Light-emitting device and method for manufacturing a light-emitting device

JP2026090517APending Publication Date: 2026-06-02CANON KK
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
CANON KK
Filing Date
2026-02-26
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing organic EL display devices face reliability issues due to moisture penetration through the bonding pad, leading to decreased yield and pad reliability, as conventional methods involve double film formation and etching which can compromise the pad structure.

Method used

A light-emitting device with a pixel region and peripheral region featuring an insulating layer with a sloped surface and a sealing layer, where the insulating layer is isotropically etched to form an opening, and the sealing layer is anisotropically etched to expose the metal layer, minimizing moisture intrusion and reducing excessive etching of the pad electrode.

Benefits of technology

This structure enhances the reliability of the pads by reducing moisture-induced corrosion and improving yield during the mounting process, while maintaining pad opening dimensions.

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Abstract

This prevents corrosion of the pad electrodes of the light-emitting device and improves its reliability. [Solution] A light-emitting device having a pixel region on which a plurality of light-emitting elements are arranged, and a peripheral region on which an electrode terminal for electrically connecting to an external terminal and an insulating layer covering the electrode terminal are arranged, wherein the electrode terminal is composed of a first metal layer exposed by an opening in the insulating layer, an insulating layer arranged on the first metal layer, and a sealing layer arranged on the insulating layer, wherein the upper surface of the insulating layer is inclined with respect to the first metal layer at the end on the opening side.
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