Composite structure of printed circuit boards

Abstract

To provide a composite structure for printed circuit boards that can suppress increases in the number of components and product weight. [Solution] The present invention is a composite printed circuit board structure comprising an upper substrate 11 having a first slit 21, a lower substrate 12 facing the upper substrate 11 and having a second slit 22 and a third slit 23, and a first connecting substrate 13 having a first convex portion 31 inserted into the first slit 21, a second convex portion 32 inserted into the second slit 22, and a third convex portion 33 inserted into the third slit 23, wherein the upper substrate 11 is fixed to the lower substrate 12 by the first connecting substrate 13.

Description

Technical Field

[0001] The present invention relates to a composite structure of a printed circuit board.

Background Art

[0002] In a conventional power supply device, a plurality of substrates are mounted in the vertical direction, and a pin header connector, a harness, or the like is used to make respective electrical connections. Further, structural components such as spacers and positioning pins are used for structural positioning between the substrates and for supporting and holding the substrates. Related technology is disclosed in Patent Document 1. In the above conventional power supply device, the pin header and the harness require a space for mounting the connector, and there has been a problem that the substrate area increases. Further, for structural positioning between the upper and lower substrates and for supporting and holding the substrates, it is necessary to use structural components such as spacers and positioning pins, and an increase in the number of parts and an increase in weight have been problems.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Various aspects of the present invention aim to provide a composite structure of a printed circuit board that can suppress an increase in the number of parts and the product weight.

Means for Solving the Problems

[0005] Various aspects of the present invention will be described below.

[0006] [1] An upper substrate having a first slit, A lower substrate facing the upper substrate and having a second slit and a third slit, A first connecting substrate having a first convex portion inserted into the first slit, a second convex portion inserted into the second slit, and a third convex portion inserted into the third slit, It has, A composite structure of a printed circuit board, characterized in that the upper substrate is fixed to the lower substrate by the first connecting substrate.

[0007] According to the composite structure of the printed circuit board described in [1] above in one aspect of the present invention, since the upper board is fixed to the lower board by a first connecting board, a spacer is not required, the number of components is reduced, and miniaturization and weight reduction are possible.

[0008] [2] In the above [1], The upper substrate has a fourth slit, The lower substrate has a fifth slit and a sixth slit, The second connecting substrate has a fourth convex portion inserted into the fourth slit, a fifth convex portion 35 inserted into the fifth slit, and a sixth convex portion inserted into the sixth slit. A composite structure of a printed circuit board, characterized in that the upper substrate is fixed to the lower substrate by the second connecting substrate.

[0009] According to the composite printed circuit board structure of [2] described above in one aspect of the present invention, since the upper board is fixed to the lower board by a second connecting board, a spacer is not required, the number of components is reduced, and miniaturization and weight reduction are possible.

[0010] [3] In the above [1] or [2], The first convex portion has a first land and a second land facing each other on one side and the other side, The first convex portion has a first through-hole that penetrates the first land and the second land. The upper surface of the upper substrate has a third land connected to one side of the first slit in the short direction and a fourth land facing the third land and connected to the other side of the first slit in the short direction. The lower surface of the upper substrate has a fifth land connected to one side in the short direction of the first slit and a sixth land facing the fifth land and connected to the other side in the short direction of the first slit. First solder is applied to the first land, the second land, the third land, the fourth land, the fifth land, the sixth land, and inside the first through-hole. The second convex portion has a seventh land and an eighth land facing each other on one side and the other side, The second convex portion has a second through-hole that penetrates the seventh land and the eighth land, The upper surface of the lower substrate has a ninth land connected to one side in the short direction of the second slit and a tenth land opposite the ninth land and connected to the other side in the short direction of the second slit. The lower surface of the lower substrate has an eleventh land connected to one side in the short direction of the second slit and a twelfth land opposite the eleventh land and connected to the other side in the short direction of the second slit. A composite structure of a printed circuit board, characterized in that a second solder is applied to the seventh land, the eighth land, the ninth land, the tenth land, the eleventh land, the twelfth land, and the second through-hole.

[0011] According to the composite printed circuit board structure of [3] described above in one aspect of the present invention, through-hole lands are used at the connection portion between the first connecting board and the upper and lower boards, and both sides of the first connecting board are firmly soldered to the upper and lower boards, respectively, thereby improving the durability of the solder.

