Apparatus for removing bonded materials and method for removing bonded materials

Abstract

The present invention provides a bonding device that suppresses defects in the peeling of a substrate from its housing compared to a case where the substrate is not pressed down by multiple claws. [Solution] The bonded object separation device 10 has a base 12, a plurality of claws 14, and contact claws 16. A workpiece 100 is placed on the base 12 with the substrate 120 facing upwards, in which a substrate 120 is bonded to the periphery of a hole 104 with adhesive 112 so as to close one end of the hole 104, in a resin housing 102 that extends in one direction and has a hole 104 that penetrates through in one direction. The plurality of claws 14 press both ends of the substrate 120 in an intersecting direction that intersects with the one direction toward the base 12. The contact claws 16 contact both sides of the housing 12 in the intersecting direction and deform the hole 104 in the intersecting direction until the adhesive 112 is destroyed.

Description

Technical Field

[0001] The present disclosure relates to a bonding material peeling device and a bonding material peeling method.

Background Art

[0002] The following Patent Document 1 discloses an adhesive peeling device. The adhesive peeling device includes a horizontally long main body, a fixed blade unit provided on the front surface near one end in the length direction of the main body, and a rail member disposed on the front surface of the main body from near the other end in the length direction of the main body to near the fixed blade unit. Further, the adhesive peeling device includes a moving blade unit that slides on the rail member, and a sliding unit for sliding the moving blade unit along the rail member. On the front surface of the fixed blade unit, a plate-shaped fixed blade having a penetration blade formed on one side is provided along the front surface of the main body. On the front surface of the moving blade unit, a plate-shaped moving blade having a penetration blade formed on one side and facing the fixed blade is provided along the front surface of the main body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a bonding material peeling device and a bonding material peeling method in which peeling failure of a substrate from a housing is suppressed as compared with a case where the substrate is pressed by a plurality of claws.

Means for Solving the Problems

[0005] The bonding release device according to the first embodiment includes a resin housing extending in one direction, having a hole formed through it in that direction, a base on which a bonded product is placed with the substrate facing upward, the bonded product having a substrate bonded to the periphery of the hole with an adhesive so as to close one end of the hole, a plurality of claws that press both ends of the substrate in an intersecting direction that intersects the one direction toward the base, and contact parts that contact both sides of the housing in the intersecting direction and deform the hole in the intersecting direction until the adhesive is destroyed.

[0006] The bonding release device according to the second embodiment comprises a resin housing extending in one direction, having a pair of walls formed on both sides of a hole penetrating in one direction, the same direction, a base on which a bonding device is placed with the substrate facing upward, in which a substrate is bonded to the periphery of the hole with an adhesive so as to close one end of the hole between the pair of walls, a plurality of claws that press both ends of the substrate in an intersecting direction that intersects the one direction toward the base, and a plurality of contact claws that contact the pair of walls located at two points separated in the one direction of the hole and widen the hole in the intersecting direction until the adhesive is destroyed.

[0007] The bonding release device according to the third embodiment is the bonding release device according to the second embodiment, wherein the plurality of contact claws are used to widen two positions in the hole that are separated in one direction and are not pressed against the substrate by the plurality of claws, in the intersecting direction.

[0008] The bonding release device according to the fourth embodiment is the bonding release device according to the third embodiment, wherein the plurality of contact claws are used to widen both ends in the one direction of the hole that are not pressed against the substrate by the plurality of claws in the intersecting direction.

[0009] The bonding release device according to the fifth embodiment is a bonding release device according to the third or fourth embodiment, wherein the bonding agent is provided in a dot-like manner at multiple intervals along the one direction, and the multiple claws press against the portion of the substrate between the multiple bonding agents in the one direction.

[0010] The joint separation device according to the sixth embodiment is a joint separation device according to the third or fourth embodiment, wherein the plurality of contact claws are used to widen the holes in the housing multiple times in the intersecting direction.

[0011] The joint separation device according to the seventh embodiment is the joint separation device described in the second embodiment, wherein the plurality of contact claws are a pair of contact claws, and the device has a moving part that moves the pair of contact claws in the one direction.

[0012] The bonding release device according to the eighth embodiment is configured such that, in the bonding release device described in the seventh embodiment, the pair of contact claws are moved by the moving part to one end of the hole in one direction, the pair of contact claws widen the hole multiple times in the intersecting direction, and then the pair of contact claws are moved by the moving part to the other end of the hole in one direction, the pair of contact claws widen the hole multiple times in the intersecting direction.

[0013] A method for peeling off a bonded object according to the ninth embodiment includes the steps of: placing a bonded object, in which a substrate is bonded to the periphery of a hole with an adhesive so as to close one end of a hole, on a stand with the substrate facing upwards; pressing both ends of the substrate in an intersecting direction that intersects the one direction toward the stand with a plurality of claws; and bringing contact portions into contact with both sides of the housing in the intersecting direction and deforming the hole in the intersecting direction until the adhesive is destroyed.

[0014] A method for peeling a bonded object according to the tenth embodiment includes the steps of: placing a bonded object, in which a substrate is bonded to the periphery of a hole with an adhesive between the pair of walls, onto a stand with the substrate facing upward, in a resin housing extending in one direction, having a pair of walls formed on both sides of a hole penetrating in one direction along the one direction, and a substrate being bonded to the periphery of the hole with an adhesive between the pair of walls; pressing both ends of the substrate in an intersecting direction that intersects the one direction toward the stand with a plurality of claws; and bringing a plurality of contact claws into contact with the pair of walls located at two separated locations in the one direction of the hole, and widening the hole in the intersecting direction until the adhesive is destroyed. [Effects of the Invention]

[0015] According to the bonding release device of the first embodiment, compared to the case where the substrate is not pressed with multiple claws, defects in the release of the substrate from the housing are suppressed.

[0016] According to the bonded material peeling device of the second embodiment, compared to the case where the substrate is not pressed with multiple claws, defects in peeling the substrate from the housing are suppressed.

[0017] In the third embodiment of the bonding peeling device, compared to the case where two positions close to one direction of the hole are widened in an intersecting direction using multiple contact claws, the bonding agent is more prone to damage.

[0018] In the fourth embodiment of the bonding peeling device, compared to the case where two positions on the central side of one direction of the hole are widened in an intersecting direction using multiple contact claws, the bonding agent is more prone to damage.

