Chamber, film deposition apparatus, and manufacturing method

Abstract

This technology provides advantages in maintaining a vacuum atmosphere within the chamber's internal space. [Solution] A chamber for maintaining an internal space in a vacuum atmosphere is provided, comprising: an opening that connects the internal space and an external space; an upper wall portion for defining the internal space; a support shaft connecting a first member disposed in the internal space and a second member disposed in the external space via the opening; a bellows provided in the opening so as to cover the support shaft; and a receiving member disposed in the internal space for receiving particles generated by the bellows via the opening.

Description

Technical Field

[0001] The present invention relates to a chamber, a film forming apparatus, and a manufacturing method.

Background Art

[0002] Organic EL display devices (organic EL displays) are applied to, for example, smartphones, TVs, automotive displays, VR HMDs (Virtual Reality Head Mount Displays), and the like. When manufacturing an organic EL display device, it is necessary to form an organic light emitting element (organic EL element: OLED) that constitutes the organic EL display device.

[0003] As a manufacturing apparatus for such an organic EL display device, a film forming apparatus that transports a substrate into a film forming chamber and performs film formation (film forming process) on the substrate through a mask is used. In the film forming apparatus, an alignment process and a film forming process for aligning the mask and the substrate are performed inside a chamber held in a vacuum (vacuum atmosphere), and inside the chamber, it is necessary to adsorb the substrate supported by a substrate support portion to an adsorption plate such as an electrostatic chuck. Therefore, for example, a film forming apparatus having a lifting plate that lifts and lowers the adsorption plate and a support shaft that connects the lifting plate and the adsorption plate through an opening in the upper wall portion of the chamber has been proposed (see Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a film deposition apparatus, a bellows is provided to cover a support shaft that connects components located inside the chamber, such as suction plates, to components located outside the chamber, such as lifting plates, in order to maintain a vacuum inside the chamber. However, the bellows can generate particles (such as dust) due to the movement of the support shaft, and these particles can enter the chamber through the opening in the upper wall, affecting the vacuum atmosphere and potentially contaminating the inside of the chamber.

[0006] This invention has been made in view of the problems of the prior art, and its exemplary objective is to provide a technique that is advantageous for maintaining a vacuum atmosphere in the internal space of a chamber. [Means for solving the problem]

[0007] To achieve the above objective, a chamber as one aspect of the present invention is a chamber that maintains an internal space in a vacuum atmosphere, and is provided with an opening that connects the internal space and the external space, and is characterized by having an upper wall portion for defining the internal space, a support shaft that connects a first member disposed in the internal space and a second member disposed in the external space via the opening, a bellows provided in the opening so as to cover the support shaft, and a receiving member disposed in the internal space for receiving particles generated by the bellows via the opening.

[0008] Further objects or other aspects of the present invention will be revealed by embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0009] According to the present invention, for example, it is possible to provide a technique that is advantageous for maintaining a vacuum atmosphere in the internal space of a chamber. [Brief explanation of the drawing]

[0010] [Figure 1]This diagram schematically shows a part of the configuration of an electronic device manufacturing line. [Figure 2] This diagram schematically shows the configuration of the film deposition apparatus. [Figure 3] This is a cross-sectional view showing a magnified portion of the upper wall of a vacuum chamber. [Figure 4] This diagram shows the arrangement relationship between the first receiving part and the second receiving part. [Figure 5] This diagram schematically shows the configuration of the film deposition apparatus. [Figure 6] This diagram schematically shows the structure from the support shaft to the suction plate. [Figure 7] This diagram shows the detailed configuration of the support shaft. [Figure 8] This is a diagram illustrating an organic EL display device as an electronic device. [Modes for carrying out the invention]

[0011] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims, and not all combinations of features described in the embodiments are essential to the invention. Two or more features from the multiple features described in the embodiments may be combined arbitrarily. Furthermore, identical or similar configurations will be given the same reference numeral, and redundant descriptions will be omitted.

[0012] Figure 1 is a schematic diagram showing a part of the configuration (layout) of a manufacturing line for an electronic device to which a film deposition apparatus, as one aspect of the present invention, can be applied. The manufacturing line shown in Figure 1 is used, for example, to manufacture a display panel for an organic EL display device for a smartphone, in which substrates 100 are sequentially transported to a film deposition block 301 (film deposition section), and organic EL film deposition is performed on the substrates 100.

[0013] The film deposition block 301 has a transport chamber 302, which has an octagonal shape in plan view, surrounded by multiple film deposition chambers 303a to 303d for performing film deposition on the substrate 100, and a mask storage chamber 305 for storing the masks used in the film deposition process. The transport chamber 302 is equipped with a transport robot 302a for transporting the substrate 100. The transport robot 302a includes a hand for holding the substrate 100 and a multi-joint arm for moving the hand horizontally. In other words, the film deposition block 301 is a cluster-type film deposition unit in which multiple film deposition chambers 303a to 303d are arranged to surround the transport robot 302a. When referring to the film deposition chambers 303a to 303d collectively, or when not specifically distinguishing between them, they are referred to as film deposition chamber 303.

[0014] In the transport direction of the substrate 100 (arrow direction), a buffer chamber 306, a swivel chamber 307, and a transfer chamber 308 are located on the upstream and downstream sides, respectively, of the film deposition block 301. During the manufacturing process, the film deposition chamber 303, mask storage chamber 305, buffer chamber 306, swivel chamber 307, and transfer chamber 308 are each maintained in a vacuum state (vacuum atmosphere). Although only one film deposition block 301 is shown in Figure 1, the configuration is not limited to this. For example, the manufacturing line may have multiple film deposition blocks 301, and the multiple film deposition blocks 301 may be connected by a connecting device consisting of a buffer chamber 306, a swivel chamber 307, and a transfer chamber 308. However, the connecting device may consist of, for example, only a buffer chamber 306 or a transfer chamber 308.

[0015] The transport robot 302a is responsible for transporting the substrate 100 from the upstream transfer chamber 308 to the transport chamber 302 and for transporting the substrate 100 between multiple film deposition chambers 303a to 303d. The transport robot 302a also transports masks between the mask storage chamber 305 and the film deposition chamber 303 and for transporting the substrate 100 from the transport chamber 302 to the downstream buffer chamber 306.

