Inductor components

Abstract

To provide an inductor component with reduced migration occurrence. [Solution] The inductor component comprises a body having a plurality of stacked insulating layers, and a coil provided within the body and wound spirally along an axis, wherein the coil has a first outer coil wiring layer located on the outermost side on one side in the axial direction, a second outer coil wiring layer located on the outermost side on the other side in the axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer, wherein the first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer and the plurality of insulating layers are stacked alternately, the thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less, and the DC resistance of the first outer coil wiring layer is 0.18 Ω or less.

Description

[Technical Field]

[0001] This disclosure relates to inductor components. [Background technology]

[0002] Conventionally, an inductor component is described in Japanese Patent Publication No. 2002-246231 (Patent Document 1). This inductor component describes a coil having a lead conductor pattern located in the outermost layer, two layers of coil conductor patterns that make up one or more turns and are in contact with the lead conductor pattern, and a plurality of coil conductor patterns that make up less than one turn and are in contact with the coil conductor patterns that make up one or more turns, with each conductor pattern and the insulating layer being alternately laminated. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2002-246231 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] Incidentally, in the conventional inductor components described above, migration sometimes occurred in the lead conductor pattern located in the outermost layer. Upon thorough investigation of this point, it was found that the DC resistance of the lead conductor pattern located in the outermost layer increased, and the electric field strength generated between the outermost layer and the conductor pattern of the layer adjacent to the outermost layer increased when current was applied.

[0005] Therefore, the purpose of this disclosure is to provide an inductor component in which the occurrence of migration is reduced. [Means for solving the problem]

[0006] To solve the aforementioned problems, an inductor component according to one aspect of this disclosure is provided. A substrate having multiple stacked insulating layers, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The DC resistance of the first outer coil wiring layer is 0.18Ω or less.

[0007] As described above, the DC resistance (hereinafter sometimes referred to as "Rdc") of the outermost layer, the first outer coil wiring layer, decreases, so that even if the thickness of the insulating layer between the first outer coil wiring layer and the first inner coil wiring layer is reduced, the electric field strength between the first outer coil wiring layer and the first inner coil wiring layer also decreases. By reducing the electric field strength, migration between the first outer coil wiring layer and the first inner coil wiring layer can be suppressed.

[0008] An inductor component in another embodiment of this disclosure is A substrate having multiple stacked insulating layers, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The line length of the first outer coil wiring layer is 670 μm or less.

[0009] By shortening the line length of the first outer coil wiring, the Rdc value decreases, and even when the thickness of the insulating layer between the first outer coil wiring layer and the first inner coil wiring layer is reduced, the electric field strength between the first outer coil wiring layer and the first inner coil wiring layer decreases. This makes it possible to suppress migration between the first outer coil wiring layer and the first inner coil wiring layer in the inductor component.

[0010] An inductor component in another embodiment of this disclosure is The base body and, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The ratio of the line length of the first outer coil wiring layer to the cross-sectional area of ​​the first outer coil wiring layer is 11 μm. -1 The following applies:

[0011] In the first outer coil wiring layer, when the cross-sectional area is large and the wire length of the first outer coil wiring layer is short, the Rdc value decreases. That is, the ratio of the wire length of the first outer coil wiring layer to the cross-sectional area becomes small, the Rdc value decreases, and even if the thickness of the insulating layer between the first outer coil wiring layer and the first inner coil wiring layer is reduced, the electric field strength between the first outer coil wiring layer and the first inner coil wiring layer becomes small. Thereby, it is possible to suppress migration between the first outer coil wiring layer and the first inner coil wiring layer.

[0012] The inductor component according to another embodiment of the present disclosure is a body, a coil provided in the body and wound spirally along an axis, and the coil has a first outer coil wiring layer located on the outermost side on one side in the axial direction, a second outer coil wiring layer located on the outermost side on the other side in the axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer, the first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer and the plurality of insulating layers are alternately laminated, when a current twice the rated current is applied, the electric field strength between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 0.040 V / μm or less.

[0013] By reducing the electric field strength, it is possible to suppress migration between the first outer coil wiring layer and the first inner coil wiring layer.

[0014] The inductor component according to another embodiment of the present disclosure is a body, a coil provided in the body and wound spirally along an axis, and The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The number of turns in the first outer coil wiring layer is less than one turn. The number of turns of the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is one or more.

[0015] By having less than one turn of the first outer coil wiring layer 501, the electrical resistance can be reduced, and the electric field strength between the first outer coil wiring layer and the first inner coil wiring layer can be reduced. This suppresses migration between the first outer coil wiring layer and the first inner coil wiring layer. By having one or more turns of the first inner coil wiring layer 502, the inductance value (L value) can be improved. [Effects of the Invention]

[0016] According to one aspect of this disclosure, an inductor component is provided in which the occurrence of migration is reduced. [Brief explanation of the drawing]

[0017] [Figure 1] This is a perspective view showing a first embodiment of an inductor component. [Figure 2] This is a perspective front view of the inductor component, seen from the first side. [Figure 3] This is a YZ cross-sectional view of an inductor component. [Figure 4A] This is a plan view of an inductor component. [Figure 4B] This is a plan view of an inductor component. [Figure 4C] This is a plan view of an inductor component. [Figure 5] This figure shows the relationship between the Rdc value and the electric field strength in the first outer coil wiring layer. [Figure 6A] This is an illustrative diagram of an inductor component. [Figure 6B] This is an illustrative diagram of an inductor component. [Figure 6C] This is an illustrative diagram of an inductor component. [Figure 7] This figure shows the relationship between the line length and electric field strength in the first outer coil wiring layer in a second embodiment of the inductor component. [Figure 8] This figure shows the relationship between the ratio of the line length to the cross-sectional area in the first outer coil wiring layer and the electric field strength in a third embodiment of the inductor component. [Figure 9] This is a plan view of the sixth embodiment of the inductor component. [Figure 10] This is a YZ cross-sectional view of the seventh embodiment of the inductor component. [Modes for carrying out the invention]

[0018] Hereinafter, an inductor component, which is one aspect of this disclosure, will be described in detail with reference to the illustrated embodiment. Note that the drawings include some schematic representations and may not reflect actual dimensions or proportions.

[0019] (First Embodiment) (Overall configuration of inductor component 1) Figure 1 is a perspective view showing a first embodiment of the inductor component. Figure 2 is a perspective front view of the inductor component seen from the first side. Figure 3 is a YZ cross-sectional view of the inductor component. Figures 4A, 4B, and 4C are exploded plan views of the inductor component. For convenience, via wiring is not shown in Figure 3.