[0019] According to the bond peeling device of the fifth embodiment, compared to the case where multiple claws press the area near the bond on the substrate in one direction, the bond is more likely to break.

[0020] According to the joint peeling device of the sixth embodiment, compared to the case in which a hole is widened once in a cross direction using multiple contact claws, defects in peeling the substrate from the housing can be suppressed.

[0021] According to the seventh embodiment of the delamination device for bonded objects, compared to a configuration in which the pair of contact claws are not moved in one direction, it is easier to adjust the position in which the holes in the housing are widened in the intersecting direction.

[0022] According to the eighth embodiment of the delamination device for bonded materials, compared to the case in which a hole is widened once in an intersecting direction using multiple contact claws, defects in delamination of the substrate from the housing can be suppressed.

[0023] According to the method for peeling off a bonded object according to the ninth embodiment, compared to the case where the substrate is not pressed with multiple claws, defects in peeling the substrate from the housing are suppressed.

[0024] According to the method for peeling the conjugate according to the tenth aspect, the peeling failure of the substrate from the housing is suppressed as compared with the case where the substrate is not pressed by a plurality of claws.

Brief Description of Drawings

[0025] [Figure 1] It is a schematic front view showing a conjugate peeling device according to the first embodiment. [Figure 2] It is a schematic plan view showing a conjugate peeling device according to the first embodiment. [Figure 3] It is a schematic plan view showing a workpiece placed on the table of a conjugate peeling device according to the first embodiment. [Figure 4] It is a schematic front view showing the state during the operation of a conjugate peeling device according to the first embodiment. [Figure 5] It is a schematic plan view showing the state during the operation of a conjugate peeling device according to the first embodiment. [Figure 6] It is a schematic front view showing a conjugate peeling device according to the second embodiment. [Figure 7] It is a schematic plan view showing a conjugate peeling device according to the third embodiment. [Figure 8] It is a schematic plan view showing the state where a pair of contact claws in a conjugate peeling device according to the third embodiment are moved.

Modes for Carrying Out the Invention

[0026] Hereinafter, modes for carrying out the present invention will be described. The X direction (+X direction, -X direction), Y direction (+Y direction, -Y direction), and Z direction (+Z direction, -Z direction) used in the following description are the directions of the arrows shown in the drawings. Also, the X direction, Y direction, and Z direction are directions that intersect each other (specifically, orthogonal directions).

[0027] 〔First Embodiment〕 FIG. 1 is a schematic front view showing a conjugate peeling device 10 according to the first embodiment. Also, FIG. 2 is a schematic plan view showing the conjugate peeling device 10.

[0028] <Overall configuration of the bonding separation device> As shown in Figures 1 and 2, the bond separation device 10 has a table 12 on which to place a workpiece 100 as an example of a bonded object.

[0029] Now, let's describe the workpiece 100. As shown in Figures 1 and 2, the workpiece 100 comprises a resin housing 102 extending in one direction (direction A shown in Figure 2) and a substrate 120 joined to the housing 102 with a bonding agent 112 such as an adhesive. The housing 102 has one hole 104 that penetrates along one direction (direction A) (see Figure 3). The hole 104 penetrates the housing 102 in a direction intersecting the one direction (direction A). The width of the hole 104 (length in the X direction in Figure 1) is smaller than the width of the substrate 120 (length in the X direction in Figure 1). Also, the length of the hole 104 (length in the Y direction in Figure 1) is smaller than the length of the substrate 120 (length in the Y direction in Figure 1). In addition, the housing 102 has a pair of walls 106 formed on both sides of the hole 104 that are aligned along one direction (direction A). A substrate 120 is positioned in the housing 102 so as to close one end of the hole 104 (in Figure 1, the end in the direction intersecting one direction of the housing 102) between a pair of walls 106, and the substrate 120 is bonded to the periphery of the hole 104 with adhesive 112. As an example, the substrate 120 closes one end of the hole 104 along one direction.

[0030] As an example, the housing 102 is a rectangular block-shaped member in plan view. The substrate 120 is a rectangular plate-shaped member in plan view. Here, "plan view" refers to the view of the object from above. As an example, the housing 102 has a plurality of protrusions 108 formed between its pair of walls 106 along one direction (direction A). With the substrate 120 positioned between the protrusions 108, the substrate 120 is bonded to the protrusions 108 with adhesive 112. The adhesive 112 is provided in a dot-like manner (spot-like) at intervals along one direction (direction A). Note that in Figure 2, the protrusions 108 are pins arranged at intervals in one direction, but this disclosure is not limited to this configuration, and the protrusions 108 may be wall-like members formed continuously along one direction. In other words, the adhesive 112 may be provided in a dot-like manner at intervals in one direction so as to span the substrate 120 and the wall-like member.

[0031] As an example, workpiece 100 is a component of a CIS (Contact Image Sensor). In Figure 1, no lens is attached to workpiece 100, but it is also possible to have a configuration in which a lens is attached to the opposite side of workpiece 100 from the substrate 120 (the lower side shown in Figure 1).

[0032] In the bonded material separation device 10, the workpiece 100 is placed on the stand 12 with the substrate 120 facing upwards. In this state, one direction (direction A) of the housing 102 is aligned with the direction of Y (see Figure 2). The bonded material separation device 10 is a device that separates the substrate 120 from the housing 102 (i.e., separates it from the portion of the adhesive 112 that is bonded to the housing 102) while the workpiece 100 is placed on the stand 12. The substrate 120 separated from the housing 102 can be reused. For example, the substrate 120 is bonded (adhered) to a new housing 102 using the adhesive 112. For example, a resin housing 102 may be deformed or deteriorated and therefore discarded.

[0033] As shown in Figures 1 and 2, the bond separation device 10 has a plurality of (e.g., 16) claws 14 that press the substrate 120 toward the base 12, and a plurality of (e.g., 4) contact claws 16 that deform the holes 104 in the housing 102. The contact claws 16 are an example of a contact portion. Furthermore, the bond separation device 10 has a first drive device 18 that drives the plurality of claws 14, and a second drive device 20 that drives the plurality of contact claws 16.