[0012] [4] In the above [2], The fourth convex portion has a 13th land and a 14th land facing each other on one side and the other side, The fourth convex portion has a third through-hole that penetrates the 13th land and the 14th land, The upper surface of the upper substrate has a 15th land connected to one side in the short direction of the 4th slit and a 16th land opposite to the 15th land and connected to the other side in the short direction of the 4th slit. The lower surface of the upper substrate has a 17th land connected to one side in the short direction of the fourth slit and a 18th land opposite to the 17th land and connected to the other side in the short direction of the fourth slit. Third solder is applied to the 13th land, the 14th land, the 15th land, the 16th land, the 17th land, the 18th land, and inside the third through-hole. The fifth convex portion has a 19th land and a 20th land facing each other on one side and the other side, The fifth convex portion has a fourth through-hole that penetrates the 19th land and the 20th land. The upper surface of the lower substrate has a 21st land connected to one side in the short direction of the 5th slit and a 22nd land opposite to the 21st land and connected to the other side in the short direction of the 5th slit. The lower surface of the lower substrate has a 23rd land connected to one side in the short direction of the 5th slit and a 24th land opposite to the 23rd land and connected to the other side in the short direction of the 5th slit. A composite structure of a printed circuit board, characterized in that a fourth solder is applied to the 19th land, the 20th land, the 21st land, the 22nd land, the 23rd land, the 24th land, and inside the 4th through-hole.

[0013] According to the composite structure of the printed circuit board of [4] according to one aspect of the present invention, lands with through holes are used at the connection parts of the second connection substrate, the upper substrate, and the lower substrate, and both sides of the second connection substrate are firmly soldered to the upper substrate and the lower substrate respectively, so that the durability of the solder can be improved.

[0014] [5] In the above [2] or [4], having a bus bar located on the lower substrate, The bus bar is fitted into a first gap formed in the first connection substrate and a second gap formed in the second connection substrate. A composite structure of a printed circuit board is characterized in that.

[0015] According to the composite structure of the printed circuit board of [5] according to one aspect of the present invention, by fitting a bus bar into the gaps of each of the first and second connection substrates, a jig for maintaining an upright posture is not required, and the number of parts can be reduced.

[0016] [6] In the above [1] or [2], The 25th land formed on one side of the first convex portion and the 26th land formed on one side of the second convex portion in the first connection substrate are electrically connected, the 25th land and the 26th land formed on the upper surface of the upper substrate are electrically connected, and the 26th land and the 27th land formed on the lower surface of the lower substrate are electrically connected. A composite structure of a printed circuit board is characterized in that.

[0017] According to the composite structure of the printed circuit board of [6] according to one aspect of the present invention, since the upper substrate and the lower substrate are electrically connected through the first connection substrate, components such as pin header connectors, bus bars, and harnesses can be made unnecessary.

[0018] [7] In the above [6], The upper end of the 25th land is located above the first slit, and the lower end of the 25th land is located below the first slit. A composite structure of a printed circuit board is characterized in that.

[0019] [8] In the above [7], The upper substrate facing the 25th land has a fifth through-hole that is connected to the first slit and connected to the 26th land, The 25th land and the 26th land are connected by a sixth solder, A composite structure of a printed circuit board, characterized in that the sixth solder fills the fifth through-hole.

[0020] According to the composite structure of the printed circuit board described in [8] above in one aspect of the present invention, a fifth through-hole is formed in the upper substrate facing the 25th land, and the fifth through-hole is connected to the first slit and the 26th land. Therefore, when the 25th land and the 26th land are connected with a sixth solder, the sixth solder can pass through the fifth through-hole to connect the 25th land and the 26th land. As a result, the quality of soldering can be improved.

[0021] [9] In the above [1] or [2], A composite structure for a printed circuit board, characterized in that the planar shapes of both longitudinal ends of the first slit and the second slit are T-shaped.

[0022] According to the composite printed circuit board structure of [9] described in one aspect of the present invention, the planar shapes of both ends of the longitudinal direction of the first slit and the second slit are made T-shaped. This ensures that the longitudinal direction of each slit is reliably constrained by the first connecting substrate, thereby improving the positioning accuracy between the upper substrate and the lower substrate.

[0023]

[10] In the above [2] or [4], A composite structure for a printed circuit board, characterized in that the planar shapes of both longitudinal ends of the fourth slit and the fifth slit are T-shaped.