[0020] As shown in Figures 1, 2, 3, 4A, 4B, and 4C, the inductor component 1 comprises a base body 10 having multiple stacked insulating layers, a coil 20 provided within the base body 10 and wound spirally along axis AX, and a first external electrode 30 and a second external electrode 40 provided on the base body 10 and electrically connected to the coil 20. For convenience, in Figure 2, the base body and coil are depicted as transparent to easily understand the structure, but they may be semi-transparent or opaque.

[0021] The inductor component 1 is electrically connected to the wiring of a circuit board (not shown) via first and second external electrodes 30 and 40. The inductor component 1 is used, for example, as an impedance matching coil in high-frequency circuits and is used in electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, car electronics, and medical and industrial machinery. However, the applications of the inductor component 1 are not limited to these, and it can also be used in tuning circuits, filter circuits, rectifier and smoothing circuits, for example.

[0022] The base body 10 is formed in a roughly rectangular parallelepiped shape. The surface of the base body 10 includes a first end face 15 and a second end face 16 that face each other, a first side face 13 and a second side face 14 that face each other, a bottom surface 17 connected between the first end face 15 and the second end face 16 and between the first side face 13 and the second side face 14, and a top surface 18 that faces the bottom surface 17. The bottom surface 17 is the surface that faces the mounting board when the inductor component 1 is mounted on a mounting board (not shown).

[0023] As shown in the figure, the X direction is perpendicular to the first end face 15 and the second end face 16, and is the direction from the first end face 15 to the second end face 16. The Y direction is perpendicular to the first side surface 13 and the second side surface 14, and is the direction from the second side surface 14 to the first side surface 13. The Z direction is perpendicular to the bottom surface 17 and the top surface 18, and is the direction from the bottom surface 17 to the top surface 18. The X direction is also called the length direction of the element 10, the Y direction is also called the width direction of the element 10, and the Z direction is also called the height direction of the element 10. The X, Y, and Z directions are mutually orthogonal directions, and when arranged in the order X, Y, Z, they form a left-handed system.

[0024] The base body 10 is constructed by sequentially laminating multiple insulating layers 701 to 721. The insulating layers 701 to 721 are made of materials such as borosilicate glass as the main component, ferrite, or resin. The lamination direction of the insulating layers is parallel (Y direction) to the first and second end faces 15, 16 and the bottom face 17 of the base body 10. That is, the insulating layers 701 to 721 are layered in the XZ plane. In this application, "parallel" is not limited to a strictly parallel relationship, but also includes a substantially parallel relationship, taking into account the range of realistic variations. Note that in the base body 10, the interfaces between the multiple insulating layers 701 to 721 may not be clearly defined due to firing or other processes.

[0025] The first external electrode 30 and the second external electrode 40 are made of a conductive material such as Ag, Cu, Au, or alloys mainly composed of these materials.

[0026] The first external electrode 30 is L-shaped and extends from the first end face 15 to the bottom face 17. The first external electrode 30 is embedded in the base body 10 so as to be exposed from the first end face 15 and the bottom face 17. The first external electrode 30 has a first end face portion 31 that extends along the first end face 15 and a first bottom face portion 32 that is connected to the first end face portion 31 and extends along the bottom face 17.

[0027] The second external electrode 40 is L-shaped and extends from the second end face 16 to the bottom face 17. The second external electrode 40 is embedded in the base body 10 so as to be exposed from the second end face 16 and the bottom face 17. The second external electrode 40 has a second end face portion 41 that extends along the second end face 16 and a second bottom face portion 42 that is connected to the second end face portion 41 and extends along the bottom face 17.

[0028] The first external electrode 30 has a structure in which a plurality of first external electrode conductor layers 33 embedded in the base body 10 (first to 21st insulating layers 701 to 721) are stacked. The second external electrode 40 has a structure in which a plurality of second external electrode conductor layers 43 embedded in the base body 10 are stacked. The first external electrode conductor layers 33 extend along the first end face 15 and the bottom face 17, and the second external electrode conductor layers 43 extend along the second end face 16 and the bottom face 17.

[0029] This allows the first and second external electrodes 30 and 40 to be embedded within the base body 10, thus enabling miniaturization of the inductor component compared to a configuration where the external electrodes are attached externally to the base body 10. Furthermore, the coil 20 and the external electrodes 30 and 40 can be formed in the same process, and by reducing variations in the positional relationship between the coil 20 and the external electrodes 30 and 40, variations in the electrical characteristics of the inductor component 1 can be reduced.

[0030] Furthermore, the first external electrode 30 may not have a first end face portion 31 and may be composed of a first bottom surface portion 32, and similarly, the second external electrode 40 may not have a second end face portion 41 and may be composed of a second bottom surface portion 42. In other words, the first external electrode 30 and the second external electrode 40 only need to be provided on the bottom surface 17 of the base body 10.

[0031] The coil 20 is made of the same conductive material as the first and second external electrodes 30 and 40, for example. The coil 20 is wound spirally along the lamination direction of the first to 21st insulating layers 701 to 721. The first end of the coil 20 is connected to the first external electrode 30, and the second end of the coil 20 is connected to the second external electrode 40. In this embodiment, the coil 20 and the first and second external electrodes 30 and 40 are integrated and there is no clear boundary between them, but this is not limited to this, and a boundary may exist if the coil and the external electrodes are formed from different materials or using different manufacturing methods.

[0032] The coil 20 is wound along axis AX such that axis AX is parallel to the bottom surface 17 and axis AX intersects the first side surface 13 and the second side surface 14. The axis AX of the coil 20 coincides with the stacking direction (Y direction) of the first to 21st insulating layers 701 to 721. The axis AX of the coil 20 refers to the central axis of the coil 20's helical shape. More specifically, axis AX refers to the center of the innermost circumference of the coil 20.

[0033] The coil 20 has a winding portion 20a, a first lead portion 20b connected between the first end of the winding portion 20a and the first external electrode 30, and a second lead portion 20c connected between the second end of the winding portion 20a and the second external electrode 40. In this embodiment, the winding portion 20a and the first and second lead portions 20b, 20c are integrated and there is no clear boundary between them, but this is not limited to this, and a boundary may exist if the winding portion and the lead portions are formed from different materials or using different manufacturing methods.