[0034] (unit) As shown in Figure 1, the workpiece 100 to be stripped is placed on the stand 12 with the substrate 120 facing upwards and the side of the housing 102 with the hole 104 facing downwards. For example, the stand 12 is flat, but it may have a recess to match the shape of the workpiece 100 so that the lower part of the workpiece 100 can be inserted.

[0035] As shown in Figure 2, the base 12 is provided with a holding device 22 for holding the housing 102 of the workpiece 100 in a predetermined position on the base 12. The holding device 22 has three pins 24 that contact three different sides of the rectangular housing 102, and three pressing parts 26 that press the housing 102 from the opposite side of each pin 24 toward each pin 24. Each pressing part 26 has a pressing pin 26A that can contact the housing 102, and a main body 26B that moves the pressing pin 26A forward and backward. The pressing parts 26 are each positioned opposite to the side of the housing 102 that contacts the pins 24.

[0036] The three pressing parts 26 press the housing 102 by advancing the pressing pins 26A with the main body part 26B, thereby sandwiching the housing 102 between the pressing pins 26A and the pins 24 (see Figure 5). This holds the housing 102 in a predetermined position on the base 12.

[0037] (Multiple claws and first drive unit) As shown in Figure 2, the multiple claws 14 are arranged at intervals in one direction (direction A, in this example, direction Y) of the substrate 120. The multiple claws 14 are arranged on both sides of the intersecting direction (in this example, direction X) that intersects with the one direction of the substrate 120. For example, a pair of claws 14 are facing each other on both sides of the intersecting direction that intersects with the one direction of the substrate 120. Therefore, it can be said that the multiple claws 14 are arranged in multiple pairs with intervals in one direction (direction Y).

[0038] As shown in Figure 1, the pair of claws 14, which are positioned opposite each other on both sides in the intersecting direction (X direction) that intersects with one direction (Y direction) of the substrate 120, have a symmetrical shape. The pair of claws 14 are positioned along the intersecting direction (X direction in this example) that intersects with one direction of the substrate 120. Each pair of claws 14 includes an extension portion 14A that extends toward the substrate 120 from the outside in the intersecting direction (X direction in this example) that intersects with one direction of the substrate 120, and a projection portion 14B that extends downward (in the -Z direction in this example) from the end of the extension portion 14A.

[0039] The first drive unit 18 includes a drive unit 18A that drives a plurality of claws 14 on one side of the intersecting direction that intersects with one direction of the substrate 120 (for example, the right claws 14 in Figure 1). Furthermore, the first drive unit 18 includes a drive unit 18B that drives a claw 14 on the other side of the intersecting direction that intersects with one direction of the substrate 120 (for example, the left claws 14 in Figure 1). For example, the drive units 18A and 18B are configured to drive a plurality of claws 14 simultaneously.

[0040] The drive unit 18A moves one claw 14 (for example, the right side in Figure 1) toward the substrate 120 in the -X direction from the outside of the intersecting direction that intersects one direction of the substrate 120, and further moves it in a direction that presses the substrate 120 from above (-Z direction) (see Figures 4 and 5). This presses the protruding portion 14B of the one claw 14 against the upper surface of one end of the substrate 120 (the end in the +X direction). The drive unit 18B moves the other claw 14 (for example, the left side in Figure 1) toward the substrate 120 in the +X direction from the outside of the intersecting direction that intersects one direction of the substrate 120, and further moves it in a direction that presses the substrate 120 from above (-Z direction) (see Figures 4 and 5). This presses the protruding portion 14B of the other claw 14 against the upper surface of the other end of the substrate 120 (the end in the -X direction). As a result, the multiple claws 14 press both ends of the substrate 120 in the intersecting direction (X direction), which is intersecting with one direction (A direction), toward the base 12 (see Figure 4). At least a portion of both ends of the substrate 120 in the intersecting direction (X direction) that the multiple claws 14 press toward the base 12 is supported by the housing 102. In other words, at least a portion of the surface directly opposite the upper surface of both ends of the substrate 120 in the intersecting direction (X direction) that the multiple claws 14 press toward the base 12 is in contact with the upper surface of the housing 102. To put it another way, the entire surface directly opposite the upper surface of both ends of the substrate 120 in the intersecting direction (X direction) that the multiple claws 14 press toward the base 12 is not located at one end of the hole 104.

[0041] As shown in Figure 1, for example, the drive unit 18A and drive unit 18B include a slide unit 52 that slides a plurality of claws 14 horizontally (X direction) from the support unit 50, and a rod 54 that moves the support unit 50 vertically (Z direction) relative to the main body unit 56. Note that the drive unit 18A and drive unit 18B are not limited to the above configuration, and other configurations are also acceptable as long as the plurality of claws 14 can press the substrate 120 toward the base 12.

[0042] Multiple claws 14 press against the portion of the substrate 120 between multiple adhesives 112 in one direction (direction A) (see Figure 5). As an example, one claw 14 is placed between adjacent adhesives 112 in one direction (direction A) of the substrate 120, but the number of adhesives 112 and the number of claws 14 can be changed. For example, when 2 × N (N is a natural number of 3 or more) adhesives are provided in the Y direction as dots at similar, equivalent, or identical intervals (pitch), 2 × (N-1) claws 14 can be provided in the Y direction at similar, equivalent, or identical intervals in the center of the Y direction between adjacent adhesives, or when 2 × N (N is a natural number of 4 or more) adhesives are provided in the Y direction as dots, at similar, equivalent, or identical intervals, N-1 claws 14 can be provided in the Y direction at twice the interval of the adhesives, in the center of the Y direction between adjacent adhesives.

[0043] (Multiple contact claws and a second drive mechanism) As shown in Figures 1 and 2, the multiple contact claws 16 are arranged in a direction (Z direction) that intersects with the planar direction (X direction and Y direction) of the base 12. The multiple contact claws 16 are members that protrude in the direction of the housing 102 of the workpiece 100 placed on the base 12. As an example, the contact claws 16 are cylindrical rod-shaped members. A total of four contact claws 16 are arranged in pairs (two) at both ends of one direction (A direction, i.e., Y direction) of the housing 102 (see Figure 2). The pairs of contact claws 16 are spaced apart in the intersecting direction (X direction in this example) that intersects with one direction of the substrate 120. Specifically, as shown in Figure 2, the Y-direction position of the pair of contact claws 16 on one side (-Y direction side, left side of Figure 2) is preferably in the middle between the claw 14 located furthest to the -Y direction (the leftmost claw in Figure 2) and the adjacent claw 14. Furthermore, the Y-direction position of the other pair of contact claws 16 (on the +Y direction side, the right side in Figure 2) is preferably in the center between the claw 14 located furthest to the +Y direction (the rightmost claw in Figure 2) and the claw 14 adjacent to it. Note that only one pair of contact claws 16 may be arranged in the center of one direction (A direction, Y direction) of the housing 102, for a total of two. Specifically, the Y-direction position of the pair of contact claws 16 may be in the center between two adjacent claws 14 in the Y direction (the fourth claw from the right in Figure 2 and the fourth claw from the left in Figure 2) in the center of the Y direction among the multiple claws 14.