[0016] The buffer chamber 306 is a chamber for temporarily storing the substrate 100 according to the operating status of the manufacturing line. In the buffer chamber 306, a substrate storage shelf, also referred to as a cassette, and a lifting mechanism are provided. The substrate storage shelf has a multi-stage structure capable of storing a plurality of substrates 100 while maintaining the state (horizontal state) in which the film-forming surface of the substrate 100 faces downward in the gravity direction (vertical direction). The lifting mechanism adjusts the stage for loading or unloading the substrate 100 to the conveyance position by raising and lowering the substrate storage shelf. Thus, the buffer chamber 306 has a function of temporarily storing and retaining a plurality of substrates 100.

[0017] In the turning chamber 307, a transfer robot is provided as a mechanism for changing the orientation of the substrate 100. In the present embodiment, in the turning chamber 307, the orientation of the substrate 100 is rotated 180 degrees by the transfer robot provided in the turning chamber 307. The transfer robot provided in the turning chamber 307 supports the substrate 100 carried in from the buffer chamber 306 and turns 180 degrees to unload it into the delivery chamber 308, so that the front end and the rear end of the substrate 100 are interchanged between the buffer chamber 306 and the delivery chamber 308. Therefore, since the orientation when the substrate 100 is loaded into the film-forming chamber 303 is the same in each film-forming block 301, in each film-forming block 301, the scan direction and the orientation of the mask in the film-forming process for the substrate 100 can be made to coincide. As a result, in each film-forming block 301, the orientation of storing the mask in the mask storage chamber 305 can be made uniform, the management of the mask can be simplified, and the usability can be improved.

[0018] The manufacturing line has, as a control system, a host device 300 that controls the entire line as a host computer, and control devices 14a to 14d, 309, and 310 that control each component. The host device 300, the control devices 14a to 14d, 309, and 310 can communicate via a wired or wireless communication line 300a. The control devices 14a to 14d are provided corresponding to each of the plurality of film-forming chambers 303a to 303d, and control the film-forming apparatuses 1 provided in each film-forming chamber. When the control devices 14a to 14d are collectively referred to, or when not particularly distinguished, they are denoted as the control device 14.

[0019] The control device 309 controls the transfer robot 302a. The control device 310 controls the devices provided in the turning chamber 307. The host device 300 transmits instructions such as information regarding the substrate 100 and transfer timings to the control devices 14, 309, and 310. The control devices 14, 309, and 310 control each device based on the instructions received from the host device 300.

[0020] FIG. 2 is a diagram schematically showing the configuration of the film forming apparatus 1 as one aspect of the present invention. The film forming apparatus 1 is provided in the film forming chamber 303. The film forming apparatus 1 performs a film forming process of attaching (depositing) a deposition material on the substrate 100 to form a film. In the present embodiment, a predetermined pattern (thin film of the deposition material) is formed on the film forming surface 100A of the substrate 100 through the mask 101. The material of the substrate 100 can be appropriately selected from materials such as glass, resin, and metal, and a substrate having a resin layer such as polyimide formed on glass is preferably used. As the deposition material, substances such as organic materials and inorganic materials (for example, metals, metal oxides, etc.) are used. The film forming apparatus 1 can be applied to manufacturing apparatuses for manufacturing electronic devices such as display devices (flat panel displays, etc.), thin film solar cells, organic optoelectronic conversion elements (organic thin film imaging elements), and optical members. The film forming apparatus 1 is particularly suitable for a manufacturing apparatus for manufacturing organic EL panels. Here, an example in which the film forming apparatus 1 performs a film forming process on the substrate 100 by vacuum deposition will be described, but the present invention is not limited thereto, and various film forming processes (film forming methods) such as sputtering and CVD can be applied. In each figure, the arrow Z indicates the vertical direction (direction of gravity), and the arrows X and Y indicate horizontal directions orthogonal to each other.

[0021] The film deposition apparatus 1 has a box-shaped vacuum chamber 3. The internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown) to maintain the internal space 3a in a vacuum atmosphere. Note that "vacuum" means a state filled with a gas at a pressure lower than atmospheric pressure, i.e., a reduced pressure state. The vacuum chamber 3 defines the internal space 3a that houses the substrate support unit 6, the mask stand 5 on which the mask 101 is placed, the film deposition unit 4, the plate unit 9, and the suction plate 15.

[0022] The mask 101 has an opening pattern corresponding to the pattern (thin film) to be deposited on the film deposition surface 100A of the substrate 100. The mask 101 is placed on the mask stand 5 and fixed in a predetermined position. The mask stand 5 can be replaced with other mechanisms for fixing the mask 101 in a predetermined position. As the mask 101, a mask having a structure in which a mask foil with a thickness of several μm to several tens of μm is welded to a frame-shaped mask frame can be used. The material of the mask 101 is not particularly limited, but it is preferable to use a metal with a low coefficient of thermal expansion, such as Invar material. The film deposition process is performed with the substrate 100 placed on the mask 101, and the substrate 100 and the mask 101 overlapping each other.

[0023] The plate unit 9 includes a cooling plate 10 and a magnetic plate 11. The cooling plate 10 is suspended below the magnetic plate 11 so as to be displaceable in the Z direction relative to the magnetic plate 11. The cooling plate 10 is a plate-shaped member that has the function of cooling the substrate 100, which is adsorbed by the adsorption plate 15, by contacting the adsorption plate 15 during the film deposition process. The cooling plate 10 is not limited to a plate that actively cools the substrate 100 by including a water cooling mechanism or the like, and may be a plate-shaped member that does not have a water cooling mechanism or the like, but cools the substrate 100 by absorbing heat from the substrate 100 by contacting the adsorption plate 15. The magnetic plate 11 is a plate that attracts the mask 101 by magnetic force. The magnetic plate is positioned above the surface 100B of the substrate 100 opposite to the film deposition surface 100A, and improves the adhesion between the substrate 100 and the mask 101 during the film deposition process. However, the cooling plate 10 and the magnetic plate 11 (plate unit 9) are not necessarily required to be provided. For example, if the suction plate 15 is equipped with a cooling mechanism, the cooling plate 10 may not be provided. Also, if the suction plate 15 is used to attract the mask 101, the magnetic plate 11 may not be provided.

