer 81. 3 is provided. The conductive layer 23 and the conductive layer 74b are separated by an opening provided in the insulating layer 81. They are electrically connected. The transistor 70 and the conductive layer 23 are connected to each pixel (sub-pixel). It is positioned.

[0074] Furthermore, the insulating layer 81 has a recess 50. The recess 50 is in a portion that does not overlap with the conductive layer 23. It is provided. In other words, the insulating layer 81 does not overlap with the conductive layer 23, and the conductive layer 23 It has a portion that is thinner than the portion that overlaps with it. The alignment film 53a fills the recess 50 of the insulating layer 81 It is provided as a cover. The upper surface of the alignment film 53a has a concave shape that conforms to the shape of the recess 50. .

[0075] Here, in Figure 1(B), the alignment film 53a is provided covering the side and top surfaces of the recess 50. An example is shown. Note that if the coverage of the alignment film 53a is low, the recess 5 of the alignment film 53a If the part in contact with the side of 0 is thinner than other parts (for example, the part that overlaps with the conductive layer 23), In some cases, the side surface of the recess 50 may not be completely covered and may be fragmented.

[0076] The colored layer 51a and the colored layer 51b are each arranged in superimposed on different conductive layers 23. Furthermore, the light-shielding layer 52 has a portion that overlaps with the region between two adjacent conductive layers 23. (Figure 1) As shown in B), it is preferable to overlap a portion of the light-shielding layer 52 with the edge of the conductive layer 23. It's nice.

[0077] The liquid crystal layer 24 has liquid crystal 12 and monomer 13 in the region that overlaps with the conductive layer 23. Furthermore, the liquid crystal layer 24 has a partition wall 11 in the region that overlaps with the space between two adjacent conductive layers 23. It is preferable that the partition wall 11 and the light-shielding layer 52 have overlapping portions. .

[0078] Monomer 13 is a material that becomes a polymer through polymerization. Also, the partition wall 11 is It is composed of a polymer obtained by polymerization of monomer 13. The component may contain the same material as the liquid crystal 12.

[0079] Polymerizable monomers can be used as monomer 13. For example, polymerizable monomers can be polymerized by light. It possesses both progressive photopolymerization (photocuring) and thermal polymerization (thermosetting) where polymerization proceeds with heat. Polymerizable monomers can be used. In particular, it is preferable to use materials that are photopolymerizable. It seems so. Also, the liquid crystal layer 24, in addition to the monomer 13, for example, has a degree of polymerization of 2 or more and 100 or less The oligomer may also be included. In this case, the oligomer is photopolymerizable or thermally polymerizable. It is preferable that it has properties.

[0080] Monomer 13 can be, for example, monofunctional monomers such as acrylates and methacrylates. Diacrylate, triacrylate, dimethacrylate, trimethacrylate, and many others Functional monomers can be used. Also, monofunctional monomers and polyfunctional monomers can be used. A mixture of more than one type is also acceptable. Furthermore, monomer 13 may be a liquid crystalline material or a non-liquid crystalline material. These materials, or materials that are a mixture thereof, can be used.

[0081] In the region of the liquid crystal layer 24 that overlaps with the conductive layer 23, residual polymerization initiator is included. This is also good. Polymerization initiators are triggers for monomer polymerization by external stimuli such as light or heat. It is a material that changes into a different substance. Polymerization initiators include, for example, light such as ultraviolet light or heat. Therefore, radical polymerization initiators that generate radicals can be used. The agent only needs to be in extremely small amounts compared to the liquid crystal or monomer; for example, the polymerization initiator is a liquid crystal, monomer And the weight ratio of the polymerization initiator and the like to the total weight of the composition is 1 wt% or less. It is sufficient if they are mixed. Furthermore, the polymerization initiator should be appropriately selected depending on the material of monomer 13. This can be done. Depending on the material of monomer 13, a cationic polymerase can be used instead of a radical polymerization initiator. Polymerization initiators, anionic polymerization initiators, etc., may also be used.

[0082] The monomer 13 should be selected based on the polymerization initiator used, which will initiate polymerization. In particular, the combination of monomer 13 and polymerization initiator is such that polymerization is initiated by ultraviolet light. Furthermore, it is preferable to use a combination of materials that undergo polymerization.

[0083] Furthermore, the liquid crystal layer 24 contains not only liquid crystal 12, monomer 13, polymerization initiator, etc., but also a chiral agent. You can stay like that.

[0084] The partition wall 11 contains a polymer obtained by polymerization of monomer 13. For example, When acrylate is used as the nomer 13, the partition wall 11 contains polyacrylate.

[0085] The partition wall 11 contains not only polymers but also components contained in the liquid crystal layer 24 (liquid crystal 12, which are not polymerized). It may contain unreacted monomer 13, unreacted polymerization initiator, chiral agent, etc. stomach.

[0086] Furthermore, the degree of polymerization of the polymer varies depending on the formation conditions and the material of monomer 13. Similarly, the volume density of the partition wall 11 depends on the polymer formation conditions and the material of the monomer 13. It will vary, but for example, 70% to 100%, preferably 80% to 100%, more preferably The percentage can be between 90% and 100%.

[0087] The partition wall 11 is preferably used to bond the substrate 21 and the substrate 31. More specifically, the partition wall 1 1 is provided on the substrate 21 side and is a layer that is in contact with the liquid crystal layer 24, and is provided on the substrate 31 side and is a liquid crystal layer It has the function of bonding the layer in contact with 24. In Figure 1(B), a part of the orientation film 53a and The partition wall 11 adheres to a portion of the orientation film 53b. If b is not provided, the partition wall 11 adheres a portion of the insulating layer 81 to a portion of the conductive layer 25. This will form the structure.

[0088] Furthermore, the partition wall 11 is provided overlapping with the recess 50 of the insulating layer 81. More specifically, The partition wall 11 covers a portion of the orientation film 53a that covers the upper surface of the recess 50, and the orientation film 5 that covers the side surface of the recess 50. It is provided in contact with a part of 3a. This prevents contact between the partition wall 11 and the orientation film 53a. As the surface area increases, an anchoring effect occurs, which can enhance the adhesion strength of these materials. The presence of the partition wall 11 to fill the recess 50 more effectively increases the adhesion strength. This is preferable because it allows for this.

[0089] Furthermore, if the alignment film 53a is not able to completely cover the side surface of the recess 50 of the insulating layer 81 and is divided, In cases where the alignment film 53a is not provided, the portion where the partition wall 11 and the insulating layer 81 are in contact It's okay to have that.

[0090] In one aspect of the present invention, the display device 10 has a partition wall 11 that strengthens the adhesive strength between the substrate 21 and the substrate 31. Its durability has been enhanced, making it a reliable display device that is less prone to damage. Furthermore, the partition wall 11 is It is provided so as to overlap at least a portion of the recess 50 provided in the insulating layer 81, and has an anchoring effect The adhesive strength is further enhanced by the effect. In addition, the partition wall 11 provides physical strength against external forces. In addition to an improved degree of clarity, this display device suppresses changes in the cell gap caused by external forces. .

[0091] Here, the positional relationship between the partition wall 11 and the recess 50, as well as their respective shapes, are shown in Figure 1(B). It is not limited to this configuration.

[0092] Figure 3(A) is an enlarged schematic cross-sectional view of the partition wall 11 and its vicinity in Figure 1(B). .

[0093] Figure 3(B) shows the case where the insulating layer 81 is not provided in the portion that does not overlap with the conductive layer 23. An example is shown. Specifically, the alignment film 53a is on the side surface of the insulating layer 81 and the upper surface of the insulating layer 73. It is provided in contact with the other. With this configuration, the partition wall 11 and the layer in contact with it Because the contact area is increased, the adhesive strength can be further enhanced.

[0094] Figure 3(C) shows that a portion of the conductive layer 74a extends to a position overlapping with the recess 50. An example of this case is shown. The partition wall 11 does not overlap with either the conductive layer 23 or the conductive layer 74a. It is located in an area where there is no existing space.

[0095] Figure 3(D) shows that an insulating layer 81 is provided in the portion that does not overlap with the conductive layer 23 in Figure 3(C). This shows an example where it is not applied. The alignment film 53a is part of the conductive layer 74a and an insulating film. It is located adjacent to a portion of layer 73.

[0096] Figure 3(E) shows that in Figure 3(D), an insulating layer 85 is provided covering the conductive layer 74a. An example is shown. The insulating layer 85 can protect the conductive layer 74a. Also, the conductive layer 7 This can suppress electrical short circuits and other malfunctions caused by the exposure of 4a.

[0097] Here, the partition wall 11 is formed self-aligned by light irradiation, so the light is ideally parallel. In the case of light, it is basically not formed in areas that overlap with light-shielding materials. However, Furthermore, due to light scattering and the directionality of the light source, the partition wall 11 also forms in the area where it overlaps with the light-shielding material. In some cases, a portion of the conductive layer 23 is covered in Figure 3(F). This shows an example where a partition wall 11 is provided.

[0098] Note that in Figures 3(A) to (F), the thickness of the alignment film 53a is depicted as uniform, but In reality, the area near the side of the recess 50 may be thinner or fragmented compared to other parts. Furthermore, in Figures 3(A) to (F), the side surface of the recess 50 of the insulating layer 81 is relative to the film surface direction. The example shown is for a roughly vertical case, but in reality, it depends on the processing method and conditions of the insulating layer 81. It may not be vertical. For example, in a plan view, the bottom may be located inside the top. Shapes such as a bottom that is wider than the top, or a cross-section where part of the side is constricted. It may take on a symmetrical or spread-out shape.

[0099] The above is an explanation of example 1-1 of the cross-sectional configuration.

[0100] [Example of pixel layout] Figure 4(A) shows an example of the pixel layout as viewed from the display side. Here, the basic The conductive layers, partition walls 11, and structures 14a, 14b, etc., provided on the plate 21 side are shown. It is present. Furthermore, some components, such as the insulating layer, are not explicitly stated.

[0101] The pixel shown in Figure 4(A) has a transistor 70 and a capacitive element 75. Transistor 7 0 represents conductive layer 71a, semiconductor layer 72, insulating layer 73 (not shown), conductive layer 74a, conductive layer It has 74b, etc. Furthermore, the capacitive element 75 has conductive layer 74b and conductive layer 71b and insulating layer 73 It has a stacked configuration via (not shown). Furthermore, the pixels have an electrical connection to the conductive layer 74b. It has a conductive layer 23 that is connected to and functions as a pixel electrode. The conductive layer 23 reflects visible light. Furthermore, it blocks ultraviolet rays.

[0102] Here, a portion of the conductive layer 74a functions as a signal line, and a portion of the conductive layer 71b functions as a capacitance line. It functions as such, and a portion of the conductive layer 71a functions as a scan line.

[0103] In Figure 4(A), a hatching pattern is applied to the area where the partition wall 11 is provided. 11 is formed in the portion where none of the aforementioned conductive layers are provided.

[0104] As shown in Figure 4(A), wiring or the like is provided between two adjacent conductive layers 23. Therefore, the partition wall 11 is not formed in the portion that overlaps with the wiring. Consequently, the partition wall 11 is conductive. Rather than completely enclosing layer 23, it is formed in an island-like shape along a portion of the contour of the conductive layer 23. Oh, the irradiation conditions of the light irradiated when the partition wall 11 is formed, and the scattering of said light, etc. In some cases, the partition wall 11 may be formed overlapping a portion of the conductive layer 23 or a portion of the above wiring.

[0105] Note that the pixel configuration shown in Figure 4(A) is just one example, and the present invention can be applied to pixels with various configurations. The method for fabricating such a display device can be applied. Here, each pixel consists of one transistor and one capacitor. Although a simple configuration with elements has been illustrated, the pixel configuration is not limited to this, and two or more transients It may have static or capacitive elements.

[0106] Furthermore, Figure 4(A) shows an example in which structures 14a and 14b are provided. Structures 14a and 14b are provided in areas where the conductive layer 23 is not provided. It is installed in contact with a portion of the partition wall 11.

[0107] Here, structure 14a shows an example where the top shape is approximately circularly symmetric. On the other hand, structure 14b has a top surface shape that is elongated in the lateral direction. As will be described later, structure 14a and structure By forming 14b with varying widths, it is possible to create self-consistent variations in its height. ru.

[0108] Figure 4(B1)(B2) shows an example of a cross-section in the region containing structure 14a. B1) is along the cutting line B1-B2 in Figure 4(A), and Figure 4(B2) is along the cutting line B3-B4 respectively. It corresponds. The cutting line B1 - B2 and the cutting line B3 - B4 are orthogonal at the portion overlapping with the structure 14a. at right angles.

[0109] The structure 14a is formed on the side of the conductive layer 25, and a part of it is covered by the alignment film 53b. Also, the top of the structure 14a (the bottom in FIGS. 4(B1) and (B2)) is provided in contact with the alignment film 53 b. Also, the structure 14a is provided such that a part of its side surface is covered by the partition wall 11 As shown in FIG. 4(B2), since the partition wall 11 is not formed in the region overlapping with the conductive layer 74 a having light shielding properties, a part of the structure 14a may be in contact with the liquid crystal 12.

[0110] Also, FIGS. 4(C1) and (C2) are an example of a cross - section in the region including the structure 14b. FIG. 4(C1) corresponds to the cutting line C1 - C2 in FIG. 4(A), and FIG. 4(C2) corresponds to the cutting line C3 - C4 respectively. FIG. 4(C1) corresponds to the cross - section in the short - axis direction of the structure 14b, and FIG. 4(C2 ) corresponds to the cross - section in the long - axis direction of the structure 14b.

[0111] The structure 14b is provided on the side of the conductive layer 25 in the same manner as the structure 14a, and a part of it is covered by the alignment film 5 3b. Also, in the portion overlapping with the conductive layer 74a, it has a portion in contact with the liquid crystal 12.

[0112] Also, the structure 14b has a smaller width in the short - axis direction than the structure 14a, and its height is also lower than that of the structure 14a. Therefore, the top of the structure 14b is not in contact with the alignment film 53a and is covered by the partition wall 1 11.

[0113] Here, an example where the structure 14a has a circular - symmetric shape is shown, but the structure 14a may be square. ​​It may also be a polygonal shape including the shape, or a polygonal shape with rounded corners. Also, the structure 14b is horizontal An example of a long shape was shown, but at least the part that is smaller in width (or diameter) than structure 14a It only needs to have a fraction, and it can be circular or polygonal in shape.

[0114] The above is an explanation of examples of pixel layouts.

[0115] The following describes other configuration examples and manufacturing method examples of a display device according to one aspect of the present invention. Note that explanations of parts that overlap with the above will be omitted, and explanations of the differences will be provided.

[0116] [Cross-sectional configuration example 1-2] Figure 5 shows a schematic cross-sectional view of the display device illustrated below. The configuration shown in Figure 5 mainly consists of structural elements. This configuration differs from the one shown in Figure 1(B) in that it has 14a and structure 14b.

[0117] Structures 14a and 14b are provided between the conductive layer 25 and the alignment film 53b. The alignment film 53b is provided covering structures 14a and 14b. Structures 4a and 14b are located between two adjacent conductive layers 23, respectively. Body 14a and structure 14b overlap with the recesses 50 of the light-shielding layer 52 and the insulating layer 81, respectively. It has a portion. Furthermore, the partition wall 11 is provided so as to surround the structures 14a and 14b. It is being done.

[0118] Structure 14 prevents substrates 21 and 31 from coming too close together when they are bonded together. It suppresses and functions as a spacer to adjust the cell gap of the liquid crystal element 40.

[0119] Furthermore, the partition wall 11 is provided so as to surround the structures 14a and 14b, The adhesive strength is higher compared to the example shown in FIG. 1(B).

[0120] 〔Cross-sectional configuration example 1-3〕 FIG. 6(A) shows a schematic cross-sectional view of a display device exemplified below. The configuration shown in FIG. 6(A) mainly has a substrate 41a, an adhesive layer 42a, and an insulating layer 82 instead of the substrate 21, and a substrate 41b, an adhesive layer 42b, and an insulating layer 62 instead of the substrate 31, and is different from the configuration shown in FIG. 5.

[0121] The insulating layer 82 is an insulating layer that forms a surface to be formed such as the transistor 70. The substrate 41a is attached to one surface of the insulating layer 82 by the adhesive layer 42a. On the other surface of the insulating layer 82 are provided a transistor 70, a conductive layer 23, etc.

[0122] The insulating layer 62 is an insulating layer that forms a surface to be formed such as the light-shielding layer 52, the colored layer 51a, the colored layer 51b, etc. The substrate 41b is attached to one surface of the insulating layer 62 by the adhesive layer 42b. On the other surface side of the insulating layer 62, a colored layer 51a, a colored layer 51b, a light-shielding layer 52, an insulating layer 61, a structure 14a, a structure 14b, a conductive layer 25, and an alignment film 53b, etc. are provided.

[0123] As the substrate 41a and the substrate 41b, a thin and light material can be used. Preferably , a flexible material can be used as the substrate 41b. Furthermore, by using a flexible material for both the substrate 41b and the substrate 41a, a display device that can be bent can be realized. For example, as the substrate 41a and the substrate 41b, the thickness is 1 μm or more and 300 μm or less, preferably

[0124] ​More preferably 3 μm to 200 μm, more preferably 5 μm to 150 μm, even more preferably Alternatively, a thin sheet-like material with a thickness of 10 μm or more and 100 μm or less can be used.

[0125] [Cross-sectional configuration example 1-4] Figure 6(B) shows a schematic cross-sectional view of the display device illustrated below. The configuration shown in Figure 6(B) is Figure 6(A) shows that the substrate 21 is present in place of the substrate 41a, adhesive layer 42a, and insulating layer 82. This differs from the configuration shown.

[0126] The configuration shown in Figure 6(B) uses a thin substrate 41b on the display side, and on the opposite side from the display side. A substrate 21, which is more rigid than substrate 41b, is provided on the side. Therefore, as shown in Figure 5 This configuration allows for the creation of a display device that is thinner than the previous configuration. In addition, the thickness of the substrate 41b on the display side is thin. Therefore, when using a relatively thick glass substrate (for example, thicker than 0.3 mm), In comparison, display devices have superior optical characteristics such as display contrast, color reproduction, and viewing angle dependence. This can be achieved.

[0127] [Cross-sectional configuration examples 1-5] Figure 6(C) shows a schematic cross-sectional view of the display device illustrated below. The configuration shown in Figure 6(C) is The main feature is that the substrate 31 has a substrate 41a, an adhesive layer 42a, and a resin layer 45a instead of the substrate 21. Instead, it has a resin layer 45b and an insulating layer 62, and the structure 14a and structure 14b This configuration differs from the one shown in Figure 5 in that it is provided in contact with the insulating layer 81.

[0128] The resin layer 45a is an insulating layer that supports the transistor 70, etc. For example, polyimide resin, acrylic resin, epoxy resin, polyamide resin, polyimide amm The use of resins such as siloxane resins, benzocyclobutene resins, and phenolic resins is possible. Yes, it is possible. Polyimide resin is particularly preferable because it has excellent heat resistance and a low coefficient of linear thermal expansion. .

[0129] The resin layer 45a has a thickness of, for example, 0.01 μm or more and 200 μm or less, preferably 0.1 μm. It is preferable that the thickness be between m and 100 μm. This gives it flexibility and allows it to be bent. We can create a display device that can do this.

[0130] The substrate 41a is attached to one side of the resin layer 45a by an adhesive layer 42a. Furthermore, an insulating layer 82 is provided on the other surface of the resin layer 45a.

[0131] The resin layer 45b can be made of a translucent resin material. Preferably, it has a thickness of 1 Film-like or sheet-like materials with a thickness of 200 μm or more can be used.

[0132] In this way, the resin layer 45b is directly coated with the colored layer 51a, the colored layer 51b, the light-shielding layer 52, and the insulating layer. By providing a structure that includes layer 61, conductive layer 25, and alignment film 53b, the manufacturing process can be simplified. It can be abbreviated.

[0133] An insulating layer 62 is provided on one side of the resin layer 45b. If it's not necessary, it doesn't need to be provided.

[0134] Structures 14a and 14b are each provided in the recess 50 and on the upper surface of the insulating layer 81 They are provided in contact with each other. They also cover at least a portion of the sides of structures 14a and 14b. An alignment film 53a is provided.

[0135] This configuration allows for a simplification of the resin layer 45b. For example, a colored layer 51a, a colored layer 51b having an island-like shape, or a light-shielding layer 52 having an opening are imprinted. It can be formed by a brushing method. This allows the structure of the resin layer 45b to be rolled. It can be manufactured inexpensively using the 3D method.

[0136] The above is an explanation of Configuration Example 1.

[0137] [Configuration Example 2] In the following, as an example of a display device according to one aspect of the present invention, a reflective liquid crystal element and both light-emitting elements are used. It has the ability to display luminescence mode, reflection mode, and hybrid mode. Next, we will explain an example of a display device (display panel). Such a display panel is called ER-Hybr id Display(Emission and Reflection Hybri d Display, or Emission / Reflection Hybrid It can also be called a Display.

[0138] One example of such a display panel is a liquid crystal element equipped with electrodes that reflect visible light, and One example is a configuration in which optical elements are stacked and arranged. In this case, the electrodes that reflect visible light are open. It is preferable that the opening and the light-emitting element are arranged in overlapping positions. In optical mode, the aperture can be driven to emit light from the light-emitting element. Furthermore, the light-emitting region of the light-emitting element is positioned in a region that does not overlap with the electrodes that reflect visible light. The configuration is such that light from the light-emitting element is emitted through the gap in the electrodes that reflect visible light. This is also acceptable. By stacking liquid crystal elements and light-emitting elements, in a plan view, the liquid crystal elements and Compared to the case where light-emitting elements are arranged side by side, pixels that have both liquid crystal elements and light-emitting elements (pixels) Because the size of the unit (also called the display unit) can be reduced, it is possible to implement a higher-resolution display device. It can be expressed.

[0139] Such display panels are designed to display in reflective mode in bright environments such as outdoors. This allows for operation with extremely low power consumption. Also, in environments with dark ambient light, such as at night or indoors. At Sakai, by displaying in illumination mode, images can be displayed with optimal brightness. Furthermore, it displays using a mode that utilizes both emitted and reflected light (also known as hybrid mode). As a result, even in environments with insufficient ambient light, it exhibits lower power consumption compared to conventional display panels. It can display with low power consumption and high contrast. Furthermore, it supports reflective mode and high contrast. In hybrid mode, it is possible to display the image in a way that reflects fluctuations in ambient light, allowing the user to... It is possible to display information in a way that feels more natural.

[0140] [Cross-sectional configuration example 2-1] Figure 7(A) shows a schematic cross-sectional view of the display device illustrated below. The configuration shown in Figure 7(A) is The liquid crystal element 40 and the light-emitting element 90 are arranged in a stacked configuration with an insulating layer 83 in between. Figure 7(A In the configuration shown, the substrate 31 side corresponds to the display surface side.

[0141] The display device has a transistor 70a and a transistor formed on one surface of the insulating layer 83 It has transistor 70b. Transistor 70a is electrically connected to liquid crystal element 40, and the transistor The 70b is electrically connected to the light-emitting element 90.