[0044] As shown in Figure 1, the second drive unit 20 includes a support portion 20A that supports each of the multiple contact claws 16, and a drive unit 20B that drives the support portions 20A. The drive unit 20B moves a pair of contact claws 16 supported by the support portion 20A to the position of a pair of walls 106 of the workpiece 100, and further moves the pair of contact claws 16 in a direction away from each other in the intersecting direction (in this example, the X direction) (arrow B direction) (see Figure 4). As an example, the second drive unit 20 is positioned at both ends of the workpiece 100 in one direction (direction A, i.e., the Y direction), and drives a pair of contact claws 16 respectively. This causes the pair of contact claws 16 positioned at both ends of the workpiece 100 in one direction to come into contact with the substrate 120-side surface (surface facing the substrate 120) of a pair of walls 106 located at two locations separated in one direction of the hole 104, and moves them in a direction away from each other, widening the hole 104 in the intersecting direction (in this example, the X direction) until the bonding agent 112 breaks. Here, failure refers to the separation (breakage) of the workpiece 100 into two parts due to at least one of the following: cohesive failure, which is failure within the bonding agent 112; interfacial failure, which is failure at the bonding interface between the bonding agent 112 and the housing 102; and interfacial failure, which is failure at the bonding interface between the bonding agent 112 and the substrate 120. In other words, failure refers to the occurrence of at least one of the following: cohesive failure, which is a state in which the bonding agent layer formed by the bonding agent 112 is destroyed and separated into two parts; interfacial failure, which is a state in which the bonding agent 112 is completely peeled off from the housing 102; and interfacial failure, which is a state in which the bonding agent 112 is completely peeled off from the substrate 120.

[0045] Although the second drive unit 20 is positioned at both ends of the workpiece 100 in one direction (direction A) (see Figure 2), the disclosure is not limited to this configuration. For example, the second drive unit 20 may be composed of an integrated device that drives a plurality of contact claws 16.

[0046] In the bond separation device 10, it is preferable to use multiple contact claws 16 to widen two locations (two locations on a pair of walls 106) in a cross direction (in this example, the X direction) at which the multiple claws 14 are not pressing against the substrate 120. That is, the multiple contact claws 16 are brought into contact with a pair of walls 106 located at two locations in the workpiece 100 that are separated in one direction from the hole 104, thereby widening the hole 104 in a cross direction (in this example, the X direction). In other words, the bond separation device 10 positions the multiple contact claws 16 approximately in the center between adjacent claws 14 in one direction (Y direction), moves a pair of opposing contact claws 16 in the X direction to separate them from each other, brings them into contact with a pair of walls 106, and continues this operation to widen the hole 104 in a cross direction (X direction).

[0047] As an example, in the bond separation device 10, the multiple claws 14 press against the substrate 120, and both ends of the hole 104 in one direction (direction A) (both ends of the pair of walls 106) are widened in a cross direction (in this example, the X direction) using multiple contact claws 16 (see Figure 5). In other words, the bond separation device 10 positions the pair of contact claws 16 on one side of one direction (left side in Figure 5) in the center between a pair of claws 14 that are adjacent to each other on one side of a plurality of pairs of claws 14 arranged in one direction (in Figure 5, the leftmost pair of claws 14 and the pair of claws 14 adjacent to the leftmost pair of claws 14 in the +Y direction), and moves them in a direction that separates them from each other to widen one end of the hole 104 in one direction in a cross direction. At the same time, the bonding separation device 10 positions a pair of contact claws 16 on the other side of one direction (right side in Figure 5) in the center between a pair of adjacent claws 14 (in Figure 5, the rightmost pair of claws 14 and the pair of claws 14 adjacent to the rightmost pair of claws 14 in the -Y direction) among a plurality of pairs of claws 14 arranged in alignment in one direction, and moves them in a direction that separates them from each other to widen the other end of the hole 104 in one direction in the intersecting direction. For example, the plurality of contact claws 16 widen both ends of the hole 104 in one direction (direction A) (both ends of the pair of walls 106) simultaneously in the intersecting direction (in this example, the X direction), but they may be moved with a time difference instead of simultaneously.

[0048] The bond separation device 10 is configured to widen the hole 104 in the housing 102 multiple times in the intersecting direction (X direction) using multiple contact claws 16. There is no particular limit to the number of times, as long as it is two or more preferred times.

[0049] <Details of the method for separating bonded materials> Next, we will explain how to separate workpiece 100, which is an example of a joined object.

[0050] In the first embodiment, a method for peeling the workpiece 100 is performed using a bonded material peeling device 10. As shown in Figures 1 and 2, in the bonded material peeling device 10, the workpiece 100 is placed on the stand 12 with the substrate 120 facing upwards (first step).

[0051] Subsequently, the holding device 22 of the bond separation device 10 is driven. Specifically, two different sides of the housing 102 on the workpiece 100 are brought into contact with the three pins 24, and the three pressing parts 26 press the pressing pins 26A against the other two different sides of the housing 102, thereby sandwiching the housing 102 between the pressing pins 26A and the pins 24 (see Figure 5). This fixes the housing 102 in a predetermined position on the base 12. In this state, one direction (direction A) of the housing 102 is aligned with the direction Y.

[0052] Furthermore, by driving the drive units 18A and 18B of the first drive unit 18, the multiple claws 14 press both ends of the substrate 120 in the intersecting direction, which intersects with one direction (direction A), toward the base 12 (see second step, Figures 4 and 5). In this example, the intersecting direction, which intersects with one direction (direction A), is the X direction. By pressing the substrate 120 toward the base 12 with the multiple claws 14, it is possible to suppress the substrate 120 from shifting relative to the base 12.