[0024] The film deposition unit 4 includes a heater, shutter, drive mechanism, evaporation rate monitor, etc., and is a deposition source that deposits (deposits) a deposition material onto the substrate 100. In this embodiment, the film deposition unit 4 is realized as a linear deposition source in which a plurality of nozzles (not shown) are arranged in the X direction and deposit the deposition material upward from each nozzle, and is driven to reciprocate in the Y direction.

[0025] The film deposition apparatus 1 includes a substrate support unit 6, a suction plate 15, a position adjustment unit 20, a distance adjustment unit 22, a plate unit lifting unit 13, a first measurement unit 7, a second measurement unit 8, an adjustment unit 17, and a control device 14 (control unit).

[0026] The substrate support unit 6 (substrate support section) supports the substrate 100, which has been transported into the film deposition apparatus 1 by the transport robot 302a, in a horizontal position. The substrate support unit 6 includes a base section 61 that constitutes its outer frame and a plurality of support sections 62 that protrude inward from the base section 61.

[0027] Multiple support portions 62 are arranged on the base portion 61 along the periphery of the substrate 100, spaced apart from each other. The multiple support portions 62 have the function of supporting the periphery of the film-forming surface 100A of the substrate 100 and are also referred to as "receiving claws" or "finger". Note that the "periphery" does not necessarily include the peripheral edge of the substrate 100. For example, the multiple support portions 62 may support the substrate 100 by contacting a portion of the substrate 100 that is a predetermined distance away from the peripheral edge towards the center of the substrate 100, without contacting the peripheral edge of the film-forming surface 100A of the substrate 100.

[0028] In this embodiment, the multiple support parts 62 are made of leaf springs. Therefore, when attaching the substrate 100, which is supported by the multiple support parts 62, to the suction plate 15, the elastic force of the leaf springs can press the substrate 100 against the suction plate 15. Alternatively, a configuration may be adopted in which multiple clamp parts are provided corresponding to each of the multiple support parts 62, and the substrate 100 is supported by sandwiching it between the multiple support parts 62 and the multiple clamp parts.

[0029] The suction plate 15 is positioned above the substrate support unit 6 (multiple support parts 62) in the internal space 3a of the vacuum chamber 3, and attracts the surface 100B of the substrate 100 supported by the substrate support unit 6. As shown in Figure 2, the suction plate 15 is positioned between the substrate support unit 6 and the plate unit 9 and is supported by one or more support shafts R1. In this embodiment, the suction plate 15 is supported by four support shafts R1. The support shafts R1 are, for example, cylindrical shafts.

[0030] In this embodiment, the suction plate 15 is embodied as an electrostatic chuck that attracts the substrate 100 by electrostatic force. For example, the suction plate 15 has a structure in which an electrical circuit such as metal electrodes is embedded inside a matrix (substrate) made of ceramic material. When positive (+) and negative (-) voltages are applied to the metal electrodes arranged in the electrode arrangement region of the suction plate 15, polarization charges are induced in the substrate 100 via the matrix. As a result, the substrate 100 is attracted (fixed) to the suction surface 150 of the suction plate 15 by the electrostatic attraction (electrostatic force) between the substrate 100 and the suction plate 15. Multiple electrode arrangement regions may be provided on the suction surface 150 of the suction plate 15, spaced apart from each other. Alternatively, one electrode arrangement region may be provided over substantially the entire surface of the suction surface 150 of the suction plate 15.

[0031] The position adjustment unit 20 adjusts the relative position between the substrate 100, which is supported by the substrate support unit 6, or the substrate 100, which is held in place by the suction plate 15, and the mask 101. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 or the suction plate 15 in the XY plane. In other words, the position adjustment unit 20 adjusts the relative horizontal position between the mask 101 and the substrate 100. For example, the position adjustment unit 20 is configured to be able to displace the substrate support unit 6 in rotational directions around the X, Y, and Z axes. In this embodiment, the relative position between the mask 101 and the substrate 100 is adjusted by fixing the position of the mask 101 and displacing the substrate 100. However, the relative position between the mask 101 and the substrate 100 may be adjusted by displacing the mask 101, or by displacing both the substrate 100 and the mask 101.

[0032] The position adjustment unit 20 includes, for example, a fixed plate 20a, a movable plate 20b, and a plurality of actuators 201 positioned between the fixed plate 20a and the movable plate 20b. The fixed plate 20a is fixed to the upper wall 30 of the vacuum chamber 3. A frame-shaped support 21 is placed on the movable plate 20b. The support 21 supports the distance adjustment unit 22 and the plate unit lifting unit 13. When the movable plate 20b is displaced horizontally relative to the fixed plate 20a by the actuators 201, the support 21, the distance adjustment unit 22, and the plate unit lifting unit 13 are displaced together.

[0033] The multiple actuators 201 include, for example, actuators capable of displacing the movable plate 20b in the X direction and actuators capable of displacing the movable plate 20b in the Y direction. By driving (controlling) the multiple actuators 201, the movable plate 20b can be displaced in a rotational direction around the axes in the X, Y, and Z directions. For example, each of the multiple actuators 201 includes a motor that is a driving source, a ball screw mechanism that converts the driving force of the motor into linear motion, etc.

[0034] The distance adjustment unit 22 has the function of adjusting the distance between the suction plate 15 and the substrate support unit 6 and the mask base 5 by raising and lowering the suction plate 15 and the substrate support unit 6. In this embodiment, the distance adjustment unit 22 moves the substrate 100 and the mask 101 closer together and further apart in the thickness direction (Z direction) of the substrate 100. In other words, the distance adjustment unit 22 moves the substrate 100 and the mask 101 closer together in the direction of overlapping, or further apart in the opposite direction. The "distance" adjusted by the distance adjustment unit 22 is the vertical distance. Therefore, the distance adjustment unit can also be said to be a unit that adjusts the relative position of the mask 101 and the substrate 100 in the vertical direction.

