Low-pressure heat pipe and low-pressure heat transfer method for heat pipes

JP2026090583APending Publication Date: 2026-06-02HONEYWELL INTERNATIONAL INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
HONEYWELL INTERNATIONAL INC
Filing Date
2026-03-04
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing heat pipes using high-pressure working fluids face challenges in maintaining structural integrity and efficiency, particularly in applications where cost, weight, and heat transfer in small areas are critical, such as in portable electronic devices.

Method used

Implementing a heat transfer method in heat pipes that limits the total non-condensable gas (NCG) concentration in the condenser section to less than 1 volume%, preferably between 0.2% to 0.5% volume%, using specific low-pressure working fluids like R1233zd, R1234ze, and others, to enhance heat transfer efficiency.

Benefits of technology

This approach improves heat transfer efficiency while reducing material and manufacturing costs, making it suitable for lightweight, compact electronic devices with high thermal output.

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Abstract

The present invention relates to heat pipes, as well as methods, systems, and working fluids used within heat pipes. [Solution] A heat pipe and a low-pressure working fluid used in the heat pipe are described, which are filled with a low-pressure working fluid containing a non-condensable gas at a level of less than 1 volume%, and the heat pipe can provide better thermal performance than an aluminum plate with little to no additional cost for degassing.
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