[0053] Subsequently, the second drive unit 20 is driven to bring multiple contact claws 16 into contact with the substrate 120 side of the pair of walls 106 in the workpiece 100, and the hole 104 in the housing 102 is expanded in a crossing direction (X direction) intersecting one direction (A direction) until the bonding agent 112 is destroyed (see third step, Figures 4 and 5). As an example, the hole 104 in the housing 102 is expanded multiple times in the crossing direction (X direction) using multiple contact claws 16.

[0054] Through the first to third steps described above, the substrate 120 can be peeled off from the adhesive 112 portion of the housing 102.

[0055] <Operation and Effects of the First Embodiment> Next, the operation and effects of the first embodiment will be described.

[0056] The bonded material separation device 10 uses a workpiece 100 in which a substrate 120 is bonded to the periphery of a hole 104 with adhesive 112 so as to close one end of the hole 104, in a resin housing 102 that extends in one direction (direction A) through the hole 104. In the bonded material separation device 10, the workpiece 100 is placed on a stand 12 with the substrate 120 facing upwards (see Figure 1, etc.).

[0057] Furthermore, in the bond separation device 10, multiple claws 14 press both ends of the substrate 120 in a direction intersecting one direction (direction A) toward the base 12 (see Figure 4). This prevents the substrate 120 from shifting relative to the base 12.

[0058] Furthermore, in the bond separation device 10, multiple contact claws 16 contact both sides of the housing 102 in an intersecting direction that intersects with one direction (direction A), and move in the intersecting direction away from each other, deforming the hole 104 in the intersecting direction until the adhesive 112 is destroyed (see Figures 4 and 5).

[0059] Therefore, in the bonded material peeling device 10, compared to the case where the substrate 120 is not pressed with multiple claws 14, peeling defects of the substrate 120 from the housing 102 are suppressed. Here, peeling defects refer to the situation where the substrate 120 and the housing 102 are bonded by at least a portion of the bonding agent 112 without the bonding agent 112 being destroyed.

[0060] In the bonded material separation device 10, a workpiece 100 is used in which a substrate 120 is bonded to the periphery of a hole 104 with a bonding agent 112 so as to close one end of the hole 104 between the pair of walls 106 in a resin housing 102 having a pair of walls 106 formed along one direction (direction A) on both sides of the intersecting direction of the hole 104. In the bonded material separation device 10, the workpiece 100 is placed on a stand 12 with the substrate 120 facing upwards (see Figure 1, etc.).

[0061] Furthermore, in the bond separation device 10, multiple claws 14 press both ends of the substrate 120 in a direction intersecting one direction (direction A) toward the base 12 (see Figure 4). This prevents the substrate 120 from shifting relative to the base 12.

[0062] Furthermore, in the bond separation device 10, multiple contact claws 16 contact a pair of walls 106 located at two separate locations in one direction of the hole 104, and move in intersecting directions that move apart from each other, widening the hole 104 in the intersecting directions until the adhesive 112 is destroyed (see Figures 4 and 5).

[0063] Therefore, in the bonded material peeling device 10, compared to the case where the substrate 120 is not pressed with multiple claws 14, defects in peeling the substrate 120 from the housing 102 are suppressed.

[0064] Furthermore, in the bonded material peeling device 10, multiple claws 16 are used to widen two locations in one direction (direction A) of the hole 104 that are not pressed against the substrate 120 by multiple claws 14, in an intersecting direction in one direction. Therefore, compared to the case where multiple contact claws 16 are used to widen two locations in the hole 104 that are close together in one direction, the bonded material 112 is more prone to damage in the bonded material peeling device 10.

[0065] Furthermore, in the bonded material peeling device 10, the multiple claws 16 are used to widen both ends of the hole 104 in one direction (direction A) that are not pressed against the substrate 120 by the multiple claws 14, in a crossing direction in that direction. As a result, in the bonded material peeling device 10, the bonded material 112 is more prone to damage compared to the case where the multiple contact claws 16 are used to widen two locations on the central side of the hole 104 in a crossing direction.

[0066] Furthermore, in the bonded material peeling device 10, the adhesive 112 is provided in a dot-like (spot-like) manner at multiple intervals along one direction (direction A). Multiple claws 14 press against the portion of the substrate 120 between the multiple adhesives 112 in one direction. For this reason, in the bonded material peeling device 10, the adhesive 112 is more prone to damage compared to the case where the multiple claws 14 press against the area near the adhesive 112 on the substrate 120 in one direction.

[0067] Furthermore, the bonded material peeling device 10 uses multiple contact claws 16 to widen the hole 104 in the housing 102 multiple times in a unidirectional intersecting direction. Therefore, compared to the case where the hole 104 is widened only once in a unidirectional direction using multiple contact claws 16, the bonded material peeling device 10 can suppress defects (mistakes) in peeling the substrate 120 from the housing 102.

[0068] Furthermore, the method for separating the bonded object uses a workpiece 100 in which a substrate 120 is bonded to the periphery of a hole 104 with adhesive 112 so as to close one end of the hole 104, in a resin housing 102 that extends in one direction (direction A) through the housing 102. The method for separating the bonded object includes the step of placing the workpiece 100 on a stand 12 with the substrate 120 facing upwards. The method for separating the bonded object also includes the step of pressing both ends of the substrate 120 in an intersecting direction that intersects with the one direction (direction A) toward the stand 12 with a plurality of claws 14. Furthermore, the method for separating the bonded object includes the step of bringing contact claws 16 into contact with both sides of the intersecting direction of the housing 102 and deforming the hole 104 in the intersecting direction until the adhesive 112 is destroyed.

[0069] Therefore, in the method for peeling the bonded material, the defect of peeling the substrate 120 from the housing 102 is suppressed compared to the case where the substrate 120 is not pressed with multiple claws 14.