[0035] As shown in Figure 2, the distance adjustment unit 22 includes a first lifting plate 220 positioned in the external space 3b of the vacuum chamber 3. The first lifting plate 220 is configured to move up and down in the Z direction along a guide rail 21a that extends in the Z direction and is formed on the side of the frame 21. The first lifting plate 220 supports the suction plate 15 via a plurality of support shafts R1. As the first lifting plate 220 moves up and down, the suction plate 15 moves up and down accordingly. In particular, since the first lifting plate 220 supports a plurality of support shafts R1 that support the suction plate 15, the plurality of support shafts R1 move up and down synchronously with the movement of the first lifting plate 220, and the suction plate 15 moves up and down while maintaining parallelism.

[0036] Furthermore, the first lifting plate 220 supports the substrate support unit 6 via a plurality of actuators 65 and a plurality of support shafts R3. When the first lifting plate 220 moves up and down, the substrate support unit 6 moves up and down accordingly. Each of the plurality of actuators 65 is connected to one of the plurality of support shafts R3. The actuators 65 include, for example, motors and ball screw mechanisms, and drive the support shafts R3 in the vertical direction. The substrate support unit 6 is driven relative to the suction plate 15 in the vertical direction by the plurality of actuators 65.

[0037] The distance adjustment unit 22 is supported by the frame 21 and includes a drive unit 221 that functions as an actuator for raising and lowering the first lifting plate 220. The drive unit 221 is a transmission mechanism that transmits the driving force of the motor 221a to the first lifting plate 220. In this embodiment, the drive unit 221 employs a ball screw mechanism as the transmission mechanism, which includes a ball screw shaft 221b and a ball nut 221c. The ball screw shaft 221b extends in the Z direction and rotates around its axis in the Z direction by the driving force of the motor 221a. The ball nut 221c is fixed to the first lifting plate 220 and engages with the ball screw shaft 221b. The first lifting plate 220 can be raised and lowered in the Z direction by the rotation of the ball screw shaft 221b and by switching the direction of rotation of the ball screw shaft 221b. The amount of lifting of the first lifting plate 220 is controlled based on the detection results of sensors, such as rotary encoders that detect the rotation amount of each motor 221a. This allows control of the position of the suction plate 15 that holds the substrate 100 in the Z direction, and control of the contact and separation between the substrate 100 and the mask 101.

[0038] In this embodiment, the distance adjustment unit 22 adjusts the distance between the mask base 5 and the substrate support unit 6 and suction plate 15 in the Z direction by fixing the position of the mask base 5 and displacing the substrate support unit 6 and suction plate 15. However, the distance between the mask base 5 and the substrate support unit 6 and suction plate 15 may also be adjusted by fixing the position of the substrate support unit 6 or the suction plate 15 and displacing the mask base 5. Alternatively, the distance between the mask base 5 and the substrate support unit 6 and suction plate 15 may be adjusted by displacing each of the substrate support unit 6, suction plate 15, and mask base 5.

[0039] The plate unit lifting unit 13 lifts and lowers the plate unit 9, which is connected to the second lifting plate 12 and located in the internal space 3a of the vacuum chamber 3, by raising and lowering the second lifting plate 12, which is located in the external space 3b of the vacuum chamber 3. The plate unit 9 is connected to the second lifting plate 12 via one or more support shafts R2. In this embodiment, the plate unit 9 is supported by two support shafts R2. The support shafts R2 extend upward from the magnet plate 11 and are connected to the second lifting plate 12 by passing through the opening in the upper wall portion 30, the openings of the fixed plate 20a and the movable plate 20b, and the opening in the first lifting plate 220.

[0040] The second lifting plate 12 is configured to move up and down in the Z direction along the guide shaft 12a. The plate unit lifting unit 13 is supported by the frame 21 and includes a drive mechanism for raising and lowering the second lifting plate 12. The plate unit lifting unit 13 is a transmission mechanism that transmits the driving force of the motor 13a to the second lifting plate 12. In this embodiment, the plate unit lifting unit 13 employs a ball screw mechanism including a ball screw shaft 13b and a ball nut 13c as the transmission mechanism. The ball screw shaft 13b extends in the Z direction and rotates around its axis in the Z direction by the driving force of the motor 13a. The ball nut 13c is fixed to the second lifting plate 12 and engages with the ball screw shaft 13b. The second lifting plate 12 can be raised and lowered in the Z direction by the rotation of the ball screw shaft 13b and by switching the direction of rotation of the ball screw shaft 13b. The amount of lifting of the second lifting plate 12 is controlled based on the detection results of sensors, such as rotary encoders that detect the rotation amount of each motor 13a. This allows control of the position of the plate unit 9 in the Z direction and control of the contact and separation between the plate unit 9 and the suction plate 15 (and the substrate 100 that is adsorbed by it).

[0041] The first measurement unit 7 and the second measurement unit 8 function as measurement units that measure the positional misalignment between the substrate 100 and the mask 101, which are supported by the substrate support unit 6. In this embodiment, the first measurement unit 7 and the second measurement unit 8 include an imaging device (camera) that images the substrate 100 and the mask 101 to acquire images. The first measurement unit 7 and the second measurement unit 8 are positioned above the upper wall portion 30 and image the substrate 100 and the mask 101, which are located in the internal space 3a of the vacuum chamber 3, through a window portion (not shown) formed in the upper wall portion 30 to acquire images.

[0042] The first measurement unit 7 includes a low-magnification CCD camera (rough camera) with a relatively wide field of view and low resolution. The first measurement unit 7 captures images of rough alignment marks formed on the substrate 100 and rough alignment marks formed on the mask 101, and measures the rough positional misalignment between the substrate 100 and the mask 101 from the relative positions of these marks.