[0034] The winding section 20a is wound spirally along the axis AX. In other words, the winding section 20a refers to the spirally wound portion where the coils 20 overlap each other when viewed from a direction parallel to the axis AX. The first and second lead-out sections 20b and 20c refer to the portions that are separated from the overlapping section.

[0035] As shown in Figures 2, 3, 4A, 4B, and 4C, the coil 20 has a plurality of coil wiring layers 501 to 510 stacked along axis AX, and first to ninth via wiring layers 601 to 609 that extend along axis AX and connect adjacent coil wiring layers in the direction of axis AX. The shape of the coil 20 is symmetrical with respect to a straight line passing through axis AX of the coil 20 and parallel to the Z direction when viewed from the direction of axis AX. This suppresses variations in the characteristics of the inductor component 1.

[0036] Multiple coil wiring layers 501-510 penetrate insulating layers 702, 704, 706, 708, 710, 712, 714, 716, 718, and 720 in the thickness direction (Y direction). Adjacent coil wiring layers in the stacking direction are electrically connected in series via via wiring layers 601-609. In this way, the multiple coil wiring layers 501-510 form a helix while being electrically connected in series with each other. In the above embodiment, as shown in Figures 4A, 4B, and 4C, the first to ninth via wiring layers 601-609 have a linear shape, but they may have other shapes, such as circular or arc shapes. In Figures 4A, 4B, and 4C, the direction from the upper left to the lower right is the stacking direction (Y direction).

[0037] Specifically, the first to tenth coil wiring layers 501 to 510 are stacked sequentially along the axis AX direction (Y direction). The first to tenth coil wiring layers 501 to 510 are each wound along a plane. The end of the first coil wiring layer 501 is electrically connected to the first external electrode conductor layer 33 of the first external electrode 30. The end of the tenth coil wiring layer 510 is electrically connected to the second external electrode conductor layer 43 of the second external electrode 40.

[0038] The first external electrode conductor layer 33 is provided in the second to 20th insulating layers 702 to 720 from the first end face 15 to the bottom face 17. The second external electrode conductor layer 43 is provided in the second to 20th insulating layers 702 to 720 from the second end face 16 to the bottom face 17.

[0039] The first coil wiring layer 501 is located on the outermost side of one side in the axial AX direction (i.e., the side facing the second side surface 14), and is hereinafter also referred to as the first outer coil wiring layer 501. The first outer coil wiring layer 501 includes a part of the winding portion 20a and a first lead portion 20b. The first lead portion 20b is electrically connected to the first external electrode conductor layer 33 of the first external electrode 30. The tenth coil wiring layer 510 is located on the outermost side of the other side in the axial AX direction (i.e., the side facing the first side surface 13), and is hereinafter also referred to as the second outer coil wiring layer 510. The second outer coil wiring layer 510 includes a part of the winding portion 20a and a second lead portion 20c. The second lead portion 20c is electrically connected to the second external electrode conductor layer 43 of the second external electrode 40.

[0040] The second coil wiring layer 502, the third coil wiring layer 503, the fourth coil wiring layer 504, the fifth coil wiring layer 505, the sixth coil wiring layer 506, the seventh coil wiring layer 507, the eighth coil wiring layer 508, and the ninth coil wiring layer 509 are located between the first outer coil wiring layer 501 and the second outer coil wiring layer 510, and are hereinafter also referred to as the first inner coil wiring layer 502, the second inner coil wiring layer 503, the third inner coil wiring layer 504, the fourth inner coil wiring layer 505, the fifth inner coil wiring layer 506, the sixth inner coil wiring layer 507, the seventh inner coil wiring layer 508, and the eighth inner coil wiring layer 509.

[0041] As shown in Figure 3, the thickness of the first and second outer coil wiring layers 501, 510 and the first to eighth inner coil wiring layers 502 to 509 is uniform. However, the thickness of the first and second outer coil wiring layers 501, 510 and the first to eighth inner coil wiring layers 502 to 509 may be non-uniform. For example, the thickness of the first and second outer coil wiring layers 501, 510 may be greater than the thickness of the first to eighth inner coil wiring layers 502 to 509, and the thickness of the first and second outer coil wiring layers 501, 510 may be less than the thickness of the first to eighth inner coil wiring layers 502 to 509. Furthermore, the thicknesses of the first and second outer coil wiring layers 501, 510 and the first to eighth inner coil wiring layers 502 to 509 may be different.

[0042] The number of turns in the first and second outer coil wiring layers 501 and 510 is less than one turn. The number of turns in the first to eighth inner coil wiring layers 502 to 509 is one turn or more. However, the number of turns in the first and second outer coil wiring layers 501 and 510 may be one turn or more. The number of turns in the first to eighth inner coil wiring layers 502 to 509 may be less than one turn.

[0043] The first outer coil wiring layer 501, the first inner coil wiring layer 502, the second inner coil wiring layer 503, the third inner coil wiring layer 504, the fourth inner coil wiring layer 505, the fifth inner coil wiring layer 506, the sixth inner coil wiring layer 507, the seventh inner coil wiring layer 508, the eighth inner coil wiring layer 509, and the second outer coil wiring layer 510 are alternately laminated with the first to twenty-first insulating layers 701 to 721.