[0142] On the substrate 21 side of the insulating layer 81 covering transistors 70a and 70b, there is a conductive layer A conductive layer 91 is provided, and an insulating layer 84 is provided covering the end of the conductive layer 91. Either the source or drain of transistor 70b is connected via an opening in the insulating layer 81. They are electrically connected. The insulating layer 84 functions as a planarizing layer. On the plate 21 side, an EL layer 92, a conductive layer 93a, and a conductive layer 93b are provided. The light-emitting element 90 is composed of 91, an EL layer 92, a conductive layer 93a, and a conductive layer 93b. Yes, they are.

[0143] The conductive layer 91 and conductive layer 93a have the function of transmitting visible light. The conductive layer 93b is It has the function of reflecting visible light. Therefore, the light-emitting element 90 emits light towards the conductive layer 91. It is a bottom-emission type light-emitting element.

[0144] Furthermore, conductive layers 23a and 23b are laminated on the substrate 31 side of the insulating layer 83. Furthermore, an alignment film 53a is provided between the conductive layer 23a and the liquid crystal layer 24. The configuration of 24 and the space between the liquid crystal layer 24 and the substrate 31 can be explained by referring to Configuration Example 1. do.

[0145] Furthermore, the display device has a connection part that electrically connects the conductive layers provided on both sides of the insulating layer 83. It has 80. In Figure 7(A), the terminal portion has an opening provided in the insulating layer 83 and a position in the opening The conductive layer is obtained by processing the same conductive film as the gate of transistor 70a, etc. This shows the configuration, which involves either the source or drain of transistor 70a and conductive layer 23b. They are electrically connected via the connection part 80.

[0146] The conductive layer 23a has the function of transmitting visible light. The conductive layer 23b, on the other hand, reflects visible light. It has the function of doing so. Therefore, the liquid crystal element 40 functions as a reflective liquid crystal element.

[0147] Furthermore, the conductive layer 23b that reflects visible light has an aperture in the region that overlaps with the light-emitting element 90. A aperture is provided. Light emitted from the light-emitting element 90 passes through the aperture to the substrate 31 side. It is launched.

[0148] The display device shown in Figure 7(A) has a liquid crystal element 40 and a transistor 70a that is electrically connected to it. Since it has a transistor 70b that is electrically connected to the light-emitting element 90, the liquid crystal element 40 and It is possible to control each of the optical elements 90 independently. Also, transistor 70a and Since Rangista 70b can be formed on the same surface through the same process, the process is It can be manufactured with a simplified process and a high yield.

[0149] Furthermore, as shown in Figure 7(A), the conductive layer 93b that reflects visible light overlaps with the partition wall 11. An opening is provided in the region. Furthermore, the conductive layer 93a has the function of transmitting ultraviolet light. When irradiating light to form the partition wall 11, the liquid crystal layer 24 is illuminated through the opening. It can be shot.

[0150] Furthermore, a recess 50 is formed in the insulating layer 83 in the region between the two conductive layers 23a. Of the multiple partition walls 11, the partition wall 11 provided between the two conductive layers 23a is a part of it. It is provided overlapping with the recess 50.

[0151] Furthermore, a structure 14 is provided on the substrate 21 side of the conductive layer 25 at a position that overlaps with the recess 50. Furthermore, the structure 14 is installed overlapping the partition wall 11.

[0152] [Variation 1] Figure 7(B) shows an example where some of the configurations differ from those in Figure 7(A). Specifically, the circuit board Instead of 31, it has an insulating layer 62, an adhesive layer 42b, and a substrate 41b, and instead of the substrate 21 It has a substrate 41a.

[0153] This configuration makes it possible to create a flexible display device.

[0154] [Cross-sectional configuration example 2-2] Figure 8(A) shows a schematic cross-sectional view of the display device illustrated below. The configuration shown in Figure 8(A) is Compared to the configuration illustrated in Figure 7(A), transistors 70a and 70b are, The main difference is that it is located on the substrate 31 side of the insulating layer 83. Also, in Figure 8(A) This shows an example with two structures of different heights (structure 14a, structure 14b). .

[0155] Transistor 70a has either its source or drain connected through an opening in the insulating layer 81. The conductive layer 23 is electrically connected to the insulating layer 81. An alignment film 53a is provided on top.

[0156] Transistor 70b is electrically connected to the conductive layer 91 via the connector 80. The EL layer 92, conductive layer 93b, and conductive layer 93a are laminated to cover the electrical layer 91. Yes, they are.

[0157] Here, the surface of the conductive layer 91 on the substrate 21 side and the surface of the insulating layer 83 on the substrate 21 side are roughly the same As a result, the difference in height at these boundaries is extremely small. Therefore, as illustrated in Figure 7(A), etc. Therefore, a configuration can be made in which an insulating layer (insulating layer 84) covering the edges of the conductive layer 91 is not provided. An insulating layer 84 may also be provided.

[0158] Furthermore, here, the conductive layer 93a that transmits visible light is more transparent than the conductive layer 93b that reflects visible light. This also shows an example where it is provided on the substrate 21 side. For example, in a conductive layer 93a containing a metal oxide Furthermore, by covering the surface of the conductive layer 93b which contains metal or alloy, the conductive layer 93b This suppresses oxidation and enables the creation of highly reliable display devices.

[0159] Furthermore, as shown in Figure 8(A), the partition wall 11 is located not only in the area where it overlaps with the light-shielding layer 52, etc., It may also be provided in the region that overlaps with the light-emitting element 90. In this case, light from the light-emitting element 90 The substrate 31 side is accessed through the openings, partitions 11, and colored layer 51a provided in the conductive layer 23. It is ejected to the outside.

[0160] [Variation 2] Figure 8(B) shows an example where some of the configurations differ from those in Figure 8(A). Specifically, the circuit board... Instead of 31, it has an insulating layer 62, an adhesive layer 42b, and a substrate 41b, and instead of the substrate 21 It has a substrate 41a.

[0161] This configuration makes it possible to create a flexible display device.

[0162] [Cross-sectional configuration example 2-3] Figure 9(A) shows a schematic cross-sectional view of the display device illustrated below. The configuration shown in Figure 9(A) is The main point is that transistor 70b is located on a different insulating layer than transistor 70a. Furthermore, in that there is an adhesive layer 99 between transistor 70a and transistor 70b, Figure This differs from the configuration shown in 7(A).

[0163] The transistor 70b is provided on one side of the insulating layer 86. The other side is bonded to the insulating layer 81 that covers the transistor 70a via an adhesive layer 99. .

[0164] Furthermore, one side of the insulating layer 86 has insulating layers 87 and 88. The insulating layer 87 is A portion of it functions as the gate insulating layer of transistor 70b. In addition, the insulating layer 88 is also part of the transistor It is provided covering the inverter 70b. The insulating layer 84 is provided covering the insulating layer 88. ru.

[0165] Furthermore, here transistor 70a functions as a second gate in conductive layer 78, and second This shows an example having an insulating layer 79 that functions as a gate insulating layer. The conductive layer 78 is It is preferable to use a conductive material that blocks visible light.

[0166] Although an example with substrates 21 and 31 is shown here, these can be provided on a flexible substrate. It may be replaced with a plate. For example, as shown in Figure 7(B), a flexible plate may be used instead of the substrate 21. A substrate 41a can be used. Alternatively, an insulating layer 62 and an adhesive layer 42b can be used instead of the substrate 31. And substrate 41b can be used. This makes it possible to realize a bendable display device. can.

[0167] [Cross-sectional configuration example 2-4] Figure 9(B) shows a schematic cross-sectional view of the display device illustrated below. The configuration shown in Figure 9(B) is The main point is that the light-emitting element 90 is a top-emission type light-emitting element, and the light-emitting element is emitted from the insulating layer 87. The laminated structure up to child 90 is oriented upside down, and it does not have an adhesive layer 99, etc., as shown in Figure This differs from the configuration shown in 9(A).

[0168] The substrate 21 and the substrate 31 are bonded together by an adhesive layer 89. The adhesive layer 89 is It is provided to cover the light-emitting element 90 and has the function of sealing the light-emitting element 90.

[0169] The above is an explanation of Configuration Example 2.

[0170] [Example of manufacturing method 1] [Example of manufacturing method 1-1] Next, an example of a method for manufacturing the display device 10 shown in Figure 1(B) will be described. Figure 10 The figures shown in Figure 11 and Figure 11 are cross-sectional diagrams of each step in the process related to the manufacturing method of the display device 10. This is a schematic diagram.

[0171] Furthermore, thin films (insulating films, semiconductor films, conductive films, etc.) that make up the display device are produced by sputtering. Chemical vapor deposition (CVD) method, Vacuum deposition, pulsed laser deposition (PLD) ion) method, Atomic Layer Deposition (ALD) It can be formed using methods such as CVD. CVD methods include plasma chemical vapor deposition (PEC). The VD (Volatile Deposition) method or the thermal CVD method may also be used. An example of the thermal CVD method is organometallic vapor deposition (MO). CVD (Metal Organic CVD) method may also be used.

[0172] Furthermore, thin films (insulating films, semiconductor films, conductive films, etc.) that make up the display device can be spin-coated, defrosted, and defrosted. Tap, spray coating, inkjet, dispensing, screen printing, offset printing Printing, doctor knife, slit coat, roll coat, curtain coat, knife coat, etc. It can be formed by the following method.

[0173] Furthermore, when processing the thin films that make up the display device, photolithography and other methods are used. It is possible to perform the process. Alternatively, island-shaped thin films can be formed by a film deposition method using a shielding mask. Alternatively, thinning can be done using methods such as nanoimprinting, sandblasting, or lift-off. The film may be processed. In the photolithography method, a resist mass is applied to the thin film to be processed. A method of forming a rib, processing the thin film by etching or the like, and removing the resist mask. After forming a photosensitive thin film, exposure and development are performed to shape the thin film into the desired form. There are two methods of construction.

[0174] In photolithography, the light used for exposure is, for example, the i-line (wavelength 365 nm). Using g-line (wavelength 436 nm), h-line (wavelength 405 nm), or a mixture thereof This can be done by using ultraviolet light, KrF laser light, or ArF laser light, etc. It is also possible to perform exposure using immersion lithography. Furthermore, the light used for exposure and Using extreme ultraviolet (EUV) light and X-rays... It is also possible to use an electron beam instead of light for exposure. Extreme ultraviolet Using light, X-rays, or electron beams is preferable because it allows for extremely fine processing. When exposure is performed by scanning a beam such as an electron beam, the photomask is It is unnecessary.

[0175] Thin film etching methods include dry etching, wet etching, and sandblasting. Laws and other regulations can be used.

[0176] <Formation of transistor 70> First, a conductive layer 71 is formed on the substrate 21. After forming the conductive film on the conductive layer 71, resin A resist mask is formed, and after etching the conductive film, the resist mask is removed. It can be formed more easily.

[0177] Next, an insulating layer 73 is formed.

[0178] Next, a semiconductor layer 72 is formed. After the semiconductor film is formed, a resist is added to the semiconductor layer 72. By forming a mask and then removing the resist mask after etching the semiconductor film, It can be formed.

[0179] Next, conductive layers 74a and 74b are formed. It can be formed by the same method as the conductive layer 71.

[0180] By following the above steps, the transistor 70 can be formed.

[0181] <Formation of insulating layer 81> Next, an insulating layer 81 is formed (Figure 10(A)). A photosensitive material is used for the insulating layer 81. This allows openings to be formed by photolithography or the like. After film formation, a resist mask is formed by photolithography or the like, and a portion of the insulating layer 81 is formed. The opening may be formed by etching. If an organic insulating material is used for the insulating layer 81, This is preferable because it can improve the flatness of its upper surface.

[0182] Alternatively, the insulating layer 81 may have a laminated structure of an inorganic insulating film and an organic insulating film.

[0183] <Formation of conductive layer 23 and recess 50> Next, a conductive film that will become the conductive layer 23 is formed on the insulating layer 81. A resist mask 95 is formed on it. Then, the conductive film that is not covered by the resist mask 95 By etching the affected area, a conductive layer 23 is formed (Figure 10(B)).

[0184] Next, a recess 50 is formed in the insulating layer 81 (Figure 10(C)). The recess 50 is formed in the resist Using SK95 as an etching mask, a portion of the upper part of the insulating layer 81 is etched. It can be formed by [this method].

[0185] It is preferable to use a dry etching method to form the recess 50, especially in the insulating layer 81. When using insulating materials, plasma treatment (ashing treatment) is performed in an oxygen-containing atmosphere. It is preferable to use this. By processing the insulating layer 81 with an ashing process, the conductive layer 23 and This allows for a higher selectivity ratio for the etching rate, suppressing the etching of the conductive layer 23. can.

[0186] Furthermore, when forming the recess 50, a resist mask 95 may be used as a mask, or The tomask 95 may be removed, and the conductive layer 23 may be used as a hard mask.

[0187] <Formation of orientation film 53a> Next, the orientation film 53a is formed (Figure 10(D)). A thin film that will become the orientation film 53a is deposited. Afterward, an orientation film 53a can be formed by performing a rubbing treatment.

[0188] <Formation of light-shielding layer 52, colored layer 51a, and colored layer 51b> Next, a light-shielding layer 52 is formed on the substrate 31. The light-shielding layer 52 is made by processing a conductive film to make it conductive It may be formed by the same method as layer 71, etc., or by using a resin material containing metal material, pigment, or dye. It may be used to form the insulating layer 81, etc., in the same manner as the others.

[0189] Next, the colored layer 51a, colored layer 51b, etc. are formed. Layer 1b can be formed by the same method as the insulating layer 81, etc.

[0190] Furthermore, the colored layer 51a and the colored layer 51b may be formed before the light-shielding layer 52. At that time, a portion of the light-shielding layer 52 is formed to cover the edges of the colored layer 51a and the colored layer 51b. It is preferable.

[0191] <Formation of insulating layer 61, conductive layer 25, and alignment film 53b> Next, an insulating layer 61 is formed by covering the light-shielding layer 52, the colored layer 51a and the colored layer 51b, etc. The insulating layer 61 prevents impurities contained in the colored layer 51a, etc., from diffusing into the liquid crystal layer 24. It also functions as an overcoat. The insulating layer 61 consists of a light-shielding layer 52 and a colored layer 51a. It may also function as a planarizing layer that covers surface irregularities such as the colored layer 51b. The insulating layer 61 may be omitted if it is not needed.

[0192] Next, a conductive layer 25 is formed on the insulating layer 61. The conductive layer 25 is similar to the conductive layer 71, etc. It can be formed by the method. Alternatively, island-like formation can be achieved by a film deposition method using a shielding mask. A conductive layer 25 may be formed.

[0193] Next, an alignment film 53b is formed on the conductive layer 25 (Figure 10(E)). The alignment film 53b is It can be formed by the same method as the orientation film 53a.

[0194] Furthermore, the processes described above for substrate 21 and substrate 31 should be carried out independently. It is possible.

[0195] <Bonding of circuit board 21 and circuit board 31> Next, an adhesive layer is applied to either one or both of substrates 21 and 31 to bond them together. (Not shown in the diagram) is formed. The adhesive layer is formed so as to surround the region where the pixels are located. The adhesive layer can be formed, for example, by screen printing or dispensing. Thermosetting resins and UV-curing resins can be used as the adhesive layer. Alternatively, a resin that hardens by applying heat after being partially cured by the lines may be used. For the adhesive layer, a resin having both UV-curing and thermosetting properties may be used.

[0196] Next, the composition that will become the liquid crystal layer 24 is dropped into the area surrounded by the adhesive layer by a dispensing method or the like. To do so, specifically, a composition containing liquid crystal 12, monomer 13, and polymerization initiator is added dropwise. Furthermore, the composition may contain chiral agents or the like.

[0197] Next, the substrate 21 and the substrate 31 are bonded together, with the composition that will become the liquid crystal layer 24 sandwiched between them. The layers are cured. When bonding is performed under reduced pressure, air bubbles may get trapped between substrate 21 and substrate 31. This is preferable because it prevents entry.

[0198] The composition that will become the liquid crystal layer 24 is prepared after the substrate 21 and substrate 31 are bonded together in a reduced pressure atmosphere. In the following case, a method of injection through a gap in the adhesive layer may be used. Also, the liquid crystal layer 24 and After dropping the composition, granular gap spacers are placed in the region where pixels are located, or the region It may be placed on the outside, or a composition containing the gap spacer may be dropped onto it.

[0199] At this point, a liquid crystal element 40 including the conductive layer 23, the conductive layer 25, and the liquid crystal 12 is formed. Figure 11(A)). Note that at this point, the partition wall 11 has not yet been formed, and the liquid crystal layer 24 is not included. The concentration of monomer 13 is high.

[0200] Next, light 20 is shone from the substrate 21 side (Figure 11(B)).

[0201] Light 20 can be light of a wavelength and intensity that reacts with the polymerization initiator. For example, Light 20 can use ultraviolet light with wavelengths of 100nm to 400nm. Wavelength 200nm Using light of ~400nm is preferable because it suppresses absorption by the atmosphere. Typically, Light with wavelengths of 254 nm, 365 nm, and 385 nm is one example. High-pressure mercury lamps, low-pressure mercury lamps, metal halide lamps, xenon lamps, LEDs, etc. It can be generated using the following light sources. In addition to lamps and LEDs, excimer lasers, etc. A laser may be used as the light source.

[0202] Light 20 is incident perpendicularly to the surface of the substrate 21, and is as close to parallel as possible. It is preferable to use this method, especially when the substrate 21 is large and multiple light sources are used. This could result in light being incident from an oblique direction. In that case, between the light source and the substrate 21 It is preferable to provide slits or the like to bring the light from the light source closer to parallel light.

[0203] As shown in Figure 11(B), in the region where the conductive layer 23 is not provided, light 20 is liquid The light is irradiated onto the crystal layer 24. Meanwhile, in the region where the conductive layer 23 is provided, the light 20 is directed onto the conductive layer 23. It is further shielded from light and does not reach the liquid crystal layer 24. Also, light 20 is not only transmitted to the conductive layer 23, but also to the conductive layer 24. Light is also blocked by layer 71, conductive layer 74a, conductive layer 74b, etc.

[0204] In this example, the conductive layer 71 that functions as the gate of the transistor 70 is located on the substrate 21. This shows a transistor with a bottom gate structure located on the side. Therefore, light 20 is conductive. Because light is blocked by layer 71 and not irradiated onto semiconductor layer 72, the electrical characteristics of transistor 70 This prevents fluctuations in performance. Furthermore, it is the top transistor 70. When using a gate-structured transistor, a part that blocks light 20 is placed below the semiconductor layer 72. Place the material, or place a conductive layer below the semiconductor layer 72 that functions as a second gate. It is preferable.

[0205] Figure 12 shows an enlarged view of the region indicated by the dashed line in Figure 11(B). Figure 12 shows light 20 This is a conceptual diagram illustrating the process of polymerization of monomer 13 as irradiation begins.

[0206] The area that is not shielded by the conductive layer 23, etc., and is irradiated with light 20 is defined as the irradiation area 30. In step 30, when light 20 is irradiated, the polymerization initiator in the liquid crystal layer 24 generates radicals. This causes monomer 13 to begin polymerization. As polymerization progresses, as shown in Figure 12 The polymer-containing septum 11 grows in this manner.

[0207] Here, as monomer 13 polymerizes, the irradiated area 30 and the nearby liquid crystal layer 24 are contained The concentration of monomer 13 decreases, and the further away from the irradiation area 30, the higher the concentration of monomer 13. In some cases, an uneven concentration distribution may occur. Monomer 13 helps to make this concentration distribution uniform. As shown above, substances sometimes have the property of diffusing from areas of higher concentration to areas of lower concentration. A portion of the monomer 13 spreads through the liquid crystal layer 24 toward the irradiation area 30, as shown in Figure 12. It disperses. As a result, after irradiation, compared to before irradiation with light 20, the region overlapping with the conductive layer 23... The concentration of monomer 13 in the liquid crystal layer 24 becomes low. Also, the liquid crystal before irradiation with light 20. If the concentration of monomer 13 contained in layer 24 is sufficiently low, or if monomer 13 is in the liquid crystal layer 24 In cases where diffusion is easily induced, the concentration of monomer 13 after irradiation with light 20 can be measured. In some cases, the level may be so low that it is not released at all.

[0208] The optimal concentration of monomer 13 in the liquid crystal layer 24 before irradiation with light 20 is It can be determined according to the area of ​​the illumination region 30. For example, the region where pixels are arranged ( When the area ratio of the irradiation area 30 to the display area is α% (α>0), the liquid The weight concentration of monomer 13 in the crystal layer 24 is (α-x)wt% or more and (α+x)wt% or less. It is preferable to set it within the range. Alternatively, the volume concentration of monomer 13 in the liquid crystal layer 24 is ( It is preferable to set it within the range of (α-x)% or more and (α+x)% or less. Here, x=0 This satisfies 0.5α, preferably x=0.3α, and more preferably x=0.2α. After irradiation with light 20, the monomer in the liquid crystal layer 24 of the portion that functions as a liquid crystal element 40 -13 concentration can be reduced.

[0209] As polymerization of monomer 13 progresses, within the irradiation region 30, the orientation film 53a and the monomer 13 become aligned. A partition wall 11 is formed that is in contact with both sides of the film 53b. The partition wall 11 is in contact with the orientation film 53a and the orientation film 5 It has the function of bonding 3b.

[0210] Furthermore, as shown in Figure 12, the recess 50 of the insulating layer 81 is located between the conductive layers 23, Light 20 will pass through the recess 50. Therefore, the partition wall 11 is formed in the region that overlaps with the recess 50. This extends the shape so that after irradiation with light 20, the partition wall 11 fits into the recess 50. Because it can be grown into a shape that fills the recess 50, the adhesive strength can be maximized. It can be made to be high.

[0211] In Figure 12, the partition wall 11 grows from the orientation film 53a side toward the orientation film 53b side. While an example is shown, it is merely a conceptual diagram, and the growth process of the septum 11 can take various forms. It is possible. For example, countless tiny polymers formed in the liquid crystal layer 24 grow while linking together. In some cases, the intensity of light 20 is strong, and the light 20 reaches the alignment film 53b with sufficient intensity. If the light reaches the surface, or if the light 20 is reflected by the light-shielding layer 52 and irradiated again onto the liquid crystal layer 24 In such cases, the polymer grows not only from the alignment film 53a side but also from the alignment film 53b side, and orientation When the polymer grown from the membrane 53a side connects and becomes one with the membrane 11, the septum 11 is formed. There are also cases where the growth process by which the septum 11 was formed is determined by the cross-sectional shape of the septum 11, etc. It can be estimated from this.

[0212] The display device 10 can be manufactured through the above process (Figure 11(C)). Figure 11( C) is the same figure as Figure 1(B).

[0213] Furthermore, in the above-described manufacturing method, the irradiation conditions of light 20 and the scattering of light 20 are important. Furthermore, the partition wall 11 may also be formed in the region that overlaps with the region inside the contour of the conductive layer 23. Similarly, there are parts that shield the light 20, such as conductive layer 74a, conductive layer 74b, and conductive layer 71. Even in areas that overlap with the material, a portion of the partition wall 11 may be arranged to overlap.