[0024] According to the composite structure of the printed circuit board described in

[10] above in one aspect of the present invention, the planar shapes of both ends of the longitudinal direction of the fourth slit and the fifth slit are made T-shaped. This ensures that the longitudinal direction of each slit is reliably constrained by the second connecting substrate, thereby improving the positioning accuracy between the upper substrate and the lower substrate. [Effects of the Invention]

[0025] According to various aspects of the present invention, it is possible to provide a composite structure for a printed circuit board that can suppress an increase in the number of components and the weight of the product. [Brief explanation of the drawing]

[0026] [Figure 1] This is a top view showing a composite structure of a printed circuit board according to one aspect of the present invention. [Figure 2] Figure 1 is a side view of the composite structure of the printed circuit board. [Figure 3] Figures 1 and 2 show the first connecting substrate (vertical substrate) viewed from the side. [Figure 4] Figure 1 shows a cross-sectional view obtained by cutting the upper substrate 11 and lower substrate 12 at the first and second through-holes 41 and 42 of the first connecting substrate 13. [Figure 5] Figure 1 is a plan view of the first slit 21 and its surrounding area on the upper substrate 11. [Figure 6] Figure 1 is a perspective view showing the mating portion and surrounding area of ​​the first connection board 13 and bus bar 81. [Figure 7] Figure 5 is a plan view showing the first slit 21 with a fifth through-hole 45 added. [Modes for carrying out the invention]

[0027] Embodiments of the present invention will be described in detail below with reference to the drawings. However, it will be readily apparent to those skilled in the art that the present invention is not limited to the following description, and that its form and details can be modified in various ways without departing from the spirit and scope of the present invention. Accordingly, the present invention shall not be interpreted as being limited to the descriptions of the embodiments shown below.

[0028] Figure 1 is a top view showing a composite structure of a printed circuit board according to one embodiment of the present invention. Figure 2 is a side view of the composite structure of the printed circuit board shown in Figure 1. Figure 3 is a side view of the first connecting board (vertical board) shown in Figures 1 and 2. Figure 4 is a cross-sectional view of the upper board 11 and lower board 12 shown in Figure 1, cut at the first and second through-holes 41 and 42 of the first connecting board 13. Figure 5 is a plan view of the first slit 21 and its surroundings in the upper board 11 shown in Figure 1.

[0029] As shown in Figures 1 and 2, the composite structure of the printed circuit board has an upper board 11 and a lower board 12 facing the upper board 11. A first slit 21 is formed in the upper board 11, and a second slit 22 and a third slit 23 are formed in the lower board 12. When viewed from above, the upper board 11 does not completely overlap the lower board 12, and the lower board 12 is positioned offset from the upper board 11.

[0030] As shown in Figure 3, the first connecting substrate 13 has a first convex portion 31, a second convex portion 32, and a third convex portion 33. The first convex portion 31 is inserted into the first slit 21 of the upper substrate 11, the second convex portion 32 is inserted into the second slit 22 of the lower substrate 12, and the third convex portion 33 is inserted into the third slit 23 of the lower substrate 12. In this way, the upper substrate 11 is fixed to the lower substrate 12 by the first connecting substrate 13.

[0031] Furthermore, as shown in Figures 1 and 2, a fourth slit 24 is formed in the upper substrate 11, and a fifth slit 25 and a sixth slit 26 are formed in the lower substrate 12. In the upper substrate 11, the fourth slit 24 is located next to the first slit 21. In the lower substrate 12, the fifth slit 25 is located next to the second slit 22, and the sixth slit 26 is located next to the third slit 23.

[0032] The second connecting board 14 has a structure substantially similar to the first connecting board 13 shown in Figure 3. The second connecting board 14 has a fourth convex portion 34, a fifth convex portion 35, and a sixth convex portion. The fourth convex portion 34 is inserted into the fourth slit 24 of the upper board 11, the fifth convex portion 35 is inserted into the fifth slit 25 of the lower board 12, and the sixth convex portion is inserted into the sixth slit 26 of the lower board 12. As a result, the upper board 11 is fixed to the lower board 12 by the second connecting board 14.

[0033] Furthermore, as shown in Figures 1 and 2, a seventh slit 27 is formed in the upper substrate 11, and an eighth slit 28 and a ninth slit 29 are formed in the lower substrate 12. In the upper substrate 11, the seventh slit 27 is located next to the fourth slit 24. In the lower substrate 12, the eighth slit 28 is located next to the fifth slit 25, and the ninth slit 29 is located next to the sixth slit 26.

[0034] The third connecting board 15 has a structure substantially similar to the first connecting board 13 shown in Figure 3. The third connecting board 15 has a seventh convex portion 37, an eighth convex portion 38, and a ninth convex portion. The seventh convex portion 37 is inserted into the seventh slit 27 of the upper board 11, the eighth convex portion 38 is inserted into the eighth slit 28 of the lower board 12, and the ninth convex portion is inserted into the ninth slit 29 of the lower board 12. As a result, the upper board 11 is fixed to the lower board 12 by the third connecting board 15.