[0044] Specifically, the first insulating layer 701 has a second side surface 14 of the base body 10 and is in contact with the second insulating layer 702 on the side opposite to the second side surface 14. The first outer coil wiring layer 501 is provided on the second insulating layer 702 (XZ plane) perpendicular to the axis AX direction and is connected to the first outer electrode conductor layer 33. The third insulating layer 703 has a first via wiring layer 601, which is connected to the first outer coil wiring layer 501. The first inner coil wiring layer 502 is provided on the fourth insulating layer 704 perpendicular to the axis AX direction and is connected to the first via wiring layer 601. The fifth insulating layer 705 has a second via wiring layer 602, which is connected to the first inner coil wiring layer 502. The second inner coil wiring layer 503 is provided on the sixth insulating layer 706 perpendicular to the axis AX direction and is connected to the second via wiring layer 602. The seventh insulating layer 707 has a third via wiring layer 603, which is connected to the second inner coil wiring layer 503. The third inner coil wiring layer 504 is provided on the eighth insulating layer 708, which is perpendicular to the axis AX, and is connected to the third via wiring layer 603. The ninth insulating layer 709 has a fourth via wiring layer 604, which is connected to the third inner coil wiring layer 504. The fourth inner coil wiring layer 505 is provided on the tenth insulating layer 710, which is perpendicular to the axis AX, and is connected to the fourth via wiring layer 604. The eleventh insulating layer 711 has a fifth via wiring layer 605, which is connected to the fourth inner coil wiring layer 505. The fifth inner coil wiring layer 506 is provided on the twelfth insulating layer 712, which is perpendicular to the axis AX, and is connected to the fifth via wiring layer 605. The 13th insulating layer 713 has a 6th via wiring layer 606, which is connected to the 5th inner coil wiring layer 506. The 6th inner coil wiring layer 507 is provided on the 14th insulating layer 714, which is perpendicular to the axis AX, and is connected to the 6th via wiring layer 606. The 15th insulating layer 715 has a 7th via wiring layer 607, which is connected to the 6th inner coil wiring layer 507. The 7th inner coil wiring layer 508 is provided on the 16th insulating layer 716, which is perpendicular to the axis AX, and is connected to the 7th via wiring layer 607. The 17th insulating layer 717 has an 8th via wiring layer 608, which is connected to the 7th inner coil wiring layer 508.The eighth inner coil wiring layer 509 is provided on the 18th insulating layer 718, which is perpendicular to the axis AX, and is connected to the eighth via wiring layer 608. The 19th insulating layer 719 has a 9th via wiring layer 609, which is connected to the eighth inner coil wiring layer 509. The second outer coil wiring layer 510 is provided on the 20th insulating layer 720, which is perpendicular to the axis AX, and is connected to the 9th via wiring layer 609 at one end. The second outer coil wiring layer 510 is connected to the second outer electrode conductor layer 43 at the other end. The 21st insulating layer 721 is in contact with the 20th insulating layer 720 and has the first side surface 13 of the base body 10 on the side opposite to the 20th insulating layer 720.

[0045] The first to ninth via wiring layers 601-609 penetrate the third, fifth, seventh, ninth, eleventh, thirteenth, fifteenth, seventeenth, and ninth 19th insulating layers 703, 705, 707, 709, 711, 713, 715, 717, and 719 in the thickness direction (Y direction). Viewed from the axial AX direction, the first to ninth via wiring layers 601-609 extend along the helical direction of the coil 20. Adjacent coil wiring layers in the stacking direction are electrically connected in series via the via wiring layers.

[0046] The thickness of the first to 21st insulating layers 701-721 is uniform. However, the thickness of the first to 21st insulating layers 701-721 does not have to be uniform. For example, the thickness of the first and 21st insulating layers 701 and 721 may be greater than the thickness of the second to 20th insulating layers 702-720. Also, for example, the thickness of the first and 21st insulating layers 701 and 721 may be less than the thickness of the second to 20th insulating layers 702-720. The thicknesses of the first to 21st insulating layers 701-721 may be different.

[0047] The first via layer 601, the second via layer 602, the third via layer 603, the fourth via layer 604, the fifth via layer 605, the sixth via layer 606, the seventh via layer 607, the eighth via layer 608, and the ninth via layer 609 are stacked sequentially along the Y direction. All via layers 601 to 609 are formed in a straight line. Each of the via layers 601 to 609 has a constant width along its extending direction.

[0048] The first via layer 601 is located between the first outer coil layer 501 and the first inner coil layer 502, connecting the end of the first outer coil layer 501 to the end of the first inner coil layer 502. The second via layer 602 is located between the first inner coil layer 502 and the second inner coil layer 503, connecting the end of the first inner coil layer 502 to the end of the second inner coil layer 503. The third via layer 603 is located between the second inner coil layer 503 and the third inner coil layer 504, connecting the end of the second inner coil layer 503 to the end of the third inner coil layer 504. The fourth via layer 604 is located between the third inner coil layer 504 and the fourth inner coil layer 505, connecting the end of the third inner coil layer 504 to the end of the fourth inner coil layer 505. The fifth via layer 605 is located between the fourth inner coil layer 505 and the fifth inner coil layer 506, and connects the end of the fourth inner coil layer 505 to the end of the fifth inner coil layer 506.

[0049] The sixth via layer 606 is located between the fifth inner coil layer 506 and the sixth inner coil layer 507, connecting the end of the fifth inner coil layer 506 to the end of the sixth inner coil layer 507. The seventh via layer 607 is located between the sixth inner coil layer 507 and the seventh inner coil layer 508, connecting the end of the sixth inner coil layer 507 to the end of the seventh inner coil layer 508. The eighth via layer 608 is located between the seventh inner coil layer 508 and the eighth inner coil layer 509, connecting the end of the seventh inner coil layer 508 to the end of the eighth inner coil layer 509. The ninth via layer 609 is located between the eighth inner coil layer 509 and the second outer coil layer 510, connecting the end of the eighth inner coil layer 509 to the end of the second outer coil layer 510.

[0050] (Details of the coil wiring layer and insulation layer) In the inductor component 1, the thickness of the third insulating layer 703 between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 adjacent to the first outer coil wiring layer 501 in the axial direction AX is 6.5 μm or less, and the Rdc value of the first outer coil wiring layer 501 is 0.18 Ω or less. The thickness of the third insulating layer 703 is not particularly limited, but may be, for example, 3.5 μm or more. The thickness of the third insulating layer 703 is not particularly limited, but may be, for example, 3.5 μm or less. The Rdc value of the first outer coil wiring layer 501 is not particularly limited, but may be, for example, 0.09 Ω or more. Note that the thickness of the insulating layer is the average value of the length of the insulating layer measured in the direction parallel to the axial direction AX. The thickness of the insulating layer is determined by exposing the two coil wiring layers in contact with the insulating layer, which are measured by polishing in the direction parallel to the axial direction AX, and measuring the average distance between the two coil wiring layers. The Rdc value of the first outer coil wiring layer 501 is the resistance value of the first outer coil wiring layer 501 in a cross-section perpendicular to the axis AX of the coil 20. Rdc is determined by exposing the coil wiring layer (in this case, the first outer coil wiring layer 501) by polishing it in a direction parallel to the XZ plane, and measuring the Rdc of the first outer coil wiring layer 501 using a manual prober or the like.

[0051] A detailed explanation will be provided based on Figure 5. Note that, in the following explanation, Ag is used as the material constituting the coil wiring layers 501-510, but other materials may also be used.