[0214] Here, in the region overlapping with the conductive layer 23, the monomer 13 is more concentrated closer to the partition wall 11. In some cases, the concentration distribution is low, and the concentration is higher the further away from the septum 11.

[0215] Furthermore, in the region overlapping with the conductive layer 23, unreacted polymerization initiator may remain. In this case, if both monomer 13 and polymerization initiator remain in the liquid crystal layer 24 There is a risk that polymerization of monomer 13 may occur due to ultraviolet rays contained in ambient light. However, in the display device 10, a colored layer 51a, etc., is provided on the display surface side of the liquid crystal layer 24. This prevents ultraviolet rays contained in ambient light from reaching the liquid crystal layer 24. Therefore, even if monomer 13 or polymerization initiator remains, under the usage environment Polymerization reactions do not occur, making it possible to realize a highly reliable display device. Cut.

[0216] The above is a description of Example 1-1 of the method for manufacturing a display device.

[0217] [Example of manufacturing method 1-2] In the following section, we will show examples of the manufacturing method of the display device illustrated in Cross-sectional Configuration Example 1-2, as shown in Figure 13. We will explain using this method.

[0218] First, similar to the manufacturing method example 1-1, the conductive layer 71 and the alignment layer 53a are layered sequentially on the substrate 21. To form.

[0219] Furthermore, layers from the light-shielding layer 52 to the conductive layer 25 are formed sequentially on the substrate 31.

[0220] Next, structures 14a and 14b are formed on the conductive layer 25. First, structure 14a And an insulating film that will form structure 14b is formed. The insulating film may be made using a photosensitive resin. Preferred. The insulating film can be formed, for example, by a spin coating method.

[0221] Next, the insulating film is exposed through a photomask, and after development, it is baked to create the structure. Body 14a and structure 14b can be formed.

[0222] Here, as the insulating film, we use a positive-type photosensitive material in which the parts not irradiated with light remain after development. It is preferable to use this. Furthermore, the width of structure 14b is smaller than that of structure 14a. It is preferable to use a photomask. This is because in the region that becomes structure 14b This makes it easier for the light used for exposure to wrap around the structure. As a result, the structure is shorter in height than structure 14a. Body 14b can be formed in a self-consistent manner.

[0223] In addition to the above, there are other methods for forming structures 14a and 14b of different heights. Exposure techniques using multi-tone masks such as halftone masks or graytone masks, Alternatively, a multiple exposure technique using two or more photomasks may be used.

[0224] Next, the alignment film 53b is formed by covering the structure 14a, structure 14b and the conductive layer 25. (Figure 13(A)).

[0225] Next, substrate 21 and substrate 31 are bonded together in the same manner as in manufacturing method example 1-1.

[0226] Next, light 20 is shone from the substrate 21 side (Figure 13(B)).

[0227] Light 20 is irradiated onto a region that is not shielded by the conductive layer 23, etc. Here, the structure 14a and structure Since the structure 14b is positioned so as not to overlap with the conductive layer 23, the light 20 is directed towards the structure 14a The region including the side of structure 14b is irradiated. Therefore, structure 14a and structure 1 A partition wall 11 is formed so as to surround 4b.

[0228] When monomer 13 polymerizes to produce a polymer, the monomer 13 is dispersed in the liquid crystal layer 24 Polymers may grow from the surface in contact with the material. Here, structures 14a and 14b Since it is provided between the alignment film 53b and the conductive layer 25, in the region where light 20 is irradiated The contact area between the alignment film 53b and the liquid crystal layer 24 is such that the structure 14a and structure 14b are not present. It becomes larger compared to the case without structures 14a and 14b. Compared to that, polymers are more easily formed, so the resulting partition wall 11 is denser and stronger. It is prone to forming polymers.

[0229] The display device can be manufactured through the above process (Figure 13(C)). Figure 13(C) This is the same figure as Figure 5.

[0230] In the configuration shown in Figure 13(C), etc., there is a partition wall 11 and a structure 14a located inside the partition wall 11. And the structure 14b can maintain the distance between substrate 21 and substrate 31. Therefore In addition to increasing the physical strength against external forces, the cell gap changes due to external forces This is a display device in which oxidation is suppressed.

[0231] The above is an explanation of example 1-2 of the manufacturing method.

[0232] [Examples of manufacturing methods 1-3] Below, we will show an example of the manufacturing method of the display device illustrated in Cross-sectional Configuration Example 1-3, as shown in Figure 14 and Figure 14. This will be explained using the 15 figures.

[0233] First, a release layer 43a and an insulating layer 82 are formed sequentially on the support substrate 44a.

[0234] The support substrate 44a has sufficient rigidity to facilitate transport within or between devices. A substrate can be used. In addition, a substrate that has heat resistance to the heat generated during the manufacturing process can be used. For example, a glass substrate with a thickness of 0.3 mm or more and 1 mm or less can be used.

[0235] The material used for the release layer 43a and the insulating layer 82 is the interface between the release layer 43a and the insulating layer 82. Alternatively, a material can be selected that causes delamination in the release layer 43a.

[0236] For example, the release layer 43a is a layer containing a high melting point metal material such as tungsten, and the metal Layers containing oxides of the material are stacked and used, with silicon nitride and silicon oxide as the insulating layer 82. Layers of inorganic insulating materials such as silicon oxide nitride and silicon nitride are used in a laminated manner. Yes, it is possible. In this specification, oxidnitrides are defined as having a composition that contains more oxygen than nitrogen. This refers to materials with a high content of nitrogen, and nitride oxides, in terms of their composition, have a higher nitrogen content than oxygen. This refers to a high-melting-point material. If a high-melting-point metal material is used in the release layer 43a, then in the subsequent process, This is preferable because it allows for processing at different temperatures, which increases the freedom in selecting materials and formation methods.

[0237] When a laminated structure of tungsten and tungsten oxide is used as the release layer 43a, The interface between tungsten and tungsten oxide, in tungsten oxide, or in tungsten oxide It can be peeled off at the interface with the insulating layer 82.

[0238] Furthermore, the composition of the release layer 43a and the layer to be released above it is not limited to this and can be made of various materials. You can choose.

[0239] Next, on the insulating layer 82, in the same manner as in fabrication method example 1-1, from the conductive layer 71 to the alignment film 53a They are formed in sequence.

[0240] A schematic cross-sectional view at this stage corresponds to Figure 14(A).

[0241] Next, a release layer 43b and an insulating layer 62 are formed sequentially on the support substrate 44b.

[0242] The support substrate 44b can be made of the same material as the support substrate 44a. Release layer 43b The insulating layer 62 can be formed in the same manner as the release layer 43a. The insulating layer 62 can be formed in the same manner as the insulating layer 82. It can be formed by law.

[0243] Next, a light-shielding layer 52, a colored layer 51a and a colored layer 51b, an insulating layer 61, and a conductive layer are placed on the insulating layer 62. The electrode layer 25, structure 14a and structure 14b, and alignment film 53b are formed in the same manner as described above. To form more.

[0244] A schematic cross-sectional view at this stage corresponds to Figure 14(B).

[0245] Next, the support substrate 44a and the support substrate 44b are bonded together. The bonding is done in the same manner as described above. It can be done by law.

[0246] Next, light 20 (not shown) is irradiated from the support substrate 44a side to form the partition wall 11. Figure 14(C)).

[0247] Here, the irradiation of light 20 is such that the light 20 reaches the liquid crystal layer 24 via the peeling layer 43a. It is necessary to do so. For example, if a material containing metal is used as the release layer 43a, light 20 In some cases, the light is blocked, and the light 20 does not reach the liquid crystal layer 24 sufficiently. Therefore, the peeling layer If a material containing metal is used for 43a, the release layer 43a will be such that light 20 is transmitted through it. By using a thin film and considering the reflection and absorption by the peeling layer 43a, the irradiation strip of light 20 It is important to ensure that the matter is appropriate.

[0248] For example, a laminated structure of a tungsten film and a tungsten oxide film was used as the release layer 43a. In this case, the thickness of the tungsten film is 1 nm to 50 nm, preferably 1 nm to 30 nm. More preferably, the thickness should be between 1 nm and 20 nm, and a special irradiation device can be used. The partition wall 11 can be formed without any need for additional equipment.

[0249] Furthermore, the output and irradiation time of the irradiation device are adjusted to control the light energy reaching the liquid crystal layer 24. 0.1 J / cm² 2 More than 100J / cm 2 Preferably, 1 J / cm 2 More than 50J / c m 2 It is preferable to irradiate with light 20 under the following conditions.

[0250] Next, by peeling between the insulating layer 62 and the release layer 43b, the support substrate 44b and Remove the peeled layer 43b (Figure 15(A)).

[0251] Thus, it is preferable to form the partition wall 11 before peeling. Since multiple partition walls 11 that join the plate 21 and the insulating layer 62 are arranged between adjacent pixels, the substrate The adhesive strength between 21 and the insulating layer 62 is increased. Therefore, in the peeling process This suppresses delamination within the liquid crystal layer 24, resulting in a higher yield for the support substrate 44. b can be peeled off.

[0252] Methods for separating the insulating layer 62 from the support substrate 44b include applying mechanical force, The release layer is etched, or liquid is dropped onto it, or it is impregnated with liquid, etc. One example is to penetrate the peeling interface with a liquid. Alternatively, the peeling interface can be shaped By utilizing the difference in thermal expansion coefficients of the two layers, separation can be achieved by heating or cooling. stomach.

[0253] Furthermore, before performing the peeling, a process may be carried out to expose a portion of the peeling interface. For example, a A portion of the insulating layer 62 on the peeling layer 43b is removed by using a sharp object or similar. The peeling process can be advanced starting from the area where the insulating layer 62 has been removed. .

[0254] After the peeling process is complete, a portion of the peeling layer 43b may remain on the surface of the insulating layer 62. In that case, the remaining peeled layer 43b can be removed by washing, etching, wiping, etc. It may be removed. Also, the remaining peeled layer 43b has high transmittance to visible light and does not affect visibility. If there is no resonance, it does not need to be removed. In that case, the insulating layer 62 and the adhesive layer 42 described later A layer containing the elements present in the delamination layer 43b remains between b and b.

[0255] Next, the insulating layer 62 and the substrate 41b are bonded together by the adhesive layer 42b. For this purpose, thermosetting resins, UV-curing resins, and the like can be used.

[0256] Next, the insulating layer 82 and the release layer 43a are separated using the same method as described above. Next, the support substrate 44a and the release layer 43a are removed (Figure 15(B)).

[0257] Subsequently, the insulating layer 82 and the substrate 41a are bonded together by the adhesive layer 42a. The same material as that used for adhesive layer 42b can be used.

[0258] A display device can be manufactured through the above process (Figure 15(C)). Figure 15(C) This is the same figure as Figure 6(A).

[0259] In this step, the support substrate 44b and the release layer 43b are removed, and the substrate 41b is bonded to them. We decided to do this first, but instead we removed the support substrate 44a and the release layer 43a, and then the substrate 41a The bonding process can be done first, or both can be done simultaneously.

[0260] In a method for manufacturing a display device according to one aspect of the present invention, the manufacturing of the transistor 70 and the conductive layer 23 Sometimes, a relatively thick support substrate 44a is used, making transportation easy and resulting in a high yield during manufacturing. This is possible. Furthermore, a method for directly forming transistors 70, etc., on a thin substrate 41a. In contrast, when forming the transistor 70 and the insulating layer around it, high-temperature processing is performed. This reduces impurities within and near transistor 70, resulting in extremely reliable performance. It is possible to achieve a high transistor count of 70.

[0261] Furthermore, when fabricating the colored layer 51a, the light-shielding layer 52, etc., a relatively thick support substrate 44b is used. Therefore, it is easy to transport and can be manufactured with a high yield. Also, by using a support substrate 44b This allows for the application of high temperatures during the formation of the colored layer 51a and the light-shielding layer 52. Therefore, the concentration of impurities is reduced, making it possible to create a highly reliable display device. Also, a thin base Compared to a method of directly forming a colored layer 51a or a light-shielding layer 52 on the plate 41b, this method provides thermal support. The effects of expansion and contraction of the substrate 44b can be suppressed. Also, the bonding of the support substrate 44a and the support substrate 44b Because these materials have rigidity, they can be bonded with high positional accuracy during the bonding process. Therefore, misalignment between the liquid crystal element 40 and the colored layer 51a can be prevented, resulting in extremely high definition. This makes it possible to create a display device.

[0262] Furthermore, the support substrate 44b is peeled off, and a substrate 41 that is at least thinner than the support substrate 44b is removed. By attaching b, a thin and lightweight display device can be realized. Also, the colored layer 51a Since a thin substrate 41b can be attached after forming a light-shielding layer 52, etc., the substrate 4 As option 1b, materials with poor heat resistance can be used, expanding the range of material choices and allowing for a variety of materials. The material can be used on the substrate 41b. Also, because the thickness of the substrate 41b on the display side is thin, For example, compared to using a relatively thick glass substrate (for example, thicker than 0.3 mm), This enables the creation of display devices with superior optical characteristics such as display contrast, color reproduction, and viewing angle dependence. Cut.

[0263] The above is an explanation of manufacturing method example 1-3.

[0264] [Examples of manufacturing methods 1-4] The display device illustrated in Figure 6(B) is manufactured using the process on the support substrate 44a side in manufacturing method example 1-3. (From the process of forming the release layer 43a to the process of forming the orientation film 53a) are described in example 1-1 of the manufacturing method. It can be manufactured by replacing it with a similar method.

[0265] The above is an explanation of manufacturing method example 1-4.

[0266] [Examples of manufacturing methods 1-5] The following describes an example of the manufacturing method for the display device illustrated in Cross-sectional Configuration Example 1-5 and Figure 6(C). I will explain.

[0267] First, on the resin layer 45b, there is an insulating layer 62, a light-shielding layer 52, a colored layer 51a, a colored layer 51b, and an insulating layer. Layer 61, conductive layer 25, and orientation film 53b are formed (Figure 16(A)).

[0268] In addition, a support substrate 44d is prepared. The support substrate 44d is the same as the support substrate 44a, etc. Materials can be used.

[0269] Next, a resin layer 45a is formed on the support substrate 44d.

[0270] To form the resin layer 45a, first, the material that will become the resin layer 45a is applied onto the support substrate 44d. Coating methods include spin coating, dipping, spray coating, inkjet, dispensing, and spray coating. Lean printing, offset printing, doctor knife, slit coat, roll coat, curtain Methods such as coating and knife coating can be used.

[0271] This material exhibits thermosetting properties (also known as thermal polymerization) where polymerization progresses with heat. It has monomers. Furthermore, the material may be photosensitive. Also, the material Preferably, the product contains a solvent to adjust the viscosity.

[0272] The material contains polyimide resin, acrylic resin, epoxy resin, and polyamide resin after polymerization. Lipids, polyimideamide resins, siloxane resins, benzocyclobutene resins, phenolic resins It is preferable that it contains polymerizable monomers that become lipids. That is, the formed resin layer 45a , including these resin materials. In particular, polymerizable monomers having imide bonds are used in the material. Therefore, when a resin such as polyimide resin is used in the resin layer 45a, heat resistance and weather resistance are improved. It is preferable because it can be improved.

[0273] Next, the support substrate 44d is heated, and the applied material is polymerized to form the resin layer 45a. This is achieved. At this time, the solvent in the material is removed by heating. Also, heating causes subsequent transients It is preferable to heat at a temperature higher than the maximum temperature required in the manufacturing process of Ta70, etc. 200°C to 700°C, or 300°C to 600°C, preferably 350°C or higher. Heating is typically done at 550°C or lower, more preferably between 400°C and 500°C, and typically at 450°C. It is preferable that the resin layer 45a is formed at such a temperature with the surface exposed. By heating, gases that may detach from the resin layer 45a can be removed, thus preventing thrash. This can suppress gas detachment during the manufacturing process of components such as the Angista 70.

[0274] Furthermore, the thermal expansion coefficient of the resin layer 45a is between 0.1 ppm / °C and 20 ppm / °C. It is preferable that the concentration be between 0.1 ppm / °C and 10 ppm / °C. The lower the thermal expansion coefficient of the resin layer 45a, the less stress will be caused by expansion or contraction due to heating. This can prevent damage to transistors and other components.

[0275] Next, an insulating layer 82 is formed on the resin layer 45a. After that, the above fabrication process is carried out on the insulating layer 82. Similar to Method Example 1-1, conductive layers 71 to 23 are formed in order.

[0276] Next, structures 14a and 14b are formed on the insulating layer 81. It is preferable that at least a portion of 14a and structure 14b is formed to overlap with the recess 50. It seems so.

[0277] Subsequently, an alignment film 53 covers the conductive layer 23, insulating layer 81, structure 14a and structure 14b, etc. Form b

[0278] A schematic cross-sectional view at this stage corresponds to Figure 16(B).

[0279] Next, the support substrate 44d and the resin layer 45b are bonded together. The bonding is done in the same manner as described above. It can be done by law.

[0280] Next, light 20 (not shown) is irradiated from the support substrate 44d side to form the partition wall 11. Figure 16(C)).

[0281] Next, light 20a is shone from the support substrate 44d side (Figure 17(A)). Due to the injection, the surface near the support substrate 44d side of the resin layer 45a, or one inside the resin layer 45a, The part is modified, and the adhesion between the support substrate 44d and the resin layer 45a decreases.

[0282] As the light 20a, laser light can be suitably used. For example, a linear laser beam can be used. It is preferable to use a laser and irradiate it with laser light by scanning it. Furthermore, the process time can be shortened when the area of ​​the support substrate 44d is increased. A flash lamp or similar device may be used if it can emit energy equivalent to that of a laser beam.

[0283] Here, light 20a is used to reduce the adhesion of the resin layer 45a, and a partition wall 11 is formed. It is preferable to use light with a different wavelength for the light 20 used for this purpose. In particular, partition wall 11 The light 20 used to form the layer is of a wavelength that is not easily absorbed by the resin layer 45a. This is preferable. More specifically, light 20a is used which has a shorter wavelength than light 20. It is preferable.

[0284] For example, as the light 20 used to form the partition wall 11, light with a wavelength of 350 nm or more is used. i. The light 20a used to reduce the adhesion of the resin layer 45a is less than 350 nm. Light can be used suitably. For example, as light 20, the third frequency of an Nd:YAG laser can be used. Solid-state UV lasers (also called semiconductor UV lasers), such as UV lasers with a wavelength of 355 nm, which are waves. In addition to these, solid-state UV rays with wavelengths of 365nm, 375nm, or 380nm are also available. You may use the 'Z'. Furthermore, as light 20a, an excimer laser with a wavelength of 308 nm is preferably used. It can be used. Excimer lasers are preferred because they have excellent productivity. Also, excimer lasers The laser is also used for laser crystallization in LTPS, so it can be installed in existing LTPS manufacturing lines. This is preferable because it allows for the reuse of existing equipment and does not require new capital investment.

[0285] Furthermore, a CW (Continuous Wave) laser may be used as the laser. Furthermore, pulsed lasers may be used. Examples of pulsed lasers include nanosecond, picosecond, and femtosecond lasers. Short-duration pulsed lasers such as, or pulsed lasers with longer durations (e.g., less than several hundred Hz) A laser can be used.

[0286] When a linear laser beam is used as light 20a, the support substrate 44d and the light source are relative to each other. By moving it, the light 20a is scanned and irradiated over the area to be peeled off. At this stage, if the entire surface where the resin layer 45a is placed is irradiated, the entire resin layer 45a will peel off. It becomes possible to separate it, and in the subsequent separation process, the outer periphery of the support substrate 44d is divided by scribing or the like. It is not necessary. Alternatively, the outer periphery of the area where the resin layer 45a is placed is not irradiated with light 20a. When a region is created, the adhesion to that region remains high, so when light 20a is irradiated, the resin layer 4 This is preferable because it can prevent the separation of 5a and the support substrate 44d.

[0287] Next, the support substrate 44d and the resin layer 45a are separated (Figure 17(B)).

[0288] The separation is performed by pulling the resin layer 45b perpendicularly to the support substrate 44d while the resin layer 45b is fixed to the stage. This can be done by applying tension. For example, a portion of the upper surface of the support substrate 44d can be attached by suction. It can be peeled off by pulling it upwards. The stage is made of resin layer 45b Any configuration is acceptable as long as it can be fixed in place, but for example, a suction device that can use vacuum suction or electrostatic suction. It may have a structure, or it may have a mechanism to physically retain the resin layer 45b. This involves applying a pulling force perpendicular to the resin layer 45b while the support substrate 44d is fixed to the stage. You can separate them by applying a certain method.

[0289] Furthermore, the separation is performed by supporting a drum-shaped member with adhesive properties on its surface with a support substrate 44d or a resin layer 45 This can also be done by pressing it against the upper surface of b and rotating it. In this case, in the direction of peeling You may move the stage.

[0290] Next, the resin layer 45a and the substrate 41a are bonded together with the adhesive layer 42a. If 45a has sufficient thickness and mechanical strength, it is not necessary to bond the substrate 41a to it. .

[0291] The display device can be manufactured through the above process (Figure 17(C)). Figure 17(C) This is the same figure as Figure 6(C).

[0292] The above is an explanation of example manufacturing method 1.

[0293] [Example of manufacturing method 2] [Example of manufacturing method 2-1] Below, an example of the method for manufacturing the display device shown in Figure 7(A) is described in Figures 18 and 19. This will be explained using the respective diagrams.

[0294] First, a release layer 43c is formed on the support substrate 44c. The support substrate 44c is the support base A substrate similar to that used for plate 44a and support substrate 44b can be used. Also, the release layer 43c is It can be formed by the same method as described above for the release layer 43a and the release layer 43b.

[0295] Next, a conductive layer 23a is formed on the release layer 43c. The conductive layer 23a is made of an oxide. It is preferable to use a conductive material. Using an oxide conductive material as the conductive layer 23a is preferable. Therefore, peeling can be suitably performed at the interface between the conductive layer 23a and the release layer 43c. Conductive layer 23a For example, metal oxides or low-resistance oxide semiconductor materials can be used. .

[0296] When an oxide semiconductor material is used for the conductive layer 23a, plasma treatment or heat treatment is performed. The carrier density may be increased by creating oxygen vacancies in the oxide semiconductor material. In addition to hydrogen and nitrogen, impurities such as noble gases like argon are introduced into the oxide semiconductor material. The carrier density may be increased by this. Also, the conductive layer 23b formed on the conductive layer 23a and By using materials that allow oxygen to diffuse easily, the amount of oxygen in oxide semiconductors can be reduced. Furthermore, two or more of the above methods may be applied.

[0297] Next, a conductive layer 23b is formed on the conductive layer 23a. The conductive layer 23b is made of metal, Alternatively, a single-layer structure or a laminated structure containing an alloy material can be used. When using a laminated structure, a material with high reflectivity should be used for the layer in contact with the conductive layer 23a. It is preferable.