[0043] The second measurement unit 8 includes a high-magnification CCD camera (fine camera) with a relatively narrow field of view and high resolution (for example, on the order of several micrometers). The second measurement unit 8 captures images of the fine alignment marks formed on the substrate 100 and the fine alignment marks formed on the mask 101, and accurately measures the positional misalignment between the substrate 100 and the mask 101 from the relative positions of these marks.

[0044] In this embodiment, under the control of the control device 14, the alignment process for aligning the substrate 100 and the mask 101 is performed in the order of rough alignment and fine alignment. In rough alignment, the relative position of the substrate 100 and the mask 101 is roughly adjusted based on the measurement results of the first measurement unit 7. In fine alignment, the relative position of the substrate 100 and the mask 101 is precisely adjusted based on the measurement results of the second measurement unit 8.

[0045] The adjustment unit 17 has the function of adjusting the relative inclination between the suction plate 15 and the mask base 5. In this embodiment, the adjustment unit 17 adjusts the relative inclination between the suction plate 15 and the mask base 5 by tilting (driving) the suction plate 15 relative to the mask base 5. Specifically, the adjustment unit 17 adjusts the relative inclination between the suction plate 15 and the mask base 5 by adjusting the axial position of at least some of the support shafts R1 among the plurality of support shafts R1.

[0046] The control device 14 controls the entire film deposition apparatus 1. The control device 14 includes a processing unit 141, a storage unit 142, an input / output interface (I / O) 143, a communication unit 144, a display unit 145, and an input unit 146. The processing unit 141 includes a processor, such as a CPU, and controls the film deposition apparatus 1 by executing a program stored in the storage unit 142. The storage unit 142 includes a storage device such as ROM, RAM, or HDD, and stores the program executed by the processing unit 141 and various control information. The I / O 143 is an interface for sending and receiving signals between the processing unit 141 and external devices. The communication unit 144 is a communication device that communicates with a higher-level device 300 or control devices 14, 309, and 310, etc., via a communication line 300a. The processing unit 141 receives information from or transmits information to the higher-level device 300 via the communication unit 144. The display unit 145 includes, for example, a liquid crystal display, and displays various information. The input unit 146 includes, for example, a keyboard or pointing device and accepts various inputs from the user. Note that all or part of the control devices 14, 309, and 310 and the host device 300 may be composed of a PLC, ASIC, or FPGA.

[0047] In the film deposition apparatus 1, the upper wall portion 30 of the vacuum chamber 3 constitutes a part of the partition wall defining the internal space 3a by separating the internal space 3a, which is maintained in a vacuum atmosphere, from the external space 3b, which is an atmospheric environment. However, in order to maintain the vacuum atmosphere, some of the components of the film deposition apparatus 1 (e.g., substrate support unit 6, mask stand 5, film deposition unit 4, plate unit 9, suction plate 15, etc.) are placed in the internal space 3a of the vacuum chamber 3. On the other hand, the remaining components of the film deposition apparatus 1 (e.g., first lifting plate 220, second lifting plate 12, etc.) are placed in the external space 3b. Thus, the components of the film deposition apparatus 1 include internal components (first components) placed in the internal space 3a and external components (second components) placed in the external space 3b. Therefore, the upper wall portion 30 needs to have openings for passing connecting members that connect the internal components and the external components, and in this embodiment, openings are provided for passing each of the support shafts R1, R2, and R3. Furthermore, bellows are provided at the openings in the upper wall portion 30 through which each of the support shafts R1, R2, and R3 passes, in order to ensure airtightness of the internal space 3a and maintain its vacuum atmosphere.

[0048] Figure 3 is an enlarged cross-sectional view showing a portion of the upper wall 30 of the vacuum chamber 3. The upper wall 30 is provided with an opening 32 that connects the internal space 3a and the external space 3b of the vacuum chamber 3. The opening 32 is an opening through which a support shaft R1 passes, which connects the suction plate 15, an internal member located in the internal space 3a, and the first lifting plate 220, an external member located in the external space 3b, and has dimensions that allow the support shaft R1 to be displaceable in the X and Y directions. Furthermore, as described above, a bellows 40 is provided for the opening 32 of the upper wall 30 in order to maintain the vacuum atmosphere in the internal space 3a of the vacuum chamber 3. The bellows 40 is constructed, for example, by providing a plurality of folds (pleats) on a cylindrical member. The bellows 40 is a sealing member that has elasticity, airtightness, and flexibility, and separates the vacuum (internal space 3a) from the atmosphere (external space 3b). In this embodiment, as shown in Figure 3, the bellows 40 is positioned in the external space 3b and is provided in the opening 32 of the upper wall portion 30 so as to cover the support shaft R1. The bellows 40 may also be provided with an intermediate ring 42 to support it in order to maintain its shape. The intermediate ring 42 may be provided, for example, between folds provided on a cylindrical member.

[0049] The bellows 40, installed in the opening 32 of the upper wall 30 of the vacuum chamber 3, repeatedly contracts and retracts in response to the driving of the support shaft R1, including displacement in the Z direction (up and down) and displacement in the X and Y directions (horizontal movement). When the bellows 40 contracts, particles (dust, etc.) are generated due to the bellows rubbing against each other. In particular, if an intermediate ring 42 is provided on the bellows 40, a large amount of particles tend to be generated at the location where the intermediate ring 42 is provided. The particles generated in the bellows 40 can enter the internal space 3a of the vacuum chamber 3 through the opening 32 of the upper wall 30 of the vacuum chamber 3, affect the vacuum atmosphere, and potentially contaminate the internal space 3a.

[0050] Therefore, in this embodiment, as shown in Figure 3, a receiving member 70 is provided in the internal space 3a of the vacuum chamber 3 to collect particles generated by the bellows 40. The receiving member 70 is positioned near the opening 32 on the side of the internal space 3a of the vacuum chamber 3 and is a member for receiving particles generated by the bellows 40 through the opening 32. In this way, with the upper wall 3a of the vacuum chamber 3 as the boundary, the receiving member 70 is provided on the side of the internal space 3a, while the opening 32 on the side of the external space 3b is provided with the bellows 40. This allows particles generated by the bellows 40 to be collected by the receiving member 70. As a result, according to this embodiment, the influence of particles generated by the bellows 40 on the vacuum atmosphere in the internal space 3a of the vacuum chamber 3 can be suppressed and the vacuum atmosphere can be maintained.