[0052] Figure 5 is a graph with the Rdc [Ω] of the first outer coil wiring layer 501 on the horizontal axis and the electric field strength [V / μm] on the vertical axis. As shown in Figure 5, when the Rdc value of the first outer coil wiring layer 501 is 0.18 Ω or less, the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 decreases even if the thickness of the third insulating layer 703 between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 is reduced. In such a case, migration between the first inner coil wiring layer 502 and the first outer coil wiring layer 501 can be suppressed. In this disclosure, migration between the first inner coil wiring layer 502 and the first outer coil wiring layer 501 refers to the ionization of Ag in the first inner coil wiring layer 502, and Ag + This refers to the process where the material moves to the first outer coil wiring layer 501 and is deposited as Ag in the first outer coil wiring layer 501. Normally, the electric field strength E is expressed by the formula: E = V / d = R × I / d (where V is voltage, d is the thickness of the insulating layer, R is resistance, and I is current). Therefore, in this disclosure, the value of the electric field strength is the value when the current I is twice the rated current, that is, the value obtained based on Rdc × (rated current × 2) / thickness of the insulating layer of the first outer coil electrode layer 501. The value of the rated current is uniquely determined for inductor component 1.

[0053] Figures 6A, 6B, and 6C will be used to explain the problems with conventional inductor components. Figures 6A, 6B, and 6C are illustrative diagrams showing a portion of the YZ cross-sectional view of a conventional inductor component.

[0054] As shown in Figure 6A, the first outer coil wiring layer 501 is provided closest to the second side surface 14, followed by the third insulating layer 703 and the first inner coil wiring layer 502. During sintering, the first outer coil wiring layer 501, which is closest to the second side surface 14, becomes over-sintered. As a result, cracks form between the particles constituting the first outer coil wiring layer 501. The Ag separated by the cracks diffuses into the first to third insulating layers 701-703 surrounding the first outer coil wiring layer 501, forming an uneven surface (sphericalization of the first outer coil wiring layer 501). In other words, the volume of the first outer coil wiring layer 501 is reduced, and its resistance increases. Furthermore, the diffusion of Ag around the first outer coil wiring layer 501 reduces the amount of filler in the first to third insulating layers 701-703, forming a low-strength layer 50a with reduced strength. Due to the coefficient of thermal expansion, stress is generated between the low-strength layer 50a and the first outer coil wiring layer 501, and because of its low strength, microcracks 50b are formed in the low-strength layer 50a.

[0055] As shown in Figure 6B, when a voltage is applied to the inductor component 1, the Ag in the first inner coil wiring layer 502 loses electrons, and Ag + Ions are reduced and precipitated. Similar to the mechanism of ion migration, the above Ag + The ions move to the first outer coil wiring layer 501, and Ag is deposited in the first outer coil wiring layer 501.

[0056] As shown in Figure 6C, the migration shown in Figure 6B creates a void 50d in the first inner coil wiring layer 502. The void 50d is the location where the Ag that migrated to the first outer coil wiring layer 501 was located. When the void 50d is created, a space is created between the third insulating layer 703 and the first inner coil wiring layer 502. Also, as shown in Figure 6C, the Ag deposited on the first outer coil wiring layer 501 extends through the microcracks 50b, creating a deposit portion 50c extending from the first outer coil wiring layer 501 toward the first inner coil wiring layer 502. The deposit portion 50c may cause a short circuit between the first outer coil wiring layer 501 and the first inner coil wiring layer 502.

[0057] In response to this, the inventors found that by lowering the Rdc value of the first outer coil wiring layer 501 to 0.18Ω or less, as shown in Figure 5, the electric field strength can be reduced even if the thickness of the third insulating layer 703 between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 is reduced. This makes it possible to suppress migration between the first inner coil wiring layer 502 and the first outer coil wiring layer 501. Furthermore, it is possible to suppress short circuits resulting from migration.

[0058] Preferably, the thickness of the 19th insulating layer 719 between the second outer coil wiring layer 510 and the eighth inner coil wiring layer 509 adjacent to the second outer coil wiring layer 510 in the axial direction AX is 6.5 μm or less, and the Rdc value of the second outer coil wiring layer 510 is 0.18 Ω or less. By having the above configuration, migration between the second outer coil wiring layer 510 and the eighth inner coil wiring layer 509 can be suppressed.

[0059] Preferably, the line length of the first outer coil wiring layer 501 is 670 μm or less. By shortening the line length of the first outer coil wiring layer 501, the Rdc value decreases, and even if the thickness of the third insulating layer 703 between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 is reduced, the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 becomes smaller. This makes it possible to suppress migration between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 in the inductor component 1. Note that the line length of the first outer coil wiring layer 501 is the length in the extending direction of the first outer coil wiring layer 501 when viewed from the axis AX direction. Specifically, the line length is the length of the center line of the line width when viewed from the axis AX direction. The line length of the second outer coil wiring layer 510 may also be 670 μm or less, similar to the line length of the first outer coil wiring layer 501. The line length of the second outer coil wiring layer 510 is the length of the second outer coil wiring layer 510 in the direction of extension, as viewed from the axis AX direction.

[0060] Preferably, the ratio of the line length of the first outer coil wiring layer 501 to the cross-sectional area of ​​the first outer coil wiring layer 501, i.e., line length / cross-sectional area, is 11 μm. -1 The following applies: When the cross-sectional area of ​​the first outer coil wiring layer 501 increases and the line length of the first outer coil wiring layer 501 decreases, the Rdc value decreases, and even if the thickness of the third insulating layer 703 between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 is reduced, the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 decreases. This suppresses migration between the first outer coil wiring layer 501 and the first inner coil wiring layer 502. The cross-sectional area of ​​the first outer coil wiring layer 501 refers to the maximum area of ​​the cross section perpendicular to the extending direction of the first outer coil wiring layer 501 when viewed from axis AX. The ratio of the line length of the second outer coil wiring layer 510 to the cross-sectional area of ​​the second outer coil wiring layer 510, i.e., line length / cross-sectional area, is 11 μm -1 The following is also possible: The cross-sectional area of ​​the second outer coil wiring layer 510 refers to the maximum area of ​​the cross-section perpendicular to the direction of extension of the second outer coil wiring layer 510, as viewed from axis AX.