[0035] Furthermore, as shown in Figures 1 and 2, a tenth slit 110 is formed in the upper substrate 11, and an eleventh slit 111 and a twelfth slit 112 are formed in the lower substrate 12. In the upper substrate 11, the tenth slit 110 is located next to the seventh slit 27. In the lower substrate 12, the eleventh slit 111 is located next to the eighth slit 28, and the twelfth slit 112 is located next to the ninth slit 29.

[0036] The fourth connecting board 16 has a structure substantially similar to the first connecting board 13 shown in Figure 3. The sixth connecting board 16 has a tenth convex portion 120, an eleventh convex portion 121, and a twelfth convex portion. The tenth convex portion 120 is inserted into the tenth slit 110 of the upper board 11, the eleventh convex portion 121 is inserted into the eleventh slit 111 of the lower board 12, and the twelfth convex portion is inserted into the twelfth slit 112 of the lower board 12. As a result, the upper board 11 is fixed to the lower board 12 by the fourth connecting board 16.

[0037] As shown in Figures 3 and 4, the first convex portion 31 of the first connecting substrate 13 has a first land 51 and a second land 52 facing each other on one side surface 31a and the other side surface 31b. The first convex portion 31 also has a first through-hole 41 that penetrates the first land 51 and the second land 52.

[0038] As shown in Figures 4 and 5, the upper surface 11a of the upper substrate 11 has a third land 53 connected to one side of the first slit 21 in the short direction, and a fourth land 54 facing the third land 53 and connected to the other side of the first slit 21 in the short direction. The lower surface 11b of the upper substrate 11 has a fifth land 55 connected to one side of the first slit 21 in the short direction, and a sixth land 56 facing the fifth land 55 and connected to the other side of the first slit 21 in the short direction (see Figure 4).

[0039] Furthermore, the first solder 71 is applied to the first land 51, the second land 52, the third land 53, the fourth land 54, the fifth land 55, the sixth land 56, and inside the first through-hole 41 (see Figure 4). In this way, by using the first and second lands 51 and 52 with the first through-hole 41 at the connection point between the first connection board 13 and the upper board 11 and soldering them, both sides of the first connection board 13 can be firmly soldered to the upper board 11.

[0040] Furthermore, the second convex portion 32 has a seventh land 57 and an eighth land 58 facing each other on one side surface 32a and the other side surface 32b, and the second convex portion 32 has a second through-hole 42 that penetrates the seventh land 57 and the eighth land 58 (see Figure 4).

[0041] As shown in Figure 4, the upper surface 12a of the lower substrate 12 has a ninth land 59 connected to one side of the second slit 22 in the short direction, and a tenth land 60 facing the ninth land 59 and connected to the other side of the second slit 22 in the short direction. The lower surface 12b of the lower substrate 12 has an eleventh land 61 connected to one side of the second slit 22 in the short direction, and a twelfth land 62 facing the eleventh land 61 and connected to the other side of the second slit 22 in the short direction (see Figure 4).

[0042] Furthermore, the second solder 72 is applied to the seventh land 57, the eighth land 58, the ninth land 59, the tenth land 60, the eleventh land 61, the twelfth land 62, and inside the second through-hole 42 (see Figure 4). In this way, by using the seventh and eighth lands 57 and 58 with the second through-hole 42 at the connection point between the first connecting board 13 and the lower board 12 and soldering, both sides of the first connecting board 13 can be firmly soldered to the lower board 12.

[0043] The fourth and fifth convex portions 34 and 35 of the second connecting substrate 14 shown in Figures 1 and 2 have the same structure as the first and second convex portions 31 and 32 of the first connecting substrate 13 described above, and will be explained in detail below.

[0044] The fourth convex portion 34 of the second connecting substrate 14 shown in Figures 1 and 2 has a 13th land (not shown) and a 14th land (not shown) facing each other on one side and the other side. The fourth convex portion 34 also has a third through-hole (not shown) that penetrates the 13th land and the 14th land.

[0045] As shown in Figures 1 and 2, the upper surface 11a of the upper substrate 11 has a 15th land (not shown) connected to one side in the short direction of the fourth slit 24, and a 16th land (not shown) opposite the 15th land and connected to the other side in the short direction of the fourth slit 24. The lower surface 11b of the upper substrate 11 has a 17th land (not shown) connected to one side in the short direction of the fourth slit 24, and a 18th land (not shown) opposite the 17th land and connected to the other side in the short direction of the fourth slit 24.

[0046] Furthermore, a third layer of solder is applied to the 13th, 14th, 15th, 16th, 17th, and 18th lands, as well as inside the third through-hole (not shown). In this way, by using the 13th and 14th lands with the third through-hole to solder the connection between the second connecting board 14 and the upper board 11, both sides of the second connecting board 14 can be firmly soldered to the upper board 11.