[0051] Furthermore, from the viewpoint of suppressing the influence of particles generated by the bellows 40 on the vacuum atmosphere, it is preferable to collect such particles with the receiving member 70 without leakage. Therefore, the receiving member 70 is provided in the internal space 3a of the vacuum chamber 3 so as to cover the region RG below the opening 32 of the upper wall portion 30. Region RG is a region having an area larger than the opening area (dimensions) of the opening 32, that is, a region that spatially covers the opening 32.

[0052] In this embodiment, the receiving member 70 specifically includes a first receiving portion 72 and a second receiving portion 74, as shown in Figure 3. By configuring the first receiving portion 72 and the second receiving portion 74 as separate components, it becomes possible to collect particles generated by the bellows 40 while allowing the drive of the support shaft R1, as will be described later. Note that the receiving member 70 is not limited to being composed of the first receiving portion 72 and the second receiving portion 74; it may also be composed of only the first receiving portion 72 or only the second receiving portion 74.

[0053] The first receiving portion 72 is a cylindrical member attached to the support shaft R1 and movable together with the support shaft R1 (and its drive). The first receiving portion 72 is provided to cover the central (inner) region RG1 of the region RG below the opening 32 of the upper wall portion 30 of the vacuum chamber 3. Therefore, the first receiving portion 72 can collect particles generated by the bellows 40 that enter the region RG1 of the internal space 3a through the opening 32.

[0054] The second receiving portion 74 is attached (fixed) to the upper wall portion 30 so as to surround the opening 32 of the upper wall portion 30. The second receiving portion 74 is an annular-shaped member having a hollow portion in its center into which the first receiving portion 72 is inserted. The second receiving portion 74 is provided so as to cover the outer edge side (outer) region RG2 of the region RG below the opening 32 of the upper wall portion 30 of the vacuum chamber 3. Therefore, the second receiving portion 74 can collect particles generated in the bellows 40 that enter the region RG2 of the internal space 3a through the opening 32.

[0055] Furthermore, it is preferable that the first receiving portion 72 and the second receiving portion 74 are provided such that a portion of them overlaps. In this embodiment, as shown in Figure 4, the first receiving portion 72 and the second receiving portion 74 are provided such that, when viewed from the +Z direction, the outer end 722 of the first receiving portion 72 on the side of the second receiving portion 74 and the inner end 742 of the second receiving portion 74 on the side of the first receiving portion 72 overlap each other. This makes it possible to collect particles generated in the bellows 40 by the first receiving portion 72 and the second receiving portion 74 without leakage, and the influence of such particles on the vacuum atmosphere can be minimized. Figure 4 is a diagram showing the arrangement relationship between the first receiving portion 72 and the second receiving portion 74. Note that in Figure 4, the first receiving portion 72 and the second receiving portion 74 are shown in the field of view from the +Z direction, that is, in the field of view along the axial direction of the support axis R1 from the external space 3b to the internal space 3a.

[0056] In this embodiment, the support shaft R1 is configured to move up and down along its axial direction (Z direction), so the first receiving portion 72 moves together with the support shaft R1, as described above. Therefore, even if the first receiving portion 72 moves together with the support shaft R1, the first receiving portion 72 and the second receiving portion 74 must be positioned such that the first receiving portion 72 does not physically interfere with (collide with) the second receiving portion 74. In this embodiment, as shown in Figure 3, the first receiving portion 72 and the second receiving portion 74 are positioned so that the end portion 722 of the first receiving portion 72 and the end portion 742 of the second receiving portion 74 do not interfere with each other. Specifically, the first receiving portion 72 and the second receiving portion 74 are positioned such that the clearance CL between the end portion 722 of the first receiving portion 72 and the end portion 742 of the second receiving portion 74 is longer than the vertical movement distance (stroke) of the support shaft R1. The support shaft R1 is also configured to move horizontally. Therefore, in the horizontal direction (X direction and Y direction), it is preferable to arrange the first receiving portion 72 and the second receiving portion 74 with sufficient clearance so that they do not interfere with each other.

[0057] Furthermore, in this embodiment, the case in which a receiving member 70 for collecting particles generated by the bellows 40 is applied to an opening 32 in the upper wall portion 30 of the vacuum chamber 3 through which a support shaft R1 connecting the suction plate 15 and the first lifting plate 220 passes. However, as described above, the upper wall portion 30 of the vacuum chamber 3 is also provided with an opening through which a support shaft R3 connecting the substrate support unit 6 (internal member) and the first lifting plate 220 (external member) passes. Since a bellows is also provided for the opening through which the support shaft R3 passes, a receiving member for collecting particles generated by the bellows can be applied. Also, as described above, the upper wall portion 30 of the vacuum chamber 3 is also provided with an opening through which a support shaft R2 connecting the plate unit 9 (internal member) and the second lifting plate 12 (external member) passes. Since a bellows is also provided for the opening through which the support shaft R2 passes, a receiving member for collecting particles generated by the bellows can be applied.

[0058] Furthermore, the film deposition apparatus 1 may also have a substrate support auxiliary unit 90, as shown in Figure 5. The substrate support auxiliary unit 90 (substrate support auxiliary part) provides auxiliary support to the substrate 100 supported by the substrate support unit 6. For example, the substrate support auxiliary unit 90 includes an auxiliary base part 91 that constitutes its outer frame, and a plurality of auxiliary support parts 92 that protrude inward from the auxiliary base part 91. The plurality of auxiliary support parts 92 are arranged on the auxiliary base part 91 along the periphery of the substrate 100, between the plurality of support parts 62 of the substrate support unit 6, and spaced apart from each other. The plurality of auxiliary support parts 92 may be made of leaf springs, similar to the plurality of support parts 62, or a plurality of auxiliary clamp parts corresponding to each may be provided, and the substrate 100 may be auxiliaryly supported by sandwiching the substrate 100 between the plurality of auxiliary support parts 92 and the plurality of auxiliary clamp parts. Figure 5 is a schematic diagram showing the configuration of the film deposition apparatus 1. Figure 5 shows only a part of the configuration of the film deposition apparatus 1, and the other configurations are the same as in Figure 2.