[0298] At this time, the conductive layer 23b does not come into contact with the release layer 43c, and the pattern of the conductive layer 23a It is preferable to process them so that they are positioned on the inside. The conductive layer 23b and the release layer 43c Contact may cause peeling defects in that area.

[0299] Next, an insulating layer 83 is formed by covering the release layer 43c, the conductive layer 23a, and the conductive layer 23b. At this time, an opening is formed in a part of the insulating layer 83 that reaches the conductive layer 23b.

[0300] A schematic cross-sectional view at this stage corresponds to Figure 18(A).

[0301] Next, transistors 70a and 70b are formed on the insulating layer 83. These can be formed by the same method as in Example 1.

[0302] At this time, in the process of forming the gates of transistors 70a and 70b Then, when processing after forming the conductive film, the conductive layer is processed through the openings provided in the insulating layer 83. A conductive layer is simultaneously formed that electrically connects to 23b. This forms the connection portion 80. It is possible.

[0303] Furthermore, either the source or drain of transistor 70a is electrically connected to the connection part 80. To that end, an opening is formed in the insulating layer that functions as the gate insulating layer of transistor 70a, etc. do.

[0304] Next, an insulating layer 81 is formed to cover transistors 70a and 70b. At that time, the insulating layer 81 has an opening that reaches either the source or the drain of the transistor 70b. A conductive layer 91 is then formed on the insulating layer 81.

[0305] A schematic cross-sectional view at this stage corresponds to Figure 18(B).

[0306] Next, an insulating layer that covers the edge of the conductive layer 91 and has an opening in the portion that overlaps with the conductive layer 91. An insulating layer 84 is formed. The insulating layer 84 covers the edges of the conductive layer 91 and also serves as a planarizing layer. It has a function. It is preferable to use an organic resin as the insulating layer 84. Preferably, the end portion has a tapered shape.

[0307] Next, the EL layer 92 and the conductive layer 93a are formed in order on the conductive layer 91 and the insulating layer 84. Subsequently, a conductive layer 93b is formed on the conductive layer 93a.

[0308] The conductive layer 93b is preferably formed to have an opening for transmitting light 20. For example, using a shadow mask such as a metal mask, vapor deposition and sputtering methods... By using any of the film deposition methods, a conductive layer 93b having an opening can be formed.

[0309] Here, we have described an example in which the conductive layer 93b is formed after the conductive layer 93a, but the conductive layer 93a The conductive layer 93b may be formed after the conductive layer 93b.

[0310] Also, although not shown here, it covers conductive layer 93a and conductive layer 93b and acts as a barrier film. A functional insulating layer may be formed. This insulating layer may be formed by methods such as sputtering or ALD. It is preferable to use a film formation method that can form a dense film even at a low formation temperature. A laminated structure consisting of a film containing a mechanical insulating material and a film containing an organic insulating material may also be used.

[0311] Next, the conductive layers 93a and 93b are bonded to the substrate 21 via the adhesive layer 89. .

[0312] A schematic cross-sectional view at this stage corresponds to Figure 18(C).

[0313] Next, between the release layer 43c and the insulating layer 83, and between the release layer 43c and the conductive layer 23a The support substrate 44c and the release layer 43c are removed by peeling (Figure 18(D)).

[0314] Here, after the peeling is complete, the surface of the conductive layer 23a and the surface of the insulating layer 83 are exposed to the peeling layer 43. In some cases, a portion of c may remain, forming a thin film. For example, if the remaining film is conductive... If such a property exists, the two conductive layers 23a between adjacent pixels, or the same conductive layer 23a There is a risk that terminals formed by processing a conductive film may short-circuit electrically. Furthermore, if the thin film has insulating properties, the surface of the conductive layer 23a and the terminals, etc., will not be exposed. These electrodes and terminals may lose their function. Therefore, after peeling Afterward, it is preferable to perform cleaning, etching, wiping, etc. Etching methods include... Jet etching or dry etching can be used.

[0315] Next, the conductive layer 23a is used as a hard mask, and a portion of the insulating layer 83 is etched. By removing it, a recess 50 is formed.

[0316] Subsequently, an alignment film 53a is formed on the conductive layer 23a and the insulating layer 83.

[0317] Next, a colored layer 51a, a colored layer 51b, a light-shielding layer 52, and an insulating layer 6 are pre-placed on the substrate 31. 1. Prepare a substrate on which a conductive layer 25, a structure 14, and an orientation film 53b are formed. The board 31 and the substrate 21 are bonded together with the liquid crystal layer 24 in between (Figure 19(A)).

[0318] At this time, the opening in the conductive layer 93b overlaps with the region between two adjacent conductive layers 23b. They can be arranged in such a way. Also, the openings in the conductive layer 93b overlap with the light-shielding layer 52. It is preferable to do so.

[0319] Furthermore, it is preferable to bond the structure 14 so that it overlaps with the recess 50. By bonding 4 so that it fits into the recess 50, misalignment during bonding is suppressed. It is possible.

[0320] Subsequently, light 20 is shone from the substrate 21 side (Figure 19(B)). At this time, light 20 is The portion of the liquid crystal layer 24 that overlaps with the aperture of the conductive layer 93b can be illuminated in a self-aligned manner. Furthermore, since the light-emitting element 90 has a conductive layer 93b on the substrate 21 side, from the substrate 21 side Even when light 20 is irradiated, the irradiation of the EL layer 92, etc., within the light-emitting element 90 is suppressed. This prevents the light-emitting element 90 from deteriorating.

[0321] Also, although not shown here, the conductive layer 23b and wiring etc. overlap with the opening of the conductive layer 93b. When placed in the area, a portion of the light 20 is blocked by the conductive layer 23b and the wiring. In other words, the partition wall 11 is located in an area that does not overlap with the conductive layer 23b, the conductive layer 93b, and the wiring, etc. It is formed.

[0322] By following the above steps, the display device shown in Figure 7(A) can be manufactured.

[0323] [Variation 1] An example of a method for manufacturing the display device shown in Figure 7(B) will be described. In the process of bonding the substrate 21 with an adhesive layer 89 in Law Example 2-1, instead of the substrate 21, Then the substrate 41a is bonded together. Alternatively, instead of substrate 31, a release layer and an insulating layer can be placed on the support substrate. Using a substrate formed by stacking layers 62, a partition wall 11 is formed, and then the support substrate and the release layer The insulating layer 62 and the substrate 41b can be bonded together using the adhesive layer 42b.

[0324] Note that in Figure 7(A), the substrate 21 is used as is, and only the substrate 31 side is coated with an insulating layer 62 Alternatively, the configuration may be changed to one in which the adhesive layer 42b and the substrate 41b are laminated.

[0325] The above is an explanation of the first variation.

[0326] [Example of manufacturing method 2-2] Below, an example of the method for manufacturing the display device shown in Figure 8(A) is described in relation to Figures 20 and 21. This will be explained using the respective diagrams.

[0327] First, a release layer 43c is formed on the support substrate 44c, and a conductive layer 91 is formed on the release layer 43c. The conductive layer 91 is formed using the same material as the conductive layer 23a and in the same manner. It is possible.

[0328] Next, the insulating layer 83 is formed by covering the conductive layer 91 and the release layer 43c. An opening is formed in 83 that reaches the conductive layer 91.

[0329] Next, transistors 70a and 70b are formed on the insulating layer 83. At that time, in the process of forming the gates of transistors 70a and 70b, A conductive layer that is electrically connected to the electrolytic layer 91 is formed simultaneously to form the connection portion 80.

[0330] Next, after forming the insulating layer 81, a conductive layer 23 is formed on the insulating layer 81. When processing the electrical layer 23, a portion of the insulating layer 81 is simultaneously removed by etching to create the recess 50. Formed. Then, the conductive layer 23 and the insulating layer 81 are covered to form the alignment film 53a.

[0331] A schematic cross-sectional view at this stage corresponds to Figure 20(A).

[0332] Next, using the same method as described above, the support substrate 44c and the substrate 31 are placed with the liquid crystal layer 24 in between. Glue them together (Figure 20(B)).

[0333] Subsequently, light 20 is irradiated from the support substrate 44c side to form a partition wall 11 in the liquid crystal layer 24. (Figure 20(C)).

[0334] At this time, in the region overlapping with the opening of the conductive layer 23, the support substrate 44c and the liquid crystal layer 24 Because there is no material in between to block the light 20, as shown in Figure 20(C), the liquid crystal overlaps with the region. Light 20 is also irradiated onto a portion of layer 24. As a result, the partition wall 11 overlaps with the opening of the conductive layer 23. A formation is created.

[0335] Next, peeling occurs between the release layer 43c and the insulating layer 83, and between the release layer 43c and the conductive layer 91. Remove the support substrate 44c and the release layer 43c (Figure 21(A)). Immediately after this, peel off. The surface may be treated with cleaning or other processes.

[0336] Next, the conductive layer 91 and the insulating layer 83 are covered with the EL layer 92, the conductive layer 93b, and the conductive layer Forms 93a (Figure 21(B)).

[0337] In this case, conductive layer 93b may be formed after conductive layer 93a. Furthermore, an insulating layer that functions as a barrier film may be formed after the conductive layer 93b has been formed.

[0338] Next, the conductive layer 93a and the substrate 21 are bonded together using the adhesive layer 89.

[0339] By following the above steps, the display device shown in Figure 8(A) can be manufactured.

[0340] [Variation 2] An example of a method for manufacturing the display device shown in Figure 8(B) will be described. In the process of bonding the substrate 21 with an adhesive layer 89 in the Act on Laws and Regulations 2-2, instead of the substrate 21, Then the substrate 41a is bonded together. Alternatively, instead of substrate 31, a release layer and an insulating layer can be placed on the support substrate. Using a substrate formed by stacking layers 62, a partition wall 11 is formed, and then the support substrate and the release layer The insulating layer 62 and the substrate 41b can be bonded together using the adhesive layer 42b.

[0341] In Figure 8(A), the substrate 21 is used as is, and only the substrate 31 side is coated with an insulating layer 62. Alternatively, the configuration may be changed to one in which the adhesive layer 42b and the substrate 41b are laminated.

[0342] The above is an explanation of the second variation.

[0343] [Example of manufacturing method 2-3] Below, an example of the manufacturing method for the display device illustrated in Cross-sectional Configuration Example 2-3 is shown in Figures 22 to This will be explained using the figures in Figure 24.

[0344] First, similar to the above manufacturing method example 2-1, a release layer 43c and a conductive layer 23 are placed on the support substrate 44c. a. A conductive layer 23b and an insulating layer 83 having an opening are formed (Figure 22(A)).

[0345] Next, a transistor 70a is formed on the insulating layer 83, and then the transistor 70a is covered. This forms an insulating layer 81 (Figure 22(B)).

[0346] Next, the support substrate 44e is bonded to the insulating layer 81 using the adhesive layer 46a (Figure 22( C)). The support substrate 44e can be made of the same material as the support substrate 44a, etc. Furthermore, it is preferable to use a material for the adhesive layer 46a that can be easily peeled off later. For example, the adhesive layer 46a may be an adhesive material, double-sided tape, silicone sheet, or water-soluble Adhesives such as viscous adhesives can be used.

[0347] Next, between the release layer 43c and the insulating layer 83, and between the release layer 43c and the conductive layer 23a The support substrate 44c and the release layer 43c are removed by peeling (Figure 22(D)).

[0348] Next, the conductive layer 23a is used as a hard mask, and a portion of the insulating layer 83 is etched. By removing it, a recess 50 is formed.

[0349] Subsequently, an alignment film 53a is formed on the conductive layer 23a and the insulating layer 83 (Figure 22(E)). .

[0350] Next, a colored layer 51a, a colored layer 51b, a light-shielding layer 52, and an insulating layer 6 are pre-placed on the substrate 31. 1. Prepare a substrate on which a conductive layer 25, a structure 14, and an orientation film 53b are formed. The board 31 and the substrate 21 are bonded together with the liquid crystal layer 24 in between.

[0351] Subsequently, light 20 (not shown) is irradiated from the support substrate 44e side to form the partition wall 11. Figure 23(A)).

[0352] Next, the adhesive layer 46a and the support substrate 44e are removed (Figure 23(B)).

[0353] In addition, a support substrate 44f is prepared separately from the above. A release layer 43d is placed on the support substrate 44f. Insulating layer 86, transistor 70b (including insulating layer 87), insulating layer 88, conductive layer 91, insulation Layer 84 and the light-emitting element 90 are formed in order. Then, the light-emitting element 90 is covered with an adhesive layer 89. The substrate 21 is attached (Figure 24(A)).

[0354] Next, the release layer 43d and the support substrate 44f are removed (Figure 24(B)).

[0355] Subsequently, substrate 21 and substrate 31 are bonded together using the adhesive layer 99 (Figure 24(C)).

[0356] A display device can be manufactured through the above process. Figure 24(C) is the same as Figure 9(A) and It's the same diagram.

[0357] By using this manufacturing method, when forming the alignment film 53a, the light-emitting element 90 Since it does not have, the alignment film 53a is formed at a high temperature (for example, a temperature of 100°C or higher). This makes it possible to form a higher quality alignment film 53a.

[0358] [Example of manufacturing method 2-4] Below, we will discuss examples of the manufacturing method for the display device illustrated in Cross-sectional Configuration Example 2-4, as shown in Figure 25. This will be explained using diagrams. Here, we will explain the differences from example 2-3 of the manufacturing method.

[0359] As shown in Figure 25(A), a transistor 70b (including an insulating layer 87) is placed on the substrate 21. An insulating layer 88, a conductive layer 91, an insulating layer 84, an EL layer 92, and a conductive layer 93 are formed in sequence.

[0360] Next, the substrate 21 and substrate 31 are bonded together with the adhesive layer 89 to create the display device. It can be manufactured (Figure 25(B)). Figure 25(B) is the same figure as Figure 9(B).

[0361] The above is an explanation of example manufacturing method 2.

[0362] [Regarding each component] The following sections will explain each of the components listed above.

[0363] A substrate having a flat surface can be used for the display device. The substrate on the side from which the light is extracted uses a material that transmits the light. For example, glass, quartz, etc. Materials such as lamination, sapphire, and organic resins can be used.

[0364] By using a thin substrate, it is possible to make the display device lighter and thinner. By using a substrate with a thickness sufficient to be flexible, a flexible display device can be realized. Cut.

[0365] Furthermore, the substrate on the side from which light is not extracted does not need to be translucent, as mentioned above. In addition to the base plate, metal substrates can also be used. Metal substrates have high thermal conductivity, and the entire substrate Because it can easily conduct heat to the body, it can suppress localized temperature increases in the display device, which is advantageous. It seems that in order to obtain flexibility and bendability, the thickness of the metal substrate should be between 10 μm and 200 μm. The lower value is preferable, and a thickness of 20 μm or more and 50 μm or less is more preferable.

[0366] There are no particular limitations on the materials that make up the metal substrate, but for example, aluminum, copper, and nickel are used. Preferably, metals such as buckle, or alloys such as aluminum alloy or stainless steel are used. It is possible.

[0367] In addition, insulating treatment is performed by oxidizing the surface of the metal substrate or forming an insulating film on the surface. A substrate that has been treated may be used. For example, a coating method such as spin coating or dip coating, or an electric coating method may be used. An insulating film may be formed using methods such as deposition, vapor deposition, or sputtering, or in an oxygen atmosphere. In addition to leaving it exposed to air or heating it, an oxide film can be formed on the surface of the substrate by methods such as anodizing. That's fine.

[0368] Materials that are flexible and transparent to visible light include, for example, materials that are flexible to a certain degree. Glass of varying thicknesses, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resin, polyimide resin, polymer Chill methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE) S) Resins, polyamide resins, cycloolefin resins, polystyrene resins, polyamide resins Examples include plastic resins, polyvinyl chloride resins, and polytetrafluoroethylene (PTFE) resins. It is preferable to use a material with a low coefficient of thermal expansion, for example, a material with a coefficient of thermal expansion of 30 ×10 -6 Polyamide-imide resins, polyimide resins, PET, etc. with a K of 0.1 or less are preferably used. It is possible to have a substrate made of glass fiber impregnated with organic resin, or an inorganic filler made of organic resin. It is also possible to use substrates in which the thermal expansion coefficient has been reduced by mixing with resin. Because the circuit board is lightweight, the display device using it can also be made lightweight.

[0369] If the above material contains fibrous material, the fibrous material is a high strength organic or inorganic compound. High-strength fibers are used. Specifically, high-strength fibers are fibers with a high tensile modulus or Young's modulus. This refers to polyvinyl alcohol-based fibers, polyester fibers, and poly- Aramid fibers, polyethylene fibers, aramid fibers, poly(p-phenylenebenzobisoxide) Examples include sazole fibers, glass fibers, or carbon fibers. Examples of glass fibers include E-glass. Examples include glass fibers using S glass, D glass, Q glass, etc. These are woven fabrics. Alternatively, it can be used in the form of a nonwoven fabric, and a structure can be made by impregnating this fiber with resin and hardening the resin. It may be used as a flexible substrate. As a flexible substrate, it may be made of a fiber and a resin. Using such a structure improves reliability against damage caused by bending and localized pressure, therefore it is preferred. It's nice.

[0370] Alternatively, a thin, flexible material such as glass or metal can be used as the substrate. Alternatively, a composite material may be used in which glass and resin materials are bonded together by an adhesive layer.

[0371] A flexible substrate is coated with a hard coat layer (for example) that protects the surface of the display device from scratches and other damage. (e.g., silicon nitride, aluminum oxide) or a layer of material that can distribute pressure (e.g., ara It may also be possible to laminate materials such as mid-resin. In addition, the lifespan of the display elements may be reduced due to moisture, etc. To suppress this, a flexible substrate may be laminated with an insulating film that has low water permeability. For example, silicon nitride, silicon oxide nitride, silicon oxide nitride, aluminum oxide, nitride Inorganic insulating materials such as aluminum can be used.

[0372] The substrate can also be constructed by stacking multiple layers. In particular, it can be configured to include a glass layer. This improves barrier properties against water and oxygen, resulting in a more reliable display device.

[0373] [Transistor] A transistor consists of a conductive layer that functions as the gate electrode, a semiconductor layer, and a source electrode. A functional conductive layer, a conductive layer that functions as a drain electrode, and a gate insulating layer that functions as a gate insulating layer. It has an insulating layer. The above shows the case where a bottom-gate transistor is applied. It is.

[0374] The structure of the transistor in the display device according to one aspect of the present invention is not particularly limited. For example, it could be a planar transistor or a staggered transistor. Furthermore, it may be used as an inverse staggered transistor. Also, top-gate type or bottom-gate type Any of the following transistor structures may be used. Alternatively, gate electrodes may be provided above and below the channel. It's okay if it's done that way.

[0375] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor (having a region) may be used. If a semiconductor with crystalline properties is used, This is preferable because it suppresses the degradation of the DISTA characteristics.

[0376] Furthermore, semiconductor materials used in transistors include, for example, elements of Group 14 (silicon). Compound semiconductors or oxide semiconductors (such as germanium) can be used as semiconductor layers. Typical examples include semiconductors containing silicon, semiconductors containing gallium arsenide, or acids containing indium. This technology can be applied to synthetic semiconductors and other materials.

[0377] In particular, it is preferable to use oxide semiconductors with a larger band gap than silicon. Using semiconductor materials with a wider band gap and lower carrier density than silicon This is preferable because it reduces the current when the transistor is off.

[0378] In particular, the semiconductor layer has multiple crystalline portions, and the c-axis of the crystalline portion is the surface on which the semiconductor layer is formed. Alternatively, the crystals are oriented roughly perpendicular to the upper surface of the semiconductor layer, and grain boundaries are observed between adjacent crystal regions. It is preferable to use an oxide semiconductor that cannot be manufactured.

[0379] Such oxide semiconductors do not have grain boundaries, so when the display panel is curved... This suppresses the formation of cracks in the oxide semiconductor film due to stress. Therefore, Such oxide semiconductors are suitably used in flexible and curved display devices and the like. It is possible.

[0380] Furthermore, by using an oxide semiconductor with such crystalline properties as the semiconductor layer, the electrical properties This suppresses fluctuations and enables the creation of highly reliable transistors.

[0381] Furthermore, transistors using oxide semiconductors with a larger band gap than silicon, Due to its low off-current, the charge accumulated in the capacitive element connected in series with the transistor is reduced over time. It is possible to retain the data over a period of time. Applying such transistors to pixels. This makes it possible to stop the drive circuit while maintaining the gradation of each pixel. As a result, This makes it possible to realize a display device with reduced power consumption.

[0382] Furthermore, the semiconductor layer and the conductive layer may have the same metal element from the above oxides. By using the same metal element for both the conductive layer and the conductive layer, manufacturing costs can be reduced. For example, by using metal oxide targets with the same metal composition, manufacturing costs can be reduced. It is possible to process the semiconductor layer and the conductive layer using etching gas or etching. The liquid can be used in common. However, the semiconductor layer and the conductive layer must have the same metallic element. Even if they are similar, the composition may differ. For example, during the manufacturing process of transistors and capacitive elements In some cases, metal elements may be removed from the film, resulting in a different metallic composition.

[0383] The oxide semiconductor constituting the semiconductor layer has an energy gap of 2 eV or more, preferably 2 It is preferable that the energy is 0.5 eV or more, and more preferably 3 eV or more. - By using oxide semiconductors with a wide gap, the off-current of the transistor can be reduced. It is possible.

[0384] When the oxide semiconductor constituting the semiconductor layer is In-M-Zn oxide, In-M-Zn oxide The atomic ratio of metal elements in a sputtering target used to deposit thin films is In≧M It is preferable that Zn≧M is satisfied. In terms of atomic ratio, In:M:Zn = 1:1:1, In:M:Zn = 1:1:1.2, In : The atomic number ratios of M:Zn = 3:1:2, 4:2:4.1, etc. are preferable. In addition, the atomic number ratio of the semiconductor layer to be formed is, as an error, within a plus or minus 40% variation of the atomic number ratio of the metal elements contained in the above sputtering target. The atomic number ratios of the semiconductor layer are each included with a plus or minus 40% variation of the atomic number ratio of the metal elements contained in the sputtering target.

[0385] As the semiconductor layer, an oxide semiconductor film with a low carrier density is used. For example, the carrier density of the semiconductor layer is 1×10 17 / cm 3 or less, preferably 1×10 15 / cm 3 or less, more preferably 1×10 13 / cm 3 or less, even more preferably 1×10 11 / cm 3 or less, even more preferably 1×10 10 / cm 3 less than 1×10 -9 / cm 3 or more of the oxide semiconductor can be used. Such an oxide semiconductor is called a high-purity intrinsic or substantially high-purity intrinsic oxide semiconductor. As a result, the impurity concentration is low and the density of defect levels is low, so it can be said that it is an oxide semiconductor having stable characteristics.

[0386] Note that it is not limited to these, and those with an appropriate composition may be used according to the required semiconductor characteristics and electrical characteristics (field effect mobility, threshold voltage, etc.) of the transistor. Also, in order to obtain the required semiconductor characteristics of the transistor, it is preferable to make the carrier density, impurity concentration, defect density, atomic number ratio of metal elements and oxygen, interatomic distance, density, etc. of the semiconductor layer appropriate.

