electrostatic chuck
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOTO LTD
- Filing Date
- 2026-03-03
- Publication Date
- 2026-06-02
AI Technical Summary
Existing electrostatic chucks face challenges in maintaining uniformity of in-plane temperature distribution due to the increasing number of power supply terminals and refrigerant flow paths, leading to temperature unevenness.
The electrostatic chuck design incorporates a ceramic dielectric substrate with a spiral-shaped refrigerant passage, multiple zones, and power supply terminals arranged in annular portions to improve temperature uniformity, with a configuration that suppresses temperature variations caused by terminal positions.
This design enhances the uniformity of temperature distribution across the processing surface by optimizing the arrangement of power supply terminals and refrigerant flow, ensuring consistent heating and cooling across the substrate.
Smart Images

Figure 2026090573000001_ABST