[0047] Furthermore, the fifth convex portion 35 has a 19th land (not shown) and a 20th land (not shown) facing each other on one side and the other side, and the fifth convex portion 35 has a fourth through-hole (not shown) that penetrates the 19th land (not shown) and the 20th land (not shown).

[0048] Furthermore, the upper surface 12a of the lower substrate 12 has a 21st land (not shown) connected to one side in the short direction of the fifth slit 25, and a 22nd land (not shown) opposite the 21st land and connected to the other side in the short direction of the fifth slit 25. The lower surface 12b of the lower substrate 12 has a 23rd land (not shown) connected to one side in the short direction of the fifth slit 25, and a 24th land (not shown) opposite the 23rd land (not shown) and connected to the other side in the short direction of the fifth slit 25.

[0049] Furthermore, a fourth layer of solder is applied to the 19th, 20th, 21st, 22nd, 23rd, and 24th lands, as well as inside the fourth through-hole. In this way, by using the 19th and 20th lands with the fourth through-hole to solder the connection between the second connecting board 14 and the lower board 12, both sides of the second connecting board 14 can be firmly soldered to the lower board 12.

[0050] The first connecting board 13 has a structure similar to the structure in which the connection portions of the first connecting board 13 and the upper board 11 and lower board 12 are firmly soldered together, which will be explained in detail below.

[0051] As shown in Figure 3, the first convex portion 31 of the first connecting substrate 13 has a 31st land 51a and a 32nd land (not shown) facing each other on one side surface 31a and the other side surface 31b. The first convex portion 31 also has a fifth through-hole 43 that penetrates the 31st land 51a and the 32nd land. The 31st land 51a is spaced apart from the first land 51, and the 32nd land is spaced apart from the second land 52.

[0052] As shown in Figure 3, the upper surface 11a of the upper substrate 11 has a 33rd land 53a connected to one side of the first slit 21 in the short direction, and a 34th land 54a facing the 33rd land 53a and connected to the other side of the first slit 21 in the short direction. The lower surface 11b of the upper substrate 11 has a 35th land (not shown) connected to one side of the first slit 21 in the short direction, and a 6th land (not shown) facing the 35th land and connected to the other side of the first slit 21 in the short direction.

[0053] Furthermore, a fifth solder (not shown) is applied to the 31st land 51a, the 32nd land, the 33rd land 53a, the 34th land 54a, the 35th land, the 36th land 56, and inside the 5th through-hole 43. In this way, by using the 31st and 32nd lands 51a with the 5th through-hole 43 at the connection point between the first connecting board 13 and the upper board 11 and soldering, both sides of the first connecting board 13 can be firmly soldered to the upper board 11.

[0054] Furthermore, the second convex portion 32 has a 37th land 57a and a 38th land (not shown) on one side surface 32a and the other side surface 32b, which face each other, and the second convex portion 32 has a sixth through-hole 44 that penetrates the 37th land 57a and the 38th land. The 37th land 57a is spaced apart from the 7th land 57, and the 38th land is spaced apart from the 8th land 58.

[0055] As shown in Figure 3, the upper surface 12a of the lower substrate 12 has a 39th land (not shown) connected to one side of the second slit 22 in the short direction, and a 40th land (not shown) opposite the 39th land and connected to the other side of the second slit 22 in the short direction. The lower surface 12b of the lower substrate 12 has a 41st land (not shown) connected to one side of the second slit 22 in the short direction, and a 42nd land (not shown) opposite the 41st land and connected to the other side of the second slit 22 in the short direction.

[0056] Furthermore, a sixth solder (not shown) is applied to the 37th land 57a, the 38th land, the 39th land, the 40th land, the 41st land, the 42nd land, and inside the 6th through-hole 44. In this way, by using the 37th and 38th lands 57a with the 6th through-hole 44 at the connection point between the first connecting board 13 and the lower board 12 and soldering, both sides of the first connecting board 13 can be firmly soldered to the lower board 12.

[0057] Furthermore, the third convex portion 33 has a 28th land 63 and a 29th land facing each other on one side surface 33a and the other side surface, and the third convex portion 33 has a 7th through-hole 46 that penetrates the 28th land 63 and the 29th land (see Figure 3).

[0058] As shown in Figures 2 and 3, the upper surface 12a of the lower substrate 12 has a 30th land 64 connected to one side of the third slit 23 in the short direction, and a 43rd land 65 facing the 30th land 64 and connected to the other side of the third slit 23 in the short direction. The lower surface 12b of the lower substrate 12 has a 44th land connected to one side of the third slit 23 in the short direction, and a 45th land facing the 44th land and connected to the other side of the third slit 23 in the short direction (see Figure 4).