[0061] Preferably, when a current twice the rated current is applied, the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 adjacent to the first outer coil wiring layer 501 in the axial direction AX is 0.040 V / μm or less. By reducing the electric field strength, migration between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 can be suppressed. The electric field strength between the second outer coil wiring layer 510 and the eighth inner coil wiring layer 509 adjacent to the second outer coil wiring layer 510 in the axial direction AX may also be 0.040 V / μm or less.

[0062] Preferably, the number of turns of the first outer coil wiring layer 501 is less than one turn. By having the above configuration, resistance can be reduced. The number of turns of the second outer coil wiring layer 510 may also be less than one turn.

[0063] Preferably, the number of turns of the first inner coil wiring layer 502 is one or more. By having the above configuration, the inductance value (L value) can be improved. The number of turns of the eighth inner coil wiring layer 509 may also be one or more.

[0064] (Second Embodiment) The configuration of the inductor component 1A in the second embodiment is the same as that of the inductor component 1 in the first embodiment, as shown in Figures 1, 2, 3, 4A, 4B, and 4C. Except for the configuration described below, the configuration is the same as in the first embodiment, and its explanation is omitted.

[0065] In the second embodiment, regardless of the Rdc value of the first outer coil wiring layer 501 in the first embodiment, the line length of the first outer coil wiring layer 501 is 670 μm or less. The line length of the first outer coil wiring layer 501 is not particularly limited, but may be, for example, 450 μm or more.

[0066] This will be explained in detail based on Figure 7. Figure 7 is a diagram in which the horizontal axis represents the line length [μm] in the first outer coil wiring layer 501 and the vertical axis represents the electric field strength [V / μm]. As shown in Figure 7, by shortening the line length of the first outer coil wiring layer 501, the Rdc value decreases, and even if the thickness of the third insulating layer 703 between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 is reduced, the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 also decreases. Therefore, migration between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 can be suppressed in the inductor component 1.

[0067] Preferably, the line length of the second outer coil wiring layer 510 is 670 μm or less. The line length of the second outer coil wiring layer 510 is not particularly limited, but may be, for example, 450 μm or more. By shortening the line length, the Rdc value decreases, and even if the thickness of the 19th insulating layer 719 between the second outer coil wiring layer 510 and the 8th inner coil wiring layer 509 is reduced, the electric field strength between the second outer coil wiring layer 510 and the 8th inner coil wiring layer 509 becomes smaller. As a result, migration between the second outer coil wiring layer 510 and the 8th inner coil wiring layer 509 in the inductor component 1 can be suppressed.

[0068] Preferably, the ratio of the line length of the first outer coil wiring layer 501 to the cross-sectional area of ​​the first outer coil wiring layer 501, i.e., line length / cross-sectional area, is 11 μm. -1 The following applies. The ratio of the line length of the second outer coil wiring layer 510 to the cross-sectional area of ​​the second outer coil wiring layer 510, i.e., line length / cross-sectional area, is 11 μm². -1 The following is also acceptable.

[0069] Preferably, when a current twice the rated current is applied, the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 adjacent to the first outer coil wiring layer 501 is 0.040 V / μm or less. The electric field strength between the second outer coil wiring layer 510 and the eighth inner coil wiring layer 509 adjacent to the second outer coil wiring layer 510 in the axial direction AX may also be 0.040 V / μm or less.

[0070] Preferably, the number of turns of the first outer coil wiring layer 501 is less than one turn. The number of turns of the second outer coil wiring layer 510 may also be less than one turn.

[0071] Preferably, the number of turns of the first inner coil wiring layer 502 is one or more. The number of turns of the eighth inner coil wiring layer 509 may also be one or more.

[0072] (Third embodiment) The configuration of the inductor component 1B of the third embodiment is shown in FIGS. 1, 2, 3, 4A, 4B, and 4C, similar to the configuration of the inductor component 1 of the first embodiment. Note that the configuration other than that described below is the same as that of the first embodiment, and the description thereof is omitted.

[0073] In the third embodiment, regardless of the Rdc value of the first outer coil wiring layer 501 of the first embodiment, the ratio of the line length of the first outer coil wiring layer 501 to the cross-sectional area of the first outer coil wiring layer 501, that is, the line length / cross-sectional area, is 11 μm. -1 The following is the case. In the first outer coil wiring layer 501, when the cross-sectional area is large and the line length of the first outer coil wiring layer 501 is short, the Rdc value decreases. That is, the ratio of the line length of the first outer coil wiring layer to the cross-sectional area becomes small, the Rdc value decreases, and even when the thickness of the third insulating layer 703 between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 is reduced, the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 becomes small. Thereby, it is possible to suppress the occurrence of migration between the first outer coil wiring layer 501 and the first inner coil wiring layer 502.

[0074] Based on FIG. 8, a detailed description will be given. FIG. 8 is a diagram in which the line length / cross-sectional area [μm -1 of the first outer coil wiring layer 501 is provided on the horizontal axis, and the electric field strength [V / μm] between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 is provided on the vertical axis. As shown in FIG. 8, when the line length / cross-sectional area is 11 μm -1 or less, it can be seen that the Rdc value decreases and the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 becomes small.

[0075] Preferably, the ratio of the line length of the second outer coil wiring layer 510 to the cross-sectional area of the second outer coil wiring layer 510 is 11 μm. -1The following is true: In the second outer coil wiring layer 510, if the cross-sectional area is large and the line length of the second outer coil wiring layer 510 is short, the Rdc value decreases, and even if the thickness of the 19th insulating layer 719 between the second outer coil wiring layer 510 and the 8th inner coil wiring layer 509 is reduced, the electric field strength between the second outer coil wiring layer 510 and the 8th inner coil wiring layer 509 decreases. This makes it possible to suppress migration between the second outer coil wiring layer 510 and the 8th inner coil wiring layer 509.

[0076] Preferably, when a current twice the rated current is applied, the electric field strength between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 adjacent to the first outer coil wiring layer 501 is 0.040 V / μm or less. The electric field strength between the second outer coil wiring layer 510 and the eighth inner coil wiring layer 509 adjacent to the second outer coil wiring layer 510 in the axial direction AX may also be 0.040 V / μm or less.

[0077] Preferably, the number of turns of the first outer coil wiring layer 501 is less than one turn. The number of turns of the second outer coil wiring layer 510 may also be less than one turn.

[0078] Preferably, the number of turns of the first inner coil wiring layer 502 is one or more. The number of turns of the eighth inner coil wiring layer 509 may also be one or more.