[0387] In the oxide semiconductor constituting the semiconductor layer, silicon or carbon, which is one of the Group 14 elements ​​​​When present, oxygen vacancies increase in the semiconductor layer, causing it to become n-type. The concentrations of silicon and carbon in the body layer (concentrations obtained by secondary ion mass spectrometry) are, ×10 18 atoms / cm 3 The following is preferably 2 × 10 17 atoms / cm 3 The following and do.

[0388] Furthermore, alkali metals and alkaline earth metals generate carriers when they bond with oxide semiconductors. This can occur, and the off-current of the transistor may increase. Alkali metals or alkaline earth metals obtained by secondary ion mass spectrometry in the body layer The concentration of 1 × 10 18 atoms / cm 3 The following is preferably 2 × 10 16 atom / cm 3 Do the following:

[0389] Furthermore, if nitrogen is present in the oxide semiconductor that makes up the semiconductor layer, the electrons, which are carriers, This occurs, increasing carrier density and making it more likely to become n-type. As a result, nitrogen-containing oxides are produced. Transistors using semiconductors tend to exhibit normally-on characteristics. Therefore, in the semiconductor layer... The nitrogen concentration obtained by secondary ion mass spectrometry is 5 × 10⁻⁶ 18 atoms / cm 3 The following is preferable:

[0390] Furthermore, the semiconductor layer may have a non-single-crystal structure, for example. A non-single-crystal structure is CAAC. -OS(C-Axis Aligned Crystalline Oxide Sem iconductor, or C-Axis Aligned and AB-pl An Anchored Crystalline Oxide Semicondu ctor), a polycrystalline structure, a microcrystalline structure, or an amorphous structure. Among non-single crystal structures , the amorphous structure has the highest density of defect levels, and CAAC-OS has the lowest density of defect levels.

[0391] The oxide semiconductor film having an amorphous structure, for example, has a disordered atomic arrangement and has no crystal component. Or, the oxide film having an amorphous structure, for example, has a completely amorphous structure and has no crystal part.

[0392] Note that the semiconductor layer may be a mixed film having two or more of an amorphous structure region, a microcrystalline structure region, a polycrystalline structure region, a CAA C-OS region, and a single crystal structure region. The mixed film may have, for example, a single layer structure or a stacked layer structure including two or more of the above-described regions.

[0393] <Configuration of CAC-OS> Hereinafter, the configuration of CAC (Cloud-Aligned Composite)-OS that can be used for the transistor disclosed in one aspect of the present invention will be described.

[0394] CAC-OS is, for example, a composition in which elements constituting a metal oxide are unevenly distributed in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 2 nm or less, or in the vicinity thereof. Note that hereinafter, in a metal oxide, one or more metal elements are unevenly distributed, and a region having the metal element is mixed in a size of 0.5 nm or more and 10 nm or less, preferably 1 nm or more and 2 nm or less, or in the vicinity thereof, and this state is also referred to as a mosaic state or a patch state.

[0395] ​​​​​​​​Furthermore, it is preferable that the metal oxide contains at least indium. In particular, indium It is preferable to include zinc. In addition to these, aluminum, gallium, and t Thorium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, ginger Lumanium, Zirconium, Molybdenum, Lanthanum, Cerium, Neodymium, Hafnium, Contains one or more elements selected from tantalum, tungsten, or magnesium. It's okay if they're born.

[0396] For example, CAC-OS in In-Ga-Zn oxide (In- Ga-Zn oxide may also be specifically referred to as CAC-IGZO. ) is indium oxide (hereinafter referred to as InO X1 (Let X1 be a real number greater than 0.) ) or indium zinc Oxides (hereinafter, In X2 Zn Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0) ) and gallium oxide (hereinafter referred to as GaO X3 (Let X3 be a real number greater than 0) ) or gallium zinc oxide (hereinafter referred to as Ga X4 Zn Y4 O Z4 (X4, Y4, oyo Let Z4 be a real number greater than 0. The material separates into parts, creating a mosaic pattern. It becomes a mosaic-like InO X1 , or In X2 Zn Y2 O Z2 However, it is uniformly distributed within the membrane. This configuration (hereinafter also referred to as cloud-based) is as follows.

[0397] In other words, CAC-OS is GaO X3 The region in which is the main component, and In X2 Zn Y2 OZ2 , or InO X1 A composite metal oxide having a composition in which a region is the main component and a region is mixed. In this specification, for example, the atomic ratio of In to element M in the first region. However, the first region is greater than the atomic ratio of In to element M in the second region. Assume that the concentration of In is higher in this region compared to region 2.

[0398] Note that IGZO is a common name and refers to a single compound composed of In, Ga, Zn, and O. There are cases where this occurs. A typical example is InGaO3(ZnO). m1 (m1 is a natural number), or In (1+x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is any number) Examples of crystalline compounds are shown.

[0399] The above-mentioned crystalline compounds have a single-crystal structure, a polycrystalline structure, or a CAAC structure. CAAC structure refers to a structure in which multiple IGZO nanocrystals have c-axis orientation and ab-plane orientation This is a crystal structure in which the elements are linked without orientation.

[0400] On the other hand, CAC-OS relates to the material composition of metal oxides. CAC-OS is In, G In a material composition containing a, Zn, and O, a portion of it is observed to be in the form of nanoparticles mainly composed of Ga. The region where the substance is suspected and the region where it is observed as nanoparticles mainly composed of In are, respectively This refers to a configuration in which elements are randomly dispersed in a mosaic-like manner. Therefore, in CAC-OS, crystals Structure is a secondary element.

[0401] Furthermore, CAC-OS does not include a layered structure of two or more films with different compositions. For example, a structure consisting of two layers, one with In as the main component and the other with Ga as the main component, includes No.

[0402] Note that GaO X3 The region in which is the main component, and In X2 Zn Y2 O Z2 , or InO X1 In some cases, a clear boundary may not be observable in a region where [this component] is the main component.

[0403] Note that aluminum, yttrium, copper, vanadium, and beryllium can be used instead of gallium. Molybdenum, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum N, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium If one or more species selected from Nesium etc. are included, CAC-OS will The region is observed to be in the form of nanoparticles mainly composed of the metal element, and the portion is mainly composed of In. The regions observed as nanoparticles are randomly dispersed in a mosaic-like manner. It refers to.

[0404] CAC-OS is a material that can be molded by sputtering, for example, under conditions where the substrate is not intentionally heated. This can be achieved. Also, when forming CAC-OS by sputtering, the deposition gas The gases selected were inert gases (typically argon), oxygen gas, and nitrogen gas. You may use one or more of them. Also, the oxygen in relation to the total flow rate of the deposition gas during film formation. A lower gas flow rate ratio is preferable; for example, a flow rate ratio of oxygen gas of 0% or more and less than 30% is preferable. Alternatively, it is preferable to have a value of 0% or more and 10% or less.

[0405] CAC-OS is an X-ray diffraction (XRD) measurement method When measured using one method, the Out-of-Plane method with a θ / 2θ scan: It is characterized by the absence of a clear peak. In other words, from X-ray diffraction, the measurement area It can be seen that there is no orientation in the ab-plane direction or the c-axis direction of the region.

[0406] Furthermore, CAC-OS uses an electron beam with a probe diameter of 1 nm (also called a nanobeam electron beam). In the electron diffraction pattern obtained by irradiation, there is a ring-shaped region of high brightness, and Multiple bright spots are observed in the ring region. Therefore, from the electron diffraction pattern, CAC-OS The crystal structure of is non-oriented in both the planar and cross-sectional directions, nc(nano- It can be seen that it has a crystal structure.

[0407] For example, in CAC-OS in In-Ga-Zn oxide, energy-dispersive X Linear spectroscopy (EDX: Energy Dispersive X-ray spectrometer) GaO X3 The region in which is the main component And, In X2 Zn Y2 O Z2 , or InO X1 Regions where it is the main component are unevenly distributed and mixed. It can be confirmed that it has the following structure.

[0408] CAC-OS has a different structure from IGZO compounds in which metal elements are uniformly distributed, It has different properties from GZO compounds. In other words, CAC-OS is GaO X3 These are the main components. The region and In X2 Zn Y2 O Z2 , or InO X1 The region in which is the main component, and It exhibits phase separation and has a mosaic-like structure in which regions composed primarily of each element are arranged.

[0409] Here, In X2 Zn Y2 O Z2 , or InO X1 The region in which is the main component is GaO X This region has higher conductivity compared to regions where 3 is the main component. X2 Zn Y2 O Z2 , or InO X1 As carriers flow through the region where gold is the main component, Conductivity as a group oxide is exhibited. Therefore, In X2 Zn Y2 O Z2 , or InO X Regions where 1 is the main component are distributed in a cloud-like manner within the metal oxide, resulting in high field effect transfer. Mobility (μ) can be achieved.

[0410] On the other hand, GaO X3 Regions in which these are the main components are In X2 Zn Y2 O Z2 , or InO X1 This region has higher insulating properties compared to the region where GaO is the main component. X3 etc. The region where this is the main component is distributed within the metal oxide, which suppresses leakage current and improves performance. It can perform itching operations.

[0411] Therefore, when CAC-OS is used in semiconductor devices, GaO X3 Insulation caused by factors such as In X2 Zn Y2 O Z2 , or InO X1 The conductivity resulting from this works in a complementary manner. This results in a high on-current (I on), and achieving high field effect mobility (μ) It is possible.

[0412] Furthermore, semiconductor devices using CAC-OS have high reliability. Therefore, CAC-OS is, It is ideal for various semiconductor devices, including displays.

[0413] Alternatively, silicon is preferred as the semiconductor in which the transistor channel is formed. It is fine. Amorphous silicon may be used as silicon, but crystalline silicon is particularly desirable. It is preferable to use silicon. For example, microcrystalline silicon, polycrystalline silicon, single-crystal silicon It is preferable to use materials such as n. In particular, polycrystalline silicon is suitable for lower temperatures compared to single-crystal silicon. It can be formed using [a specific method] and possesses higher field-effect mobility and higher reliability compared to amorphous silicon. By applying such polycrystalline semiconductors to pixels, the aperture ratio of the pixels can be improved. It is possible. Furthermore, even when an extremely high-resolution display unit is used, the gate drive circuit and source drive circuit This makes it possible to form the paths on the same substrate as the pixels, reducing the number of components that make up electronic devices. It is possible.

[0414] The bottom-gate transistor exemplified in this embodiment can reduce the manufacturing process. It is preferable. Also, by using amorphous silicon in this case, it is preferable to using polycrystalline silicon. Because it can be formed at low temperatures, it can be used as a material for wiring and electrodes in layers below the semiconductor layer, and as a substrate material, and is resistant to Because it is possible to use materials with low heat properties, the range of material choices can be broadened. For example This allows for the use of extremely large-area glass substrates, etc. On the other hand, top gate type Because transistors tend to form impurity regions in a self-aligning manner, variations in characteristics can occur. This is preferable because it can reduce the amount of silicon. In particular, polycrystalline silicon and monocrystalline silicon This is suitable when using [a specific method / tool].

[0415] [Conductive layer] In addition to the gate, source, and drain of a transistor, various wiring components make up a display device. Materials that can be used for conductive layers such as electrodes include aluminum, titanium, and chromium. Molybdenum, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten. Examples include metals such as sten, or alloys in which these are the main component. The film containing the material can be used as a single layer or as a multilayer structure. For example, silicon A single-layer structure containing an aluminum film, a double-layer structure in which an aluminum film is laminated on a titanium film, and tan A two-layer structure consisting of an aluminum film laminated on a gusten film, and a copper-magnesium-aluminum alloy. A two-layer structure with a copper film laminated on a gold film, a two-layer structure with a copper film laminated on a titanium film, tungsten A two-layer structure with a copper film laminated on top of a film, a titanium film or titanium nitride film, and an aluminum film layered on top of that. A three-layer structure is formed by laminating a titanium film or copper film, and then forming a titanium film or titanium nitride film on top of it. A layered structure, a molybdenum film or a molybdenum nitride film, with an aluminum film or layered on top thereof. A three-layer structure in which copper films are stacked, and then a molybdenum film or molybdenum nitride film is formed on top of them. These include, for example. Furthermore, oxides such as indium oxide, tin oxide, or zinc oxide may also be used. Furthermore, using copper containing manganese is preferable because it improves the controllability of the shape through etching. .

[0416] Furthermore, examples of conductive materials that are translucent include indium oxide, indium tin oxide, and Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium or Graphene can be used. Alternatively, gold, silver, platinum, magnesium, nickel, and t Examples include sten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium. Metal materials or alloy materials containing such metal materials can be used. Alternatively, the nitrogen of the metal material can be used. Metallic compounds (e.g., titanium nitride) may also be used. When using these nitrides, they should be thinned to a degree that allows light to pass through. A laminated film of materials can be used as a conductive layer. For example, an alloy of silver and magnesium and an ink Using a multilayer film of tungsten oxide is preferable because it can improve conductivity. These include conductive layers such as various wirings and electrodes that constitute the display device, and conductive elements of the display element. It can also be used as an electrochemical layer (a conductive layer that functions as a pixel electrode or common electrode).

[0417] [Insulating layer] Examples of insulating materials that can be used for each insulating layer include acrylic, epoxy, etc. In addition to resins and resins containing siloxane bonds, silicon oxide, silicon oxide nitride, and silicon nitride oxide are also used. Inorganic insulating materials such as silicon nitride and aluminum oxide can also be used.

[0418] Furthermore, it is preferable that the light-emitting element is provided between a pair of insulating films with low water permeability. This prevents impurities such as water from entering the light-emitting elements, thus suppressing a decrease in the reliability of the device. It can be controlled.

[0419] Examples of insulating films with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Silicon oxide films, silicon oxide nitride films, aluminum oxide films, etc., may also be used.

[0420] For example, the water vapor transmission rate of a low-permeability insulating film is 1×10 -5 [g / (m 2 ·day) Hereinafter, preferably 1×10 -6 [g / (m 2 ·day)] or less, more preferably 1×1 0 -7 [g / (m 2 ·day)] or less, even more preferably 1×10 -8 [g / (m 2 ·d ay)] or less.

[0421] [Liquid crystal element] As the liquid crystal element, for example, a liquid crystal element to which a vertical alignment (VA: Vertical Alignment) mode is applied can be used. As the vertical alignment mode, MVA ( Multi-Domain Vertical Alignment) mode, PVA ( Patterned Vertical Alignment) mode, ASV (Advanced Super View) mode, etc. can be used.

[0422] In addition, for the liquid crystal element, a liquid crystal element to which various modes are applied can be used. For example besides the VA mode, TN (Twisted Nematic) mode, IPS (In -Plane-Switching) mode, FFS (Fringe Field Sw itching) mode, ASM (Axially Symmetric aligne d Micro-cell) mode, OCB (Optically Compensat ed Birefringence) mode, FLC (Ferroelectric L iquid Crystal) mode, AFLC (AntiFerroelectric Liquid Crystal mode, ECB (Electrically Controlled) Trolled Birefringence mode, guest host mode, etc. are applied. A liquid crystal element can be used.

[0423] Furthermore, liquid crystal elements control the transmission or non-transmission of light through the optical modulation effect of liquid crystals. It is a child. Furthermore, the optical modulation effect of liquid crystals is due to the electric field acting on the liquid crystal (horizontal electric field, vertical electric field) It is controlled by an electric field (including an electric field in an oblique direction). Note that the liquid crystal used in the liquid crystal element is For example, thermotropic liquid crystals, low molecular weight liquid crystals, polymer liquid crystals, polymer dispersed liquid crystals (PDLCs): Polymer Dispersed Liquid Crystal), Polymer Net Work-type liquid crystal (PNLC: Polymer Network Liquid Crystal) Al), ferroelectric liquid crystals, antiferroelectric liquid crystals, etc. can be used. These liquid crystal materials are Depending on the conditions, cholesteric phase, smectic phase, cubic phase, chiral nematic This shows the relationship between phase and isotropic phase.

[0424] Furthermore, either positive-type or negative-type liquid crystals may be used as the liquid crystal material. The optimal liquid crystal material should be used depending on the mode and design to be applied.

[0425] Furthermore, an alignment film can be provided to control the orientation of the liquid crystal. If adopted, a liquid crystal exhibiting a blue phase without an alignment layer may be used. The blue phase is the liquid crystal phase. One such example is when a cholesteric liquid crystal is heated, and it transitions from the cholesteric phase to the isotropic phase. This phase appears just before transfer. The blue phase only appears within a narrow temperature range. To improve the properties, a liquid crystal composition containing several weight percent or more of a chiral agent is used in the liquid crystal layer. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a short response speed and optical isotropy. It is a property. Furthermore, a liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent is an alignment treatment. It is essential and has low viewing angle dependence. Also, since an alignment layer is not required, rubbing treatment is not necessary. As this is essential, it can prevent electrostatic discharge damage caused by rubbing, and This can reduce defects and damage to liquid crystal display devices during the manufacturing process.

[0426] Furthermore, the liquid crystal elements include transmissive liquid crystal elements, reflective liquid crystal elements, or semi-transmissive liquid crystal elements. Elements and the like can be used.

[0427] In one aspect of the present invention, a reflective liquid crystal element can be used in particular.

[0428] When using transmissive or semi-transmissive liquid crystal elements, two polarizing elements are placed so as to sandwich a pair of substrates. A plate is provided. Also, a backlight is provided on the outside of one of the polarizing plates. For example, it could be a direct-lit backlight or an edge-lit backlight. This is also good. Using a direct-lit backlight with LEDs makes local dimming easy. This is preferable because it can enhance contrast. Also, edge-lit backgrounds are preferable. Using lights is preferable because it reduces the thickness of the module, including the backlight.

[0429] When using reflective liquid crystal elements, a polarizing plate is provided on the display surface side. In addition, Placing a light diffuser on the display side is preferable because it improves visibility.

[0430] [Light-emitting element] As the light-emitting element, a self-emitting element can be used, and it will light up when current or voltage is applied. This category includes elements whose degree of control is managed. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc., can be used.

[0431] Light-emitting devices include top-emission type, bottom-emission type, and dual-emission type. These are some examples. A conductive film that transmits visible light is used for the electrode that extracts light. It is preferable to use a conductive film that reflects visible light on the electrode that is not removed.

[0432] In one aspect of the present invention, a bottom-emission type light-emitting element can be used in particular.

[0433] The EL layer has at least an emissive layer. The emissive layer contains at least an emissive material. EL layer The layers other than the light-emitting layer include materials with high hole injection potential, materials with high hole transport potential, and hole block layers. Materials, substances with high electron transport properties, substances with high electron injection properties, or bipolar substances (electron The material may further contain a layer containing a substance with high transportability and hole transportability.

[0434] The EL layer can use either low-molecular-weight compounds or high-molecular-weight compounds, and inorganic compounds It may contain materials. Each layer constituting the EL layer is made by a vapor deposition method (including vacuum deposition). It can be formed by methods such as transfer, printing, inkjet, and coating.

[0435] When a voltage higher than the threshold voltage of the light-emitting element is applied between the cathode and anode, the EL layer on the anode side... Holes are injected from the cathode side, and electrons are injected from the cathode side. The injected electrons and holes are in the EL layer. They recombine, and the light-emitting material contained in the EL layer emits light.

[0436] When using a white light-emitting element as the light-emitting element, two or more types of light-emitting elements are used in the EL layer. It is preferable to have a composition that includes substances. For example, the emission of light from two or more light-emitting substances is related to the complementary color White light emission can be obtained by selecting a light-emitting material that acts in conjunction with the light-emitting material. For example, These are light-emitting substances that exhibit light emission in the following colors: R (red), G (green), B (blue), Y (yellow), O (orange), etc. Or, among luminescent materials that exhibit emission containing two or more spectral components of R, G, and B, It is preferable that it contains 2 or more. Also, the spectrum of emission from the light-emitting element is in the visible light region. A light-emitting element having two or more peaks within a wavelength range (e.g., 350 nm to 750 nm) is suitable. It is preferable to use it. Also, the emission spectrum of a material having a peak in the yellow wavelength region is Preferably, the material has spectral components in the green and red wavelength regions.

[0437] The EL layer includes an emissive layer containing an emissive material that emits one color, and an emissive material that emits another color. It is preferable to have a structure in which multiple light-emitting layers are stacked. For example, multiple light-emitting layers in the EL layer The layers may be stacked in contact with each other, or they may be separated by regions that do not contain any light-emitting material. They may be laminated. For example, between the fluorescent emitting layer and the phosphorescent emitting layer, the fluorescent emitting layer or It contains the same material as the phosphorescent layer (e.g., host material, assist material), and either emission The configuration may also include a region that does not contain any optical material. This makes it easier to fabricate the light-emitting element. This also results in a reduction in the drive voltage.

[0438] Furthermore, the light-emitting element may be a single element having one EL layer, or it may have multiple EL layers These may be tandem elements stacked with charge generation layers in between.

[0439] Examples of conductive films that transmit visible light include indium oxide, indium tin oxide, and indium It can be formed using zinc oxide, zinc oxide, or zinc oxide with added gallium. Also, gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum Metal materials such as iron, cobalt, copper, palladium, or titanium, and materials containing these metal materials. Alloys, or nitrides of these metallic materials (e.g., titanium nitride), etc., are also translucent to a certain extent. It can be used by forming it into a thin layer. Furthermore, the laminated film of the above material can be used as a conductive layer. This is possible. For example, by using a multilayer film of a silver-magnesium alloy and indium tin oxide. It is preferable to include this because it can improve conductivity. Alternatively, graphene or the like may be used. .

[0440] Conductive films that reflect visible light include, for example, aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, the above metal materials and alloys can be treated with ran It may also contain additives such as tungsten, neodymium, or germanium. Additionally, titanium and nickel may be added. Alternatively, an alloy containing neodymium and aluminum (aluminum alloy) may be used. An alloy containing copper, palladium, magnesium, and silver may also be used. An alloy containing silver and copper is Furthermore, it is preferable because it has high heat resistance. By laminating a metal film or metal oxide film, oxidation can be suppressed. Examples of materials for metal films and metal oxide films include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated together. For example, silver and an ink Multilayer films of zinc-tin oxide, multilayer films of silver-magnesium alloy and indium-tin oxide, etc. It can be used.

[0441] The electrodes can be formed using methods such as vapor deposition or sputtering. Shapes are formed using ejection methods such as inkjet, printing methods such as screen printing, or plating methods. It is possible.

[0442] Furthermore, the above-mentioned light-emitting layer, as well as materials with high hole injection potential, materials with high hole transport potential, and electricity Layers containing materials with high electron transport properties, materials with high electron injection properties, bipolar materials, etc. These include inorganic compounds such as quantum dots, and polymer compounds (oligomers, dendrimers, poly It may have (such as a mer). For example, by using quantum dots as the light-emitting layer, the light-emitting material and It can also be made to function in that way.

[0443] Furthermore, quantum dot materials include colloidal quantum dot materials, alloy-type quantum dot materials, Core-shell type quantum dot materials, core-type quantum dot materials, etc., can be used. Materials containing elemental groups 12 and 16, 13 and 15, or 14 and 16 May be used. Alternatively, cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, Quantum dot materials containing elements such as lead, gallium, arsenic, and aluminum may also be used.