[0059] Furthermore, the 7th solder is applied to the 28th land 63, the 29th land, the 30th land 64, the 43rd land 65, the 44th land, the 45th land, and inside the 7th through-hole 46 (see Figure 4). In this way, by using the 28th land 63 and the 29th land with the 7th through-hole 46 at the connection point between the first connecting board 13 and the lower board 12 and soldering, both sides of the first connecting board 13 can be firmly soldered to the lower board 12.

[0060] Furthermore, the third convex portion 33 has a 50th land 66 and a 51st land (not shown) facing each other on one side surface 33a and the other side surface, and the third convex portion 33 has an 8th through-hole 47 that penetrates the 50th land 66 and the 51st land (see Figure 3). The 50th land 66 is spaced apart from the 23rd land 63, and the 51st land is spaced apart from the 29th land.

[0061] As shown in Figures 1 and 3, the upper surface 12a of the lower substrate 12 has a 52nd land 67 connected to one side of the third slit 23 in the short direction, and a 53rd land 68 facing the 52nd land 67 and connected to the other side of the third slit 23 in the short direction. The lower surface 12b of the lower substrate 12 has a 54th land connected to one side of the third slit 23 in the short direction, and a 55th land facing the 54th land and connected to the other side of the third slit 23 in the short direction.

[0062] Furthermore, an eighth solder (not shown) is applied to the 50th land 66, the 51st land, the 52nd land 67, the 53rd land 68, the 54th land, the 55th land, and inside the eighth through-hole 47. In this way, by using the 50th land 66 and the 51st land with the eighth through-hole 47 at the connection point between the first connecting board 13 and the lower board 12 and soldering, both sides of the first connecting board 13 can be firmly soldered to the lower board 12.

[0063] As shown in Figures 3 and 5, on the first connecting board 13, the 25th land 101 formed on one surface 31a of the first convex portion 31 and the 26th land 102 formed on one surface 32a of the second convex portion 32 are electrically connected by wiring 201. The 25th land 101 and the 26th land 102 formed on the upper surface 11a of the upper board 11 are electrically connected by solder (not shown), and the 26th land 102 and the 27th land formed on the lower surface 12b of the lower board 12 are electrically connected by solder. As a result, the upper board 11 and the lower board 12 are electrically connected. Because the upper board 11 and the lower board 12 are electrically connected via the first connecting board 13 in this way, components such as pin header connectors, busbars, and harnesses can be eliminated. Furthermore, the upper end of the 25th land 101 is located above the first slit 21, and the lower end of the 25th land 101 is located below the first slit 21.

[0064] As shown in Figure 3, on the first connecting board 13, the 46th land 104 formed on one surface 31a of the first convex portion 31 and the 47th land 105 formed on one surface 33a of the third convex portion 33 are electrically connected by wiring 202. The 46th land 104 and the 48th land 106 formed on the upper surface 11a of the upper board 11 are electrically connected by solder (not shown), and the 47th land 105 and the 49th land formed on the lower surface 12b of the lower board 12 are electrically connected by solder. As a result, the upper board 11 and the lower board 12 are electrically connected. Furthermore, the upper end of the 46th land 104 is located above the first slit 21, and the lower end of the 47th land 105 is located below the third slit 23.

[0065] Figure 7 is a plan view showing the first slit 21 shown in Figure 5 with a fifth through-hole 45 added. The fifth through-hole 45 is desirable, but the design can be implemented without it. A fifth through-hole 45 is formed in the upper substrate 11 opposite the 25th land 101 shown in Figures 3 and 7, and the fifth through-hole 45 is connected to the first slit 21. The fifth through-hole 45 is also connected to the 26th land 102. The 25th land 101 and the 26th land 102 are electrically connected by a sixth solder (not shown). The sixth solder is embedded in the fifth through-hole 45.

[0066] As shown in Figures 3, 5, and 7, the planar shapes of the longitudinal ends 21a, 21b, 22a, and 22b of the first slit 21 and the second slit 22 are preferably T-shaped. Similarly, the planar shapes of the longitudinal ends of the third slit 23 are also preferably T-shaped.

[0067] Each of the second to fourth connecting boards 14 to 16 has the same lands, wiring, through-holes, etc., as shown in Figures 3, 4, 5, and 7, and has the same structure and the same effects.

[0068] Furthermore, the planar shapes of the longitudinal ends 24a and 24b of the fourth slit 24 and fifth slit 25 of the second connecting substrate 14 are preferably T-shaped (see Figures 1, 2, 5, and 7). Similarly, the planar shapes of the longitudinal ends of the sixth slit 26 are also preferably T-shaped. Likewise, the planar shapes of the longitudinal ends of the seventh to twelfth slits of the third and fourth connecting substrates 15 and 16 are also preferably T-shaped.