[0079] (Fourth Embodiment) The configuration of the inductor component 1C in the fourth embodiment is the same as the configuration of the inductor component 1 in the first embodiment, as shown in Figures 1, 2, 3, 4A, 4B, and 4C. Except for the configuration described below, the configuration is the same as in the first embodiment, and its explanation is omitted.

[0080] In the fourth embodiment, regardless of the Rdc value of the first outer coil wiring layer 501 and the thickness of the third insulating layer 703 in the first embodiment, the electric field strength between the first outer coil wiring layer 501 and the inner coil wiring layer 502 adjacent to the first outer coil wiring layer 501 in the axial direction AX is 0.040 V / μm or less. By reducing the electric field strength, migration between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 can be suppressed.

[0081] Preferably, when a current twice the rated current is applied, the electric field strength between the second outer coil wiring layer 510 and the eighth inner coil wiring layer 509 adjacent to the second outer coil wiring layer 510 in the axial direction AX is 0.040 V / μm or less. By reducing the electric field strength, migration between the second outer coil wiring layer 510 and the eighth inner coil wiring layer 509 can be suppressed.

[0082] Preferably, the number of turns of the first outer coil wiring layer 501 is less than one turn. The number of turns of the second outer coil wiring layer 510 may also be less than one turn.

[0083] Preferably, the number of turns of the first inner coil wiring layer 502 is one or more. The number of turns of the eighth inner coil wiring layer 509 may also be one or more.

[0084] (Fifth embodiment) The configuration of the inductor component 1D in the fifth embodiment is the same as that of the inductor component 1 in the first embodiment, as shown in Figures 1, 2, 3, 4A, 4B, and 4C. Except for the configuration described below, the configuration is the same as in the first embodiment, and its explanation is omitted.

[0085] In the fifth embodiment, regardless of the Rdc value of the first outer coil wiring layer 501 and the thickness of the third insulating layer 703 in the first embodiment, the number of turns of the first outer coil wiring layer 501 is less than one turn, and the number of turns of the first inner coil wiring layer 502 adjacent to the first outer coil wiring layer 501 in the axial direction AX is one turn or more. By having less than one turn of turns for the first outer coil wiring layer 501, the resistance can be reduced. By having one turn or more turns for the first inner coil wiring layer 502, the inductance value (L value) can be improved.

[0086] Preferably, the number of turns of the second outer coil wiring layer 510 is less than one turn, and the number of turns of the eighth inner coil wiring layer 509 adjacent to the second outer coil wiring layer 510 in the axial direction AX is one turn or more. By having less than one turn of turns for the second outer coil wiring layer 510, the resistance can be reduced. By having one turn or more turns for the eighth inner coil wiring layer 509, the inductance value can be improved.

[0087] (Sixth Embodiment) Figure 9 shows a plan view of the inductor component 1E. The sixth embodiment differs from the first embodiment in the width of the coil wiring layer. Otherwise, the configuration is the same as the first embodiment, and its explanation is omitted.

[0088] As shown in Figure 9, in the inductor component 1E, the width of the first outer coil wiring layer 501E in the direction perpendicular to the direction in which the first outer coil wiring layer 501E extends and perpendicular to the axis of the first outer coil wiring layer 501E is greater than the width of the first inner coil wiring layer 502 adjacent to the first outer coil wiring layer 501E in the direction perpendicular to the direction in which it extends. With this configuration, the Rdc value of the first outer coil wiring layer 501E is reduced, and migration between the first outer coil wiring layer 501 and the first inner coil wiring layer 502 can be suppressed. Note that the width (line width) is the average value of the width in the direction perpendicular to the axis AX of the coil 20.

[0089] Preferably, the width of the second outer coil wiring layer 510E in the direction perpendicular to the direction extending along axis AX is greater than the width of the eighth inner coil wiring layer 509 adjacent to the second outer coil wiring layer 510E in the direction perpendicular to the direction extending along axis.

[0090] (Seventh Embodiment) Figure 10 shows a plan view of inductor component 1F. The seventh embodiment differs from the first embodiment in the thickness of the first outer coil wiring layer. Otherwise, the configuration is the same as the first embodiment, and its explanation is omitted.

[0091] In the inductor component 1F, the thickness of the first outer coil wiring layer 501 in the direction parallel to the axis AX is greater than the thickness of the first inner coil wiring layer 502 adjacent to the first outer coil wiring layer 501 in the direction parallel to the axis AX. With the above configuration, the Rdc value of the first outer coil wiring layer 501E becomes smaller, and the electric field strength becomes smaller when a voltage is applied.

[0092] Preferably, the thickness of the second outer coil wiring layer 510 in the direction parallel to the axis AX is greater than the thickness of the eighth inner coil wiring layer 509 adjacent to the second outer coil wiring layer 510 in the direction parallel to the axis AX. With the above configuration, the Rdc value of the second outer coil wiring layer 510E becomes smaller, and the electric field strength becomes smaller when a voltage is applied.

[0093] This disclosure is not limited to the embodiments described above, and design modifications are possible without departing from the gist of this disclosure. For example, the features of each of the first to seventh embodiments may be combined in various ways. The shape of the core is not limited to this embodiment and can be modified. Also, the quantity of coils is not limited to this embodiment and can be modified.