[0070] Furthermore, in the method for separating the bonded object, a workpiece 100 is used in which a substrate 120 is bonded to the periphery of the hole 104 with adhesive 112 so as to close one end of the hole 104 between the pair of walls 106, in a resin housing 102 having a pair of walls 106 formed along one direction (direction A) on both sides of the hole 104. The method for separating the bonded object includes the step of placing the workpiece 100 on a stand 12 with the substrate 120 facing upwards. The method for separating the bonded object also includes the step of pressing both ends of the substrate 120 in an intersecting direction that intersects with the one direction (direction A) toward the stand 12 with a plurality of claws 14. Furthermore, the method for separating the bonded object includes the step of bringing a plurality of contact claws 16 into contact with a pair of walls 106 located at two separate locations in one direction of the hole 104, and widening the hole 104 in the intersecting direction until the adhesive 112 is destroyed.

[0071] Therefore, in the method for peeling the bonded material, the defect of peeling the substrate 120 from the housing 102 is suppressed compared to the case where the substrate 120 is not pressed with multiple claws 14.

[0072] [Second Embodiment] Next, the peeling device for bonded products according to the second embodiment will be described. Note that components identical to those in the first embodiment described above will be given the same numbers and their descriptions will be omitted.

[0073] As shown in Figure 6, in the bond separation device 200 of the second embodiment, the workpiece 150, which is an example of a bond, and the stand 202 on which the workpiece 150 is placed, differ from the configuration of the workpiece 100 and bond separation device 10 of the first embodiment.

[0074] As an example, workpiece 150 is a component of an LED print head. Workpiece 150 comprises a resin housing 152 extending in one direction (the Y direction perpendicular to the X direction in Figures 6 and 7) and a substrate 170 bonded to the housing 152 with adhesive 162. The housing 152 has one hole 154 that penetrates along one direction. The hole 154 penetrates in a direction intersecting the one direction in the housing 152 (the Z direction in Figure 6). The housing 152 has a pair of walls 156 that extend along one direction on both sides of the hole 154. The substrate 170 is positioned in the housing 152 so as to close one end of the hole 154 between the pair of walls 156, and the substrate 170 is bonded to the periphery of the hole 154 with adhesive 162.

[0075] As an example, the housing 152 is a rectangular block-shaped member in plan view, with a shape in which the outer diameter gradually decreases in the -Z direction. The outer diameter of the lower end 152A of the housing 152 is smaller than the outer diameter near the pair of walls 156. The substrate 170 is a rectangular plate-shaped member in plan view. As an example, the substrate 170 is joined to the sides of the pair of walls 156 with adhesive 162. Although not shown in the figure, the adhesive 162 is provided in a dot-like (spot-like) manner at multiple intervals along one direction of the pair of walls 156. The holes 154 of the housing 152 have a shape in which the width of the inner wall gradually decreases in the -Z direction.

[0076] The bond separation device 200 includes a stand 202 on which the workpiece 150 is placed with the substrate 170 facing upwards. The stand 202 has a recess 204 into which the lower end portion 152A of the housing 152 is inserted. The width of the recess 204 in the X direction is slightly larger than the width of the lower end portion 152A of the housing 152 in the X direction. The other configurations of the bond separation device 200 are the same as those of the bond separation device 10 of the first embodiment. The method for separating the bond is also the same as the method for separating the bond of the first embodiment.

[0077] Specifically, the bond release device 200 is equipped with multiple claws 14 that press both ends of the substrate 170 toward the base 202 in a direction intersecting one direction (the X direction in Figure 6). Furthermore, the bond release device 200 is equipped with multiple contact claws 16 that contact a pair of walls 156 located at two separate locations in one direction of the hole 154, and expand the hole 104 in the intersecting direction (X direction) until the adhesive 112 is destroyed.

[0078] The bonded material peeling device 200 has the same configuration as the bonded material peeling device 10 of the first embodiment, and can achieve the same operation and effect. Furthermore, the bonded material peeling method can achieve the same operation and effect by following the same steps as the bonded material peeling method of the first embodiment.

[0079] [Third Embodiment] Next, the peeling device for bonded products according to the third embodiment will be described. Note that components identical to those in the first and second embodiments described above will be given the same numbers and their descriptions will be omitted.

[0080] As shown in Figures 7 and 8, the configuration of the pair of contact claws 302 and the movable part 310 in the bonded material peeling device 300 of the second embodiment differs from the configuration of the bonded material peeling device 10 of the first embodiment.

[0081] The bond separation device 300 includes a pair of contact claws 302 arranged in an intersecting direction (in this example, the X direction) that intersects one direction (direction A). Furthermore, the bond separation device 300 includes a moving unit 310 that moves the pair of contact claws 302 in one direction (direction A). The moving unit 310 moves a second drive unit 304 that drives the pair of contact claws 302 in one direction (direction A).

[0082] The second drive unit 304 brings a pair of contact claws 302 into contact with a pair of walls 106 in the workpiece 100, and presses the pair of contact claws 302 in a crossing direction (in this example, the X direction) away from each other. As a result, the pair of contact claws 302 expand the hole 104 in the housing 102 in the crossing direction until the bonding agent 112 is destroyed.

[0083] As shown in Figure 7, the bonding separation device 300 moves a pair of contact claws 302 to one end of the hole 104 in one direction (direction A) using the moving part 310. In this state, the second drive device 304 expands the pair of contact claws 302 multiple times in a cross direction (in this example, the X direction) that intersects the one direction with the hole 104 of the housing 102.

[0084] As shown in Figure 8, the bond separation device 300 moves a pair of contact claws 302 to the other end of the hole 104 in one direction (direction A) using a moving part 310. In this state, the second drive device 304 expands the pair of contact claws 302 multiple times in a crossing direction (in this example, direction X) that intersects the one direction with the hole 104 of the housing 102. The other configurations of the bond separation device 300 are the same as those of the bond separation device 10 of the first embodiment. The method of separating the bond is also the same as the method of separating the bond of the first embodiment.

[0085] The bonded material peeling device 300 has the same configuration as the bonded material peeling device 10 of the first embodiment, and can achieve the same operation and effect. Furthermore, the bonded material peeling method can achieve the same operation and effect by following the same steps as the bonded material peeling method of the first embodiment.

[0086] Furthermore, the bonded material peeling device 300 has a different configuration from the bonded material peeling device 10 of the first embodiment, and can obtain the following actions and effects.

[0087] The bond separation device 300 is provided with a pair of contact claws 302 and a moving part 310 that moves the pair of contact claws 302 in one direction. Therefore, compared to a configuration in which the pair of contact claws 302 are not moved in one direction, the bond separation device 300 makes it easier to adjust the position in which the holes 104 in the housing 102 are widened in the intersecting direction.