[0444] [Adhesive layer] The adhesive layer can be a photocuring adhesive such as an UV-curing type, a reaction-curing adhesive, or a thermosetting adhesive. Various types of curing adhesives, such as anaerobic adhesives, can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imi Plastic resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, E Examples include VA (ethylene vinyl acetate) resin. In particular, the moisture permeability of epoxy resins, etc. Materials with low properties are preferred. A two-part resin mixture may also be used. Furthermore, adhesive sheets, etc. You may use it.

[0445] Furthermore, the above resin may contain a desiccant. For example, an alkaline earth metal oxide (acid Using substances that adsorb moisture by chemical adsorption, such as calcium carbonate or barium oxide. It is possible to remove moisture through physical adsorption, such as with zeolite or silica gel. Adsorbent substances may be used. If a desiccant is included, impurities such as moisture may enter the element. This is preferable because it can suppress the process and improve the reliability of the display panel.

[0446] Furthermore, by mixing a filler or light scattering material with a high refractive index into the above resin, light can be extracted. This can improve efficiency. For example, titanium dioxide, barium oxide, zeolite, and Aquatic plants such as ruconium can be used.

[0447] [Connection layer] As a connecting layer, an anisotropic conductive film (ACF) is used. (Active Film) and anisotropic conductive paste (ACP: Anisotropic C) You can use inductive pastels, etc.

[0448] [Colored layer] Materials that can be used for the colored layer include metal materials, resin materials, pigments, or dyes. Examples include resin materials.

[0449] [Light blocking layer] Materials that can be used as a light-shielding layer include carbon black, titanium black, Examples include metals, metal oxides, and composite oxides containing solid solutions of multiple metal oxides. Light-shielding layer This may be a film containing a resin material, or a thin film of an inorganic material such as a metal. Furthermore, a laminated film containing the material for the colored layer can be used as the light-shielding layer. For example, a film of a certain color A film containing a material used for a light-transmitting colored layer, and a material used for a colored layer that transmits light of other colors. A laminated structure with a film containing can be used. By using the same material for the colored layer and the light-shielding layer, This is preferable because it allows for the standardization of equipment and simplifies the process.

[0450] The above is a description of each component.

[0451] [Example of manufacturing method] This section describes an example of a method for manufacturing a display device using a flexible substrate.

[0452] Here, we have display elements, circuits, wiring, electrodes, optical components such as colored layers and light-shielding layers, and insulating layers. Each layer containing such elements will be collectively referred to as an element layer. For example, an element layer may include display elements. In addition to the display elements, there are also the wiring that electrically connects to the display elements, and transistors used in pixels and circuits. It may have any of the elements.

[0453] Furthermore, at the stage when the display element is completed (the manufacturing process is finished), the element layer is A supporting and flexible component will be called a substrate. For example, a substrate has a thickness This also includes extremely thin films, etc., with a thickness of 10 nm to 300 μm.

[0454] Typical methods for forming an element layer on a substrate that is flexible and has an insulating surface include There are two methods, as listed below. One is to form the element layer directly on the substrate. Another method involves forming an element layer on a support substrate different from the substrate, and then separating the element layer from the support substrate. This is a method of transferring the element layer onto the substrate. Although not explained in detail here, the two above... In addition to the above method, an element layer is formed on a non-flexible substrate, and the substrate is thinned by polishing or the like. Another method is to make it flexible by doing so.

[0455] If the materials constituting the substrate have heat resistance to the heat generated during the device layer formation process, Forming the element layer directly on the substrate is preferable because it simplifies the process. When the element layer is formed with the plate fixed to the support substrate, transport within and between devices is It is preferable because it makes things easier.

[0456] Furthermore, when using a method in which the element layer is formed on a support substrate and then transferred to the substrate, first the support A release layer and an insulating layer are laminated on the substrate, and an element layer is formed on the insulating layer. Subsequently, the support base The element layer is delaminated between the plate and the element layer, and the element layer is transferred to the substrate. At this time, the interface between the support substrate and the delamination layer. Therefore, a material should be selected that causes delamination at the interface between the release layer and the insulating layer, or within the release layer itself. In this method, the element layer is formed by using highly heat-resistant materials for the support substrate and release layer. This allows for an increase in the upper limit of the temperature applied during the process, resulting in the formation of an element layer with more reliable components. This is preferable because it allows for this.

[0457] For example, as a release layer, a layer containing a high melting point metal material such as tungsten, and the metal material Layers containing oxides are stacked and used, with silicon oxide and silicon nitride as the insulating layer on the release layer. It is preferable to use a layer made by stacking multiple silicon oxide nitride, silicon nitride oxide, etc. In this specification, oxidnitrides are defined as having a composition in which the oxygen content is greater than the nitrogen content. The term refers to materials with a high nitrogen content, and nitride oxides are materials whose composition contains more nitrogen than oxygen. To point.

[0458] Methods for separating the element layer from the support substrate include applying mechanical force and removing the delamination layer. Examples include chipping or penetrating the peeling interface with a liquid. Alternatively, the difference in thermal expansion coefficients of the two layers forming the delamination interface can be used to heat the support substrate or Delamination may be performed by cooling.

[0459] Furthermore, if delamination is possible at the interface between the support substrate and the insulating layer, a delamination layer may not be necessary.

[0460] For example, glass is used as the support substrate and an organic resin such as polyimide is used as the insulating layer. This can be done by locally heating a portion of the organic resin using a laser beam or the like. Alternatively, the organic resin may peel off due to physical cutting or piercing of a portion of it by a sharp object. A starting point may be formed, and delamination may be performed at the interface between the glass and the organic resin.

[0461] Alternatively, a heating layer is provided between the support substrate and an insulating layer made of organic resin, and the heating layer is heated. By doing so, delamination may occur at the interface between the heating layer and the insulating layer. The heating layer is a current Materials that generate heat when a fluid is passed through them, materials that generate heat when light is absorbed, and materials to which a magnetic field is applied. Various materials can be used, such as materials that generate heat. For example, the heating layer can be Semiconductors, metals, and insulators can be selected and used.

[0462] In the method described above, the insulating layer made of organic resin is used as a substrate after peeling. It is possible.

[0463] The above is a description of the method for manufacturing a flexible display device.

[0464] [Configuration Example 3] In the following, a more specific configuration example of a display device according to one aspect of the present invention will be described with reference to the drawings. explain.

[0465] [Cross-sectional configuration example 3-1] Figure 26 is a schematic cross-sectional view of the display device illustrated below. FPC3 in Figure 1(A) An example of a cross-section is shown, including the region containing 6, the region containing circuit 34, and the region containing display unit 32. ru.

[0466] Substrate 21 and substrate 31 are bonded together by an adhesive layer 141. Also, substrate 21, The liquid crystal 112 is sealed in the region surrounded by the substrate 31 and the adhesive layer 141. The outer surface of the plate 31 has a polarizing plate 130.

[0467] In Figure 26, the liquid crystal element 40 is sandwiched between the conductive layer 111, a part of the conductive layer 113, and the layer between them. It is composed of the liquid crystal 112. An alignment layer is also placed between the liquid crystal 112 and the conductive layer 111. A 133a is provided, and an alignment film 133b is provided between the liquid crystal 112 and the conductive layer 113. .

[0468] Furthermore, monomers 13 are dispersed in the liquid crystal 112 between substrate 21 and substrate 31. Furthermore, a partition wall 11 is provided between substrate 21 and substrate 31.

[0469] Furthermore, although not shown in the diagram, a front light can be provided outside the polarizing plate 130. It is preferable to use edge-light type front lights. Using LED-equipped front lights is preferable because it reduces power consumption.

[0470] The substrate 31 has a colored layer 131, a light-shielding layer 132, an insulating layer 121, and a common liquid crystal element 40. A conductive layer 113 and an alignment film 133b, which function as electrodes, are provided.

[0471] The substrate 21 has a conductive layer 111 that functions as a pixel electrode for the liquid crystal element 40, and an alignment layer 133a. , transistor 201, transistor 202, capacitive element 203, connection part 204, wiring 35 And so on. Transistor 201 corresponds to, for example, the transistor 70 mentioned above. ru.

[0472] On the substrate 21, insulating layers such as insulating layer 211, insulating layer 212, insulating layer 213, insulating layer 214 are placed. A layer is provided. A portion of the insulating layer 211 serves as the gate insulating layer for each transistor. It functions, and other parts also function as dielectrics for the capacitive element 203. Insulating layer 212, insulating Layer 213 and insulating layer 214 are provided covering each transistor and capacitive element 203. The insulating layer 214 functions as a planarization layer. Note that here, transistors, etc. When the covering insulating layer has three layers, insulating layer 212, insulating layer 213, and insulating layer 214 Although shown here, it is not limited to this and may be four or more layers, or even a single layer or two layers. It is also acceptable to omit the insulating layer 214, which functions as a planarizing layer, if it is not needed. .

[0473] Furthermore, transistors 201 and 202 are conductive, with a portion of them functioning as gates. A dielectric layer 221, a conductive layer 222 which partially functions as a source or drain, and a semiconductor layer 231 It has. Here, multiple layers obtained by processing the same conductive film have the same hatching pattern. It has the letter "n" attached.

[0474] Here, of the pair of conductive layers 222 of transistor 202, the conductive layer 111 is electrically connected The conductive layer 222 that is not connected may function as part of the signal line. The conductive layer 221, which functions as the gate of the zistor 202, may also function as part of the scan line. stomach.

[0475] Figure 26 shows a cross-section of two pixels (sub-pixels) as an example of the display unit 32. Each subpixel consists of a transistor 202, a capacitive element 203, a liquid crystal element 40, and a colored layer. It has 131 and, for example, a subpixel exhibiting red and green by selectively forming a colored layer 131. By arranging subpixels that exhibit a certain color and subpixels that exhibit a blue color, full-color display can be achieved. can.

[0476] Figure 26 shows an example of circuit 34 in which transistor 201 is provided. .

[0477] Figure 26 shows an example of transistors 201 and 202, with one gate... The configuration to be provided is shown, but the semiconductor layer 231 in which the channel is formed is sandwiched between two gates. This configuration may be applied. By using this configuration, the threshold voltage of the transistor can be controlled. It can be controlled. In this case, two gates are connected and the same signal is supplied to them. The transistor may be driven by this. Such a transistor is a different transistor from other transistors. Compared to this, it is possible to increase the field effect mobility and increase the on-current. As a result, it is possible to create a circuit that can be driven at high speed. Furthermore, the occupancy of the circuit section is reduced. It becomes possible to reduce the area. By applying transistors with a large on-current, the surface Even if the number of wires increases when the display device is made larger or higher resolution, in each wire This makes it possible to reduce signal delay and suppress display inconsistencies.

[0478] Note that the transistors in circuit 34 and the transistors in display unit 32 have the same structure. It may be constructed in the same way. Also, all of the transistors in circuit 34 have the same structure. Alternatively, a combination of transistors with different structures may be used. Also, the display unit 32 Multiple transistors may all have the same structure, or they may have different structures. You may also use it in combination with other characters.

[0479] At least one of the insulating layers 212 and 213 covering each transistor is protected from water and hydrogen It is preferable to use a material that does not easily allow impurities such as to diffuse. That is, the insulating layer 212 and The insulating layer 213 can function as a barrier film. This makes it possible to effectively suppress the diffusion of impurities from the outside into the transistor. This makes it possible to create a highly reliable display device.

[0480] A conductive layer 111 is provided on the insulating layer 214. Through openings formed in insulating layer 213, insulating layer 212, etc., the saw of transistor 202 It is electrically connected to either the drain or the casing. The conductive layer 111 is connected to the capacitive element 203 It is electrically connected to one of the electrodes.

[0481] On the substrate 31 side, an insulating layer 121 is provided covering the colored layer 131 and the light-shielding layer 132. The insulating layer 121 may also function as a planarizing layer. Therefore, the surface of the conductive layer 113 can be made approximately flat, which allows for a uniform orientation of the liquid crystal 112.

[0482] Furthermore, in Figure 26, the partition wall 11 overlaps with the region between the two adjacent conductive layers 111. It is located in the region. Furthermore, the partition wall 11 overlaps with the alignment film 133a, the alignment film 133b, the conductive layer 113, etc. They are arranged horizontally. Also, the partition wall 11 is arranged so as not to overlap with the conductive layer 221 or the conductive layer 222. It is positioned.

[0483] Furthermore, a recess 50 is formed in the insulating layer 214. The partition wall 11 is the region that overlaps with the recess 50. It has a structure 14a and a structure 14b of different heights in contact with the conductive layer 113. Each is provided. Structure 14a and structure 14b are arranged to overlap with the recess 50. Furthermore, it is provided so as to be covered by the partition wall 11.

[0484] In the liquid crystal element 40, the conductive layer 111 has the function of reflecting visible light, and the conductive layer 113 is It has the function of transmitting visible light. Light incident from the substrate 31 side is polarized by the polarizing plate 130. It then passes through the conductive layer 113 and the liquid crystal 112, and is reflected by the conductive layer 111. 2 passes through the conductive layer 113 again and reaches the polarizing plate 130. At this time, the conductive layer 111 and The orientation of the liquid crystal 112 is controlled by the voltage applied between the conductive layers 113, thereby controlling the optical modulation of light. This is possible. In other words, it is possible to control the intensity of the light emitted through the polarizing plate 130. This is possible. Also, light is absorbed by the colored layer 131, which absorbs light outside of a specific wavelength range. The resulting light will, for example, be red in color.

[0485] Here, a linear polarizer may be used as the polarizer 130, but a circular polarizer may also be used. For circular polarizers, for example, a plate made by laminating a linear polarizer and a quarter-wavelength phase difference plate can be used. This makes it possible to suppress external light reflection. Also, the polarizing plate 130 Depending on the type, the cell gap, orientation, driving voltage, etc. of the liquid crystal elements used in the liquid crystal element 40 are adjusted. The goal is to achieve the desired contrast by doing so.

[0486] The conductive layer 113 is a conductive layer provided on the substrate 21 side in a portion close to the edge of the substrate 31. It is electrically connected to the F located on the substrate 21 side. Potential and signals can be supplied to the conductive layer 113 from a PC, IC, etc.

[0487] For example, conductive particles can be used as the connector 243. In this case, a material is used in which the surface of particles such as organic resin or silica is coated with a metal material. Yes, it is possible. Using nickel or gold as the metallic material is preferable because it reduces contact resistance. Particles coated in layers of two or more metal materials, such as nickel further coated with gold. It is preferable to use a material that is elastically deformable or plastically deformable as the connecting body 243. It is preferable to use it. In this case, the conductive particles, which are the connectors 243, are as shown in Figure 26. In some cases, it may take on a shape that is flattened in the vertical direction. This allows the connector 243 and the electrical The contact area with the conductive layer that is connected by gas is increased, which reduces contact resistance and also prevents connection failures. This can suppress the occurrence of malfunctions.

[0488] It is preferable that the connecting body 243 be positioned so as to be covered by the adhesive layer 141. For example, hard The connector 243 should be dispersed in the adhesive layer 141 before the transformation process.

[0489] A connection portion 204 is provided in the region near the edge of the substrate 21. The connection portion 204 is It is electrically connected to the FPC36 via the subsequent layer 242. In the configuration shown in Figure 26, the wiring By laminating a portion of 35 with a conductive layer obtained by processing the same conductive film as the conductive layer 111, This shows an example of how the connection section 204 is constructed.

[0490] The above is an explanation of example 3-1 of the cross-sectional configuration.

[0491] [Cross-sectional configuration example 3-2] In the following, as an example of a display device according to one aspect of the present invention, a touch panel equipped with a touch sensor is described. This section explains an example configuration.

[0492] Figure 27 is a schematic cross-sectional view of the display device illustrated below.

[0493] Insulating layers 161, 162, and 163 are sequentially laminated on the substrate 31 facing the substrate 21. It is provided with conductive layers 151 and 152 between insulating layer 161 and insulating layer 162. Furthermore, a conductive layer 153 is provided between the insulating layer 162 and the insulating layer 163. On the substrate 21 side of 3, a light-shielding layer 132, a colored layer 131, etc., are provided.

[0494] The conductive layer 151 and the conductive layer 152 are wiring that constitutes a capacitive touch sensor, respectively. It functions in this way.

[0495] Figure 27 clearly shows the intersection of conductive layer 151 and conductive layer 152. Conductive layer 153 is Through an opening in the insulating layer 162, the two conductive layers 151 sandwiching the conductive layer 152 communicate with each other. They are connected.

[0496] The conductive layer 151 and the conductive layer 152 are provided in the display section at a position that overlaps with the light-shielding layer 132. In addition, in Figure 27, the conductive layer 151 is arranged so as not to overlap with the liquid crystal element 40. This shows an example where the conductive layer 151 has an aperture that overlaps with the liquid crystal element 40. It has a mesh shape. With this configuration, light is incident from the outside and reflected by the liquid crystal element 40. Because the conductive layer 151 is not placed on the path of light that is emitted and then re-emitted to the outside, the conductive layer Placing 151 does not result in any significant decrease in brightness, resulting in high visibility and low power consumption. This enables the realization of a display device with reduced noise. Furthermore, conductive layers 152 and 153 have a similar configuration. It is possible.

[0497] Furthermore, since conductive layers 151, 152, and 153 do not overlap with the liquid crystal element 40, Relatively low-resistance metal materials can be used for these. Therefore, transparent conductive materials can be used for these. Compared to using a different material, the sensitivity of the touch sensor can be improved.

[0498] Furthermore, in Figure 27, the conductive layer 151 and conductive layer 152 (and conductive layer 153) are greater than the substrate 31. The side shows an example in which a light-shielding layer 135 is provided in addition to these. Furthermore, even when a metallic material is used for the conductive layer 151, etc., these external light reflections can be suppressed. Therefore, a touch panel with higher visibility can be realized. Note that here, the light-shielding layer 132 and light-shielding An example was shown in which two light-shielding layers of layer 135 are provided, but a configuration in which only one of them is provided is also shown. That's good too.

[0499] Furthermore, without providing the polarizing plate 130 on the substrate 31, the substrate 31 can be examined by a finger or stylus. It may also be used as a substrate that comes into direct contact with the body. In this case, a protective layer (ceramic) is placed on the substrate 31. It is preferable to provide a protective layer (such as a coating). The protective layer may be, for example, silicon oxide or aluminum oxide. Using inorganic insulating materials such as yttrium oxide and yttria-stabilized zirconia (YSZ) This is possible. Furthermore, tempered glass may be used for the substrate 31. Tempered glass is ion exchange Physical or chemical treatments are applied to the surface through methods such as exchange or air-cooling strengthening, thereby creating compressive stress on the surface. The added components can be used. A touch sensor is placed on one side of the tempered glass, and on the opposite side. By placing this surface on the outermost surface of an electronic device and using it as a touch surface, the overall thickness of the device can be reduced. This can reduce the problem.

[0500] As shown in Figure 27, the liquid crystal element 40, multiple transistors, and touch sensor are configured. By placing a conductive layer between substrate 21 and substrate 31, the number of components is reduced. This allows for the creation of a panel. This type of configuration is called an in-cell type touch panel. It is possible.

[0501] Note that the configuration of the display device that functions as a touch panel is not limited to this; for example, touch A substrate on which a conductive layer or the like that constitutes the sensor is provided is stacked with a display device, for example, as shown in Figure 26. A switch panel may be configured.

[0502] The above is an explanation of example 3-2 of the cross-sectional configuration.

[0503] [Cross-sectional configuration example 3-3] Figure 28 shows the conductive layers 151, 152, etc. that constitute the touch sensor on the substrate 31. This shows an example formed on the opposite side from side 21. Such a configuration is used in on-cell type touch panels. It can be called Nell.

[0504] A conductive layer 151, a conductive layer 152, etc. are formed on the substrate 31, and an insulating layer 1 covers them. A layer 63 is provided. In addition, a conductive layer 153 is provided on the insulating layer 163.

[0505] The substrate 170 is a substrate that functions as a touch surface, and can be used, for example, to integrate a display device into an electronic device. It functions as part of the casing when installed, or as protective glass, etc. Circuit board 170 and circuit board 31 and They are bonded together by an adhesive layer 165.

[0506] Here, in Figure 28, the conductive layer 151 overlaps not only with the light-shielding layer 132, but also with the liquid crystal element. 40. This shows an example where it is also placed in a region that overlaps with the colored layer 131, etc. In this case, conductivity The layer 151 can be made of a material that transmits visible light. For example, a film containing a metal oxide. or films containing graphene, or films containing metals or alloys that are thin enough to transmit visible light, etc. This can be used in the conductive layer 151. The same applies to the conductive layer 152. Alternatively, the conductive layer 153 may also be made of a material that transmits similar visible light, but the conductive layer 153 may be light-shielding. When layer 132 is placed on top of the conductive layer 153, or when the area of ​​the conductive layer 153 is extremely small, metal Materials that block visible light, such as alloys, may also be used.

[0507] The above is an explanation of example 3-3 of the cross-sectional configuration.

[0508] [Configuration Example 4] In the following, we will describe a configuration example 2 which has both a reflective liquid crystal element and a light-emitting element, and a transparent mode A more specific cross-sectional example of a display device capable of displaying both color and reflection modes. I will explain this.

[0509] [Cross-sectional configuration example 4-1] Figure 29 shows a schematic cross-sectional view of the display device illustrated below. The display device shown in Figure 29 is... This corresponds to the display device exemplified in 7(A).

[0510] The display device has an insulating layer 220 between substrate 21 and substrate 31. Between layers 220 are light-emitting element 60, transistor 205, transistor 206, and colored layer 13. It has four components. Also, between the insulating layer 220 and the substrate 31, there is a liquid crystal element 40, a colored layer 131, and a partition wall. 11. It has a structure 14, etc. The substrate 31 and the insulating layer 220 are bonded via an adhesive layer 141. The substrate 21 and the insulating layer 220 are bonded together via the adhesive layer 142. 0 has a recess 50.

[0511] The liquid crystal element 40 is a reflective liquid crystal element. The liquid crystal element 40 consists of a conductive layer 111a and liquid crystal 11 2. It has a laminated structure in which conductive layers 113 are stacked. Also, the conductive layer 111a is in contact with the substrate 21 side. Furthermore, a conductive layer 111b that reflects visible light is provided. The conductive layer 111b is located at the opening 251 It has the following properties. Furthermore, the conductive layer 111a and the conductive layer 113 contain a material that transmits visible light.

[0512] The light-emitting element 60 is a bottom-emission type light-emitting element. The light-emitting element 60 has an insulating layer 2 A laminated structure in which conductive layer 191, EL layer 192, and conductive layer 193b are stacked in that order from the 20 side. It has a conductive layer 193a covering the conductive layer 193b. b contains a material that reflects visible light, and conductive layers 191 and 193a transmit visible light. Includes materials. The light emitted by the light-emitting element 60 is transmitted through the colored layer 134, the insulating layer 220, the aperture 251, and the guide It is ejected towards the substrate 31 via the electrolytic layer 113, etc.