[0094] This disclosure includes the following aspects: <1> A substrate having multiple stacked insulating layers, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The DC resistance of the first outer coil wiring layer is 0.18Ω or less. Inductor components. <2> The thickness of the insulating layer between the second outer coil wiring layer and the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is 6.5 μm or less. The DC resistance of the second outer coil wiring layer is 0.18Ω or less. <1> The inductor components listed below. <3> A substrate having multiple stacked insulating layers, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The line length of the first outer coil wiring layer is 670 μm or less. Inductor components. <4> The thickness of the insulating layer between the second outer coil wiring layer and the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is 6.5 μm or less. The line length of the second outer coil wiring layer is 670 μm or less. <3> The inductor components listed below. <5> The base body and, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The ratio of the line length of the first outer coil wiring layer to the cross-sectional area of ​​the first outer coil wiring layer is 11 μm. -1 The following is: Inductor components. <6> The thickness of the insulating layer between the second outer coil wiring layer and the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is 6.5 μm or less. The ratio of the line length of the second outer coil wiring layer to the cross-sectional area of ​​the second outer coil wiring layer is 11 μm. -1 The following is: <5> The inductor components listed below. <7> The base body and, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. When a current twice the rated current is applied, the electric field strength between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 0.040 V / μm or less. Inductor components. <8> When a current twice the rated current is applied, the electric field strength between the second outer coil wiring layer and the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is 0.040 V / μm or less. <7> The inductor components listed below. <9> The base body and, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The number of turns in the first outer coil wiring layer is less than one turn. The number of turns of the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is one or more. Inductor components. <10> The number of turns in the second outer coil wiring layer is less than one turn. The number of turns of the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is one or more. <9> The inductor components listed below. <11> The line length of the first outer coil wiring layer is 670 μm or less. <1> , <2> , and, <5> from <10> An inductor component listed in any one of the following. <12> The ratio of the line length of the first outer coil wiring layer to the cross-sectional area of ​​the first outer coil wiring layer is 11 μm. -1 The following is: <1> from <4> , and, <7> from <10> An inductor component listed in any one of the following. <13> When a current twice the rated current is applied, the electric field strength between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer is 0.040 V / μm or less. <1> from <6> , <9> and <10> An inductor component listed in any one of the following. <14> The number of turns in the first outer coil wiring layer is less than one turn. <1> from <8> An inductor component listed in any one of the following. <15> The number of turns of the inner coil wiring layer adjacent to the first outer coil wiring layer is one or more. <14> The inductor components listed below. <16> The width of the first outer coil wiring layer in a direction perpendicular to the direction in which the first outer coil wiring layer extends and perpendicular to the axis of the first outer coil wiring layer is greater than the width of the inner coil wiring layer adjacent to the first outer coil wiring layer in a direction perpendicular to the direction in which the axis extends. <1> from <15> An inductor component listed in any one of the following. <17> The thickness of the first outer coil wiring layer in the direction parallel to the axis is greater than the thickness of the inner coil wiring layer adjacent to the first outer coil wiring layer in the direction parallel to the axis. <1> from <15> An inductor component listed in any one of the following. [Explanation of symbols]

[0095] 1, 1A, 1B, 1C, 1D, 1E, 1F Inductor Components 10, 10E base body 13 First aspect 14 Second aspect 15 First end surface 16 Second end face 17. Bottom 18 Top surface 20 coils 20a Winding section 20b 1st drawer 20c 2nd drawer 30 1st external electrode 31 First end section 32 1st bottom part 33 First outer electrode conductor layer 40 2nd external electrode 41 Second end section 42 2nd bottom part 43. Second external electrode conductor layer 501-510 1st-10th coil wiring layers 501E, 510E: 1st and 10th coil wiring layers 501F, 510F: 1st and 10th coil wiring layers Via layers 601-609 (1st-9th via wiring layers) 701-721 Insulating layer AX axis

Claims

1. A substrate having multiple stacked insulating layers, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The DC resistance of the first outer coil wiring layer is 0.18 Ω or less. Inductor components.

2. The thickness of the insulating layer between the second outer coil wiring layer and the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is 6.5 μm or less. The DC resistance of the second outer coil wiring layer is 0.18 Ω or less. The inductor component according to claim 1.

3. A substrate having multiple stacked insulating layers, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The line length of the first outer coil wiring layer is 670 μm or less. Inductor components.

4. The thickness of the insulating layer between the second outer coil wiring layer and the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is 6.5 μm or less. The line length of the second outer coil wiring layer is 670 μm or less. The inductor component according to claim 3.

5. The base body and, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The thickness of the insulating layer between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 6.5 μm or less. The ratio of the line length of the first outer coil wiring layer to the cross-sectional area of ​​the first outer coil wiring layer is 11 μm. －１ The following is: Inductor components.

6. The thickness of the insulating layer between the second outer coil wiring layer and the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is 6.5 μm or less. The ratio of the line length of the second outer coil wiring layer to the cross-sectional area of ​​the second outer coil wiring layer is 11 μm. －１ The following is: The inductor component according to claim 5.

7. The base body and, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. When a current twice the rated current is applied, the electric field strength between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is 0.040 V / μm or less. Inductor components.

8. When a current twice the rated current is applied, the electric field strength between the second outer coil wiring layer and the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is 0.040 V / μm or less. The inductor component according to claim 7.

9. The base body and, A coil provided within the aforementioned body and wound spirally along an axis, Equipped with, The coil comprises a first outer coil wiring layer located on the outermost side of one axial direction, a second outer coil wiring layer located on the outermost side of the other axial direction, and at least one inner coil wiring layer located between the first outer coil wiring layer and the second coil wiring layer. The first outer coil wiring layer, the at least one inner coil wiring layer, and the second outer coil wiring layer are alternately laminated with the plurality of insulating layers. The number of turns in the first outer coil wiring layer is less than one turn. The number of turns of the inner coil wiring layer adjacent to the first outer coil wiring layer in the axial direction is one or more. Inductor components.

10. The number of turns in the second outer coil wiring layer is less than one turn. The number of turns of the inner coil wiring layer adjacent to the second outer coil wiring layer in the axial direction is one or more. The inductor component according to claim 9.

11. The line length of the first outer coil wiring layer is 670 μm or less. An inductor component according to any one of claims 1, 2, and 5 to 10.

12. The ratio of the line length of the first outer coil wiring layer to the cross-sectional area of ​​the first outer coil wiring layer is 11 μm. －１ The following is: An inductor component according to any one of claims 1 to 4 and 7 to 10.

13. When a current twice the rated current is applied, the electric field strength between the first outer coil wiring layer and the inner coil wiring layer adjacent to the first outer coil wiring layer is 0.040 V / μm or less. An inductor component according to any one of claims 1 to 6, 9, and 10.

14. The number of turns in the first outer coil wiring layer is less than one turn. An inductor component according to any one of claims 1 to 8.

15. The number of turns of the inner coil wiring layer adjacent to the first outer coil wiring layer is one or more. The inductor component according to claim 14.

16. An inductor component according to any one of claims 1 to 10, wherein the width of the first outer coil wiring layer in a direction perpendicular to the direction in which the first outer coil wiring layer extends and perpendicular to the axis of the first outer coil wiring layer is greater than the width of the inner coil wiring layer adjacent to the first outer coil wiring layer in a direction perpendicular to the direction in which the axis extends.

17. An inductor component according to any one of claims 1 to 10, wherein the thickness of the first outer coil wiring layer in the direction parallel to the axis is greater than the thickness of the inner coil wiring layer adjacent to the first outer coil wiring layer in the direction parallel to the axis.

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