[0059] The substrate support auxiliary unit 90 is supported by the first lifting plate 220 via a plurality of actuators (not shown) and a plurality of support shafts R4. Therefore, when the first lifting plate 220 moves up and down, the substrate support auxiliary unit 90 moves up and down accordingly. Each of the plurality of actuators is connected to one of the plurality of support shafts R4. The actuators include, for example, motors and ball screw mechanisms, and drive the support shafts R4 in the vertical direction. The substrate support auxiliary unit 90 is driven relative to the suction plate 15 in the vertical direction by the plurality of actuators.

[0060] In the film deposition apparatus 1 having a substrate support auxiliary unit 90, an opening is provided in the upper wall portion 30 of the vacuum chamber 3 through which a support shaft R4, which connects the substrate support auxiliary unit 90 (internal member) and the first lifting plate 220 (external member), passes. Since a bellows is also provided for the opening through which the support shaft R4 passes, a receiving member for collecting particles generated by the bellows can be applied.

[0061] Furthermore, as shown in Figure 6, the bellows 40 can also be installed so as to cover the support shaft R1 that connects the suction plate 15 and the first lifting plate 220 in the internal space 3a, over the opening 32 of the upper wall portion 30 of the vacuum chamber 3. Even in this case, as described above, a receiving member 70 for collecting particles generated by the bellows 40 can be provided at the opening 32 through which the support shaft R1 connecting the suction plate 15 and the first lifting plate 220 passes. In Figure 6, the receiving member 70 is composed only of a first receiving portion 72 attached to the support shaft R1, but a second receiving portion 74 may also be attached to the upper wall portion 30 to further constitute the receiving member 70. Figure 6 is a schematic diagram showing the structure from the support shaft R1 to the suction plate 15 covered by the bellows 40.

[0062] Furthermore, as shown in Figure 6, the adjustment unit 17 may include a bent portion 18 provided between the support shaft R1 and the suction plate 15. The bent portion 18 connects the support shaft R1 and the suction plate 15 so that the angle of the suction plate 15 with respect to the support shaft R1 is variable. The bent portion 18 includes, for example, two members such as a universal joint and a structure that connects them so that their angles can be changed. By bending the suction plate 15 with respect to the support shaft R1 at the bent portion 18, the support shaft R1 can support the suction plate 15 even when the suction plate 15 is tilted. It is preferable to provide a floating portion 19 between the bent portion 18 and the suction plate 15 in order to reduce the load applied to the mask 101 when the suction plate 15 contacts the mask 101 and to ensure clearance for the suction plate 15 when the suction plate 15 and the mask 101 come into contact.

[0063] Furthermore, as shown in Figure 7, the support shaft R1 that supports the suction plate 15 is composed of a cylindrical member CM including a hollow section HL. Wires for applying voltage to the suction plate 15 are routed through the hollow section HL of the support shaft R1 from the external space 3b to the internal space 3a of the vacuum chamber 3 and connected to an electrical connection part provided on the suction plate 15. In addition, a through hole TH is formed in the cylindrical member CM, and the end of the through hole TH on the internal space 3a side is connected to a path (not shown) provided inside or outside the suction plate 15 via a relay pipe (not shown). A coolant (such as a liquid or gas) for cooling the suction plate 15 flows through the through hole TH. This coolant is routed through the through hole TH of the cylindrical member CM constituting the support shaft R1 from the external space 3b to the internal space 3a of the vacuum chamber 3 and supplied to the path provided on the suction plate 15 to cool the suction plate 15. Figure 7 is a diagram showing the detailed configuration of the support shaft R1.

[0064] Next, a manufacturing method for producing electronic devices using the film deposition apparatus 1 (or the manufacturing line having it) in this embodiment will be described. Here, an organic EL display device will be used as an example of the electronic device.

[0065] First, let's explain the organic EL display device. Figure 8(A) shows the overall configuration of the organic EL display device 50. Figure 8(B) shows the cross-sectional structure of one pixel of the organic EL display device 50.

[0066] As shown in Figure 8(A), the organic EL display device 50 has a display area 51 in which pixels 52, each containing a plurality of light-emitting elements, are arranged in a matrix. As will be described later, each of the plurality of light-emitting elements has a structure comprising an organic layer (organic film) sandwiched between a pair of electrodes. In this embodiment, a pixel means the smallest unit that enables the display of a predetermined color in the display area 51. For example, in the organic EL display device 50, the pixels 52 are composed of a combination of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B, each enabling the display of different colors. Generally, the pixels 52 are composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but are not limited to this. For example, they may be composed of a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and only need to be composed of at least one color of light-emitting element.

[0067] Figure 8(B) is a partial cross-sectional view along the A-B line shown in Figure 8(A). The pixel 52 consists of an organic EL element on a substrate 53, comprising an anode 54, a hole transport layer 55, one of the light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a cathode 58. Of these, the hole transport layer 55, the light-emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to organic layers. In this embodiment, the light-emitting layer 56R is an organic EL layer that emits red light, the light-emitting layer 56G is an organic EL layer that emits green light, and the light-emitting layer 56B is an organic EL layer that emits blue light. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The anode 54 is formed separately for each light-emitting element. The hole transport layer 55, electron transport layer 57, and cathode 58 may be formed in common with multiple light-emitting layers 56R, 56G, and 56B, or they may be formed for each light-emitting element. In addition, an insulating layer 59 is provided between the electrodes to prevent the anode 54 and cathode 58 from short-circuiting due to foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer PL is provided to protect the organic EL element from moisture and oxygen.

[0068] In Figure 8(B), the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but depending on the structure of the organic EL device, they may be formed from multiple layers including a hole blocking layer and an electron blocking layer. Furthermore, a hole injection layer having an energy band structure may be formed between the anode 54 and the hole transport layer 55 to facilitate the smooth injection of holes from the anode 54 to the hole transport layer 55. Similarly, an electron injection layer may be formed between the cathode 58 and the electron transport layer 57.