[0088] Furthermore, in the bonded material peeling device 300, the moving part 310 moves a pair of contact claws 302 to one end of the hole 104 in one direction, and the pair of contact claws 302 widens the hole 104 multiple times in an intersecting direction that intersects with the one direction. After that, the moving part 310 moves the pair of contact claws 302 to the other end of the hole 104 in one direction, and the pair of contact claws 302 widens the hole 104 multiple times in an intersecting direction that intersects with the one direction. Therefore, the bonded material peeling device 300 can suppress defects (mistakes) in peeling the substrate 120 from the housing 102 compared to the case where the hole 104 is widened once in an intersecting direction using multiple contact claws 302.

[0089] 〔supplementary explanation〕 In the bond separation apparatus of the first to third embodiments, the shape of the multiple claws 14 is not limited to the configuration of the disclosure and can be changed. Furthermore, the configuration of each part of the first drive unit 18 that drives the multiple claws 14 is not limited to the configuration of the disclosure. The first drive unit can have any configuration as long as it can drive the multiple claws 14 in the same manner as in the first to third embodiments.

[0090] In the bond separation devices of the first and second embodiments, the shape of the plurality of contact claws 16 is not limited to the configuration of the present disclosure and can be changed. Furthermore, the configuration of each part of the second drive device 20 that drives the plurality of contact claws 16 is not limited to the configuration of the present disclosure. The second drive device can have any configuration as long as it can drive the plurality of contact claws 16 in the same manner as in the first and second embodiments.

[0091] In the bonding separation device of the third embodiment, the shape of the plurality of contact claws 302 is not limited to the configuration of the disclosure and can be changed. Furthermore, the configuration of each part of the second drive device 304 that drives the plurality of contact claws 302 is not limited to the configuration of the disclosure. The second drive device can have any configuration as long as it can drive the plurality of contact claws 302 in the same manner as in the third embodiment.

[0092] Furthermore, in the first to third embodiments, the shapes of the workpieces 100 and 150 to be peeled off can be changed without departing from the present invention.

[0093] Furthermore, in the first to third embodiments, the pair of contact claws 16 are configured to open in an intersecting direction that intersects one direction with the housings 102 and 152, but the present disclosure is not limited to this configuration. For example, the two sides of the housings 102 and 152 may be sucked by a pair of vacuum chucks as an example of contact parts, and then the pair of vacuum chucks may move in an intersecting direction so that they separate from each other.

[0094] Furthermore, in the first to third embodiments, the holes 104 and 154 of the housings 102 and 152 were deformed to widen in the intersecting direction, but the present disclosure is not limited to this configuration. For example, if the width of the holes in the housing is wide in the intersecting direction, the housing may be deformed in a direction that narrows the width of the holes.

[0095] Although the present invention has been described in detail with respect to specific embodiments, it will be apparent to those skilled in the art that the present invention is not limited to these embodiments, and that various other embodiments are possible within the scope of the present invention.

[0096] [Note] (((1))) A resin housing extending in one direction has a hole formed through it in one direction, and a substrate is bonded to the periphery of the hole with an adhesive so as to close one end of the hole, and a stand on which the substrate is placed with the substrate facing upwards. Multiple claws that press both ends of the substrate in an intersecting direction, which is intersecting with the one direction, toward the base, Contact portions that contact both sides of the housing in the intersecting direction and deform the hole in the intersecting direction until the adhesive breaks, A device for peeling off bonded materials.

[0097] (((2))) A resin housing extending in one direction, having a pair of walls formed on both sides of a hole penetrating in one direction, and a substrate bonded to the periphery of the hole with adhesive between the pair of walls so as to close one end of the hole, is placed on a stand with the substrate facing upwards. Multiple claws that press both ends of the substrate in an intersecting direction, which is intersecting with the one direction, toward the base, Multiple contact claws that contact the pair of walls located at two separate locations in the same direction within the hole, and expand the hole in the intersecting direction until the adhesive is destroyed, A device for peeling off bonded materials.

[0098] (((3))) A peeling device for a bonded product according to (((2))), wherein the plurality of contact claws are used to widen two positions in the hole that are separated in one direction and not pressed against the substrate by the plurality of claws in the intersecting direction.

[0099] (((4))) A peeling device for a bonded product according to (((3))), wherein the plurality of contact claws are used to widen both ends in the one direction of the hole that are not pressed against the substrate by the plurality of claws in the intersecting direction.

[0100] (((5))) The aforementioned bonding agent is provided in a dotted manner at multiple intervals along the aforementioned one direction. The apparatus for peeling a bonded product according to any one of (((2))) to (((4))), wherein the plurality of claws press the portion of the substrate between the plurality of bonding agents in the one direction.

[0101] (((6))) A peeling device for a bonded object according to any one of (((2))) to (((5))), wherein the hole in the housing is widened multiple times in the intersecting direction using the plurality of contact claws.

[0102] (((7))) The plurality of contact claws are a pair of contact claws, A device for peeling off a bonded object according to any one of (((2))) to (((6))), having a movable part for moving the pair of contact claws in the one direction.

[0103] (((8))) With the moving part moving the pair of contact claws to one end of the hole in one direction, after the pair of contact claws have widened the hole multiple times in the intersecting direction, The peeling device for bonded objects according to claim 7, wherein the pair of contact claws are moved by the moving part to the other end of the hole in one direction, and the pair of contact claws are configured to widen the hole multiple times in the intersecting direction.

[0104] (((9))) A step of placing a bonded object, in which a resin housing extending in one direction has a hole formed through it in one direction, and a substrate is bonded to the periphery of the hole with an adhesive so as to close one end of the hole, onto a stand with the substrate facing upwards. A step of pressing both ends of the substrate in an intersecting direction that intersects the one direction toward the base with multiple claws, The process involves bringing the contact portion into contact with both sides of the housing in the intersecting direction, and deforming the hole in the intersecting direction until the adhesive breaks down. A method for peeling off a bonded material having a specific characteristic.