[0513] Furthermore, an insulating layer 217 is provided on the insulating layer 216 that covers the edge of the conductive layer 191. The insulating layer 217 acts as a spacer to prevent the insulating layer 220 and the substrate 21 from coming into excessively close proximity. It also functions as a shielding mask (metal mask) for the EL layer 192 and conductive layer 193a. When formed using ), a function is provided to suppress contact between the shielding mask and the surface to be formed. It may have [a certain feature]. Furthermore, the insulating layer 217 may be omitted if it is not needed.

[0514] Either the source or drain of transistor 205 is connected to the light-emitting element 6 via the conductive layer 224. It is electrically connected to the conductive layer 191 of 0.

[0515] One of the sources or drains of transistor 206 is connected to the conductive layer 11 via the connector 207. It is electrically connected to 1b. The conductive layer 111b and the conductive layer 111a are provided in contact with each other. These are electrically connected. Here, the connection part 207 is an opening provided in the insulating layer 220 This is the part that connects the conductive layers provided on both sides of the insulating layer 220 via an opening.

[0516] A connection portion 204 is provided in the area where substrate 21 and substrate 31 do not overlap. 04 has the same configuration as the connection part 207. The upper surface of the connection part 204 is the conductive layer 111a A conductive layer obtained by processing the same conductive film is exposed. As a result, the connection part 204 and The FPC36 can be electrically connected via the connecting layer 242.

[0517] A connecting portion 252 is provided in a part of the area where the adhesive layer 141 is provided. In 52, a conductive layer obtained by processing the same conductive film as conductive layer 111a, and conductive layer 11 A portion of 3 is electrically connected by the connector 243. Therefore, a shape is formed on the substrate 31 side. The conductive layer 113 receives signals input from the FPC 36 connected to the substrate 21 side or The electric potential can be supplied via the connection part 252.

[0518] The above is an explanation of example 4-1 of the cross-sectional configuration.

[0519] [Cross-sectional configuration example 4-2] Figure 30 shows a schematic cross-sectional view of the display device illustrated below. The display device shown in Figure 30 is This corresponds to the display device exemplified in 8(A).

[0520] The display device has an insulating layer 220 between substrate 21 and substrate 31. A light-emitting element 60 is provided between the layers 220. A liquid crystal element is provided between the insulating layer 220 and the substrate 31. 40, Transistor 205, Transistor 206, Colored layer 134, Colored layer 131, Light-shielding layer It has 132, partition walls 11, etc.

[0521] In Figure 30, the liquid crystal element 40 is electrically connected to the transistor 206 via the conductive layer 224. An example of a case having a continuous conductive layer 111b and a conductive layer 111a covering the conductive layer 111b is given below. It is showing.

[0522] This also shows an example where the partition wall 11 is arranged in overlap with the light-emitting element 60. The wall 11 is arranged in layers with the colored layer 134, the colored layer 131, the conductive layer 191, etc. The light emitted by element 60 is transmitted through the colored layer 134, the insulating layer 220, the aperture 251, the partition wall 11, and the conductive layer 1 It is ejected to the substrate 31 side via 13, etc.

[0523] The above is an explanation of example 4-2 of the cross-sectional configuration.

[0524] [Cross-sectional configuration example 4-3] Figure 31 shows a schematic cross-sectional view of the display device illustrated below. The display device shown in Figure 31 is This corresponds to the display device exemplified in 3(A).

[0525] Furthermore, the display device shown in Figure 31 differs from the configuration illustrated in Figure 29 in the following respects: They are different. The display device uses transistor 201a instead of transistor 201. It has a ZISTA 201b. In addition, the display device replaces the FPC36 and the connection layer 242 with FP It has C36a, FPC36b, connection layer 242a and connection layer 242b. The display device is , has an adhesive layer 143. The display device also has wiring 35a and wiring 35 instead of wiring 35. b is included. The display device also has insulating layer 261, insulating layer 262, insulating layer 263, insulating layer 26 4. It has an insulating layer 265.

[0526] Transistor 201a drives the pixel circuit, which includes transistor 206, etc. It is a transistor. Also, transistor 201b drives the pixel circuit including transistor 205, etc. It is a transistor.

[0527] FPC36a is electrically connected to wiring 35a via connection layer 242a. FPC36b is electrically connected to wiring 35b via connection layer 242b.

[0528] The adhesive layer 143 adheres the insulating layer 214 and the insulating layer 261. On the side opposite to the adhesive layer 143, there are insulating layers 262, 263, 264, and 3. Layers 265 and others are stacked and provided. Part of the insulating layer 262 is made of transistor 201b and tra Functions as the gate insulating layer of the inverter 205. Insulating layer 263, insulating layer 264, insulating layer 2 65 is provided covering transistors 201b and 205.

[0529] The above is an explanation of example 4-3 of the cross-sectional configuration.

[0530] [About transistors] The following describes an example of a transistor configuration applicable to the above-mentioned display device.

[0531] The transistor 310 illustrated in Figure 32(A) is an example of a bottom-gate transistor. That is the case.

[0532] The transistor 310 has a conductive layer 311 that functions as a gate electrode and a gate insulating layer A portion of the insulating layer 332 that functions, a semiconductor layer 312, and a source electrode or drain electrode One of the conductive layers 313a functions as one, and the other functions as either the source electrode or the drain electrode. It has a conductive layer 313b.

[0533] In Figure 32(A), a transistor 310 is provided on the insulating layer 331. An insulating layer 334 is provided covering the inverter 310, and a conductive layer 321 is provided on the insulating layer 334. The conductive layer 321 is electrically connected to the conductive layer 313b through an opening provided in the insulating layer 334. It is electrically connected and functions as a pixel electrode. Also, in Figure 32(A), the edge of the conductive layer 321 This shows an example having an insulating layer 335 covering it.

[0534] In transistor 310, the conductive layer 311, which functions as the gate electrode, is connected to the semiconductor layer 312. It is also located on the side of the surface to be formed (the side of the insulating layer 331). Furthermore, the insulating layer 332 covers the conductive layer 311. It is provided in this way. Also, the semiconductor layer 312 is provided covering the conductive layer 311. The region of the conductive layer 312 that overlaps with the conductive layer 311 corresponds to the channel formation region. Layer 313a and conductive layer 313b are provided in contact with the upper surface and side edge of semiconductor layer 312, respectively. It's being kicked.

[0535] Furthermore, in the case where the width of the semiconductor layer 312 is greater than that of the conductive layer 311, the transistor 310 An example is shown. With this configuration, conductive layer 311 and conductive layer 313a or conductive layer 3 Since the semiconductor layer 312 is placed between 13b, the conductive layer 311 and the conductive layer 313a or conductive The parasitic capacitance between the electrode and the electrode layer 313b can be reduced.

[0536] Transistor 310 is a channel-etched transistor, and the transistor occupies Because it is relatively easy to reduce the area, it can be suitably used in high-resolution display devices. Cut.

[0537] The transistor 310a shown in Figure 32(B) has different conductivity compared to transistor 310. It differs in that it has layer 314 and insulating layer 336. The conductive layer 314 is on the insulating layer 333. It is provided and has a region that overlaps with the semiconductor layer 312. The insulating layer 336 is located on the conductive layer 314 It is also provided covering the insulating layer 333.

[0538] The conductive layer 314 is located on the opposite side of the conductive layer 311 from the semiconductor layer 312. When the electrode layer 311 is used as the first gate electrode, the conductive layer 314 is used as the second gate electrode. This can be achieved by applying the same potential to conductive layer 311 and conductive layer 314. The on-current of the sta 310a can be increased. Also, the conductive layer 311 and conductive layer 314 By applying a potential to control the threshold voltage to one side and a potential to drive the other side, This allows control of the threshold voltage of transistor 310a.

[0539] Here, it is preferable to use a conductive material containing an oxide as the conductive layer 314. This allows the conductive film constituting the conductive layer 314 to be formed in an oxygen-containing atmosphere. This allows oxygen to be supplied to the insulating layer 333. Preferably, the oxygen gas in the film-forming gas is divided. It is preferable that the ratio be in the range of 90% to 100%. Acid supplied to the insulating layer 333 The element is supplied to the semiconductor layer 312 by subsequent heat treatment, reducing oxygen vacancies in the semiconductor layer 312. It is possible to measure this.

[0540] In particular, it is preferable to use a low-resistance oxide semiconductor for the conductive layer 314. It is preferable to use a hydrogen-releasing insulating film, such as a silicon nitride film, for the insulating layer 336. Hydrogen is supplied to the conductive layer 314 during the deposition of the insulating layer 336 or by subsequent heat treatment. This allows for an effective reduction in the electrical resistance of the conductive layer 314.

[0541] The transistor 310b shown in Figure 32(C) is a top-gate structure transistor. .

[0542] The transistor 310b has a conductive layer 311 that functions as a gate electrode, and a semiconductor layer 312 It is located above (on the opposite side from the surface to be formed). Also, a semiconductor is located on the insulating layer 331. Layer 312 is formed. Also, an insulating layer 332 and a conductive layer 311 are formed on the semiconductor layer 312. These are formed by stacking. In addition, the insulating layer 333 is located on the upper surface and side edges of the semiconductor layer 312. It is provided covering the sides of the insulating layer 333 and the conductive layer 311. The conductive layer 313b is provided on the insulating layer 333. Conductive layer 313a and conductive layer 313b It is electrically connected to the upper surface of the semiconductor layer 312 through an opening provided in the insulating layer 333. It is.

[0543] Note that this is an example where the insulating layer 332 does not exist in the portion that does not overlap with the conductive layer 311. This shows that the insulating layer 332 is provided covering the upper surface and side edges of the semiconductor layer 312. That's fine.

[0544] Transistor 310b is a material of conductive layer 311 and conductive layer 313a or conductive layer 313b Because it is easy to create a rational distance between them, it is possible to reduce the parasitic capacity between them. .

[0545] The transistor 310c shown in Figure 32(D) has different conductivity compared to transistor 310b. It differs in that it has layer 315 and insulating layer 337. The conductive layer 315 is the insulating layer 331 It is provided on top and has a region that overlaps with the semiconductor layer 312. The insulating layer 337 is located on the conductive layer 31 It is provided covering 5 and the insulating layer 331.

[0546] The conductive layer 315 functions as a second gate electrode, similar to the conductive layer 314. Therefore, it is possible to increase the on-current and control the threshold voltage.

[0547] Figure 32(E) shows a configuration in which transistors 310 and 310d are stacked. Transistor 310d is a transistor having a pair of gate electrodes.

[0548] Transistor 310d is a portion of the conductive layer 313b that functions as the first gate electrode, A portion of the insulating layer 333 which functions as the first gate insulating layer, a semiconductor layer 312a, and a source A conductive layer 313c that functions as one of the electrodes and the drain electrode, and a source electrode and a drain A conductive layer 313d that functions as the other electrode, and an insulating layer that functions as a second gate insulating layer. It has a portion of 336 and a conductive layer 314a that functions as a second gate electrode.

[0549] Such a configuration can be suitably applied to circuits that are electrically connected to light-emitting elements. In other words, transistor 310 controls the selected and deselected states of pixels. Used in transistors (also called switching transistors or select transistors), The 310d is a transistor (also known as a driving transistor) that controls the current flowing to the light-emitting element 60. It is preferable to use it for (meaning).

[0550] In the configuration shown in Figure 32(E), the conductive layer 314a is connected through an opening provided in the insulating layer 336. The conductive layer 321 is electrically connected to the insulating layer 334. The conductive layer 314a is electrically connected through the provided opening. The capacitive component between 314a and the semiconductor layer 312a (also called gate capacitance) is the pixel retention capacitance. It can be used as such.

[0551] That concludes the explanation of transistors.

[0552] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0553] (Embodiment 2) This embodiment describes a more specific example of a display device according to one aspect of the present invention. The display device illustrated below has both a reflective liquid crystal element and a light-emitting element, and has both a transmission mode and a reflective mode. This is a display device capable of showing both firing modes.

[0554] [Example Configuration] Figure 33(A) is a block diagram showing an example of the configuration of the display device 400. 0 has multiple pixels 410 arranged in a matrix on the display unit 362. 400 has circuit GD and circuit SD. Also, a plurality of pixels 410 arranged in direction R, and Multiple wires G1, multiple wires G2, multiple wires ANO, and that are electrically connected to circuit GD. It has multiple wiring CSCOMs, as well as multiple pixels 410 arranged in direction C, and circuit S It has multiple wires S1 and multiple wires S2 that are electrically connected to D.

[0555] For simplicity, the configuration shown here has one circuit GD and one circuit SD, but the liquid Circuits GD and SD for driving the crystal element, and circuits GD and SD for driving the light-emitting element They may be provided separately.

[0556] Pixel 410 has a reflective liquid crystal element and a light-emitting element. In pixel 410, the liquid crystal element The child and the light-emitting element have overlapping portions.

[0557] Figure 33(B1) shows an example of the configuration of the conductive layer 311b of the pixel 410. Conductive layer 311 b functions as a reflective electrode of the liquid crystal element in pixel 410. Also, the conductive layer 311b An opening 451 is provided.

[0558] Figure 33(B1) shows the light-emitting element 360 located in the region overlapping with the conductive layer 311b, indicated by a dashed line. This shows that the light-emitting element 360 is arranged in overlap with the opening 451 of the conductive layer 311b. Therefore, the light emitted by the light-emitting element 360 is emitted towards the display surface side through the aperture 451. It can be done.

[0559] In Figure 33(B1), the pixels 410 adjacent to each other in direction R are pixels corresponding to different colors. At this time, as shown in Figure 33(B1), in two pixels adjacent to each other in direction R, aperture 4 The 51s are provided at different positions on the conductive layer 311b so that they are not arranged in a single line. This is preferable. This makes it possible to separate the two light-emitting elements 360, and the light-emitting elements 360 emit light. The phenomenon in which light entering a pixel 410 is incident on the colored layer of an adjacent pixel 410 (also known as crosstalk) This can suppress (u). Also, by arranging two adjacent light-emitting elements 360 apart, Therefore, when differentiating the EL layer of the light-emitting element 360 using a shadow mask, etc. However, this makes it possible to create a display device with high resolution.

[0560] Alternatively, the arrangement shown in Figure 33(B2) may also be used.

[0561] If the ratio of the total area of ​​the aperture 451 to the total area of ​​the non-apertures is too large, the liquid crystal elements will not be used. The display becomes dim. Also, the ratio of the total area of ​​the opening 451 to the total area of ​​the non-openings. If the value is too small, the display using the light-emitting element 360 will become dim.

[0562] Furthermore, the area of ​​the opening 451 provided in the conductive layer 311b, which functions as a reflective electrode, is too small. This reduces the efficiency of the light that can be extracted from the light emitted by the light-emitting element 360.

[0563] The shape of the opening 451 may be, for example, a polygon, a square, an ellipse, a circle, or a cross. It is possible to have long, narrow stripes, slits, or checkerboard patterns. The aperture 451 may be positioned close to adjacent pixels. Preferably, the aperture 451 is the same color. Position the pixels close to the other pixels being displayed. This helps suppress crosstalk.

[0564] [Circuit Configuration Example] Figure 34 is a circuit diagram showing an example configuration of pixel 410. In Figure 34, two adjacent pixels It shows 410.

[0565] Pixel 410 consists of switch SW1, capacitive element C1, liquid crystal element 340, switch SW2, and It has a transistor M, a capacitive element C2, and a light-emitting element 360, etc. Furthermore, the pixel 410 has Wiring G1, G2, ANO, CSCOM, S1, and S2 are electrically connected. They are connected. Also, in Figure 34, the wiring VCOM1 is electrically connected to the liquid crystal element 340. The diagram also shows the wiring VCOM2 that electrically connects to the light-emitting element 360.

[0566] Figure 34 shows an example where transistors are used for switches SW1 and SW2. It is showing.

[0567] Switch SW1 has its gate connected to wiring G1, and either its source or drain connected to wiring S Connected to 1, with the other being either the source or drain, one electrode of the capacitive element C1 and the liquid crystal element 3 One electrode of 40 is connected. The capacitive element C1 has the other electrode connected to the wiring CSCOM. The liquid crystal element 340 has its other electrode connected to the wiring VCOM1.

[0568] Switch SW2 has its gate connected to wiring G2, and either the source or drain is connected to wiring Connected to line S2, the other of the source or drain is one electrode of the capacitive element C2, transient It is connected to the gate of transistor M. Capacitive element C2 has its other electrode connected to the sole of transistor M. Transistor M is connected to either the source or the drain, and to wiring ANO. Transistor M is connected to the source or the drain. The other end of the drain is connected to one electrode of the light-emitting element 360. The light-emitting element 360 is The other electrode is connected to the wiring VCOM2.

[0569] In Figure 34, transistor M has two gates sandwiching a semiconductor, and these are connected. This shows an example where the current that transistor M can supply is increased. It is possible.

[0570] Wiring G1 is used to provide a signal that controls switch SW1 to either a conductive or non-conductive state. This is possible. A predetermined potential can be applied to the wiring VCOM1. A liquid can be applied to the wiring S1. A signal can be provided to control the orientation state of the liquid crystal in the crystal element 340. (Wiring CSC) A predetermined potential can be applied to the OM.

[0571] Wiring G2 is used to provide a signal that controls switch SW2 to either a conductive or non-conductive state. This is possible. A potential difference is generated between wiring VCOM2 and wiring ANO, causing the light-emitting element 360 to emit light. The potentials can be applied to each. Wiring S2 controls the conduction state of transistor M. It can provide signals to control the situation.

[0572] Pixel 410 shown in Figure 34, for example, when displaying in reflection mode, wiring G1 and wiring It is driven by a signal applied to line S1 and displays using optical modulation by the liquid crystal element 340. This is possible. Also, when displaying in transparent mode, the signal to wiring G2 and wiring S2 It is driven by a motor, and the light-emitting element 360 can be illuminated to display information. Also, both modes When driven by this, the signals given to each of the wires G1, G2, S1 and S2 It can be driven by a number.

[0573] In Figure 34, one pixel 410 contains one liquid crystal element 340 and one light-emitting element 360. An example with such a feature has been shown, but it is not limited to this. Figure 35(A) shows one pixel 410. The liquid crystal element 340 and four light-emitting elements 360 (light-emitting elements 360r, 360g, 360b, 3 This shows an example with 60w). Pixel 410 shown in Figure 35(A) is different from Figure 34. A pixel is one that can display full color.

[0574] In Figure 35(A), in addition to the example in Figure 34, wiring G3 and wiring S3 are connected to pixel 410. It is.

[0575] In the example shown in Figure 35(A), for example, four light-emitting elements 360 are colored red (R) and green, respectively. Light-emitting elements exhibiting color (G), blue (B), and white (W) can be used. As the crystal element 340, a reflective liquid crystal element that exhibits white color can be used. Furthermore, when displaying in reflective mode, a highly reflective white display can be used. When displaying in transmissive mode, high color rendering can be achieved with low power consumption.

[0576] Figure 35(B) also shows an example of the configuration of pixel 410. Pixel 410 is connected to conductive layer 3 The light-emitting element 360w overlaps with the opening of 11, and the light-emitting element is arranged around the conductive layer 311. It has an element 360r, a light-emitting element 360g, and a light-emitting element 360b. It is preferable that the light-emitting element 360g and the light-emitting element 360b have approximately the same light-emitting area. stomach.

[0577] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0578] (Embodiment 3) In this embodiment, a display module that can be manufactured using one aspect of the present invention is provided. I will explain.

[0579] The display module 6000 shown in Figure 36 consists of an upper cover 6001 and a lower cover 6002. In between, the touch panel 6004 connected to FPC6003 and the FPC6005 are connected Display panel 6006, frame 6009, printed circuit board 6010, and battery 601 It has 1.

[0580] A display device manufactured using one aspect of the present invention is, for example, used in a display panel 6006. It is possible.

[0581] The upper cover 6001 and the lower cover 6002 are the touch panel 6004 and the display panel. The shape and dimensions can be appropriately modified to match the size of the 6006.

[0582] The touch panel 6004 is a resistive or capacitive touch panel. It can be used superimposed on the panel 6006. Also, without the touch panel 6004, the display It is also possible to give the display panel 6006 a touch panel function.

[0583] Frame 6009 provides protection for the display panel 6006, as well as the movement of the printed circuit board 6010. It has the function of an electromagnetic shield to block electromagnetic waves generated by the operation. The 6009 may also function as a heat sink.

[0584] Printed circuit board 6010 is a power supply circuit and a signal for outputting video signals and clock signals. It has a power processing circuit. The power supply that provides power to the power supply circuit is an external commercial power supply. Alternatively, a separate battery 6011 may be used as the power source. This can be omitted when using commercial power.

[0585] Furthermore, the display module 6000 includes components such as polarizing plates, phase difference plates, and prism sheets. They may also be provided.

[0586] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0587] (Embodiment 4) In this embodiment, an electronic device and a lighting device according to one aspect of the present invention will be described with reference to the drawings. I will reveal it.

[0588] Electronic devices and lighting devices can be manufactured using a display device according to one aspect of the present invention. Using this type of display device, it is possible to manufacture curved, highly reliable electronic and lighting devices. Furthermore, using a display device according to one aspect of the present invention, a flexible and highly reliable electronic device or lighting device can be used. It is possible to create a stand.

[0589] Examples of electronic devices include television equipment, desktop or notebook computers, etc. Computer monitors, digital cameras, digital video cameras, etc. Cameras, digital photo frames, mobile phones, portable game consoles, personal digital assistants, audio players Examples include live-action devices and large-scale game machines such as pachinko machines.

[0590] An electronic device or lighting device according to one aspect of the present invention can be used on the interior or exterior walls of a house or building. Alternatively, it can be incorporated along the curved surfaces of the interior or exterior of a vehicle.

[0591] An electronic device according to one aspect of the present invention may have a secondary battery and uses contactless power transmission. It is preferable that the secondary battery can be recharged.

[0592] Examples of secondary batteries include lithium polymer batteries (lithium-ion batteries) that use a gel-like electrolyte. Lithium-ion secondary batteries such as polymer batteries, nickel-metal hydride batteries, nickel-cadmium batteries, organic Examples include radical batteries, lead-acid batteries, air-based rechargeable batteries, nickel-zinc batteries, and silver-zinc batteries. ru.

[0593] An electronic device according to one aspect of the present invention may have an antenna. The antenna receives a signal. This allows the display unit to show images, information, etc. Also, the electronic device acts as an antenna. Furthermore, if a secondary battery is present, the antenna may be used for contactless power transmission.

[0594] An electronic device according to one aspect of the present invention includes a sensor (force, displacement, position, velocity, acceleration, angular velocity, rotation). Number, distance, light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power (including functions for measuring radiation, flow rate, humidity, gradient, vibration, odor, or infrared radiation) It is acceptable to have it.

[0595] An electronic device according to one aspect of the present invention can have various functions. For example, various information Functions to display (still images, videos, text images, etc.) on the display unit, touch panel function, calendar Functions to display the date or time, and to run various software (programs). Functions include: wireless communication, and reading programs or data recorded on a recording medium. It can have functions, etc.