[0069] Figure 6 is a perspective view showing the mating portion and surrounding area of ​​the first connection board 13 and busbar 81 shown in Figure 1. As shown in Figures 1, 3, and 6, the composite structure of the printed circuit board according to this embodiment has a busbar 81 located on the lower board 12, and the busbar 81 is fitted into a first gap 13a formed in the first connecting board 13 and a second gap 14a formed in the second connecting board 14. By fitting the busbar 81 in this way, a jig to maintain the upright position is not required, and the number of parts can be reduced.

[0070] According to this embodiment, since the upper substrate 11 is fixed to the lower substrate 12 by the first connecting substrate 13 and the second connecting substrate 14, spacers are not required, reducing the number of components and enabling miniaturization and weight reduction. Similarly, since the upper substrate 11 is fixed to the lower substrate 12 by the third connecting substrate 15 and the fourth connecting substrate 16, spacers are not required, reducing the number of components and enabling miniaturization and weight reduction.

[0071] Furthermore, according to this embodiment, through-hole lands are used at the connection points between each of the first connection board 13 and the second connection board 14 and the upper board 11 and the lower board 12, and both sides of each of the first connection board 13 and the second connection board 14 are firmly soldered to each of the upper board 11 and the lower board 12, thereby improving the durability of the solder.

[0072] Furthermore, according to this embodiment, as shown in Figure 7, a fifth through-hole 45 is formed in the upper substrate 11 facing the 25th land 101, and the fifth through-hole 45 is connected to the first slit 21 and the 26th land 102. Therefore, when the 25th land 101 and the 26th land 102 are connected by a sixth solder, the sixth solder can pass through the fifth through-hole 45 to connect the 25th land 101 and the 26th land 102. As a result, the quality of the soldering can be improved.

[0073] Furthermore, according to this embodiment, as shown in Figure 7, the planar shapes of the longitudinal ends 21a, 21b, 22a, 22b, 24a, and 24b of each of the first slit 21 and the second slit 22, and each of the fourth slit 24 and the fifth slit 25, are made T-shaped. This ensures that the longitudinal direction of each slit is reliably constrained by the first connecting substrates 13, 14 and the second connecting substrate 14, thereby improving the positioning accuracy between the upper substrate 11 and the lower substrate 12.

[0074] In this embodiment, the upper and lower substrates are positioned offset from each other as shown in Figure 1, but the invention is not limited to this configuration, and the upper and lower substrates may be positioned completely overlapping.

[0075] Furthermore, in this embodiment, as shown in Figure 1, the second connecting substrate and its slit are arranged parallel to the first connecting substrate and its slit, but the embodiment is not limited to this, and the second connecting substrate and its slit may be arranged perpendicular to the first connecting substrate and its slit, or they may be arranged at various angles such as 45 degrees.

[0076] Furthermore, in this embodiment, as shown in Figure 3, both the upper substrate 11 and the lower substrate 12 are electrically connected by the first connecting substrate 13. However, the embodiment is not limited to this, and the substrates may be electrically connected at only one of the upper or lower substrates, with the other being fixed only by soldering. [Explanation of Symbols]

[0077] 11 Upper circuit board 11a Top surface of the upper substrate 11b Lower surface of the upper substrate 12 Lower board 12a Top surface of the lower substrate 12b Lower surface of the lower substrate 13. First connection board 13a First gap 14. Second connection board 14a The second gap 21 First slit 21a, 21b Both ends in the longitudinal direction of the first slit 22 Second slit 22a, 22b Both ends in the longitudinal direction of the second slit 23 Third Slit 24 The fourth slit 24a, 24b Both ends in the longitudinal direction of the fourth slit 24 25 The fifth slit 26. The sixth slit 31 First convex portion 31a One side surface of the first convex portion 31b The other side surface of the first convex portion 32 Second convex portion 32a One side surface of the second convex portion 32b The other side surface of the second convex portion 33 Third convex part 34. Fourth convex part 35 Fifth convex part 41. First through hole 42. Second through hole 45. The 5th through hole 51 The First Land 52 The Second Land 53 The Third Land 54 The Fourth Land 55 The Fifth Land 56 The Sixth Land 57 The Seventh Land 58 The 8th Land 59 The Ninth Land 60 The 10th Land 61 The Eleventh Land 62 The 12th Land 71 First solder 72 Second solder 81 Bus Bar 101 The 25th Land 102 The 26th Land

Claims

1. An upper substrate having a first slit, A lower substrate facing the upper substrate and having a second slit and a third slit, A first connecting substrate having a first convex portion inserted into the first slit, a second convex portion inserted into the second slit, and a third convex portion inserted into the third slit, It has, A composite structure of a printed circuit board, characterized in that the upper substrate is fixed to the lower substrate by the first connecting substrate.