[0105] (((10))) The process involves placing a bonded object, in which a resin housing extending in one direction has a pair of walls formed on both sides of a hole penetrating in one direction, and a substrate is bonded to the periphery of the hole with an adhesive so as to close one end of the hole between the pair of walls, onto a stand with the substrate facing upwards. A step of pressing both ends of the substrate in an intersecting direction that intersects the one direction toward the base with multiple claws, The process involves bringing a plurality of contact claws into contact with the pair of walls located at two separate locations in the same direction within the hole, and expanding the hole in the intersecting direction until the adhesive is destroyed. A method for peeling off a bonded material having a specific characteristic.

[0106] According to the bonding release device described in (((1))), the failure to release the substrate from the housing is suppressed compared to the case where the substrate is not pressed with multiple claws.

[0107] According to the bonding release device described in (((2))), defects in the release of the substrate from the housing are suppressed compared to the case where the substrate is not pressed with multiple claws.

[0108] In the case of the bonding material peeling device described in (((3))), the bonding agent is more prone to damage compared to the case in which two positions close to one direction of the hole are widened in an intersecting direction using multiple contact claws.

[0109] In the case of the bonding peeling device described in (((4))), the bonding agent is more prone to damage compared to the case in which the two positions on the central side of one direction of the hole are widened in an intersecting direction using multiple contact claws.

[0110] With the bonding removal device described in (((5))), the bonding agent is more prone to damage compared to the case where multiple claws press the area near the bonding agent in one direction on the substrate.

[0111] The delamination device for bonded materials described in (((6))) can suppress defects (mistakes) in delaminating the substrate from the housing compared to the case in which multiple contact claws are used to widen the hole once in the intersecting direction.

[0112] The delamination device for bonded materials according to (((7))) makes it easier to adjust the position in which the holes in the housing are widened in the intersecting direction, compared to a configuration in which the pair of contact claws are not moved in one direction.

[0113] The delamination device for bonded materials described in (((8))) can suppress defects (mistakes) in delaminating the substrate from the housing compared to the case in which a hole is widened once in the intersecting direction using multiple contact claws.

[0114] According to the method for peeling off the bonded material described in (((9))), the defect of peeling the substrate from the housing is suppressed compared to the case where the substrate is not pressed with multiple claws.

[0115] According to the method for peeling off the bonded material described in (((10))), the defect of peeling the substrate from the housing is suppressed compared to the case in which the substrate is not pressed with multiple claws. [Explanation of symbols]

[0116] 10. Apparatus for separating bonded materials 12 units 14 claws 16. Contact claws (an example of a contact part) 100 Workpieces (Examples of Joined Parts) 102 circuit boards 102 cabinets 104 holes 106 A pair of walls 112 Bonding agent 120 circuit boards 150 Workpieces (Examples of Joined Parts) 152 cabinets 154 holes 156 A pair of walls 162 Bonding agent 170 circuit boards 200 Joint separation device 202 units 300 Bonding device 302 Contact claw (an example of a contact part) 310 Mobile Unit

Claims

1. A resin housing extending in one direction has a hole formed through it in one direction, and a substrate is bonded to the periphery of the hole with an adhesive so as to close one end of the hole, and a stand on which the substrate is placed with the substrate facing upwards. Multiple claws that press both ends of the substrate in an intersecting direction, which is intersecting with the one direction, toward the base, Contact portions that contact both sides of the housing in the intersecting direction and deform the hole in the intersecting direction until the adhesive breaks, A device for peeling off bonded materials.

2. A resin housing extending in one direction, having a pair of walls formed on both sides of a hole penetrating in one direction, and a substrate bonded to the periphery of the hole with adhesive between the pair of walls so as to close one end of the hole, is placed on a stand with the substrate facing upwards. Multiple claws that press both ends of the substrate in an intersecting direction, which is intersecting with the one direction, toward the base, Multiple contact claws that contact the pair of walls located at two separate locations in the same direction within the hole, and expand the hole in the intersecting direction until the adhesive is destroyed, A device for peeling off bonded materials.

3. The bonding peeling device according to claim 2, wherein the plurality of contact claws are used to widen two positions in the hole that are separated in one direction from the substrate and are not pressed against the substrate by the plurality of claws, in the intersecting direction.

4. The delamination device for a bonded product according to claim 3, wherein the plurality of contact claws are used to widen both ends of the hole in one direction that are not pressed against the substrate by the plurality of claws in the intersecting direction.

5. The aforementioned bonding agent is provided in a dotted manner at multiple intervals along the aforementioned one direction. The apparatus for peeling a bonded product according to claim 3 or 4, wherein the plurality of claws press against the portion of the substrate between the plurality of bonding agents in the one direction.

6. The peeling device for a bonded object according to claim 3 or claim 4, wherein the hole in the housing is widened multiple times in the intersecting direction using the plurality of contact claws.

7. The plurality of contact claws are a pair of contact claws, The peeling device for bonded objects according to claim 2, further comprising a moving part for moving the pair of contact claws in the one direction.

8. With the moving part moving the pair of contact claws to one end of the hole in one direction, after the pair of contact claws have widened the hole multiple times in the intersecting direction, The peeling device for bonded objects according to claim 7, wherein the pair of contact claws are moved by the moving part to the other end of the hole in one direction, and the pair of contact claws are configured to widen the hole multiple times in the intersecting direction.

9. A step of placing a bonded object, in which a resin housing extending in one direction has a hole formed through it in one direction, and a substrate is bonded to the periphery of the hole with an adhesive so as to close one end of the hole, onto a stand with the substrate facing upwards. A step of pressing both ends of the substrate in an intersecting direction that intersects the one direction toward the base with multiple claws, The process involves bringing the contact portion into contact with both sides of the housing in the intersecting direction, and deforming the hole in the intersecting direction until the adhesive breaks down. A method for peeling off a bonded material having a specific characteristic.

10. The process involves placing a resin housing extending in one direction, having a pair of walls formed on both sides of a hole penetrating in one direction, and a substrate bonded to the periphery of the hole with an adhesive between the pair of walls so as to close one end of the hole, onto a stand with the substrate facing upwards. A step of pressing both ends of the substrate in an intersecting direction that intersects the one direction toward the base with multiple claws, The process involves bringing a plurality of contact claws into contact with the pair of walls located at two separate locations in the same direction within the hole, and expanding the hole in the intersecting direction until the adhesive is destroyed. A method for peeling off a bonded material having a specific characteristic.

Images