[0069] The following describes the manufacturing method for organic EL display devices.

[0070] First, a substrate 53 is prepared on which a circuit (not shown) for driving the organic EL display device and an anode 54 are formed.

[0071] Next, an acrylic resin is formed on the substrate 53 on which the anode 54 is formed by spin coating, and an insulating layer 59 is formed by patterning the acrylic resin in the area where the anode 54 is formed using lithography. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0072] A substrate 53 with an insulating layer 59 patterned on it is brought into the film deposition apparatus 1 (first film deposition chamber) of the manufacturing line, and a hole transport layer 55 is deposited as a common layer on the anode 54 of the display area 51. The hole transport layer 55 is deposited, for example, by vacuum deposition. Since the hole transport layer 55 is actually formed to be larger than the display area 51, a high-resolution mask is not required.

[0073] Next, the substrate 53, on which the hole transport layer 55 has been formed, is brought into the film deposition apparatus 1 (second film deposition chamber). The substrate 53 and the mask are aligned, and a red light-emitting layer 56R is deposited on the portion of the substrate 53 that will form the red light-emitting element, via the mask.

[0074] Similar to the deposition of the light-emitting layer 56R, a light-emitting layer 56G that emits green light is deposited in the deposition apparatus 1 (third deposition chamber), and then a light-emitting layer 56B that emits blue light is deposited in the deposition apparatus 1 (fourth deposition chamber). After the light-emitting layers 56R, 56G, and 56B have been deposited, an electron transport layer 57 is deposited over the entire display area 51 in the deposition apparatus 1 (fifth deposition chamber). The electron transport layer 57 is formed as a layer common to the three light-emitting layers 56R, 56G, and 56B.

[0075] Next, the substrate 53, on which the electron transport layer 57 has been formed, is brought into the film deposition apparatus 1 (sixth film deposition chamber) to deposit the cathode 58.

[0076] Then, the substrate 53 with the cathode 58 formed is brought into a sealing device, and a protective layer PL is deposited by plasma CVD (sealing process) to complete the organic EL display device 50. Here, the protective layer PL is formed by the CVD method, but it is not limited to this. For example, the protective layer PL may be deposited by the ALD method or the inkjet method.

[0077] Furthermore, if the substrate 53, which has the insulating layer 59 patterned on it, is exposed to an atmosphere containing moisture or oxygen between the time it is loaded into the film deposition apparatus 1 and the time the protective layer PL is deposited, the light-emitting layer made of organic EL material may deteriorate. Therefore, it is preferable that the loading and unloading of the substrate 53 between film deposition apparatuses be carried out under a vacuum atmosphere or an inert gas atmosphere.

[0078] The invention is not limited to the embodiments described above, and various modifications and changes are possible within the scope of the gist of the invention. [Explanation of Symbols]

[0079] 1: Film deposition apparatus 3: Vacuum chamber 3a: Internal space 3b: External space 6: Substrate support unit 9: Plate unit 12: Second lifting plate 15: Suction plate 30: Upper wall section 32: Opening 40: Bellows 70: Receiving member 72: First receiving section 74: Second receiving section 220: First lifting plate R1, R2, R3, R4: Support shafts

Claims

1. A chamber that maintains an internal vacuum atmosphere, An opening is provided to connect the internal space and the external space, and an upper wall portion is provided to define the internal space, A support shaft connects the first member, which is located in the internal space, and the second member, which is located in the external space, through the aforementioned opening. A bellows is provided in the opening so as to cover the support shaft, A receiving member is provided in the internal space and, through the opening, for receiving particles generated by the bellows. A chamber characterized by having the following features.

2. The chamber according to claim 1, characterized in that the receiving member is provided in the internal space so as to cover the area below the opening.

3. The chamber according to claim 1, characterized in that the receiving member is attached to the support shaft and includes a first receiving portion provided to cover the central portion of the region below the opening.

4. The chamber according to claim 3, characterized in that the receiving member includes a second receiving portion attached to the upper wall portion and provided to cover the area on the outer edge side of the area below the opening.

5. The chamber according to claim 4, characterized in that the first receiving portion and the second receiving portion are constructed as separate parts.

6. The chamber according to claim 5, characterized in that the first receiving portion and the second receiving portion are provided such that, in a field of view along the axial direction of the support shaft from the external space to the internal space, the end of the first receiving portion on the side of the second receiving portion and the end of the second receiving portion on the side of the first receiving portion overlap each other.

7. The support shaft is configured to allow vertical movement along the axial direction. The chamber according to claim 6, characterized in that the first receiving portion and the second receiving portion are provided such that the end of the first receiving portion on the side of the second receiving portion and the end of the second receiving portion on the side of the first receiving portion do not interfere with each other.

8. The chamber according to claim 1, characterized in that the bellows includes an intermediate ring that supports the bellows.

9. The first member is positioned above a substrate support portion that supports the substrate and includes a suction plate that adsorbs the substrate supported by the substrate support portion. The second member includes a lifting plate for raising and lowering the suction plate. The chamber according to claim 1.

10. The first member is positioned below the suction plate that adsorbs the substrate and includes a substrate support portion that supports the substrate before it is adsorbed by the suction plate. The second member includes a lifting plate that raises and lowers the substrate support portion. The chamber according to claim 1.

11. The first member includes a substrate support auxiliary part that provides auxiliary support to the substrate supported by the substrate support part, The second member includes a lifting plate that raises and lowers the substrate support auxiliary portion. The chamber according to claim 1.

12. The first member includes a plate unit positioned above a suction plate that adsorbs a substrate, The second member includes a lifting plate for raising and lowering the plate unit, The chamber according to claim 1.

13. The chamber according to claim 1, characterized in that the bellows is located in the external space.

14. A chamber according to any one of claims 1 to 13, A film deposition unit for forming a pattern on a substrate placed in the internal space of the chamber, A film deposition apparatus characterized by having

15. A manufacturing method characterized by manufacturing an electronic device using the film deposition apparatus described in claim 14.

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