[0596] Furthermore, in electronic devices having multiple display units, one display unit primarily displays image information. A function that displays one display unit and primarily displays text information on another display unit, or multiple display units It can have functions such as displaying three-dimensional images by displaying images that take parallax into account. Furthermore, in electronic devices having an image receiving unit, the function of taking still images or videos, Functions to automatically or manually correct shadowed images, and to record captured images on a recording medium (external or electronic). It can have functions such as saving to a built-in device and displaying captured images on the display unit. It is possible. However, the functions of an electronic device according to one aspect of the present invention are not limited to these, and various functions It can have.

[0597] Figures 37(A) to (E) show an example of an electronic device having a curved display unit 7000. The display unit 7000 has a curved display surface, and displays are performed along the curved display surface. This is possible. Furthermore, the display unit 7000 may be flexible.

[0598] The display unit 7000 is manufactured using a display device or the like according to one aspect of the present invention. This makes it possible to provide highly reliable electronic devices equipped with a curved display.

[0599] Figures 37(A) and (B) show examples of mobile phones. Figure 37(A) shows mobile phone 71. The mobile phone 7110 shown in Figure 00 and Figure 37(B) consists of a housing 7101 and a display unit 7, respectively. 000, Operation button 7103, External connection port 7104, Speaker 7105, Microphone 71 It has 06, etc. The mobile phone 7110 shown in Figure 37(B) further has a camera 7107 To possess.

[0600] Each mobile phone is equipped with a touch sensor on the display unit 7000. (This allows you to make or write calls.) All operations, such as inputting data, are performed by touching the display unit 7000 with your finger or stylus. It is possible to do so.

[0601] Furthermore, the power can be turned ON or OFF by operating the operation button 7103, and the display unit 7000 You can switch the type of image displayed. For example, from the email composition screen, You can switch to the menu screen.

[0602] Furthermore, a detection device such as a gyro sensor or accelerometer is installed inside the mobile phone. Then, it determines the orientation of the mobile phone (vertical or horizontal) and automatically adjusts the orientation of the display on the display unit 7000. It can be made to switch dynamically. Also, the orientation of the screen display can be switched by the display unit. Touching the 7000, operating the control button 7103, or using the microphone 7106 for voice input. This can also be done by inputting information, etc.

[0603] Figures 37(C) and (D) show an example of a personal digital assistant (PDTA). Figure 37(C) shows a personal digital assistant. The portable information terminal 7210 shown in Figure 37(D) consists of the housing 7201 and, respectively, the housing 7201 and It has a display unit 7000. Furthermore, it has operation buttons, an external connection port, a speaker, a microphone, and It may have a tank, camera, or battery, etc. The display unit 7000 has a touch sensor. It is equipped with a stylus. The mobile information terminal is operated by touching the display unit 7000 with a finger or stylus. It can be done in this way.

[0604] The portable information terminal exemplified in this embodiment is, for example, a telephone, a notebook, or an information viewing device. It has one or more functions selected from among them. Specifically, as a smartphone, This can be used. The portable information terminal exemplified in this embodiment is, for example, a mobile phone, an electric phone. Email, document viewing and creation, music playback, internet communication, computer games, etc. It can run various applications.

[0605] The personal digital assistant 7200 and personal digital assistant 7210 display text and image information, etc., on their multiple devices. It can be displayed on the surface. For example, as shown in Figures 37(C) and (D), three operation buttons The information 7202, represented by a rectangle, can be displayed on one side, and the information 7203, represented by a rectangle, can be displayed on the other side. Figure 37(C) shows an example where information is displayed on the top surface of a mobile information terminal, and Figure 37(D) Now, let's look at an example where information is displayed on the side of a mobile device. Also, let's look at an example where information is displayed on three or more sides of a mobile device. Information may be displayed there.

[0606] For example, notifications from social networking services (SNS) are an example of this type of information. , a display indicating incoming emails or phone calls, the subject or sender name of emails, etc. This includes the date, time, battery level, and antenna signal strength. Alternatively, the information may be displayed. Instead of information, you may display operation buttons, icons, or other elements in the same location.

[0607] For example, a user of the personal digital assistant 7200 would carry the personal digital assistant 7200 in the breast pocket of their clothing. With the device stored, you can check its display (information 7203 in this case).

[0608] Specifically, the mobile information terminal 7200 records the caller's phone number or name, etc., of the incoming call. It will be displayed in a position where it can be observed from above. The user will take the 7200 personal information terminal out of their pocket. Without having to take it out, you can check the display and decide whether or not to answer the call.

[0609] Figure 37(E) shows an example of a television system. The television system 7300 consists of a housing 7 The display unit 7000 is incorporated into 301. Here, the stand 7303 connects to the housing 7 This shows the configuration that supported 301.

[0610] The operation of the television device 7300 shown in Figure 37(E) is performed using the operating system provided on the housing 7301. This can be done via a switch or a separate remote control unit 7311. Alternatively, the display unit 70 00 may be equipped with a touch sensor, and can be operated by touching the display unit 7000 with a finger, etc. This is also acceptable. The remote control unit 7311 displays the information output from the remote control unit 7311. It may have a display unit that shows the following. The remote control unit 7311 has operation keys or touch The control panel allows you to operate the channel and volume, and the information displayed on the display unit 7000 is shown. You can manipulate the displayed video.

[0611] The television system 7300 will consist of a receiver and a modem, etc. The device can receive regular television broadcasts. It can also receive broadcasts via a modem via wired or By connecting to a wireless communication network, one-way communication (from sender to receiver) or It is also possible to communicate information in two directions (between a sender and receiver, or between receivers). be.

[0612] Figure 37(F) shows an example of a lighting device having a curved light-emitting section.

[0613] The light-emitting part of the lighting device shown in Figure 37(F) uses a display device or the like according to one aspect of the present invention. A reliable lighting device is manufactured according to one aspect of the present invention, which includes a curved light-emitting section. We can provide this.

[0614] The light-emitting section 7411 of the lighting device 7400 shown in Figure 37(F) has two convexly curved parts The light-emitting parts are arranged symmetrically. Therefore, the lighting device 7400 is centered around It can illuminate in all directions.

[0615] Furthermore, the light-emitting part of the lighting device 7400 may be flexible. The light-emitting surface of the light-emitting part is fixed with a component or a movable frame or other component, and the light-emitting surface of the light-emitting part can be freely adjusted according to the application. It may also be configured to be flexible.

[0616] The lighting device 7400 includes a base 7401 equipped with an operating switch 7403, and on the base 7401 It has a supported light-emitting part.

[0617] Here, we have provided an example of a lighting device in which the light-emitting part is supported by a base, but the light-emitting part The enclosure equipped with this feature can also be fixed to the ceiling or suspended from the ceiling. Because the light-emitting surface can be curved, it is possible to curve the light-emitting surface into a concave shape to illuminate a specific area. It can illuminate a room with a light source, or the light-emitting surface can be curved into a convex shape to brightly illuminate the entire room.

[0618] Figures 38(A) to (I) show a display section 7001 that is flexible and can be bent. An example of a personal digital assistant (PDA) is shown.

[0619] The display unit 7001 is manufactured using a display device or the like according to one aspect of the present invention. For example, the curvature half This can be used for display devices and the like that can be bent to a diameter of 0.01 mm or more and 150 mm or less. The display unit 7001 may also be equipped with a touch sensor, and the display unit 7001 can be touched with a finger or the like. A mobile information terminal can be operated with this. According to one aspect of the present invention, a flexible display It is possible to provide electronic equipment that is equipped with a reliable component.

[0620] Figures 38(A) and (B) are perspective views showing an example of a personal digital assistant (PDA). Personal digital assistant 75 00 represents the housing 7501, display unit 7001, pull-out member 7502, operation buttons 7503, etc. It has.

[0621] The portable information terminal 7500 has a flexible display unit wound in a roll inside the housing 7501. It has a 7001. The display unit 7001 can be pulled out using the pull-out member 7502. ru.

[0622] Furthermore, the 7500 portable information terminal is capable of receiving video signals via its built-in control unit, and it can receive The generated video can be displayed on the display unit 7001. In addition, the portable information terminal 7500 has It has a built-in battery. Furthermore, the 7501 housing has a terminal section for connecting a connector, and the display... The image signal and power may also be supplied directly from an external source via a wired connection.

[0623] Additionally, the 7503 control button allows you to turn the power on and off, and switch the displayed image. These can be performed. Note that in Figures 38(A) and (B), the side of the mobile information terminal 7500 An example is shown in which the operation buttons 7503 are placed on the surface, but this is not the only example, for the portable information terminal 7500. It may be placed on the same side as the display surface (the front side) or on the back side.

[0624] Figure 38(B) shows the portable information terminal 7500 with the display unit 7001 extended. In this state, video can be displayed on the display unit 7001. Also, part of the display unit 7001 Figure 38(A) shows the rolled-up state, and Figure 38(B) shows the display unit 7001 pulled out. The mobile information terminal 7500 may be configured to display different information depending on the state. For example, see Figure 38. (A) When the rolled portion of the display unit 7001 is in state (A), This can reduce the power consumption of the 7500 mobile information terminal.

[0625] Furthermore, when the display unit 7001 is pulled out, the display surface of the display unit 7001 becomes flat. To secure it, a reinforcing frame may be provided on the side of the display unit 7001.

[0626] In addition to this configuration, a speaker is installed in the enclosure, and the audio signal received along with the video signal is used. It would also be possible to configure it to output audio.

[0627] Figures 38(C) to (E) show an example of a foldable portable information terminal. Figure 38(C) In Figure 38(D), the unfolded state is shown, or in either the unfolded or folded state. In Figure 38(E), the portable information terminal 76 is in a state in the process of changing to the other state, in the folded state. It indicates 00. The portable information terminal 7600 is highly portable when folded, and when unfolded... In this configuration, the seamless, wide display area provides excellent readability.

[0628] The display unit 7001 is supported by three housings 7601 connected by hinges 7602. It is. By bending the two housings 7601 via the hinge 7602, portable information The 7600 device can be reversibly transformed from an unfolded state to a folded state.

[0629] Figures 38(F) and (G) show an example of a foldable portable information terminal. Figure 38(F) In Figure 38(G), the display unit 7001 is folded inwards. This shows the 7650 mobile information terminal in a folded state with 7001 on the outside. The terminal 7650 has a display unit 7001 and a non-display unit 7651. When not in use, the display unit 7001 is folded inwards. It can suppress dirt and scratches.

[0630] Figure 38(H) shows an example of a flexible portable information terminal. Portable information terminal 7700 is It has a housing 7701 and a display unit 7001. Furthermore, it has an input means, a button 7703a 7703b, speaker 7704a, 7704b which is an audio output means, external connection port 7 It may also have 705, microphone 7706, etc. Furthermore, the portable information terminal 7700 is flexible A battery 7709 having the following can be installed. The battery 7709 is, for example, a display unit 7 It may be placed on top of 001.

[0631] The housing 7701, the display unit 7001, and the battery 7709 are flexible. Therefore, To curve the personal digital assistant 7700 into a desired shape, and to twist the personal digital assistant 7700 It is easy to add this. For example, the portable information terminal 7700 has a display unit 7001 inside Alternatively, it can be folded outwards for use. It can also be used in a rolled state. In this way, the housing 7701 and the display unit 7 Because 001 can be freely deformed, the mobile information terminal 7700 will not fall if it is dropped. Furthermore, it has the advantage of being less prone to damage even if unintended external forces are applied.

[0632] Furthermore, because the 7700 portable information terminal is lightweight, the top of the 7701 casing can be held with a clip or similar. Do not use by holding it and hanging it, or by fixing the 7701 enclosure to a wall with magnets or the like. It can be used conveniently in a variety of situations.

[0633] Figure 38(I) shows an example of a wristwatch-type personal information terminal. The personal information terminal 7800 is a van. It has a dome 7801, a display unit 7001, input / output terminals 7802, operation buttons 7803, etc. The 7801 has the function of a housing. The portable information terminal 7800 has flexibility. The battery 7805 can be installed. The battery 7805 is, for example, installed in the display unit 70 It may be placed in conjunction with 01 or band 7801, etc.

[0634] The band 7801, the display unit 7001, and the battery 7805 are flexible. Furthermore, the 7800 portable information terminal can be easily bent into a desired shape.

[0635] The 7803 control button is used for time setting, power on / off, wireless communication on, and more. Various functions such as operation, activation and deactivation of silent mode, and activation and deactivation of power saving mode. It can be made to hold it. For example, the operating system built into the personal digital assistant 7800 The system also allows you to freely configure the function of the control button 7803.

[0636] Furthermore, by touching the icon 7804 displayed on the display unit 7001 with your finger, etc., the application You can start the application.

[0637] Furthermore, the 7800 portable information terminal can perform short-range wireless communication compliant with communication standards. It is possible. For example, by communicating with a wireless headset, hands-free communication is possible. You can also make calls using Lee.

[0638] Furthermore, the personal information terminal 7800 may also have an input / output terminal 7802. If 802 is present, data can be exchanged directly with other information terminals via a connector. This is possible. Furthermore, charging can also be performed via the input / output terminal 7802. Note that this implementation... The charging operation of the portable information terminal exemplified by its form is performed by contactless power transmission without using input / output terminals. You may go.

[0639] Figure 39(A) shows the exterior of the automobile 7900. Figure 39(B) shows the driver's seat of the automobile 7900. This shows that the automobile 7900 consists of the body 7901, wheels 7902, windshield 7903, and It includes parts such as light 7904 and fog lamp 7905.

[0640] A display device according to one aspect of the present invention can be used in the display unit of an automobile 7900, etc. For example, the display units 7910 to 7917 shown in Figure 39(B) are equipped with a display device according to one embodiment of the present invention. A space can be provided.

[0641] Display units 7910 and 7911 are mounted on the windshield of the automobile. In one embodiment, the electrodes of the display device are made of a light-transmitting conductive material. Therefore, it can be used as a display device that is transparent, allowing the other side to be seen through, a so-called see-through display device. If the display device is transparent, it will not obstruct the driver's view when driving a car 7900. Therefore, a display device according to one aspect of the present invention is installed on the windshield of an automobile 7900. It is possible. Furthermore, if transistors or the like are provided in the display device, organic semiconductors are used. Transmissive materials such as organic transistors or oxide semiconductors It is advisable to use a transistor that has [a certain characteristic].

[0642] The display unit 7912 is located on the pillar. The display unit 7913 is located on the dashboard. It is provided in the vehicle. For example, the image from the imaging means provided on the vehicle body is displayed on the display unit 7912. By doing so, the field of view obstructed by the pillar can be compensated for. Similarly, the display unit 7 In the 913, the view obstructed by the dashboard can be compensated for, and in the display unit 7914 This can compensate for the view obstructed by the door. In other words, a camera mounted on the outside of the car By displaying images from imaging devices, blind spots can be compensated for, thereby enhancing safety. Furthermore, by displaying images that fill in the gaps in the unseen areas, safety checks can be performed more naturally and without any sense of unease. It is possible to do so.

[0643] Furthermore, the display unit 7917 is located on the handle. Display unit 7915, display unit 791 6, or the display unit 7917, shows navigation information, speedometer, tachometer, and distance. It can provide various information such as distance traveled, fuel level, gear status, and air conditioning settings. It can be customized to the user's preferences. Furthermore, the display items and layout shown on the display unit can be customized to the user's preferences. The above information can be changed as appropriate. It can also be displayed.

[0644] Furthermore, display units 7910 to 7917 can also be used as lighting devices.

[0645] The display unit to which a display device according to one aspect of the present invention is applied may be planar. In this case, the present invention A display device in one embodiment may have a configuration that does not have curved surfaces or flexibility.

[0646] Figures 39(C) and (D) show digital signage. An example of a sub-sign is shown. The digital signage consists of a housing 8000, a display unit 8001, and a sub-sign. It has a Pika 8003, etc. Furthermore, it has an LED lamp, an operation key (power switch, or operation key). It may include a switch, connection terminals, various sensors, a microphone, etc.

[0647] Figure 39(D) shows a digital signage display mounted on a cylindrical column.

[0648] The larger the display unit 8001, the more information can be provided at once. The wider the display area 8001, the more easily it catches people's attention, which can, for example, enhance the effectiveness of advertising. can.

[0649] By applying a touch panel to the display unit 8001, images or videos can be displayed on the display unit 8001. It is desirable that it not only displays information but also allows users to operate it intuitively. Furthermore, route information... Alternatively, if used for purposes such as providing traffic information, intuitive operation is possible. This can improve usability.

[0650] The portable game console shown in Figure 39(E) consists of a casing 8101, a casing 8102, and a display unit 8103. Display unit 8104, microphone 8105, speaker 8106, operation key 8107, It includes the Tyrus 8108, etc.

[0651] The portable game console shown in Figure 39(E) has two display units (display unit 8103 and display unit 810 4) It has. Note that the number of display units in an electronic device according to one aspect of the present invention is not limited to two. It may be one or three or more. When an electronic device has multiple display units, at least At least one display unit may have a display device according to one aspect of the present invention.

[0652] Figure 39(F) shows a notebook personal computer, consisting of a casing 8111 and a display unit 811 2. It includes a keyboard 8113, a pointing device 8114, etc.

[0653] A display device according to one embodiment of the present invention can be applied to the display unit 8112.

[0654] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination. [Explanation of Symbols]

[0655] 10 Display device 10a Touch Panel 11 Bulkhead 12 LCD 13 Monomers 14 Structure 14a Structure 14b Structure 15 Touch sensor panel 16 FPC 20 light 20a Light 21 circuit boards 23 Conductive layer 23a Conductive layer 23b Conductive layer 24 liquid crystal layers 25 Conductive layer 30 Irradiation area 31 circuit boards 32 Display section 34 circuits 35 Wiring 35a wiring 35b Wiring 36 FPC 36a FPC 36b FPC 37 IC 38 Diffuser 39 Polarizing plate 40 Click the LCD button 41a Substrate 41b Circuit board 42a Adhesive layer 42b Adhesive layer 43a Detachment layer 43b Delamination layer 43c Delamination layer 43d Delamination layer 44a Support board 44b Support board 44c support board 44d Support board 44e Support board 44f Support board 45a Resin layer 45b Resin layer 46a Adhesive layer 50 recesses 51a Colored layer 51b Colored layer 52 Light blocking layer 53a Orientation film 53b Orientation film 60 light-emitting elements 61 Insulating layer 62 Insulating layer 70 transistors 70a transistor 70b Transistor 71 Conductive layer 71a Conductive layer 71b Conductive layer 72 Semiconductor layer 73 Insulating layer 74a Conductive layer 74b Conductive layer 75 Capacitive elements 78 Conductive layer 79 Insulating layer 80 Connection part 81 Insulating layer 82 Insulating layer 83 Insulating layer 84 Insulating layer 85 Insulating layer 86 Insulating layer 87 Insulating layer 88 Insulating layer 89 Adhesive layer 90 light-emitting elements 91 Conductive layer 92 EL layer 93 Conductive layer 93a Conductive layer 93b Conductive layer 95 Resist Mask 99 Adhesive layer 111 Conductive layer 111a Conductive layer 111b Conductive layer 112 LCD 113 Conductive layer 121 Insulating layer 130 Polarizing plate 131 Colored layer 132 Light blocking layer 133a Orientation film 133b Alignment film 134 Colored layer 135 Light blocking layer 141 Adhesive layer 142 Adhesive layer 143 Adhesive layer 151 Conductive layer 152 Conductive layer 153 Conductive layer 161 Insulating layer 162 Insulating layer 163 Insulating layer 165 Adhesive layer 170 circuit boards 191 Conductive layer 192 EL layer 193a conductive layer 193b Conductive layer 201 Transistors 201a Transistor 201b Transistor 202 transistors 203 Capacitive element 204 Connection part 205 transistors 206 transistors 207 Connection part 211 Insulating layer 212 Insulating layer 213 Insulating layer 214 Insulating layer 216 Insulating layer 217 Insulating layer 220 Insulating layer 221 Conductive layer 222 Conductive layer 224 Conductive layer 231 Semiconductor layer 242 Connecting Layers 242a Connecting Layer 242b Connecting Layer 243 Connectors 251 Aperture 252 Connection part 261 Insulating layer 262 Insulating layer 263 Insulating layer 264 Insulating layer 265 Insulating layer 310 transistors 310a Transistor 310b transistor 310c transistor 310d Transistor 311 Conductive layer 311b Conductive layer 312 Semiconductor layer 312a Semiconductor layer 313a conductive layer 313b Conductive layer 313c conductive layer 313d conductive layer 314 Conductive layer 314a conductive layer 315 Conductive layer 321 Conductive layer 331 Insulating layer 332 Insulating layer 333 Insulating layer 334 Insulating layer 335 Insulating layer 336 Insulating layer 337 Insulating layer 340 LCD buttons 360 light-emitting elements 360b light-emitting element 360g light-emitting element 360r light-emitting element 360W light-emitting element 362 Display section 400 display device 410 pixels 451 Aperture 6000 Display Module 6001 Top cover 6002 Lower cover 6003 FPC 6004 Touch Panel 6005 FPC 6006 Display Panel 6009 Frame 6010 Printed Circuit Board 6011 Battery 7000 Display 7001 Display section 7100 Mobile Phone 7101 enclosure 7103 Operation Buttons 7104 External connection port 7105 Speaker 7106 Microphone 7107 Camera 7110 Mobile phone 7200 Mobile Information Terminal 7201 enclosure 7202 Operation Buttons 7203 Information 7210 Mobile Information Terminal 7300 Television equipment 7301 enclosure 7303 Stand 7311 Remote Control Unit 7400 Lighting device 7401 Daibu 7403 Operation switch 7411 Light-emitting part 7500 Mobile Information Terminals 7501 enclosure 7502 component 7503 Operation Buttons 7600 Mobile Information Terminal 7601 enclosure 7602 Hinge 7650 Mobile Information Terminal 7651 Hidden part 7700 Mobile Information Terminal 7701 enclosure 7703a button 7703b button 7704a speaker 7704b speaker 7705 External connection port 7706 Mike 7709 Battery 7800 Mobile Information Terminal 7801 Band 7802 Input / output terminal 7803 Operation Buttons 7804 Icon 7805 Battery 7900 automobiles 7901 Car body 7902 Wheel 7903 Windshield 7904 Light 7905 Fog Lights 7910 Display section 7911 Display section 7912 Display section 7913 Display section 7914 Display section 7915 Display section 7916 Display section 7917 Display section 8000 units 8001 Display section 8003 Speaker 8101 enclosure 8102 enclosure 8103 Display section 8104 Display section 8105 Microphone 8106 speaker 8107 Operation Keys 8108 Stylus 8111 enclosure 8112 Display section 8113 Keyboard 8114 Pointing device

Claims

[Claim 1] A display device having a first electrode, a liquid crystal layer, a light-shielding layer, and an insulating layer, The first electrode has the function of reflecting visible light and blocking ultraviolet light. The first electrode is provided on the insulating layer, The liquid crystal layer has a first portion that overlaps with the first electrode and a second portion that surrounds a part of the first portion. The second portion overlaps with the light-shielding layer, The first part includes a monomer and a liquid crystal, The second portion includes a polymer obtained by polymerization of the monomers, Display device.

Images