2. In claim 1, The upper substrate has a fourth slit, The lower substrate has a fifth slit and a sixth slit, The second connecting substrate has a fourth convex portion inserted into the fourth slit, a fifth convex portion inserted into the fifth slit, and a sixth convex portion inserted into the sixth slit. A composite structure of a printed circuit board, characterized in that the upper substrate is fixed to the lower substrate by the second connecting substrate.

3. In claim 1 or 2, The first convex portion has a first land and a second land facing each other on one side and the other side, The first convex portion has a first through-hole that penetrates the first land and the second land. The upper surface of the upper substrate has a third land connected to one side in the short direction of the first slit and a fourth land facing the third land and connected to the other side in the short direction of the first slit. The lower surface of the upper substrate has a fifth land connected to one side in the short direction of the first slit and a sixth land facing the fifth land and connected to the other side in the short direction of the first slit. First solder is applied to the first land, the second land, the third land, the fourth land, the fifth land, the sixth land, and inside the first through-hole. The second convex portion has a seventh land and an eighth land facing each other on one side and the other side, The second convex portion has a second through-hole that penetrates the seventh land and the eighth land. The upper surface of the lower substrate has a ninth land connected to one side in the short direction of the second slit and a tenth land facing the ninth land and connected to the other side in the short direction of the second slit. The lower surface of the lower substrate has an eleventh land connected to one side in the short direction of the second slit and a twelfth land opposite the eleventh land and connected to the other side in the short direction of the second slit. A composite structure of a printed circuit board, characterized in that a second solder is applied to the seventh land, the eighth land, the ninth land, the tenth land, the eleventh land, the twelfth land, and the second through-hole.

4. In claim 2, The fourth convex portion has a 13th land and a 14th land facing each other on one side and the other side, The fourth convex portion has a third through-hole that penetrates the thirteenth land and the fourteenth land. The upper surface of the upper substrate has a 15th land connected to one side in the short direction of the fourth slit and a 16th land opposite to the 15th land and connected to the other side in the short direction of the fourth slit. The lower surface of the upper substrate has a 17th land connected to one side in the short direction of the fourth slit and a 18th land opposite to the 17th land and connected to the other side in the short direction of the fourth slit. Third solder is applied to the 13th land, the 14th land, the 15th land, the 16th land, the 17th land, the 18th land, and inside the third through-hole. The fifth convex portion has a 19th land and a 20th land facing each other on one side and the other side, The fifth convex portion has a fourth through-hole that penetrates the 19th land and the 20th land. The upper surface of the lower substrate has a 21 land connected to one side in the short direction of the 5th slit and a 22 land facing the 21 land and connected to the other side in the short direction of the 5th slit. The lower surface of the lower substrate has a 23 land connected to one side in the short direction of the 5th slit and a 24 land facing the 23 land and connected to the other side in the short direction of the 5th slit. A composite structure of a printed circuit board, characterized in that a fourth solder is applied to the 19th land, the 20th land, the 21st land, the 22nd land, the 23rd land, the 24th land, and inside the fourth through-hole.

5. In claim 2 or 4, Having a busbar located on the lower substrate, The composite structure of a printed circuit board is characterized in that the busbar is fitted into a first gap formed in the first connecting substrate and a second gap formed in the second connecting substrate.

6. In claim 1 or 2, A composite structure for a printed circuit board, characterized in that, in the first connecting substrate, a 25th land formed on one side of the first convex portion and a 26th land formed on one side of the second convex portion are electrically connected, the 25th land and a 26th land formed on the upper surface of the upper substrate are electrically connected, and the 26th land and a 27th land formed on the lower surface of the lower substrate are electrically connected.

7. In claim 6, A composite structure for a printed circuit board, characterized in that the upper end of the 25th land is located above the first slit, and the lower end of the 25th land is located below the first slit.

8. In claim 7, The upper substrate facing the 25th land has a fifth through-hole that is connected to the first slit and connected to the 26th land, The 25th land and the 26th land are connected by a sixth solder, A composite structure of a printed circuit board, characterized in that the sixth solder fills the fifth through-hole.

9. In claim 1 or 2, A composite structure for a printed circuit board, characterized in that the planar shapes of both longitudinal ends of the first slit and the second slit are T-shaped.

10. In claim 2 or 4, A composite structure for a printed circuit board, characterized in that the planar shapes of both longitudinal ends of the fourth slit and the fifth slit are T-shaped.

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